RT7296AGJ8F
RT7296AGJ8F
RT7296AGJ8F
RT7296A C3
VIN VIN BOOT
C1 L1
SW VOUT
Enable EN/SYNC
PVCC R5 R1
FB
R3
C2 R2 C4
TTH
GND
R4
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RT7296A
Pin Configurations
(TOP VIEW)
EN/SYNC
BOOT
PVCC
FB
8 7 6 5
2 3 4
TTH
VIN
SW
GND
TSOT-23-8 (FC)
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RT7296A
Function Block Diagram
TTH PVCC VIN
Internal
Regulator Current
UVLO Sense
BOOT
UVLO
Shutdown
BOOT
EN/SYNC - Comparator
1.4V + Logic & Power
Protection Stage & SW
Control Deadtime
0.4V + Control
- UV
Comparator
1pF HS Switch
Current
Current LS Switch Sense
50pF 400k Comparator Current
Comparator
FB - Slope GND
0.807V + EA Oscillator
Internal SS + Compensation
Operation
Under-Voltage Lockout Threshold Operating Frequency and Synchronization
The IC includes an input Under Voltage Lockout The internal oscillator runs at 500kHz (typ.) when the
Protection (UVLO). If the input voltage exceeds the EN/SYNC pin is at logic-high level (>1.6V). If the EN
UVLO rising threshold voltage (3.9V), the converter pin is pulled to low-level over 8s, the IC will shut down.
resets and prepares the PWM for operation. If the input The RT7296A can be synchronized with an external
voltage falls below the UVLO falling threshold voltage clock ranging from 200kHz to 2MHz applied to the
(3.25V) during normal operation, the device stops EN/SYNC pin. The external clock duty cycle must be
switching. The UVLO rising and falling threshold from 20% to 80% with logic-high level = 2V and
voltage includes a hysteresis to prevent noise caused logic-low level = 0.8V.
reset.
Internal Regulator
Chip Enable The internal regulator generates 5V power and drive
The EN pin is the chip enable input. Pulling the EN pin internal circuit. When VIN is below 5V, PVCC will drop
low (<1.1V) will shut down the device. During shutdown with VIN. A capacitor (>0.1F) between PVCC and
mode, the RT7296A’s quiescent current drops to lower GND is required.
than 1A. Driving the EN pin high (>1.6V) will turn on
Internal Soft-Start Function
the device.
The RT7296A provides internal soft-start function. The
soft-start function is used to prevent large inrush
current while converter is being powered-up. The
soft-start time (VFB from 0V to 0.8V) is 1.5ms.
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RT7296A
Over-Current Protection
RT7296A provides cycle-by-cycle over current
protection. When the inductor current peak value
reaches current limit, IC will turn off high-side MOS to
avoid over current.
Thermal Shutdown
Thermal shutdown is implemented to prevent the chip
from operating at excessively high temperatures. When
the junction temperature is higher than 150C, the chip
will shut down the switching operation. The chip is
automatically re-enabled when the junction
temperature cools down by approximately 20C.
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RT7296A
Absolute Maximum Ratings (Note 1)
Supply Input Voltage, VIN --------------------------------------------------------------------------------------------- 0.3V to 20V
Switch Voltage, SW ------------------------------------------------------------------------------------------------------ 0.3V to VIN + 0.3V
BOOT to SW, VBOOT – SW --------------------------------------------------------------------------------------------- 0.3V to 6V
Other Pins------------------------------------------------------------------------------------------------------------------- 0.3V to 6V
Power Dissipation, PD @ TA = 25C
TSOT-23-8 (FC) ---------------------------------------------------------------------------------------------------------- 1.428W
Package Thermal Resistance (Note 2)
TSOT-23-8 (FC), JA --------------------------------------------------------------------------------------------------- 70C/W
TSOT-23-8 (FC), JC --------------------------------------------------------------------------------------------------- 15C/W
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260C
Junction Temperature --------------------------------------------------------------------------------------------------- 40C to 150C
Storage Temperature Range ----------------------------------------------------------------------------------------- 65C to 150C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------- 2kV
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Shutdown Supply Current VEN = 0V -- -- 1 A
Quiescent Current with no Load
VEN = 2V, VFB = 1V, TTH = 0.5V -- 0.8 1 mA
at DCDC Output
Feedback Voltage VFB 0.799 0.807 0.815 V
Feedback Current IFB VFB = 820mV -- 10 50 nA
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RT7296A
Parameter Symbol Test Conditions Min Typ Max Unit
Logic-High VIH 1.2 1.4 1.6
EN Input Voltage V
Logic-Low VIL 1.1 1.25 1.4
VEN = 2V -- 2 --
EN Input Current IEN A
VEN = 0V -- 0 --
EN Turn-off Delay ENtd-off -- 8 -- s
Input Under-Voltage VIN Rising VUVLO VIN Rising 3.7 3.9 4.1 V
Lockout Threshold Hysteresis VUVLO -- 650 -- mV
VCC Regulator VCC -- 5 -- V
VCC Load Regulation VLOAD IVCC = 5mA -- 3 -- %
Soft-Start Time tSS FB from 0V to 0.8V -- 1.5 -- ms
o
Thermal Shutdown Temperature TSD -- 150 -- C
Thermal Shutdown Hysteresis TSD -- 20 -- o
C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT7296A
Typical Application Circuit
C3
RT7296A 0.1μF
2 5
VIN VIN BOOT
4.5V to 17V C1
R6
22μF L1
6 10
Enable EN/SYNC 4.7μH
7 3 VOUT
PVCC SW
R3 R5 R1
C2 91k 33k 40.2k
1 TTH 8
0.1μF FB
GND R2 C4
R4 4
13k 44μF
10k
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RT7296A
Typical Operating Characteristics
Efficiency vs. Output Current Output Voltage vs. Input Voltage
100 3.60
90 3.55
VIN = 7V 3.50
80
3.45
VIN = 17V
60 3.35
50 3.30
40 3.25
3.20
30
3.15
20
3.10
10 3.05
VOUT = 3.3V VOUT = 3.3V, IOUT = 3A
0 3.00
0 0.5 1 1.5 2 2.5 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Output Current (A) Input Voltage (V)
0.83 3.42
Reference Voltage (V)
0.82 3.38
Output Voltage (V)
0.81 3.34
0.80 3.30
0.79 3.26
0.78 3.22
0.77 3.18
TTH = 3V VIN = 12V, VOUT = 3.3V
0.76 3.14
-50 -25 0 25 50 75 100 125 0 0.5 1 1.5 2 2.5 3
Temperature (°C) Load Current (A)
4.20 1.45
UVLO Voltage (V)
EN Threshold (V)
3.60 1.30
3.40 1.25
Falling
Falling
3.20 1.20
VOUT = 3.3V, IOUT = 0A VOUT = 3.3V, IOUT = 0A
3.00 1.15
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
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RT7296A
Load Transient Response Output Ripple Voltage
VOUT VOUT
(100mV/Div) (20mV/Div)
IOUT VLX
VIN = 12V, VOUT = 3.3V,
(1A/Div) IOUT = 1.5A to 3A to 1.5A, L = 4.7H (5V/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A, L = 4.7H
VOUT VOUT
(2V/Div) (2V/Div)
VEN VEN
(2V/Div) (2V/Div)
VLX VLX
(10V/Div) (10V/Div)
ILX ILX
(3A/Div) (3A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A
VOUT VOUT
(2V/Div) (2V/Div)
VIN VIN
(10V/Div) (10V/Div)
VLX VLX
(10V/Div) (10V/Div)
ILX ILX
(3A/Div) (3A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A
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RT7296A
Application Information
The RT7296A is a high voltage buck converter that can 5V
support the input voltage range from 4.5V to 17V and
the input voltage range from 4.5V to 17V and the output
BOOT
current can be up to 3A. RT7296A 100nF
SW
Output Voltage Selection
The resistive voltage divider allows the FB pin to sense
Figure 2. External Bootstrap Diode
a fraction of the output voltage as shown in Figure 1.
The TTH Voltage setting
R5 R1
FB VOUT
The TTH voltage is used to be change the transition
RT7296A R2
GND
threshold between power saving mode and CCM.
Higher TTH voltage gets higher efficiency at light load
Figure 1. Output Voltage Setting condition but larger output ripple; a lower TTH voltage
For adjustable voltage mode, the output voltage is set can improve output ripple but degrades efficiency
by an external resistive voltage divider according to the during light load condition. A resistor divider from PVCC
following equation : (5V) of RT7296A can help to build TTH voltage, as
R1 shown in Figure 3. It is recommended that TTH voltage
VOUT VFB 1
R2 should be less than 0.6V.
Where VFB is the feedback reference voltage (0.8V PVCC
typ.). Table 1 lists the recommended resistors value for R3
common output voltages. TTH
RT7296A R4
Table1. Recommended Resistors Value GND
VOUT (V) R1 (k) R2 (k) R5 (k)
1.0 20.5 82 82 Figure 3. TTH Voltage Setting
3.3 40.2 13 33
Inductor Selection
5.0 40.2 7.68 33
The inductor value and operating frequency determine
External Bootstrap Diode the ripple current according to a specific input and
Connect a 100nF low ESR ceramic capacitor between output voltage. The ripple current ΔIL increases with
the BOOT pin and SW pin. This capacitor provides the higher VIN and decreases with higher inductance.
gate driver voltage for the high side MOSFET. It is V V
IL OUT 1 OUT
recommended to add an external bootstrap diode f L VIN
between an external 5V and BOOT pin, as shown as Having a lower ripple current reduces not only the ESR
Figure 2, for efficiency improvement when input voltage losses in the output capacitors but also the output
is lower than 5.5V or duty ratio is higher than 65% .The voltage ripple. High frequency with small ripple current
bootstrap diode can be a low cost one such as IN4148 can achieve highest efficiency operation. However, it
or BAT54. The external 5V can be a 5V fixed input from requires a large inductor to achieve this goal.
system or a 5V output (PVCC) of the RT7296A.
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RT7296A
For the ripple current selection, the value of IL = 0.3 voltage since IL increases with input voltage. Multiple
(IMAX) will be a reasonable starting point. The largest capacitors placed in parallel may be needed to meet
ripple current occurs at the highest VIN. To guarantee the ESR and RMS current handling requirement. Dry
that the ripple current stays below the specified tantalum, special polymer, aluminum electrolytic and
maximum, the inductor value should be chosen ceramic capacitors are all available in surface mount
according to the following equation : packages. Special polymer capacitors offer very low
VOUT VOUT ESR value. However, it provides lower capacitance
L 1
f IL(MAX)
VIN(MAX)
density than other types. Although Tantalum capacitors
The inductor's current rating (caused a 40°C have the highest capacitance density, it is important to
temperature rising from 25°C ambient) should be only use types that pass the surge test for use in
greater than the maximum load current and its switching power supplies. Aluminum electrolytic
saturation current should be greater than the short capacitors have significantly higher ESR. However, it
circuit peak current limit. can be used in cost-sensitive applications for ripple
current rating and long term reliability considerations.
CIN and COUT Selection
Ceramic capacitors have excellent low ESR
The input capacitance, CIN, is needed to filter the
characteristics but can have a high voltage coefficient
trapezoidal current at the source of the top MOSFET.
and audible piezoelectric effects. The high Q of
To prevent large ripple current, a low ESR input
ceramic capacitors with trace inductance can also lead
capacitor sized for the maximum RMS current should
to significant ringing.
be used. The RMS current is given by :
VOUT VIN Thermal Considerations
IRMS IOUT(MAX) 1
VIN VOUT For continuous operation, do not exceed absolute
This formula has a maximum at VIN = 2VOUT, where maximum junction temperature. The maximum power
IRMS = IOUT / 2. This simple worst-case condition is dissipation depends on the thermal resistance of the IC
commonly used for design because even significant package, PCB layout, rate of surrounding airflow, and
deviations do not offer much relief. difference between junction and ambient temperature.
Choose a capacitor rated at a higher temperature than The maximum power dissipation can be calculated by
required. Several capacitors may also be paralleled to the following formula :
meet size or height requirements in the design. The PD(MAX) = (TJ(MAX) TA) / θJA
selection of COUT is determined by the required where TJ(MAX) is the maximum junction temperature,
Effective Series Resistance (ESR) to minimize voltage TA is the ambient temperature, and θJA is the junction
ripple. Moreover, the amount of bulk capacitance is to ambient thermal resistance.
also a key for COUT selection to ensure that the control For recommended operating condition specifications,
loop is stable. Loop stability can be checked by viewing the maximum junction temperature is 125°C. The
the load transient response as described in a later junction to ambient thermal resistance, θJA, is layout
section. The output ripple, VOUT, is determined by : dependent. For TSOT-23-8 (FC) package, the thermal
1 resistance, θJA, is 70°C/W on a standard four-layer
VOUT IL ESR
8fCOUT thermal test board. The maximum power dissipation at
The output ripple will be highest at the maximum input TA = 25°C can be calculated by the following formula :
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RT7296A
PD(MAX) = (125°C 25°C) / (70°C/W) = 1.428W for Layout Considerations
TSOT-23-8 (FC) package For best performance of the RT7296A, the following
The maximum power dissipation depends on the layout guidelines must be strictly followed.
operating ambient temperature for fixed TJ(MAX) and Input capacitor must be placed as close to the IC as
thermal resistance, θJA. The derating curve in Figure 4 possible.
allows the designer to see the effect of rising ambient SW should be connected to inductor by wide and
temperature on the maximum power dissipation. short trace. Keep sensitive components away from
1.5
this trace.
Maximum Power Dissipation (W)1
Four-Layer PCB
Keep every trace connected to pin as wide as
1.2 possible for improving thermal dissipation.
0.9
0.6
0.3
0.0
0 25 50 75 100 125
Ambient Temperature (°C)
SW
EN/SYNC SW
6
TTH
8
R1 FB
VOUT CIN
Via can help to reduce
R2 power trace and improve
R4
R3 GND
thermal dissipation.
The feedback components
must be connected as close PVCC Input capacitor must be placed as close
to the device as possible. to the IC as possible. Suggestion layout
trace wider for thermal.
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RT7296A
Outline Dimension
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