RT7296AGJ8F

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RT7296A

3A, 17V Current Mode Synchronous Step-Down Converter


General Description Features
The RT7296A is a high-efficiency, 3A current mode  4.5V to 17V Input Voltage Range
synchronous step-down DC/DC converter with a wide  3A Output Current
input voltage range from 4.5V to 17V. The device  Internal N-Channel MOSFETs
integrates 80m high-side and 30m low-side  Current Mode Control
MOSFETs to achieve high efficiency conversion. The  Fixed Switching Frequency : 500kHz
current mode control architecture supports fast  Synchronous to External Clock : 200kHz to 2MHz
transient response and internal compensation. A  Cycle-by-Cycle Current Limit
cycle-by-cycle current limit function provides protection  TTH Power-Save Mode
against shorted output. The RT7296A provides  Internal Soft-Start Function
complete protection functions such as input  Input Under-Voltage Lockout
under-voltage lockout, output under-voltage protection,  Output Under-Voltage Protection
over-current protection, and thermal shutdown. The  Thermal Shutdown
PWM frequency is adjustable by the EN/SYNC pin. The
Applications
RT7296A is available in the TSOT-23-8 (FC) package.
 Industrial and Commercial Low Power Systems
Ordering Information  Computer Peripherals

RT7296A  LCD Monitors and TVs

Package Type  Set-top Boxes


J8F : TSOT-23-8 (FC)
Lead Plating System Marking Information
G : Green (Halogen Free and Pb Free)
02= : Product Code
02=DNN DNN : Date Code
Note :
Richtek products are :
 RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes.

Simplified Application Circuit

RT7296A C3
VIN VIN BOOT
C1 L1
SW VOUT
Enable EN/SYNC
PVCC R5 R1
FB
R3
C2 R2 C4
TTH
GND
R4

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RT7296A
Pin Configurations
(TOP VIEW)

EN/SYNC
BOOT
PVCC
FB
8 7 6 5

2 3 4

TTH
VIN
SW

GND
TSOT-23-8 (FC)

Functional Pin Description


Pin No. Pin Name Pin Function
Transition Threshold. Connect a resistor divider to let the RT7296A into power
1 TTH saving mode under light loads. Connect to PVCC to force RT7296A into forced
PWM mode.
Power Input. Support 4.5V to17V Input Voltage. Must bypass with a suitable
2 VIN
large ceramic capacitor at this pin.
3 SW Switch Node. Connect to external L-C filter.
4 GND System Ground.
Bootstrap Supply for High-Side Gate Driver. Connect a 0.1F ceramic
5 BOOT
capacitor between the BOOT and SW pins.
Enable Control Input. High = Enable. Apply an external clock to adjust the
6 EN/SYNC
switching frequency
7 PVCC 5V Bias Supply Output. Connect a 0.1F capacitor to ground.
Feedback Voltage Input. The pin is used to set the output voltage of the
8 FB converter to regulate to the desired voltage via a resistive divider. Feedback
reference = 0.8V.

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RT7296A
Function Block Diagram
TTH PVCC VIN

Internal
Regulator Current
UVLO Sense

BOOT
UVLO
Shutdown
BOOT
EN/SYNC - Comparator
1.4V + Logic & Power
Protection Stage & SW
Control Deadtime
0.4V + Control
- UV
Comparator
1pF HS Switch
Current
Current LS Switch Sense
50pF 400k Comparator Current
Comparator
FB - Slope GND
0.807V + EA Oscillator
Internal SS + Compensation

Operation
Under-Voltage Lockout Threshold Operating Frequency and Synchronization
The IC includes an input Under Voltage Lockout The internal oscillator runs at 500kHz (typ.) when the
Protection (UVLO). If the input voltage exceeds the EN/SYNC pin is at logic-high level (>1.6V). If the EN
UVLO rising threshold voltage (3.9V), the converter pin is pulled to low-level over 8s, the IC will shut down.
resets and prepares the PWM for operation. If the input The RT7296A can be synchronized with an external
voltage falls below the UVLO falling threshold voltage clock ranging from 200kHz to 2MHz applied to the
(3.25V) during normal operation, the device stops EN/SYNC pin. The external clock duty cycle must be
switching. The UVLO rising and falling threshold from 20% to 80% with logic-high level = 2V and
voltage includes a hysteresis to prevent noise caused logic-low level = 0.8V.
reset.
Internal Regulator
Chip Enable The internal regulator generates 5V power and drive
The EN pin is the chip enable input. Pulling the EN pin internal circuit. When VIN is below 5V, PVCC will drop
low (<1.1V) will shut down the device. During shutdown with VIN. A capacitor (>0.1F) between PVCC and
mode, the RT7296A’s quiescent current drops to lower GND is required.
than 1A. Driving the EN pin high (>1.6V) will turn on
Internal Soft-Start Function
the device.
The RT7296A provides internal soft-start function. The
soft-start function is used to prevent large inrush
current while converter is being powered-up. The
soft-start time (VFB from 0V to 0.8V) is 1.5ms.

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RT7296A
Over-Current Protection
RT7296A provides cycle-by-cycle over current
protection. When the inductor current peak value
reaches current limit, IC will turn off high-side MOS to
avoid over current.

Under-Voltage Protection (Hiccup Mode)


RT7296A provides Hiccup Mode of Under-Voltage
Protection (UVP). When the FB voltage drops below
half of the feedback reference voltage, VFB, the UVP
function will be triggered and the IC will shut down for a
period of time and then recover automatically. The
Hiccup Mode of UVP can reduce input current in
short-circuit conditions.

Thermal Shutdown
Thermal shutdown is implemented to prevent the chip
from operating at excessively high temperatures. When
the junction temperature is higher than 150C, the chip
will shut down the switching operation. The chip is
automatically re-enabled when the junction
temperature cools down by approximately 20C.

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RT7296A
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage, VIN --------------------------------------------------------------------------------------------- 0.3V to 20V
 Switch Voltage, SW ------------------------------------------------------------------------------------------------------ 0.3V to VIN + 0.3V
 BOOT to SW, VBOOT – SW --------------------------------------------------------------------------------------------- 0.3V to 6V
 Other Pins------------------------------------------------------------------------------------------------------------------- 0.3V to 6V
 Power Dissipation, PD @ TA = 25C
TSOT-23-8 (FC) ---------------------------------------------------------------------------------------------------------- 1.428W
 Package Thermal Resistance (Note 2)
TSOT-23-8 (FC), JA --------------------------------------------------------------------------------------------------- 70C/W
TSOT-23-8 (FC), JC --------------------------------------------------------------------------------------------------- 15C/W
 Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260C
 Junction Temperature --------------------------------------------------------------------------------------------------- 40C to 150C
 Storage Temperature Range ----------------------------------------------------------------------------------------- 65C to 150C
 ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------------- 2kV

Recommended Operating Conditions (Note 4)


 Supply Input Voltage, VIN ---------------------------------------------------------------------------------------- 4.5V to 17V
 Junction Temperature Range ---------------------------------------------------------------------------------------- 40C to 125C
 Ambient Temperature Range ---------------------------------------------------------------------------------------- 40C to 85C

Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Shutdown Supply Current VEN = 0V -- -- 1 A
Quiescent Current with no Load
VEN = 2V, VFB = 1V, TTH = 0.5V -- 0.8 1 mA
at DCDC Output
Feedback Voltage VFB 0.799 0.807 0.815 V
Feedback Current IFB VFB = 820mV -- 10 50 nA

Switch High-Side RDS(ON)H -- 80 --


m
On-Resistance Low-Side RDS(ON)L -- 30 --
Switch Leakage VEN = 0V, VSW = 0V -- -- 1 A
Current Limit ILIM Under 40% duty-cycle 4.2 5 -- A
Low-Side Switch Current Limit From Drain to Source -- 2 -- A
Oscillation Frequency fOSC VFB = 0.75V 440 500 580 kHz
SYNC Frequency Range f SYNC 200 -- 2000 kHz
Fold-Back Frequency VFB < 400mV -- 125 -- kHz
Maximum Duty-Cycle DMAX VFB = 0.7V 90 95 -- %
Minimum On-Time tON -- 60 -- ns

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RT7296A
Parameter Symbol Test Conditions Min Typ Max Unit
Logic-High VIH 1.2 1.4 1.6
EN Input Voltage V
Logic-Low VIL 1.1 1.25 1.4
VEN = 2V -- 2 --
EN Input Current IEN A
VEN = 0V -- 0 --
EN Turn-off Delay ENtd-off -- 8 -- s

Input Under-Voltage VIN Rising VUVLO VIN Rising 3.7 3.9 4.1 V
Lockout Threshold Hysteresis VUVLO -- 650 -- mV
VCC Regulator VCC -- 5 -- V
VCC Load Regulation VLOAD IVCC = 5mA -- 3 -- %
Soft-Start Time tSS FB from 0V to 0.8V -- 1.5 -- ms
o
Thermal Shutdown Temperature TSD -- 150 -- C
Thermal Shutdown Hysteresis TSD -- 20 -- o
C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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RT7296A
Typical Application Circuit
C3
RT7296A 0.1μF
2 5
VIN VIN BOOT
4.5V to 17V C1
R6
22μF L1
6 10
Enable EN/SYNC 4.7μH
7 3 VOUT
PVCC SW
R3 R5 R1
C2 91k 33k 40.2k
1 TTH 8
0.1μF FB
GND R2 C4
R4 4
13k 44μF
10k

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RT7296A
Typical Operating Characteristics
Efficiency vs. Output Current Output Voltage vs. Input Voltage
100 3.60
90 3.55
VIN = 7V 3.50
80
3.45

Output Voltage (V)


70 VIN = 12V
3.40
Efficiency (%)

VIN = 17V
60 3.35
50 3.30
40 3.25
3.20
30
3.15
20
3.10
10 3.05
VOUT = 3.3V VOUT = 3.3V, IOUT = 3A
0 3.00
0 0.5 1 1.5 2 2.5 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Output Current (A) Input Voltage (V)

Reference Voltage vs. Temperature Output Voltage vs. Load Current


0.84 3.46

0.83 3.42
Reference Voltage (V)

0.82 3.38
Output Voltage (V)

0.81 3.34

0.80 3.30

0.79 3.26

0.78 3.22

0.77 3.18
TTH = 3V VIN = 12V, VOUT = 3.3V
0.76 3.14
-50 -25 0 25 50 75 100 125 0 0.5 1 1.5 2 2.5 3
Temperature (°C) Load Current (A)

UVLO Voltage vs. Temperature EN Threshold vs. Temperature


4.40 1.50

4.20 1.45
UVLO Voltage (V)

EN Threshold (V)

4.00 1.40 Rising


Rising
3.80 1.35

3.60 1.30

3.40 1.25
Falling
Falling
3.20 1.20
VOUT = 3.3V, IOUT = 0A VOUT = 3.3V, IOUT = 0A
3.00 1.15
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

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RT7296A
Load Transient Response Output Ripple Voltage

VOUT VOUT
(100mV/Div) (20mV/Div)

IOUT VLX
VIN = 12V, VOUT = 3.3V,
(1A/Div) IOUT = 1.5A to 3A to 1.5A, L = 4.7H (5V/Div) VIN = 12V, VOUT = 3.3V, IOUT = 3A, L = 4.7H

Time (200s/Div) Time (2s/Div)

Power On from EN Power Off from EN

VOUT VOUT
(2V/Div) (2V/Div)

VEN VEN
(2V/Div) (2V/Div)
VLX VLX
(10V/Div) (10V/Div)

ILX ILX
(3A/Div) (3A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A

Time (5ms/Div) Time (500s/Div)

Power On from VIN Power Off from VIN

VOUT VOUT
(2V/Div) (2V/Div)

VIN VIN
(10V/Div) (10V/Div)
VLX VLX
(10V/Div) (10V/Div)
ILX ILX
(3A/Div) (3A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A VIN = 12V, VOUT = 3.3V, IOUT = 3A

Time (5ms/Div) Time (5ms/Div)

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RT7296A
Application Information
The RT7296A is a high voltage buck converter that can 5V
support the input voltage range from 4.5V to 17V and
the input voltage range from 4.5V to 17V and the output
BOOT
current can be up to 3A. RT7296A 100nF
SW
Output Voltage Selection
The resistive voltage divider allows the FB pin to sense
Figure 2. External Bootstrap Diode
a fraction of the output voltage as shown in Figure 1.
The TTH Voltage setting
R5 R1
FB VOUT
The TTH voltage is used to be change the transition
RT7296A R2
GND
threshold between power saving mode and CCM.
Higher TTH voltage gets higher efficiency at light load
Figure 1. Output Voltage Setting condition but larger output ripple; a lower TTH voltage
For adjustable voltage mode, the output voltage is set can improve output ripple but degrades efficiency
by an external resistive voltage divider according to the during light load condition. A resistor divider from PVCC
following equation : (5V) of RT7296A can help to build TTH voltage, as
 R1  shown in Figure 3. It is recommended that TTH voltage
VOUT  VFB  1  
 R2  should be less than 0.6V.
Where VFB is the feedback reference voltage (0.8V PVCC
typ.). Table 1 lists the recommended resistors value for R3
common output voltages. TTH
RT7296A R4
Table1. Recommended Resistors Value GND
VOUT (V) R1 (k) R2 (k) R5 (k)
1.0 20.5 82 82 Figure 3. TTH Voltage Setting
3.3 40.2 13 33
Inductor Selection
5.0 40.2 7.68 33
The inductor value and operating frequency determine
External Bootstrap Diode the ripple current according to a specific input and
Connect a 100nF low ESR ceramic capacitor between output voltage. The ripple current ΔIL increases with
the BOOT pin and SW pin. This capacitor provides the higher VIN and decreases with higher inductance.
gate driver voltage for the high side MOSFET. It is V   V 
IL   OUT    1  OUT 
recommended to add an external bootstrap diode  f  L   VIN 

between an external 5V and BOOT pin, as shown as Having a lower ripple current reduces not only the ESR
Figure 2, for efficiency improvement when input voltage losses in the output capacitors but also the output
is lower than 5.5V or duty ratio is higher than 65% .The voltage ripple. High frequency with small ripple current
bootstrap diode can be a low cost one such as IN4148 can achieve highest efficiency operation. However, it
or BAT54. The external 5V can be a 5V fixed input from requires a large inductor to achieve this goal.
system or a 5V output (PVCC) of the RT7296A.

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RT7296A
For the ripple current selection, the value of IL = 0.3 voltage since IL increases with input voltage. Multiple
(IMAX) will be a reasonable starting point. The largest capacitors placed in parallel may be needed to meet
ripple current occurs at the highest VIN. To guarantee the ESR and RMS current handling requirement. Dry
that the ripple current stays below the specified tantalum, special polymer, aluminum electrolytic and
maximum, the inductor value should be chosen ceramic capacitors are all available in surface mount
according to the following equation : packages. Special polymer capacitors offer very low
 VOUT   VOUT  ESR value. However, it provides lower capacitance
L  1
 f  IL(MAX)   
VIN(MAX) 
   density than other types. Although Tantalum capacitors
The inductor's current rating (caused a 40°C have the highest capacitance density, it is important to
temperature rising from 25°C ambient) should be only use types that pass the surge test for use in
greater than the maximum load current and its switching power supplies. Aluminum electrolytic
saturation current should be greater than the short capacitors have significantly higher ESR. However, it
circuit peak current limit. can be used in cost-sensitive applications for ripple
current rating and long term reliability considerations.
CIN and COUT Selection
Ceramic capacitors have excellent low ESR
The input capacitance, CIN, is needed to filter the
characteristics but can have a high voltage coefficient
trapezoidal current at the source of the top MOSFET.
and audible piezoelectric effects. The high Q of
To prevent large ripple current, a low ESR input
ceramic capacitors with trace inductance can also lead
capacitor sized for the maximum RMS current should
to significant ringing.
be used. The RMS current is given by :
VOUT VIN Thermal Considerations
IRMS  IOUT(MAX) 1
VIN VOUT For continuous operation, do not exceed absolute
This formula has a maximum at VIN = 2VOUT, where maximum junction temperature. The maximum power
IRMS = IOUT / 2. This simple worst-case condition is dissipation depends on the thermal resistance of the IC
commonly used for design because even significant package, PCB layout, rate of surrounding airflow, and
deviations do not offer much relief. difference between junction and ambient temperature.
Choose a capacitor rated at a higher temperature than The maximum power dissipation can be calculated by
required. Several capacitors may also be paralleled to the following formula :
meet size or height requirements in the design. The PD(MAX) = (TJ(MAX) TA) / θJA
selection of COUT is determined by the required where TJ(MAX) is the maximum junction temperature,
Effective Series Resistance (ESR) to minimize voltage TA is the ambient temperature, and θJA is the junction
ripple. Moreover, the amount of bulk capacitance is to ambient thermal resistance.
also a key for COUT selection to ensure that the control For recommended operating condition specifications,
loop is stable. Loop stability can be checked by viewing the maximum junction temperature is 125°C. The
the load transient response as described in a later junction to ambient thermal resistance, θJA, is layout
section. The output ripple, VOUT, is determined by : dependent. For TSOT-23-8 (FC) package, the thermal
 1  resistance, θJA, is 70°C/W on a standard four-layer
VOUT  IL   ESR  
 8fCOUT  thermal test board. The maximum power dissipation at
The output ripple will be highest at the maximum input TA = 25°C can be calculated by the following formula :
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RT7296A
PD(MAX) = (125°C 25°C) / (70°C/W) = 1.428W for Layout Considerations
TSOT-23-8 (FC) package For best performance of the RT7296A, the following
The maximum power dissipation depends on the layout guidelines must be strictly followed.
operating ambient temperature for fixed TJ(MAX) and  Input capacitor must be placed as close to the IC as
thermal resistance, θJA. The derating curve in Figure 4 possible.
allows the designer to see the effect of rising ambient  SW should be connected to inductor by wide and
temperature on the maximum power dissipation. short trace. Keep sensitive components away from

1.5
this trace.
Maximum Power Dissipation (W)1

Four-Layer PCB
 Keep every trace connected to pin as wide as
1.2 possible for improving thermal dissipation.

0.9

0.6

0.3

0.0
0 25 50 75 100 125
Ambient Temperature (°C)

Figure 4. Derating Curve of Maximum Power


Dissipation

SW should be connected to inductor by Wide and


short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.

SW

BOOT GND VOUT


5

EN/SYNC SW
6

CIN COUT COUT


PVCC VIN
7

TTH
8

R1 FB
VOUT CIN
Via can help to reduce
R2 power trace and improve
R4
R3 GND
thermal dissipation.
The feedback components
must be connected as close PVCC Input capacitor must be placed as close
to the device as possible. to the IC as possible. Suggestion layout
trace wider for thermal.

Figure 5. PCB Layout Guide

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RT7296A
Outline Dimension

Dimensions In Millimeters Dimensions In Inches


Symbol
Min. Max. Min. Max.
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.220 0.380 0.009 0.015
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.585 0.715 0.023 0.028
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

TSOT-23-8 (FC) Surface Mount Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

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