MBRF20100CT

Preferred Device

SWITCHMODEt
Schottky Power Rectifier
The SWITCHMODE Power Rectifier employs the Schottky Barrier
principle in a large area metal- to- silicon power diode.
State-of-the-art geometry features epitaxial construction with oxide
passivation and metal overlay contact. Ideally suited for use as http://onsemi.com
rectifiers in very low-voltage, high-frequency switching power
supplies, free wheeling diodes and polarity protection diodes. SCHOTTKY BARRIER
Features
RECTIFIER
•Highly Stable Oxide Passivated Junction 20 AMPERES, 100 VOLTS
•Very Low Forward Voltage Drop
•Matched Dual Die Construction 2
1

•High Junction Temperature Capability 3

•High dv/dt Capability
•Excellent Ability to Withstand Reverse Avalanche Energy Transients
•Guardring for Stress Protection
•Epoxy Meets UL 94 V-0 @ 0.125 in
•Electrically Isolated. No Isolation Hardware Required.
•Pb-Free Package is Available* ISOLATED TO-220
CASE 221D
STYLE 3
Mechanical Characteristics:
•Case: Epoxy, Molded 1
2
•Weight: 1.9 Grams (Approximately) 3

•Finish: All External Surfaces Corrosion Resistant and Terminal MARKING DIAGRAM
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
AYWW
B20100G
AKA

A = Assembly Location
Y = Year
WW = Work Week
B20100 = Device Code
G = Pb-Free Package
AKA = Polarity Designator

ORDERING INFORMATION
Device Package Shipping

MBRF20100CT TO-220 50 Units/Rail

MBRF20100CTG TO-220 50 Units/Rail

(Pb-Free)
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Preferred devices are recommended choices for future use
Reference Manual, SOLDERRM/D. and best overall value.

© Semiconductor Components Industries, LLC, 2007 1 Publication Order Number:

June, 2007 - Rev. 7 MBRF20100CT/D
 MBRF20100CT

MAXIMUM RATINGS (Per Leg)

Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 100 V
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IF(AV) 10 A
(Rated VR), TC = 133°C Total Device 20
Peak Repetitive Forward Current IFRM 20 A
(Rated VR, Square Wave, 20 kHz), TC = 133°C
Non-repetitive Peak Surge Current IFSM 150 A
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 0.5 A
Operating Junction and Storage Temperature Range (Note 1) TJ, Tstg -65 to +175 °C
Voltage Rate of Change (Rated VR) dv/dt 10000 V/ms
RMS Isolation Voltage (t = 0.3 second, R.H. ≤ 30%, TA = 25°C) (Note 2) Per Figure 3 Viso1 4500 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS (Per Leg)
Rating Symbol Value Unit
Maximum Thermal Resistance, Junction to Case RqJC 3.5 °C/W
Lead Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds TL 260 °C
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic Symbol Max Unit
Maximum Instantaneous Forward Voltage (Note 3) vF V
(iF = 10 Amp, TC = 25°C) 0.85
(iF = 10 Amp, TC = 125°C) 0.75
(iF = 20 Amp, TC = 25°C) 0.95
(iF = 20 Amp, TC = 125°C) 0.85
Maximum Instantaneous Reverse Current (Note 3) iR mA
(Rated DC Voltage, TC = 25°C) 0.15
(Rated DC Voltage, TC = 125°C) 150
1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA.
2. Proper strike and creepage distance must be provided.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)

50
TJ = 150°C
150°C
20 10
I R, REVERSE CURRENT (mA)

TJ = 125°C
10
100°C TJ = 100°C
5.0 1.0
TJ = 25°C
3.0
0.1

1.0

0.01 TJ = 25°C
0.5
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 20 40 60 80 100 120
vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage Per Diode Figure 2. Typical Reverse Current Per Diode

http://onsemi.com
2
 MBRF20100CT

TEST CONDITIONS FOR ISOLATION TESTS*

FULLY ISOLATED PACKAGE

LEADS

HEATSINK

0.110, MIN

Figure 3. Mounting Position for Isolation Test Number 1

*Measurement made between leads and heatsink with all leads shorted together.

MOUNTING INFORMATION

CLIP

HEATSINK

Clip-Mounted

Figure 4. Typical Mounting Technique

http://onsemi.com
3
 MBRF20100CT

PACKAGE DIMENSIONS

TO-220 FULLPAK
CASE 221D-03
ISSUE J

NOTES:
-T- SEATING
PLANE 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-B- C 2. CONTROLLING DIMENSION: INCH
F 3. 221D-01 THRU 221D-02 OBSOLETE, NEW
S STANDARD 221D-03.
Q INCHES MILLIMETERS
U
DIM MIN MAX MIN MAX
A A 0.617 0.635 15.67 16.12
B 0.392 0.419 9.96 10.63
1 2 3 C 0.177 0.193 4.50 4.90
D 0.024 0.039 0.60 1.00
H F 0.116 0.129 2.95 3.28
K -Y- G 0.100 BSC 2.54 BSC
H 0.118 0.135 3.00 3.43
J 0.018 0.025 0.45 0.63
K 0.503 0.541 12.78 13.73
G L 0.048 0.058 1.23 1.47
J N 0.200 BSC 5.08 BSC
N R Q 0.122 0.138 3.10 3.50
L R 0.099 0.117 2.51 2.96
S 0.092 0.113 2.34 2.87
D 3 PL U 0.239 0.271 6.06 6.88
0.25 (0.010) M B M Y STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: [email protected] Phone: 81-3-5773-3850 Sales Representative

http://onsemi.com MBRF20100CT/D
4