323-1851-102.6 (6500 R12.6 PhotonicsEqpt) Issue2

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6500 Packet-Optical Platform

Photonics Equipment
Release 12.6

What’s inside...
New in this release and documentation roadmap
Photonics equipment description
Photonics equipment procedures

323-1851-102.6 - Standard Issue 2


October 2019
Copyright© 2010-2019 Ciena® Corporation. All rights reserved.
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Contacting Ciena
Corporate Headquarters 410-694-5700 or 800-921-1144 www.ciena.com
Customer Technical Support/Warranty www.ciena.com/support/
Sales and General Information North America: 1-800-207-3714 E-mail: [email protected]
International: +44 20 7012 5555
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For additional office locations and phone numbers, please visit the Ciena web site at www.ciena.com.

6500 Packet-Optical Platform Photonics Equipment


Release 12.6 323-1851-102.6 Standard Issue 2
Copyright© 2010-2019 Ciena® Corporation October 2019
READ THIS LICENSE AGREEMENT (“LICENSE”) CAREFULLY BEFORE INSTALLING OR USING CIENA
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unless authorized by Ciena in writing; or

6500 Packet-Optical Platform Photonics Equipment


Release 12.6 323-1851-102.6 Standard Issue 2
Copyright© 2010-2019 Ciena® Corporation October 2019
viii) Publish the results of any benchmark tests run on the Software.
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compliance with this License.
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and effect.

6500 Packet-Optical Platform Photonics Equipment


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v

Contents 0

New in this release and documentation roadmap xv

Photonics equipment description 1-1


Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT circuit pack
(NTK554BAE5) 1-5
Overview 1-5
Supported functionality 1-8
Supported SFPs 1-9
Performance monitoring 1-10
Alarms 1-10
Equipping rules 1-11
Technical specifications 1-13
Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5) 1-17
Overview 1-17
Supported functionality 1-20
Cross-connection types 1-21
Cross-connection rates 1-21
Performance monitoring 1-21
Alarms 1-24
Equipping rules 1-25
Technical specifications 1-26
Latency 1-28
Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5) and Midstage
Line Amplifier (MLA L-Band) circuit pack (NTK552BL) 1-29
Overview 1-29
Supported functionality 1-32
Cross-connection types 1-33
Cross-connection rates 1-33
Performance monitoring 1-33
Alarms 1-36
Equipping rules 1-37
Technical specifications 1-38
Latency 1-43
Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5 and
NTK552FB) 1-44
Overview 1-44
Supported functionality 1-49
Cross-connection types 1-50

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vi Contents

Cross-connection rates 1-50


Performance monitoring 1-50
Alarms 1-54
Equipping rules 1-55
Technical specifications 1-56
Latency 1-61
Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5) and Midstage
Line Amplifier 3 (MLA3 L-Band) circuit pack (NTK552GL) 1-62
Overview 1-62
Supported functionality 1-66
Cross-connection types 1-67
Cross-connection rates 1-67
Performance monitoring 1-67
Alarms 1-71
Equipping rules 1-72
Technical specifications 1-73
Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and Line Interface
Module (LIM L-Band) circuit packs (NTK552DL and NTK552DN) 1-80
Overview 1-80
Supported functionality 1-83
Cross-connection types 1-83
Cross-connection rates 1-84
Performance monitoring 1-84
Alarms 1-86
Equipping rules 1-87
Technical specifications 1-89
Latency 1-90
Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel (OSC) 1xSFP
10/100 BT WSC circuit pack (NTK552JA) 1-91
Overview 1-91
Supported functionality 1-94
Cross-connection types 1-94
Cross-connection rates 1-95
Supported SFPs 1-95
Performance monitoring 1-96
Alarms 1-100
Equipping rules 1-101
Technical specifications 1-103
OSC SFP optical specifications for SRA circuit packs 1-105
Latency 1-105
Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA) 1-106
Overview 1-106
Supported functionality 1-109
Performance monitoring 1-109
Alarms 1-112
Equipping rules 1-113
Technical specifications 1-114
Latency 1-117
Service Access Module (SAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/
100 BT WSC circuit pack (NTK552JN) and Enhanced Service Access Module

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Contents vii

(ESAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/100 BT WSC


circuit pack (NTK552JT) 1-118
Overview 1-118
Supported functionality 1-123
Cross-connection types 1-123
Cross-connection rates 1-123
Supported SFPs 1-124
Performance monitoring 1-125
Alarms 1-130
Equipping rules 1-131
Technical specifications 1-133
OSC SFP optical specifications for SAM/ESAM circuit packs 1-135
Latency 1-135
WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) 1-136
Overview 1-136
Supported functionality 1-138
Performance monitoring 1-140
Alarms 1-142
Equipping rules 1-143
Technical specifications 1-145
Latency 1-145
WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and
NTK553JB) 1-146
Overview 1-146
Supported functionality 1-152
Performance monitoring 1-153
Alarms 1-156
Equipping rules 1-157
Technical specifications 1-159
Latency 1-160
WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA) 1-161
Overview 1-161
Supported functionality 1-164
Performance monitoring 1-165
Alarms 1-167
Equipping rules 1-168
Technical specifications 1-169
Latency 1-169
WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and
NTK553LB) 1-170
Overview 1-170
Supported functionality 1-176
Performance monitoring 1-178
Alarms 1-182
Equipping rules 1-183
Technical specifications 1-185
Latency 1-187
WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM) 1-188
Overview 1-188

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viii Contents

Supported functionality 1-191


Performance monitoring 1-193
Alarms 1-195
Equipping rules 1-196
WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA) 1-197
Overview 1-197
Supported functionality 1-200
Performance monitoring 1-202
Alarms 1-204
Equipping rules 1-205
Technical specifications 1-206
Latency 1-206
WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and
NTK553KAE5) 1-207
Overview 1-207
Supported functionality 1-213
Performance monitoring 1-214
Alarms 1-217
Equipping rules 1-218
Technical specifications 1-220
Latency 1-220
ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (NTK553RA) 1-221
Overview 1-221
Supported functionality 1-224
Performance monitoring 1-225
Alarms 1-229
Equipping rules 1-230
Technical specifications 1-231
Latency 1-237
Optical Power Monitor (OPM C-Band) 2 Port circuit pack (NTK553PAE5) and Optical
Power Monitor (OPM Flex C-Band) 2-Port circuit pack (NTK553PB) 1-238
Overview 1-238
Supported functionality 1-242
Performance monitoring 1-243
Alarms 1-246
Equipping rules 1-246
Technical specifications 1-247
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs
(NTK508AxE5) 1-249
Overview 1-249
Supported functionality 1-252
Cross-connection types 1-254
Cross-connection rates 1-254
Performance monitoring 1-254
Alarms 1-256
Equipping rules 1-256
Technical specifications 1-258
Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),
Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack

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Contents ix

(NTK553GC) 1-259
Overview 1-259
Supported functionality 1-266
Performance monitoring 1-268
Alarms 1-273
Equipping rules 1-274
Technical specifications 1-275
Latency 1-277
12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (NTK508FAE5)
and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack
(NTK508FL) 1-278
Overview 1-278
Supported functionality 1-281
Cross-connection types 1-283
Cross-connection rates 1-283
Performance monitoring 1-283
Alarms 1-287
Equipping rules 1-288
Technical specifications 1-289
Latency 1-290
8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band 1xCXM) circuit
pack (NTK508HA) and CCMD8x16 C-Band Expansion Module (CXM C-Band
Type 1) (NTK576BA) 1-291
Overview 1-291
Supported functionality 1-297
Performance monitoring 1-300
Alarms 1-302
Equipping rules 1-303
Technical specifications 1-304
Latency 1-306
Optical multiplexers (OMX) modules (NT0H32xxE5) 1-307
Overview 1-307
OMX 4CH DWDM 1-310
OMX 16CH DWDM 1-318
Alarms 1-327
Equipping rules 1-327
Technical specifications 1-327
Center wavelength frequencies 1-330
OMX engineering rules 1-331
Optical link budgets 1-331
Calculating the link budget - OMX 4CH 1-332
Calculating the link budget - OMX 16CH 1-337
OMX fibering 1-344
44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules (NTT862AAE5 and
NTT862FAE5) 1-349
Overview 1-349
Supported functionality 1-353
Cross-connection types 1-356
Cross-connection rates 1-356
Alarms 1-356

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x Contents

Equipping rules 1-357


Technical specifications 1-358
Latency 1-358
44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, NTT862BDE5) 1-359
Overview 1-359
Supported functionality 1-365
Cross-connection types 1-372
Cross-connection rates 1-372
Performance monitoring 1-372
Alarms 1-374
Equipping rules 1-374
Technical specifications 1-375
Latency 1-375
64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA) 1-376
Overview 1-376
Supported functionality 1-378
Cross-connection types 1-381
Cross-connection rates 1-381
Alarms 1-382
Equipping rules 1-382
Technical specifications 1-383
Latency 1-383
96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA) 1-384
Overview 1-384
Supported functionality 1-386
Cross-connection types 1-391
Cross-connection rates 1-391
Performance monitoring 1-391
Alarms 1-393
Equipping rules 1-393
Technical specifications 1-394
Latency 1-394
16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (NTT862KA) 1-395
Overview 1-395
Supported functionality 1-397
Alarms 1-399
Equipping rules 1-400
Technical specifications 1-401
Latency 1-401
24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (NTT862LA) 1-402
Overview 1-402
Supported functionality 1-404
Alarms 1-407
Equipping rules 1-407
Technical specifications 1-407
Latency 1-408
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules
(NTK504AxE5) 1-409
Overview 1-409

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Supported functionality 1-413


Alarms 1-415
Equipping rules 1-416
Technical specifications 1-417
Broadband Mux/Demux 1x2 module (NTT862DAE5) 1-418
Overview 1-418
Supported functionality 1-419
Alarms 1-421
Equipping rules 1-421
Technical specifications 1-422
Latency 1-422
Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5) 1-423
Overview 1-423
Supported functionality 1-424
Alarms 1-426
Equipping rules 1-426
Technical specifications 1-427
Latency 1-427
Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5) 1-428
Overview 1-428
Supported functionality 1-429
Alarms 1-431
Equipping rules 1-431
Technical specifications 1-432
Latency 1-432
C/L-Band Mux/Demux (CLMD) module (NTK504PA) 1-433
Overview 1-433
Supported functionality 1-435
Alarms 1-436
Equipping rules 1-436
Technical specifications 1-438
Latency 1-438
Upgrade Coupler/Splitter (UCS) module (NTK504PL) 1-439
Overview 1-439
Supported functionality 1-441
Alarms 1-442
Equipping rules 1-442
Technical specifications 1-443
Latency 1-443
Monitor Coupler/Splitter (MonCS) nodule (NTK504PN) 1-444
Overview 1-444
Supported functionality 1-445
Alarms 1-446
Equipping rules 1-447
Provisioning rules 1-447
Technical specifications 1-448
Latency 1-448
10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10 Group Mux/
Demux (GMD10) L-Band module (NTT862GL) 1-449
Overview 1-449

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xii Contents

Supported functionality 1-453


Alarms 1-454
Equipping rules 1-455
Technical specifications 1-455
Latency 1-456
Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB, NTK504CC, NTK504CD,
NTK504CE, and NTK504CF) 1-457
Overview 1-457
Supported functionality 1-468
Alarms 1-474
Equipping rules 1-475
Technical specifications 1-476
Latency 1-477
Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA) 1-478
Overview 1-478
Supported functionality 1-480
Alarms 1-481
Equipping rules 1-481
Technical specifications 1-482
Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,
NTT870ExE5, and NTT870GxE5) 1-483
Overview 1-483
Supported functionality 1-485
Alarms 1-486
Equipping rules 1-486
Technical specifications 1-487
Latency 1-489
Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB) 1-490
Overview 1-490
Supported functionality 1-492
Performance monitoring 1-493
Alarms 1-495
Equipping rules 1-496
Technical specifications 1-497
Latency 1-498
Photonic passive equipment 1-499
Overview 1-499
2-Slot Optical Module Chassis (OMC2) (NTK504NA) 1-500
2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001) 1-501
2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900) 1-503
6-slot passive photonic chassis (PPC6) (174-0040-900) 1-505
100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x) 1-508
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (174-0104-
900) 1-514
Performance monitoring 1-516
Cross-connection types 1-518
Cross-connection rates 1-518
Latency 1-518
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (174-0115-
900) 1-519

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Performance monitoring 1-521


Latency 1-523
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (174-0116-
900) 1-524
Performance monitoring 1-526
Latency 1-528
Band splitter 100 GHz modules (B-720-0020-0xx) 1-529
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module
(B-720-0014-003) 1-535
2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x, B-
955-0003-3xx, 166-0203-9xx, 166-0403-9xx) 1-536
Supported functionality 1-541
Alarms 1-545
Equipping rules 1-545
Technical specifications 1-548

Photonics equipment procedures 2-1


Photonic circuit packs provisioning procedures 2-1
Non-passive photonic OTS 2-2
Passive photonic OTS 2-3
List of procedures
2-1 Provisioning a circuit pack automatically 2-4
2-2 Provisioning a pluggable automatically 2-9
2-3 Routing fiber-optic cables and electrical cables onto the 6500 shelf 2-10
2-4 Connecting or disconnecting fiber-optic cables to or from circuit packs 2-11
2-5 Setting up the photonic system configurations 2-12
2-6 Changing the primary state of a facility 2-13
2-7 Changing the primary state of a circuit pack or pluggable 2-15
2-8 Deleting a facility from an equipment 2-17
2-9 Deleting a circuit pack, module, or pluggable 2-19
Primary and secondary states 2-21
ADJ facility parameters 2-22
AMP facility parameters 2-47
AMPMON facility parameters 2-54
CHC facility parameters 2-55
DISP facility parameters 2-59
NMCC facility parameters 2-61
OTDRCFG facility parameters 2-66
OPTMON facility parameters 2-69
PC facility parameters 2-71
RAMAN facility parameters 2-71
TELEMETRY facility parameters 2-73
SSC facility parameters 2-74
VOA facility parameters 2-75

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xiv Contents

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New in this release and documentation


roadmap 0

This Technical Publication supports 6500 Packet-Optical Platform (6500)


Release 12.6 software and subsequent maintenance releases for Release
12.6.

Issue 2
This document was up-issued to include
• the modified OPTMON facility parameter table for SRA and ESAM LOS
Threshold. See Table 2-11 on page 2-69 for details.
• the modified equipping rules for ROADM with Line Amplifier (RLA) C-Band
5x1 circuit pack (NTK553RA). See “Equipping rules” on page 1-230 for
details.
Issue 1
The following section details what’s new in 6500 Packet-Optical Platform
Photonics Equipment, 323-1851-102.6, Standard Issue 1 for Release 12.6.

The following new/enhanced features are covered in this document.


• Monitor Coupler/Splitter (NTK504PN)
• FIM Type 3 (NTK504CC)

6500 Packet-Optical Platform technical publications


The following two roadmaps identify the technical publications that support the
6500 D-Series and S-Series and the technical publications that support the
6500 T-Series platform for Release 12.6.

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xvi New in this release and documentation roadmap

6500 D-Series and S-Series roadmap


Planning a Network Installing, Managing and Maintaining and Circuit Pack-Based
Commissioning and Provisioning Troubleshooting Documentation
Testing a Network a Network a Network

Documentation Installation - Administration Fault Management - Common Equipment


Roadmap General Information and Security Performance (323-1851-102.1)
(323-1851-090) (323-1851-201.0) (323-1851-301) Monitoring
(323-1851-520) Electrical
Planning - Installation - Configuration -
(323-1851-102.2)
Parts 1, 2, and 3 2-slot Shelves Provisioning &
(NTRN10EY) Operating Parts 1 & 2 Fault Management -
(323-1851-201.1) OC-n/STM-n
Data Comms (323-1851-310) Alarm Clearing
(323-1851-102.3)
Planning & User Guide Installation - 7-slot & Parts 1 and 2
(323-1851-101) 6500-7 packet-optical Configuration - (323-1851-543) WaveLogic Ai, Flex,
Shelves Protection Switching 100G+, 40G,
Ordering Information
(323-1851-201.2) (323-1851-315) Fault Management - OSIC ISS, & SLIC10
(323-1851-151)
Module (323-1851-102.4)
Manufacturing Installation - Configuration - Replacement
Discontinued Parts 14-slot Shelves Bandwidth & Data (323-1851-545)
(323-1851-155) (323-1851-201.3) Services Parts 1,2,3 Broadband/SMUX
(323-1851-320) OTN FLEX MOTR
NBI Fundamentals Installation - Fault Management - (323-1851-102.5)
(323-1851-165) 32-slot Shelves Configuration - SNMP
(323-1851-201.4) Control Plane (323-1851-740) Photonics
Latency
(323-1851-330) Equipment
Specifications Passive Chassis
(323-1851-170) Encryption and FIPS Fault Management - (323-1851-102.6)
(2150 & Photonics), Customer Visible
Pluggable Security Policy
Filters, and Modules Logs Data and Layer 2
Datasheets Overview and
(323-1851-201.5) (323-1851-840) (323-1851-102.7)
and Reference Procedures
(323-1851-180) (323-1851-340)
Licensing OTN I/F, PKT I/F, &
TL-1 Description (323-1851-210) MyCryptoTool PKT/OTN I/F
(323-1851-190) Certificate (323-1851-102.8)
Commissioning Management and
CLI Reference and Testing Quick Start
(323-1851-193) (323-1851-221) (323-1851-341)
Site Manager
Fundamentals
(323-1851-195)

SAOS-based Command Fault and MIB


Configuration Reference
Packet Services Reference Performance
(323-1851-630) (323-1851-690)
Documentation (323-1851-610) (323-1851-650)

Supporting WaveLogic Photonics 6500 Data 6500 Control Plane Submarine Networking
Documentation Coherent Select Application Guide Application Guide Application Guide
(323-1851-980) (NTRN15BA) (NTRN71AA) (NTRN72AA)
6500 Photonic Common 6500 - 5400 / 8700 Fiber Node Return 6500 AC Rectifier
Layer Guide Photonic Layer Interworking Solution Configuration (323-1851-900)
(NTRN15DA) Technical Publications (323-1851-160) (323-1851-985)

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New in this release and documentation roadmap xvii

6500 T-Series roadmap

Planning a Network Installing, Managing and Maintaining and


Commissioning and Provisioning Troubleshooting
Testing a Network a Network a Network

T-Series Administration Fault Management -


Installation - Performance
Shelf Guide and Security
T-Series Shelves Monitoring
(323-1851-103) (323-1851-301)
(323-1851-201.6) (323-1851-520)
Data Communications Configuration -
Planning and Licensing Provisioning and Fault Management -
User Guide (323-1851-210) Operating Parts 1 & 2 Alarm Clearing
(323-1851-101) for T-Series Parts 1 and 2
T-Series Shelf (323-1851-311) for T-Series
Manufacturing Guide
(323-1851-544)
Discontinued Parts (323-1851-103) Configuration -
(323-1851-155) Protection Switching Fault Management -
(323-1851-315) Module
NBI Fundamentals
Replacement
(323-1851-165) Configuration - for T-Series
Bandwidth (323-1851-546)
TL-1 Description for T-Series
for T-Series (323-1851-321) Fault Management -
(323-1851-191) SNMP
CLI Reference Configuration - (323-1851-740)
for T-Series Control Plane
(323-1851-194) (323-1851-330) Fault Management -
Customer Visible
Site Manager Logs
Fundamentals (323-1851-840)
(323-1851-195)

SAOS-based Command Fault and MIB


Packet Services Configuration Reference
Reference Performance
Documentation (323-1851-630) (323-1851-690)
(323-1851-610) (323-1851-650)

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1-1

Photonics equipment description 1-

This section provides an overview of the 6500 Packet-Optical Platform (6500)


Photonics equipment. See the following table for different circuit packs
covered in this section.

Note: Refer to 6500 Packet-Optical Platform Photonic Layer Guide,


NTRN15DA, for detailed information on Photonic concepts, applications,
and engineering rules supported in this release of 6500.

Table 1-1
Photonic circuit packs and modules in this chapter

Topic

Circuit packs

“Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT circuit pack
(NTK554BAE5)” on page 1-5

“Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5)” on page 1-17

“Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5) and Midstage
Line Amplifier (MLA L-Band) circuit pack (NTK552BL)” on page 1-29

“Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5 and


NTK552FB)” on page 1-44

“Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5) and


Midstage Line Amplifier 3 (MLA3 L-Band) circuit pack (NTK552GL)” on page 1-62

“Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and Line Interface
Module (LIM L-Band) circuit packs (NTK552DL and NTK552DN)” on page 1-80

“Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (NTK552JA)” on page 1-91

“Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA)” on page 1-106

“Service Access Module (SAM C-Band) w/Optical Service Channel (OSC) 1xSFP
10/100 BT WSC circuit pack (NTK552JN) and Enhanced Service Access Module
(ESAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/100 BT WSC circuit
pack (NTK552JT)” on page 1-118

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Table 1-1
Photonic circuit packs and modules in this chapter (continued)

“WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5)” on page 1-136

“WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and NTK553JB)” on
page 1-146

“WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA)” on page 1-161

“WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and NTK553LB)” on page
1-170

“WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM)” on page 1-188

“WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA)” on page 1-197

“WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and NTK553KAE5)”
on page 1-207

“ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (NTK553RA)” on page
1-221

“Optical Power Monitor (OPM C-Band) 2 Port circuit pack (NTK553PAE5) and
Optical Power Monitor (OPM Flex C-Band) 2-Port circuit pack (NTK553PB)” on page
1-238

“4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs (NTK508AxE5)”


on page 1-249

“Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),


Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (NTK553GC)” on page
1-259

“12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (NTK508FAE5)


and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack (NTK508FL)”
on page 1-278

“8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band 1xCXM) circuit


pack (NTK508HA) and CCMD8x16 C-Band Expansion Module (CXM C-Band Type
1) (NTK576BA)” on page 1-291

Passive modules/circuit pack/chassis

“Optical multiplexers (OMX) modules (NT0H32xxE5)” on page 1-307

“44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules (NTT862AAE5 and
NTT862FAE5)” on page 1-349

“44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,


NTT862BBE5, NTT862BCE5, NTT862BDE5)” on page 1-359

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Table 1-1
Photonic circuit packs and modules in this chapter (continued)

“64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA)” on page


1-376

“96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA)” on page


1-384

“16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (NTT862KA)” on page
1-395

“24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (NTT862LA)” on page
1-402

“4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules (NTK504AxE5)”


on page 1-409

“Broadband Mux/Demux 1x2 module (NTT862DAE5)” on page 1-418

“Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5)” on page


1-423

“Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5)” on page


1-428

“C/L-Band Mux/Demux (CLMD) module (NTK504PA)” on page 1-433

“Upgrade Coupler/Splitter (UCS) module (NTK504PL)” on page 1-439

“Monitor Coupler/Splitter (MonCS) nodule (NTK504PN)” on page 1-444

“10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10 Group


Mux/Demux (GMD10) L-Band module (NTT862GL)” on page 1-449

“Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB, NTK504CC,


NTK504CD, NTK504CE, and NTK504CF)” on page 1-457

“Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA)” on page
1-478

“Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,


NTT870ExE5, and NTT870GxE5)” on page 1-483

“Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB)” on page 1-490

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Table 1-1
Photonic circuit packs and modules in this chapter (continued)

Photonic passive equipment including:

— “2-Slot Optical Module Chassis (OMC2) (NTK504NA)” on page 1-500

— “2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)” on page


1-501

— “2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)” on page


1-503

— “6-slot passive photonic chassis (PPC6) (174-0040-900)” on page 1-505

— “100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)” on page 1-508

— “CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4)


100 GHz modules (B-720-0020-0xx)” on page 1-508

— “CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules


(B-720-0022-00x)” on page 1-511

— “Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (174-0104-900)”


on page 1-514

— “Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (174-0115-900)”


on page 1-519

— “Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (174-0116-900)”


on page 1-524

Band splitter 100 GHz modules (B-720-0020-0xx) including:

— “CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (B-720-0014-003)” on page 1-535

— “2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x,


B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)” on page 1-536

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Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT


circuit pack (NTK554BAE5)
Overview
The Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT (also
referred to as 2xOSC) module provides the physical layer communication
across photonic optical spans for the 6500 system. Each module can support
two independent 155 Mbps Ethernet-over-SONET (EOS) communications
channels (one per direction) at 1511 nm that are muxed together with the line
signal in the LIM module of the associated Optical Transmission Section
(OTS). Each OSC channel is generated by a dedicated Small Form Pluggable
(SFP) that has various reach options available.

The OSC signal is divided into two working channels, an internal comms
channel for use by the 6500 OAM&P functions and a customer wayside
channel which provides a layer 2 channel for any customer communication
needs across the span.

Note: The integrated 2xOSC in SPAP-2 w/2xOSC (NTK555NA or


NTK555NB) has the exact same functionality of standalone 2xOSC circuit
pack (NTK554BAE5) described in this section.

Figure 1-1 on page 1-6 shows the faceplate of a 2xOSC circuit pack and
Figure 1-2 on page 1-7 provides a functional block diagram of the 2xOSC
circuit pack.

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Figure 1-1
2xOSC circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

OSC ports

Red/yellow bi-color circle (Fail/LOS)


- Used to communicate Rx Loss of Signal/optical module fail
- Red = module fail;
- Yellow = Rx Loss of Signal

WSC ports

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Figure 1-2
2xOSC circuit pack block diagram (NTK554BAE5)

EOS SFP
1
Mapper OSC-1

EOS SFP
Ethernet
Mapper OSC-2 2
Switch
Backplane

10/100BT
RJ45 3
Wayside-3
10/100BT
RJ45 4
Wayside-4

Processor Power
Module Supply

Legend
EOS Ethernet over SONET
OSC Optical service channel

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Supported functionality
The 2xOSC circuit pack (NTK554BAE5) provides the following functionality:
• up to two OSC facilities operating out of band in the 1511 nm CWDM
window provided by two OC3/STM1 SFP ports (see Table 1-2 for function
and connector type for each OSC port).
Table 1-2
2xOSC optical interfaces

Interface name Physical port # Function Connector type

OSC 1 In / Out 1 Out-of-band (1511 nm) OSC input / Dual LC


output to and from Amplifier

OSC 2 In / Out 2 Out-of-band (1511 nm) OSC input / Dual LC


output to and from Amplifier

• for an in-line amplifier application, two SFPs are required and the two
SFPs can both be equipped on the same 2xOSC circuit pack or on
different 2xOSC circuit packs. If equipped on different 2xOSC circuit
packs, it provides datacomms protection if one of the 2xOSC circuit pack
fails.
• optical generation and termination of each OSC facility
• Ethernet over SONET (EOS) mapping of each OSC facility
• wayside access for customer use (IP over 10/100BT Ethernet data
communications for unspecified use by the customer) provided by two
10/100BT ports (RJ45 MDI-X connectors). The wayside access ports are
called WSC. The default rate for the wayside channel is 10BT Full Duplex.
When configured in 100BT, the wayside traffic will be squelched when the
rate exceeds 45 Mb/sec, this is performed in order to avoid OSC link
congestion and potential impact on management and operations. Refer to
6500 Packet-Optical Platform Photonic Layer Guide, NTRN15DA for more
information on wayside channel.
Note: Each LAN port is configurable as half-duplex 10 Mbit/s, half-duplex
100 Mbit/s, full-duplex 10 Mbit/s, full-duplex 100 Mbit/s, or Automatic. If
you set the configuration to Automatic, auto-negotiation is enabled.
Auto-negotiation automatically senses the speed (10BT/100BT) and
mode (half-/full-duplex) settings of the link. If the configuration is set to
Automatic, the Wayside ports automatically detect the correct MDI/MDI-X
setting to use, so either straight or crossover cables can be used. If the
configuration is not set to automatic, then since the Wayside ports are
MDI-X type, use a straight 10/100BT cable to connect to a MDI interface
or a crossover 10/100BT cable to connect to a MDI-X interface.

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Photonics equipment description 1-9

• OSC Signal Degrade alarming based on user-provisioned Signal Degrade


Threshold. Signal Degrade Threshold default is 1E-6. Other possible
values are 1E-4, 1E-5, 1E-7, 1E-8, 1E-9 and 1E-10.
• OSC Estimated Bit Error Rate calculation.
• RTD and distance measurement

Supported SFPs
The following provides a list of the SFPs that are supported on the 2xOSC
circuit pack.

Table 1-3
Supported SFP modules for the 2xOSC circuit pack (NTK554BAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1 and Note 2)

• P155M OC-3/STM-1 CWDM 1511 nm (0-15 dB span) NTK592NPE6


— OSC, (ADJ, ADJ-FIBER) — OC-3/STM-1 (155.52Mb/s)
(Note 3)
OC-3/STM-1 CWDM 1511 nm (10-30 dB span) NTK592NBE6
— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (20-34 dB span) NTK592NHE6


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (0-34 dB span) NTK592NGE5


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 DWDM 1610.06 nm (12-40 dB span) NTK592NS


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (12-42 dB span) NTK592NVE5


— OC-3/STM-1 (155.52Mb/s)

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Table 1-3
Supported SFP modules for the 2xOSC circuit pack (NTK554BAE5)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1 and Note 2)

• P155622M OC-3/12/STM-1/4 SR1/I1.1_I4.1 1310 nm SFP NTTP04BF


— OSC, (ADJ, ADJ-FIBER) — OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)

OC-3/12/STM-1/4 IR1/S1.1_S4.1 1310 nm XCT NTTP04CF


Enhanced SFPs
— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)

Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and OnePlanner design.
Note 3: The P155M pluggable on the 2xOSC circuit pack supports WSC facilities. These facilities are
not displayed or managed in the Equipment & Facilities Provisioning applications. They are handled by
Comms Setting Management application through LAN option under Interfaces tab. If you provision the
low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV or NTK592NS), the
connected LIM port 4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal”
alarm from being raised.

Performance monitoring
The 2xOSC circuit pack supports the following monitored entities:
• PM collection of SONET section (S)/SDH regenerator section (RS) at
OC-3/STM-1 rate for OSC facilities
• PM collection of SONET line (L)/SDH multiplex section (MS) at
OC-3/STM-1 rate for OSC facilities
• Physical layer PM collection for OSC facilities

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed

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• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Packet Rate Limit Exceeded
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• SLDD Adjacency Loss
Pluggable alarms
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Unknown - Pluggable
• Circuit Pack Failed - Pluggable
• Autoprovisioning Mismatch - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

Photonic alarms
• OSC Loss of Signal
• OSC Signal Degrade
• OSC OSPF Adjacency Loss

Common equipment alarms


• Software Auto-Upgrade in Progress
• WAYSIDE 1 Port Failure
• WAYSIDE 2 Port Failure

Equipping rules
The following equipping rules apply to 2xOSC circuit pack:
• is a four-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.

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• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or


NTK503KA).
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
• cannot be equipped in the 2-slot shelf.

ATTENTION
If there is an intention to use Wayside traffic on the 2xOSC circuit pack now or in the
future, it is recommended to equip 2xOSC as follows:
— slot 1 of the 6500-7 packet-optical shelf (for the first pair of 2xOSC circuit packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of 2xOSC circuit packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of 2xOSC circuit packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the two Wayside Ethernet ports found on the 2xOSC
circuit pack.
The Wayside Ethernet ports are intended for intrabuilding use only. For the
NTK503KA variant of 7-slot shelf, it is recommended to use the integrated 2xOSC
on the SPAP-2 w/2xOSC (NTK555NA or NTK555NB); the second choice is to equip
a 2xOSC circuit pack in slot 1.

• up to four 2xOSC circuit packs can be equipped in a 6500-7


packet-optical, 7-slot, 14-slot, or 32-slot 6500 shelf at the same time.
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a 2xOSC circuit pack:
• the 2xOSC circuit packs do not use any cross-connect capacity and can
be installed in shelves equipped with or without cross-connect circuit
packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a 2xOSC circuit pack
• In a 14-slot shelf type, when the 2xOSC circuit packs are installed in slot
7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a 2xOSC circuit pack
• In a 6500-7 packet-optical shelf type, when the 2xOSC circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

Technical specifications
The following lists the weight, power consumption, transmitter, and receiver
specifications for the 2xOSC optical interface circuit pack and 2xOSC ports on
shelf processor SPAP-2 w/2xOSC.

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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB)

Parameter 2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC


(NTK555NA or NTK555NB)
Weight (estimated) 0.7 kg (1.6 lb)
Power consumption Typical (W): 20 (Note 1 and Note 4)
Power Budget (W): 20 (Note 2 and Note 4)
Transmitter
Connector type LC
SFP types (Note 5) Short reach SFP (0-15 dB span) (NTK592NPE6)
Standard reach SFP (10-30 dB span) (NTK592NBE6)
Premium reach SFP (20-34 dB span) (NTK592NHE6)
Long reach SFP (0-34 dB span) (NTK592NGE5)
Extended reach SFP (12-40 dB span) (NTK592NS)
Extended reach SFP (12-42 dB span) (NTK592NVE5)
Short reach SFP (NTTP04BF)
Intermediate reach SFP (NTTP04CF)
Laser modulation NRZ
Wavelength range 1511 nm +/- 6.5 nm
Maximum transmit output 0 dBm (EOL) for Short reach SFP (0-15 dB span) (NTK592NPE6)
power 5 dBm (EOL) for Standard reach SFP (10-30 dB span) (NTK592NBE6)
5 dBm (EOL) for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-4 dBm (EOL) for Long reach SFP (0-34 dB span) (NTK592NGE5)
4 dBm (EOL) for Extended reach SFP (12-40 dB span) (NTK592NS)
5 dBm (EOL) for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-8 dBm (EOL) for short reach SFP (NTTP04BF)
-8 dBm (EOL) for intermediate reach SFP (NTTP04CF)
Minimum transmit output -5 dBm (EOL) for Short reach SFP (0-15 dB span) (NTK592NPE6)
power 0 dBm (EOL) for Standard reach SFP (10-30 dB span) (NTK592NBE6)
1 dBm (EOL) for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-7.5 dBm (EOL) for Long reach SFP (0-34 dB span) (NTK592NGE5)
0 dBm (EOL) for Extended reach SFP (12-40 dB span) (NTK592NS)
1 dBm (EOL) for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-15 dBm (EOL) for short reach SFP (NTTP04BF)
-15 dBm (EOL) for intermediate reach SFP (NTTP04CF)

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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB) (continued)

Parameter 2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC


(NTK555NA or NTK555NB)
Tx power monitor accuracy +/- 2 dB over the following power ranges:
-8 to 0 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-3 to 5 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-2 to 5 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-10.5 to -4 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-3 to 5 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-2 to 5 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-15 to -8 dBm for short reach SFP (NTTP04BF)
-15 to -8 dBm for intermediate reach SFP (NTTP04CF)
Receiver
Receiver sensitivity -34 dBm (EOL sensitivity) for Short reach SFP (0-15 dB span)
(NTK592NPE6)
-34 dBm (EOL sensitivity) for Standard reach SFP (10-30 dB span)
(NTK592NBE6)
-37 dBm (EOL sensitivity) for Premium reach SFP (20-34 dB span)
(NTK592NHE6)
-44 dBm (EOL sensitivity) for Long reach SFP (0-34 dB span)
(NTK592NGE5)
-40.5 dBm (EOL sensitivity) for Extended reach SFP (12-40 dB span)
(NTK592NS)
-44 dBm (EOL sensitivity) for Extended reach SFP (12-42 dB span)
(NTK592NVE5)
-23 dBm (EOL sensitivity) for short reach SFP (NTTP04BF)
-28 dBm (EOL sensitivity) for intermediate reach SFP (NTTP04CF)
Receiver overload -1 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-3 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-10 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-7 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-7 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-7 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-8 dBm for short reach SFP (NTTP04BF)
-8 dBm for intermediate reach SFP (NTTP04CF)

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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB) (continued)

Parameter 2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC


(NTK555NA or NTK555NB)
Rx power monitor accuracy +/- 2 dB over the following power ranges:
(Note 6) -29 to -1 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-37 to -13 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-37 to -13 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-44 to -20 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-44 to -24 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-44 to -20 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-23 to -8 dBm for short reach SFP (NTTP04BF)
-28 to -8 dBm for intermediate reach SFP (NTTP04CF)
Maximum link budget 15 dB for Short reach SFP (0-15 dB span) (NTK592NPE6)
30 dB for Standard reach SFP (10-30 dB span) (NTK592NBE6)
34 dB for Premium reach SFP (20-34 dB span) (NTK592NHE6)
34 dB for Long reach SFP (0-34 dB span) (NTK592NGE5)
40 dB for Extended reach SFP (12-40 dB span) (NTK592NS)
42 dB for Extended reach SFP (12-42 dB span) (NTK592NVE5)
7 dB for short reach SFP (NTTP04BF)
12 dB for intermediate reach SFP (NTTP04CF)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add the
power values for each of the required pluggable devices. For pluggable transceiver power values, refer
to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and OnePlanner design.
Note 6: The Rx power monitoring accuracy is undefined outside the mentioned ranges.

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Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5)


Overview
The Single Line Amplifier (SLA C-Band) circuit pack (also referred to as SLA)
is used for edge applications and contains a single (pre-amplifier)
erbium-doped fiber amplifier (EDFA), a non-amplified line passthrough with
power monitoring in place of the post amplifier, and a single OSC channel
(1511 nm) splitter/coupler. This circuit pack is equipped at a 6500 site where
pre-amplification is required according to link engineering rules.

The 6500 amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control that
delivers enhanced reach capabilities to ensure each wavelength is amplified
equally.

Figure 1-3 on page 1-18 shows the faceplate of an SLA circuit pack and
Figure 1-4 on page 1-19 provides a functional block diagram of the SLA circuit
pack.

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Figure 1-3
SLA circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-4
SLA circuit pack block diagram (NTK552AAE5)

Mon B 1

OSC B In 3

Line B Out 5
Backplane

PD

Line B In 6

Mon A 2

EDFA
Line A Out 7

PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
OSC Optical service channel
PD Photodiode

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Supported functionality
The SLA circuit packs (NTK552AAE5) provide the following functionality:
• wavelength range: C-band 1530.33 nm to 1565.09 nm
• 50 GHz and 100 GHz grid compliant
• integrated OSC add/drop filters - OSC add/drop ports
• external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the SLA circuit pack (NTK552AAE5) is
supported in MuxAmp configurations. The MuxAmp is used in some
networks where lower power interfaces (like the WL3n source) are used.
This configuration requires that the Shelf Processor disables the
Automatic Power Reduction (APR), otherwise APR may be triggered
during normal operation. For this reason, the SLA circuit pack
(NTK552AAE5) is reclassified as Class 1M from IEC 60825-1. When APR
is disabled, clamping is added automatically to ensure safety. Circuit
packs that were originally manufactured with a Hazard Level 1 warning
label can be re-labeled with the Level 1M label kit (part number
415-2818-001). For information on how to apply this label, see the section
on observing product and personnel safety guidelines in Installation -
General Information, 323-1851-201.0.

• the following combinations can be used as an alternative to SLA/SLA pair


at uncompensated line-amp sites, as dictated by link-engineering
— MLA2/LIM C-Band
— MLA2 w/VOA/LIM C-Band
— MLA3 C-Band/LIM C-Band
• SLA is supported for a Cascaded LIM C-Band or a Drop LIM C-Band
configuration
• see Table 1-5 for function and connector type for each port

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Table 1-5
SLA optical interfaces

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of Amplifier A LC

Line B In / Out 6/5 Input / output port of passthrough LC


channel B

Mon 2 Monitor port for Line A Out LC

Mon 1 Monitor port for Line B Out LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

Cross-connection types
The SLA circuit pack supports the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The SLA circuit pack only supports the OCH (Optical Channel) Photonic
cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for SLA C-Band circuit pack
facilities. Table 1-6 provides a list of monitor types supported on SLA C-Band
circuit packs. Figure 1-5 on page 1-23 shows the SLA C-Band circuit pack
optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-6
Monitor types table for Photonic SLA C-Band circuit packs

Facility OPTMON CHMON AMP SDMON


Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
Note 1

ORL-OTS X
ORLMIN-OTS X
ORLMAX-OTS X
ORLAVG-OTS X
Note 2

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note 3

Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).
Note 3: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.

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Figure 1-5
SLA C-Band circuit pack optical monitoring points

Mon B 1

OSC B In 3

Facility: OPTMON port 6


Parameter: OPR-OTS*
Line B Out 5
Facility: CHMON port 5
Parameter: OPT-OCH* **
PD Facility: SDMON port 5
Backplane

Parameter: OPT-OTS* ***


Line B In 6
Facility: CHMON port 7
Facility: AMP port 8 Parameter: OPT-OCH* **
Parameter: OPIN-OTS* Facility: SDMON port 7
OPOUT-OTS*, ORL-OTS* Parameter: OPT-OTS* ***
Mon A 2

EDFA
Line A Out 7

Facility: OPTMON port 4


Parameter: OPR-OTS* PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8
* AVG, MIN, and MAX measurements are also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• High Received Span Loss
• Low Received Span Loss

Photonic alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• Fiber Type Manual Provisioning Required
• High Fiber Loss
• Shutoff Threshold Crossed
• Optical Line Failed
• Automatic Power Reduction Active
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected

COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to SLA circuit packs:
• is an eight-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf

The following restrictions on using a cross-connect circuit pack apply when


deploying a SLA circuit pack:
• the SLA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SLA circuit pack
• In a 14-slot shelf type, when the SLA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SLA circuit pack

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• In a 6500-7 packet-optical shelf type, when the SLA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SLA optical interface circuit pack.

Table 1-7
Technical specifications for SLA optical interface circuit packs

Parameter SLA (NTK552AAE5)


Weight (estimated) 1.8 kg (4.0 lb)
Power consumption Typical (W): 30 (Note 1)
Power Budget (W): 30 (Note 2)
Line A Line B
Gain (dB) Design Flat Gain (DFG) = 20 N/A
Typical: 12-20
Extended range: 7 to 25
Gain mask See Figure 1-6 on page 1-28 N/A
Noise figure (NF) Different at various gains N/A
(dB)
Gain 14-20 (dB) Gain 12-14 (dB) N/A
• NF < 7.0 • NF < 8.0 N/A
(maximum) (maximum)
• NF < 6.2 (typical) • NF < 7.2 (typical)
Maximum output 17 EOL (on average 1 dB higher) N/A
power (dBm)
Wavelength range 1530.33 to 1565.09 (88 channels capable)
(nm)
Tap ratio loss (dB) Minimum Maximum Minimum Maximum

Line_A_Out to 14.6 18.4 N/A N/A


Line_A_Mon
Line_B_Out to N/A N/A 8.0 12.0
Line_B_Mon

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Table 1-7
Technical specifications for SLA optical interface circuit packs (continued)

Parameter SLA (NTK552AAE5)


Insertion loss from N/A (Note 3) N/A
Line_A_In to
Line_A_Out (dB)
Line A Line B
Insertion loss from N/A 1.8 (max.)
Line_B_In to
Line_B_Out (dB)
Insertion loss from 1.2 (max.) N/A
Line_A_In to
OSC_A_Out (dB)
Insertion loss from N/A 1.0 (max.)
OSC_B_In to
Line_B_Out (dB)
Amplifier input and Minimum Default Maximum Minimum Default Maximum
output LOS
thresholds (dBm)
Input LOS threshold -40 -32 10 -28 -20 20
Output LOS -15 -13 15 N/A (Note 4)
threshold
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.
Note 4: There is no output LOS alarms on passive devices.

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yyyyyy
;;;;;;
1-28 Photonics equipment description

Figure 1-6
SLA line A gain mask

yyyyyy
;;;;;;
Typical range
20
18
16

yyyyyy
;;;;;;
14
12
Over Gain
10 range
Output Power (dBm)

yyyyyy
;;;;;;
6
Extended
4
range
2
0
-2
-4
-6
Minimum guaranteed output
-8 power under single channel
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 17 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5)


and Midstage Line Amplifier (MLA L-Band) circuit pack (NTK552BL)
Overview
The Midstage Line Amplifier (MLA C-Band) circuit pack (also referred to as
MLA C-Band) and Midstage Line Amplifier (MLA L-Band) circuit pack (also
referred to as MLA L-Band) are used for both edge and core applications and
each MLA C-Band or MLA L-Band contains two erbium-doped fiber amplifiers
(EDFA); one in a pre-amplifier configuration (amplifying the signal as it is
entering the site from the line) and the other in a post-amplifier configuration
(amplifying the signal as it leaves the site onto the line), and a single OSC
channel (1511 nm) splitter/coupler. These circuit packs are equipped at a
6500 site where pre- and post-amplification (booster amplification) is required
per link engineering rules.

The MLA C-Band and MLA L-Band circuit packs are intended for different
applications:
• the MLA C-Band circuit pack is a gain-controlled amplifier used in
DOC-controlled systems.
• the MLA L-Band circuit pack is a fixed-gain amplifier used in passive
photonic systems that are manually equalized using pads.

The 6500 Amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control (in case
of MLA C-Band or fixed gain control in case of MLA L-Band) that delivers
enhanced reach capabilities to ensure each wavelength is amplified equally.

Figure 1-7 on page 1-30 shows the faceplate of an MLA C-Band circuit pack.
For MLA L-Band circuit pack, the circuit pack’s faceplate is the same as MLA
C-Band circuit pack’s faceplate with the following exceptions:
• The MLA C-Band variant shows C-band on its faceplate while The MLA
L-Band variant shows L-Band on its faceplate.
• “Line A In/Out” and “Line B In/Out” have spring-loaded mechanical
shutters in MLA L-Band variant.

Figure 1-8 on page 1-31 provides a functional block diagram of the MLA
(C-Band or L-Band) circuit pack. For MLA L-Band circuit pack, the circuit
pack’s block diagram is the same as MLA C-Band circuit pack’s block diagram.

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Figure 1-7
MLA (C-Band and L-Band) circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-8
MLA (C-Band and L-Band) circuit packs block diagram (NTK552BAE5 and NTK552BL)

Mon B 1

OSC B In 3

EDFA Line B Out 5


Backplane

PD PD

Line B In 6

Mon A 2

EDFA
Line A Out 7 Reflective
event
PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
OSC Optical service channel
PD Photodiode

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Supported functionality
The MLA circuit packs (NTK552BAE5 and NTK552BL) provide the following
functionality:
• wavelength range: C-band 1530.33 nm to 1565.09 nm for MLA C-Band
circuit pack (NTK552BAE5 variant)
• wavelength range: L-band 1570.22 nm to 1605.94 nm for MLA L-Band
circuit pack (NTK552BL variant)
• 50 GHz and 100 GHz grid compliant for MLA C-Band circuit pack
(NTK552BAE5 variant)
• 200 GHz grid compliant for MLA L-Band circuit pack (NTK552BL variant)
• integrated OSC add/drop filters - OSC add/drop ports
• external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA (NTK552BA variant) is supported in
MuxAmp configurations. The MuxAmp is used in some networks where
lower power interfaces (like the WL3n source) are used. This configuration
requires that the Shelf Processor disables the Automatic Power Reduction
(APR), otherwise APR may be triggered during normal operation. For this
reason, the MLA circuit pack (NTK552BA) is reclassified as Class 1M from
IEC 60825-1. When APR is disabled, clamping is added automatically to
ensure safety. Circuit packs that were originally manufactured with a
Hazard Level 1 warning label can be re-labeled with the Level 1M label kit
(part number 415-2818-001). For information on how to apply this label,
see the section on observing product and personnel safety guidelines in
Installation - General Information, 323-1851-201.0.

• editing provisioned PEC between MLA C-Band, MLA2, MLA2 w/VOA and
MLA3 C-Band is supported. PEC editing is not supported between MLA
L-Band or MLA3 L-Band and MLA C-Band, MLA2, MLA2 w/VOA, and
MLA3 C-Band). Also, PEC editing is not supported between MLA3 L-Band
and LIM L-Band.
• unlike MLA C-Band variant (NTK552BAE5) that is managed by DOC, MLA
L-Band variant (NTK552BL) is not managed by DOC
• see Table 1-8 for function and connector type for each port

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Table 1-8
MLA optical interfaces (C-Band and L-Band)

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of Amplifier A LC

Line B In / Out 6/5 Input / output port of Amplifier B LC

Mon 2 Monitor port for Line A Out LC

Mon 1 Monitor port for Line B Out LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

Note: In MLA L-Band variant (NTK552BL), each optical interface on Line A Out and Line B Out have a
spring-loaded mechanical shutter.

Cross-connection types
The MLA circuit packs support the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The MLA circuit packs only support the OCH (Optical Channel) Photonic
cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for MLA circuit pack facilities.
Table 1-9 on page 1-34 provides a list of monitor types supported on MLA
circuit packs. Figure 1-9 on page 1-35 shows the MLA circuit pack optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-9
Monitor types table for MLA circuit pack

Facility OPTMON CHMON AMP NMCMON SDMON


Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
Note 1

ORL-OTS X
ORLMIN-OTS X
ORLMAX-OTS X
ORLAVG-OTS X
Note 2

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

OPT-OCH X X
OPTMIN-OCH X X
OPTMAX-OCH X X
OPTAVG-OCH X X
Note 3

Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 3: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).

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Figure 1-9
MLA circuit pack optical monitoring points

Mon B 1

OSC B In 3

Facility: AMP port 6


Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*

EDFA Line B Out 5


Facility: CHMON port 5,
NMCMON port 5
PD PD
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Line B In 6
Backplane

Facility: CHMON port 7,


NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Facility: SDMON port 7
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS* Parameter: OPT-OTS* ***
Mon A 2

EDFA
Line A Out 7

Facility: OPTMON port 4


PD PD
Parameter: OPR-OTS*
OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

* AVG, MIN, and MAX measurements are also provided


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Far End Not Discovered (MLA C-band only)
• Adjacency Mismatch
• Fiber Type Manual Provisioning Required
• High Fiber Loss
• High Optical Power
• High Received Span Loss (MLA C-band only)
• Shutoff Threshold Crossed
• Optical Line Failed
• Automatic Power Reduction Active
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected (MLA C-band only)
• Excessive Input Power (MLA L-band variant)

COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to MLA circuit packs (C-Band and
L-Band):
• C-Band variant (NTK552BAE5) is an eight-port single slot interface.
• L-Band variant (NTK552BL) is an eight-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). These circuit packs are not supported for use in slots 7 and
8 of the 14-slot packet-optical shelf (NTK503SA variant).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf
• the MLA circuit packs (C-Band) can be followed by interior SLA circuit
packs.

The following restrictions on using a cross-connect circuit pack apply when


deploying an MLA circuit packs (C-Band and L-Band):
• the MLA circuit packs (C-Band and L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA circuit pack
(C-Band or L-Band)
• In a 14-slot shelf type, when the MLA circuit packs (C-Band or L-Band) are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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• In a 6500-7 packet-optical shelf type, you cannot provision a


cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a MLA circuit pack (C-Band or L-Band)
• In a 6500-7 packet-optical shelf type, when the MLA circuit packs (C-Band
or L-Band) are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the MLA (C-Band and L-Band) optical interface circuit
packs.

Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band)

Parameter MLA C-Band (NTK552BAE5) MLA L-Band (NTK552BL)


Weight 1.8 kg (4.0 lb) 1.2 kg (2.6 lb)
(estimated)
Power Typical (W): 34 (Note 1) Typical (W): 21 (Note 1)
consumption Power Budget (W): 34 (Note 2) Power Budget (W): 24 (Note 2)
Line A Line B Line A Line B
Gain (dB) Design Flat Gain Design Flat Gain (DFG) Fixed Fixed
(DFG) = 20 = 17 Nominal: 23 Nominal: 23
Typical: 12-20 Typical: 9-17
Extended range: 7 to Extended range: 6 to 22
25
Gain mask See Figure 1-10 on See Figure 1-11 on See Figure 1-12 See Figure 1-12
page 1-41 page 1-42 on page 1-43 on page 1-43
Noise figure Different at various Different at various Fixed Fixed
(NF) (dB) gains gains
Gain Gain 12-14 Gain Gain 9-12
14-20 (dB) 12-17 (dB)
(dB) (dB)
NF < NF < 8.0 NF < NF < 9.7
6.0 6.0
7.0 (max.) 7.2 (max.)
(max.) NF < 7.2 (max.) NF < 8.8
NF < (typical) NF < (typical)
6.2 6.5
(typical) (typical)

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Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band) (continued)

Parameter MLA C-Band (NTK552BAE5) MLA L-Band (NTK552BL)


Line A Line B Line A Line B
Maximum 17 EOL (on average 1 19 EOL (on average 1 16 EOL (on 16 EOL (on
output power dB higher) dB higher) average 1 dB average 1 dB
(dBm) higher) higher)
Wavelength 1530.33 nm to 1565.09 nm 1570.22 nm to 1605.94 nm
range (nm)
Tap ratio loss Min. Max. Min. Max. Min. Max. Min. Max.
(dB)
Line_A_Out 14.6 18.4 N/A N/A 14.6 18.4 N/A N/A
to
Line_A_Mon
Line_B_Out N/A N/A 14.4 18.2 N/A N/A 14.4 18.2
to
Line_B_Mon
Insertion loss N/A (Note 3) N/A N/A (Note 3) N/A
from
Line_A_In to
Line_A_Out
(dB)
Insertion loss N/A N/A (Note 3) N/A N/A (Note 3)
from
Line_B_In to
Line_B_Out
(dB)

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Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band) (continued)

Parameter MLA C-Band (NTK552BAE5) MLA L-Band (NTK552BL)


Line A Line B Line A Line B
Insertion loss 1.2 (max.) N/A 1.2 (max.) N/A
from
Line_A_In to
OSC_A_Out
(dB)
Insertion loss N/A 1.0 (max.) N/A 1.0 (max.)
from
OSC_B_In to
Line_B_Out
(dB)
Amplifier Min. Default Max. Min. Default Max. Min. Def- Max. Min. Def- Max.
input and ault ault
output LOS
thresholds
(dBm)
Input LOS -40 -32 10 -30 -22 13 -40 -36 10 -30 -22 13
threshold
Output LOS -15 -13 15 -11 -10 24 -15 -13 15 -11 -10 24
threshold
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.

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yyyyyy
;;;;;;
Photonics equipment description 1-41

Figure 1-10
MLA C-Band line A gain mask

;;;;;;
yyyyyy
Typical range
20
18
16

;;;;;;
yyyyyy
14
12
Over Gain
10 range
Output Power (dBm)

;;;;;;
yyyyyy
6
Extended
4
range
2
0
-2
-4
-6
Minimum guaranteed output
-8 power under single channel
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 17 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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;;;;;;
yyyyyy
Figure 1-11
MLA C-Band Line B gain mask

Typical range

;;;;;;
yyyyyy
22
20
18 Over Gain
16 range
Output Power (dBm)

;;;;;;
yyyyyy
14
12
10
8
Extended

;;;;;;
yyyyyy
6 range
4
2
0
-2 Minimum guaranteed output
power under single channel
-4
Extended range minimum output
-6 power under single channel

-20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16


Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 19 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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Figure 1-12
MLA L-Band Line A/B gain mask

20
18
Gain = 24 dB
16
14
12
10
Output Power (dBm)

8 Gain = 23 dB
6
4 Gain = 22 dB
2
0
-2
-4
-6
-8
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5


and NTK552FB)
Overview
Similar to MLA, the Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs are
used for both edge and core applications.

This release of 6500 supports the following variants of the MLA2 circuit packs:
• Midstage Line Amplifier 2 (MLA2 C-Band) circuit pack (also referred to as
MLA2) (NTK552FAE5)
• Midstage Line Amplifier 2 (MLA2 C-Band) with variable optical attenuator
(VOA) circuit pack (also referred to as MLA2 w/VOA) (NTK552FB)

The MLA2 or MLA2 w/VOA circuit pack contains two erbium-doped fiber
amplifiers (EDFA); one in a pre-amplifier configuration (amplifying the signal
as it is entering the site from the line) and the other in a post-amplifier
configuration (amplifying the signal as it leaves the site onto the line), a single
OSC channel (1511 nm) splitter/coupler, and in case of the MLA2 w/VOA
variant (NTK552FB), a variable optical attenuator (VOA) at the output of each
amplifier (required for applications where attenuation is needed to meet link
budget constraints and pads are not desired). The primary difference
comparing to the MLA circuit pack is that the MLA2 or MLA2 w/VOA circuit
pack has a higher gain in both the pre and post amps than the MLA, gaining
more flexibility in link budgets, therefore MLA2 or MLA2 w/VOA circuit pack is
chosen over MLA circuit pack when spans have more losses (as directed by
link engineering). This MLA2 or MLA2 w/VOA circuit pack is equipped at a
6500 site where pre- and post-amplification (booster amplification) is required
per link engineering rules.

The 6500 amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control that
delivers enhanced reach capabilities to ensure each wavelength is amplified
equally.

Figure 1-13 on page 1-45 shows the faceplate of an MLA2 circuit pack and
Figure 1-14 on page 1-46 provides a functional block diagram of the MLA2
circuit pack.

Figure 1-15 on page 1-47 shows the faceplate of an MLA2 w/VOA circuit pack
and Figure 1-16 on page 1-48 provides a functional block diagram of the
MLA2 w/VOA circuit pack.

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Figure 1-13
MLA2 circuit pack faceplate

Red triangle (Fail)


2
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-14
MLA2 circuit pack block diagram (NTK552FAE5)

Mon B 1

OSC B In 3

EDFA Line B Out 5


Backplane

PD PD

Line B In 6

Mon A 2

EDFA
Line A Out 7

PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
OSC Optical service channel
PD Photodiode

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Figure 1-15
MLA2 w/VOA circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-16
MLA2 w/VOA circuit pack block diagram (NTK552FB)

Mon B 1

OSC B In 3

EDFA Line B Out 5


VOA
Backplane

PD PD PD

Line B In 6

Mon A 2

EDFA
Line A Out 7
VOA
PD PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
VOA Variable Optical Attenuator

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Supported functionality
The MLA2 circuit packs (NTK552FAE5) and the MLA2 w/VOA circuit packs
(NTK552FB) provide the following functionality:
• wavelength range: C-band 1530.33 nm to 1565.09 nm
• 50 GHz and 100 GHz grid compliant
• integrated OSC add/drop filters - OSC add/drop ports
• external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
• a Variable Optical Attenuator at the output of each amplifier (only
applicable to MLA2 w/VOA variant; NTK552FB)
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA2 circuit packs (NTK552FAE5 and
NTK552FB variants) are supported in MuxAmp configurations. The
MuxAmp is used in some networks where lower power interfaces (like the
WL3n source) are used. This configuration requires that the Shelf
Processor disables the Automatic Power Reduction (APR), otherwise APR
may be triggered during normal operation. For this reason, the MLA2
circuit packs (NTK552FAE5 and NTK552FB variants) are reclassified as
Class 1M from IEC 60825-1. When APR is disabled, clamping is added
automatically to ensure safety. Circuit packs that were originally
manufactured with a Hazard Level 1 warning label can be re-labeled with
the Level 1M label kit (part number 415-2818-001). For information on how
to apply this label, see the section on observing product and personnel
safety guidelines in Installation - General Information, 323-1851-201.0.

• editing provisioned PEC between MLA C-Band, MLA2, MLA2 w/VOA and
MLA3 C-Band is supported (PEC editing is not supported between MLA
L-Band or MLA3 L-Band and MLA C-Band, MLA2, MLA2 w/VOA, and
MLA3 C-Band)
• MLA2/LIM C-Band or MLA2 w/VOA/LIM C-Band combination can be used
as an alternative to SLA/SLA pair at uncompensated line-amp sites, as
dictated by link-engineering
• gain clamp mode
• see Table 1-11 for function and connector type for each port

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Table 1-11
MLA2 and MLA2 w/VOA optical interfaces

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of Amplifier A LC

Line B In / Out 6/5 Input / output port of Amplifier B LC

Mon 2 Monitor port for Line A Out LC

Mon 1 Monitor port for Line B Out LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

Cross-connection types
The MLA2 and MLA2 w/VOA circuit packs support the following
cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Note: Coherent Select configurations support 2WAY connections only.

Cross-connection rates
The MLA2 and MLA2 w/VOA circuit packs only support the OCH (Optical
Channel) Photonic cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for MLA2 and MLA2 w/VOA
circuit pack facilities. Table 1-12 on page 1-51 provides a list of monitor types
supported on MLA2 and MLA2 w/VOA circuit packs. Figure 1-17 on page 1-52
shows the MLA2 and Figure 1-18 on page 1-53 shows the MLA2 w/VOA
circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-12
Monitor types table for MLA2 and MLA2 w/VOA circuit pack

Facility OPTMON CHMON AMP VOA NMCMON SDMON


Monitor type Note 1 Note 2

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
Note 3

ORL-OTS X X
ORLMIN-OTS X X
ORLMAX-OTS X X
ORLAVG-OTS X X
Note 4 and Note 5 Note 6

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X X
OPOUTMIN-OTS X X
OPOUTMAX-OTS X X
OPOUTAVG-OTS X X

OPT-OCH X X
OPTMIN-OCH X X
OPTMAX-OCH X X
OPTAVG-OCH X X
Note 7

Note 1: The VOA facility type is only applicable to the MLA2 w/VOA circuit pack.
Note 2: The NMCMON facility type is not applicable to the MLA2 w/VOA circuit pack.
Note 3: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 4: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 5: Though the ORL readings are against the VOA facility on the MLA2 w/VOA circuit pack (monitor
tap is after the VOA), the associated Automatic Power Reduction alarm is raised against the AMP facility
of the MLA2 w/VOA circuit pack.
Note 6: These monitor types do not apply to the MLA2 w/VOA circuit pack.
Note 7: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).

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Figure 1-17
MLA2 circuit pack optical monitoring points

Mon B 1

OSC B In 3

Facility: AMP port 6


Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*

EDFA Line B Out 5


Facility: CHMON port 5,
NMCMON port 5
PD PD
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Line B In 6
Backplane

Facility: CHMON port 7,


NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Facility: SDMON port 7
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS* Parameter: OPT-OTS* ***
Mon A 2

EDFA
Line A Out 7

Facility: OPTMON port 4


PD PD
Parameter: OPR-OTS*
OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

* AVG, MIN, and MAX measurements are also provided


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel

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Figure 1-18
MLA2 w/VOA circuit pack optical monitoring points

Mon B 1
Facility: VOA port 5
Parameter: OPOUT-OTS*,
ORL-OTS* OSC B In 3

Facility: AMP port 6


Parameter: OPIN-OTS*
OPOUT-OTS* PD

EDFA Line B Out 5


VOA
PD PD Facility: CHMON port 5, NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* *** 
Backplane

Line B In 6
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Parameter: OPIN-OTS* Facility: SDMON port 7
OPOUT-OTS* Parameter: OPT-OTS* *** 
Mon A 2

EDFA
Line A Out 7
VOA
Facility: OPTMON port 4
PD PD PD
Parameter: OPR-OTS*
OSC A Out 4
Facility: VOA port 7
PD
Processor Power Parameter: OPOUT-OTS*, ORL-OTS*
Module Supply
Line A In 8
* AVG, MIN, and MAX measurements are also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Power data is collected from the EDFA monitor and scaling is done using VOA loss
such that the reported power is that at the faceplate port.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel
VOA Variable Optical Attenuator

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• High Received Span Loss

AMP alarm
• Minimum Gain
Photonic alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• High Fiber Loss
• High Optical Power
• Fiber Type Manual Provisioning Required
• Shutoff Threshold Crossed
• Optical Line Failed
• Automatic Power Reduction Active
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• VOA Output LOS (applies to MLA2 w/VOA)
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected

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COM alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to MLA2 or MLA2 w/VOA circuit packs:
• is an eight-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). The MLA2 circuit pack is not supported for use in slots 7 and
8 of the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• MLA2 circuit pack can be equipped in slots 1 to 6 of the 6500-7
packet-optical shelf (NTK503RA). This circuit pack is not supported for
use in slots 7 and 8 of the 6500-7 packet-optical shelf (NTK503RA).
• MLA2 w/VOA circuit pack can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf
• the MLA2 or MLA2 w/VOA circuit packs can be followed by interior SLA
circuit packs.

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The following restrictions on using a cross-connect circuit pack apply when


deploying an MLA2 and MLA2 w/VOA circuit packs:
• the MLA2 and MLA2 w/VOA circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA2 or MLA2
w/VOA circuit pack
• In a 14-slot shelf type, when the MLA2 or MLA2 w/VOA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains an MLA2 or MLA2 w/VOA circuit pack
• In a 6500-7 packet-optical shelf type, when the MLA2 or MLA2 w/VOA
circuit packs are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

Technical specifications
Table 1-13 lists the weight and power consumption for the MLA2 and MLA2
w/VOA optical interface circuit packs. Table 1-14 on page 1-57 lists technical
specifications for the MLA2 and MLA2 w/VOA optical interface circuit packs.

Table 1-13
Weight and power consumption for MLA2 and MLA2 w/VOA optical interface circuit packs

Parameter MLA2 (NTK552FAE5) MLA2 w/VOA (NTK552FB)


Weight 1.2 kg (2.7 lb) 1.2 kg (2.7 lb)
(estimated)
Power Typical (W): 30 (Note 1) Typical (W): 33 (Note 1)
consumption Power Budget (W): 36 (Note 2) Power Budget (W): 37 (Note 2)

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Table 1-13
Weight and power consumption for MLA2 and MLA2 w/VOA optical interface circuit packs

Parameter MLA2 (NTK552FAE5) MLA2 w/VOA (NTK552FB)


Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs

Parameter MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)


Line A Line B
Gain (dB) (Note 1) Design Flat Gain (DFG) = 23.5 Design Flat Gain (DFG) = 23.5
Typical: 15-23.5 Typical: 15-23.5
Extended range: 11 to 28 Extended range: 11 to 28
Gain mask See Figure 1-19 on page 1-60 See Figure 1-20 on page 1-61
Noise figure (NF) Different at various gains Different at various gains
(dB)
Gain 17.5-23.5 Gain 15-17.5 (dB) Gain 17.5-23.5 (dB) Gain 15-17.5 (dB)
(dB)
• NF < 5.9 • NF < 7.0 • NF < 5.7 • NF < 6.8
(maximum) (maximum) (maximum) (maximum)
• NF < 5.4 (typical) • NF < 6.5 (typical) • NF < 4.9 (typical) • NF < 6.0 (typical)
Maximum output 19.5 EOL (on average 1 dB higher) 19 EOL (on average 1 dB higher)
power (dBm)
(applies to MLA2
circuit pack only)
Maximum output 19.5 EOL (on average 1 dB higher) 19 EOL (on average 1 dB higher)
power before the
VOA (dBm)
(applies to MLA2
w/VOA circuit
pack only)

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Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs (continued)

Parameter MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)


Line A Line B
Maximum output 18.25 EOL (on average 1 dB higher) 17.75 EOL (on average 1 dB higher)
power after the (Note 2) (Note 2)
VOA tap (dBm)
(applies to MLA2
w/VOA circuit
pack only)
Wavelength range 1530.33 to 1565.09 (88 channels capable)
(nm)
Tap ratio loss (dB) Minimum Maximum Minimum Maximum
(applies to MLA2
circuit pack only)
Line_A_Out to 14.6 18.4 N/A N/A
Line_A_Mon
Line_B_Out to N/A N/A 14.4 18.2
Line_B_Mon
Tap ratio loss (dB) Minimum Maximum Minimum Maximum
(applies to MLA2
w/VOA circuit
pack only)
Line_A_Out to 13.6 (Note 3) 17.4 (Note 3) N/A N/A
Line_A_Mon
Line_B_Out to N/A N/A 13.4 (Note 3) 17.2 (Note 3)
Line_B_Mon
Insertion loss from N/A (Note 4) N/A
Line_A_In to
Line_A_Out (dB)
Insertion loss from N/A N/A (Note 4)
Line_B_In to
Line_B_Out (dB)
Insertion loss from 1.2 (max.) N/A
Line_A_In to
OSC_A_Out (dB)
Insertion loss from N/A 1.0 (max.)
OSC_B_In to
Line_B_Out (dB)

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Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs (continued)

Parameter MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)


Line A Line B
Amplifier input Minimum Default Maximum Minimum Default Maximum
and output LOS
thresholds (dBm)
Input LOS -40 -36 10 -40 -36 10
threshold
Output LOS -15 -12 24 -15 -12 15
threshold
VOA attenuation +/- 0.8
setting accuracy
(dB)
(applies to MLA2
w/VOA circuit
pack only)
Open loop 2.0
attenuation setting
accuracy (dB)
(applies to MLA2
w/VOA circuit
pack only)
(Note 5)
VOA attenuation 20 (max.)
range (dB) 1 (min.)
(applies to MLA2
w/VOA circuit
pack only)
VOA output LOS Minimum Default Maximum Minimum Default Maximum
thresholds (dBm)
-45 -31 20 -45 -31 20
(applies to MLA2
w/VOA circuit
pack only)
Note 1: The gain for the MLA2 w/VOA circuit pack is defined from the input connector to a reference point
immediately before the VOA, that is, the VOA and the components after it, are excluded.
Note 2: This value is at minimum attenuation and it varies depending on the VOA attenuation target.
Note 3: This value includes a default VOA loss of 1 dB.
Note 4: The EDFA modules do not have insertion loss.
Note 5: The VOA is in open loop when the EDFA is in shutoff.

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yyyyy
;;;;;
Figure 1-19
MLA2 and MLA2 w/VOA Line A gain mask

Typical range

;;;;;
yyyyy
22
20
18
16

;;;;;
yyyyy
14
12 Over Gain
Output Power (dBm)

10 range

8
Extended

;;;;;
yyyyy
6 range
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 19.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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yyyyy
;;;;;
Figure 1-20
MLA2 and MLA2 w/VOA Line B gain mask

Typical range

;;;;;
yyyyy
22
20
18
16

;;;;;
yyyyy
14
12 Over Gain
Output Power (dBm)

10 range

8
Extended

;;;;;
yyyyy
6 range
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 19 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5)


and Midstage Line Amplifier 3 (MLA3 L-Band) circuit pack
(NTK552GL)
Overview
Similar to MLA and MLA2, the Midstage Line Amplifier 3 (MLA3 C-Band)
circuit pack (also referred to as MLA3 C-Band) or Midstage Line Amplifier 3
(MLA3 L-Band) circuit pack (also referred to as MLA3 L-Band) is used for both
edge and core applications and contains two erbium-doped fiber amplifiers
(EDFA); one in a pre-amplifier configuration (amplifying the signal as it is
entering the site from the line) and the other in a post-amplifier configuration
(amplifying the signal as it leaves the site onto the line), and a single OSC
channel (1511 nm) splitter/coupler for MLA3 C-Band and a single OSC
channel (1611 nm) splitter/coupler for MLA3 L-Band. The primary difference
with MLA circuit pack is that similar to MLA2, the MLA3 C-Band or MLA3
L-Band has a higher gain in both the pre and post amps than the MLA, gaining
more flexibility in link budgets, therefore MLA3 C-Band or MLA3 L-Band circuit
pack is chosen over MLA circuit pack when spans have more losses (as
directed by link engineering). This circuit pack is equipped at a 6500 site
where pre- and post-amplification (booster amplification) is required per link
engineering rules.

The MLA3 C-Band circuit pack (NTK552GAE5) or MLA3 L-Band circuit pack
(NTK552GL) has similar functionality to the existing MLA2. However, its
typical power consumption is slightly higher than the MLA2. The MLA3
C-Band or MLA3 L-Band also has the same maximum gain as the MLA2 but
has a higher maximum total output power:
• for Line A, MLA3 C-Band or MLA3 L-Band has 23.5 dBm compared to
19.5 dBm for MLA2.
• for Line B, MLA3 C-Band or MLA3 L-Band has 23 dBm compared to 19
dBm for MLA2.

MLA3 software and OnePlanner software have been enhanced to take


advantage of the higher total output power and enable some extra
functionalities compared to MLA2 such as:
• MLA3 C-Band or MLA3 L-Band can be used in applications where reach
and capacity are limited by output power.
• MLA3 C-Band or MLA3 L-Band can help with avoiding RAMAN use in
some cases.
• in some cases, MLA3 C-Band or MLA3 L-Band can help remove the need
for regeneration.
• MLA3 C-Band enables fully filling the C-Band with 100G wavelengths.

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• MLA3 L-Band enables fully filling the L-Band with 200G wavelengths.
• In some network scenarios, MLA3 C-Band or MLA3 L-Band can provide
margin improvements.

The MLA3 L-Band circuit packs are only used in Submarine applications.

OnePlanner will help determine when an MLA3 C-Band or MLA3 L-Band is


required.

The MLA3 C-Band and MLA3 L-Band circuit packs are intended for different
applications:
• the MLA3 C-Band circuit pack is a gain-controlled amplifier used in
DOC-controlled systems.
• the MLA3 L-Band circuit pack is a fixed-gain amplifier used in passive
photonic systems that are manually equalized using pads.

The 6500 Amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control (in case
of MLA3 C-Band or fixed gain control in case of MLA3 L-Band) that deliver
enhanced reach capabilities to ensure each wavelength is amplified equally.

Figure 1-21 on page 1-64 shows the faceplate of an MLA3 C-Band circuit pack
(the MLA3 L-Band variant shows L-Band on its faceplate). Figure 1-22 on
page 1-65 provides a functional block diagram of the MLA3 (C-Band or
L-Band) circuit pack. For MLA3 L-Band circuit pack, the circuit pack’s block
diagram is the same as MLA3 C-Band circuit pack’s block diagram.

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Figure 1-21
MLA3 C-Band circuit pack faceplate

Red triangle (Fail)


3
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-22
MLA3 (C-Band and L-Band) circuit pack block diagram (NTK552GAE5 and NTK552GL)

Mon B 1

OSC B In 3

EDFA Line B Out 5


Backplane

PD PD

Line B In 6

Mon A 2

EDFA
Line A Out 7

PD PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
OSC Optical service channel
PD Photodiode

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Supported functionality
The MLA3 circuit packs (NTK552GAE5 and NTK552GL) provide the following
functionality:
• Wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems (NTK552GAE5 variant)
• Frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (NTK552GAE5 variant)
• Wavelength range: L-band channels 1569.8 nm to 1608.98 nm (96 total)
when used in fixed grid systems (NTK552GL variant)
• Frequency range: L-band 190.975 THz to 186.325 THz when used in
flexible grid systems (NTK552GL)
• 50 GHz and 100 GHz grid compliant for MLA3 C-Band circuit pack
(NTK552GAE5 variant)
• 200 GHz grid compliant for MLA3 L-Band circuit pack (NTK552GL variant)
• integrated OSC add/drop filters - OSC add/drop ports
• external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA3 circuit pack (NTK552GAE5 variant)
is supported in MuxAmp configurations. The MuxAmp is used in some
networks where lower power interfaces (like the WL3n source) are used.
This configuration requires that the Shelf Processor disables the
Automatic Power Reduction (APR), otherwise APR may be triggered
during normal operation. For this reason, the MLA3 circuit pack
(NTK552GAE5) is reclassified as Class 1M from IEC 60825-1. When APR
is disabled, clamping is added automatically to ensure safety. Circuit
packs that were originally manufactured with a Hazard Level 1 warning
label can be re-labeled with the Level 1M label kit (part number
415-2818-001). For information on how to apply this label, see the section
on observing product and personnel safety guidelines in Installation -
General Information, 323-1851-201.0.

• editing provisioned PEC between MLA C-Band, MLA2 and MLA3 C-Band
is supported (PEC editing is not supported between MLA L-Band or MLA3
L-Band and MLA C-Band, MLA2, and MLA3 C-Band)
• MLA3 C-Band/LIM C-Band or MLA3 L-Band/LIM L-Band combination can
be used as an alternative to SLA/SLA pair at uncompensated line-amp
sites, as dictated by link-engineering
• gain clamp mode

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• see Table 1-15 for function and connector type for each port
Table 1-15
MLA3 optical interfaces (C-Band and L-Band)

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of Amplifier A LC

Line B In / Out 6/5 Input / output port of Amplifier B LC

Mon 2 Monitor port for Line A Out LC

Mon 1 Monitor port for Line B Out LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

Cross-connection types
The MLA3 circuit pack supports the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Note: Coherent Select configurations support 2WAY connections only.

Cross-connection rates
The MLA3 C-Band circuit pack supports Optical Channel (OCH) and Network
Media Channel (NMC) Photonic cross-connection rates.

The MLA3 L-Band circuit pack supports Network Media Channel (NMC)
Photonic cross-connection rates.

Performance monitoring
The 6500 monitors and collects physical PMs for MLA3 C-Band and L-Band
circuit pack facilities. Table 1-16 on page 1-68 provides a list of monitor types
supported on MLA3 C-Band and L-Band circuit packs. Figure 1-23 on page
1-69 shows the MLA3 C-Band circuit pack optical monitoring points.
Figure 1-24 on page 1-70 shows the MLA3 L-Band circuit pack optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-16
Monitor types table for MLA3 C-Band and L-Band circuit packs

Facility OPTMON CHMON AMPMON AMP NMCMON SDMON


Monitor type Note 2

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
Note 1

ORL-OTS X
ORLMIN-OTS X
ORLMAX-OTS X
ORLAVG-OTS X
Note 3

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

OPT-OCH X X X
OPTMIN-OCH X X X
OPTMAX-OCH X X X
OPTAVG-OCH X X X
Note 4

Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: The AMPMON facility type is only applicable to the MLA3 L-Band circuit pack.
Note 3: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 4: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).

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Figure 1-23
MLA3 C-Band circuit pack optical monitoring points

Mon B 1

OSC B In 3

Facility: AMP port 6


Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*

EDFA Line B Out 5


Facility: CHMON port 5,
NMCMON port 5
PD PD
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Line B In 6
Backplane

Facility: CHMON port 7,


NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Facility: SDMON port 7
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS* Parameter: OPT-OTS* ***
Mon A 2

EDFA
Line A Out 7

Facility: OPTMON port 4


PD PD
Parameter: OPR-OTS*
OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

* AVG, MIN, and MAX measurements are also provided


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel

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Figure 1-24
MLA3 L-Band circuit pack optical monitoring points

Mon B 1

OSC B In 3

Facility: AMP port 6


Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*

EDFA Line B Out 5


Facility: CHMON port 5,
PD PD NMCMON port 5
AMPMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***

Line B In 6
Backplane

Facility: CHMON port 7,


NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Facility: SDMON port 7
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS* Parameter: OPT-OTS* ***
Mon A 2

EDFA
Line A Out 7

Facility: OPTMON port 4


PD PD
Parameter: OPR-OTS*
OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

* AVG, MIN, and MAX measurements are also provided


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode
OSC Optical Service Channel

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Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• High Received Span Loss
• Output Loss of Signal
• Automatic Power reduction Active
Photonic alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• High Fiber Loss
• High Optical Power
• Fiber Type Manual Provisioning Required
• Shutoff Threshold Crossed
• Optical Line Failed
• Automatic Power Reduction Active
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected
• Min Gain
COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to MLA3 circuit packs (C-Band and
L-Band):
• is an eight-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf
• the MLA3 C-Band circuit packs can be followed by interior SLA circuit
packs.

The following restrictions on using a cross-connect circuit pack apply when


deploying an MLA3 circuit pack (C-Band and L-Band):
• the MLA3 circuit packs (C-Band or L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA3 circuit pack
(C-Band or L-Band)
• In a 14-slot shelf type, when the MLA3 circuit packs (C-Band or L-Band)
are installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains an MLA3 circuit pack (C-Band or L-Band)

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• In a 6500-7 packet-optical shelf type, when the MLA3 circuit packs


(C-Band or L-Band) are installed in slot 7 or 8, only Broadband circuit
packs or Photonic circuit packs can be provisioned in the other interface
slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

Technical specifications
Table 1-17 lists the weight, power consumption, and other specifications for
the MLA3 (C-Band and L-Band) optical interface circuit pack.

Table 1-17
Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)

Parameter MLA3 C-Band (NTK552GAE5) MLA3 L-Band (NTK552GL)


Line A Line B Line A Line B
Weight 1.4 kg (3.0 lb) 1.4 kg (3.0 lb)
(estimated)
Power Typical (W): 36 (Note 1) Typical (W): 43 (Note 1)
consumption Power Budget (W): 40 (Note 2) Power Budget (W): 48 (Note 2)
Gain (dB) Design Flat Gain (DFG) Design Flat Gain (DFG) = Design Flat Gain (DFG) Design Flat Gain
= 23.5 23.5 = 23.5 (DFG) = 23.5
Typical: 15-23.5 Typical: 15-23.5 Typical: 15-23.5 Typical: 15-23.5
Extended range: 11 to 28 Extended range: 11 to 28 Extended range: 11 to Extended range: 11 to
28 28
Gain mask See Figure 1-25 on page See Figure 1-26 on page See Figure 1-27 on See Figure 1-28 on
1-76 1-77 page 1-78 page 1-79
Noise figure Different at various gains Different at various gains Different at various Different at various
(NF) (dB) gains gains
Gain Gain 15-17.5 Gain Gain 15-17.5 Gain Gain Gain Gain
17.5-23.5 (dB) 17.5-23.5 (dB) 14.5-18.5 18.5-23.5 14.5-18.5 18.5-23.5
(dB) (dB) (dB) (dB) (dB) (dB)
NF < 6.6 NF < 8.2 NF < 6.4 NF < 7.9 (max.) NF < 9.9 NF < 7.6 NF < 9.4 NF < 7.4
(max.) (max.) (max.) NF < 7.1 (typical) (max.) (max.) (max.) (max.)
NF < 6.0 NF < 7.5 NF < 5.3 NF < 9 NF < 6.9 NF < 8.5 NF < 6.7
(typical) (typical) (typical) (typical) (typical) (typical) (typical)
Maximum 23.5 EOL (on average 1 23 EOL (on average 1 dB 23.5 EOL (on average 1 23 EOL (on average 1
output dB higher) higher) dB higher) dB higher)
power (dBm)
Wavelength C-band channels 1528.77 nm to 1566.72 nm (96 total) L-band channels 1569.8 nm to 1608.98 nm (93
range (nm) when used in fixed grid systems total) when used in fixed grid systems

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Table 1-17 (continued)


Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)

Parameter MLA3 C-Band (NTK552GAE5) MLA3 L-Band (NTK552GL)


Line A Line B Line A Line B
Frequency C-band 196.125 THz to 191.325 THz when used in L-band 190.975 THz to 186.325 THz when used
range (THz) flexible grid systems in flexible grid systems
Tap ratio Min. Max. Min. Max. Min. Max. Min. Max.
loss (dB)
Line_A_Out 14.6 18.4 N/A N/A 14.6 18.4 N/A N/A
to
Line_A_Mon
Line_B_Out N/A N/A 14.4 18.2 N/A N/A 14.4 18.2
to
Line_B_Mon
Insertion N/A (Note 3) N/A N/A (Note 3) N/A
loss from
Line_A_In to
Line_A_Out
(dB)
Insertion N/A N/A (Note 3) N/A N/A (Note 3)
loss from
Line_B_In to
Line_B_Out
(dB)
Insertion 1.2 (max.) N/A 1.2 (max.) N/A
loss from
Line_A_In to
OSC_A_Out
(dB)
Insertion N/A 1.0 (max.) N/A 1.0 (max.)
loss from
OSC_B_In
to
Line_B_Out
(dB)
Amplifier Min. Default Max. Min. Default Max. Min. Defaul Max Min. Defa Ma
input and t . ult x.
output LOS
thresholds
(dBm)
Input LOS -40 -32 10 -40 -32 10 -39 -36 10 -39 -36 10
threshold

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Table 1-17 (continued)


Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)

Parameter MLA3 C-Band (NTK552GAE5) MLA3 L-Band (NTK552GL)


Line A Line B Line A Line B
Output LOS -15 -12 15 -15 -12 15 -15 -12 15 -15 -12 15
threshold
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25 (+/-3oC) and
voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered equipment. For practical
purposes, the rounded typical power consumption of equipment can be used as the equipment heat dissipation when
calculating the facilities’ thermal loads (an estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient temperature range
from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered
equipment. These rounded power values must be used in sizing feeders and estimating theoretical maximum power
draw.
Note 3: The EDFA modules do not have insertion loss.

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Figure 1-25
MLA3 C-Band Line A gain mask

Typical range

24
22
20
18
16
14
12 Over Gain
Output Power (dBm)

10 range

8
Extended
6 range
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 23.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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Figure 1-26
MLA3 C-Band Line B gain mask

Typical range
24
22
20
18
16
14
12 Over Gain
Output Power (dBm)

10 range

8 Extended
range
6
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Input Power (dBm)

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 23 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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Figure 1-27
MLA3 L-Band Line A gain mask

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 23.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

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Figure 1-28
MLA3 L-Band Line B gain mask

1. The dashed lines area ( ), identifies the minimum guaranteed output


power when the module is over gained. It is not required to maintain flat
gain in those regions.

2. In the Extended Range, it is not required to meet a maximum output power of 23 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and


Line Interface Module (LIM L-Band) circuit packs (NTK552DL and
NTK552DN)
Overview
The Line Interface Module (LIM C-Band) circuit pack (also referred to as LIM
C-Band) and Line Interface Module (LIM L-Band) circuit packs (also referred
to as LIM L-Band) are line interface modules with no amplifier but each LIM
C-Band or LIM L-Band (NTK552DL variant) contains a single OSC channel
(1511 nm) splitter/coupler (LIM L-Band NTK552DN variant contains a single
OSC channel (1611 nm) splitter/coupler). LIM is used for point-to-point and
unamplified edge applications and core applications when used with an
MLA2, MLA2 w/VOA, MLA3 C-Band, or MLA3 L-Band. Therefore, The LIM
circuit pack is used in unamplified applications at a 6500 site where no pre- or
post-amplification (booster amplification) is required (per link engineering
rules).

The LIM L-Band (NTK552DN variant) circuit packs are only used in
Submarine applications.

The LIM C-Band and LIM L-Band circuit packs are intended for different
applications:
• the LIM C-Band circuit pack is used in DOC-controlled systems.
• the LIM L-Band circuit pack is used in passive photonic systems that are
manually equalized using pads.

Figure 1-29 on page 1-81 shows the faceplate of a LIM C-Band circuit pack.
For LIM L-Band circuit pack, the circuit pack’s faceplate is the same as LIM
C-Band circuit pack’s faceplate with the following exceptions:
• the LIM C-Band variant shows C-Band on its faceplate while The LIM
L-Band variant shows L-Band on its faceplate.
• “Line A In/Out” and “Line B In/Out” have spring-loaded mechanical
shutters in LIM L-Band (only NTK552DL variant).
• the LIM C-Band variant shows Hazard Level 1 on its faceplate while the
LIM L-Band variants show Hazard Level 1M on their faceplates.

The following provides a functional block diagram of the LIM (C-Band or


L-Band) circuit pack. For LIM L-Band circuit pack, the circuit pack’s block
diagram is the same as LIM C-Band circuit pack’s block diagram.

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Figure 1-29
LIM C-Band circuit pack faceplate

Red triangle (Fail)


LIM
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-30
LIM (C-Band and L-Band) circuit packs block diagram (NTK552DAE5, NTK552DL, and NTK552DN)

Mon B 1

OSC B In 3

Line B Out 5
Backplane

PD

Line B In 6

Mon A 2

Line A Out 7

PD

OSC A Out 4
PD
Processor Power
Module Supply
Line A In 8

Legend
OSC Optical service channel
PD Photodiode

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Supported functionality
The LIM circuit packs (NTK552DAE5, NTK552DL, and NTK552DN) provide
the following functionality:
• wavelength range: C-band 1528.77 nm to 1566.72 nm for LIM C-Band
circuit pack (NTK552DAE5 variant)
• wavelength range: L-band 1570.22 nm to 1605.94 nm for LIM L-Band
circuit pack (NTK552DL variant)
• wavelength range: L-band 1569.80 nm to 1608.98 nm for LIM L-Band
circuit pack (NTK552DN variant)
• 50 GHz and 100 GHz grid compliant for LIM C-Band circuit pack
(NTK552DAE5 variant)
• 200 GHz grid compliant for LIM L-Band circuit packs (NTK552DL and
NTK552DN variants)
• integrated OSC add/drop filters - OSC add/drop ports
• ALSO (Automatic Line Shut Off) functionality
• MLA L-Band/LIM L-Band, MLA2/LIM C-Band, MLA2 w/VOA/LIM C-Band,
MLA3 C-Band/LIM C-Band, or MLA3 L-Band/LIM L-Band combination can
be used as an alternative to SLA/SLA pair at uncompensated line-amp
sites, as dictated by link-engineering
• see Table 1-18 for function and connector type for each port
Table 1-18
LIM optical interfaces (C-Band and L-Band)

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of passthrough channel A LC

Line B In / Out 6/5 Input / output port of passthrough channel B LC

Mon 2 Monitor port for Line A Out LC

Mon 1 Monitor port for Line B Out LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

Cross-connection types
The LIM C-Band circuit pack supports the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Note: Coherent Select configurations support 2WAY connections only.

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Cross-connection rates
The LIM C-Band circuit pack only supports the OCH (Optical Channel)
Photonic cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for LIM C-Band and LIM L-Band
circuit pack facilities. Table 1-19 provides a list of monitor types supported on
LIM C-Band and LIM L-Band circuit packs. Figure 1-31 on page 1-85 shows
the LIM C-Band and LIM L-Band circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-19
Monitor types table for Photonic LIM C-Band and LIM L-Band circuit packs

Facility OPTMON CHMON NMCMON SDMON


Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
Note 1

OPT-OCH X X
OPTMIN-OCH X X
OPTMAX-OCH X X
OPTAVG-OCH X X
Note 2

Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded
within an ADJ provisioned OPM supported device with Equipment Profile set to
FlexibleGrid.
Note 2: CHMON OPT-OCH monitor type support requires the OPM (embedded
within WSS w/OPM circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs).

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Figure 1-31
LIM C-Band and L-Band circuit pack optical monitoring points

Mon B 1

OSC B In 3

Line B Out 5
Facility: CHMON port 5,
PD NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Backplane

Line B In 6
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7 Mon A 2
Parameter: OPT-OTS* ***
Line A Out 7

PD

OSC A Out 4

Power PD
Processor
Module Supply
Line A In 8
PMs collected at all PD locations
Facility: OPTMON port 4,6,8
Parameter: OPR-OTS*

* AVG, MIN, and MAX measurements are also provided.


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the LIM L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Legend
PD Photodiode
OSC Optical Service Channel

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Far End Not Discovered (MLA C-band only)
• Adjacency Mismatch
• Line Adjacency Manual Provisioning Required
• High Fiber Loss
• High Received Span Loss (MLA C-band only)
• Fiber Type Manual Provisioning Required
• Shutoff Threshold Crossed
• Optical Line Failed
• Input Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected

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COM alarms
• Software Auto-Upgrade in Progress
• Hardware Subsystem Failed
Equipping rules
The following equipping rules apply to LIM circuit packs (C-Band and L-Band):
• C-Band variant (NTK552DAE5) is an eight-port single slot interface.
• L-Band variants (NTK552DL and NTK552DN) are eight-port single slot
interfaces.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). The NTK552DAE5 and NTK552DL variants of LIM circuit
packs are not supported for use in slots 7 and 8 of the 14-slot
packet-optical shelf (NTK503SA variant).The NTK552DN variant of LIM
circuit packs is supported for use in slots 7 and 8 of the 14-slot
packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.

• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• NTK552DAE5 and NTK552DL variants of LIM circuit packs can be
equipped in slots 1 to 6 of the 6500-7 packet-optical shelf (NTK503RA).
These circuit packs are not supported for use in slots 7 and 8 of the 6500-7
packet-optical shelf (NTK503RA).
• NTK552DN variant of LIM circuit packs can be equipped in slots 1 to 8 of
the 6500-7 packet-optical shelf (NTK503RA).

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• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of


2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a LIM circuit packs (C-Band and L-Band):
• the LIM circuit packs (C-Band and L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a LIM circuit pack
(C-Band and L-Band)
• In a 14-slot shelf type, when the LIM circuit packs (C-Band and L-Band)
are installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a LIM circuit pack (C-Band and L-Band)
• In a 6500-7 packet-optical shelf type, when the LIM circuit packs (C-Band
and L-Band) are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the LIM (C-Band and L-Band) optical interface circuit pack.

Table 1-20
Technical specifications for LIM optical interface circuit packs (C-Band and L-Band)

Parameter LIM (NTK552DAE5, NTK552DL, and NTK552DN)


Weight (estimated) 0.9 kg (2.0 lb) for C-Band variant (NTK552DAE5)
1.0 kg (2.2 lb) for L-Band variants (NTK552DL and NTK552DN)
Power Typical (W): 8 for C-Band variant (NTK552DAE5) and 9 for L-Band variants (NTK552DL and
consumption NTK552DN) (Note 1)
Power Budget (W): 10 for both C-Band variant (NTK552DAE5) and L-Band variants
(NTK552DL and NTK552DN) (Note 2)
Gain (dB) N/A (Note 3)
Gain mask N/A (Note 3)
Noise figure (NF) N/A (Note 3)
(dB)
Maximum output N/A (Note 3)
power (dBm)
Wavelength range 1528.77 to 1566.72 for C-Band variant (NTK552DAE5) (96 channels capable)
(nm) 1570.22 to 1605.94 for L-Band variant (NTK552DL)
1560.80 to 1608.98 for L-Band variant (NTK552DN)
Line A Line B
Tap ratio loss (dB) Minimum Maximum Minimum Maximum

Line_A_Out to 8.0 12.0 N/A N/A


Line_A_Mon
Line_B_Out to N/A N/A 8.0 12.0
Line_B_Mon
Insertion loss from 1.8 (max.) N/A
Line_A_In to
Line_A_Out (dB)
Insertion loss from N/A 1.8 (max.)
Line_B_In to
Line_B_Out (dB)
Insertion loss from 1.2 (max.) N/A
Line_A_In to
OSC_A_Out (dB)

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Table 1-20
Technical specifications for LIM optical interface circuit packs (C-Band and L-Band) (continued)

Parameter LIM (NTK552DAE5, NTK552DL, and NTK552DN)


Insertion loss from N/A 1.0 (max.)
OSC_B_In to
Line_B_Out (dB)
Amplifier input and Minimum Default Maximum Minimum Default Maximum
output LOS
thresholds (dBm)
Input LOS -36 -36 • 30 for -20 • -20 for • 20 for
threshold C-Band C-Band C-Band
variant variant and variant and
• 20 for L-Band L-Band
L-Band NTK552DL NTK552DL
NTK552DL variant variant
variant • -10 for • 10 for
• 10 for L-Band L-Band
L-Band NTK552DN NTK552DN
NTK552DN variant variant
variant
Output LOS N/A (Note 4)
threshold
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25 (+/-3oC)
and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered equipment. For
practical purposes, the rounded typical power consumption of equipment can be used as the equipment heat
dissipation when calculating the facilities’ thermal loads (an estimate of the long term heat release of the item in
a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient temperature
range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. These rounded power values must be used in sizing feeders and estimating theoretical
maximum power draw.
Note 3: LIM circuit packs (C-Band and L-Band) do not have any EDFA modules (LIM is only used to extract/inject
the OSC signal from the line) and therefore optical characteristics of the EDFA modules are not applicable to LIM
circuit packs (C-Band and L-Band).
Note 4: There is no output LOS alarms on passive devices.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Single Line Raman Amplifier (SRA C-Band) w/Optical Service


Channel (OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JA)
Overview
The Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel
(OSC) 1xSFP 10/100 BT WSC circuit pack (also referred to as SRA) is used
for providing Raman amplification and Optical Time-Domain Reflectometry
(OTDR) functionality in Photonic Layer applications. An OTDR is used for
• estimating the fiber length and overall attenuation, including splice and
mated-connector losses.
• locating faults, such as breaks, and to measure optical return loss.
• fault finding on installed systems.

The SRA circuit pack has one Raman-gain amplifier in the incoming Line A
facing direction and by including integrated OSC add/drop filters and OSC
add/drop ports, the SRA circuit pack removes the need for 2xOSC circuit
packs at Line Amp and ROADM sites.

Note: It is recommended to read 6500 Packet-Optical Platform Photonic


Layer Guide, NTRN15DA, for detailed information on RAMAN
amplification and its concept in 6500.

Figure 1-32 on page 1-92 shows the faceplate of an SRA circuit pack and
Figure 1-33 on page 1-93 provides a functional block diagram of the SRA
circuit pack.

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Figure 1-32
SRA circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can WSC port
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

OSC ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Line ports

Monitor
ports

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Figure 1-33
SRA circuit pack block diagram (NTK552JA)

Wayside 1
Ethernet
Switch EOS OSC 2
Mapper SFP

OSC In 3

Mon B 9

Line B Out 5
Backplane

OTDR/
Telemetry PD

Line B In 6

Mon A 10

Line A Out 7

PD / 4 Ch.
OPM
OSC Out 4

PD Raman

Processor Power
Module Supply
Line A In 8

Legend
EOS Ethernet over SONET OTDR Optical time domain reflectometry
OPM Optical power monitoring PD Photodiode
OSC Optical service channel

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Supported functionality
The SRA circuit packs (NTK552JA) provide the following functionality:
• wavelength range: C-band 1528.77 nm to 1566.72 nm
• 50 GHz and 100 GHz grid compliant
• integrated OSC add/drop filters - OSC add/drop ports
• integrated coarse 4-band OPM
• integrated Wayside connection (WSC) port
• external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
• Optical Time-Domain Reflectometry (OTDR) (shared) to measure integrity
of fiber plant and interconnects
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality. Note that SRA is rated
Hazard Level 1M but features Automatic Power Reduction (APR)
capabilities to handle high return loss conditions at the Raman amplifier
output ports.
• see Table 1-21 for function and connector type for each port
Table 1-21
SRA optical interfaces

Interface name Physical port # Function Connector type

Mon A 10 Monitor port for Line A Out LC

Mon B 9 Monitor port for Line B Out LC

Line A In / Out 8/7 Input / output port of Line A LC

Line B In / Out 6/5 Input / output port of Line B LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

OSC SFP In / Out 2 Optical Service Channel SFP pluggable LC


input/output port

WSC 1 Wayside channel RJ45

Cross-connection types
The SRA circuit pack supports the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

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Cross-connection rates
The SRA circuit pack only supports the OCH (Optical Channel) Photonic
cross-connection rate.

Supported SFPs
The following table provides a list of the SFPs that are supported on the SRA
circuit pack.

Table 1-22
Supported SFP modules for the SRA circuit pack (NTK552JA)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1, Note 2, and
Note 3)

• P155M OC-3/STM-1 CWDM 1511 nm (0-34 dB span) NTK592NGE5


— OSC (Note 4) — OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (12-42 dB span) NTK592NVE5


— OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 DWDM 1516.9 nm SFP module NTK592NR (Note


(12-44 dB span) 5)
— OC-3/STM-1 (155.52Mb/s)

Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and OnePlanner design.
Note 3: An SRA has 2 OPTMON facilities (ports 4 and 6), one RAMAN facility (port 8), one AMPMON
facility (port 7), and one TELEMETRY facility (port 5). The P155M pluggable and OSC facility is
supported on port 2.
Note 4: The P155M pluggable on the SRA circuit pack supports WSC facilities. These facilities are not
displayed or managed in the Equipment & Facilities Provisioning applications. They are handled by
Comms Setting Management application through LAN option under Interfaces tab. If you provision the
low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV), the connected LIM port
4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal” alarm from being
raised.
Note 5: Use this SFP when the fiber type of the span is TWRS and when the CWDM SFP limit is
exceeded. This SFP must always be used in combination with OSC Filter (1516.9 nm) module
(NTK504BA) to reach spans losses of up to 46 dB on all fiber types.

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Performance monitoring
The 6500 monitors and collects physical PMs for SRA circuit pack facilities.
Table 1-23 provides a list of monitor types supported on SRA circuit packs.
Figure 1-34 on page 1-99 shows the SRA circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-23
Monitor types table for SRA circuit pack

Monitor type Facility

OSC OPTMON RAMAN OTDRCFG


Note 1

SONET Section (S)/SDH Regenerator Section (RS)

CV-S or RS-BBE X

ES-S or RS-ES X

SES-S or RS-SES X

SEFS-S or RS-OFS X

SONET Line (L)/SDH Multiplex Section (MS)

CV-L or MS-BBE X

ES-L or MS-ES X

SES-L or MS-SES X

UAS-L or MS-UAS X

FC-L or MS-FC X

DMMIN-L or L-DMMIN X
DMMAX-L or L-DMMAX X
DMAVG-L or L-DMAVG X

Physical

OPR-OCH X
OPRMIN-OCH X
OPRMAX-OCH X
OPRAVG-OCH X
Note 2

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Table 1-23
Monitor types table for SRA circuit pack (continued)

Monitor type Facility

OSC OPTMON RAMAN OTDRCFG


Note 1

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note 3

SPANLOSS-OCH X
SPANLOSSMIN-OCH X
SPANLOSSMAX-OCH X
SPANLOSSAVG-OCH X

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

ORLIN-OTS X X
ORLINMIN-OTS X X
ORLINMAX-OTS X X
ORLINAVG-OTS X X

ORLOUT-OTS X X
ORLOUTMIN-OTS X X
ORLOUTMAX-OTS X X
ORLOUTAVG-OTS X X

OPIN-OTS X X
OPINMIN-OTS X X
OPINMAX-OTS X X
OPINAVG-OTS X X

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Table 1-23
Monitor types table for SRA circuit pack (continued)

Monitor type Facility

OSC OPTMON RAMAN OTDRCFG


Note 1

OPOUT-OTS X X
OPOUTMIN-OTS X X
OPOUTMAX-OTS X X
OPOUTAVG-OTS X X

OPROSC-OTS X X
OPROSCMIN-OTS X X
OPROSCMAX-OTS X X
OPROSCAVG-OTS X X

Note 1: Support for OTDRCFG PM counts is restricted to shelves with SP2 shelf processor types.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH value is reported with an accuracy of ±0.3 dB.

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Figure 1-34
SRA circuit pack optical monitoring points

Wayside 1
Ethernet
Switch EOS OSC 2
Mapper SFP

Facility: OSC port 2


Parameter: OPR-OCH*, OPT-OCH*, SPANLOSS-OCH*
OSC In 3

Mon B 9

Line B Out 5
Backplane

OTDR/
Telemetry PD

Line B In 6
Facility: OPTMON port 6
Parameter: OPR-OTS*

Mon A 10

Line A Out 7

PD / 4 Ch.
OPM
Facility: OPTMON port 4
Parameter: OPR-OTS*

OSC Out 4

Raman
PD
Processor Power
Module Supply

Line A In 8

*AVG, MIN, and MAX measurements also provided.

Facility: RAMAN port 8


Legend Parameter: ORLIN-OTS*, ORLOUT-OTS*,
OPIN-OTS*, OPOUT-OTS*, OPROSC-OTS*
EOS Ethernet over SONET Facility: OTDRCFG port 8
OPM Optical power monitoring Parameter: EVC(SH/LG/SHMAX/LGMAX)-OTS,
OSC Optical service channel MAXEVL(SH/LG/SHMAX/LGMAX)-OTS,
OTDR Optical time domain reflectometry MAXEVR(SH/LG/SHMAX/LGMAX)-OTS,
PD Photodiode MAXEVLDIS(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVRDIS(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVL(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVR(SH/LG/SHMAX/LGMAX)-OTS,

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• High Received Span Loss
• Low Received Span Loss
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• SLDD Adjacency Loss
• Software Subsystem Failed
RAMAN amplifier alarms
• Automatic Power Reduction Active
• Automatic Shutoff
• Automatic Shutoff Compromised
• Automatic Shutoff Disabled
• Calibration Required
• Shutoff Threshold Crossed
• Input Loss Of Signal
• Optical Line Fail
• Raman Failed To Turn On
• Target Unachievable
• Telemetry Loss of Signal
OTDRCFG alarms
• Gauge Threshold Crossing Alert Summary
• OTDR Trace In Progress
• Line A Input OTDR High Loss detected
• Line A Input OTDR High Reflection detected

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COM alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to SRA circuit packs:
• is a 10-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). If using a 7-slot shelf with 2xOSC ports, the OSC
connections is made on the SRA, not the shelf OSC ports.
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• each SRA in a domain must be at the same software release.

ATTENTION
If there is an intention to use Wayside traffic on the SRA circuit pack now or in the
future, it is recommended to equip SR as follows:
— slots 1 and/or 8 of the 6500-7 packet-optical shelf (for the first pair of SRA circuit
packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of SRA circuit packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of SRA circuit packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SRA circuit
pack. The Wayside Ethernet ports are intended for intrabuilding use only.

• requires high flow cooling fan modules (NTK507LDE5, NTK507MDE5,


NTK507LS, and NTK507MS) when equipped in a 14-slot shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a SRA circuit pack:
• The SRA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs.
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SRA circuit pack.
• In a 14-slot shelf type, when the SRA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SRA circuit pack
• In a 6500-7 packet-optical shelf type, when the SRA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SRA optical interface circuit pack.

Table 1-24
Technical specifications for SRA optical interface circuit packs

Parameter SRA (NTK552JA)


Weight (estimated) 1.6 kg (3.5 lb)
Power Typical (W): 85 (Note 1 and Note 3)
consumption Power Budget (W): 110 (Note 2 and Note 3)
Line A Line B
Wavelength range 1528.77 to 1566.72 (96 channels capable)
(nm)
Insertion loss from 1.9 (max.) N/A
Line_A_In to
Line_A_Out (dB)
Insertion loss from N/A 1.7 (max.)
Line_B_In to
Line_B_Out (dB)
Insertion loss from 2.4 (max.) N/A
Line_A_In to
OSC_Out (dB)
Insertion loss from N/A 1.9 (max.)
OSC_In to
Line_B_Out (dB)
Minimum Default Maximum Minimum Default Maximum
Input LOS -36 -36 10 -20 -10 10
threshold (dBm)
OSC A Out LOS -43 -40 0 N/A
Set (dBm)
APR (dB) 15 24 30 N/A
Shutoff threshold -60 -39 10 N/A
(dBm)

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Table 1-24 (continued)


Technical specifications for SRA optical interface circuit packs

Parameter SRA (NTK552JA)


Raman specifications
Raman power 1 (achieved using four pumps totaling +30 dB)
(Watt)
Raman pump Pump 1: 1424 nm
wavelength (nm) Pump 2: 1465 nm
Pump 3: 1455 nm
Pump 4: 1434 nm
Raman gain (dB) 0 to 24 (depending on the fiber type)
SFP specifications (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add
the power values for each of the required pluggable devices. For pluggable transceiver power values,
refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For optical SFP specifications, see chapter 3 of Pluggable Datasheets and Reference,
323-1851-180.

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OSC SFP optical specifications for SRA circuit packs


Table 1-25 lists the OSC SFP specifications for SRA circuit packs.

Table 1-25
OSC SFP specifications for SRA circuit packs

PEC Description Mode Wavelength Transmitter Receiver sensitivity (dBm)


(nm) power (dBm) (Note 1)
Min. Max. Min. Max.
NTK592NG Low Tx power CWDM 1511 -7.5 -4.0 -44.0 -7.0
NTK592NV Long reach CWDM 1511 1.0 5.0 -44.0 -7.0
NTK592NR Long reach DWDM 1517 3.0 6.0 -43.0 -7.0
(Note 2)
Note 1: The Rx power monitoring accuracy is +/- 2 dB over the power range of -44 to -20 dBm for
NTK592NG and NTK592NV is undefined outside the documented range.
Note 2: NTK592NR applies to SRA circuit packs only. Use this SFP when the fiber type of the span
is TWRS and when the CWDM SFP limit is exceeded. This SFP must always be used in combination
with OSC Filter (1516.9 nm) module (NTK504BA) to reach spans losses of up to 46 dB on all fiber
types.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA)


Overview
The Switchable Line Amplifier (XLA C-Band) circuit pack (also referred to as
XLA) is used for providing amplification in Photonic Layer applications. The
XLA circuit pack has one fixed-gain amplifier per outgoing line facing direction
where Line A and Line B can be independently provisioned for either High or
Low Gain values. Unlike SRA circuit packs, there are no OSC filters or WSC
port. An XLA circuit pack must always be paired with an SRA circuit pack
(Raman span/long span) or SAM/ESAM circuit pack (short span) depending
on the requirements.

Figure 1-35 on page 1-107 shows the faceplate of an XLA circuit pack and
Figure 1-36 on page 1-108 provides a functional block diagram of the XLA
circuit pack.

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Figure 1-35
XLA circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Monitor
ports

Yellow circle (LOS) Line ports


- Used to communicate Rx Loss of Signal

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Figure 1-36
XLA circuit pack block diagram (NTK552KA)

Mon B 1

EDFA Line B Out 5


Backplane

PD PD

Line B In 6

Mon A 2

EDFA
Line A Out 7

PD PD

Processor Power
Module Supply
Line A In 8

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Supported functionality
The XLA circuit packs (NTK552KA) provide the following functionality:
• wavelength range: C-band 1528.77 nm to 1566.72 nm
• 50 GHz and 100 GHz grid compliant
• external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
• ALSO (Automatic Line Shut Off) functionality
• APR (Automatic Power Reduction) functionality
• see below for function and connector type for each port
Table 1-26
XLA optical interfaces

Interface name Physical port # Function Connector type

Line A In / Out 8/7 Input / output port of Amplifier A LC

Line B In / Out 6/5 Input / output port of Amplifier B LC

Mon A 2 Monitor port for Line A Out LC

Mon B 1 Monitor port for Line B Out LC

Performance monitoring
The 6500 monitors and collects physical PMs for XLA circuit pack facilities.
Table 1-27 provides a list of monitor types supported on XLA circuit packs.
Figure 1-37 on page 1-111 shows the XLA circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-27
Monitor types table for XLA circuit pack

Monitor type Facility

AMP NMCMON CHMON

ORL-OTS X
ORLMIN-OTS X
ORLMAX-OTS X
ORLAVG-OTS X

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

OPT-OCH X X
OPTMIN-OCH X X
OPTMAX-OCH X X
OPTAVG-OCH X X

Note: CHMON OPT-OCH monitor type support requires the OPM (embedded within
WSS w/OPM circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs).

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Figure 1-37
XLA circuit pack optical monitoring points

Facility: CHMON port 5,


Facility: AMP port 6 NMCMON port 5
Parameter: ORL-OTS*, OPIN-OTS*, OPOUT-OTS* Parameter: OPT-OCH* **

MON B 1

EDFA Line B Out 5


Backplane

PD PD

Line B In 6

Facility: CHMON port 7,


NMCMON port 7
Parameter: OPT-OCH* **

Facility: AMP port 8


Parameter: ORL-OTS*, OPIN-OTS*, OPOUT-OTS*
Mon A 2

EDFA Line A Out 7

PD PD

Processor Power
Module Supply
Line A In 8

* AVG, MIN, and MAX measurements also provided.


** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the LIM L-Band circuit pack, as there is no corresponding L-Band OPM.

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• High Received Span Loss

AMP alarm
• Low Optical Return Loss at Output

Photonic alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• High Fiber Loss
• Fiber Type Manual Provisioning Required
• Shutoff Threshold Crossed
• Optical Line Failed
• Automatic Power Reduction Active
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff
• Automatic Shutoff Disabled
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected
COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to XLA circuit packs:
• is a 6-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).

The following restrictions on using a cross-connect circuit pack apply when


deploying a XLA circuit pack:
• the XLA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a XLA circuit pack
• In a 14-slot shelf type, when the XLA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a XLA circuit pack
• In a 6500-7 packet-optical shelf type, when the XLA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the XLA optical interface circuit pack.

Table 1-28
Technical specifications for XLA optical interface circuit packs

Parameter XLA (NTK552KA)


Weight (estimated) 1.0 kg (2.2 lb)
Power consumption Typical (W): 36 (Note 1)
Power Budget (W): 40 (Note 2)
Line A and Line B
Maximum output power (dBm) 23
Wavelength range (nm) 1528.77 to 1566.72 (96 channels capable)
Top offset (Note 3) Minimum Default Maximum
-6 0 0
Low Gain mode (Note 4): Minimum Default Maximum
Gain (dB) 5 11 19
Amplifier Input LOS threshold (dBm) -39 -26 -22
Amplifier Output LOS threshold (dBm) -15 -12 0
Shutoff threshold (dBm) -42 -29 -22
High Gain mode (Note 4): Minimum Default Maximum
Gain (dB) 11 11 29
Amplifier Input LOS threshold (dBm) -39 -36 -22
Amplifier Output LOS threshold (dBm) -15 -12 0
Shutoff threshold (dBm) -42 -39 -22
Tap ratio loss (dB) Minimum Maximum
Line_A_Out to Line_A_Mon 14.6 18.4
Line_B_Out to Line_B_Mon 14.6 18.4
Gain mask See Figure 1-38 on page 1-116 for low gain mode
and Figure 1-39 on page 1-116 for high gain mode

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Table 1-28 (continued)


Technical specifications for XLA optical interface circuit packs

Parameter XLA (NTK552KA)


Line A and Line B
Noise figure (NF) (dB) (Note 5) Different at various gains
at output power of 23 dBm Low Gain mode High Gain mode
• Gain 5 - 10 dB • Gain 15 - 18 dB
NF < 16.6 (maximum) NF < 10.3 (maximum)
• Gain 10 - 15 dB • Gain 18 - 25 dB
NF < 9.6 (maximum) NF < 7.8 (maximum)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: TOP Offset is a lever that can be used to maximize link budget (by reducing noise figure), and
the value will be provided by the modeling tools where applicable.
Note 4: Gain mode is defined as NA, High, or Low. Gain mode is set at provisioning from value
provided by OnePlanner. Gain mode drives minimum and maximum amplifier gain. Gain mode of NA
(Not Applicable) is used for all amplifiers except XLA. On database restore, if the gain mode is different
between the saved database and the actual gain setting on the circuit pack, traffic may be impacted.
You cannot switch from Low Gain mode to High Gain mode if the current target gain is less than 11 dB,
which is outside of the common range (11-19 dB) for the Low Gain setting.
Note 5: Contact Ciena if more information is required.

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Figure 1-38
XLA line A and Line B gain mask (low gain mode)

Extended
range

Typical range

Figure 1-39
XLA line A and Line B gain mask (high gain mode)

Typical range

Extended
range

Extended
range

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Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Service Access Module (SAM C-Band) w/Optical Service Channel


(OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JN) and Enhanced
Service Access Module (ESAM C-Band) w/Optical Service Channel
(OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JT)
Overview
The Service Access Module (SAM C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (also referred to as SAM) and Enhanced
Service Access Module (ESAM C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (also referred to as ESAM) are used as
the outgoing line facing circuit packs for short-span configurations in Photonic
Layer applications. By including integrated OSC add/drop filters and OSC
add/drop ports, the SAM and ESAM circuit packs remove the need for 2xOSC
circuit packs at Line Amp and ROADM sites. The ESAM circuit pack also
provides OTDR functionality.

Figure 1-40 on page 1-119 shows the faceplate of a SAM circuit pack and
Figure 1-41 on page 1-120 shows the faceplate of an ESAM circuit pack.
Figure 1-42 on page 1-121 provides a functional block diagram of the SAM
circuit pack and Figure 1-43 on page 1-122 provides a functional block
diagram of the ESAM circuit pack.

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Figure 1-40
SAM circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can WSC port
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

OSC ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Line ports

Monitor
ports

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Figure 1-41
ESAM circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can WSC port
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

OSC ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Line ports

Monitor
ports

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Figure 1-42
SAM circuit pack block diagram (NTK552JN)

Wayside 1
Ethernet
Switch EOS OSC 2
Mapper SFP

OSC In 3

Mon B 9

Line B Out 5
Backplane

PD

Line B In 6

Mon A 10

Line A Out 7

PD

OSC Out 4

Processor Power PD
Module Supply
Line A In 8

Legend
EOS Ethernet over SONET
OSC Optical service channel
PD Photodiode

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Figure 1-43
ESAM circuit pack block diagram (NTK552JT)

Wayside 1
Ethernet
Switch EOS OSC 2
Mapper SFP

OSC In 3

Mon B 9

Line B Out 5
Backplane

OTDR
PD

Line B In 6

Mon A 10

Line A Out 7

PD

OSC Out 4

Processor Power PD
Module Supply
Line A In 8

Legend
EOS Ethernet over SONET
OSC Optical service channel
OTDR Optical time domain reflectometry

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Supported functionality
The SAM circuit packs (NTK552JN) and ESAM circuit packs (NTK552JT)
provide the following functionality:
• wavelength range: C-band 1528.77 nm to 1566.72 nm
• 50 GHz and 100 GHz grid compliant
• integrated OSC add/drop filters - OSC add/drop ports
• integrated a Wayside connection (WSC) port
• external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
• Optical Time-Domain Reflectometry (OTDR) to measure integrity of fiber
plant and interconnects (only supported in ESAM circuit packs)
• see below for function and connector type for each port
Table 1-29
SAM and ESAM optical interfaces

Interface name Physical port # Function Connector type

Mon A 10 Monitor port for Line A Out LC

Mon B 9 Monitor port for Line B Out LC

Line A In / Out 8/7 Input / output port of Line A LC

Line B In / Out 6/5 Input / output port of Line B LC

OSC A Out 4 Optical Service Channel output LC

OSC B In 3 Optical Service Channel input LC

OSC SFP In / Out 2 Optical Service Channel SFP pluggable LC


input/output port

WSC 1 Wayside channel RJ45

Cross-connection types
The SAM and ESAM circuit packs support the following cross-connection
types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The SAM and ESAM circuit packs only support the OCH (Optical Channel)
Photonic cross-connection rate.

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Supported SFPs
The following table provides a list of the SFPs that are supported on the SAM
and ESAM circuit pack.

Table 1-30
Supported SFP modules for the SAM and ESAM circuit packs (NTK552JN and NTK552JT)

Pluggable Equipment and Supported SFP modules and rates Part Number
Facilities (Note 1, Note 2, and
Note 3)

• P155M OC-3/STM-1 CWDM 1511 nm (0-34 dB span) NTK592NGE5


— OSC (Note 4) — OC-3/STM-1 (155.52Mb/s)

OC-3/STM-1 CWDM 1511 nm (12-42 dB span) NTK592NVE5


— OC-3/STM-1 (155.52Mb/s)

Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and OnePlanner design.
Note 3: An ESAM/SAM has three OPTMON facilities (ports 4, 6, and 8). In addition, an ESAM has one
TELEMETRY facility (port 5). The P155M pluggable and OSC facility is supported on port 2.
Note 4: The P155M pluggable on the SAM or ESAM circuit pack supports WSC facilities. These
facilities are not displayed or managed in the Equipment & Facilities Provisioning applications. They are
handled by Comms Setting Management application through LAN option under Interfaces tab. If you
provision the low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV), the
connected LIM port 4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal”
alarm from being raised.

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Performance monitoring
The 6500 monitors and collects physical PMs for SAM and ESAM circuit pack
facilities. Table 1-31 provides a list of monitor types supported on SAM and
ESAM circuit packs. Figure 1-44 on page 1-128 and Figure 1-45 on page
1-129 show the SAM and ESAM circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-31
Monitor types table for SAM and ESAM circuit pack

Monitor type Facility

OSC OPTMON OTDRCFG


(ESAM only)
Note 1

SONET Section (S)/SDH Regenerator Section (RS)

CV-S or RS-BBE X

ES-S or RS-ES X

SES-S or RS-SES X

SEFS-S or RS-OFS X

SONET Line (L)/SDH Multiplex Section (MS)

CV-L or MS-BBE X

ES-L or MS-ES X

SES-L or MS-SES X

UAS-L or MS-UAS X

FC-L or MS-FC X

DMMIN-L or L-DMMIN X
DMMAX-L or L-DMMAX X
DMAVG-L or L-DMAVG X

Physical

OPR-OCH X
OPRMIN-OCH X
OPRMAX-OCH X
OPRAVG-OCH X
Note 2

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Table 1-31
Monitor types table for SAM and ESAM circuit pack

Monitor type Facility

OSC OPTMON OTDRCFG


(ESAM only)
Note 1

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note 3

SPANLOSS-OCH X
SPANLOSSMIN-OCH X
SPANLOSSMAX-OCH X
SPANLOSSAVG-OCH X

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

EVCSH-OTS X

EVCLG-OTS X

EVCSHMAX-OTS X

EVCLGMAX-OTS X

MAXEVLSH-OTS X

MAXEVLLG-OTS X

MAXEVLSHMAX-OTS X

MAXEVLLGMAX-OTS X

MAXEVRSH-OTS X

MAXEVRLG-OTS X

MAXEVRSHMAX-OTS X

MAXEVRLGMAX-OTS X

MAXEVLDISSH-OTS X

MAXEVLDISLG-OTS X

MAXEVLDISSHMAX-OTS X

MAXEVLDISLGMAX-OTS X

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Table 1-31
Monitor types table for SAM and ESAM circuit pack

Monitor type Facility

OSC OPTMON OTDRCFG


(ESAM only)
Note 1

MAXEVRDISSH-OTS X

MAXEVRDISLG-OTS X

MAXEVRDISSHMAX-OTS X

MAXEVRDISLGMAX-OTS X

CUMEVLSH-OTS X

CUMEVLLG-OTS X

CUMEVLSHMAX-OTS X

CUMEVLLGMAX-OTS X

CUMEVRSH-OTS X

CUMEVRLG-OTS X

CUMEVRSHMAX-OTS X

CUMEVRLGMAX-OTS X

Note 1: Support for OTDRCFG PM counts is restricted to shelves with SP2 shelf processor types.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH/OCH-OPT value is reported with an accuracy of ±0.3 dB.

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Figure 1-44
SAM circuit pack optical monitoring points

Wayside 1
Ethernet
Switch EOS OSC 2
Mapper SFP

Facility: OSC port 2


Parameter: OPR-OCH*, OPT-OCH*, SPANLOSS-OCH* OSC In 3

Facility: OPTMON port 6 Mon B 9


Parameter: OPR-OTS*

Line B Out 5
Backplane

PD

Line B In 6

Mon A 10

Line A Out 7

PD

Facility: OPTMON port 4


Parameter: OPR-OTS*

OSC Out 4

Processor Power PD
Module Supply
Line A In 8

Facility: OPTMON port 8


Parameter: OPR-OTS*

*AVG, MIN, and MAX measurements also provided.

Legend
EOS Ethernet over SONET
OSC Optical service channel
PD Photodiode

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Figure 1-45
ESAM circuit pack optical monitoring points

Wayside
Wayside 11
Ethernet
Ethernet
Switch
Switch EOS OSC
EOS OSC 22
Mapper
Mapper SFP
SFP
Facility:
Facility: OSC
OSC port
port 22
Parameter:
Parameter: OPR-OCH*, OPT-OCH*,
OPR-OCH*, OPT-OCH*, SPANLOSS-OCH*
SPANLOSS-OCH* OSC
OSC In
In 33

Facility:
Facility: OPTMON
OPTMON port
port 66 Mon
Mon B
B 99
Parameter: OPR-OTS*
Parameter: OPR-OTS*

Line
Line B Out 55
B Out
Backplane
Backplane

OTDR
OTDR PD
PD

Line
Line B
B In
In 66

Mon
Mon A
A 10
10

Line
Line A Out 77
A Out

PD
PD

Facility:
Facility: OPTMON
OPTMON port
port 44
Parameter: OPR-OTS*
Parameter: OPR-OTS*

OSC
OSC Out
Out 44

PD
PD
Processor
Processor Power
Power
Module Supply Line
Line A
A In
In 88
Module Supply
Facility: OPTMON port 8
Parameter: OPR-OTS*
*AVG, MIN, and MAX measurements also provided.
*AVG, MIN, and MAX measurements also provided.
Facility: OPTMON port 8
Parameter: OPR-OTS*
Legend
Legend Facility: OTDRCFG port 8
EOS
EOS Ethernet
Ethernet over
over SONET
SONET Parameter: EVC(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVL(SH/LG/SHMAX/LGMAX)-OTS,
OSC
OSC Optical
Optical service channel
service channel MAXEVR(SH/LG/SHMAX/LGMAX)-OTS,
OTDR
OTDR Optical
Optical Time Domain Reflectometry
Time Domain Reflectometry MAXEVLDIS(SH/LG/SHMAX/LGMAX)-OTS,
PD Photodiode MAXEVRDIS(SH/LG/SHMAX/LGMAX)-OTS,
PD Photodiode
CUMEVL(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVR(SH/LG/SHMAX/LGMAX)-OTS,

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Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• High Received Span Loss
• Low Received Span Loss
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• Automatic Shutoff Compromised
• SLDD Adjacency Loss
• Software Subsystem Failed

Adjacency alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• High Fiber Loss
• Fiber Type Manual Provisioning Required
• Input Loss of Signal
• Optical Line Failed

OTDRCFG alarms (ESAM only)


• OTDR Trace In Progress
• Gauge Threshold Crossing Alert Summary

COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to SAM and ESAM circuit packs:
• SAM is a 10-port single slot interface.
• ESAM is a 10-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• SAM cannot be equipped in the 2-slot shelf
• ESAM cannot be equipped in the NTK503MAE5 and NTK503NAE5
variants of 2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA
variant of 2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC
(NTK555NA or NTK555NB).

ATTENTION
If there is an intention to use Wayside traffic on the SAM or ESAM circuit pack now
or in the future, it is recommended to equip SAM or ESAM as follows:
— slots 1 and/or 8 of the 6500-7 packet-optical shelf (for the first pair of SAM or
ESAM circuit packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of SAM or ESAM circuit
packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of SAM or ESAM circuit
packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SAM or
ESAM circuit pack. The Wayside Ethernet ports are intended for intrabuilding use
only.

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ATTENTION
Although SAM or ESAM circuit packs can be equipped in slots 1-8, 11-18,
21-28, and 31-38 of a 32-slot shelf, it is recommended to use slots 1, 18, 21,
and/or 38 of the 32-slot shelf. Channels for electrical cable management
within the 32-slot packet-optical shelves (NTK603AAE5 and NTK603AB)
fiber management tray associated with slots 1, 18, 21, and 38 of the 32-slot
shelf allow for routing of two RJ45 Category 5 Ethernet cables to each of
those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SAM
or ESAM circuit pack. The Wayside Ethernet port is intended for intrabuilding
use only.

The following restrictions on using a cross-connect circuit pack apply when


deploying a SAM or ESAM circuit pack:
• The SAM or ESAM circuit packs do not use any cross-connect capacity
and can be installed in shelves equipped with or without cross-connect
circuit packs.
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SAM or ESAM circuit
pack.
• In a 14-slot shelf type, when the SAM or ESAM circuit packs are installed
in slot 7 or 8, only Broadband circuit packs or Photonic circuit packs can
be provisioned in the other interface slots (slots 1 to 6 and 9 to14) as
MSPP or PKT/OTN I/F interface circuit packs require a cross-connect
circuit pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and
equipment descriptions) for a full list of supported Broadband and
Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SAM or ESAM circuit pack
• In a 6500-7 packet-optical shelf type, when the SAM or ESAM circuit
packs are installed in slot 7 or 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6)
as MSPP or PKT/OTN I/F interface circuit packs require a cross-connect
circuit pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and
equipment descriptions) for a full list of supported Broadband and
Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SAM and ESAM optical interface circuit packs.

Table 1-32
Technical specifications for SAM and ESAM optical interface circuit packs

Parameter SAM (NTK552JN) and ESAM (NTK552JT)


Weight (estimated) 0.9 kg (2.0 lb) for SAM and 1.4 kg (3.0 lb) for ESAM
Power Typical (W): 25 for SAM and 30 for ESAM (Note 1 and Note 3)
consumption Power Budget (W): 30 for SAM and 35 for ESAM (Note 2 and Note 3)
Line A Line B
Wavelength range 1528.77 to 1566.72 (96 channels capable)
(nm)
Minimum Default Maximum Minimum Default Maximum
Input LOS -36 -36 10 -20 -12 10
threshold (dBm)
OSC A Out LOS -43 -40 0 N/A
Set (dBm)
Shutoff threshold -60 -39 10 N/A
(dBm)
Maximum insertion 1.0 for SAM N/A
loss from Line A_In 1.5 for ESAM
to Line A_Out (dB)
Maximum insertion N/A 0.9 for SAM
loss from Line B_In 1.3 for ESAM
to Line B_Out (dB)
Maximum Insertion 1.5 for SAM N/A
loss from 1.8 for ESAM
Line_A_In to
OSC_Out (dB)
Maximum Insertion N/A 1.2 for SAM
loss from OSC_In 1.3 for ESAM
to Line_B_Out
(dB)

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Table 1-32
Technical specifications for SAM and ESAM optical interface circuit packs

Parameter SAM (NTK552JN) and ESAM (NTK552JT)


SFP specifications (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add
the power values for each of the required pluggable devices. For pluggable transceiver power values,
refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For optical SFP specifications, see chapter 3 of Pluggable Datasheets and Reference,
323-1851-180.

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OSC SFP optical specifications for SAM/ESAM circuit packs


The following table lists the OSC SFP specifications for SAM/ESAM circuit
packs.

Table 1-33
OSC SFP specifications for SAM/ESAM circuit packs

PEC Description Mode Wavelength Transmitter Receiver sensitivity (dBm)


(nm) power (dBm)
Min. Max. Min. Max.
NTK592NG Low Tx power CWDM 1511 -7.5 -4.0 -44.0 -7.0
NTK592NV Long reach CWDM 1511 1.0 5.0 -44.0 -7.0
Note: The Rx power monitoring accuracy is +/- 2 dB over the power range of -44 to -20 dBm and is
undefined outside the documented range.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5)


Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 5x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 5x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 100 GHz w/OPM 5x1 circuit pack and CMD44 modules
(at ROADM or WSS-based terminal sites) are required to perform add/drop
operation. Figure 1-46 shows the faceplate of a WSS 100 GHz w/OPM 5x1
circuit pack and Figure 1-47 on page 1-137 provides a functional block
diagram of the WSS 100 GHz w/OPM 5x1 circuit pack.

Figure 1-46
WSS 100 GHz w/OPM 5x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use) Monitor
- Used to communicate whether circuit pack can ports
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow circle (LOS)


Switch
- Used to communicate Rx Loss of Signal
ports

Common
ports

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Figure 1-47
WSS 100 GHz w/OPM 5x1 circuit pack block diagram (NTK553EAE5)

Processor
Module

Power
Supply Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7

Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
Switch In-6 13
Backplane

9x1 100GHZ

Switch In-7 14
Switch In-8 15

Switch In-9 16
PD PD PD PD PD PD PD PD PD
Common 18
Out
Isolator Common 17
In
PD
Demux Out-1 4
Passive Demux Out-2 6
Demux
1x5 Demux Out-3 8
Demux Out-4 10

Demux Out-5 12

Legend
PD Photodiode

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Supported functionality
The WSS 100 GHz w/OPM 5x1 circuit packs (NTK553EAE5) provide the
following functionality:
• a per wavelength attenuation profile for up to 44 C-band channels at
100 GHz spacing
• a demultiplexer block which is essentially a 1:5 passive power splitter
• in-service dynamic per channel add/drop/branching/broadcast
• embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports
• per channel power control on add and pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching and broadcast (up to five connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-34 on page 1-139 for function and connector type for each
port

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Table 1-34
WSS 100 GHz w/OPM 5x1 optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input / output from other WSS or LC


Switch 2 In / Out 5/6 CMD44

Switch 3 In / Out 7/8


Switch 4 In / Out 9 / 10
Switch 5 In / Out 11 / 12
Switch 6 In 13
Switch 7 In 14
Switch 8 In 15
Switch 9 In 16

Common In / Out 17 / 18 DWDM optical input / output to /from the LC


line amplifier

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 5x1
circuit pack facilities. Table 1-35 provides a list of monitor types supported on
WSS 100 GHz w/OPM 5x1 circuit packs. Figure 1-48 on page 1-141 shows
the WSS 100 GHz w/OPM 5x1 circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-35
Monitor types table for WSS 100 GHz w/OPM 5x1 circuit packs

Monitor type Facility

OPTMON

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note

Note: Use optical terminators on unused input faceplate connectors of


installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and
the ports may appear in-service.

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Figure 1-48
WSS 100 GHz w/OPM 5x1 circuit pack optical monitoring points

Processor
Module

Power
Supply Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7
Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
Switch In-6 13
Backplane

9x1 100GHZ

Switch In-7 14
Switch In-8 15
Switch In-9 16
PD PD PD PD PD PD PD PD PD
Common 18
Out
Isolator Common 17
In
PD
Demux Out-1 4
Passive Demux Out-2 6
PMs collected at all PD locations Demux
Facility: OPTMON port 1,2,3,5,7, 1x5 Demux Out-3 8
9,11,13,14,15,16,17
Parameter: OPR-OTS* Demux Out-4 10

Demux Out-5 12
*AVG, MIN, and MAX measurements also provided

Legend
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Mismatch
• Adjacency Provisioning Error
• Channel Opacity Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Wavelength Measurement Warning
• Wavelength Measurement Error

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 5x1 circuit
packs:
• is a -slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 14 since WSS 100 GHz w/OPM 5x1 circuit pack is a -slot interface.
This circuit pack is not supported for use in slots 7/8 and 8/9 of the 14-slot
packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.

• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. WSS 100 GHz w/OPM 5x1 circuit pack cannot be
placed in slot 8, 18, 28, or 38 since WSS 100 GHz w/OPM 5x1 circuit pack
is a -slot interface.
Note: Due to faceplate dimensions, the following releases of the -slot 100
GHz WSS circuit pack cannot be equipped in slots 7/8 or 27/28 of 32-slot
shelves:
WSS 100 GHz w/OPM 5x1 (NTK553EAE5): releases 01, 02 and 03
You must use the following releases of the -slot 100 GHz WSS circuit pack:
WSS 100 GHz w/OPM 5x1 (NTK553EAE5): releases 04 and above

• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or


NTK503KA). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 7 since WSS 100 GHz w/OPM 5x1 circuit pack is a -slot interface.
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 8 since WSS 100 GHz w/OPM 5x1 circuit pack is a -slot interface. This
circuit pack is not supported for use in slots 7/8 of the 6500-7
packet-optical shelf (NTK503RA).
• cannot be equipped in the 2-slot shelf.

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• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 100 GHz w/OPM 5x1 circuit pack:
• the WSS 100 GHz w/OPM 5x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, when the WSS 100 GHz w/OPM 5x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, when the WSS 100 GHz w/OPM 5x1
circuit packs are installed in slots 7 and 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 5x1 optical interface circuit pack.

Table 1-36
Technical specifications for WSS 100 GHz w/OPM 5x1 optical interface circuit pack

Parameter WSS 100 GHz w/OPM 5x1 (NTK553EAE5)


Weight (estimated) 2.5 kg (5.5 lb)
Power consumption Typical (W): 32 (Note 1)
Power Budget (W): 32 (Note 2)
Connector type LC
OPM power range -35 dBm to +10 dBm
Wavelength range (nm) 1530.33 to 1565.09 (88 channels capable)
Maximum total input power 24 dBm for Common In, Switch In ports 1-9
Maximum Demux insertion loss 8.7 dB from Common In to Switch Out 1-5 ports
Maximum Mux insertion loss 7 dB from Switch In ports 1-9 to Common Out
Available attenuation per channel 0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and NTK553JB)
Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 2x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 2x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching.

The combination of WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 or
NTK553JB variant) and CMD44 modules (at ROADM or WSS-based terminal
sites) or the combination of WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JB variant only) and Photonic Passive Equipment (OMDF4, OMDF8
and BS5 modules, or CMD44 modules) (at ROADM or WSS-based terminal
sites) are required to perform add/drop operation. WSS 100 GHz w/OPM 2x1
circuit packs are mostly used for 1-way Terminal or 2-way ROADM
applications.

The WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 variant) is a newer
variant of WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) with
the following distinctions:
• NTK553EAE5 variant has branching and broadcast capability of up to five
connected nodes (5x1) while NTK553JAE5 variant has branching and
broadcast capability of up to two connected nodes (2x1). In other words,
a WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) has five
Switch In ports while a WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JAE5) has two Switch In ports.
• demultiplexer block in NTK553EAE5 variant is a 1:5 passive power splitter
while demultiplexer block in NTK553JAE5 variant is a 1:2 passive power
splitter. In other words, a WSS 100 GHz w/OPM C-Band 5x1 circuit pack
(NTK553EAE5) has five Switch Out ports while a WSS 100 GHz w/OPM
2x1 circuit pack (NTK553JAE5) has two Switch Out ports.
• lower demux insertion loss compared to NTK553EAE5 variant lowers total
network costs since lower power amps can be used in some scenarios.

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The WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JB variant) is a newer
variant of the NTK553JAE5 with the following distinctions:
• NTK553JB circuit pack is single slot-wide while NTK553JAE5 circuit pack
is slot-wide.
• NTK553JB circuit pack has less power consumption than NTK553JAE5
circuit pack.
• NTK553JB adds a power tap/monitor on Common Out port.
• different optical technical specifications.
• the faceplate LC connectors on the NTK553JB circuit pack protrude by an
extra 10 mm compared to faceplate LC connectors on the NTK553JAE5
circuit pack. As a result, in order to avoid unacceptable interference with
the shelf front cover, NTTC50++ patch cords (NTTC50++ patch cords are
Corning standard LC strain relief boots) or approved equivalent must be
used. Also, attenuator pads cannot be mounted on the faceplate of the
NTK553JB circuit pack when the shelf front cover is installed.

Figure 1-49 on page 1-148 shows the faceplate of a WSS 100 GHz w/OPM
2x1 circuit pack (NTK553JAE5 variant) and Figure 1-50 on page 1-149
provides a functional block diagram of the WSS 100 GHz w/OPM 2x1 circuit
pack (NTK553JAE5 variant).

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Figure 1-49
WSS 100 GHz w/OPM 2x1 circuit pack faceplate (NTK553JAE5 variant)

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use) Monitor
- Used to communicate whether circuit pack can ports Switch
be extracted ports
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Common
ports

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Figure 1-50
WSS 100 GHz w/OPM 2x1 circuit pack block diagram (NTK553JAE5 variant)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch
Monitor-2 2

Switch In-1 3
Switch In-2 5
Wavelength
Backplane

Selective Switch
2x1 100GHz PD PD

Common 18
Out

Isolator Common
In 17
Passive PD
Demux Demux Out-1 4
1x2
Demux Out-2 6

Legend
PD Photodiode

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Figure 1-51 shows the faceplate of a WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JB variant) and Figure 1-52 on page 1-151 provides a functional
block diagram of the WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JB
variant).

Figure 1-51
WSS 100 GHz w/OPM 2x1 circuit pack faceplate (NTK553JB variant)

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can Monitor
be extracted ports
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off Switch
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Common
ports

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Figure 1-52
WSS 100 GHz w/OPM 2x1 circuit pack block diagram (NTK553JB variant)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch
Monitor-2 2

Switch In-1 3
Switch In-2 5
Wavelength
Backplane

Selective Switch
2x1 100GHz PD PD

Common 8
Out

PD

Isolator Common
In 7
Passive PD
Demux Demux Out-1 4
1x2
Demux Out-2 6

Legend
PD Photodiode

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Supported functionality
The WSS 100 GHz w/OPM 2x1 circuit packs (NTK553JAE5 and NTK553JB)
provide the following functionality:
• a per-wavelength-attenuation profile for up to 44 C-band channels at 100
GHz spacing
• a demultiplexer block which is essentially a 1:2 passive power splitter
• in-service dynamic per channel add/drop/branching/broadcast
• embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports for both NTK553JAE5 and
NTK553JB variants and also at Common Out port for NTK553JB variant
• per channel power control on add and pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching and broadcast (up to two connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-37 for function and connector type for each port
Table 1-37
WSS 100 GHz w/OPM 2x1 optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input / output from other WSS or LC


Switch 2 In / Out 5/6 CMD44

Common In / Out 17 / 18 on DWDM optical input / output to /from the LC


NTK553JAE5 line amplifier
variant and 7 / 8 on
NTK553JB variant

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 2x1
circuit pack facilities. Table 1-38 provides a list of monitor types supported on
WSS 100 GHz w/OPM 2x1 circuit packs. Figure 1-53 on page 1-154 shows
the WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 variant) optical
monitoring points. Figure 1-54 on page 1-155 shows the WSS 100 GHz
w/OPM 2x1 circuit pack (NTK553JB variant) optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-38
Monitor types table for WSS 100 GHz w/OPM 2x1 circuit pack

Monitor type Facility

OPTMON

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note

Note: Use optical terminators on unused input faceplate connectors of


installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and
the ports may appear in-service.

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Figure 1-53
WSS 100 GHz w/OPM 2x1 circuit pack optical monitoring points (NTK553JAE5 variant)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch
Monitor-2 2

Switch In-1 3
Switch In-2 5
Wavelength
Backplane

Selective Switch
2x1 100GHz PD PD

Common 18
Out

Facility: OPTMON port 18


Parameter: OPR-OTS*

Isolator Common
In 17
Passive PD
PMs collected at all PD locations Demux Demux Out-1 4
Facility: OPTMON port 1,2,3,5,17 1x2
Parameter: OPR-OTS* Demux Out-2 6

*AVG, MIN, and MAX measurements also provided

Legend
PD Photodiode

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Figure 1-54
WSS 100 GHz w/OPM 2x1 circuit pack optical monitoring points (NTK553JB variant)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch
Monitor-2 2

Switch In-1 3
Switch In-2 5
Wavelength
Backplane

Selective Switch
2x1 100GHz PD PD

Common 8
Out

PD

Isolator Common
In 7
Passive PD
PM collected at all PD locations Demux Demux Out-1 4
Facility: OPTMON port 1,2,3,5,7,8 1x2
Demux Out-2 6
Parameter: OPR-OTS*

*AVG, MIN, and MAX measurements also provided.

Legend
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Mismatch
• Adjacency Provisioning Error
• Channel Opacity Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• High Optical Power
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Wavelength Measurement Warning
• Wavelength Measurement Error

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 2x1 circuit packs
(NTK553JAE5 variant):
• is a -slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 14 since WSS 100 GHz w/OPM 5x1 circuit pack is a -slot interface.
This circuit pack is not supported for use in slots 7/8 and 8/9 of the 14-slot
packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.

• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. WSS 100 GHz w/OPM 2x1 circuit pack cannot be
placed in slot 8, 18, 28, or 38 since WSS 100 GHz w/OPM 2x1 circuit pack
is a -slot interface.
Note: Due to faceplate dimensions, the following releases of the -slot 100
GHz WSS circuit pack cannot be equipped in slots 7/8 or 27/28 of 32-slot
shelves:
WSS 100 GHz w/OPM 2x1(NTK553JAE5): releases 01 and 02
You must use the following releases of the -slot 100 GHz WSS circuit pack:
WSS 100 GHz w/OPM 2x1(NTK553JAE5): releases 03 and above

• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or


NTK503KA). WSS 100 GHz w/OPM 2x1 circuit pack cannot be placed in
slot 7 since WSS 100 GHz w/OPM 2x1 circuit pack is a -slot interface.
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). WSS 100 GHz w/OPM 2x1 circuit pack cannot be placed in
slot 8 since WSS 100 GHz w/OPM 2x1 circuit pack is a -slot interface. This
circuit pack is not supported for use in slots 7/8 of the 6500-7
packet-optical shelf (NTK503RA).
• cannot be equipped in the 2-slot shelf.

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• all equipment that is part of an OTS must be located within the same
physical shelf.

The following equipping rules apply to WSS 100 GHz w/OPM 2x1 circuit packs
(NTK553JB variant):
• is a single slot interface.
• can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 100 GHz w/OPM 2x1 circuit pack:
• the WSS 100 GHz w/OPM 2x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, when the WSS 100 GHz w/OPM 2x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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• In a 6500-7 packet-optical shelf type, when the WSS 100 GHz w/OPM 2x1
circuit packs are installed in slots 7 and 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 2x1 optical interface circuit pack.

Table 1-39
Technical specifications for WSS 100 GHz w/OPM 2x1 optical interface circuit pack

Parameter WSS 100 GHz w/OPM 2x1


NTK553JAE5 variant NTK553JB variant
Weight (estimated) 2.5 kg (5.5 lb) 1.9 kg (4.1 lb)
Power consumption Typical (W): 32 (Note 1) Typical (W): 14 (Note 1)
Power Budget (W): 32 (Note 2) Power Budget (W): 31 (Note 2)
Connector type LC LC
OPM power range -35 dBm to +10 dBm -35 dBm to -6.5 dBm
Wavelength range (nm) 1530.33 to 1565.09 (88 channels 1530.33 to 1565.09 (88 channels
capable) capable)
Maximum total input 24 dBm for Common In, Switch In 24 dBm for Common In, Switch In
power ports 1-2 ports 1-2
Maximum Demux 4.4 dB from Common In to Switch 5.3 dB from Common In to Switch Out
insertion loss Out 1-2 ports 1-2 ports
Maximum Mux insertion 7 dB from Switch In 1-2 ports to 8.8 dB from Switch In 1-2 ports to
loss Common Out Common Out
Available attenuation per 0-18 dB 0-18 dB
channel
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

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Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA)


Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 4x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 4x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 100 GHz w/OPM 4x1 circuit pack and Photonic Passive
Equipment (OMDF4, OMDF8 and BS5 modules only), OMD4, or CMD44,
modules (at ROADM or WSS-based terminal sites) are required to perform
add/drop operation. Figure 1-55 on page 1-162 shows the faceplate of a WSS
100 GHz w/OPM 4x1 circuit pack and Figure 1-56 on page 1-163 provides a
functional block diagram of the WSS 100 GHz w/OPM 4x1 circuit pack.

The WSS 100 GHz w/OPM 4x1 circuit pack (NTK553HA) is a newer variant of
WSS 100 GHz w/OPM 5x1 circuit pack (NTK553EAE5) with the following
distinctions:
• NTK553HA circuit pack is single slot-wide while NTK553EAE5 circuit pack
is slot-wide.
• NTK553HA circuit pack has less power consumption than NTK553EAE5
circuit pack.
• NTK553HA circuit pack has four switch ports and 4 demux ports while
NTK553EAE5 circuit pack has nine switch ports and five demux ports.
• different optical technical specifications.
• the faceplate LC connectors on the NTK553HA circuit pack protrude by an
extra 10 mm compared to faceplate LC connectors on the NTK553EAE5
circuit pack. As a result, in order to avoid unacceptable interference with
the shelf front cover, NTTC50++ patch cords (NTTC50++ patch cords are
Corning standard LC strain relief boots) or approved equivalent must be
used. Also, attenuator pads cannot be mounted on the faceplate of the
NTK553HA circuit pack when the shelf front cover is installed.

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Figure 1-55
WSS 100 GHz w/OPM 4x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off Monitor
Blue diamond (In Use) ports
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow circle (LOS) Switch


- Used to communicate Rx Loss of Signal ports

Common
ports

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Figure 1-56
WSS 100 GHz w/OPM 4x1 circuit pack block diagram (NTK553HA)

Processor
Module

Power
Supply Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch Monitor-2 2

Switch In-3 3
Switch In-5 5

Switch In-7 7

Switch In-9 9
Wavelength
Selective Switch
Backplane

4x1 100GHZ
PD PD PD PD

Common 12
Out
Isolator Common 11
In
PD
Demux Out-4 4
Passive Demux Out-6 6
Demux
1x4 Demux Out-8 8
Demux Out-10 10

Legend
PD Photodiode

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Supported functionality
The WSS 100 GHz w/OPM 4x1 circuit packs (NTK553HA) provide the
following functionality:
• a per wavelength attenuation profile for up to 44 C-band channels at
100 GHz spacing
• a demultiplexer block which is essentially a 1:4 passive power splitter
• in-service dynamic per channel add/drop/branching/broadcast
• embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports
• per channel power control on add and pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching and broadcast (up to four connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-40 for function and connector type for each port
Table 1-40
WSS 100 GHz w/OPM 4x1 optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input / output from other WSS or LC


Switch 2 In / Out 5/6 CMD44

Switch 3 In / Out 7/8


Switch 4 In / Out 9 / 10

Common In / Out 11 / 12 DWDM optical input / output to /from the LC


line amplifier

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 4x1
circuit pack facilities. Table 1-41 provides a list of monitor types supported on
WSS 100 GHz w/OPM 4x1 circuit packs. Figure 1-57 on page 1-166 shows
the WSS 100 GHz w/OPM 4x1 circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-41
Monitor types table for WSS 100 GHz w/OPM 4x1 circuit packs

Monitor type Facility

OPTMON

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note

Note: Use optical terminators on unused input faceplate


connectors of installed WSS w/OPM circuit packs. If dust
caps are used instead of optical terminators on “Switch In”
ports, PMs can be reported against the ports and the ports
may appear in-service.

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Figure 1-57
WSS 100 GHz w/OPM 4x1 circuit pack optical monitoring points

Processor
Module

Power
Supply Optical Channel 2x1 Monitor-1 1
Monitor Optical
100GHz PD Switch Monitor-2 2

Switch In-3 3
Switch In-5 5

Switch In-7 7
Switch In-9 9
Wavelength
Selective Switch
Backplane

4x1 100GHz
PD PD PD PD

Common 12
Out
Isolator Common 11
In
PD
Demux Out-4 4
Passive Demux Out-6 6
PM collected at all PD locations Demux
Facility: OPTMON port 1,2,3,5,7,9,11 1x4 Demux Out-8 8
Parameter: OPR-OTS*
Demux Out-10 10

*AVG, MIN, and MAX measurements also provided.

Legend
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• Cold Restart Required

Photonic alarms
• Adjacency Mismatch
• Adjacency Provisioning Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• Channel Degrade
• Channel Opacity Error
• Loss of Signal
• Gauge Threshold Crossing Alert Summary

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 4x1 circuit
packs:
• is a single slot interface.
• can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 100 GHz w/OPM 4x1 circuit pack:
• the WSS 100 GHz w/OPM 4x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, when the WSS 100 GHz w/OPM 4x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 4x1 optical interface circuit pack.

Table 1-42
Technical specifications for WSS 100 GHz w/OPM 4x1 optical interface circuit pack

Parameter WSS 100 GHz w/OPM 4x1 (NTK553HA)


Weight (estimated) 1.9 kg (4.1 lb)
Power consumption Typical (W): 14 (Note 1)
Power Budget (W): 31 (Note 2)
Connector type LC
OPM power range -35 dBm to -6.5 dBm
Wavelength range (nm) 1530.33 to 1565.09 (88 channels capable)
Maximum total input power 24 dBm for Common In, Switch In ports 1-4
Maximum Demux insertion loss 8.5 dB from Common In to Switch Out 1-4 ports
Maximum Mux insertion loss 11.4 dB from Switch In 1-4 ports to Common Out
Available attenuation per channel 0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and NTK553LB)
Overview
The following variants of WSS 50 GHz w/OPM C-Band 9x1 circuit packs are
supported:
• Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 9x1 circuit
pack (triple slot-wide variant) (NTK553FAE5). This circuit pack is also
referred to as WSS 50 GHz w/OPM 9x1.
• Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 9x1 circuit
pack (slot-wide variant) (NTK553FC). This circuit pack is also referred to
as WSS 50 GHz w/OPM 9x1.
• Wavelength Selective Switch (WSS) Flex C-Band w/OPM 9x1 circuit
packs (slot-wide variants) (NTK553LA and NTK553LB). These circuit
packs are also referred to as WSS Flex C-Band w/OPM 9x1.

The WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit
packs are used for flexible per-wavelength add/drop/passthrough and
per-wavelength switching. The combination of WSS 50 GHz w/OPM 9x1 or
WSS Flex C-Band w/OPM 9x1 circuit pack and Photonic Passive Equipment
(OMDF4, OMDF8 and BS5 modules only), OMD4, CMD44, or Enhanced
CMD44 modules (at ROADM or WSS-based terminal sites) are required to
perform add/drop operation.

The WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit
packs offer the same functionality and Table 1-43 on page 1-171 lists some
differences between the three variants.

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Table 1-43
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs comparison

Functionality Circuit pack

NTK553FAE5 NTK553FC NTK553LA


NTK553LB
(Note 2)

slot-wide variant (Note 1) √ √


Triple slot-wide variant (Note 1) √
Including a power tap/monitor on Common Out port √ √
Support for flexible grid ROADM (Note 2) √
ITU 50 GHz spaced C-band √ √
Flex C-band √
Note 1: The slot-wide variants make more efficient use of the slots available in the shelf comparing to
triple slot-wide variant and allow for support of new applications. For example, slot-wide variants can be
used to support a 2-way ROADM configuration in a 7-slot 6500 shelf while this is not possible with the
use of triple slot-wide variant.
Note 2: The NTK553LB variant is architected to support future flexible grid applications with traffic
channels that are greater than 500 GHz. Use of the NTK553LA variant with traffic channels greater than
500 GHz wide is supported.

Note 1: The faceplate LC connectors on the NTK553FC, NTK553LA, and


NTK553LB circuit packs protrude by an extra 10 mm compared to
faceplate LC connectors on the NTK553FAE5 circuit pack. As a result, in
order to avoid unacceptable interference with the shelf front cover,
NTTC50++ patch cords (NTTC50++ patch cords are Corning standard LC
strain relief boots) or approved equivalent must be used. Also, attenuator
pads cannot be mounted on the faceplate of the NTK553FC, NTK553LA,
or NTK553LB circuit pack when the shelf front cover is installed.
Note 2: Although PEC editing between different variants of WSS 50 GHz
w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs is supported,
some optical specifications are different and therefore, a variant cannot be
used as a direct substitute for another variant without using OnePlanner
to simulate your particular application.

Figure 1-58 on page 1-172 shows the faceplate of a WSS 50 GHz w/OPM 9x1
circuit pack (NTK553FAE5 is shown as an example) and Figure 1-59 on page
1-173 to Figure 1-61 on page 1-175 provide functional block diagrams of the
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs.

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Figure 1-58
WSS 50 GHz w/OPM 9x1 circuit pack faceplate (example: NTK553FAE5 is shown)

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
Monitor be extracted
ports (on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow circle (LOS)


Switch - Used to communicate Rx Loss of Signal
ports

Common
ports

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Figure 1-59
WSS 50 GHz w/OPM 9x1 circuit pack block diagram (NTK553FAE5 variant)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7

Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 50GHZ Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17

Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
Isolator Common 21
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16

Demux Out-8 18
Passive
EDFA Demux 1x2 Demux Out-9 20

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Figure 1-60
WSS 50 GHz w/OPM 9x1 circuit pack block diagram (NTK553FC variant)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7

Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 50GHZ Switch In-6 13

Switch In-7 15
Switch In-8 17

Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
PD
Isolator Common 21
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16

Demux Out-8 18
Passive
EDFA Demux 1x2 Demux Out-9 20

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Figure 1-61
WSS Flex C-Band w/OPM 9x1 block diagram (NTK553LA and NTK553LB variants)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
Flex PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7
Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 Flex Switch In-6 13

Switch In-7 15
Switch In-8 17
Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
PD
Isolator Common 21
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16

Demux Out-8 18
Passive
EDFA Demux 1x2 Demux Out-9 20

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Supported functionality
The WSS 50 GHz w/OPM 9x1 circuit packs (NTK553FAE5 and NTK553FC)
and WSS Flex C-Band w/OPM 9x1 (NTK553LA and NTK553LB) provide the
following functionality:
• a per wavelength attenuation profile for up to 88 C-band channels at
50 GHz spacing for NTK553LA, NTK553LB, NTK553FAE5 and
NTK553FC variants
• a per frequency attenuation profile for Flex C-band for NTK553LA and
NTK553LB variants
• wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
• frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (NTK553LA and NTK553LB variants)
• a demultiplexer block which is essentially a power splitter with seven
passive drop ports (SW 1 to 7) and two amplified drop ports (Switch 8 and
9)
• in-service dynamic per channel add/drop/branching/broadcast
• embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports for all NTK553FAE5, NTK553FC,
NTK553LA, and NTK553LB variants; and also at Common Out port for
NTK553FC, NTK553LA, and NTK553LB variants
• supports flexible grid ROADM for NTK553LA and NTK553LB variants
• per channel power control on add and pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching and broadcast (up to eight connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-44 on page 1-177 for function and connector type for each
port

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Table 1-44
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input/output from other WSS LC


Switch 2 In / Out 5/6 (ports 3 to 16)

Switch 3 In / Out 7/8 Optical input/output from other CMD44


or Enhanced CMD44 (ports 17 to 20)
Switch 4 In / Out 9 / 10
Switch 5 In / Out 11 / 12
Switch 6 In / Out 13 / 14
Switch 7 In / Out 15 / 16
Switch 8 In / Out 17 / 18
Switch 9 In / Out 19 / 20

Common In / Out 21 / 22 DWDM optical input / output to /from the LC


line amplifier

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 50 GHz w/OPM 9x1
and WSS Flex C-Band w/OPM 9x1 circuit pack facilities. Table 1-45 provides
a list of monitor types supported on WSS 50 GHz w/OPM 9x1 and WSS Flex
C-Band w/OPM 9x1 circuit packs. Figure 1-62 on page 1-179 and Figure 1-63
on page 1-180 show the WSS 50 GHz w/OPM 9x1 circuit pack optical
monitoring points, and Figure 1-64 on page 1-181 shows the WSS Flex
C-Band w/OPM 9x1 circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-45
Monitor types table for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs

Monitor type Facility

OPTMON AMP

OPR-OTS (Note 1) X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note 2

DROPGAIN-OTS X
DROPGAINMIN-OTS X
DROPGAINMAX-OTS X
DROPGAINAVG-OTS X

Note 1: The OPTMON facility OPR-OTS monitor type for the Common In port
on WSS w/OPM circuit packs with amplified ports represents the total input
power on that port, and not the input power of the internal EDFA amplifier. The
internal EDFA amplifier input power is lower as the signal is going through an
Isolator and Passive Demux optical components (as depicted in the optical
monitoring points figures referenced above).
Note 2: Use optical terminators on unused input faceplate connectors of
installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and the
ports may appear in-service.

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Figure 1-62
WSS 50 GHz w/OPM 9x1 circuit pack optical monitoring points (NTK553FAE5 variant)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
50 GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7

Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 50 GHz Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17

Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
Isolator Common 21
In
Facility: OPTMON port 22 PD
Demux Out-1 4
Parameter: OPR-OTS*
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9, Demux Out-8 18
11,13,15,17,19,21 Passive
Parameter: OPR-OTS* EDFA Demux 1x2 Demux Out-9 20

*AVG, MIN, and MAX measurements also provided

Facility: AMP port 21


Legend Parameter: DROPGAIN-OTS*

EDFA Erbium Doped Fiber Amplifier


PD Photodiode

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Figure 1-63
WSS 50 GHz w/OPM 9x1 circuit pack optical monitoring points (NTK553FC variant)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
50 GHz PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7
Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 50 GHz Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17

Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
PD
Isolator Common 21
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9, Demux Out-8 18
11,13,15,17,19,21,22 Passive
Parameter: OPR-OTS* EDFA Demux 1x2 Demux Out-9 20

* AVG, MIN, and MAX measurements also provided.

Facility: AMP port 21


Legend Parameter: DROPGAIN-OTS*

EDFA Erbium Doped Fiber Amplifier


PD Photodiode

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Figure 1-64
WSS Flex C-Band w/OPM 9x1 circuit pack optical monitoring points (NTK553LA and NTK553LB
variants)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
Flex PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7
Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
9x1 Flex Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17
Switch In-9 19
PD PD PD PD PD PD PD PD PD
Common 22
Out
PD
Isolator Common 21
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Passive Demux Out-5 12


Demux
1x8 Demux Out-6 14

Demux Out-7 16
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9, Demux Out-8 18
11,13,15,17,19,21,22 Passive
Parameter: OPR-OTS* EDFA Demux 1x2 Demux Out-9 20

* AVG, MIN, and MAX measurements also provided.

Facility: AMP port 21


Legend Parameter: DROPGAIN-OTS*

EDFA Erbium Doped Fiber Amplifier


PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Mismatch
• Adjacency Provisioning Error
• Channel Opacity Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• High Optical Power
• Shutoff Threshold Crossed
• Input Loss of Signal
• Output Loss of Signal
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Wavelength Measurement Warning
• Wavelength Measurement Error

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS 50 GHz w/OPM 9x1 circuit packs
(NTK553FAE5 variant):
• is a triple slot interface.
• can be equipped in slots 1 to 12 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This variant of WSS 50 GHz w/OPM 9x1 circuit packs cannot
be placed in slot 13 or 14 since it is a triple slot interface. This variant of
WSS 50 GHz w/OPM 9x1 circuit packs is not supported for use in slots
5/6/7 and 6/7/8 of the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.

• can be equipped in slots 1-6, 11-16, 21-26, and 31-36 of the 32-slot
packet-optical shelf. This variant of WSS 50 GHz w/OPM 9x1 circuit packs
cannot be placed in slot 7, 8, 17, 18, 27, 28, or 37, 38 since it is a triple
slot interface.
• can be equipped in slots 1 to 5 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). This variant of WSS 50 GHz w/OPM 9x1 circuit packs cannot
be placed in slot 6 and 7 since it is a triple slot interface.
• can be equipped in slots 1 to 4 of the 6500-7 packet-optical shelf
(NTK503RA). This variant of WSS 50 GHz w/OPM 9x1 circuit packs
cannot be placed in slot 7 and 8 since it is a triple slot interface. This circuit
pack is not supported for use in slots 5/6/7 or 6/7/8 of the 6500-7
packet-optical shelf (NTK503RA).
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 50 GHz w/OPM 9x1 (NTK553FAE5 variant) circuit pack:
• these circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
• in a 14-slot shelf type, when the circuit pack is installed in slots 7, 8, and
9, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 10 to 14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
• in a 6500-7 packet-optical shelf type, when the circuit pack is installed in
slots 6, 7, and 8, only Broadband circuit packs or Photonic circuit packs
can be provisioned in the other interface slots (slots 1 to 5) as MSPP or
PKT/OTN I/F interface circuit packs require a cross-connect circuit pack.
See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

The following equipping rules apply to WSS 50 GHz w/OPM 9x1 (NTK553FC
variant) and WSS Flex C-Band w/OPM 9x1 (NTK553LA and NTK553LB)
circuit packs:
• are -slot interfaces.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support these
circuit packs). These circuit packs cannot be placed in slot 14 since they
are -slot interfaces.
• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. These circuit packs cannot be placed in slot 8, 18, 28,
or 38 since they are -slot interfaces.
• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). These circuit packs cannot be placed in slot 7 since they are
-slot interfaces.
• can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). These circuit packs cannot be placed in slot 8 since they are
-slot interfaces.
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 50 GHz w/OPM 9x1 (NTK553FC variant) or WSS Flex
C-Band w/OPM 9x1 circuit pack:
• these circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
• in a 14-slot shelf type, when the circuit pack is installed in slots 7 and 8,
only Broadband circuit packs or Photonic circuit packs can be provisioned
in the other interface slots (slots 1 to 6 and 9 to 14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. See Part 1
of 6500 Planning, NTRN10EY (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.
• in a 6500-7 Packet-optical shelf type, when the circuit pack is installed in
slots 7 and 8, only Broadband circuit packs or Photonic circuit packs can
be provisioned in the other interface slots (slots 1 to 6) as MSPP or
PKT/OTN I/F interface circuit packs require a cross-connect circuit pack.
See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM
9x1 optical interface circuit packs.

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Table 1-46
Technical specifications for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical
interface circuit packs

Parameter WSS 50 GHz w/OPM 9x1 WSS Flex C-Band


w/OPM 9x1
NTK553FAE5 NTK553FC NTK553LA/NTK553LB
Weight (estimated) 4.5 kg (9.9 lb) 2.5 kg (5.5 lb) 2.5 kg (5.5 lb)
Power consumption Typical (W): 35 (Note 1) Typical (W): 32 (Note Typical (W): 32 (Note 1)
Power Budget (W): 42 1) Power Budget (W): 65
(Note 2 and Note 3) Power Budget (W): (Note 2 and Note 4)
65 (Note 2 and Note
4)
Connector type LC
OPM power range -33 dBm to -5 dBm -35 dBm to -6.5 dBm -35 dBm to -6.5 dBm
Wavelength range (nm) 1530.33 to 1565.09 1530.33 to 1565.09 1528.77 to 1566.72
(88 channels capable) (88 channels (96 channels capable)
capable) and
Frequency range (THz):
C-Band 196.125 THz to
191.325 THz when used
in flexible grid systems
Maximum total input 24 dBm for Common In, 24 dBm for Common 24 dBm for Common In,
power Switch In ports 1-9 In, Switch In ports 1-9 Switch In ports 1-9
Maximum Demux 11.2 dB from Common In 11.7 dB from 11.7 dB from Common
insertion loss to Switch Out ports 1-7 Common In to Switch In to Switch Out ports
(Note 5) Out ports 1-7 (Note 5) 1-7 (Note 5)
Maximum Mux insertion 7 dB from Switch In ports 6.8 dB from Switch In 6.8 dB from Switch In
loss 1-9 to Common Out ports 1-9 to Common ports 1-9 to Common
Out Out
Output LOS threshold N/A Minimum: -15.0 dBm,
(Note 6) Default: -8.0 dBm,
Maximum: 15 dBm

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Table 1-46
Technical specifications for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical
interface circuit packs (continued)

Parameter WSS 50 GHz w/OPM 9x1 WSS Flex C-Band


w/OPM 9x1
NTK553FAE5 NTK553FC NTK553LA/NTK553LB
Available attenuation per 0-18 dB 0-18 dB 0-18 dB
channel
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies three slots in the shelf and power is drawn from the right-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
entire power budget to the zone associated with the left-most slot when computing the “Calculated shelf
zone power” parameter even if the right-most slot occupied by the circuit pack is in a different power zone.
Note 4: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot. When
equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s power
budget to the zone associated with the left-most slot occupied by the circuit pack.
Note 5: For the demux path of the WSS 50 GHz w/OPM 9x1 or WSS Flex C-Band w/OPM 9x1 circuit
packs (NTK553FAE5, NTK553FC, NTK553LA, NTK553LB), there is an embedded EDFA between the
Common In and Switch Out ports 8-9. This amplifier provides between 6 dB and 13 dB gain to
compensate for the maximum total passive loss of 11.7 dB in those paths.
Note 6: The Output LOS Alarm is driven from a power reading internal to the circuit pack before a
splitter and is not accessible at the faceplate. The faceplate reading is approximately 3 dB lower.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM)


Overview
The Wavelength Selective Switch (WSS) Flex L-Band w/OPM 8x1 circuit pack
(also referred to as WSS Flex L-Band w/OPM 8x1) is used for add/drop,
passthrough and switching. The combination of WSS Flex L-Band w/OPM 8x1
and CCMD12 L-Band circuit packs is required to perform add/drop operation.

The WSS Flex L-Band w/OPM 8x1 circuit packs are only used in Submarine
applications.

Figure 1-65 on page 1-189 shows the faceplate of a WSS Flex L-Band w/OPM
8x1 circuit pack and Figure 1-66 on page 1-190 provides functional block
diagram of the WSS Flex L-Band w/OPM 8x1 circuit pack.

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Figure 1-65
WSS Flex L-Band w/OPM 8x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off Monitor
ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Switch
ports

Common
ports

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Figure 1-66
WSS Flex L-Band w/OPM 8x1 block diagram (NTK553LM)

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
Flex PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7

Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
8x1 Flex Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17

PD PD PD PD PD PD PD PD
Common 20
Out
PD
Isolator Common 19
In
PD
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Demux Out-4 10

Splitter1x8 Demux Out-5 12

Demux Out-6 14

Demux Out-7 16

Demux Out-8 18

Legend

PD Photodiode

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Supported functionality
The WSS Flex L-Band w/OPM 8x1 (NTK553LM) provides the following
functionality:
• a per frequency attenuation profile
• eight flexible grid Mux WSS and eight flexible grid Demux WSS ports
• a demultiplexer block which is essentially a power splitter with eight
passive drop ports (SW 1 to 8)
• wavelength range: L-band channels 1569.80 nm to 1608.98 nm (93 total)
when used in fixed grid systems
• frequency range: L-band 190.975 THz to 186.325 THz when used in
flexible grid systems
• in-service dynamic per channel add/drop/branching/broadcast
• embedded Optical Power Monitor provides per channel power monitoring
(on a 6.25 GHz granularity) capability for two directions (Monitor 1 and
Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common ports, and Monitor ports
• supports flexible grid ROADM
• per channel power control (on a 6.25 GHz granularity) on add and
pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching and broadcast (up to eight connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-47 on page 1-192 for function and connector type for each
port

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Table 1-47
WSS Flex L-Band w/OPM 8x1 optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input/output from CCMD12 LC


Switch 2 In / Out 5/6 L-Band circuit pack or other WSS (ports
3 to 18)
Switch 3 In / Out 7/8
Switch 4 In / Out 9 / 10
Switch 5 In / Out 11 / 12
Switch 6 In / Out 13 / 14
Switch 7 In / Out 15 / 16
Switch 8 In / Out 17 / 18

Common In / Out 19 / 20 DWDM optical input / output to /from the LC


line amplifier

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS Flex L-Band w/OPM
8x1 circuit pack facilities. Table 1-48 provides a list of monitor types supported
on WSS Flex L-Band w/OPM 8x1 circuit packs. Figure 1-67 on page 1-194
shows the WSS Flex L-Band w/OPM 8x1 circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-48
Monitor types table for WSS Flex L-Band w/OPM 8x1 circuit packs

Monitor type Facility

OPTMON AMP

OPR-OTS (Note 1) X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

DROPGAIN-OTS X
DROPGAINMIN-OTS X
DROPGAINMAX-OTS X
DROPGAINAVG-OTS X

Note 1: The OPTMON facility OPR-OTS monitor type for the Common In port on
WSS w/OPM circuit packs with amplified ports represents the total input power on
that port, and not the input power of the internal EDFA amplifier. The internal EDFA
amplifier input power is lower as the signal is going through an Isolator and Passive
Demux optical components (as depicted in Figure 1-67 on page 1-194).
Note 2: Use optical terminators on unused input faceplate connectors of installed
WSS w/OPM circuit packs. If dust caps are used instead of optical terminators on
“Switch In” ports, PMs can be reported against the ports and the ports may appear
in-service.

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Figure 1-67
WSS Flex L-Band w/OPM 8x1 circuit pack optical monitoring points

Processor
Module

Power
Supply Optical Power 2x1 Monitor-1 1
Monitor Optical
Flex PD Switch Monitor-2 2

Switch In-1 3
Switch In-2 5

Switch In-3 7
Switch In-4 9
Wavelength Switch In-5 11
Selective Switch
8x1 Flex Switch In-6 13

Switch In-7 15
Backplane

Switch In-8 17

PD PD PD PD PD PD PD PD
Common 20
Out
PD
Isolator Common 19
In
PD
Facility: AMP port 19
Parameter: DROPGAIN-OTS*
Demux Out-1 4

Demux Out-2 6
Demux Out-3 8
Passive
Demux Demux Out-4 10
1x8
Demux Out-5 12
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9, Demux Out-6 14
11,13,15,17,19, 20
Parameter: OPR-OTS* Demux Out-7 16

Demux Out-8 18

* AVG, MIN, and MAX measurements a, 20lso provided.

Legend
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• Software Subsystem Failed
• Hardware Subsystem Failed

Photonic alarms
• Adjacency Mismatch
• Adjacency Far End Not Discovered
• Fiber Type Manual Provisioning Required
• Channel Opacity Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• High Optical Power
• Shutoff Threshold Crossed
• Input Loss of Signal
• Output Loss of Signal
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Channel Degrade

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS Flex L-Band w/OPM 8x1
(NTK553LM) circuit pack:
• is a -slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack cannot be placed in slot 14 since this is a
-slot interface.
• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. This circuit pack cannot be placed in slot 8, 18, 28, or
38 since this is a -slot interface.
• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). This circuit pack cannot be placed in slot 7 since this is a -slot
interface.
• can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack cannot be placed in slot 8 since this is a
-slot interface.
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS Flex L-Band w/OPM 8x1 circuit pack:
• WSS Flex L-Band w/OPM 8x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• in a 14-slot shelf type, when the WSS Flex L-Band w/OPM 8x1 circuit pack
is installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to 14) as MSPP

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WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA)


Overview
The Wavelength Selective Switch (WSS) Flex C-Band w/OPM 20x1 circuit
pack (also referred to as WSS Flex C-Band w/OPM 20x1) is used for add/drop,
passthrough and switching. The combination of WSS Flex C-Band w/OPM
20x1 and CCMD8x16 or CCMD12 C-Band circuit packs is required to perform
add/drop operation.

Figure 1-68 on page 1-198 shows the faceplate of a WSS Flex C-Band
w/OPM 20x1 circuit pack and Figure 1-69 on page 1-199 provides functional
block diagram of the WSS Flex C-Band w/OPM 20x1 circuit pack.

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Figure 1-68
WSS Flex C-Band w/OPM 20x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use) Monitor
- Used to communicate whether circuit pack can ports
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

Switch
ports

Common
ports

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Figure 1-69
WSS Flex C-Band w/OPM 20x1 circuit pack block diagram (NTK553MA)

Processor
Monitor-1 1
Module Optical Power
Monitor PD
Flex
Power
Supply Monitor-2 2

PD

Common Out-Monitor 3
PD
Common Out 10

Wavelength
Selective Switch 5 5
MPO
Mux 2x20 Flex PD Connector 5
Backplane

5 5
CT
PD
MPO
5 5 Connector 6
PD
CT
5 5
MPO
PD Connector 7

CT
5 5
MPO
PD Connector 8
5 5
Wavelength PD CT
EDFA Selective Switch
Demux 2x20 Flex 5 5
PD
5 5
PD

Common In 9
PD

Legend
EDFA Erbium Doped Fiber Amplifier
MPO Multi-fiber Push On
PD Photodiode
CT Cable Trace

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Supported functionality
The WSS Flex C-Band w/OPM 20x1 (NTK553MA) provides the following
functionality:
• 20 flexible grid Mux WSS and 20 flexible grid Demux WSS ports.
• wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
• frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
• embedded Optical Power Monitor provides per channel power monitoring
(on a 6.25 GHz granularity) capability for two directions (Monitor 1 and
Monitor 2 ports)
• Common Out external tap
• PD (PIN Detectors) provide power monitoring capability at Switch
A/B/C/D, Common In, and Monitor ports
• Integrated loopback path with Amplification/ASE continuity source
• Switch A/B/C/D ports bundle related optical signals in 12-fiber MPO
connectors with Cable Trace for fiber management simplification
• supports flexible grid ROADM
• in-service dynamic per channel add/drop
• per channel power control (on a 6.25 GHz granularity) on add and
pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to a particular add/drop wavelength or changing a
passthrough degree.
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• variable attenuation per channel used by DOC for system optimization
• see Table 1-49 on page 1-201 for function and connector type for each
port

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Table 1-49
WSS Flex C-Band w/OPM 20x1 optical interfaces

Interface name Physical port # Function Connector type

Monitor 1 1 Monitor port for OPM LC

Monitor 2 2 Monitor port for OPM LC

Common Out 3/4 Common monitor out external tap LC


Monitor

Switch A 5 Optical input/output from CCMD8x16 12-Fiber


Switch B 6 circuit pack via FIM Type 1 or FIM Type 2 MPO/APC Male
or from CCMD12 C-Band circuit pack via
Switch C 7 FIM Type 4, FIM Type 5, or FIM Type 6.
Switch D 8 or
Optical input/output from SMD Flex 14x8
circuit pack via FIM Type 3 or FIM Type 4.
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

Common In / Out 9 / 10 DWDM optical input / output to /from the LC


line amplifier

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Performance monitoring
The 6500 monitors and collects physical PMs for WSS Flex C-Band w/OPM
20x1 circuit pack facilities. Table 1-50 provides a list of monitor types
supported on WSS Flex C-Band w/OPM 20x1 circuit packs. Figure 1-70 on
page 1-203 shows the WSS Flex C-Band w/OPM 20x1 circuit pack optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-50
Monitor types table for WSS Flex C-Band w/OPM 20x1 circuit packs

Monitor type Facility

OPTMON

OPR-OTS (Note 1) X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note 2

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X

Note 1: The OPTMON facility OPR-OTS monitor type for the Common
In port on WSS w/OPM circuit packs with amplified ports represents the
total input power on that port, and not the input power of the internal
EDFA amplifier. The internal EDFA amplifier input power is lower as the
signal is going through an Isolator and Passive Demux optical
components (as depicted in the optical monitoring points figure
referenced above).
Note 2: For ports 5 to 8 of installed WSS Flex C-Band w/OPM 20x1
circuit packs, PMs can be reported against unused ports and those
ports may appear in-service.

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Figure 1-70
WSS Flex C-Band w/OPM 20x1 circuit pack optical monitoring points

Processor Monitor-1 1
Module Optical Power
Monitor PD
Flex
Power Monitor-2 2
Supply
PD

Common Out-Monitor 3
PD
Common Out 10

Wavelength 5 ch CT
5 ch
Selective Switch
Mux 2x20 Flex PD
MPO 5
5 ch 5 ch Connector
Backplane

PD
MPO 6
5 ch 5 ch Connector
PD
MPO 7
5 ch 5 ch Connector

PD
MPO
Connector 8
5 ch 5 ch
PD CT
5 ch 5 ch
Wavelength PD
EDFA Selective Switch
Demux 2x20 Flex 5 ch 5 ch
PD
5 ch 5 ch
PD

Common In 9
PD
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,6,7,8,9
Parameter: OPR-OTS* and OPT-OTS*

* AVG, MIN, and MAX measurements also provided.

Legend
CT Cable Trace
EDFA Erbium Doped Fiber Amplifier
MPO Multi-fiber Push On
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed
• Cable Trace Compromised

Photonic alarms
• Adjacency Mismatch
• Channel Degrade
• Channel Opacity Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• High Optical Power
• Loss of Signal
• Output Loss of Signal
• Gauge Threshold Crossing Alert Summary

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS Flex C-Band w/OPM 20x1 circuit
pack (NTK553MA):
• is a -slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 14 since WSS Flex C-Band w/OPM 20x1 circuit pack is a
-slot interface.
• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
WSS Flex C-Band w/OPM 20x1 circuit pack cannot be placed in slot 8, 18,
28, or 38 since WSS Flex C-Band w/OPM 20x1 circuit pack is a -slot
interface.
• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 7 since WSS Flex C-Band w/OPM 20x1 circuit pack is a -slot
interface.
• can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 8 since WSS Flex C-Band w/OPM 20x1 circuit pack is a -slot
interface.
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS Flex C-Band w/OPM 20x1 circuit pack:
• the WSS Flex C-Band w/OPM 20x1 circuit packs do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
• In a 14-slot shelf type, when the WSS Flex C-Band w/OPM 20x1 circuit
packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to13) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS Flex C-Band w/OPM 20x1 optical interface circuit
packs.

Table 1-51
Technical specifications for WSS Flex C-Band w/OPM 20x1 optical interface circuit packs

Parameter WSS Flex C-Band w/OPM 20x1


NTK553MA
Weight (estimated) 3.5 kg (7.7 lb)
Power consumption Typical (W): 40 (Note 1)
Power Budget (W): 60 (Note 2, and Note 3)
Connector type 12-Fiber MPO/APC Male, LC
Wavelength range (nm) C-Band channels 1528.77 nm to 1566.72 nm (96 total) when used
in fixed grid systems
Frequency range (THz) C-Band 196.125 THz to 191.325 THz when used in flexible grid
systems
OPM power range -37 dBm to 9 dBm
Maximum total input power 24 dBm total or 9 dBm/12.5 GHz
Maximum Demux insertion loss 9.6 dB
Maximum Mux insertion loss 9.5 dB
Available attenuation per channel 18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
power budget to the zone associated with the left-most slot occupied by the circuit pack.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and


NTK553KAE5)
Overview
The Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 2x1 circuit
pack (also referred to as WSS 50 GHz w/OPM 2x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 50 GHz w/OPM 2x1 circuit pack and CMD44, Enhanced
CMD44, or BMD2 modules (at ROADM or WSS-based terminal sites) are
required to perform add/drop operation. WSS 50 GHz w/OPM 2x1 circuit
packs are mostly used for 1-way Terminal or 2-way ROADM applications.

The following variants of WSS 50 GHz w/OPM 2x1 circuit packs are
supported:
• NTK553KAE5 (single slot-wide):
The Add/Drop port can be connected to a CMD44 50 GHz or Enhanced
CMD44 for 44 channels capacity or a BMD2 for an initial capacity of 44
channels and can be upgraded in-service to 88 channels if BMD2 is
installed day 1.
• NTK553KCE5 (triple slot-wide):
One Switch port can be connected to a CMD44 50 GHz or Enhanced
CMD44 for 44 channels capacity or a BMD2 for an initial capacity of 44
channels and can be upgraded in-service to 88 channels if BMD2 is
installed day 1.

The WSS 50 GHz w/OPM 2x1 variants offer similar functionality, however
• the single slot-wide variant (NTK553KAE5) makes more efficient use of
the slots available in the shelf and allows for support of new applications.
For example, this circuit pack can be used to support a 2-way ROADM
configuration in a 7-slot 6500 shelf while this is not possible with the use
of triple slot-wide variant (NTK553KCE5).
• the triple slot-wide variant (NTK553KCE5) has two switch ports that can
be used for either pass-through traffic or add/drop traffic whereas the
single slot-wide variant (NTK553KAE5) has one dedicated pass-through
port and one dedicated add/drop port.
• The single slot-wide variant (NTK553KAE5) is only supported in
configurations that use a maximum of two OTSs. This means the single
slot-wide variant (NTK553KAE5) cannot be used in the following
configurations:
— 3-way node configurations
— DIA configurations: the single slot-wide variant (NTK553KAE5) cannot
be used in the DIA configuration backbone OTS or DIA OTS

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• some optical specifications are different and therefore, single slot-wide


variant (NTK553KAE5) cannot be used as a direct substitute for triple
slot-wide variant (NTK553KCE5) (and vice versa) without using
OnePlanner to simulate your particular application.

The WSS 50 GHz w/OPM 2x1 circuit pack (NTK553KAE5 or NTK553KCE5)


is similar to the WSS 50 GHz w/OPM C-Band 9x1; NTK553FAE5 with the
following distinctions:
• NTK553FAE5 variant has branching and broadcast capability of up to nine
connected nodes (9x1) while NTK553KAE5 or NTK553KCE5 variant has
branching capability of up to two connected nodes (2x1).
• demultiplexer block in NTK553FAE5 variant is a 1:9 power splitter while
demultiplexer block in NTK553KAE5 or NTK553KCE5 variant is a 1:2
passive power splitter.
• For the demux path of the WSS 50 GHz w/OPM 9x1 circuit pack
(NTK553FAE5), there is an embedded EDFA between the Common In
and Switch Out 8-9 ports. This amplifier provides between 6 and 13dB
gain to compensate for the maximum total passive loss of 14.7dB in those
paths. Since the WSS 50 GHz w/OPM 2x1 circuit pack (NTK553KAE5 or
NTK553KCE5) has less demux path insertion loss, it does not have an
embedded EDFA.

A maximum of eight of the following Photonic circuit packs in total can be


installed in a single 14-slot shelf as long as the total of number of equipped
slots does not exceed 14:
• WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
• WSS 100 GHz w/OPM 2x1(NTK553JAE5)
• WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
• WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
• MLA2 (NTK552FAE5)
• LIM C-Band (NTK552DAE5)

Note: If you want to use more than eight of these circuit packs, you must
contact your Ciena representative.

Figure 1-71 on page 1-209 shows the faceplate of a WSS 50 GHz w/OPM 2x1
circuit pack (triple slot-wide variant; NTK553KCE5) and Figure 1-72 on page
1-210 shows the faceplate of a WSS 50 GHz w/OPM 2x1 circuit pack (single
slot-wide variant; NTK553KAE5). Figure 1-73 on page 1-211 provides a
functional block diagram of the WSS 50 GHz w/OPM 2x1 circuit pack (triple
slot-wide variant; NTK553KCE5) and Figure 1-74 on page 1-212 provides a
functional block diagram of the WSS 50 GHz w/OPM 2x1 circuit pack (single
slot-wide variant; NTK553KAE5).

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Figure 1-71
WSS 50 GHz w/OPM 2x1 circuit pack (triple slot-wide variant; NTK553KCE5) faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
Monitor - Used to communicate whether circuit pack can
ports be extracted
Switch Monitor
(on->no pull, off->can be pulled)
ports
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Yellow bi-color circle (LOS)


- Used to communicate Rx Loss of Signal

Common
ports

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Figure 1-72
WSS 50 GHz w/OPM 2x1 circuit pack (single slot-wide variant; NTK553KAE5) faceplate

Switch/Demux
ports

Add/Drop
ports

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Figure 1-73
WSS 50 GHz w/OPM 2x1 circuit pack (triple slot-wide variant; NTK553KCE5) block diagram

Processor
Module

Power
Supply
Optical Power 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch
Monitor-2 2

Switch In-1 3
Wavelength Switch In-2 5
Selective Switch
2x1 50GHz
Backplane

PD PD

Common 8
Out

Isolator Common
In 7
Passive
Demux PD
1x2 Demux Out-1 4

Demux Out-2 6

Legend
PD Photodiode

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Figure 1-74
WSS 50 GHz w/OPM 2x1 circuit pack (single slot-wide variant; NTK553KAE5) block diagram

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch
Monitor-2 2

Switch In 3

Add In 5
Backplane

PD PD

Wavelength Common 8
Selective Switch Out
2x1 50GHz

Isolator Common
In 7

PD
Demux Out 4

Drop Out 6

Legend
PD Photodiode

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Supported functionality
The WSS 50 GHz w/OPM 2x1 circuit packs (NTK553KAE5 and
NTK553KCE5) provide the following functionality:
• a per wavelength attenuation profile for up to 88 C-band channels at 50
GHz spacing
• a demultiplexer block which is essentially a 1:2 passive power splitter
• in-service dynamic per channel add/drop/passthrough
• embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
• PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In (in the case of NTK553KCE5 variant), Add In/Switch In (in the
case of NTK553KAE5 variant), Common In, and Monitor ports
• Switch In (NTK553KC) and Add In/Switch In (NTK553KA)
• per channel power control on add and pass-through traffic
• provides 100% add/drop capability at each site
• supports 2.5G, 10G, 40G, 100G, and 200G channels
• per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
• branching (up to two connected nodes)
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• one channel control facility per wavelength
• variable attenuation per channel used by DOC for system optimization
• see Table 1-52 for function and connector type for each port
Table 1-52
WSS 50 GHz w/OPM 2x1 optical interfaces

Interface name Physical port # Function Connector type

NTK553KCE5 variant

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch 1 In / Out 3/4 Optical input/output from other WSS, LC


Switch 2 In / Out 5/6 CMD44, or Enhanced CMD44, or
BMD2

Common In / Out 7/8 DWDM optical input / output to /from LC


the line amplifier

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Table 1-52
WSS 50 GHz w/OPM 2x1 optical interfaces

Interface name Physical port # Function Connector type

NTK553KAE5 variant

Mon 1 Monitor port for OPM LC

Mon 2 Monitor port for OPM LC

Switch In / Demux Out 3/4 Optical input/output from other WSS LC

Add In / Drop Out 5/6 Optical input/output from CMD44, or LC


Enhanced CMD44, or BMD2

Common In / Out 7/8 DWDM optical input / output to /from LC


the line amplifier

Performance monitoring
The 6500 monitors and collects physical PMs for WSS 50 GHz w/OPM 2x1
circuit pack facilities. Table 1-53 provides a list of monitor types supported on
WSS 50 GHz w/OPM 2x1 circuit packs. Figure 1-75 on page 1-215 and
Figure 1-76 on page 1-216 show the WSS 50 GHz w/OPM 2x1 circuit pack
optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-53
Monitor types table for WSS 50 GHz w/OPM 2x1 circuit pack

Monitor type Facility

OPTMON

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note

Note: Use optical terminators on unused input faceplate


connectors of installed WSS w/OPM circuit packs. If dust caps are
used instead of optical terminators on “Switch In” ports, PMs can be
reported against the ports and the ports may appear in-service.

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Figure 1-75
WSS 50 GHz w/OPM 2x1 circuit pack optical monitoring points (triple slot-wide variant,
NTK553KCE5)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch
Monitor-2 2

Switch In-3 3
Wavelength
Selective Switch Switch In-5 5
2x1 50GHz
Backplane

PD PD

Common 8
Out

Isolator Common
In 7
Passive PD
PMs collected at all PD locations Demux Demux Out-4 4
Facility: OPTMON port 1,2,3,5,7 1x2
Parameter: OPR-OTS* Demux Out-6 6

*AVG, MIN, and MAX measurements also provided

Legend
PD Photodiode

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Figure 1-76
WSS 50 GHz w/OPM 2x1 circuit pack optical monitoring points (single slot-wide variant,
NTK553KAE5)

Processor
Module

Power
Supply
Optical Channel 2x1 Monitor-1 1
Monitor Optical
50GHz PD Switch
Monitor-2 2

Switch In 3

Add In 5
Backplane

PD PD

Wavelength Common 8
Selective Switch Out
2x1 50GHz

Isolator Common
In 7

PD
Demux Out 4

Drop Out 6

PMs collected at all PD locations


Facility: OPTMON port 1,2,3,5,7
Parameter: OPR-OTS*
*AVG, MIN, and MAX measurements also provided

Legend
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Mismatch
• Adjacency Provisioning Error
• Duplicate Adjacency Discovered
• High Fiber Loss
• High Optical Power
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Wavelength Measurement Warning
• Wavelength Measurement Error

Common equipment alarms


• Software Auto-Upgrade in Progress
• Channel Controller: Failure detected
• Channel Controller: Unexpected Loss detected

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Equipping rules
The following equipping rules apply to WSS 50 GHz w/OPM 2x1 circuit packs:
• NTK553KAE5 variant is a single slot interface. NTK553KCE5 variant is a
triple slot interface.
• NTK553KAE5 variant can be equipped in slot 1 to 14 (except slots 7 and
8 if cross-connect circuit packs are provisioned in slots 7 and 8) of the
14-slot shelf.
• NTK553KCE5 variant can be equipped in slots 1 to 12 (except slots 7 and
8 if cross-connect circuit packs are provisioned in slots 7 and 8) of the
14-slot shelf (except the NTK503GA metro front electrical shelf, which
does not support this circuit pack). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 13 or 14 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface. This circuit pack is not supported for use in slots 5/6/7 and 6/7/8
of the 14-slot packet-optical shelf (NTK503SA variant).
• NTK553KAE5 variant can be equipped in slots 1-8, 11-18, 21-28, and
31-38 of the 32-slot packet-optical shelf.
• NTK553KCE5 variant can be equipped in slots 1-6, 11-16, 21-26, and
31-36 of the 32-slot packet-optical shelf. WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 7, 8, 17, 18, 27, 28,
or 37, 38 since WSS 50 GHz w/OPM 2x1 (triple slot-wide variant) circuit
pack is a triple slot interface.
• NTK553KAE5 variant can be equipped in slots 1 to 7 of the 7-slot optical
shelf (NTK503PAE5 or NTK503KA).
• NTK553KAE5 variant can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA).
• NTK553KCE5 variant can be equipped in slots 1 to 5 of the 7-slot optical
shelf (NTK503PAE5 or NTK503KA). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 6 or 7 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface.
• NTK553KCE5 variant can be equipped in slots 1 to 4 of the 6500-7
packet-optical shelf (NTK503RA). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 7 or 8 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface. This circuit pack is not supported for use in slots 5/6/7 or 6/7/8
of the 6500-7 packet-optical (NTK503RA).
• cannot be equipped in the 2-slot shelf except NTK553KA variant that can
be equipped in slots 1 and 2 of the NTK503LA variant of 2-slot shelf when
the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a WSS 50 GHz w/OPM 2x1 circuit pack:
• the WSS 50 GHz w/OPM 2x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
• In a 14-slot shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs
(triple slot-wide variant; NTK553KCE5) are installed in slots 7, 8, and 9,
only Broadband circuit packs or Photonic circuit packs can be provisioned
in the other interface slots (slots 1 to 6 and 10 to14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. In a 14-slot
shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs (single
slot-wide variant; NTK553KAE5) are installed in slots 7 or 8, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6 and 9 to14) as MSPP or PKT/OTN I/F
interface circuit packs require a cross-connect circuit pack. See Part 1 of
6500 Planning, NTRN10EY (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, when the WSS 50 GHz w/OPM 2x1
circuit packs (triple slot-wide variant; NTK553KCE5) are installed in slots
6, 7, and 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 5) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. In a 6500-7
packet-optical shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs
(single slot-wide variant; NTK553KAE5) are installed in slots 7 or 8, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface
circuit packs require a cross-connect circuit pack. See Part 1 of 6500
Planning, NTRN10EY (Shelf and equipment descriptions) for a full list of
supported Broadband and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 50 GHz w/OPM 2x1 optical interface circuit pack.

Table 1-54
Technical specifications for WSS 50 GHz w/OPM 2x1 optical interface circuit pack

Parameter WSS 50 GHz w/OPM 2x1


Triple slot-wide variant; Single slot-wide variant;
NTK553KCE5 NTK553KAE5
Weight (estimated) 4.5 kg (9.9 lb) 1.7 kg (3.8 lb)
Power consumption Typical (W): 35 (Note 1) Typical (W): 22 (Note 1)
Power Budget (W): 42 (Note 2) Power Budget (W): 31 (Note 2)
Connector type LC LC
OPM power range -33 dBm to -5 dBm -38 dBm to -11 dBm
Wavelength range (nm) 1530.33 to 1565.09 (88 channels 1530.33 to 1565.09 (88 channels
capable) capable)
Maximum total input 24 dBm for Common In, Switch In 24 dBm for Common In, Switch In
power ports 1-2 ports 1-2
Maximum Demux 4.4 dB from Common In to Switch 12.4 dB from Common In to Demux
insertion loss Out 1-2 ports Out
and
2.0 dB from Common In to Drop Out
Maximum Mux insertion 7 dB from Switch In 1-2 ports to 8.4 dB from Add In or Switch In to
loss Common Out Common Out
Available attenuation 0-15 dB 0-18 dB
per channel
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack


(NTK553RA)
Overview
The ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (also referred
to as RLA 5x1) includes
• one 5x1 flexible grid WSS and one passive Demux splitter for broadcast
and select wavelength switching and
• a dual line EDFA consisting of a switchable gain pre-amp and a variable
gain post-amp.

Figure 1-77 on page 1-222 shows the faceplate of an RLA 5x1 circuit pack and
Figure 1-78 on page 1-223 provides a functional block diagram of the RLA 5x1
circuit pack.

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Figure 1-77
RLA 5x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or
software failure state
- Card not failed = LED off,
Card Failed = LED on

Green rectangle (Ready)


- Used to communicate hardware or
software functional state
- Card initializing = Blinking LED;
Card OK = LED on;
Card not ready = LED off

Blue diamond (In Use)


- Used to communicate whether
circuit pack can be extracted Monitor ports
(on->no pull, off->can be pulled)
- Equipment in-service = LED on;
Equipment out-of-service = LED off
OSC ports

Line ports

Yellow circle (LOS)


- Used to communicate
Rx Loss of Signal

Switch/Demux ports

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Figure 1-78
RLA 5x1 circuit pack block diagram (NTK553RA)

Switch In-1 21
Switch In-2 23

Switch In-3 25

Switch In-4 27
Wavelength Switch In-5 29
Selective Switch
5x1 Flex
PD PD PD PD PD

EDFA Line Out 5

PD PD PD
OSC In 3

PD

MON B 1
Backplane

OPM

MON A 2

EDFA Line In 8

PD PD OSC Out 4

PD
Demux Out-1 22
Passive Demux Demux Out-2 24
1x5
Demux Out-3 26
Demux Out-4 28
Demux Out-5 30

Processor Power
Sync Supply
Module

Legend
EDFA Erbium Doped Fiber Amplifier OSC Optical service channel
OPM Optical power monitor PD Photodiode

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Supported functionality
The RLA 5x1 circuit pack (NTK553RA) provides the following functionality:
• broadcast and select wavelength switching through a 5-port flexible grid
Mux WSS and 5-port flexible grid Demux broadcast. Flexible grid
operation on a 6.25 GHz pitch is provided.
• optical amplification through a dual line EDFA consisting of a switchable
gain pre-amp and a variable gain post-amp.
• per channel optical monitoring through a flexible grid Optical Power
Monitor (OPM) (OPM is in-skin and does not need to be externally
fibered). Capability for two directions (Monitor A and Monitor B ports).
• optical filtering of the optical supervisory channel (OSC) using integrated
OSC add/drop filters.
• wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
• frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
• supports flexible grid ROADM
• external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
• EDFAs on both booster-amp and pre-amp directions support ALSO
(Automatic Line Shut Off). Only EDFA on booster-amp direction supports
APR (Automatic Power Reduction).
• power monitoring capabilities for the line EDFAs.
• the control loop on WSS (Middle optical control) maintains per-channel
loss profile
• variable attenuation per channel used by DOC for system optimization
• see Table 1-55 on page 1-225 for port function and connector type on a
RLA 5x1 circuit pack

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Table 1-55
RLA 5x1 circuit pack port function and connector type

Interface name Physical port # Function Connector type

Mon B/A 1/2 Monitor port for OPM LC

OSC In / Out 3/4 Optical Service Channel Input / output LC

Line Out / In 5/8 Output / input port of Line LC

Switch In / 21 / 22 Optical input / output LC


Demux Out 23 / 24
25 / 26
27 / 28
29 / 30

Performance monitoring
The 6500 monitors and collects physical PMs for RLA 5x1 module facilities.
Table 1-56 provides a list of monitor types supported on RLA 5x1 modules.
Figure 1-79 on page 1-228 shows the RLA 5x1 module optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-56
Monitor types table for Photonic RLA 5x1 modules

Facility OPTMON OSC AMP CHMON


Monitor type

SONET Section (S)/SDH Regenerator Section (RS)

CV-S or RS-BBE X

ES-S or RS-ES X

SES-S or RS-SES X

SEFS-S or RS-OFS X

SONET Line (L)/SDH Multiplex Section (MS)

CV-L or MS-BBE X

ES-L or MS-ES X

SES-L or MS-SES X

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Table 1-56
Monitor types table for Photonic RLA 5x1 modules (continued)

Facility OPTMON OSC AMP CHMON


Monitor type

UAS-L or MS-UAS X

FC-L or MS-FC X

DMMIN-L or L-DMMIN X
DMMAX-L or L-DMMAX X
DMAVG-L or L-DMAVG X

Physical

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRVG-OTS X

OPR-OCH X
OPRMIN-OCH X
OPRMAX-OCH X
OPRAVG-OCH X
Note 2

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note 3

SPANLOSS-OCH X
SPANLOSSMIN-OCH X
SPANLOSSMAX-OCH X
SPANLOSSAVG-OCH X

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

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Table 1-56
Monitor types table for Photonic RLA 5x1 modules (continued)

Facility OPTMON OSC AMP CHMON


Monitor type

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note 4

Note 1: For a diagram showing the RLA 5x1 optical monitoring points, refer to Figure 1-79 on page
1-228.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH value is reported with an accuracy of ±0.3 dB.
Note 4: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs).

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Figure 1-79
RLA 5x1 circuit pack optical monitoring points

Switch In-1 21
Switch In-2 23
Switch In-3 25
Switch In-4 27
Switch In-5
In-1 21
29
Facility: CHMON port 5,
Wavelength Selective PD PD PD PD PD
NMCMON port 5,
Switch
5x1 Flex Parameter: OPT-OCH*
Facility: SDMON port 5
Parameter: OPT-OTS

EDFA Line Out 5


PD
PD PD OSC In 3
PD
Facility: AMP port 5
Backplane

Parameter: OPIN-OTS*, OPOUT-OTS*

OPM Mon B 1

Mon A 2
Facility: CHMON port 8, NMCMON port 8
Parameter: OPT-OCH*
Facility: SDMON port 8
Facility: OPTMON port 1,2,3
Parameter: OPT-OTS Parameter: OPT-OTS*

EDFA Line In 8

PD PD OSC Out 4

Facility: AMP port 8 PD

Passive Demux Parameter: OPIN-OTS*, OPOUT-OTS*


1x5 Demux Out-1 22
Demux Out-2 24
Demux Out-3 26
Demux Out-4 28
Demux Out- 5 30

PMs collected at all PD locations


Facility: OPTMON port 4,21,23,25,27,29 Processor
Sync Power Supply
Parameter: OPR-OTS* Module

* AVG, MIN, and MAX measurements also provided.

Legend
EDFA Erbium Doped Fiber Amplifier
OSC Optical Service Channel
OPM Optical Power Monitor
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Upgrade Failed
• Internal Mgmt Comms Suspected
• High Received Span Loss
• Low Received Span Loss
• Automatic Shutoff Compromised
• Hardware Subsystem Failed

Adjacency alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• Fiber Type Manual Provisioning Required
• Duplicate Adjacency Discovered
• High Fiber Loss
• Line Adjacency Manual Provisioning Required

Photonic alarms
• Shutoff Threshold Crossed
• Optical Line Fail
• High Optical Power
• Automatic Power Reduction Active
• Input Loss of Signal
• Low Optical Return Loss at Output
• Output Loss of Signal
• Automatic Shutoff
• Gauge Threshold Crossing Alert Summary
• Automatic Shutoff Disabled
• Minimum Gain
• Channel Degrade
• Channel Opacity Error
• Loss Of Signal

COM alarms
• Software Auto-Upgrade in Progress

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• Channel Controller: Failure Detected


• Channel Controller: Unexpected Loss Detected
• Timing Generation Manual Switch - 1st Ref
• Timing Generation Manual Switch - 2nd Ref
• Timing Generation Manual Switch - 3rd Ref
• Timing Generation Manual Switch - 4th Ref
• Timing Distribution Manual Switch - 1st Ref
• Timing Distribution Manual Switch - 2nd Ref
• Timing Distribution Manual Switch - 3rd Ref
• Timing Distribution Manual Switch - 4th Ref

Equipping rules
The following equipping rules apply to the RLA 5x1 circuit pack:
• is a single-slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot packet-optical,
14-slot converged optical, converged optical/front electrical, or 14-slot
converged optical/rear electrical shelf. RLA 5x1 circuit pack cannot be
placed in slot 14 since RLA 5x1 circuit pack is a -slot interface.
• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
RLA 5x1 circuit pack cannot be placed in slot 8, 18, 28, or 38 since RLA
5x1 circuit pack is a -slot interface.
• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). RLA 5x1 circuit pack cannot be placed in slot 7 since RLA
5x1 circuit pack is a -slot interface.
• can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). RLA 5x1 circuit pack cannot be placed in slot 8 since RLA
5x1 circuit pack is a -slot interface.
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a RLA 5x1 circuit pack:
• the RLA 5x1 circuit packs do not use any cross-connect capacity and can
be installed in shelves equipped with or without cross-connect circuit
packs
• in a 14-slot shelf type, when the RLA 5x1 circuit packs are installed in slots
7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to13) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

Technical specifications
• Table 1-57 lists the weight, power, and wavelength range for the RLA 5x1
optical interface circuit pack.
• Table 1-58 on page 1-232 lists the specifications for the RLA 5x1 optical
interface circuit pack (pre-amp and booster specifications).
• Table 1-59 on page 1-237 lists the specifications for the RLA 5x1 optical
interface circuit pack (WSS specifications).
Table 1-57
Technical specifications for RLA 5x1 optical interface circuit packs (weight, power, and
wavelength range)

Parameter RLA 5x1 circuit pack (NTK553RA)


Weight (estimated) 2.5 kg (5.5 lb)
Power consumption Typical (W): 54 (Note 1)
Power Budget (W): 65 (Note 2)
Wavelength range (nm) C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
Frequency range (THz) C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V). For practical purposes, the rounded typical power
consumption of an equipment can be used as the equipment heat dissipation when calculating facilities
thermal loads (an estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in a system
operating at an ambient temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V). These
values must be used in sizing feeders and estimating theoretical maximum power draw.

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Table 1-58
Technical specifications for RLA 5x1 optical interface circuit packs (pre-amp and booster
specifications)

Parameter RLA 5x1 circuit pack (NTK553RA)


Minimum Default Maximum

Pre-amp Booster Pre-amp Booster Pre-amp Booster


Maximum Output N/A N/A 23
Power (dBm)
Wavelength Range 1528.77 N/A 1566.72
(nm)
Top offset (Note 3) -6 N/A 0 N/A 0 N/A
Low Gain mode
(Note 4):
Gain (dB) 5 10 5 10 15 20
Amplifier Input LOS -39 -39 -26 -26 10 10
threshold (dBm)
Amplifier Output LOS -15 -15 -12 -12 15 15
threshold (dBm)
Shutoff threshold -42 -42 -29 -29 10 10
(dBm)
High Gain mode
(Note 4):
Gain (dB) 15 10 15 10 25 20
Amplifier Input LOS -39 N/A -36 N/A 10 N/A
threshold (dBm)
Amplifier Output LOS -15 N/A -12 N/A 15 N/A
threshold (dBm)
Shutoff threshold -42 N/A -39 N/A 10 N/A
(dBm)
Tap ratio loss (dB):
Output of Line In to 19 N/A N/A N/A 24 N/A
Mon A
Line Out to Mon B N/A 19 N/A N/A N/A 24
Gain mask See:
• Figure 1-80 on page 1-234 for pre-amp gain mask (low gain mode)
• Figure 1-81 on page 1-235 for pre-amp gain mask (high gain mode)
• Figure 1-82 on page 1-236 for booster gain mask (low gain mode)

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Table 1-58
Technical specifications for RLA 5x1 optical interface circuit packs (pre-amp and booster
specifications) (continued)

Parameter RLA 5x1 circuit pack (NTK553RA)


Minimum Default Maximum

Pre-amp Booster Pre-amp Booster Pre-amp Booster


Noise figure (NF) (dB)
(Note 3)
at output power of 23
dBm
Low Gain mode N/A N/A N/A N/A • Gain 5- 10 dB • Gain 10 - 15 dB
NF < 17.1 NF < 12
(maximum) (maximum)
• Gain 10 - 15 dB • Gain 15 - 20 dB
NF < 10.1 NF < 7.4
(maximum) (maximum)
High Gain mode N/A N/A N/A N/A • Gain 15- 20 dB N/A
NF < 10.9
(maximum)
• Gain 20 - 25 dB
NF < 7.1
(maximum)
Note 1: TOP Offset is a lever that can be used to maximize link budget (by reducing noise figure), and
the value will be provided by the modeling tools where applicable.
Note 2: Gain mode is defined as NA, High, or Low. Gain mode is set at provisioning from value provided
by Optical Modeler. Gain mode drives minimum and maximum amplifier gain. Gain mode of NA (Not
Applicable) is used for all amplifiers. On database restore, if the gain mode is different between the
saved database and the actual gain setting on the circuit pack, traffic may be impacted. You cannot
switch from Low Gain mode to High Gain mode if the current target gain is less than 11 dB, which is
outside of the common range (11-19 dB) for the Low Gain settings.
Note 3: Contact Ciena if more information is required.

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Figure 1-80
RLA 5x1 pre-amp gain mask (low gain mode)

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Figure 1-81
RLA 5x1 pre-amp gain mask (high gain mode)

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Figure 1-82
RLA 5x1 booster gain mask (low gain mode)

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Table 1-59
Technical specifications for RLA 5x1 optical interface circuit packs (WSS specifications)

Parameter RLA 5x1 circuit pack (NTK553RA); WSS


Connector type LC
Maximum total input power 27 dBm total or 9 dBm/12.5 GHz
Minimum Demux insertion loss 6.0 dB
Maximum Demux insertion loss 8.0 dB
Minimum Mux insertion loss 3.0 dB
Maximum Mux insertion loss 6.5 dB
Minimum attenuation per channel 0 dB
Maximum attenuation per channel 18 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Optical Power Monitor (OPM C-Band) 2 Port circuit pack


(NTK553PAE5) and Optical Power Monitor (OPM Flex C-Band) 2-Port
circuit pack (NTK553PB)
Overview
This release of 6500 supports two variants of the Optical Power Monitor
(OPM) circuit packs:
• NTK553PAE5: Optical Power Monitor (OPM C-Band) 2 Port circuit pack
(also referred to as 2-Port OPM).
This circuit pack provides the ability to monitor and report the
per-wavelength optical powers on the 50 GHz ITU grid across the entire
C-band supports (96 ITU-T 50GHz channels).
• NTK553PB: Optical Power Monitor (OPM Flex C-Band) 2-Port circuit pack
(also referred to as 2-Port OPM Flex C-Band)
— similar to 2-Port OPM circuit pack (NTK553PAE5), this circuit pack
provides the ability to monitor and report the per-wavelength optical
powers on the 50 GHz ITU grid across the entire C-band supports (96
ITU-T 50GHz channels).
— this circuit pack also provides the support for Flex spectrum
measurement and therefore ability to monitor and report the
per-frequency (6.25 GHz) optical powers. This results in NTK553PB
variant being used in flexible grid submarine applications while
NTK553PAE5 variant cannot be used in flexible grid submarine
applications.

Figure 1-83 on page 1-239 shows the faceplate of a 2-Port OPM circuit pack
and Figure 1-84 on page 1-240 shows the faceplate of a 2-Port OPM Flex
C-Band circuit pack. Figure 1-85 on page 1-241 provides a functional block
diagram of the 2-Port OPM and 2-Port OPM Flex C-Band circuit packs.

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Figure 1-83
2-Port OPM circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

Monitor ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-84
2-Port OPM Flex C-Band circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off

Monitor ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-85
2-Port OPM circuit pack block diagram (NTK553PAE5 and NTK553PB)

OPM In-1 1
Optical Power
Monitor
OPM In-2 2
Backplane

PD PD

OPM Validation 3

OPM Validation 4

Processor Power
Module Supply

Legend
OPM Optical Power Monitor
PD Photodiode

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Supported functionality
The 2-Port OPM circuit pack (NTK553PAE5) and 2-Port OPM Flex C-Band
circuit pack (NTK553PB) provide the following functionality:
• operates in ITU 50 GHz spaced C-band (NTK553PAE5 variant).
• operates in Flex C-band (NTK553PB variant).
• when used with the Enhanced CMD44 50 GHz or CMD96 modules,
provides a check point for service circuit pack Tx powers connected to
CMD44 or CMD96. Installers can validate connections between service
circuit packs and CMD44 or CMD96 without provisioning CMD44 or
CMD96 Tx/Rx adjacency and adding the channel in DOC.
• when used with an amplifier circuit pack at an amplifier node, provides
per-channel power monitoring capabilities. Per-channel power monitoring
capabilities at a line amp node provides CHMON PM’s for troubleshooting
purposes. DOC does not use the power monitoring capabilities for
optimization purposes.
• provides two optical connections to the 2-Port OPM or 2-Port OPM Flex
C-Band to be monitored on demand at any port
— connect to Enhanced CMD44 50 GHz or CMD96 module or amplifier
circuit pack to measure the optical power from the Enhanced CMD44
50 GHz or CMD96 module or the amplifier circuit pack.
— power measured at 2-Port OPM or 2-Port OPM Flex C-Band is scaled
and reported against the designated input ports (Port 1 and 2).
• provides two output optical connections for monitoring of the input ports
— connect to external OSA to validate the 2-Port OPM or 2-Port OPM
Flex C-Band measured powers (if necessary) via 50% tap from each
monitor ports.
— calibrated loss (~3dB) from Port 1 to 3 and from Port 2 to 4
programmed in CCT and displayed in Site Manager. Users can then
use the calibrated loss to add up with the external OSA measurements
in order to relate the measured spectra back at the 2-Port OPM or
2-Port OPM Flex C-Band faceplate.
• provides updated data for all ports within one second
• provides per channel as well as total band power monitor capability for
each 2-Port OPM or 2-Port OPM Flex C-Band port
• see Table 1-60 for function and connector type for each port
Table 1-60
2-Port OPM and 2-Port OPM Flex C-Band optical interfaces

Interface name Physical port # Function Connector type

Mon (In) 1 and 2 Monitor input ports LC

Mon (Out) 3 and 4 Monitor output ports LC

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Performance monitoring
The 6500 monitors and collects physical PMs for 2-Port OPM and 2-Port OPM
Flex C-Band circuit pack facilities. Table 1-61 provides a list of monitor types
supported on 2-Port OPM and 2-Port OPM Flex C-Band circuit packs.
Figure 1-86 on page 1-244 and Figure 1-87 on page 1-245 show the
2-Port OPM and 2-Port OPM Flex C-Band circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-61
Monitor types table for Photonic 2-Port OPM and 2-Port OPM Flex C-Band
circuit packs

Facility OPTMON CHMON SDMON


Monitor Type Note 1 Note 2

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OCH X X
OPTMIN-OCH X X
OPTMAX-OCH X X
OPTAVG-OCH X X

Note 1: CHMON facilities are only supported on 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs that are configured as a standalone OPM.
Note 2: SDMON facilities are only supported on the 2-Port OPM Flex C-Band circuit
pack when configured as a standalone OPM and running the flexible grid equipment
profile.

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Figure 1-86
2-Port OPM circuit pack optical monitoring points

Facility: CHMON port 1, 2


Parameter: OPT-OCH* **

Optical 2x1 OPM In - 1 1


Power Optical
Monitor Switch OPM In - 2 2

PD PD
Backplane

OPM
Validation 3

OPM
Validation 4

Processor Power
Module Supply
PMs collected on all PD locations
Facility: OPTMON port 1, 2
Parameter: OPR-OTS*
* AVG, MIN, and MAX measurements also provided.
** CHMON facilities are only supported on 2-Port OPM circuit packs that are configured
as a standalone OPM.

Legend
OPM Optical Power Monitor
PD Photodiode

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Figure 1-87
2-Port OPM Flex C-Band circuit pack optical monitoring points

Facility: CHMON port 1, 2


Parameter: OPT-OCH* **
Facility: SDMON port 1, 2
Parameter: OPT-OCH* ***

Optical 2x1 OPM In - 1 1


Power Optical
Monitor Switch OPM In - 2 2

PD PD
Backplane

OPM
Validation 3

OPM
Validation 4

PMs collected on all PD locations Processor Power


Facility: OPTMON port 1, 2 Module Supply
Parameter: OPR-OTS*

* AVG, MIN, and MAX measurements also provided.


** CHMON facilities are only supported on 2-Port OPM Flex C-Band circuit packs that are
configured as a standalone OPM.
*** SDMON facilities are only supported on the 2-Port OPM Flex C-Band circuit pack when
configured as a standalone OPM and running the flexible grid equipment profile.

Legend

OPM Optical Power Monitor


PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Loss of Signal
• Gauge Threshold Crossing Alert Summary

Equipping rules
The following equipping rules apply to 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs:
• is a single-slot interface.
• can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
Note: Up to four 2-Port OPM and 2-Port OPM Flex C-Band circuit packs
can be equipped in a 6500 shelf at the same time.

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• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of


2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf

The following restrictions on using a cross-connect circuit pack apply when


deploying a 2-Port OPM or 2-Port OPM Flex C-Band circuit pack:
• the 2-Port OPM and 2-Port OPM Flex C-Band circuit packs do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
• In a 14-slot shelf type, when the 2-Port OPM or 2-Port OPM Flex C-Band
circuit packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, when the 2-Port OPM or 2-Port OPM
Flex C-Band circuit packs are installed in slots 7 or 8, only Broadband
circuit packs or Photonic circuit packs can be provisioned in the other
interface slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface circuit
packs require a cross-connect circuit pack. See Part 1 of 6500 Planning,
NTRN10EY (Shelf and equipment descriptions) for a full list of supported
Broadband and Photonic circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the 2-Port OPM) and 2-Port OPM Flex C-Band optical
interface circuit packs.

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Table 1-62
Technical specifications for 2-Port OPM and 2-Port OPM Flex C-Band optical interface circuit
packs

Parameter 2-Port OPM (NTK553PAE5) 2-Port OPM Flex C-Band


(NTK553PB)
Weight (estimated) 0.9 kg (2.0 lb) 0.9 kg (2.0 lb)
Power consumption Typical (W): 8 (Note 1) Typical (W): 10 (Note 1)
Power Budget (W): 11 (Note 2) Power Budget (W): 12 (Note 2)
Connector type LC
Maximum total input optical power +17.5 dBm
Maximum total input power at +14.5 dBm
monitor-in port
Frequency range (in fixed-channel 191.325 THz to 196.125 THz
mode with 50 GHz spacing)
Wavelength range (in 1528.77 nm to 1566.72 nm
fixed-channel mode with 50 GHz
spacing)
Frequency range (in Flex-grid N/A 191.3125 THz to 196.1375 THz
mode with 6.25 GHz spacing)
Wavelength range (in Flex-grid N/A 1567.03 nm to 1528.48 nm
mode with 6.25 GHz spacing)
Total input power range per port -36 dBm to +14.5 dBm
(port 1 and 2)
Total power monitor accuracy -0.85 dB to +0.85 dB
(input power >= -36.0 dBm)
Per channel input power range -28.5 dBm to -0.6 dBm
Per channel input power accuracy -1.05 dB to +1.05 dB
LOS Threshold Default: -38 dBm
Minimum: -40 dBm
Maximum: 0 dBm
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

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4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs (NTK508AxE5)


Overview
The 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack (also
known as SCMD4 100 GHz) is a cost effective way to increase capacity. It
provides the ability to add/drop channels, without the requirement of having a
WSS at the site. Channel access sites using SCMD4s instead of WSSs are
referred to as thin terminal or thin OADM sites (TOADMs). The SCMD4 100
GHz circuit pack has passive group filters and passthrough/upgrade ports for
cascading.

Each SCMD4 circuit pack supports four DWDM channels in the 100
GHz-spaced ITU grid. Nine different SCMD4 circuit packs are required to
cover the entire C-band for a total of 36 wavelengths. Those nine SCMD4 100
GHz circuit packs are:
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 1
(NTK508AAE5): 1530.33 nm- 1531.12 nm- 1531.90 nm- 1532.68 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 2
(NTK508ABE5): 1534.25 nm- 1535.04 nm- 1535.82 nm- 1536.61 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 3
(NTK508ACE5): 1538.19 nm- 1538.98 nm- 1539.77 nm- 1540.56 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 4
(NTK508ADE5): 1542.14 nm- 1542.94 nm- 1543.73 nm- 1544.53 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 5
(NTK508AEE5): 1546.12 nm- 1546.92 nm- 1547.72 nm- 1548.51 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 6
(NTK508AFE5): 1550.12 nm- 1550.92 nm- 1551.72 nm- 1552.52 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 7
(NTK508AGE5): 1554.13 nm- 1554.94 nm- 1555.75 nm- 1556.55 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 8
(NTK508AHE5): 1558.17 nm- 1558.98 nm- 1559.79 nm- 1560.61 nm
• 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 9
(NTK508AJE5): 1562.23 nm- 1563.05 nm- 1563.86 nm- 1564.68 nm

Figure 1-88 on page 1-250 shows the faceplate of a SCMD4 100 GHz circuit
pack. Figure 1-89 on page 1-251 provides a functional block diagram of the
SCMD4 100 GHz circuit pack.

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Figure 1-88
SCMD4 100 GHz circuit pack faceplate (example: NTK508AAE5)

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
1531.90
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
In

o
- Equipment in-service = LED on; Equipment out-of-service = LED off
Out

Common ports
In

o
Out

Ch3

Ch5
Channel ports
In

o
Out

Ch7

Yellow circle (LOS)


In

o
- Used to communicate Rx Loss of Signal
Out

o Upgrade ports

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Figure 1-89
SCMD4 100 GHz circuit pack block diagram (NTK508AxE5)

Ch-In 1 3

PD VOA

Channel MUX
Ch-In 2 5

PD VOA
Upgrade MUX Ch-In 3 7

PD VOA
Ch-In 4 9
Processor VOA
PD
Module
Upgrade In 11

Power Common Out 2


Backplane

Supply

Common In 1

Upgrade Out 12
Upgrade DeMUX

Ch-Out 1 4
Channel DeMUX
Ch-Out 2 6

Ch-Out 3 8
Isolator
VOA
PD
Ch-Out 4 10

Legend
PD Photodiode
VOA Variable Optical Attenuator

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Supported functionality
The SCMD4 100 GHz circuit packs (NTK508AxE5) provide the following
functionality:
• offers 36 channels Mux/Demux in nine groups at 100 GHz grid listed in
Table 1-63
Table 1-63
SCMD4 100 GHz ITU grid 36 wavelength plan

Channel Wavelength Channel Wavelength Channel Wavelength


ID of the 100 GHz (nm) ID of the 100 GHz (nm) ID of the 100 GHz (nm)
mux/de mux/dem mux/de
mux ux mux

Group 1 (NTK508AAE5) Group 4 (NTK508ADE5) Group 7 (NTK508AGE5)

1 1530.33 31 1542.14 61 1554.13

3 1531.12 33 1542.94 63 1554.94

5 1531.90 35 1543.73 65 1555.75

7 1532.68 37 1544.53 67 1556.55

Group 2 (NTK508ABE5) Group 5 (NTK508AEE5) Group 8 (NTK508AHE5)

11 1534.25 41 1546.12 71 1558.17

13 1535.04 43 1546.92 73 1558.98

15 1535.82 45 1547.72 75 1559.79

17 1536.61 47 1548.51 77 1560.61

Group 3 (NTK508ACE5) Group 6 (NTK508AFE5) Group 9 (NTK508AJE5)

21 1538.19 51 1550.12 81 1562.23

23 1538.98 53 1550.92 83 1563.05

25 1539.77 55 1551.72 85 1563.86

27 1540.56 57 1552.52 87 1564.68

• has express path (upgrade port) that is 50 GHz-compliant.


• channel level optical power monitor and adjustment via a voltage
controlled optical attenuator (VOA) with 20 dB range on the MUX side for
wavelength optimization support
• total optical power monitor and adjustment via a voltage controlled optical
attenuator (VOA) with 20 dB range on the demultiplexer side allowing
adjustment of average drop power to connected receivers

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• VOAs fail to opaque. Hence add traffic lost on power down. Express path
is passive hence no impact with power down.
• Demux path includes an isolator to ensure the pre-amp APR (Automatic
Power Reduction) does not get triggered with a Tx to Ch Out
misconnection
• it is required to provision the cascading order when multiple SCMD4 cards
are cascaded.
• For TOADM configurations, line amplifiers connected to SCMD4s may not
go into shutoff mode when all channels are deleted due to the limited
range of the internal VOAs coupled with the fact that the transponders stay
tuned and outputting power in this colored configuration. To avoid this,
disconnect all transponders connected to the affected SCMD4s after the
last channel is deleted.
• see Table 1-64 for function and connector type for each port.
Table 1-64
SCMD4 100 GHz optical interfaces

Interface name Physical port # Function Connector type

Ch 1 In / Out 3/4 Optical input / output from the client-side LC


Ch 2 In / Out 5/6 interface(s)
Ch 3 In / Out 7/8
Ch 4 In / Out 9 / 10

Common In / Out 1/2 The SCMD4 Common In/Out ports are LC


connected to:
• the LIM Line A Out (port 7) of the
amplifier circuit pack when the SCMD4
circuit pack is the first group in the
cascading order.
• the preceding SCMD4 Upgrade In/Out
ports when the SCMD4 circuit pack is
not the first group in the cascading
order.

Upgrade In / Out 11 / 12 Group level bypass input / output LC (LC/UPC (Note)


terminators are
shipped on the
Demux upgrade
out port)

Note: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).

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Cross-connection types
The SCMD4 100 GHz circuit pack supports the following cross-connection
types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The SCMD4 100 GHz circuit pack only supports the OCH (Optical Channel)
Photonic cross-connection rate.

Performance monitoring
The 6500 monitors physical PMs for SCMD4 circuit pack facilities. Table 1-65
provides a list of monitor types supported on SCMD4 circuit packs.
Figure 1-90 on page 1-255 shows the SCMD4 circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-65
Monitor types table for SCMD4 circuit packs

Monitor Type Facility

VOA

GRPOPOUT-OTS X
GRPOPOUTMIN-OTS X
GRPOPOUTMAX-OTS X
GRPOPOUTAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

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Figure 1-90
SCMD4 circuit pack optical monitoring points

Ch-In 1 3

PD VOA

Channel MUX
Ch-In 2 5

PD VOA
Ch-In 3 7
Upgrade MUX
PD VOA
Ch-In 4 9

Processor PD VOA
Module
Upgrade-In 11

Common-Out 2
Backplane

Common-In 1

Power Upgrade-Out 12
Supply
Upgrade DeMUX

Ch-Out 1 4
Channel DeMUX
Ch-Out 2 6

PMs collected at all PD locations 8


Isolator VOA Ch-Out 3
Facility VOA port 1,3,5,7,9
Parameter: GRPOPOUT-OTS* port 1
Parameter: OPOUT-OTS* ports 3,5,7,9 PD
Ch-Out 4 10

*AVG, MIN, and MAX measurements also provided

Legend
PD Photodiode
VOA Variable Optical Attenuator

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Autoprovisioning Mismatch
• Circuit Pack Failed
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Upgrade Failed
• Database Not Recovered For Slot
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible

Photonic alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• Gauge Threshold Crossing Alert Summary
• Group Loss of Signal
• Loss of Signal

COM alarms
• Software Auto-Upgrade in Progress

Equipping rules
The following equipping rules apply to SCMD4 100 GHz circuit packs:
• is a 12-port single slot interface.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).

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• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of


2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a SCMD4 100 GHz circuit pack:
• the SCMD4 100 GHz circuit packs do not use any cross-connect capacity
and can be installed in shelves equipped with or without cross-connect
circuit packs
• In a 14-slot shelf type, when the SCMD4 100 GHz circuit packs are
installed in slots 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
• In a 6500-7 packet-optical shelf type, when the SCMD4 100 GHz circuit
packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SCMD4 100 GHz optical interface circuit pack.

Table 1-66
Technical specifications for SCMD4 100 GHz optical interface circuit pack

Parameter SCMD4 100 GHz (NTK508AxE5)


Weight (estimated) 1.1 kg (2.4 lb)
Power consumption Typical (W): 7 (Note 1)
Power Budget (W): 10 (Note 2)
Maximum total Input power Per port for the 4:1 MUX= 14 dBm
Any other optical port (input or output)= 20 dBm
Minimum return loss 40 dB
Working bandwidth +/- 12.5 GHz
Add path maximum insertion losses • Ch-In to Common Out: 4.6 dB
(VOAs = 0 dB) • Upgrade In to Common Out: 1.1 dB
Drop Path maximum insertion losses • Common In to Ch-Out: 5.4 dB
(VOA = 0 dB) • Common In to Upgrade Out: 0.75 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.

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Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),


Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (NTK553GC)
Overview
This release of 6500 supports the following variants of the SMD circuit packs:
• Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (also
referred to as SMD 50 GHz 8x1) (NTK553GAE5)
• Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (also referred
to as SMD Flex 8x1) (NTK553GB)
• Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (also referred
to as SMD Flex 14x8) (NTK553GC)

The SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8 circuit pack is used
together with the CCMD12 C-Band circuit pack (NTK508FAE5) to provide
colorless add/drop per-wavelength switching.

The SMD Flex 8x1 or SMD Flex 14x8 circuit pack offers similar functionality
as SMD 50 GHz 8x1 circuit pack with some variations on technical
specifications and power consumption (see Table 1-71 on page 1-276 for
details). Also, unlike NTK553GAE5 and NTK553GB variants, the SMD Flex
14x8 circuit pack (NTK553GC) offers the colorless mux and the directional
switching functions in a single circuit pack.

The SMD Flex 8x1 (NTK553GB) and SMD Flex 14x8 (NTK553GC) circuit
pack variants are flexible grid-capable hardware and support flexible grid
COADM-based colorless applications.

The following figures are available:


• Figure 1-91 on page 1-260 shows the faceplate of a SMD 50 GHz 8x1
circuit pack.
• Figure 1-92 on page 1-261 shows the faceplate of a SMD Flex 8x1 circuit
pack. SMD Flex 8x1 faceplate is similar but using Flex instead of 50 GHz
on its faceplate label.
• Figure 1-93 on page 1-262 shows the faceplate of a SMD Flex 14x8 circuit
pack.
• Figure 1-94 on page 1-263 provides the functional block diagram of the
SMD 50 GHz 8x1 circuit pack.
• Figure 1-95 on page 1-264 provides the functional block diagram of the
SMD Flex 8x1 circuit pack.
• Figure 1-96 on page 1-265 provides the functional block diagram of the
SMD Flex 14x8 circuit pack.

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Figure 1-91
SMD 50 GHz 8x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled) Monitor
- Equipment in-service = LED on; Equipment ports
out-of-service = LED off

Channel
ports
Common
ports

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Figure 1-92
SMD Flex 8x1 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports

Channel
ports
Common
ports

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Figure 1-93
SMD Flex 14x8 circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Common Mux/Demux
ports

Add/drop switch
ports

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Figure 1-94
SMD 50 GHz 8x1 circuit pack block diagram (NTK553GAE5)

Processor Demux Out-1 12


Module
Demux Out-2 14

Power Demux Out-3 16


Supply
Demux Out-4 18
Wavelength
Demux Out-5 20
Selective Switch
2x8 Demux Out-6 22
1529.94 nm filter
Demux Out-7 24

Demux Out-8 26

Monitor 1 1

Monitor 2 2
PD
Optical 2x1 Monitor 3 3
Power Optical
Monitor Switch Monitor 4 4
50 GHz PD
8x1 Combiner
Monitor 5 5
Backplane

Monitor 6 6

Monitor 7 7

Monitor 8 8
PD

Isolator Common-In 9
Common-Out 10
PD PD PD PD PD PD PD PD

Switch In-1 11

Switch In-2 13

Switch In-3 15

Switch In-4 17
Wavelength
Selective Switch Switch In-5 19
8x2
Switch In-6 21

Switch In-7 23

Switch In-8 25

Legend
OPM Optical Power Monitor
PD Photodiode

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Figure 1-95
SMD Flex 8x1 circuit pack block diagram (NTK553GB)

Processor Demux Out-1 12


Module
Demux Out-2 14

Power Demux Out-3 16


Supply
Demux Out-4 18
Wavelength
Demux Out-5 20
Selective Switch
2x8 Demux Out-6 22

Demux Out-7 24

Demux Out-8 26

Monitor 1 1

Monitor 2 2
Optical Power
Monitor Flex Monitor 3 3

Monitor 4 4
8x1 Combiner
Monitor 5 5
Backplane

Monitor 6 6
PD
Monitor 7 7
PD
Monitor 8 8
PD

Isolator Common-In 9
Common-Out 10
PD PD PD PD PD PD PD PD

Switch In-1 11

Switch In-2 13

Switch In-3 15

Switch In-4 17
Wavelength
Selective Switch Switch In-5 19
8x2
Switch In-6 21

Switch In-7 23

Switch In-8 25

Legend
OPM Optical Power Monitor
PD Photodiode

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Figure 1-96
SMD Flex 14x8 circuit pack block diagram (NTK553GC)

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Supported functionality
The SMD 50 GHz 8x1 circuit pack (NTK553GAE5), SMD Flex 8x1 circuit pack
(NTK553GB), and SMD Flex 14x8 circuit pack (NTK553GC) provide the
following functionality:
• wavelength range:
— for NTK553GAE5 variant, C-band channels 1530.33 nm to 1565.092
nm (88 channels capable) when used in fixed grid systems
— for NTK553GB and NTK553GC variants, C-band channels 1528.77
nm to 1566.72 nm (96 channels capable) when used in fixed grid
systems
• frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (only applicable to NTK553GB and NTK553GC
variants)
• provides two independently controlled wavelength selective switches
(WSS) to select each of the 88 channels in the band plan from any of its 8
ports
• provides blocking of channels on unselected ports of either the mux or
demux path
• provides per channel attenuation of all channels in either the mux or
demux path
• provides an internal loopback connection between the two WSSs. The
loopback path has a fixed filter to only allow wavelength 1529.94 nm.
• provides monitoring (total power) on all Switch In ports and the Common
In port
• provides optical isolation on the demux Common In path to eliminate
return loss and extraneous connection reverse-propagating power from
exiting the demux common
• provides 8 monitor ports that are combined into a single input to an
internal optical power monitor (OPM) (meant to be used in conjunction
with CCMD12 C-band monitor ports in the demux direction). This allows
power measurement and power setting of drop channels.
• provides per channel as well as total band power monitor capability for
each OPM port
• provides an internal fiber connection from the Common Out path of the
SMD 50 GHz 8x1 or SMD Flex 8x1 circuit pack to a dedicated OPM port.
This allows power measurement and power setting of add channels.
• flexible grid COADM-based colorless application support for NTK553GB
and NTK553GC variants.
• see Table 1-67 on page 1-267 for function and connector type for each
port

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Table 1-67
SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interfaces

Interface name Physical port # Function Connector


type

SMD 50 GHz 8x1 and SMD Flex 8x1 circuit packs

Mon 1 to 8 Input Monitor ports for the SMD 50 GHz LC-UPC


8x1 or SMD Flex 8x1. Up to 8 CCMD12
C-Band Mon Out ports can be
connected.

Common In / Out 9 / 10 DWDM optical input / output connected LC-UPC


to DIA or OADM configurations.

Demux Out 1 / Switch In 1 12 / 11 Optical input/output from CCMD12 LC-UPC


Demux Out 2 / Switch In 2 14 / 13 C-Band

Demux Out 3 / Switch In 3 16 / 15


Demux Out 4 / Switch In 4 18 / 17
Demux Out 5 / Switch In 5 20 / 19
Demux Out 6 / Switch In 6 22 / 21
Demux Out 7 / Switch In 7 24 / 23
Demux Out 8 / Switch In 8 26 / 25

SMD Flex 14x8 circuit packs

Switch Out 1 / Switch In 1 6/5 Optical input/output from CCMD12 LC-UPC


Switch Out 2 / Switch In 2 8/7 C-Band for add/drop

Switch Out 3 / Switch In 3 10 / 9


Switch Out 4 / Switch In 4 12 / 11
Switch Out 5 / Switch In 5 14 / 13
Switch Out 6 / Switch In 6 16 / 15
Switch Out 7 / Switch In 7 18 / 17
Switch Out 8 / Switch In 8 20 / 19

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Table 1-67
SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interfaces

Interface name Physical port # Function Connector


type

Demux In 1 / Mux Out 1 1/A DWDM optical input/output MPO ports 12-Fiber
Demux In 2 / Mux Out 2 connected to FIM3 CMD MPO or MPO/APC
WSS/CMD MPO ports in the MPO port Male
Demux In 3 / Mux Out 3 range 11-20
Demux In 4 / Mux Out 4 Use MPO(F)-MPO(F), APC, 12 Fiber,
Demux In 5 / Mux Out 5 2/B SM fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Demux In 6 / Mux Out 6
Demux In 7 / Mux Out 7
Demux In 8 / Mux Out 8

Demux In 9 / Mux Out 9 3/C


Demux In 10 / Mux Out 10
Demux In 11 / Mux Out 11
Demux In 12 / Mux Out 12

Demux In 13 / Mux Out 13 4/D


Demux In 14 / Mux Out 14

Performance monitoring
The 6500 monitors and collects physical PMs for SMD 50 GHz 8x1 circuit
pack (NTK553GAE5), SMD Flex 8x1 circuit pack (NTK553GB), and SMD Flex
14x8 circuit pack (NTK553GC) facilities. Table 1-68 provides a list of monitor
types supported on SMD 50 GHz 8x1 circuit pack (NTK553GAE5), SMD Flex
8x1 circuit pack (NTK553GB), and SMD Flex 14x8 circuit pack (NTK553GC).
Figure 1-97 on page 1-270, Figure 1-98 on page 1-271, and Figure 1-99 on
page 1-272 show the SMD 50 GHz 8x, SMD Flex 8x1, and SMD Flex 14x8
circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-68
Monitor types table for Photonic SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex
14x8 circuit packs

Facility OPTMON SDMON NMCMON CHMON


Monitor Type Note 1 Note 2 Note 3

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X

OPT-OCH X X X
OPTMIN-OCH X X X
OPTMAX-OCH X X X
OPTAVG-OCH X X X

Note 1: SDMON facilities are only supported on the SMD Flex 8x1 circuit pack.
Note 2: NMCMON facilities are only supported on the SMD 50 GHz 8x1 and SMD
Flex 8x1 circuit packs.

Note 3: CHMON facilities are not supported on the SMD Flex 14x8 circuit pack.

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Figure 1-97
SMD 50 GHz 8x1 circuit pack optical monitoring points

Demux Out 1 12
Processor
Module
Demux Out 2 14

Power Demux Out 2 16


Supply
Demux Out 2 18
Wavelength
Selective Switch Demux Out 2 20
2x8
1529.94 nm Demux Out 2 22
filter
Demux Out 2 24

Demux Out 2 26

Monitor1 1
Optical Power
Monitor 50GHz Monitor 2 2

Monitor 3 3

Monitor 4 4
8x1 Combiner
Monitor 5 5
Backplane

2x1 Optical Switch Monitor 6 6

Monitor 7 7
PD
Monitor 8 8
PD PD

Isolator Common-In 9

Common-Out 10
PD PD PD PD PD PD PD PD

Switch In 1 11
Switch In 2 13

Switch In 3 15

Switch In 4 17

Wavelength Switch In 5 19
Selective Switch
8x2 Switch In 6 21

Switch In 7 23

Switch In 8 25

PMs collected at all PD locations (except PD between 2x1 Optical Switch and 8x1 combiner)
Facility: OPTMON port 9,11,13,15,17,19,21,23,25
Parameter: OPR-OTS*
Facility: OPTMON port 10
Parameter: OPT-OTS*
Facility: CHMON port 10, NMCMON port 10
Parameter OPT-OCH* *AVG, MIN, and MAX measurements also provided.

Le gend
OPM Optical Power Monitor
PD Photodiode

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Figure 1-98
SMD Flex 8x1 circuit pack optical monitoring points

PMs collected at all PD locations


Facility: OPTMON port 9,11,13,15,17,19,21,23,25 Demux Out-1 12
Parameter: OPR-OTS*
Facility: OPTMON port 10 Demux Out-2 14
Parameter: OPT-OTS*
Demux Out-3 16
Facility: CHMON port 10, SDMON port 10
Parameter: OPT-OCH* Demux Out-4 18
Wavelength
Facility: NMCMON port 10 Selective Switch
Parameter: OPT-OTS 2x8 Demux Out-5 20
* AVG, MIN, and MAX measurements also provided.
Demux Out-6 22
Processor
Module Demux Out-7 24

Demux Out-8 26
Power
Supply
Monitor 1 1

Monitor 2 2

Monitor 3 3

Optical Power Monitor 4 4


Monitor Flex 8x1 Combiner
Monitor 5 5
Backplane

Monitor 6 6
PD
Monitor 7 7
PD
Monitor 8 8
PD

Isolator Common-In 9
Common-Out 10
PD PD PD PD PD PD PD PD

Switch In-1 11

Switch In-2 13

Switch In-3 15

Switch In-4 17
Wavelength
Selective Switch Switch In-5 19
8x2
Switch In-6 21

Switch In-7 23

Switch In-8 25

Legend
OPM Optical Power Monitor
PD Photodiode

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Figure 1-99
SMD Flex 14x8 circuit pack optical monitoring points

PD
DFLM CT
x4
x4 MPO 1
14x9 Mux Connector
Wavelength x4 PD x4
Selective PD CT
x4
Switch x4 MPO 2
Connector
x4 PD x4
PD CT
x4
x4 MPO 3
14x8 Demux Connector
Processor x4 PD x4
Wavelength CT
Module PD x2
Selective
x2 MPO 4
Switch
Connector
x2 x2
PD
5
Backplane

6
7
Power 8
Supply 9
10
11
12
13
14
15
16
17
18
19
20

PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD
-
PMs collected at all PD locations
Facility: OPTMON port 1,2,3 (sub-ports 7 to 10),4 (sub-ports 7 and 8),5,7,9,11,13,15,17,19
Parameter: OPR-OTS*
Facility: OPTMON port 1,2,3, (sub-ports 3 to 6),4 (sub-ports 5 and 6),6,8,10,12,14,16,18,20
Parameter: OPT-OTS*

* AVG, MIN, and MAX measurements also provided.

Legend
CT Cable Trace
DFLM Dark Fiber Loss Measurement
MPO Multi-fiber Push On
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• High Fiber Loss
• High Optical Power
• Loss of Signal
• Gauge Threshold Crossing Alert Summary

Common equipment alarms


• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to SMD 50 GHz 8x1, SMD Flex 8x1, and
SMD Flex 14x8 circuit packs:
• are double-slot interfaces.
• Shelf/slot support: follow the instructions on the following tables:
Table 1-69
Shelf/slot support for SMD 50 GHz 8x1 and SMD Flex 8x1 circuit packs

Shelf type Slot number

All 2-slot shelf types Not supported

All 7-slot shelf types Not supported

6500-7 packet-optical shelf type Not supported for SMD 50 GHz 8x1 variant
slots 1 to 7 for SMD Flex 8x1 variant
The SMD Flex 8x1 circuit pack is a double-slot
interface and cannot be placed in slot 8 of a 6500-7
packet-optical shelf type.

All 14-slot shelf types (except the NTK503GA slots 1 to 13


metro front electrical shelf) The SMD circuit pack is a double-slot interface and
cannot be placed in slot 14 of a 14-slot shelf type.

All 32-slot shelf types slots 1-7, 11-17, 21-27, and 31-37
The SMD circuit pack is a double-slot interface and
cannot be placed in slot 8, 18, 28, and 38 of a
32-slot shelf type.

Table 1-70
Shelf/slot support for SMD Flex 14x8 circuit pack

Shelf type Slot number

All 2-slot shelf types Not supported

7-slot shelf types (only NTK503KA variant) slots 1 to 6


The SMD circuit pack is a double-slot interface and
cannot be placed in slot 7 of a 7-slot shelf type.

6500-7 packet-optical shelf type slots 1 to 7


The SMD circuit pack is a double-slot interface and
cannot be placed in slot 8 of a 6500-7 packet-optical
shelf type.

14-slot Packet-optical and Converged shelf types slots 1 to 13


(NTK503SA, NTK503ADE5, NTK503BDE5, and The SMD circuit pack is a double-slot interface and
NTK503CDE5 variants) cannot be placed in slot 14 of a 14-slot shelf type.

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Table 1-70
Shelf/slot support for SMD Flex 14x8 circuit pack

All 32-slot shelf types slots 1-7, 11-17, 21-27, and 31-37
The SMD circuit pack is a double-slot interface and
cannot be placed in slot 8, 18, 28, and 38 of a
32-slot shelf type.

• requires that the 6500 shelf is equipped with the SP-2 shelf processor
(NTK555FAE5 variant) or SPAP-2 w/2xOSC (NTK555NA or NTK555NB),
otherwise the SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8
equipment does not provision.
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8 circuit pack:
• the SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 circuit packs do
not use any cross-connect capacity and can be installed in shelves
equipped with or without cross-connect circuit packs
• In a 14-slot shelf type, when the SMD 50 GHz 8x1, SMD Flex 8x1, and
SMD Flex 14x8 circuit packs are installed in slots 7, 8, and 9, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6 and 10 to14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. See Part 1
of 6500 Planning, NTRN10EY (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SMD 50 GHz 8x1, SMD Flex 8x1, SMD Flex 14x8 optical
interface circuit packs.

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Table 1-71
Technical specifications for SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interface
circuit packs

Parameter SMD 50 GHz 8x1 SMD Flex 8x1 SMD Flex 14x8
(NTK553GAE5) (NTK553GB) (NTK553GC)
Weight (estimated) 2.8 kg (6.2 lb) 3 kg (6.6 lb) 2.3 kg (5.0 lb)
Power consumption Typical (W): 24 (Note 1) Typical (W): 35 (Note 1) Typical (W): 20
Power Budget (W): 27 (Note Power Budget (W): 70 (Note 1)
2 and Note 3) (Note 2, and Note 3) Power Budget (W):
70 (Note 2, and
Note 3)
Connector type LC-UPC LC-UPC 12-Fiber MPO/APC
Male, LC-UPC
Wavelength range (nm) 1530.33 to 1565.09 1528.77 to 1566.72 1528.77 to 1566.72
(88 channels capable) (96 channels capable) (96 channels
capable)
Frequency range (THz) N/A C-Band 196.125 THz to 191.325 THz when
used in flexible grid systems
SMD Mux/DeMux loss 2.2 dB to 7.3 dB 2.5 dB to 7.1 dB 4.5 dB to 9.5 dB
Maximum attenuation 18 dB 18 dB 10 dB
range
Loopback In 1 to Out 1 4.5 dB to 15.7 dB N/A N/A
Loss
Loopback In 8 to Out 8
Loss
Loopback In x to Out x 4.5 dB to 13.5 dB N/A N/A
Loss
x=2,3,4,5,6,7
Loopback In x to Out x N/A 5 dB to 15 dB N/A
Loss
x=1,2,3,4,5,6,7,8
Maximum total input 24 dBm 24 dBm 24 dBm
power at Common In port
Maximum total input 18 dBm 18 dBm 18 dBm
power at Switch input port

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Table 1-71
Technical specifications for SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interface
circuit packs

Parameter SMD 50 GHz 8x1 SMD Flex 8x1 SMD Flex 14x8
(NTK553GAE5) (NTK553GB) (NTK553GC)
Maximum input power in 12 dBm 12 dBm 12 dBm
any 50 GHz channel
passband
Maximum total input 14.5 dBm 14.5 dBm N/A
power at monitor input
port
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
power budget to the zone associated with the left-most slot occupied by the circuit pack.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack


(NTK508FAE5) and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit
pack (NTK508FL)
Overview
This release of 6500 supports two variants of the CCMD12 circuit packs:
• 12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (also
referred to as CCMD12 C-Band).The CCMD12 C-Band circuit pack is
used together with the
— SMD 50 GHz 8x1 (NTK553GAE5), SMD Flex 8x1 (NTK553GB), or
SMD Flex 14x8 (NTK553GC) circuit pack to provide colorless
add/drop per-wavelength switching.
— GMD10 C-Band modules (NTT862GA) or FIM Type 4 (NTK504CD) as
a cost effective way to provide a multiplexing point for channels from
CCMD12 C-Band circuit packs.
• 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack (also
referred to as CCMD12 L-Band). The CCMD12 L-Band circuit pack is
used together with the GMD10 L-Band modules (NTT862GL) as a cost
effective way to provide a multiplexing point for channels from CCMD12
L-Band circuit packs. The CCMD12 L-Band circuit packs are only used in
Submarine applications.

See “10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10


Group Mux/Demux (GMD10) L-Band module (NTT862GL)” on page 1-449 for
more information on GMD10 modules. See “Fiber Interconnect Modules (FIM)
(NTK504CA, NTK504CB, NTK504CC, NTK504CD, NTK504CE, and
NTK504CF)” on page 1-457 for more information on FIM Type 4 modules.

Figure 1-100 on page 1-279 shows the faceplate of a CCMD12 C-Band circuit
pack (the CCMD12 L-Band variant shows L-Band on its faceplate).
Figure 1-101 on page 1-280 provides a functional block diagram of the
CCMD12 (C-Band or L-Band) circuit pack. For CCMD12 L-Band circuit pack,
the circuit pack’s block diagram is the same as CCMD12 C-Band circuit pack’s
block diagram.

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Figure 1-100
CCMD12 C-Band circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Channel
ports

Common
ports
Monitor
port

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Figure 1-101
CCMD12 (C-Band and L-Band) circuit pack block diagram (NTK508FAE5 and NTK508FL)

Ch 1 In 1

Ch 2 In 3

Ch 3 In 5

Ch 4 In 7

Ch 5 In 9

Ch 6 In 11

Ch 7 In 13
12 Channel Mux
Ch 8 In 15

Ch 9 In 17

Ch 10 In 19

Processor Ch 11 In 21
Module
Ch 12 In 23

PD PD PD PD PD PD PD PD PD PD PD PD
Backplane

EDFA Common Out 26


Drop Mon 27
Power EDFA Common In 25
Supply
Ch 1 Out 2

Ch 2 Out 4

Ch 3 Out 6

Ch 4 Out 8

Ch 5 Out 10
12 Channel Demux
Ch 6 Out 12

Ch 7 Out 14

Ch 8 Out 16

Ch 9 Out 18

Ch 10 Out 20

Ch 11 Out 22

Ch 12 Out 24

Legend
PD Photodiode

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Supported functionality
The CCMD12 circuit packs (NTK508FAE5 and NTK508FL) provide the
following functionality:
• provide 12 mux ports without filtering
• provide 12 demux ports without filtering
• provide monitoring (total power) on all mux ingress ports
• provides an erbium-doped fiber amplifier (EDFA) at the common input port
of the demux path
• provide an erbium-doped fiber amplifier (EDFA) at the common output port
of the mux path
• provide total power monitoring at both the input and output of both EDFAs
• provide an external monitor port at the output of the demux EDFA. In
CCMD12 C-Band variant (NTK508FAE5), this port connects to the SMD
50 GHz 8x1 or SMD Flex 8x1 monitor ports in colorless configuration. In
CCMD12 L-Band variant (NTK508FL), this port connects to the GMD10
L-Band module monitor ports in colorless configuration.
• CCMD12 C-Band variant (NTK508FAE5) connects to GMD10 C-Band
modules (NTT862GA), or FIM Type 4 modules (NTK504CD) as a cost
effective way to provide a multiplexing point for channels from CCMD12
C-Band circuit packs
• CCMD12 L-Band variant (NTK508FL) connects to GMD10 L-Band
modules (NTT862GL) as a cost effective way to provide a multiplexing
point for channels from CCMD12 L-Band circuit packs
• provide optical isolation in the EDFAs to eliminate return loss and
extraneous connection reverse-propagating power
• see Table 1-72 on page 1-282 for function and connector type for each
port

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Table 1-72
CCMD12 optical interfaces (C-Band and L-Band)

Interface name Physical port # Function Connector type

Drop Mon 27 For CCMD12 C-Band (NTK508FAE5 variant): LC-UPC


For DWDM optical output to the
• SMD Flex 14x8, SMD 50 GHz 8x1, or SMD
Flex 8x1 circuit pack Monitor port in colorless
configuration, or
• GMD10 C-Band
• FIM Type 4
For CCMD12 L-Band (NTK508FL variant):
For DWDM optical output to the
• GMD10 L-Band

Common In / Out 25 / 26 For CCMD12 C-Band (NTK508FAE5 variant): LC-UPC


DWDM optical input /output to/from the
• SMD Flex 14x8, SMD 50 GHz 8x1, or SMD
Flex 8x1 circuit pack Demux Out/Switch In in
colorless configuration, or
• GMD10 C-Band
• FIM Type 4
For CCMD12 L-Band (NTK508FL variant):
DWDM optical input /output to/from the
• GMD10 L-Band

Channel 1 In / Out 1/2 Optical input / output from transponders LC-UPC


Channel 2 In / Out 3/4
Channel 3 In / Out 5/6
Channel 4 In / Out 7/8
Channel 5 In / Out 9 / 10
Channel 6 In / Out 11 / 12
Channel 7 In / Out 13 / 14
Channel 8 In / Out 15 / 16
Channel 9 In / Out 17 / 18
Channel 10 In / Out 19 / 20
Channel 11 In / Out 21 / 22
Channel 12 In / Out 23 / 24

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Cross-connection types
The CCMD12 circuit pack only supports the 2WAY (Bidirectional)
cross-connection type.

Cross-connection rates
The CCMD12 C-Band circuit pack supports Optical Channel (OCH) and
Network Media Channel (NMC) Photonic cross-connection rates.

The CCMD12 L-Band circuit pack supports Network Media Channel (NMC)
Photonic cross-connection rates.

Performance monitoring
The 6500 monitors and collects physical PMs for CCMD12 circuit pack
facilities. Table 1-73 provides a list of monitor types supported on CCMD12
circuit packs. Figure 1-102 on page 1-285 shows the CCMD12 C-Band circuit
pack optical monitoring points and Figure 1-102 on page 1-285 shows the
CCMD12 L-Band circuit pack optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

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Table 1-73
Monitor types table for CCMD12 circuit packs

Monitor Type Facility

OPTMON SDMON NMCMON CHMON AMP


Note

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X

OPT-OCH X X X
OPTMIN-OCH X X X
OPTMAX-OCH X X X
OPTAVG-OCH X X X

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

Note: The SDMON facility on port 25 is only supported when the CCMD12 circuit
pack is connected to an SMD Flex 1x8 circuit pack.

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Figure 1-102
CCMD12 C-Band circuit pack optical monitoring points

Ch 1 In 1

Ch 2 In 3

Ch 3 In 5

Ch 4 In 7

Ch 5 In 9

Ch 6 In 11

Ch 7 In 13
12 Channel Mux
Ch 8 In 15

Ch 9 In 17

Ch 10 In 19

Ch 11 In 21
Processor Ch 12 In 23
Module

PD PD PD PD PD PD PD PD PD PD PD PD

EDFA Common Out 26


Backplane

Facility: AMP port 26


Parameter: OPIN-OTS*
Parameter: OPOUT-OTS* Drop Mon 27
Power EDFA Common In 25
Supply
Ch 1 Out 2

Ch 2 Out 4

Ch 3 Out 6

Ch 4 Out 8

Ch 5 Out 10
12 Channel Demux
Ch 6 Out 12

Ch 7 Out 14

Ch 8 Out 16

Ch 9 Out 18

Ch 10 Out 20

Ch 11 Out 22

Ch 12 Out 24
PMs collected at all PD locations and Ch # Out ports Facility: AMP port 25
Facility: OPTMON port 1,3,5,...,21,23 Parameter: OPIN-OTS*
Parameter: OPR-OTS* Parameter: OPOUT-OTS*
Facility: OPTMON port 2,4,6,...,22,24 Facility: CHMON port 25, SDMON port 25,
Parameter: OPT-OTS* NMCMON port 25
* AVG, MIN, and MAX measurements also provided Parameter: OPT-OCH*

Le gend
ED FA Erbium Doped Fiber Amplifier
PD Photodiode

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Figure 1-103
CCMD12 L-Band circuit pack optical monitoring points

Ch 1 In 1

Ch 2 In 3

Ch 3 In 5

Ch 4 In 7

Ch 5 In 9

Ch 6 In 11

Ch 7 In 13
12 Channel Mux
Ch 8 In 15

Ch 9 In 17

Ch 10 In 19

Ch 11 In 21
Processor Ch 12 In 23
Module

PD PD PD PD PD PD PD PD PD PD PD PD

EDFA Common Out 26


Backplane

Facility: AMP port 26


Parameter: OPIN-OTS*
Parameter: OPOUT-OTS* Drop Mon 27
Power EDFA Common In 25
Supply
Ch 1 Out 2

Ch 2 Out 4

Ch 3 Out 6

Ch 4 Out 8

Ch 5 Out 10
12 Channel Demux
Ch 6 Out 12

Ch 7 Out 14

Ch 8 Out 16

Ch 9 Out 18

Ch 10 Out 20

Ch 11 Out 22

Ch 12 Out 24
PMs collected at all PD locations and Ch # Out ports Facility: AMP port 25
Facility: OPTMON port 1,3,5,...,21,23 Parameter: OPIN-OTS*
Parameter: OPR-OTS* Parameter: OPOUT-OTS*
Facility: CHMON port 25, SDMON port 25,
NMCMON port 25
* AVG, MIN, and MAX measurements also provided Parameter: OPT-OCH*

Le gend
ED FA Erbium Doped Fiber Amplifier
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected
• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Photonic alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• Loopback Active - Facility
• High Fiber Loss
• Shutoff Threshold Crossed
• Input Loss of Signal
• Output Loss of Signal
• Loss of Signal
• Automatic Power reduction Active
• Gauge Threshold Crossing Alert Summary

Common equipment alarms


• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to CCMD12 circuit packs (C-Band and
L-Band):
• are single slot interfaces.
• can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• CCMD12 C-Band can be equipped in slots 1 to 7 of the 7-slot optical shelf
(NTK503PAE5 or NTK503KA) only for the use in CDA solution (CCMD12
C-Band/ WSS Flex C-Band w/OPM 20x1). The CCMD12 C-Band is not
supported in other configurations in the 7-slot shelf (NTK503PAE5 or
NTK503KA).
• CCMD12 L-Band can be equipped in slots 1 to 7 of the 7-slot optical shelf
(NTK503PAE5 or NTK503KA) only for the use in GMD10 solution
(CCMD12 L-Band/ GMD10 L-Band/ WSS Flex L-Band w/OPM 8x1). The
CCMD12 L-Band is not supported in other configurations in the 7-slot
shelf (NTK503PAE5 or NTK503KA).
• CCMD12 C-Band can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA) only for the use in CDA solution
(CCMD12 C-Band/ WSS Flex C-Band w/OPM 20x1). The CCMD12
C-Band is not supported in other configurations in the 6500-7
packet-optical shelf.
• CCMD12 L-Band can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA) only for the use in GMD10 solution
(CCMD12 L-Band/ GMD10 L-Band/ WSS Flex L-Band w/OPM 8x1). The
CCMD12 L-Band is not supported in other configurations in the 6500-7
packet-optical shelf.
• can be equipped in slots 1 and 2 of the NTK503LA variant of 2-slot shelf
for applications such as the 6500-Waveserver Flex-12 (50GHz)
configuration when the shelf is equipped with SPAP-2 w/2xOSC
(NTK555NA or NTK555NB)
• require that the 6500 shelf is equipped with the SP-2 shelf processor
(NTK555CAE5, NTK555EAE5, or NTK555FAE5), otherwise the CCMD12
equipment does not provision.
• all equipment that is part of an OTS must be located within the same
physical shelf.

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The following restrictions on using a cross-connect circuit pack apply when


deploying a CCMD12 circuit pack (C-Band or L-Band):
• the CCMD12 circuit packs (C-Band or L-Band) do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
• In a 14-slot shelf type, when the CCMD12 circuit packs (C-Band or
L-Band) are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10EY
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CCMD12 (C-Band and L-Band) optical interface circuit
packs.

Table 1-74
Technical specifications for CCMD12 optical interface circuit packs (C-Band and L-Band)

Parameter CCMD12 C-Band CCMD12 L-Band


(NTK508FAE5) (NTK508FL)
Weight (estimated) 1.8 kg (4.0 lb)
Power consumption Typical (W): 17 (Note 1)
Power Budget (W): 25 (Note 2)
Connector type LC-UPC
Wavelength range (nm) 1528.77 to 1566.72 (96 channels 1569.80 to 1608.98 (93
capable) channels capable)
Drop EDFA gain 17 dB to 23 dB (Note 3)
Drop EDFA design flat gain 19.5 dB to 20.5 dB
Drop EDFA gain ripple 1 dB
Drop EDFA total input power -15.5 dBm to -4.5 dBm
Drop EDFA total output power 5 dBm to 15 dBm
Drop EDFA noise figure 4.5 dB to 4.8 dB 5.8 dB to 6.1 dB
Add EDFA gain 17 dB to 23 dB (Note 3)
Add EDFA design flat gain 19.5 dB to 20.5 dB
Add EDFA gain ripple 0.5 dB
Add EDFA total input power -25.5 dBm to -4 dBm
Add EDFA total output power -5.5 dBm to 15 dBm

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Table 1-74
Technical specifications for CCMD12 optical interface circuit packs (C-Band and L-Band)

Parameter CCMD12 C-Band CCMD12 L-Band


(NTK508FAE5) (NTK508FL)
Add EDFA noise figure 4.5 dB to 4.8 dB
1x12 split/combiner loss 11.2 dB to 13.4 dB
Tap loss for OPM 8 dB to 11 dB
Maximum total input power at Common In 24 dBm
port
Maximum total input power at Mux input 24 dBm
port
Maximum input power in any 50 GHz 12 dBm
channel passband
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered
equipment. For practical purposes, the rounded typical power consumption of equipment can be used as
the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate of the long term
heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage range
in the case of AC-powered equipment. These rounded power values must be used in sizing feeders and
estimating theoretical maximum power draw.
Note 3: Although the CCMD12 circuit pack can support different gains, the circuit pack is intended to be
operated at the design flat gain of 20 dB.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band


1xCXM) circuit pack (NTK508HA) and CCMD8x16 C-Band Expansion
Module (CXM C-Band Type 1) (NTK576BA)
Overview
The 8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band
1xCXM) circuit pack (also referred to as CCMD8x16) is a colorless 16 Mux/16
Demux-channel circuit pack used with up to 16 transponders being switched
to up to 8-degrees. The optical source from each transponder can be switched
to any of the 8-Degree’s and amplified on board the CCMD8x16 circuit pack
before connecting to a WSS circuit pack. The main fixed EDFA module on
CCMD8x16 circuit pack supports up to four degrees (4xMux + 4xDemux). A
pluggable EDFA CCMD8x16 C-Band Expansion Module (also referred to as
CXM C-Band Type 1) can be equipped in-service in a sub-slot of the
CCDM8x16 circuit pack for an additional four degrees to support up to eight
degrees in total. The CCMD8x16 circuit pack comes with a CCDM8x16
sub-slot filler panel/cover (410-5819-001) which must only be removed when
a CXM is equipped in the sub-slot. The CXM C-Band Type 1 module comes
with an optical patchcord, MPO(F)-MPO(F), APC, SM, riser, bend insensitive,
12 Fiber, Tx-Rx, 0.35 meterNTTC97AXV6.

Figure 1-104 on page 1-292 and Figure 1-105 on page 1-293 show the
faceplate of a CCMD8x16 circuit pack and Figure 1-106 on page 1-294
provides a functional block diagram of the CCMD8x16 circuit pack.

Figure 1-107 on page 1-295 shows the faceplate of a CXM C-Band Type 1
module and Figure 1-108 on page 1-296 provides a functional block diagram
of the CXM C-Band Type 1 module.

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Figure 1-104
CCMD8x16 circuit pack faceplate (with sub-slot filler panel/cover (410-5819-001) in place, without
CXM C-Band Type 1)

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Common A port

Upgrade CXM port

LC connections to/from
transponders

Yellow uni-color circle (LOS)


- Used to communicate Rx Loss
of Signal
- Yellow = Rx Loss of Signal

Sub-slot filler panel/cover


(410-5819-001)

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Figure 1-105
CCMD8x16 circuit pack faceplate (with CXM C-Band Type 1 in place)

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off

Common A port

Upgrade CXM port

LC connections to/from
transponders

Yellow uni-color circle (LOS)


- Used to communicate Rx Loss
of Signal
- Yellow = Rx Loss of Signal

Pluggable EDFA array


(CXM C-Band Type 1; NTK576BA)

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Figure 1-106
CCMD8x16 circuit pack block diagram (NTK508HA)

Legend

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Figure 1-107
CXM C-Band Type 1 module faceplate

Upgrade CCMD port

Common B port

Red triangle (Fail)


- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off

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Figure 1-108
CXM C-Band Type 1 module block diagram (NTK576BA)

Legend

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Supported functionality
The CCMD8x16 circuit pack (NTK508HA) and CXM C-Band Type 1 modules
(NTK576BA) provide the following functionality:
• CCMD8x16 circuit pack provides
— one fixed-module erbium-doped fiber amplifier (EDFA) array having
four Mux + four Demux amplifiers
— one fixed module multicast switch having 32x8-by-1 switches and
16x16-by-1 passive splitters
— Upgrade (UPG CXM) and Common A ports bundle related optical
signals in 12-fiber MPO connectors with Cable Trace for fiber
management simplification
— total power monitoring at both the input and output of EDFA
— a common port A to connect to the FIM Type 1 or FIM Type 2
— an upgrade port to connect to the upgrade port of a CXM C-Band Type
1 module
— total power monitoring at both input and output of channel ports
See Table 1-75 on page 1-298 for function and connector type for each
port on a CCMD8x16 circuit pack.
• CXM C-Band Type 1 module provides
— one pluggable erbium-doped fiber amplifier (EDFA) array for providing
an extra four Mux + four Demux amplifiers to the host CCMD8x16
circuit pack
— two MPO connectors on the faceplate, one connects to the Multicast
Switch on the host CCMD8x16 circuit pack and the other connects to
the network
— total power taps on every fiber
— a common port B to connect to the FIM Type 1 or FIM Type 2
— an upgrade port to connect to the upgrade port of the host CCMD8x16
circuit pack
See Table 1-76 on page 1-299 for function and connector type for each
port on a CXM C-Band Type 1 module.

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Table 1-75
CCMD8x16 optical interfaces

Interface name Physical port # Function Connector type

UPG CXM 34 Port used for MPO cable connection to the 12-Fiber
upgrade CCMD port (UPG CCMD) of CXM MPO/APC Male
C-Band Type 1 module.
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

Common A 33 Port used for MPO cable connection to the 12-Fiber


FIM Type 1 or FIM Type 2 module. MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

Channel 1 In / Out 1/2 Optical input Mux/ output Demux to LC-UPC


Channel 2 In / Out 3/4 transponder Tx/Rx

Channel 3 In / Out 5/6


Channel 4 In / Out 7/8
Channel 5 In / Out 9 / 10
Channel 6 In / Out 11 / 12
Channel 7 In / Out 13 / 14
Channel 8 In / Out 15 / 16
Channel 9 In / Out 17 / 18
Channel 10 In / Out 19 / 20
Channel 11 In / Out 21 / 22
Channel 12 In / Out 23 / 24
Channel 13 In / Out 25 / 26
Channel 14 In / Out 27 / 28
Channel 15 In / Out 29 / 30
Channel 16 In / Out 31 / 32

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Table 1-76
CXM C-Band Type 1 optical interfaces

Interface name Physical port # Function Connector type

UPG CCMD 35 Port used for MPO cable connection to the 12-Fiber
upgrade CXM port (UPG CXM) of host MPO/APC Male
CCMD8x16 circuit pack.
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

Common B 36 Port used for MPO cable connection to the 12-Fiber


FIM Type 1 or FIM Type 2. MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

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Performance monitoring
The 6500 monitors and collects physical PMs for CCMD8x16 circuit pack and
CXM C-Band Type 1 module facilities. Table 1-77 provides a list of monitor
types supported on CCMD8x16 circuit packs and CXM C-Band Type 1
modules. Figure 1-109 on page 1-301 and Figure 1-110 on page 1-302 show
the CCMD8x16 circuit pack and CXM C-Band Type 1 module optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-77
Monitor types table for CCMD8x16 circuit packs and CXM C-Band Type 1
modules

Monitor Type Facility

OPTMON AMP
Note

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

Note: OPTMON facilities only apply to CCMD8x16 circuit packs.

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PMs collected at all PD locations
Facility: OPTMON port 1,3,5,7,...,25,27,29,31 1
3
Parameter: OPR-OTS* 5
Figure 1-109

Release 12.6
Facility: OPTMON port 2,4,6,8,...,26,28,30,32 7
9
Parameter: OPT-OTS* 11
Facility: AMP port 33 (sub-ports 3 to 10) 13
15
Parameter: OPIN-OTS* 17
19
Facility: AMP port 33 (sub-ports 3 to 10) 21
Parameter: OPOUT-OTS* CT 23
25
* AVG, MIN, and MAX measurements also provided. 27
29

6500 Packet-Optical Platform


31
PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD
MCS Switch
CT 2
4
6
8
10

Copyright© 2010-2019 Ciena® Corporation


12
14
16
18
20
22

Backplane
24
CCMD8x16 circuit pack optical monitoring points

26
28
30
32
PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD

UPG CXM MPO 34

Common A MPO 33

Inventory
CXM Pluggable Module
Power Processor
PD PD PD PD PD PD PD PD Supply Module
PD PD PD PD PD PD PD PD

Legend
CT Cable Trace MPO Multi-fiber Push On
CXM C-Band Expansion Module PD Photodiode
MCS Multi-Cast Switch UPG Upgrade Port

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Photonics Equipment
1-302 Photonics equipment description

Figure 1-110
CXM C-Band Type 1 module optical monitoring points

UPG CCMD MPO 35

PD PD PD PD PD PD PD PD
PD PD PD PD PD PD PD PD

Common B MPO 36

Inventory &
Control

PMs collected at all PD locations


Facility: AMP port 33,36 (sub-ports 3 to 10)
Parameter: OPIN-OTS*
Facility: AMP port 33,36 (sub-ports 3 to 10)
Parameter: OPOUT-OTS*
* AVG, MIN, and MAX measurements also provided.

Legend
CCMD Colorless Channel Mux/Demux PD Photodiode
MPO Multi-fiber Push On UPG Upgrade Port

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Intercard Suspected
• Internal Mgmt Comms Suspected

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• Cold Restart Required


• Provisioning Incompatible
• Database Not Recovered For Slot
• Circuit Pack Upgrade Failed

Pluggable alarms
• Circuit Pack Missing - Pluggable
• Circuit Pack Mismatch - Pluggable
• Circuit Pack Failed - Pluggable
• Autoprovisioning Mismatch - Pluggable
• Intercard Suspected - Pluggable
• Provisioning Incompatible - Pluggable

Photonic alarms
• Adjacency Far End Not Discovered
• Adjacency Mismatch
• Adjacency Provisioning Error
• High Fiber Loss
• Shutoff Threshold Crossed
• Input Loss of Signal
• Output Loss of Signal
• Loss of Signal
Common equipment alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to CCMD8x16 circuit packs:
• is a -slot interface.
• can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). CCMD8x16 circuit pack cannot be placed in slot 14 since
CCMD8x16 circuit pack is a -slot interface.
• can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
The CCMD8x16 circuit pack cannot be placed in slots 8, 18, 28, or 38
since the CCMD8x16 circuit pack is a -slot interface.
• can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). The CCMD8x16 circuit pack cannot be placed in slot 7 since
the CCMD8x16 circuit pack is a -slot interface.

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• can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf


(NTK503RA). The CCMD8x16 circuit pack cannot be placed in slot 8 since
the CCMD8x16 circuit pack is a -slot interface.
• cannot be equipped in the 2-slot shelf.
• all equipment that is part of an OTS must be located within the same
physical shelf.

The following restrictions on using a cross-connect circuit pack apply when


deploying a CCMD8x16 circuit pack:
• the CCMD8x16 circuit packs do not use any cross-connect capacity and
can be installed in shelves equipped with or without cross-connect circuit
packs
• In a 14-slot shelf type, when the CCMD8x16 circuit packs are installed in
slots 7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to13) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CCMD8x16 optical interface circuit pack and CXM
C-Band Type 1 expansion module.

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Table 1-78
Technical specifications for CCMD8x16 optical interface circuit pack and CXM C-Band Type 1
module

Parameter CCMD8x16 (NTK508HA) CXM C-Band Type 1 (NTK576BA)


Weight (estimated) 2.1 kg (4.7 lb) 0.5 kg (1.1 lb)
Dimension:
• Height: 141 mm / 5.55 in
• Width: 24 mm / 0.94 in.
• Depth: 211 mm / 8.31 in. for CXM
modules (NTK576BA)
Depth: 15 mm / 0.59 in. for subslot
filler panel/cover (410-5819-001)
included with the CCMD8x16 circuit
pack (NTK508HA)
Power consumption Typical (W): 34 (Note 1) Typical (W): 9 (Note 1)
Power Budget (W): 41 (Note 2 Power Budget (W): 13 (Note 2)
(Note 3)
Connector type 12-Fiber MPO/APC Male, LC 12-Fiber MPO/APC Male
Wavelength range (nm) 1528.77 to 1566.72 1528.77 to 1566.72
(96 channels capable) (96 channels capable)
Drop EDFA gain 18.5 dB to 21.5 dB (Note 4)
Drop EDFA design flat gain 18.5 dB to 21.5 dB
Drop EDFA gain ripple (Pk-Pk 1.0 dB
C-Band)
Drop EDFA total input power -18 dBm to 2.5 dBm (typical)
-26 dBm to -18 dBm (extended)
Drop EDFA total output power 0.5 dBm to 21 dBm
Drop EDFA noise figure Demux EDFA Gain = 20 dB to 12.8 dB, Pin = -18 dBm
(typical range) Demux EDFA Gain = 20 dB to 12.0 dB, Pin = 0 dBm
Add EDFA gain 13.5 dB to 16.5 dB (Note 4)
Add EDFA design flat gain 13.5 dB to 16.5 dB
Add EDFA gain ripple (Pk-Pk 1.0 dB
C-Band)
Add EDFA total input power -20 dBm to -0.5 dBm (typical)
-28 dBm to -20 dBm (extended)

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Table 1-78
Technical specifications for CCMD8x16 optical interface circuit pack and CXM C-Band Type 1
module

Parameter CCMD8x16 (NTK508HA) CXM C-Band Type 1 (NTK576BA)


Add EDFA total output power -5 dBm to 13 dBm
Add EDFA noise figure Mux EDFA Gain = 15 dB to 6.8 dB, Pin = -20 dBm
Mux EDFA Gain = 15 dB to 6.0 dB, Pin = -1 dBm
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the right-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
entire power budget (including the power budget any equipped CXM) to the zone associated with the
left-most slot when computing the “Calculated shelf zone power” parameter even if the right-most slot
occupied by the circuit pack is in a different power zone.
Note 4: Although the CCMD8x16 circuit pack can support different gains, the circuit pack is intended
to be operated at the design flat gain of 15 dB in Mux direction and 20 dB in Demux direction.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Optical multiplexers (OMX) modules (NT0H32xxE5)


Overview
The optical multiplexer (OMX) can be used with the 6500 shelves and is a
stand-alone unit.
• can be equipped with the 14-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the OMX modules are passive modules and therefore do not require DC
power.
• although the OMX module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMX module's
RJ45 port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OMX module's RJ45 port to
the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMX module's RJ45 port to the NTK505PAE5 access
panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMX module's
RJ45 port to the NTK555NA or NTK555NB external slot ports).

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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and


NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OMX module's RJ45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMX module's RJ45 port to the access panel external
slot ports).
• the OMX module must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
OMX module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly).

The following table shows the supported circuit packs and pluggables that can
be used with OMX.

Table 1-79
Supported circuit packs and pluggables working with OMX

Circuit pack or pluggable PEC Alarm


correlation

OC-192/STM-64 DWDM circuit pack NTK526xxE5 OTM1


NTK527xxE5

Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503MAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (DC-powered)

Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503NAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (AC-powered)

OTN FLEX MOTR circuit pack NTK532BAE5 OTM1

2.5G MOTR circuit pack NTK530NAE5 OTM2

NTK530NCE5 OTM2
OTM1

2x10G OTR circuit pack NTK530PGE5 OTM2


NTK530PME5

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Table 1-79
Supported circuit packs and pluggables working with OMX

Circuit pack or pluggable PEC Alarm


correlation

4x10G OTR circuit packs NTK530QA OTM2


NTK530QE
NTK530QM

SuperMux with XFP circuit pack NTK535FAE5 OTM2

L2 MOTR circuit pack NTK531VAE5 OTM2

40G OCLD circuit packs NTK539PxE5 OTM3 (Note


1)
Wavelength-Selective 40G OCLD circuit pack NTK539RxE5

100G OCLD circuit packs NTK539TxE5 OTM4 (Note


2)
100G WL3/WL3e OCLD circuit packs NTK539Ux

Flex2 WL3/WL3e OCLD circuit packs NTK539Bx

Flex3 WL3e OCLD circuit packs NTK539Qx

Flex4 WL3e OCLD circuit packs NTK539Fx

100G WL3e OTR NTK538Ux

100G WL3n MOTR NTK538Bx

DWDM XFP modules (when equipped in the circuit packs listed above NTK588xxE5 N/A
provided the circuit pack supports the pluggable) NTK587xxE5
NTK583AAE5
NTK589xxE5

DWDM SFP modules (when equipped in the circuit packs listed above NTK585xxE5 N/A
provided the circuit pack supports the pluggable) NTK586xxE5

DWDM DPO modules NTK580xxE5 N/A

Note 1: The client circuit pack that mates with 40G OCLD circuit pack can be 40G MUX OCI, 40G OCI,
or 40/43G OCI circuit pack.
Note 2: The client circuit pack that mates with 100G OCLD, 100G WL3 OCLD, Flex4 WL3e OCLD,
Flex3 WL3e OCLD, or Flex2 WL3/WL3e OCLD circuit pack can be 10x10G MUX or 100G OCI circuit
pack.

The 6500 supports two types of DWDM OMX:


• OMX 4CH DWDM
• OMX 16CH DWDM

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OMX 4CH DWDM


The OMX 4CH DWDM multiplexes and demultiplexes up to four optical
channels in one band.

Each OMX 4CH DWDM is a 1U high external drawer that contains optical
filters, a small patch panel with bulkhead connectors, and fiber management
components. The drawers can be mounted anywhere in a rack (see
“Configuration rules” section in Planning - Ordering Information,
323-1851-151). Each OMX 4CH DWDM uses bulkhead connectors and patch
cords to connect circuit packs. The OMX has locking latches to prevent trays
from being pulled out completely.

The following variants of the OMX 4CH DWDM are available:


• 200 GHz
— Standard OMX 4CH DWDM (NT0H32xE)
— OMX 4CH DWDM Enhanced (NT0H32xF) - provides higher isolation
and lower insertion loss
Note 1: 200 GHz C-band 4-CH OMX PECs are available for Bands 1, 2,
3 and 4. 200 GHz L-band 4-CH OMX PECs are available for Bands 5, 6,
7 and 8.
Note 2: The standard 4CH OMX modules (NT0H32xE) have been
manufacture discontinued and are no longer available. You must use the
enhanced variant (NT0H32xF). For replacement information, see
Planning - Ordering Information, 323-1851-151.
• 100 GHz
— OMX 4CH DWDM, odd (NT0H32xG)
— OMX 4CH DWDM, even (NT0H32xH)

The OMX 4CH DWDM assembly (NT0H32xE, NT0H32xF, NT0H32xG, and


NT0H32xH) has one filter module. The filter module adds and drops four
specific ITU DWDM channels and optically passes through all other ITU
DWDM channels supported by 6500 Packet-Optical Platform. See Planning -
Ordering Information, 323-1851-151 for different ordering codes.

Figure 1-111 on page 1-311 shows the OMX 4CH DWDM with the tray open.
The following figures show the block diagrams of OMX 4CH DWDM
equipment:
• Figure 1-112 on page 1-312
• Figure 1-113 on page 1-313
• Figure 1-114 on page 1-314

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Figure 1-111
OMX 4CH DWDM equipment drawer

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Figure 1-112
OMX 4CH DWDM equipment block diagram (NT0H32xF)

11 THRU In

Band ADF
OTS Out 2

12 THRU Out

Band ADF
OTS In 1

Equipment
Channel MUX Channel DEMUX Inventory inventory
(RJ-45)

Ch. Ch. Ch. Ch. Ch. Ch. Ch. Ch.


1 2 3 4 1 2 3 4
In In In In Out Out Out Out

3 5 7 9 4 6 8 10

Legend
ADF Add/Drop filter
OTS Optical trunk switch

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Figure 1-113
OMX 4CH DWDM equipment block diagram (100 GHz Odd; NT0H32xG)

11 THRU In

Band ADF
OTS Out 2

12 THRU Out

Band ADF
OTS In 1

Band Drop/Rx
Band Add/Tx

Equipment
Channel MUX/DEMUX Inventory inventory
(RJ-45)

Ch. 7 Ch. 3 Ch. 5 Ch. 1

9 10 5 6 7 8 3 4

Legend
ADF Add/Drop filter
OTS Optical trunk switch

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Figure 1-114
OMX 4CH DWDM equipment block diagram (100 GHz Even; NT0H32xH)

11 THRU In

Band ADF
OTS Out 2

12 THRU Out

Band ADF
OTS In 1

Band Add/Tx
Band Add/Tx

Equipment
Channel MUX/DEMUX Inventory inventory
(RJ-45)

Ch. 8 Ch. 2 Ch. 6 Ch. 4

9 10 3 4 7 8 5 6

Legend
ADF Add/Drop filter
OTS Optical trunk switch

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OMX 4CH DWDM features


All variants of OMX 4CH DWDM have the following common features.
• Each OMX multiplexes and demultiplexes four channels.
• An OMX can add and drop up to four optical channels in a band.
• An OMX cannot add or drop optical channels that are outside the band
assigned to it. It also cannot bypass optical channels within the band
assigned to it.
• An OMX can pass through all channels that are not in band.
• The band add-drop filters (ADF) add and drop one wavelength band and
allows the other bands to pass through the filters. The channel multiplexer
and demultiplexer add and drop the optical channels, respectively.

The distinguishing features of the OMX 4CH DWDM 100 GHz are as follows:
• The Optical Multiplexer 4CH (OMX 4CH) multiplexes and demultiplexes up
to four channels to support 32 channels in the C-band.
• The physical design of the OMX 4CH DWDM 100 GHz module is the same
as the original OMX 4CH DWDM Enhanced variants.
• The OMX 4CH 100 GHz supports 32 channels in the C-band.
• The filter module adds and drops four specific ITU DWDM channels and
optically passes through all other ITU DWDM channels supported by 6500
Packet-Optical Platform.
• The OMX 4CH 100 GHz modules are supported in linear and ring
systems. These passive OADM modules provide add, drop and
passthrough capabilities which allow support of hubbed, dual-hubbed,
and meshed traffic, in addition to point-to-point traffic.
• 100 GHz Bands and 200 GHz Bands can be deployed using both the older
and newer OMXs on the same unamplified optical layer. However, if a
band is designated as 100 GHz, all OMX modules on that band must be
an OMX 4CH DWDM 100 GHz module.
• The OMX 4CH modules use SC connectors for installing fiber-optic patch
cords.
• offers 32 channels Mux/Demux at 100 GHz grid listed in Table 1-80 on
page 1-316

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Table 1-80
OMX 4CH 100 GHz ITU grid 32 wavelength plan

Port name Port# B/C Wavelength 100 GHz (nm) B/C Wavelength 100 GHz (nm)

In Out

OTS 1 2

Thru 11 12

NT0H32AGE5 NT0H32AHE5

Band 1 Odd Band 1 Even

Ch-1 3 4 B1C1 1528.77 B1C2 1533.47

Ch-2 5 6 B1C3 1530.33 B1C4 1531.90

Ch-3 7 8 B1C5 1529.55 B1C6 1532.68

Ch-4 9 10 B1C7 1531.12 B1C8 1534.25

NT0H32BGE5 NT0H32BHE5

Band 2 Odd Band 2 Even

Ch-1 3 4 B2C1 1538.19 B2C2 1542.94

Ch-2 5 6 B2C3 1539.77 B2C4 1541.35

Ch-3 7 8 B2C5 1538.98 B2C6 1542.14

Ch-4 9 10 B2C7 1540.56 B2C8 1543.73

NT0H32CGE5 NT0H32CHE5

Band 3 Odd Band 3 Even

Ch-1 3 4 B3C1 1547.72 B3C2 1552.52

Ch-2 5 6 B3C3 1549.32 B3C4 1550.92

Ch-3 7 8 B3C5 1548.51 B3C6 1551.72

Ch-4 9 10 B3C7 1550.12 B3C8 1553.33

NT0H32DGE5 NT0H32DHE5

Band 4 Odd Band 4 Even

Ch-1 3 4 B4C1 1557.36 B4C2 1562.23

Ch-2 5 6 B4C3 1558.98 B4C4 1560.61

Ch-3 7 8 B4C5 1558.17 B4C6 1561.42

Ch-4 9 10 B4C7 1559.79 B4C8 1563.05

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• offers 32 channels Mux/Demux at 200 GHz grid listed in Table 1-81


Table 1-81
OMX 4CH 200 GHz ITU grid 32 wavelength plan

Port name Port# B/C Wavelength 200 GHz (nm) B/C Wavelength 200 GHz (nm)

In Out

OTS 1 2

Thru 11 12

NT0H32AFE5 NT0H32BFE5

Band 1 Band 2

Ch-1 3 4 B1C1 1528.77 B2C1 1538.19

Ch-2 5 6 B1C2 1533.47 B2C2 1542.94

Ch-3 7 8 B1C3 1530.33 B2C3 1539.77

Ch-4 9 10 B1C4 1531.90 B2C4 1541.35

NT0H32CFE5 NT0H32DFE5

Band 3 Band 4

Ch-1 3 4 B3C1 1547.72 B4C1 1557.36

Ch-2 5 6 B3C2 1552.52 B4C2 1562.23

Ch-3 7 8 B3C3 1549.32 B4C3 1558.98

Ch-4 9 10 B3C4 1550.92 B4C4 1560.61

NT0H32EFE5 NT0H32FFE5

Band 5 Band 6

Ch-1 3 4 B5C1 1570.42 B6C1 1580.35

Ch-2 5 6 B5C2 1575.37 B6C2 1585.36

Ch-3 7 8 B5C3 1572.06 B6C3 1582.02

Ch-4 9 10 B5C4 1573.71 B6C4 1583.69

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Table 1-81
OMX 4CH 200 GHz ITU grid 32 wavelength plan

Port name Port# B/C Wavelength 200 GHz (nm) B/C Wavelength 200 GHz (nm)

NT0H32GFE5 NT0H32HFE5

Band 7 Band 8

Ch-1 3 4 B7C1 1590.41 B8C1 1600.60

Ch-2 5 6 B7C2 1595.49 B8C2 1605.74

Ch-3 7 8 B7C3 1592.10 B8C3 1602.31

Ch-4 9 10 B7C4 1593.79 B8C4 1604.03

OMX 16CH DWDM


The OMX 16CH DWDM multiplexes and demultiplexes up to 16 optical
channels. Each OMX 16CH DWDM is a 2U high passive shelf that can be
mounted anywhere in a rack. The OMX 16CH DWDM module minimizes
overall insertion loss for 32-wavelength DWDM applications while maximizing
the reach of unamplified point-to-point systems. The OMX 16CH DWDM
module also reduces footprint requirements at terminal sites.

The following variants of the OMX 16CH DWDM are available:


• standard 200 GHz OMX 16CH DWDM (NT0H32JA and NT0H32KA)
The OMX 16CH DWDM 200 GHz is a stand-alone unit that multiplexes
and demultiplexes up to 16 channels. Two variants are available: C-band
for DWDM bands 1, 2, 3, and 4, and L-band for DWDM bands 5, 6, 7, and
8.
• 100 GHz OMX 16CH DWDM (NT0H32JB and NT0H32JC)
The OMX 16CH DWDM 100 GHz is a stand-alone unit that multiplexes
and demultiplexes up to 16 channels. Two C-band variants are available:
band 1 and 2, band 3 and 4.

The following figures show the block diagrams of OMX 16CH DWDM
equipment:
• Figure 1-115 on page 1-319
• Figure 1-116 on page 1-320
• Figure 1-117 on page 1-321
• Figure 1-118 on page 1-322

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Figure 1-115
OMX 16CH DWDM equipment block diagram (C-band; NT0H32JA)

C/L Band
C/L Band

filter
filter
1 OTS In OTS Out 2

L-band L-band
Upgrade 35
36 Upgrade
Out In

Equipment
Inventory inventory
(RJ-45)

Drop filter Add filter

Band 1 Band 2 Band 3 Band 4 Band 1 Band 2 Band 3 Band 4


4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33

Legend

OTS Optical trunk switch

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Figure 1-116
OMX 16CH DWDM equipment block diagram (L-band; NT0H32KA)

1 OTS In
OTS Out 2

Equipment
Inventory inventory
(RJ-45)

Drop filter Add filter

Band 1 Band 2 Band 3 Band 4 Band 1 Band 2 Band 3 Band 4


4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33

Legend

OTS Optical trunk switch

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Figure 1-117
OMX 16CH DWDM equipment block diagram (100 GHz Band 1 and 2; NT0H32JB)

Band 1 & 2
Add filter
Band 1 & 2
Drop filter
1 OTS In OTS Out 2

C-band (3-4)/
C-band (3-4)/ L-band (5-8)/ 35
36 L-band (5-8)/ Thru In
Thru Out

Equipment
Inventory inventory
(RJ-45)

Drop filter Add filter

Band 1 Band 2 Band 1 Band 2


4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33

Legend

OTS Optical trunk switch

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Figure 1-118
OMX 16CH DWDM equipment block diagram (100 GHz Band 3 and 4; NT0H32JC)

Band 3 & 4
Add filter
Band 3 & 4
Drop filter
1 OTS In OTS Out 2

C-band (1-2)/
C-band (1-2)/ L-band (5-8)/ 35
36 L-band (5-8)/ Thru In
Thru Out

Equipment
Inventory inventory
(RJ-45)

Drop filter Add filter

Band 3 Band 4 Band 3 Band 4


4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33

Legend

OTS Optical trunk switch

OMX 16CH DWDM features


The distinguishing features of the OMX 16CH DWDM are as follows:
• The physical design of the OMX 16CH DWDM minimizes the module size
through the use of slider adapter on the faceplate. Each slider adapter
contains either two dual LC adapters or two single SC adapters.
Note: By using the slider adapter, you can clean back-side fibers without
the need for sliding drawers or fiber patch cord blocks inside the chassis.
The slider adapters increase connector density on the faceplate and
reduce the risk of accidental fiber pinching.

• The OMX 16CH DWDM module permits in-service channel addition and
removal without the need to disable line-side traffic. If you plan to fully fill
your 6500 DWDM system with 32 channels, you must deploy the OMX
16CH DWDM C-band module prior to adding the L-band module.

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• The C-band OMX 16CH DWDM 200 GHz has a total of 36 optical ports:
— 16 channel add and drop ports (32 LC-LC ports)
— OTS IN and OTS OUT ports (2 SC-SC ports)
— L-band OUT and L-band IN upgrade ports (2 SC-SC ports)
Note: The L-band upgrade ports on the C-band OMX 16CH DWDM
module eliminate the need for C and L splitter/coupler trays.

• The L-band OMX 16CH DWDM 200 GHz has a total of 34 optical ports:
— 16 channel add and drop ports (32 LC-LC ports)
— OTS IN and OTS OUT ports (2 SC-SC ports)
Note 1: Direct padding on the LC-LC slider adapters is supported using
LC-LC attenuators. You must place LC-LC attenuators in the OMX 16CH
DWDM between the slider adapters and the internal fibers. You cannot
place the LC-LC attenuators between the slider adapters and the client
fibers. Direct padding using SC-SC attenuators is not supported on the
OMX 16CH DWDM.
Note 2: Fiber management is not provided in the OMX 16CH DWDM
chassis. The Fiber Manager tray (NT0H57BB) can be used for fiber
management, if required.

The distinguishing features of the OMX 16CH DWDM 100 GHz are as follows:
• The OMX 16CH DWDM 100 GHz supports 32 channels in the C-band.
• The physical design of the OMX 16CH DWDM 100 GHz module is the
same as the 200 GHz variants (NT0H32JA and NT0H32KA).
• The C/L splitter and coupler components are integrated into the C-band
OMX 16CH DWDM 100 GHz module. The C and L splitter/coupler inside
the C-band OMX 16CH DWDM 100 GHz module does not support any
faceplate accessible monitoring taps and has a lower isolation in order to
reduce the insertion loss. Direct optical monitoring of the line-side fibers
(OTS IN and OTS OUT) is supported with the OSC Splitter/Coupler.
• The OMX 16CH DWDM 100 GHz supports THRU IN and THRU OUT
functions.
• The OMX 16CH DWDM 100 GHz C-band has a Thru In port and a Thru
Out port, eliminating the need for C and L splitter/coupler trays. These
Thru ports support L-band signals as well as the other C-band signals
(OMX 16CH DWDM 100 GHz Band 1 and Band 2 supports Band 3,
Band 4, and L-band signals on Thru ports. OMX 16CH DWDM 100 GHz
Band 3 and Band 4 supports Band 1, Band 2, and L-band signals on Thru
ports). The OMX 16CH DWDM 100 GHz also supports optical Pass-Thru.

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• Like the 200 GHz variants, the OMX 16CH DWDM 100 GHz module is
typically deployed at terminal sites in point-to-point networks or at the hub
of a ring network. In unamplified networks, the OMX 16CH DWDM 100
GHz module permits in-service channel addition and removal without the
need to disable line-side traffic.
• To fully fill 6500 systems with 32 channels, it is possible to deploy either
100 GHz bands (C-band only) or 200 GHz bands (C-band and L-band). It
is also possible to deploy both 100 GHz bands using the newer OMXs in
the C-band and 200 GHz bands using the older OMXs in L-band on the
same optical layer bringing the total number of channels in the system to
48 channels. For the OMX 16CH DWDM 100 GHz, if a band is designated
as 100 GHz, then this band together with its adjacent band (band 1 is
adjacent to band 2 and band 3 is adjacent to band 4 due to hardware) will
also be designated as a 100 GHz band.
• 100 GHz Bands and 200 GHz Bands can be deployed using both the older
and newer OMXs on the same unamplified optical layer. However, if a
band is designated as 100 GHz, all OMX modules on that band must be
an OMX 16CH DWDM 100 GHz module.

• The OMX 16CH DWDM 100 GHz module permits in-service channel
addition and removal without the need to disable line-side traffic. If you
plan to fully fill your 6500 DWDM system with 48 channels, you must
deploy the OMX 16CH DWDM 100 GHz C-band module prior to adding
the L-band module.

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• offers 32 channels Mux/Demux at 100 GHz grid listed below


Table 1-82
OMX 4CH 100 GHz ITU grid 32 wavelength plan

Port name Port# B/C Wavelength 100 GHz (nm) B/C Wavelength 100 GHz (nm)
for Band 1 and Band 2 of for Band 3 and Band 4 of
NT0H32JBE5 NT0H32JCE5

In Out

OTS 1 2

Thru 35 36

Ch-1 3 4 B1C1 1528.77 B3C1 1547.72

Ch-2 5 6 B1C2 1533.47 B3C2 1552.52

Ch-3 7 8 B1C3 1530.33 B3C3 1549.32

Ch-4 9 10 B1C4 1531.90 B3C4 1550.92

Ch-5 11 12 B1C5 1529.55 B3C5 1548.52

Ch-6 13 14 B1C6 1532.68 B3C6 1551.72

Ch-7 15 16 B1C7 1531.12 B3C7 1550.12

Ch-8 17 18 B1C8 1534.25 B3C8 1553.33

Ch-9 19 20 B2C1 1538.19 B4C1 1557.36

Ch-10 21 22 B2C2 1542.94 B4C2 1562.23

Ch-11 23 24 B2C3 1539.77 B4C3 1558.98

Ch-12 25 26 B2C4 1541.35 B4C4 1560.61

Ch-13 27 28 B2C5 1538.98 B4C5 1558.17

Ch-14 29 30 B2C6 1542.14 B4C6 1561.42

Ch-15 31 32 B2C7 1540.56 B4C7 1559.79

Ch-16 33 34 B2C8 1543.73 B4C8 1563.05

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• offers 32 channels Mux/Demux at 200 GHz grid listed below


Table 1-83
OMX 4CH 200 GHz ITU grid 32 wavelength plan

Port name Port# B/C Wavelength 200 GHz (nm) B/C Wavelength 200 GHz (nm)
for C-band of for L-band of
NT0H32JAE5 NT0H32KAE5

In Out

OTS 1 2

Thru 35 36

Ch-1 3 4 B1C1 1528.77 B5C1 1570.42

Ch-2 5 6 B1C2 1533.47 B5C2 1575.37

Ch-3 7 8 B1C3 1530.33 B5C3 1572.06

Ch-4 9 10 B1C4 1531.90 B5C4 1573.71

Ch-5 11 12 B2C1 1538.19 B6C1 1580.35

Ch-6 13 14 B2C2 1542.94 B6C2 1585.36

Ch-7 15 16 B2C3 1539.77 B6C3 1582.02

Ch-8 17 18 B2C4 1541.35 B6C4 1583.69

Ch-9 19 20 B3C1 1547.72 B7C1 1590.41

Ch-10 21 22 B3C2 1552.52 B7C2 1595.49

Ch-11 23 24 B3C3 1549.32 B7C3 1592.10

Ch-12 25 26 B3C4 1550.92 B7C4 1593.79

Ch-13 27 28 B4C1 1557.36 B8C1 1600.60

Ch-14 29 30 B4C2 1562.23 B8C2 1605.74

Ch-15 31 32 B4C3 1558.98 B8C3 1602.31

Ch-16 33 34 B4C4 1560.61 B8C4 1604.03

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Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Photonic alarms
• Duplicate Adjacency Discovered
• Group Loss of Signal
• Loss of Signal

Equipping rules
The OMX is external equipment.

Technical specifications
The following table lists the physical specifications for OMX.

Table 1-84
Physical specifications for OMX

Equipment Physical Notes Power


specification
Typical (W) Power
Budget (W)
OMX 4CH DWDM modules
Height 1U (43 mm / 1.70 in.) The width specified is with the 0 0
mounting brackets installed.
Width 443.0 mm / 17.44 in.
Depth 279.0 mm / 11 in.
OMX 16CH DWDM modules
Height 2U (88.0 mm / 3.48 The width specified is with the 0 0
in.) mounting brackets installed.
Width 448.8 mm / 17.67 in. 448.8 mm / 17.67 in. with a
437.1 mm /17.21 in. setback from front to mounting
flange equal to 35.6 mm (1.4 in.),
Depth 279.0 mm / 11 in. 127 mm (5.0 in.), or 152.4 mm
(6.0 in.).
437.1 mm / 17.21 in. with a
setback from front to mounting
flange equal to 165.1 mm (6.5
in.).

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The following table lists the optical specifications for the OMX 4CH modules.
Table 1-85
OMX 4CH DWDM specifications
Characteristic Value or range

4 CH + Fiber Manager 4 CH Enhanced 4CH 100 GHz

Maximum total input 17 dBm 17 dBm 24 dBm


power

Minimum return loss 40 dB 45 dB 45 dB

Passband Center wavelength ± 0.25 nm (see Table 1-87) Center wavelength ±


0.1 nm (see
Table 1-88)

Minimum band isolation

Drop 20 dB 35 dB 25 dB

Thru Out 12 dB 20 dB 14 dB

Insertion loss Maximum Typical Maximum Typical Maximum Typical

Add path 4.5 dB 3.2 dB 2.8 dB 2.1 dB 3.3 dB 2.1 dB

Drop path 4.9 dB 3.5 dB 3.1 dB 2.4 dB 3.6 dB 2.4 dB

Pass-through 1.2 dB 0.7 dB 1.0 dB 0.7 dB 1.1 dB 0.7 dB

Note: For single-shelf OADM sites with a standard OMX (where the THRU OUT is wired to the
THRU IN of the same OMX), one connector is saved between the two band filters. Because the
values in this table include the most common connector losses (typical is 0.2 dB, worst case is 0.3
dB), you must subtract the value of one connector from the table values. For example, the typical
OMX pass-through losses for a single-shelf OADM site are:
0.7 dB x 2 (standard pass-through losses, including connectors) – 0.2 dB (one less connector) =
1.2 dB (total OMX pass-through losses).
This rule does not apply to single-shelf sites with the OMX + Fiber Manager 4CH or OMX 4CH
Enhanced.

The following table lists the optical specifications for the OMX 16CH modules.

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Table 1-86
OMX 16CH DWDM specifications
Value or range
Characteristic
OMX 16CH DWDM OMX 16CH DWDM OMX 16CH DWDM
C-band L-band 100 GHz C-band

Maximum total input power 21 dBm 21 dBm 24 dBm

Minimum return loss 40 dB 40 dB 40 dB

Passband Center wavelength Center wavelength Center wavelength


± 0.25 nm ± 0.25 nm ± 0.1 nm
(see Table 1-87) (see Table 1-87) (see Table 1-88)

Minimum Channel Add 30 dB 30 dB 25 dB


isolation and Drop

THRU In and Out 18 dB 18 dB 15 dB

Insertion Maximum Typical Maximum Typical Maximum Typical


loss
Add path 4.5 dB 3.9 dB 4.1 dB 3.5 dB 5.1 dB 3.6 dB

Drop path 4.5 dB 3.9 dB 4.1 dB 3.5 dB 5.1 dB 3.5 dB

L-band upgrade: 1.1 dB 0.8 dB Not Not Not Not


OTS IN to L OUT applicable applicable applicable applicable
L IN to OTS OUT

Pass-THRU Not Not Not Not 1.2 dB 0.8 dB


applicable applicable applicable applicable

Add and Drop 6.9 dB 5.7 dB 6.0 dB 5.0 dB 7.8 dB 5.7 dB


(16 channel
C-band or
L-band only,
end-to-end)

Add and Drop Not Not Not Not 10.2 dB 6.8 dB


(32 channel applicable applicable applicable applicable
C-band only,
end-to-end)

Add and Drop 6.9 dB 5.7 dB 8.2 dB 6.6 dB 8.5 dB 6.4 dB


(32 channel [16
channel C-band
and 16 channel
L-band],
end-to-end)

Add and Drop Not Not Not Not 10.9 dB 7.8 dB


(48 channel, applicable applicable applicable applicable
end-to-end)

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Center wavelength frequencies


The following table lists the DWDM-6500 200 GHz center wavelengths.

Table 1-87
ITU-T DWDM grid wavelengths for 200 GHz OMXs used on 6500

OMX Band Center wavelength

Channel 1 Channel 2 Channel 3 Channel 4

C-band 1 1528.77 nm 1533.47 nm 1530.33 nm 1531.90 nm

2 1538.19 nm 1542.94 nm 1539.77 nm 1541.35 nm

3 1547.72 nm 1552.52 nm 1549.32 nm 1550.92 nm

4 1557.36 nm 1562.23 nm 1558.98 nm 1560.61 nm

L-band 5 1570.42 nm 1575.37 nm 1572.06 nm 1573.71 nm

6 1580.35 nm 1585.36 nm 1582.02 nm 1583.69 nm

7 1590.41 nm 1595.49 nm 1592.10 nm 1593.79 nm

8 1600.60 nm 1605.73 nm 1602.31 nm 1604.03 nm

The following table lists the DWDM-6500 100 GHz center wavelengths of each
band and channel in a 6500 DWDM system.

Table 1-88
ITU-T DWDM grid wavelengths for 100 GHz OMXs used on 6500

OMX Center wavelength (nm)


Band
Channel Channel Channel Channel Channel Channel Channel Channel
1 2 3 4 5 6 7 8

C-band 1 1528.77 1533.47 1530.33 1531.90 1529.55 1532.68 1531.12 1534.25

2 1538.19 1542.94 1539.77 1541.35 1538.98 1542.14 1540.56 1543.73

3 1547.72 1552.52 1549.32 1550.92 1548.51 1551.72 1550.12 1553.33

4 1557.36 1562.23 1558.98 1560.61 1558.17 1561.42 1559.79 1563.05

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OMX engineering rules


DWDM circuit packs, DWDM XFP, SFP, and DPO modules must be used with
a specific OMX module. See Planning - Ordering Information, 323-1851-151
(Circuit packs, modules, pluggable modules, and interface hardware) for
wavelengths, band, and channel number details.

The OMX module is a passive optical multiplexer and does not regenerate or
amplify signals. Optical reach between 6500 shelves is dependent on the
number of intermediate OMX modules. DWDM OMX modules introduce some
signal loss when a wavelength is added or dropped, and cascaded OMX
modules of different DWDM bands introduce pass-through signal loss.

Optical link budgets


Link budgets are specified for typical conditions and apply to all optical fiber
types (NDSF). Repair margin or connector losses at a fiber distribution frame
are not included and should be allocated as required. The recommended
repair margin is 10% of the total fiber plant loss for each site-to-site fiber span.

Link budgets are accurate for operating temperatures between 0oC and 40oC
(32oF to 104oF).

The link budgets for unamplified networks are based on power calculations for
each band.

The optical link budget specifies the typical loss supported for a connection
between the point where it originates and the point where it terminates. The
link budgets are calculated by adding the loss for each individual fiber sections
between the two ends of a connection. The loss must be calculated for each
band because the various bands are subject to different attenuation
depending on the path and the number of network elements that it passes
through.

The link budgets listed are based on NDSF optical fiber.

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Calculating the link budget - OMX 4CH


Link budgets are calculated for every band for both directions, from each shelf
on a particular band in a site to an adjacent site that contains a shelf with the
same band.

To calculate the link budget, you must determine the number and type of
OMXs that any one band must pass through to establish its connection.

See Figure 1-119 on page 1-333 for loss for one band in an add/drop
configuration. See Table 1-89 for loss details for this configuration.

Table 1-89
Loss summary—OMX 4CH

Parameter Loss (dB)

Add loss 3.2 dB typical (standard OMX)


(Note 1) 2.1 dB typical (enhanced OMX)
2.1 dB typical (100 GHz OMX)

Drop loss 3.5 dB typical (standard OMX)


(Note 1) 2.4 dB typical (enhanced OMX)
2.4 dB typical (100 GHz OMX)

Connector loss 0.3 dB


(Note 1)

Pass-through loss 1.2 dB typical (standard OMX)


(Note 1) 1.0 dB typical (enhanced OMX)
1.1 dB typical (100 GHz OMX)

Seam add/drop values 0.5 dB for each band

Fiber loss Fiber loss with additional 0.5 dB for connectors/splice


(Note 1) or other interconnection loss

Transmit power +2.6 dBm to +4.2 dBm (OC-192/STM-64 DWDM)


(Note 2) +2.6 dBm to +4.2 dBm (OC-48/STM-16 DPO DWDM)
0.0 dBm to +4.0 dBm (OC-48/STM-16 SFP DWDM)

Receiver sensitivity -23 dBm (OC-192/STM-64 DWDM)


(includes path penalty) -26 dBm (OC-48/STM-16 DPO DWDM)
(Note 2)
-26 dBm (OC-48/STM-16 SFP DWDM)

Note 1: All loss figures quoted include connector losses.


Note 2: These are typical values for the mentioned circuit packs. However, refer
to Part 3 of 6500 Planning, NTRN10EY (Technical specifications) to find out
exact values for each circuit pack.

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For receive powers greater than -8 dBm (OC-192/STM-64 DWDM), -9 dBm


(OC-48/STM-16 DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM),
there must be sufficient attenuation in the fiber path so that the overload
requirement of -8 dBm (OC-192/STM-64 DWDM), -9 dBm (OC-48/STM-16
DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM) is not exceeded.

Note: These are typical values for the mentioned circuit packs. However,
refer to Part 3 of 6500 Planning, NTRN10EY (Technical specifications) to
find out exact values for each circuit pack.

Figure 1-119
Optical loss in an add/drop configuration

Drop OMX Add OMX

Pass-through
loss 1.4 dB

Band 1-4 in Bands 2-4 through Band 1-4 through

Drop loss Add loss


3.5 dB (Std) 3.2 dB (Std)
2.4 dB (Enh) 2.1 dB (Enh)
2.4 dB (100 GHz) 2.1 dB (100 GHz)
Patch panel Patch panel
Patch loss Patch loss
0.4 dB 0.4 dB
Band 1 drop Band 1 add

Link budgets for a hubbed-ring OMX 4CH only configuration


To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a three band unamplified hubbed-ring
configuration shown in Figure 1-120 on page 1-334, the losses in the OMXs
for band 1 in the east-bound and west-bound directions are as follows:

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Figure 1-120
Physical connections in a hubbed-ring configuration—OMX 4CH only

Terminal site A

OMX OMX OMX


1 2 3

OADM site B
OADM site C
OMX
1
OMX
3
OMX
2

The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
• East-bound
— Losses at Terminal Site A
– Add losses: 1 x 3.2 dB (Std) or 1 x 2.1 dB (Enh or 100 GHz OMX)
– Pass-through losses: 2 x 0.7 dB (as band 1 passes through the
filters of OMX for band 2 and 3)
– Patch losses: 0.4 dB
– Total: 5 dB (Std) or 3.9 dB (Enh or 100 GHz OMX)
— Losses at OADM Site B
– Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh or 100 GHz OMX)
– Patch losses: 0.4 dB
– Total: 3.9 dB (Std) or 2.8 dB (Enh or 100 GHz OMX)
— Total for band 1 east-bound: 8.9 dB (Std) or 6.7 dB (Enh or 100 GHz
OMX)
• West-bound
— Losses at Terminal Site A
– Add losses: 1 x 3.2 dB (Std) or 1 x 2.1 dB (Enh or 100 GHz OMX)
– Pass-through losses: 0 dB (as band 1 does not pass through the
filters of OMX for band 2 and 3)
– Patch losses: 0.4 dB
– Total: 3.6 dB (Std) or 2.5 dB (Enh or 100 GHz OMX)

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— Losses at OADM Site C


– Pass-through losses: 2 x 0.7 dB
– Total: 1.4 dB (Std) or 1.4 dB (Enh or 100 GHz OMX)
— Losses at OADM Site B
– Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh or 100 GHz OMX)
– Pass-through losses: 1 x 0.7 dB
– Patch losses: 0.4 dB
– Total: 4.6 dB (Std) or 3.5 dB (Enh or 100 GHz OMX)
— Total for band 1 west-bound: 9.6 dB (Std) or 7.4 dB (Enh or 100 GHz
OMX)

You must also calculate the OMX losses the band 2 and 3 west-bound. For the
three band unamplified hubbed-ring configuration in Figure 1-120 on page
1-334, each band has a maximum of three path-through losses (same as
band 1 west-bound) so the OMX losses for the band 1 west-bound are used
for the following estimates.

The band link budget for a three band unamplified hubbed-ring configuration
in Figure 1-120 on page 1-334 is therefore:
• Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
– +2.6 dBm - -26 dBm - 9.6 dB (Std OMX) = 19.0 dB
– +2.6 dBm - -26 dBm - 7.4 dB (Enh or 100 GHz OMX) = 21.2 dB
— OC-48/STM-16 SFP DWDM
– 0.0 dBm - -26 dBm - 9.6 dB (Std OMX) = 16.4 dB
– 0.0 dBm - -26 dBm - 7.4 dB (Enh or 100 GHz OMX) = 18.6 dB
— OC-192/STM-64 DWDM
– +2.6 dBm - -23 dBm - 9.6 dB (Std OMX) = 16.0 dB
– +2.6 dBm - -23 dBm - 7.4 dB (Enh or 100 GHz OMX) = 18.2 dB

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See Table 1-90 for link budget estimates of other hub-based configurations.
The span length is based on 0.3 dB/km loss.

Table 1-90
Estimates of link budgets for hub-based configurations

Number Number Power budget (dB) Furthest For equally spaced sites
of of add/drop
bands channels span Total Distance
(km) circumference between
(km) (Note) remotes
(km)

1 4 21.8 (OC-48/STM-16 DPO) & Std OMX 73 145 73

24.0 (OC-48/STM-16 DPO) & Enh/100 GHz 80 160 80


OMX

19.2 (OC-48/STM-16 SFP) & Std OMX 64 128 64

21.4 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 71 143 71

18.8 (OC-192/STM-64) & Std OMX 63 125 63

21.0 (OC-192/STM-64) & Enh/100 GHz OMX 70 140 70

2 8 20.4 (OC-48/STM-16 DPO) & Std OMX 68 102 34

22.6 (OC-48/STM-16 DPO) & Enh/100 GHz 75 113 38


OMX

17.8 (OC-48/STM-16 SFP) & Std OMX 59 89 30

20.0 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 67 100 33

17.4 (OC-192/STM-64) & Std OMX 58 87 29

19.6 (OC-192/STM-64) & Enh/100 GHz OMX 65 98 33

3 12 19.0 (OC-48/STM-16 DPO) & Std OMX 63 84 21

21.2 (OC-48/STM-16 DPO) & Enh/100 GHz 71 94 24


OMX

16.4 (OC-48/STM-16 SFP) & Std OMX 55 73 18

18.6 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 62 82 21

16.0 (OC-192/STM-64) & Std OMX 53 71 18

18.2 (OC-192/STM-64) & Enh/100 GHz OMX 61 81 20

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Table 1-90
Estimates of link budgets for hub-based configurations

Number Number Power budget (dB) Furthest For equally spaced sites
of of add/drop
bands channels span Total Distance
(km) circumference between
(km) (Note) remotes
(km)

4 16 18.0 (OC-48/STM-16 DPO) & Std OMX 59 73 15

19.8 (OC-48/STM-16 DPO) & Enh/100 GHz 66 82 16


OMX

15.0 (OC-48/STM-16 SFP) & Std OMX 50 62 12

17.2 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 57 72 14

14.6 (OC-192/STM-64) & Std OMX 49 61 12

16.8 (OC-192/STM-64) & Enh/100 GHz OMX 56 70 14

Note: The link budget specifies the maximum loss of the ring circumference. The loss for individual fiber
sections does not affect the link budget because the channel travels along the ring circumference.

Calculating the link budget - OMX 16CH


Use the following guidelines for unamplified DWDM networks when using the
OMX 16CH:
• amplification is not supported
• optical pass-through is not supported by the OMX 16CH, it can be only
used at terminal or hub sites
• mixing the OMX 16CH with any other OMX type is not supported at the
same site

Link budgets are calculated for every band for both directions, from each shelf
on a particular band in a site to an adjacent site that contains a shelf with the
same band.

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To calculate the link budget, you must determine the number and type of
OMXs that any one band must pass through to establish its connection. See
below for loss details for the OMX 16CH module.

Table 1-91
Loss summary—OMX 16CH

Parameter Loss (dB)

Add loss 3.9 dB typical (C-band OMX 16CH)


3.5 dB typical (L-band OMX 16CH)
3.6 dB typical (100 GHz OMX 16CH)

Drop loss 3.9 dB typical (C-band OMX 16CH)


3.5 dB typical (L-band OMX 16CH)
3.5 dB typical (100 GHz OMX 16CH)

Passthrough loss (Note 1) 0.7 dB typical (100 GHz OMX 16CH)

L-band upgrade 0.8 dB typical (C-band OMX 16CH)


(OTS IN to L OUT,
L IN to OTS OUT)

Add/drop loss (16 channel C-band 5.7 dB typical (C-band OMX 16CH)
or L-band only, end-to-end) 5.0 dB typical (L-band OMX 16CH)
5.7 dB typical (100 GHz OMX 16CH)

Add/drop loss (32 channel C-band 5.7 dB typical (C-band OMX 16CH)
and L-band, end-to-end) 6.6 dB typical (L-band OMX 16CH)
6.4 dB typical (100 GHz OMX 16CH)

Add/drop loss (32 channel 6.8 dB typical (100 GHz OMX 16CH)
C-band only, end-to-end)

Connector loss 0.4 dB

Fiber loss Fiber loss with additional 0.5 dB for connectors/splice or other
interconnection loss

Transmit power (Note 2) +2.6 dBm to +4.2 dBm (OC-192/STM-64 DWDM)


+2.6 dBm to +4.2 dBm (OC-48/STM-16 DPO DWDM)
0.0 dBm to +4.0 dBm (OC-48/STM-16 SFP DWDM)

Receiver sensitivity (includes path -23 dBm (OC-192/STM-64 DWDM)


penalty) (Note 2) -26 dBm (OC-48/STM-16 DPO DWDM)
-26 dBm (OC-48/STM-16 SFP DWDM)

Note 1: Passthrough loss is only applicable to 100 GHz OMX modules.


Note 2: These are typical values for the mentioned circuit packs. However, refer to Part 3 of 6500
Planning, NTRN10EY (Technical specifications) to find out exact values for each circuit pack.

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For receive powers greater than -8 dBm (OC-192/STM-64 DWDM), -9 dBm


(OC-48/STM-16 DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM),
there must be sufficient attenuation in the fiber path so that the overload
requirement of -8 dBm (OC-192/STM-64 DWDM), -9 dBm (OC-48/STM-16
DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM) is not exceeded.

Note: These are typical values for the mentioned circuit packs. However,
refer to Part 3 of 6500 Planning, NTRN10EY (Technical specifications) to
find out exact values for each circuit pack.

OMX 16CH point-to-point configurations


For OMX 16CH point-to-point configurations, you can use the end-to-end
combined add/drop loss for a pair of OMX 16CH modules (see Table 1-91).
The following considerations apply:
• C-band only networks, use the add and drop (16 channel C-band only,
end-to-end) loss
• L-band only networks, use the add and drop (16 channel L-band only,
end-to-end) loss
• C-band and L-band networks, use the add and drop (32 channel C-band
and L-band, end-to-end) loss

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Link budgets for a hubbed-ring configuration - OMX 16CH (C-band)


terminal and OMX 4CH OADM
To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a three band unamplified hubbed-ring
configuration shown in Figure 1-121, C-band OMX 16CH is used at the
terminal site and OMX 4CH is used at the OADM sites. The losses in the
OMXs for band 1 in the east-bound and west-bound directions are as follows
(refer to Table 1-89 on page 1-332 and Table 1-91 on page 1-338 for loss
details):

Figure 1-121
Physical connections in a hubbed-ring configuration—OMX 16CH (C-band) terminal and OMX
4CH OADM

Terminal site B

OMX OMX OMX OMX OMX


1 2 3 4 5

OADM site C
OADM site A
OMX
1
OMX
5
OMX
2
OMX
3
OMX
4

The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
• East-bound
— Losses at Terminal Site A
– Add losses: 1 x 3.9 dB
– Patch losses: 0.4 dB
– Total: 4.3 dB
— Losses at OADM Site B
– Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
– Patch losses: 0.4 dB
– Total: 3.9 dB (Std) or 2.8 dB (Enh)
— Total for band 1 east-bound: 8.2 dB (Std) or 7.1 dB (Enh)

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• West-bound
— Losses at Terminal Site A
– Add losses: 1 x 3.9 dB
– Patch losses: 0.4 dB
– Total: 4.3 dB
— Losses at OADM Site C
– Pass-through losses: 2 x 0.7 dB
– Total: 1.4 dB (Std) or 1.4 dB (Enh)
— Losses at OADM Site B
– Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
– Pass-through losses: 1 x 0.7 dB
– Patch losses: 0.4 dB
– Total: 4.6 dB (Std) or 3.5 dB (Enh)
— Total for band 1 west-bound: 10.3 dB (Std) or 9.2 dB (Enh)

You must also calculate the OMX losses the band 2 and 3 west-bound. For the
three band unamplified hubbed-ring configuration in Figure 1-121 on page
1-340, each band has a maximum of three path-through losses (same as
band 1 west-bound) so the OMX losses for the band 1 west-bound are used
for the following estimates.

The band link budget for a three band unamplified hubbed-ring configuration
in Figure 1-121 on page 1-340 is therefore:
• Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
– +2.6 dBm - -26 dBm - 10.3 dB (Std OMX) = 18.3 dB
– +2.6 dBm - -26 dBm - 9.2 dB (Enh OMX) = 19.4 dB
— OC-48/STM-16 SFP DWDM
– 0.0 dBm - -26 dBm - 10.3 dB (Std OMX) = 15.7 dB
– 0.0 dBm - -26 dBm - 9.2 dB (Enh OMX) = 16.8 dB
— OC-192/STM-64 DWDM
– +2.6 dBm - -23 dBm - 10.3 dB (Std OMX) = 15.3 dB
– +2.6 dBm - -23 dBm - 9.2 dB (Enh OMX) = 16.4 dB

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Link budgets for a hubbed-ring configuration - OMX 16CH (C-band and


L-band) terminal and OMX 4CH OADM
To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a five band unamplified hubbed-ring configuration
shown in Figure 1-122, C-band and L-band OMX 16CH modules are used at
the terminal site and OMX 4CH is used at the OADM sites. The losses in the
OMXs for band 5 in the east-bound and west-bound directions are as follows
(refer to Table 1-89 on page 1-332 and Table 1-91 on page 1-338 for loss
details):

Figure 1-122
Physical connections in a hubbed-ring configuration—OMX 16CH (C-band and L-band) terminal
and OMX 4CH OADM

Terminal site B

OMX OMX OMX OMX OMX


1 2 3 4 5

OADM site C
OADM site A
OMX
1
OMX
5
OMX
2
OMX
3
OMX
4

The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
• East-bound
— Losses at Terminal Site B
– Add losses: 1 x 3.5 dB
– Pass-through losses (L-band upgrade): 1 x 0.8 dB
– Patch losses: 0.4 dB
– Total: 4.7 dB
— Losses at OADM Site C
– Pass-through losses: 6 x 0.7 dB
– Total: 4.2 dB (Std) or 4.2 dB (Enh)

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— Losses at OADM Site C


– Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
– Pass-through losses: 1 x 0.7 dB
– Patch losses: 0.4 dB
– Total: 4.6 dB (Std) or 3.5 dB (Enh)
— Total for band 5 east-bound: 13.5 dB (Std) or 12.4 dB (Enh)

You must also calculate the OMX losses the other east-bound and
west-bound bands. For the five band unamplified hubbed-ring configuration in
Figure 1-122 on page 1-342, each band has a maximum of eight path-through
losses (same as band 5 west-bound) so the OMX losses for the band 5
east-bound are used for the following estimates.

The band link budget for a five band unamplified hubbed-ring configuration in
Figure 1-122 on page 1-342 is therefore:
• Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
– +2.6 dBm - -26 dBm - 13.5 dB (Std OMX) = 15.1 dB
– +2.6 dBm - -26 dBm - 12.4 dB (Enh OMX) = 16.2 dB
— OC-48/STM-16 SFP DWDM
– 0.0 dBm - -26 dBm - 13.5 dB (Std OMX) = 12.5 dB
– 0.0 dBm - -26 dBm - 12.4 dB (Enh OMX) = 13.6 dB
— OC-192/STM-64 DWDM
– +2.6 dBm - -23 dBm - 13.5 dB (Std OMX) = 12.1 dB
– +2.6 dBm - -23 dBm - 12.4 dB (Enh OMX) = 13.2 dB

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OMX fibering
The ordering of the OMXs depends on the order in which the OMXs are
fibered together. The fibering method affects the number of OMX filters a
signal passes through, and therefore affects the link budget of that signal. It is
important to understand the supported OMX fibering methods in order to
properly plan your optical layer.

West and east fiber pairs


At all sites in ring topologies or at intermediate sites in linear topologies, there
are two fiber pairs that carry traffic in and out of the site. The west fiber pair
refers to the fiber that is connected to OMX modules that add and drop traffic
from the West direction. The east fiber pair refers to the fiber that is connected
to OMX modules that add and drop traffic from the East direction.

For terminal sites that are the end points of a linear network, only one fiber
pair entering the site and at the OADM sites, there are two fiber pairs entering
the site. The east and west concept applies to both terminal and OADM sites.

Each fiber pair has a Rx fiber on which the signal is received and a Tx fiber on
which the signal is transmitted. The Rx fiber is often referred to as OTS IN and
the Tx fiber is often referred to as OTS OUT. All OMX connections, regardless
of ordering or fibering method are bounded by an OTS IN and an OTS OUT
for each fiber pair, as shown in Figure 1-123.

Figure 1-123
Fiber in and out of WDM functional block

West fiber East fiber

to OTS IN from OTS OUT


Wavelength
Division
Multiplexing/
De-multiplexing
(add/drop)
from OTS OUT to OTS IN

OMX fibering refers to the way that the OMXs are interconnected and apply to
DWDM systems that support multiple OMXs per direction with optical
pass-through. There are four methods for fibering OMXs:
• standard fibering
• stacked fibering
• single-band fibering
• OMX 16CH DWDM fibering

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Table 1-92 lists the features and applications for each fibering method.

Table 1-92
OMX fibering methods

Method Use Applicable to site


type

standard optimal link budgets • terminal


• OADM
• bridge

stacked allows for the addition of shelves • terminal


without breaking a fiber • bridge

single-band single-band site • OADM


• bridge

OMX 16CH terminal or bridge site with more than • terminal


DWDM 16 channels • bridge

Standard OMX fibering


Use standard fibering for optimal link budgets. Adding OMXs to sites with
standard fibering involves breaking the fiber. All the drops are executed first
followed by all the adds. Drops and adds are executed in the same order:
• drop 1, drop 2, drop 3
• add 1, add 2 and add 3

If all bands are being dropped and then added at a site, there is no need to
optically connect the west OMX modules with the east OMX modules. In this
case, there is no optical pass-through at this site and this site is referred to as
a terminal site and is said to use terminal standard fibering. Terminal sites can
exist in linear or ring network topologies.

If there are bands carrying signals on the fiber entering the site that are not
dropping and adding, they optically pass through this site. In this case, you
must connect the west OMX modules to the east OMX modules. The site is
referred to as an OADM site and is said to use OADM standard fibering.

Figure 1-124 on page 1-346 shows an example of OMXs with standard OMX
fibering. These diagrams show the traffic flowing one direction only. For the
opposite direction, the signal flow is reversed.

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Figure 1-124
Standard OMX fibering

Terminal

drop β3, west β3, east add

drop β2, west β2, east add

drop β1, west β1, east add

OADM

drop β3, west β3, east add

drop β2, west β2, east add

drop β1, west β1, east add

Stacked fibering
Use stacked fibering if you will be adding more shelves to a terminal site in the
future. All drops are done first, then all adds are done. Drops and adds are
executed in reverse order:
• drop 1, drop 2, drop 3,
• add 3, add 2 and add 1

Stacked fibering is only used if all bands are being optically dropped (to the
client interface or for electrical regeneration) and added at a site, and there is
therefore no need to optically connect the west OMX modules with the east
OMX modules. This includes cases where a channel is being regenerated,
(since in this case it is being electrically passed-through the shelf there is no
need for optical pass-through). In this case, there is no optical pass-through
at this site and this site is referred to as a terminal site and is said to use
terminal stacked fibering. Terminal sites can appear in a linear or ring network.

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Figure 1-125 shows an example of OMXs with stacked fibering. This diagram
shows the traffic flow in one direction only. For the opposite direction, the
signal flow is reversed.

Figure 1-125
Stacked OMX fibering

drop β3, west β3, east add

drop β2, west β2, east add

drop β1, west β1, east add

Single-shelf fibering
Use single shelf fibering to drop and add bands and wavelengths at a site with
only one band in a single shelf.

If there are other bands in the network that must optically pass through this
site, then the west OMX must be fibered to the east OMX. This is a special
case of standard OADM fibering, where there is only one band. Figure 1-126
shows an example of single-band fibering. These diagrams show the traffic
flow in one direction only. For the opposite direction, the signal flow is
reversed.

Figure 1-126
Single-shelf OMX fibering

drop β1, west β1, east add

Single-shelf fibering at a multi-shelf site


In some instances, it may be desirable to fiber all OMX modules within a shelf
using single-shelf fibering even though there is more than one shelf at the site.
This is not recommended since it is costly from a link budget perspective and
it does not allow shelves to be added without breaking the fiber. This method
of fibering always has optical pass-through; any site that is fibered using
single-shelf fibering must be an OADM site.

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Figure 1-127 shows an example of single-shelf fibering at a multi-shelf site.


The drops and adds are interleaved:
• drop 1, add 1
• drop 2, add 2,
• drop 3, add 3

These diagrams show the traffic flow in one direction only. For the opposite
direction, the signal flow is reversed.

Figure 1-127
Single-shelf OMX fibering at a multi-shelf site

drop β3, west β3, east add

drop β2, west β2, east add

drop β1, west β1, east add

OMX 16CH DWDM fibering


Use OMX 16CH DWDM fibering at a terminal or bridge site which has more
than 16 channels. Figure 1-128 shows an example of OMX 16CH DWDM
fibering. The L-band OMX 16CH DWDM is not needed if the channel count is
16 channels or less.

Figure 1-128
OMX 16CH DWDM fibering

L-band L-band
drop west east add

drop C-band C-band add


west east

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44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules


(NTT862AAE5 and NTT862FAE5)
Overview
The 44 Channel Mux/Demux (CMD44) 100 GHz C-Band module (also known
as CMD44 100 GHz) is a cost effective module for multiplexing up to 44 optical
DWDM channels into a single fiber pair and is used for both ROADMs and
WSS-based terminals.

The CMD44 100 GHz module has two 100 GHz temperature stable arrayed
waveguide grating (AWG) optical mux/demux modules, one for multiplexing
and one for demultiplexing. Therefore one CMD44 100 GHz module is used
per facing direction (if the direction requires local channel add/drop). This
module is a 2U height and intended to be mounted in a bay. The CMD44 100
GHz module is compatible with all 100 GHz versions of WSS modules.

Two variants of CMD44 100 GHz modules are available:


• 44 Channel Mux/Demux (CMD44) 100 GHz C-Band module
(NTT862AAE5)
• Enhanced 44 Channel Mux/Demux (eCMD44) 100 GHz C-Band module
(NTT862FAE5)

Both CMD44 100 GHz variants offer same functionality but NTT862FAE5
variant also includes a one way optical isolator on the common In port.
Although both the NTT862AAE5 and NTT862FAE5 variants can be used with
a drop LIM at TOADM applications, it is recommended that the NTT862FAE5
variant be used since the embedded isolator prevents the SLA from entering
the APR (Automatic Power Reduction) state if a user were to accidentally
misconnect the Tx and Rx signals from the service equipment to the CMD44
Ch In and Ch Out ports. When in the APR state, the SLA’s total output power
is reduced to +3 dBm maximum for safety reasons, this reduction in power can
lead to traffic loss on all drop channels carried by the CMD44 attached. The
isolator in the NTT862FAE5 blocks any optical light that is input in any of the
Ch Out ports from being transferred to the Common In port thus preventing
the reflection monitor on the SLA’s output port from reading any undesired
power. This allows the SLA’s reflection monitor to perform its normal function
of measuring return loss to help identify any dirty or misconnected patch
cords.

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Figure 1-129 shows the faceplate of a CMD44 100 GHz module. Figure 1-130
on page 1-351 and Figure 1-131 on page 1-352 provide functional block
diagrams of the CMD44 100 GHz modules.

Figure 1-129
CMD44 100 GHz module faceplate (NTT862AAE5 variant)

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Figure 1-130
CMD44 100 GHz ports block diagram (NTT862AAE5)

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch-87 Out 88
Ch-85 Out 86
Ch-83 Out 84
Ch-81 Out 82
Ch-79 Out 80
Ch-77 Out 78
Ch-75 Out 76
Ch-73 Out 74
Ch-71 Out 72
Ch-69 Out 70
Ch-67 Out 68
Ch-65 Out 66
Ch-63 Out 64
Ch-61 Out 62
Ch-59 Out 60
Ch-57 Out 58
Ch-55 Out 56
Ch-53 Out 54
Demux AWG

Ch-51 Out 52
Ch-49 Out 50
Ch-47 Out 48
Ch-45 Out 46
Ch-43 Out 44
Ch-41 Out 42
Ch-39 Out 40 Physical port numbers for
Ch-37 Out 38
Ch-35 Out 36 Demux channel outputs
Ch-33 Out 34
Ch-31 Out 32
Ch-29 Out 30
Ch-27 Out 28
Ch-25 Out 26
Ch-23 Out 24
Ch-21 Out 22
Ch-19 Out 20
Ch-17 Out 18
Ch-15 Out 16
Ch-13 Out 14
Ch-11 Out 12
Ch-9 Out 10
Ch-7 Out 8
Ch-5 Out 6
Ch-3 Out
Ch-1 Out
4
2
Note: Ch-# refers to Channel ID.
Common Out 90 For the wavelength associated
Ch-87 In 87
Ch-85 In 85 to each channel ID, see next table.
Ch-83 In 83
Ch-81 In 81
Ch-79 In 79
Ch-77 In 77
Ch-75 In 75
Ch-73 In 73
Ch-71 In 71
Ch-69 In 69
Ch-67 In 67
Ch-65 In 65
Ch-63 In 63
Ch-61 In 61
Ch-59 In 59
Ch-57 In 57
Ch-55 In 55
Ch-53 In 53
Ch-51 In 51
Mux AWG

Ch-49 In 49
Ch-47 In 47
Ch-45 In 45
Ch-43 In 43
Ch-41 In 41
Ch-39 In 39
Ch-37 In 37 Physical port numbers for
Ch-35 In 35 Mux channel inputs
Ch-33 In 33
Ch-31 In 31
Ch-29 In 29
Ch-27 In 27
Ch-25 In 25
Ch-23 In 23
Ch-21 In 21
Ch-19 In 19
Ch-17 In 17
Ch-15 In 15
Ch-13 In 13
Ch-11 In 11
Ch-9 In
Ch-7 In
9
7
Legend
Ch-5 In 5
Ch-3 In 3 AWG Arrayed Waveguide Grating
Ch-1 In 1

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Figure 1-131
Enhanced CMD44 100 GHz ports block diagram (NTT862FAE5)

Inventory Equipment Inventory (RJ-45)


Isolator Common In 89
Ch-87 Out 88
Ch-85 Out 86
Ch-83 Out 84
Ch-81 Out 82
Ch-79 Out 80
Ch-77 Out 78
Ch-75 Out 76
Ch-73 Out 74
Ch-71 Out 72
Ch-69 Out 70
Ch-67 Out 68
Ch-65 Out 66
Ch-63 Out 64
Ch-61 Out 62
Ch-59 Out 60
Ch-57 Out 58
Ch-55 Out 56
Ch-53 Out 54
Demux AWG

Ch-51 Out 52
Ch-49 Out 50
Ch-47 Out 48
Ch-45 Out 46
Ch-43 Out 44
Ch-41 Out 42
Ch-39 Out 40 Physical port numbers for
Ch-37 Out 38
Ch-35 Out 36 Demux channel outputs
Ch-33 Out 34
Ch-31 Out 32
Ch-29 Out 30
Ch-27 Out 28
Ch-25 Out 26
Ch-23 Out 24
Ch-21 Out 22
Ch-19 Out 20
Ch-17 Out 18
Ch-15 Out 16
Ch-13 Out 14
Ch-11 Out 12
Ch-9 Out 10
Ch-7 Out 8
Ch-5 Out 6
Ch-3 Out
Ch-1 Out
4
2
Note: Ch-# refers to Channel ID.
Common Out 90 For the wavelength associated
Ch-87 In 87
Ch-85 In 85 to each channel ID, see next table.
Ch-83 In 83
Ch-81 In 81
Ch-79 In 79
Ch-77 In 77
Ch-75 In 75
Ch-73 In 73
Ch-71 In 71
Ch-69 In 69
Ch-67 In 67
Ch-65 In 65
Ch-63 In 63
Ch-61 In 61
Ch-59 In 59
Ch-57 In 57
Ch-55 In 55
Ch-53 In 53
Ch-51 In 51
Mux AWG

Ch-49 In 49
Ch-47 In 47
Ch-45 In 45
Ch-43 In 43
Ch-41 In 41
Ch-39 In 39
Ch-37 In 37 Physical port numbers for
Ch-35 In 35 Mux channel inputs
Ch-33 In 33
Ch-31 In 31
Ch-29 In 29
Ch-27 In 27
Ch-25 In 25
Ch-23 In 23
Ch-21 In 21
Ch-19 In 19
Ch-17 In 17
Ch-15 In 15
Ch-13 In 13
Ch-11 In 11
Ch-9 In
Ch-7 In
9
7
Legend
Ch-5 In 5
Ch-3 In 3 AWG Arrayed Waveguide Grating
Ch-1 In 1

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Supported functionality
The CMD44 100 GHz modules (NTT862AAE5 and NTT862FAE5) provide the
following functionality:
• the CMD44 100 GHz modules are passive modules and therefore do not
require DC power
• although the CMD44 100 GHz module is a passive device,
autoprovisioning and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 100
GHz RJ45 port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD44 100 GHz RJ45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 100 GHz RJ45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 100
GHz RJ45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD44 100 GHz RJ45 module's RJ45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 100 GHz RJ45 port to the access panel
external slot ports).
• offers 44 channels Mux/Demux at 100 GHz grid listed in Table 1-93 on
page 1-354.

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Table 1-93
CMD44 100 GHz ITU grid 44 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength 100 GHz Function Connector


mux/demux (nm) type
(Note)

1/2 Ch 1 In / Out 1530.33 Optical input / output from LC


the client-side interface(s)
3/4 Ch 3 In / Out 1531.12

5/6 Ch 5 In / Out 1531.90

7/8 Ch 7 In / Out 1532.68

9 / 10 Ch 9 In / Out 1533.47

11 / 12 Ch 11 In / Out 1534.25

13 / 14 Ch 13 In / Out 1535.04

15 / 16 Ch 15 In / Out 1535.82

17 / 18 Ch 17 In / Out 1536.61

19 / 20 Ch 19 In / Out 1537.40

21 / 22 Ch 21 In / Out 1538.19

23 / 24 Ch 23 In / Out 1538.98

25 / 26 Ch 25 In / Out 1539.77

27 / 28 Ch 27 In / Out 1540.56

29 / 30 Ch 29 In / Out 1541.35

31 / 32 Ch 31 In / Out 1542.14

33 / 34 Ch 33 In / Out 1542.94

35 / 36 Ch 35 In / Out 1543.73

37 / 38 Ch 37 In / Out 1544.53

39 / 40 Ch 39 In / Out 1545.32

41 / 42 Ch 41 In / Out 1546.12

43 / 44 Ch 43 In / Out 1546.92

45 / 46 Ch 45 In / Out 1547.72

47 / 48 Ch 47 In / Out 1548.51

49 / 50 Ch 49 In / Out 1549.32

51 / 52 Ch 51 In / Out 1550.12

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Table 1-93
CMD44 100 GHz ITU grid 44 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength 100 GHz Function Connector


mux/demux (nm) type
(Note)

53 / 54 Ch 53 In / Out 1550.92 Optical input / output from LC


the client-side interface(s)
55 / 56 Ch 55 In / Out 1551.72

57 / 58 Ch 57 In / Out 1552.52

59 / 60 Ch 59 In / Out 1553.33

61 / 62 Ch 61 In / Out 1554.13

63 / 64 Ch 63 In / Out 1554.94

65 / 66 Ch 65 In / Out 1555.75

67 / 68 Ch 67 In / Out 1556.55

69 / 70 Ch 69 In / Out 1557.36

71 / 72 Ch 71 In / Out 1558.17

73 / 74 Ch 73 In / Out 1558.98

75 / 76 Ch 75 In / Out 1559.79

77 / 78 Ch 77 In / Out 1560.61

79 / 80 Ch 79 In / Out 1561.42

81 / 82 Ch 81 In / Out 1562.23

83 / 84 Ch 83 In / Out 1563.05

85 / 86 Ch 85 In / Out 1563.86

87 / 88 Ch 87 In / Out 1564.68

89 / 90 Common In / Out N/A AMP Line A Out /Line B In LC


or
WSS Switch Out port /
Switch In port

Note: “Ch In” and “Ch Out” labels reflect the 88-channel plan corresponding to the
6500 Photonic 50 GHz grid.

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• the channels on the CMD44 100 GHz module have 100% add/drop
capability at each side, allowing one to 44 channels to be added or
dropped. The combination of WSS 100 GHz w/OPM 5x1, WSS 100 GHz
w/OPM 2x1 (slot-wide and single slot-wide variants), WSS 100 GHz
w/OPM 4x1, or WSS 50 GHz w/OPM 9x1, or WSS 50 GHz w/OPM 2x1
(triple slot-wide and single slot-wide variants) circuit pack and CMD44 100
GHz modules (at ROADM or WSS-based terminal sites) is required to
perform add/drop operation.
• the CMD44 100 GHz module has no variable optical attenuators (VOA),
optimization is carried out through the wavelength selective switch (WSS).

Cross-connection types
The CMD44 100 GHz and Enhanced CMD44 100 GHz modules support the
following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The CMD44 100 GHz and Enhanced CMD44 100 GHz modules only support
the OCH (Optical Channel) Photonic cross-connection rate.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Photonic alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• Loss of Signal

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Equipping rules
The following equipping rules apply to CMD44 100 GHz modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this circuit pack) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the CMD44 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD44 100 GHz module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly) and its assigned OTS
reside.
• the CMD44 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD44 100 GHz optical interface module.

Table 1-94
Technical specifications for CMD44 100 GHz optical interface modules

Parameter CMD44 100 GHz (NTT862AAE5/NTT862FAE5)


Dimension Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated) 7.5 kg (16.7 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
0.5 dB Passband width (full Bandwidth) >46 GHz
3 dB Passband width (full Bandwidth) >76 GHz
0.5 dB net half Bandwidth >21.3 GHz
3 dB net half Bandwidth >34.1 GHz
Max insertion loss per channel (Add or Drop) 6.0 dB for NTT862AAE5
6.6 dB drop loss and 6.0 dB add loss for NTT862FAE5
Minimum insertion loss (all ports) 4 dB
Maximum insertion loss variation (port to port) 1 dB
Minimum tap insertion loss (Monitor Out port) N/A
Maximum tap insertion loss (Monitor Out port) N/A

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,


NTT862BBE5, NTT862BCE5, NTT862BDE5)
Overview
The 44 Channel Mux/Demux (CMD44) 50 GHz C-Band module (also known
as CMD44 50 GHz) and Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band module (also known as Enhanced CMD44 50 GHz) are cost effective
modules for multiplexing up to 44 optical DWDM channels into a single fiber
pair and are used for both ROADMs and WSS-based terminals.

The CMD44 50 GHz or Enhanced CMD44 50 GHz module has two 50 GHz
temperature stable arrayed waveguide grating (AWG) optical mux/demux
modules, one for multiplexing and one for demultiplexing. Therefore, one or
two CMD44 50 GHz or Enhanced CMD44 50 GHz modules is used per facing
direction (if the direction requires local channel add/drop). This module is a 2U
height and intended to be mounted in a bay. The CMD44 50 GHz and
Enhanced CMD44 50 GHz modules are compatible with all 50 GHz versions
of WSS modules.

This release of 6500 supports four variants of 44 Channel Mux/Demux


50 GHz C-Band module:
• NTT862BAE5: 44 Channel Mux/Demux (CMD44) 50 GHz C-Band (Blue)
module (also referred to as CMD44 50 GHz [Blue]). The wavelength range
is 1530.33 nm to 1547.32 nm.
• NTT862BBE5: 44 Channel Mux/Demux (CMD44) 50 GHz C-Band (Red)
module (also referred to as CMD44 50 GHz [Red]). The wavelength range
is 1547.72 nm to 1565.09 nm.
• NTT862BCE5: Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band (Blue) module (also referred to as Enhanced CMD44 50 GHz
[Blue]). The wavelength range is 1530.33 nm to 1547.32 nm.
• NTT862BDE5: Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band (Red) module (also referred to as Enhanced CMD44 50 GHz
[Red]). The wavelength range is 1547.72 nm to 1565.09 nm.

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The CMD44 50 GHz (NTT862BAE5 and NTT862BBE5) and Enhanced


CMD44 50 GHz (NTT862BCE5 and NTT862BDE5) variants offer the same
functionality. However, the Enhanced variants (NTT862BCE5 and
NTT862BDE5) provide the following additional features:
• a passive 5% tap added on the Common Out port which allows the
Monitor Out signal to be monitored with an external OSA, the 2-Port OPM
circuit pack (NTK553PAE5), or the 2-Port OPM Flex C-Band circuit pack
(NTK553PB).
• two additional LC connectors added on the faceplate (total 92 LC
connectors). The Monitor Out is port# 92 and port# 91 is unconnected and
not labeled.
• 0.5 dB higher insertion loss.

Figure 1-132 shows the faceplate of a CMD44 50 GHz module (NTT862BAE5


is shown as an example; others are similar). Figure 1-133 on page 1-361 and
Figure 1-134 on page 1-362 provide functional block diagrams of the CMD44
50 GHz modules. Figure 1-135 on page 1-363 and Figure 1-136 on page
1-364 provide functional block diagrams of the Enhanced CMD44 50 GHz
modules.

Figure 1-132
CMD44 50 GHz module faceplate (example: NTT862BAE5)

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Figure 1-133
CMD44 50 GHz ports- Blue block diagram (NTT862BAE5)

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch-44 Out 88
Ch-43 Out 86
Ch-42 Out 84
Ch-41 Out 82
Ch-40 Out 80
Ch-39 Out 78
Ch-38 Out 76
Ch-37 Out 74
Ch-36 Out 72
Ch-35 Out 70
Ch-34 Out 68
Ch-33 Out 66
Ch-32 Out 64
Ch-31 Out 62
Ch-30 Out 60
Ch-29 Out 58
Ch-28 Out 56
Ch-27 Out 54
Demux AWG

Ch-26 Out 52
Ch-25 Out 50
Ch-24 Out 48
Ch-23 Out 46
Ch-22 Out 44
Ch-21 Out 42
Ch-20 Out
Ch-19 Out
40 Physical port numbers for
38
Ch-18 Out
Ch-17 Out
36 Demux channel outputs
34
Ch-16 Out 32
Ch-15 Out 30
Ch-14 Out 28
Ch-13 Out 26
Ch-12 Out 24
Ch-11 Out 22
Ch-10 Out 20
Ch- 9 Out 18
Ch- 8 Out 16
Ch- 7 Out 14
Ch- 6 Out 12
Ch- 5 Out 10
Ch- 4 Out 8
Ch- 3 Out 6 Note: Ch-# refers to Channel ID.
Ch- 2 Out 4
Ch- 1 Out 2
Common Out 90 For the wavelength associated
Ch-44 In 87 to each channel ID, see next table.
Ch-43 In 85
Ch-42 In 83
Ch-41 In 81
Ch-40 In 79
Ch-39 In 77
Ch-38 In 75
Ch-37 In 73
Ch-36 In 71
Ch-35 In 69
Ch-34 In 67
Ch-33 In 65
Ch-32 In 63
Ch-31 In 61
Ch-30 In 59
Ch-29 In 57
Ch-28 In 55
Ch-27 In 53
Ch-26 In 51
Mux AWG

Ch-25 In 49
Ch-24 In 47
Ch-23 In 45
Ch-22 In 43
Ch-21 In 41
Ch-20 In 39 Physical port numbers for
Ch-19 In 37
Ch-18 In 35 Mux channel inputs
Ch-17 In 33
Ch-16 In 31
Ch-15 In 29
Ch-14 In 27
Ch-13 In 25
Ch-12 In 23
Ch-11 In 21
Ch-10 In 19
Ch- 9 In 17
Ch- 8 In 15
Ch- 7 In 13
Ch- 6 In 11
Ch- 5 In 9 Legend
Ch- 4 In 7
Ch- 3 In 5
Ch- 2 In
Ch- 1 In
3
1
AWG Arrayed Waveguide Grating

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Figure 1-134
CMD44 50 GHz ports- Red block diagram (NTT862BBE5)

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch-88 Out 88
Ch-87 Out 86
Ch-86 Out 84
Ch-85 Out 82
Ch-84 Out 80
Ch-83 Out 78
Ch-82 Out 76
Ch-81 Out 74
Ch-80 Out 72
Ch-79 Out 70
Ch-78 Out 68
Ch-77 Out 66
Ch-76 Out 64
Ch-75 Out 62
Ch-74 Out 60
Ch-73 Out 58
Ch-72 Out 56
Ch-71 Out 54
Demux AWG

Ch-70 Out 52
Ch-69 Out 50
Ch-68 Out 48
Ch-67 Out 46
Ch-66 Out 44
Ch-65 Out 42
Ch-64 Out 40 Physical port numbers for
Ch-63 Out 38
Ch-62 Out 36 Demux channel outputs
Ch-61 Out 34
Ch-60 Out 32
Ch-59 Out 30
Ch-58 Out 28
Ch-57 Out 26
Ch-56 Out 24
Ch-55 Out 22
Ch-54 Out 20
Ch-53 Out 18
Ch-52 Out 16
Ch-51 Out 14
Ch-50 Out 12
Ch-49 Out 10
Ch-48 Out 8
Ch-47 Out 6
Ch-46 Out 4 Note: Ch-# refers to Channel ID.
Ch-45 Out 2
Common Out 90 For the wavelength associated
Ch-88 In 87
Ch-87 In 85 to each channel ID, see next table.
Ch-86 In 83
Ch-85 In 81
Ch-84 In 79
Ch-83 In 77
Ch-82 In 75
Ch-81 In 73
Ch-80 In 71
Ch-79 In 69
Ch-78 In 67
Ch-77 In 65
Ch-76 In 63
Ch-75 In 61
Ch-74 In 59
Ch-73 In 57
Ch-72 In 55
Ch-71 In 53
Ch-70 In 51
Mux AWG

Ch-69 In 49
Ch-68 In 47
Ch-67 In 45
Ch-66 In 43
Ch-65 In 41
Ch-64 In 39 Physical port numbers for
Ch-63 In 37
Ch-62 In 35 Mux channel inputs
Ch-61 In 33
Ch-60 In 31
Ch-59 In 29
Ch-58 In 27
Ch-57 In 25
Ch-56 In 23
Ch-55 In 21
Ch-54 In 19
Ch-53 In 17
Ch-52 In 15
Ch-51 In 13
Ch-50 In 11
Ch-49 In
Ch-48 In
9
7 Legend
Ch-47 In 5
Ch-46 In 3 AWG Arrayed Waveguide Grating
Ch-45 In 1

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Figure 1-135
Enhanced CMD44 50 GHz ports—Blue block diagram (NTT862BCE5)

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch-44 Out 88
Ch-43 Out 86
Ch-42 Out 84
Ch-41 Out 82
Ch-40 Out 80
Ch-39 Out 78
Ch-38 Out 76
Ch-37 Out 74
Ch-36 Out 72
Ch-35 Out 70
Ch-34 Out 68
Ch-33 Out 66
Ch-32 Out 64
Ch-31 Out 62
Ch-30 Out 60
Ch-29 Out 58
Ch-28 Out 56
Ch-27 Out 54
Demux AWG

Ch-26 Out 52
Ch-25 Out 50
Ch-24 Out 48
Ch-23 Out 46
Ch-22 Out 44
Ch-21 Out 42
Ch-20 Out 40
Ch-19 Out
Ch-18 Out
38
36
Physical port numbers for
Ch-17 Out
Ch-16 Out
34
32
Demux channel outputs
Ch-15 Out 30
Ch-14 Out 28
Ch-13 Out 26
Ch-12 Out 24
Ch-11 Out 22
Ch-10 Out 20
Ch- 9 Out 18
Ch- 8 Out 16
Ch- 7 Out 14
Ch- 6 Out 12
Ch- 5 Out 10
Ch- 4 Out 8
Ch- 3 Out 6
Ch- 2 Out 4
Ch- 1 Out 2 Note: Ch-# refers to Channel ID.
MON Out 92 For the wavelength associated
Common Out 90
Ch-44 In 87 to each channel ID, see next table.
Ch-43 In 85
Ch-42 In 83
Ch-41 In 81
Ch-40 In 79
Ch-39 In 77
Ch-38 In 75
Ch-37 In 73
Ch-36 In 71
Ch-35 In 69
Ch-34 In 67
Ch-33 In 65
Ch-32 In 63
Ch-31 In 61
Ch-30 In 59
Ch-29 In 57
Ch-28 In 55
Ch-27 In 53
Ch-26 In 51
Mux AWG

Ch-25 In 49
Ch-24 In 47
Ch-23 In 45
Ch-22 In 43
Ch-21 In 41
Ch-20 In 39 Physical port numbers for
Ch-19 In 37 Mux channel inputs
Ch-18 In 35
Ch-17 In 33
Ch-16 In 31
Ch-15 In 29
Ch-14 In 27
Ch-13 In 25
Ch-12 In 23
Ch-11 In 21
Ch-10 In 19
Ch- 9 In 17
Ch- 8 In 15
Ch- 7 In 13
Ch- 6 In 11 Legend
Ch- 5 In 9
Ch- 4 In 7
Ch- 3 In 5 AWG Arrayed Waveguide Grating
Ch- 2 In 3
Ch- 1 In 1

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Figure 1-136
Enhanced CMD44 50 GHz ports—Red block diagram (NTT862BDE5)

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch- 88 Out 88
Ch- 87 Out 86
Ch- 86 Out 84
Ch- 85 Out 82
Ch- 84 Out 80
Ch- 83 Out 78
Ch- 82 Out 76
Ch- 81 Out 74
Ch- 80 Out 72
Ch- 79 Out 70
Ch- 78 Out 68
Ch- 77 Out 66
Ch- 76 Out 64
Ch- 75 Out 62
Ch- 74 Out 60
Ch- 73 Out 58
Ch- 72 Out 56
Ch- 71 Out 54
Demux AWG

Ch- 70 Out 52
Ch- 69 Out 50
Ch- 68 Out 48
Ch- 67 Out 46
Ch- 66 Out 44
Ch- 65 Out 42
Ch- 64 Out 40
Ch- 63 Out
Ch- 62 Out
38
36
Physical port numbers for
Ch- 61 Out
Ch- 60 Out
34
32
Demux channel outputs
Ch- 59 Out 30
Ch- 58 Out 28
Ch- 57 Out 26
Ch- 56 Out 24
Ch- 55 Out 22
Ch- 54 Out 20
Ch- 53 Out 18
Ch- 52 Out 16
Ch- 51 Out 14
Ch- 50 Out 12
Ch- 49 Out 10
Ch- 48 Out 8
Ch- 47 Out 6
Ch- 46 Out 4
Ch- 45 Out 2 Note: Ch-# refers to Channel ID.
MON Out 92 For the wavelength associated
Common Out 90
Ch- 88 In 87 to each channel ID, see next table.
Ch- 87 In 85
Ch- 86 In 83
Ch- 85 In 81
Ch- 84 In 79
Ch- 83 In 77
Ch- 82 In 75
Ch- 81 In 73
Ch- 80 In 71
Ch- 79 In 69
Ch- 78 In 67
Ch- 77 In 65
Ch- 76 In 63
Ch- 75 In 61
Ch- 74 In 59
Ch- 73 In 57
Ch- 72 In 55
Ch- 71 In 53
Ch- 70 In 51
Mux AWG

Ch- 69 In 49
Ch- 68 In 47
Ch- 67 In 45
Ch- 66 In 43
Ch- 65 In 41 Physical port numbers for
Ch- 64 In 39
Ch- 63 In 37 Mux channel inputs
Ch- 62 In 35
Ch- 61 In 33
Ch- 60 In 31
Ch- 59 In 29
Ch- 58 In 27
Ch- 57 In 25
Ch- 56 In 23
Ch- 55 In 21
Ch- 54 In 19
Ch- 53 In 17
Ch- 52 In 15
Ch- 51 In 13
Ch- 50 In 11
Ch- 49 In 9 Legend
Ch- 48 In 7
Ch- 47 In 5
Ch- 46 In
Ch- 45 In
3
1
AWG Arrayed Waveguide Grating

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Supported functionality
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, and NTT862BDE5) provide the following
functionality:
• the CMD44 50 GHz and Enhanced CMD44 50 GHz modules are passive
modules and therefore do not require DC power
• although the CMD44 50 GHz and Enhanced CMD44 50 GHz module are
passive devices, autoprovisioning and automatic inventory support are
still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 50
GHz or Enhanced CMD44 50 GHz module's RJ45 port to the
NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD44 50 GHz or
Enhanced CMD44 50 GHz module's RJ45 port to the NTK605MAE5
access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 50 GHz or Enhanced CMD44 50 GHz module's
RJ45 port to the NTK505PAE5 access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 50
GHz or Enhanced CMD44 50 GHz module's RJ45 port to the
NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD44 50 GHz RJ45 module's RJ45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 50 GHz module's RJ45 port to the access panel
external slot ports).

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• CMD44 50 GHz (Blue) (NTT862BAE5) or Enhanced CMD44 50 GHz


(Blue) (NTT862BCE5) module offers 44 channels Mux/Demux at 50 GHz
grid (1530.33 nm to 1547.32 nm) and CMD44 50 GHz (Red)
(NTT862BBE5) or Enhanced CMD44 50 GHz (Red) (NTT862BDE5)
module offers 44 channels Mux/Demux at 50 GHz grid (1547.72 nm to
1565.09 nm). The channels are listed in the following table.

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Table 1-95
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions

Physical port # Channel ID of the Wavelength 50 GHz (nm) Function Connector


mux/demux type

Blue wavelengths plan (NTT862BAE5 and NTT862BCE5)

1/2 Ch 1 In / Out 1530.33 Optical input / output LC


from the client-side
3/4 Ch 2 In / Out 1530.72 interface(s)
5/6 Ch 3 In / Out 1531.12

7/8 Ch 4 In / Out 1531.51

9 / 10 Ch 5 In / Out 1531.90

11 / 12 Ch 6 In / Out 1532.29

13 / 14 Ch 7 In / Out 1532.68

15 / 16 Ch 8 In / Out 1533.07

17 / 18 Ch 9 In / Out 1533.47

19 / 20 Ch 10 In / Out 1533.86

21 / 22 Ch 11 In / Out 1534.25

23 / 24 Ch 12 In / Out 1534.64

25 / 26 Ch 13 In / Out 1535.04

27 / 28 Ch 14 In / Out 1535.43

29 / 30 Ch 15 In / Out 1535.82

31 / 32 Ch 16 In / Out 1536.22

33 / 34 Ch 17 In / Out 1536.61

35 / 36 Ch 18 In / Out 1537.00

37 / 38 Ch 19 In / Out 1537.40

39 / 40 Ch 20 In / Out 1537.79

41 / 42 Ch 21 In / Out 1538.19

43 / 44 Ch 22 In / Out 1538.58

45 / 46 Ch 23 In / Out 1538.98

47 / 48 Ch 24 In / Out 1539.37

49 / 50 Ch 25 In / Out 1539.77

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Table 1-95 (continued)


CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions

Physical port # Channel ID of the Wavelength 50 GHz (nm) Function Connector


mux/demux type

51 / 52 Ch 26 In / Out 1540.16 Optical input / output LC


from the client-side
53 / 54 Ch 27 In / Out 1540.56 interface(s)
55 / 56 Ch 28 In / Out 1540.95

57 / 58 Ch 29 In / Out 1541.35

59 / 60 Ch 30 In / Out 1541.75

61 / 62 Ch 31 In / Out 1542.14

63 / 64 Ch 32 In / Out 1542.54

65 / 66 Ch 33 In / Out 1542.94

67 / 68 Ch 34 In / Out 1543.33

69 / 70 Ch 35 In / Out 1543.73

71 / 72 Ch 36 In / Out 1544.13

73 / 74 Ch 37 In / Out 1544.53

75 / 76 Ch 38 In / Out 1544.92

77 / 78 Ch 39 In / Out 1545.32

79 / 80 Ch 40 In / Out 1545.72

81 / 82 Ch 11 In / Out 1546.12

83 / 84 Ch 42 In / Out 1546.52

85 / 86 Ch 43 In / Out 1546.92

87 / 88 Ch 44 In / Out 1547.32

89 / 90 Common In / Out N/A WSS Switch Out LC


port / Switch In port
(if WSS is a
NTK553KCE5
variant)
WSS Drop Out port /
Add In port (if WSS
is a NTK553KAE5
variant)

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Table 1-95 (continued)


CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions

Physical port # Channel ID of the Wavelength 50 GHz (nm) Function Connector


mux/demux type

92 MON (Note) N/A Monitor port for Mux LC


Out

Red wavelengths plan (NTT862BBE5 and NTT862BDE5)

1/2 Ch 45 In / Out 1547.72 Optical input / output LC


from the client-side
3/4 Ch 46 In / Out 1548.11 interface(s)
5/6 Ch 47 In / Out 1548.51

7/8 Ch 48 In / Out 1548.91

9 / 10 Ch 49 In / Out 1549.32

11 / 12 Ch 50 In / Out 1549.72

13 / 14 Ch 51 In / Out 1550.12

15 / 16 Ch 52 In / Out 1550.52

17 / 18 Ch 53 In / Out 1550.92

19 / 20 Ch 54 In / Out 1551.32

21 / 22 Ch 55 In / Out 1551.72

23 / 24 Ch 56 In / Out 1552.12

25 / 26 Ch 57 In / Out 1552.52

27 / 28 Ch 58 In / Out 1552.93

29 / 30 Ch 59 In / Out 1553.33

31 / 32 Ch 60 In / Out 1553.73

33 / 34 Ch 61 In / Out 1554.13

35 / 36 Ch 62 In / Out 1554.54

37 / 38 Ch 63 In / Out 1554.94

39 / 40 Ch 64 In / Out 1555.34

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Table 1-95 (continued)


CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions

Physical port # Channel ID of the Wavelength 50 GHz (nm) Function Connector


mux/demux type

41 / 42 Ch 65 In / Out 1555.75 Optical input / output LC


from the client-side
43 / 44 Ch 66 In / Out 1556.15 interface(s)
45 / 46 Ch 67 In / Out 1556.55

47 / 48 Ch 68 In / Out 1556.96

49 / 50 Ch 69 In / Out 1557.36

51 / 52 Ch 70 In / Out 1557.77

53 / 54 Ch 71 In / Out 1558.17

55 / 56 Ch 72 In / Out 1558.58

57 / 58 Ch 73 In / Out 1558.98

59 / 60 Ch 74 In / Out 1559.39

61 / 62 Ch 75 In / Out 1559.79

63 / 64 Ch 76 In / Out 1560.20

65 / 66 Ch 77 In / Out 1560.61

67 / 68 Ch 78 In / Out 1561.01

69 / 70 Ch 79 In / Out 1561.42

71 / 72 Ch 80 In / Out 1561.83

73 / 74 Ch 81 In / Out 1562.23

75 / 76 Ch 82 In / Out 1562.64

77 / 78 Ch 83 In / Out 1563.05

79 / 80 Ch 84 In / Out 1563.45

81 / 82 Ch 85 In / Out 1563.86

83 / 84 Ch 86 In / Out 1564.27

85 / 86 Ch 87 In / Out 1564.68

87 / 88 Ch 88 In / Out 1565.09

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Table 1-95 (continued)


CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions

Physical port # Channel ID of the Wavelength 50 GHz (nm) Function Connector


mux/demux type

89 / 90 Common In / Out N/A WSS Switch Out LC


port / Switch In port
(if WSS is a
NTK553KCE5
variant)
WSS Drop Out port /
Add In port (if WSS
is a NTK553KAE5
variant)

92 MON (Note) N/A Monitor port for Mux LC


Out

Note: Only applicable to Enhanced CMD44 50 GHz modules (NTT862BCE5 and NTT862BDE5).

• the channels on the CMD44 50 GHz and Enhanced CMD44 50 GHz


modules have 100% add/drop capability at each side, allowing 44
channels for each CMD44 50 GHz or Enhanced CMD44 50 GHz module
(i.e. 44 for blue CMD44 50 GHz or Enhanced CMD44 50 GHz and 44 for
red CMD44 50 GHz or Enhanced CMD44 50 GHz) to be added or
dropped. The combination of WSS 100 GHz w/OPM 5x1, WSS 100 GHz
w/OPM 2x1 (slot-wide and single slot-wide variants), WSS 100 GHz
w/OPM 4x1, or WSS 50 GHz w/OPM 9x1, or WSS 50 GHz w/OPM 2x1
(triple slot-wide and single slot-wide variants) circuit pack and CMD44 50
GHz or Enhanced CMD44 50 GHz modules (at ROADM or WSS-based
terminal sites) is required to perform add/drop operation. However, it is
recommended to use 50 GHz WSS circuit packs with CMD44 50 GHz or
Enhanced CMD44 50 GHz modules since by using 100 GHz WSS circuit
packs with CMD44 50 GHz or Enhanced CMD44 50 GHz modules, you
can only use 100 GHz channels.
• the CMD44 50 GHz or Enhanced CMD44 50 GHz module has no variable
optical attenuators (VOA), optimization is carried out through the
wavelength selective switch (WSS).

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Cross-connection types
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules support the
following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Note: Coherent Select configurations support 2WAY connections only.

Cross-connection rates
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules only support the
OCH (Optical Channel) Photonic cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for Enhanced CMD44 50 GHz
module facilities. Table 1-96 provides a list of monitor types supported on
Enhanced CMD44 50 GHz modules. Figure 1-137 on page 1-373 shows the
Enhanced CMD44 50 GHz module optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-96
Monitor types table for Enhanced CMD44 50 GHz modules

Monitor type Facility

OPTMON CHMON

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note

OPT-OCH X
OPTMIN-OCH X
OPTMAX-OCH X
OPTAVG-OCH X
Note

Note: The retrieved OPTMON OPR-OTS and CHMON OPT-OCH


PM counts for Enhanced CMD44 50 GHz modules used with the
2-Port OPM circuit packs have +/-3 dB precision.

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Figure 1-137
Enhanced CMD44 50 GHz module optical monitoring points

Inventory Equipment Inventory (RJ-45)


Common In 89
Ch-44 Out 88
Ch-43 Out 86
Ch-42 Out 84
Ch-41 Out 82
Ch-40 Out 80
Ch-39 Out 78
Ch-38 Out 76
Ch-37 Out 74
Ch-36 Out 72
Ch-35 Out 70
Ch-34 Out 68
Ch-33 Out 66
Ch-32 Out 64
Ch-31 Out 62
Ch-30 Out 60
Ch-29 Out 58
Ch-28 Out 56
Ch-27 Out 54
Demux AWG

Ch-26 Out 52
Ch-25 Out 50
Ch-24 Out 48
Ch-23 Out 46 Physical port numbers for
Ch-22 Out 44
Ch-21 Out 42 Demux channel outputs
Ch-20 Out 40
Ch-19 Out 38
Ch-18 Out 36
Ch-17 Out 34
Ch-16 Out 32
Ch-15 Out 30
Ch-14 Out 28
Ch-13 Out 26
Ch-12 Out 24
Ch-11 Out 22
Ch-10 Out 20
Ch- 9 Out 18
Ch- 8 Out 16
Ch- 7 Out 14
Ch- 6 Out 12
Ch- 5 Out 10
Ch- 4 Out 8
Ch- 3 Out 6
Ch- 2 Out 4
Ch- 1 Out 2 Facility: CHMON port 92
Facility: OPTMON port 1,3,5,7...,85,87 Parameter: OPT-OCH
Parameter: OPR-OTS* Mon Out 92
Common Out 90
Ch-44 In 87
Ch-43 In 85
Ch-42 In 83
Ch-41 In 81
Ch-40 In 79
Ch-39 In 77
Ch-38 In 75
Ch-37 In 73
Ch-36 In 71
Ch-35 In 69
Ch-34 In 67
Ch-33 In 65
Ch-32 In 63
Ch-31 In 61
Ch-30 In 59
Ch-29 In 57
Ch-28 In 55
Ch-27 In 53
Ch-26 In 51
Mux AWG

Ch-25 In 49
Ch-24 In 47
Ch-23 In 45 Physical port numbers for
Ch-22 In 43 Mux channel inputs
Ch-21 In 41
Ch-20 In 39
Ch-19 In 37
Ch-18 In 35
Ch-17 In 33
Ch-16 In 31 Note: Ch-# refers to the Channel ID.
Ch-15 In 29
Ch-14 In 27 For the Blue module, # = 1 to 44.
Ch-13 In 25
Ch-12 In 23 For the Red module, # = 45 to 88.
Ch-11 In 21
Ch-10 In 19
Ch- 9 In 17 *AVG, MIN, and MAX measurements
Ch- 8 In 15
Ch- 7 In 13 also provided.
Ch- 6 In 11
Ch- 5 In 9
Ch- 4 In 7 Legend
Ch- 3 In 5
Ch- 2 In 3
Ch- 1 In 1 AWG Arrayed Waveguide Grating

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Photonic alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• Loss of Signal

Equipping rules
The following equipping rules apply to CMD44 50 GHz modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this circuit pack) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the CMD44 50 GHz or Enhanced CMD44 50 GHz module must be located
in the same bay as the access panel (in 6500-7 packet-optical, 7-slot shelf,
14-slot shelf, 32-slot shelf), shelf processor w/access panel (SPAP) circuit
pack (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD44 50 GHz or Enhanced CMD44 50 GHz module
connects to (by using the NTTC09BME6 or NTTC09DM cable assembly)
and its assigned OTS reside.
• the CMD44 50 GHz and Enhanced CMD44 50 GHz modules do not use
any cross-connect capacity and can be used with shelves equipped with
or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD44 50 GHz optical interface module.

Table 1-97
Technical specifications for CMD44 50 GHz optical interface modules

Parameter CMD44 50 GHz Enhanced CMD44 50


(NTT862BAE5 and GHz (NTT862BCE5 and
NTT862BBE5) NTT862BDE5)
Dimension Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated) 7.6 kg (16.9 lb) 7.6 kg (16.9 lb)
Power consumption Typical (W): 0 Typical (W): 0
Power Budget (W): 0 Power Budget (W): 0
Maximum total Input power 24 dBm 24 dBm
Minimum return loss 36 dB 36 dB
Max insertion loss per channel (Add or Drop) 7.0 dB 7.5 dB
Minimum insertion loss (all ports) 4 dB 4 dB
Maximum insertion loss variation (port to port) 1.5 dB 1.5 dB
Minimum tap insertion loss (Monitor Out port) N/A 12 dB
Maximum tap insertion loss (Monitor Out port) N/A 14 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA)


Overview
The 64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (also known
as CMD64) is a cost effective module for multiplexing up to 64 optical DWDM
channels into a single fiber pair.

The CMD64 module has two 75 GHz temperature stable arrayed waveguide
grating (AWG) optical mux/demux modules, one for multiplexing and one for
demultiplexing. This module is a 2U height and intended to be mounted in a
bay.

The CMD64 module includes a passive 5% tap added on the Common In and
Common Out ports which allows the signals to be monitored with an external
OSA, the 2-Port OPM Flex C-Band circuit pack (NTK553PB).

The CMD64 includes a one-way optical isolator on the Common In port. The
isolator prevents the preceding amplifier from entering the APR (Automatic
Power Reduction) state if a user accidentally misconnects the Tx and Rx
signals from the service equipment to the CMD64 Ch In and Ch Out ports.
When in the APR state, the amplifier's total output power is reduced to +3 dBm
maximum for safety reasons, this reduction in power can lead to traffic loss on
all drop channels carried by the CMD64 attached. The isolator in the CMD64
blocks any optical light that is input in any of the Ch Out ports from being
transferred to the Common In port thus preventing the reflection monitor on
the amplifier’s output port from reading any undesired power. This allows the
amplifier’s reflection monitor to perform its normal function of measuring
return loss to help identify any dirty or misconnected patch cords.

Figure 1-138 shows the faceplate of a CMD64 module and Figure 1-139 on
page 1-377 provides the functional block diagram of the CMD64 module.

Figure 1-138
CMD64 module faceplate

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Figure 1-139
CMD64 block diagram (NTT862JA)

Physical port
numbers for
Demux frequency
outputs

Physical port
numbers for
Mux frequency
inputs

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Supported functionality
The CMD64 module (NTT862JA) provides the following functionality:
• is a passive module and therefore does not require DC power
• although the CMD64 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD64
module's RJ45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD64 module's RJ45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD64 module's RJ45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD64
module's RJ45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD64 module's RJ45 port to the NTK505JA access panel
external slot ports).
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD64 module's RJ45 port to the access panel’s external slot
ports).
• 64 frequencies Mux/Demux at 75 GHz grid (191.3625 THz to 196.0875
THz). The frequencies are listed in Table 1-98 on page 1-379.

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Table 1-98
CMD64 ITU grid 64 frequency plan and interface port descriptions

Physical port # Frequency of the mux/demux Function Connector


(Note) type

1/2 196.0875 THz In / Out Optical input / output from the LC


client-side interface(s)
3/4 196.0125 THz In / Out

5/6 195.9375 THz In / Out

7/8 195.8625 THz In / Out

9 / 10 195.7875 THz In / Out

11 / 12 195.7125 THz In / Out

13 / 14 195.6375 THz In / Out

15 / 16 195.5625 THz In / Out

17 / 18 195.4875 THz In / Out

19 / 20 195.4125 THz In / Out

21 / 22 195.3375 THz In / Out

23 / 24 195.2625 THz In / Out

25 / 26 195.1875 THz In / Out

27 / 28 195.1125 THz In / Out

29 / 30 195.0375 THz In / Out

31 / 32 194.9625 THz In / Out

33 / 34 194.8875 THz In / Out

35 / 36 194.8125 THz In / Out

37 / 38 194.7375 THz In / Out

39 / 40 194.6625 THz In / Out

41 / 42 194.5875 THz In / Out

43 / 44 194.5125 THz In / Out

45 / 46 194.4375 THz In / Out

47 / 48 194.3625 THz In / Out

49 / 50 194.2875 THz In / Out

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Table 1-98
CMD64 ITU grid 64 frequency plan and interface port descriptions

Physical port # Frequency of the mux/demux Function Connector


(Note) type

51 / 52 194.2125 THz In / Out Optical input / output from the LC


client-side interface(s)
53 / 54 194.1375 THz In / Out

55 / 56 194.0625 THz In / Out

57 / 58 193.9875 THz In / Out

59 / 60 193.9125 THz In / Out

61 / 62 193.8375 THz In / Out

63 / 64 193.7625 THz In / Out

65 / 66 193.6875 THz In / Out

67 / 68 193.6125 THz In / Out

69 / 70 193.5375 THz In / Out

71 / 72 193.4625 THz In / Out

73 / 74 193.3875 THz In / Out

75 / 76 193.3125 THz In / Out

77 / 78 193.2375 THz In / Out

79 / 80 193.1625 THz In / Out

81 / 82 193.0875 THz In / Out

83 / 84 193.0125 THz In / Out

85 / 86 192.9375 THz In / Out

87 / 88 192.8625 THz In / Out

89 / 90 192.7875 THz In / Out

91 / 92 192.7125 THz In / Out

93 / 94 192.6375 THz In / Out

95 / 96 192.5625 THz In / Out

97 / 98 192.4875 THz In / Out

99 / 100 192.4125 THz In / Out

101 / 102 192.3375 THz In / Out

103 / 104 192.2625 THz In / Out

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Table 1-98
CMD64 ITU grid 64 frequency plan and interface port descriptions

Physical port # Frequency of the mux/demux Function Connector


(Note) type

105 / 106 192.1875 THz In / Out Optical input / output from the LC
client-side interface(s)
107 / 108 192.1125 THz In / Out

109 / 110 192.0375 THz In / Out

111 / 112 191.9625 THz In / Out

113 / 114 191.8875 THz In / Out

115 / 116 191.8125 THz In / Out

117 / 118 191.7375 THz In / Out

119 / 120 191.6625 THz In / Out

121 / 122 191.5875 THz In / Out

123 / 124 191.5125 THz In / Out

125 / 126 191.4375 THz In / Out

127 / 128 191.3625 THz In / Out

129 / 130 Common In / Out AMP Line A Out /Line B In or WSS


Switch Out port / Switch In port

131 / 132 Monitor Out / Out Monitor output for common in/out

Note: All physical ports have an LC connector type.

Cross-connection types
The CMD64 module supports the following cross-connection types:
• 1WAY (Unidirectional)
• 2WAY (Bidirectional)

Cross-connection rates
The CMD64 module supports network media channel (NMC) Photonic
connections.

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Photonic alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• Gauge Threshold Crossing Alert Summary
• Loss of Signal

Equipping rules
The following equipping rules apply to CMD64 modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 6500 2-slot optical Type 2 shelf (NTK503LA).
Cannot be equipped with any other 2-slot shelf types (NTK503MAE5 and
NTK503NAE5).
• the CMD64 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf) or shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, that CMD64 module
connects to (by using the NTTC09BME6 or NTTC09DM cable assembly)
and its assigned OTS reside.
• can be only used with coherent interfaces (different from CMD44
modules).
• the CMD64 module does not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD64 optical interface module.

Table 1-99
Technical specifications for CMD64 optical interface modules

Parameter CMD64 (NTT862JA)


Dimension Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated) 6.0 kg (13.2 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 36 dB
0.5 dB net half Bandwidth > 22.5 GHz
3 dB net half Bandwidth > 36.0 GHz
Port to port insertion loss variation (over all 64 wavelengths) < 1.5 dB
Mux insertion loss Minimum: 4 dB
Maximum: 6.5 dB
Demux insertion loss Minimum: 4 dB
Maximum: 7.1 dB
Monitor port insertion loss (Mux Monitor) Minimum: 12 dB
Maximum: 13.5 dB
Monitor port insertion loss (Demux Monitor) Minimum: 12.2 dB
Maximum: 14.5 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA)


Overview
The 96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (also known
as CMD96) is a cost effective module for multiplexing up to 96 optical DWDM
channels into a single fiber pair.

The CMD96 module has two 50 GHz temperature stable arrayed waveguide
grating (AWG) optical mux/demux modules, one for multiplexing and one for
demultiplexing. This module is a 3U height and intended to be mounted in a
bay.

The CMD96 module includes a passive 5% tap added on the Common In and
Common Out ports which allows the Monitor Out and Monitor In signals to be
monitored with an external OSA, the 2-Port OPM circuit pack (NTK553PAE5),
or the 2-Port OPM Flex C-Band circuit pack (NTK553PB).

The CMD96 includes a one-way optical isolator on the Common In port. The
isolator prevents the preceding amplifier from entering the APR (Automatic
Power Reduction) state if a user accidentally misconnects the Tx and Rx
signals from the service equipment to the CMD96 Ch In and Ch Out ports.
When in the APR state, the amplifier's total output power is reduced to +3 dBm
maximum for safety reasons, this reduction in power can lead to traffic loss on
all drop channels carried by the CMD96 attached. The isolator in the CMD96
blocks any optical light that is input in any of the Ch Out ports from being
transferred to the Common In port thus preventing the reflection monitor on
the amplifier’s output port from reading any undesired power. This allows the
amplifier’s reflection monitor to perform its normal function of measuring
return loss to help identify any dirty or misconnected patch cords.

Figure 1-140 shows the faceplate of a CMD96 module and Figure 1-141 on
page 1-385 provides the functional block diagram of the CMD96 module.

Figure 1-140
CMD96 module faceplate

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Figure 1-141
CMD96 block diagram (NTT862EA)

Physical port numbers for


Demux channel outputs

Note: Ch-# refers to Channel ID of the mux/demux.


For the wavelength associated to each
Channel ID of the mux/demux, see next table.

Physical port numbers for


Mux channel inputs

Legend
AWG Arrayed Waveguide Grating

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Supported functionality
The CMD96 module (NTT862EA) provides the following functionality:
• is a passive module and therefore does not require DC power
• although the CMD96 is a passive device, autoprovisioning and automatic
inventory support are possible if using
— NTK555ABE5, NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf
processor and NTK505MBE5 access panel in a 14-slot shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD96 module's RJ45 port to the NTK505MBE5 access panel
external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD96 module's RJ45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD96
module's RJ45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD96 module's RJ45 port to the NTK505JA access panel
external slot ports).
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD96 module's RJ45 port to the access panel’s external slot
ports).
• 96 channels Mux/Demux at 50 GHz grid (1528.77 nm to 1566.72 nm). The
channels are listed in the following table.

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Table 1-100
CMD96 ITU grid 96 wavelength plan and interface port descriptions

Physical port # Channel ID of Wavelength Function Connector type


(Note) the mux/demux 50 GHz (nm)

1/2 Ch 93 In / Out 1528.77 Optical input / output LC


from the client-side
3/4 Ch 94 In / Out 1529.16 interface(s)
5/6 Ch 95 In / Out 1529.55

7/8 Ch 96 In / Out 1529.94

9 / 10 Ch 1 In / Out 1530.33

11 / 12 Ch 2 In / Out 1530.72

13 / 14 Ch 3 In / Out 1531.12

15 / 16 Ch 4 In / Out 1531.51

17 / 18 Ch 5 In / Out 1531.90

19 / 20 Ch 6 In / Out 1532.29

21 / 22 Ch 7 In / Out 1532.68

23 / 24 Ch 8 In / Out 1533.07

25 / 26 Ch 9 In / Out 1533.47

27 / 28 Ch 10 In / Out 1533.86

29 / 30 Ch 11 In / Out 1534.25

31 / 32 Ch 12 In / Out 1534.64

33 / 34 Ch 13 In / Out 1535.04

35 / 36 Ch 14 In / Out 1535.43

37 / 38 Ch 15 In / Out 1535.82

39 / 40 Ch 16 In / Out 1536.22

41 / 42 Ch 17 In / Out 1536.61

43 / 44 Ch 18 In / Out 1537.00

45 / 46 Ch 19 In / Out 1537.40

47 / 48 Ch 20 In / Out 1537.79

49 / 50 Ch 21 In / Out 1538.19

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Table 1-100
CMD96 ITU grid 96 wavelength plan and interface port descriptions

Physical port # Channel ID of Wavelength Function Connector type


(Note) the mux/demux 50 GHz (nm)

51 / 52 Ch 22 In / Out 1538.58 Optical input / output LC


from the client-side
53 / 54 Ch 23 In / Out 1538.98 interface(s)
55 / 56 Ch 24 In / Out 1539.37

57 / 58 Ch 25 In / Out 1539.77

59 / 60 Ch 26 In / Out 1540.16

61 / 62 Ch 27 In / Out 1540.56

63 / 64 Ch 28 In / Out 1540.95

65 / 66 Ch 29 In / Out 1541.35

67 / 68 Ch 30 In / Out 1541.75

69 / 70 Ch 31 In / Out 1542.14

71 / 72 Ch 32 In / Out 1542.54

73 / 74 Ch 33 In / Out 1542.94

75 / 76 Ch 34 In / Out 1543.33

77 / 78 Ch 35 In / Out 1543.73

79 / 80 Ch 36 In / Out 1544.13

81 / 82 Ch 37 In / Out 1544.53

83 / 84 Ch 38 In / Out 1544.92

85 / 86 Ch 39 In / Out 1545.32

87 / 88 Ch 40 In / Out 1545.72

89 / 90 Ch 41 In / Out 1546.12

91 / 92 Ch 42 In / Out 1546.52

93 / 94 Ch 43 In / Out 1546.92

95 / 96 Ch 44 In / Out 1547.32

97 / 98 Ch 45 In / Out 1547.72

99 / 100 Ch 46 In / Out 1548.11

101 / 102 Ch 47 In / Out 1548.51

103 / 104 Ch 48 In / Out 1548.91

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Table 1-100
CMD96 ITU grid 96 wavelength plan and interface port descriptions

Physical port # Channel ID of Wavelength Function Connector type


(Note) the mux/demux 50 GHz (nm)

105 / 106 Ch 49 In / Out 1549.32 Optical input / output LC


from the client-side
107 / 108 Ch 50 In / Out 1549.72 interface(s)
109 / 110 Ch 51 In / Out 1550.12

111 / 112 Ch 52 In / Out 1550.52

113 / 114 Ch 53 In / Out 1550.92

115 / 116 Ch 54 In / Out 1551.32

117 / 118 Ch 55 In / Out 1551.72

119 / 120 Ch 56 In / Out 1552.12

121 / 122 Ch 57 In / Out 1552.52

123 / 124 Ch 58 In / Out 1552.93

125 / 126 Ch 59 In / Out 1553.33

127 / 128 Ch 60 In / Out 1553.73

129 / 130 Ch 61 In / Out 1554.13

131 / 132 Ch 62 In / Out 1554.54

133 / 134 Ch 63 In / Out 1554.94

135 / 136 Ch 64 In / Out 1555.34

137 / 138 Ch 65 In / Out 1555.75

139 / 140 Ch 66 In / Out 1556.15

141 / 142 Ch 67 In / Out 1556.55

143 / 144 Ch 68 In / Out 1556.96

145 / 146 Ch 69 In / Out 1557.36

147 / 148 Ch 70 In / Out 1557.77

149 / 150 Ch 71 In / Out 1558.17

151 / 152 Ch 72 In / Out 1558.58

153 / 154 Ch 73 In / Out 1558.98

155 / 156 Ch 74 In / Out 1559.39

157 / 158 Ch 75 In / Out 1559.79

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Table 1-100
CMD96 ITU grid 96 wavelength plan and interface port descriptions

Physical port # Channel ID of Wavelength Function Connector type


(Note) the mux/demux 50 GHz (nm)

159 / 160 Ch 76 In / Out 1560.20 Optical input / output LC


from the client-side
161 / 162 Ch 77 In / Out 1560.61 interface(s)
163 / 164 Ch 78 In / Out 1561.01

165 / 166 Ch 79 In / Out 1561.42

167 / 168 Ch 80 In / Out 1561.83

169 / 170 Ch 81 In / Out 1562.23

171 / 172 Ch 82 In / Out 1562.64

173 / 174 Ch 83 In / Out 1563.05

175 / 176 Ch 84 In / Out 1563.45

177 / 178 Ch 85 In / Out 1563.86

179 / 180 Ch 86 In / Out 1564.27

181 / 182 Ch 87 In / Out 1564.68

183 / 184 Ch 88 In / Out 1565.09

185 / 186 Ch 89 In / Out 1565.50

187 / 188 Ch 90 In / Out 1565.90

189 / 190 Ch 91 In / Out 1566.31

191 / 192 Ch 92 In / Out 1566.72

193 / 194 Common In / Out N/A AMP Line A Out /Line B


In or WSS Switch Out
port / Switch In port

195 / 196 Monitor Out / Out N/A Monitor output for


common in/out

Note: All physical ports have an LC connector type.

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Cross-connection types
The CMD96 module supports the 2WAY (Bidirectional) cross-connection type
only.

Cross-connection rates
The CMD96 module only supports the OCH (Optical Channel) Photonic
cross-connection rate.

Performance monitoring
The 6500 monitors and collects physical PMs for CMD96 module facilities.
Table 1-101 provides a list of monitor types supported on CMD96 modules.
Figure 1-142 on page 1-392 shows the CMD96 optical monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-101
Monitor types table for CMD96 modules

Facility OPTMON SDMON


Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X
Note 3

OPT-OTS X
OPTMIN-OTS X
OPTMAX-OTS X
OPTAVG-OTS X
Note 3

Note 1: PM support on the CMD96 module requires the OPM on the


standalone 2-Port OPM circuit pack.
Note 2: For a diagram showing the Photonic CMD96 module optical
monitoring points, refer to Figure 1-142 on page 1-392.
Note 3: The retrieved OPTMON OPR-OTS and SDMON OPT-OTS PM
counts for Photonic CMD64 modules used with the 2-Port OPM or
2-Port OPM Flex C-Band circuit packs have +/-3 dB precision.

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Figure 1-142
CMD96 module optical monitoring points

Equipment Inventory
Inventory
(RJ-45)
Mon Out 195
Isolator Common In 193
Ch 92 Out 192
Ch 91 Out 190
Ch 90 Out 188

...
Ch 16 Out 40
Ch 15 Out 38
Ch 14 Out 36
Ch 13 Out 34
Ch 12 Out 32
Ch 11 Out 30
Ch 10 Out 28
Physical port numbers for
Ch 9 Out 26
Demux channel outputs
Ch 8 Out 24
Ch 7 Out 22
Ch 6 Out 20
Ch 5 Out 18
Ch 4 Out 16
Ch 3 Out 14
Ch 2 Out 12
Ch 1 Out 10
Ch 96 Out 8
Ch 95 Out 6
Ch 94 Out 4
Ch 93 Out 2
Mux / Demux

Facility: CHMON port 194


Parameter: OPT-OCH
Mon Out 196
Common Out 194
Ch 92 In 191
Ch 91 In 189
Ch 90 In 187
Facility: OPTMON port 1,3,5,7...,189,191
...

Parameter: OPR-OTS*
Ch 16 In 39
Ch 15 In 37
Ch 14 In 35
Ch 13 In 33
Ch 12 In 31
Ch 11 In 29
Ch 10 In 27
Physical port numbers for
Ch 9 In 25
Mux channel inputs
Ch 8 In 23
Ch 7 In 21
Ch 6 In 19
Ch 5 In 17
Ch 4 In 15
Ch 3 In 13
Ch 2 In 11
Ch 1 In 9
Ch 96 In 7 Note: Ch-# refers to Channel ID.
Ch 95 In 5
Ch 94 In 3
Ch 93 In 1 *AVG, MIN, and MAX
measurements also provided.

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Alarms
The following alarms can be raised on the CMD96 module:
• Adjacency Mismatch
• Autoprovisioning Mismatch
• Circuit Pack Mismatch
• Circuit Pack Missing
• Duplicate Adjacency Discovered
• Gauge Threshold Crossing Alert Summary
• Loss Of Signal (OPTMON)
Equipping rules
The following equipping rules apply to CMD96 modules:
• can be equipped with the Packet-optical (NTK503SA) and Converged
NTK503ADE5, NTK503BDE5, and NTK503CDE5) variants of 14-slot
shelf types by using the shelf processor and access panel.
• can be equipped with the NTK603AB variant of 32-slot shelf types by
using the shelf processor and access panel.
• can be equipped with the 7-slot shelf (NTK503KA variant only) by using
the shelf processor and access panel. Cannot be equipped with the
NTK503PAE5 variant of 7-slot shelf types.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 6500 2-slot optical Type 2 shelf (NTK503LA).
Cannot be equipped with any other 2-slot shelf types (NTK503MAE5 and
NTK503NAE5).
• the CMD96 module must be located in the same bay as the
— access panel (in 6500-7 packet-optical)
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB)
that CMD96 module connects to (by using the NTTC09BME6 or
NTTC09DM cable assembly).
• can be only used with coherent interfaces (different from CMD44
modules).
• the CMD96 module does not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD96 optical interface module.

Table 1-102
Technical specifications for CMD96 optical interface modules

Parameter CMD96 (NTT862EA)


Dimension Height: 3U (133 mm / 5.2 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated) 7.2 kg (15.8 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 36 dB
0.5 dB net half Bandwidth > 14.0 GHz
3 dB net half Bandwidth > 23.0 GHz
Max insertion loss per channel (Add or Drop) Add: 7.0 dB
Drop: 7.6 dB
Minimum insertion loss (all ports) 4 dB
Maximum insertion loss variation (port to port) 1.5 dB
Minimum tap insertion loss (Monitor Out port) 12 dB
Maximum tap insertion loss (Monitor Out port) 14 dB
Minimum tap insertion loss (Monitor In port) 12.2 dB
Maximum tap insertion loss (Monitor In port) 15 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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16 Channel Mux/Demux (CMD16) 100 GHz C-Band module


(NTT862KA)
Overview
The 16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (also known
as CMD16 100 GHz) is a cost effective module for multiplexing up to 16 optical
DWDM channels into a single fiber pair to provide the ability to add/drop
channels in non-ROADM applications (that is, without the requirement to have
a WSS at the site).

The CMD16 100 GHz module is a purely passive module containing WDM
thin-film 2x band splitters and 2x 8-channel filters each in the Mux/Demux
directions for multiplexing and demultiplexing of the 16 100 GHz channels with
frequency range from 195.90 to 194.30 THz (corresponding to a wavelength
range of 1530.33 to 1542.94 nm). The supported channels are listed in
Table 1-103 on page 1-398. All other channels are passed through unchanged
via the upgrade port.

The CMD16 100 GHz module also contains one upgrade port each in the
Mux/Demux directions for expansion purpose when combined with CMD24
100 GHz module to cover up to 40 add/drop channels.

In the current release, software support for the CMD16 100 GHz (NTT862KA)
is limited to inventory display. Any software feature descriptions that refer to
CMD modules, other than those related to inventory, do not apply to the
CMD16 unless stated otherwise.

This CMD16 100 GHz module is a 1U height and intended to be mounted in


a bay.

Figure 1-143 shows the faceplate of a CMD16 100 GHz module. Figure 1-144
on page 1-396 provides functional block diagrams of the CMD16 100 GHz
module.

Figure 1-143
CMD16 100 GHz module faceplate

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Figure 1-144
CMD16 100 GHz ports block diagram (NTT862KA)

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Supported functionality
The CMD16 100 GHz module (NTT862KA) provides the following
functionality:
• the CMD16 100 GHz module is a passive module and therefore does not
require DC power
• although the CMD16 100 GHz module is a passive device, automatic
inventory support is still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD16 100
GHz RJ45 port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD16 100 GHz RJ45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD16 100 GHz RJ45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD16 100
GHz RJ-45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD16 100 GHz RJ45 module's RJ45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD16 100 GHz RJ45 port to the access panel
external slot ports).
• offers 16 channels Mux/Demux at 100 GHz grid listed in Table 1-103 on
page 1-398.

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Table 1-103
CMD16 100 GHz ITU grid 16 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength Frequency Function Connector


mux/demux 100 GHz (nm) (THz) type

Out / In Ch 1 1530.33 195.90 Optical input / LC/UPC


output from the (Note 1)
Out / In Ch 2 1531.12 195.80 client-side
Out / In Ch 3 1531.90 195.70 interface(s)

Out / In Ch 4 1532.68 195.60

Out / In Ch 5 1533.47 195.50

Out / In Ch 6 1534.25 195.40

Out / In Ch 7 1535.04 195.30

Out / In Ch 8 1535.82 195.20

Out / In Ch 9 1537.40 195.00

Out / In Ch 10 1538.19 194.90

Out / In Ch 11 1538.98 194.80

Out / In Ch 12 1539.77 194.70

Out / In Ch 13 1540.56 194.60

Out / In Ch 14 1541.35 194.50

Out / In Ch 15 1542.14 194.40

Out / In Ch 16 1542.94 194.30

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Table 1-103
CMD16 100 GHz ITU grid 16 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength Frequency Function Connector


mux/demux 100 GHz (nm) (THz) type

Out / In Common N/A N/A DWDM optical LC/UPC


input / output to
/from the line
amplifier

Out / In Upgrade N/A N/A Upgrade ports LC/UPC


for bypass input (Note 2)
/ output and for
expansion to 40
channels
(separate
CMD24 module
needed)

Note 1: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Note 2: Low reflection terminators are shipped on the Demux upgrade out port to prevent Low ORL
alarms when Common ports connected to AMP.

• the channels on the CMD16 100 GHz module have 100% add/drop
capability at each side, allowing one to 16 channels to be added or
dropped.
• has express path (upgrade port) that is 100 GHz-compliant.

ATTENTION
In the current release, software support for CMD16 modules is limited to
inventory display. Any software feature descriptions that refer to CMD
modules, other than those related to inventory, do not apply to the CMD16
unless stated otherwise.

Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch

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Equipping rules
The following equipping rules apply to CMD16 100 GHz modules
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the CMD16 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD16 100 module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
• the CMD16 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD16 100 GHz optical interface module.

Table 1-104
Technical specifications for CMD16 100 GHz optical interface modules

Parameter CMD16 100 GHz (NTT862KA)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280 mm / 11.02 in.
Weight (estimated) 4.4 kg (9.8 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Add path maximum insertion losses • Ch-In to Common Out: 4.8 dB
• Upgrade In to Common Out: 1.2 dB
Drop Path maximum insertion losses • Common In to Ch-Out: 4.8 dB
• Common In to Upgrade Out: 1.2 dB
Minimum return loss 45 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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24 Channel Mux/Demux (CMD24) 100 GHz C-Band module


(NTT862LA)
Overview
The 24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (also known
as CMD24 100 GHz) is a cost effective module for multiplexing up to 24 optical
DWDM channels into a single fiber pair to provide the ability to add/drop
channels in non-ROADM applications (i.e. without the requirement to have a
WSS at the site).

The CMD24 100 GHz module is a purely passive module containing WDM
thin-film 3x band splitters and 3x 8-channel filters each in the Mux/Demux
directions for multiplexing and demultiplexing of the 24 100 GHz channels with
frequency range from 194.10 to 191.60 THz (corresponding to a wavelength
range of 1544.53 to 1564.68 nm). The supported channels are listed in
Table 1-103 on page 1-398. All other channels are passed through unchanged
via the upgrade port.

The CMD24 100 GHz module also contains one upgrade port each in the
Mux/Demux directions for expansion purpose when combined with CMD16
100 GHz module to cover up to 40 add/drop channels.

In the current release, software support for the CMD24 100 GHz (NTT862LA)
is limited to inventory display. Any software feature descriptions that refer to
CMD modules, other than those related to inventory, do not apply to the
CMD16 unless stated otherwise.

This CMD24 100 GHz module is a 1U height and intended to be mounted in


a bay.

Figure 1-145 shows the faceplate of a CMD24 100 GHz module. Figure 1-146
on page 1-403 provides functional block diagrams of the CMD24 100 GHz
module.

Figure 1-145
CMD24 100 GHz module faceplate

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Figure 1-146
CMD24 100 GHz ports block diagram (NTT862LA)

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Supported functionality
The CMD24 100 GHz module (NTT862LA) provides the following
functionality:
• the CMD24 100 GHz module is a passive module and therefore does not
require DC power
• although the CMD24 100 GHz module is a passive device, automatic
inventory support is still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD24 100
GHz RJ45 port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD24 100 GHz RJ45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD24 100 GHz RJ45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD24 100
GHz RJ45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD24 100 GHz RJ45 module's RJ45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD24 100 GHz RJ45 port to the access panel
external slot ports).
• offers 24 channels Mux/Demux at 100 GHz grid listed in Table 1-105 on
page 1-405.

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Table 1-105
CMD24 100 GHz ITU grid 24 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength Frequency Function Connector


mux/demux 100 GHz (nm) (THz) type

Out / In Ch 1 1544.53 194.10 Optical input / LC/UPC


output from the (Note 1)
Out / In Ch 2 1545.32 194.00 client-side
Out / In Ch 3 1546.12 193.90 interface(s)

Out / In Ch 4 1546.92 193.80

Out / In Ch 5 1547.72 193.70

Out / In Ch 6 1548.51 193.60

Out / In Ch 7 1549.32 193.50

Out / In Ch 8 1550.12 193.40

Out / In Ch 9 1551.72 193.20

Out / In Ch 10 1552.52 193.10

Out / In Ch 11 1553.33 193.00

Out / In Ch 12 1554.13 192.90

Out / In Ch 13 1554.94 192.80

Out / In Ch 14 1555.75 192.70

Out / In Ch 15 1556.55 192.60

Out / In Ch 16 1557.36 192.50

Out / In Ch 17 1558.98 192.30

Out / In Ch 18 1559.79 192.20

Out / In Ch 19 1560.61 192.10

Out / In Ch 20 1561.42 192.00

Out / In Ch 21 1562.23 191.90

Out / In Ch 22 1563.05 191.80

Out / In Ch 23 1563.86 191.70

Out / In Ch 24 1564.68 191.60

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Table 1-105
CMD24 100 GHz ITU grid 24 wavelength plan and interface ports descriptions

Physical port # Channel ID of the Wavelength Frequency Function Connector


mux/demux 100 GHz (nm) (THz) type

Out / In Common N/A N/A DWDM optical LC/UPC


input / output to
/from the line
amplifier

Out / In Upgrade N/A N/A Upgrade ports LC/UPC


for bypass input (Note 2)
/ output and for
expansion to 40
channels
(separate
CMD24 module
needed)

Note 1: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Note 2: Low reflection terminators are shipped on the Demux upgrade out port to prevent Low ORL
alarms when Common ports connected to AMP.

• the channels on the CMD24 100 GHz module have 100% add/drop
capability at each side, allowing one to 24 channels to be added or
dropped.
• has express path (upgrade port) that is 100 GHz-compliant.

ATTENTION
In the current release, software support for CMD24 modules is limited to
inventory display. Any software feature descriptions that refer to CMD
modules, other than those related to inventory, do not apply to the CMD24
unless stated otherwise.

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Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
Equipping rules
The following equipping rules apply to CMD24 100 GHz modules
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the CMD24 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD24 100 module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
• the CMD24 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD24 100 GHz optical interface module.

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Table 1-106
Technical specifications for CMD24 100 GHz optical interface modules

Parameter CMD24 100 GHz (NTT862LA)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280 mm / 11.02 in.
Weight (estimated) 4.4 kg (9.8 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Add path maximum insertion losses • Ch-In to Common Out: 5.1 dB
• Upgrade In to Common Out: 1.4 dB
Drop Path maximum insertion losses • Common In to Ch-Out: 4.8 dB
• Common In to Upgrade Out: 1.4 dB
Minimum return loss 45 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules (NTK504AxE5)


Overview
The 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module (also
known as OMD4 100 GHz) is a cost effective module to increase capacity by
multiplexing up to 4 optical DWDM channels into a single fiber pair to provide
the ability to add/drop channels in either non-ROADM applications (i.e.
without the requirement to have a WSS at the site) or Metro ROADM
configurations.

The OMD4 100 GHz modules have passive group filters and
passthrough/upgrade ports for cascading, therefore each OMD4 is able to add
and drop specific wavelengths assigned to that OMD4 and to allow other
wavelengths to pass through unchanged via the upgrade port.

Each OMD4 100 GHz module is a purely passive module containing WDM
thin-film filters for multiplexing and demultiplexing the four 100 GHz channels
in each of the nine WDM groups. Additionally, an isolator is placed in the
Demux path to ensure limited light is output from the Common In port in the
event of a mistake in connecting the OMD4 ports. One OMD4 100 GHz
module is used per facing direction (if the direction requires local channel
add/drop). This module is a 1U height and intended to be mounted in a bay.
Each OMD4 module supports four DWDM channels in the 100 GHz-spaced
ITU grid. Nine different OMD4 modules are required to cover the entire
C-band for a total of 36 wavelengths. Those nine OMD4 100 GHz modules
are:
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
1 (NTK504AAE5): 1530.33 nm- 1531.12 nm- 1531.90 nm- 1532.68 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
2 (NTK504ABE5): 1534.25 nm- 1535.04 nm- 1535.82 nm- 1536.61 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
3 (NTK504ACE5): 1538.19 nm- 1538.98 nm- 1539.77 nm- 1540.56 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
4 (NTK504ADE5): 1542.14 nm- 1542.94 nm- 1543.73 nm- 1544.53 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
5 (NTK504AEE5): 1546.12 nm- 1546.92 nm- 1547.72 nm- 1548.51 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
6 (NTK504AFE5): 1550.12 nm- 1550.92 nm- 1551.72 nm- 1552.52 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
7 (NTK504AGE5): 1554.13 nm- 1554.94 nm- 1555.75 nm- 1556.55 nm

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• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group


8 (NTK504AHE5): 1558.17 nm- 1558.98 nm- 1559.79 nm- 1560.61 nm
• 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
9 (NTK504AJE5): 1562.23 nm- 1563.05 nm- 1563.86 nm- 1564.68 nm

Table 1-107 shows the supported circuit packs and pluggables that can be
used with OMD4.

Table 1-107
Supported circuit packs and pluggables working with OMD4

Circuit pack or pluggable PEC Alarm


correlation

Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503MAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (DC-powered)

Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503NAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (AC-powered)

OTN FLEX MOTR circuit pack NTK532BAE5 OTM1

FLEX MOTR circuit pack NTK531YAE5 OTM2

2.5G MOTR circuit pack NTK530NAE5 OTM2

NTK530NCE5 OTM2
OTM1

10G OTSC circuit pack NTK528AAE5 OTM2

2x10G OTR circuit pack NTK530PGE5 OTM2


NTK530PME5

4x10G OTR circuit packs NTK530QA OTM2


NTK530QE
NTK530QM

SuperMux with XFP circuit pack NTK535FAE5 OTM2

L2 MOTR circuit pack NTK531VAE5 OTM2

40G MUX OCI circuit pack NTK525CAE5 OTM2


NTK525CFE5

40G OCLD circuit packs NTK539PxE5 OTM3 (Note 1)

Wavelength-Selective 40G OCLD circuit pack NTK539RxE5

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Table 1-107
Supported circuit packs and pluggables working with OMD4

Circuit pack or pluggable PEC Alarm


correlation

100G OCLD circuit packs NTK539TxE5 OTM4 (Note 2)

100G WL3/WL3e OCLD circuit packs NTK539Ux

Flex2 WL3/WL3e OCLD circuit packs NTK539Bx

Flex3 WL3e OCLD circuit packs NTK539Qx

Flex4 WL3e OCLD circuit packs NTK539Fx

100G WL3e OTR NTK538Ux

100G WL3n MOTR NTK538Bx

DWDM XFP modules (when equipped in the circuit packs listed above NTK588xxE5 N/A
provided the circuit pack supports the pluggable) NTK587xxE5 OTM4 (Note 2)
NTK583AAE5
NTK589xxE5

DWDM SFP modules (when equipped in the circuit packs listed above NTK585xxE5 N/A
provided the circuit pack supports the pluggable) NTK586xxE5

Note 1: The client circuit pack that mates with 40G OCLD circuit pack can be
40G MUX OCI, 40G OCI, or 40/43G OCI circuit pack.
Note 2: The client circuit pack that mates with 100G OCLD, 100G WL3 OCLD, Flex4 WL3e OCLD,
Flex3 WL3e OCLD, or Flex2 WL3/WL3e OCLD circuit pack can be 10x10G MUX or 100G OCI circuit
pack.

Figure 1-147 shows the faceplate of an OMD4 100 GHz module. Figure 1-148
on page 1-412 provides functional block diagrams of the OMD4 100 GHz
modules.

Figure 1-147
OMD4 100 GHz module faceplate

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Figure 1-148
OMD44 100 GHz ports block diagram

Ch-In 1 3

Channel MUX
Ch-In 2 5

Ch-In 3 7

Upgrade MUX
Ch-In 4 9

Upgrade In 11

Common Out 2

Common In 1

Upgrade Out 12
Upgrade DeMUX

Ch-Out 1 4

Channel DeMUX
Ch-Out 2 6

Ch-Out 3 8
Isolator

Ch-Out 4 10

Inventory Equipment Inventory (RJ-45)

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Supported functionality
The OMD4 100 GHz modules (NTK504AxE5) provide the following
functionality:
• the OMD4 100 GHz modules are passive modules and therefore do not
require DC power
• although the OMD4 100 GHz module is a passive device, autoprovisioning
and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMD4 100
GHz module's RJ45 port to the NTK505MBE5 access panel external
slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OMD4 100 GHz module's
RJ45 port to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMD4 100 GHz module's RJ45 port to the
NTK505PAE5 access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMD4 100
GHz module's RJ45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OMD4 100 GHz RJ45 module's RJ45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMD4 100 GHz module's RJ45 port to the access
panel external slot ports).
• offers 36 channels Mux/Demux in nine groups at 100 GHz grid listed in
Table 1-108 on page 1-414

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Table 1-108
OMD4 100 GHz ITU grid 36 wavelength plan

Channel Wavelength Channel Wavelength Channel Wavelength


ID of the 100 GHz (nm) ID of the 100 GHz (nm) ID of the 100 GHz (nm)
mux/de mux/dem mux/de
mux ux mux

Group 1 (NTK504AAE5) Group 4 (NTK504ADE5) Group 7 (NTK504AGE5)

1 1530.33 31 1542.14 61 1554.13

3 1531.12 33 1542.94 63 1554.94

5 1531.90 35 1543.73 65 1555.75

7 1532.68 37 1544.53 67 1556.55

Group 2 (NTK504ABE5) Group 5 (NTK504AEE5) Group 8 (NTK504AHE5)

11 1534.25 41 1546.12 71 1558.17

13 1535.04 43 1546.92 73 1558.98

15 1535.82 45 1547.72 75 1559.79

17 1536.61 47 1548.51 77 1560.61

Group 3 (NTK504ACE5) Group 6 (NTK504AFE5) Group 9 (NTK504AJE5)

21 1538.19 51 1550.12 81 1562.23

23 1538.98 53 1550.92 83 1563.05

25 1539.77 55 1551.72 85 1563.86

27 1540.56 57 1552.52 87 1564.68

• the channels on the OMD4 100 GHz module have 100% add/drop
capability at each side, allowing one to 4 channels to be added or dropped.
• has express path (upgrade port) that is 100 GHz-compliant.
• unlike the SCMD4 circuit packs, the OMD4s does not have voltage
controlled optical attenuator (VOA) for channel level optical power
monitoring and adjustment
• Demux path includes an isolator to ensure the pre-amp APR (Automatic
Power Reduction) does not get triggered with a Tx to Ch Out
misconnection
• see Table 1-109 on page 1-415 for function and connector type for each
port.

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Table 1-109
OMD4 100 GHz optical interfaces

Interface name Physical port # Function Connector type

Ch 1 In / Out 3/4 Optical input / output from the client-side LC


Ch 2 In / Out 5/6 interface(s)
Ch 3 In / Out 7/8
Ch 4 In / Out 9 / 10

Common In / Out 1/2 The OMD4 Common In/Out ports are LC


connected to:
• the office fiber plant or the LIM Line A
Out (port 7) of the amplifier circuit pack
when the OMD4 circuit pack is the first
group in the cascading order.
• the preceding OMD4 Upgrade In/Out
ports when the OMD4 circuit pack is
not the first group in the cascading
order.

Upgrade In / Out 11 / 12 Group level bypass input / output LC (LC/UPC (Note)


terminators are
shipped on the
Demux upgrade
out port)

Note: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Photonic alarms
• Duplicate Adjacency Discovered
• Group Loss of Signal
• Loss of Signal

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Equipping rules
The following equipping rules apply to OMD4 100 GHz modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the OMD4 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that OMD4 100 GHz module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
• the OMD4 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the OMD4 100 GHz optical interface modules.

Table 1-110
Optical specifications for OMD4 modules

Parameter OMD4 (NTK504AxE5)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 3.0 kg (6.6 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 40 dB
Working bandwidth +/- 12.5 GHz
Add path maximum insertion losses • Ch-In to Common Out: 2.5 dB
• Upgrade In to Common Out: 1.1 dB
Drop Path maximum insertion losses • Common In to Ch-Out: 3.3 dB
• Common In to Upgrade Out: 0.75 dB

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Broadband Mux/Demux 1x2 module (NTT862DAE5)


Overview
The Broadband Mux/Demux 1x2 module (also known as BMD2) is a cost
effective way to increase capacity. It provides low cost 50 GHz Mux/Demux for
ROADMs and WSS-based terminals.

The BMD2 module is used together with a WSS 50 GHz w/OPM 2x1 (triple
slot-wide and single slot-wide variants) circuit pack to allow full 88 channel
support and freeing up a switch port for passthrough traffic.

The BMD2 module has two wide-band optical couplers that perform the
function of coupler on the MUX side and power splitter on the DEMUX side.

The BMD2 module is a 1U height and intended to be mounted in a bay.

Figure 1-149 shows the faceplate of a BMD2 module and Figure 1-150 on
page 1-419 provides a functional block diagram of the BMD2 module.

Figure 1-149
BMD2 module faceplate

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Figure 1-150
BMD2 module block diagram (NTT862DAE5)

Common Out 2
Passive
Mux Mux In 1 3
2x1
Mux In 2 5

Isolator Common In 1
Passive
Demux Demux Out-1 4
1x2
Demux Out-2 6

Equipment
Inventory Inventory
(RJ-45)

Supported functionality
The BMD2 module (NTT862DAE5) provides the following functionality:
• the BMD2 modules are passive modules and therefore do not require DC
power
• although the BMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the BMD2 RJ45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the BMD2 RJ45 port to the
NTK605MAE5 access panel external slot ports).

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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and


NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the BMD2 RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the BMD2 RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the BMD2 module's RJ45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the BMD2 RJ45 port to the access panel external slot
ports).
• the channels on the BMD2 module have 100% add/drop capability at each
side, allowing one to 88 channels to be added or dropped. The
combination of WSS 50 GHz w/OPM 2x1 (triple slot-wide and single
slot-wide variants) circuit pack and CMD44, Enhanced CMD44, or BMD2
modules (at ROADM or WSS-based terminal sites) is required to perform
add/drop operation.
• the BMD2 module can be used as a Transponder Protection Tray (TPT) to
provide line and/or client protection for 2x10G OTR and SuperMux circuit
packs.
• see Table 1-111 for function and connector type for each port.
Table 1-111
BMD2 module

Interface name Physical port # Function Connector type

Common In / Out 1/2 WSS Switch Out port / Switch In port (if LC
WSS is a NTK553KCE5 variant)
WSS Drop Out port / Add In port (if WSS
is a NTK553KAE5 variant)

Input 1 In / Out 3/4 CMD44 50 GHz or Enhanced CMD44 50 LC


Input 2 In / Out 5/6 GHz Common Out/CMD44 50 GHz or
Enhanced CMD44 50 GHz Common In

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to BMD2 modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the BMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
BMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the BMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the BMD2 optical interface module.

Table 1-112
Technical specifications for BMD2 optical interface modules

Parameter BMD2 (NTT862DAE5)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 4.2 kg (9.0 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
Working bandwidth 1528 to 1570 nm
Max insertion loss (Mux ports) 3.8 dB
Max insertion loss (Demux ports) 4.15 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5)


Overview
The Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (also known as
UBMD2) is a cost effective way to increase capacity and performs three main
functions:
• 50/50 upgrade splitter/combiner that allows the Ciena SLTE to be inserted
into an existing wet plant that is to be shared with an existing incumbent’s
SLTE as part of an upgrade.
• isolator, as it stops the counter propagating power from reaching the
amplifier.
• transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.

This module is a 1U height and intended to be mounted in a bay.

The UBMD2 modules are only used in Submarine applications.

Figure 1-151 shows the faceplate of a UBMD2 module and Figure 1-152 on
page 1-424 provides a functional block diagram of the UBMD2 module.

Figure 1-151
UBMD2 module faceplate

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Figure 1-152
UBMD2 module block diagram (NTT862DCE5)

OSA Monitor Out 9

Passive
Common Out 2
Mux 2x2

Mux In 1 3
Mux In 2 5

Passive
Demux 1x2 Common In 1

Demux Out 1 4
Demux Out 2 6

Isolator In 7
Isolator
Isolator Out 8

Equipment
Inventory Inventory
(RJ-45)

Legend
OSA Optical Spectrum Analyzer

Supported functionality
The UBMD2 module (NTT862DCE5) provides the following functionality:
• the UBMD2 modules are passive modules and therefore do not require
DC power
• although the UBMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UBMD2 RJ45
port to the NTK505MBE5 access panel external slot ports).

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— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5


access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the UBMD2 RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UBMD2 RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UBMD2 RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the UBMD2 module's RJ45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UBMD2 RJ45 port to the access panel external slot
ports).
• see Table 1-113 for function and connector type for each port.
Table 1-113
UBMD2 module

Interface name Physical port # Function Connector type

Common In / Out 1/ 2 50/50% Coupler / Splitter Common SC / SC

In Mux 1 / Out Demux 1 3/4 Upgrade in/out pair 1 (50% or 3dB) SC / SC

In Mux 2 / Out Demux 2 5/ 6 Upgrade in/out pair 2 (50% or 3dB) SC / SC

Isolator In / Out 7/ 8 Optical Isolator SC / SC

OSA Monitor Out 9 A copy of the common out signal SC

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to UBMD2 modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the UBMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
UBMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the UBMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the UBMD2 optical interface module.

Table 1-114
Technical specifications for UBMD2 optical interface modules

Parameter UBMD2 (NTT862DCE5)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 4.2 kg (9.0 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
Working bandwidth 1528 to 1570 nm
Max insertion loss (Add or Drop) 3.8 dB
Max insertion loss (Isolator) 0.7 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5)


Overview
The Monitor Broadband Mux/Demux 1x2 (MBMD2) module (also known as
MBMD2) is a cost effective way to increase capacity and to provide a point
where submarine line monitoring equipment can be inserted and extracted.
As submarine lines use a Coherent (or Correlated) OTDR (C-OTDR) test set
to detect repeater and fiber conditions (cuts, reflection points, etc.), the
MBMD2 provides a 90/10 Splitter/Combiner port where the CODTR or other
equipment can be connected for fiber measurements. The 10% splitter output
is also connected to the OSIC/ISS Rx port during normal operation, when the
submarine line has an OSIC/ISS supported supervisory capability.

This module is a 1U height and intended to be mounted in a bay.

The MBMD2 modules are only used in Submarine applications.

Figure 1-153 shows the faceplate of a MBMD2 module and Figure 1-154 on
page 1-429 provides a functional block diagram of the MBMD2 module.

Figure 1-153
MBMD2 module faceplate

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Figure 1-154
MBMD2 module block diagram (NTT862DDE5)

Common Out 2
Passive
90% / 10% Mux In 1 (90%) 3
Mux 2x1
Mux In 2 (10%) 5

Passive
90% / 10% Common In 1
Demux 1x2
Demux Out 1 (90%) 4
Demux Out 2 (10%) 6

Equipment
Inventory Inventory
(RJ-45)

Supported functionality
The MBMD2 modules (NTT862DDE5) provide the following functionality:
• the MBMD2 modules are passive modules and therefore do not require
DC power
• although the MBMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MBMD2 RJ45
port to the NTK505MBE5 access panel external slot ports).

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— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5


access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the MBMD2 RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MBMD2 RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MBMD2 RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the MBMD2 module's RJ45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MBMD2 RJ45 port to the access panel external slot
ports).
• see Table 1-115 for function and connector type for each port.
Table 1-115
MBMD2 module

Interface name Physical port # Function Connector type

Common In / Out 1/ 2 90/100% Coupler / Splitter Common SC / SC

In Mux 1 / Out Demux 1 3/4 Through in/out pair 1 (90% or 1dB) SC / SC

In Mux 2 / Out Demux 2 5/ 6 Monitor in/out pair 2 (10% or 10-dB) SC / SC

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to MBMD2 modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the MBMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
MBMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the MBMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the MBMD2 optical interface module.

Table 1-116
Technical specifications for MBMD2 optical interface modules

Parameter MBMD2 (NTT862DDE5)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 4.2 kg (9.0 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
Working bandwidth 1528 to 1570 nm
Max insertion loss (Add or Drop), 90% path 1.1 dB
Max insertion loss (Add or Drop), 10% path 11.5 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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C/L-Band Mux/Demux (CLMD) module (NTK504PA)


Overview
The C/L-Band Mux/Demux (CLMD) module (also known as CLMD) is a cost
effective way to increase capacity and performs three main functions:
• multiplexing (combining) or demultiplexing (splitting) the C and L-Band
signals.
• isolator, as it stops the counter propagating power from reaching the
amplifier.
• transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.

The CLMD module is intended to be equipped in a 1U height OMC2 chassis.

The CLMD modules are only used in Submarine C-Band or L-Band


applications.

Figure 1-155 shows the faceplate of a CLMD module and Figure 1-156
provides a functional block diagram of the CLMD module.

Figure 1-155
CLMD module faceplate

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Figure 1-156
CLMD module block diagram (NTK504PA)

C-Band In 3

L-Band In 5

Common-Out 2

Monitor 2 Out 12

Monitor 1 Out 11

Common In 1

C-Band Out 4

L-Band Out 6

Isolator C-Band Isolator In 7

C-Band Isolator Out 8

Isolator L-Band Isolator In 9

L-Band Isolator Out 10

Equipment
Inventory Inventory
(RJ-45)

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Supported functionality
The CLMD module (NTK504PA) provides the following functionality:
• the CLMD modules are passive modules and therefore do not require DC
power
• although the CLMD module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CLMD RJ45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CLMD RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CLMD RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CLMD RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CLMD module's RJ45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CLMD RJ45 port to the access panel external slot
ports).
• see Table 1-117 on page 1-436 for function and connector type for each
port.

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Table 1-117
CLMD module

Interface name Physical port # Function Connector type

Common In / Out 1/ 2 Combined C/L-Band input/output LC / LC

C-Band In / C-Band Out 3/4 C-Band mux/demux signal LC / LC

L-Band In / L-Band Out 5/6 L-Band mux/demux signal LC / LC

C-Band Isolator In / Out 7/ 8 C-Band optical Isolator LC / LC

L-Band Isolator In / Out 9/ 10 L-Band optical Isolator LC / LC

Monitor 1 Out 11 Monitor port for C-Band mux/demux LC


signal

Monitor 2 Out 12 Monitor port for L-Band mux/demux LC


signal

Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to CLMD modules:
• occupies one of the half-width slots of OMC2 chassis
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.

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• the CLMD module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
CLMD module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the CLMD modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CLMD optical interface module.

Table 1-118
Technical specifications for CLMD optical interface modules

Parameter CLMD (NTK504PA)


Weight (estimated) 1.6 kg (3.5 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Transmission/Reflection working C-Band bandwidth 1504.5 to 1565.3 nm/1569.8 to 1610.5 nm
Transmission/Reflection working L-Band bandwidth 1569.8 to 1610.5 nm/1504.5 to 1565.3 nm
Max Common In to C-Band Out EOL 2.25 dB
Max Common In to L-Band Out EOL 2.05 dB
Min C-Band In to Common Out EOL 0.4 dB (in addition to the maximum insertion
loss)
Max C-Band In to Common Out EOL 1.85 dB
Min L-Band In to Common Out EOL 0.4 dB (in addition to the maximum insertion
loss)
Max L-Band In to Common Out EOL 1.65 dB
Max insertion loss (Isolator) 0.7 dB
Output monitor insertion loss EOL 12.2 to 14.1 dB
Input monitor insertion loss EOL 13 to 14.4 dB
Minimum return loss 45 dB
Min Common In to L-Band Out filter isolation 30 dB
Min Common In to C-Band Out filter isolation 35 dB
Min C-Band In to Common Out filter isolation 20 dB
Min L-Band In to Common Out filter isolation 15 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Upgrade Coupler/Splitter (UCS) module (NTK504PL)


Overview
The Upgrade Coupler/Splitter (UCS) module (also known as UCS) is a cost
effective way to increase capacity and performs three main functions:
• 50/50 upgrade splitter/combiner that allows the Ciena SLTE to be inserted
into an existing wet plant that is to be shared with an existing incumbent’s
SLTE as part of an upgrade.
• isolator, as it stops the counter propagating power from reaching the
amplifier.
• transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.

The UCS module is intended to be equipped in a 1U height OMC2 chassis.

The UCS modules are only used in Submarine C-Band or L-Band


applications.

Figure 1-157 shows the faceplate of a UCS module and Figure 1-158 on page
1-440 provides a functional block diagram of the UCS module.

Figure 1-157
UCS module faceplate

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Figure 1-158
UCS module block diagram (NTK504PL)

Upgrade
Ch-In 1 3

Mux
Ch-In 2 5

Common-Out 2

Isolator OSA Monitor Out 9

Common-In 1

Upgrade
DeMux
Ch-Out 1 4

Ch-Out 2 6

Isolator C-Band Isolator In 7

C-Band Isolator Out 8

Equipment
Inventory Inventory
(RJ-45)

Legend
OSA Optical Spectrum Analyzer

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Supported functionality
The UCS module (NTK504PL) provides the following functionality:
• the UCS modules are passive modules and therefore do not require DC
power
• although the UCS module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UCS RJ45 port
to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the UCS RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UCS RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UCS RJ45 port
to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the UCS module's RJ45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UCS RJ45 port to the access panel external slot ports).
• see Table 1-119 for function and connector type for each port.

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Table 1-119
UCS module

Interface name Physical port # Function Connector type

Common In / Out 1/ 2 50/50% Coupler / Splitter Common LC / LC

Mux In 1 / Demux 1 Out 3/4 Upgrade in/out pair 1 (50% or 3dB) LC / LC

Mux In 2 / Demux 2 Out 5/ 6 Upgrade in/out pair 2 (50% or 3dB) LC / LC

Isolator In / Out 7/ 8 Optical Isolator LC / LC

OSA Monitor Out 9 A copy of the common out signal LC

Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

OPTMON alarms
• Loss Of Signal
Adjacency alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• High Fiber Loss

Equipping rules
The following equipping rules apply to UCS modules:
• occupies one of the half-width slots of OMC2 chassis.
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.

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• the UCS module must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
the UCS module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the UCS modules do not use any cross-connect capacity and can be used
with shelves equipped with or without cross-connect circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the UCS optical interface module.

Table 1-120
Technical specifications for UCS optical interface modules

Parameter UCS (NTK504PL)


Weight (estimated) 1.6 kg (3.5 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
Working bandwidth 1527 to 1610.5 nm
Max insertion loss (Add or Drop) 3.9 dB
Max insertion loss (Isolator) 0.7 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Monitor Coupler/Splitter (MonCS) nodule (NTK504PN)


Overview
The Monitor Coupler/Splitter (MonCS) module (also known as MonCS) is a
cost effective way to increase capacity and to provide a point where
submarine line monitoring equipment can be inserted and extracted.
Submarine lines use a Coherent (or Correlated) OTDR (C-OTDR) test set to
detect repeater and fiber conditions (cuts, reflection points, etc.) and the
MonCS provides a 90/10 Splitter/Combiner port where the CODTR or other
equipment can be connected for fiber measurements. The 10% splitter output
is also connected to the OSIC/ISS Rx port during normal operation, when the
submarine line has an OSIC/ISS supported supervisory capability.

The MonCS modules are only used in Submarine C-Band or L-Band


applications and can be considered a replacement for the MBMD2 modules
(NTT862DDE5) 2 x 10%/90% couplers. An improvement in the MonCS design
versus the MBMD2 is the higher density ½ width module with LC connectors.

The MonCS module is intended to be equipped in a 1U height OMC2 chassis.

Figure 1-159 shows the faceplate of a MonCS module and Figure 1-160 on
page 1-445 provides a functional block diagram of the MonCS module.

Figure 1-159
MonCS module faceplate

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Figure 1-160
MonCS module block diagram (NTK504PN)

Common Out 2
Passive
90% / 10% Mux In 1 (90%) 3
Mux 2x1
Mux In 2 (10%) 5

Passive
90% / 10% Common In 1
Demux 1x2
Demux Out 1 (90%) 4
Demux Out 2 (10%) 6

Equipment
Inventory Inventory
(RJ-45)

Supported functionality
The MonCS module (NTK504PN) provides the following functionality:
• the MonCS modules are passive modules and therefore do not require DC
power
• although the MonCS module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MonCS RJ45
port to the NTK505MBE5 access panel external slot ports).

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— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5


access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the MonCS RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MonCS RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MonCS RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the MonCS module's RJ45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MonCS RJ45 port to the access panel external slot
ports).
• see Table 1-121 for function and connector type for each port.
Table 1-121
MonCS module

Interface name Physical port # Function Connector type

Common In / Out 1/ 2 90/100% Coupler / Splitter Common LC-UPC

Mux 1 In / Demux 1Out 3/4 Through in/out pair 1 (90% or 1dB) LC-UPC

Mux 2 In / Demux 2 Out 5/ 6 Monitor in/out pair 2 (10% or 10-dB) LC-UPC

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

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Equipping rules
The following equipping rules apply to MonCS modules:
• occupies one of the half-width slots of OMC2 chassis.
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the MonCS module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
the MonCS module connects to (by using the NTTC09BME6 or
NTTC09DM cable assembly) and its assigned OTS reside.
• the MonCS modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

Provisioning rules
The following equipping rule applies to the MonCS:
• The MonCS module is only used in Submarine C-Band or L-Band
applications. submarine. Refer to the Submarine Networking Application
Guide, NTRN72AA for submarine details.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the MonCS optical interface module.

Table 1-122
Technical specifications for MonCS optical interface modules

Parameter MonCS (NTK504PN)


Dimension Height: 39 mm / 1.54 in.
Width: 207 mm / 8.25 in.
Depth: 215 mm / 8.46 in.
Weight (estimated) 1.2 kg (2.6 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 24 dBm
Minimum return loss 45 dB
Working bandwidth 1528 to 1570 nm
Max insertion loss (Add or Drop), 90% path 1.1 dB
Max insertion loss (Add or Drop), 10% path 11.5 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10


Group Mux/Demux (GMD10) L-Band module (NTT862GL)
Overview
The 10 Group Mux/Demux (GMD10) C-Band module (also known as GMD10
C-Band) and 10 Group Mux/Demux (GMD10) L-Band module (also known as
GMD10 L-Band) are cost effective ways to provide multiplexing points for
channels from CCMD12 C-Band and CCMD12 L-Band circuit packs. The
GMD10 C-Band and GMD10 L-Band are passive modules and enable the
system to utilize the spectrum better as they remove the restrictions on
channel spacing within the groups. The GMD10 C-Band module is used
together with CCMD12 C-Band circuit pack and the GMD10 L-Band module
is used together with CCMD12 L-Band circuit pack. The GMD10 L-Band
modules are only used in Submarine applications.

Each GMD10 C-Band or GMD10 L-Band module includes 10 wide groups


(one Mux/Demux port per group) with no restrictions on channel spacing
within the groups. Table 1-123 on page 1-450 shows the supported frequency
range and wavelength range for each group in GMD10 C-Band module.
Table 1-124 on page 1-450 shows the supported frequency range and
wavelength range for each group in GMD10 L-Band module.

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Table 1-123
Supported frequency range and wavelength range for each group in a GMD10
C-Band module

Group# Frequency range (THz) Wavelength range (nm)

1 196.215 to 195.485 1527.88 to 1533.58

2 195.735 to 195.005 1531.62 to 1537.36

3 195.255 to 194.525 1535.39 to 1541.15

4 194.775 to 194.045 1539.17 to 1544.96

5 194.295 to 193.565 1542.98 to 1548.79

6 193.815 to 193.085 1546.80 to 1552.64

7 193.335 to 192.605 1550.64 to 1556.51

8 192.855 to 192.125 1554.50 to 1560.40

9 192.375 to 191.645 1558.38 to 1564.31

10 191.895 to 191.165 1562.27 to 1568.24

Table 1-124
Supported frequency range and wavelength range for each group in a GMD10
L-Band module

Group# Frequency range (THz) Wavelength range (nm)

1 191.156 to 190.426 1568.31 to 1574.33

2 190.676 to 189.946 1572.26 to 1578.30

3 190.196 to 189.466 1576.23 to 1582.30

4 189.716 to 188.986 1580.22 to 1586.32

5 189.236 to 188.506 1584.23 to 1590.36

6 188.756 to 188.026 1588.25 to 1594.42

7 188.276 to 187.546 1592.30 to1598.50

8 187.796 to 187.066 1596.37 to 1602.60

9 187.316 to 186.586 1600.46 to 1606.73

10 186.836 to 186.106 1604.58 to 1610.87

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Figure 1-161 shows the faceplate of a GMD10 (C-Band or L-Band) circuit


pack. Figure 1-162 on page 1-452 provides a functional block diagram of the
GMD10 (C-Band or L-Band) circuit pack. For GMD10 L-Band circuit pack, the
circuit pack’s block diagram is the same as GMD10 C-Band circuit pack’s
block diagram.

Figure 1-161
GMD10 C-Band module faceplate

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Figure 1-162
GMD10 (C-Band and L-Band) module block diagram (NTT862GA and NTT862GL)

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Supported functionality
The GMD10 modules (NTT862GA and NTT862GL) provide the following
functionality:
• the GMD10 modules are passive modules and therefore do not require DC
power
• although the GMD10 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the GMD10 RJ45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the GMD10 RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the GMD10 RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the GMD10 RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the GMD10 RJ45 port to the NTK505JA access panel external slot
ports).
• see Table 1-125 on page 1-454 for function and connector type for each
port.

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Table 1-125
GMD10 module (C-Band and L-Band)

Interface name Physical port # Function Connector type

Common In / Out 1/2 • For GMD10 C-Band variant: Optical LC


input /output to/from the WSS Flex
C-Band w/OPM 9x1 or MBMD2 circuit
pack
• For GMD10 L-Band variant: Optical
input /output to/from the WSS Flex
L-Band w/OPM 8x1 circuit pack

Group 1 In / Out 3/4 • For GMD10 C-Band variant: Optical LC


Group 2 In / Out 5/6 input / output channels from Common
In / Out ports of CCMD12 C-Band
Group 3 In / Out 7/8
• For GMD10 L-Band variant: Optical
Group 4 In / Out 9 / 10 input / output channels from Common
Group 5 In / Out 11 / 12 In / Out ports of CCMD12 L-Band
Group 6 In / Out 13 / 14
Group 7 In / Out 15 / 16
Group 8 In / Out 17 / 18
Group 9 In / Out 19 / 20
Group 10 In / Out 21 / 22

Monitor Out 24 Monitor port for GMD10 Mux Out LC

Alarms
Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Adjacency alarms
• Adjacency Mismatch
• Duplicate Adjacency Discovered
• High Fiber Loss

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Equipping rules
The following equipping rules apply to GMD10 modules (C-Band and L-Band):
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• cannot be equipped with the 2-slot shelf.
• the GMD10 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf) that
GMD10 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
• the GMD10 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the GMD10 (C-Band and L-Band) optical interface module.

Table 1-126
Technical specifications for GMD10 optical interface modules (C-Band and L-Band)

Parameter GMD10 C-Band (NTT862GA) GMD10 L-Band (NTT862GL)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 3.6 kg (7.9 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input power 27 dBm
Frequency range 196.215 THz to 191.165 THz 191.156 THz to 186.106 THz
Wavelength range 1527.88 nm to 1568.24 nm 1568.31 nm to 1610.87 nm
Maximum insertion loss (Demux 6.5 dB
ports)
Minimum insertion loss (Demux ports) 5.5 dB

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Table 1-126
Technical specifications for GMD10 optical interface modules (C-Band and L-Band)

Parameter GMD10 C-Band (NTT862GA) GMD10 L-Band (NTT862GL)


Maximum insertion loss (Mux ports) 7.0 dB
Minimum insertion loss (Mux ports) 6.0 dB
Maximum insertion loss (Monitor port) 18.5 dB
Minimum insertion loss (Monitor port) 15.5 dB
Maximum Insertion loss variation 0.5 dB
across all groups
Minimum return loss 45 dB

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB,


NTK504CC, NTK504CD, NTK504CE, and NTK504CF)
Overview
The FIM modules are intended to be mounted in a bay and Table 1-127 lists
the different variants of FIM Modules supported in this release.

Table 1-127
Supported FIM modules

Name (order code) Also known Function Upgrade support


as

Fiber Interconnect FIM Type 1 Provides simplified The upgrade ports on a FIM
Module (FIM) Type 1 interconnects for up to Type 1 can be used to perform
(NTK504CA) • eight WSS Flex C-Band add/drop expansion for
w/OPM 20x1 circuit packs CCMD8x16 channels by using
(degree connections), and FIM Type 2 (supported in a
future release).
• 11 CCMD8x16 circuit packs
(add/drop ports)

Fiber Interconnect FIM Type 2 Provides simplified N/A


Module (FIM) Type 2 interconnects for up to
(NTK504CB) • eight WSS Flex C-Band
w/OPM 20x1 circuit packs
(degree connections), and
• 20 CCMD8x16 circuit packs
(add/drop ports)

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Table 1-127
Supported FIM modules

Name (order code) Also known Function Upgrade support


as

Fiber Interconnect FIM Type 3 Provides simplified The upgrade ports on a FIM
Module (FIM) Type 3 interconnects for up to Type 3 can be used to perform
(NTK504CC) • 14 WSS Flex C-Band w/OPM add/drop expansion
20x1 circuit packs (degree (supported in a future release).
connections), and
• 10 SMD Flex 14x8 circuit
packs (add/drop ports),
The maximum number of
connected circuit packs
(whether WSS Flex C-Band
w/OPM 20x1 or SMD Flex
14x8) is 20. For example,
• 10 degrees + 10 SMD14x8s
corresponds to 100% of the
add/drop capacity), or
• 14 degrees + 6 SMD14x8s
corresponds to ~ 42.86% of
the add/drop capacity).
Note that the CCMD12 C-Band
circuit packs (up to 8) connect
to each of the SMD14x8 circuit
packs, and not connected
directly to the FIM Type 3.

Fiber Interconnect FIM Type 4 Provides simplified N/A


Module (FIM) Type 4 interconnects for up to four
(NTK504CD) WSS Flex C-Band w/OPM
20x1, four SMD Flex 14x8
circuit packs or 20 CCMD12
C-Band circuit packs.

Fiber Interconnect FIM Type 5 Provides simplified The upgrade ports on a FIM
Module (FIM) Type 5 interconnects for up to five WSS Type 5 can be used to perform
(NTK504CE) Flex C-Band w/OPM 20x1 add/drop expansion
circuit packs. (supported in a future release).

Fiber Interconnect FIM Type 6 Provides simplified N/A


Module (FIM) Type 6 interconnects for up to ten WSS
(NTK504CF) Flex C-Band w/OPM 20x1
circuit packs.

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• Figure 1-163 on page 1-459 shows the faceplate of a FIM Type 1 module.
• Figure 1-164 on page 1-460 shows the faceplate of a FIM Type 2 module.
• Figure 1-165 on page 1-460 shows the faceplate of a FIM Type 3 module.
• Figure 1-166 on page 1-460 shows the faceplate of a FIM Type 4 module.
• Figure 1-167 on page 1-461 shows the faceplate of a FIM Type 5 module.
• Figure 1-168 on page 1-461 shows the faceplate of a FIM Type 6 module.
• Figure 1-169 on page 1-462 provides a functional block diagram of the
FIM Type 1 module
• Figure 1-170 on page 1-463 provides a functional block diagram of the
FIM Type 2.
• Figure 1-171 on page 1-464 provides a functional block diagram of the
FIM Type 3.
• Figure 1-172 on page 1-465 provides a functional block diagram of the
FIM Type 4.
• Figure 1-173 on page 1-466 provides a functional block diagram of the
FIM Type 5.
• Figure 1-174 on page 1-467 provides a functional block diagram of the
FIM Type 6.
Figure 1-163
FIM Type 1 module faceplate

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Figure 1-164
FIM Type 2 module faceplate

Figure 1-165
FIM Type 3 module faceplate

Figure 1-166
FIM Type 4 module faceplate

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Figure 1-167
FIM Type 5 module faceplate

Figure 1-168
FIM Type 6 module faceplate

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Figure 1-169
FIM Type 1 module block diagram (NTK504CA)

Legend

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Figure 1-170
FIM Type 2 module block diagram (NTK504CB)

Legend

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Figure 1-171
FIM Type 3 module block diagram (NTK504CC)

Legend

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Figure 1-172
FIM Type 4 module block diagram (NTK504CD)

Legend

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Figure 1-173
FIM Type 5 module block diagram (NTK504CE)

Legend

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Figure 1-174
FIM Type 6 module block diagram (NTK504CF)

Legend

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Supported functionality
The FIM Type 1 module (NTK504CA), FIM Type 2 module (NTK504CB), FIM
Type 3 module (NTK504CC), FIM Type 4 module (NTK504CD), FIM Type 5
module (NTK504CE), and
FIM Type 6 module (NTK504CF) provide the following functionality:
• are passive modules and therefore do not require DC power.
• see Table 1-128 for supported loopback modules in FIMs.
Table 1-128
FIM optical interfaces, loopback modules and dust caps

FIM type MPO ports Duplex LC connector positions

Number of pre-installed Number of Number of pre-installed Number of


MPO loopback modules dust caps duplex LC Loopback dust caps
(APC, SM, 12 Fiber) (SM) modules
(299-1576-001) (Note 1, (299-1575-001)
Note 2, and Note 3)

FIM Type 1 50 (MPO ports 5 to 54) 4 (MPO ports 16 (one for each duplex 0
1 to 4) LC connector position)

FIM Type 2 68 (MPO ports 5 to 72) 4 (MPO ports N/A N/A


1 to 4)

FIM Type 3 76 (MPO ports 5 to 80) 4 (MPO ports 20 (one for each duplex 0
1 to 4) LC connector position)

FIM Type 4 0 4 (MPO ports 20 (one for each duplex 0


1 to 4) LC connector position)

FIM Type 5 4 (MPO ports 2 to 5) 1 (MPO port 1) 5 (one for each duplex LC 0
connector position)

FIM Type 6 8 (MPO ports 2 to 5 and 2 (MPO ports N/A N/A


ports 7 to 10) 1 and 6)

Note 1: In addition to providing the optical loopback operation required by applications that use the
FIM, these loopback modules act as dust caps for the optical connectors.
Note 2: Do not remove the loopback modules except as part of a fiber installation procedure. Any FIM
connector not equipped with a loopback module or fiber patch cord must be equipped with a dust cap.
The FIM tray assembly includes a bag of dust caps that must be put on any loopback module that is
being removed and saved for future use. Removing the loopback and replacing with a simple dust cap
in FIMs could result in High Fiber Loss.
Note 3: With the exception of Upgrade (UPG) and CMD In/Out ports on the FIM Type 4, related optical
signals are bundled through 12-fiber MPO connectors for fiber management simplification. Use
MPO(F)-MPO(F), APC, 12 Fiber, SM fiber crossover patchcords such as NTTC97Ax or NTTC97AxV6.
Refer to “Cables” section in Planning - Ordering Information, 323-1851-151.

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• although the FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type
5, and FIM Type 6 modules are passive devices, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the FIM module’s RJ45 port to the
NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the FIM module’s RJ45 port to the NTK605MAE5
access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09DM cable assembly is required to connect the FIM
module’s RJ45 port to the NTK505PAE5 access panel external slot
ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly
is required to connect the FIM module’s RJ45 port to the NTK555NA
or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the FIM module’s
RJ45 port to the NTK505JA access panel external slot ports).
• see the following table for function and connector type for each port.

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Table 1-129
FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM Type 6 modules

Interface name Physical port # FIM Type Function Connector type

WSS ports (applied to all FIM types except FIM Type 3)

WSS1 A/B/C/D 1/2/3/4 • FIM Type 1 WSS ports on FIM Type 1 or 12-Fiber
WSS2 A/B/C/D 5/6/7/8 • FIM Type 2 FIM Type 2 module are MPO/APC Male
WSS3 A/B/C/D 9/10/11/12 connected to WSS Flex C-Band
WSS4 A/B/C/D 13/14/15/16 w/OPM 20x1 circuit packs (up
WSS5 A/B/C/D 17/18/19/20 to eight).
WSS6 A/B/C/D 21/22/23/24 (Note)
WSS7 A/B/C/D 25/26/27/28
WSS8 A/B/C/D 29/30/31/32

1 1 FIM Type 4 WSS ports on FIM Type 4 12-Fiber


2 2 module are connected to WSS MPO/APC Male
3 3 Flex C-Band w/OPM 20x1
4 4 circuit packs (up to four). In this
release, two MPO ports on a
FIM Type 4 are dedicated to the
same WSS Flex C-Band
w/OPM 20x1 circuit pack,
therefore a FIM Type 4 module
can be connected to up to only
two different WSS Flex C-Band
w/OPM 20x1 circuit packs. In
future releases, a FIM Type 4
module can be connected to up
to four different WSS Flex
C-Band w/OPM 20x1 circuit
packs.
(Note)

1 1 FIM Type 5 WSS ports on FIM Type 5 12-Fiber


2 2 module are connected to WSS MPO/APC Male
3 3 Flex C-Band w/OPM 20x1
4 4 circuit packs (up to five).
5 5 (Note)

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Table 1-129
FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM Type 6 modules

Interface name Physical port # FIM Type Function Connector type

1 1 FIM Type 6 WSS ports on FIM Type 6 12-Fiber


2 2 module are connected to WSS MPO/APC Male
3 3 Flex C-Band w/OPM 20x1
4 4 circuit packs (up to ten).
5 5 (Note)
6 6
7 7
8 8
9 9
10 10

Fiber Group ports (applied to FIM Type 3 module)

Fiber Groups Physical ports FIM Type 3 Up to 20 Fiber Groups (four 12-Fiber
A/B/C/D including: ports per Fiber Group) on FIM MPO/APC Male
including: Type 3 module are connected
• Fiber Group 1 • 1/2/3/4 to WSS Flex C-Band w/OPM
20x1 circuit packs for degree
• Fiber Group 2 • 5/6/7/8 interconnect or SMD Flex 14x8
• Fiber Group 3 • 9/10/11/12 circuit packs for add/drop
• Fiber Group 4 • 13/14/15/16 interconnect.

• Fiber Group 5 • 17/18/19/20 (See Note)

• Fiber Group 6 • 21/22/23/24


• Fiber Group 7 • 25/26/27/28
• Fiber Group 8 • 29/30/31/32
• Fiber Group 9 • 33/34/35/36
• Fiber Group 10 • 37/38/39/40
• Fiber Group 11 • 41/42/43/44
• Fiber Group 12 • 45/46/47/48
• Fiber Group 13 • 49/50/51/52
• Fiber Group 14 • 53/54/55/56
• Fiber Group 15 • 57/58/59/60
• Fiber Group 16 • 61/62/63/64
• Fiber Group 17 • 65/66/67/68
• Fiber Group 18 • 69/70/71/72
• Fiber Group 19 • 73/74/75/76
• Fiber Group 20 • 77/78/79/80

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Table 1-129
FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM Type 6 modules

Interface name Physical port # FIM Type Function Connector type

Upgrade ports (applied to FIM Type 1, FIM Type 3, and FIM Type 5 modules)

UPG1A In/Out 33/34 FIM Type 1 Up to eight upgrade ports on LC-UPC


UPG1B In/Out 35/36 FIM Type 1 module are
UPG2A In/Out 37/38 connected to WSS Flex C-Band
UPG2B In/Out 39/40 w/OPM 20x1 circuit packs for
UPG3A In/Out 41/42 add/drop expansion.
UPG3B In/Out 43/44
UPG4A In/Out 45/46
UPG4B In/Out 47/48
UPG5A In/Out 49/50
UPG5B In/Out 51/52
UPG6A In/Out 53/54
UPG6B In/Out 55/56
UPG7A In/Out 57/58
UPG7B In/Out 59/60
UPG8A In/Out 61/62
UPG8B In/Out 63/64

UPG 1 In/Out 81/82 FIM Type 3 Up to 20 upgrade ports on FIM LC-UPC


UPG 2 In/Out 83/84 Type 3 module are connected
UPG 3 In/Out 85/86 to WSS Flex C-Band w/OPM
UPG 4 In/Out 87/88 20x1 circuit packs for add/drop
UPG 5 In/Out 89/90 expansion.
UPG 6 In/Out 91/92
UPG 7 In/Out 93/94
UPG 8 In/Out 95/96
UPG 9 In/Out 97/98
UPG 10 In/Out 99/100
UPG 11 In/Out 101/102
UPG 12 In/Out 103/104
UPG 13 In/Out 105/106
UPG 14 In/Out 107/108
UPG 15 In/Out 109/110
UPG 16 In/Out 111/112
UPG 17 In/Out 113/114
UPG 18 In/Out 115/116
UPG 19 In/Out 117/118
UPG 20 In/Out 119/120

UPG 1 Out/In 10/11 FIM Type 5 Upgrade ports on FIM Type 5 LC-UPC
UPG 2 Out/In 20/21 module are connected to WSS
UPG 3 Out/In 30/31 Flex C-Band w/OPM 20x1
UPG 4 Out/In 40/41 circuit packs (up to five).
UPG 5 Out/In 40/41 Upgrade ports on FIM Type 5
module are not supported in this
release.

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Table 1-129
FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM Type 6 modules

Interface name Physical port # FIM Type Function Connector type

CMD ports (applied to FIM Type 1, FIM Type 2 and FIM Type 4 modules)

CMD1 A/B 65/66 FIM Type 1 CMD ports on FIM Type 1 12-Fiber
CMD2 A/B 67/68 module are connected to MPO/APC Male
CMD3 A/B 69/70 CCMD8x16 ports (up to 11).
CMD4 A/B 71/72 (Note)
CMD5 A/B 73/74
CMD6 A/B 75/76
CMD7 A/B 77/78
CMD8 A/B 79/80
CMD9 A/B 81/82
CMD10 A/B 83/84
CMD11 A/B 85/86

CMD1 A/B 33/34 FIM Type 2 CMD ports on FIM Type 2 12-Fiber
CMD2 A/B 35/36 module are connected to MPO/APC Male
CMD3 A/B 37/38 CCMD8x16 ports (up to 20).
CMD4 A/B 39/40 (Note)
CMD5 A/B 41/42
CMD6 A/B 43/44
CMD7 A/B 45/46
CMD8 A/B 47/48
CMD9 A/B 49/50
CMD10 A/B 51/52
CMD11 A/B 53/54
CMD12 A/B 55/56
CMD13 A/B 57/58
CMD14 A/B 59/60
CMD15 A/B 61/62
CMD16 A/B 63/64
CMD17 A/B 65/66
CMD18 A/B 67/68
CMD19 A/B 69/70
CMD20 A/B 70/72

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Table 1-129
FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM Type 6 modules

Interface name Physical port # FIM Type Function Connector type

CMD1 Out/In 10/11 FIM Type 4 CMD ports on FIM Type 4 LC-UPC
CMD2 Out/In 12/13 module are connected to
CMD3 Out/In 14/15 CCMD12 C-Band ports (up to
CMD4 Out/In 16/17 20).
CMD5 Out/In 18/19
CMD6 Out/In 20/21
CMD7 Out/In 22/23
CMD8 Out/In 24/25
CMD9 Out/In 26/27
CMD10 Out/In 28/29
CMD11 Out/In 30/31
CMD12 Out/In 32/33
CMD13 Out/In 34/35
CMD14 Out/In 36/37
CMD15 Out/In 38/39
CMD16 Out/In 40/41
CMD17 Out/In 42/43
CMD18 Out/In 44/45
CMD19 Out/In 46/47
CMD20 Out/In 48/49

Note: For these ports, use MPO(F)-MPO(F), APC, 12 Fiber, SM fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch
• Cable Trace Compromised

Photonic alarms
• Adjacency Mismatch
• Adjacency Far End Not Discovered

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Equipping rules
The following equipping rules apply to FIM modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• cannot be equipped with the 2-slot shelf.
• the FIM modules must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in 7-slot Type 2 shelf that FIM module connects to (by using
the NTTC09DM cable assembly) and its assigned OTS reside.

CAUTION
Risk of damage to MPO cables
Before you close the FIM door, make sure you bend the flexible
boots of the MPO cables to allow the cables to route to the side
of the FIM. Otherwise, you can pinch the optical fiber. Refer to
the procedure on connecting or disconnecting fiber-optic
cables in the Installation technical publication specific to your
6500 shelf type (323-1851-201.x).

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM
Type 5, and FIM Type 6 optical interface modules.

Table 1-130

Parameter FIM Type 1 FIM Type 2 FIM Type 4 FIM Type 5 FIM Type 6
(NTK504CA) (NTK504CB) (NTK504CD) (NTK504CE) (NTK504CF)
Dimension Height: 3U (133 mm / 5.2 in.) Height: 1U (43 mm / 1.7 in.)
Width: 439 mm / 17.25 in. Width: 438.1 mm / 17.25 in.
Depth: 281 mm / 11.06 in. Depth: 280 mm / 11.02 in.
Weight (estimated) 7.8 kg (17.2 lb) 5.3 kg (11.7 lb) 5.2 kg (11.5 lb) 4.2 kg (9.3 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Maximum total Input 24 dBm (Note)
power
Minimum return loss 50 dB
Working bandwidth 1528 to 1570 nm
Max insertion loss: 1.4 dB N/A 1.4 1.4
MPO-MPO connections
Max insertion loss: 1.1 N/A 1.1 1.1 N/A
MPO-LC connections
Note: For a FIM Type 4 module and to respect the 1M laser safety limit on the aggregate MPO output,
the individual input powers to the LC ports must be <=13dBm.

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Table 1-131
Technical specifications for FIM Type 1, FIM Type 2, FIM Type 3, FIM Type 4, FIM Type 5, and FIM
Type 6 optical interface modules

Parameter FIM Type 1 FIM Type 2 FIM Type 3 FIM Type 4 FIM Type 5 FIM Type 6
(NTK504CA) (NTK504CB) (NTK504CC) (NTK504CD) (NTK504CE) (NTK504CF)
Dimension • Height: 3U (133 mm / 5.2 • Height: 4U • Height: 1U (43 mm / 1.7 in.)
in.) (177 mm / • Width: 438.1 mm / 17.25 in.
• Width: 439 mm / 17.25 in. 6.95 in.)
• Depth: 280 mm / 11.02 in.
• Depth: 281 mm / 11.06 in. • Width: 439
mm / 17.25 in.
• Depth: 281
mm / 11.06 in.
Weight 7.8 kg (17.2 lb) 9.3 kg (20.4 lb) 5.3 kg (11.7 lb) 5.2 kg (11.5 lb) 4.2 kg (9.3 lb)
(estimated)
Power Typical (W): 0
consumption Power Budget (W): 0
Maximum 24 dBm (Note)
total Input
power
Minimum 50 dB
return loss
Working 1528 to 1570 nm
bandwidth
Max insertion 1.4 dB 1.4 dB N/A 1.4
loss:
MPO-MPO
connections
Max insertion 1.1 N/A 1.1 1.1 1.1 N/A
loss:
MPO-LC
connections
Note: For a FIM Type 4 module and to respect the 1M laser safety limit on the aggregate MPO output, the
individual input powers to the LC ports must be <=13dBm.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA)


Overview
The Optical Service Channel (OSC) Filter (1516.9 nm) module (also known as
OSC Filter (1516.9 nm) is used to alleviate ASE issues for Four Wave Mixing
(FWM) in TWRS fiber.
The NTK592NR OSC SFP must always be used with the OSC Filter
(1516.9 nm) module. It is only used in conjunction with the SRA circuit pack.
The NTK592NR SFP must be used if TWRS fiber is present on the span or
the span is over the CWDM SFP limits.

Figure 1-175 shows the faceplate of an OSC Filter (1516.9 nm) module and
Figure 1-176 on page 1-479 provides a functional block diagram of the OSC
Filter (1516.9 nm) module.

Figure 1-175
OSC Filter (1516.9 nm) module faceplate

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Figure 1-176
OSC Filter (1516.9 nm) module block diagram (NTK504BA)

Out

In

Equipment
Inventory Inventory
(RJ-45)

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Supported functionality
The OSC Filter (1516.9 nm) modules (NTK504BA) provide the following
functionality:
• the OSC Filter (1516.9 nm) modules are passive modules and therefore
do not require DC power
• although the OSC Filter (1516.9 nm) module is a passive device,
autoprovisioning and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OSC Filter
[1516.9 nm] RJ45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OSC Filter [1516.9 nm]
RJ45 port to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OSC Filter [1516.9 nm] RJ45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OSC Filter
[1516.9 nm] RJ45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OSC Filter [1516.9 nm] RJ45 port to the NTK505JA access panel
external slot ports).
• see Table 1-132 for function and connector type for each port.
Table 1-132
OSC Filter (1516.9 nm) module

Interface name Physical port # Function Connector type

In / Out 1/2 Input port is connected to OSC A Out LC


port of SRA circuit pack
Output port is connected to OSC SFP
of SRA circuit pack

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to OSC Filter (1516.9 nm) modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• cannot be equipped with the 2-slot shelf.
• the OSC Filter (1516.9 nm) module must be located in the same bay as
the access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf,
32-slot shelf) that OSC Filter (1516.9 nm) module connects to (by using
the NTTC09BME6 or NTTC09DM cable assembly) and its assigned OTS
reside.
• the OSC Filter (1516.9 nm) modules do not use any cross-connect
capacity and can be used with shelves equipped with or without
cross-connect circuit packs.

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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the OSC Filter (1516.9 nm) optical interface module.

Table 1-133
Technical specifications for OSC Filter (1516.9 nm) optical interface modules

Parameter OSC Filter (1516.9 nm) (NTK504BA)


Dimension Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated) 3.4 kg (7.5 lb)
Power consumption Typical (W): 0
Power Budget (W): 0
Insertion loss 1.2 dB
Maximum total Input power 22 dBm
Minimum return loss 45 dB
Working bandwidth 1516.9 nm +/- 0.11

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Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,


NTT870ExE5, and NTT870GxE5)
Overview
The Dispersion Slope Compensation Module (also referred to as DSCM) is a
passive device used to provide chromatic dispersion compensation and slope
compensation introduced by the inherent characteristics of the transmission
fiber as a light pulse travels through the fiber over long distances. DSCMs are
therefore used to maximize the performance of the 6500 system.

DSCMs are available for various fiber types and they come in different fiber
lengths for varying amounts of accumulated dispersion. DSCM types and
lengths available include:
• DSCM Type 1 is used for the compensation of NDSF fiber spans. DSCM
Type 1 units are available in a 5 km length and in lengths ranging from
10 km to 140 km (in 10 km increments).
• DSCM Type 2 is used for the compensation of TWRS fiber spans. DSCM
Type 2 units are available in a 20 km length and in lengths ranging from
40 km to 320 km (in 40 km increments).
• DSCM Type 3 is used for the compensation of TWCL fiber spans. DSCM
Type 3 units are available in a 20 km length and in lengths ranging from
40 km to 120 km (in 40 km increments).
• DSCM Type 5 is used for the compensation of ELEAF fiber spans. DSCM
Type 5 units are available in a 12.5 km length and in lengths ranging from
25 km to 150 km (in 25 km increments).

The DSCM consists of a DSCM variant, a bulkhead equipped with two SC-SC
adaptors and a plate to secure the DSCM to the DSCM drop-in plate assembly
in the 1U DSCM drawer. The DSCM is a field-replaceable unit. DSCM module
must be housed in the DSCM drawer (NT0H57LA).

Figure 1-177 on page 1-484 shows a DSCM and an interior view of the FM
with DSCM and Figure 1-178 on page 1-484 provides a functional block
diagram of the DSCM module.

DSCM module must be housed in the DSCM drawer (NT0H57LA).

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Figure 1-177
Interior view of the 1U DSCM drawer equipped with DSCM drop-in plate assembly and DSCM

Figure 1-178
DSCM module block diagram (NTT870xx)

OUT

IN

Equipment Inventory
Inventory (RJ-45)

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Supported functionality
The DSCM modules (NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5,
NTT870CAE5-CHE5/CJE5, NTT870EAE5-EDE5, and NTT870GAE5-GGE5)
provide the following functionality:
• the DSCM is a passive module and therefore does not require DC power
• although the DSCM module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the DSCM RJ45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the DSCM RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the DSCM RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the DSCM RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the DSCM RJ45 port to the NTK505JA access panel external slot
ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the DSCM RJ45 port to the access panel external slot
ports).
• see Table 1-134 on page 1-486 for function and connector type for each
port

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Table 1-134
DSCM optical interfaces

Interface name Physical port # Function Connector type

DCSM In Input to DSCM DCSM In SC

DSCM Out Compensated DSCM Out SC


output

Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch

Equipping rules
The following equipping rules apply to DSCM modules:
• can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
• can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
• can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
• can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
• can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
• the DSCM module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
DSCM module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.

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• the DSCM modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the DSCM optical interface modules. Table 1-136 lists the
maximum insertion loss for DSCM optical interface modules.

Table 1-135
Technical specifications for DSCM optical interface modules (NTT870xx variants)

Parameter DSCM (NTT870AA-AH/AJ-AN/AP-AQ,


NTT870CA-CH/CJ, NTT870EA-ED, and
NTT870GA-GG)
Dimension Height: 1U (43 mm / 1.7 in.)
Width: 443 mm / 17.44 in.
Depth: 279.0 mm / 11 in. (including mounting
brackets installed)
Weight (estimated) 4.5 kg (9.9 lb) (Note 1)
Wavelength range 1528 nm to 1565 nm
Maximum total input power 24 dBm (Note 2)
Minimum return loss 45 dB (Note 3 and Note 4)
Maximum insertion loss Variable (see Table 1-136) (Note 5)
Note 1: The specified weight includes the Fiber Manager (FM) chassis and drawer assembly, DSCM
drop-in plate assembly, and DSCM.
Note 2: To avoid module damage, the maximum optical input power must not exceed 24 dBm.
Note 3: Module loss is the worst case insertion loss of any wavelength within the specified C-Band.
Note 4: When the DSCM is added to the network, the total optical return loss decreases.
Note 5: The insertion loss includes 0.3 dB connector loss for two mated connections.

Table 1-136
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)

Description Equivalent fiber Order code Maximum Notes


length (km) insertion loss (dB)
DSCM-5 Type 1 C-Band SC 5 NTT870AA 2.0 Note
DSCM-10 Type 1 C-Band SC 10 NTT870AB 2.3 Note
DSCM-20 Type 1 C-Band SC 20 NTT870AC 2.9 Note
DSCM-30 Type 1 C-Band SC 30 NTT870AD 3.5 Note
DSCM-40 Type 1 C-Band SC 40 NTT870AE 4.1 Note
DSCM-50 Type 1 C-Band SC 50 NTT870AF 4.7 Note

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Table 1-136
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)

Description Equivalent fiber Order code Maximum Notes


length (km) insertion loss (dB)
DSCM-60 Type 1 C-Band SC 60 NTT870AG 5.4 Note
DSCM-70 Type 1 C-Band SC 70 NTT870AH 6.0 Note
DSCM-80 Type 1 C-Band SC 80 NTT870AJ 6.6 Note
DSCM-90 Type 1 C-Band SC 90 NTT870AK 7.2 Note
DSCM-100 Type 1 C-Band SC 100 NTT870AL 7.8 Note
DSCM-110 Type 1 C-Band SC 110 NTT870AM 9.5 Note
DSCM-120 Type 1 C-Band SC 120 NTT870AN 10.1 Note
DSCM-130 Type 1 C-Band SC 130 NTT870AP 10.9 Note
DSCM-140 Type 1 C-Band SC 140 NTT870AQ 11.5 Note
DSCM-20 Type 2 C-Band SC 20 NTT870CA 2.5 Note
DSCM-40 Type 2 C-Band SC 40 NTT870CB 2.9 Note
DSCM-80 Type 2 C-Band SC 80 NTT870CC 3.9 Note
DSCM-120 Type 2 C-Band SC 120 NTT870CD 5.0 Note
DSCM-160 Type 2 C-Band SC 160 NTT870CE 6.1 Note
DSCM-200 Type 2 C-Band SC 200 NTT870CF 7.1 Note
DSCM-240 Type 2 C-Band SC 240 NTT870CG 8.2 Note
DSCM-280 Type 2 C-Band SC 280 NTT870CH 9.3 Note
DSCM-320 Type 2 C-Band SC 320 NTT870CJ 10.3 Note
DSCM-20 Type 3 C-Band SC 20 NTT870EA 4.1 Note
DSCM-40 Type 3 C-Band SC 40 NTT870EB 5.1 Note
DSCM-80 Type 3 C-Band SC 80 NTT870EC 6.9 Note
DSCM-120 Type 3 C-Band SC 120 NTT870ED 8.2 Note
DSCM-12.5 Type 5 C-Band SC 12.5 NTT870GA 3.7 Note
DSCM-25 Type 5 C-Band SC 25 NTT870GB 4.3 Note
DSCM-50 Type 5 C-Band SC 50 NTT870GC 5.5 Note
DSCM-75 Type 5 C-Band SC 75 NTT870GD 7.0 Note
DSCM-100 Type 5 C-Band SC 100 NTT870GE 8.2 Note

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Table 1-136
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)

Description Equivalent fiber Order code Maximum Notes


length (km) insertion loss (dB)
DSCM-125 Type 5 C-Band SC 125 NTT870GF 8.8 Note
DSCM-150 Type 5 C-Band SC 150 NTT870GG 10.0 Note
Note: The maximum insertion loss values include effects of temperature, aging, polarization
dependent loss (PDL) and one mated connector.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB)


Overview
The Fixed Gain Amplifier (FGA C-Band) circuit pack (also referred to as FGA)
is used for edge and core passive Photonic layer applications and contains a
single (pre-amplifier) erbium-doped fiber amplifier (EDFA).

This circuit pack can provide both pre-amplification and post-amplification and
if link engineering permits, FGA can be placed anywhere in the passive
network including pre-amp position, post-amp position, cascaded-amp
position, and anywhere in between filters, except between transponders and
filter channel ports. There is no tilt control via software so FGA circuit pack
does not have capability to ensure equal amplification on wavelengths. FGA
monitor ports monitor FGA circuit pack input and output power.

Figure 1-179 shows the faceplate of an FGA circuit pack and Figure 1-180 on
page 1-491 provides a functional block diagram of the FGA circuit pack.

Figure 1-179
FGA circuit pack faceplate

Red triangle (Fail)


- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports

Line ports

Yellow circle (LOS)


- Used to communicate Rx Loss of Signal

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Figure 1-180
FGA circuit pack block diagram (NTK552AB)

Mon Out 2

EDFA
Line Out 3

PD PD
Backplane

Mon In 1
PD

Line In 4

Processor Power
Module Supply

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Supported functionality
The FGA circuit packs (NTK552AB) provide the following functionality:
• supports a per wavelength amplification for up to 88 C-band channels at
50 GHz spacing
• provides fast transient suppression
• provides automatic gain control (AGC) circuitry to maintain desired
performance at a fixed gain
• provides total output power (TOP) control, with TOP target
• provides fixed gain with ASE compensation
• provides flat gain when operated in the desired range
• external monitor at outputs of each amplifier line (Line In Mon and Line Out
Mon)
Note: The FGA circuit pack does not support ALSO (Automatic Line Shut
Off), APR (Automatic Power Reduction), or DOC functionality.

• see Table 1-137 for function and connector type for each port in FGA
Table 1-137
FGA optical interfaces

Interface name Physical port # Function Connector type

Mon 1 Monitor port for Line In LC

Mon 2 Monitor port for Line Out LC

Line Out 3 output port of Amplifier passthrough LC


channel

Line In 4 Input port of Amplifier LC

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Performance monitoring
The 6500 monitors and collects physical PMs for FGA circuit pack facilities.
Table 1-138 provides a list of monitor types supported on FGA circuit packs.
Figure 1-181 on page 1-494 shows the FGA circuit pack optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-138
Monitor types table for FGA circuit pack

Monitor type Facility

AMP

OPIN-OTS X
OPINMIN-OTS X
OPINMAX-OTS X
OPINAVG-OTS X

OPOUT-OTS X
OPOUTMIN-OTS X
OPOUTMAX-OTS X
OPOUTAVG-OTS X

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Figure 1-181
FGA circuit pack optical monitoring points

Mon Out 2

EDFA
Line Out 3

PD PD
Backplane

Mon In 1
PD

Line In 4

Processor Power
Module Supply

PMs collected at all PD locations


Facility: AMP port 1,3,4
Parameter: OPIN-OTS* and OPOUT-OTS*

Legend
EDFA Erbium Doped Fiber Amplifier
PD Photodiode

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Circuit Pack Failed
• Autoprovisioning Mismatch
• Internal Mgmt Comms Suspected
• Database Not Recovered For Slot
• Excessive Input Power
• Circuit Pack Upgrade Failed
• High Received Span Loss
• Low Received Span Loss

Photonic alarms
• Fiber Type Manual Provisioning Required
• High Fiber Loss
• Shutoff Threshold Crossed
• Input Loss of Signal
• Output Loss of Signal
• Automatic Shutoff Disabled
• Gauge Threshold Crossing Alert Summary
• Crossed Fibers Suspected

COM alarms
• Software Auto-Upgrade in Progress

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Equipping rules
The following equipping rules apply to FGA circuit packs:
• is a four-port single slot interface for FGA.
• can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
• can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
• can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
• can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
• cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with shelf processor w/access
panel (SPAP) (NTK555LA) or SPAP-2 w/2xOSC (NTK555NA or
NTK555NB).
• all equipment that is part of an OTS must be located within the same
physical shelf

The following restrictions on using a cross-connect circuit pack apply when


deploying a FGA circuit pack:
• the FGA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
• In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a FGA circuit pack
• In a 14-slot shelf type, when the FGA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

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• In a 6500-7 packet-optical shelf type, you cannot provision a


cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a FGA circuit pack
• In a 6500-7 packet-optical shelf type, when the FGA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10EY (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.

Technical specifications
The following table lists the weight, power consumption, and other
specifications for the FGA optical interface circuit pack.

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Table 1-139
Technical specifications for FGA optical interface circuit packs

Parameter FGA (NTK552AB)


Weight (estimated) 1.0 kg (2.4 lb)
Power consumption Typical (W): 24 (Note 1)
Power Budget (W): 33 (Note 2)
Gain (dB) 23 (fixed gain and not provisionable by the user)
Maximum noise figure (NF) (dB) 5.5
Maximum output power (dBm) 17 EOL (on average 1 dB higher)
Wavelength range (nm) 1530.33 to 1565.09 (88 channels capable)
Tap ratio loss (dB) Minimum Maximum

Line_Out to Line_Out_Mon 14.6 18.4


Line_In to Line_In_Mon 18.5 21.5
Insertion loss from Line_In to Line_Out (dB) N/A (Note 3)
Amplifier input and output LOS thresholds (dBm) Minimum Default Maximum
Input LOS threshold -40 -34 10

Output LOS threshold -15 -12 20


Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 Vdc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Photonic passive equipment


Overview
The following table lists Photonic passive equipment that can be used with the
6500 shelves and covered in this section:
Table 1-140
Photonic passive equipment covered in this section

Topic

“2-Slot Optical Module Chassis (OMC2) (NTK504NA)” on page 1-500

“2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)” on page 1-501

“2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)” on page 1-503

“6-slot passive photonic chassis (PPC6) (174-0040-900)” on page 1-505

“100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)” on page 1-508 including:

• “CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
(B-720-0020-0xx)” on page 1-508

• “CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules (B-720-0022-00x)” on
page 1-511

“Band splitter 100 GHz modules (B-720-0020-0xx)” on page 1-529

“CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module (B-720-0014-003)”
on page 1-535

“2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x, B-955-0003-3xx,


166-0203-9xx, 166-0403-9xx)” on page 1-536

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2-Slot Optical Module Chassis (OMC2) (NTK504NA)


The 2-Slot Optical Module Chassis (OMC2) (also known as OMC2 chassis) is
a stand-alone passive chassis designed to accommodate up to two passive
modules. Those passive modules include:
• “C/L-Band Mux/Demux (CLMD) module (NTK504PA)” on page 1-433
• “Upgrade Coupler/Splitter (UCS) module (NTK504PL)” on page 1-439
• “Monitor Coupler/Splitter (MonCS) nodule (NTK504PN)” on page 1-444

The OMC2 chassis is 1U in height and intended to be mounted in a bay and


includes two half-width slots.

Note: If you equip the passive modules in an OMC2 chassis, the 6500 can
support autoprovisioning and automatic inventory through the RJ45
interfaces in the passive modules which directly connect to the 6500 shelf
access panel.

It is mandatory that the empty half-width sub-slots in an OMC2 chassis are


filled with a Filler Panel (for OMC2 slot) (NTK504PY).

Figure 1-182 shows the faceplate of passive modules in an OMC2 chassis.

Figure 1-182
OMC2 chassis (B-310-0142-001)

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2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)


The 2150 Passive Optical Multiplexer (6-slot) chassis (also known as
2150 (6-slot) chassis) is a stand-alone passive chassis designed to
accommodate up to six passive modules. Those passive modules include:
• 100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-508 for more
information.
• 100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-529 for more information.
• OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-535 for
more information.

The 2150 (6-slot) chassis can accept passive modules from the Ciena 4200
platform. The 2150 (6-slot) chassis is 2U in height and intended to be mounted
in a bay.
The modular platform of a 2150 (6-slot) chassis offers invest-as-you-grow
scalability. Possible configurations include:
• six half-width slots
• four half-width slots and a full-width slot
• two half-width slots and two full-width slots
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (6-slot) chassis
since 2150 (6-slot) chassis cannot be connected to 6500 shelf access
panel external slots. Hence, you must manually provision the 2150 (6-slot)
chassis and any passive modules in its sub-slots.

You cannot order 2150 (6-slot) chassis (B-310-0142-001) separately. You


must order one of the following kits where the kit includes the mounting
brackets and optional fiber management bar and cover:
• B-967-0001-002 (2150 Passive Optical Multiplexer (6-slot) chassis with 19
inch brackets, fiber management bar and cover)
This kit includes 19 inch brackets (B-395-0003-001), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).
• B-967-0002-002 (2150 Passive Optical Multiplexer (6-slot) chassis with 23
inch brackets, fiber management bar and cover)
This kit includes 23 inch brackets (B-395-0003-002), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).
• B-967-0003-002 (2150 Passive Optical Multiplexer (6-slot) chassis with
ETSI inch brackets, fiber management bar and cover)
This kit includes ETSI inch brackets (B-395-0003-003), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).

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It is recommended that the empty half-width sub-slots in a 2150 (6-slot)


chassis are filled with half-width blank (filler panel) (B-390-0069-001). It is
recommended that the empty full-width sub-slots in a 2150 (6-slot) chassis are
filled with full-width blank (filler panel) (B-720-0016-001).

The following shows the faceplate of a 2150 (6-slot) chassis.

Figure 1-183
2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)

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2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)


The 2150 Passive Optical Multiplexer (3-slot) chassis (also known as 2150
(3-slot) chassis) is a stand-alone passive chassis designed to accommodate
up to three passive modules. Those passive modules include:
• 100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-508 for more
information.
• 100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-529 for more information.
• OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-535 for
more information.
• OBMD 1x8 modules. See “Optical Broadband Mux/Demux (OBMD 1x8
C-Band) module (174-0104-900)” on page 1-514 for more information.
• OBB 2x2x2 modules. See “Optical Bridge and Broadcast (OBB 2x2x2
C-Band) module (174-0115-900)” on page 1-519 for more information.
• OBB 2x4x1 modules. See “Optical Bridge and Broadcast (OBB 2x4x1
C-Band) module (174-0116-900)” on page 1-524 for more information.

The 2150 (3-slot) chassis can also accept passive modules from the Ciena
4200 platform. The 2150 (3-slot) chassis is 1U in height and intended to be
mounted in a bay. The 2150 (3-slot) chassis (174-0064-900) offers the same
functionality as 2150 (6-slot) chassis (B-310-0142-001) but it can free 1U of
space.

The modular platform of a 2150 (3-slot) chassis offers invest-as-you-grow


scalability. Possible configurations include:
• three half-width slots
• one half-width slots and one full-width slots
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (3-slot) chassis
since 2150 (3-slot) chassis cannot be connected to 6500 shelf access
panel external slots. Hence, you must manually provision the 2150 (3-slot)
chassis and any passive modules in its sub-slots.
The exception is OBMD 1x8 (174-0104-900), OBB 2x2x2 (174-0115-900),
and OBB 2x4x1 (174-0116-900) modules equipped in a 2150 (3-slot)
chassis where these modules include tap/photodetectors powered
through a connection to the 6500 access panel and therefore supporting
autoprovisioning and automatic inventory.

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You cannot order 2150 (3-slot) chassis (174-0064-900) separately. You must
order one of the following kits where the kit includes the mounting brackets
and cover:
• K80-0002-901 (2150 Passive Optical Multiplexer (3-slot) chassis with 19
inch, 23 inch, and ETSI brackets)
This kit includes 19 inch, 23 inch, and ETSI brackets (174-0096-900) and
cover (174-0095-900).
• K80-0002-902 (2150 Passive Optical Multiplexer (3-slot) chassis with 19
inch, 23 inch, and ETSI brackets and cover)
This kit includes 19 inch, 23 inch, and ETSI brackets (174-0096-900) and
cover (174-0095-900).

It is recommended that the empty half-width sub-slots in a 2150 (3-slot)


chassis are filled with half-width blank (filler panel) (B-390-0069-001). It is
recommended that the empty full-width sub-slots in a 2150 (3-slot) chassis are
filled with full-width blank (filler panel) (B-720-0016-001).

The following shows the faceplate of a 2150 (3-slot) chassis.

Figure 1-184
2150 Passive Optical Multiplexer (3-slot) chassis (174-0064-900)

Module slots

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6-slot passive photonic chassis (PPC6) (174-0040-900)


The 6-slot passive photonic chassis (also known as PPC6) is a stand-alone
passive chassis designed to accommodate up to six passive modules. Those
passive modules include:
• 100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-508 for more
information.
• 100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-529 for more information.
• OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-535 for
more information.

The PPC6 chassis can accept passive modules from the 2150 (6-slot), 2150
(3-slot) chassis, and Ciena 4200 platform. The PPC6 chassis has similar
functionality as existing 2150 (6-slot) or 2150 (3-slot) chassis
(B-310-0142-001). However, the PPC chassis includes an RJ45 interface to
allow connection to 6500 shelf Access Panel for auto-provisioning and
inventory support. The PPC6 chassis is 2U in height and intended to be
mounted in a bay.

The modular platform of a PPC6 offers invest-as-you-grow scalability.


Possible configurations include:
• six half-width slots
• four half-width slots and a full-width slot
• two half-width slots and two full-width slots
Note: If you equip the passive modules in a PPC6, the 6500 supports
autoprovisioning and automatic inventory via the built-in PPC6 inventory
control logic which interfaces directly with the 6500 shelf access panel.
The passive modules do not directly report to the 6500 shelf access panel.

You cannot order PPC6 (174-0040-900) separately. You must order one of the
following kits where the kit includes the mounting brackets and optional fiber
management bar and cover:
• K80-0001-001 (6-slot Passive Photonics Chassis (PPC6) with 19 inch and
23 inch brackets)
This kit includes 19 inch and 23 inch brackets (174-0042-001).
• K80-0001-002 (6-slot Passive Photonics chassis (PPC6) with 19 inch and
23 inch brackets, fiber management bar and cover)
This kit includes 19 inch and 23 inch brackets (174-0042-001), fiber
management bar and cover (174-0043-001).

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• K80-0001-003 (6-slot Passive Photonics chassis (PPC6) with ETSI


brackets)
This kit includes ETSI brackets (174-0042-002).
• K80-0001-004 (6-slot Passive Photonics chassis (PPC6) with ETSI
brackets, fiber management bar and cover)
This kit includes ETSI brackets (174-0042-002), fiber management bar
and cover (174-0043-001).

You can also order the following equipment separately:


• 174-0042-001 (6-slot Passive Photonics chassis (PPC6) mounting kit with
19 inch and 23 inch brackets)
• 174-0042-002 (6-slot Passive Photonics chassis (PPC6) mounting kit with
ETSI brackets)
• 174-0043-001 (6-slot Passive Photonics chassis (PPC6) kit with fiber
management bar and cover)
• 174-0059-001 (6-slot Passive Photonics chassis (PPC6) slot divider kit,
top and bottom)

It is mandatory that the empty half-width sub-slots in a PPC6 are filled with
half-width blank (filler panel) (B-390-0069-001). It is mandatory that the empty
full-width sub-slots in a PPC6 are filled with full-width blank (filler panel)
(B-720-0016-001).

Figure 1-185 shows the faceplate of a 6-slot passive Photonic chassis.

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Figure 1-185
6-slot passive photonic chassis faceplates (174-0040-900)

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100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)


These optical filters are designed to manage DWDM wavelengths that
conform to the ITU-T 694.1 100 GHz grid specification, thus enabling them to
filter any DWDM wavelength that conforms to this standard and grid. The
filters comprising this category align into two classes:
• Wavelength filter modules, which mux/demux some set of individual
wavelength channels into and from one of the 100 GHz wavelength
groups. In this release, these wavelength filter modules include OMDF4
and OMDF8 passive modules. For more information, see “CN-100-x4L
and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz
modules (B-720-0020-0xx)” on page 1-508 and “CN-100-x80 8-channel
Optical Mux/Demux Filter (OMDF8) 100 GHz modules (B-720-0022-00x)”
on page 1-511.
• Band splitters, which mux/demux an aggregated DWDM signal into one or
more of the five 100 GHz DWDM wavelength groups. For more
information, see “Band splitter 100 GHz modules (B-720-0020-0xx)” on
page 1-529.

CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter


(OMDF4) 100 GHz modules (B-720-0020-0xx)
The CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter
(OMDF4) 100 GHz modules (also known as OMDF4 modules) are half-width
modules and are used to mux/demux four 100 GHz DWDM signals into and
from an aggregated DWDM signal. Ten modules are available; one for each
set of four wavelengths:
• CN-100-E4L, 4-Ch OMDF 100 GHz Group E-Low (1562-1564 nm)
(B-720-0020-022)
• CN-100-E4H, 4-Ch OMDF 100 GHz Group E-High (1558-1561 nm)
(B-720-0020-023)
• CN-100-D4L, 4-Ch OMDF 100 GHz Group D-Low (1554-1557 nm)
(B-720-0020-024)
• CN-100-D4H, 4-Ch OMDF 100 GHz Group D-High (1551-1554 nm)
(B-720-0020-025)
• CN-100-C4L, 4-Ch OMDF 100 GHz Group C-Low (1547-1550 nm)
(B-720-0020-026)
• CN-100-C4H, 4-Ch OMDF 100 GHz Group C-High (1544-1546 nm)
(B-720-0020-027)
• CN-100-B4L, 4-Ch OMDF 100 GHz Group B-Low (1540-1542 nm)
(B-720-0020-028)
• CN-100-B4H, 4-Ch OMDF 100 GHz Group B-High (1537-1539 nm)
(B-720-0020-029)

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• CN-100-A4L, 4-Ch OMDF 100 GHz Group A-Low (1533-1535 nm)


(B-720-0020-030)
• CN-100-A4H, 4-Ch OMDF 100 GHz Group A-High (1530-1532 nm)
(B-720-0020-031)

Figure 1-186 on page 1-509 shows the faceplates of the OMDF4 modules.
Figure 1-188 on page 1-510 provides functional block diagram of the OMDF4
modules.

Figure 1-186
OMDF4 modules faceplates (B-720-0020-0xx)

NTWK EXPR Ch 16 Ch 17 Ch 18 Ch 19 MON NTWK EXPR Ch 20 Ch 21 Ch 22 Ch 23 MON


R R

T T

CN-100-E4L CN-100-E4H

NTWK EXPR Ch 25 Ch 26 Ch 27 Ch 28 MON NTWK EXPR Ch 29 Ch 30 Ch 31 Ch 32 MON


R R

T TT

CN-100-D4L CN-100-D4H

NTWK EXPR Ch 34 Ch 35 Ch 36 Ch 37 MON NTWK EXPR Ch 38 Ch 39 Ch 40 Ch 41 MON


R R

T
T TT

CN-100-C4L CN-100-C4H

NTWK EXPR Ch 43 Ch 44 Ch 45 Ch 46 MON NTWK EXPR Ch 47 Ch 48 Ch 49 Ch 50 MON


R R

T
T TT

CN-100-B4L CN-100-B4H

NTWK EXPR Ch 52 Ch 53 Ch 54 Ch 55 MON NTWK EXPR Ch 56 Ch 57 Ch 58 Ch 59 MON


R R

T
T T
T
CN-100-A4L CN-100-A4H

Note: The wavelength corresponding to each channel port is indicated


underneath the channel port’s connector (an example is shown in
Figure 1-187).

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Figure 1-187
Example showing markings for C-band wavelengths

Figure 1-188
OMDF4 modules block diagram (B-720-0020-0xx)

3 Express R Network T 2
Sub-Band Filter

4 Express T Network R 1

Monitor T 14

Monitor R 13

Channel Mux/Demux

Ch. ww Ch. xx Ch. yy Ch. zz

5 6 7 8 9 10 11 12

ww = 16, 20, 25, 29, 34, 38, 43, 47, 52, 56


xx = 17, 21, 26, 30, 35, 39, 44, 48, 53, 57
yy = 18, 22, 27, 31, 36, 40, 45, 49, 54, 58
zz = 19, 23, 38, 32, 37, 41, 46, 50, 55, 59

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CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz


modules (B-720-0022-00x)
The CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz
modules (also known as OMDF8 modules) are full-width modules and are
used to mux/demux eight of the supported 100 GHz DWDM wavelengths. Five
modules are available; one for each set of eight wavelengths:
• CN-100-A80, 8-Ch OMDF 100 GHz Group A (1530-1535 nm)
(B-720-0022-001)
• CN-100-B80, 8-Ch OMDF 100 GHz Group B (1537-1542 nm)
(B-720-0022-002)
• CN-100-C80, 8-Ch OMDF 100 GHz Group C (1544-1550 nm)
(B-720-0022-003)
• CN-100-D80, 8-Ch OMDF 100 GHz Group D (1551-1557 nm)
(B-720-0022-004)
• CN-100-E80, 8-Ch OMDF 100 GHz Group E (1558-1564 nm)
(B-720-0022-005)

Figure 1-189 shows the faceplates of the OMDF8 modules. Figure 1-190 on
page 1-513 provides functional block diagram of the OMDF8 modules.

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Figure 1-189
OMDF8 modules faceplates (B-720-0022-00x)

NTWK CH 16 CH 17 CH 18 CH 19 CH 20 CH 21 CH 22 CH 23 MON
R

T
CN-100-E80

NTWK CH 25 CH 26 CH 27 CH 28 CH 29 CH 30 CH 31 CH 32 MON
R

CN-100-D80

NTWK CH 34 CH 35 CH 36 CH 37 CH 38 CH 39 CH 40 CH 41 MON
R

CN-100-C80

NTWK CH 43 CH 44 CH 45 CH 46 CH 47 CH 48 CH 49 CH 50 MON
R

CN-100-B80

NTWK CH 52 CH 53 CH 54 CH 55 CH 56 CH 57 CH 58 CH 59 MON
R

CN-100-A80

Note: The wavelength corresponding to each channel port is indicated


underneath the channel port’s connector (an example is shown in
Figure 1-187 on page 1-510).

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Figure 1-190
OMDF8 modules block diagram (B-720-0022-00x)

Network T 2

Network R 1

Monitor T 20

Monitor R 19

Channel Mux/Demux

Ch. ss Ch. tt Ch. uu Ch. vv Ch. ww Ch. xx Ch. yy Ch. zz

3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

ss = 16, 25, 34, 43, 52 ww = 20, 29, 38, 47, 56


tt = 17, 26, 35, 44, 53 xx = 21, 30, 39, 48, 57
uu = 18, 27, 36, 45, 54 yy = 22, 31, 40, 49, 58
vv = 19, 28, 37, 46, 55 zz = 23, 32, 41, 50, 59

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Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module


(174-0104-900)
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (also known as
OBMD 1x8) is a full-width module and is part of WaveLogic Photonics
Coherent Select passive architecture. The Coherent Select nodes use a
combination of existing 6500 circuit packs (amplifiers, OSC, CMD44, BMD2)
and OBMD 1x8 modules.

The OBMD 1x8 module includes:


• 8x Mux/Demux ports (in/out)
• 1x Common port (in/out)
• An RJ45 port for equipment inventory
Figure 1-191 shows the faceplate of the OBMD 1x8 module. Figure 1-192 on
page 1-515 provides functional block diagram of the OBMD 1x8 module.

Figure 1-191
OBMD 1x8 module faceplate (174-0104-900)

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Photonics equipment description 1-515

Figure 1-192
OBMD 1x8 module block diagram (174-0104-900)

Equipment
Inventory inventory
(RJ-45)

Common Out 18

Common In 17

PD

1:8 Splitter/Combiner

PD PD PD PD PD PD PD PD
4 Out

7 Out

8 Out
1 Out

6 Out
2 Out

3 Out

5 Out
4 In

7 In

8 In
1 In

6 In
2 In

3 In

5 In

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Although the OBMD 1x8 module is a passive device, autoprovisioning and


automatic inventory support are still possible if using
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBMD 1x8 RJ45 port to the
NTK505MBE5 access panel external slot ports).
• NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBMD 1x8 RJ45 port to the NTK605MAE5 access
panel external slot ports).

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• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and


NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBMD 1x8
RJ45 port to the NTK505PAE5 access panel external slot ports).
• NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBMD 1x8 RJ45 port to the NTK555NA or
NTK555NB external slot ports).
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBMD 1x8
module's RJ45 port to the NTK505JA access panel external slot ports).
• integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBMD 1x8 RJ45
port to the access panel external slot ports).

Performance monitoring
The 6500 monitors and collects physical PMs for OBMD 1x8 module facilities.
Table 1-141 provides a list of monitor types supported on OBMD 1x8 modules.
Figure 1-193 on page 1-517 shows the OBMD 1x8 module optical monitoring
points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-141
Monitor types table for Photonic OBMD 1x8 modules

Facility OPTMON
Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

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Figure 1-193
OBMD 1x8 module optical monitoring points

PMs collected at all PD locations


Facility: OPTMON port 1,3,5,7,9,11,13,15,17 Equipment
Parameter: OPR-OTS* Inventory inventory
* AVG, MIN, and MAX measurements also provided. (RJ-45)

Common Out 18

Common In 17

PD

1:8 Splitter/Combiner

PD PD PD PD PD PD PD PD
4 Out

7 Out

8 Out
1 Out

6 Out
2 Out

3 Out

5 Out
4 In

7 In

8 In
1 In

6 In
2 In

3 In

5 In

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Legend

PD Photodiode

Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• Duplicate Adjacency Discovered
• High Fiber Loss
• Unassigned Channel in Use

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Cross-connection types
The OBMD 1x8 supports the 2WAY (Bidirectional) cross-connection type.

Cross-connection rates
The OBMD 1x8 only supports the OCH (Optical Channel) Photonic
cross-connection rate.

Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Photonics equipment description 1-519

Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module


(174-0115-900)
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (also known as
OBB 2x2x2) is a half-width module and is part of WaveLogic Photonics
Coherent Select passive architecture. The Coherent Select nodes use a
combination of existing 6500 circuit packs (amplifiers, OSC, CMD44, BMD2)
and OBB 2x2x2 modules.

The OBB 2x2x2 module includes:


• 2x Line 1 ports (in/out)
• 2x Line 2 ports (in/out)
• 2x CMD 1 ports (in/out)
• 2x CMD 2 ports (in/out)
• An RJ45 port for equipment inventory

Figure 1-194 shows the faceplate of the OBB 2x2x2 module. Figure 1-195 on
page 1-520 provides functional block diagram of the OBB 2x2x2 module.

Figure 1-194
OBB 2x2x2 module faceplate (174-0115-900)

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Figure 1-195
OBB 2x2x2 module block diagram (174-0115-900)

Equipment
Inventory inventory
(RJ-45)

Splitter/Combiner
Splitter/Combiner
5 Line 1 In Line 2 Out 8

PD
6 Line 1 Out Line 2 In 7

PD

Isolator
Isolator

2:2 Splitter/Combiner

PD PD
CMD1 Out

CMD2 Out
CMD1 In

CMD2 In

1 2 3 4

Although the OBB 2x2x2 module is a passive device, autoprovisioning and


automatic inventory support are still possible if using
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBB 2x2x2 RJ45 port to the
NTK505MBE5 access panel external slot ports).
• NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x2x2 RJ45 port to the NTK605MAE5
access panel external slot ports).

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Photonics equipment description 1-521

• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and


NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBB 2x2x2
RJ45 port to the NTK505PAE5 access panel external slot ports).
• NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x2x2 RJ45 port to the NTK555NA or
NTK555NB external slot ports).
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBB 2x2x2
module's RJ45 port to the NTK505JA access panel external slot ports).
• integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBB 2x2x2 RJ45
port to the access panel external slot ports).

Performance monitoring
The 6500 monitors and collects physical PMs for OBB 2x2x2 module facilities.
Table 1-142 provides a list of monitor types supported on OBB 2x2x2
modules. Figure 1-196 on page 1-522 shows the OBB 2x2x2 module optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-142
Monitor types table for Photonic OBB 2x2x2 modules

Facility OPTMON
Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

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Figure 1-196
OBB 2x2x2 module optical monitoring points

PMs collected at all PD locations


Facility: OPTMON port 1,3,5,7
Parameter: OPR-OTS*

PMs collected for


Facility: OPTMON port 2,4
Parameter: OPT-OTS* Equipment
Inventory inventory
* AVG, MIN, and MAX measurements also provided. (RJ-45)

Splitter/Combiner
Splitter/Combiner

5 Line 1 In Line 2 Out 8

PD
6 Line 1 Out Line 2 In 7

PD

Isolator
Isolator

2:2 Splitter/Combiner

PD PD
CMD1 Out

CMD2 Out
CMD1 In

CMD2 In

1 2 3 4

Legend

PD Photodiode

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Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch
Photonic alarms
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• High Fiber Loss
• High Optical Power
Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module


(174-0116-900)
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (also known as
OBB 2x4x1) is a half-width module and is part of WaveLogic Photonics
Coherent Select (Coherent Select) passive architecture. The Coherent Select
nodes use a combination of existing 6500 circuit packs (amplifiers, OSC,
CMD44, BMD2) and OBB 2x4x1 modules.

The OBB 2x4x1 module includes:


• 2x Line 1 ports (in/out)
• 2x Line 2 ports (in/out)
• 2x CMD 1 ports (in/out)
• 2x CMD 2 ports (in/out)
• 2x CMD 3 ports (in/out)
• 2x CMD 4 ports (in/out)
• An RJ45 port for equipment inventory

Figure 1-197 shows the faceplate of the OBB 2x4x1 module. Figure 1-198 on
page 1-525 provides functional block diagram of the OBB 2x4x1 module.

Figure 1-197
OBB 2x4x1 module faceplate (174-0116-900)

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Figure 1-198
OBB 2x4x1 module block diagram (174-0116-900)

Equipment
Inventory inventory
(RJ-45)

Splitter/Combiner
Splitter/Combiner
9 Line 1 In Line 2 Out 12

PD
10 Line 1 Out Line 2 In 11

PD

Isolator
Isolator

1:2 Splitter/Combiner 1:2 Splitter/Combiner

PD PD PD PD
CMD4 Out
CMD3 Out
CMD1 Out

CMD2 Out

CMD3 In
CMD1 In

CMD4 In
CMD2 In

1 2 3 4 1 2 3 4

Although the OBB 2x4x1 module is a passive device, autoprovisioning and


automatic inventory support are still possible if using
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBB 2x4x1 RJ45 port to the
NTK505MBE5 access panel external slot ports).
• NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x4x1 RJ45 port to the NTK605MAE5
access panel external slot ports).

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• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and


NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBB 2x4x1
RJ45 port to the NTK505PAE5 access panel external slot ports).
• NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x4x1 RJ45 port to the NTK555NA or
NTK555NB external slot ports).
• NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBB 2x4x1
module's RJ45 port to the NTK505JA access panel external slot ports).
• integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBB 2x4x1 RJ45
port to the access panel external slot ports).

Performance monitoring
The 6500 monitors and collects physical PMs for OBB 2x4x1 module facilities.
Table 1-143 provides a list of monitor types supported on OBB 2x4x1
modules. Figure 1-199 on page 1-527 shows the OBB 2x4x1 module optical
monitoring points.

For detailed information and procedures associated with performance


monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.

Table 1-143
Monitor types table for Photonic OBB 2x4x1 modules

Facility OPTMON
Monitor type

OPR-OTS X
OPRMIN-OTS X
OPRMAX-OTS X
OPRAVG-OTS X

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Figure 1-199
OBB 2x4x1 module optical monitoring points

PMs collected at all PD locations


Facility: OPTMON port 1,3,5,7,9,11
Parameter: OPR-OTS*

PMs collected for


Facility: OPTMON port 2,4,10,12
Parameter: OPT-OTS*

* AVG, MIN, and MAX measurements also provided. Equipment


Inventory inventory
(RJ-45)

Splitter/Combiner
Splitter/Combiner

9 Line 1 In Line 2 Out 12


PD
PD
10 Line 1 Out Line 2 In 11

Isolator
Isolator

1:2 Splitter/Combiner 1:2 Splitter/Combiner

PD PD PD PD
CMD4 Out
CMD2 Out

CMD3 Out
CMD1 Out

CMD4 In
CMD2 In

CMD3 In
CMD1 In

1 2 3 4 1 2 3 4

Legend

PD Photodiode

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Equipment alarms
• Circuit Pack Missing
• Circuit Pack Mismatch
• Autoprovisioning Mismatch
Photonic alarms
• Loss of Signal
• Gauge Threshold Crossing Alert Summary
• High Fiber Loss
• High Optical Power
Latency
Latency information is available in Latency Specifications, 323-1851-170.

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Photonics equipment description 1-529

Band splitter 100 GHz modules (B-720-0020-0xx)


A variety of Band splitter 100 GHz modules (also known as BS modules)
support the 100 GHz DWDM filter modules by dividing an aggregated DWDM
signal into the one or more of the five bands that comprise the 100 GHz
DWDM channel plan. The BS modules provide a practical and convenient
means of facilitating an upgrade path for those who want to equip only a few
initial wavelengths while maintaining the ability to deploy additional channels
at some future time.

Positionally, the BS modules are placed ahead of the channel filter modules.
When used, they act as the first stage(s) of a multi-stage filter configuration,
with the BS(s) interfacing the network fibers and the channel filter modules
interfacing the BS(s) from their network ports and the equipment interfaces
from their channel ports.

The following Band Splitter modules are available as:


• CN-BS1-x 1-Group Band Splitter 100 GHz modules (also known as BS1
modules)
These filters mux/demux one of the supported 100 GHz DWDM
wavelength groups: A, B, C, D, or E. Five modules are available, one for
each group:
— CN-BS1-A, Band Splitter 100 GHz C-Band Group A (B-720-0020-036)
— CN-BS1-B, Band Splitter 100 GHz C-Band Group B (B-720-0020-037)
— CN-BS1-C, Band Splitter 100 GHz C-Band Group C (B-720-0020-038)
— CN-BS1-D, Band Splitter 100 GHz C-Band Group D (B-720-0020-039)
— CN-BS1-E, Band Splitter 100 GHz C-Band Group E (B-720-0020-040)
Figure 1-200 shows the faceplates of the BS1 modules. Figure 1-201 on page
1-530 provides functional block diagram of the BS1 modules.

Figure 1-200
BS1 modules faceplates (B-720-0020-036, 037, 038, 039, 040)

NTWK EXPR GRP A MON NTWK EXPR GRP B MON


R R

T T

CN-BS1-A CN-BS1-B

NTWK EXPR GRP C MON NTWK EXPR GRP D MON


R R

T
T T
T

CN-BS1-C CN-BS1-D

NTWK EXPR GRP E MON


R

T T

CN-BS1-E

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Figure 1-201
BS1 modules block diagram (B-720-0020-036, 037, 038, 039, 040)

3 Express R Network T 2

Group Splitter
4 Express T Network R 1

Monitor T 7

Monitor R 8

Group X

5 6

X = A or B or C or D or E

• CN-BS2-xx 2-Group Band Splitter 100 GHz modules (also known as BS2
modules)
These filters mux/demux two of the supported 100 GHz DWDM
wavelength groups: A and B or C and D. Two modules are available:
— CN-BS2-AB, Band Splitter 100 GHz C-Band Groups A, B
(B-720-0020-034)
— CN-BS2-CD, Band Splitter 100 GHz C-Band Groups C, D
(B-720-0020-035)

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Figure 1-202 shows the faceplates of the BS2 modules. Figure 1-203
provides functional block diagram of the BS2 modules.

Figure 1-202
BS2 modules faceplates (B-720-0020-034, 035)

NTWK EXP GRP A GRP B MON NTWK EXP GRP C GRP D MON
R R

T T

CN-BS2-AB CN-BS2-CD

Figure 1-203
BS2 modules block diagram (B-720-0020-034, 035)

3 Express R Network T 2
Group Splitter

4 Express T Network R 1

Monitor T 9

Monitor R 10

Group X Group Y

5 6 7 8

XY = AB or CD

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• CN-BS3-ABE 3-Group Band Splitter 100 GHz modules (also known as


BS3 modules)
This filter muxes/demuxes three of the supported 100 GHz DWDM
wavelength groups: A, B, and E. One module is available:
— CN-BS3-ABE, Band Splitter 100 GHz C-Band Groups A, B, E
(B-720-0020-033)

Figure 1-204 shows the faceplates of the BS3 modules. Figure 1-205 on page
1-533 provides functional block diagram of the BS3 modules.

Figure 1-204
BS3 modules faceplates (B-720-0020-033)

NTWK GRP A GRP B GRP E


R

CN-BS3-ABE

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Figure 1-205
BS3 modules block diagram (B-720-0020-033)

Network T 2

Network R 1

Group Splitter

Group A Group B Group E

3 4 5 6 7 8

• CN-BS5 5-Group Band Splitter 100 GHz modules (also known as BS5
modules)
This filter muxes/demuxes all five of the supported 100 GHz DWDM
wavelength groups: A through E. One module is available:
— CN-BS5, Band Splitter 100 GHz C-Band Groups A, B, C, D, E
(B-720-0020-032)

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Figure 1-206 shows the faceplates of the BS5 modules. Figure 1-207
provides functional block diagram of the BS5 modules.

Figure 1-206
BS5 modules faceplates (B-720-0020-032)

NTWK GRP A GRP B GRP C GRP DGRP E MON


R

CN-BS5

Figure 1-207
BS5 modules block diagram (B-720-0020-032)

Network T 2

Network R 1

Monitor T 13

Monitor R 14

Group Splitter

Group A Group B Group C Group D Group E

3 4 5 6 7 8 9 10 11 12

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CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (B-720-0014-003)
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (also known as OSCF) is a half-width 1-channel filter module that
muxes/demuxes one CWDM signal into and from an aggregated CWDM
signal.

Figure 1-208 shows the faceplates of the OSCF module. Figure 1-209 on
page 1-535 provides functional block diagram of the OSCF module.

Figure 1-208
OSCF module faceplate (B-720-0014-003)

NTWK EXPR 1511


R

T
CN-51S-00

Figure 1-209
OSCF module block diagram (B-720-0014-003)

3 Express R Network T 2
OSC MUX/DEMUX

4 Express T Network R 1

1511

5 6

OSC = Optical service channel

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2110-Tx-xxxx Dispersion Compensation Modules (DCMs)


(B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)
The 2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (also referred
to as 2110 DCMs) are passive devices and are used to provide chromatic
dispersion compensation and slope compensation introduced by the inherent
characteristics of the transmission fiber as a light pulse travels through the
fiber over long distances. The 2110 DCMs are therefore used to maximize the
performance of the 6500 system. Unlike DSCM modules
(NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5, NTT870CAE5-CHE5/CJE5,
NTT870EAE5-EDE5, and NTT870GAE5-GGE5) supported in previous
releases of 6500, the 2110 DCMs (B-955-0003-00x, B-955-0003-3xx,
166-0203-9xx, 166-0403-9xx) cannot be automatically inventoried on a 6500
shelf. However, they can be inventoried in 6500 shelves by manual
provisioning. The users who want DCMs automatic inventory information on a
6500 shelf need to use the DSCM modules
(NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5, NTT870CAE5-CHE5/CJE5,
NTT870EAE5-EDE5, and NTT870GAE5-GGE5).

The 2110 DCMs must be equipped in one of the following shelves:


• 2110 shelf with 19 inch brackets for EIA or NEBS equipment racks
(B-955-0004-005)
• 2110 shelf with 23 inch brackets for EIA or NEBS equipment racks
(B-955-0004-006)
• 2110 shelf with ETSI bracket configured for 300 mm rack brackets
(B-955-0004-008)
Note: The 6500 does not support autoprovisioning and automatic
inventory on the 2110 DCMs equipped in a 2110 shelf since 2110 shelf
cannot be connected to 6500 shelf access panel external slots. You must
use the DSCM variants NTT870xx if you need automatic inventory
support.

The following 2110 DCMs are supported:


• G.652 (NDSF) standard 2110 DCMs including:
— 2110-T0-10, DCM -10 Type 1 C-Band (Half-Width) (B-955-0003-001)
— 2110-T0-20, DCM -20 Type 1 C-Band (Half-Width) (B-955-0003-002)
— 2110-T0-30, DCM -30 Type 1 C-Band (Half-Width) (B-955-0003-003)
— 2110-T0-40, DCM -40 Type 1 C-Band (Half-Width) (B-955-0003-004)
— 2110-T0-50, DCM -50 Type 1 C-Band (Half-Width) (B-955-0003-005)
— 2110-T0-60, DCM -60 Type 1 C-Band (Half-Width) (B-955-0003-006)

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• G.652 (NDSF) low loss 2110 DCMs including:


— 2110-T0-70L, DCM -70 Low Loss Type 1 C-Band (Half-Width)
(166-0203-907)
— 2110-T0-80L, DCM -80 Low Loss Type 1 C-Band (Half-Width)
(166-0203-908)
— 2110-T0-90L, DCM -90 Low Loss Type 1 C-Band (Full-Width)
(166-0203-909)
— 2110-T0-100L, DCM -100 Low Loss Type 1 C-Band (Full-Width)
(166-0203-910)
— 2110-T0-110L, DCM -110 Low Loss Type 1 C-Band (Full-Width)
(166-0203-911)
— 2110-T0-120L, DCM -120 Low Loss Type 1 C-Band (Full-Width)
(166-0203-912)
— 2110-T0-130L, DCM -130 Low Loss Type 1 C-Band (Full-Width)
(166-0203-913)
— 2110-T0-140L, DCM -140 Low Loss Type 1 C-Band (Full-Width)
(166-0203-914)
— 2110-T0-150L, DCM -150 Low Loss Type 1 C-Band (Full-Width)
(166-0203-915)
— 2110-T0-160L, DCM -160 Low Loss Type 1 C-Band (Full-Width)
(166-0203-916)
— 2110-T0-170L, DCM -170 Low Loss Type 1 C-Band (Full-Width)
(166-0203-917)
• G.655 (ELEAF) standard 2110 DCMs including:
— 2110-T3-20, DCM -20 Type 5 C-Band (Half-Width) (B-955-0003-302)
— 2110-T3-40, DCM -40 Type 5 C-Band (Half-Width) (B-955-0003-304)
— 2110-T3-60, DCM -60 Type 5 C-Band (Half-Width) (B-955-0003-306)

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• G.655 (ELEAF) low loss 2110 DCMs including:


— 2110-T3-80L, DCM -80 Low Loss Type 5 C-Band (Half-Width)
(166-0403-908)
— 2110-T3-100L, DCM -100 Low Loss Type 5 C-Band (Full-Width)
(166-0403-910)
— 2110-T3-120L, DCM -120 Low Loss Type 5 C-Band (Full-Width)
(166-0403-912)
— 2110-T3-140L, DCM -140 Low Loss Type 5 C-Band (Full-Width)
(166-0403-914)
– 2110-T3-160L, DCM -160 Low Loss Type 5 C-Band (Full-Width)
(166-0403-916)
— 2110-T3-180L, DCM -180 Low Loss Type 5 C-Band (Full-Width)
(166-0403-918)
It is recommended that the empty sub-slots in a 2110 shelf are filled with 2110
blank (filler panel) (B-955-0004-001).

Figure 1-210 shows the faceplates of the 2110 DCM modules. Figure 1-211
on page 1-540 provides functional block diagram of the 2110 DCM modules.

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Figure 1-210
2110 DCM faceplates (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)

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Figure 1-211
2110 DCM block diagram (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)

OUT

IN

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Supported functionality
Photonic passive equipment provides the following functionality:
• The following shows ports descriptions for OMDF4 modules, OMDF8
modules, BS, and OSCF module.
Table 1-144
Ports descriptions for OMDF4 modules, OMDF8 modules, BS, and OSCF module

Passive NTWK EXPR Ch # Number Channel GRP # Number MON


modules (network (Express/ (channel of (1511) (group of (monitor
port) Expansion ports) channel ports) group port)
port) ports ports

OMDF4 √ √ √ 4 N/A N/A N/A √


modules (Note 1 (Note 4 (Note 6 (Note 12)
and and and
Note 7) Note 7) Note 7)

OMDF8 √ N/A √ 8 N/A N/A N/A √


modules (Note 1 (Note 6 (Note 12)
and and
Note 7) Note 7)

BS modules √ √ N/A N/A N/A √ 1, 2, 3, or √


(Note 2 (Note 5 (Note 11) 5 (Note 12)
and and
Note 8) Note 7)

OSCF √ √ N/A N/A √ N/A N/A N/A


module (Note 3 (Note 4 (Note 10)
and and
Note 9) Note 9)

Note 1: NTWK (network port) provides input/output ports to the aggregate DWDM signal and is typically
connected either to the jumpers leading to the network (for example, outside plant) or to the relevant
Group port of a 100 GHz DWDM band splitter module.
Note 2: NTWK (network port) provides input/output ports to the aggregate CWDM signal and is typically
connected to the jumpers leading to the network (for example, outside plant or transmission fibers).
Note 3: NTWK (network port) provides input/output ports to the aggregate DWDM signal and is typically
connected to the jumpers leading to the network (for example, outside plant).
Note 4: EXPR (Express/Expansion port) provides input/output ports for the pass-through channels and
may be connected to the network. They may also be connected to a companion filter either for additional
downstream filtering or in the construction of an OADM node.
Note 5: EXPR (Express/Expansion port) provides input/output ports for the pass-through channel groups
and may be connected to the network. They may also be connected to a companion filter either for
additional downstream filtering or in the construction of an OADM node.
Note 6: Channel ports provide input/output ports for the channels that are muxed/demuxed by their
respective filters. The channel ports are typically connected to the optical transceivers of one or more
network elements.

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Table 1-144
Ports descriptions for OMDF4 modules, OMDF8 modules, BS, and OSCF module

Passive NTWK EXPR Ch # Number Channel GRP # Number MON


modules (network (Express/ (channel of (1511) (group of (monitor
port) Expansion ports) channel ports) group port)
port) ports ports

Note 7: In the demux direction, the aggregated DWDM signal entering the NTWK port passes through
four channel filters (in case of a 4-channel passive module) or eight channel filters (in case of a 8-channel
passive module), which separate the intended wavelengths from the composite signal and routes them
to their respective channel ports. In a 4-channel passive module, the remaining DWDM signal passes to
the EXPR port. In a 8-channel passive module, and since 8-channel passive module do not support an
express passband, any pass-through traffic must be filtered and passed by another module (e.g. band
splitter), bypassing this filter. In the mux direction, the converse occurs. All ports use LC connectors.
Note 8: For the BS1 module and in the demux direction, the aggregated DWDM signal entering the
NTWK port passes through the group filter, which separates the group band from the composite signal
and routes it to the group port. The remaining DWDM signal passes to the EXPR port. All ports use LC
connectors. For the 2-group, 3-group, and BS5 modules and in the demux direction, the aggregated
DWDM signal entering the NTWK port passes through the group filters, which separate the group bands
from the composite signal and route them to their respective group ports. The remaining DWDM signal
passes to the EXPR port except for 3-group and BS5 modules which do not support an express
passband; hence, any passthrough traffic must be filtered by another module, bypassing this filter. All
ports use LC connectors.
Note 9: In the demux direction, the aggregated signal entering the NTWK port passes through a channel
filter, which separates the intended wavelength from the composite signal and routes it to the channel
port. The remaining CWDM signal passes to the EXPR port. In the mux direction, the converse occurs.
All ports use LC connectors.
Note 10: Channel (1511) provides input/output ports for the single channel that is muxed/demuxed by
the filter. The channel ports are typically connected to the optical transceiver of a network element.
Note 11: Group ports provide input/output ports for a wavelength group that is muxed/demuxed by the
group filter. The group ports are typically connected to the NTWK ports of a cascaded DWDM channel
filter.
Note 12: MON (monitor port) provides 1% output and 5% input taps with which to monitor the aggregated
DWDM signal at the NTWK interfaces. These taps are useful for monitoring the DWDM spectrum in an
unobtrusive manner. While the BS3 modules can be connected directly to the network fibers and serve
as first stage mux/demux in a manner similar to that of the BS2 modules, it is designed primarily to serve
as a 3- band, 24-channel expansion module. In this scenario the NTWK ports connect to the Expansion
port of the BS2 module, which in turn connects to the network fibers. For this reason, this module does
not support the MON ports, since monitoring can be performed either from the BS2 module connected to
the network fiber (if present) or from the cascaded channel filters.

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• The following shows 40-wavelength 100 GHz grid planning in 6500 for
OMDF4 modules, OMDF8 modules, and band splitter modules.
Table 1-145
Photonic passive modules 100 GHz ITU grid 40 wavelength plan

Band Sub-band 4200 channel # 6500 channel # 6500


(written on faceplate Wavelength
of the module) 100 GHz (nm)

Band A (or Group A)

Band A ch 1 Sub-band A4H ch 1 59 1 1530.33

Band A ch 2 Sub-band A4H ch 2 58 3 1531.12

Band A ch 3 Sub-band A4H ch 3 57 5 1531.90

Band A ch 4 Sub-band A4H ch 4 56 7 1532.68

Band A ch 5 Sub-band A4L ch 1 55 9 1533.47

Band A ch 6 Sub-band A4L ch 2 54 11 1534.25

Band A ch 7 Sub-band A4L ch 3 53 13 1535.04

Band A ch 8 Sub-band A4L ch 4 52 15 1535.82

Band B (or Group B)

Band B ch 1 Sub-band B4H ch 1 50 19 1537.40

Band B ch 2 Sub-band B4H ch 2 49 21 1538.19

Band B ch 3 Sub-band B4H ch 3 48 23 1538.98

Band B ch 4 Sub-band B4H ch 4 47 25 1539.77

Band B ch 5 Sub-band B4L ch 5 46 27 1540.56

Band B ch 6 Sub-band B4L ch 6 45 29 1541.35

Band B ch 7 Sub-band B4L ch 7 44 31 1542.14

Band B ch 8 Sub-band B4L ch 8 43 33 1542.94

Band C (or Group C)

Band C ch 1 Sub-band C4H ch 1 41 37 1544.53

Band C ch 2 Sub-band C4H ch 2 40 39 1545.32

Band C ch 3 Sub-band C4H ch 3 39 41 1546.12

Band C ch 4 Sub-band C4H ch 4 38 43 1546.92

Band C ch 5 Sub-band C4L ch 1 37 45 1547.72

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Table 1-145
Photonic passive modules 100 GHz ITU grid 40 wavelength plan

Band Sub-band 4200 channel # 6500 channel # 6500


(written on faceplate Wavelength
of the module) 100 GHz (nm)

Band C ch 6 Sub-band C4L ch 2 36 47 1548.51

Band C ch 7 Sub-band C4L ch 3 35 49 1549.32

Band C ch 8 Sub-band C4L ch 4 34 51 1550.12

Band D (or Group D)

Band D ch 1 Sub-band D4H ch 1 32 55 1551.72

Band D ch 2 Sub-band D4H ch 2 31 57 1552.52

Band D ch 3 Sub-band D4H ch 3 30 59 1553.33

Band D ch 4 Sub-band D4H ch 4 29 61 1554.13

Band D ch 5 Sub-band D4L ch 5 28 63 1554.94

Band D ch 6 Sub-band D4L ch 6 27 65 1555.75

Band D ch 7 Sub-band D4L ch 7 26 67 1556.55

Band D ch 8 Sub-band D4L ch 8 25 69 1557.36

Band E (or Group E)

Band E ch 1 Sub-band E4H ch 1 23 73 1558.98

Band E ch 2 Sub-band E4H ch 2 22 75 1559.79

Band E ch 3 Sub-band E4H ch 3 21 77 1560.61

Band E ch 4 Sub-band E4H ch 4 20 79 1561.42

Band E ch 5 Sub-band E4L ch 1 19 81 1562.23

Band E ch 6 Sub-band E4L ch 2 18 83 1563.05

Band E ch 7 Sub-band E4L ch 3 17 85 1563.86

Band E ch 8 Sub-band E4L ch 4 16 87 1564.68

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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.

Equipment alarms
• Circuit pack Missing
• Circuit Pack Mismatch

Facility alarm
• Duplicate adjacency discovered
• Loss of signal
• Group loss of signal

Equipping rules
The following equipping rules apply to Photonic passive equipment:
• 2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001) or
2150 Passive Optical Multiplexer (3-slot) chassis (174-0064-900) can be
manually provisioned (although not automatically) and 2-Slot Optical
Module Chassis (OMC2) or 6-slot passive Photonic chassis (PPC6)
(174-0040-900) can be automatically provisioned in external slots of
— 14-slot shelf (except the NTK503GA metro front electrical shelf, which
does not support this module) by using the shelf processor and access
panel.
— 32-slot shelf by using the shelf processor and access panel.
— 7-slot shelf (NTK503PAE5 or NTK503KA) by using the shelf processor
and access panel.
— 6500-7 packet-optical shelf (NTK503RA) by using the shelf processor
and access panel.
— 2-slot shelf by using the integrated shelf processor/access panel in
NTK503MAE5 and NTK503NAE5 variants or shelf processor
w/access panel (SPAP) (NTK555LA)/shelf processor w/access panel
(SPAP-2) w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA
variant.

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Note: Maximum ten 2150 Passive Optical Multiplexer (6-slot) chassis


(B-310-0142-001), 2150 Passive Optical Multiplexer (3-slot) chassis
(174-0064-900), 2-Slot Optical Module Chassis (OMC2), or 6-slot passive
Photonic chassis (PPC6) (174-0040-900) can be provisioned in a 2-slot
(NTK503LA variant), 6500-7 packet-optical, 7-slot, 14-slot, or 32-slot
shelves. Maximum seven 2150 Passive Optical Multiplexer (6-slot)
chassis (B-310-0142-001), 2150 Passive Optical Multiplexer (3-slot)
chassis (174-0064-900), 2-Slot Optical Module Chassis (OMC2), or 6-slot
passive Photonic chassis (PPC6) (174-0040-900) can be provisioned in a
2-slot shelf (NTK503MAE5 and NTK503NAE5 variants).

• although the PPC6 is a passive device, autoprovisioning and automatic


inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the PPC6's RJ45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the PPC6's RJ45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the PPC6's RJ45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the PPC6's RJ45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the PPC6's RJ45 port to the NTK505JA access panel external slot
ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the PPC6's RJ45 port to the access panel external slot
ports).

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• The 2-Slot Optical Module Chassis (OMC2) contains two sub-slots and
can be equipped with:
— CLMD modules (NTK504PA); single-slot, one per sub-slot (any
sub-slot)
— UCS modules (NTK504PL); single-slot, one per sub-slot (any sub-slot)
— MonCS modules (NTK504PN); single-slot, one per sub-slot (any
sub-slot)
• The 2150 (6-slot) chassis or PPC6 contains six sub-slots (1, 2, 3 in the first
row from left to right and 4, 5, 6 in the second row from left to right) and
can be equipped with:
— OMDF4 modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OMDF8 modules (B-720-0022-00x); -slot, in sub-slots 1+2 and 4+5
only
— BS modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OSCF modules (B-720-0014-003); single-slot, one per sub-slot (any
sub-slot)
• The 2150 (3-slot) chassis contains three sub-slots (1, 2, 3) and can be
equipped with:
— OMDF4 modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OMDF8 modules (B-720-0022-00x); -slot, in sub-slots 1+2 only
— BS modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OSCF modules (B-720-0014-003); single-slot, one per sub-slot (any
sub-slot)
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (6-slot) or 2150
(3-slot) chassis since 2150 (6-slot) or 2150 (3-slot) chassis cannot be
connected to 6500 shelf access panel external slots. Hence, you must
manually provision the 2150 (6-slot) or 2150 (3-slot) chassis and any
passive modules in its sub-slots. However, if you equip these passive
modules in a PPC6, the 6500 supports autoprovisioning and automatic
inventory through the built-in PPC6 inventory control logic which interfaces
directly with the 6500 shelf access panel. The passive modules OMDF4,
OMDF8, BS1, BS2, BS3, BS5, and OSCF do not directly report to the
6500 shelf access panel. Also, if you equip the passive modules (MonCS,
CLMD and/or UCS) in an OMC2 chassis, the 6500 can support

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autoprovisioning and automatic inventory through the RJ45 interfaces in


the passive modules which directly connect to the 6500 shelf access
panel.

• 2110 DCMs (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx,


166-0403-9xx) can be also manually provisioned (although not
automatically) in external slots of 2-slot, 6500-7 packet-optical, 7-slot,
14-slot, and 32-slot shelf types.
Note: The 6500 does not support autoprovisioning and automatic
inventory on the 2110 DCMs equipped in a 2110 shelf since 2110 shelf
cannot be connected to 6500 shelf access panel external slots. You must
use the DSCM variants NTT870xx if you need automatic inventory
support.

• Photonic passive equipment does not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
• Photonic passive equipment are passive modules and therefore do not
require DC power.

Technical specifications
The following tables show different technical specifications for the Photonic
passive equipment supported in this release of 6500:
• Table 1-146 on page 1-549 lists the weight, dimensions and power
consumption for the chassis.
• Table 1-147 on page 1-552 lists the weight, dimensions and power
consumption for the 2110-Tx-xxxx Dispersion Compensation Modules
(DCMs).
• Table 1-148 on page 1-552 lists the weight and power consumption for the
CN-xxx modules.
• Table 1-149 on page 1-553 lists the weight and power consumption for the
OBB and OBMD modules.
• Table 1-150 on page 1-553 and on page 1-554 provide the optical
characteristics of the CN-100-x4L and CN-100-x4H 4-channel Optical
Mux/Demux Filter (OMDF4) 100 GHz modules (B-720-0020-0xx).
• Table 1-152 on page 1-556 and Table 1-153 on page 1-557 provide the
optical characteristics of the CN-100-x80 8-channel Optical Mux/Demux
Filter (OMDF8) 100 GHz modules (B-720-0022-00x).
• Table 1-154 on page 1-558 and Table 1-155 on page 1-558 provide the
optical characteristics of the OBMD 1x8 C-Band modules.
• Table 1-156 on page 1-558 and Table 1-157 on page 1-559 provide the
optical characteristics of the OBB 2x2x2 C-Band modules.

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• Table 1-158 on page 1-559 and Table 1-159 on page 1-560 provide the
optical characteristics of the OBB 2x4x1 C-Band modules.
• Table 1-160 on page 1-560 and Table 1-161 on page 1-561 provide the
optical characteristics of the CN-BS1-x 1-Group Band Splitter 100 GHz
modules.
• Table 1-162 on page 1-562 and Table 1-163 on page 1-562 provide the
optical characteristics of the CN-BS2-xx 2-Group Band Splitter 100 GHz
modules.
• Table 1-164 on page 1-563 and Table 1-165 on page 1-564 provide the
optical characteristics of the CN-BS3-ABE 3-Group Band Splitter 100 GHz
module.
• Table 1-166 on page 1-565 and Table 1-167 on page 1-566 provide the
optical characteristics of the CN-BS5 5-Group Band Splitter 100 GHz
module.
• Table 1-168 on page 1-567 and Table 1-169 on page 1-568 provide the
optical characteristics of the OSCF module.
• Table 1-170 on page 1-569 provides the optical characteristics of the 2110
DCMs.
Table 1-146
Weight, dimensions, power consumption for the chassis

Photonic passive equipment Weight (estimated) Dimensions Power


and PEC consumption
2-Slot Optical Module Chassis 4.6 kg (10.1 lb) Height: (43 mm / 1.7 in.) 0
(OMC2) (NTK504NA) Width: 438.1 mm / 17.25 in.)
Depth: 278.5 mm / 10.96 in.

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Table 1-146
Weight, dimensions, power consumption for the chassis

Photonic passive equipment Weight (estimated) Dimensions Power


and PEC consumption
2150 Passive Optical Multiplexer 4.5 kg (9.9 lb) Height: 88.9 mm / 3.5 in. 0
(6-slot) chassis including brackets, Width: 445 mm / 17.5 in.
(B-310-0142-001): fiber management bar
and cover and fully Depth: 260.0 mm / 10.2 in.
• 2150 Passive Optical (chassis only),
Multiplexer (6-slot) chassis with equipped with 300.0 mm / 11.8 in. (chassis
19 inch brackets, fiber modules
w/optional fiber guard)
management bar and cover
(B-967-0001-002)
• 2150 Passive Optical
Multiplexer (6-slot) chassis with
23 inch brackets, fiber
management bar and cover
(B-967-0002-002)
• 2150 Passive Optical
Multiplexer (6-slot) chassis with
ETSI inch brackets, fiber
management bar and cover
(B-967-0003-002)
2150 Passive Optical Multiplexer 5.4 kg (11.9 lb) Height: 43 mm / 1.7 in. 0
(3-slot) chassis (174-0064-900): including brackets Width: 437 mm / 17.2 in.
• 2150 Passive Optical and cover and fully
Depth: 279 mm / 11 in.
Multiplexer (3-slot) chassis with equipped with
19 inch, 23 inch, and ETSI modules
brackets (K80-0002-901)
• 2150 Passive Optical
Multiplexer (3-slot) chassis with
19 inch, 23 inch, and ETSI
brackets and cover
(K80-0002-902)

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Table 1-146
Weight, dimensions, power consumption for the chassis

Photonic passive equipment Weight (estimated) Dimensions Power


and PEC consumption
6-slot passive photonic chassis 7.7 kg (17.0 lb) Height: 86.9 mm / 3.4 in. 0
(174-0040-900): including brackets, Width: 432 mm / 16.9 in.
• 6-slot Passive Photonics fiber management bar
and cover and fully Depth: 290.6 mm / 11.4 in.
chassis (PPC6) with 19 inch (chassis only)
and 23 inch brackets equipped with
(K80-0001-001) modules

• 6-slot Passive Photonics


chassis (PPC6) with 19 inch
and 23 inch brackets, fiber
management bar and cover
(K80-0001-002)
• 6-slot Passive Photonics
chassis (PPC6) with ETSI
brackets (K80-0001-003)
• 6-slot Passive Photonics
chassis (PPC6) with ETSI
brackets, fiber management
bar and cover (K80-0001-004)
2110 shelf for Dispersion 13.6 kg (30.0 lb) Height: 43 mm / 1.7 in. 0
Compensation Modules: including brackets Width: 437 mm / 17.2 in.
• 2110 shelf with 19 inch and one full width (excluding mounting
brackets for EIA or NEBS DCM or two half-width brackets)
equipment racks DCMs
Depth: 279 mm / 11 in.
(B-955-0004-005)
• 2110 shelf with 23 inch
brackets for EIA or NEBS
equipment racks
(B-955-0004-006)
• 2110 shelf with ETSI bracket
configured for 300 mm rack
brackets (B-955-0004-008)

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Table 1-147
Weight, dimensions, power consumption for the 2110-Tx-xxxx Dispersion Compensation
Modules (DCMs)

Photonic passive equipment Weight (estimated) Dimensions Power


and PEC consumption
• B-955-0003-00x (half-width) <1.5 kg (< 3.3 lb) Height: 40 mm / 1.6 in. 0
• B-955-0003-3xx (half-width) Width: 213 mm / 8.4 in. for
• 166-0203-9xx (half-width) half-width modules and
428 mm / 16.9 in. for
• 166-0403-9xx (half-width) full-width modules
• 166-0203-9xx (full-width) <2.7 kg (< 5.9 lb) Depth: 275 mm / 10.9 in 0
• 166-0403-9xx (full-width)

Table 1-148
Power consumption for the CN-xxx modules

Photonic passive equipment and PEC Weight (estimated) Power


consumption
CN-100-x4L and CN-100-x4H 4-channel Optical <0.4 kg (< 0.9 lb) 0
Mux/Demux Filter (OMDF4) 100 GHz modules
(B-720-0020-0xx)
CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 0
100 GHz modules (B-720-0022-00x)
CN-BS1-x 1-Group Band Splitter 100 GHz modules 0
(B-720-0020-0xx)
CN-BS2-xx 2-Group Band Splitter 100 GHz modules 0
(B-720-0020-03x)
CN-BS3-ABE 3-Group Band Splitter 100 GHz module 0
(B-720-0020-033)
CN-BS5 5-Group Band Splitter 100 GHz module 0
(B-720-0020-032)
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF 0
CWDM 1511 nm) module (B-720-0014-003)

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Table 1-149
Power consumption for the OBB and OBMD modules

Photonic passive equipment and PEC Weight (estimated) Power


consumption
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) 0.6 kg (1.2 lb) 0
module (174-0104-900)
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) 0.3 kg (0.7 lb) 0
module (174-0115-900)
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) 0.3 kg (0.7 lb) 0
module (174-0116-900)

Table 1-150
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
insertion loss

Network Port Port name for OMDF4 modules Insertion


Loss
(Note)

E4L E4H D4L D4H C4L C4H B4L B4H A4L A4H Typ Max
(dB) (dB)

Ntwk Out 16 In 20 In 25 In 29 In 34 In 38 In 43 In 47 In 52 In 56 In 1.0 1.7


(Mux)

Ntwk Out 17 In 21 In 26 In 30 In 35 In 39 In 44 In 48 In 53 In 57 In 1.2 2.0


(Mux)

Ntwk Out 18 In 22 In 27 In 31 In 36 In 40 In 45 In 49 In 54 In 58 In 1.4 2.3


(Mux)
DWDM Channels

Ntwk Out 19 In 23 In 28 In 32 In 37 In 41 In 46 In 50 In 55 In 59 In 1.6 2.6


(Mux)

Ntwk In 16 20 25 29 34 38 43 47 52 56 1.7 2.8


(Demux) Out Out Out Out Out Out Out Out Out Out

Ntwk In 17 21 26 30 35 39 44 48 53 57 1.5 2.5


(Demux) Out Out Out Out Out Out Out Out Out Out

Ntwk In 18 22 27 31 36 40 45 49 54 58 1.3 2.2


(Demux) Out Out Out Out Out Out Out Out Out Out

Ntwk In 19 23 28 32 37 41 46 50 55 59 1.1 1.9


(Demux) Out Out Out Out Out Out Out Out Out Out

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Table 1-150
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
insertion loss

Network Port Port name for OMDF4 modules Insertion


Loss
(Note)

E4L E4H D4L D4H C4L C4H B4L B4H A4L A4H Typ Max
(dB) (dB)

Ntwk Out Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In 1.2 2.0


(Mux)
EXPR

Ntwk In Ex Ex Ex Ex Ex Ex Ex Ex Ex Ex 1.6 2.7


(Demux) Out Out Out Out Out Out Out Out Out Out

Note: Losses include two connector pairs for fiber-to-fiber measurement.

Table 1-151
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
optical specifications

Parameter Min Typ Max

Channel Passband (nm) (Note) λc±0.125 λc±0.15


DWDM Channels

Total Channel Bandwidth (0.5 dB) (nm) 0.4

Insertion Loss Variation (65% of 0.5 dB passband width) (dB) 0.4

Adjacent Channel Isolation (Demux) (dB) 28

Adjacent Channel Isolation (Mux) (dB) 25

Non-Adjacent DWDM Channel Isolation (dB) 40

Expr Passbanda (excl. λ1 through λ4) (nm) 1529 1566

Insertion Loss Variation (full passband) (dB) 0.3


EXPR

Isolation: Expr port Out (dB) 22

Isolation: Expr port In (dB) 12

Ntwk Input (%) 5


MON

Ntwk Output (%) 1

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Table 1-151
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
optical specifications

Parameter Min Typ Max

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.15


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note: All passbands are specified at 0.5 dB bandwidth.

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Table 1-152
8-channel Mux/Demux modules (OMDF8) insertion loss

Network Port Port name for OMDF8 modules Insertion Loss


(Note)

E80 D80 C80 B80 A80 Typ (dB) Max (dB)

Ntwk Out (Mux) 16 In 25 In 34 In 43 In 52 In 1.0 1.7

Ntwk Out (Mux) 17 In 26 In 35 In 44 In 53 In 1.2 2.0

Ntwk Out (Mux) 18 In 27 In 36 In 45 In 54 In 1.4 2.3

Ntwk Out (Mux) 19 In 28 In 37 In 46 In 55 In 1.6 2.6

Ntwk Out (Mux) 20 In 29 In 38 In 47 In 56 In 1.7 2.9

Ntwk Out (Mux) 21 In 30 In 39 In 48 In 57 In 1.9 3.2


DWDM Channels

Ntwk Out (Mux) 22 In 31 In 40 In 49 In 58 In 2.1 3.5

Ntwk Out (Mux) 23 In 32 In 41 In 50 In 59 In 2.3 3.8

Ntwk In (Demux) 16 Out 25 Out 34 Out 43 Out 52 Out 2.4 4.0

Ntwk In (Demux) 17 Out 26 Out 35 Out 44 Out 53 Out 2.2 3.7

Ntwk In (Demux) 18 Out 27 Out 36 Out 45 Out 54 Out 2.0 3.4

Ntwk In (Demux) 19 Out 28 Out 37 Out 46 Out 55 Out 1.9 3.1

Ntwk In (Demux) 20 Out 29 Out 38 Out 47 Out 56 Out 1.7 2.8

Ntwk In (Demux) 21 Out 30 Out 39 Out 48 Out 57 Out 1.5 2.5

Ntwk In (Demux) 22 Out 31 Out 40 Out 49 Out 58 Out 1.3 2.2

Ntwk In (Demux) 23 Out 32 Out 41 Out 50 Out 59 Out 1.1 1.9

Note: Losses include two connector pairs for fiber-to-fiber measurement.

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Table 1-153
CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules optical specifications

Parameter Min Typ Max

Channel Passband (nm) (Note) λc±0.125 λc±0.15


DWDM Channels

Total Channel Bandwidth (0.5 dB) (nm) 0.4

Insertion Loss Variation (65% of 0.5 dB passband width) (dB) 0.4

Adjacent Channel Isolation (Demux) (dB) 28

Adjacent Channel Isolation (Mux) (dB) 25

Non-Adjacent DWDM Channel Isolation (dB) 40

Ntwk Input (%) 5


MON

Ntwk Output (%) 1

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.2


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note: All passbands are specified at 0.5 dB bandwidth.

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Table 1-154
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) (174-0104-900) module insertion loss

From To Insertion loss (dB)

Min Max

Common In 1/2/3/4/5/6/7/8 Out 9.8 11

1/2/3/4/5/6/7/8 In Common Out 10.1 11.3

Table 1-155
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) (174-0104-900) module power monitoring
dynamic range

Port Dynamic range (dBm)

Min Max

Common In -9.0 19

1/2/3/4/5/6/7/8 In -11.0 4

Table 1-156
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) (174-0115-900) module insertion loss

From To Insertion loss (dB)

Min Max

Line 1 In Line 2 Out 20.3 21.3

CMD1 Out 4.2 5.4


CMD2 Out

Line 2 In Line 1 Out 20.3 21.3

CMD1 Out 4.2 5.4


CMD2 Out

CMD 1 In Line 1 Out 5.2 6.4


Line 2 Out

CMD 2 In Line 1 Out 5.2 6.4


Line 2 Out

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Table 1-157
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) (174-0115-900) module power monitoring
dynamic range

Port Dynamic range (dBm)

Min Max

Line 1 In -4.0 24

Line 2 In -4.0 24

CMD 1 In -21.0 7

CMD 2 In -21.0 7

Table 1-158
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) (174-0116-900) module insertion loss

From To Insertion loss (dB)

Min Max

Line 1 In Line 2 Out 20.3 21.3

CMD1 Out 4.2 5.4


CMD2 Out

Line 2 In Line 1 Out 20.3 21.3

CMD3 Out 4.2 5.4


CMD4 Out

CMD 1 In Line 1 Out 5.2 6.4

CMD 2 In Line 1 Out 5.2 6.4

CMD 3 In Line 2 Out 5.2 6.4

CMD 4 In Line 2 Out 5.2 6.4

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Table 1-159
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) (174-0116-900) module power monitoring
dynamic range

Port Dynamic range (dBm)

Min Max

Line 1 In -4.0 24

Line 2 In -4.0 24

CMD 1 In -21.0 7

CMD 2 In -21.0 7

CMD 3 In -21.0 7

CMD 4 In -21.0 7

Table 1-160
CN-BS1-x 1-Group Band Splitter 100 GHz modules insertion loss

Port names Insertion Loss


(Note)

Typ (dB) Max (dB)

Ntwk Out (Mux) to Group x In 1.1 1.9


GRP

Ntwk In (Demux) to Group x Out 1.3 2.1

Ntwk Out (Mux) to Expr In 0.7 1.2


EXPR

Ntwk In (Demux) to Expr Out 1.1 1.8

Note: Losses include two connector pairs for fiber-to-fiber measurement.

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Table 1-161
CN-BS1-x 1-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Group E Passband (nm) (Note) 1558.82 1564.84


-E

Ntwk to EXPR passband (nm) (Note) 1529.00 1558.17

Group D Passband (nm) (Note) 1551.56 1557.53


-D

Ntwk to EXPR passband (excl. λgroupD ±.8nm) (nm) 1529.00 1566.00


(Note)

Group C Passband (nm) (Note) 1544.37 1550.28


-C

Ntwk to EXPR passband (excl. λgroupC ±.8nm) (nm) 1529.00 1566.00


Groups (-Module)

(Note)

Group B Passband (nm) (Note) 1537.24 1543.10


-B

Ntwk to EXPR passband (excl. λgroupB ±.8nm) (nm) 1529.00 1566.00


(Note)

Group A Passband (nm) (Note) 1530.18 1535.98


-A

Ntwk to EXPR passband (nm) (Note) 1536.61 1566.00

Passband Insertion Loss Variation (excl. outermost 5GHz 0.3


either side of passband, Grp and Expr ports) (dB)

Isolation (Ntwk In to Expr Out) (dB) 26

Isolation (Ntwk Out to Expr In) (dB) 16

Isolation (Ntwk to Grp port) (dB) 20

Ntwk Input (%) 5


MON

Ntwk Output (%) 1

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.1


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note: All passbands are specified at 0.5 dB bandwidth.

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Table 1-162
CN-BS2-xx 2-Group Band Splitter 100 GHz modules insertion loss

Port names Insertion Loss


(Note)

Typ (dB) Max (dB)

Ntwk Out (Mux) to Group x In 1.2 2.0

Ntwk Out (Mux) to Group y In 1.3 2.2


GRP

Ntwk In (Demux) to Group x Out 1.4 2.4

Ntwk In (Demux) to Group y Out 1.3 2.1

Ntwk Out (Mux) to Expr In 1.0 1.6


EXPR

Ntwk In (Demux) to Expr Out 1.1 1.8

Note: Losses include two connector pairs for fiber-to-fiber measurement.

Table 1-163
CN-BS2-xx 2-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Group D Passband (nm) (Note) 1551.56 1557.53

Group C Passband (nm) (Note) 1544.37 1550.28


-CD

Ntwk to EXPR passband (excl. lgroupsC+D ±.8nm) (nm) 1529.00 1556.00


(Note)
Groups (-Module)

Group B Passband (nm) (Note) 1537.24 1543.10

Group A Passband (nm) (Note) 1530.18 1535.98


-AB

Ntwk to EXPR Passbanda (excl. lgroupsA+B ±.8nm) (nm) 1529.00 1556.00


(Note)

Passband Insertion Loss Variation (excl. outermost 5GHz 0.3


either side of passband, Grp and Expr ports) (dB)

Isolation (Ntwk In to Expr) (dB) 16

Isolation (Ntwk to Grp port) (dB) 20

Ntwk Input (%) 5


MON

Ntwk Output (%) 1

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Table 1-163
CN-BS2-xx 2-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.1


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note: All passbands are specified at 0.5 dB bandwidth

Table 1-164
CN-BS3-ABE 3-Group Band Splitter 100 GHz modules insertion loss

Port names Insertion Loss


(Note)

Typ (dB) Max (dB)

Ntwk Out (Mux) to Group A In 0.8 1.4

Ntwk Out (Mux) to Group B In 1.0 1.7

Ntwk Out (Mux) to Group C In 1.2 2.0


GRP

Ntwk In (Demux) to Group A Out 1.2 2.0

Ntwk In (Demux) to Group B Out 1.0 1.7

Ntwk In (Demux) to Group C Out 0.8 1.4

Note: Losses include two connector pairs for fiber-to-fiber measurement.

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Table 1-165
CN-BS3-ABE 3-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Group E Passband (nm) (Note) 1558.82 1564.84

Group B Passband (nm) (Note) 1537.24 1543.10

Group A Passband (nm) (Note) 1530.18 1535.98

Passband Insertion Loss Variation (excl. outermost 5GHz 0.3


either side of passband, Grp ports) (dB)
Groups

Isolation (Ntwk In to Grp E Out) (dB) 20

Isolation (Ntwk In to Grp B Out) (dB) 20

Isolation (Ntwk In to Grp A Out) (dB) 16

Isolation (Ntwk Out to Grp E In) (dB) 16

Isolation (Ntwk Out to Grp B In) (dB) 20

Isolation (Ntwk Out to Grp A In) (dB) 20

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.1


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note: All passbands are specified at 0.5 dB bandwidth.

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Table 1-166
CN-BS5 5-Group Band Splitter 100 GHz modules insertion loss

Port names Insertion Loss


(Note)

Typ (dB) Max (dB)

Ntwk Out (Mux) to Group A In 1.2 2.0

Ntwk Out (Mux) to Group B In 1.3 2.2

Ntwk Out (Mux) to Group C In 1.5 2.5

Ntwk Out (Mux) to Group D In 1.7 2.8

Ntwk Out (Mux) to Group E In 1.9 3.1


GRP

Ntwk In (Demux) to Group A Out 1.9 3.2

Ntwk In (Demux) to Group B Out 1.8 3.0

Ntwk In (Demux) to Group C Out 1.6 2.7

Ntwk In (Demux) to Group D Out 1.4 2.4

Ntwk In (Demux) to Group E Out 1.2 2.1

Note: Losses include two connector pairs for fiber-to-fiber measurement.

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Table 1-167
CN-BS5 5-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Group E Passband (nm) (Note 1 and Note 2) 1558.82 1564.84

Group D Passband (nm) (Note 1) 1551.56 1557.53

Group C Passband (nm) (Note 1) 1544.37 1550.28

Group B Passband (nm) (Note 1) 1537.24 1543.10

Group A Passband (nm) (Note 1 and Note 3) 1530.18 1535.98

Passband Insertion Loss Variation 0.3


(excl. outermost 5GHz either side of passband, Grp ports) (dB)

Isolation (Ntwk In to Grp E Out) (dB) 20


Groups

Isolation (Ntwk In to Grp D Out) (dB) 20

Isolation (Ntwk In to Grp C Out) (dB) 20

Isolation (Ntwk In to Grp B Out) (dB) 20

Isolation (Ntwk In to Grp A Out) (dB) 16

Isolation (Ntwk Out to Grp E In) (dB) 16

Isolation (Ntwk Out to Grp D In) (dB) 20

Isolation (Ntwk Out to Grp C In) (dB) 20

Isolation (Ntwk Out to Grp B In) (dB) 20

Isolation (Ntwk Out to Grp A In) (dB) 20

Ntwk Input (%) 5


MON

Ntwk Output (%) 1

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Table 1-167 (continued)


CN-BS5 5-Group Band Splitter 100 GHz modules optical specifications

Parameter Min Typ Max

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (dB) 0.1


General

Polarization Mode Dispersion (ps) 0.15

Directivity (dB) 50

Backreflection (All ports) (dB) 40

Optical Power Handling (mW) 250

Note 1: All passbands are specified at 0.5 dB bandwidth.


Note 2: The Group E Input port is directly connected to the Group D add filter express port. As a result,
the Group E Input port has different out-of-band spectral characteristics compared to Output ports A to
D. Nevertheless, the specifications in this table are all applicable.
Note 3: The Group A Output port is directly connected to the Group B drop filter express port. As a result,
the Group A Output port has different out-of-band spectral characteristics compared to Output ports B to
E. Nevertheless, the specifications in this table are all applicable.

Table 1-168
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module insertion loss

Port names Insertion Loss


(Note)

Typ (dB) Max (dB)


EXPR CWDM Channel

Ntwk Out (Mux) to Channel In 0.8 (0.9) 1.4 (1.6)

Ntwk In (Demux) to Channel Out 0.8 (1.0) 1.4 (1.7)

Ntwk Out (Mux) to Expr In 0.5 (0.7) 0.9 (1.2)

Ntwk In (Demux) to Expr Out 0.5 (0.7) 0.9 (1.2)

Note: Losses include two connector pairs for fiber-to-fiber measurement. Parenthetical numbers
pertain to extended temperature range conditions; all other numbers pertain to standard operating
conditions.

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Table 1-169
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module optical
specifications

Parameter Min Typ Max

Channel Passband (nm) (Note 1) λc±6.5 λc±7.2

Insertion Loss Variation: Ntwk to Channel (dB) 0.08 0.3


CWDM channel

CWDM Channel Isolation: Ntwk to Expr (dB) 15 20

Adjacent CWDM Channel Isolation (Demux) (dB) 35 >40

Adjacent CWDM Channel Isolation (Mux) (dB) 20 >40

Non-Adjacent CWDM Channel Isolation (dB) 45 >55

Expr Passband (excl. lc±10nm) (nm) (Note 1) 1460 1621


EXPR

Insertion Loss Variation: Ntwk to Expr (dB) (Note 2) 0.15 (0.25) 0.3 (0.5)

Insertion loss temperature sensitivity (dB/oC) 0.005

Polarization Dependent Loss (Ntwk to Channel) (dB) 0.1

Polarization Dependent Loss (Ntwk to Expr) (dB) 0.05


General

Polarization Mode Dispersion (ps) 0.1

Directivity (dB) 55

Backreflection (All ports) (dB) 45

Optical Power Handling (mW) 250

Note 1: All passbands are specified at 0.5 dB bandwidth.


Note 2: Parenthetical numbers pertain to extended temperature range conditions; all other numbers
pertain to both operating conditions.

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Table 1-170
2110 DCM specifications (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, and 166-0403-9xx
variants)

2110 DCM Module PEC Maximum 2110 DCM tilt (dB)


insertion loss (dB)

2110-T0-10, DCM -10 Type 1 B-955-0003-001 2.53 0.1


C-Band (Half-Width)

2110-T0-20, DCM -20 Type 1 B-955-0003-002 3.16 0.07


C-Band (Half-Width)

2110-T0-30, DCM -30 Type 1 B-955-0003-003 3.79 0.04


C-Band (Half-Width)

2110-T0-40, DCM -40 Type 1 B-955-0003-004 4.42 0.01


C-Band (Half-Width)

2110-T0-50, DCM -50 Type 1 B-955-0003-005 5.05 -0.03


C-Band (Half-Width)

2110-T0-60, DCM -60 Type 1 B-955-0003-006 5.68 -0.06


C-Band (Half-Width)

2110-T0-70L, DCM -70 Low Loss 166-0203-907 4.4 -0.29


Type 1 C-Band (Half-Width)

2110-T0-80L, DCM -80 Low Loss 166-0203-908 4.9 -0.32


Type 1 C-Band (Half-Width)

2110-T0-90L, DCM -90 Low Loss 166-0203-909 5.4 -0.38


Type 1 C-Band (Full-Width)

2110-T0-100L, DCM -100 Low Loss 166-0203-910 5.9 -0.41


Type 1 C-Band (Full-Width)

2110-T0-110L, DCM -110 Low Loss 166-0203-911 6.4 -0.45


Type 1 C-Band (Full-Width)

2110-T0-120L, DCM -120 Low Loss 166-0203-912 6.9 -0.50


Type 1 C-Band (Full-Width)

2110-T0-130L, DCM -130 Low Loss 166-0203-913 7.4 -0.54


Type 1 C-Band (Full-Width)

2110-T0-140L, DCM -140 Low Loss 166-0203-914 7.9 -0.58


Type 1 C-Band (Full-Width)

2110-T0-150L, DCM -150 Low Loss 166-0203-915 8.4 -0.61


Type 1 C-Band (Full-Width)

2110-T0-160L, DCM -160 Low Loss 166-0203-916 8.9 -0.68


Type 1 C-Band (Full-Width)

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Table 1-170
2110 DCM specifications (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, and 166-0403-9xx
variants)

2110 DCM Module PEC Maximum 2110 DCM tilt (dB)


insertion loss (dB)

2110-T0-170L, DCM -170 Low Loss 166-0203-917 8.9 -0.72


Type 1 C-Band (Full-Width)

2110-T3-20, DCM -20 Type 5 B-955-0003-302 4.0 -0.07


C-Band (Half-Width)

2110-T3-40, DCM -40 Type 5 B-955-0003-304 4.8 -0.05


C-Band (Half-Width)

2110-T3-60, DCM -60 Type 5 B-955-0003-306 5.7 -0.02


C-Band (Half-Width)

2110-T3-80L, DCM -80 Low Loss 166-0403-908 5.0 -0.06


Type 5 C-Band (Half-Width)

2110-T3-100L, DCM -100 Low Loss 166-0403-910 5.9 -0.03


Type 5 C-Band (Full-Width)

2110-T3-120L, DCM -120 Low Loss 166-0403-912 6.8 -0.06


Type 5 C-Band (Full-Width)

2110-T3-140L, DCM -140 Low Loss 166-0403-914 7.4 -0.11


Type 5 C-Band (Full-Width)

2110-T3-160L, DCM -160 Low Loss 166-0403-916 7.4 -0.19


Type 5 C-Band (Full-Width)

2110-T3-180L, DCM -180 Low Loss 166-0403-918 7.4 -0.20


Type 5 C-Band (Full-Width)

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2-1

Photonics equipment procedures 2-

Photonic circuit packs provisioning procedures


The following flowcharts provide the various steps/procedures to perform in
order to provision the different photonic circuit packs involved in the photonic
OTS.

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2-2 Photonics equipment procedures

Non-passive photonic OTS

Make sure the required passive modules such as CMD, BMD, or DSCM are installed.

See the Installation technical publication specific to the respective 6500 shelf type.

Install and provision required service slot circuit packs such as OSC and SFP(s), LIM, WSS, etc.

See the procedures in this chapter.

Route and connect fiber-optic cables to circuit packs

See the procedure in this chapter.


or
Provision photonic OTS using the original model
Provision photonic OTS using the new model
See the “Photonic layer provisioning procedures”
See the "Photonic Configuration Management"
chapter in Commissioning and Testing, 323-1851-221.
section in Part 2 of Configuration -
Provisioning and Operating, 323-1851-310

For Submarine applications, see


6500 Packet-Optical Platform
Submarine Networking Application Guide,
NTRN72AA

Does the system Yes


include root equipment, such as Provision the
FIM or GMD10? TID slot sequence

See Part 2 of
Configuration - Provisioning
No
and Operating, 323-1851-310
Provision photonic parameters

See the “Photonic layer provisioning procedures”


chapter in Commissioning and Testing, 323-1851-221.

Provision adjacencies

See the “Photonic layer provisioning procedures” chapter in Commissioning and Testing, 323-1851-221.

Connect intra-NE fibers

See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.

Test the applicable configuration

See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.

Equalize a thin terminal system if applicable

See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.

Proceed to "Photonic Network SLAT" in the Photonic Layer Guide, NTRN15DA

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Photonics equipment procedures 2-3

Passive photonic OTS

See Commissioning and Testing, 323-1851-221,


“Passive OTS network procedures” chapter,
to perform the following tasks:

Provision the required passive components

Create the required passive OTS or


passive configuration

Provision line adjacencies

Equalize the passive network

End
Procedure

The table below provides references to procedures covered in this section.

Figure 2-1
Procedures in this section

Topic

Procedure 2-1, “Provisioning a circuit pack automatically”

Procedure 2-2, “Provisioning a pluggable automatically”

Procedure 2-3, “Routing fiber-optic cables and electrical cables onto the 6500 shelf”

Procedure 2-4, “Connecting or disconnecting fiber-optic cables to or from circuit packs”

Procedure 2-5, “Setting up the photonic system configurations”

Procedure 2-6, “Changing the primary state of a facility”

Procedure 2-7, “Changing the primary state of a circuit pack or pluggable”

Procedure 2-8, “Deleting a facility from an equipment”

Procedure 2-9, “Deleting a circuit pack, module, or pluggable”

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2-4 Photonics equipment procedures

Procedure 2-1
Provisioning a circuit pack automatically
If automatic equipping is enabled, when inserted in the shelf, a photonic circuit
pack and any SFPs (if applicable) auto-provision and facilities are auto-
created. See Table 2-1 on page 2-6 for facilities supported on the photonic
circuit packs.

In a 14-slot shelf, the high flow fan requirement must be met before an SRA,
ESAM, SAM, or XLA circuit pack can auto-provision. For more information on
the shelf actual cooling capacity, see node information in Administration and
Security, 323-1851-301.

Note 1: The 2150 chassis (6-slot and 3-slot) and the passive modules
equipped in the 2150 chassis do not support auto-provisioning.
Note 2: The 6-slot passive photonics chassis (PPC6) and the passive
modules equipped in the 6-slot passive photonics chassis (PPC6) support
auto-provisioning if the 6-slot passive photonics chassis (PPC6) are
connected via Ethernet cables to unused and available external I2C slots
on the access panel.
To enable automatic equipping, refer to the “Enabling/disabling slot-based
automatic equipping” procedure in Administration and Security, 323-1851-
301.

For supported slots for photonic circuit packs, refer to the Equipping rules
section for each circuit pack.

Note 1: For double width or triple width WSSOPM circuit packs, the two
or three adjacent slots in the shelf must be valid and unprovisioned for the
WSSOPM circuit pack to auto-provision.
Note 2: For double width OMDF8 passive modules, the two adjacent slots
(1 and 2, or 4 and 5) in the 6-slot passive photonics chassis (PPC6) must
be valid and unprovisioned for the OMDF8 modules to auto-provision.

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Photonics equipment procedures 2-5

Procedure 2-1 (continued)


Provisioning a circuit pack automatically

CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.

Prerequisites
To provision equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and cross-connects
have been deleted.

Step Action

1 Wear an appropriate ESD personal grounding device to dissipate


electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2 Insert the circuit pack in the correct slot in the shelf.
If you are logged in to Site Manager when you automatically provision a circuit
pack, click Refresh in the Equipment & Facility Provisioning application to
display the circuit pack in the list of available equipment.
3 Repeat step 1 for all circuit packs to be provisioned.
—end—

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2-6 Photonics equipment procedures

Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)

Circuit pack (Equipment) Facilities on the circuit pack SFP Facilities on the SFP
(Note 2) equipment (Note 2)

2xOSC (2xOSC) NTK554BA none • P155M OSC, (ADJ,


• P155622M ADJ-FIBER) (Note 3)

SPAP-2 w/2xOSC (SP) none • P155M OSC, (ADJ,


NTK555NA/NTK555NB • P155622M ADJ-FIBER) (Note 3)

SRA (SRA) NTK552JA (Note 4) OPTMON, (RAMAN, TELEMETRY, P155M OSC (Note 3)
OTDRCFG, AMPMON, ADJ,
ADJ-FIBER, ADJ-LINE)

SAM (SAM) NTK552JN (Note 4) OPTMON, (ADJ, ADJ-FIBER, P155M OSC (Note 3)
ADJ-LINE)

ESAM (ESAM) NTK552JT (Note OPTMON, (OTDRCFG, ADJ, ADJ- P155M OSC (Note 3)
4) FIBER, ADJ-LINE)

CCMD8x16 (CCMD8x16) (PC), OPTMON, AMP, ADJ-TX, PCXM OPTMON, AMP,


NTK508HA ADJ-RX, (ADJ, ADJ-FIBER) (ADJ, ADJ-FIBER)

SLA, MLA, MLA2, MLA2 w/VOA, VOA (applicable to MLA2 w/VOA N/A N/A
MLA3 (LIM) NTK552AA/BA/FA/ only), AMP (AMPMON), OPTMON,
GA/FB/BL (Note 5) (ADJ, ADJ-LINE, ADJ-FIBER),
ADJPEER

XLA (XLA) (Note 6) NTK552KA AMP (AMPMON), (ADJ, N/A N/A


ADJ-FIBER)

LIM (LIM) (Note 7) NTK552DA/ OPTMON (ADJ, ADJ-LINE, N/A N/A


DL/DN ADJ-FIBER)

FGA (FGA) (Note 8) NTK552AB AMP (AMPMON), (ADJ, N/A N/A


ADJ-FIBER)

WSS 100GHz w/OPM 5x1, 4x1, OPTMON, (ADJ, ADJ-FIBER, SSC), N/A N/A
WSS 50 or 100GHz w/OPM 2x1 CHC, NMCC, Note 9
(WSSOPM) (Note 2) NTK553EA/
KC/JA/KA/HA/JB

WSS 50GHz w/OPM 9x1, WSS AMP, OPTMON, (ADJ, ADJ-FIBER), N/A N/A
Flex C-Band w/OPM 9x1, WSS (CHC Note 9) or CHC (SSC)
Flex C-Band w/OPM 20x1 (Note 10)
(WSSOPM) NTK553FA/FC/LA/
MA

2-port OPM (OPM) NTK553PA/ OPTMON, (ADJ, ADJ-FIBER) N/A N/A


PB, Note 2

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Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)

Circuit pack (Equipment) Facilities on the circuit pack SFP Facilities on the SFP
(Note 2) equipment (Note 2)

SMD 50GHz/Flex 8x1 (SMD) OPTMON, (ADJ, ADJ-FIBER, SSC), N/A N/A
NTK553GA/GB/GC, Note 2 CHC, NMCC

CCMD12 (CCMD12) NTK508FA AMP, OPTMON, ADJ-TX, ADJ-RX, N/A N/A


(ADJ, ADJ-FIBER, LOC)

SCMD4 (CMD4) NTK508AA to VOA, ADJ-TX, ADJ-RX, (ADJ, N/A N/A


NTK508AH, NTK508AJ, Note 2 ADJ-FIBER)

44 Channel Mux/Demux 100GHz OPTMON, ADJ-TX, ADJ-RX, (ADJ, N/A N/A


or 50GHz (CMD44) NTT862AA/ ADJ-FIBER), LOC
FA, NTT862BA to NTT862BD

OMD4 (OMD) NTK504AA to OPTMON, ADJ-TX, ADJ-RX, (ADJ) N/A N/A


NTK504AH, NTK504AJ

OMX 4CH or 16CH (OMX) OPTMON, ADJ-TX, ADJ-RX, (ADJ) N/A N/A
NT0H32xx

Dispersion Slope Compensation (DISP Note 11. ADJ, ADJ-FIBER) N/A N/A
Module (DSCM) NTT870xx and
4200 series

Broadband Mux/Demux 1x2 (ADJ, ADJ-FIBER) N/A N/A


(BMD) NTT862DA/DC/DD

OBB 2x2x2 (OBB) 174-0115-900 OPTMON, (ADJ, ADJ-FIBER) N/A N/A


OBB 2x4x1 (OBB) 174-0116-900

OBMD 1x8 (OBMD8) 174-0104- OPTMON, ADJ-TX, ADJ-RX, (ADJ, N/A N/A
900 ADJ-FIBER)

FIM (FIM) NTK504CA, (ADJ) N/A N/A


NTK504CC, NTK504CB,
NTK504CD, NTK504CE,
NTK504CF

Upgrade Coupler/Splitter (UCS) (ADJ, ADJ-FIBER, OPTMON) N/A N/A


NTK504PL

Monitor Coupler/Splitter (ADJ, ADJ-FIBER, OPTMON) N/A N/A


(MONCS) NTK504PN,

10 Group Mux/Demux C-Band, (ADJ, ADJ-FIBER) N/A N/A


GMD10 L-Band (GMD10) (Note
2) NTT862GA/GL

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2-8 Photonics equipment procedures

Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)

Circuit pack (Equipment) Facilities on the circuit pack SFP Facilities on the SFP
(Note 2) equipment (Note 2)

4-ch OMDF (OMDF4) OPTMON, ADJ-TX, ADJ-RX, (ADJ, N/A N/A


ADJ-FIBER)

8-ch OMDF (OMDF8) OPTMON, ADJ-TX, ADJ-RX, (ADJ, N/A N/A


ADJ-FIBER)

Band Splitter (BS) OPTMON, (ADJ, ADJ-FIBER) N/A N/A

OSC Filter (OSCF) (ADJ, ADJ-FIBER) N/A N/A

Note 1: Refer to Planning - Ordering Information, 323-1851-151, for the engineering rules associated with
each supported circuit pack and SFP module in this release.
Note 2: Facilities on photonic circuit packs/modules are auto-provisioned upon equipment/pluggable
equipment creation. The facilities in brackets are facilities that cannot be manually added or deleted. When you
delete an ADJ-TX (or ADJ-RX), the corresponding ADJ-RX (or ADJ-TX) is also deleted if the Paired Rx or
Paired Tx parameter for this adjacency is set to Yes.
Note 3: The P155M pluggable on the SRA, SAM, ESAM, 2xOSC or SPAP-2 w/2xOSC circuit pack supports
WSC facilities. These facilities are not displayed or managed in the Equipment & Facilities Provisioning
applications. They are handled by Comms Setting Management application through LAN option under
Interfaces tab.
Note 4: An SRA has two OPTMON facilities (ports 4 and 6), one RAMAN facility (port 8), one AMPMON facility
(port 7), one TELEMETRY facility (port 5), and one OTDRCFG facility (port 8). An ESAM/SAM has three
OPTMON facilities (ports 4, 6, and 8). An ESAM also has one OTDRCFG facility (port 8). The P155M
pluggable and OSC facility is supported on port 2.
Note 5: An MLA/MLA2/MLA2 w/VOA/MLA3 has LIM with two AMPMON facilities (ports 5 and 7), one
OPTMON facility (port 4), and two AMP facilities (ports 6 and 8). The MLA2 w/VOA has one VOA facility per
direction (ports 5 and 7). An SLA has LIM with one AMPMON facility (port 7), two OPTMON facilities (ports 4
and 6), and one AMP facility (port 8). If an SLA is configured as a DropLIM or cascaded LIM in an OTS before
the equipment is provisioned, the two OPTMON facilities will not auto-provision when the SLA equipment is
provisioned.
Note 6: An XLA has two AMP facilities (ports 6 and 8) and two AMPMON facilities (ports 5 and 7).
Note 7: A LIM has LIM with three OPTMON facilities (ports 4, 6 and 8) and no AMP facility.
Note 8: An FGA has one AMP facility (port 4) and one AMPMON facility (port 3).
Note 9: CHC facilities are auto-created and deleted against WSSOPM equipment. On the WSS Flex C-Band
w/OPM 9x1, CHC facilities are auto-created only when the equipment profile is set to FIXEDGRID. If the
equipment profile is set to FLEXIBLEGRID, the CHC facilities must be manually provisioned and the child SSC
facilities are auto-created.
Note 10: Applicable to WSS Flex C-Band w/OPM 9x1 with FLEXIBLEGRID equipment profile only.
Note 11: DISP facilities are auto-created and deleted against DSCM equipment. The Add and Delete buttons
are visible and always disabled in this facility screen.

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Photonics equipment procedures 2-9

Procedure 2-2
Provisioning a pluggable automatically
If automatic equipping is enabled, when inserted in the SRA, SAM, ESAM,
2xOSC or SPAP-2 w/2xOSC circuit pack, an SFP is automatically provisioned
and the OSC and ADJ facilities are auto-created. If auto OSC/OSPF
provisioning is enabled in the System tab of Node Information application, an
associated OSPF circuit is automatically created. When a CXM pluggable is
inserted in the CCMD8x16, pluggable equipment and facilities are auto-
created.

To enable automatic equipping, refer to the “Enabling/disabling slot-based


automatic equipping” procedure in Administration and Security, 323-1851-
301.

CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.

Prerequisites
To provision a pluggable for an empty circuit pack port, ensure the last
pluggable that occupied the circuit pack port and its related facilities have
been deleted.

Step Action

1 Wear an appropriate ESD personal grounding device to dissipate


electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2 Insert the pluggable in the correct circuit pack port. SFPs are supported in
ports 1 and 2 of the SRA, SAM, ESAM, 2xOSC or SPAP-2 w/2xOSC circuit
pack. CXM pluggables are supported in port 1 of the CCMD8x16 circuit pack.
The pluggable is automatically provisioned with the same primary state as the
circuit pack.
3 Repeat step 1 for all pluggables to be provisioned.
—end—

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2-10 Photonics equipment procedures

Procedure 2-3
Routing fiber-optic cables and electrical cables onto
the 6500 shelf
Refer to the procedure on routing fiber-optical cables onto the 6500 shelf, in
the Installation technical publication specific to the respective 6500 shelf type.

—end—

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Photonics equipment procedures 2-11

Procedure 2-4
Connecting or disconnecting fiber-optic cables to or
from circuit packs
Refer to the procedure on connecting or disconnecting fiber-optic cables to or
from circuit packs, in the Installation technical publication specific to the
respective 6500 shelf type.

—end—

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2-12 Photonics equipment procedures

Procedure 2-5
Setting up the photonic system configurations
Refer to the overviews and the procedures in the following sections of
Commissioning and Testing, 323-1851-221:
• for non-passive configurations (see the flowchart for “Non-passive
photonic OTS” on page 2-2):
— “Photonic layer provisioning procedures”
— “Photonic layer site testing procedures”
• for passive configurations (see the flowchart for “Passive photonic OTS”
on page 2-3:
— “Passive OTS network procedures”
—end—

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Photonics equipment procedures 2-13

Procedure 2-6
Changing the primary state of a facility
Use this procedure to change the primary state of a facility.

CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a loss of
traffic.

The primary state of adjacency facilities of type ADJ, ADJ-LINE and ADJ-
FIBER is not editable. However, you can change the primary state of non-
derived ADJ-TX or ADJ-RX facilities to OOS by changing the Transmitter/
Receiver type to UNKNOWN or Far end address to Null. In turn, an OOS ADJ-
TX or ADJ-RX can be changed to IS by editing its Transmitter/Receiver type
to a supported type other than UNKNOWN or the Far end address to a valid
end point. To put ADJ-TX or ADJ-RX facilities to OOS, the optical channel
must be unmanaged first from DOC.

Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration drop-
down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or SFP whose facility state you want to change.
5 Select the appropriate facility from the Facility Type drop-down list.
6 In the Facility area, select the facility whose state you want to change.
7 Click Edit in the Facility area to open the Edit facility dialog box.

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2-14 Photonics equipment procedures

Procedure 2-6 (continued)


Changing the primary state of a facility

Step Action

8 Select OOS or IS from the Primary state drop-down list.


CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.

9 Click OK.
10 If changing the primary state to OOS, click Yes in the warning dialog box.
—end—

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Photonics equipment procedures 2-15

Procedure 2-7
Changing the primary state of a circuit pack or
pluggable
Use this procedure to change the primary state of a circuit pack or pluggable
to in-service or out-of-service. You must change the primary state of any
related facilities (AMP, OPTMON, OSC, or CHC) to out-of-service before
changing the primary state of a circuit pack or SFP to out-of-service. See
Procedure 2-6, “Changing the primary state of a facility”.

The primary state of adjacency facilities of type ADJ, ADJ-LINE and ADJ-
FIBER is not editable. However, you can change the primary state of non-
derived ADJ-TX or ADJ-RX facilities to OOS by changing the Transmitter/
Receiver type to UNKNOWN or Far end address to Null. In turn, an OOS ADJ-
TX or ADJ-RX can be put IS by editing its Transmitter/Receiver type to a
supported type other than UNKNOWN or the Far end address to a valid end
point.

You cannot change the primary state of an SFP to IS if the associated circuit
pack is OOS.

Changing the primary state of a circuit pack automatically changes the


primary state of any provisioned SFPs on that circuit pack to the same state.

To change the primary state of the 2150 chassis, 3-slot or 6-slot passive
photonics chassis (PPC6) to OOS, all of the passive filters in its subslots must
be OOS. Passive filters cannot be changed to IS if the 2150 chassis, 3-slot or
6-slot passive photonics chassis (PPC6) is OOS.

Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration drop-
down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.

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2-16 Photonics equipment procedures

Procedure 2-7 (continued)


Changing the primary state of a circuit pack or pluggable

Step Action

4 If you are changing the primary state to Then go to


OOS step 5
IS step 6

5 Ensure are any related facilities are out-of-service. See Procedure 2-6,
“Changing the primary state of a facility”.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.

6 Select the circuit pack or SFP in the Equipment area.


7 Click Edit in the Equipment area to open the Edit Equipment dialog box.
8 Select IS or OOS from the Primary state drop-down list.
9 Click OK.
10 If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—

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Photonics equipment procedures 2-17

Procedure 2-8
Deleting a facility from an equipment
Use this procedure to delete a facility.

CAUTION
Risk of service interruption
If you delete a facility, you can cause a loss of traffic.

Note: If you delete an OSC facility, you can cause a loss of Comms,
depending on the Comms configuration.

You cannot manually delete a CHC facility. It will be auto-deleted as the


corresponding WSSOPM equipment is deleted. The exception is on the WSS
Flex C-Band w/OPM 9x1 in FLEXIBLEGRID mode, where the CHC facilities
must be manually provisioned and deleted. The child SSC facilities are auto-
created and deleted with the parent CHC facilities.

You cannot delete adjacency facilities except ADJ-TX and ADJ-RX.

Prerequisites
To perform this procedure, you must
• ensure the end-to-end service to be deleted is not carrying traffic
• ensure the facility to be deleted is out-of-service and is not in maintenance
state
• delete the cross-connects of the entire path. Refer to the “Deleting
photonic cross-connects” procedure in Part 1 of Configuration - Bandwidth
and Data Services, 323-1851-320.
• delete the OSPF circuit (if provisioned) on the OSC facility (for SFPs on
2xOSC circuit packs). See “Deleting an entry in the communications
settings” in Part 1 of Configuration - Provisioning and Operating, 323-
1851-310.
• use an account with a level 3 or higher UPC

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2-18 Photonics equipment procedures

Procedure 2-8 (continued)


Deleting a facility from an equipment

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration drop-
down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or SFP whose facilities you want to delete.
5 Select the appropriate facility from the Facility Type drop-down list.
6 In the Facility area, select the facility you want to delete.
7 Ensure the Primary state of the selected facility or facilities is out-of-service
(OOS). See Procedure 2-6, “Changing the primary state of a facility”.
8 Click Delete in the Facility area.
9 Click Yes in the warning dialog box.
—end—

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Photonics equipment procedures 2-19

Procedure 2-9
Deleting a circuit pack, module, or pluggable
Use this procedure to delete a circuit pack, module or pluggable equipment
from the list of provisioned equipment in the Equipment and Facility
Provisioning application. Deleting a circuit pack automatically deletes any
provisioned pluggables on that circuit pack.

Passive components (OMDF4, OMDF8, BS, OSCF, FGA, CMD44, and 6500/
4200 DSCM) cannot be deleted if they are part of a slot sequence. The 2150
chassis, 3-slot or 6-slot passive photonics chassis (PPC6) cannot be deleted
if any passive filters in its subslots are not deleted.

Prerequisites
To perform this procedure, you must
• use an account with a level 3 or higher UPC
• put the circuit pack or pluggable to be deleted out-of-service. See
Procedure 2-7, “Changing the primary state of a circuit pack or pluggable”.
• delete all cross-connects provisioned through the equipment. Refer to the
“Deleting photonic cross-connects” procedure in Part 1 of Configuration -
Bandwidth and Data Services, 323-1851-320.
For photonic cross-connects, the optical channel must be unmanaged
from all DOCs and deleted on all nodes that are carrying the channel.
Photonic cross-connects with a Derived status are auto-created/deleted
by the system. To delete a photonic equipment (LIM, WSSOPM, CMD, or
BMD), make sure the derived cross-connects going through the
equipment are deleted by placing all the ADJ-TX/ADJ-RX associated with
the cross-connects to OOS (by changing the Tx type and Rx type to
Unknown or Far end address to Null) on all end to end nodes. See
Procedure 2-6, “Changing the primary state of a facility”.
• ensure the photonic equipment to be deleted is not part of a slot sequence
(including the TID slot sequence)
• delete all facilities (AMP, OPTMON, VOA, OSC, and ADJ-TX) on the circuit
pack and its associated pluggables. You cannot and do not need to delete
the facilities on the DSCM module. See Procedure 2-8, “Deleting a facility
from an equipment”.
Note that if the BMD is manually deleted then re-created, the WSS
adjacency must be manually provisioned, instead of automatically
provisioned by the system.

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Procedure 2-9 (continued)


Deleting a circuit pack, module, or pluggable

• Make sure the following steps are done when deleting a WSS circuit pack:
— Put all CHC facilities OOS and delete (CHC deletion is applicable to
WSS Flex C-Band w/OPM 9x1 in FLEXIBLEGRID mode only)
— Put the AMP facility OOS and delete (applicable to WSS 50GHz w/
OPM 9x1/WSS Flex C-Band w/OPM 9x1 only)
— Put all OPTMON facilities OOS and delete
— Change the far end address to Null for ADJ facilities of WSS/CMD type
that are not derived
— Change the far end address to Null for ADJ-FIBER facilities of WSS/
CMD type that are not derived
— Put the WSS equipment OOS

Step Action

1 Select the required network element in the navigation tree.


2 Select Equipment & Facility Provisioning from the Configuration drop-
down menu to open the Equipment & Facility Provisioning application.
3 Select the required shelf from the Shelf drop-down list.
4 In the Equipment area, select the equipment (circuit pack or SFP) you want
to delete.
5 Click Delete in the Equipment area.
6 Click Yes in the warning dialog box.
Note: If the circuit pack or pluggable is part of an OTS, make sure you edit
the OTS to reflect the change.
—end—

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Photonics equipment procedures 2-21

Primary and secondary states


Table 2-2
Equipment and facility primary states

Primary State Description


IS In-service; no failure detected
IS-ANR In-service - abnormal; failure exists but entity is still capable of performing
some of its provisioned functions (that is partial failure)
OOS-AU Out-of-service - autonomous; failure detected
OOS-MA Out-of-service - maintenance; no failure detected (OOS for maintenance
for provisioning memory administration)
OOS-AUMA Out-of-service - autonomous - maintenance; failure detected
OOS-MAANR Out-of-service - maintenance - abnormal; partial failure detected

Table 2-3
Equipment secondary states

Secondary State Description


Active Equipment has connections established to at least one of the facilities it
supports and the connected facilities are in-service
Fault detected Equipment failure detected
Idle No connections established to facilities supported on this equipment, all
connected facilities are out-of-service, or in-service connected facilities are
not on the active traffic path in a protected connection
Mismatched eqp. attribute Mismatched or unknown equipment detected in a provisioned slot
No OAM DSM does not have an OAM link with host shelf processor
No site DSM does not have a site address provisioned
Protection switch inhibited Protection switching has been inhibited for the equipment
Standby Equipment is inactive in a 1+1 equipment protection configuration (standby
cross-connect circuit pack)
Supporting entity outage Supporting equipment has a failure (applicable to pluggables when
associated circuit pack is missing or has failed or is mismatched)
Unequipped Equipment is missing
Unknown Equipment cannot be identified
Working Circuit pack in an equipment protection scheme that is actively carrying
traffic
Working synchronization Cross-connect circuit pack is working circuit pack providing synchronization
function
Working traffic Cross-connect circuit pack is working circuit pack carrying traffic

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Table 2-3
Equipment secondary states (continued)

Secondary State Description


Working Control Plane Cross-connect circuit pack is the working circuit pack for Control Plane.
1:N standby Circuit pack in a 1:N configuration with no active traffic
AINS Auto in-service is enabled.

ADJ facility parameters


Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters

Parameter Options Description

ADJ

Unit • ADJ-shelf-slot-port Displays the facility AID.


• ADJ-shelf-slot-port-
subport

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Adjacency Type • BMD Sets the type of the adjacency.


• BS
• CMD
• DSCM
• FGA
• FIM
• GMD
• LIM
• LINE
• OBB
• OMD
• OMDF
• OMX
• OPM
• OPS
• OSC
• OSCF
• RX
• SMD
• TX
• TXRX
• UCS
• Unknown (default)
• WSS

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Status • Unverified Displays current status of the adjacency facility.


• Derived • Unverified - The provisioned far end address has been
• Reliable set by the end-user. If an actual far end address exists,
it matches the provisioned far end address and has
• Unreliable been discovered through information received from
• Unused the far end shelf but has not been verified by any
physical connectivity.
• Derived - The provisioned far end address has been
set by the system. If an actual far end address exists,
it matches the provisioned far end address and has
been discovered through information received from
the far end shelf but has not been verified by any
physical connectivity.
• Reliable - The actual far end address matches the
provisioned far end address and has been discovered
through physical connectivity. The provisioned far end
address has been set by either the system or the
end-user.
• Unreliable - The actual far end address is detected and
it does not match the provisioned far end address or
the discovery validation has detected a mis-fibering.
• Unused - The adjacency is not used and not editable.
The Adjacency Type remains Unknown. Applicable to
non-line-facing receive ports of circuit packs
(modules) provisioned in a slot sequence.

ITU Center decimal format Displays the wavelength.


Wavelength (nm)

Actual Far End string format Displays the actual far end address which is the
Address detected TID, shelf, slot, and port of the far end of the
fiber. This parameter is also supported in CDC
configurations between WSSOPM
20x1-FIM-CCMD8x16. Read-only. This parameter is
always blank for CCMD8x16 MPO ports 34 and 35.

Actual Far End See Note 2 Displays the option that each field of the far end address
Address Format represents. Read-only. This field is always NULL for
CCMD8x16 MPO ports 34 and 35.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Expected Far End TID-shelf-slot-port Sets the provisioned far end address of the fiber
Address (Note 1) connection.
In the 1x20 Colorless Directionless with FIM4
configuration, Site Manager supports editing derived
loopback ADJ facilities for Expected Far End Address.
For information about the1x20 Colorless Directionless
with FIM4 configuration, and its requirements for
manually provisioned far end address, refer to
Configuration - Provisioning and Operating, Part 1.

Expected Far End See Note 2 Sets the expected far end line receive and client receive
Address Format addresses format reported by the adjacency.

OPS Far End OPS-sh-sl-port Selects the Common port of the adjacent OPS module
Address in span layer path protection configurations. Applicable
to MLA2 and MLA3, and MLA3 L-Band.

Customer Defined • string of up to 64 Used to identify a provisioned facility. It is the same as


Facility Identifier characters the Common Language Facility Identifier (CLFI). The
• N/A (default) provisioned value appears in the facility alarm report if
the SP2, SPAP, SPAP-2 w/2xOSC, or the 2-slot
integrated SP is equipped.

Layer • Physical Indicates the layer of the adjacency. Physical


• SUBPORT represents the physical fiber connectivity. SUBPORT
represents the sub-fiber connectivity of an MPO port.
• Layer 1 OTN (L1OTN)
Read-only. Applicable to equipment that supports the
• Layer 2 monitor ADJ facility.
(L2MON)
• Layer 2 physical
(L2PHYS)
• LINE
• OTU
• Section (SECT)

Port Label • string Displays the description of the port. Applicable to


• N/A (default) RLA5x1, UCS, CMD64, OBB, OBMD8, FIM, WSSOPM,
CCMD8x16, OPS, POPS, FGA, OMDF4, OMDF8, BS,
OSCF, and DSCM.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

ADJ-LINE

Unit ADJ-shelf-slot-port Displays the facility AID.

Adjacency Type • Unknown (default) Displays type of the adjacency. Read-only.


• LINE

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21

Status same as for ADJ facility See the description of this parameter for ADJ facility.

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.If
Address (Note 1) the Expected Far End address is not provisioned,
during a failure condition, an “DOC Invalid Photonic
Domain” alarm is raised. For more information, see Part
1 of Fault Management - Alarm Clearing,
323-1851-543.

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

OPS Far End OPS-sh-sl-port Selects the Common port of the adjacent OPS module
Address in span layer path protection configurations. Applicable
to MLA2 and MLA3, and MLA3 L-Band.

Customer Defined same as for ADJ facility See the description of this parameter for ADJ facility.
Facility Identifier

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Fiber Type • Allwave Sets the type of the Optical fiber.


• Dispersion Shifted
Single Mode Fiber
• Enhanced Large
Effective Area Fiber
• EX2000
• Freelight
• Lambda Shifted Single
Mode Fiber
• Large Effective Area
Fiber
• Non-Dispersion Shifted
Fiber
• Non-Dispersion Shifted
Fiber Low Water Peak
• Other
• Pure Silica Core
• Teralight
• TeraWave ULL
• TrueWave Classic
• TrueWave Plus
• TrueWave Reach
• TrueWave Reduced
Slope
• Unknown Fiber Type

Span Loss (dB) numeric format Displays the calculated OSC or Telemetry Gain span
loss. A dash is displayed when not applicable.
Read-only.

Span Loss Margin • 0.00 to 10.00 Sets the margin for span loss. For more information,
(dB) • 3.00 (default) see the description for Target Span Loss and Minimum
Span Loss.

Span Loss Source • Telemetry Gain Displays the source used by the system for calculating
• OSC the span loss: Telemetry Gain for SRA; OSC otherwise.
Read-only.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Target Span Loss • 0.00 to 60.00 Sets the maximum acceptable span loss.
(dB) • 0.00 (default) When Span Loss exceeds (Target Span Loss + Span
Loss Margin), the “High Received Span Loss” alarm is
raised.
When Span Loss drops below (Target Span Loss +
Span Loss Margin - 1.0 dB), the “High Received Span
Loss” alarm is cleared.
When Target Span Loss is set to 0.00, the “High
Received Span Loss” alarm is disabled.

Minimum Span • 0.00 to 60.00 Sets the minimum acceptable span loss.
Loss (dB) • 0.00 (default) When Span Loss drops below (Minimum Span Loss -
Span Loss Margin), the “Low Received Span Loss”
alarm is raised.
When Span Loss exceeds (Minimum Span Loss - Span
Loss Margin + 1.0 dB), the “Low Received Span Loss”
alarm is cleared.
When Minimum Span Loss is set to 0.00, the “Low
Received Span Loss” alarm is disabled.

ADJ-TX (Note 1)

Unit ADJ-shelf-slot-port Displays the facility AID.

Adjacency Type • Unknown Displays type of the adjacency. Unknown is applicable


• TX to OPS/POPS only.

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21

Circuit Identifier Up to 64 characters Sets circuit identifier text. The parameter is also
displayed in the DOC screen, Photonic connections
screen, and shelf wavelength topology screen, to help
the user identify the channels.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Auto Discovered • Auto (default) Enables or disables the auto-population of the


• Manual Transmitter Type. Auto specifies that the Transmitter
Type is auto-populated with the Discovered Type.
Manual specifies that Transmitter Type is user defined
and is not subject to auto-population. Any user edit of
the provisioned Transmitter Type causes Auto to
change to Manual.
Note: After an upgrade to the current release, this
parameter defaults to Manual if the Transmitter Type is
not Unknown.

Transmitter Type varies Sets the transmitter type of the facility. It identifies the
equipment type that is transmitting the signal.
Transmitter Type can be automatically set by SPLI.

Provisioned • 35GBAUD_100G Selects the provisioned transmission mode. Applicable


Transmission • 35GBAUD_150G for CCMD12 C-Band, CCMD12 L-Band, CCMD8X16
Mode (NTK508HA), CMD64, and CMD44.
• 35GBAUD_200G
• 56GBAUD_100G
• 56GBAUD_150G
• 56GBAUD_200G
• 56GBAUD_250G
• 56GBAUD_300G
• 56GBAUD_400G

Discovery same as previous row Displays the discovered transmission mode. Applicable
Transmission for CCMD12 C-Band, CCMD12 L-Band, CCMD8X16
Mode (NTK508HA), CMD64, and CMD44.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Provisioned Link • LNKSTDMODE Determines the link optimization mode.


Optimization Mode (Standard)
• LNKSNRMODE
(SNR-Tolerance)
• LNKTRACKINGMODE
(Fast-Tracking)
• LNKNONLCHMODE
(Non-Linear Channel)
• LNKSPECTRALMODE
(Spectral-Efficiency)
• LNKLATENCYMODE
(Latency)
• LNKNRBWCHMODE
(Narrow)
• LNKNONLCHMODE
(Non-linear)
• LNKFLINEMODE
(Foreign)
• LNKRSVMODE1
(Reserved-1)
• LNKRSVMODE2
(Reserved-2)
• LNKRSVMODE3
(Reserved-3)
• CUSTOM
• UNKNOWN (Default)

Discovered Link same as link optimization Displays the discovered the link optimization mode.
Optimization Mode mode

Center Frequency numeric format Sets the center frequency. Applicable for CCMD12
(THz) C-Band, CCMD12 L-Band, CCMD8X16 (NTK508HA),
CMD64, and CMD44.

Discovered Center numeric format Displays the discovered center frequency. Applicable
Frequency (THz) for CCMD12 C-Band, CCMD12 L-Band, CCMD8X16
(NTK508HA), CCMD16x12 (NTK723AA), CMD64, and
CMD44.

Controller numeric format Defines the spectral offset for WSS controller from the
Frequency Offset center frequency. Not applicable for Fixed Grid.
(GHz)

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

ITU Center numeric format Displays the wavelength of the facility in numeric
Wavelength (nm) format. The number in brackets is the channel ID.
Read-only.

Discovered numeric format Displays the wavelength that is discovered by SPLI.


Wavelength (nm) Read-only.

Actual Tx Power numeric format Sets the current provisioned/measured power in


(dBm) numeric format in dBm unit. The data is part of the
defaulted value entered as part of the Transmitter Type
provisioning. The Maximum/typical Launch Power
parameter is used by the DOC application to add the
channel into the network. This power must be within 3
dBm of the actual power.
Manual edits of this parameter while LOC is In-Service
will be overwritten by LOC. To make manual edits, the
LOC must set OOS-MA first.

Discovered Tx numeric format Displays the discovered Tx provisioned power.


Provisioned Power Note: N/A is displayed for associated transmitters/
(dBm)
PECs that do not support provisionable Tx power. For
more details, refer to the “CMD Tx/Rx type discovery, Tx
power and Tx wavelength/frequency autoprovisioning,
network and site alarm correlation per circuit pack type
support” table in Part 1of Planning, NTRN10EY.

Target Input Power decimal Displays the desired target transmit power at the
At CMD (dBm) CCMD/CMD input add port. Read-only.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

Status same as for ADJ facility See the description of this parameter for ADJ facility.

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Expected Far End string, up to eight Provisions the expected far end product engineering
PEC characters code (PEC).
The NE software does not validate the string; the NE
software does not confirm that you have entered a valid
PEC. No alarm is raised if the Discovered Far End PEC
does not match the provisioned Far End PEC.

Discovered Far string Displays the discovered far end product engineering
End PEC code.

Customer Defined same as for ADJ facility See the description of this parameter for ADJ facility.
Facility Identifier

Discovered Type same range of values as The receiver type that is discovered by SPLI.
Receiver Type

Active False Sets the Active flag of the ADJ-TX. When set to TRUE,
True the channel will be automatically added when DOC
Auto add channels parameter is set to Enabled. For a
DOC managed channel, the Active parameter is TRUE.
If the Active parameter is changed to FALSE for a DOC
managed channel and the DOC Auto delete channels
parameter is set to Enabled, then the channel will be
automatically deleted by DOC.

Min. Launch Power numeric format Sets minimum capable power in numeric format in dBm
(dBm) unit.
The data is part of the defaulted value entered as part
of the Transmitter Type provisioning. The Minimum
Launch Power parameter is used by the DOC
application to add the channel into the network.

Max. Launch numeric format Sets the maximum capable power in numeric format in
Power (dBm) dBm unit. The data is part of the defaulted value entered
as part of the Transmitter Type provisioning. The
Maximum Launch Power parameter is used by the DOC
application to add the channel into the network.

Paired RX • Yes (default) Sets if the signal has a paired receiver.


• No • Yes: The Transmitter Type will be applied to the
Receiver Type automatically. The Auto Discovered and
Sync Provisioned provisioning on ADJ-TX will also be
applied to ADJ-RX. Used for bidirectional channels.
• No: The provisioning on ADJ-TX and on ADJ-RX are
independent. Used for unidirectional channels.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Basic Rate • Unknown Displays the line rate.


• 2.5G
• 4.0G
• 10.0G
• 10.7G
• 11.1G
• 11.3G
• 40.0G
• 100.0G
• 200G
• 300G
• 400G

DOC Care • False (default) Displays whether the channel is under DOC control.
• True Any change to the facility provisioning could be traffic
affecting. The transmitter type cannot be changed when
DOC care is set to True.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Modulation Class • 10G Sets the relative bias for the channel. Used to enable
• 10GNGM groups (or classes) of channels to be prioritized to
achieve a different relative OSNR to other channels.
• 2G5
In Foreign and Foreign Coherent configurations,
• 40G Modulation Class must be modified to reflect 3rd party
• 40GULH supplier Tx specifications. Modulation Class must be
• 100G set as a CUSTOM(1-6) class to specify the Differential
Provisioning to be used for the signal. This reflects any
• 100GWL3 adjustment in dB relative to provisioned EDFA peak
• 100GWL3BPSK power targets required to be set by DOC, which
• 100GWL38QAM depends on the underlying modulation format of the
signal and link-engineering analysis.
• 100GWL316QAM
Refer to Part 1 of Photonic Layer Guide, NTRN15DA for
• 100GWL34ASK the minimum transmitter and receiver specifications
• 35GBAUD_100G that must be provided for foreign wavelength
• 35GBAUD_150G characterization.

• 35GBAUD_200G
• 35GBAUD_250G
• 56GBAUD_100G
• 56GBAUD_150G
• 56GBAUD_200G
• 56GBAUD_250G
• 56GBAUD_300G
• 56GBAUD_350G
• 56GBAUD_400G
• CUSTOM1 to
CUSTOM6
• Undefined
• Unknown

FEC gain (dB) numeric format Sets the FEC gain in dB. Applicable to OBMD8 only.

Express Delete • False (default) Enables or disables express delete of the channel by
• True DOC. When Express Delete is True and the Active
parameter is changed from True to False, DOC invokes
the Forced delete action. The Express Delete
parameter automatically changes to False when the
Active parameter changes from False to True.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Sync Provisioned • True (default) This parameter, along with the Auto Discovered
• False parameter, controls whether OTMn facility Tx
wavelength and Tx power autoprovisioning occurs.

Discovered SPLI Unknown, True, False Discovered SPLI Management as seen by the
Management transmitter.

Loopback Status • Unknown or Displays the result of the optical loopback test.
• result of the loopback Applicable only to CCMD12 and CCMD8x16.
test

Port Label • Chn (R) Displays the port label. Applicable to OBMD8, OPS,
• OPSn Common In POPS, OMDF4, OMDF8.

Mate Info string Displays mate information for CCMD at Regen site. This
parameter is also used by the Layer 0 Control Plane to
learn whether a circuit pack is used in a regen
application (WLAi MOTR, 2-card configuration only).

Tx Power Reduced • On Enables or disables the Tx power reduced state feature.


State • Off (default)

Discovered Tx • On Displays the discovered Tx power reduced state.


Power Reduced • Off
State
• Unknown

Tx Tuned • True Displays the Tx turning state on the corresponding


• False transponder.

• Unknown

OCH Line System • Colored Selects the value of the OCH Line System Type for the
Type • Colorless selected facility.

• Contentionless
• CSColored (Coherent
Select Colored)
• CSColorless (Coherent
Select Colorless)

Low Frequency 0.000 to 65.50, default is Indicates the minimum required frequency spacing for
Guard-Band (GHz) dependent on Tx Type the previous network media channel (NMC).

High Frequency 0.000 to 65.50, default is Indicates the minimum required frequency spacing for
Guard-Band (GHz) dependent on Tx Type the next network media channel (NMC).

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Tx SNR Bias (dB) -10.00 to 10.00 Sets the transmit signal noise ratio bias in dB. This
represents the NMC signal noise ratio bias level at the
Photonic line.

Tx Controlled • No Determines if the Tx is controlled.


• Yes
• Unknown

Laser Centering • On Sets the laser centering. Applicable only for WL3x and
• Off WLAi transponders. SPLI usually sets this parameter to
the appropriate setting, but in some cases (for example,
• Standby colored CMD at one end, colorless CMD at the other
• Unknown end), the user must provision this parameter according
to the OnePlanner recommended value, referred to as
LCC (Laser Control Center).

Discovered Laser • On Displays the discovered laser centering.


Centering • Off
• Standby
• Unknown

Discovered Laser 0.000 to 2.500 Displays the discovered laser centering range.
Centering Range
(GHz)

Tx Frequency 0.001 to 1.000 Indicates the recurring frequency step that is allowed to
Tuning Resolution be configured on the transponder.
(GHz)

Allocated NMC numeric format Displays the allocated NMC Spectral Width (GHz).
Spectral Width Applicable for CCMD12 C-Band, CCMD12 L-Band,
(GHz) CCMD8X16 (NTK508HA), CMD64.

Tx Minimum • 12.5 to 4800 Displays the Tx Network Media Channel (NMC) Signal
Spectral Width • Default for Foreign Bandwidth in GHz. Used to create default NMCC
(GHz) Coherent is 37.5 bandwidth. Applicable for CCMD12 C-Band, CCMD12
L-Band, CCMD8X16 (NTK508HA), CMD64.
• Default for Foreign is 42

Tx Signal • 12.5 to 4800 Selects the Tx Signal Bandwidth in GHz measured at


Bandwidth 3dB • Default for Foreign 3 dBm less than peak power. Represents the 3dB signal
(GHz) Coherent is 32.5 bandwidth where the measured power is expected to be
3dB lower than the peak center frequency power.
• Default for Foreign is 8.9 Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Tx Signal • 12.5 to 4800 Selects the Tx Signal Bandwidth in GHz measured at 10


Bandwidth 10dB • Default for Foreign dBm less than peak power. Represents the 10dB signal
(GHz) Coherent is 36 bandwidth where the measured power is expected to be
10dB lower than the peak center frequency power.
• Default for Foreign is Applicable for CCMD12 C-Band, CCMD12 L-Band,
16.2 CCMD8X16 (NTK508HA), CMD64.

Transmitter • AUTOMATIC Determines how dispersion compensation for the


Dispersion Mode • FIXEDTX transmitter is managed.

• UNKNOWN Applicable for CCMD12 C-Band, CCMD12 L-Band,


CCMD8X16 (NTK508HA), CMD64, and CMD44.

Discovered TX • AUTOMATIC Displays the discovered dispersion compensation


Dispersion Mode • FIXEDTX mode for the transmitter. Read-only.

• UNKNOWN Applicable for CCMD12 C-Band, CCMD12 L-Band,


CCMD8X16 (NTK508HA), CMD64, and CMD44.
• SEARCH

Path Dispersion -100,000 to 1,500,000 Enables the user to edit the Layer 0 Control Plane (L0
(ps/nm) CP) path dispersion (PATHDISP). This is the path
dispersion at a given frequency on the port.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

Discovered Path numeric Displays discovered path dispersion at a given


Dispersion (ps/nm) frequency. Read-only.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

Transmitter -100,000 to 1,500,000 Sets the pre-compensation for the transmitter.


Pre-Compensation Applicable for CCMD12 C-Band, CCMD12 L-Band,
(ps/nm) CCMD8X16 (NTK508HA), CMD64, and CMD44.

Discovered TX numeric Displays the discovered pre-compensation for the


Pre-Compensation transmitter. Read-only.
Value (ps/nm) Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Provisioned Tuning • Performance Optimized Displays/edits the provisioned wavelength tuning mode.
Mode Tuning (default) • Performance-Optimized Tuning performs a full
• Accelerated Tuning calibration self-test to optimize performance.
• Fast Tuning • Accelerated Tuning performs a partial calibration
self-test.
• Fast tuning performs minimal calibration to support
fast transmitter retuning as part of a restoration action.
After a circuit pack cold restart, tuning is always done as
Performance-Optimized, regardless of the tuning mode
setting. All subsequent tuning is done based on the
tuning mode setting.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

Discovered Tuning • Performance Optimized Displays the discovered wavelength tuning mode.
Mode Tuning (default) Read-only.
• Accelerated Tuning • Performance-Optimized Tuning performs a full
• Fast Tuning calibration self-test to optimize performance.
• Accelerated Tuning performs a partial calibration
self-test.
• Fast tuning performs minimal calibration to support
fast transmitter retuning as part of a restoration action.
After a circuit pack cold restart, tuning is always done as
Performance-Optimized, regardless of the tuning mode
setting. All subsequent tuning is done based on the
tuning mode setting.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

Expected • 0 to 255 (default is 10) Displays the expected restoration time in seconds. This
Restoration Time • UNKNOWN is the hold-off time on the transponder before the
(Seconds) re-acquisition loop is entered after a loss of signal.
Read-only.
Applicable for CCMD12 C-Band, CCMD12 L-Band,
CCMD8X16 (NTK508HA), CMD64, and CMD44.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

ADJ-RX

Unit ADJ-shelf-slot-port Displays the facility AID.

Adjacency Type • Unknown Displays type of the adjacency. Unknown is applicable


• RX to OPS/POPS only.

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21

Auto Discovered • Auto (default) Enables or disables the auto-population of the


• Manual Transmitter Type. Auto specifies that the Transmitter
Type is auto-populated with the Discovered Type.
Manual specifies that Transmitter Type is user defined
and is not subject to auto-population. Any user edit of
the provisioned Transmitter Type causes Auto to
change to Manual.
Note: After an upgrade to the current release, this
parameter defaults to Manual if the Transmitter Type is
not Unknown.

Receiver Type varies Sets the receiver type of the facility. The Receiver Type
can be automatically set by SPLI.

Center Frequency numeric format Sets the frequency.


(THz)

Discovered Center numeric format Displays the discovered frequency.


Frequency (THz)

ITU Center numeric format Displays the wavelength of the facility in numeric
Wavelength (nm) format. The number in brackets is the channel ID.
Read-only.

Discovered numeric format Displays the wavelength that is discovered by SPLI.


Wavelength (nm) Read-only

Current Rx Input numeric format Displays the expected power at the receiver.
Power (dBm) This parameter is not supported in this release.

Status same as for ADJ facility See the description of this parameter for ADJ facility.

Ignore Rx Faults • False (default) Indicates whether Rx faults are ignored.


• True

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address (Note 1)

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

Expected Far End string, up to eight Provisions the expected far end product engineering
PEC characters code (PEC).
The NE software does not validate the string; the NE
software does not confirm that you have entered a valid
PEC. No alarm is raised if the Discovered Far End PEC
does not match the provisioned Far End PEC.

Discovered Far string Displays the discovered far end product engineering
End PEC code.

Customer Defined same as for ADJ facility See the description of this parameter for ADJ facility.
Facility Identifier

Max. Positive numeric format Displays the maximum positive transient for the
Transient (dB/s) receiver. Read-only.

Max. Negative numeric format Displays the maximum negative transient for the
Transient (dB/s) receiver. Read-only.

Sensitivity Level numeric format Sets the sensitivity threshold power in dBm.
(dBm) This parameter is automatically provisioned when
provisioning a selected ADJ-RX type.

Overload Level numeric format Sets the overload threshold in dBm.


(dBm) This parameter is automatically provisioned when
provisioning a selected ADJ-RX type.

Nominal Level numeric format Sets the nominal receiver power in dBm.
(dBm) This parameter is automatically provisioned when
provisioning a selected ADJ-RX type.
Manual edits of this parameter while LOC is In-Service
will be overwritten by LOC. To make manual edits, the
LOC must set OOS-MA first.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Paired Tx • Yes (default) Sets if the signal has a paired transmitter.


• No • Yes: The Receiver Type will be applied to the
Transmitter Type automatically. The Auto Discovered
and Sync Provisioned provisioning on ADJ-RX will
also be applied to ADJ-TX. Used for bidirectional
channels.
• No: The provisioning on ADJ-RX and on ADJ-TX are
independent. Used for unidirectional channels.

DOC Care • False (default) Displays whether the channel is under DOC control.
• True Any change to the facility provisioning could be traffic
affecting. The receiver type cannot be changed when
DOC care is set to True.

Basic Rate • Unknown Displays the Rx Adjacency rate.


• 2.5G
• 4.0G
• 10.0G
• 11.1G
• 11.3G
• 40.0G
• 100.0G

Discovered Type same range of values as The receiver type that is discovered by SPLI.
Receiver Type

Sync Provisioned • True (default) This parameter, along with the Auto Discovered
• False parameter, controls whether OTMn facility Tx
wavelength and Tx power autoprovisioning occurs.

Loopback Status • Unknown or Displays the result of the optical loopback test.
• result of the loopback Applicable only to CCMD12 C-Band, CCMD12 L-Band,
test CCMD8X16 (NTK508HA).

Port Label • Chn (T) Displays the port label. Applicable to OBMD8, OPS,
• OPSn Common Out POPS, OMDF4 and OMDF8.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

OCH Line System • Colored Selects the value of the OCH Line System Type for the
Type • Colorless selected facility.

• Contentionless
• CSColored (Coherent
Select Colored)
• CSColorless (Coherent
Select Colorless)

ADJ-FIBER

Unit • ADJ-shelf-slot-port Displays the facility AID.


• ADJ-shelf-slot-port-
subport

Adjacency Type • BS Displays type of the adjacency. Read-only.


• BMD
• CMD
• DSCM
• FGA
• GMD
• LIM
• LINE
• OBB
• OMDF
• OPM
• OPS
• OSC
• OSCF
• RX
• SMD
• TX
• UCS
• WSS
• UNKNOWN

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21

Status same as for ADJ facility See the description of this parameter for ADJ facility.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Fiber Loss (dB) • numeric format Displays the fiber loss in dB.
• N/A N/A (Not Available) indicates that the reading is
unstable or invalid. LOS indicates loss of signal.
• LOS VARYING indicates the measurements are fluctuating
• VARYING every second, preventing a stable reading.

Excess Loss (dB) numeric format, (default: Sets the excess loss input power in dB. Excess loss
0.00) provisioning is performed during system commissioning
and testing. For details, refer to Commissioning and
Testing, 323-1851-221.

Pad Loss (dB) numeric format, (default: Sets the pad loss in dB. Pads are provisioned as Pad
0.00) Loss for a passive layer network.
For a non-passive network, channel pads that connect
to a CMD Tx and/or Rx must be provisioned as Pad
Loss. Everywhere else in the network, pads are
provisioned as DSCMs.

Last Connection numeric format Indicates the time the last connection validation was
Validation Run run. Applicable for CCMD12 (NTK508FA) / CCMD8X16
(NTK508HA) / CCMD16x12 (NTK723AA) only.

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address This parameter is not applicable to ADJ-FIBER facilities
in this release.

Actual Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format This parameter is not applicable to ADJ-FIBER facilities
in this release.

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address (Note 1)

Expected Far End same as for ADJ facility See the description of this parameter for ADJ facility.
Address Format

OPS Far End OPS-sh-sl-port Selects the Common port of the adjacent OPS module
Address in span layer path protection configurations. Applicable
to MLA2 and MLA3, and MLA3 L-Band.

Customer Defined same as for ADJ facility See the description of this parameter for ADJ facility.
Facility Identifier

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Fiber Loss Minor 1.00 to 30.00 Sets the fiber loss minor threshold in dB. When the fiber
Threshold (dB) The default is the High loss exceeds the provisioned excess loss for that fiber
Fiber Loss Minor by more than the provisioned threshold, the “High Fiber
Threshold value that is Loss” alarm is raised with minor severity if the High
provisioned in the System Fiber Loss Detection Alarm system parameter is
tab of the Node enabled.
Information application. Supported range is 1 to 30 dB in 0.01 dB increments. If
set to 0, the “High Fiber Loss” alarm is disabled for the
facility.

Fiber Loss Major 1.00 to 30.00 Sets the fiber loss major threshold in dB. When the fiber
Threshold (dB) The default is the High loss exceeds the provisioned excess loss for that fiber
Fiber Loss Major by more than the provisioned threshold, the “High Fiber
Threshold value that is Loss” alarm is raised with major severity if the High
provisioned in the System Fiber Loss Detection Alarm system parameter is
tab of the Node enabled.
Information application. Supported range is 1 to 30 dB in 0.01 dB increments. If
set to 0, the “High Fiber Loss” alarm is disabled for the
facility.

Drift Threshold (dB) numeric format, (default: Displays the threshold of the changes in the span loss
6.00) before a fault alarm is raised, in dB. DOC raises an
‘DOC Action: Fault Detected’ alarm if a span loss
changes by an amount that exceeds the provisioned
“drift threshold input” value for the fiber used by the
span. The value has a supported range of 0.00 to 99.99
dB.

Port Label string format Displays the description of the port. Applicable to UCS,
OBB, OBMD8, WSSOPM, CCMD8x16, OPS, POPS,
FGA, OMDF4, OMDF8, BS, OSCF, and DSCM.

System numeric format, (default: Displays the OPS or FIM insertion loss in dB.
Configuration Loss 0.00) Read-only.
(dB) Applicable to CMD44, CMD64, CCMD12 L-Band,
CCMD12 C-Band, SCMD4, OMDF4, and OMDF8 for
OPS insertion loss.
Applicable to CCMD8x16 and WSS Flex C-Band w/
OPM 20x1 for FIM1 and FIM2 insertion loss.
Applicable to CCMD12 and WSS Flex C-Band w/OPM
20x1 for FIM4 insertion loss. See Note 3.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

ADJPEER

Unit • ADJ-shelf-slot-port- Displays the facility AID. Applicable for Inline


subport Submarine Supervisor (ISS), MLA2 (C-Band), MLA3
(C-Band and L-Band), and LIM (L-Band) only.

Primary State See Table 2-2 on page Displays the primary state of the facility. Read-only.
2-21 Applicable for Inline Submarine Supervisor (ISS), MLA2
(C-Band), MLA3 (C-Band and L-Band), and LIM
(L-Band) only.

Adjacency Type • LINE Sets the type of the adjacency. Applicable for Inline
Submarine Supervisor (ISS), MLA2 (C-Band), MLA3
(C-Band and L-Band), and LIM (L-Band) only.

Actual Far End same as for ADJ facility Displays the actual far end address which is the
Address detected TID, shelf, slot, and port. Read-only.
Applicable for Inline Submarine Supervisor (ISS), MLA2
(C-Band), MLA3 (C-Band and L-Band), and LIM
(L-Band) only.

Actual Far End same as for ADJ facility Displays the option that each field of the far end address
Address Format represents. Read-only.

Expected Far End TID-shelf-slot-port- Sets the provisioned far end address. Applicable for
Address (Note 1) instance Inline Submarine Supervisor (ISS), MLA2 (C-Band),
MLA3 (C-Band and L-Band), and LIM (L-Band) only.

Expected Far End same as for ADJ facility Sets the expected far end address format. Applicable
Address Format for Inline Submarine Supervisor (ISS), MLA2 (C-Band),
MLA3 (C-Band and L-Band), and LIM (L-Band) only.

Customer Defined same as for ADJ facility Used to identify a provisioned facility. It is the same as
Facility Identifier the Common Language Facility Identifier (CLFI).
Applicable for Inline Submarine Supervisor (ISS), MLA2
(C-Band), MLA3 (C-Band and L-Band), and LIM (L-
Band) only.

Layer PEER Indicates the layer of the adjacency. Read-only.


Applicable for Inline Submarine Supervisor (ISS), MLA2
(C-Band), MLA3 (C-Band and L-Band), and LIM (L-
Band) only.

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Table 2-4
ADJ/ADJ-LINE/ADJ-TX/ADJ-RX/ADJ-FIBER facility parameters (continued)

Parameter Options Description

Note 1: The Expected Far End Address is controlled by the Expected Far End Address Format
selection. If the Expected Far End Address Format is set to ‘NULL’, then the Expected Far End
Address is disabled; Otherwise, it is enabled.
Note 2: The Far End Address Format options are:
• NULL
• TID-BAY-SH-SL-PRT
• TID-SH-SL-PRT
• TID-SH-SL-SBSL-PRT
• TID-SH-SL-PRT-SBPRT
• TID-SH-SL-PRT-INSTANCE
Note 3: The SCL is increased to 0.6dB for paths that include two FIM4 modules for pass-through and
add/drops. If only the WSS to FIM adjacency or SMD to FIM4 adjacency is provisioned, the SCL of 1.1dB
is reflected on the WSS/SMD subport, as their adjacencies are still pointing to its corresponding loopback
ports. When the FIM4 to FIM4 is provisioned, then the SCL on the corresponding WSS/SMD subports
will be changed to 0.6dB. The 0.6dB SCL applies only when the adjacency on the WSS to WSS subports
or the WSS to SMD subports is derived with two FIM4s in between. If any of the FIM4 LC ports adjacency
is provisioned to an active card rather than another FIM4, the SCL applies the value of 0.3dB.

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AMP facility parameters


Table 2-5
AMP facility parameters

Parameter Options Description

Unit • AMP-shelf-slot-port Displays the facility AID.


• AMP-shelf-slot-port-subport

Primary State See Table 2-2 on page 2-21 Sets the primary state of the facility. IS and OOS
(Note 3) are selectable.

Secondary See Table 2-3 on page 2-21 Displays the facility operational state.
State

AMP Mode • Gain (default) Sets amplifier mode.


• Gain Clamp Under normal operation, the control mode must
• Power be set to Gain or Gain Clamp. In Gain Clamp
mode, the amp total output power will always be
clamped to the target power, if the gain target
would make the amp output power exceed the
target power. In Gain mode, the amp always
controls the amp output power to a value that
meets the gain target.
Gain Clamp AMP mode only applies to amplifiers
that connect to the line/fiber plant. As such, it does
not apply to amplifiers used in a DIA OTS or a
COADM OTS. Gain Clamp is supported on the
following amplifier variants: MLA2, MLA2 w/VOA,
MLA3 C-Band, and MLA3 L-Band, and CCMD12
L-Band.
The AMP mode is automatically set to Gain
Clamp for amplifier types that support this AMP
mode when the amplifier is DOC controlled unless
the DOC DOCGAINCLAMP parameter is set to
disable. The DOCGAINCLAMP parameter is only
retrievable/editable using the TL1 RTRV-DOC
and ED-DOC commands.
For CCMD12 C-Band, WSS Flex C-Band w/OPM
20x1, and CCMD8x16/PCXM, the only option is
Gain.

Peak Power • Enabled (Default) Sets the peak power control algorithm of DOC for
Control State • Disabled the amplifier.
Not applicable to CCMD12 C-Band, CCMD12
L-Band, WSS Flex C-Band w/OPM 20x1,
CCMD8x16/PCXM, and Drop LIM (SLA).

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Target Gain • 0.00 to 30.00, default: 7.00 for SLA and Sets target gain in dB. It is the provisioned gain for
(dB) MLA port 8, 6.00 for MLA port 6 the amplifier, controlled by DOC, and any change
• 11.00 for MLA2, MLA2 w/VOA, MLA3 may be overwritten as part of DOC action.
C-Band and MLA3 L-Band ports 6 and 8 Target gain= Input power- output power
• 17.00 to 23.00 (default 20.00) for Note: If the operation is in the Gain mode
CCMD12 C-Band and for CCMD8x16/ (default), ‘Target Gain’ sets the target gain for the
PCXM subports 7, 8, 9, 10 (demux) amplifier.
• 1.00 to 23.00 (default 20.00) for Not applicable to WSS Flex C-Band w/OPM 20x1.
CCMD12 L-Band
• 12.00 to 18.00 (default 15.00) for
CCMD8x16/PCXM subports 3, 4, 5, 6
(mux)
• fixed gain at 23 dB for FGA and MLA
L-Band
• 0.00 to 30 (default 11.00) for XLA and
RLA5x1

Target Gain Tilt -5.00 to 5.00 (default: 0.00) Sets target gain tilt of the amplifier, used in
(dB) optimization. The target gain tilt is the difference
in power between channels on either side of the
spectrum. Not applicable to CCMD12 C-Band,
CCMD12 L-Band, WSS Flex C-Band w/OPM
20x1, and CCMD8x16/PCXM.

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Target Power • -15.00 to 24.00 for SLA, MLA C-Band, Sets the provisioned total power (Broadband) that
(dBm) MLA2, MLA2 w/VOA, and MLA3 the AMP will attempt to reach when operating in
C-Band port 8, Power mode in dBm.
• -10.00 to 40.00 for MLA C-Band port 6, When AMP mode is Gain Clamp, the AMP total
default: 18.00 for SLA and MLA C-Band output power will always be clamped to the target
port 8, 20.00 for MLA C-Band MLA2/ power, if the gain target would make the AMP
MLA2 w/VOA port 6, 20.50 for MLA2/ output power exceed the target power.
MLA2 w/VOA port 8, 23.00 for MLA3 When AMP mode is Gain, the target power is
port 6, 23.50 for MLA3 port 8 automatically calculated by DOC during channel
• -15.00 to 40.00 for MLA3 L-Band port 6 capacity changes (add or delete). The target
(default: 23.00) and port 8 (default: power value is derived from the number of
23.50) channels present and the peak channel power
• -15.00 to 40.00 (default 23.00) for XLA target on that amplifier. The Tx bias (Differential
and RLA5x1 Provisioning) of these signals is also considered.
It is calculated independently for each amplifier
• -15.00 to 24.00 (default 0.00) for FGA and therefore varies from one amplifier to
• 16.00 for MLA L-Band (fixed) another.
• 5.00 to 20.00 for CCMD12 C-Band, Note: The Target Power setting on the CCMD12
CCMD12 L-Band, port 25, and -5.00 to has no effect on the operation of the amplifier.
20.00 for port 26 (default: 15.00)
Not applicable to WSS Flex C-Band w/OPM 20x1.
• 12.00 for CCMD8x16/PCXM subports
3, 4, 5, 6 (mux)
• 21.00 for CCMD8x16/PCXM subports
7, 8, 9, 10 (demux)

Target Peak -15.00 to 24.00 (default: 0.00) Sets the maximum target power for any given
Power (dBm) channel at this AMP that DOC will attempt to
reach when it runs its peak power algorithm in
dBm.
Not applicable to CCMD12 C-Band, CCMD12
L-Band, WSS Flex C-Band w/OPM 20x1, and
CCMD8x16/PCXM.

Max Target numeric value Displays the maximum target power in dBm.
Power (dBm) Read-only.

Reference • 12.5 GHz ITU (default for Flexible Grid) Sets the reference bandwidth, which refers to the
Bandwidth • 50 GHz ITU (default for Fixed Grid) frame of reference for local controller to use.

Input Loss (dB) 0 to 3.00 (default: 0.25) Sets the provisioned input loss for the amplifier in
dB, used in optimization. Not applicable to WSS
Flex C-Band w/OPM 20x1 and CCMD8x16/
PCXM.

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Output Loss 0 to 3.00 (default: 0.25) Sets the provisioned output loss for the amplifier
(dB) in dB, used in optimization. Not applicable to WSS
Flex C-Band w/OPM 20x1 and CCMD8x16/
PCXM.

Gain Mode • Low Sets the gain mode. Applicable to MLA3 L-Band,
• High (default) XLA and RLA5x1 port 8 only. To edit this
parameter, the facility must be OOS and the target
• NA gain must be in the common range of 11 to 19 dB.

Gain (dB) numeric value Displays the actual gain. Read-only.

Input LOS • RLA5x1, port 5: -39.00 to 10.00 (default: Sets the threshold at which to declare input LOS
Threshold -36.00) alarm for the amplifier in dBm. When an LOS
(dBm) • RLA5x1, port 8: -39.00 to 10.00 (default: raises against the input port, it is reported to DOC
-26.00 low gain and -36.00 high gain) and an alarm is raised.

• SLA port 8: -40.00 to 10.00 (default: For more information, see Part 2 of Fault
-32.00) Management - Alarm Clearing, 323-1851-543.

• MLA C-Band port 6 and 8: -40.00 to Not applicable to WSS Flex C-Band w/OPM 20x1.
13.00 for port 6 (default: -22.00) -40.00
to 10.00 for port 8 (default: -32.00)
• MLA3/MLA2/MLA2 w/VOA and MLA
L-Band ports 6 and 8:
-40.00 to 10.00 (default:-36.00)
• MLA3 L-Band ports 6 and 8:
-39.00 to 10.00. For port 6, default is
-36.00. For port 8, default is -26.00 for
low gain mode and -36.00 for high gain
mode.
• XLA ports 6 and 8: -39.00 to -22.00
(default:-26.00 low gain and -36.00 high
gain)
• FGA port 4: -40.00 to 10.00 (default:
-34.00)
• CCMD12 C-Band and CCMD12 L-Band
port 25: -40.00 to 0.00 (default: -29.00)
• CCMD12 C-Band and CCMD12 L-Band
port 26: -40.00 to 0.00 (default: -33.00)
• CCMD8x16/PCXM subports 3, 4, 5, 6
(mux): -28.00 to -0.50 (default: -25.00)
• CCMD8x16/PCXM subports 7, 8, 9, 10
(demux): -26.00 to 2.50 (default: -23.00)

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Output LOS • RLA 5x1, port 5 and port 8: -15.00 to Sets the threshold at which to declare output LOS
Threshold 15.00 (default: -12.00) alarm for the amplifier in dBm.
(dBm) • SLA port 8: -15.00 to 15.00 Not applicable to WSS Flex C-Band w/OPM 20x1.
(default:-13.00)
• MLA port 6 and port 8: -11.00 to 24.00
(default:-10.00) for port 6, -15.00 to
15.00 (default: -13.00) for port 8
• MLA2, MLA2 w/VOA, MLA3 C-Band,
MLA3 L-Band ports 6 and 8: -15.00 to
15.00 (default:-12.00)
• XLA ports 6 and 8: -15.00 to 0.00
(default:-12.00)
• FGA port 4: -15.00 to 20.00 (default:
-12.00)
• CCMD12 C-Band and CCMD12 L-Band
port 25: -20.00 to 20.00 (default:-12.00)
• CCMD12 C-Band and CCMD12 L-Band
port 26: -20.00 to 20.00 (default:-16.00)
• CCMD8x16/PCXM subports 3, 4, 5, 6
(mux): -5.00 to 13.00 (default:-5.00)
• CCMD8x16/PCXM subports 7, 8, 9, 10
(demux): 0.50 to 21.00 (default:0.50)

Top Offset -6.00 to 0.00 (default 0.00) Sets the total output power offset value for clamp
settings.
Not applicable to WSS Flex C-Band w/OPM 20x1
and CCMD8x16/PCXM. Applicable for XLA,
RLA5x1, CCMD12 C-Band, CCMD12 L-Band,
and MLA.

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Shut Off • -60.00 to 10.00, default: -35.00 for SLA, Sets the threshold at which to shut down the
Threshold MLA C- Band, WSSOPM 50GHz 9x1, amplifier. Any input power below this threshold
(dBm) (Note 1) WSSOPM Flex C-Band 9x1, CCMD12 shuts off the amplifier. If the Shutoff Threshold is
C-Band, CCMD12 L-Band, and FGA. set to -60, the Shutoff is effectively disabled.
-39.00 for MLA3 C-Band, MLA2, MLA2 When a shut off threshold is crossed, it is reported
w/VOA. to DOC and a Shutoff Threshold Crossed alarm is
• -42.00 to 10.00, for MLA3 L-Band. For raised. For more information about the alarm, see
port 6, default is -39.00. For port 8, Part 2 of Fault Management - Alarm Clearing,
default is -29.00 for low gain mode and 323-1851-543.
-39.00 for high gain mode. Not applicable to WSS Flex C-Band w/OPM 20x1.
• For XLA: -42.00 to -22.00 (default
-29.00 low gain mode or -39.00 for high
gain mode)
• For CCMD8x16/PCXM subports 3, 4, 5,
6 (mux): -28.00 to -0.50 (default -27.00)
• For CCMD8x16/PCXM subports 7, 8, 9,
10 (demux): -26.00 to 2.50 (default
-25.00)
• For RLA5x1, port 5 and 8: range is
-42.00 to 10.00. Default for port 5:
-39.00. Default for port 8 is -29 for low
gain mode and -39 for high gain mode.

Drop Target 0.00 to 20.00 (default: 6.00) (up to 13.00 Sets the target gain for the drop amplifier to
Gain (dB) in this release) provide more or less power for the receivers. This
(Note 2) parameter is only applicable to 9x1 OPM 50GHz.
The gain only applies to the demux path of
switches 8 and 9 (ports 18 and 20).

Forced Shut Off • Disabled Enables or disables forced shutoff of the amplifier.
(Note 3) • Enabled This parameter is only applicable to CCMD8x16/
PCXM, WSSOPM 50GHz 9x1, WSSOPM Flex C-
Band 9x1, WSS Flex C-Band w/OPM 20x1, XLA,
and SLA. Always Disabled and not editable on the
mux AMP facilities on CCMD8x16/PCXM.

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Table 2-5
AMP facility parameters (continued)

Parameter Options Description

Path Identifier 1 to 254 Identifies the path (and thus the direction) of the
traffic supported by this AMP. This parameter is
read-only. For AMPs receiving channels coming
into the node from the line (including local drop
within the node), the Path ID is reported as the RX
Path ID for the OTS this AMP is a part of. For
AMPs transmitting channels exiting the node onto
the line (including traffic added from the node),
the Path ID is reported as the Tx Path ID for the
OTS this AMP is a part of. If the AMP is not part
of an OTS, no Path ID is reported.
• Not applicable to CCMD12, WSS Flex C-Band
w/OPM 20x1, 0.25 (default), RLA5x1, and
CCMD8x16/PCXM.
Note: Path ID will be displayed for Drop LIM, too.

Auto In-Service numeric value Displays the time left on the Auto in-service timer.
Time Left Not applicable to WSS Flex C-Band w/OPM 20x1.
(hh-mm)

ALSO Disabled • False (Default) Indicates whether the automatic laser shutoff
• True feature is enabled or disabled.
Not applicable to WSS Flex C-Band w/OPM 20x1
and CCMD8x16/PCXM. Applicable for XLA.

Gain Offset numeric value Displays the gain offset. Applicable for RLA 20x1
port 5 and RLA port 8, MLA3 C-Band, MLA3
L-Band, CCMD12 L-Band only.

Note 1: If the Shutoff Threshold is set to -60, the Shutoff is effectively disabled.
Note 2: Target gain is automatically set by DOC as part of channel addition and deletion. DOC attempts to
achieve the provisioned ADJ-RX's “Nominal Level (dBm)” on the managed channels that connect to the
WSSOPM 50GHz 9x1 or WSSOPM Flex C-Band 9x1 drop ports (ports 18 and 20). Under normal system use,
you do not need to set this parameter.
Note 3: When the AMP facility on the WSSOPM 50GHz 9x1 or WSSOPM Flex C-Band 9x1 is created, the
primary state defaults to OOS-AU, with Forced Shut Off set to Enabled. When channels are present and
controlled by DOC, the primary state changes to IS and the Forced Shut Off is set to Disabled automatically.

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AMPMON facility parameters


Table 2-6
AMPMON facility parameters

Parameter Options Description

Unit AMPMON-shelf-slot-port Displays the facility AID.

Primary State See Table 2-2 on page Displays the primary state of the facility, which follows the
2-21 primary state of the AMP or RAMAN facility on the input
port.

Secondary State See Table 2-3 on page Displays the facility operational state, which follows the
2-21 secondary state of the AMP or RAMAN facility on the input
port. The Auto in-service state is editable independently.

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CHC facility parameters


In this release, CHC facilities are displayed in index-based AID format.

“Wavelength-based” refers to the original Fixed Grid CHC facility support that
has the AID format: CHC-shelf-slot-port-wavelength.

When upgrading from a release where CHC is displayed in wavelength-based


AID format, the following rules apply:
• The existing CHC facilities are not deleted if the opaque setting is False,
and/or the base target power is provisioned to a non-default value.
• CHC facilities without traffic-carrying channels are deleted.
• New NMCC facilities are created to align with the CHC facilities.
• The topology prevents CHC/NMCC from being deleted when a CRS is
deleted if the Sequence CHC Updates parameter is enabled (OTS
application).

When upgrading from releases where CHC is displayed in index-based AID


format, the above rules are not applied. Instead, the CHC/NMCC (if existing)
are maintained/copied over the upgrade.

Table 2-7
Channel Control facility (CHC) parameters

Parameter Options Description

Unit • CHC-shelf-slot-port-index Displays the facility AID, where index = 1


• CHC-shelf-slot-portSsubport-index to 128. The CHC AID includes the
common port to which the cross-connect
directs the CHC.

Primary State See Table 2-2 on page 2-21 Sets the primary state of the facility. IS
and OOS are selectable.

Secondary State See Table 2-3 on page 2-21 Displays the facility operational state.
Read-only.

Minimum Frequency 191.32500 to 196.08750 Displays the minimum frequency of the


(THz) channel frequency range. The value is
the difference between the maximum
frequency and the channel width.
The calculated center frequency value
must be on 50GHz ITU grid for 50GHz
channel and on 100GHz ITU grid for
100GHz channel in Fixed Grid mode.
The value must be on the 6.25GHz grid
for Flexible Grid mode.
Applicable to WSSOPM/RLA/SMD.

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Table 2-7
Channel Control facility (CHC) parameters (continued)

Parameter Options Description

Maximum 191.36250 to 196.12500 Displays the maximum frequency of the


Frequency (THz) channel frequency range.
The calculated center frequency value
must be on 50GHz ITU grid for 50GHz
channel and on 100GHz ITU grid for
100GHz channel in Fixed Grid mode.
The value must be on the 6.25GHz grid
for Flexible Grid mode.
Applicable to WSSOPM/RLA/SMD.

Targeted Minimum 191.32500 to 196.08750 Displays the target minimum frequency in


Frequency (THz) THz. Applicable to WSSOPM/RLA/SMD
only.

Targeted Maximum 191.36250 to 196.12500 Displays the target maximum frequency


Frequency (THz) in THz. Applicable to WSSOPM/RLA/
SMD only.

ITU Center numeric format Displays the wavelength as follows:


Wavelength (nm) Wavelength is displayed if the CHC is on
a Fixed Grid circuit pack. For a Flexible
Grid circuit pack, wavelength is displayed
only if its channel width is 50GHz, its
calculated center frequency is on 50GHz
ITU grid, and there is only one NMCC
whose center frequency is on the 50GHz
ITU grid.

Channel Width numeric format Displays the channel width of the


(GHz) channel. Applicable to WSSOPM/RLA/
SMD only.

Minimum Frequency numeric format Indicates the limit of expansion of the


Limit (THz) channel for the minimum frequency.
Applicable to WSSOPM/RLA/SMD only.
For NTK553MA and NTK553GB and
other Flexible Grid circuit packs: fixed
value, C-band start, 191.32500 THz.
For NTK553LA, by default, the frequency
limit is set to C-Band start as for other
Flexible Grid circuit packs; however, this
parameter on this PEC can also be set to
limit 500GHz upon creation (maxfreqlimit
- minfreqlimit <= 500GHz).

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Table 2-7
Channel Control facility (CHC) parameters (continued)

Parameter Options Description

Maximum numeric value Indicates the limit of expansion of the


Frequency Limit channel for the maximum frequency.
(THz) Applicable to WSSOPM/RLA/SMD only.
For NTK553MA and NTK553GB and
other Flexible Grid circuit packs: fixed
value, C-band end, 196.12500 THz.
For NTK553LA, by default, the frequency
limit is set to C-Band end as for other
Flexible Grid circuit packs; however, this
parameter on this PEC can also be set to
limit 500GHz upon creation (maxfreqlimit
- minfreqlimit <= 500GHz).

CHC Mode • Loss Sets the control mode for the WSS
• Open Loop Loss Controller. For Fixed Grid channel, the
default is Loss. For Flexible Grid, the
• Power default is Open Loop Loss.

Lower Freq numeric value Sets the bandwidth at the lower


Filter-edge Spacing The range is 0 to (channel width frequency edge of the channel where the
(GHz) minus Upper Freq Filter-edge filter is shutoff. Applicable to WSSOPM/
Spacing), where channel width is RLA/SMD only. The default is 6.25GHz.
MAXFREQ -MINFREQ.

Upper Freq numeric value Sets the bandwidth at the higher


Filter-edge Spacing The range is 0 to (channel width frequency edge of the channel where the
(GHz) minus Lower Freq Filter-edge filter is shutoff. Applicable to WSSOPM/
Spacing), where channel width is RLA/SMD only. The default is 6.25GHz.
MAXFREQ -MINFREQ.

Switch Selector • 3, 5, 7, 9, 11, 13, 14, 15, 16 Sets the WSS ingress port for which
(Note 1 and Note 2) (WSSOPM 100GHz 5x1) another equipment is connected.
• 3, 5, 7, 9 (WSSOPM 4x1) Applicable to WSSOPM/RLA/SMD only.

• 3, 5 (WSSOPM 2x1) Note 1: This field is set automatically


when a channel is created, and should
• 3, 5, 7, 9, 11, 13, 14, 15, 17, 19 not be modified by the user. Facility must
(WSSOPM 50GHz 9x1/WSSOPM be OOS to edit this parameter.
Flex C-Band 9x1) Note 2: Changing the values of Switch
• 11 to 26 (SMD) Selector could be traffic affecting.
• 5S2, 5S3, ... 5S11, 6S2, 6S3, ...
6S11, 7S2, 7S3, ... 7S11, 8S2, 8S3,
... 8S11 (WSSOPM Flex 20x1)
• 21, 23, 25, 27, 29 (RLA5x1 port 5)

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Table 2-7
Channel Control facility (CHC) parameters (continued)

Parameter Options Description

Target Switch defaults to the value of the switch Displays the port setting of switch
Selector selector selector when the targeted channel is
connected to the WSS. Read-only.

Opaque (Note 3, • Yes (default) Set the opacity of the pixel for the
Note 4, and • No channel.
Note 5) • Yes: The light (channel) is blocked from
passing through.
• No: The channel is allowed to pass
through.
Note 3: This field is set automatically
when a channel is created, and should
not be modified by the user. Facility must
be OOS to edit this parameter.
Note 4: Changing the values of Opaque
could be traffic-affecting.
Note 5: The Opaque parameter is
applicable in Fixed Grid mode and
Flexible Grid mode, but should only be
edited/changed in Flexible Grid mode.

Loopback Ready • True (Yes) Indicates if a loopback is ready. Only


• False (No) displays for circuit packs with a loopback
(SMD).

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DISP facility parameters


Table 2-8
DISP facility parameters

Parameter Options Description

Unit DISP-shelf-slot-port Displays the facility AID.

Primary State See Table 2-2 on page 2-21 Displays the primary state of the facility.
Read-only.

Rack Unit Number 0 to 44 Sets the rack unit location of the device. It
must remain unchanged in this release.

DSCM Order, Note 3 • None (default) Sets the order of the DSCM. It represents
•1 which DSCM comes before another when two
DSCMs are connected to the same LIM port.
•2 The DSCM directly connected to the LIM is
instance 1. The DSCM not directly connected
to a LIM is instance 2.
Note: For consistency, DISPs must always be
provisioned against the line-side amplifier.
The slot/port of a DISP should not be mapped
to the interior amplifier. (CASCLIM).

LIM Slot, Note 3 • None (default) Sets the slot of the amplifier module to which
• 1 to 8 for 6500-7 packet-optical shelf the DSCM is connected.
• 1 to 14 for 14-slot shelf Note: For consistency, DISPs must always be
provisioned against the line-side amplifier.
• 1 to 8, 11 to 18, 21 to 28, 31 to 38 for
The slot/port of a DISP should not be mapped
32-slot shelf
to the interior amplifier. (CASCLIM).
• 1 to 7 for 7-slot shelf
• 1 to 2 for 2-slot shelf with SPAP-2 w/
2xOSC

LIM Port, Note 3 • None (default) Sets the port of the amplifier module to which
• 5 to 8 the DSCM is connected.
Note: For consistency, DISPs must always be
provisioned against the line-side amplifier.
The slot/port of a DISP should not be mapped
to the interior amplifier. (CASCLIM).

Type • OTHER Sets the DSCM Type.


• Pad Type
• Type1
• Type2
• Type3
• Type5

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Table 2-8
DISP facility parameters (continued)

Parameter Options Description

Input Loss (dB), Note 2 • default is 1.0 (If a Pad is selected in Sets the input connector loss in numeric
Provisioned PEC) format in dB unit.
• default is 0.4 (If a DSCM is selected
in Provisioned PEC)

Output Loss (dB), • default is 0.0 (If a Pad is selected in Sets the output connector loss in numeric
Note 2 Provisioned PEC) format in dB unit.
• default is 0.3 (If a DSCM is selected
in Provisioned PEC)

Module • Pad 01 to Pad 17 (If a Pad is Sets the DSCM module.


selected in Provisioned PEC)
• Mod 05 to 320, depending on type (If
a DSCM is selected in Provisioned
PEC)

Wavelength Dependent numeric format Sets the wavelength loss slope in dB/nm.
Loss Slope (dB/nm),
Note 2

Raman Gain Peak numeric format Sets the gain peak at wavelength 1455nm.
(/km-W), Note 2

Average Loss (dB/km), numeric format Sets the attenuation co-efficient.


Note 2

Length (km), Note 2 numeric format Sets the length of distance, in kilometers.

Wavelength Dependent numeric format Sets the wavelength dependent loss


Loss Maximum (dB), maximum at wavelength 1530nm.
Note 2

Note 1: When DSCM circuit packs are provisioned based on the PEC provided, most of the DISP facility
parameters are auto-provisioned as well. They must be modified only if the DSCM circuit pack is a custom type.
Ciena indicates that when a change is needed. These parameters are used during optimization.
Note 2: Any numeric range within this number of characters including +/- values are accepted. These values
are auto-provisioned and should not be modified by the user unless Ciena indicates that a change is needed.
Note 3: You must edit these parameters to reflect the actual position of the DSCM if you use the OTS
Management application to provision the OTS.

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NMCC facility parameters


Network media channel control (NMCC) facilities are used for equalization
within a CHC parent facility which represent a media channel (MC). In this
release, the NMCC is the child facility of the CHC facility.

The NMCC controls the individual network media channels (NMC) within the
media channel and any controller-related parameters (for example, target
power). In this release, NMCC facilities are displayed in index-based AID
format.

“Wavelength-based” refers to the original Fixed Grid CHC facility support that
has the AID format: CHC-shelf-slot-port-wavelength.

When upgrading from a release where CHC is displayed in wavelength-based


AID format, the following rules apply:
• The existing CHC facilities are not deleted if the opaque setting is False,
and/or the base target power is provisioned to a non-default value.
• CHC facilities without traffic-carrying channels are deleted.
• New NMCC facilities are created to align with the CHC facilities.
• The topology prevents CHC/NMCC from being deleted when a CRS is
deleted if the Sequence CHC Updates parameter is enabled (OTS
application).

When upgrading from releases where CHC is displayed in index-based AID


format, the above rules are not applied. Instead, the CHC/NMCC (if existing)
are maintained/copied over the upgrade.

Table 2-9
NMCC facility parameters

Parameter Options Description

Unit NMCC-shelf-slot-port-chcIdx- Displays the facility AID. The index range is 1 to 384.
index

Primary State See Table 2-2 on page 2-21 Sets the primary state of the facility. IS and OOS are
selectable.

Secondary State See Table 2-3 on page 2-21 Displays the facility operational state. Read-only.
Supporting entity outage indicates that the
supporting entity outage based on parent CHC is
OOS (AU/MA/AU-MA) or controller is not in closed
loop control for this NMCC.

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Table 2-9
NMCC facility parameters (continued)

Parameter Options Description

Center Frequency 191.33125 to 196.08750 THz Displays the center frequency. The range is within its
(THz) parent CHC frequency range excluding the parent
CHC dead bands (bands that are not available) on
both sides.

Controller numeric format Defines the spectral offset for WSS controller from
Frequency Offset the center frequency. Not applicable for Fixed Grid.
(GHz)

Spectral Width string Sets the spectral width. Minimum value is 12.5 GHz.
(GHz) Maximum value is limited to its parent CHC range
and its deadbands. Granularity is 0.1 GHz.

Minimum string Displays the minimum frequency. This is calculated


Frequency (THz) from center frequency and the spectral width.

Maximum string Displays the maximum frequency. This is calculated


Frequency (THz) from the center frequency and the spectral width.

ITU Center numeric format Displays the wavelength as follows: Wavelength is


Wavelength (nm) displayed if the NMCC is on a Fixed Grid circuit
pack. For a Flexible Grid circuit pack, wavelength is
displayed only if its center frequency is on 50GHz
ITU grid and its spectral width is less than or equal
to 37.5.

Loss (dB) numeric Displays the measured loss across the WSS device.
Read-only.
Loss= Input Power - Output Power.
The “Channel Controller: Unexpected Loss
Detected” alarm is raised when the difference
between Target Loss and measured Loss is greater
than 6 dB.
Applicable to WSSOPM with equipment profile in
Fixed Grid or Flexible Grid mode and RLA 5x1 only.

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Table 2-9
NMCC facility parameters (continued)

Parameter Options Description

Target Loss (dB) • 0.00 to 18.00 (default: 18.00) Sets the desired loss across switch-input to
for WSS 50GHz w/OPM 2x1 common-output port of WSS. DOC automatically
• 18.00 for WSS 50GHz w/OPM calculates this target loss based on its optimization
9x1/WSS Flex C-Band w/OPM scheme. Any changes made to the target loss may
9x1 (NTK553FC/LA) be overwritten by DOC during the next optimization.

• 0.00 to 28.00 (default: 18.00) Note: This field is set automatically when a channel
for all other WSS and RLA5x1 is created, and should not be modified by the user.
• for SMD IS: N/A Applicable when CHC Mode is Loss or
OpenLoopLoss. Applicable for Fixed Grid and
• for SMD OOS: 0.00 to 28.00
Flexible Grid modes.
(default 28.00) for an opaque
channel. For a non opaque
channel, target loss is set to the
current drive of pixel upon
transition from IS to OOS.

Reference • 12.5 GHz ITU (default for Sets the reference bandwidth, which refers to the
Bandwidth Flexible Grid) frame of reference for local controller to use.
• 50 GHz ITU (default for Fixed
Grid)

Controller Target • -21 to 24 dBm Sets the control target power, the target power in the
Power (dBm) • N/A (default) control bandwidth to be achieved by the controller at
the reference control in dBm.
Applicable to WSSOPM with equipment profile in
Fixed Grid mode only. Not applicable (N/A) for
WSSOPM in Flexible Grid mode.

Initial Attenuation 0 to 18, default is 12 dB Sets the initial attenuation.


(dB)

Controller State string Displays the control state of the NMCC.

Control SSC string Displays the control SSC, the AID of Control SSC.
Applicable for Flexible Grid mode.

Control SSC decimal Displays the control SSC attenuation, the


Attenuation (dB) attenuation that has been applied at the reference
control SSC. Applicable for Flexible Grid mode.

Controller Output decimal or N/A Displays the measured power at the output of the
Power (dBm) booster.
Applicable to WSSOPM with equipment profile in
Fixed Grid mode or Flexible Grid mode and RLA 5x1
only.

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Table 2-9
NMCC facility parameters (continued)

Parameter Options Description

WSS Output decimal Displays the measured power in the control


Power bandwidth at the output of the WSS.

Opaque • Yes (default) Displays the opacity status of the parent CHC.
• No • Yes: The light (channel) is blocked from passing
through.
• No: The channel is allowed passing through.

CHC Mode • Loss Displays the CHC mode of the parent CHC.
• Open Loop Loss Note: Loss, Open Loop Loss, and Power are
• Power applicable to Fixed Grid CHC. Open Loop Loss, and
Power are applicable for Flexible Grid CHC.

Switch Selector string Displays the switch selector WSS port for the parent
CHC.

Target Switch string Displays the target switch selector for the parent
Selector CHC.

Total WSS numeric value Displays the measured power in the control channel
Channel In Power bandwidth at the input of WSS.
(dBm)

Total WSS numeric value Displays the measured power in the control channel
Channel Out bandwidth at the output of WSS.
Power (dBm)

Channel Power • -15 to 24 Displays the channel power, the estimated power
(dBm) • N/A across the NMCC spectral width.

Input Power string Displays the TID-shelf-slot-port of the source of the


Source input power reading. Can be TID-shelf-slot-IDLER
and TID-shelf-slot-ASE in submarine applications.
For pass through channels, this point references the
remote WSS output port. For local channels, this
point references the local (S)CMD input port.
Read-only.
Applicable to WSSOPM with equipment profile in
Fixed Grid mode or Flexible Grid mode and RLA 5x1
only.

Derived Input numeric Displays the estimated channel input power at the
Power (dBm) WSS input port (Port 3, 5, 7, 9, 11, 13, 14, 15 or 16).
Read-only.
Applicable to WSSOPM with equipment profile in
Fixed Grid or Flexible Grid mode and RLA 5x1 only.

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Table 2-9
NMCC facility parameters (continued)

Parameter Options Description

Expected Initial • -21.00 to 24.00 Displays the expected initial power that is used by
Power (dBm) • N/A (default) the control application in OPENLOOPLOSS mode.
Applicable to WSSOPM with equipment profile in
Fixed Grid mode and RLA 5x1 only. Not applicable
(NA) for WSSOPM in Flexible Grid mode.

Reference Input numeric Displays a referenced or baselined value for the


Power Profile Derived Input Power parameter. This power profile
(dBm) helps determine how the channel power changes
over time. The power profile is system reset after a
capacity change (that is, a channel add or delete) or
can be user reset using the Reset Power Profile
button in the Equipment & Facility Provisioning
application or the Reset TCA Baselines button in
the DOC application.
On a DIA OADM OTS WSS, if the Derived Input
Power is less than the Reference Input Power
Profile - the Minor Degrade Threshold value, then
the “Channel Degrade” alarm is raised.
Applicable to WSSOPM with equipment profile in
Fixed Grid mode or Flexible Grid mode and RLA 5x1
only.
To reset the reference input power profile on the
COADM SMD or DIA WSS, or CDC Upgrade WSS
in the drop direction, the “Reset TCA Baselines”
action should be performed from the DOC
controlling the drop channels (upstream of the SMD/
WSS equipment).

Attenuation (dB) numeric Displays the attenuation in dB.

Circuit Identifier string Displays circuit identifier text. The parameter is also
displayed in the DOC screen, Photonic connections
screen, and shelf wavelength topology screen, to
help the user identify the channels. Applicable to
WSSOPM with equipment profile in Fixed Grid mode
and RLA 5x1 only.

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OTDRCFG facility parameters


The OTDRCFG facility provides support for OTDR traces. The OTDRCFG
facility is applicable for the SRA and ESAM, port 8.

Table 2-10
OTDRCFG facility parameters

Parameter Options Description

Unit OTDRCFG-shelf-slot-port Displays the facility AID. Applicable for SRA and
ESAM, port 8.

Max Acquisition The range is 30 to 180 Sets the maximum acquisition time for manual
Time(s) seconds. The default is 60 traces. Applicable for SRA and ESAM, port 8.
seconds.

Fiber Type • AllWave Select the fiber type. To edit this parameter, the
• Dispersion Shifted Single facility must be OOS. Applicable for SRA and ESAM,
Mode Fiber port 8.

• Enhanced Large Effective


Area Fiber
• EX2000
• Freelight
• Lambda Shifted Single
Mode Fiber
• Large Effective Area Fiber
• Non-Dispersion Shifted
Fiber
• Non-Dispersion Shifted
Fiber Low Water Peak
• Other
• Pure Silica Core
• Teralight
• TeraWave ULL
• TrueWave Classic
• TrueWave Plus
• TrueWave Reach
• TrueWave Reduced Scope
• Unknown Fiber Type
(default)

Disc Fiber Type Same fiber types listed for Displays the discovered fiber type sent from
Fiber Type. upstream. Applicable for SRA and ESAM, port 8.
Read-only.

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Table 2-10
OTDRCFG facility parameters (continued)

Parameter Options Description

OTDR Event 0-128000, default: 0 Selects the OTDR event range in meters. Applicable
Range (m) for SRA and ESAM, port 8. If left blank, then the
discovered OTDR event range value will be used for
performance monitoring for the gauge TCA check.

Disc OTDR Event 0-128000, default: 20000 Displays the discovered OTDR event range in
Range (m) meters. This value is overwritten by the delay
measurement (DM) distance from the OSC when
available. Applicable for SRA and ESAM, port 8.
Read-only.

STATUS • Idle Displays the status. Applicable for SRA and ESAM,
• Active-Short port 8. Read-only.

• Active-Long
• Active-Auto
• Active-Office

Office Pulse • 10 Selects the office pulse width in nanoseconds.


Width (ns) • 30 Applicable for SRA and ESAM, port 8.

• 100 (default)

Office Max Fiber 8000 (default) Selects the maximum office fiber length in meters.
Length (m) Applicable for SRA and ESAM, port 8.

Short Pulse • 1000 (default) Sets the pulse rate for short distance in
Width (ns) nanoseconds. Applicable for SRA and ESAM, port 8.

Short Max Fiber • 8000 Sets the measure length for short pulse.
Length (m) • 16000
• 20000 (default)
• 32000

Long Pulse Width • 3000 Sets the pulse rate for long distance in nanoseconds.
(nS) • 10000 Applicable for SRA and ESAM, port 8.

• 40000 (default)

Long Max Fiber • 16000 Sets the measure length for long pulse in meters.
Length (m) • 32000 Applicable for SRA and ESAM, port 8.

• 64000
• 128000 (default)

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Table 2-10
OTDRCFG facility parameters (continued)

Parameter Options Description

OTDR Loss Per 0.00 to -1.50 (default 0.50) For SRA, sets the loss per event for go/no go
Event (dB) decision. For ESAM, sets the loss per event. Applies
to the first 20 km. Applicable for SRA and ESAM, port
8.

OTDR Loss All 0.00 to 3.00 (default 1.00) For SRA, sets the loss for all events for go/no go
Events (dB) decision. For ESAM, sets the loss for all events.
Applies to the first 20 km. Applicable for SRA and
ESAM, port 8.

OTDR Reflection -40.00 to -27.00 (default For SRA, sets the reflection for a single event for go/
Per Event (dB) -33.00) no go decision. For ESAM, sets the reflection for a
single event.
Applies to the first 20 km. Applicable for SRA and
ESAM, port 8.

OTDR Reflection -40.00 to -24.00 (default For SRA, sets the reflection for all events for go/no
All Events (dB) -27.00) go decision. For ESAM, sets the reflection for all
events.
Applies to the first 20 km. Applicable for SRA and
ESAM, port 8.

Average Loss decimal Displays the average fiber loss. Applicable for SRA
(dB/Km) and ESAM, port 8. Read-only.

Total Loss (dB) decimal Displays the total OTDR loss for all events in the first
20 km. This value is calculated from the last OTDR
trace that was done. Applicable for SRA and ESAM,
port 8. Read-only.

Total Reflection decimal Displays the OTDR total reflection. Applicable for
(dB) SRA and ESAM, port 8. Read-only.

OTDR Signal decimal Displays the OTDR signal power. Applicable for SRA
Power (dB) and ESAM, port 8. Read-only.

OTDR 1527.22 nm Displays the OTDR wavelength. Applicable for SRA


Wavelength (nm) and ESAM, port 8. Read-only.

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OPTMON facility parameters


Table 2-11
OPTMON facility parameters

Parameter Options Description

Unit OPTMON-shelf-slot-port Displays the facility AID.

Primary See Table 2-2 on page 2-21 Sets the primary state of the facility. IS
State and OOS are selectable.

Secondary See Table 2-3 on page 2-21. The Auto in-service state is Sets the facility operational state.
State editable for supported circuit packs. The Maintenance
state is editable for supported circuit packs.

LOS • LIM, SLA, MLA, MLA2, MLA3 C-Band, MLA3 L-Band Sets the loss of signal threshold at which
Threshold port 4: -40.00 to 0.00 or NA (default:-38.00) alarm reporting occurs. For more
(dBm) • MLA2 w/VOA and SRA port 4: -40.00 to 0.00 or NA information, see Part 2 of Fault
(default: -36.00) Management - Alarm Clearing,
323-1851-543.
• SRA and ESAM port 6: -20.00 to 10.00 (default: -12.00)
Not applicable to MONCS, CMD44/
• ESAM ports 4: -43.00 to 0.00 or NA (default: -40.00) OMD4/OMD8/BS/OMX modules or
• ESAM ports 8: -38.00 to 10.00 or NA (default: -36.00) SLIC10/SLIC10 Flex circuit pack.
• SLA port 6: -28.00 to 20.00 (default: -20.00) N/A (not applicable) is displayed on port
• LIM port 8: -36.00 to 20.00 (default: -36.00) 4 of a line amplifier if the associated
OSC pluggable in the 2xOSC or SPAP-2
• LIM port 6: -20.00 to 20.00 (default: -20.00) w/2xOSC circuit pack is an extended
• LIM L-Band -40.00 to 0.00. The default is -38.00 for reach SFP (NTK592NV). This value is
port 4, -20.00 for port 6, and -36.00 for port 8 read-only.
• RLA5x1 port 3: 24.00 to 3.00 (default: -18.00) For OPS/POPs, refer to “1+1 OPS traffic
• RLA5x1 port 4: -39.00 to -5.00 (default: -38.00) protection” section in Configuration -
Protection Switching, 323-1851-315.
• RLA5x1, switch ports: -30.00 to 19.00 (default: -18.00)
• CMD64 input ports: default -26
• CCMD12 C-Band, CCMD12 L-Band, and SMD: -35.00 to
15.00 (default: -18.00)
• CCMD8x16 (ports 2, 4, ...32): -20.00 to 9.00 (default: -20)
• CCMD8x16 (ports 1, 3, ...31): -15.00 to 5.00 (default: -10)
• CCMD8x16 (port 33) and PCXM (ports 35 and 36): N/A
• UCS ports 1, 3, and 5: -40.00 to 0.00 or NA (default: NA)
• OPS and POPS:-40.00 to 15.00 (default: -20)
• OBB Line In ports: -10.00 to 20.00 (default: -7.00)
• OBB CMD In ports: -27.00 to 3.00 (default: -21.00)
• OBMD8 Common In: -16.00 to 15.00 (default: -13.00)
• OBMD8 Ch In ports: -17.00 to 0.00 (default: -14.00)

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Table 2-11
OPTMON facility parameters (continued)

Parameter Options Description

LOS • WSSOPM OPM/Monitor (ports 1 and 2): LOS Threshold description (continued):
Threshold -40.00 to 7.00 (default: -32.00), or The OPTMON LOS Threshold default is
(dBm) -37.00 to 6.00 (default: -37.00) for NTK553KA/HA/JB/FC/
-21dB for the switch ports on the
(continued) LA/LM, or -37.00 to 9.00 (default: -37.00) for NTK553MA
WSSOPM 20x1 circuit pack; however,
• WSSOPM Common In: that value gets updated to 2dB by the
-35.00 to 18.00 (default: -12.00) or Connection Validation application upon
-30.00 to 20.00 (default: -19.00) for NTK553KA/HA/JB/ detecting the dark sub-fiber. Refer to the
FC/LA/LM, or -30.00 to 28.00 (default: -19.00) for Connection Validation section in part 2
NTK553MA of Configuration - Provisioning and
• NTK553MA Common Out: -30.00 to 15.00 (default: -30) Operating, 323-1851-310 for additional
information.
• NTK553LM Common Out: -39.00 to 15.00 (default: -39)
• NTK553MA sub-fibers: -30.00 to 24.00 (default: -21)
• WSSOPM
Switch In: -35.00 to 15.00 (default: -18.00) or
-30.00 to 19.00 (default: -30.00) for NTK553KA Switch In/
Add In
-30.00 to 19.00 (default: -18.00) for NTK553FC/LA/LM
-30.00 to 19.00 (default: -25.00) for NTK553JB
-30.00 to 19.00 (default: -28.00) for NTK553HA
• 2-port OPM (ports 1 and 2): -40 to 0.00 (default: -38)

Monitor Loss numeric value Displays the insertion loss between the
(dB) Mon In and the Mon Out. Read-only.
Applicable to the 2-port OPM and WSS
Flex L-Band w/OPM 8x1 only.

ALSO • False (Default) Indicates whether the automatic laser


Disabled • True shutoff feature is enabled or disabled.
Applicable to the UCS, MONCS, LIM
and ESAM circuit packs only.
ALSO should only be disabled (ALSO
Disabled set to True) when there is no
OSC in the OTS for automatic recovery
from optical line fail.

Auto In- numeric value Displays the time left on the Auto
Service Time in-service timer.
Left (hh-mm)

Port Label string format Displays the description of the port.


Applicable to MONCS, UCS, OBB,
OBMD8, WSSOPM, OPS, POPS,
OMDF4, OMDF8, and BS only.

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PC facility parameters
Table 2-12
PC facility parameters

Parameter Options Description

Unit PC-shelf-slot-port Displays the facility AID.

Primary State See Table 2-2 on page Displays the primary state of the facility, which
2-21 follows the primary state of the port.

Secondary State See Table 2-3 on page Displays the facility operational state, which
2-21 follows the secondary state of the port.

Port Selection • Block (default) Sets the subport to be used.


• 33S3, 33S4, ... 33S10
• 36S3, 36S4, ... 36S10

Port Label string format Displays the description of the port.

RAMAN facility parameters


Table 2-13
RAMAN facility parameters

Parameter Options Description

Unit RAMAN-shelf-slot-port Displays the facility AID.

Primary State See Table 2-2 on page 2-21 Sets the primary state of the facility. IS and OOS
are selectable.

Secondary State See Table 2-3 on page 2-21 Sets the facility operational state. The Auto
in-service state is editable.

RAMAN Pump Mode • Auto (default) Displays the Raman provisioning mode. Editable
• MANUAL through TL1 only.

• MAXGAIN

Target Power (dBm) 23 to 30 (default 30) Sets the target power, which is the total power
that can come out the Raman at any given time.
If needed, this parameter can be password
protected for safety reasons.

Target Power • Set Indicates whether the RAMAN override password


Password Status • Not Set has been set through TL1. Read-only.

Actual Pump1 Power numeric value Displays the measured pump1 power.
(dBm) Read-only.

Actual Pump2 Power numeric value Displays the measured pump2 power.
(dBm) Read-only.

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Table 2-13
RAMAN facility parameters (continued)

Parameter Options Description

Actual Pump3 Power numeric value Displays the measured pump3 power.
(dBm) Read-only.

Actual Pump4 Power numeric value Displays the measured pump4 power.
(dBm) Read-only.

Raman Gain Mode • Recommended (default) Sets whether the target gain is provisioned by the
• Provisioned user or recommended by the system.

Recommended Gain 0 to 24 (default 0) Displays the target gain recommended by the


(dBm) system. Only applicable when the RAMAN Mode
is Auto and the Raman Gain Mode is
Recommended.

Provisioned Gain 0 to 24 (default 0) Sets the provisioned gain. This parameter is used
(dB) only if the RAMAN Mode is Manual and the
Raman Gain Mode is Provisioned. Value is
provided by OPNET.

Target Gain Tilt (dB) -3 to 3 (default 0) Sets the target gain tilt.

Calibration Flag • Not Calibrated (default) Indicates the state of the Raman pumps.
• Calibrated
• Recalibration required
• Calibration not required

Forced Shut Off • True (default) Indicates whether to turn pumps off when there is
• False no controlled channel.

Target Unachievable 0 to 4 (default 3) Sets the threshold for raising the “Target
Minor (dB) Unachievable” minor alarm.

Target Unachievable 4 to 7 (default 6) Sets the threshold for raising the “Target
Major (dB) Unachievable” major alarm.

Calculated Gain (dB) numeric value (default -60) Displays the Raman gain calculated to achieve
an optimal gain. Only applicable when the
RAMAN Mode is Auto and the Gain Mode is
Recommended.

Raman State • Normal Displays the operating state of the Raman


• APR pumps. Read-only.

• SHUTOFF

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TELEMETRY facility parameters


Site Manager provides TELEMETRY facility support for SRA port 5 only.

Table 2-14
TELEMETRY facility parameters

Parameter Options Description

Unit TELEMETRY-shelf-slot-port Displays the facility AID.

Primary State See Table 2-2 on page 2-21 Sets the primary state of the facility. IS
and OOS are selectable.

Secondary State See Table 2-3 on page 2-21 Sets the facility operational state. The
Auto in-service state is editable. The
Maintenance state is editable.

Mode • TELEMETRYSIGNALON Displays the current telemetry mode.


• TELEMETRYSIGNALOFF Read-only.

LOS Threshold (dBm) -50.00 to -40.00 (default -47.00) Sets the telemetry gain loss of signal
threshold.

CW Optical Power (dBm) numeric value, 1.70 (default) Displays the continuous wave power.
Read-only.

Tx TG Power (dBm) numeric value Displays the measured telemetry gain


signal transmit power. Read-only.

Received TG Power (dBm) numeric value Displays the received power from
telemetry gain signal. Read-only.

Span Loss (dB) numeric value Displays the calculated span loss
based on transmit and receive power.
Read-only.

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SSC facility parameters


SSC (Spectral Shape Controller) facility defines the bias relative to the current
attenuation of the reference control SSC of the parent NMCC. SSC facilities
are supported on both Fixed Grid and Flexible Grid circuit packs.

Up to 768 SSC facilities per supported direction will be auto-created with


Flexible Grid circuit pack creation. Up to 96 SSC facilities at the control SSC
of the Fixed Grid channels are created on Fixed Grid circuit pack creation.
SSC facilities are auto-deleted with circuit pack deletion.

Table 2-15
SSC facility parameters

Parameter Options Description

Unit SSC-shelf-slot-port-index Displays the facility AID, where index = 1 to 768.

Bias (dB) -20.0 to 20.0 (default is 0.0) Sets the attenuation bias of this spectral unit.
Editing of BIAS is blocked for Fixed Grid circuit
packs. Editing of Bias is blocked when it does not
belong to a parent NMCC on a Flexible Grid
circuit pack.

Minimum Frequency numeric format Displays the minimum frequency of this spectral
(THz) unit. Read-only.

Maximum Frequency numeric format Displays the maximum frequency of this spectral
(THz) unit. Read-only.

Parent Network Media NMCC-shelf-slot-port-index Displays the AID of the Network Media Channel
Channel Controller Controller (NMCC) that contains this SSC in its
(NMCC) frequency range. Applicable for Flexible Grid
mode only. Read-only.

Index Within NMCC string format Displays the index of this SSC relative to the
maximum number of SSCs that the parent NMCC
contains. For example, 1 of 10. Applicable for
Flexible Grid mode only. Read-only.

Attenuation decimal Displays the attenuation of this spectral unit.

Base Target Power decimal Set the base target power. The default is N/A. The
(dBm) range for L-Band WSS, RLA20x1, and RLA5x1:
-21.0 to 24.0 or NA. The range for C-Band WSS
and SMD: -15.0 to 24.0 or NA.

Reference Bandwidth • 12.5 GHz ITU (default for Sets the reference bandwidth, which refers to the
Flexible Grid) frame of reference for local controller to use. This
• 50 GHz ITU (default for Fixed parameter is editable only on flexible capable
Grid) circuit packs.

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VOA facility parameters


Table 2-16
VOA facility parameters

Parameter Options Description

Unit VOA-shelf-slot-port Displays the facility AID.

Primary See Table 2-2 on page Sets the primary state of the facility. IS and OOS are selectable.
State 2-21

Secondary See Table 2-3 on page Sets the facility operational state.
State 2-21

VOA Mode Loss (default) Sets the VOA control mode. Loss = loss mode.

Target Loss 0.00 to 20.00 (default: Sets the target loss in dB.
(dB) 15.00 for SCMD4, 1.00 For more information about VOA target loss calculation for MLA2 w/
for MLA2 w/VOA) VOA, see the description of VOA Reset Required and Target Pad
parameters, and the 6500 Packet-Optical Platform Photonic Layer
Guide, NTRN15DA.

Target Sets the target peak Target Peak Power (dBm)


Peak power in dB.
Power
(dBm)

LOS • -30.00 to 10.00 Sets the loss of signal threshold in dBm at which alarm reporting
Threshold (default: -26.00) for occurs.
(dBm) Mux In (ports 3, 5, 7, 9)
on SCMD4
• -26.00 to 10.00
(default: -26.00) for
Demux Common In
(port 1) on SCMD4
• -45.00 to 20.00
(default: -31.00) for
ports 5 and 7 on MLA2
w/VOA

VOA Reset • True When set to True, the VOA target loss is automatically calculated
Required • False and set by DOC. Once the calculation/setting is complete and DOC
has successfully set the VOA target loss, DOC sets the VOA Reset
Required parameter to False. To trigger a new VOA target loss
calculation, you can set this parameter back to True.
When set to False, the VOA target loss value can be overridden by
the user.
Default setting is determined by the setting of the VOA Reset
Required parameter in the Node Information application. Applicable
to MLA2 w/VOA only.

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Table 2-16
VOA facility parameters (continued)

Parameter Options Description

Target Pad 1 to 20 or MIN Defines the total loss targeted on the span or mid-stage. Default
(dB) (default:15.00) setting is determined by the setting of the Target pad loss parameter
in the Node Information application.
The DOC calculated VOA target loss is dependent on the Target
Pad parameter. If the Target Pad value is numeric, the VOA target
loss is set to achieve a total loss between adjacent amplifiers equal
to the Target Pad value. If the Target Pad value is set to MIN, the
VOA target loss is set to ensure that the downstream amplifier’s gain
is above its minimum. This algorithm uses the provisioned target
peak powers of both the MLA2 w/VOA and the downstream
amplifier. Applicable to MLA2 w/VOA only.

Auto hh-mm (default: 5 min) Sets the system auto-in-service (AINS) default time.
In-service If the AINS time is edited, the new AINS time is used only after a
Time current AINS timer expires and a new AINS condition/timer entered.
(hh-mm) Applicable to MLA2 w/VOA only.

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6500 Packet-Optical Platform

Photonics Equipment

Copyright© 2010-2019 Ciena® Corporation. All rights reserved.

Release 12.6
Publication: 323-1851-102.6
Document status: Standard
Issue 2
Document release date: October 2019

CONTACT CIENA
For additional information, office locations, and phone numbers, please visit the Ciena
web site at www.ciena.com

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