DFT - Interview Qns - 02 - 8
DFT - Interview Qns - 02 - 8
1. Scan chain stitching order in case of both positive edge & negative edge flops are present.
2. What approach was followed in scan chain stitching & balancing (bottomup/topdown) ?
3. ATPG flow related questions - Explain ATPG flow what you followed?
5. Why do you toggle one capture clock at a time? If you toggle two capture clocks then what is
the problem?
7. How to generate patterns for LBIST module if all scan related pins are internal?
8. LBIST logic & MBIST logic implementation techniques if any you know?
11. What are the silicon failures I met & how did I debug those?
18. What are all the project done and its DFT futures ?
22. Do you have any programing knowledge, like perl, TCL, verilog etc...
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24. Explain capture operation in JTAG state machine
25. How many TCK(clocks) need, to reach CAPTURE IR state from UPDATE IR state?
29. If you use testclock how do you use it for capture procedure?
31. How do you specify capture clock using test procedure file?
32. Explain how sing le clock used top procedure three clocks?
33. During chain simulaton is there a clock skew how do you take care of it?
35. what is the difference between clock skew & clock delay?
38. how do you take care of negative setup & hold viloation?
39. Howbidi are taken care during i/p and o/p if there is scan_in and scan_out how it is taken
care?
40. If data arrives before flops ie in previous flop what is the problem?
41. What is the pattern you used for mbist retention test?
45. In perl, if we define array whether we can asses the array using scalar?
46. If clock is handled from top as single test clock whether you will loss coverage?
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48. at what edge tdo is sampled ?
52. How will you pulse these internal clock from top level?
56. The project # has how many clock domains and its frequency
60. How do you get 250Mhz freq, do you have any logic for that?
61. Are you sharing scan pins in the top level of the design?
63. Why do you force it to "Z", any test logic you put, to control bidi's ?
65. How you generated bist controller, which tool you have used?
66. How you are verifying the generated controller, is it in RTL level?
67. When you receive SDF with -ve delays, how will you handle it?
70. Any MCP (multi cycle path) in the design, if so, how you handled
71. How will you handle -ve and +ve edge Flip Flop in single scan chain?
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73. Did you see any mismatch in the ATPG simulation?
78. Did you insert one MBIST controller for each memory?
81. Was there any critical issue you faced in clock domain?
82. What are the clocks that you used for shift & capture?
89. Have you written perl scripts? When did you use it?
94. Do you know what are all the work that we are doing?
96. What will you do if the pre-dft & revised one differs?
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98. What are all the recent projects involved?
104. If we have 32 bit binary& '1' indicates the fail, how to find out the number of '1's in the
pattern?
113. How did you shift out the data from data logger and which clock have you used?
116. If we have the register array of 10 bits how to swap 5 bits of MSB with LSB?
117. How much are you aware of Perl? How it is helpful in your project?
118. If array @y={a,b,c,d } is assigned to a scalar variable what will be content of the scalar
variable?
121. It we want to add a synchronous reset in the circuit what will you do?
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122. Are u familiar with ATPG?
123. If we get the coverage 90% what are all things that you will consider?
127. Are there any repairable memories in the design & will you consider those memories also
while doing controller partioning?
129. How the data logger will shift out the data?
133. How will you test the MBIST? If there is any timing issue how will you handle it?
138. Is there any mandatory opcode for any instruction? Why it’s all ones for Bypass?
139. How many numbers of clock domains & scan chains are in your design?
142. What is meant by transition faults? Which will cause the transition defect?
145. If there is any defect in combinational logic thats slow functioning & other is functioning
fast, how will you find out?
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146. How the scan chain is stitched?
147. How will you handle the neg edge flops in the design?
148. If we put posedge flops in the beginning of the scan chain what will happen?
149. Have you done coverage analysis? How did you improve the coverage?
151. Are you aware of dath path & control path implementation?
158. Why start padding bits and end padding bits in the scan out data
159. why we keep diagclk for two cycles after fail signal is de-aaserted
160. How Dp ram with two ports with different clk frequencies are handled in controller
generation
163. How will you edit a SDF to overcome any particular critical path and to check weather
the rest of the design is working fine
169. at which state we observe output and bidi pins in HIGHZ test
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170. how you did atpg verification
180. Can you replace your Scan_en with TMS signal? If so what would be the result, will it
affect CAN/SHIFT/CAPTURE or others.
186. What is pattern failure? How you faced it any time if so, how do you handle it?
188. Have you worked on pattern simulation with respect to timing i.e. with SDF files?
190. How do check the interconnection between 2 pins of two IC's using JTAG.
191. What are the tools you use for SCAN, ATPG& MBIST?
192. What is ATPG mode, Testmode, Scan mode & Funtional modes during testing. Explain
their differences.
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194. What projects you have handled
200. if delay is specified in the verilog code and unit delay or zero delay switch is used then
what will happen
201. if negative values are present in sdf then which switch is used
211. how SE and test mode pins are different and what values are given to them
214. weather scain chains were crossing clock domains and how you handled it
217. How to decide the number of controllers for a given design (that is factors you consider).
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218. How many memories were there?
221. Verification process, problems, scripts, automation, type of files used in the environment
in the project
222. Asked details about projects worked on (Based on what is given in resume).
223. Familiarity in DFT tools like COMBATADS and CUSION. How comfortable are you
using these tools.
225. DFT work involved in each project and what exactly was done by me
227. Questions on pipelining ,why to use of flops , where did you use , issues by using these
236. How did u handle the clock domains in your design with in the scan chains?
237. What are the issues you faced during ATPG verification?
238. How many states are there in the JTAG tap machine?
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242. How did you handle Bidi and tristate buses in scan?
243. I have a random integer, i want to know that last bit is 1 how do you design the circuit?
245. Were the reset were synchronous or asynchronous for scan insertion?
247. One question on cmos inverter? what happens if the gate is open?
248. How do you reset the flip flops in the design if there is no reset pin?
253. How do you handle clock domain crossing over in the RTL coding design?(clue
synchronizers)
254. If i give a task and you dont know anything about that task you have to start from the
scratch and you did not able to complete the task then what is your approach next?
255. In next 3 yrs where do you see yourself and in which domain?
259. How did you decide the algorithm for the memory in MBIST?
260. How do you handle the multiple clock domains in the scan?
262. Explain the verilog code using Synchronous and Asynchronous Reset for the counter?
263. If there are Bidis in your design which are not sharing with the Scan pins does these
cause any roblem?
264. If Your mixing the clock domains there will be any problem during the atSpeed test
during capture?
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265. How do you write the Testbench in verilog ?
270. How do you do the board level testing using the jtag?
276. What are the cell types you can use for BIDIs ?(clue BC_5 BC_7 and BC_1)
277. If there is a Mismatch in the Simulation how do you trace?(clue waveform)&which tool
you used?
278. How did you decide the controllers for a memory in MBIST?
279. If you do at the RTL level hw did you get the data on the Floor planning?
284. What is the technology that you have used for your last project?
287. When multiple clock domains are there what are the things you need to take care?
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288. What are the setup and hold violations and how did you come to know the violation and
how u have analyzed? Have you used any debussy tool? How did you debug when there is X
on combo logic?
300. How do you improve coverage in ATPG? How do you start analyzing coverage in
ATPG?
301. Have you done ATPG verification? What are the issues you faced?
304. What are the TFT schemes you have? Which scheme do you use and why?
306. In scan suppose three clocks are coming from PLL and one test clock is coming from
307. Top level then what is your strategy for capture? How do you switch the test clock?
308. Can you explain about internal circuit of PLL and PLL clocking?
310. Can you explain what are blocking and non blocking operators?
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311. In the RTL code for the flop whether you will go for blocking or non blocking
assignment?
315. How you will apply the inputs from the test bench?
316. Have you worked on any MBIST generation insertion and verification?
320. Did you used encounter test? for which vendor you have used?
323. Did your scan chain has clock domain mixing, what should be taken care while doing?
324. what will happens if you not insert lock-up latch during clock domain crossing?
327. How do you design a ckt to check the bit of an integer is '1' or '0' in verilog.
329. If you don't have reset pin for a flop then how do you handle during simulation?
330. What is the difference between JTAG EXTEST and SAMPLE instruction and why it is
used explain?
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335. If without time your vector simulation is failing then what will be approach?
336. What are the violations you have observed while doing ATPG timing simulation and how
do confirm same?
338. If I give you new task which you don’t know and time for task is also very less then how
will be your approach?
339. Down the line in another 3 to 5 years where do will see yourself.
341. Explain what is functional verification and how you will do it?
342. what are the problems you have faced during tracing the chains?
344. If you have async reset how do you handle while stiching?
347. How do you initialize the flop if it doesn’t have reset pin?
349. Did you face any problem with negative delays in SDF?
350. If you have negative delay how do you handled during simulation?
351. Did you seen -negtive setup and hold information in the library file and what are those?
Why negative delays?
353. How do you handle clocks during stuck-at and transition faults?
356. Did you face any problem with ATPG coverage and how you have solved?
357. During memory BIST verification did you used production and diagnostic mode?
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358. Is there any other way that we confirm which memory is failing and why without seeing
waveforms?
362. How mbist was being enabled? (jtag or any other means) and working of mbist
controller mbist_done and fail operation w.r.t combiner DID i implemented datalogger
circuit? What sequence you followed for mbist?
364. Explain the stuck at faults for a 2 - input AND gate andpatttern for detecting a@0?
365. Any issues faced in chain simulation? How you corrected it?
367. How many chains in your design and flops per chain
369. Wgat was the purppose of converting all chains into 1 chain
373. How was scan pins were shared and its working if bidis?
374. In scan insertion, you have 2 clock domain and one scan chain. will you face any issue in
this case?
376. In LOC if you have problem in scan_en toggling, how will you take care?
378. If you have low test coverage, how will you debug?
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380. In a single flop who's clock line is connected both clock input and D input, what is this
violation how will you fix this in the ATPG?
381. In a single flop, 'Q' output has 'X' value , how will you debug this? (in both timing and
notiming)
382. How you did the MBIST verification (writing test bech and CMBIST)
384. At the tester side MBIST is failing, how will you debug which memory is failing?
388. How you verified JTAG (tool used for this verification)
390. Explain about the BSDL file, what are all the information you get from BSDL file?
392. If you have BC7 cell in the design how will you test this cell?
393. If you have a user defined cell, how will you handle this?
394. What is your goal? In which domain you would like to work.
395. How do you handle both negedge and posedge flops? Explain the reasons?
398. How will u handle multiple clock domains in SCAN and ATPG?
401. In TDL , if you want to insert dummy cycles before and after capture pulse , what u do in
fastscan ? (Adding dummy cycles in testproc file)
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403. Explain the diagnostic operation in MBIST?
416. Explain, how will handle multiple taps in a design 24)what is bypass register length in
when 2 taps connected in seriel?
420. Are there any repairable memories in the design & will you consider those memories also
while doing controller partioning?
422. How the data logger will shift out the data?
426. How will you test the MBIST? If there is any timing issue how will you handle it?
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427. In which part will you insert pipeline registers?
431. Is there any mandatory opcode for any instruction? Why its all ones for Bypass?
432. How many number of clock domains & scan chains are in your design?
435. What is meant by transition faults? Which will cause the transition defect?
438. If there is any defect in combinational logic thats slow functioning & other is functioning
fast, how will you find out?
440. How will you handle the neg edge flops in the design?
441. If we put posedge flops in the beginning of the scan chain what will happen?
442. Have you done coverage analysis?How did you improve the coverage
444. Are you aware of dath path & control path implementation?
446. What was the complexity of the projects you have done so far?
Here, one should explain about No. of diffrent clock domains, No. of memories,
No. of MBIST controllers, PLL Clocking Scheme etc. depending on projects in the resume.
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1. Module Level.
Problems in simulation will arise at this level, mainly due to mismatch between the Memory
models.
MBIST / ATPG Memory Model will be used to generate the MBIST Controller Logic, by
MBIST Generation tool (e.g. MBISTArchitect).
Whereas, Verilog Memory Model will be used by simulator in MBIST Verification phase.
These two Models should match with each other in describing the memory.
2. Top Level.
Here, problems may arise due to improper hook-up of MBIST Controller logic with J-TAG
circuitary.
448. If you have mismatch in simulation, how do you go about it? (How to Debug it?)
In case of mismatch in Module level simulation, we will check the dofiles for MBIST Logic
Generation. We will check if algorithms were correctly mentioned. Also, we will check if
MBIST / ATPG Memory Model and Verilog Memory Model matches with each other.
In case of mismatch in top level simulation, we will check the top J-TAG hook-up with
MBIST Logic. Also, we will check our "clock generation scheme". Most of the time, the
simulation will fail because of clock issues. Say, we have a PLL inside our design, and we
didn't wait till PLL gets locked up to the rated frequency; then we can have problems in
simulation.
Hold Time Violation in general is due to mismatch between the clock edges at connected
FlipFlops. These violations will come up mostly due to the clock skew.
MBIST eases the Memory testing. It takes care of Pattern Generation to check the memories.
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451. It takes care of feeding those patterns to deeply embedded memories in TEST MODE.
(Localized MBIST Controllers and Collars) .It takes care of at-speed memory testing. It
reduces the tester operations required to test the memory. As with MBIST; tester only
provides clock, enable signals and then waits for fail or test done signals. (With Intgration of
MBIST with J-TAG, even enable signals are fed through J-TAG.) Solves the problem of
deterministic ATPG for memories. Hence, ATPG work for memories is saved. It is more
suitable to target memory related faults, like neighborhood pattern sensitive faults.
452. Why is the Collar needed? Can you have any logic other than the Muxes in the Collar?
The basic function of Collar is to diffrentiate between Functional Memory Signals and Test
Memory Signals; and feed memory with proper signals in TEST MODE and FUNCTIONAL
MODE.
454. The Bypass ciruit is the mechanism by which we can gain OBSERVABILLITY on Input
Side and CONTROBILLITY on output side of Memories in ATPG Mode; which is
otherwise very difficult to obtain. Draw the Bypass circuitry. is the FlipFlops, driving data
output signals of memories (Thus, achieving CONROLABILITY on Output side of
Memories); fed by Ex-OR Logic driven by Input signals of memories (Thus, achieving
OBSERVABILITY on Input side of Memories).
455. Why do we need the flops in the bypass circuitry? Can we do away with the flops of the
bypass circuitry? What will be its impact on the design?
We certainly require flops in our bypass circuit. These flops we will be stitching in our scan
chains; to gain controllability and observability around Memories.
456. Can we go for scan in case of memories? whycant we go for scan in case of memories?
Deterministic ATPG is very difficult in case of Memories. Also, some memory faults are
difficult to target using conventional scan methodology. (e.g. Neighbourhood Pattern
sensetive faults) Testing of Memories at-speed will be a issue. Tester overhead will increase
to impractical level. No. of Patterns can also be the issue.
457. If you do not have the bypass circuitry in the MBIST; how will you handle the memory
in scan and atpg?
Say you are not allowed to introduce any extra logic around the memory during scan, how
will you gain coverage of the downstream logic being driven by the memory output. We will
loose coverage around the memories then.
458. What was the memory configurations for which mbist were done? How many bist
controllers were used? What was the strategy?
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This is to be answered with respect to: Single Port / Double Port / Multiport Memories.
Frequency of operation of Memories. Placement of Memories and level of embedding.
Repair Mechanism present or not, etc..
MBIST insertion can be done at RTL level or Gate level. On RTL Level, it can be manual or
using tools like MBISTArchitect or BISTINPLACE. On gate Level, it can be using tools like
BISTINPLACE.
460. Please write the MBIST Architecture of single controller with mutiple memories and
explain how you insert this.
It is to be answered with respect to: If MBIST Controller was testing the Memories in
SERIAL or PARALLEL Fashion. And then, how the memories were portmapped to get
connected to MBIST Controller, through collar.
Collar selects between TEST MODE and FUNCTIONAL MODE signals to reach to
Memory; depending on mode.
462. If you have a situation like memories are near or far in the netlist, what is your strategy
for MBIST insertion? Explain.
We will always try to group nearer memories; so that only one controller can take care of
their testing.
463. What problems you can face when Multiple memories with single controller executing in
parallel? Impact of this on the design?
The main problem will be the power consumption in IC, when controller is run in parallel.
When controller runs in parallel; there will be many transitions inside IC. This is going to
dissipate lot of power, and if it exceeds beyond rated power consumption of chip; that may
be hazardous to the chip.
Module Level Testbench was generated by MBISTArchitect Tool. Top Level Testbench was
generated by CMBIST Tool. One can also generate the testbench manually on both the
levels.
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466. Which takes more time sequential or parallel testing of memories?
467. Sequential testing of memories takes more time than the parallel testing.
469. How many clock domains where there in your design & how it was handled during scan
chain ?
470. No. of scan chains & scan chain length in the design.
473. Individual clock domain frequencies for TFT & their coverage .
475. For MBIST how many memories & controllers in the design , based on what you chose
the controllers?
477. What approach was used (parallel / Serial) while testing memories?
479. Strategy & test procedure followed while testing the controller.
481. Did you do Gate level simulation for ATPG & issues faced?
482. Knowledge of skills (like Perl scripting, C modeling if mentioned in the resume ) ?
483. What is the HDL language used & your comfort level (Verilog / VHDL ) ?
Ans: Explained, In DC mode using with clock gating and in DC_NOCG using without clock
gating.
486. What is the use of clock gaters in design? Why they are keeping?
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Ans: Explained, to reduce the power dissipation, we are using clock gaters in design. Power
dissipation p= ½ cv2 f.(clock frequency =f)
Ans: I drew the wave forms; explanation was not much clear from my side.
Ans: I explained in DC mode SE is always “1” so we can not cover EN logic side faults. so
we are targeting EN logic side faults in DC_NOCG.
493. What faults are targeting in NOCOMP mode (draw any structure)
Ans: I explained we are using 13 bit UDR and for compression mode compressb is 0 and in
uncompression mode using 1. We can cover SA0 faults. (still more explanation was
expected by the interviewer)
496. What are the issues faced during timing simulation and how you resolved?
1) setup violation:
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how to avoid this ?
ans: increase delay in data path, increase delay in clock path of launch flop (by adding delay)
than capture flop.
(3). netlist structure issue between pre-layout and post-layout netlist faced in SERIALS0
ans: yes. increase delay in clock path of launch flop (by adding delay) than capture flop.
ans: 1. memory repairable process. The fault location of the entire column in the memory
are replaced with good redundancy column. Qualcom have column redundancy memories. If
failed a ROM in Tester, observed that delivered signature of ROM was wrong. Regenerated
signature with correct data and delivered to PE.
499. In what are the different phases the silicon will be tested?
ans: phase0: target pass from any one of the LV(low votage), NV(nominal voltage),
HV(high voltage)
500. How the memory bist logic works ? What are the blocks inside BIST controller and how
it is working for different algorithm?
ans: 1. FSM, address generator, data generator, control signals generator, comparator, etc..
2. FSM will generate addr, data, control signals based on algorithm. The read data from
memory and the expected data from BIST logic are XNOR-ed to ensure both are same.
501. Can directly test the memory using tester instead using BIST logic ?
502. Other than BIST, what are the ways to test the memories ?
ans: Through ATPG we can test the faults on memory ports. But can not target the faults on
all the memory cells.
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503. If a memory is failing on post silicon, what you do?
ans: find the failing location using FAT(Failure Analysis Test) and replace the fault cell with
good spare cell.
505. What are the faults and how you are targeted those faults in ATPG ?
ans:transition and stuck-at faults. explained about various modes of ac and dc...
ans: write data into memory at NV(nominal voltage) and dip the NV for some time then
again read data from the memory at NV to ensure data is retained in memory.
507. What are the different algorithms used to test memories? Describe working of each
algorithm? what kind faults are captured and not captured in each algorithm ?
fauts: stuck-at, transition, coupling, address decoding fault, neighourhood transition fault,
etc..
508. Memory test is passing from your side. But the functional team says memory is not
behaving properly. What you do ?
ans: we ask them which address location is failing and what kind data is mismatching when
read back. based on that we try with different algorithm to test the memories.
509. How to identify base cell and neighborhood cells from memory.
ans: surrounding cells have unique values and base cell have different value.
510. What is the difference between timing and no-timing simulation? What happen if no-
timing simulation run with high frequency ?
Explained in detail about ET Flow process – Starting with Build model till commit the last
mode.
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512. PMC multipass flow details?
After generating the PFT, will do fault simulation to determine which faults the patterns
detect. Thus we can evaluate the quality of a test set.
It is process to reduce the overlapped stuck at faults. Two types of fault collapsing
techniques:
1.Equivalence fault collapsing: Two faults of a Boolean circuit are called equivalent if they
have exactly the same set of tests and have identical output functions.
2. Dominance fault collapsing: If all tests of fault F1 (in PI) detect another fault F2 (in PO),
then F2 is said to dominate F1, and fault F2 can be deleted.
The compression in DFT is basically used for tester application time & test data volume. It is
the reduction in these parameters compared to a non-compressed scan chain. We will be
opting compression technique only when there are more number of scan chains compared
with limited number of io pins.
Two structural fault model are stuck-at fault model & transition fault model. Stcuk-at fault
affect the logical behavior of the system but transition faults affect the timing behavior of the
design. To test such delay inducing faults, scan based transition fault testing techniques are
usually used. Two existing methods are LOC & LOS.
In los the transition is launched during the last shift cycle from the scan path, the SE will be
high during this time and then immediately turned off to capture the response during the
capture cycle.
In loc SE wiil be turned off after loading; transition is launched at functional frequency & it
will capture immediately during capture cycle. Then SE willtrun ON and the captured value
will shift it out.
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518. Tell me about coverage analysis you have done in your project in detail?
519. What are the various methods you have opted to improve it over 99%?
520. What are the post silicon activities you have done?
Explained about CFV what I did for TORRES, CONDOR & TORRES_MCM – How to
make nci file and inputting it.
Explained in detail about ET Flow process – Starting with Build model till commit the last
mode.
Full scan is a scan design methodology that replaces all storage elements in the design with
their scannable equivalents and connects them in to scan chains.
But in partial scan, only a certain percentage of storage elements are replaced & connected to
scan chain. This is mainly due to constrains on area & timing.
524. Why they are topup together & consider for total fault coverage?
The compression in DFT is basically used for tester application time & test data volume. It is
the reduction in these parameters compared to a non-compressed scan chain.
We will be opting compression technique only when there are more number of scan chains
compared with limited number of io pins.
526. How you identify & fix compression ratio in your particular design?
Test coverage is the ratio of percentage of detected faults by all testable faults.
Fault coverage is the ratio of percentage of detected faults by all allfaults(full faults).
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There are three main types of defect categories: functional, IDDQ & at-speed. in which
IDDQ testing measures supply current going through the circuit in the quiescent state.
529. During path-delay, what is the min pattern number you have noticed?
530. What are all violations you have noticed & how you fixed them?
531. What Are all the debugging technique you have implemented for Coverage
improvements.
With a given test vector, we need to predict the logic values in the good circuit or fault-free
circuit at all the circuit outputs.
We are running simulations at slow frequency for only SA faults.. for At speed testing, we
require functional frequency.
534. What is an sdf file ?why you are using it ? how it looks ?
Sdf file is the standard delay format for timing simulation. It is interpret the different timing
of data.
535. What re all the debugging technique you have used in timing simulation issues?
A scan chain is getting broken during scan stitching. The effective way to test the scan chains
to detect any broken scan chains is to do scan flush. A chain test simply shifts a sequence
through the entire scan chain without exercising the functional circuitry.
537. What are all practical approaches you will take if found scan chain broken?
The effective way to test the scan chains to detect any broken scan chains, is to do scan flush.
A chain test simply shifts a sequence through the entire scan chain without exercising the
functional circuitry.
538. What are the disadvantages of MBIST logic you have noticed?
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542. how will you test the isolation cells, level shifters and the glue logic if there are multiple
power domains
543. If there are two functional clocks how will you to transition fault anaylysis--I told I shall
try to control them from through the STIL file
544. What are the issues you ran into when working
545. how will you do fault grading ? Using the functional patterns use the same so that you
can reduce the total patterns
548. were there multiple scan clocks , if so how did u take care of the DFT approach
549. If there are clock gating logic how will you test it ?
552. Have you worked on compression--If yes then she said ok.
553. SOC level DFT how was the pattern generation take care..
556. If there are multiple functional clocks how will be the launch and capture be done.
557. If there are multiple clock domains how will you do transition or stuck-at and what other
fault models will you use
559. Why we do simulation, even though we generate the patterns on the same scan stiched
netlist. What are we expecting from simulation, as it is not the actual hardware we are
testing?
560. Why people prefer doing serial simulation though it takes very long time compared to
parallel simulation. Tester doesn't support parallel simulation. Still we don't prefer parallel
simulation on the netlist, why?
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561. What are the disadvantages of the MBIST on the chip other than the extra logic
overheard? 4. Why the coverage for the transition faults is always less than Stuck-at faults?
563. How do we deduct to a particular net or node from a failure on the tester?
564. What are the main things to look for to improve the coverage?
566. What is the % overhead of the MBIST? 10. what is the typical vector count which gives
the maximum coverage?
568. What is the reason for increase in pattern count for compressed mode?
Because the chain lenght is small,more number of chains exist.More number of control bits
toidentify faults in EDT.
569. The actual compression achieved will be less than the specified compression factor.Why?
Because of extra cycles(initialization cycles) in EDT.
572. How scan chains are handled from a 3rd party IP in the chip?By using "add subchain
command"
573. Use of LOCKUP latch? a) When two clock domains exist , b) When one domain with
different edges trigger the flops,c) When clock skew is more than half cycle of hold time.
574. Difference between LOS and LOC? Look for the basic differences in the guide. Other
difference is that in LOS,there is a chance of testing unrequired functional paths because of
last shift is done when SE=1.
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575. Scan considerations required for At-speed test?
a) OCC that supports and generate 2 pulses for capture cycle. b) Free running functional
clocks.
576. What are advantages of LOS and disadvantages when compared to LOC?
579. Timing issues specific to scan chain clock domain mixing? Hold issues.Use lockup latch
to avoid them.Clock skew to be decreased.
580. How to avoid hold issues when scan chain is stitched from +ve edge to –ve edge flop?
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593. How do you fix the Hold/Setup time violation
594. Explain Test Cost ?
595. JTAG Basics (TAP Controller, Inputs, 16 States etc...).
596. Memory Testing Basics (Main components and how they interact)
597. How do you perform Binary Search in Scan chain? ( Diagnostics ) Different methods ?
598. wht is the diffrence between verification and dft?
599. difference between defect, fault and failure?
600. wht is observability and controlability?
601. wht is scan?
602. how can we perform scan operation?
603. wht is serial and parallel loading?
604. wht is the difference between sequential and combinational atpg?
605. wht is atpg?
606. wht is drc violation?
607. wht is fault model?
608. how many fault models are there?
609. wht is scan stiching?
610. different command option….
611. wht is bist?
612. wht is bisa?
613. wht is bscan?
614. How is logic transition fault is different from memory transition fault.
615. What are RAM sequential patterns?
616. Diff b/w Named Capture Precedures and Clock Procedures
617. What are the typical scan clock frequencies?
618. How much is your design count? Complexity?
619. What is possible cause of simulation mismatches when you simulae the generated ATPG
patterns? what is right way to debug them?
620. how do you solve coverage issues?
621. what is normal mode and at-speed mode?
622. what is mbist?
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623. what is dft coverage? how to get high dft coverage?
624. normal flow for dft ?
625. Whats the difference between structural and functional vectors?
626. What the major problem faced in dft with tri-state buffers and how is it resolved.
627. Which is advantageous, launch at shift or capture launch.
628. How to achieve high fault coverage. How to increase it.
629. latch – how is it used in dft for sync two clock domains.
630. Fault types?
631. Does the dft vectors test the functionality of the design also?
632. What does test procedure files have?
633. How is logic transition fault is different from memory transition fault.
634. What are RAM sequential patterns?
635. Diff b/w Named Capture Precedures and Clock Procedures
636. What are the typical scan clock frequencies?
637. How much is your design count? Complexity?
638. What is possible cause of simulation mismatches when you simulae the generated ATPG
patterns? what is right way to debug them?
639. How do you solve coverage issues?
640. Whats the difference between structural and functional vectors.
641. What the major problem faced in dft with tri-state buffers and how is it resolved.
642. How to achieve high fault coverage. How to increase it.
643. Does the dft vectors test the functionality of the design also?
644. What is scannability checking.
645. Give three Clock drc rules and how to fix them.
646. What does test procedure files have?
647. What problems u faced while inserting test points.
648. what's the different using sync reset or async reset?
649. what's the affect for the coveray of the two reset?
650. How to do IDDQ below 90nm?
651. What is the DFT process for an ASIC?
652. What factors that affect scan chains?
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653. What is the purpose of DFT?
654. What are the major cost factors of DFT and what do you do to lower costs?
655. What are the errors/problems that occur during the DFT process and how do you resolve
them?
656. What tests do people use for DFT and what are their purpose?
657. How do clock domains affect DFT and how to you handle them?
658. Given a small circuit (see diagram) how would you generate tests for it?
659. for path-delay pattern, what is the min pattern number needed?
660. For mbist , what is the min pattern needed? 0/1; &|a/5
661. Why we do simulation, even though we generate the patterns on the same scan stiched
netlist. What are we expecting from simulation, as it is not the actual hardware we are
testing?
662. Why people prefer doing serial simulation though it takes very long time compared to
parallel simulation. Tester doesn't support parallel simulation. Still we don't prefer parallel
simulation on the netlist, why?
663. what are the disadvantages of the MBIST on the chip other than the extra logic
overheard?
664. Why the coverage for the transition faults is always less than Stuck-at faults?
665. Will MBIST be part of Scan logic?
666. How do we deduct to a particular net or node from a mismatch on the tester?
667. What are the main things to look for to improve the coverage?
668. why latches are made transparent during scan?
669. what is the % overhead of the MBIST logic?
670. what is the typical vector count which gives the maximum coverage?
671. During ATPG we use some models, and during simulation other one, the ATPG could
generate wrong patterns due to inconsistency in the model.
672. with serial simulation, you check also the worst hold time constraints.
673. hardcoded Bist is limited to a type of checks, if you need to extend or reduce it, you could
not.
674. well you do not check the same stuff, no?
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675. To improve the coverage, you could report the uncovered faults, and after you need to
analysis this list.
676. which latch?, for the latch used for clock gating, need only to be transparent during the
shift phase, during the capture, this one could used the functional mode, to improve the
coverage.
677. That depend of the MBIST strategy, I means, did you want to have a BIST engine for
each memory, or for a group....
678. Too large question, that depend of your design, I means ratio combinational versus flop,
and which coverage you want to reach?
679. What constraints should be set and considerations should be taken while generation of the
ATPG patterns?
680. What common Interview Questions are asked for the Test Pattern Generation and
TetraMax usage?
681. wht is the diffrence between verification and dft?
682. difference between defect, fault and failure?
683. wht is observability and controlability?
684. wht is scan?
685. how can we perform scan operation?
686. wht is serial and parallel loading?
687. wht is the difference between sequential and combinational atpg?
688. wht is atpg?
689. wht is drc violation?
690. wht is fault model?
691. how many fault models are there?
692. wht is scan stiching?
693. different command option….
694. How is logic transition fault is different from memory transition fault.
695. What are RAM sequential patterns?
696. Diff b/w Named Capture Precedures and Clock Procedures
697. What are the typical scan clock frequencies?
698. How much is your design count? Complexity?
36
699. What is possible cause of simulation mismatches when you simulae the generated ATPG
atterns? what is right way to debug them?
700. how do you solve coverage issues?
701. what is normal mode and at-speed mode?
702. what is mbist?
703. what is dft coverage? how to get high dft coverage?
704. normal flow for dft ?
705. Whats the difference between structural and functional vectors?
706. What the major problem faced in dft with tri-state buffers and how is it resolved.
707. Which is advantageous, launch at shift or capture launch.
708. How to achieve high fault coverage. How to increase it.
709. latch – how is it used in dft for sync two clock domains.
710. Fault types?
711. Does the dft vectors test the functionality of the design also?
712. What does test procedure files have?
713. I have three memories in my design. I set_scan_element false for them when do DFT.
But it still report that :
Warning:Cell VPOST_FILTER/FILTER_C_LINE_BUFFER/T018SRF3X_368X16M4 has
no function specification.
Warning: Cell VPOST_FILTER/FILTER_Y_LINE_BUFFER/T018SRF3X_720X8M4 has
no function specification.
Warning: Cell VPOST_OSD/BIST_RA1SH_SR256X24S/T018SRF3X_256X24M4 has no
function specification.
Warning: the required number of observe test points can not be met. (TEST-147)
Warning: Violations occurred during test design rule checking. (TEST-124)
How to solve this kind violation?
714. When i write the netlist that has been inserted scan chains, there are "asign" statement in
my netlist. I have try to remove them from netlist and add some command like below:
set save_place [current_design]
foreach_in_collection design [ get_designs "*" ] {
current_design $design
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set_fix_multiple_port_nets -all -outputs -feedthroughs -constants -buffer_constants;
}
current_design $save_place
set_fix_multiple_port_nets -all -outputs -feedthroughs -constants -buffer_constants;
unset save_place;
But these commands can't affect the "assign" statement written in my netlist.
715. How to decide the observe and control points number?
I want to use set_testability_configuration command to set observe and control points
neumber? Who can tell me how to set it?
716. Is it recommend to have tri-state bus in the design, if so what precaution needs to be
taken during design
717. Functionally it is taken care that the existing tri-state bus drivers can never create bus
contention. Is this sufficient for Scan shift and capture? Do we need to take any extra care?
Why?
718. If the entire design is a shift register, do you need scan insertion, explain
719. How do you ignore the block which is already scan inserted from re-inserting scan?
720. What is the purpose of latches at the end of scan chains and is there any impact, explain
721. Is it recommend to have tri-state bus in the design, if so what precaution needs to be
taken during design
722. Functionally it is taken care that the existing tri-state bus drivers can never create bus
contention. Is this sufficient for Scan shift and capture? Do we need to take any extra care?
Why?
723. If the entire design is a shift register, do you need scan insertion, explain
724. How do you ignore the block which is already scan inserted from re-inserting scan?
725. What is the purpose of latches at the end of scan chains and is there any impact, explain
726.
727.
728.
729.
730.
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