dt

TSB621, TSB622, TSB624

Datasheet

Low power, 1.7 MHz, rail-to-rail output, 36 V operational amplifier

Features
• Low offset voltage: 1 mV max. @ 25 °C
• Low current consumption: 375 μA max. / operator @ 36 V
TSSOP14 SO14 • Wide supply voltage: 2.7 to 36 V
• Gain bandwidth product: 1.7 MHz
• Unity gain stable
• Rail-to-rail output
MiniSO8 SO8 • Input common mode voltage incudes ground
• High ESD tolerance: 4 kV HBM
• EMI hardened
• Extended temperature range: -40 to 125 °C
SOT23-5 DFN8 (3 x 3 mm)
• Automotive qualification

Applications
• Industrial
Maturity status link • Power supplies
TSB621, TSB622, TSB624 • Automotive

Description
Related products

TSB611, For lower power The TSB621, TSB622, TSB624 are general purpose operational amplifiers featuring
TSB612 consumption an extended supply voltage operating range and rail-to-rail output. They also offer an
TSB571, excellent speed/power consumption ratio with 1.7 MHz gain bandwidth product while
For higher speed and rail- consuming less than 375 μA per operator at 36 V supply voltage.
TSB572,
to-rail inputs
TSB514 The TSB621, TSB622, TSB624 operate over a wide temperature range from -40 °C
TSB711, For a higher precision and to 125 °C making these devices ideal for industrial and automotive applications with
TSB712 speed the associated qualification.
Thanks to the small package size, the TSB621, TSB622, TSB624 can be used in
applications where space on the board is limited. It can thus reduce the overall cost
of the PCB.

DS13848 - Rev 3 - December 2022 www.st.com

For further information contact your local STMicroelectronics sales office.
 TSB621, TSB622, TSB624
Pin connections

1 Pin connections

Figure 1. TSB621 pin connections (top view)

OUT 1 5 VCC+

VCC- 2
+ -

IN+ 3 4 IN-

SOT23-5

Table 1. TSB621 pin description

Pin n° Pin name Description

1 OUT1 Output
2 VCC - Negative supply voltage
3 IN + Positive input voltage
4 IN - Negative input voltage
5 VCC Positive supply voltage

Figure 2. TSB622 pin connections (top view)

OUT1 1 8 VCC+
Out1 1 8 VCC+

IN1- 2 7 OUT2 In1- 2 7 Out2

In1+ 3 6 In2-
IN1+ 3 6 IN2-
VCC- 4 5 In2+
VCC- 4 5 IN2+

(1)
SO8 - MiniSO8 DFN8 (3 x 3)

(1) Exposed pad can be left floating or connected to ground.

Table 2. TSB622 pin description

Pin n° Pin name Description

1 OUT1 Output
2 IN1 - Negative input voltage
3 IN1 + Positive input voltage
4 VCC - Negative supply voltage
5 IN2 + Positive input voltage
6 IN2 - Negative input voltage
7 OUT2 Output
8 VCC + Positive supply voltage

DS13848 - Rev 3 page 2/35

 TSB621, TSB622, TSB624
Pin connections

Figure 3. TSB624 pin connections (top view)

SO14 - TSSOP14

Table 3. TSB624 pin description

Pin n° Pin name Description

1 OUT1 Output
2 IN1 - Negative input voltage
3 IN1 + Positive input voltage
4 VCC + Positive supply voltage
5 IN2 + Positive input voltage
6 IN2 - Negative input voltage
7 OUT2 Output
8 OUT3 Output
9 IN3 - Negative input voltage
10 IN3 + Positive input voltage
11 VCC - Negative supply voltage
12 IN4 + Positive input voltage
13 IN4 - Negative input voltage
14 OUT4 Output

DS13848 - Rev 3 page 3/35

 TSB621, TSB622, TSB624
Absolute maximum ratings and operating conditions

2 Absolute maximum ratings and operating conditions

Table 4. Absolute maximum ratings

Symbol Parameter Value Unit

Vcc Supply voltage (1) 40 V

Vid Differential input voltage (2) ± Vcc V

Vin Input voltage (Vcc-) -0.2 to (Vcc+) +0.2 V

Iin Input current (3) 10 mA

Tstg Storage temperature -65 to 150 °C

Tj Junction temperature 150 °C

Thermal resistance junction to ambient (4) (5)

SO8 125

MiniSO8 190

Rth-ja DFN8 3x3 WF 40 °C/W

SOT23-5 250

SO14 105

TSSOP14 100

Human Body Model (HBM TSB621, TSB622) (6) 4000

ESD Human Body Model (HBM TSB624) (6) 3000 V

Charged Device Model (CDM) (7) 1500

1. All voltage values, except differential voltage, are with respect to network ground terminal.
2. The differential voltage is the non-inverting input terminal with respect to the inverting input terminal.
3. Input current must be limited by a resistor in series with the inputs.
4. Rth are typical values.
5. Short-circuits can cause excessive heating and destructive dissipation.
6. According to JEDEC standard JESD22-A114F.
7. According to ANSI/ESD STM5.3.1.

Table 5. Operating conditions

Symbol Parameter Value Unit

Vcc Supply voltage 2.7 to 36 V

Vicm Common mode voltage on input pins (Vcc-) -0.1 to (Vcc+) -1 V

T Operating free-air temperature range -40 to 125 °C

DS13848 - Rev 3 page 4/35

 TSB621, TSB622, TSB624
Electrical characteristics

3 Electrical characteristics

Table 6. Electrical characteristics VCC+ = 2.7 V, Vcc- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to VCC/2 (unless
otherwise specified)

Symbol Parameter Conditions Min. Typ. Max. Unit

DC performance
T = 25 °C -1 1
VIO Input offset voltage mV
Tmin < T < Tmax -1.6 1.6
|∆ VIO/∆T| Input offset voltage drift Tmin < T < Tmax 2 µV/°C

T = 25 °C 15 30
IIB Input bias current
Tmin < T < Tmax 45
nA
T = 25 °C 3 10
IIO Input offset current
Tmin < T < Tmax 15
Vicm = - 0.1 to VCC -1 V,
Common mode rejection ratio: 90 115
CMR VOUT = VCC/2 dB
20 log (ΔVicm/ΔVio)
Tmin < T < Tmax 85
VOUT = 0.5 V to (VCC -0.5 V) 90 105
AVD Large signal voltage gain dB
Tmin < T < Tmax 82
High-level output voltage, T = 25 °C 35 46
VOH
VOH = VCC - VOUT Tmin < T < Tmax 55
mV
T = 25 °C 50 60
VOL Low-level output voltage
Tmin < T < Tmax 75
VOUT = VCC 20 27
Isink
Tmin < T < Tmax 10
IOUT mA
VOUT = 0 V 20 28
Isource
Tmin < T < Tmax 8
No load, VOUT = VCC/2 280 330
ICC Supply current (per channel) µA
Tmin < T < Tmax 400
AC performance
RL = 10 kΩ, CL = 100 pF 1 1.45
GBP Gain bandwidth product MHz
Tmin < T < Tmax 0.7
Φm Phase margin 45 degrees
RL = 10 kΩ, CL = 100 pF
Gm Gain margin 18 dB

T = 25 °C 0.30 0.53
SR Slew rate V/µs
Tmin < T < Tmax 0.20
EN Equivalent input noise voltage f = 1 kHz 30 nV/√Hz

fin = 1 kHz, Gain = 1, RL = 100 kΩ,

THD+N Total harmonic distortion + noise Vicm = (Vcc -1 V) / 2, 0.005 %

BW = 22 kHz, VOUT = 1 Vpp

CS Channel separation f = 1 kHz 120 dB

trec Overload recovery time 2 µs

DS13848 - Rev 3 page 5/35

 TSB621, TSB622, TSB624
Electrical characteristics

Table 7. Electrical characteristics VCC+ = 12 V, VCC- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to VCC/2 (unless
otherwise specified)

Symbol Parameter Conditions Min. Typ. Max. Unit

DC performance
T = 25 °C -1 1
VIO Input offset voltage mV
Tmin < T < Tmax -1.6 1.6
|∆ VIO/∆T| Input offset voltage drift Tmin < T < Tmax 2 µV/°C

T = 25 °C 15 30
IIB Input bias current
Tmin < T < Tmax 45
nA
T = 25 °C 3 10
IIO Input offset current
Tmin < T < Tmax 15
Vicm = - 0.1 to VCC -1 V,
Common mode rejection ratio: 100 130
CMR VOUT = VCC/2 dB
20 log (ΔVicm/ΔVio)
Tmin < T < Tmax 95
VOUT = 0.5 V to (VCC -0.5 V) 98 115
AVD Large signal voltage gain dB
Tmin < T < Tmax 90
High-level output voltage, T = 25 °C 68 80
VOH
VOH = VCC - VOUT Tmin < T < Tmax 95
mV
T = 25 °C 86 100
VOL Low-level output voltage
Tmin < T < Tmax 125
VOUT = VCC 25 35
Isink
Tmin < T < Tmax 10
IOUT mA
VOUT = 0 V 30 37
Isource
Tmin < T < Tmax 15
No load, VOUT = VCC/2 295 345
ICC Supply current (per channel) µA
Tmin < T < Tmax 420
AC performance
RL = 10 kΩ, CL = 100 pF 1.1 1.55
GBP Gain bandwidth product MHz
Tmin < T < Tmax 0.8
Φm Phase margin 45 degrees
RL = 10 kΩ, CL = 100 pF
Gm Gain margin 18 dB

T = 25 °C 0.35 0.58
SR Slew rate V/µs
Tmin < T < Tmax 0.20
EN Equivalent input noise voltage f = 1 kHz 30 nV/√Hz

fin = 1 kHz, Gain = 1, RL = 100 kΩ,

THD+N Total harmonic distortion + noise Vicm = (VCC -1 V) / 2, 0.005 %

BW = 22 kHz, VOUT = 1 Vpp

CS Channel separation f = 1 kHz 120 dB

trec Overload recovery time 2 µs

DS13848 - Rev 3 page 6/35

 TSB621, TSB622, TSB624
Electrical characteristics

Table 8. Electrical characteristics VCC+ = 36 V, VCC- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to Vcc/2 (unless
otherwise specified)

Symbol Parameter Conditions Min. Typ. Max. Unit

DC performance
T = 25 °C -1 1
VIO Input offset voltage mV
Tmin < T < Tmax -1.6 1.6
|∆ VIO/∆T| Input offset voltage drift Tmin < T < Tmax 2 µV/°C

T = 25 °C 15 30
IIB Input bias current
Tmin < T < Tmax 45
nA
T = 25 °C 3 10
IIO Input offset current
Tmin < T < Tmax 15
Vicm = -0.1 to VCC -1 V,
Common mode rejection ratio: 105 135
CMR VOUT = VCC/2 dB
20 log (ΔVicm/ΔVio)
Tmin < T < Tmax 100

Supply voltage rejection ratio: VCC = 4.5 to 36 V, Vicm = 0 V 100 124

SVR dB
20 log (ΔVCC/ΔVio) Tmin < T < Tmax 95
VOUT = 0.5 V to (VCC -0.5 V) 105 120
AVD Large signal voltage gain dB
Tmin < T < Tmax 100
High-level output voltage, T = 25 °C 110 140
VOH
VOH = VCC - VOUT Tmin < T < Tmax 180
mV
T = 25 °C 125 150
VOL Low-level output voltage
Tmin < T < Tmax 195
VOUT = VCC 35 45
Isink
Tmin < T < Tmax 15
IOUT mA
VOUT = 0 V 35 45
Isource
Tmin < T < Tmax 25
No load, VOUT = VCC/2 310 375
ICC Supply current (per channel) µA
Tmin < T < Tmax 420
AC performance
RL = 10 kΩ, CL = 100 pF 1.2 1.7
GBP Gain bandwidth product MHz
Tmin < T < Tmax 0.95
Φm Phase margin 45 degrees
RL = 10 kΩ, CL = 100 pF
Gm Gain margin 18 dB

T = 25 °C 0.35 0.60
SR Slew rate V/µs
Tmin < T < Tmax 0.25
EN Equivalent input noise voltage f = 1 kHz 25 nV/√Hz

fin = 1 kHz, Gain = 1, RL = 100 kΩ,

THD+N Total harmonic distortion + noise Vicm = (VCC - 1 V) / 2, 0.005 %

BW = 22 kHz, VOUT = 1 Vpp

CS Channel separation f = 1 kHz 120 dB

trec Overload recovery time 2 µs

DS13848 - Rev 3 page 7/35

 TSB621, TSB622, TSB624
Typical performance characteristics

4 Typical performance characteristics

Figure 4. Supply current vs. supply voltage Figure 5. Input offset voltage distribution at VCC = 2.7 V

Figure 6. Input offset voltage distribution at VCC = 12 V Figure 7. Input offset voltage distribution at VCC = 36 V

DS13848 - Rev 3 page 8/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 8. Input offset voltage vs. temperature at Figure 9. Input offset voltage temperature variation
VCC = 36 V distribution at VCC = 36 V

Figure 10. Input offset voltage temperature variation Figure 11. Input offset voltage vs. common-mode voltage
distribution at VCC = 36 V at VCC = 36 V

DS13848 - Rev 3 page 9/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 12. Common-mode reject. ratio CMR at VCC = 5 V Figure 13. Supply voltage rejection ratio SVR at VCC = 5 V

Figure 14. Input bias current vs. temperature Figure 15. Bode diagram at VCC = 2.7 V

DS13848 - Rev 3 page 10/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 16. Bode diagram at VCC = 12 V Figure 17. Bode diagram at VCC = 36 V

Figure 18. Overshoot vs. capacitive load at VCC = 36 V Figure 19. Phase margin vs. capacitive load at VCC = 2.7 V

DS13848 - Rev 3 page 11/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 20. Phase margin vs. capacitive load at VCC = 12 V Figure 21. Phase margin vs. capacitive load at VCC = 36 V

Figure 22. Short-circuit current vs. temperature Figure 23. Output source current vs. output voltage at
VCC = 2.7 V

DS13848 - Rev 3 page 12/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 24. Output source current vs. output voltage at Figure 25. Output source current vs. output voltage at
VCC = 12 V VCC = 36 V

Figure 26. Output sink current vs. output voltage at Figure 27. Output sink current vs. output voltage at
VCC = 2.7 V VCC = 12 V

DS13848 - Rev 3 page 13/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 28. Output sink current vs. output voltage at

VCC = 36 V Figure 29. Slew rate at VCC = 2.7 V

Figure 30. Slew rate at VCC = 12 V Figure 31. Slew rate at VCC = 36 V

DS13848 - Rev 3 page 14/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 32. Slew rate vs. temperature at VCC = 36 V Figure 33. Small signal step response

Figure 34. Maximum output voltage vs. frequency Figure 35. THD+Noise vs. frequency

DS13848 - Rev 3 page 15/35

 TSB621, TSB622, TSB624
Typical performance characteristics

Figure 36. THD+Noise vs. output voltage Figure 37. Cross talk vs. frequency

Figure 38. Equivalent input noise voltage vs. frequency

DS13848 - Rev 3 page 16/35

 TSB621, TSB622, TSB624
Package information

5 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.

DS13848 - Rev 3 page 17/35

 TSB621, TSB622, TSB624
SOT23-5 package information

5.1 SOT23-5 package information

Figure 39. SOT23-5 package outline

E
A1

e1 D

5xb

5x
0.10 C
A2

s
C

E1
SOT23-5

Table 9. SOT23-5 mechanical data

Milimeters Inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.

A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.15 1.30 0.035 0.045 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.90 0.114
E 2.80 0.110
E1 1.60 0.063
e 0.95 0.037
e1 1.90 0.075
L 0.30 0.45 0.60 0.012 0.018 0.024
θ 0 4 8 0 4 8

1. Values in inches are converted from mm and rounded to 4 decimal digits.

DS13848 - Rev 3 page 18/35

 TSB621, TSB622, TSB624
SOT23-5 package information

Figure 40. SOT23-5 recommended footprint

1.10

1 5

0.95

3 4 0.60

2.30

DS13848 - Rev 3 page 19/35

 TSB621, TSB622, TSB624
SO8 package information

5.2 SO8 package information

Figure 41. SO8 package outline

0016023_So-807_fig2_Rev10

Table 10. SO8 mechanical data

mm
Dim.
Min. Typ. Max.

A 1.75
A1 0.10 0.25
A2 1.25
b 0.31 0.51
b1 0.28 0.48
c 0.10 0.25
c1 0.10 0.23
D 4.80 4.90 5.00
E 5.80 6.00 6.20
E1 3.80 3.90 4.00
e 1.27
h 0.25 0.50
L 0.40 1.27
L1 1.04
L2 0.25
k 0° 8°
ccc 0.10

DS13848 - Rev 3 page 20/35

 TSB621, TSB622, TSB624
SO8 package information

Figure 42. SO8 recommended footprint

DS13848 - Rev 3 page 21/35

 TSB621, TSB622, TSB624
MiniSO8 package information

5.3 MiniSO8 package information

Figure 43. MiniSO8 package outline

Table 11. MiniSO8 mechanical data

Dim. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 1.1 0.043
A1 0 0.15 0 0.006
A2 0.75 0.85 0.95 0.03 0.033 0.037
b 0.22 0.4 0.009 0.016
c 0.08 0.23 0.003 0.009
D 2.8 3 3.2 0.11 0.118 0.126
E 4.65 4.9 5.15 0.183 0.193 0.203
E1 2.8 3 3.1 0.11 0.118 0.122
e 0.65 0.026
L 0.4 0.6 0.8 0.016 0.024 0.031
L1 0.95 0.037
L2 0.25 0.01
k 0° 8° 0° 8°
ccc 0.1 0.004

DS13848 - Rev 3 page 22/35

 TSB621, TSB622, TSB624
MiniSO8 package information

Figure 44. MiniSO8 recommended footprint

DS13848 - Rev 3 page 23/35

 TSB621, TSB622, TSB624
DFN8 3x3 wettable flanks package information (package code: A03Y)

5.4 DFN8 3x3 wettable flanks package information (package code: A03Y)

Figure 45. DFN8 3x3 package outline and mechanical data

Table 12. DFN8 3x3 mechanical data

mm
Symbol
Min. Typ. Max.

A 0.70 0.75 0.80

A1 0.0 0.05
A2 0.10
A3 0.20 Ref.
b 0.25 0.30 0.35
D 2.95 3.00 3.05
D2 2.25 2.35 2.45
e 0.65 BSC
E 2.95 3.00 3.05
E2 1.45 1.55 1.65
L 0.35 0.45 0.55
K 0.275 Ref.

DS13848 - Rev 3 page 24/35

 TSB621, TSB622, TSB624
DFN8 3x3 wettable flanks package information (package code: A03Y)

Figure 46. DFN8 3x3 footprint data

DS13848 - Rev 3 page 25/35

 TSB621, TSB622, TSB624
SO14 package information

5.5 SO14 package information

Figure 47. SO14 package outline

DS13848 - Rev 3 page 26/35

 TSB621, TSB622, TSB624
SO14 package information

Table 13. SO14 package mechanical data

mm
Dim.
Min. Typ. Max.

A 1.75
A1 0.10 0.225
A2 1.30 1.40 1.50
A3 0.60 0.65 0.70
b 0.39 0.47
b1 0.38 0.41 0.44
c 0.20 0.24
c1 0.19 0.20 0.21
D 8.55 8.65 8.75
E 5.80 6.00 6.20
E1 3.80 3.90 4.00
e 1.27 BSC
h 0.25 0.50
L 0.50 0.80
L1 1.05 REF
0 8°

Figure 48. SO14 recommended footprint

DS13848 - Rev 3 page 27/35

 TSB621, TSB622, TSB624
TSSOP14 package information

5.6 TSSOP14 package information

Figure 49. TSSOP14 package outline

DS13848 - Rev 3 page 28/35

 TSB621, TSB622, TSB624
TSSOP14 package information

Table 14. TSSOP14 package mechanical data

mm
Dim.
Min. Typ. Max.

A 1.20
A1 0.05 0.15
A2 0.80 1.00 1.05
b 0.19 0.30
c 0.09 0.20
D 4.90 5.00 5.10
E 6.20 6.40 6.60
E1 4.30 4.40 4.50
e 0.65
L 0.45 0.60 0.75
L1 1.00
k 0° 8°
aaa 0.10

DS13848 - Rev 3 page 29/35

 TSB621, TSB622, TSB624
Ordering information

6 Ordering information

Table 15. Order code

Order code Package Packaging Marking

TSB621ILT K2K
SOT23-5
TSB621IYLT (1) K2L

TSB622IDT TSB622I
SO8
TSB622IYDT (1) TSB622IY

TSB622IST K2K
MiniSO8
TSB622IYST (1) K2L
Tape & Reel
TSB622IQ3T K2K
DFN8 3x3 WF
TSB622IYQ3T (1) K2L

TSB624IDT TSB624I
SO14
TSB624IYDT (1) TSB624IY

TSB624IPT TSB624I
TSSOP14
TSB624IYPT (1) TSB624IY

1. Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 &
Q002 or equivalent.

DS13848 - Rev 3 page 30/35

 TSB621, TSB622, TSB624

Revision history
Table 16. Document revision history

Date Revision Changes

03-Nov-2021 1 Initial release.

15-Feb-2022 2 Updated Figure 2.
Added new TSSOP14, SO14 and SOT23-5 packages in Section 5 Package information.
01-Dec-2022 3 Updated Section 1 Pin connections, Table 4. Absolute maximum ratings, phase margin typical
value in Table 6, Table 7, Table 8 and Section 6 Ordering information.

DS13848 - Rev 3 page 31/35

 TSB621, TSB622, TSB624
Contents

Contents
1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.1 SOT23-5 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2 SO8 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3 MiniSO8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.4 DFN8 3x3 wettable flanks package information (package code: A03Y). . . . . . . . . . . . . . . . . 24
5.5 SO14 package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.6 TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

DS13848 - Rev 3 page 32/35

 TSB621, TSB622, TSB624
List of tables

List of tables
Table 1. TSB621 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table 2. TSB622 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table 3. TSB624 pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 5. Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 6. Electrical characteristics VCC+ = 2.7 V, Vcc- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to VCC/2 (unless
otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 7. Electrical characteristics VCC+ = 12 V, VCC- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to VCC/2 (unless
otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 8. Electrical characteristics VCC+ = 36 V, VCC- = 0 V, Vicm = VCC/2, T = 25 °C, RL = 10 kΩ connected to Vcc/2 (unless
otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 9. SOT23-5 mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10. SO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 11. MiniSO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 12. DFN8 3x3 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 13. SO14 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 14. TSSOP14 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 15. Order code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 16. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

DS13848 - Rev 3 page 33/35

 TSB621, TSB622, TSB624
List of figures

List of figures
Figure 1. TSB621 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 2. TSB622 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 3. TSB624 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 4. Supply current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. Input offset voltage distribution at VCC = 2.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. Input offset voltage distribution at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. Input offset voltage distribution at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 8. Input offset voltage vs. temperature at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 9. Input offset voltage temperature variation distribution at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 10. Input offset voltage temperature variation distribution at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 11. Input offset voltage vs. common-mode voltage at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 12. Common-mode reject. ratio CMR at VCC = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 13. Supply voltage rejection ratio SVR at VCC = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 14. Input bias current vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 15. Bode diagram at VCC = 2.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 16. Bode diagram at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 17. Bode diagram at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 18. Overshoot vs. capacitive load at VCC = 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 19. Phase margin vs. capacitive load at VCC = 2.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 20. Phase margin vs. capacitive load at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 21. Phase margin vs. capacitive load at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 22. Short-circuit current vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 23. Output source current vs. output voltage at VCC = 2.7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 24. Output source current vs. output voltage at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 25. Output source current vs. output voltage at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 26. Output sink current vs. output voltage at VCC = 2.7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 27. Output sink current vs. output voltage at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 28. Output sink current vs. output voltage at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 29. Slew rate at VCC = 2.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 30. Slew rate at VCC = 12 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 31. Slew rate at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 32. Slew rate vs. temperature at VCC = 36 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 33. Small signal step response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 34. Maximum output voltage vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 35. THD+Noise vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 36. THD+Noise vs. output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 37. Cross talk vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 38. Equivalent input noise voltage vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 39. SOT23-5 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 40. SOT23-5 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 41. SO8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 42. SO8 recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 43. MiniSO8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 44. MiniSO8 recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 45. DFN8 3x3 package outline and mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 46. DFN8 3x3 footprint data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 47. SO14 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 48. SO14 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 49. TSSOP14 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

DS13848 - Rev 3 page 34/35

 TSB621, TSB622, TSB624

IMPORTANT NOTICE – READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved

DS13848 - Rev 3 page 35/35