Data Sheet
Data Sheet
Data Sheet
Applications
• Wireless Infrastructure
• LTE / WCDMA / CDMA / GSM
• TDD or FDD systems
• General Purpose Wireless
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
Package Topside
• 0.7 – 3.6 GHz Broadband Performance
32 31 30 29 28 27 26 25
• 5-bit control, 31 dB range
N/C 1 24 N/C
• 13 dB Gain at 1.9 GHz TQC9305
GND 2 23 GND
• 3.1 dB Noise Figure at max gain setting
RF In 3 DSA Amp 22 RF Out/VAMP
• +23 dBm P1dB
GND GND
• +27 dBm IIP3, +40 dBm OIP3 4 21
SPI
• Integrated shutdown control for TDD compatibility N/C 6 19 N/C
SID 8 17 VPD
9
CLK 10 11 12 13 14 15 16
LE
GND
VDD
VDD
GND
N/C
GND
Exposed Backside Pad
RF/DC Gnd
Electrical Specifications
Test conditions: TLEAD=+25°C, VAMP = VDD = +5 V
Parameter Conditions Min Typ Max Units
Operational Frequency Range 700 3600 MHz
Test Frequency 1950 MHz
Gain Max gain setting 11.5 13 14.5 dB
Gain Control Range 31 dB
Gain Control Step Size 1 dB
Gain Accuracy 700 – 2700 MHz (major states) ± (0.3 + 4% of Atten. Setting) dB
Input Return Loss 19 dB
Output Return Loss 16.5 dB
Output P1dB +23 dBm
Output IP3 Pout/tone = 0 dBm, Δf = 1 MHz +39.7 dBm
Input IP3 Pin/tone = -13 dBm, Δf = 1 MHz +23.5 +26.7 dBm
Noise Figure Max gain setting 3.1 dB
OFF to ON State (50% VPD to 90% RFout) 0.85 µs
Switching Speed
ON to OFF State (50% VPD to 10% RFout) 2.0 µs
Amplifier Shutdown On state 0 0.4 V
Control, VPD Off state (Power down) 1.5 VDD V
Shutdown pin current, IPD Off state 140 µA
On state 100 130 160 mA
Amplifier Current, IAMP (pin 22)
Off state (Power down) 3 mA
DSA Current, IDD (pins 12, 13) 1.4 mA
Thermal Resistance (Rth) Channel to case 48.3 °C /W
Parallel data
valid
LE
CLK
SERIN D7 D6 D5 D4 D3 D2 D1 D0
Performance Summary
Test conditions: TLEAD=+25°C, VAMP = VDD =+5V, IAMP = 130 mA
Frequency 900 1700 1950 2140 2600 MHz
Gain 15 13.4 12.9 12.7 12 dB
Input Return Loss 18 18 19 20 18 dB
Output Return Loss 20 17 17 17 17 dB
Output P1dB +23 +23 +23 +23 +22.1 dBm
Output IP3 (Pout/tone=0dBm, Δf=1MHz) +41.2 +40 +40 +40 +38 dBm
Input IP3 (Pin/tone=-13dBm, Δf=1MHz) +26.2 +26.5 +26.7 +27.5 +26 dBm
Noise Figure 2.8 3.0 3.1 3.2 3.6 dB
Amplifier Current, IAMP 130 mA
Performance Plots
Gain vs. Frequency Input Return Loss vs. Frequency Output Return Loss vs. Frequency
16 0 0
+85°C
+25°C
14 -5 -5
−40°C
+85°C
+85°C
12 -10 -10
|S22| (dB)
|S11| (dB)
Gain (dB)
+25°C
+25°C
−40°C
−40°C
10 -15 -15
8 -20 -20
6 -25 -25
0 500 1000 1500 2000 2500 3000 3500 4000 0 500 1000 1500 2000 2500 3000 3500 4000 0 500 1000 1500 2000 2500 3000 3500 4000
Frequency (MHz) Frequency (MHz) Frequency (MHz)
IIP3 vs. Frequency P1dB vs. Frequency Noise Figure vs. Frequency
35 25 5
+85°C +85°C
+25°C 24 +25°C 4
30 −40°C −40°C
Noise Figure (dB)
P1dB (dBm)
IIP3 (dBm)
23 3
25
22 2
+85°C
+25°C
20
21 1 −40°C
15 20 0
800 1200 1600 2000 2400 2800 800 1200 1600 2000 2400 2800 800 1200 1600 2000 2400 2800
Frequency (MHz) Frequency (MHz) Frequency (MHz)
Attenuation Error vs. Attenuation States Bit Error vs. Attenuation States k-Factor vs. Frequency
2 0.2 5
Frequency = 1950 MHz
1.5 0.1
4
Attenuation Error (dB)
1
0 +85°C
0.5 3 +25°C
Bit Error
-0.1
k-factor
−40°C
0
-0.2 +85°C 2
-0.5 +85°C
+25°C
+25°C -0.3 −40°C
-1
−40°C 1
-1.5 -0.4
-2 -0.5 0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 0.5 1 1.5 2 2.5 3 3.5 4
Attenuation States Attenuation State Frequency (GHz)
C6
C4
L1
32
30
29
27
26
25
31
28
U1 0603
24
1
TQC9305
23
C1 C2
2
J1 J2
Amp
DSA
22
3
RF RF
21
4
Input Output
20
5
SPI
19
6
R3
18
R1
7
J6 Pin 3
17
8
0Ω 0Ω
11
12
14
15
16
10
13
9
SID
DNP
R2
J6 Pin 11 Vpd
C3
J3
CLK LE
J6 Pins 12 13 GND
C5
J4
VDD
J6 Pin 1
Note: R1, R2 & R3 need not be populated if the shut-down functionality is not required. Pin 17 can be left
open or grounded.
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
Package Topside
32 31 30 29 28 27 26 25
N/C 1 24 N/C
TQC9305
GND 2 23 GND
GND 4 21 GND
N/C 5 20 N/C
N/C 7 18 GND
SID 8 17 VPD
9 10 11 12 13 14 15 16
CLK
LE
GND
VDD
VDD
GND
N/C
GND
Exposed Backside Pad
RF/DC Gnd
2X .10 C
5.0±0.1 A TERMINAL #1 4
B 32X 0.50 Pitch
TERMINAL #1 32X 0.10 0.25
(32X) 0.35x X 0.250y
IDENTIFIER
0.10 C A B
Package Marking:
TriQuint 1.75
2X .10 C
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin
profile, fine pitch, internal stacking module (ISM).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.
23X 3 PACKAGE
32X 0.31 0.50 PITCH
OUTLINE
0.15
1
32X 0.70
3.70
0.76
0.38
0.66
3.70
COMPONENT SIDE
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of
0.25mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information
about TriQuint:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The
information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with
such information is entirely with the user. All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-
sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.