Manual Spectrace 5000

TECHNO'- MANt&l-l .
.
>-.'
November, 1990
Rev. B
Spectrace Instruments, Inc., 345 Eut Middlefield Road, Mountain View, California 910'3, (415) 967-0350
Spectrace Instruments, Inc_. 67 Montgomery Knoll, Skillm'li.n: New Jersey, 08558, (609) 924-1878
Spectrace Instruments, Inc., 2401 Relearch BouJev&rd #206,'FortColUIlt', Colorado 80526, (303)
TABLE OF CONTENTS
Section 1 General information
Scope of the manual 1-1
Reference documents 1-2
Tool kit 1-2
Service and support 1-2
Section 2 Product description
Functional overview 2-1
Hardware architecture 2-3
Software architecture 2-6
Physical description 2-9
Specifications 2-13
Section 3 Safety
Section 4 Theory of operation
Xray source 4-2
Detector 4-5
Bias supply 4-6
Pulse processor 4-8
ADC micro 4-13
Data memory 4-21
Chamber controller 4-22
He protection system 4-28
Section 5 Installation
Hardware 5-1
Software 5-2
Section 6 Periodic maintenance
List by frequency of service 6-1
List by items to be serviced 6-2
Section 7 Troubleshooting
Troubleshooting chart 7-2
Error message chart 7-18
Test matrix 7-21
Spectrace 5000 Technical Manual
Section 8
Section 9
Section 10
Section II
Appendix
Assembly procedures
Test procedures
Diagnostic software
ECHOA
LIGHTEST
MEMTEST
System status page
Test procedures
TXCONFIG
VERIFYP
System and error messages
Boot sequence
Initia.lization sequence
Acquisition sequence
List of engineering documentation
10-3
J0-5
10-6
10-7
10-10
10-11
10-17
11-2
11-2
11-3
2.1
2.2
2.3
2.4
2.5
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
8.1
9.1
9.2
9.3
9.4
10.1
LIST QF FIGURES
Funtional block diagram of the 5000
X-ray beam geometry
Software architecture
External views and connections of the 5000
Location of components in the SOOO
Xray tube
X-ray power supply controller
Diagram of Si(Li) detector
Pulsed optical preamplifier
Pulse processor PCB
Pulse processor test points
Pulse processor timing; count rate =
ADC micro PCB
ADC input circuits
ADC timing diagram
Dynamic RAM timing
Chamber controller PCB
high
Interlock logic on the chamber controller PCB
Helium flush panel
Adjustment pots and indicator lights on the
signal processing subsystem
System out of calibration
Waveform on drain of Ql
Waveforms in the X ~ R A Y ON warning light circuit
Diagnostics for the Spectrace 5000
LIST QF TABLES
10.1 ECHOA command language
10.2 System status page
Section I
GENERAL INFORMATION
Introduction 1-1
Scope of the manual 1-1
Reference documents 1-3
Tool kit 1-3
Service and support 14
1-1 General Information
INTRODUCTION
This service manual describes the
Spectrace SOOO energy-dispersive X-ray
fluorescence analyzer used for elemental
analysis.
The manual is designed to acquaint the
service technician with the instrument,
its hardware and software characteristics.
its installation, and the service
procedures that can be performed on-site.
This manual is written for service
technicians who have a general
experience with electronic circuits and
standard bench instruments. No expertise
with X-ray or elemental analysis
techniques is assumed (the references
listed in this section should enable the
interested reader to get acquainted with
these topics).
This manual does assume that anyone
working with the Spectrace 5000 has
become somewhat familiar with Its
operation as described in the operator's
manual.
SCOPE OF THE MANUAL
To achieve its stated goals, the manual is
organized as follows:
Section 1, General information
This section describes the service
policy. the organization of this
manual, additional documentation,
and other information of general
interest.
Section 2, Product description
This section provides a general
overview of the product, and a
summary of its specifications.
Section 3, Safety
This section is a compilation and
explanation of all safety notices and
precautions which are required by
government and industry standards
applicable to the product.
Section 4, Theory of operation
This section describes the hardware
and software architecture of the
product, and the theories of
operation of its modules and
subassemblies.
Section 5, Installation
This section describes the
environmental preparation
requirements, and the hardware and
software procedures for the
successful installation of the product.
Section 6. Periodic maintenance
This section summarizes the
maintenance requirements of the
product by indicating the frequency
of required service. the items
requiring service. and the applicable
procedures.
Section 7, Troubleshooting
This section is a guide to trouble
shooting procedures, presented as a
table of symptoms, causes and
remedies.
Section 8. Assembly procedures
This section presents detailed
procedures for the mechanical
disassembly and reassembly of the
product and its component modules.
Section 9. Test procedures
This section presents detailed
procedures for the mechanical,
electrical and software adjustment.
calibration and testing of the product
and its component modules.
Section 10, Diagnostic software
This section describes ROM- and
RAM-resident diagnostic software
used as part of the various service
procedures.
Section 11, System and error messages
This section presents a summary of
system and error messages that may
appear on the monitor display during
the operation or servicing of the
product.
Appendices
This section contains lists of
schematics and other engineering
drawing that are mentioned in the
other sections of this manual; also
tables of jumper and switch settings,
fuse types and locations, register
addresses and memory address space
allocations, parts lists. and similar
information.
Index
This section lists the page numbers
where key words appear in this
manual.
Glossary
This section lists definitions of
technical terms used in the special
context of the product.
Revisions and updates
This section is reserved for the
reader to log and keep changes or
additions to the manual.
Service bulletins
reader to keep service publications
sent to the field.
User notes
reader to keep additional
information that may be useful.
General Information I)
REFERENCE DOCUMENTS
Tracor manuals and publications
Spectrace 5000 Operator's Manual
Spectrace 5000 marketing brochure and
specification sheet
"Fundamentals of X-ray Spectrometry"
by Donald E. Leyden (Tracor Xray, 1984)
OEM manuals
IBM DOS version 3.1 Reference Manual
IBM DOS version 3.1 Technical
Reference Manual
IBM PC/AT Guide to Operations
IBM PC/ AT Technical Reference Manual
IBM PC/AT Hardware Maintenance and
Service Manual
TOOL KIT
The following equipment is required to
service the Spectrace 5000 in the field.
Test diskette
Extender board
B N C - t o ~ B N C cable
Vacuum test fixture and gauge
Copper. brass samples
Copper calibration standard
Ti-Zr calibration standard
Conostan S12 trace elements std.
Collimator
Digital multimeter and probes
IDa MHz oscilloscope and probes
IBM PC extender board
Universal adjustment tool (tweeker)
Misc. hand tools (screwdrivers. etc.)
Lens cleaning vacuum/air kit
Acetone or TCE
SERVICE AND SUPPORT
The following provisions apply both to
in-warranty and servicecontract support
of Spectrace products.
On-site service
On-site service is available during normal
business hours. Emergency service is
provided if possible.
Telephone support
A service technician is available from
8:00 AM to 5:00 PM Pacific Time for any
help or information required. Extensive
troubleshooting is provided if both
parties feel the problem may be resolved
over the telephone. Call:
Spectrace Instruments, Inc.
Customer service
(415) 967-0350
Customer involvement
During warranty period the user may be
requested to perform simple diagnostics
to assist the technician in localizing the
problem. This may include voltage
measurements. board swaps. or running
special software routines. Complex
technical skill is not expected. After the
warranty period, the degree of
involvement is the user's choice.
Trainine;
From time to time, we offers on-site and
in-factory training for users (Spectrace
user school).
Equipment exchange
AU subassemblies are available for
instant ex.change. We normally respond
within one working day of the initial
request.
ReDackiDlz for shipment
Whenever possible. packing materials
should be saved for use when components
must be returned. Sensitive components
such as the X-ray tube and the detector
assembly require special care in packing.
Call customer service for instructions.
Section 2
PRODUCT DESCRIPTION
Introduction 2-1
Bias supply PCB 24
Pulse processing PCB 24
Data memory PCB 25
Functional overview 2-1
Hardware architecture 2-3
Sample tray 2-3
Atmosphere control 2-3
Chamber controller PCB 2-3
Xray source 2-3
Spectrometer 2-4
ADC micro PCB 2-4
Safety design 2-6
Software architecture 2-6
DOS 2-6
Applications 2-6
Signal flow 2-7
Diagnostics 2-8
Outline of operation 2-8
Physical description 2-9
Sample chamber 2-9
Master wiring PCB 2-9
Xray source 2-9
Spectrometer 2-9
Signal processing PCB set 2-10
Data memory PCB 2-] 2
Computer 2-] 2
Printer _ 2-12
Display 2-12
Specifications 2-13
Spectrace 5000 Technical ManuaL
2-1 Product Descriotion
INTRODUCTION
The Spectrace 5000 is an automated
energy dispersive X-ray fluorescence
(EDXRF) analyzer used for non
destructive elemental analysis of solids
and liquids. The system includes the
features and flexibility necessary for
solving a wide range of analytical
problems, and can be configured to
accommodate a variety of sample
geometries.
For the purpose of introducing the reader
to the Spectrace 5000. this section
describes it in terms of a general,
functional block diagram, a discussion of
its hardware and software architecture. a
guide to its major components, and a
summary of the system specifications.
FUNCTIONAL OVERVIEW
An instrument of analysis must be able
to evoke a signal characteristic of the
sample's properties, and transform that
signal into a form suitable for electronic
processing and analysis. In this context,
the Spectrace 5000 consists of four major
functional blocks, shown in Figure 2.1.
Sample handling and control implements
the operator's instructions and the
system's control over the conditions in
the chamber for analyzing samples.
The operator places samples onto the
sample tray in the chamber, and selects
the acquisition parameters by means of
the software running on the computer.
The operator's commands and selections
(of chamber parameters) are implemented
via the chamber controller PCB; a serial
link with the computer carries the
relevant hardware status and control
information.
During acquisition, the "primary" X-rays
from the X-ray tube hit the sample, and
induce the emission of "secondary" X
rays by the elements contained in the
sample.
Signal detection captures the "secondary"
X-rays emitted by the sample and
converts them into electrical signals.
Signal processing applies some analog and
digital hardware and software techniques
to refine the signals from the spectro
meter, and converts them into digital
data. These are sent to an interface PCB
in the computer via a parallel data cable.
Data analysis and disolay consists of
analyzing the data from the signal
processor, identifying the elements in and
the composition of the sample, and
generating and displaying the spectra.
This is done by software running in the
computer.
2-2 Product Description
SPECTRO
METER
~
SIGNAL
DETECTION
secondary x-rays
CHAMBER
')primary
x-rays
X-RAY
SOURCE
-
ATMOSPHERE
CONTROL
SAFETY
INTERLOCKS
iSS: BIAS
:>:<
SUPPLY
iSS
PCB
PULSE
PROCESSOR
PCB
ADC
data
,...
MICRO
PCB
:t&
DATA
SIGNAL PROCESSING
MEMORY
PCB
COLOR
DISPLAY
GRAPHICS
ADAPTER
DISPLAY
PRINTER GRAPHICS
ADAPTER PRINTER
control
...
MASTER
and
WIRING
status
SERIAL
PCB
INTERFACE
ADAPTER
1
CHAMBER
CONTROLLER
PC/AT KEYBOARD
PCB
DATA ANALYSIS AND DISPLAY SAMPLE HANDLING AND CONTROL
Figure 2.1 Functional block diagram of the 5000
Product Description 23
HARDWARE ARCHITECTURE
The discussion in this section is based on
the functional block diagram (Figure 2.1)
and on the system cabling diagram
(drawing no. 0140-0304).
Sample tray
The sample tray places samples into the
X-ray beam. The tray is rotated by a
stepper motor controlled by the chamber
controller PCB. The tray is equipped
with a home sensor to detect the first
sample position of a multi-sample tray.
Because the sample height (distance from
the X-ray source as well as the detector)
affects the accuracy of measurements, it
is maintained within a 0.005" tolerance.
For some samples, such as powder or
semiconductors. the surface texture
makes a preferred orientation necessary.
It is beneficial to rotate the sample to get
more accurate answerS. This is
accomplished by an optional sample
spinner, driven by an AC synchronous
motor.
Atmosphere control
For low-Z samples a vacuum environment
is needed and thus the sample chamber is
also a vacuum chamber. The vacuum
system is also controlled by the chamber
controller PCB.
For other lowZ and liquid samples, a
helium environment is needed. Since
helium can diffuse very quickly through
the thin Be window on the detector and
damage it, an optional helium protection
unit is used.
The chamber controller PCB is an
intermediary between the computer and
that part of the hardware which affects
the excitation conditions, sample
preparation and safety:
Position of sample tray
Position of filter wheel
X-ray tube voltage and current
Chamber atmosphere
Sample spinner
Interlock monitoring and safety
The computer issues commands to the
board via the 1200-baud RS-232 link.
This board then decodes the instruction
and executes the operation by either
sending data to modules connected to it
via the master wiring PCB, such as the
Xray power supply. or generates a
sequence of pulses to the tray or filter
drive stepper motors. The chamber
controller PCB also returns system status
information to the computer.
X-ray source
The Spectrace 5000 uses a low power x
ray tube (less than 50 watts) with a
rhodium anode target. Other anode
targets are also available. A 30 kV or 50
kV high voltage power supply drives the
X-ray tube. The Xray tube generates
the Xrays that are incident upon the
sample so as to cause the sample to
fluoresce.
The X-ray power supply controller PCB
controls the tube voltage and current.
(The chamber controller PCB. in turn,
controls the power supply controller.)
Tube voltage is controlled by a O-IOV
input voltage to the Xray power supply,
and the tube current is controlled by
heating the filament/cathode of the tube.
2-4 Product DescriptioD
The regulation of voltage and current is
such that the X ~ r a y output from the tube
is kept to within 0.5 % over an 8hour
period.
The X-rays emitted by the anode pass
through a 0.005" Beryllium (Be) window.
Then the beam is collimated and filtered.
The filter is selected by rotating the 6
position filter wheel by means of a
stepper motor. which is controlled by the
chamber controller PCB.
The collimator and X-ray tube define the
illumination beam. To minimize
scattering, the detector acceptance beam
is 90
0
from the incident beam. The
sample is placed at the intercept plane of
the two beams. as shown is Figure 2,2.
Spectrometer
The X-ray spectrometer converts X-rays
into a series of pulses whose amplitude is
proportional to the X-ray energy. X-ray
photons from the sample are converted in
the Si(Li) detector into dectron-hole
pairs whose number can be precisely
determined by physics. Under a biasing
voltage (up to 600 volts) these electrons
and holes move to the cathode and the
anode, respectively, and a small external
current results.
This signal is amplified by a pre
amplifier whose critical component is a
field effect transistor (FET) inside the
cryostat. The preamplifier handles linear
and low-noise signals by using the
combination of a LN-cooled FET input
stage and pulsed optical feedback
stabilization.
Liquid nitrogen inside a dewar cools the
Si(Li) dctector and the FET to reduce
noise caused by the leakage current in
the detector and thermal noise in the
FET. A liquid nitrogen level sensor is
mounted on a rod which is immersed in
the liquid nitrogen.
Bias supply PCB
The bias supply PCB fulfills four
important functions. It monitors the
liquid nitrogen level sensor and issues an
alarm if the level drops too low. It
protects the detector and the FET from
excess leakage current; if the leakage
current becomes excessive, the bias
voltage is turned off. It supplies detector
bias for proper operation. Finally, it
passes on the signal from the
preamplifier to the signal processing
modules in the card cage.
Pulse processing PCB
The pulse processing PCB performs
analog signal processing functions such as
amplification, filtering and pulse pile-up
rejection. This board generates "live
time" (circuit active) and "dead time"
(circuit disabled) information which is
used in these circuits to reduce spectral
distortion. and which allows the operator
to optimize the trade-off between data
rate and resolution.
ADC micro PCB
The heart of the Spectrace 5000 is the
multichannel pulse height analyzer
implementcd in computer hardware and
software. The key to this is the
microp rocessor-based ana log-to-digi ta I
conversion circuit on the ADC micro
PCB. Under software control, the output
of the pulse processor is converted into a
histogram with high precision and
accuracy.
In addition, this board provides
automatic digital zero (baseline) and gain
stabilization, dead time correction to the
pulse processing PCB, and communicates
with the data memory PCB in the
computer.
Product DescriPtion
SAMPLE OPTIONAL
COLLIMATOR
MOUNTING SCREW
X-RAY TUBE
/
K
/ -
, '
/
FILTER
/ /
COLLIMATOR
X-RAY TUBE
FILTEA WHEEL
DETECTOR
Figure 2.2 X ~ r a y
Data memory PCB
The data memory PCB is the interface
between the ADC micro PCB and the rest
of the computer. This board:
Downloads the program to the ADC
micro PCB;
Provides memory into which the
ADC writes a spectrum, and from
which the computer reads it;
Provides priority arbitration between
the computer and the ADC;
Sends commands to and receive
status information from the AOC.
beam geometry
The spectrum memory is mapped into an
unused portion of computer memory, and,
as a result, the spectrum is readily
available for display purposes.
OEM eauinment
The power supplies in the system unit,
and all equipment associated with the
computer (printer, monitor, PCBs) are
described in the vendors' manuals.
Safety design
Due to the potential health hazard of x ~
rays. the Spectrace 5000 has extensive
safety interlock circuitry, with sensors
and microswitches throughout the system
unit, and continuous hardware and
software checks of their status.
The chamber controller PCB monitors a
series circuit of 6 microswitches. which,
when connected, indicate that:
X-ray tube is installed
Detector is installed
Front door is closed
Back door is closed
Chamber lid is closed
X-ray tube cathode is connected
When the chamber controller PCB senses
that this circuit is closed, the EDXRF
program funning in the computer (see
below) orders the chamber lid to be
latched. Thus, closing of the chamber lid
is doubly ensured and double-checked.
The successful closing of the lid latch
causes the X-ray ON warning light to
come on. A sensor in the warning light
assembly monitors the light. If the light
does indeed come on, a relay on the
chamber controller PCB and on the X-ray
power supply controller PCB finally
enable the power supply to energize the
X-ray tube.
SOFTWARE ARCHITECTURE
The major components of the Spectrace
5000 software, and the signal paths
between them, are illustrated in Figure
2.3.
The operating system, DOS, runs all other
programs on the computer, as well as the
computer's I/O devices.
DOS resides partly in ROM and partly on
disk. DOS recognizes disk drives (A:, B:,
C:, ete.), I/O devices (CON:, COMI:,
COM2:, PRN:, etc.) and I/O ports as the
means by which it accepts inputs and
outputs.
Aoplications
EDXRF runs the Spectrace 5000 and does
the analysis on the data generated by the
detection and signal analysis circuits. A
larger version of the program
(EDXRFIFP) also includes a fundamental
parameters program. Both can be
configured in a "test" version to run
special tests on the system.
In addition to EDXRF, other programs
are also needed to run the system:
LOCKOUT and UNLOCK implement
software security functions in EDXRF,
to prevent unauthorized changes in
analysis protocols.
For EDXRF versions 1.0 and 1.1 only,
MKCNFG and RDCNFG are used to edit
and read, respectively, the CONFIG file,
where data about the options on the
system arc stored. EDXRF versions 1.2
and higher use NEWCNFG.
XRAYOFF, called from the AUTOEXEC
batch file, makes sure that the X-rays are
turned off and the chamber lid is
unlocked when the system is rebooted.
INSTALL and UPDATE are used to load
initial and subsequent releases,
respectively, of the application software
package.
FPCONFG is used [0 define X-ray tube,
filters and geometry for EDXRFIFP
(versions 1.2 and higher).
VERIFYP is a diagnostic program used
to identify damaged procedure files.
r ~ ~ W - - - - - - - - - - - - J
DATA
EDXRF MEMORY
1 PCB
I
; (SPECTRA) I
I
I
VOl EGA
I CON:
I
/'
SERIAL
I
DISK
"
A ~
DOS PARALLEL
I
I
I
I
I
I
I
I
C:
ADAPTER
COM 1:1
..I
"
CON
~ __J
L
------ ------
GRAPHICS
KEYBOARD
PRINTER
Figure 2.3 Software architecture
ADC
MICRO
PCB
ENHANCED
COLOR
DISPLAY
CHAMBER
CONTROLLER
PCB
DENOTES
SOFTWARE
Two subdirectories are created on the
hard disk at installation time. HELP
contains online explanations of the
functions and features of EDXRF.
SPECTRAC contains files specific to the
operation of the system.
Sienal flow
Application programs, such as EDXRF,
are loaded from the release diskettes in
drive A: onto drive C: (and into RAM).
Signal processing software is downloaded
via the data memory PCB into the ADC
micro PCB.
The operator interacts with the EDXRF
program by typing commands or menu
selections on the keyboard (the console
port) and reading the menus, spectra and
text on the color monitor.
Commands to the system unit, generated
by EDXRF in response to operator inputs
or protocol requirements, go to the
chamber controller PCB via the serial
communication port of the serial/parallel
adapter, and to the signal processing
boards via the data memory PCB. Status
information from the hardware uses the
same paths.
Spectral data stored on the data memory
PCB are passed to EDXRF for analysis,
from which the spectra and other results
arc constructed. The spectra arc put on
the monitor via the EGA board. Other
graphics, such as calibration curves, arc
assembled by the VDI graphics interface
and sent to the EGA board via DOS.
ASCII text bypasses VOl, on its way
either to the printer via the
serial/parallel adapter or to the EGA
board.
EDXRF system status Dage
The EDXRF application program is
described fully in the Spectrace
operator's manual.
The system status page is described in
Section 10 (Diagnostics) because of its
usefulness in monitoring the hardware.
Diagnostics
An important part of the system software
architecture is the package of diagnostic
programs. The Spectrace 5000 is
provided with two classes of diagnostics:
(1) diagnostics for the system unit,
written by Spectrace Instruments, and (2)
diagnostics for the computer, provided by
IBM.
The system unit diagnostics are described
in Section 10.
The computer diagnostics are described
in the IBM manuals.
Outline of ooerallon
The X-ray fluorescence measurement,
data reduction and display are performed
by the computer and its enhanced
graphics display system. The EDXRF
program initializes the chamber
controller and the ADC microprocessor,
then either carries out a prepared
program or prompts the user for
information needed for the analysis.
Then it performs a series of operations
needed to output the results of the
analysis.
The computer samples system parameters
via the chamber controller PCB, and the
signal processing parameters via the data
memory PCB. It then initiates the
acquisition of a spectrum. While the
spectrum is being collected, it is also
displayed and updated every second on
the enhanced graphics display monitor.
While the spectrum is being displayed,
KLM markers and cursors can be
repositioned anywhere on the spectrum,
The spectrum can be scaled vertically as
well as horizontally, using log or linear
scales. Spectrum peak labels can be
attached to a peak and swred. Regions
of interest can be defined using the
various soft keys. The graphics display
is highly interactive and user-friendly.
After the collection of a spectrum is
complete, the spectrum intensities can be
processed through various programs to
obtain deconvoluted }jne intensities. This
intensity file is processed by the program
using a leastsQuares algorithm. The use
of the 80287 math coprocessor speeds up
the numerous floating-point operations
required in this calculation. The nnal
elemental concentration can then be
displayed as calibration curves, and a
hard copy is printed out on the IBM
Proprinter.
Spcctrace 5000 Technical Manual
2-9 Product Descriotion
PHYSICAL DESCRIPTION
The Spectrace 5000 consists of two
modules: the system unit and an IBM
PCI AT computer.
The external features and connections of
the system unit are shown in Figure 2.4.
(The computer is described in its own
manuals.)
The system unit houses all the
components of three major functional
blocks shown in Figure 2.1: sample
handling, signal detection and signal
processing. The locations of these
components in the system unit are shown
in Figure 2.5; the view in the Figure is
with the front door open or removed.
The components of the fourth major
functional block, data analysis, are built
into or connected to the computer.
SamDle chamber
The sample chamber is located on top of
the system unit. It is a mechanical
assembly which includes the following:
Base plate
Chamber lid
Sample tray
Filter wheel
Tray and filter drive motors
X-ray tube and detector ports, and
Sample spinner and motor (optional).
The chamber controller PCB is located in
the left-most slot in the system unit'S
card cage. It communicates with the rest
of the system via the master wiring PCB
and the card cage motherboard.
Master wiring PCB
The master wiring PCB is located on the
left side of the system card cage. It is a
connector panel for all cables between (1)
the chamber controller PCB and the card
cage motherboard, (2) the power supplies,
motors, solenoids, safety interlocks and
other parts of the system, and (3) the
serial link to the computer.
X-ray source
The X-ray source is located just under
the chamber. It consists of the X-ray
tube which protrudes into the chamber,
the X-ray high voltage power supply, and
the X-ray power supply controller PCB.
Spectrometer
The X-ray spectrometer consists of the
detector, the preamplifier, and the liquid
nitrogen dewar.
The detector is a lithium-drifted silicon
diode that converts incoming X-rays to
an electric charge which is proportional
to the X-ray energy of the incoming X
ray. This becomes the output signal from
the preamplifier which is sent to the
pulse processor PCB via the bias supply
PCB.
The LN dewar is an insulated I 7 ~ 1 i t e r
container for the storage of liquid
nitrogen, and is equipped with a LN level
sensor.
2-1 0 Product Description
R8232 CABLE XRAYS ON
TO CABLE
LIQUID
X-RAYS ON CHAMBER
NITROGEN
,
LIGHT CONTROLLER
FILL
I CABLE
'C,
,
jNNEL
from
CHAMBER --I II
DATA
LID
MEMORY
'C'
ADC
MICRO
"
PC, =
ON/OFF
FAN
FILTERS
AC POWE
FUSES
ELECTRI
OUTLET ,,0
VACUUM
LOCK
PUMP AND
POWER
'"

HELIUM
HOSE
VACUUM
FRONT DOOR
HOSE
BACK DOOR
I ,
::;;

I
w
Figure 2.4 External views and connections of the 5000
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l"=
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00

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HELIUM
FLUSH
PANEL

it
I

Siena I nracessloe PCB sel
The signal processing circuits are
contained on three PCBs located in the
system card cage and interconnected via
the motherboard.
The bias supply PCB is located in the
right-most slot. This board controls and
protects the detector, and receives the
signal from the preamplifier.
The pulse processor PCB is located in the
next slot. This board filters and shapes
the signal from the preamplifier.
The ADC micro PCB is located in the
third slot from the right. This board
converts the signal from the pulse
processor into digital data. Its output
goes to the data memory PCB.
Spectrace 5000 Technica.l Manual
Product Descriotion 2-11
X-RAY TUBE
DETECTOR
X-RAY POWEA SUPPLY
CURRENT CONTROLLER PCB

12V POWER SUPPLY
.,'
MASTER -__..
WIRING
PCB
PULSE PAOCESSOR PCB
__ BIAS SUPPLY PCB
;; QADG MICRO PCB
o'=' 0 AND
m CABLE TO DATA MEMORY PCB
o
CHAMBER CONTAOLLER PCB
,
,
LIQUID NITROGEN DEWAR
24V POWEA SUPPLY
5V POWER SUPPLY
Figure 2.5. Location of components in the 5000
Spectracc 5000 Technical Manual
Data memory PCB
The data memory PCB occupies a full
size expansion slot in the computer. It
provides memory for storing spectra
which are being collected. It also
provides the communication path
between the computer and the signal
processing PCB set.
Computer
The computer is an IBM PCIAT equipped
as follows:
512 Kbytes of RAM
20 Mbyte Winchester disk drive
1.2 Mbyte floppy disk drive
80287 math co-processor
Enhanced graphics adapter
Printer adapter
Serial/parallel adapter
Printer cable
Serial interface cable (09-to-D25)
The adapter boards are located in the
PCs expansion slots. The EGA board has
an additional 128 Kbytes of memory.
(The Spectrace 5000 can also work with
an IBM PC or PCjXT if it is equipped
with a hard disk, a math c o ~ p r o c e s s o r ,
and the EGA board.)
Printer
The Spectrace 5000 is normally equipped
with a 200 cps IBM Proprinter with
graphics, for printing text and plotting
spectra.
Display
The Spectrace 5000 is normally equipped
with the IBM Enhanced Graphics Display
monitor for displaying information and
spectra. The color monitor has 16 colors
and a reSOlution of 640x350 pixels.
Spectrace 5000 TechnicaL Manual
SPECIFICATIONS
SAMPLE CHAMBER
Sample Types Solid
Powder
Liquid
Thin film
Tray types Single
IO-position
IO-pos. with spinner
Custom
Sample sizes 10.OxI2.0"
(245x305 mm) max.
l.2S" (31.8 mm)
l.8S" (47.0 mm)
Custom
Environment Air
Vacuum
Helium
EXCITATION
Geometry Inverted 90
(target-sample-det.)
1.125" (28.6mm)
Target-sample 3.6" (91.4 mm)
X-ray TUBE
Type Bremsstrahlung
Target Rh
Others optional
Window Be
Window thickness 0.005"
Cooling Natural convection
and conduction.
X-ray GENERATORS
30 kV:
Voltage range 6-30 kV
Increments lkV
Current range 0-O.3mA
Increments O.OlmA
>0 kV:
Voltage range 6-50 kV
Increments IkV
Current range 0-0.3SmA
Increments O.OlmA
Stability
Filters
Materials
Collimators
0.5% over 8 hours
6-position wheel
Aluminum
Cellulose
Rhodium
Copper (with 50 kV)
I mm hole (min.)
Detector
Area
Resolution
Window
Window thickness
LN dewar
X-ray SPECTROMETER
Si(Li)
2
30 mm
ISS eV FWHM
at 5.9 keV, 1000 cps.
Be
0.0003" and 0.0005"
17 liters
Low LN warning.
HV thermal cutoff
Amplifier
Shaping network
Stability
Linearity
Pileup reject
Preamplifier: pulsed optical feedback
Live time correction +/-1.0%
from a to 20 keps
converter
Addresses
Clock rate
Energy calibr.
4.096
JOOMHz
Automatic
Data Memory
Data channels
Counts/channel
2048
16 million
Time variant
O.OI%;oC
0.1%
250 ns above 2.5 keY
I us below 2.5 keV
SOFTWARE
Operating system PC-DOS version 3.1
or higher
Application EDXRF
EDXRF/FP
Menu-driven program with softkeys and
options shown on the display for ease of
use. A HELP key is available on most
menus which brings up a description and
instructions for the choices on each
menu.
Spectral display information
Xray spectrum (linear or log)
Procedure title
Sample ID
Tray position
kV. rnA, filter
KLM markers
Peak labels
Energy cursor
Energy scale
Gross/net intensity of region of interest
Preset livetime
Elapsed livetime
% dead time
Overlap comparison of two spectra
Out out: CRT and graphics printer.
Automation
Chamber environment
Xray tube voltage and current
Sample position
Filter selection
Single pushbutton operation
Spectrum processing
Digital filter background removal;
Empirical peak unfolding by least
squares fitting;
Gross peak intensities and net peak
intensities above background.
Analysis techniques
Peak ratios
Linear and quadratic fit
Intensity matrix correction
Two concentration matrix corrections
Sort
Wafer analysis
OPERATING ENVIRQNMENT
Temperature so to 104F
10 to 40C
Humidity 20 to gO% RH
non-condensing
DIMENSIONS
Spectrometer/sample chamber;
Height 43.75" (11Ll cm)
Width 28.0" (71.1 em)
Depth 27.0" (68.6 em).
Computer workstation
Hei8ht 26.5" (67.3 em)
Width 40.0" (101.6 em)
Depth 27.0" (68.6 em).
WEIGHT
Spectrometer/sample chamber
450 Ib' (204.3 kg)
Computer and workstation
150 Ib' (68.1 kg)
POWER REOUIREMENTS
Voltage 115 or 230 VAC
Frequency 50 or 60 Hz
Current 6 Amps @ 115V
(with vac. pump) J3 amps @ 115V
Power 700 watts
(with vac. pump) 1500 watts
OPTIQNS
Vacuum pump
Helium environment detector protection
Sample spinner
Special sample trays
Computer workstation table/enclosure
PCXRF fundamental parameters program
Sectiog 4
THEORY OF OPERATION
Introduction
X-ray tube
Current control
Voltage control
30/50 kV selection
Interlocks
XRAY ON warning light PCB
Detector
Preamplifier
Bias supply PCB
Detector bias supply
Protection circuit
Liquid nitrogen level monitor
Pulse processor PCB
Overview
Controls and indicators
Fast discriminator
Timing section
Pulse rejection
Count rate range
Linear signal path
ADC micro PCB
Overview
ADC inputs
Pulse stretcher
Rundown current
100 MHz oscillator
Address scaler
Conversion timing
Store, DMA
Reset circuit
ZERO and GAIN DACs
Fast discriminator scaler
Dynamic RAM
Communications bus
Processor
Data memory PCB
Memory
Communication
4-1
4-2
4-3
4-3
4-3
4-3
4-3
4 ~ 4
4-5
4-6
4-6
4-6
4-7
4-7
4-8
4-8
4-8
4-10
4-10
4-11
4-12
4-12
4-13
4-13
4-13
4-13
4-15
4-16
4-16
4-16
4-17
4-18
418
418
418
4 ~ 19
420
421
4-21
421
Overview 4-22
Auto-reset 4-22
Initialization 4-22
Vacuum sense and control 4-22
Stepper motor control 4-22
Home condition 4-24
High voltage control 4-24
Sample spinner 4-24
Interlocks 424
Safety features 4-24
Command/confirm logic 4-25
Interlock circuit 4-25
Communication with the computer 4-26
Inquiry mode 4-26
Command mode 4-27
Receive mode , , , , 4-27
He protection system 4-28
4-1 Theory of Ooeration
INTRODUCTION
This section describes the Spectrace 5000
in detail. The presentation consists of
descriptions of the several components
introduced in Section 2.
The reader is referred to the Spectrace
5000 operator's manual and the manuals
of OEM products built into the Spectrace
5000 for any details that are not present
in this section.
NOTE
In the following discussion, a reference
to a negativetrue signal is indicated by
the slash character (f) placed in front of
the signal name.
4-2 Theory of Operation
X-RAY TUBE
The source for illuminating the sample
with X-rays is the X-ray tube, shown
schematically in Figure 4.1. The tungsten
filament is heated by a pulse width
modulated AC current from the X-ray
power supply controller PCB. The heated
filament cathode emits electrons; the
current is controlled by the X-ray supply
controller PCB. and is limited to 0.35 rnA.
The emitted electrons are focused by a
focusing electrode to a spot about I to 5
mm
2
on the anode. The anode is also
called the target, which consists of a thin
disk of rhodium plated on a copper
block. The anode is typically cut such
that the angle between the face of the
target and the normal to the exit window
is 20. The window is made of thin
(O.oosn) beryllium foil, which allows X
rays to escape and at the same time holds
a high vacuum.
Use of the X-ray tube in quantitative
analysis requires careful attention to the
following four considerations:
It is important to measure the spectrum
from the X-ray tube to make sure that
the correct target material is used. This
can be done by observing the scattered
spectrum. The characteristic K and L
lines of the target should be present.
Slight changes occur in the position and
dimension of the filament and other
internal dimensions as the tube warms up
to its equilibrium temperature. These
changes may affect the intensity
distribution of the primary beam. It is
thus important to wait half an hour at
operating voltage and current before
making precise Quantitative
measurements.
To align the X-ray optics, unexposed
polariod X-ray film can be placed in the
sample socket and illuminated by full
power X-rays for IS-30 seconds. The
illuminated area is colored and can be
used for alignment purposes.
The output flux of the X-ray tube at
constant kV and rnA decreases 3% for
each 1000 hours of operation due to
pitting and sublimation of target material
on the inside of the tube window. To
obtain accurate results, this effect should
be calibrated out.
FOCUSING
ELECTRODE
ANODE
GLASS
ENVELOPE
FILAMENT
CATHODE
SAMPLE
Figure 4.1 X-ray tube
Spectrace SO 00 Technical Manual
X-RAY POWER SUPPLY CONTROLLER
The X-ray power supply controller PCB
(schematic no. 5919-0161) controls the
voltage and current applied to the X-ray
tube, as shown in Figure 4.2. It is able to
control both 30 kV and SO kV X-ray
power supplies {or currents up to 0.35
mAo
Current control
In an X-ray tube, electrons flow from the
filament to the target, where they
produce X-rays upon impact. The
magnitude of the current depends upon
the temperature of the filament and the
voltage difference between the filament
and the target. An AC current produced
by transformer TI heats the filament. A
pulse width regulator UI controls the AC
current by varying the width of the
pulses used to drive the transformer. The
regulator has a feedback path designed
such that the chip heats the filament to
cause a current flow in the tube, which is
used to balance the current in the
feedback circuit. The current control
DAC UlO controls the amount of current
taken out of the feedback path.
YoHnKe control
The X-ray power supply is controlled by
varying the control voltage between
positive and negative reference voltages.
As this control voltage increases (0-10 V),
so does the output of the high voltage
supply. The power supply has a
reference voltage. The output voltage
reaches its maximum when the control
voltage is equal to the reference voltage.
The circuit that generates the control
voltage consists of U9. US and Q4. The
reference voltage from the power supply
is buffered by half of U9 and is used as
a reference voltage for US and a digital
to-analog converter (DAC). The output
of the DAC is amplified by the other
half of U9 and by Q4.
30/50 kY selection
To provide the control voltage for either
power supply, the gain of the U9-Q4
amplifier is jumper-selectable for either
30 or 50 kY. This is necessary because
the chamber controller PCB sets the DAC
at full scale for 50 kV. To provide full
scale output for 30 kV, the gain of the
amplifier is jumpered to a larger value.
Interlocks
Interlocks are designed to prevent
operators, technicians or bystanders from
being exposed to Xrays. The input
power for the Xray power supplies goes
through the interlocks, so if any of them
are open, there can be no power for the
X-ray power supply.
The interlock circuit is described
elsewhere in this section.
4-4 Theory of Qoeration
24V
POWER
SUPPLY
PULSE
WIDTH
REGULATOR
f-
INTERLOCKS
I ir> ,l
X-RAY TUBE
TRANSFORMER
~
FEEDBACK
CHAMBER
CONTROLLER
PCB
X-RAY
POWER
SUPPLY
+REF
W
-REF
VOLTAGE
I--
WR CONTROL
DAC
CS
CS
L
CURRENT
f4
CONTROL
DAC
OPTICAL
ISOLATORS
DATAlSTROBE
SERIAL
PARALLEL
CONVERTER
Figure 4.2 X-ray power supply controller
X-RAY ON LIGHT PCB
The X-RAYON warning light assembly
(schematic no. 5919-0184) is used to
provide a visual indication that X-rays
are being produced. This light is a
safety requirement and is part of the
interlock system. No X-rays are
produced without the light being lit.
The light is a 6-inch fluorescent tube.
The AC voltage used to power the light is
converted from 12 VDC. A hex CMOS
inverter UI is used as an oscillator and
driver for QI and Q2. These transistors
drive transformer Tl which produces the
AC voltage for the light. A capacitor C6
limits the power to the light. An
inductor LI limits the current heating
the filaments and produces high voltage
spikes to break down the gas inside the
light. causing the light to turn on. A
phototransistor Q3 is used to determine
that the light has lit.
TO PREAMP
t
N-TYPE Si
.J--------- LITHIUM
+ + _ COMPENSATED
- -:I ,. \I
REGION
'>-,l-+'
I ~ __- P-TYPE Si
~
1
SCHOTIKY
DETECTOR BIAS
BARRIER
CONTACT
(200 )( GOLD)
X-RAY PHOTON
Figure 4.3 Diagram of Si(Li) detector
DETECTOR
The Si(Li) detector is a layered structure
in which a lithium-diffused active region
separates the P-type input side from the
N-type output side (see Figure 4.3).
Under a reverse bias of approximately
600 Y, the active region acts as an
insulator with an electric field gradient
throughout its volume. When an X-ray
photon enters the active region of the
detector, photo-ionization occurs as an
electron-hole pair is created for each 3.8
eY of photon energy.
In the X-ray spectrometric region of I to
20 kY, silicon detectors have excellent
efficiency for converting X-ray photon
energy into an electric charge. These
charges are then fed into a field effect
transistor for highly sensitive detection.
Physically, in order to protect the Si(Li)
detector. both detector and FET are
mounted in a unique microphonic
absorber and cooled by a cold finger
from the liquid nitrogen dewar.
4-6 TheQry of Operation
PREAMPLIFIER
The pulsed optical preamplifier is shown
in Figure 4.4 and schematic no. 50500-02.
The FET and the amplifier are in a
negative feedback configuration. C
r
acts
as the integrating capacitor. Output A is
proportional to the integrated charge;
thus it looks like a staircase. In order to
reset the output to zero, an optical
feedback loop is used. When the output
exceeds a certain value, the LED in the
detector assembly is switched on to
discharge the gate of the FET and thus
reset it to zero.

IIr-:=::=---,
RESET
BIAS
CIRCUIT
LI ---'
SI(U) PREAMPLIFIER
DETECTOR
Figure 4.4 Pulsed optical preamplifier
BIAS SUPPLY PCB
The bias supply PCB (schematic no. 5919
0189) consists of a detector bias supply, a
detector protection circuit. and a liquid
nitrogen level monitor.
Detector bias supply
The heart of the bias supply is a bridge
oscillator whose amplitude is voltage
controllable. This oscillator, consisting
of amplifier U5 and its associated
components C20. C23. R34, and R43,
determines the operating frequency,
which is nominally 25-30 kHz. The
oscillation amplitude is determined by
the feedback network consisting of CR5.
CR6. R21, R23, R33, and QI. A variable
resistor. R20, is used to calibrate the gain
of the oscillator to a nominal value. FET
QI functions as a voltage variable
resistor and allows the oscillator
amplitude to be varied by a control
voltage from the stabilizing feedback
network.
Transistors Q8 and Q9 provide the power
gain necessary to drive a voltage
multiplier circuit, consisting of TI. C2
C8, CRl-CR4, and R16-RI8. This circuit
converts the oscillator output to -1000
VDC. The desired detector bias voltage
is selected by connecting resistor R3 to
the appropriate tap on the voltage
divider formed by resistors R5-R15.
Thus the detector bias voltage is jumper
selecta ble.
U3 and its associated components form a
voltage stabilizing feedback network
which compares the multiplier output
voltage with a reference voltage. Any
deviation from -1000 VDC produces an
error voltage which changes the oscillator
amplitude to correct the deviation. A
variable resistor R26 is adjusted to set
the output of the error amplifier U3 to
its nominal value when the multiplier
output is -1000 VDC. Thus the bias
voltage is also very stable, and has very
low ripple.
Protection circuit
The protection circuit is designed to
guard the input FET against damage
caused by system warmup due to loss of
liquid nitrogen. vacuum failure or
electrical transients, or by improper
system operation and installation. This
circuit monitors the detector leakage and
disables the detector bias if the current
exceeds safe limits, regardless of the
origin of the high current.
The magnitude of the leakage current is
deduced from the preamplifier reset
pulse rate. as it is proportional to the
current. The reset pulses are averaged by
an R-C integrator. R45 and C35. If this
average value exceeds a predetermined
limit, the output of U7 switches to zero
volts and the output of U6 switches high.
A high output from U6 turns off the
front panel LED and stops the oscillator
by switching Q2 on. When the excessive
leakage current stops. the output of U7
switches high and U6 provides about a
one second delay before the oscillator is
restarted.
Liquid nitrogen lenl monitor
The liquid nitrogen level monitor
provides a visual and an audible alarm
whenever the detector dewar needs
refilling. When the liquid nitrogen level
falls below the sensor. the sensor
resistance increases. UB senses this
increase and its output switches high.
A stable oscillator U9 begins to operate
and flash the front panel LED. If the
ALARM MUTE switch is pushed, Q7
turns off and Q6 turns on. Since Q7 is
now held turned off by Q6, the audio
alarm is turned off but the LED
continues to flash.
If the system does not have a LN sensor,
the jumper block should be connected
across E2. This disables the alarm
circuitry. The LOW LN light should be
on.
When the dewar is refilled, the output of
U8 switches low, thus stopping the
oscillator U9.
48 Theory of Operation
PULSE PROCESSOR PCB
The pulse processor PCB is shown in
schematic no. 5919-0190. Its functions
are described with the help of the block
diagram in Figure 4.5. while Figure 4.6
shows the signals at various test points on
the board.
Overview
The pulse processor PCB is a
sophisticated X-ray signal processing
circuit which provides linear
amplification, noise filtering, and pulse
pile-up rejection. This combination of
functions is an essential prerequisite for
achieving accurate and rapid X-ray
analysis.
The pulse processor incorporates time
variant filtering which is a significantly
different noise reduction technique
compared to the Gaussian shaping used
in conventional X-ray amplifiers. Time
variant filtering provides superior noise
filtering without a penalty in count rate
performance. This means a narrower
spectrum peak width, which is
particularly important for low-Z element
analysis. Three different signal
processing times can be selected. This
gives the operator a convenient means of
optimizing the tradeoff between energy
resolution and data output rate.
Special circuits are incorporated to
reduce spectral distortions. Baseline
stabilization reduces baseline shift with
count rate and temperature to a
negligible amount. Background and false
peaks are reduced by the pulse pile-up
rejector. ThiS circuit incorporates a fast
and slow channel to produce effective
pileup rejection at high count rates and
at [ow energies.
A unique feature of the pulse processor
is the ability to abort unwanted signals
before they are fully processed by the
time variant filter. When this feature is
employed, the analysis rate of the desired
portion of the spectrum is increased.
Controls and Indicators
The pulse processor PCB presents a
number of adjustments (gain, coarse and
fine calibrate, fast discriminator, zero)
and indicator lights (high dead time,
pulse amplifier reset) that are acceSSible
on the front panel of the PCB module or
via the system/PHA status screen (count
rate range). These controls find use in
the various adjustment and test
procedures described elsewhere in this
manual.
GAIN
This is a switch which acts as the coarse
gain selector of the amplifier section. As
the 1,2,4 labels indicate, the gain
change between positions is a factor of
two and the total range is four.
The appropriate setting of this switch
depends on the X-ray energy of interest
and the gain of the detector preamplifier.
COARSE and FINE CAL/BRATION
These are multi turn pots which allow
continuous adjustment (hence, exact
calibration) of the spectrum with the
analyzer's energy scale.
The "coarse calibrate" pot varies the gain
over a 2.4:1 range which provides an
overlap in amplification ranges when the
GAIN control is switched.
The "fine calibratc" pot varies the gain
about 10%. It provides a fine adjustment
to facilitate exact energy calibration.
Specrrace 5000 Technical Manual
4-9
AMP
HIGH
LEVEL
DISC
022
017
X1
o
TP4 TP3

Theory of Operation
COARSE FINE
TP2
600n$
DELAY
TP6
r- ___.J
800 os
Figure 4.5 Pulse processor PCB
FAST DISC ZERO
The function of the fast discriminator is This is a pot which provides a means of
to detect both the occurrence and the adjusting the output voltage which
time of occurrence of an X-ray signal. corresponds to zero energy.
This information is used to start the PA RESET
processing of each signal and to detect
pulse pile-up. This is a light which flashes each time
the detector's pulsed optical preamplifier
The FAST DlSC pot varies the threshold resets. The rate of flashing is
level of the fast discriminator circuit. proportional to the number of X-rays
The threshold is set just above noise level detected per second and thus gives an
during initial calibration and rarely indication that the detector is operating.
needs to be adjusted.
Theory of Operation 4-10
HIGH DT
This is an indicator light which is lit up
when the input count rate exceeds the
value which produces the maximum data
output rate at the currently selected
count ratc range. It is a visual indicator
to the user that the input count rate
should be reduced or a higher count rate
range selected.

TP'\L _

BG-U--------
TP3
TP4 -- -
TP5 -----r-
TPS-----
Figure 4.6 Pulse processor test points
Fast discriminator
A dual channel fast discriminator (U4)
develops fast timing pulses from the
input signal. These pulses initiate signal
processing in the time-variant filter and
provide timing information for the pulse
rejection logic. The fast discriminator
output is available on the module's panel.
The dual fast discriminator consists of a
variable gain amplifier with two delay
line shaped outputs. One is 200 osee
wide and the other is 800 osee wide.
Each output signal goes to a voltage
comparator (US, U8) which produces an
output pulse when its input signal is
above a threshold voltage. The 200 osee
signal channel produces the FFD signal
and has very short pulses. so pile-up is
not a problem. However, the noise in
this channel limits the useful energy
threshold to about 2 keY. The 800 nsec
channel generates the SO signal and has
less noise. so its threshold is below I keY.
The signals from both channels are
combined in such a manner that only one
output signal. FD, occurs for each X-ray
exceeding the threshold of either channel.
These output pulses are all approximately
200 nsec wide. The advantage of this
technique is that it produces a low
energy threshold and a short pulse pair
resolution.
TimIng section
The timing function controls the time
variant filter and baseline stabilizer, as
shown in Figure 4.7.
..QJL
I I I I I I I I I I I I I I I I I I I I I 'B
I'2\
us us
2T 3 45678 9 10 11 12 13 14151617 18192021 22T I
U27 pin 11
RE-.... I L
PE_ n L
--.J AMP BUSY (U20 pin 4) ABY L
----c.......J BG IU2B pin 2; 0 Q7 OFF)
---, INTSW 10 = Q22 OFF)

BLRflNT U25 pin 3)
o 0160FF
I U40 pin 8

---.JRESET GATE I.. 1 = 08 ON
-JU30 pin 5 L
LGS U

R
INTEGRATE I ----I-o =,"8=
1,8 us
SYNC
SAMPLE = 1/2 I
LOW 1=38.4 us
MED 1=19.2 us
HIGH 1=9.6 us
Figure 4.7 Pulse processor timing; count rate"" high
Pulse rejection
The pulse rejection circuit blocks If the overlap of the two pulses occurs on
distorted signal pulses from the the tail of the first, only the second pulse
amplifier. These pulses can occur when is rejected.
the amplifier is recovering from a reset
of the pulsed-optical preamplifier; they If the overlap occurs before the peak of
also occur when pulses overlap in the the first pulse, both pulses are rejected.
main signal channel of the amplifier:
The time relationship of the signal pulses
is derived from the output of the dual
fast discriminator.
Count rate ranee
The count ratc range is a parameter
selected in the system/PHA status menu.
It controls the processing time for an
input pulse, and therefore allows the user
to optimize the energy resolution and
data collection rate for the particular
application. The LOW setting provides
the longest filtering time which results in
the best energy resolution of the
spectrum peaks (measured as FWHM, full
width at half max). However, the data
output rate is limited by the long
processing time of each signal. The MED
and HIGH settings progressively reduce
the processing time and thus increase the
data output rate -- at the cost of
degrading the resolution.
For continuous X ~ r a y input, the
maximum data output rate is 10k counts
on the LOW setting, 20k on MED and 40k
on HIGH.
Linear signal Dath
The input to the pulse processor from the
preamplifier is a series of Dositivegoing
steps whose amplitude corresponds to
approximately I mV/keV. The pulse
processor must transform this signal into
an analog signal suitable for conversion
by the ADC.
U I provides a gain of ~ 4 . It feeds a 600
nsec delay line U2. The output at U2
connects to U6. U6 provides a gain of
approximately -2. U6 drives a low pass
filter whose time constant is changed by
the LOW, MEDIUM, or HIGH count rate
selected by the ADC micro PCB.
The output of the low pass filter
connects to UIQ which drives the
baseline restoring circuitry which
includes Q16. This is followed by gain
buffer VII with a gain of +5. VII
drives the gain selection switch and
amplifier U12. The other input at UI2 is
from U14. U14 combines a correction
signal (Z-COR) from the ADC micro PCB
and a reference level (ZERO) to produce
a baseline stabilization signal.
Q17. Q18, and UI3 form the integrator
gate circuitry. The integrator, U16,
provides the output signal (AMP) to the
ADC located on the ADC micro PCB.
The L. M, H control selects different
integration components on U16.
ADC MICRO rCB
Onnlew
Figure 4.8 is a general block diagram of
this board. The full circuit is shown in
schematic no. 5919-0188.
The processor is an 80186 with 2Kxl6
bits of ROM and 16Kxl6 bits of dynamic
RAM
The ADC is a 100 MHz Wilkinson type,
which digitizes the analog outputs from
the pulse processor PCB. The resulting
data are stored in the RAM
Other RAM, 4Kx8 bits, is used to
generate X-ray mapping pulses.
One of the functions of the 80186 is to
monitor and correct baseline drift in the
pulse processor. The 80186 instructs the
pulse processor to sample its baseline
periodically. The resulting ADC
conversions cause a DMA operation into
channell of the 80186 (normal data
conversions use DMA channel 0). The
80186 can then monitor the resulting
values and control a 12-bit DAC which
prov ides zero correction.
The separation of valid data events and
baseline sample events allows the 80186
to determine the dead time.
APe innuts
The analog input circuits of the AOC are
diagrammed in Figure 4.9.
The output from the pulse processor PCB
is the AMP signal. This 0-4 volt signal is
the input of voltage follower U73; the
output connects to the pulse stretcher.
The ILG signal from the pulse processor
PCB is used to generate a peak detect
(PO) signal at U93 pin 13. On the
trailing edge of PO, pulse stretcher busy
flip-flop U92 is set. Signals PSB and
IPSB are used to trigger logic circuits
which effect a conversion.
Pulse stretcher
Amplifier U74 and transistor Q3 form
the pulse stretcher for the ADC. The
amplifier is unity gain voltage follower,
modified to perform pulse stretching.
The incoming positive pulse is applied to
U74 pin 9. The amplifier loop is closed
by means of a diode from the collector of
Q3 to the inverting input of the
amplifier at U74 pin 3. The stretcher
capacitors are also connected at pin 3
through a small resistor. As the input
signal goes positive, the diode conducts
and pin 3 follows the input up to peak
amplitude. As the signal passes through
peak amplitude, pin 3 remains at peak
voltage due to the stretcher capacitors.
At this time the loop opens because of
the polarity reversal at the diode which
normally closes the loop. The collector of
Q3 swings negative with respect to
ground.
4-14
FD INP
FROM
PULSE
AMP
FROM
PULSE
UT
16-BIT
SCALER
PROCESSOR
100 MHz
D D O ~ > -
0015
ADC
H:f
PROCESSOR
[)J
I
GAIN DAC
LATCH
ALE >
I
f
/ MO- <::
AA15
BUS
TRANSCEIVER
2Kx 16 BIT
ROM
,
-
OUT1.0UT8
MAPPING OUTPUTS
rC>
1
16Kx16BIT
DYNAMIC R ~ M
,
MAOMAl
~
T
MULTIPLEXER
,
TRISTATE
LATCH
4K x 8 BIT
RAM
BUS
TRANSCEIVER
I
DO
~ D15
I MHz
~
80186
PROCESSOR
Figure 4.8 ADC micro PCB
Theory of Operation
ZCOR
""- TO
/PULSE PROCESSOR
ZERO DAC
REFRESH
FA1FA12
TO DATA MEMOR Y
0000015
TO DATA MEMOR Y
Theory of Ooeration 4-15
VOLTAGE
FOLLOWER
RESET
B
AOC BUSY
FLIP-FLOP
U96
PULSE
STRETCHER
LINEAR
GATE
02
AMP __._-l
PULSE STRETCHER BUSY
PO
FLIp FLOP
U92
ZL
B U94 C[j5
L G - - . _ ~
STRETCHER
CAPACITOR
(2000 pfj I
RFF
CLAMP
01
CLAMP
07
CURRENT
SWITCH
05.06.04
ZERO LEVEL
BIAS COMPARATOR
ZL
'------< CSC
CURRENT
SOURCE
U79
Figure 4.9
Rundown cutrent
After PSB goes positive, a constant
current is applied to the stretcher
capacitors C97. C98 to generate a linear
discharge. The magnitude of this
rundown current is determined by U79, a
DAC08. The amount of current is also
controlled by DAC un and pot FS.
Rundown begins when CSC goes to the I
(one) state. This turns transistor 4 off,
and, in turn, pinches off FET 5. Because
transistor 5 is no longer sinking the
output from the current source U79. the
voltage swings negative until FET 6 turns
on.
ADC input circuits
The linear rundown current remains
switched on until the address (as
converted) is stored. CSC goes to the I
state after the PSB flip-flop is set. CSC
returns to the 0 (zero) state when the
ADC is reset.
100 MHz oscillator
In the 100 MHz oscillator, transistor 12 is
the active device. The crystal connects to
the base of the transistor and the 1k
resistor at the base keeps the transistor
biased in the linear region. The 100 MHz
crystal is a fifth overtone type; the
oscillation at the proper overtone is
determined by the resonant circuit at the
collector. The oscillator's output is AC
coupled into one input of a two-input
EeL NOR gate UIOO. The DC bias at
this input is determined by another gate
in UIOO having its output connected back
to its inputs. This causes its outputs to
set at about 3.8 volts or approximately
the middle of its output swing. The
remaining gates in UIOO buffer and gate
the 100 MHz to the scaler.
Address scaler
The first two stages of the address scaler
are 10131 ECL series and the remainder
are low-power Schottky TTL. The
address scaler is 12 bits in length plus a
13th bit which is described later.
U99 is an ECL type 10131 for 100 MHz
scaling. U98 and transistors 8-11
translate the ECL levels to TTL levels
for readout and/or further scaling in the
eleven following TTL scaler stages.
The address scaler is composed of two
flip-flops described above, followed by
II flip-flops the 7400LS TTL family.
Note that the output of the third address
scaler, the first scaler, the first Q output
in U86, connects as carry to two flip
flops. One flip-flop of the two is address
scaler stage A3. The other f l i p ~ f l o p U91
is the current source control (CSC) flip
flop. This flip-flop is set when the carry
from pin 5 of the third stage switches
positive.
Con"erslon timing
Figure 4.10 shows the timing of the
major signals in the data conversion
sequence.
The incoming AMP signal goes to the
unity gain voltage follower. The output
of the voltage follower connects the pulse
stretcher circuitry through the linear gate
Q2. When /LG from the pulse processor
goes negative, the linear gate Q2 is
turned off, and the signal is connected to
the stretcher capacitors.
After /LG returns positive, a SO nsec
peak detect pulse (PO) is generated at
U93 pin 13. This signal triggers the PSB
flip-flop, setting it to the one state. /PSB
sets the AOC busy flip-flop and forces B
positive. B is differentiated at C147, and
the resultant pulse sets the clock
synchronizing flip-flop U I 01.
The output of this flip-flop switches low,
and the clock is now connected to the
input of the first address stage and it
begins to scale. Four pulses later, A2
switches positive and sets the esc flip
flop. esc turns on the rundown current.
Since the address scaler started with a
negative count of 96, after 96 clock
pulses the address stages are all in the I
state. One clock pulse later, the address
scaler is in channel O.
This offset serves two purposes. First,
the turn-on of the rundown current is
synchronized to the clock by scaling 4
address-advance pulses before setting the
esc flip-flop. For good channel profile,
it is essential that the start of rundown
current be well synchronized to the clock.
The second function of the offset is to
provide the ADC with settling time. At
PD time, several circuits are triggered
and several logic transitions occur. The
0.96 usee period before reaching address
zero allows settling time.
INPUT /1L- _
STRETCHER
P.:::S.:::B --..JFSET BY PO t-RESET BY ZERO LEVEL
B FSETBY PSB
OUTPUT OF
FIRST STAGE OF AAAAAAAA AA
ADDRESS SCALER/yVVVVVVVYIL- _
CSC
-='
F4TH
--J ADDRESS ADVANCE
I.N..:.G=- P_U_L_SE_I _-lii1f-_-r'----
H
ING 0

STORE
I
It 1 _

PCS5R

Figure 4.10 ADC timing diagram
The conversion process continues until Store. DMA
the voltage at the stretcher capacitors
reaches the zero level bias. With the At this time an address has been
small propagation delay from the zero generated. Whether the conversion was
level threshold, ZL returns to a logic 0 caused by a baseline sample command, or
and resets the PSB flip-flop. The by a valid pulse processor event, was
transition of PSB to zero starts the determined at LG time. If the pulse
scaling of clock pulses into the clock processor output is the result of a
synchronizing flip-flop. The output of baseline sample command, BS at U89 pin
the flip-flop switches high in 2 is positive when /LG goes negative, and
synchronization to the clock and gates V89 pin 5 reflects this condition.
off the clock to the address scaler.
The STORE signal at V89 pin 9.
therefore. generates either a DMA
channel 0 or channel 1 command,
depending on the condition of V89 pin 5.
Normal ADC conversions use DMA
channel O. while baseline sample
conversions use DMA channell. In both
cases, the presented address is used as the
value of the source pointer PCSS-R.
Reset circuit
When the 80186 processor starts the DMA
transfer {channel 0 or I}. jPCS5-R goes
negative and the ADC value is enabled
onto the DDO-DD I S lines. jPCSS-R also
clears the store flip-flop. When jPCSS-R
returns positive, U90 pin 8 goes positive
and generates the 300nsec RESET pulse.
This pulse resets the ADC busy flip-flop
U96 which, in turn. resets the esc flip
flop U9I.
ZERO and GAIN DACs
The ZERO and GAIN DACs are used to
digitally control the amplifier gain and
zero (baseline) offset. The latches US6,
US7 and J2-bit DAC U77 can produce a
oto -7 volt signal at U78 pin 6. This
output controls DAC U79, which
determines the rundown current at the
stretcher capacitors.
Latches US4, U55 and 12-bit DAC U7S
generate ZCOR. This signal is fed to the
pulse processor PCB and has an
approximate range of 0 to ~ 7 volts. If
zero drift is detected by the 80186
processor, this DAC compensates for the
drift.
Fast discriminator scaler
When the pulse processor PCB detects an
event, an FD pulse is generated. A scaler
(U65, U5J, U53) is used to count these
events and determine the amount of dead
time.
/FDLD transfers the total count from the
scaler into the latches U50 and U52. The
latches can be read by the 80186 by
/PCS2-R.
Dynamic RAM
The 80186 has 16K x 16 bits of dynamic
RAM associated with it (U32-U35). This
RAM is accessed by lower memory chip
select /RAM at U9 pin 33. Figure 4.11
shows RAM cycle timing.
When normal access to this memory is
required. /GRAM at U49 pin 6 goes
negative. /CLK at U37 pin 3 forces
SRDY-I low at U23 pin J2. This causes
a wait state to be inserted in the memory
cycle timing.
/INREQ also goes negative, which forces
U62 pin 12 positive. When CLK goes
positive, QA goes positive. At this time,
address lines AAI-AA8 are selected at
U30 and U31 as the RAS (row) address
MAO-MA7. When QA goes positive. /RAS
is generated at U61 pin 8.
At the trailing edge of CLK. SEL at U63
pin 8 goes positive. This forces AA9
AA14 to be selected at U30-U31. When
/QB goes negative at the next CLK time,
the column address is latched at CAS
time.
Refresh timing is generated by timer 0 of
the 80186. This timer is set up with a
period of approximately IS usec.
Therefore, U63 pin 5 goes positive and
genera tes a RFSH every 15 usee. The
address where the refresh cycle is run is
determined by scaler U47. Us value is
enabled onto the MAO-MA7 lines through
U46.
Specuace 5000 Technical Manual
Theory of Operation 419
T4 ---I--
T1
--1 I
1....-.../
00/ \\\
\\
\\
\\
\\
Figure 4.11 Dynamic RAM timing
Communications bus
The ADC micro PCB communicates with
the computer through registers and ports
located on the data memory board. The
ADC micro PCB also reads and writes the
data memory through this communication
bus physically located on the edge of the
PC board.
U19, U21, U22, and U38 generate signals
(lRQB, /BSY, etc.) used to gain access to
the communication bus. U14 and UI5
determine the type action the data
memory PCB takes; U 16, U 17 are the
data line transceivers.
Two interrupts are also used in the
communication process. /IPHA1 is used
during the download process while
/IPHA2 is used during normal
communication of instructions, values,
etc. These interrupts are controlled by
bit 3 of 772660 and are generated on the
data memory PCB.
4-20 Theory of Operatjon
Processor
The 16-bit 80186 microprocessor is
described fully in the OEM literature.
The following table of pes (peripheral
chip selects) is presented as an aid to
understanding the ADC micro PCB.
PCS Address Name or Function
PCSO
PCSI-O
PCSI-I
PCSI-2
PCSI-3
PCS2
PCS4-0
PCS4-1
PCS4-2
pcss
PCS6
8000
8080
8082
8084
8086
8100
8200
8202
8204
8280
8300
ADC Status Register
bits value/meaning
0,1 External outputs /GI, /G2
2,3 Pulse processor count rate control
4 ..0 Transition kill LN alarm
5 ... 1 map out enable
6 = I ADC enable
7 -0 clear fast discriminator scaler
after read (PCS2)
8 -I high voltage ON
9 -1 high dead time in pulse processor
10 -0 low LN level
I I -1 sample baseline
12-14 Read external inputs
15 Preamp reset indication
GAIN DAC (Write Only)
ZERO DAC (Write Only)
Mapping RAM input code (write only)
Bit 0=1 generates pulse out (write only)
Fast discriminator scaler (read only)
LSI/micro communication port
Data memory latch (upper 8 bits)
Write only ~ LSI can read at 772660 bits 8-14
Read only ~ source of DMA-O and DMA-I operations
Mapping address
Theorv of Operation 4-2 I
DAIA MEMORY PCB
The data memory PCB is shown in
schematic no. 5919-0181. It provides
memory for storing the spectra that are
being collected. And it provides the
communication path between the
computer and the system unit. This
board occupies one expansion slot in the
computer.
Memory
The data memory is organized as 4K by
24 bits (three bytes). Both the ADC and
the computer can access this memory.
The ADC accesses it 16 bits at a time,
reading or writing to the two least
significant bytes. In the computer the
contents of this data memory are mapped
into its RAM space as a 16Kx8 block.
Starting at the beginning of this block,
the first three bytes of RAM correspond
to the first 24-bit data memory word.
The fourth byte does not exist and
reading it returns zeros. This pattern is
repeated for the entire block of RAM
The computer accesses the RAM one byte
at a time.
Since both the ADC and the computer
can access the data memory, a bus
arbitration circuit is used to prevent
them from accessing it at the same time.
When the ADC accesses the data memory,
it generates a memory request, and then
waits until it receives a grant from the
arbitration circuit. When the computer
accesses the data memory, the I/O
CHANNEL READY line goes low,
causing wait states to be generated, until
the arbitration circuit sets it high again.
Whichever has access to the memory will
continue to have access to the memory
until completion of the read or write
cycle. When both the ADC and the
computer try to access the memory
within one clock cycle, the ADC is
granted access first.
When the ADC reads or writes the two
least significant bytes of the data
memory, the most significant byte is
latched into a register or written into the
memory from the same register. This
register is located in the ADC I/O space.
When the computer reads the least
significant byte of the data memory, the
two most significant bytes are latched
into a pair of registers. These two
registers are read when the computer
reads the next two memory locations.
When the computer writes the least
significant byte of the data memory, the
two most significant bytes are written
into memory from two different registers.
These two registers are written to when
the computer writes to the next two
memory locations.
Communication
The ADC and the computer communicate
with each other through registers located
in their I/O spaces. The ADC uses
interrupts for handshaking; the computer
employs polling.
Whenever the computer sends a command
to the ADC, it writes two bytes, which
represent the command, into a pair of
registers. This generates an interrupt to
the ADC that tells it the computer has a
command for it. The interrupt is cleared
when the ADC reads the two bytes. The
computer will write into the registers
only after it has determined that the
interrupt has been cleared.
Whenever the ADC sends data to the
computer in response to a command, it
writes two bytes into another pair of
registers. This sets a bit in a register the
computer uses for polling. When the
computer sees that this bit is set, it reads
the information sent to it. This action
clears the bit that was set. The ADC also
sends status information to the computer.
This is a byte written to its own register
and sets its own polling bit.
CHAMBER CONTROLLER PCB
The chamber controller PCB is shown in
schematic no. Figure 4.12 is a
simplified diagram of this board.
Overview
The chamber controller PCB is based on
an 8031 microcontroller. Communication
with the computer is by means of a 4
wire RS-232 interface using RxD. TxD.
DTR and DSR. The program memory is
stored in a 4K x 8 EPROM. An 8282
octal latch is used to separate the address
for the EPROM. Two 82555 and a
74LS139 are used to increase the number
of I/O lines on the board.
Auto-reset
In order to ensure that the
microcontroller will recover from a
random software error, an automatic
reset circuit is used. Should a software
error cause the auto reset circuit to be
serviced too often or not often enough,
the auto-reset circuit generates a reset
(RST) to the microcontroller. The circuit
senses the voltage on a capacitor C8
being charged to +5V. Either one of two
comparators will generate RST if the
voltage on C8 is too high or too low. A
third comparator sends AZRO to the
microcontroller to indicate that the reset
circuit requires service. Service consists
of AZRI being sent to the reset circuit,
which discharges capacitor C8.
Initialization
When the chamber controller PCB is
initialized, the filter wheel and the
sample tray are rotated until they are in
the home position.
Vacuum sense and control
The status of the vacuum is determined
using a thermocouple vacuum sensor
mounted in the chamber. One of the
wires is heated with an AC current,
resulting in a DC voltage between the
two wires. As the vacuum increases.
there is less air to conduct the heat from
the wire. And as the temperature of the
wire increases. so does the voltage
between the wires.
The AC current is supplied to the
vacuum sensor by transformer Tl. Ul4
(a 555) generates a square wave for Q23,
which drives Tl. Voltage regulator Ul3
is used to adjust the voltage supplied to
TI, which regulates the AC current to the
vacuum sensor. This is how the vacuum
circuit is calibrated. The op-amp UJO
amplifies the signal from the vacuum
sensor by lOa, filters it. and sends
VACOK to the microcontroller when the
signal reaches the level set by R84.
Stepper motor conCro!
The chamber controller PCB can control
three stepping motors. One motor is used
to turn the filter wheel. and another to
turn the sample tray. The third motor.
the V-axis motor, can be used with the
sample tray motor to drive an X-Y
sample table. Each one shorts a line
(SIN, YIN) to ground when it is plugged
in. This informs the microcontroller of
its existence. The circuit used to drive
each motor is identical. The motor
windings are driven by MOSFET
transistors. The inverters serve to buffer
the signals from the 8255. The two
NAND gates ensure that the motor is
driven only in excitation
mode.
Spec trace 5000 Technical Manual
AUTO
RESET
RS232
ATMOSPHERE
CONTROL
HIGH
VOLTAGE
CONTROL
ABA12
AOA7
LATCH
~
XRAYS ON
DOD7
DOD7
CS
DOD1

MUX
INTERLOCK
CONTROL
STR
WRI
DATA CONFIRM
BIAS DETOK
SUPPLY
FRONT
PCB
PANEL
S-IN
MOTORS
F-IN FILTER
FILTER WHEEL
PRESENT
0104 MOTOR DRIVE
Y-HOME
S-HOME
F-HOME
SAMPLE
SAMPLE TRAY
0104
MOTOR DRIVE
VAC OK Y AXES
Y-AXES
SENSE 01-04 MOTOR DRIVE
Figure 4.12 Chamber controller PCB
RST B031
AZRO
AZR1
ENABLE
DO
TxD D7
DSR
DTR
RxD
AO,A1
8255
Y-IN (2 ea.)
HOME
SENSE
VACUUM
4K
EPROM
Home condition
A phototransistor and an LED are used
to tell the microcontroller the position of
each motor. The home position is
indicated when a tab interrupts the beam
between the LED and the phototransistor.
In each case a comparator buffers the
signal from the phototransislor (HOME
SAMPLE, HOME FILTER, HOME Y) for
the microcontroller.
High voltage control
The chamber controller PCB controls the
X-ray power supply controller PCB via a
3-wire serial interface. The three control
lines are DATA. WRI, and STR. The
data is send over the DATA line, most
significant bit (MSB) first. The MSB
selects either the voltage or the current
control DACs. The other seven bits set
the value of the selected CAe. The STR
signal indicates a new bit. The WRI
signal writes the value into the DAC.
Sample spinner
The sample spinner is an AC synchronous
hysteresis motor that is turned on and
off by a solid state relay. This relay is
located on a separate PC board (5911
0010). On the chamber controller PCB, a
signal from U6 (SAMPLE SPINNER) is
buffered by U22 and Q4, and controls
the relay.
Interlocks
Safety features
The safety features implemented by the
interlock circuit provide fail-safe
protection against X-rays being turned
on. In particular, the interlocks provide
the following features:
All interlocks must be closed for X-rays
to turn on. If any of the interlocks is
opened, the Xrays are turned off
immediately.
The X-RAYS ON warning light must be
on for X-rays to turn on.
If the interlock circuit is broken, X-rays
do not turn on again until the interlocks
are closed and the analysis sequence is
re-initiated by the operator.
The current that powers the X-ray high
voltage power supply flows through the
interlock circuit. Thus, if the circuit is
broken at anyone of the interlocks, there
is no power to the X-ray tube.
The circuit is designed so that failure of
any of the electrical components can only
cause the Xrays to turn off, not to turn
on.
Double, redundant interlocks are
provided on the sample chamber lid
latch. No Xrays can escape into the
operator work area with the lid closed.
The interlock switches open and turn off
the X-rays if the lid latch fails or is
defeated and the lid is opened.
4-25 Theory of OpeoHiQn
XRAY POWER SUPPLY CONTROLLER PCB
from microprocessor on
chamber control pcb
OPTICAL"
ISOLATOR
12 LV-----' ..
LIGHT ON
(COMMAND)
CURRENT 1--,.--------,--
CONTROL to x-ray power supply
l.-L===t= = -- ---- --..
to warning lamp module
from interlocks

VOLTAGE
CONTROL
to x-ray power supply
confirm
to microprocessor on
chamber control pcb
- Ito x-ray power supply
,----+----'
LIGHT ON
from warning
(CONFIRM)
lamp module
Figure 4.13 Interlock logic on the chamber controller PCB
Command/confirm logic
See Figure 4.13. When the computer
requests the X-rays to be on, and when
all interlocks are closed, +12V is supplied
to the XRAYS ON warning light
module. This is the LIGHT ON
command.
When the warning light turns on. a
phototransistor generates the LIGHT ON
CONFIRM signal. This signal closes a
relay and supplies the current, which has
also passed through the interlock
switches, to turn on the X-ray power
supply. The computer then receives the
CONFlRM signal indicating that the X
ray tube is on.
(Note that the high voltage to the X-ray
tube and the X-tays are not monitored
directly. The X-ray power supply is
energized only if the interlocks permit it.
The only indication that X-rays are
produced is that data are being
collected.)
InterlQck circuit
See schematic nQ. to follow the
+24V tQ the X-ray power supply. The
+24V arrives Qn J2 pin I. and is
CQnnected thrQugh J5 pins 4,5 (which is
the CQnnectQr tQ the X-ray tube), to 13
pin 4. Cable 5101-0183 carries the +24V
tQ the interlocks SI-56, then back through
13 pins 2.3 to J6 pin I on the master
wiring PCB. From there, +24V is
supplied to the chamber cQntrQller PCB
Qn edge CQnnector P I pin 20.
The circuit continues on schematic no.
5919-0162. The +24V is seen as a high Qn
V II pin 5 which fQrces the output of the
cQmparatQr to gQ high, signaling to the
microprQcessQr that all interlock switches
are closed. This high enables the reset of
flip-flop V15. This allows VI5 pin 6 to
go IQw when an X-RAYS ON command
latches the data (VeC) to the Q output.
At this time Ul6 pins 8,9 are low, thus
enabling the ENABLE LAMP signal
which activates the warning light.
Spectracc JOOO Technical M:mual
If any interlock is opened, it causes the
reset of VIS and pin 6 goes high, thereby
shutting off the warning light and the X
rays. A new YS ON request is
required to turn on the warning light.
5919-0184. When the lamp is on. it
illuminates phototransistor Q2. causing it
to turn on. Q3 enables the +SV LIGHT
ON SENSE signal at Jl pin 4.
5919-0162. The LIGHT ON SENSE signal
arrives on PI pin 21 of the chamber
controller PCB. The +SV is seen as a
high on VII pin 7, which energizes relay
Kl.
5919-0161. With Kl closed. +24V is
connected to the master wiring PCB
through Jl pin 17. J6 pin 2 connects to
13 pin 1 on the Xray power supply
controller PCB through cable
completing the circuit to J4 pin I. which
is the only +24V power source for the x
ray power supply.
Communication with the computer
There are three modes of communication
between the computer and the micro
controller over the 4-wire RS-232
interface. Thcy are the command, inquiry
and receive modes. In the receive mode,
the computer receives status information
from the microcontroller. In the
command mode, the computer issues
commands to the microcontroller. The
microcontroller executes the command
and sends a reply to the computer in the
receive mode format. In the inquiry
mode, the computer asks the
microcontroller questions using the
inquiry format. The microcontroller then
replies to the computer using the receive
mode format. The communication format
of the three modes uses ASCII characters.
Inquiry mode
The format of the inquiry mode is:
In this ASCII string. the Q indicates the
question mode represents the character
string used to specify the actual question,
and the <ENTER> (the ENTER or
return" key) indicates the end
of the string. The questions implemented
are:
FUNCTION
F Filter position
S Sample wheel position
y
Y table position
I Interlock status
B Sample spinner status
V Vacuum status
R Air status
H Helium status
L LN status
P X-ray status
QH Kilovolts
QI Milliamps
QKI-QK5 Lid latch. etc.
Command mode
The format of the command mode is:
C*<ENTER>
Here, C indicates the command mode, *
represents the character string specifying
the actual command, and the ENTER key
indicates the end of the string. The
commands implemented are:
FUNCTION
FI-F6 Set filter wheel to pas. 1-6
SOO-S09 Set sample tray to pos. 1-10
BO/BF Turn sample spinner on/off
VO/VF Turn vacuum pump on/off
RO/RF Turn air solenoid on/off
HO/HF Turn He solenoid on/off
PO/PF Turn X-rays on/off
(latch must be locked to
generate X-rays)
CH## Set kV to ##
CI## Set tube current to ##
EZO/EZF Turn interrupts on/off
X Execute previous commands
(except K-commands)
KIF/KIO Lock/unlock lid latch
K20-K50 Turn K2-K5 on
K2F-K5F Turn K2-K5 off
Receive mode
The status-report format for the receive
mode is:
A*<ENTER>
Here, A indicates that the microcontroller
is answering the computer, * represents
the character string specifying the
answer, and <ENTER> indicates the end
of the string. The answers implemented
are:
FUNCTION
F# Filter at position #
S## Sample at position #
y#
Y table at position #
IO/IF Interlocks closed/open
BO/BF Sample spinner on/off
VO/VF Vacuum pump on/off
RO/RF Air solenoid on/off
HO/HF Helium solenoid on/off
PO/PF X-ray tube power on/off
H## High voltage at ## kV
1## Tube current at ## rnA
VW Wait for vacuum
HW Wait for helium
RW Wait for air
NO Option not available
LF All operations done
In the error-report format in the receive
mode, the character string starts with an
E. The error messages implemented are:
EAO Air on
EVO Vacuum on
EHO Helium on
EHI A reset has occurred
EZI I don't understand
ERa Too many characters
INT Interlocks are broken
(EAO,EVO,EHO arise from inconsistent
atmosphere requests).
4-28 Theory Qr Operation
He PROTECTION SYSTEM
The purpose of the helium protection
system is to flush the sample chamber
without having He gas in contact with
the beryllium window of the detector.
Without this protection, He will diffuse
through the detector window, causing
reduced performance and the possible
need for factory repair.
The helium protection system includes a
special detector collimator with a
beryllium window, and a system of
valves that pumps out the space between
this second beryllium window and the
beryllium window of the detector.
Note that if helium flush is not being
used, the special collimator may be
replaced by the standard collimator in
order to obtain improved sensitivity for
low energy X-rays. Changing collimators
will change count rates for all elements
in a given sample analyzed under the
same conditions.
See schematic no. 0110-0601. The circuit
consists of 3 relays, 2 solenoid valves,
and a transformer. The transformer TI
provides 110 VAC power for the two
solenoid valves. Whenever the system
unit is turned on, a +12V signal is
supplied to the circuit. This signal turns
on relay Kl, supplying AC power to the
circuit.
When the sample chamber is filled with
helium, the HELIUM signal is grounded,
turning on relay K3. This relay, when
on, supplies power to the vacuum pump
and turns off power to the air valve
solenoid. This closes the valve and
allows the vacuum pump to evacuate the
helium protection chamber.
When the sample chamber is evacuated,
the VAC signal is grounded, turning on
relay K2. It supplies power to the air
solenoid, closing the valve. It also
supplies power to the vacuum valve
solenoid. This opens the valve and
allows the sample chamber to be
evacuated.
Section 5
INSTALLATIQN
Introduction 51
Site preparation 5-1
Hardware installation 51
Data memory PCB 52
Power supplies 52
Operating system 52
EDXRF 52
EDXRF/FP 53
Diagnostics 53
Unpacking 5-1
Inspection 5-1
Switch settings 5-1
JBM Enhanced Graphics Adapter 5-1
IBM Proprinter , 5-2
IBM diagnostics 5-2
Software installation 5-2
Proof-of-performance tests 5-4
Specrrace 5000 Technical Manual
5-1 Installation
INTRODUCTION
This section describes the procedures that
ensure the successful installation of the
Spectrace 5000.
SITE PREPARATION
Make sure that the facilities where the
Spectrace 5000 is to be installed provide
adequate electrical power and ventilation.
See the system specifications for power
and environmental requirements.
In addition. because the system uses
liquid nitrogen, the room where it is
operated and the storage room where
reserve dewars are kept must both be
adequately ventilated to remove the boil
off.
HARDWARE INSTALLATION
UnPacking
If possible, save the packing materials
for re-use when components must be
returned for repairs.
Insnection
Verify that all PCB assemblies are
plugged in and seated properly.
Verify that the interlock cables are
installed, and that the microswitches are
held closed by the flange or door they
contact.
Remove any tape or other means to
defeat the interlocks.
Verify that fuses of the correct rating
are installed.
Verify or fill in the serial numbers on
the "system report" form.
NOTE: Parts of this form are designed to
record data from the test procedures, and
are referred to as the "maintenance log
sheet."
Switch settings
In order to make the computer
compatible with the EDXRF program,
switches on the computer and printer
must be set correctly.
IBM Enhanced Graphics Adapter
SWI 1,4 OFF (OPEN)
2,3 ON (CLOSED)
Jumper PI, next to the 9-pin connector,
should be between pins 1 and 2.
Jumper P2, located next to SWI has no
jumper.
Jumper P3, located next to C32, should be
between pins 1 and 2.
Speetrace 5000 Technical Manual
5-2 Installation
IBM Proprinter
On the printed circuit board, located
under the access cover, find a set of six
switches. With the power turned off, set
switches 15 OFF aod 6 ON.
Data Memory PCB
SWI (Memory Address)
1,2,6 OFF
3,4,5,7,8 ON
SW2 (I/O Address)
1,2,5,6 OFF
3,4,7,8 ON
Set jumper labeled (TPl) towards C12.
Note: Computer systems not supplied by
Spectface Instruments must have all
hardware options correctly installed
using the SETUP option on the IBM
diagnostic disk.
Power supplies
Verify that the power supply output
voltages are correct. (See the power
supplies test procedure.)
IBM diaEnostics
Boot the system from the IBM diagnostic
diskette in drive A. Run all the
diagnostics on the menu.
SQFTWARE INSTALLATIQN
The instructions in this section assume
that the reader is familiar with the basics
of using DOS commands and calling DOS
files. See the IBM DOS manuals for
instructions.
The notation <ENTER> means press the
ENTER (return) key. As DOS commands
execute only when this key is pressed, use
of this key is shown only when needed to
avoid ambiguity.
Also, the notation C> is used to indicate
the DOS prompt (and currently active
disk drive). It is not to be typed when
entering DOS commands.
Operating system
The process of installing DOS onto the
hard disk and of making back-up
diskettes are documented in the IBM DOS
manuals.
Make sure that DOS version 3.1 or higher
is installed on the hard disk.
Two files, AUTOEXEC.BAT and
CONFIG.SYS, are loaded onto the hard
disk when EDXRF is installed. If these
files already exist on the hard disk,
rename them before installing EDXRF.
Make changes, if any, in these files after
installation is complete. Again, see the
IBM DOS manuals for instructions on
editing the AUTOEXEC.BAT and
CONFIG.SYS files.
EDXRF
To install EDXRF and other supporting
files onto the hard disk, proceed as
follows:
Change the default to drive C:
C:<ENTER>
5-3 InstallatiQn
Change tQ the rQQt directQry:
C>cd \
EDXRF is distributed Qn tWQ diskettes.
Place diskette" 1 Qf 2" in drive A, and
type:
C>a:install
The system cQpies the files, then issues a
prQmpt IQad diskette "2 Qf 2" in drive A
and cQntinues cQpying files Qnto drive C.
When the prQgram is finished, the system
displays the C> system prQmpt.
Now re-boot the system by pressing the
CTRL ALT DEL keys simultaneously.
To run EDXRF, type:
C>edxrf
EDXRF/FP
This program is distributed on a 1.2 MB
diskette. Place it in drive A and prQceed:
C>3:install
The system copies the EDXRFIFP
prQgrams and data files to the C: drive
and returns the system prompt when
finished.
Re-boot the system by pressing the CTRL
ALT DEL keys simultaneQusly.
To run EDXRFIFP. type:
C>edxrf
Diagnostics
The test diskette contains tWQ sets of
files. one for a 30 kV system. another for
50 kY.
At the user's or technician's option, the
contents of the test diskette need be
copied Qnto the hard disk. Note that all
test procedures (Section 9) call for using
the test diskette.
However, the contents of the test diskette
could be loaded on the hard disk during
installation. either for the purpose of
having a back-up copy of the files, or of
making use of the faster execution from
the hard disk. Proceed as follows.
Place the test diskette in drive A.
To load the 30 kV test files. type
a:instal1 30
and press the ENTER key.
The program makes a subdirectory called
\30KV on the hard disk, and copies all
relevant files into it.
To load the SO kV test files, type
a:install SO
To run thse test files from the hard disk,
start EDXRF from the root directory:
C>cd \
C>edxrf
the press the CDIR soft key and type the
name of thh subdirectory where the files
are (30KV or 5DK V) and press ENTER.
5-4 Installation
PROOF-OF-PERFORMANCE TESTS
Open the chamber lid, boot the system
and run EDXRF.
Verify that the filter wheel and the
sample tray initialize by rotating through
one or morc revolutions and stop at the
first position, with the index flag at the
optical sensor.
Verify that the LN LOW light comes on
instantly upon power-up. that it does not
flicker, and that it does not go out.
(Otherwise, check the LN level and LN
sensor circuit).
Perform the tests indicated on the system
report (maintenance log sheet). See
Sections 9, 10 and 11 for detailed
instructions on the test procedures. the
diagnostic software and error messages.
Section 6
PERIODIC MAINTENANCE
Introduction 6-1
Energy calibration 61
LN dewar 6-1"
Fast discriminator 61
LN dewar 62
Vacuum pump 62
List by frequency of service 6-1
Daily 6-1
Weekly 6-1
Monthly or semiannually 6-2
Floppy disk drive 6-2
List by items to be serviced 6-2
Be detector window 6-2
Filter wheel drive 6-2
Sample tray drive 6-2
Sample spinner 6-2
Lid latch assembly 6-2
6-1 Periodic Maintenance
INTRQDUCIION
This section presents the periodic
maintenance requirements of the
Spectrace 5000 by (1) frequency of
service and by (2) items that need to be
serviced.
LIST BY FREQUENCY QF SERVICE
DAILY
Energy Calibration
Per instructions in the Spectrace 5000
operation manual, or per test and
calibration procedures in Section 9.
Failure to calibrate daily may result in
peaks not lining up with KLM markers,
causing inaccuracies in quantitative
analyses.
WEEKLY
LN dewar
Fill dewar by pouring liquid nitrogen
into the funnel on the back of the unit.
Fill until it just overflows. Use extreme
caution when pouring LN.
Failure to keep an adequate LN level
will overheat the detector, and the energy
calibration will drift.
Fast Discriminator
Per instructions in the Spectrace 5000
operation manual, or per test and
calibration procedures in Section 9.
Note: One hour of warm up time is
required before making the adjustment.
If FD is set too LOW, low energy cutoff
of spectrum will cause low energy peaks
to be lost.
If FD is set too HIGH, dead time will be
higher than normal. FD normally does
not need to be adjusted. Drastic changes
may indicate some other problem with
the system.
6-2 Periodic Maintenance
MONTHLY Qr SEMIANNUALLY
Floppy disk drive
Clean the read/write heads with a special
cleaning diskette. Clean the disk drive
more often if it is used heavily or if the
air is dusty.
Dirty heads will lose data and damage
the diskette.
LIST BY ITEMS TO BE SERVICEQ
LN Dewar
Whenever the LN LOW light is flashing,
check the LN level and rcfill the dewar
as required.
Vacuum pump
Oil must be maintained at the center of
the sight glass, and must be changcd
when it is contaminated. (Pcr operating
and maintenance instructions supplied
with the pump.)
Proper maintenance will greatly prolong
the life and performance of the pump.
Be detector window
If dirt or dust gets on window, clean it,
or if broken, very carefully replace the
X-ray tube. Warning -- Doisoninll hazard.
A broken window will cause
condensation and ice on the detector
assembly. There will be no spectrum
produced.
Filter wheel drive.
Samole tray drive
Clean, lubricate or replace the bearing
and lubricate the o-rings with vacuum
grease, whenever the X-ray tube is
replaced.
Sample spinner
Whenever the spinner seems to be
sticking, diassemble, clean and de-burr it.
and lubricate the a-ring with vacuum
grease.
Lid latch assembly
Whenever the latch seems to be sticking,
lubricate it with WD40 or equivalent.
Section 7
TROUBLESHOOTING
Introduction 7 ~ 1
Troubleshooting chart 72
Error message chart 7 ~ 1 8
Test matrix 722
7-1 Troubleshooting
INTRODUCTION
This section provides a guide to
troubleshooting the Spectrace 5000. The
guide consists of two parts.
The first part lists problems observable
during the operation of the system, and
identifies the corresponding causes and
the measures to be taken to remedy the
problems.
The second part lists error messages that
may occur during operation, and also
identifies the causes and remedies.
In the first part, the order of
presentation follows as closely as
reasonable the sequence of events during
the booting and initialization of the
system.
In the second part the error messages are
listed in alphabetical order, exactly as
they appear on the screen, so they could
be located quickly. (Section 11 presents
the system and error messages in order of
appearance during booting and
ini tialization.)
The remedies listed in the
troubleshooting guide are, for the most
part, references to procedures. rather
than the actual instructions, which
should be used to test a particular
hardware module that is identified as a
possible cause of the observed problem.
The procedures are described in Section
9, which contains all information
necessary to test, adjust or replace the
module, including references to
schematics.
NOTE
In the troubleshooting chart below,
whenever the entry under REMEDY is
"see below" or "see above," it means that
the corresponding CAUSE is further
discussed as a PROBLEM elsewhere in
the chart.
Whenever the REMEDY is "... per
procedure," it means that there is a test
procedure in Section 9 to test the
hardware item in question.
Whenever the test procedure
recommended under REMEDY indicates
that the corresponding module must be
replaced, be sure to consult the TEST
MATRIX at the end of this section for
the list of additional tests that may have
to be performed in order to make sure
that the system is put back in properly
working order.
Spectrace 5000 Technical Manu31
7-2 Troubleshooting
PRQBLEM
Chamber lid does not
open.
CLOSE LID message
does not go away.
SETTING UP
PARAMETERS message
does not go away.
CAUSE
X-rays are on.
Chamber is under
vacuum.
Latch mechanism is
subject to mechanical
binding.
Latch solenoid does not
receive correct voltage.
Sample chamber lid is
not closed or latched.
Another interlock switch
is Dot closed.
24 VDC power supply is
defective.
is defective.
Sample tray is unable to
rotate.
Filter wheel is unable to
rotate.
is defective.
REMEDY
Bring it up to air.
1. Press down and wiggle lid
until it opens.
2. Then adjust latch mechanism.
1. Check solenoid voltage. wiring
per procedure.
2. Check per chamber controller
test.
Close lid.
Check interlock switches (doors,
etc.); 13 pins 3,4 are short if
interlocks are closed.
Verify that doors "click" when
closed. Verify that detector and
tube interlocks are fully depressed
and do not "cljck" when pushed
on.
Test power supply per procedure.
Test PCB per procedure.
See below.
See below.
7-3 Troubleshooting
PROBLEM
Actual position of
sample tray does not
match its indicated
position.
Sample tray rotates
uncontrollably.
CAUSE
Wrong tray is used, or
indicated in CONFIG
file.
Tray is not seated
correctly.
Home flag on tray
dri ver is loose or
damaged.
Home sensor is
defective.
Gears in driver gearbox
are loose.
Tray driver motor is
defective.
is defective.
System unit needs to be
reset.
Computer is off.
Interface cable is loose
or defective.
Home sensor is
misaligned or defective.
RS232 port or chamber
controller PCB is
defective.
REMEDY
1. Run RDCNFG.
2. Change to indicated tray, or
run MKCNFG to show actual
tray being used.
1. Reseat the tray.
2. Make sure tray is level and
locator pin is engaged
correctly.
3. Test per tray accuracy
procedure.
Tighten/repair flag.
During boot-up, flag must pass
through sensor, reverse, and stop
with center of tab on centor of
sensor.
Check/replace sensor.
I. Tighten set SCrews on gear
shafts.
2. Make sure each Screw is
centered on flat part of shaft.
Check/replace motor.
Turn off the power; then turn it
back on.
Turn it on.
Reseat or replace interface cable.
Check/replace sensor.
7-4 TrQubleshooting
PROBLEM
Sample tray is unable to
rotate in onc direction
or the other.
Filter wheel is unable to
rotate.
Sample spinner does not
turn samples smoothly.
Sample spinner motor
does not turn. or turns
erratically.
CAUSE
Tray drive is subject to
mechanical binding or
blockage.
Set screw on a drive
gcar is loose.
is defective.
Filter drive is subject to
mechanical binding or
blockage.
Set screw on a drive
gear is loose.
is defective.
A link in the belt is
defective.
Belt tension is incorrect.
Belt is misaligned with
tray insert (sample cup).
Motor turns erratically.
TURN signal is not
present.
Solid state relay on
spinner PCB is defective.
There is mechanical
binding between motor
shaft and motor
mounting plate.
REMEDY
Remove blockage (sample cup,
etc.)
Center each set screw on flat part
of shaft, and tighten.
Remove blockage (sample cup,
etc.)
Center each set screw on flat part
of shaft, and tighten.
Look for broken/damaged link;
replace belt.
Adjust tension.
Adjust belt housing height with
spacers. (Teeth of tray insert
must engage center of belt links.)
Remove belt housing, then see
below:
Test chamber controller PCB per
procedure.
I. Short pins 6 and 7.
(WARNING -- shock hazard),
If motor turns, replace relay
chip.
Clean and lubricate the
mechanism.
7-5 Troubleshooting
PROBLEM
TURNING ON X-RAYS
message does not go
away.
XRAY ON warning
light does not come on.
X-rays take long time to
come on.
CAUSE
Motor is defective.
XRAY ON warning
light is not on.
CONFIRM signal is not
present (light sensor in
X-RAY ON warning
light module is
defective).
is defective.
Interlock is open.
(CLOSE LID message
does not go away.)
LAMP ON signal is not
present.
Bulb in light module is
defective.
Light module is
defective.
defective.
X-RAYON warning
light module is
defective.
is defective.
REMEDY
I. Verify AC line voltage input
of motor.
(WARNING -- shock hazard),
2. If correct, disconnect AC
power and replace motor.
See below.
Test module per procedure.
See above.
Check interlock circuit.
(WARNING -- shock hazard).
Replace bulb.
Check/replace module.
Replace bulb.
7-6 Troubleshooting
PROBLEM
X-RAY ON warning
light flashes on/off.
WAITING FOR
VACUUM message does
not go away, or takes a
long time to go away.
WAITING FOR
HELIUM message does
not go away.
CAUSE
defective.
X-RAYON warning
light module is
defective.
Chamber is not
evacuated.
Vacuum gauge is
defective.
AIR solenoid is.
energized, or it is
leaking.
Chamber fittings, or
hoses arc leaking.
Helium flush panel
fittings or hoses are
leaking.
is defective or requires
adjustment.
VACUUM OK signal is
true because connector
at vacuum gauge is
loose.
Helium flush timer does
not time out.
REMEDY
Replace bulb.
1. Clean and lubricate chamber
lid o-ring with vacuum grease.
2. Close lid and press down
firmly (to compress oring).
Check gauge per chamber
controller test.
1. Check solenoid voltage, wiring
per procedure. AIR solenoid
must not be energized when
the vacuum pump is on.
test.
Locate/fix leaks.
1. Bypass the panel: reroute the
vacuum pump hose directly to
the cabinet rear panel, and
pinch off the small, internal
hose to the detector flange.
2. Retest.
Reseat connector.
Check per chamber controller test.
7-7 Troubleshooting
PROBLEM
WAITING FOR AIR
message does not go
away.
Resolution is poor.
CAUSE
is defective.
VACUUM OK signal is
true because connector
at vacuum gauge is
loose.
Vacuum gauge is
defective.
AIR solenoid is not
energized.
is defective or requires
adjustment.
Incorrect count rate
range is selected.
Liquid nitrogen level is
low.
Fast discriminator is set
incorrectly.
12 or 24 VDC power
supply is noisy.
PA reset rate. with x
rays off, is too high.
Electrical noise is picked
up.
Microphonic noise is
picked up.
Pulse processor PCB is
defective.
REMEDY
Reseat connector.
controller test.
1. Check solenoid voltage. wiring
per procedure.
test.
Select count rate per normally
used protocol.
Check/refill.
Readjust per procedure.
Verify per procedure that ripple
of power supply is within
specifications.
Verify in system status page; then
see below.
See below.
See below.
Test/recalibrate PCB per
procedure.
7-8 Troubleshooting
PRQBLEM
up.
CAUSE
Preamp is deCeetive.
Detector bias is noisy.
Spectrometer is
defective.
Confirm noise pick-up:
Note: EDXRF versions
1.1 or higher will not
acquire if X-rays are not
generated in the first
second of an acquisition.
Use version 1.0, or
change parameters after
acquisition has begun.
Preamp power cable is
susceptible to noise pick
up.
Cables are loose.
Preamp cable is
grounded incorrectly.
Cables are grounded
incorrectly.
Spectrometer is grounded
to chassis.
Data cable is defective.
Noise is picked up from
x-ray or DC power
supplies.
REMEDY
Replace PCB.
Test bias supply PCB per
procedure.
Check/replace.
I. Block X-rays with lead foil,
or fun aeq. at 7 kV with thick
filter.
2. Check fast disc. rate with:
- X-rays on,
- X-rays off.
3. If the rates are not the same,
determine cause:
Do not re-route preamp power
cable near high energy sources.
Check/reseat connectors.
1. Turn power off.
2. Remove preamp cover.
3. Tighten ground braid screw.
Check all ground connections.
I. Turn power off.
2. Wait one minute.
3. Disconnect preamp cable.
(WARNING -- high voltaKe;)
4. With ohmmeter, verify that
spectrometer is isolated from
chassis (frame) ground.
Wiggle to confirm; replace.
Test power supplies per procedure.
Check/tighten connectors.
710
TrQubleshooting
PROBLEM
Dead time is
high/low/erratic.
Input count rate is low.
CAUSE
Beryllium window is
contaminated.
defective.
Excitation conditions are
incorrect.
range is selected.
incorrectly.
PA reset rate, with x
rays off. is incorrect.
up.
X-ray power supply
connector is arcing.
defective.
ADC micro PCB is
defective.
Sample-la-sample
variation.
Wrong filter is selected.
REMEDY
Using a squirt bottle filled with
methanol or TeE, direct a fine,
gentle stream at the aluminum
around the Be window. Let the
liquid run over the window the
clean it.
(Warnine -- Doisonin2 hazard),
The window is very fragile.
I. Check set up via EDXRF
menus.
2. Visually check filter selection
and alignment.
used protocol.
see below.
See above.
See below.
Re-do analysis with known
sample.
Check protocol; select another
filter.
TroubleshoQting 79
PROBLEM
MicrQphonic nQise is
picked up.
Low energy sensitivity is
poor.
CAUSE
Noise is picked up from
X-RAYON warning
light mQdule.
The detector is sensitive
to vibration and loud
noises.
Vacuum pump is
touching the system unit.
Sample spinner motor is
vibrating.
Vibration from other
equipment is picked up.
Liquid nitrogen boil-off
is excessive.
incQrrect.
incorrectly.
ADC is adjusted
incorrectly.
up.
Background level is
high.
REMEDY
Check/replace module. Make sure
that the warning light module is
isolated from chassis ground.
Place the system unit on a stable
f100f, isolated from sources of
external vibration.
Separate them.
Disconnect power to the sample
spinner; check/replace.
1. Turn off other equipment.
2. Recheck resQlution per
prQcedure.
3. If resQlution improves, keep
offending equipment turned
off, Qr isolate it with
foam/etc.
Replace dewar.
menus.
and alignment.
I. Check resolution per
procedure.
2. If bad, look for source of
electrical noise (see above).
See below.
7-1 0 Troubleshooting
PROBLEM
Dead time is
high/lowterratic.
Input count rate is low.
CAUSE
Beryllium window is
contaminated.
defective.
incorrect.
range is selected.
incorrectly.
fays off, is incorrect.
up.
X-ray power supply
defective.
ADC micro PCB is
defective.
Sample-la-sample
variation.
REMEDY
Using a squirt bottle filled with
methanol or TCE, direct a fine,
gentle stream at the aluminum
around the Be window. Let the
Ijquid run over the window the
clean it.
(Warninx: -- poisoning hazardl.
The window is very fragile.
menus.
and alignment.
used protocol.
see below.
See above.
See below.
Re-do analysis with known
sample.
filter.
7-11 Troubleshooting
PROBLEM
Background level is
high.
No spectrum is
produced.
CAUSE
Sample tray is
misaligned.
incorrectly.
X-ray power supply is
defective.
Sample-to-sample
variation.
incorrectly.
Resolution is poor.
up.
defective.
Spectrometer is
defective.
There is no sample in
position to be tested.
HY light on bias supply
PCB is off.
REMEDY
Check/realign per procedure.
Redo analysis with known
sample.
filter.
I. Test per procedure.
2. If bad. see above.
See above.
Check/replace.
Check sample tray.
filter.
See below.
see below.
712 Troubleshooting
PROBLEM
No spectrum is
produced.
PA RESET light is on;
Sample is OK;
Filter is OK;
X-rays arc on.
HIGH DT light is on;
PA RESET light is on;
No x-rays arc generated.
HIGH DT light is always
on;
HV light is on;
PA reset ratc is normal;
No x-rays are generated.
CAUSE
X-ray/other power
supply is defective.
Spectrometer is
defective.
ADC micro PCB is
defective.
incorrectly.
defective.
Data memory PCB is
defective.
12/24V power supply is
defective.
defective.
incorrectly.
defective.
REMEDY
Test power supplies per procedure.
Check/replace.
with pulse processor PCB
(I) installed,
(2) removed.
Verify on system status page; if
PA reset rate is not zero, see
below.
PRQBLEM
HV light is off;
PA RESET light is off;
No x-rays are generated.
Repeatability of peak
count is poor.
Prominent noise peak
(zero peak).
CAUSE
Cable. pulse processor to
detector, is defective.
Power supply is
defective.
Preamp is defective.
Bias supply PCB is
defective.
Spectrometer is
defective.
incorrectly.
rays off, is. incorrect.
Position of samples in
the tray is inconsistent.
Energy calibration is
unstable.
Resolution (peak width)
is unstable.
defective.
defective.
X-ray tube is defective.
Spectrometer is
defective.
REMEDY
Check/replace cable.
Replace PCB.
Check/replace.
see below.
I. See "sample preparation" in
operation manual to review
proper technique.
2. See "actual position of sample
tray... " above.
See below.
Test per stability procedure.
Replace tube.
Check/replace.
see below.
7-14
TroubleshoQting
PRQBLEM
Energy calibration is
unstable ("peak shift").
Spectrum contains
periodic errors.
Consumption of liquid
nitrogen is too high (>2
liters/day).
Detector bias is off, or
cycles on and off.
CAUSE
incorrectly.
up.
Microphonic noise is
picked up.
defective.
Output of power supply
is too low.
ADC micro PCB is
defective.
Data memory PCB is
defective ("stuck bits").
Dewar is defective
(cryostat vacuum has
degraded).
Detector vacuum has
degraded.
low.
Detector vacuum is
degraded.
Cable, bias supply to
preamp, is defective.
REMEDY
See above.
See above.
Check/adjust by measuring on the
ADC micro PCB.
Replace dewar.
I. Verify that PA reset, with x
rays off, is more than 1 per
second.
2. If so. replace detector.
Check/refill.
See above (consumption of liquid
nitrogen is too high).
Wiggle/replace cable.
I
PRQBLEM
rays off. is too high.
Liquid nitrogen sensor
alarm trips when dewar
is full; or
sensor alarm does not
trip when dewar is low.
CAUSE
Cable connector at bias
supply PCB is defective.
12/24V power supply is
defective.
Bias supply is unstable.
Bias supply PCB is
defective,
Preamp is defective,
Spectrometer is
defective.
low.
Detector bias is
incorrect.
Detector vacuum is
degraded.
Si(Li) crystal is breaking
down (mechanical
damage due to thermal
cycling).
Alarm circuit is
defective.
Liquid nitrogen sensor is
defective.
Dewar is NOT full; ice
is blocking the fill pa tho
REMEDY
Wiggle/replace cable.
Replace PCB.
Check/replace.
Check/refill.
procedure.
See above (consumption of liquid
nitrogen is too high).
Replace spectrometer.
procedure.
Check/replace sensor:
measure sensor resistance at BNC
connector on dewar collar;
expected readings are:
200.150 ohms at LN temp.;
2k.lk at room temp.
(open=def ecti ve).
Remove spectrometer from dewar.
Remove ice from fill and exhaust
ports of dewar.
Troubleshooting 7-16
PRQBLEM CAUSE REMEDY
Cable, preamp to sensor, Check/replace cable.
is defective.
Fast discriminator Problem may be See Section 10 or operation
cannot be adjusted indicated on system manual.
properly; reads anything. stntus page.
ADC or data cable is Wiggle to confirm; replace.
defective.
Electrical noise is picked See above.
up.
Pulse processor PCB is Test PCB per procedure.
defective.
Preamp is defective. Replace PCB.
Fast discriminator reads Preamp is defective. Replace PCB.
zero.
Jumper cable, pulse Replace cable.
processor to bias supply.
is open.
Detector bias voltage is Test bias supply PCB per
off. procedure.
Power supply is Test power supply per procedure.
defective.
Pulse processor PCB is Test PCB per procedure.
defective.
X-ray high voltage is X-ray power supply is See below.
arcing. arcing,
X-ray power supply See below.
, "
PROBLEM
arcing.
X-ray power supply
CAUSE
X-ray tube has not
warmed up properly.
High voltage cable is
damaged or
contaminated.
defective.
X-ray tube is defective.
Connection looks correct
but leaves an internal
gap.
REMEDY
1. Reduce high voltage setting
until arcing stops.
2. Operate at reduced voltage
for about 10 minutes.
3. Increase voltage slowly.
I. Turn off power.
2. Remove high voltage cable.
3. Inspect cable for damage.
4. Clean ends with methanol.
S. Reinsert (see step 4 below).
6. Retest.
Replace tube.
1. Turn off the power.
2. Disconnect the x-ray tube HV
cable and clean the connector.
3. Reconnect the HV cable.
4. Make sure the connector is
inserted fully:
Roll back the o-ring fully
(30kY only);
Insert connector until it stops;
Roll o-ring forward;
Tighten the nuts.
MESSAGE
ACQ aborted:
HV bias off
Acq aborted:
stabilizer lost zero peak
Acq aborted:
zero DAC at limit
Acquisit.ion failed to
initiate
CAUSE
Preamp cable is loose.
low.
HY light is off.
ADC micro PCB is
defective.
X-ray detector is
malfunctioning.
Random noise. or high
dead time.
+SVDC line at ADC
micro PCB is low.
Noise pick-up is
excessive.
ADC micro PCB is
malfunctioning,
Random noise, or high
dead time.
Zero DAC is out of
adjustment.
+SVDC line at ADC
micro PCB is low.
Noise pick-up is
excessive.
ADC micro PCB is
malfunctioning.
No sample is in place.
REMEDY
Check/fix connection.
Check/refill.
See above.
Test detector per procedure.
Check acquisition parameters;
restart.
Check acquisition parameters;
restart.
Readjust DAC per procedure.
Put in sample;
select proper tray position.
7-19 TrQubleshQoting
MESSAGE
Air nQt achieved
CannQt read CONFIG
file
Chamber failed to
respond
Check system status
He flush not achieved
CAUSE
Tube voltage, current
are tQQ lQw; filter is too
thick.
Wrong collimator is in
place.
ADC micro PCB is
malfunctioning.
Vacuum gauge (sensor)
connector is loose.
Vacuum gauge is
malfunctioning.
CONFIG file has been
corrupted.
Disk is bad.
Operation is interrupted
by random glitch.
5000 is not powered up.
R S ~ 2 3 2 cable is not
plugged in, or is
defective.
is malfunctiQning.
Operating parameters
are invalid.
Data acquisition PCB is
malfunctioning.
Insufficient time has
elapsed.
REMEDY
Check/change acquisition
parameters as required.
Check/change as required.
Check/fix connection.
controller test.
Exit EXDRF program.
Run MKCNFG.
Check disk per DOS diagnostics.
Reboot and retry.
Turn it Qn.
Plug in; replace.
Read system status page; change
acquisition parameters as required.
1. Wait (if important).
2. Override (if not).
3, Correct hardware problem.
7-20 TrQubleshooting
MESSAGE
INITSSOO: firmware file
not present
Invalid CONFIG file
Vacuum not achieved
Voltage not achieved
Voltage set too low
X-rays not on -
hardware problem
CAUSE
ADC micro PCB
program is missing from
SPECTRAC directory.
CONFIG file is
incompatible with
system.
Chamber lid a-ring is
leaking.
Vacuum sensor has
failed.
Hoses/connections arc
leaking,
is malfunctioning.
HV cable connectors arc
not seated correctly.
X-ray power supply
controller PCB is
malfunctioning.
malfunctioning,
Operating parameters
arc incorrect.
System times out after
attempting to latch the
chamber lid.
X-RAY ON light failed.
Interlock circuit is
malfunctioning.
REMEDY
Reload hard disk from the
distribution diskettes.
Exit EDXRF program.
Run MKCNFG.
Check/lubricate a-ring. Press
down on lid.
Test sensor per procedure (see
chamber controller test).
Check/fix at pump, He flush
panel, etc.
Reseat the connectors.
Check/replace.
Edit acquisition parameters screen.
Adjust lid latch;
retry.
Check light. sensor.
Check interlocks.
Troubleshootjos
7-21
MESSAGE CAUSE REMEDY
Cannot open graphics
workstation
VOl driver files are
missing or are not
initialized properly.
Check the IBM VOl driver,
AUTOEXEC.BAT and
CONFIG.SYS files, or reload them
from the master floppy to the
hard disk.
TEST MATRIX
When a test identifies a defective module
and it is replaced, other tests must also
be performed to restore the system to its
original performance level. The
following test/module matrix specifies
the additional tests.
Xray tube
Interlock
Radiation survey
Vacuum
Repeatability
Resolution and stability
Stray lines
Sample tray accuracy
Xray high voltage supply, or
Xray power supply controller
Current-voltage steps
Repeatability
Detector
Interlock
Vacuum
Bias supply
Fast discriminator
Energy calibration
Sample tray accuracy
Preamplifier
all "detector" except tray ace.
ADe micro PCB
Energy calibration
Pulse processor PCB
Fast discriminator
Energy calibration
Pile-up
Bias supply PCB
Bias supply
Fast discriminator
Energy calibration
System initialization
Chamber controller
Section 8
ASSEMBLY PRQCEDURES
Introduction 8-1
HV cable at X-ray tube 8-1
Sample spinner 8-1
X-RAY ON light 8-1
X-ray source 8-1
Detector 8-1
Preamplifier 8-2
Filter asssembly 8-3
Power supplies 8-3
Card cage 83
Dewar 8-3
Helium protection system 8-3
Spectrace 5000 Technica! Manual
8-1 Assembly Procedures
INTRODUCTION
For the most part the mechanical and
electrical connections used in the
Spectrace 5000 are very simple and
readily obvious upon inspection of the
hardware. This section. therefore,
presents only some notes and hints that
may be helpful.
HV cable connection at X-ray tube
(3Q kV only)
1. Roll the o-ring back.
2. Insert the connector until it stops.
3. Roll the o-ring forward. and tighten
the nuts.
Sample spinner
I. Remove mounting plate from
chamber base plate.
2. Disassemble, clean. deburr.
3. Lube o-ring with vacuum grease.
4. Reassemble.
X-RAY ON light
This is held on by two phillips head
screws on the bottom, and by two
spring-loaded snap fittings on top,
Save the isolating washers for re
installation.
NOTE
The X-RAYON warning light
module must always be electrically
isolated from ground.
X-ray source
The tube comes in two models,
fastened differently.
l. Wing nuts
2. Screws
Detector
1. Take 4 screws out.
2. Drop detector out the bottom
Caution:
Mylar washer isolates detector from
baseplate; it is hard to see, and tends
to fall off. Put vacuum grease on
mylar, stick it to detector before
using the mounting screws.
Before reassembling:
Measure the resistance between case
of preamp connector and chassis
ground; should be infinite. Plug
connector into bias module, measure
between detector body and chassis
ground; should measure low.
Detector replacement procedure:
1. Locate all required parts. the mylar
isolation ring. high vacuum grease,
collimator, and screws which hold
the detector in place at the sample
chamber.
2. Place the mylar washer and the 0
ring on the detector. The detector
MUST be isolated from the chamber
by the mylar washer.
3. Loosen the screws on the dewar
collar so the detector is free.
Carefully guide the detector and the
dewar as a unit up into the cabinet
(from the back) so that it clears all
wiring and hoses. Align the detector
snout (by hand) so that it. interfaces
flat against the opening in the
chamber.
Align the screw holes. Be sure the
mylar washer and a-ring are placed
properly.
Place [he screws and tighten every
other one gen[ly while still holding
the detector in place. Make sure the
interlock is properly located under
the de[ector assembly.
4. Insert dewar supports under the
dewar.
5. Tighten the screws on the dewar
collar.
6. Check with an ohm meter that the
detector is electrically isolated from
the chamber.
7. Connect the preamp cable to the bias
supply PCB. Check all other boards
to see that they are all in place
before turning on the power.
8. Fill dewar with liquid nitrogen.
9. Allow the unit to cool for one hour
before turning on the power.
Preamplifier
2 screws hold preamp cover.
6 colored-coded wires go from
unlabelled pins on the preamp into
side of detector. Note where wires
go before disassembly.
Preamplifier replacement procedure:
1. Turn off the power.
2. Remove the preamp cover.
3. Turn on the power. Measure voltage
between violet wire and ground (20
VDC max.)
4. Turn off the power and wait one
minute.
5. Unplug the power cable and LN
sensor cable.
6. Desolder wires from gold pins; note
where wires go!
7. Remove nuts, slide PCB and spacers
off the threaded shaft.
8. Measure the resistance at the trim
pot at the corner of the PCB.
9. Set the trim pot on the new
(replacement) PCB to this same value.
Assembly Procedures 83
10. Mount the new PCB and resolder the
wires. Make sure no wire or
component is touching the mtal
spacers.
11. Reconnect the cables and apply
power.
12. Using the pot nearest to it, set the
voltage on the violet wire to the
value measured previously.
13. Turn off the power and replace the
cover. Make sure the preamp is not
pushed down, or it will touch the
bottom of the cover.
Filter assembly
The assembly comes out with one
screw.
If filters fall out. first identify the
filter positions:
1. Boot system and start EDXRF;
wheel comes up in no-filter position.
Then the order is: no filter, cellulose,
aluminum. thin, thick, copper.
2. Select cellulose, start acquisition.
After filter wheel moves, stop the
acquisition. and install filters in
order.
3. Use a drop of cruy glue or vacuum
version of loctite to hold filters in
position.
Power supplies
Those on bottom of cardcage are in a
drawer that slides out for servicing,
Power supplies on top of the card
cage are fixed but accessible.
Card cage
PCBs are not in zero insertion force
sockets (they have tabs to loosen
them, then pull out),
Dewar
Make sure is it strapped to side
panel.
Helium protection system
The connection panel is illustrated in
Figure 8.1 (see also Figure 2.4).
1. A.C. power must always be connected
to the He protection panel. whether
He flush is being used or not;
otherwise, the system will not operate
properly in vacuum mode.
2. The vacuum pump A.c. line must be
connected to the vacuum pump outlet
on the He protection panel, rather
than the one located off the panel.
3. There must be a vacuum hose from
the connection on the cabinet to the
connection on the panel labeled
"CABINET". All vacuum hoses
should be attached with proper hose
clamps.
4. The vacuum pump must be connected
to the outlet on the panel labeled
'VACUUM PUMP".
5. The special detector collimator
supplied with the He protection
system must be installed in place of
the standard detector collimator.
6. An internal vacuum hose must be
routed to the nipple on the
spectrometer flange.
7. Internal helium hoses must be routed
to the inlet and the chamber. as
marked.
HELIUM
HOSE
Figure 8,1 Helium flush panel
POWER ON
LIGHT
@))
c:::J
000
HOSE FROM
VACUUM PUMP
VACUUM PUMP ON
LIGHT
VACUUM HOSE TO
BACK PANEL
025
o HELIUM
FLOW
8
GAUGE
o
o
_---'O:=...-r-- AC POWER
VACUUM
PUMP
POWER
HELIUM
VACUUM
POWER
FUSE
VACUUM
PUMP
FUSE
PUMP
POWER
(not used)
VACUUM
HOSE
Section 9
TEST PROCEDURES
Introduction , , ", 9-1
Bias supply test 9-2
Chamber controller test 9-3
Data memory test 9-5
Energy calibration 9-6
Fast discriminator adjustment 9-7
Gain vs. count rate range adjustment 9-8
Initial energy calibration 9-11
Interlock test 9-13
Livetime test 9-14
Minimum detection limits test 915
Pile-up test 9-16
Power supplies test 9-17
Radiation survey 9-18
Repeatability test 9-20
Resolution test 9-22
Resolution-stability test 9-23
Signal processing system test 9-25
Solenoid voltage test 9-26
Spot alignment 9-27
Stability test 9-28
Stray lines test 9-29
Tray accuracy test 9-30
Tray height adjustment 9-31
Vacuum system test 9-32
X-RAY ON warning light test 9-33
X-ray power supply controller test 9-35
X-ray tube current/voltage test 9-37
9-1 Test Procedures
INTRODUCTION
This section describes test procedures
which call for adjustments in the
operating characteristics of individual
hardware modules, and procedures which
test the performance of the system or its
modules on a pass/fail basis (and do not
include immediate corrective measures).
In the descriptions of the procedures, it
is assumed that the reader need not be
instructed on the use of a voltmeter or an
oscilloscope to make a voltage or signal
waveform measurement, or in the steps to
get a program on a diskette loaded and
running on a microcomputer.
Portions of the test procedures are
performed while running the EDXRF
program. Directions to run this program
and to make use of the soft keys
available under its various menus are
found in the Spectrace 5000 operation
manual.
In this section, the EDXRF soft keys are
always identified by the name of the
function they invoke under a given menu
(rather than by the numbers FI-FIO by
which they are labelled on the keyboard).
Other parts of these procedures make use
of the diagnostic programs found on the
test diskette. See Section 10 of this
manual for the descriptions and
operating instructions of these programs.
A number of the test procedures can be
initiated from the PROCEDURE menu
on the diagnostic diskette. This menu
and related software tools are also
described in Section 10.
At the completion of each test. record the
result on the maintenance log sheet.
NOTE
Make sure that the test version of
EDXRF is used with the test procedures
described in this section. The test
version of EDXRF is invoked by running
MKCNFG and answering YES to "test
version (Y/N)?" (see Section 10).
9-2 Test Procedures
BIAS SUPPLY
SCODe and Dumose
To test (1) the bias level supplied to the
detector. and (2) the low LN level alarm
circuit.
Reference documents
Schematic no. 5919-0189
Test conditions
Complete, fully functional system
(computer and 5000).
Test equipment
Extender board
DMM or oscilloscope
Sample (any)
Safety precautions
Interlocks must be defeated to perform
this test (high voltage. Xray hazards).
Test Drondure
I. Put the bias supply PCB on an
e"tender board, and power up the
5000.
Bypass interlocks as required.
2. Place the sample in tray position 1.
3. Run EDXRF, go to the ACQ menu,
press ACQ PARM and set up a low
voltage, low current acquisition to
activate the circuits in the 5000.
Detector bias
4. Make a voltage measurement at the
tV test point. Verify that the
reading is -1.00 O.OI VDC with no
drop-outs or fluctuations.
LN alarm
5. Make a voltage measurement at the
LN alarm test point. Verify that the
reading is greater than 3.8 0.1 VDC
when the LN dewar is full.
If less than 3.8 VDC, trace the
problem to the sensor or the PCB.
The resistance of the sensor should
be less than 200 ohms.
9-3
Test Procedures
CHAMBER CONTROLLER
Scope and Purpose
To verify that the chamber controller PCB
initializes and controls the chamber
functions correctly.
Reference documents
Test conditions
Complete fully functional system
(Computer and 5000).
Test equipment
Test diskette
Vacuum test fixture
Vacuum gauge
Vacuum pump
Compressed air
Voltmeter
Voltmeter test probes
Safety precautions
The interlocks must be defeated in order
to perform this calibration (high voltage,
X ~ r a y hazards).
Test procedure
I. Check that the RS232 cable between
the computer and the 5000 is
connected.
2. Turn on the unit, and raise the
chamber lid.
3. Verify that:
The filter wheel rotates and stops
with filter 1 in position; and
The sample tray rotates and stops in
position 1.
4. Load the ECHOA program.
5. Rotate the filter wheel to position
3 by typing the command sequence
CF2
CX
Verify that the filter wheel
rotates accordingly.
6. Rotate the sample tray to posHion
5 by typing the command sequence
CS04
CX
Verify that the sample tray rotates
accordingly.
7. Close the chamber lid and connect
a vacuum pump to the unit.
8. Attach the vacuum test and
adjustment fixture in line with
the vacuum hose. Use a vacuum
gauge that has been calibrated for
the fixture.
9. Do the following to achieve initial
adjustment of the vacuum sense
circuit.
Unplug the cable from the
vacuum sensor.
Install a clip lead jumper between
the (+) lead of C20 (TP5) and the
input side of R80 (TP4).
On the control board, adjust R79
for +IO.3V at C18. (Pin 1 of U13)
Adjust R 117 so the voltage at TP2
is equal to the voltage at C20 (+)
(TP5). Should be approximately
.47 volts.
lOa. Chamber boards rnislon C or
lower
Adjust R84 for .67 volts at TPI.
Remove clip lead jumper.
Reconnect the cable to the vacuum
sensor.
lOb. Chamber boards revision D or
higher
The vacuum trip point is determined
by the setting of multisection switch
SW
p
3. The switch is first set to
establish a baseline then an offset is
added.
The proper baseline occurs when the
VACUUM OK LED, 08-6, is OFF and
as many sections as possible of SW-3
are on with the chamber at
atmospheric pressure.
To determine the proper baseline, set
all segments of switch SW-3 to the ON
position.
Remove the shorting lead between
TP4 and TP5.
Check if the VAC OK LED, 056, is
OFF. If it is, proceed to set
threshold. If not, set the first section
of 5W-3 to OFF and recheck D5-6.
Repeat for additional switch section
until D5-6 if OFF. To establish the
proper threshold, set an additional 3
sections of SW-3 OFF.
11. Turn off the air solenoid by typing
the command sequence
CRF
CX
Verify that the solenoid is turned off.
(It can be heard switching; also, it
whistles very loudly when the
chamber is pumped down.)
12. Turn on the vacuum pump by typing
CVO
CX
Verify that the vacuum pump has
started pumping, and that the
chamber is being pumped down (easy
test: lid can't be lifted open.)
13. Chamber boards revision C or
~
Monitor the voltage at TP2.
Adjust R84 as necessary to trip
the circuit at 750 millitors. (The
voltage at TP2 should be greater
than or equal to the voltage at
TPI at 750 millitor.)
(If no vacuum gauge is available
and if there are no leaks, wait 1-2
minutes to achieve vacuum before
adjusting R84)
14. Check the staus of the vacuum by
typing the command
QV
Verify that the response
YO
appears on the screen. This
indicates that the circuit has been
set properly.
15. Turn off the vacuum pump and
bring the chamber back up to air
by typing the command sequence
CYF
CX
CRO
CX
Verify that the pump is off and
that the chamber is at atmospheric
pressure (by trying to lift the lid.)
16. Turn off the air solenoid and turn
on the helium solenoid by typing
CRF
CX
CHO
CX
17. Connect a source of compressed
air to the helium inlet.
18. Open the chamber lid and turn on
the compressed air.
Verify that air is coming from the
helium outlet in the chamber
baseplate.
19. Turn off the helium solenoid by
typing the command sequence
CHF
CX
Verify that there is no air flowing
from the helium outlet in the
baseplate.
20. Disconnect the compressed air.
21. Set the tube current and voltage to
zero by typing
CCIOO
CCH06
CX
22. Lock the chamber lid by typing
CKIF
The lid latch should make a sound
when the solenoid is activated.
23. Turn on the X-RAYON warning
light by typing the command sequence
CPO
CX
Verify that the light comes on in less
than 5 second after the command IS
given.
24. Turn off the XRAY ON light by
typing the command sequence
CPF
CX
25. Unlock the chamber lid by typing
CKIO
26. Type CTRLC to exit the ECHOA
program.
27. Do the "X-ray tube current voltage
steps" procedure.
Test Procedures 95
DATA MEMORY PCB
Scope and purpose
To set the DIP switches and verify the
operation by means of a pass/fail
diagnostic.
Reference documents
Schematic no. 59190181
Test conditions
Only the computer is used in this test.
The 5000 need not be powered up or
connected to the computer.
Test eauipment
Test diskette
Digital muJtimeter (D:tv1M)
IBM PC/XT/ AT extender board
Safety precautions
High voltage hazard.
Test nrocedure
I. Turn off the computer.
2. Remove the board from the computer
and inspect it visually. Verify that
the three memory chips (UI, U7 and
U12) are placed flush-rear in the 28
pin sockets.
3. Verify that the dip switches SWI and
SW2 are set as follows:
IlQi SWI SW2
1 off off
2 off off
3 on on
4 on on
S on off
6 off off
7 on on
8 on on
4. Verify that the jumper at TPI is set
towards the rear of the board.
5. Measure the resistance across Cl.
Verify that it is not shorted out.
The resistance should be less than 10
ohms.
6. Install the board into the computer.
7. Turn on and boot the computer.
8. Load the MEMTEST program.
9. Select the option to run the entire
test.
10. If no errors are printed. the board
has passed the test.
If there were errors noted, replace
the board.
9-6 Test Procedures
ENERGY CALIBRATIQN
Scope and pUrPose
To adjust the gain DAC periodically, and
thus keep the 5000 calibrated.
Reference documents
See the Spectrace 5000 operation manual
for a description of the EDXRF program.
Test eauipment
Spectrace OFHC copper calibration
standard
Test diskette
Test conditions
Count rate range to be same as is stored
in previously updated reference files, and
the same as is to be used in subsequent
acquisitions.
Safety precautions
Routine.
Test procedure
I. Boot the system, run EDXRF, put the
tcst diskette in drive A, and go to
the PROCEDURE menu.
2. Press SETUP; press SYS STAT on the
main menu, then ECAL CNFG on the
PHA STATUS page. Verify the
acquisition parameters:
Tube voltage 30 kV
Tube current 0.02 rnA
Filter Thin
Livetime 600 sec
Max energy 20 keY
Atmosphere Air
Warmup osec
3. Press EXIT. The program responds:
INPUT ENERGY QF LINE (eY) - ...
where ... is the current value. Verify
that it is 8041 for Cu K-alpha.
4. Press EXIT twice to return to the
PROCEDURE menu.
s. Put the copper standard in sample
tray position 10.
6. Press ENRGY CALIB to run the
calibration procedure.
7. The procedure displays the current
value of the gain DAC and the
difference (error) between this value
and what it should be.
If the error is too large, terminate
this procedure and run the "initial
energy calibration" procedure.
Otherwise, this procedure continues
until the current and expected gain
DAC values converge.
If this procedure is terminated
prematurely (by pressing EXIT), it
asks whether the latest gain DAC
value should be saved (and used the
next time EDXRF is run).
9-7 Test Procedures
FAST DISCRIMINATOR
Scope and purpose
To adjust the fast discriminator
threshold, so that it produces 100-150
counts per second when no xrays are
entering the detector.
This threshold should be checked and
adjusted whenever the ADC micro PCB.
the pulse processor PCB, or the detector
has been changed. or if the gain settings
have been changed or have drifted.
Reference documents
Test conditions
(computer and 5000);
powered on for at least an hour.
Test equipment
Universal adjustment tool (tweeker)
Safety precautions
Routine.
Test procedure
I. Boot the system. load the EDXRF
program. and go to the MAIN menu.
2. Select the SYS STAT display.
3. Read the number being shown next
to FAST DISC RATE. This number
changes about once per second, and
normally has a range of about 50
counts (150 50).
4. If the fast disc. rate is not between
100-150, adjust the FAST DISC pOl
on the pulse processor PCB
(clockwise to decrease,
counterclockwise to increase the
count rate). Figure 9.1 shows the
locations of the adjustment pots.
\
@2 GAIN
4
COARSE
t
CALIBRATE
FINE
OFDOUTPUT
o HIGH DT
o PA RESET
@ FAST DISC
@ ZERO
to preamp
PULSE
PROCESSOR
PCB
OUTPUT
PREAMP
o
@ HV
@ LN LEVEL
@ ALARM
MUTE
BIAS
SUPPLY
PCB
Figure 9.1
Adjustment pots and indicator lights of
the signal processing subsystem
9-8 Test Procedures
GAIN yS. COUNT RATE RANGE
Scope and Durnose
To adjust the gain DAC in the high,
medium and low count ratc ranges, in
order to correct for possible variation in
amplifier response.
Reference documents
Test conditions
(computer and SODO).
Test eQuioment
Pulse processor extender board
20 inch BNC to BNC cable
Universal adjustment tooJ (tweeker)
Medium philips screw driver
standard
Safety precautions
X-ray hazards).
Test procedure
Installation of 50PO extender board
I. Turn off the power.
2. Open the front door of the system
module and defeat the interlock on
the front door.
3. Disconnect the 40-1ead data bus cable
from the pulse processor and remove
the BNe cable between the bias
supply and the pulse processor.
4. Remove the pulse processor from the
card cage and take the shield ofr.
s. Insert the pulse processor into the
extender board and plug the extender
into the card slot.
6. Using the 20 inch BNe cable,
connect the pulse processor to the
bias supply.
7. Reconnect the data bus cable.
8. Reconnect the power cord. boot the
system and allow 10 minutes for the
components to warm up and stabilize
before starting the adjustments.
Calibration of high count rate range
1. Load the EDXRF program. and go to
the PROCEDURE menu.
2. Select ENRGY CALIB.
3. Place the energy standard (copper)
into position 10 of the sample tray.
4. Press the space bar to continue.
S. Enable the KLM function. Select the
Cu marker with the arrow keys.
6. Enable movement of the cursor.
Bring the cursor to the center of the
peak.
7. Expand the display until the Cu K
alpha peak fills the screen.
8. Select the ACQ MENU. Display the
SYS STAT page.
9. Select COUNT RATE, then press the
H and the ENTER (return) keys to
select the high range.
10. Press EXIT to display the ACQ
MENU soft keys.
9-9 Test Procedures
II. Make sure that the DT (dead time) is
50%. If necessary, press ACQ
PARMS and adjust the acquisition
parameters to be:
Tube voltage 20kV
Filter Thin
12. Press EXIT.
NOTE
If the acquisition parameters must be
changed to achieve 50% dead time,
wait 20 seconds after making the
changes before EXITing, in order to
allow the zero stabilizer to reach
equilibrium.
13. Observe the ERR= number at the
bottom left of your screen. This
indicates how far off the peak is
from where it should be.
The GAIN DAC= shows the amount
of correction that the system has
calculated is necessary to bring the
peak into correct gain adjustment.
14. Press ZERO GAIN to reset the gain
DAC to zero. Now observe the peak
and marker locations.
If the center of the peak is near the
K-alpha marker, use the FINE adjust
pot.
If the peak is not close to the
marker, then start with the COARSE
gain adjust pot to bring the peak
close to the marker, then use the
FINE pot.
To move the peak up in energy (a
negative error reading) turn the pot
clockwise. To move the peak down
in energy (a positive error reading)
turn the pot counterclockwise.
Adjust the peak so that the error is
less than 10 with the gain DAC at
zero.
NOTE
When adjusting to correct the error,
press the ZERO GAIN key as
necessary so that gain DAC stays at
O.
15. When the peak is as close to the
marker as possible by visual
inspection, use the software to help
evaluate the gain error.
16. Adjust the FINE GAIN pot so that
the error is less than IO with the
gain DAC set (forced) to zero.
NOTE
If the pot is over-adjusted in one
direction, there wi1l be some
backlash when adjusted in the
reverse direction. It is best to
continue turning past this point in
the same direction before turning
back in the opposite direction.
17. Repeat the steps until the error is
less than IO when the gain DAC is
forced to zero and the system
automatically halts calibration.
The program halts energy calibration
automatically when the error is very
small (less than l).
NOTE
If the system halts acquisition before
the gain pot is adjusted, restart the
energy ca1.ibration.
9-10 Test Procedures
Calibration of medium count rate range
1.-8.
Same as steps 1.8. of "calibration of
high count rate range".
M and the ENTER (return) keys to
select the medium range.
MENU soft keys.
11. Make sure that the DT (dead time) is
parameters to be:
Tube voltage 20kV
Filter Thin
12.-17.
Same as steps 12.-17. of "calibration
of high count rate range". Use R102
(instead of the FINE pot), located
just behind the PA RET light on the
front of the pulse processor PCB.
NOTE
Rl02 is much more sensitive than the
FINE adjustment pot, and has worse
backlash.
Calibration of low count rate range
1.-8.
Same as steps 1 . ~ 8 . of "calibration of
high count rate range".
L and the ENTER (return) keys to
select the low range.
MENU soft keys.
II. Make sure that the DT (dead time) is
parameters to be:
Tube voltage
Tube current
Filter
20kV
0.04 rnA
Thin
12.-17.
Same as steps 12.17. of "calibration
of high count rate range", Use RiOl
(instead of the FINE pot), located
just behind the PA RET light on the
front of the pulse processor PCB.
NOTE
RIOI is much more sensitive than the
FINE adjustment pot. and has worse
backlash.
NOTE
After the low range is calibrated. re
check the high range. If the high
range needs to be readjusted, then re
check and readjust the medium and
low ranges again as well.
-. " , -, .
, ;',
, i'
" . - ~ ,j ,.J
Test Procedures 9-11
INITIAL ENERGY CALIBRATION
Scope and purnose
To adjust the zero DAC and the coarse
zero on the amplifier, and thereby verify
that the data acquisition system is
working properly.
Reference documents
Test conditions
System warmed up at least for an hour.
Fast discriminator checked and adjusted
just before starting this calibration.
Test equipment
Universal adjustment tool (twecker)
standard
Safety precautions
to perform this calibration (high voltage.
X-ray hazards)
Test procedure
I. Boot the: system, load the EDXRF
program, and press SETUP to go to
the MAIN menu.
2. Select SVS STAT. Record the zero
width on the maintenance log sheet.
3. Adjust the coarse zero on the
amplifier so that the zero DAC reads
IO.
4, Press EXIT to return to the MAIN
menu, and press EXIT again to go to
the PROCEDURE menu.
5, Select ENRGY CALIB,
6. Place the Cu caHbration standard in
position 10 of the sample tray. Press
the space bar on the keyboard, and
close the sample chamber Hd.
7, The system begins an acquisition.
Press KLM to enable the KLM
function, and use the arrow keys to
display the K Hnes of copper.
8. Press KLM again to attach the arrow
keys to the cursor, and position the
cursor near the K-alpha line at 8.041
keY.
9. Expand the display until the Cu K
alpha peak fills the screen.
, . I, I
10. Select the ACQ MENU and display
the secondary acquisition soft keys.
I L Press ZERO GAIN, and thereby reset
the gain DAC to zero.
If the Cu peak is close to the marker,
the system automatically readjusts
,
I
,
the gain DAC to bring the peak
closer to the marker.
/ I'
If the Cu spectrum is very far out of
adjustment, as illustrated in Figure
9.2, then adjust the COARSE and
FINE gain pots on the amplifier
until the Cu peak is within 20 eY of
the marker when the gain DAC is set
to zero:
12. Press ZERO GAIN. Monitor the
GAIN DAC reading on the screen.
When the reading goes out of range,
adjust the GAIN pot.
9-! 2 Test Procedures
13. Press RESTART to start another
acquisition.
Cu
14. Repeat this cycle (ZERO GAIN,
adjust, RESTART) until the Cu peak
comes within 20 eV.
Cu
Figure 9.2 System out of calibration
Test Procedures 913
INTERLQCKS
Scope and pUrPose
To test the X-ray interlock circuit.
Reference documents
Schemalic no. 01400304,59190161,
5919-0183.
Test eQuloment
Test diskette
Test conditions
Safety precautions
to perform this test (high voltage, X-ray
hazards).
Test procedure
1. Boot the system, run EDXRF, put the
test diskette in drive A, and go to
the PROCEDURE menu.
2. Selece the interlock test from the
menu.
3. Press SETUP to verify the
Tube voltage 6 kV
Filter Thin
Livetime osec
Max; energy 10 keY
Atmosphere Air
Warmup o sec
4. Put a sample in tray position L
S. Open the chamber lid and press
RUN.
When the CLOSE LID message
appears, the system should wait until
the lid is closed before the XRAYS
ON warning light turns on. The
light should not flicker.
6. Repeat this procedure for each of the
door interlocks, the X-ray tube
interlock, and the detector interlock.
Verify that when an interlock is
open, the X-RAYON warning light
does not come on when RUN is
pressed.
7. Close all interlocks and press RUN.
Note that 13 pins 3,4 are shorted if
all the interlocks arc closed; that the
switches should "click" when closed;
that the spectrometer and X-ray tube
switches must be fully depressed, and
that they must not Mclick" if pressed.
Verify for each interlock that if it is
opened, the X-RAYS ON warning
light goes off immediately.
LIVETIME
Scope and purpose
To test the dead time correction circuit,
and thus make sure that test results are
reproducible regardless of the mix of
elements in a sample.
Reference documents
Test equipment
Test diskette
Sample cup
Small pieces of copper
M n O ~ powder
Test conditions
SlIfrh precautions
Routine.
Test prpcedure
I. Boot the system. run EDXRF, put the
the PROCEDURE menu.
2. Select the livetime test from the
menu.
Tube voltage 20 kV
Filter Thin
Livetime 100 sec
Max energy 10 keY
Atmosphere Air
Warmup o sec
Spectrum processing:
I region
Cu K-alpha
eV 7200-9380
Technique No analysis
Mode Run unknowns
Save on disk 400
4. Place some copper in the sample CUP.
and put the cup on tray position I.
5. Select the ACQ MENU and press
RUN. Perform one acquisition.
6. When the acquisition is complete.
increment the SAVE ON DISK
number by 1. and pour some Mn0
2
powder into the CUP. creating a 10
30% mixture of Cu and Mn.
Make sure the Cu in the cup does not
move when the Mn0
2
is poured in;
otherwise. the test must be redone
correctly.
7. Perform another acquisition.
8. Reset the SAVE ON DISK number to
the previous value.
9. Select SPECTRUM PROCESSING
and press RUN.
No. of spectra to process:
enter "2,"
10. Select ANALYSIS TECHNIQUE and
press RUN.
11. Verify that the gross counts for
copper from both runs are within
0.3% of each other.
MINIMUM DETECTION LIMITS
Scope and purpose
To measure the sensitivity of the system
when analyzing a rcaI sample, using an
oil sample with known concentrations of
iron and lead to measure and calculate
the minimum detectable concentrations
of these elements in oil.
Rdrrence documents
Test equipment
Test diskette
Conostan 512 100 ppm trace elements
Test conditions
Safety prenutions
Routine.
Test procedure
the PROCEDURE menu.
2. Setect the oil MDL test from the
menu.
Tube voltage 22 kY
Filter used ThIn
Livetime 300 sec
Max energy 20 keY
Atmosphere Air
Warmup o sec
Mode Run unknowns
REFERENCE file with Fe and Pb
defined as the elements to be
analyzed.
4. Put the sample in position 1.
S. Press EXIT to return to the
PROCEDURE menu, and press RUN
to start the test. Answer the prompts
as follows.
No. of samples to run: 1
Sample label: (press ENTER)
6. Adjust the tube current to give
SO%DT.
7. When the acquisition is finished, the
system prints out peak and
background intensities for the
analysis of the oils.
8. Calculate and record the MOL for Fe
and Pb. The formula is as follows:
or
MOL {3*IlOOppm*SQRT(IbltlPld)}/lpeak
where
C.
td
concentration in the standard
I uk peak intensity
= background intensity I:
kind
9. Verify that MDL for Fe is less than
3.0 ppm and that the MDL for Pb is
less than 6.0 ppm.
916 Test Procedures
PILE-UP
Scope and purpose
To test the pile-up rejection circuit on
the pulse processor PCB.
Reference documents
Test egujDmegt
MoO, sample
Test diskette
Test conditions
Safety precautions
Routine.
Test procedure
the PROCEDURE menu.
2. Select the pileup test from the menu.
Tube voltage 20 kV
Tube current 0.30 mA
Filter Thin
Uvctime 300 sec
Max energy 20 keY
Atmosphere Air
Warmup Osee
2 net ROIs
Region 1 Mn K-alpha
eV 53206220
Region 2 Sum peak
eV 1146012120
Technique Linear
Mode Run unknowns
4. Press EXIT to return to the
PROCEDURE menu.
5. Press RUN to start the test. Answer
the prompts as follows.
No. of samples to run: I
Sample label: (press ENTER)
6. The procedure automatically runs the
spectrum processing and analysis
technique at the completion of
acquisition. The result is the ratio of
the sum peak to the parent peak.
Verify that this ratio is 0.25 to 0.30
(the lower the better).
If the ratio is larger, it is indicative
of a defective pile-up rejection
circuit; replace the pulse processor
PCB.
--------------------------------------------------------
PQWER SUPPLIES
Scope and purpose
To adjust the DC outputs of the linear
and switching power supplies, and verify
that their operating characteristics are
within specifications.
Reference documents
Schematic no. 8100-6015, 8100-6027,
8100-6028,0140-0304,5919-0183.
Test conditions
Test equipment
Digital multimeter
Oscilloscope
Safety precautions
High voltage hazard (110 VAC).
Test procedure
1. Unplug the AC power cord of the
5000.
2. Check the input AC voltage selection
jumpers. For test purposes they
should be set to 115 VAC.
3. Check that the fuses are installed
and verify their values.
4. Plug in the AC power cord and turn
on the 5000. Measure the voltages at
the DC power inputs on the PCBs
(not at the power supply outputs):
-_..-............_.....................................
Ca.!2k Ei.n.
Voltage RiDple
VDC mV p.p
J22 1 + I 2.0.0. 1 5.0
2 GND
3 -12.0:!;.0.1 5.0
J23 1 +24.00.2 5.0
2 GND
3 -24.0:!;.0.2 5.0
124 1 12.0:!;.0. 1 120
3 +5.00:!;.0.05 5.0
4 +5.00:!;.0.05 5.0
5 GND
6 GND
7 +12.0.O.1 120
5. Adjust the DC power supply outputs
as necessary.
6. The 30 or 50 kV xray power
supplies are adjusted not directly on
the power supply itself (it would
involve the little matter of making a
high-kV measurement directly), but
on the xray power supply controller
PCB.
RADIATION SURVEY
SCODe and purpose
To verify that there is no radiation
leakage from the 5000.
Reference documepts
Radiation survey recording form no. 226
Test equipment
Test diskette
Sample (any)
Dosimeter ring or badge
1 milliCurie Fe
55
source
Survey meter, Viela.een model 444 or 493
Test conditions
Complete. fully functional system
Safety precautions
Radiation hazard; test personnel must
wear dosimeter during test.
Test procedure
I. Fill out the survey form.
the PROCEDURE menu.
3. Select radiation survey from the
menu.
Tube voltage:
30 kY system 30 kV
SO kY system 50 kV
Filter No filter
Livetime osec
Max energy 40 keY
Atmosphere Air
Warmup osec
S. Place the sample in tray position I,
and press RUN to turn on the X
rays.
6. Verify that the survey meter has
been calibrated in the last 6 months.
If not, have it calibrated before
using it.
For the model 444:
7. Turn knob A from OFF to BAT.
Verify that the meter reads in the
black zone near 10. If not. replace
the batteries.
Slowly turn knob A from BAT to
mR/h, Do not peg the meter. Slowly
turn knob B to 3.
Verify that the meter reads less than
0.10.
Carefully open the probe window.
For the model 493:
7. Turn the knob to BAT.
Verify that the meter reads in the
green zone. If not. replace the
battery.
Turn the knob to Xl. and take a
reading of the 5000.
Verify that the meter reads less than
0.2 mR/h. If it reads greater than
0.2, take another reading to
determine if there is a radiation leak.
8. Carefully remove the end cap.
9. Place the Fe source within 6 inches
of the detector on the survey meter.
Verify that the meter reads at least
mR(h.
10. Very. very slowly move the meter
around the 5000 at a maximum
distance of 2 inches from the
surface. Check all areas of the
chamber lid and access doors.
The probe on the 493 must be held
parallel to the direction from where
X-ray would be leaving the system.
II. Double-check around the seals and
edges where there may be gaps
between the lid, doors and chassis.
12. Try prying the lid open with one
hand, while holding the survey meter
in the other, and see if there is an
increase in the amount of radiation
detected along the seal.
13. Note any deflection of the meter on
form 226.
14. Press EXIT to turn off the X-rays.
REPEATABILITY
Scope and purpose
To check that the X-ray output of the X
ray tube returns to the same level, for a
given kY and rnA setting, when the
system is turned off and on, or set to
different values.
Reference documents
Test equioment
Test diskette
Collimator
Single sample stage
Brass sample
Test conditions
Safety precautions
Routine.
Test procedure
I. Boot the system, fun EDXRF. put the
the PROCEDURE menu.
2. Select the repeatability test from the
menu.
For a SO kV system:
Tube voltage 20 kY
Filter Thin
Livetime 60 sec
Max energy 10 keY
Atmosphere Air
Warmup Osee
For a 30 kV system:
Tube voltage 15 kY
Filter Aluminum
Livetime 60 sec
Max energy 10 keY
Atmosphere Air
Warmup 10 sec
For either:
Gross ROI
Brass
Technique Linear
Mode Run unknowns
Save on disk 501
4. Press EXIT to return to the
PROCEDURE menu.
5. Press RUN to start the test. Answer
the prompts as follows:
No. samples 10
All others Press ENTER.
6. The system acquires and stores
spectra. During acquisition of the
first spectrum, set the %DT to 50%
by changing the tube current.
7. While sample 6 is being acquired, go
to the ACQ menu and press ACQ
PARM. Change the tube voltage to
twice the present value, and change
the tube current to half of its present
value. Press EXIT.
8. The system acquires additional
spectra.
Press ACQ PARM again and change
the tube current and tube voltage
back to their original values, but
wait 2 minutes before pressing EXIT.
9. After the 10 spectra have been
stored, the system turns off the X
rays. Select SAVE ON DISK and
press SETUP. Change the number to
611, press ENTER and EXIT.
10. Wait until the Xrays have been off
for 2 minutes.
11. Press ACQ PARM and RUN. Answer
No. samples 5
12. The system acquires 5 more spectra.
13. Process the spectra as follows.
Change the SAVE ON DISK number
back to 601.
Select SPECTRUM PROCESSING
and press RUN.
Enter 15 for the number of spectra
to process, and press ENTER.
14. Print the results as follows.
Select ANALYSIS TECHNIQUE and
press SETUP.
Change the MODE from RUN
UNKNOWNS to STANDARDlZE.
Set PRINT STATISTICS to YES.
Press EXIT, then RUN.
15. Verify that the sigma value that is
printed out is less than 0.25.
RESOLUTION
Scope and DUrPose
To verify the operation of the detector
and related circuitry.
Reference documents
Test equipment
Test diskette
Mn0
2
sample, or
1 milliCurie Fe" source
Test conditions
Safety precautions
Routine.
Test prOcedure
the PROCEDURE menu.
2. Press SETUP, then SYS STAT on the
main menu, and TEST PROeS on the
PHA status page. Select the energy
resolution test from the menu.
Tube voltage 19 kY
Filler Thin
Livetime 22 see
Max energy 10 keY
Atmosphere Air
Warmup osec
4. Place the sample in tray position I.
then press EXIT and RUN.
5. The system performs 2S acquisitions.
Arter each one, it prints the
following:
Full width at half-max (FWHM)
R uooing average of FWHM
Peak-la-background ratio at 1 keY
Peak-la-background ratio at 5 keY
Average of the two ratios
Value of peak centroid
6. Verify the following:
Resolution at low count rate is less
than 155 eV.
Resolution at medium count rate is
less than 165 eV.
Peak-to-background ratio at I keY is
1200 or greater.
Peak-to-background ratio at 5 keY is
520 or greater.
NOTE
The peak-to-background ratio is
indicative of the detector alone. The
resolution (FWHM) is indicative of
the detector and its electronics.
NOTE
If the Fe source is used to run this
test, there may be a variation of
about 10% from the results obtained
with the Mn sample.
RESOLUTION-STABILITY
(a.k.a. NEW ENERGY RESOLUTION)
Scope and puruose
To verify that the acquisition subsystem
of the SOOO is working properly, and to
differentiate between problems arising in
the X-ray source and detection circuits.
Reference documents
See the Spectrace SOOO operation manual
Test equipment
Test diskette
standard
or sample supplied by customer
Test conditions
(computer and SOOO).
Safety precautions
Routine.
Test procedure
the PROCEDURE menu.
2. Press SETUP, then SYS STAT on the
resolution test from the menu.
Tube voltage 30 kY
Tube current 0.Q2 mA
Filter Thin
Livetime 600 sec
Max energy 20 keY
Atmosphere Air
Warmup 1000 sec
4. Place the sample in tray position 10,
then press EXIT and RUN.
5. The system performs acquisitions
continuously until EXIT is pressed.
After each acquisition, it prints
values for the following list of
variables (the values shown below
are the typical acceptable values for
copper on medium range):
Run number (any)
FWHM <lg3
Peak centroid 8041
Deviation 3
Total counts >2 million
Deviation <0.5%
Peak counts >I million
Deviation <0.5%
Elapsed time up to 8 hours
6. Use the following table as a guide to
further testing and replacement of
modules.
IF Peak centroid is bad
THEN check
ADC
Pulse processor
IF Total count deviation is good
Peak count deviation is bad
THEN check
Detector
ADC
Pulse processor
IF FWHM is good
Peak centroid is good
Total count deviation is bad
THEN check
X-ray power supply
X-ray tube
IF FWHM is bad
THEN check
Detector
ADC
Pulse processor
IF Peak centroid is bad
THEN check
Detector
ADC
Pulse processor
IF FWHM is good
Peak centroid is good
Total count is decreasing
Total count deviation is bad
Peak count is decreasing
THEN check
Xray power supply
X-ray tube
IF FWHM is bad
Total count deviation is good
Peak count deviation is bad
THEN check
Detector
ADC
Pulse processor.
7. Note the following bits of wisdom.
The stability of the Xray source
(tube. power supply, controller) is
indicated by the total count, which is
generatly unaffected by changes in
FWHM or peak centroid.
Variation in FWHM causes unstable
peak count; as FWHM increases, peak
count decreases.
Variation in peak position (centroid)
causes a decrease in peak count.
Variation in stability also affects
peak count.
8. Any sample may be used for this test.
To change the test parameters. do the
following;
From the PHA Status Display, press
ECAL CONFIG. then press EXIT.
Enter the energy of the element you
wish to use; press ENTER.
Run the test as usual.
NOTE
The values in step 5 are valid only
for copper. Reset the ECAL
CONFlG to 8041 eV when the test is
completed; otherwise the energy
calibration routine will not work
properly.
SIGNAL PROCESSING SUBSYSTEM
(.k.. FRONT END)
Scone and purpose
To verify the operation of tbe
acquisition and signal processing circuits,
and to indicate further tests tbat may be
required.
Reference documents
Test equipment
Copper sample
Jest conditions
Safety precautiQns
to perform this test (high voltage, X-ray
hazards).
Test procedure
1. Check that the gain switch on the
pulse processor is set to Xl and that
the coax cable from the bias supply
to the pulse processor is connected.
On the bias SUpply the HV and LOW
LN lights should be on.
On the pulse processor the HIGH OT
light should be off and the PA
RESET light should be flashing less
than once per second.
2. Boot the system and load the EOXRF
program.
3. Press SETUP to go to the main menu,
then SYS STAT to go to the PHA
STATUS PAGE.
4. Verify that the ZERO OAC number
is green and within )OO of zero.
If it is not, do the "initial energy
calibration" procedure.
5. Verify that the FAST DISC RATE is
approximately 100 counts/second.
If it is not, do the "fast
discriminator" adjustment procedure.
6. Verify that the ZERO FWHM
number is between 90 and 110 in the
medium count rate range.
7. PTCSS EXIT to leave the status page.
8. Place a copper sample in position I
on the sample tray and close the
chamber lid.
9. Collect a spectrum of the coppeT
sample and use the KLM marker to
determine the accuracy of the gain
DAC.
If the error is greater than 80 eV, do
the gain vs. count rate range
adjustment procedure.
926 Test PrQcedures
SOLENOID VOLTAGE
Scope and purpose
To test the operation of the various
solenoids (air, vacuum, helium) by means
of voltage measurements.
Reference documents
Schematic no. 0140-0304, 0110-0601.
Test conditions
(computer and SODa).
Test equipment
Test diskette
Voltmeter
Safety precautions
this test (high voltage hazard).
Test procedure
1. Boot the system and load the E. Load
the ECHOA program from the test
diskette.
2. Use ECHOA commands to energize a
solenoid. (See Section 10 or the
"chamber controller" test procedure.)
NOTE
The AIR solenoid should not be
energized when vacuum pump is on.
3. Measure the voltage on the solenoid.
Expcc[ed reading: 12 0.1 V
SPOT ALIGNMENT
Scope and purpose
To verify that the X-ray beam and the
sample tray are aligned correctly.
Reference documents
Test equipment
Test diskette
Type 52 Polaroid film
Test conditions
Safety precautions
Routine.
Test procedure
I. Boot the system and run the EDXRF
program.
2. Open the chamber lid and position a
sheet of film below the sample tray
but propped up so it is against the
tray.
3. Set the acquisition parameters as
follows:
Tube voltage 30 kY
Filter used Aluminum
Livetime a sec
Max energy 10 keY
Atmosphere Air
Warmup a sec
4. Press RUN. Wait 7-10 seconds after
the X ~ r a y s corne on, then press EXIT.
5. Open the lid, and using a felt tip
pen, make a circle on the film packet
through the sample tray to indicate
where the sample sits, then take the
film out and re-draw the circle with
a ball point pen to leave an imprint
on the film.
6. When the film is developed, there
should be a light area where the film
was exposed by the X ~ r a y s and it
should be within the scribed circle.
STABILITY
Scope and purpose
To verify that the X-ray output of the
tube is constant with time; also to test
the GAIN and ZERO stability of the
pulse processor and the ADC.
See also "resolutionstability" test.
Reference documents
Test equipment
Test diskette
Ti-Zr calibration standard
Collimator
Printer
Test conditions
Safety precautioos
Routine.
Test procedure
1. Boot the system, run EDXRF. put the
the PROCEDURE menu.
2. Press SETUP, then SYS 5TAT on the
stability test from the menu.
3. PTess SETUP to vedfy the
acquisition paTameters:
Tube voltage:
30 kV system 30 kY
50 kV system 50 kY
Filter Thin
Livetime 200 sec
Max eneTgy 40 keY
Atmosphere Air
Warmup 600 sec
4. Press EXIT.
The program prompts for the
centroid values of Ti (lower limit)
and Zr (upper limit). These should
be 4508 and 15746, respectively.
5. Press RUN.
6. Increase the tube current to give
50%DT (select ACQ menu, press ACQ
PARM).
7. The program Tuns continuously until
EXIT is pressed, and pdnts out the
following:
Gain and zero errors
Gross integral
Standard deviation of 8mss integnl
8. After staTting the test, let it run faT
30 minutes, then stop and restart it
in order to allow for warm-up. The
test should then run for 8 hours, or
overnjght.
After 8 hours:
The gain and zeTa should not change
by more than .3 gain units and .3
eV respectively.
The standard deviation of the gTOSS
integral should be less than 0.5%
STRAY LINES - TYPE II
Scope and purpose
To verify that the intensities of any
jnstrumental stray lines in the 4 KeY to
10 KeY region of the x-ray spectrum are
below specified limits. This is
accomplished by analyzing a sample
known to contain only very light elements
which the 5000 cannot detect.
Reference documents
See the Spectrace 5000 Operators Manual
for a descriptjon of the EDXRF program.
Tel'it conditions
Test equipment
Diagnostic diskette
Delrin disk
Safety precautions
Routine
Te!\;t procedure
I. Check that the detector collimator
and sample tray arc installed and
properly aligned. This is very
important since both components can
be sources of suay lines.
2. Boot the system, run EDXRF, press
CDIR, type \STRA Y, and go to the
PROCEDURE menu.
3. Select the 25 KV test from the menu.
Tube voltage 25 kV
Tube current .04 rnA
Filter Thin filter
Livetime 1000 sec
Max energy 40 keV
Atmosphere Air
Warmup 0 sec
5 ROI,
Region I Cu net ROI
eY 7820-8220
Region 2 Fe net ROJ
eY 6200-6600
Region 3 W net ROJ
eY 8200-8600
Region 4 R I gross
eY 0-30000
Region 5 R2 gross
eY 5000-5500
Technique Linear
Mode Run unknowns
Note: Dead time should be
approximatly 40 percent. If not, adjust
current.
5. Place the delrin disk into sample
tray position 1.
6. Press EXIT, then RUN. Answer
No. samples I
All others Press ENTER
7. The procedure automatically runs
the spectrum processing and
analysis technique at the
completion of acquisition.
The result is the percentage of
each element in the total spectrum.
Verify that each is less than 0.015.
Region 5 is a measure of the
background level and a maximum
value is not specified.
Test Procedures
9-29.
STRAY LINES - TYPE III
Scope and purpose
To verify that the intensities of any
instrumental stray lines in the 10 KeY to
25 KeY region of the x-ray spectrum are
below specified limits. This is
accomplished by analyzing a sample
known to contain only very light elements
which the 5000 cannot detect.
Reference documents
See the Spectrace 5000 Operators Manual
Test conditions
Test equipment
Diagnostic diskette
Delrin disk
Safety precautions
Routine.
Test procedure
1. Check that the detector collimator
and sample tray are installed and
properly aligned. This is very
important since both components can
be SOurces of stray lines.
2. Boot the system, run EDXRF, press
CDIR, type \STRAY, and go to the
PROCEDURE menu.
3. Select the 50 K V test from the menu.
Tube voltage
Tube current ~ 3 ~ ~ A '
Filter Copper filter
Livetime 500 sec
Max energy 40 keV
Atmosphere Air
Warmup Osee
4 ROb
Region Ag net ROI
eV 21700-22440
Region 2 So net ROI
eV 24820-25480
Region 3 R1 gross
eV 0-40920
Region 4 R2 gross
ev 1500-1600
Technique Peak Ratios
Mode Run unknowns
Note: Dead time should be
approximatly 30 percent. If not, adjust
current.
5. Place the delrin disk into sample
tray position I.
6. Press EXIT, then RUN. Answer
No. samples I
All others Press ENTER
7. The procedure automatically runs
the spectrum processing and
analysis technique at the
completion of acquisition.
The result is the percentage of
each element in the total spectrum.
Verify that each is less than 0.02.
Region 4 is a measure of the
background level and a maximum
value is not specified.
Test Procedures
TRAY ACCURACY
Scope and purpose
To verify that the system gives the same
results when analyzing the same sample
in any position. To do this the test uses
a set of 10 identical brass plugs, analyzes
one in each tray position and checks that
we get the same result in each position.
Reference documents
See the Spectrace SOOO operation manual
Test eauiDment
Test diskette
10 identical brass plugs
Test conditions
"Tray height" adjustment procedure has
been performed.
Safety precautions
Routine.
Test procedure
I. Boot the system, run EDXRF. put the
test diskette in drive A. and go to
the PROCEDURE menu.
2. Select the tray accuracy test from the
menu.
Tube voltage 20 kV
Filter Thin
Livetime 60 sec
Max energy 10 keY
Atmosphere Air
Warmup 1000 sec
Brass
Gross ROI
eV 7200-10080
Technique Linear
Mode Run unknowns
Print stats. Yes
4. Go to ACQ menu, press ACQ PARM
then RUN. Answer the prompts as
follows:
No. samples 10
5. Change the analysis technique to
"standardize." select ANALYSIS
TECHNIQUE and press RUN.
6. The system prints out the difference.
relative error and sigma value for
each tray position.
Verify that the maximum deviation
is less than 0.5% and that the sigma
is less than 0.3 for any position.
7, If this test fails, do the "spot
alignment" procedure.
Test Procedures 9-3 I
TRAY HEIGHT
Scope and purpose
To set the tray at the optimum height for
X-ray analysis. At this height the system
has a higher count rate than at lower or
higher settings, and will give better
sample tray accuracy results.
Reference documents
Test equinment
Test diskette
Brass sample
Set of washers
Test conditions
(computer and SOOO).
Safety precautions
Routine.
Test procedure
the PROCEDURE menu.
2. Select the tray accuracy test from the
menu.
Tube voltage 20 kY
Filter Thin
Livetime 60 sec
Max energy 10 keY
Atmosphere Air
Warmup 30 sec
Brass
Gross ROI
eY 7200-10080
Save on disk 600
Mode Run unknowns
4. Install the smallest washer, and puc
the brass sample in tray posicion I.
5. Go to ACQ menu, press ACQ PARM
then RUN. Answer the prompts as
follows:
No. samples I
6. At the end of the acquisition,
increment the SAVE ON DISK
number by I, install the next larger
washer, and do another acquisition.
Repeat this for each of the washers
(at least 5).
7. At the end of the series of
acquisitions, reset the SAVE ON
DISK number to 600.
8. Select SPECTRUM PROCESSING,
press RUN, and enter the number of
acquisitions performed (no. of
washers) as the number of spectra to
process.
9. Select ANALYSIS TECHNIQUE and
press RUN.
The program displays the gross count
for each acquisition (tray height).
10. The correct tray height is the one
with the highest gross count. Install
the corresponding washer on the
sample tray.
VACUUM
Scope and purpose
To tcst the operation of the vacuum
subsystem, by measuring the time (I) to
evacuate the chamber. and (2) to let it
back up to air.
Reference documents
Test equipment
Test diskette
Vacuum pump
Vacuum gauge
Test conditiops
Safety precautions
Routine.
Test procedure
the PROCEDURE menu.
2. Select the vacuum test from the
menu.
Tube voltage 6 kV
Tube current 0.Q2 rnA
Filter Thin
Livetime osec
Max energy 10 keV
Atmosphere Air
Warmup 30 sec
4. Place a solid sample (not liquid or
sealed) in tray position I. and press
RUN.
5. When the spectrum appears on the
screen, go to ACQ menu, press ACQ
PARM. and change the atmosphere to
vacuum.
6. Press EXIT.
Verify that the vacuum pump turns
on and that the WAITING FOR
VACUUM message appears, and note
the time.
7. Verify that the acquisition restarts
when the pressure is down to 750
microns. Note the time again.
Verify that the elapsed time since
the pump started ("evacuation time")
is less than 2 minutes.
NOTE
The chamber tid should seal itself
(may help to push down on it at
first), and the vacuum should be less
than 250 microns in 10-15 minutes.
8. When the pump-down is completed,
press PREY L VL to get to the main
spectrum menu, then press EXIT.
Note the time.
9. Try to lift the chamber lid. When
successful, note the time.
Verify that the elapsed time since
EXIT was pressed ("air bleed time")
is less than 20 seconds.
9-33 lest Procedures
X-RAY ON WARNING LIGHT
Scope and DUrPose
To verify by means of voltage
measurements that the X-RAYON
warning light module is working
properly.
Reference documents
Schematic no. 59J9-0184
Test equipment
Oscilloscope
DMM
Test tondltlons
Safety precautions
this test (high voltage hazard).
Test procedure
J. Make sure the 5000 is powered off.
2. Verify that there is no short circuit
between +12V and ground, and
between +5V and ground on the X
RAY ON light PCB.
3. Apply +12V to the unit.
4. Verify that the X-RAY ON light
turns on.
5. Using channell of the oscilloscope,
verify that the signal on UI pin 2
looks as shown in Figure 9.3.
Verify that II is between lJ and 14
microseconds, and that T2 is between
22 and 28 microseconds.
--- ---f--
T1
T2 12V U1
2
25EV02
_ DRAIN
ll"'irl2L01

0=,;::,-:-,
-=rL
T4
0 12EV02
---.lL
--+-;-,.!. , , GATE
T1
SECONDARY
V
o 1020304050 USEC
Figure 9.3
Waveforms in the XRAY ON
warning light circuit
6. Triggering off channel I, and using
channel 2. verify that the signal at
the gates of Ql and Q2 look as
shown in the Figure.
Verify that 13 and 14 are between 4
and 6 microseconds.
7. Using channel 2, verify that the
drains of Q1 and Q2 look as shown
in the Figure.
8. Using channel 2, verify that the
secondary of transformer TI looks as
shown in the Figure.
9. Using the DMM, verify that the
current from the +12V supply to the
unit is less than SOD rnA.
10. Make sure the light is cold. Adjust
the power supply output to 11.5 V
and verify that the light starts
reliably.
1I. Test phototransistor Q3 as follows:
block the light entering Q3 and
verify that the interlock opens and
the xrays are turned off.
Spectrace SOOO Technical Manual
X-RAY POWER SUPPLY CONTROLLER
Scope and purpose
To check and adjust the x-ray power
supply controller PCB at various
operating points of the x-ray source.
Reference documents
Test conditions
Jest rouiDment
Test diskette
Voltmeter
Oscilloscope
")2" cable
Test diskette
Safety precautions
X-ray hazards).
Trst procedure
1. Make sure the 5000 is turned off.
2. Connect J2 to the x-ray power supply
controller PCB.
12 goes to the filament of the x-ray
tube. In this procedure the filament
is removed from the circuit and is
replaced by a dummy load, so that
the x-ray tube cannot come on.
3. Check that the programming jumper
is set for the correct power supply.
For 30 kV the jumper should be
placed in front of R30. The other
setting is for selecting 50 kV.
4. Turn on the 5000.
5. Measure the voltage at TP6. It should
be 15O.75 V.
6. Use the oscilloscope to look at the
drain of Ql while triggering on the
gate.
Figure 9.4 shows the expected trace.
T l should be between 40 and 50 usec,
T2 between 2 and 8 usee.
7. Measure the voltage at TP1. It
should be 2.21 0.01 V. Adjust R2
as required.
8. Measure the voltage at IP3. It
should be 2.21 0.01 V. Adjust Rl
as required.
9. Now check that the drain of Ql is
still as shown in the Figure.
10. Load the ECHOA program.
11. Close the chamber lid and bypass the
interlock on the front door.
12. Set the tube current to 0 rnA, the
voltage to 15 kV, and turn on the X
RAY ON light by typing the
command sequence
CCIOO
CX
CCHI5
CX
CKIF
CPO
CX
13. Measure the voltage at pin 5 of U9.
14. Adjust R30 until the voltage at TP7
is the same.
---
NOTE
The output of the high voltage block
is directly proportional to the voltage
at TP7. That is,
On a 30 kV system,
lOY @ TP7 = 30 kY, 5Y = 15 kY, etc.
On a 50 kV system.
lOY @ TP7 = 50 kY, 5Y = 25 kY, etc.
15. Set the tube current to IS rnA and
the voltage to 5 kV by typing the
command sequence
CCH05
CX
CC1l5
CX
16. Measure the voltage at pin 2 of UII.
It should be 261 10 mY.
17. Open the front door interlock that
was bypassed.
Verify that the X-RAY ON warning
light is turned off immediately.
18. Unlock the chamber lid by typing
CKIQ
19. Type CTRL-C to exit the ECHOA
program.
NOTE
The actual tube current can be measured
with a floating voltmeter connected
across R18. The X ~ r a y tube must be
connected normally.
The correspondence between the
measured voltage and the tube current is
as follows:
30 mY O.t mA
60 mY = 0.2 mA
90 mY = 0.3 mA
56V-
2BV-
1V-
Figure 9.4
---J T1
Waveform on drain of QI
Spcctracc 5000 Technical Manual
X-RAY TUBE
CURRENT-VOLTAGE STEPS
Scope and purpose
To verify the current and voltage
response of the 5000.
Reference documegts
Test equloment
Sample (any).
Test conditions
Safety precautions
Routine.
Test procedure
This test is run by incrementing the tube
voltage and the tube current by I kV and
0.01 rnA. respectively, and observing that
the count rate and the dead time increase
normally. The filter has to be changed
as the tube voltage inreases.
1. Run EDXRF, go to the ACQ menu,
press ACQ PARM and set the
acquisition parameters as follows:
Tube voltage:
Initially 6 kV
Then I kV steps
Tube current:
Initially 0.0 rnA
Then 0.0 I rnA steps
Filter:
0-20 kV No filter
20-30 kV Thin
30-40 kV Thick
40-50 kV Copper (no.6)
Livetime osec
Atmosphere Air
Warmup osec
2. Observe the values of the count rate
and dead time on the PHA 8TATUS
page.
Verify that the count rate and
deadtime increase with tube voltage
and current. (For example. the count
rate is directly proportional to tube
current; also, as the tube voltage
doubles. the count rate quadruples).
Section 10
DIAGNOSTIC SOFTWARE
Introduction 10-1
ECHOA ............................. 10-3
Loading the ECHOA program ............... 10-3
Command language 10-3
"Command" syntax 10-3
"Query" syntax 10-3
LIGHTEST ............. _.......... _.. 10-5
Loading the LIGHTEST program 10-5
Program ope"lion .. _...................... 10-5
Errors and troubleshooting 10-5
MEMTEST _ _ __ _ 10-6
Loading the MEMTEST program 106
Test selections 10-6
Test results, messages 10-7
System status page ~ 10-7
TEST PROCEDURES 10-10
Loading the PROCEDURE menu 1010
Procedure menu 1010
Sort key functions 10-10
TXCONFIG PROGRAM 10-11
Previous versions 10-11
Changing the configuration 10-11
Running TXCONFIG 1Q-11
Filter selection 10-14
Spectrometer geometry 10-15
Exiting the program 10-16
YERIFYP PROGRAM 10-17
10-1 Diagnostic Software
INTRODUCTION
The Spectrace 5000 is supported by four
classes of diagnostic programs:
Hardware diagnostics ECHOA,
MEMTEST and LIGHTEST. which test
the chamber controller and the data
memory PCBs, and the X-RAYON
warning light module, respectively.
The system status page in EXDRF. which
reports on the signal processing board set.
DOS diagnostics, which are specific to
the computer and its peripherals.
Software-driven adjustment and
performance test procedures, which guide
the technician through tests of the
various parts and functions of the
Spectrace 5000.
All four classes of diagnostics run on the
IBM PCIAT computer.
ECHOA, MEMTEST, LIGHTEST and the
system status page are described in this
section. The system status page is also
described in the operator's manual.
The DOS diagnostics are described in the
IBM manuals.
The software-driven test procedures are
described in detail in Section 9. This
section describes the software path to
these procedures, provided via EDXRF,
as well as the RDCNFG and MKCNFG
programs to read and change the
configuration of the Spectrace 5000.
X-RAY ON
WARNING
LIGHT
CHAMBER
CONTROLLER
PCB
DATA
MEMORY
PCB
ADC
MICRO
PCB
PULSE
PROCESSOR
PCB
BIAS
SUPPLY
PCB
LIGHTEST
ECHOA
MEMTEST
Figure 10.1
MEMORY
DOS
DIAGNOSTICS
PC/AT
PHA STATUS PAGE
DISPLAY
PRINTER
DISK
DRIVES
KEYBOARD
REAL TIME CLOCK
MATH COPROCESSOR
SERIAL INTERFACE
Diagnostics for the Spectrace 5000
ECHQA
The ECHOA program allows the service
technician to exercize various sample
processing hardware parameters that are
normally under the application software
control via the chamber controller PCB.
The ECHOA program is located on the
system test diskette. To run the ECHOA
program, the computer and the
communication path up to the chamber
controller PCB must be operational. and
the computer must be booted. Keep the
keyboard in the caps-lock mode.
L9ad1ng the ECHOA D[Qaram
I. Place the test diskette into a disk
drive (for example, A:), and
make sure that it is the default drive
(type A: and press the ENTER key).
2. Type ECHOA and press the ENTER
key to load the: program.
3. When the program has finished
loading. press the ENTER key again.
The letter Z (or I) should appear on
the screen.
Command laneuav;e
The ECHOA commands are listed in table
10.1; "usage" shows exactly how the
commands are to be typed in. Note how
some commands take a numerical
parameter; for others, ON or OFF are the
only allowed parameters.
Note that every character typed on the
keyboard is displayed twice. This is the
echo function of the system.
"Command" syntax
Simply typing the command is not quite
enough. The following syntax must be
followed:
I. Type the command for the function
to be performed (upper case only),
press the ENTER key, then
2. Type the command to execute,
and press the ENTER key.
For example, the command sequence
CVO
CX
turns on the vacuum pump.
The execute command ex must be
used after every function command.
"Query" syntax
The query syntax (use of comma.nds to
evoke a status report from the
hardware) is similar to the command
syntax.
I. Type Q, the letter denoting the
hardware, and its parameters; then
press the ENTER key.
2. The status of the hardware is
displayed as a two letter message on
the screen.
For example, the command
QV
evokes the response
VF
indicating that the vacuum is off.
10-4
C
Diagnostic Software
Table 10.1 ECHOA command language
-------------------------------------===========----------------------=====
Command Name Usage Function
-----------------------------------=-==-=----------------------=--.-==-===
command (prefix)
Q query
CI set tube current
CH set tube voltage
F filter position
H helium
P X-RAY ON light
R air
S sample position
V vacuum
F off
o on
x execute
CCIOO
CCH15
CF2
CS04
CRF
CVO
CX
_
control-C terminate ECHOA program
-.------.--_ _---_._-----_._--------.-------------_
(prefix)
set tube current to 0.0 rna
set tube voltage to 15 kv
go to filter position 2
go to sample position 4
turn air off
turn vacuum on
execute previous command
_---------------------------------..--_.-------
Pages 4-26 and 4-27 show additional commands that can be used in ECHOA.
Diagnostic Software 10-5
LIGHTEST
The LIGHTEST program turns the X
RAY ON warning light on and off 150
times. It verifies the operation of the
light, the corresponding circuit on the
chamber controller PCB. and its
connections to this PCB.
Loading the LIGHTEST urogram
1. Place the test diskette into drive A.
and make sure that it is the default
drive (type A: and press the ENTER
key).
2. Close the chamber lid.
3. Type LIGHTEST and press the
ENTER key to load the program.
PrOKram operation
The program locks the chamber lid and
the turns on the light for about I second,
then off for another second.
If the program detects no errors. it
displays END TEST about 5 minutes
after starting it.
If the program detects a problem. it
displays an error message, the iteration
number when the error was detected. and
it stops.
The program can be stopped at any time
by typing a CNTL-C. If the light is left
on, it is necessary either to fun the
XRAYOFF program or to reboot the
computer. in order to turn off the light
and unlatch the chamber lid.
Errors and troubleshootinl!.
The LIGHTEST program displays a
message on the screen when it detects an
error. The error messages and
corresponding remedial steps are as
follows:
CANNOT TALK TO CHAMBER BOARD
Check the AC power, RS232 cable
and other connections between the
computer and the chamber controller
PCB.
CANNOT LOCK CHAMBER LID
The light did not come on, or the lid
latch did not close in time.
Check the chamber lid, lid latch. X
RAY ON light, interlock circuit, and
the chamber controller PCB.
FAILED TRANSMITTING POWER OFF
COMMAND, or
FAILED TRANSMITTING POWER ON
COMMAND
Chamber controller PCB did not
accept a power-off (or power-on)
command.
Check RS232 connection, chamber
controller PCB (especially UI, US,
U9).
X-RAY LIGHT NOT ON
Power-on command was received but
the light did not come on.
Check the tight, chamber controller
PCB (especially K2).
X-RAY LIGHT NOT OFF
Powerorr ccommand was received,
but the light stayed on.
Check the light, chamber controller
PCB (especially K2).
MEMTEST
The MEMTEST program is a pass/fail
test of the data memory PCB. It returns
an error printout which can be used to
locate simple problems on the board.
The program tests the data bits of the
memory on the board. This is done by
writing and then reading a test pattern to
every memory address. The number of
errors for each data bit for each memory
chip is counted and printed when this
portion of the program is completed.
The program next tests the address lines
of the memory chips. This is done by
clearing the memory. writing a number
into the first memory location, and
checking to see if the number appears
anywhere else in the memory. This will
test for an address line stuck high (I). If
an address line is stuck high, a number
written into the first memory location
(all zeros) will not be stored there but at
another (all zeros ex.cept the one stuck
line). When the contents of the memory
at other locations are read (using a
walking one pattern for the addresses)
and compared to the number. a match
indicates a stuck address line and which
line it k An address line stuck low can
similarly be detected by writing the
number into the last memory location (all
ones) and checking the other addresses
using a walking zero pattern.
The MEMTEST program is located on the
system test diskette. To run the program,
the computer and the communication
path up to the data memory PCB must be
operational, and the computer must be
booted.
LOldlo&. the MEMTEST program
I. Place the test diskette into drive A,
and make sure that it is the default
drive (type A: and press the ENTER
key).
2. Type MEMTEST and press the
ENTER key to load the program.
3. When the program has finished
loading, the MEMTEST menu appears
on the screen.
Test selections
Selections from the MEMTEST menu are
made by pressing one of the function
keys. Press F I to run the entire program,
or F2-F9 to run parts of the program
repeatedly.
Select Test
FI All (F2-F9)
F2 Data memory
F3 Memory address
F4 ADC read data (from PC)
F5 ADC write data (to PC)
F6 ADC write port 2
F7 ADC rIw MSB to memory
F8 ADC read data memory
F9 ADC write data memory
FlO Exit program
Diagnostic Software I0-7
Test results. messages
While a particular test is running, the
computer displays a message on the
screen:
TESTING (test name)
In this message, (test name) is the name
of the test that was selected.
If the test is completed successfully, no
further messages appear on the screen.
If the test fails. an error table appears on
the screen, below the test name.
Test Contents of error table
F2 Chip no.
lines BO-87, error count
F3 Chip no.
lines AI-Al2, ok/error
F4 Lines error count
FS Lines error count
F8 Lines 80-823, error count
F9 Lines 80-823, error count
SYSTEM STATUS PAGE
The system status page in EXDRF is the
most accessible (and hence, most
important) diagnostic tool for the signal
processing section of the Spectrace 5000.
However. if the computer is disconnected
from the system unit or is
malfunctioning, some of the information
jn the system status page is also available
in the form of indicator lights on the
pulse processor, ADC and bias supply
modules.
Table 10.2 summarizes the line items. the
corresponding parameters in the system
status page (possible or optimum values
of the parameters), and other information
of interest when servicing the equipment.
Table 10.2 System status page
Line item Values Explanation
PHA STATUS
LN LEVEL
active
idle
OK
low
HIGH VOLTAGE on
off
AMP COUNT RATE
% DEAD TIME
PREAMP RESET
low
medium
high
10%
>20%
>50%
0-1
higher
>5
STORED COUNTS
o
higher
When PHA is acquiring data, status=active.
Level=low if the dewar needs to be refilled;
also if circuit is disabled.
Problem;
(I) Detector warmed up, leakage current is too
high, and bias supply has shut down.
Also. LN level is usually low.
Solution:
Turn system off,
Refill LN.
Wait I hour before turning power back on.
(2) HV cable is disconnected;
Bias supply PCB is defective.
Increases resolution (and acquisition time).
Often optimum trade-off between other settings.
Reduces acquisition times (and resolution).
Ratio of stored counts and fast disc. counts
(see below).
If PHA STATUS=idle.
DT can fluctuate between 5-20 %.
If X-rays are orr, noise pick-up is excessive.
If X-rays are on, X-ray tube power is too high.
Count/sec"" preamp reset rate;
Also, flashing rate of PA RESET light.
Count/sec when X-rays are off;
depends on detector.
X-rays are being detected.
If X-rays are off,
see Troubleshooting Guide ("PA reset too high").
Counts/sec stored by AOC.
If PHA STATUS=idle, count=O (by definition).
If PHA STATUS=acti ve,
count is some fraction of fast discriminator rate.
Table 10.2 (continued)
Line item Values Explanation
FAST DISC RATE 100
higher
ZERO OFFSET O3eV
other
erratic
ZERO WIDTH
100IQeV
higher
normal
ZERO DAC
erratic
GAIN DAC
Counts/sec; can fluctuate between JSOSO
Once set, should stay in range over lifetime of
instrument.
If X-rays are off, look for:
High leakage current; warm detector; low LN;
Noise pick-up (external source);
Noise (internal: power supply going bad).
ADC maintains the zero DAC by reading the
noise peak (also called zero peak) by strobing
the baseline when no X-rays are present, storing
the counts and measuring the width and
centroid of the peak;
it tweeks the zero DAC to keep OFFSET-0.
If OFFSET"another value (e.g., 5 eV),
or if OFFSET fluctuates (-10 to +10),
then the circuit is out of control:
e.g., OFFSET is at limit (,2000)
and it can't self-adjust.
Readjust the hardware per procedure.
Large noise sources (motors, RF).
High dead time (see above).
Indicative of resolution (or noise level).
If COUNT RATE""medium;
slightly higher if COUNT RATE-high,
slightly lower if COUNT RATE-low.
Noise pick-up.
If OFFSET is at limit,
readjust the hardware per procedure.
Indicative of compensation for offset drift.
Large noise sources (motors, RF).
Value stored after last energy calibration;
(does not change unless recalibrated).
TEST PROCEDURES
The test diskette contains a PROCEDUR
file and associated data files. which
present a menu of test procedures and
guide the technician through the tcst
procedures (These arc described in
Section 9).
Loading the PROCEDUR menu
The test menu is accessed from EDXRF
as follows (the notation "<ENTER>"
means "press the ENTER key"):
1. Place the tcst diskette in drive A.
2. C>edxrf<ENTER>
3. Press the CHANGE DIR soft key
4. <ENTER>
S. a:30kv<ENTER> or
a:50kv<ENTER>
depending on which system you have.
Procedure menu
The program responds by displaying a
soft key pad and the following menu;
I. Interlock test
2. Radiation survey
3. Vacuum test
4. Livetime tcst
5. Repeatability test
6. Tray accuracy test
7. Oil MOL test
8. Stray line test
9. Pile up test
10. Ti-Zn
(-MDL ;; minimum detection limits)
Soft key functions
The functions assigned to the soft keys
are explained in a help screen (press the
HELP soft key).
DiagnQstic Software 10-11
TXCONFIG PROGRAM
This program allows you to read and
change the configuration Qf the system
software.
Prnious Versions
TXCONFIG takes the place of the
NEWCNFG and FPCONFG programs from
version 1.2 and the programs MKCNFG
and RDCNFG in versiQns 1.0 and 1.1.
Both of these versions created a data file
called CONFIG which cQntained selections
regarding the hardware and software
configuration of the system. VersiQn 1.33
uses a new file, called TXCONFIG, to
store system configuration information.
When the EDXRF program is started for
the first time, the old CONFIG file is read
and converted to the new TXCONFIG
format. and the old CONFIG file is
erased. All previous selections from
running NEWCNFG and FPCONFG are
saved in the new file structure. Both
NEWCNFG and FPCONFG are
automatically erased by the UPDATE
program.
ChaORioll the confl&uralioD
If the system configuration is changed
(for instance when replacing a 10 position
tray with the single sample stage in the
Spectrace 5000), it is necessary to run the
TXCONFlG program before using the
system in order for the SPECTRACE
system to operate properly. Some
applications require that the configuration
file be changed, depending on how the
system is currently being used. For
example, when changing from 10 position
tray to the single stage, it is necessary to
update TXCONFIG file to reflect the
change and then restart the program.
Users Qf the Spectrace 6000 or 7000
should be especially careful to run
TXCONFIG any time they change Qne
Qf the filters in the system. Four or
five filters are supplied with the system,
but Qnly tWQ can be installed at one
time.
When a filter is changed, run
TXCONFIG and change the filter in
order for the system to display the
appropriate choices on the
ACQUISITION PARAMETERS MENU,
and fQr proper Fundamental Parameters
calculatiQns.
Runoln$! TXCONFIG
It is not necessary tQ run TXCONFIG;
if you are only updating to the new
version EDXRF, the ex.isting
configuration will be preserved.
All of the information entered or
displayed with TXCONFIG is saved in
data filed in the \SPECTRAC directory.
To run the program, type:
C>TXCONFIG<ENTER>
The program will read the TXCONFIG
file in \SPECTRAC directory if one is
there. If the file does not exist, the
default values will be used. The
opening screen is shown on the next
page. Use the arrow keys to select the
type of system that is being configured,
and press ENTER.
Below is the menu for selecting the type
of system being selected:
SPECTRACE CONFIGURATION PROGRAM
Select Hod_l Type
A 8PECTRACZ 5000, 6100, PCXRF, FPXRP
B SFECTRACE 6000 SERIal
C SPECTRACE 7000 SERIES
u UP or DOWN arrow key 'to .elect
lac or FlO Quit P9 Help
After entering the system type, the main
menu selections will appear on the screen
as shown below:
SPECTRACE CONJ'JCURATION PROGRAM
I
A Main Menu Selection
.f-------------------j
C A X-RAY SYSTEM OPTIONS
B FILTER SELECTION
C SPEC'I'ROMETER GEOME"l'RY
o COMPUTER
u
.f-------------------j
Us. UP or DOWN arrow key to lect
EBC or FlO Quit P9 Help
Select one of the four options and press
ENTER to continue.
The following sections describe the
different menus and each of the options
on those menus.
Diagnostic Software 1013
Below is the System Options menu:
-=,-----1
I
--.:... =.::n::=.:....:.::.:.'.:.c::t:.'.::n:.--: --,I .... __ ..,
C A X-ray Sr-t_ options

D BICS VOLTAGB POWER SUPPLY 'l"YPB I 1
SERVICE IXIB (yIlt) I ItO
"@ USI"Q J:LBC'1'RlCALLY COOLEtI DETECTOR (yilt I : 110
-Iu IlUMBU 0' TRAY POSITIOltS (10, 5 0Jl. 1) : 10
f,u,- -:.. =-.-,-:-""""'=,-.-,-,-""-..-=.. ::-:t-=.-.-:.-:,-= ..=t:--------j

C' or '10 - QUit F9 - Belp
The above configuration menu is for the
5000 and 6100 systems. The 6000 and 7000
configuration menu will look almost the
same except that the NUMBER OF TRAY
POSITIONS, and USING ELECT,
COOLED DETECTOR questions are not
shown. To change the data, you simply
move the cursor to the position of the data
that you want to change and insert the
new value.
NUMBER OF X-RAY TUBE ANODES
(1/2): This line specifies whether a single
anode or dual anode tube is installed.
HIGH VOLTAGE POWER SUPPLY
TYPE: Select the type of supply installed
in your system. All systems supplied as of
June 1989 are either TYPE I or TYPE 2.
SERVICE MODE (YIN) Service Mode
is a special option for use by service
personnel. Use of this option under
normal conditions is not recommended.
USING ELECTRICALLY COOLED
DETECTOR (YIN) This is to indicate
whether the ECD option is installed.
This is for the Spectrace 5000 only.
NUMBER OF TRAY POSITIONS:
This line is not present in 6000 and
7000 series. The program will assume
only I position tray for 6000 and 7000
series.
For Spectrace 5000 systems, the disk
supplied is initially configured for a 10
position sample tray. The allowed
numbers of positions are 1,5, and 10. If
you enter some other number, the
program will give an error message but
will allow the entry. Use of trays with
values other than the 1,5, or 10 require
usc of a special ROM.
------------------------------------------------------------------------------

1014
Diagnostic Software
Filter Selection
Below is the Filter Selection menu:
r 1 1 ~ S.lection
ft1ckn__
Position I'Ut.r ahort '0.
0'
At.
'0. 0' '0.
of AtOlU
or _ch Bl __nt
(1 _ 6)
1Q g/ca.q Bl_nU aI_lit.
.- .
1 JIO Ftt'f'b
J
0.000
II'"
,
2 CELLULOSE ICE I
0.060 1
8
ALUMINUM 0.034 1 13 1
,
..,.
'A]. I
" .
{'1'BI" I
0.062 1 os 1

"VII
[PIYB
I
0.157 1 os 1

8IX (SIX
I
0.559 1 2. 1

I I 0.000
I I
0.000

I I 0.000

(
I 0.000
U.. arrow key to lect
Bse or 1'10 Quit 1'9 - lp
This menu combines some of the functions
of the version 1.2 NEWCNFG and
FPCONFG programs. The menu allows
for entry of the positions of the filters,
the filter name. a short filter name, the
thickness of the filter. and the
composition of the filter.
The usual complement of four or five
filters supplied with Spectrace systems.
and their compositions, are listed in the
table. For the 5000, the filters are
numbered in the order that they are
usually installed in the system. For the
6000 and 7000 systems, only two filters
can be installed in the system, so only two
in the list will be numbered.
POSitiOD This column indicates the
position of the filter described to the
right. For the 5000 the filters are
numbered I - 6. while for the 6000 and
7000 they are numbered I and 2 only.
There is always a NO FILTER position
for the 6000 and 7000 systems which is not
numbered.
filter Name This is the name that is
used by the program when printing out
analysis conditions.
Short Name This name is used in the
list of filters on the ACQUISITION
PARAMETERS menu to the right of the
filter selection. Short names are
required in order to save space.
Thickness in g/cmsq This is the
thickness of the filter in grams per
square centimeter. This column and all
others to the right are used by the
Fundamental Parameters software for
calculation of the filtered X-ray tube
spectrum.
No. of Elements This is the number
of elements in the material that
composes the filter. In the case of the
cellulose filter, there are 3: carbon,
hydrogen, and oxygen.
At. No. of Elements For each of the
different elements numbered in the
previous column, list the atomic number
in this column, separated by spaces.
Cellulose for example has hydrogen,
carbon, and oxygen, so the atomic
numbers would be I 6 8 separated by
spaces.
Spec trace 5000 Technical Manual
Diagnostic SQftware
1015
No. of Atoms of each Element For each
of the atoms for which an atomic number
is given in the previous column, list the
number present in the simplest moecular
formula for that compound. For cellulose
in the previous example the number of
atoms of each element in the simplest
formula would be 10 6 5 for hydrogen,
carbon, and oxygen respectively.
Spectrometer Geometry
Below is the Spectrometer Geometry menu:
XRAY TUBE TAKEOFF ANGLE
This is the angle at which X-rays must
leave the surface of the anode in order
to exit the tube. For the tubes used on
Spectrace systems, the angle is 20
0
.
XRAY TUBE INCIDENT ANGLE
This is the angle at which X-rays from
the X-ray tube enter the surface of the
sample. For models 4000, 5000, 6000,
and 7000 the angle is 45
0
.
SPECTlUCE CONFIGURATION PROGRAM
8el-et Model
I

Main aaleetlan
e'A Spectromater QaamBtry
e TUBE AlfODS 1
o TUBE All'ODB 2
U ELEC'l'RON IMCIDDrr AJlcn.B

X-RAY TUBE ANGlL.
U X-RAY TUBE INCIDEKT ANGL.
E TBIClOlESS OF 'l"UBK liE WIIlDOW IN MILS
X-RAY DETBC"l"OR '1'.ua:-oPP MGlLE
TBIC'lOlESS OF D1'ECTOR liE WINDOW Ire MILS
Uae UP or DOWIIl arrow key to a.lect
I

..
,
,
Q
70.000
,
,
20.000

0&5.000

0.500
.ac or '10 Quit " Salp
This menu allows definition of the various
spectrometer angles and dimensions. The
default values are correct for most
Spectrace 4000, 5000, 6000, and 7000
systems.
TUBE ANODE I (and 2) Enter the
atomic number of the X-ray tube anode
material here.
ELECTRON INCIDENT ANGLE This
is the angle of incidence of the electron
beam to the X-ray tube target inside the
X-ray tube, relative to the surface of the
anode. For the tubes used on Spectrace
systems, the angle is 700.
THICKNESS OF TUBE WINDOW IN
MILS The val ue of 5 mils is correct
for most rhodium target tubes. The
tungsten target tubes have 2 mil
windows.
XRAY DETECTOR TAKE-OFF
ANGLE This is the angle between the
surface of the sample and the Xray
detector. For models 4000, 5000, 6000,
and 7000 the angle is 45.
THICKNESS OF DETECTOR BE
WINDOW IN MILS Most detectors
have 0.5 mil Be windows, but some have
the thinner 0.3 mil windows. See the
System Report supplied with your
system to verify this value.
Below is the Computer Printer menu:
A Main Menu aelection I
C A Cacputer ~ Printer
C MICROCBA1f1fEL OR PC: IU8 PC

D MEMORY ADDRESS USCD 04000
U PRIlfTER PAPItR LnO'l'B IK laCHES 11
E DU'AULr DRtvI C
~ f - - - - - - - - - - - - - - - - - - 1
U til' or DOWlI arrow key to l.ct
a.c or Pl0 Quit Pi - Help
This menu allows selection of various
computer and printer options.
MICROCHANNEL OR PC BUS The
IBM PCI AT, the Ps/2 model 30, and
almost all PC "clones" use the PC bus. The
newer IBM PS/2 series models 50 and
higher use the Micro Channel bus.
MEMORY ADDRESS USED This is the
address in the computers memory structure
at which the program will expect to find
the Spectrace da ta memory board. The
default values for the PC bus and Micro
Channel bus are shown when the bus type
is selected. In some cases, depending on
what other hardware devices have been
installed in the system, the address used
for the interface board may be different.
For Micro Channel systems, the address is
set through software during the hardware
installation. For the PC bus systems, the
address is set using the DIP switches on
the interface board.
See your hardware installation
instructions.
PRINTER PAPER LENGTH IN
INCHES Set the length of the paper
being used here in order for the
program to maintain proper top of form
adjustment.
DEFAULT DRIVE This is the drive
letter of the drive that will contain the
files for running the EDXRF software.
For version 1.33, only drive C can be
used for the default drive.
Exitin2 from the Dtoeram
Press the Esc or FlO to EXIT back to
the opening menu and then to exit from
the program and save the changes. If
you make changes in the configuration
file, the program will prompt "SAVE
THE CHANGES (YIN)?". Type N if
you want to delete the changes and type
Y if you want to save them.
Diagnostic Software 10-17
VERIFYP PROGRAM
A significant problem which was present
in the EDXRF 1.0 and 1.1 versions was
that PROCEDURE files could be
corrupted after running energy
calibration. PROCEDURE files are the
data files that contain all of the selections
made in setting up the MAIN menu.
There is one PROCEDURE file in each
subdirectory that has been used with the
EDXRF software. When this data file
becomes corrupted, incorrect analysis
results and unpredictable system operation
can occur. The generation of these
corrupted PROCEDURE files has been
corrected in the current release, but
already damaged PROCEDURE files will
continue to cause problems unless it is
corrected.
A new utility program, VERIFYP.EXE,
has been provided to identify corrupted
PROCEDURE files, however this program
will not Correct a bad file. A new
PROCEDURE file must be input
manually. Below is an example of how a
MAIN menu might look if a corrupted
PROCEDURE file is present.
PROCEDURE 2 - TI &ZN OXIDE
ACQUISITION PARAMETERS
Tuse VOLTAGE 0 KV
RU, TUBE CURRENT 0.0 1M.
1f1
11:,lu'l
fiLTER USED
L1VET [ME 0 SEC
MAX ENERGY
PRINT SYS ATMOSPHERE
'"
PROC STAT o SEC
I" II"
I
SPECTRUM PROCESSING
DISP REF FILE NO. : NONE
I"
I
SPEC fRMT ELEM OF INT : NONE
DEFINED
fiLE IF?
II" 1
MAIHT
HELP
I"
II:,:: I
Note the blank spaces and zeros where
the various parameters should appear.
Following is a procedure for finding
and correcting your PROCEDURE
files:
1. The first PROCEDURE file to be
fixed must be the one in the root
directory. See steps 3 to 8.
2. Find all by using
the DOS TREE command:
C>TREE
3. Move to each directory using the
DOS command CD and run VERIFYP.
This program will give one of three
indications: (I) there is NO
PROCEDURE rile, (2) the
PROCEDURE rile is GOOD, or (3)
the PROCEDURE file is BAD.
ANALYSIS
ANALYSIS TECHNIQUE
METHOD
,
MOO'
STD. FILE
, 0
SAVE OH 0 [SI(
SPECTRUM
I NTENST! ES
FILE NUMBER 0
RESULTS
I0-18
Diagnostic Software
4. If the file is bad, run EDXRF in that
directory and get as much information as
possible regarding the PROCEDURE file:
a.) Make a hard copy of the
PROCEDURE menu.
b.) For each PROCEDURE make a hard
copy of the MAIN menu.
c.) For each of the PROCEDURES used,
note the following: COUNT RATE
RANGE used (from the system status
display), the DELTA value fOr
Fundamental Parameters (from the
Analysis Technique menu), and the
report header and other parameters of
the REPORT FORMAT menu.
d.) REFERENCE, STANDARDS, and
EFFECTS files do not need to be
re-created. but the file numbers need to
be noted.
e.} Note the energy calibration
parameters.
5. Once all the information is known,
exit to DOS and rename the bad
PROCEDURE file using the DOS
RENAME command:
C> REN PROCEDUR BADPROC
6. Establish a new PROCEDURE file
by loading the EDXRF program.
When the program is started, a
default, or blank procedure will be
displayed. Setup each of the
PROCEDURES as they were before
by typing in the values.
7. When done, the old file can be
deleted after exiting to DOS:
C>DEL BADPROC
By remaining the file rather than
removing it initially, it is possible to
switch back-and-forth between the
good and bad one to ensure that all
necessary information is retrieved.
8. If the original PROCEDURE file
was "locked-out". LOCKOUT must be
re-run.
Spectracc 5000 Technical Manual
StelloR J1
SYSTEM AND ERRQR MESSAGES
Introduction 11-1
Boot sequence 11-2
Initialization sequence 11-2
Acquisition sequence 11-3
Analysis sequence 11-3
System & Error Messages I I-I
INTRODUCTION
This section summarizes the status and
error messages that the operator or the
service technician is likely to see
displayed on the screen. The table below
presents these messages in the order they
may appear as the system progresses from
bootup to acquisition (inclusive).
Under EVENT, actions taken by the
operator are indicated by the leading
asterisk (*); otherwise, the action is
performed by the system.
Under STATUS, only messages indicative
of system status or activity are included;
normal dialog between the operator and
the acquisition/analysis program is shown
in the operation manual.
Remedial action to be taken in response
to the possible error messages are
indicated in Section 7 (Troubleshooting).
11-2 System & ErrQr Messages
EVENT STATUS MESSAGES
Boot sequence
Powers up toil. carom. port
toil. chamber electr.
Init. analyzer
Reads CONFIG file
Reads PROCEDUR file
(Procedure menu)
Sets analysis parameters
-Loads samples
Starts acquisition
(Ends sequence; redefines parameters)
initialization sequence
Close lid
Tests interlocks
Closes lid
Transmits parameters to chamber
Setting up parameters
Throws lid latch
Turns on X ~ R A YS ON light
Turning on x-rays
Checks lid latch
Checks X-RAYS ON light
Ramps 30-50kV Ramping voltage
Voltage - ..,
Overrides Waiting for warmup; ...
Sets atmosphere Waiting for:
air
He flush
vacuum
Overrides
Checks interlocks continuously
POSSIBLE ERROR MESSAGES
Chamber failed to respond
INITSSOO: firmware file not present
Invalid CONFIG file
Cannot read CONFIG file
Voltage sct too low
X-rays not on -- hardware problem
seconds left
Voltage not achieved;
Continue ramping?
Air not achieved; continue waiting?
He flush not achieved; cant. wait.?
Vacuum not achieved; cont. wait.?
11-3
System & Error Messages
EVENT STATUS MESSAGES
Acquisition sequence
Checks ADC
Clears data memory PCB
Waits I sec.
Downloads parameters to ADC
Initiates acquisition
Acquires test spectrum
Tests for presence of data
Test failed restarts acquisition
Test failed again
*Returns to previous menu
Test passed:
Continues aCQ. (see operation manual)
Keeps checking ADC. interlocks
(spectrum is displayed)
ACQ. succeeds ACQ. complete
ACQ. fails
Analysis sequence (see operation manual)
Displays calibration curve
Prints spectrum hardcopy
POSSIBLE ERROR MESSAGES
Acquisition failed to initiate
ACQ aborted: HV bias off
ACQ aborted: lost zero peak
ACQ aborted: zero DAC at limit
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