Top242-250 Topswitch-Gx Family: Extended Power, Design Flexible, Ecosmart, Integrated Off-Line Switcher

TOP242-250
TOPSwitch-GX Family
Extended Power, Design Flexible, EcoSmart,
Integrated Off-Line Switcher
Product Highlights +
AC DC
Lower System Cost, High Design Flexibility IN OUT
• Extended power range for higher power applications
• No heat sink required up to 34 W using P/G packages
• Features eliminate or reduce cost of external components
• Fully integrated soft-start for minimum stress/overshoot D L
• Externally programmable accurate current limit CONTROL

C
TOPSwitch-GX
• Wider duty cycle for more power, smaller input capacitor
• Separate line sense and current limit pins on Y/R/F S X F
packages
• Line undervoltage (UV) detection: no turn off glitches
• Line overvoltage (OV) shutdown extends line surge limit PI-2632-060200
• Line feed-forward with maximum duty cycle (DCMAX) Figure 1. Typical Flyback Application.
reduction rejects line ripple and limits DCMAX at high line
• Frequency jittering reduces EMI and EMI filtering costs OUTPUT POWER TABLE
• Regulates to zero load without dummy loading
• 132 kHz frequency reduces transformer/power supply size 230 VAC ±15%4 85-265 VAC
• Half frequency option in Y/R/F packages for video applications PRODUCT 3
Open Open
Adapter1 Adapter1
• Hysteretic thermal shutdown for automatic fault recovery Frame2 Frame2
• Large thermal hysteresis prevents PC board overheating TOP242 P or G 9 W 15 W 6.5 W 10 W
EcoSmart™– Energy Efficient TOP242 R 15 W 22 W 11 W 14 W
• Extremely low consumption in remote off mode TOP242 Y or F 10 W 22 W 7W 14 W
(80 mW at 110 VAC, 160 mW at 230 VAC) TOP243 P or G 13 W 25 W 9W 15 W
• Frequency lowered with load for high standby efficiency TOP243 R 29 W 45 W 17 W 23 W
• Allows shutdown/wake-up via LAN/input port TOP243 Y or F 20 W 45 W 15 W 30 W
TOP244 P or G 16 W 28 W 11 W 20 W
Description TOP244 R 34 W 50 W 20 W 28 W
TOP244 Y or F 30 W 65 W 20 W 45 W
TOPSwitch™-GX uses the same proven topology as
TOP245 P or G 19 W 30 W 13 W 22 W
TOPSwitch, cost effectively integrating the high voltage
power MOSFET, PWM control, fault protection and other TOP245 R 37 W 57 W 23 W 33 W
control circuitry onto a single CMOS chip. Many new TOP245 Y or F 40 W 85 W 26 W 60 W
functions are integrated to reduce system cost and improve TOP246 P or G 21 W 34 W 15 W 26 W
design flexibility, performance and energy efficiency. TOP246 R 40 W 64 W 26 W 38 W
TOP246 Y or F 60 W 125 W 40 W 90 W
Depending on package type, either 1 or 3 additional pins over TOP247 R 42 W 70 W 28 W 43 W
the TOPSwitch standard DRAIN, SOURCE and CONTROL TOP247 Y or F 85 W 165 W 55 W 125 W
terminals allow the following functions: line sensing (OV/UV, TOP248 R 43 W 75 W 30 W 48 W
line feed-forward/DCMAX reduction), accurate externally set TOP248 Y or F 105 W 205 W 70 W 155 W
current limit, remote ON/OFF, synchronization to an external TOP249 R 44 W 79 W 31 W 53 W
lower frequency, and frequency selection (132 kHz/ 66 kHz). TOP249 Y or F 120 W 250 W 80 W 180 W
TOP250 R 45 W 82 W 32 W 55 W
All package types provide the following transparent features: TOP250 Y or F 135 W 290 W 90 W 210 W
Soft-start, 132 kHz switching frequency (automatically
reduced at light load), frequency jittering for lower EMI, Table 1.
wider DCMAX, hysteretic thermal shutdown, and larger Notes: 1. Typical continuous power in a non-ventilated enclosed adapter measured at
50 °C ambient. 2. Maximum practical continuous power in an open frame design at
creepage packages. In addition, all critical parameters (i.e. 50 °C ambient. See Key Applications for detailed conditions. 3. For lead-free package
current limit, frequency, PWM gain) have tighter tempera- options, see Part Ordering Information. 4. 230 VAC or 100/115 VAC with doubler.
ture and absolute tolerances to simplify design and
optimize system cost.
www.power.com May 2015

TOP242-250
Section List
Functional Block Diagram ........................................................................................................................................ 3

Pin Functional Description ....................................................................................................................................... 4
TOPSwitch-GX Family Functional Description ........................................................................................................ 5
CONTROL (C) Pin Operation..................................................................................................................................... 6
Oscillator and Switching Frequency........................................................................................................................... 6
Pulse Width Modulator and Maximum Duty Cycle..................................................................................................... 7
Light Load Frequency Reduction............................................................................................................................... 7
Error Amplifier........................................................................................................................................................... 7
On-Chip Current Limit with External Programmability................................................................................................ 7
Line Undervoltage Detection (UV).............................................................................................................................. 8
Line Overvoltage Shutdown (OV)............................................................................................................................... 8
Line Feed-Forward with DCMAX Reduction................................................................................................................. 8
Remote ON/OFF and Synchronization....................................................................................................................... 9
Soft-Start.................................................................................................................................................................. 9
Shutdown/Auto-Restart............................................................................................................................................ 9
Hysteretic Over-Temperature Protection.................................................................................................................... 9
Bandgap Reference................................................................................................................................................ 10
High-Voltage Bias Current Source........................................................................................................................... 10
Using Feature Pins .................................................................................................................................................... 10
FREQUENCY (F) Pin Operation............................................................................................................................... 10
LINE-SENSE (L) Pin Operation................................................................................................................................ 10
EXTERNAL CURRENT LIMIT (X) Pin Operation........................................................................................................ 11
MULTI-FUNCTION (M) Pin Operation....................................................................................................................... 11
Typical Uses of FREQUENCY (F) Pin ....................................................................................................................... 14
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins ........................................................ 15
Typical Uses of MULTI-FUNCTION (M) Pin ............................................................................................................ 17
Application Examples ............................................................................................................................................... 20
A High Efficiency, 30 W, Universal Input Power Supply............................................................................................ 20
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply.................................................................................. 20
A High Efficiency, 250 W, 250-380 VDC Input Power Supply................................................................................... 22
Multiple Output, 60 W, 185-265 VAC Input Power Supply....................................................................................... 23
Processor Controlled Supply Turn On/Off................................................................................................................ 24
Key Application Considerations ............................................................................................................................... 26
TOPSwitch-II vs. TOPSwitch-GX......................................................................................................................... 26
TOPSwitch-FX vs. TOPSwitch-GX....................................................................................................................... 28
TOPSwitch-GXDesign Considerations ............................................................................................................... 28
TOPSwitch-GX Layout Considerations................................................................................................................ 30
Quick Design Checklist......................................................................................................................................... 32
Design Tools.......................................................................................................................................................... 32
Product Specifications and Test Conditions .......................................................................................................... 33
Typical Performance Characteristics ..................................................................................................................... 40
Part Ordering Information ....................................................................................................................................... 46
Package Outlines ...................................................................................................................................................... 47
2
Rev. P 05/15 www.power.com
TOP242-250
CONTROL
(C) VC DRAIN
0 (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER
+
SOFT START
- 5.8 V
-
4.8 V
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
ADJUST START -
÷8
ON/OFF +
EXTERNAL
CURRENT LIMIT SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
(X) VBG + VT COMPARATOR
HYSTERETIC
STOP
LOGIC THERMAL
SHUTDOWN
LINE-SENSE 1V CONTROLLED
(L) VBG TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DC DMAX
MAX DCMAX
SENSE
FREQUENCY CLOCK
(F) HALF S Q
SAW - LEADING
FREQ. EDGE
R
+ BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
RE
FREQUENCY
REDUCTION
SOURCE
(S)
PI-2639-031915
Figure 2a. Functional Block Diagram (Y, R or F Package).
CONTROL
(C) VC DRAIN
0 (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER
+
SOFT START
- 5.8 V
-
4.8 V
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
ADJUST START -
÷8
ON/OFF
+
SHUTDOWN/
MULTI- AUTO-RESTART CURRENT LIMIT
FUNCTION VBG + VT COMPARATOR
(M)
HYSTERETIC
STOP
LOGIC THERMAL
SHUTDOWN
CONTROLLED
VBG TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
DCMAX
SENSE DCMAX
CLOCK
S Q LEADING
SAW -
EDGE
R
+ BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
RE
FREQUENCY
REDUCTION
SOURCE
(S)
PI-2641-031915
Figure 2b. Functional Block Diagram (P or G Package).
3
www.power.com Rev. P 05/15
TOP242-250
Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

Input pin for selecting switching frequency: 132 kHz if
DRAIN (D) Pin: connected to SOURCE pin and 66 kHz if connected to
High voltage power MOSFET drain output. The internal CONTROL pin. The switching frequency is internally set for
start-up bias current is drawn from this pin through a fixed 132 kHz operation in P and G packages.
switched high-voltage current source. Internal current limit
sense point for drain current. SOURCE (S) Pin:
Output MOSFET source connection for high voltage power
CONTROL (C) Pin: return. Primary side control circuit common and reference
Error amplifier and feedback current input pin for duty cycle point.
control. Internal shunt regulator connection to provide
PI-2629-092203
internal bias current during normal operation. It is also used + VUV = IUV x RLS
as the connection point for the supply bypass and auto- VOV = IOV x RLS
restart/compensation capacitor. For RLS = 2 M
RLS 2M
VUV = 100 VDC
LINE-SENSE (L) Pin: (Y, R or F package only) VOV = 450 VDC
Input pin for OV, UV, line feed forward with DCMAX reduction, DC DCMAX@100 VDC = 78%
D L
remote ON/OFF and synchronization. A connection to Input DCMAX@375 VDC = 38%
Voltage CONTROL
SOURCE pin disables all functions on this pin. C
For RIL = 12 k
EXTERNAL CURRENT LIMIT (X) Pin: S
ILIMIT = 69%
X
(Y, R or F package only) RIL
See Figure 54b for
other resistor values
Input pin for external current limit adjustment, remote - 12 k
(RIL) to select different
ON/OFF, and synchronization. A connection to SOURCE pin ILIMIT values
disables all functions on this pin.
Figure 4. Y/R/F Pkg Line Sense and Externally Set Current Limit.
MULTI-FUNCTION (M) Pin: (P or G package only)
This pin combines the functions of the LINE-SENSE (L) and
EXTERNAL CURRENT LIMIT (X) pins of the Y package into
one pin. Input pin for OV, UV, line feed forward with DCMAX
reduction, external current limit adjustment, remote
ON/OFF and synchronization. A connection to SOURCE pin Ω Ω
disables all functions on this pin and makes TOPSwitch-GX DC

operate in simple three terminal mode (like TOPSwitch-II). Input
Voltage
D M
CONTROL
C
Y Package (TO-220-7C)
S
Tab Internally 7D
Connected to 5F
SOURCE Pin 4S
3X Figure 5. P/G Package Line Sense.
2L
1C
R Package (TO-263-7C) +
For RIL = 12 k
F Package (TO-262-7C) ILIMIT = 69%
P Package (DIP-8B)
G Package (SMD-8B) For RIL = 25 k
ILIMIT = 43%
M 1 8 S DC
See Figures 54b, 55b
Input
and 56b for other resistor
S 2 7 S Voltage values (RIL) to select
D M
different ILIMIT values.
S 3 CONTROL
RIL C
C 4 5 D
123 4 5 7
CL X S F D PI-2724-010802 S
-
PI-2517-022604
Figure 3. Pin Configuration (top view).
Figure 6. P/G Package Externally Set Current Limit.
4
TOP242-250
TOPSwitch-GX Family Functional

Auto-restart
Description ICD1 IB
Like TOPSwitch, TOPSwitch-GX is an integrated switched IL = 125 µA
mode power supply chip that converts a current at the 132
control input to a duty cycle at the open drain output of a
Frequency (kHz)
high voltage power MOSFET. During normal operation the IL = 190 µA
IL < IL(DC)
duty cycle of the power MOSFET decreases linearly with

increasing CONTROL pin current as shown in Figure 7.
In addition to the three terminal TOPSwitch features, such 30

as the high voltage start-up, the cycle-by-cycle current
limiting, loop compensation circuitry, auto-restart, thermal
shutdown, the TOPSwitch-GX incorporates many additional IC (mA)
functions that reduce system cost, increase power supply
performance and design flexibility. A patented high voltage
CMOS technology allows both the high voltage power Auto-restart
MOSFET and all the low voltage control circuitry to be cost ICD1 IB
effectively integrated onto a single monolithic chip.
78
Slope = PWM Gain
Three terminals, FREQUENCY, LINE-SENSE, and EXTERNAL
Duty Cycle (%)

CURRENT LIMIT (available in Y, R or F package) or one
terminal MULTI-FUNCTION (available in P or G package) I = 125 µA
have been added to implement some of the new functions. 38
L
These terminals can be connected to the SOURCE pin IL < IL(DC)

to operate the TOPSwitch-GX in a TOPSwitch-like three
IL = 190 µA
terminal mode. However, even in this three terminal mode, 10
the TOPSwitch-GX offers many new transparent features
that do not require any external components: TOP242-5 1.6 2.0 5.2 6.0
TOP246-9 2.2 2.6 5.8 6.6
1. A fully integrated 10 ms soft-start limits peak currents TOP250 2.4 2.7 IC (mA) 6.5 7.3
and voltages during start-up and dramatically reduces Note: For P and G packages IL is replaced with IM.
or eliminates output overshoot in most applications. PI-2633-011502
2. DCMAX of 78% allows smaller input storage capacitor,

Figure 7. Relationship of Duty Cycle and Frequency to CONTROL
lower input voltage requirement and/or higher power
Pin Current.
capability.
3. Frequency reduction at light loads lowers the switching line voltage above the undervoltage threshold. See Table 2
losses and maintains good cross regulation in multiple and Figure 11.
output supplies.
4. Higher switching frequency of 132 kHz reduces the The pin can also be used as a remote ON/OFF and a
transformer size with no noticeable impact on EMI. synchronization input.
5. Frequency jittering reduces EMI.
6. Hysteretic over-temperature shutdown ensures The EXTERNAL CURRENT LIMIT (X) pin is usually used to
automatic recovery from thermal fault. Large hysteresis reduce the current limit externally to a value close to the
prevents circuit board overheating. operating peak current, by connecting the pin to SOURCE
7. Packages with omitted pins and lead forming provide through a resistor. This pin can also be used as a remote
large drain creepage distance. ON/OFF and a synchronization input in both modes. See
8. Tighter absolute tolerances and smaller temperature Table 2 and Figure 11.
variations on switching frequency, current limit and
PWM gain. For the P or G packages the LINE-SENSE and EXTERNAL
CURRENT LIMIT pin functions are combined on one
The LINE-SENSE (L) pin is usually used for line sensing by MULTI-FUNCTION (M) pin. However, some of the functions
connecting a resistor from this pin to the rectified DC high become mutually exclusive as shown in Table 3.
voltage bus to implement line overvoltage (OV), under-
voltage (UV) and line feed-forward with DCMAX reduction. In The FREQUENCY (F) pin in the Y, R or F package sets the
this mode, the value of the resistor determines the OV/UV switching frequency to the default value of 132 kHz when
thresholds and the DCMAX is reduced linearly starting from a connected to SOURCE pin. A half frequency option of
5
TOP242-250
66 kHz can be chosen by connecting this pin to CONTROL pin voltage has had a chance to discharge to the lower
pin instead. Leaving this pin open is not recommended. threshold voltage of approximately 4.8 V (internal supply
undervoltage lockout threshold). When the externally fed
CONTROL (C) Pin Operation current charges the CONTROL pin to the shunt regulator
The CONTROL pin is a low impedance node that is capable voltage of 5.8 V, current in excess of the consumption of
of receiving a combined supply and feedback current. During the chip is shunted to SOURCE through resistor RE as
normal operation, a shunt regulator is used to separate shown in Figure 2. This current flowing through RE controls
the feedback signal from the supply current. CONTROL the duty cycle of the power MOSFET to provide closed
pin voltage VC is the supply voltage for the control circuitry loop regulation. The shunt regulator has a finite low output
including the MOSFET gate driver. An external bypass impedance ZC that sets the gain of the error amplifier when
capacitor closely connected between the CONTROL and used in a primary feedback configuration. The dynamic
SOURCE pins is required to supply the instantaneous gate impedance ZC of the CONTROL pin together with the
drive current. The total amount of capacitance connected external CONTROL pin capacitance sets the dominant pole
to this pin also sets the auto-restart timing as well as for the control loop.
control loop compensation.
When a fault condition such as an open loop or shorted
When rectified DC high voltage is applied to the DRAIN pin output prevents the flow of an external current into
during start-up, the MOSFET is initially off, and the CONTROL the CONTROL pin, the capacitor on the CONTROL
pin capacitor is charged through a switched high voltage pin discharges towards 4.8 V. At 4.8 V, auto-restart is
current source connected internally between the DRAIN activated which turns the output MOSFET off and puts
and CONTROL pins. When the CONTROL pin voltage the control circuitry in a low current standby mode. The
VC reaches approximately 5.8 V, the control circuitry is high-voltage current source turns on and charges the
activated and the soft-start begins. The soft-start circuit external capacitance again. A hysteretic internal supply
gradually increases the duty cycle of the MOSFET from undervoltage comparator keeps VC within a window
zero to the maximum value over approximately 10 ms. If no of typically 4.8 V to 5.8 V by turning the high-voltage
external feedback/supply current is fed into the CONTROL current source on and off as shown in Figure 8. The
pin by the end of the soft-start, the high voltage current auto-restart circuit has a divide-by-eight counter which
source is turned off and the CONTROL pin will start prevents the output MOSFET from turning on again until
discharging in response to the supply current drawn by the eight discharge/charge cycles have elapsed. This is
control circuitry. If the power supply is designed properly, accomplished by enabling the output MOSFET only when
and no fault condition such as open loop or shorted the divide-by-eight counter reaches full count (S7). The
output exists, the feedback loop will close, providing counter effectively limits TOPSwitch-GX power dissipation
external CONTROL pin current, before the CONTROL by reducing the auto-restart duty cycle to typically 4%.
~
~
~
~
VUV
VLINE
~
~
~
~
~
~
0V
S7 S0 S1 S2 S6 S7 S0 S1 S2 S6 S7 S0 S1 S2 S6 S7 S7 5.8 V
~
~
~
~
~
~
VC 4.8 V
0V
~
~
~
~
VDRAIN
~
~
0V
VOUT
0V
~
~
~
~
~
~
1 2 3 2 4
Note: S0 through S7 are the output states of the auto-restart counter PI-2545-082299
Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-Restart (4) Power Down.
6
TOP242-250
Auto-restart mode continues until output voltage regulation
PI-2550-092499
is again achieved through closure of the feedback loop. 136 kHz
Switching
Frequency
Oscillator and Switching Frequency
128 kHz
The internal oscillator linearly charges and discharges an
internal capacitance between two voltage levels to create
4 ms
a sawtooth waveform for the pulse width modulator. This
oscillator sets the pulse width modulator/current limit latch
at the beginning of each cycle. VDRAIN
The nominal switching frequency of 132 kHz was chosen to Time

minimize transformer size while keeping the fundamental
EMI frequency below 150 kHz. The FREQUENCY pin Figure 9. Switching Frequency Jitter (Idealized VDRAIN
(available only in Y, R or F package), when shorted to the Waveforms).
CONTROL pin, lowers the switching frequency to 66 kHz (half
frequency) which may be preferable in some cases such duty cycle is proportional to the current flowing into the
as noise sensitive video applications or a high efficiency CONTROL pin. As the CONTROL pin current increases,
standby mode. Otherwise, the FREQUENCY pin should be the duty cycle decreases linearly towards a duty cycle of
connected to the SOURCE pin for the default 132 kHz. 10%. Below 10% duty cycle, to maintain high efficiency
at light loads, the frequency is also reduced linearly until a
To further reduce the EMI level, the switching frequency
minimum frequency is reached at a duty cycle of 0% (refer
is jittered (frequency modulated) by approximately ±4 kHz
to Figure 7). The minimum frequency is typically 30 kHz
at 250 Hz (typical) rate as shown in Figure 9. Figure 46
and 15 kHz for 132 kHz and 66 kHz operation, respectively.
shows the typical improvement of EMI measurements with
frequency jitter. This feature allows a power supply to operate at lower
frequency at light loads thus lowering the switching losses
Pulse Width Modulator and Maximum Duty Cycle
while maintaining good cross regulation performance and low
The pulse width modulator implements voltage mode
output ripple.
control by driving the output MOSFET with a duty cycle
inversely proportional to the current into the CONTROL pin Error Amplifier
that is in excess of the internal supply current of the chip The shunt regulator can also perform the function of an
(see Figure 7). The excess current is the feedback error error amplifier in primary side feedback applications.
signal that appears across RE (see Figure 2). This signal is The shunt regulator voltage is accurately derived from a
filtered by an RC network with a typical corner frequency temperature-compensated bandgap reference. The gain
of 7 kHz to reduce the effect of switching noise in the chip of the error amplifier is set by the CONTROL pin dynamic
supply current generated by the MOSFET gate driver. The impedance. The CONTROL pin clamps external circuit
filtered error signal is compared with the internal oscillator signals to the VC voltage level. The CONTROL pin current
sawtooth waveform to generate the duty cycle waveform. in excess of the supply current is separated by the shunt
As the control current increases, the duty cycle decreases. regulator and flows through RE as a voltage error signal.
A clock signal from the oscillator sets a latch which turns on
the output MOSFET. The pulse width modulator resets the On-Chip Current Limit with External Programmability
latch, turning off the output MOSFET. Note that a minimum The cycle-by-cycle peak drain current limit circuit uses
current must be driven into the CONTROL pin before the the output MOSFET ON-resistance as a sense resistor. A
duty cycle begins to change. current limit comparator compares the output MOSFET
on-state drain to source voltage, VDS(ON) with a threshold
The maximum duty cycle, DCMAX, is set at a default
voltage. High drain current causes VDS(ON) to exceed the
maximum value of 78% (typical). However, by connecting
threshold voltage and turns the output MOSFET off until the
the LINE-SENSE or MULTI-FUNCTION pin (depending on
start of the next clock cycle. The current limit comparator
the package) to the rectified DC high voltage bus through
threshold voltage is temperature compensated to minimize
a resistor with appropriate value, the maximum duty cycle
the variation of the current limit due to temperature related
can be made to decrease from 78% to 38% (typical) as
changes in RDS(ON) of the output MOSFET. The default
shown in Figure 11 when input line voltage increases (see
current limit of TOPSwitch-GX is preset internally. However,
line feed forward with DCMAX reduction).
with a resistor connected between EXTERNAL CURRENT
Light Load Frequency Reduction LIMIT (X) pin (Y, R or F package) or MULTI-FUNCTION (M)
The pulse width modulator duty cycle reduces as the load pin (P or G package) and SOURCE pin, current limit can
at the power supply output decreases. This reduction in be programmed externally to a lower level between 30%
7
TOP242-250
and 100% of the default current limit. Please refer to the storage capacitor present in applications such as standby
graphs in the typical performance characteristics section supplies. A single resistor connected from the LINE-
for the selection of the resistor value. By setting current limit SENSE pin (Y, R or F package) or MULTI-FUNCTION pin
low, a larger TOPSwitch-GX than necessary for the power (P or G package) to the rectified DC high voltage bus sets
required can be used to take advantage of the lower RDS(ON) UV threshold during power up. Once the power supply
for higher efficiency/smaller heat sinking requirements. is successfully turned on, the UV threshold is lowered to
With a second resistor connected between the EXTERNAL 40% of the initial UV threshold to allow extended input
CURRENT LIMIT (X) pin (Y, R or F package) or MULTI- voltage operating range (UV low threshold). If the UV low
FUNCTION (M) pin (P or G package) and the rectified DC threshold is reached during operation without the power
high voltage bus, the current limit is reduced with increasing supply losing regulation, the device will turn off and stay
line voltage, allowing a true power limiting operation against off until UV (high threshold) has been reached again. If the
line variation to be implemented. When using an RCD power supply loses regulation before reaching the UV low
clamp, this power limiting technique reduces maximum threshold, the device will enter auto-restart. At the end of
clamp voltage at high line. This allows for higher reflected each auto-restart cycle (S7), the UV comparator is enabled.
voltage designs as well as reducing clamp dissipation. If the UV high threshold is not exceeded the MOSFET will
be disabled during the next cycle (see Figure 8). The UV
The leading edge blanking circuit inhibits the current limit feature can be disabled independent of the OV feature as
comparator for a short time after the output MOSFET is shown in Figures 19 and 23.
turned on. The leading edge blanking time has been set so
that, if a power supply is designed properly, current spikes Line Overvoltage Shutdown (OV)
caused by primary-side capacitances and secondary-side The same resistor used for UV also sets an overvoltage
rectifier reverse recovery time should not cause premature threshold which, once exceeded, will force TOPSwitch-GX
termination of the switching pulse. output into off-state. The ratio of OV and UV thresholds
is preset at 4.5 as can be seen in Figure 11. When the
The current limit is lower for a short period after the leading MOSFET is off, the rectified DC high voltage surge capability
edge blanking time as shown in Figure 52. This is due to is increased to the voltage rating of the MOSFET (700 V),
dynamic characteristics of the MOSFET. To avoid triggering due to the absence of the reflected voltage and leakage
the current limit in normal operation, the drain current spikes on the drain. A small amount of hysteresis is provided
waveform should stay within the envelope shown. on the OV threshold to prevent noise triggering. The OV
feature can be disabled independent of the UV feature as
Line Undervoltage Detection (UV)
shown in Figures 18 and 32.
At power up, UV keeps TOPSwitch-GX off until the input
line voltage reaches the undervoltage threshold. At Line Feed-Forward with DCMAX Reduction
power down, UV prevents auto-restart attempts after The same resistor used for UV and OV also implements
the output goes out of regulation. This eliminates power line voltage feed-forward, which minimizes output line
down glitches caused by slow discharge of the large input ripple and reduces power supply output sensitivity to line
Oscillator
(SAW)
DMAX
Enable from
X, L or M Pin (STOP)
Time
PI-2637-060600
Figure 10. Synchronization Timing Diagram.
8
TOP242-250
transients. This feed-forward operation is illustrated in time to allow the CONTROL pin to discharge to the internal
Figure 7 by the different values of IL (Y, R or F package) or supply undervoltage threshold of 4.8 V (approximately 32
IM (P or G package). Note that for the same CONTROL ms for a 47 µF CONTROL pin capacitance), the CONTROL
pin current, higher line voltage results in smaller operating pin goes into the hysteretic mode of regulation. In this
duty cycle. As an added feature, the maximum duty cycle mode, the CONTROL pin goes through alternate charge
DCMAX is also reduced from 78% (typical) at a voltage and discharge cycles between 4.8 V and 5.8 V (see
slightly higher than the UV threshold to 30% (typical) at CONTROL pin operation section above) and runs entirely
the OV threshold (see Figure 11). Limiting DCMAX at higher off the high voltage DC input, but with very low power
line voltages helps prevent transformer saturation due to consumption (160 mW typical at 230 VAC with M or X
large load transients in TOP248, TOP249 and TOP250 pins open). When the TOPSwitch-GX is remotely turned
forward converter applications. DCMAX of 38% at high on after entering this mode, it will initiate a normal start-up
line was chosen to ensure that the power capability of sequence with soft-start the next time the CONTROL pin
the TOPSwitch-GX is not restricted by this feature under reaches 5.8 V. In the worst case, the delay from remote
normal operation. on to start-up can be equal to the full discharge/charge
cycle time of the CONTROL pin, which is approximately
Remote ON/OFF and Synchronization 125 ms for a 47 µF CONTROL pin capacitor. This reduced
TOPSwitch-GX can be turned on or off by controlling consumption remote off mode can eliminate expensive and
the current into the LINE-SENSE pin or out from the unreliable in-line mechanical switches. It also allows for
EXTERNAL CURRENT LIMIT pin (Y, R or F package) and microprocessor controlled turn-on and turn-off sequences
into or out from the MULTI-FUNCTION pin (P or G package) that may be required in certain applications such as inkjet
(see Figure 11). In addition, the LINE-SENSE pin has a 1 V and laser printers.
threshold comparator connected at its input. This voltage
threshold can also be used to perform remote ON/OFF Soft-Start
control. This allows easy implementation of remote Two on-chip soft-start functions are activated at start-up with
ON/OFF control of TOPSwitch-GX in several different ways. a duration of 10 ms (typical). Maximum duty cycle starts
A transistor or an optocoupler output connected between from 0% and linearly increases to the default maximum
the EXTERNAL CURRENT LIMIT or LINE-SENSE pins of 78% at the end of the 10 ms duration and the current
(Y, R or F package) or the MULTI-FUNCTION pin (P or G limit starts from about 85% and linearly increases to 100%
package) and the SOURCE pin implements this function at the end of the 10 ms duration. In addition to start-up,
with “active-on” (Figures 22, 29 and 36) while a transistor soft-start is also activated at each restart attempt during
or an optocoupler output connected between the LINE- auto-restart and when restarting after being in hysteretic
SENSE pin (Y, R or F package) or the MULTI-FUNCTION regulation of CONTROL pin voltage (VC), due to remote OFF
(P or G package) pin and the CONTROL pin implements or thermal shutdown conditions. This effectively minimizes
the function with “active-off” (Figures 23 and 37). current and voltage stresses on the output MOSFET, the
clamp circuit and the output rectifier during start-up. This
When a signal is received at the LINE-SENSE pin or the feature also helps minimize output overshoot and prevents
EXTERNAL CURRENT LIMIT pin (Y, R or F package) or saturation of the transformer during start-up.
the MULTI-FUNCTION pin (P or G package) to disable the
output through any of the pin functions such as OV, UV Shutdown/Auto-Restart
and remote ON/OFF, TOPSwitch-GX always completes its To minimize TOPSwitch-GX power dissipation under fault
current switching cycle, as illustrated in Figure 10, before conditions, the shutdown/auto-restart circuit turns the
the output is forced off. The internal oscillator is stopped power supply on and off at an auto-restart duty cycle
slightly before the end of the current cycle and stays there of typically 4% if an out of regulation condition persists.
as long as the disable signal exists. When the signal at Loss of regulation interrupts the external current into the
the above pins changes state from disable to enable, CONTROL pin. VC regulation changes from shunt mode to
the internal oscillator starts the next switching cycle. This the hysteretic auto-restart mode as described in CONTROL
approach allows the use of these pins to synchronize pin operation section. When the fault condition is removed,
TOPSwitch-GX to any external signal with a frequency the power supply output becomes regulated, VC regulation
between its internal switching frequency and 20 kHz. returns to shunt mode, and normal operation of the power
supply resumes.
As seen above, the remote ON/OFF feature allows the
TOPSwitch-GX to be turned on and off instantly, on a cycle- Hysteretic Over-Temperature Protection
by-cycle basis, with very little delay. However, remote Temperature protection is provided by a precision analog
ON/OFF can also be used as a standby or power switch to circuit that turns the output MOSFET off when the junction
turn off the TOPSwitch-GX and keep it in a very low power temperature exceeds the thermal shutdown temperature
consumption state for indefinitely long periods. If the (140 °C typical). When the junction temperature cools to
TOPSwitch-GX is held in remote off state for long enough below the hysteretic temperature, normal operation
9
TOP242-250
resumes providing automatic recovery. A large hysteresis of 132 kHz (Figure 13), which is suited for most applications.
70 °C (typical) is provided to prevent overheating of the PC For other cases that may benefit from lower switching
board due to a continuous fault condition. VC is regulated frequency such as noise sensitive video applications, a
in hysteretic mode and a 4.8 V to 5.8 V (typical) sawtooth 66 kHz switching frequency (half frequency) can be
waveform is present on the CONTROL pin while in thermal selected by shorting the FREQUENCY pin to the CONTROL
shutdown. pin (Figure 14). In addition, an example circuit shown in
Figure 15 may be used to lower the switching frequency
Bandgap Reference from 132 kHz in normal operation to 66 kHz in standby
All critical TOPSwitch-GX internal voltages are derived mode for very low standby power consumption.
from a temperature-compensated bandgap reference.
This reference is also used to generate a temperature- LINE-SENSE (L) Pin Operation (Y, R and F Packages)
compensated current reference, which is trimmed to When current is fed into the LINE-SENSE pin, it works as a
accurately set the switching frequency, MOSFET gate voltage source of approximately 2.6 V up to a maximum
drive current, current limit, and the line OV/UV thresholds. current of +400 µA (typical). At +400 µA, this pin turns into
TOPSwitch-GX has improved circuitry to maintain all of the a constant current sink. Refer to Figure 12a. In addition, a
above critical parameters within very tight absolute and comparator with a threshold of 1 V is connected at the
temperature tolerances. pin and is used to detect when the pin is shorted to the
SOURCE pin.
High-Voltage Bias Current Source
This current source biases TOPSwitch-GX from the DRAIN There are a total of four functions available through the
pin and charges the CONTROL pin external capacitance use of the LINE-SENSE pin: OV, UV, line feed-forward
during start-up or hysteretic operation. Hysteretic operation with DCMAX reduction, and remote ON/OFF. Connecting
occurs during auto-restart, remote OFF and over-temp- the LINE-SENSE pin to the SOURCE pin disables all
erature shutdown. In this mode of operation, the current four functions. The LINE-SENSE pin is typically used for
source is switched on and off with an effective duty cycle of line sensing by connecting a resistor from this pin to the
approximately 35%. This duty cycle is determined by the rectified DC high voltage bus to implement OV, UV and
ratio of CONTROL pin charge (IC) and discharge currents DCMAX reduction with line voltage. In this mode, the value
(ICD1 and ICD2). This current source is turned off during normal of the resistor determines the line OV/UV thresholds, and
operation when the output MOSFET is switching. The effect the DCMAX is reduced linearly with rectified DC high voltage
of the current source switching will be seen on the DRAIN starting from just above the UV threshold. The pin can
voltage waveform as small disturbances and is normal. also be used as a remote ON/OFF and a synchronization
input. Refer to Table 2 for possible combinations of the
Using Feature Pins functions with example circuits shown in Figure 16 through
Figure 40. A description of specific functions in terms of
FREQUENCY (F) Pin Operation
the LINE-SENSE pin I/V characteristic is shown in Figure
The FREQUENCY pin is a digital input pin available in the
11 (right hand side). The horizontal axis represents LINE-
Y, R or F package only. Shorting the FREQUENCY pin to
SENSE pin current with positive polarity indicating currents
SOURCE pin selects the nominal switching frequency of
LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

Figure Number 16 17 18 19 20 21 22 23 24 25 26 27 28 29
t
Three Terminal Operation 3

Undervoltage 3 3 3 3 3
Overvoltage 3 3 3 3 3
Line Feed-Forward (DCMAX) 3 3 3 3
Overload Power Limiting 3
External Current Limit 3 3 3 3 3 3
Remote ON/OFF 3 3 3 3 3 3 3
*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible.
Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.
10
TOP242-250
flowing into the pin. The meaning of the vertical axes varies section for the current limit programming range and the
with functions. For those that control the ON/OFF states of selection of appropriate resistor value.
the output such as UV, OV and remote ON/OFF, the vertical
axis represents the enable/disable states of the output. UV MULTI-FUNCTION (M) Pin Operation
triggers at IUV (+50 µA typical with 30 µA hysteresis) and (P and G Packages)
OV triggers at IOV (+225 µA typical with 8 µA hysteresis). The LINE-SENSE and EXTERNAL CURRENT LIMIT pin
Between the UV and OV thresholds, the output is enabled. functions are combined to a single MULTI-FUNCTION
For line feed-forward with DCMAX reduction, the vertical axis pin for P and G packages. The comparator with a 1 V
represents the magnitude of the DCMAX. Line feed-forward threshold at the LINE-SENSE pin is removed in this case
with DCMAX reduction lowers maximum duty cycle from 78% as shown in Figure 2b. All of the other functions are kept
at IL(DC) (+60 µA typical) to 38% at IOV (+225 µA). intact. However, since some of the functions require
opposite polarity of input current (MULTI-FUNCTION pin),
EXTERNAL CURRENT LIMIT (X) Pin Operation they are mutually exclusive. For example, line sensing
(Y, R and F Packages) features cannot be used simultaneously with external
When current is drawn out of the EXTERNAL CURRENT current limit setting. When current is fed into the MULTI-
LIMIT pin, it works as a voltage source of approximately FUNCTION pin, it works as a voltage source of
1.3 V up to a maximum current of -240 µA (typical). At approximately 2.6 V up to a maximum current of +400 µA
-240 µA, it turns into a constant current source (refer to (typical). At +400 µA, this pin turns into a constant current
Figure 12a). sink. When current is drawn out of the MULTI-FUNCTION
pin, it works as a voltage source of approximately 1.3 V up
There are two functions available through the use of the to a maximum current of -240 µA (typical). At -240 µA, it
EXTERNAL CURRENT LIMIT pin: external current limit turns into a constant current source. Refer to Figure 12b.
and remote ON/OFF. Connecting the EXTERNAL
CURRENT LIMIT pin to the SOURCE pin disables the two There are a total of five functions available through the use
functions. In high efficiency applications, this pin can be of the MULTI-FUNCTION pin: OV, UV, line feed-forward
used to reduce the current limit externally to a value close with DCMAX reduction, external current limit and remote
to the operating peak current by connecting the pin to ON/OFF. A short circuit between the MULTI-FUNCTION
the SOURCE pin through a resistor. The pin can also be pin and SOURCE pin disables all five functions and forces
used for remote ON/OFF. Table 2 shows several possible TOPSwitch-GX to operate in a simple three terminal mode
combinations using this pin. See Figure 11 for a description like TOPSwitch-II. The MULTI-FUNCTION pin is typically
of the functions where the horizontal axis (left hand side) used for line sensing by connecting a resistor from this pin
represents the EXTERNAL CURRENT LIMIT pin current. to the rectified DC high voltage bus to implement OV, UV
The meaning of the vertical axes varies with function. For and DCMAX reduction with line voltage. In this mode, the
those that control the ON/OFF states of the output such value of the resistor determines the line OV/UV thresholds,
as remote ON/OFF, the vertical axis represents the enable/ and the DCMAX is reduced linearly with increasing rectified
disable states of the output. For external current limit, the DC high voltage starting from just above the UV threshold.
vertical axis represents the magnitude of the ILIMIT. Please External current limit programming is implemented by
see graphs in the Typical Performance Characteristics connecting the MULTI-FUNCTION pin to the SOURCE pin
MULTI-FUNCTION PIN TABLE*

Figure Number 30 31 32 33 34 35 36 37 38 39 40
t
Three Terminal Operation 3

Undervoltage 3 3 3
Overvoltage 3 3 3
Line Feed-Forward (DCMAX) 3 3
Overload Power Limiting 3
External Current Limit 3 3 3 3
Remote ON/OFF 3 3 3 3 3
*This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible.
Table 3. Typcial MULTI-FUNCTION Pin Configurations.
11
TOP242-250
M Pin
X Pin L Pin
IREM(N) IUV IOV

(Enabled)
Output
MOSFET
Switching
(Disabled)
Disabled when supply I

output goes out of
regulation
ILIMIT (Default)
Current
Limit
DCMAX (78.5%)
Maximum
Duty Cycle
I
-22 A
-27 A
VBG + VTP
VBG
Pin Voltage
I
-250 -200 -150 -100 -50 0 50 100 150 200 250 300 350 400
X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current ( A)
Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric
table and typical performance characteristics sections of the data sheet for measured data.
PI-2636-010802
Figure 11. MULTI-FUNCTION (P or G package), LINSE-SENSE, and EXTERNAL CURRENT LIMIT (Y, R or F package) Pin Characteristics.
through a resistor. However, this function is not necessary shown in Figure 11. The horizontal axis represents MULTI-
in most applications since the internal current limit of the FUNCTION pin current with positive polarity indicating
P and G package devices has been reduced, compared currents flowing into the pin. The meaning of the vertical
to the Y, R and F package devices, to match the thermal axes varies with functions. For those that control the ON/
dissipation capability of the P and G packages. It is there- OFF states of the output such as UV, OV and remote ON/
fore recommended that the MULTI-FUNCTION pin is used OFF, the vertical axis represents the enable/disable states
for line sensing as described above and not for external of the output. UV triggers at IUV (+50 µA typical) and OV
current limit reduction. The same pin can also be used triggers at IOV (+225 µA typical with 30 µA hysteresis).
as a remote ON/OFF and a synchronization input in both Between the UV and OV thresholds, the output is enabled.
modes. Please refer to Table 3 for possible combinations For external current limit and line feed- forward with DCMAX
of the functions with example circuits shown in Figure 30 reduction, the vertical axis represents the magnitude
through Figure 40. A description of specific functions in of the ILIMIT and DCMAX. Line feed-forward with DCMAX
terms of the MULTI-FUNCTION pin I/V characteristic is reduction lowers maximum duty cycle from 78% at IM(DC)
12
TOP242-250
Y, R and F Package
CONTROL (C)
TOPSwitch-GX
240 µA
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
VBG + VT
EXTERNAL CURRENT LIMIT (X)
LINE-SENSE (L) (Voltage Sense)

1V
VBG
(Positive Current Sense - Undervoltage,
Overvoltage, ON/OFF Maximum Duty
Cycle Reduction)
400 µA
PI-2634-022604
Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic.
P and G Package
CONTROL (C)
TOPSwitch-GX
240 µA
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
VBG + VT
MULTI-FUNCTION (M)
VBG
(Positive Current Sense - Undervoltage,
Overvoltage, Maximum Duty
Cycle Reduction)
400 µA
PI-2548-022604
Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.
(+60 µA typical) to 38% at IOV (+225 µA). External current

limit is available only with negative MULTI-FUNCTION pin
current. Please see graphs in the Typical Performance
Characteristics section for the current limit programming
range and the selection of appropriate resistor value.
13
TOP242-250
Typical Uses of FREQUENCY (F) PIN
+ +
DC D DC D
Input Input
Voltage CONTROL Voltage CONTROL
C C
S F S F
- -
PI-2654-071700 PI-2655-071700
Figure 13. Full Frequency Operation (132 kHz). Figure 14. Half Frequency Operation (66 kHz).
DC
D
Input
Voltage CONTROL
C
STANDBY
S F Ω
Figure 15. Half Frequency Standby Mode (For High Standby

Efficiency).
14
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins
+ + VUV = IUV x RLS

VOV = IOV x RLS
For RLS = 2 M
CL X S F D RLS 2M VUV = 100 VDC
VOV = 450 VDC
DC DC
Input Input DCMAX@100 VDC = 78%
Voltage Voltage DCMAX@375 VDC = 38%
D L D L
CONTROL C S D CONTROL
C C
S X F S
- -
PI-2617-050100 PI-2618-081403
Figure 16. Three Terminal Operation (LINE-SENSE and Figure 17. Line-Sensing for Undervoltage, Overvoltage and Line
EXTERNAL CURRENT LIMIT Features Disabled. Feed-Forward.
FREQUENCY Pin Tied to SOURCE or CONTROL Pin).
Ω Ω
DC DC
Input Ω Input Ω
Voltage Voltage
D M D L
CONTROL CONTROL
C C
S S
Figure 18. Line-Sensing for Undervoltage Only (Overvoltage Figure 19. Linse-Sensing for Overvoltage Only (Undervoltage
Disabled). Disabled). Maximum Duty Cycle Reduced at Low Line
and Further Reduction with Increasing Line Voltage.
+ For RIL = 12 k
ILIMIT = 69%
Ω
For RIL = 25 k
ILIMIT = 43%
DC See Figure 54b for DC

D other resistor values D
Input Input
Voltage CONTROL (RIL) Voltage CONTROL
C C
S X S X
RIL
Ω
-
PI-2623-092303
Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.
15
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
+ QR can be an optocoupler
output or can be replaced by
a manual switch.
ON/OFF
Ω
DC DC
D
Input Input Ω
Voltage CONTROL Voltage
C
D L
CONTROL
S X C
QR ON/OFF
47 K S
-
PI-2625-040501
Figure 22. Active-on (Fail Safe) Remove ON/OFF. Figure 23. Active-off Remote ON/OFF. Maximum Duty Cycle
Reduced.
+ QR can be an optocoupler
output or can be replaced
ON/OFF
by a manual switch.
Ω
For RIL = 12 k
Ω
ILIMIT = 69%
DC DC
D For RIL = 25 k D L
Input Input
Voltage CONTROL ILIMIT = 43% Voltage CONTROL
C C
S X S X
RIL
QR ON/OFF
- 47 k
PI-2626-040501
Figure 24. Active-on Remote ON/OFF with Externally Set Figure 25. Active-off Remote ON/OFF with Externally Set
Current Limit. Current Limit.
+ VUV = IUV x RLS

Ω VOV = IOV x RLS
DCMAX@100 VDC = 78%

RLS 2M
DCMAX@375 VDC = 38%
Ω
ON/OFF
Ω
QR can be an optocoupler
DC output or can be replaced
D L
Input by a manual switch.
DC Voltage CONTROL
C For RIL = 12 k
Input D L
Voltage CONTROL ILIMIT = 69%
C S X
QR
RIL
ON/OFF
S
- 47 k
PI-2628-040501
Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and
EXTERNAL CURRENT LIMIT.
16
TOP242-250
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
PI-2629-092203
VUV = IUV x RLS
+
VOV = IOV x RLS
For RLS = 2 M
RLS 2M
VUV = 100 VDC
VOV = 450 VDC
DC DC Ω
D L DCMAX@100 VDC = 78% D L
Input Input
DCMAX@375 VDC = 38% CONTROL
Voltage CONTROL Voltage
C C
For RIL = 12 k
S
ILIMIT = 69% S
X
See Figure 54b for ON/OFF
RIL
other resistor values Ω
- 12 k
(RIL) to select different
ILIMIT values
Figure 28. Line-Sensing and Externally Set Current Limit. Figure 29. Active-on Remote ON/OFF.
Typical Uses of MULTI-FUNCTION (M) Pin
C S S
M
Ω Ω
D S S
DC DC
Input Input
Voltage Voltage
D M D M
C D S
CONTROL CONTROL
C C
S S
-
PI-2508-081199
Figure 30. Three Terminal Operation (MULIT-FUNCTION Figure 31. Line-Sensing for Undervoltage, Overvoltage and Line
Features Disabled). Feed-Forward.
Ω Ω
DC DC
Input Ω Input Ω
Voltage Voltage
D M D M
CONTROL CONTROL
C C
S S
Figure 32. Line-Sensing for Undervoltage Only (Overvoltage Figure 33. Line-Sensing for Overvoltage Only (Undervoltage
Disabled). Disabled). Maximum Duty Cycle Reduced at Low Line
and Further Reduction with Increasing Line Voltage.
17
TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+
For RIL = 12 k
ILIMIT = 69%
Ω
For RIL = 25 k
ILIMIT = 43%
DC DC
See Figures 54b, 55b
Input Input
and 56b for other resistor
Voltage values (RIL) to select Voltage
D M D M
different ILIMIT values.
CONTROL CONTROL
RIL C Ω C
S S
-
PI-2517-022604
Figure 34. Externally Set Current Limit (Not Normally Required- Figure 35. Current Limit Reduction with Line Voltage (Not
See M Pin Operation Description). Normally Required-See M Pin Operation Description).
+
by a manual switch.
DC DC ON/OFF
Input Input Ω
Voltage Voltage
D M Ω
D M
CONTROL CONTROL
QR C C
ON/OFF
47 kΩ S
- S
PI-2519-040501
Figure 36. Active-on (Fail Safe) Remote ON/OFF. Figure 37. Active-off Remote ON/OFF. Maximum Duty Cycle
Reduced.
18
TOP242-250
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+
by a manual switch.
For RIL = 12 k
ON/OFF
DC ILIMIT = 69% DC Ω
Input For RIL = 25 k Input
Voltage Voltage Ω
RIL D M ILIMIT = 43% D M
CONTROL CONTROL
QR C Ω C
ON/OFF
47 k S S
-
PI-2520-040501
Figure 38. Active-on Remote ON/OFF with Externally Set Figure 39. Active-off Remote ON/OFF with Externally Set
Current Limit (See M Pin Operation Description). Current Limit (See M Pin Operation Description).
DC ON/OFF
Input Ω
Voltage Ω
D M
CONTROL
C
Figure 40. Active-off Remote ON/OFF with LINE-SENSE.
19
TOP242-250
Application Examples provides line sensing, setting UV at 100 VDC and OV at

450 VDC. The extended maximum duty cycle feature of
A High Efficiency, 30 W, Universal Input Power Supply TOPSwitch-GX (guaranteed minimum value of 75% vs.
The circuit shown in Figure 41 takes advantage of several 64% for TOPSwitch-II) allows the use of a smaller input
of the TOPSwitch-GX features to reduce system cost and capacitor (C1). The extended maximum duty cycle and
power supply size and to improve efficiency. This design the higher reflected voltage possible with the RCD clamp
delivers 30 W at 12 V, from an 85 VAC to 265 VAC input, also permit the use of a higher primary to secondary
at an ambient of 50 °C, in an open frame configuration. turns ratio for T1, which reduces the peak reverse voltage
A nominal efficiency of 80% at full load is achieved using experienced by the secondary rectifier D8. As a result
TOP244Y. a 60 V Schottky rectifier can be used for up to 15 V
The current limit is externally set by resistors R1 and R2 outputs, which greatly improves power supply efficiency.
to a value just above the low line operating peak DRAIN The frequency reduction feature of the TOPSwitch-GX
current of approximately 70% of the default current limit. eliminates the need for any dummy loading for regulation
This allows use of a smaller transformer core size and/or at no load and reduces the no-load/standby consumption
higher transformer primary inductance for a given output of the power supply. Frequency jitter provides improved
power, reducing TOPSwitch-GX power dissipation, while margin for conducted EMI, meeting the CISPR 22 (FCC B)
at the same time avoiding transformer core saturation specification.
during start-up and output transient conditions. The Output regulation is achieved by using a simple Zener
resistors R1 & R2 provide a signal that reduces the current sense circuit for low cost. The output voltage is determined
limit with increasing line voltage, which in turn limits the by the Zener diode (VR2) voltage and the voltage drops
maximum overload power at high input line voltage. This across the optocoupler (U2) LED and resistor R6. Resistor
function in combination with the built-in soft-start feature R8 provides bias current to Zener VR2 for typical regulation
of TOPSwitch-GX, allows the use of a low cost RCD clamp of ±5% at the 12 V output level, over line and load and
(R3, C3 and D1) with a higher reflected voltage, by safely component variations.
limiting the TOPSwitch-GX drain voltage, with adequate
margin under worst case conditions. Resistor R4
PERFORMANCE SUMMARY
Output Power: 30 W CY1
Regulation: ± 4% 2.2 nF
Efficiency: ≥ 79% C14 R15
Ripple: ≤ 50 mV pk-pk 1 nF 150 Ω
L3 12 V @
3.3 µH 2.5 A
C3 R3
4.7 nF 68 kΩ
D8 C10 C11 C12
1 kV 2W
MBR1060 560 µF 560 µF 220 µF
35 V 35 V 35 V
BR1
600 V D1 RTN
2A UF4005
R4 D2
L1 2 MΩ 1N4148 R6
20 mH 1/2 W 150 Ω
R8
R1 T1 C6 150 Ω
4.7 MΩ 0.1 µF
C1 U2
68 µF 1/2 W
CX1 TOPSwitch-GX LTV817A
100 nF 400 V D L U1
250 VAC CONTROL TOP244Y
C
R5
F1 S X F 6.8 Ω VR2
J1 3.15 A 1N5240C
10 V, 2%
L R2
C5
9.09 kΩ 47 µF
10 V
N
PI-2657-081204
Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.
20
TOP242-250
A High Efficiency, Enclosed, 70 W, Universal lost or when the input voltage falls to below 40 V, whichever
Adapter Supply occurs first. This same value of R11 sets the OV threshold
The circuit shown in Figure 42 takes advantage of several to 450 V. If exceeded, for example during a line surge,
of the TOPSwitch-GX features to reduce cost, power supply TOPSwitch-GX stops switching for the duration of the
size and increase efficiency. This design delivers 70 W at surge, extending the high voltage withstand to 700 V
19 V, from an 85 VAC to 265 VAC input, at an ambient of without device damage. Capacitor C11 has been added in
40 °C, in a small sealed adapter case (4”x2.15”x1”). Full parallel with VR1 to reduce Zener clamp dissipation. With
load efficiency is 85% at 85 VAC rising to 90% at 230 VAC a switching frequency of 132 kHz, a PQ26/20 core can be
input. used to provide 70 W. To maximize efficiency, by reducing
winding losses, two output windings are used each with
Due to the thermal environment of a sealed adapter, a their own dual 100 V Schottky rectifier (D2 and D3). The
TOP249Y is used to minimize device dissipation. Resistors frequency reduction feature of the TOPSwitch-GX eliminates
R9 and R10 externally program the current limit level to any dummy loading to maintain regulation at no load and
just above the operating peak DRAIN current at full load reduces the no-load consumption of the power supply to
and low line. This allows the use of a smaller transformer only 520 mW at 230 VAC input. Frequency jittering provides
core size without saturation during start-up or output load conducted EMI meeting the CISPR 22 (FCC B) / EN55022B
transients. Resistors R9 and R10 also reduce the current specification, using simple filter components (C7, L2, L3 and
limit with increasing line voltage, limiting the maximum C6), even with the output earth grounded.
overload power at high input line voltage, removing the
need for any protection circuitry on the secondary. Resistor To regulate the output, an optocoupler (U2) is used with a
R11 implements an undervoltage and overvoltage sense as secondary reference sensing the output voltage via a
well as providing line feed-forward for reduced output line resistor divider (U3, R4, R5, R6). Diode D4 and C15 filter
frequency ripple. With resistor R11 set at 2 MΩ, the power and smooth the output of the bias winding. Capacitor C15
supply does not start operating until the DC rail voltage (1 µF) prevents the bias voltage from falling during zero to
reaches 100 VDC. On removal of the AC input, the UV full load transients. Resistor R8 provides filtering of leakage
sense prevents the output glitching as C1 discharges, inductance spikes, keeping the bias voltage constant even
turning off the TOPSwitch-GX when the output regulation is at high output loads.
C7 2.2 nF PERFORMANCE SUMMARY

C13 C12 C11 D2
MBR20100 Output Power: 70 W
0.33 F 0.022 F 0.01 F
400 V 400 V 400 V Y1 Safety Regulation: 4%
Efficiency: 84%
Ripple: 120 mV pk-pk
No Load Consumption: 0.52 W @ 230 VAC
VR1 D3
P6KE- MBR20100
C3 C14
200 820 F L1 0.1 F 19 V
BR1 25 V 200 H 50 V @ 3.6 A
RS805 D1
8A 600 V UF4006
C2 C4 RTN
D4 820 F R1 820 F
1N4148 25 V 270 25 V
L2 R11
820 H 2M R4
U2 31.6 k
2A 1/2 W R8 PC817A
C1 4.7 1%
T1 R2
150 F C15 R5
400 V 1k
C6 TOPSwitch-GX 1 F 562
0.1 F D L 50 V C9 1%
X2 L3 TOP249Y 4.7 nF 50 V
CONTROL
RT1 75 H R9 C U1
10 t 2A 13 M C10
1.7 A R3 0.1 F
S X F R7
F1 6.8 56 k 50 V
J1 3.15 A R10 C8 U3
0.1 F TL431 R6
85-265 VAC
20.5 k 4.75 k
L 50 V C5
47 F 1%
16 V
N All resistors 1/8 W 5% unless otherwise stated.
PI-2691-042203
Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.
21
TOP242-250
Resistor R7, C9 and C10 together with C5 and R3 provide 450 VDC, then TOPSwitch-GX will stop switching until the
loop compensation. voltage returns to normal, preventing device damage.
Due to the large primary currents, all the small signal control Due to the high primary current, a low leakage inductance
components are connected to a separate source node that transformer is essential. Therefore, a sandwich winding
is Kelvin connected to the SOURCE pin of the TOPSwitch-GX. with a copper foil secondary was used. Even with this
For improved common-mode surge immunity, the bias technique, the leakage inductance energy is beyond the
winding common returns directly to the DC bulk capacitor power capability of a simple Zener clamp. Therefore, R2,
(C1). R3 and C6 are added in parallel to VR1. These have been
sized such that during normal operation, very little power
A High Efficiency, 250 W, 250-380 VDC Input is dissipated by VR1, the leakage energy instead being
Power Supply dissipated by R2 and R3. However, VR1 is essential to
The circuit shown in Figure 43 delivers 250 W (48 V @ limit the peak drain voltage during start-up and/or overload
5.2 A) at 84% efficiency using a TOP249 from a 250 VDC conditions to below the 700 V rating of the TOPSwitch-GX
to 380 VDC input. DC input is shown, as typically at this MOSFET.
power level a p.f.c. boost stage would preceed this supply,
providing the DC input (C1 is included to provide local The secondary is rectifed and smoothed by D2 and C9,
decoupling). Flyback topology is still usable at this power C10 and C11. Three capacitors are used to meet the
level due to the high output voltage, keeping the secondary secondary ripple current requirement. Inductor L2 and C12
peak currents low enough so that the output diode and provide switching noise filtering.
capacitors are reasonably sized.
A simple Zener sensing chain regulates the output voltage.
In this example, the TOP249 is at the upper limit of its The sum of the voltage drop of VR2, VR3 and VR4 plus the
power capability and the current limit is set to the internal LED drop of U2 gives the desired output voltage. Resistor
maximum by connecting the X pin to SOURCE. However, R6 limits LED current and sets overall control loop DC gain.
line sensing is implemented by connecting a 2 MΩ resistor Diode D4 and C14 provide secondary soft-finish, feeding
from the L pin to the DC rail. If the DC input rail rises above current into the CONTROL pin prior to output regulation
C7
2.2 nF Y1 D2
MUR1640CT
R2 R3 C6 C10 C11 L2
+250-380 VR1 68 kΩ 68 kΩ 4.7 nF 560 µF 560 µF 48 V@
VDC P6KE200 3 µH 8A 5.2 A
2W 2W 1 kV 63 V 63 V
C9 C12
560 µF 68 µF
63 V 63 V
D1
BYV26C RTN
D2
1N4148 U2
LTV817A
R1
2 MΩ
1/2 W R9
T1 10 kΩ
C4
C1 1 µF
22 µF 50 V
400 V R6
TOPSwitch-GX 100 Ω
C13
D L TOP249Y 150 nF D4
PERFORMANCE SUMMARY U1
CONTROL 63 V 1N4148
Output Power: 250 W C
VR2 22 V
Line Regulation: ± 1% BZX79B22
Load Regulation: ± 5% R4
S X F 6.8 Ω C14
Efficiency: ≥ 85% VR3 12 V 22 µF
Ripple: < 100 mV pk-pk C3 BZX79B12 R8 63 V
0.1 µF C3 56 Ω
No Load Consumption: ≤ 1.4 W (300 VDC) 50 V 47 µF
10 V VR4 12 V
BZX79B12
0V All resistor 1/8 W 5% unless

otherwise stated. PI-2692-081204
Figure 43. 250 W, 48 V Power Supply using TOP249.
22
TOP242-250
and thus ensuring that the output voltage reaches Due to the high ambient operating temperature requirement
regulation at start-up under low line, full load conditions. typical of a set-top box (60 °C), the TOP246Y is used to
Resistor R9 provides a discharge path for C14. Capacitor reduce conduction losses and minimize heat sink size.
C13 and R8 provide control loop compensation and are Resistor R2 sets the device current limit to 80% of typical
required due to the gain associated with such a high output to limit overload power. The line sense resistor (R1)
voltage. protects the TOPSwitch-GX from line surges and transients
by sensing when the DC rail voltage rises to above 450
Sufficient heat sinking is required to keep the TOPSwitch-GX V. In this condition the TOPSwitch-GX stops switching,
device below 110 °C when operating under full load, low extending the input voltage withstand to 496 VAC, which
line and maximum ambient temperature. Airflow may also is ideal for countries with poor power quality. A thermistor
be required if a large heat sink area is not acceptable. (RT1) is used to prevent premature failure of the fuse by
limiting the inrush current (due to the relatively large size of
Multiple Output, 60 W, 185-265 VAC Input C2). An optional MOV (RV1) extends the differential surge
Power Supply protection to 6 kV from 4 kV.
Figure 44 shows a multiple output supply typical for high
end set-top boxes or cable decoders containing high Leakage inductance clamping is provided by VR1, R5
capacity hard disks for recording. The supply delivers an and C5, keeping the DRAIN voltage below 700 V under
output power of 45 W continuous/60 W peak (thermally all conditions. Resistor R5 and capacitor C5 are selected
limited) from an input voltage of 185 VAC to 265 VAC. such that VR1 dissipates very little power except during
Efficiency at 45 W, 185 VAC is ≥ 75%. overload conditions. The frequency jittering feature of
TOPSwitch-GX allows the circuit shown to meet CISPR22B
The 3.3 V and 5 V outputs are regulated to ±5% without with simple EMI filtering (C1, L1 and C6) and the output
the need for secondary linear regulators. DC stacking (the grounded.
secondary winding reference for the other output voltages
is connected to the cathode of D10 rather than the anode) The secondaries are rectified and smoothed by D7 to D11,
is used to minimize the voltage error for the higher voltage C7, C9, C11, C13, C14, C16 and C17. Diode D11 for the
outputs. 3.3 V output is a Schottky diode to maximize efficiency.
R6 D7
PERFORMANCE SUMMARY 10 Ω UF4003 30 V @
Output Power: 45 W Cont./60 W Peak 0.03 A
C7 L2 C8
Regulation: D8 47 µF 10 µF
3.3 µH
3.3 V: ± 5% UF5402 50 V 3A 50 V 18 V @
5 V: ± 5% 0.5 A
C9
12 V: ± 7% 330 µF L3 C10
100 µF
D9 3.3 µH
18 V: ± 7% UF5402 25 V
3A 25 V 12 V @
30 V: ± 8% 0.6 A
Efficiency: ≥75% C11 C13 C16 C12
C6 390 µF 1000 µF 1000 µF 100 µF
No Load Consumption: 0.6 W 2.2 nF 35 V 25 V 25 V L4
3.3 µH 25 V
Y1
VR1 R5 5A 5V@
P6KE170 68 kΩ 3.2 A
2W C14 C15
1000 µF L5 220 µF
D10 3.3 µH
BYV32-200 25 V 16 V
5A 3.3 V @
C5 3A
1 nF
400 V D11 C18
C17 220 µF
MBR1045 1000 µF 16 V
D1-D4 25 V
1N4007 V RTN
D6
1N4937
C2
L1 68 µF
20 mH 400 V R10
0.8A D6 C3 R7 15.0
R1
1N4148 1 µF 150 Ω kΩ
2 MΩ 50 V
C1 1/2 W T1 U2
0.1 µF LTV817 R8
X1 1 kΩ R11
9.53
TOPSwitch-GX kΩ
RV1 D L
TOP246Y
275 V CONTROL U1
14 mm R9 C19
C 3.3 kΩ 0.1 µF
F1 C3
3.15 A 0.1 µF R3
J1 S X F 50 V 6.8 Ω
RT1
C20
185-265 VAC
10 Ω U3
t°
R2 C5
L 1.7 A 47 µF 22 µF TL431 R12
9.08 kΩ 10 V 10 V 10 k
PI-2693-081704
N
Figure 44. 60 W Multiple Output Power Supply using TOP246.
23
TOP242-250
Diode D10 for the 5 V output is a PN type to center the supply on by shorting the M pin of the TOPSwitch-GX to
5 V output at 5 V. The 3.3 V and 5 V output require two SOURCE through a diode (remote ON). When the
capacitors in parallel to meet the ripple current requirement. secondary output voltage VCC is established, the micro-
Switching noise filtering is provided by L2 to L5 and C8, processor comes alive and recognizes that the switch P1
C10, C12, C15 and C18. Resistor R6 prevents peak is closed through the switch status input that is driven
charging of the lightly loaded 30 V output. The outputs are by the optocoupler U3 output. The microprocessor then
regulated using a secondary reference (U3). Both the 3.3 sends a power supply control signal to hold the power
V and 5 V outputs are sensed via R11 and R10. Resistor supply in the on-state through the optocoupler U4. If the
R8 provides bias for U3 and R7 sets the overall DC gain. user presses the switch P1 again to command a turn off,
Resistor R9, C19, R3 and C5 provide loop compensation. the microprocessor detects this through the optocoupler
A soft-finish capacitor (C20) eliminates output overshoot. U3 and initiates a shutdown procedure that is product
specific. For example, in the case of the inkjet printer, the
Processor Controlled Supply Turn On/Off shutdown procedure may include safely parking the print
A low cost momentary contact switch can be used to turn heads in the storage position. In the case of products
the TOPSwitch-GX power on and off under microprocessor with a disk drive, the shutdown procedure may include
control, which may be required in some applications such saving data or settings to the disk. After the shutdown
as printers. The low power remote OFF feature allows procedure is complete, when it is safe to turn off the power
an elegant implementation of this function with very few supply, the microprocessor releases the M pin by turning
external components, as shown in Figure 45. Whenever the optocoupler U4 off. If the manual switch and the
the push button momentary contact switch P1 is closed optocouplers U3 and U4 are not located close to the M pin,
by the user, the optocoupler U3 is activated to inform the a capacitor CM may be needed to prevent noise coupling to
microprocessor of this action. Initially, when the power the pin when it is open.
supply is off (M pin is floating), closing of P1 turns the power
VCC
(+5 V)
External
Wake-up
High-Voltage Signal
DC Input
MICRO- Power
PROCESSOR/ Supply
100 kΩ CONTROLLER ON/OFF
U2 Control
27 kΩ
LOGIC LOGIC 1N4148

1N4148
INPUT OUTPUT 6.8 kΩ
D M TOPSwitch-GX
U4
CONTROL
U3 C
6.8 kΩ
CM 47 µF
S F U1 U3
P1 1 nF P1 Switch
LTV817A Status U4
LTV817A
RETURN
PI-2561-030805
Figure 45. Remote ON/OFF using Microcontroller.
24
TOP242-250
The power supply could also be turned on remotely 3. No debouncing circuitry for the momentary switch
through a local area network or a parallel or serial port by is required. During turn-on, the start-up time of the
driving the optocoupler U4 input LED with a logic signal. power supply (typically 10 ms to 20 ms) plus the
Sometimes it is easier to send a train of logic pulses microprocessor initiation time act as a debouncing filter,
through a cable (due to AC coupling of cable, for example) allowing a turn-on only if the switch is depressed firmly
instead of a DC logic level as a wake up signal. In this for at least the above delay time. During turn-off, the
case, a simple RC filter can be used to generate a DC microprocessor initiates the shutdown sequence when
level to drive U4 (not shown in Figure 45). This remote it detects the first closure of the switch and subsequent
on feature can be used to wake up peripherals such as bouncing of the switch has no effect. If necessary, the
printers, scanners, external modems, disk drives, etc., as microprocessor could implement the switch debouncing
needed from a computer. Peripherals are usually designed in software during turn-off, or a filter capacitor can be
to turn off automatically if they are not being used for a used at the switch status input.
period of time, to save power. 4. No external current limiting circuitry is needed for the
operation of the U4 optocoupler output due to internal
In addition to using a minimum number of components, limiting of M pin current.
TOPSwitch-GX provides many technical advantages in this 5. No high voltage resistors to the input DC voltage rail are
type of application: required to power the external circuitry in the primary.
Even the LED current for U3 can be derived from the
1. Extremely low power consumption in the off mode: CONTROL pin. This not only saves components and
80 mW typical at 110 VAC and 160 mW typical at simplifies layout, but also eliminates the power loss
230 VAC. This is because, in the remote OFF mode, associated with the high voltage resistors in both ON
the TOPSwitch-GX consumes very little power and the and OFF states.
external circuitry does not consume any current (either 6. Robust design: There is no ON/OFF latch that can be
M, L or X pin is open) from the high voltage DC input. accidentally triggered by transients. Instead, the power
2. A very low cost, low voltage/current, momentary supply is held in the ON-state through the secondary-
contact switch can be used. side microprocessor.
25
TOP242-250
Key Application Considerations

TOPSwitch-II vs. TOPSwitch-GX
Table 4 compares the features and performance differences components. Other features increase the robustness of
between TOPSwitch-GX and TOPSwitch-II. Many of the design, allowing cost savings in the transformer and other
new features eliminate the need for additional discrete power components.
TOPSwitch-GX
Function TOPSwitch-II TOPSwitch-GX Figures
Advantages
Soft-Start N/A* 10 ms • Limits peak current and voltage
component stresses during start-
up
• Eliminates external components
used for soft-start in most
applications
• Reduces or eliminates output
overshoot
External Current N/A* Programmable 100% 11,20,21, • Smaller transformer
Limit to 30% of default 24,25,27, • Higher efficiency
current limit 28,34,35, • Allows power limiting (constant
38,39 overload power independent of
line voltage)
• Allows use of larger device for
lower losses, higher efficiency
and smaller heat sink
DCMAX 67% 78% 7 • Smaller input cap (wider dynamic
range)
• Higher power capability (when
used with RCD clamp for large
VOR)
• Allows use of Schottky secondary
rectifier diode for up to 15 V
output for high efficiency
Line Feed-Forward N/A* 78% to 38% 7,11,17, • Rejects line ripple
with DC MAX Reduction 26,27,28,
31,40
Line OV Shutdown N/A* Single resistor 11,17,19, • Increases voltage withstand
programmable 26,27,28 capability against line surge
31,33,40
Line UV Detection N/A* Single resistor 11,17,18, • Prevents auto-restart glitches
programmable 26,27,28, during power down
31,32,40
Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 • Smaller transformer
• Below start of conducted EMI
limits
Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX (continued on next page). *Not available
26
TOP242-250
TOPSwitch-GX
Function TOPSwitch-II TOPSwitch-GX Figures
Advantages
Switching Frequency N/A* 66 kHz ±7% 14,15 • Lower losses when using RC and
Option (Y, R and F RCD snubber for noise reduction
Packages) in video applications
• Allows for higher efficiency in
standby mode
• Lower EMI (second harmonic
below 150 kHz)
Frequency Jitter N/A* ±4 kHz @ 132 kHz 9,46 • Reduces conducted EMI
±2 kHz @ 66 kHz
Frequency Reduction N/A* At a duty cycle below 7 • Zero load regulation without
10% dummy load
• Low power consumption at
no-load
Remote ON/OFF N/A* Single transistor or 11,22,23, • Fast ON/OFF (cycle-by-cycle)
optocoupler interface 24,25,26, • Active-on or active-off control
or manual switch 27,29,36, • Low consumption in remote off
37,38,39, state
40 • Active-on control for fail-safe
• Eliminates expensive in-line
on/off switch
• Allows processor controlled turn
on/off
• Permits shutdown/wake-up of
peripherals via LAN or parallel
port
Synchronization N/A* Single transistor or • Synchronization to external lower
optocoupler interface frequency signal
• Starts new switching cycle on
demand
Thermal Shutdown 125 °C min. Hysteretic 130 °C min. • Automatic recovery from thermal
Latched shutdown (with 75 °C fault
hysteresis) • Large hysteresis prevents circuit
board overheating
Current Limit ±10% (@ 25 °C) ±7% (@ 25 °C) • 10% Higher power capability due
Tolerance -8% (0 °C to -4% Typical to tighter tolerance
100 °C) (0 °C to 100 °C)**
DRAIN DIP 0.037” / 0.94 mm 0.137” / 3.48 mm • Greater immunity to arcing as a
Creepage SMD 0.037” / 0.94 mm 0.137” / 3.48 mm result of build-up of dust, debris
at Package and other contaminants
TO-220 0.046” / 1.17 mm 0.068” / 1.73 mm
DRAIN Creepage at 0.045” / 1.14 mm 0.113” / 2.87 mm • Performed leads accommodate
PCB for Y, R and F (R and F Package (performed leads) large creepage for PCB layout
Packages N/A*) • Easier to meet Safety (UL/VDE)
Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available **Current limit set to internal maximum
27
TOP242-250
TOPSwitch-GX
Function TOPSwitch-FX TOPSwitch-GX
Advantages
Light Load Operation Cycle skipping Frequency and duty • Improves light load efficiency
cycle reduction • Reduces no-load consumption
Line Sensing/Exter- Line sensing and Line sensing and • Additional design flexibility allows all
nally Set Current externally set current externally set current features to be used simultaneously
Limit (Y, R and F limit mutually limit possible simulta-
Packages) exclusive (M pin) neously (functions split
onto L and X pins
Current Limit 100% to 40% 100% to 30% • Minimizes transformer core size in highly
Programming Range continuous designs
P/G Package Current Identical to Y TOP243-246 P and G • Matches device current limit to package
Limits package packages internal cur- dissipation capability
rent limits reduced • Allows more continuous design to lower
device dissipation (lower RMS currents)
Y/R/F Package 100% (R and F 90% (for equivalent • Minimizes transformer core size
Current Limits package N/A*) RDS(ON)) • Optimizes efficiency for most applications
Thermal Shutdown 125 °C min. 130 °C min. • Allows higher output powers in high
70 °C hysteresis 75 °C hysteresis ambient temperature applications
90 mA 60 mA • Reduces output line frequency ripple at
low line
Maximum Duty Cycle
• DCMAX reduction optimized for forward
Reduction Threshold
designs using TOP248, TOP249 and
TOP250
Line Undervoltage N/A* 40% of positive • Provides a well defined turn-off threshold
Negative (turn-off) (turn-on) threshold as the line voltage falls
Threshold
Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + • Gradually increasing current limit in
current limit) addition to duty cycle during soft-start
further reduces peak current and voltage
• Further reduces component stresses
during start up
Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available
TOPSwitch-FX vs. TOPSwitch-GX AN-29. TOP247 to TOP250: Higher output voltages, with a
maximum output current of 6 A.
Table 5 compares the features and performance differences
between TOPSwitch-GX and TOPSwitch-FX. Many of For all devices, a 100 VDC minimum for 85-265 VAC and
the new features eliminate the need for additional discrete 250 VDC minimum for 230 VAC are assumed and sufficient
components. Other features increase the robustness of heat sinking to keep device temperature ≤100 °C. Power
design, allowing cost savings in the transformer and other levels shown in the power table for the R package device
power components. assume 6.45 cm2 of 610 g/m2 copper heat sink area in an
enclosed adapter, or 19.4 cm2 in an open frame.
TOPSwitch-GX Design Considerations
TOPSwitch-GX Selection
Power Table
Selecting the optimum TOPSwitch-GX depends upon
Data sheet power table (Table 1) represents the maximum
required maximum output power, efficiency, heat sinking
practical continuous output power based on the following
constraints and cost goals. With the option to externally
conditions: TOP242 to TOP246: 12 V output, Schottky
reduce current limit, a larger TOPSwitch-GX may be used
output diode, 150 V reflected voltage (VOR) and efficiency
for lower power applications where higher efficiency is
estimates from curves contained in application note
needed or minimal heat sinking is available.
28
TOP242-250
Input Capacitor feedback loop to take control of the duty cycle. This
The input capacitor must be chosen to provide the minimum reduces the stress on the TOPSwitch-GX MOSFET, clamp
DC voltage required for the TOPSwitch-GX converter to circuit and output diode(s), and helps prevent transformer
maintain regulation at the lowest specified input voltage saturation during start-up. Also, soft-start limits the amount
and maximum output power. Since TOPSwitch-GX has of output voltage overshoot and, in many applications,
a higher DCMAX than TOPSwitch-II, it is possible to use a eliminates the need for a soft-finish capacitor.
smaller input capacitor. For TOPSwitch-GX, a capacitance
of 2 µF per watt is possible for universal input with an EMI
appropriately designed transformer. The frequency jitter feature modulates the switching
frequency over a narrow band as a means to reduce
Primary Clamp and Output Reflected Voltage VOR conducted EMI peaks associated with the harmonics of
A primary clamp is necessary to limit the peak the fundamental switching frequency. This is particularly
TOPSwitch-GX drain to source voltage. A Zener clamp beneficial for average detection mode. As can be seen in
requires few parts and takes up little board space. For Figure 46, the benefits of jitter increase with the order of
good efficiency, the clamp Zener should be selected to be the switching harmonic due to an increase in frequency
at least 1.5 times the output reflected voltage VOR, as this deviation.
keeps the leakage spike conduction time short. When
using a Zener clamp in a universal input application, a
80
VOR of less than 135 V is recommended to allow for the
PI-2576-010600
absolute tolerances and temperature variations of the 70
Zener. This will ensure efficient operation of the clamp 60
circuit and will also keep the maximum drain voltage
Amplitude (dBµV)
50
below the rated breakdown voltage of the TOPSwitch-GX
40
MOSFET.
30
A high VOR is required to take full advantage of the wider 20
DCMAX of TOPSwitch-GX. An RCD clamp provides tighter
-10
clamp voltage tolerance than a Zener clamp and allows
a VOR as high as 150 V. RCD clamp dissipation can be 0
minimized by reducing the external current limit as a EN55022B (QP)
-10 EN55022B (AV)
function of input line voltage (see Figures 21 and 35). The
-20
RCD clamp is more cost effective than the Zener clamp but 0.15 1 10 30
requires more careful design (see Quick Design Checklist).
Frequency (MHz)
Output Diode Figure 46a. TOPSwitch-II Full Range EMI Scan (100 kHz,
The output diode is selected for peak inverse voltage, output No Jitter).
current, and thermal conditions in the application (including
heat sinking, air circulation, etc.). The higher DCMAX of 80
PI-2577-010600
TOPSwitch-GX, along with an appropriate transformer turns 70 TOPSwitch-HX (with jitter)
ratio, can allow the use of a 60 V Schottky diode for higher 60
efficiency on output voltages as high as 15 V (see Figure 41:
Amplitude (dBµV)
50
A 12 V, 30 W design using a 60 V Schottky for the output
diode). 40
30
Bias Winding Capacitor
20
Due to the low frequency operation at no-load a 1 µF bias
winding capacitor is recommended. -10
0
Soft-Start EN55022B (QP)
-10
Generally, a power supply experiences maximum stress at EN55022B (AV)
start-up before the feedback loop achieves regulation. For -20
0.15 1 10 30
a period of 10 ms, the on-chip soft-start linearly increases
the duty cycle from zero to the default DCMAX at turn on. Frequency (MHz)
In addition, the primary current limit increases from 85% Figure 46b. TOPSwitch-GX Full Range EMI Scan (132 kHz, with
to 100% over the same period. This causes the output Jitter) with Identical Circuitry and Conditions.
voltage to rise in an orderly manner, allowing time for the
29
TOP242-250
The FREQUENCY pin of TOPSwitch-GX offers a surge capabilities by returning surge currents from the
switching frequency option of 132 kHz or 66 kHz. In bias winding directly to the input filter capacitor.
applications that require heavy snubbers on the drain
node for reducing high frequency radiated noise (for The CONTROL pin bypass capacitor should be located
example, video noise sensitive applications such as as close as possible to the SOURCE and CONTROL pins
VCR, DVD, monitor, TV, etc.), operating at 66 kHz will and its SOURCE connection trace should not be shared
reduce snubber loss resulting in better efficiency. Also, in by the main MOSFET switching currents. All SOURCE
applications where transformer size is not a concern, use pin referenced components connected to the MULTI-
of the 66 kHz option will provide lower EMI and higher FUNCTION, LINE-SENSE or EXTERNAL CURRENT
efficiency. Note that the second harmonic of 66 kHz is LIMIT pins should also be located closely between their
still below 150 kHz, above which the conducted EMI respective pin and SOURCE. Once again, the SOURCE
specifications get much tighter. connection trace of these components should not be
shared by the main MOSFET switching currents. It is
For 10 W or below, it is possible to use a simple inductor very critical that SOURCE pin switching currents are
in place of a more costly AC input common mode choke returned to the input capacitor negative terminal through
to meet worldwide conducted EMI limits. a seperate trace that is not shared by the components
connected to CONTROL, MULTI-FUNCTION, LINE-
Transformer Design SENSE or EXTERNAL CURRENT LIMIT pins. This is
It is recommended that the transformer be designed for because the SOURCE pin is also the controller ground
maximum operating flux density of 3000 Gauss and a reference pin.
peak flux density of 4200 Gauss at maximum current
limit. The turns ratio should be chosen for a reflected Any traces to the M, L or X pins should be kept as short
voltage (VOR) no greater than 135 V when using a Zener as possible and away from the DRAIN trace to prevent
clamp, or 150 V (max) when using an RCD clamp noise coupling. LINE-SENSE resistor (R1 in Figures 47-
with current limit reduction with line voltage (overload 49) should be located close to the M or L pin to minimize
protection). the trace length on the M or L pin side.
For designs where operating current is significantly lower In addition to the 47 µF CONTROL pin capacitor, a high
than the default current limit, it is recommended to use frequency bypass capacitor in parallel may be used for
an externally set current limit close to the operating peak better noise immunity. The feedback optocoupler output
current to reduce peak flux density and peak power should also be located close to the CONTROL and
(see Figures 20 and 34). In most applications, the tighter SOURCE pins of TOPSwitch-GX.
current limit tolerance, higher switching frequency and
soft-start features of TOPSwitch-GX contribute to a Y-Capacitor
smaller transformer when compared to TOPSwitch-II. The Y-capacitor should be connected close to the
secondary output return pin(s) and the positive primary
Standby Consumption DC input pin of the transformer.
Frequency reduction can significantly reduce power
loss at light or no load, especially when a Zener clamp Heat Sinking
is used. For very low secondary power consumption, The tab of the Y package (TO-220) or F package
use a TL431 regulator for feedback control. Alternately, (TO-262) is internally electrically tied to the SOURCE pin.
switching losses can be significantly reduced by To avoid circulating currents, a heat sink attached to the
changing from 132 kHz in normal operation to 66 kHz tab should not be electrically tied to any primary ground/
under light load conditions. source nodes on the PC board.
TOPSwitch-GX Layout Considerations When using a P (DIP-8), G (SMD-8) or R (TO-263)

package, a copper area underneath the package
As TOPSwitch-GX has additional pins and operates connected to the SOURCE pins will act as an effective
at much higher power levels compared to previous heat sink. On double sided boards (Figure 49), top side
TOPSwitch families, the following guidelines should and bottom side areas connected with vias can be used
be carefully followed. to increase the effective heat sinking area.
Primary Side Connections In addition, sufficient copper area should be provided at

Use a single point (Kelvin) connection at the negative the anode and cathode leads of the output diode(s) for
terminal of the input filter capacitor for the TOPSwitch-GX heat sinking.
SOURCE pin and bias winding return. This improves
30
TOP242-250
Safety Spacing Maximize hatched copper

areas ( ) for optimum
Y1- heat sinking
Capacitor
+ Output Rectifier
HV Output Filter Capacitor
Input Filter Capacitor
- PRI T
r
BIAS a SEC
n
s
PRI f
S S D o
r
m
TOPSwitch-GX
e
BIAS r
TOP VIEW
M S S C
Opto-
R1 coupler
- DC +
R2 Out
PI-2670-042301
Figure 47. Layout Consideratiions for TOPSwitch-GX using P or G Package.
Safety Spacing
Y1- Maximize hatched copper

+ Capacitor
heat sinking
HV Input Filter Capacitor
Output Rectifier
Output Filter Capacitor
-
T
r SEC
a
TOPSwitch-GX
n
D s
f
o
X r
L m
C e
TOP VIEW r
Opto-
R1 Heat Sink coupler
- DC +
Out
PI-2669-042301
Figure 48. Layout Consideratiions for TOPSwitch-GX using Y or F Package.
31
TOP242-250
Solder Side Output Filter Capacitors

Safety Spacing
Component Side
Y1-
+ Capacitor
TOP VIEW
HV
T
PRI r
a
Input Filter n
Capacitor PRI s
- f SEC
o
r
R1a - 1c m
e
r
BIAS
S
X
L - DC +
Out
C
Opto-
coupler Maximize hatched copper
TOPSwitch-GX heat sinking
PI-2734-043001
Figure 49. Layout Considerations for TOPSwitch-GX using R Package.
In Figures 47, 48 and 49, a narrow trace is shown between leading edge current spike is below the allowed current
the output rectifier and output filter capacitor. This trace limit envelope (see Figure 52) for the drain current
acts as a thermal relief between the rectifier and filter waveform at the end of the 220 ns blanking period.
capacitor to prevent excessive heating of the capacitor.
3. Thermal check – At maximum output power, minimum
Quick Design Checklist input voltage and maximum ambient temperature, verify
that temperature specifications are not exceeded for
As with any power supply design, all TOPSwitch-GX TOPSwitch-GX, transformer, output diodes and output
designs should be verified on the bench to make sure that capacitors. Enough thermal margin should be allowed
components specifications are not exceeded under worst for the part-to-part variation of the RDS(ON) of TOPSwitch-
case conditions. The following minimum set of tests is GX, as specified in the data sheet. The margin required
strongly recommended: can either be calculated from the tolerances or it can
be accounted for by connecting an external resistance
1. Maximum drain voltage – Verify that peak VDS does not in series with the DRAIN pin and attached to the same
exceed 675 V at highest input voltage and maximum heat sink, having a resistance value that is equal to the
overload output power. Maximum overload output difference between the measured RDS(ON) of the device
power occurs when the output is overloaded to a level under test and the worst-case maximum specification.
just before the power supply goes into auto-restart (loss
of regulation). Design Tools
2. Maximum drain current – At maximum ambient For a discussion on utilizing TOP248, TOP249
temperature, maximum input voltage and maximum and TOP250 in forward converter configurations,
output load, verify drain current waveforms at start-up please refer to the TOPSwitch-GX Forward Design
for any signs of transformer saturation and excessive Methodology Application Note.
leading edge current spikes. TOPSwitch-GX has
a leading edge blanking time of 220 ns to prevent Up-to-date information on design tools can be found at the
premature termination of the ON-cycle.Verify that the Power Integrations website: www.power.com
32
TOP242-250
ABSOLUTE MAXIMUM RATINGS(1,4)

DRAIN Voltage ................................................... -0.3 V to 700 V CURRENT LIMIT Pin Voltage ............................... -0.3 V to 4.5 V
DRAIN Peak Current: TOP242......................................0.72 A MULTI-FUNCTION Pin Voltage ................................ -0.3 V to 9 V
TOP243......................................1.44 A FREQUENCY Pin Voltage ....................................... -0.3 V to 9 V
TOP244......................................2.16 A Storage Temperature ....................................... -65 °C to 150 °C
TOP245......................................2.88 A Operating Junction Temperature(2) ................... -40 °C to 150 °C
TOP246...................................... 4.32 A Lead Temperature(3) ...................................................... ...260 °C
TOP247...................................... 5.76 A Notes:
TOP248...................................... 7.20 A 1. All voltages referenced to SOURCE, TA = 25 °C.
TOP249...................................... 8.64 A 2. Normally limited by internal circuitry.
TOP250.................................... 10.08 A 3. 1/16 in. from case for 5 seconds.
CONTROL Voltage ..................................................-0.3 V to 9 V 4. Maximum ratings specified may be applied one at a time, ......
CONTROL Current........ ................................................. 100 mA without causing permanent damage to the product. ...............
LINE SENSE Pin Voltage ......................................... -0.3 V to 9 V Exposure to Absolute Maximum Rating conditions for ............
extended periods of time may affect product reliability.
THERMAL RESISTANCE
Thermal Resistance: Y or F Package: Notes:
(qJA)(1) ...................................................80 °C/W 1. Free standing with no heat sink.
(qJC)(2) ....................................................2 °C/W 2. Measured at the back surface of tab.
P or G Package: 3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
(qJA)..................................70 °C/W(3); 60 °C/W(4) 4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
(qJC)(5)...................................................11 °C/W 5. Measured on the SOURCE pin close to plastic interface.
R Package: 6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad.
(qJA).................80 °C/W(7); 40 °C/W(4); 30 °C/W(6) 7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.
(qJC)(5).....................................................2 °C/W
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
Parameter Symbol Min Typ Max Units
See Figure 53
(Unless Otherwise Specified)
CONTROL FUNCTIONS
FREQUENCY Pin
Switching Connected to SOURCE
124 132 140
IC = 3 mA;
Frequency fOSC
TJ = 25 °C
kHz
FREQUENCY Pin
(average) Connected to CONTROL
61.5 66 70.5
Duty Cycle at
ONSET of
DC(ONSET) 10 %
Frequency
Reduction
Switching 132 kHz Operation 30
Frequency near fOSC(DMIN) kHz
0% Duty Cycle 66 kHz Operation 15
Frequency Jitter 132 kHz Operation ±4

Df kHz
Deviation 66 kHz Operation ±2
Frequency Jitter
fM 250 Hz
Modulation Rate
33
TOP242-250
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 53
CONTROL FUNCTIONS (cont.)
IL ≤ IL(DC) or IM ≤ IM(DC) 75 78 83
IL or IM = 190 mA
28 38 50
TOP242-247
Maximum IL or IM = 100 mA
DCMAX IC = ICD1 66.5 %
TOP242-247
Duty Cycle
IL = 190 mA
33 41.3 49.5
TOP248-250
IL = 100 mA
60 66.8 73.5
TOP248-250
Soft-Start Time tSOFT TJ = 25 °C; DCMIN to DCMAX 10 15 ms
PWM Gain DCreg IC = 4 mA; TJ = 25 °C -28 -23 -18 %/mA
PWM Gain
See Note A -0.01 %/mA/°C
Temperature Drift
TOP242-245 1.2 2.0 3.0
External Bias
IB See Figure 7 TOP246-249 1.6 2.6 4.0 mA
Current TOP250 1.7 2.7 4.2
CONTROL TOP242-245 6.0 7.0
Current at 0% IC(OFF) TJ = 25 °C TOP246-249 6.6 8.0 mA
Duty Cycle TOP250 7.3 8.5
Dynamic IC = 4 mA; TJ = 25 °C
ZC 10 15 22 W
Impedance See Figure 51
Dynamic
Impedance 0.18 %/°C
Temperature Drift
CONTROL Pin In-
7 kHz
ternal Filter Pole
SHUTDOWN/AUTO-RESTART
CONTROL Pin VC = 0 V -5.0 -3.5 -2.0
IC(CH) TJ = 25 °C mA
Charging Current VC = 5 V -3.0 -1.8 -0.6
Charging Current
See Note A 0.5 %/°C
Temperature Drift
Auto-Restart
Upper Threshold VC(AR)U 5.8 V
Voltage
Auto-Restart
Lower Threshold VC(AR)L 4.5 4.8 5.1 V
Voltage
34
TOP242-250
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 53
SHUTDOWN/AUTO-RESTART (cont.)
Auto-Restart
VC(AR)hyst 0.8 1.0 V
Hysteresis Voltage
Auto-Restart
DC(AR) 4 8 %
Duty Cycle
Auto-Restart
f(AR) 1.0 Hz
Frequency
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
Line Undervoltage Threshold 44 50 54 mA
Threshold Current
IUV TJ = 25 °C
and Hysteresis (M
Hysteresis 30 mA
or L Pin)
Line Overvoltage
Threshold 210 225 240 mA
or Remote ON/OFF
Threshold Current IOV TJ = 25 °C
and Hysteresis Hysteresis 8 mA
(M or L Pin)
L Pin Voltage
VL(TH) 0.5 1.0 1.6 V
Threshold
Remote ON/OFF
Threshold -35 -27 -20 mA
Negative
Threshold Current IREM (N) TJ = 25 °C
and Hysteresis Hysteresis 5 mA
(M or X Pin)
L or M Pin Short IL(SC) or
VL, VM = VC 300 400 520 mA
Circuit Current IM(SC)
X or M Pin Short IX(SC) or Normal Mode -300 -240 -180

VX, VM = 0 V mA
Circuit Current IM(SC) Auto-Restart Mode -110 -90 -70
L or M Pin Voltage IL or IM = 50 mA 1.90 2.50 3.00

VL, VM V
(Positive Current) IL or IM = 225 mA 2.30 2.90 3.30
X Pin Voltage IX = -50 mA 1.26 1.33 1.40

VX V
(Negative Current) IX = -150 mA 1.18 1.24 1.30
M Pin Voltage IM = -50 mA 1.24 1.31 1.39

VM V
(Negative Current) IM = -150 mA 1.13 1.19 1.25
35
TOP242-250
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 53
MULTI-FUNCTION, LINSE-SENSE AND EXTERNAL CURRENT LIMIT INPUTS (cont.)
Maximum Duty
Cycle Reduction IL(DC) or
TJ = 25 °C 40 60 75 mA
Onset Threshold IM(DC)
Current
X, L or M Pin
Remote-OFF Floating
0.6 1.0
See Figure 71
DRAIN Supply ID(RMT)
VDRAIN = 150 V
mA
L or M Pin Shorted
Current to CONTROL
1.0 1.6
Remote-ON From Remote ON to Drain Turn-On

tR(ON) 2.5 ms
Delay See Note B
Remote-OFF Minimum Time Before Drain Turn-On
tR(OFF) 2.5 ms
Setup Time to Disable Cycle, See Note B
FREQUENCY INPUT
FREQUENCY Pin
Threshold VF See Note B 2.9 V
Voltage
FREQUENCY Pin
IF VF = VC 10 40 100 mA
Input Current
CIRCUIT PROTECTION
TOP242 P/G
TOP242 Y/R/F Internal
0.418 0.45 0.481
TJ = 25 °C di/dt = 90 mA/ms
TOP243 P/G Internal

0.697 0.75 0.802
TJ = 25 °C di/dt = 150 mA/ms
TJ = 25 °C 0.837 0.90 0.963
di/dt = 180 mA/ms
TOP244 P/G Internal
TJ = 25 °C 0.930 1.00 1.070
di/dt = 200 mA/ms
Self Protection TOP244 Y/R/F Internal
1.256 1.35 1.445
Current Limit ILIMIT TJ = 25 °C di/dt = 270 mA/ms A
(See Note C) TOP245 P/G Internal
1.02 1.10 1.18
TJ = 25 °C di/dt = 220 mA/ms
1.674 1.80 1.926
TJ = 25 °C di/dt = 360 mA/ms
TOP246 P/G Internal
1.256 1.35 1.445
TJ = 25 °C di/dt = 270 mA/ms
2.511 2.70 2.889
TJ = 25 °C di/dt = 540 mA/ms
TJ = 25 °C 3.348 3.60 3.852
di/dt = 720 mA/ms
36
TOP242-250
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 53
CIRCUIT PROTECTION (cont.)
4.185 4.50 4.815
TJ = 25 °C di/dt = 900 mA/ms
Self Protection
Current Limit ILIMIT
TJ = 25 °C di/dt = 1080 mA/ms
5.022 5.40 5.778 A
(See Note C)
5.859 6.30 6.741
TJ = 25 °C di/dt = 1260 mA/ms
≤85 VAC 0.75 x
Initial Current (Rectified Line Input) ILIMIT(MIN)
IINIT See Note B A
Limit 265 VAC 0.6 x
(Rectified Line Input) ILIMIT(MIN)
Leading Edge See Figure 52
tLEB 220 ns
Blanking Time TJ = 25 °C, IC = 4 mA
Current Limit
tIL(D) IC = 4 mA 100 ns
Delay
Thermal
Shutdown 130 140 150 °C
Temperature
Thermal Shut-
Ω 75 °C
down Hysteresis
Power-Up Reset
V Figure 53, S1 Open 1.75 3.0 4.25 V
Threshold Voltage C(RESET)
OUTPUT
TOP242 TJ = 25 °C 15.6 18.0
ID = 50 mA TJ = 100 °C 25.7 30.0
TOP243 TJ = 25 °C 7.80 9.00
ID = 100 mA TJ = 100 °C 12.9 15.0
TOP244 TJ = 25 °C 5.20 6.00
ID = 150 mA TJ = 100 °C 8.60 10.0
ON-State TOP245 TJ = 25 °C 3.90 4.50
RDS(ON) W
Resistance ID = 200 mA TJ = 100 °C 6.45 7.50
TOP246 TJ = 25 °C 2.60 3.00
ID = 300 mA TJ = 100 °C 4.30 5.00
TOP247 TJ = 25 °C 1.95 2.25
ID = 400 mA TJ = 100 °C 3.22 3.75
TOP248 TJ = 25 °C 1.56 1.80
ID = 500 mA TJ = 100 °C 2.58 3.00
37
TOP242-250
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 53
OUTPUT (cont.)
TOP249 TJ = 25 °C 1.30 1.50
ID = 600 mA TJ = 100 °C 2.15 2.50
ON-State
RDS(ON) W
Resistance TOP250 TJ = 25 °C 1.10 1.28
ID = 700 mA TJ = 100 °C 1.85 2.15
OFF-State Drain VL, VM = Floating; IC = 4 mA
IDSS 470 mA
Leakage Current VDS = 560 V; TJ = 125 °C
Breakdown VL, VM = Floating; IC = 4 mA
BVDSS 700 V
Voltage See Note D, TJ = 25 °C
Rise Time tR Measured in a Typical Flyback 100 ns
Fall Time tF Converter Application 50 ns
SUPPLY VOLTAGE CHARACTERISTICS
DRAIN Supply
See Note E 36 V
Voltage
Shunt Regulator
VC(SHUNT) IC = 4 mA 5.60 5.85 6.10 V
Voltage
Shunt Regulator
±50 ppm/°C
Temperature Drift
Output MOSFET TOP242-245 1.0 1.6 2.5
ICD1 Enabled TOP246-249 1.2 2.2 3.2
Control Supply/ VX, VL, VM = 0 V TOP250 1.3 2.4 3.65
Discharge mA
Current Output MOSFET
ICD2 Disabled 0.3 0.6 1.3
VX, VL, VM = 0 V
NOTES:
A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in magnitude
with increasing temperature, and a positive temperature coefficient corresponds to a decrease in magnitude with
increasing temperature.
B. Guaranteed by characterization. Not tested in production.
C. For externally adjusted current limit values, please refer to Figures 54b, 55b and 56b (Current Limit vs. External
Current Limit Resistance) in the Typical Performance Characteristics section. The tolerance specified is only valid at full
current limit.
D. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to but
not exceeding minimum BVDSS.
E. It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the CONTROL pin
charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart duty cycle. Refer to
Figure 68, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage for low voltage operation
characteristics.
38
TOP242-250
t2
t1
HV
90% 90%
DRAIN t1
D=
VOLTAGE t2
10%
0V
PI-2039-033001
Figure 50. Duty Cycle Measurement.
PI-2022-033015
tLEB (Blanking Time)
120 1.3
PI-1939-033015
1.2
DRAIN Current (normalized)

CONTROL Pin Current (mA)
100 1.1
1.0
80 0.9
0.8
IINIT(MIN) @ 85 VAC
60 0.7
0.6 IINIT(MIN) @ 265 VAC
0.5
40
1
0.4 ILIMIT(MAX) @ 25 ˚C
Dynamic
= 0.3 ILIMIT(MIN) @ 25 ˚C
Impedance Slope
20 0.2
0.1
0 0
0 2 4 6 8 10 0 1 2 3 4 5 6 7 8
CONTROL Pin Voltage (V) Time (µs)
Figure 51. CONTROL Pin I-V Characteristic. Figure 52. Drain Current Operating Envelope.
Y or R Package (X and L Pins) P or G Package (M Pin)
S1 470 Ω 0-100 kΩ
5W 0-100 kΩ
S5
5-50 V M
5-50 V
0-60 kΩ
40 V
L D
470 Ω CONTROL
C C TOPSwitch-GX
S2
S4 F X S
0-15 V
S3
47 µF 0.1 µF
0-60 kΩ
NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.
2. For P and G packages, short all SOURCE pins together. PI-2631-081204
Figure 53. TOPSwitch-GX General Test Circuit.
39
TOP242-250
BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS
The following precautions should be followed when is only a 12.5% chance that the CONTROL pin oscillation
testing TOPSwitch-GX by itself outside of a power will be in the correct state (drain active state) so that the
supply. The schematic shown in Figure 53 is suggested continuous drain voltage waveform may be observed.
for laboratory testing of TOPSwitch-GX. It is recommended that the VC power supply be turned
on first and the DRAIN pin power supply second if
When the DRAIN pin supply is turned on, the part will continuous drain voltage waveforms are to be observed.
be in the auto-restart mode. The CONTROL pin voltage The 12.5% chance of being in the correct state is due
will be oscillating at a low frequency between 4.8 V and to the divide-by-8 counter. Temporarily shorting the
5.8 V and the drain is turned on every eigth cycle of the CONTROL pin to the SOURCE pin will reset TOPSwitch-GX,
CONTROL pin oscillation. If the CONTROL pin power which then will come up in the correct state.
supply is turned on while in this auto-restart mode, there
Typical Performance Characteristics

PI-2653-033015
1.1
Scaling Factors:
1.0 TOP242 P/G/Y/R/F: .45 200
TOP243 P/G: .75
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 TOP244 Y/R/F: 1.35 160
di/dt (mA/µs)
TOP245 Y/R/F: 1.80
0.7 TOP246 Y/R/F: 2.70 140
TOP247 Y/R/F: 3.60
0.6 TOP248 Y/R/F 4.50 120
TOP249 Y/R/F: 5.40
0.5 TOP250 Y/R/F: 6.32 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IX or IM (µA)
Figure 54a. Current Limit vs. X or M Pin Current (see Figures 55a and 56a for TOP245P/G and TOP246P/G).
PI-2652-042303
1.1
Scaling Factors:
1.0 TOP242 P/G/Y/R/F: .45 200
TOP243 P/G: .75
0.9 TOP243 Y/R/F: .90 180
TOP244 P/G: 1
Current Limit (A)
0.8 TOP244 Y/R/F: 1.35 160

di/dt (mA/µs)
Maximum TOP245 Y/R/F: 1.80

0.7 TOP246 Y/R/F: 2.70 140
Minimum
TOP247 Y/R/F: 3.60
0.6 TOP248 Y/R/F 4.50 120
TOP249 Y/R/F: 5.40
0.5 Typical 100
TOP250 Y/R/F: 6.32
0.4 80
Maximum and minimum levels
0.3 are based on characterization. 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
External Current Limit Resistor RIL (Ω)
Figure 54b. Current Limit vs. External Current Limit Resistance (see Figures 55b and 56b for TOP245P/G
and TOP246P/G).
40
TOP242-250
Typical Performance Characteristics (cont.)

PI-3652-033015
1.1
Scaling Factor:
1.0 TOP245P/G: 1.1 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/µs)
0.7 140
0.6 120
0.5 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IM (µA)
Figure 55a. Current Limit vs. MULTI-FUNCTION Pin Current (TOP245P/G only).
PI-3651-110405
1.1
Scaling Factor:
1.0 TOP245P/G: 1.1 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/µs)
Refer to MULTIFUNCTION (M) Pin
0.7 140
Operation section
0.6 120
0.5 Typical 100
0.4 80
Measured at 25 °C.
0.3 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 55b. Current Limit vs. External Current Limit Resistance (TOP245P/G only).
1.25
Current Limit (Normalized to 25 °C)
PI-3653-073003
1.20
1.15 0 °C
1.10
1.05
1.00
.95
25 °C
.90
.85
.80 100 °C
.75
.70
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 55c. External Current Limit vs. External Current Limit Resistance at 0 °C, 25 °C and 100 °C Junction
Temperature (TOP245P/G only).
41
TOP242-250

PI-3724-033015
1.1
Scaling Factor:
1.0 TOP246P/G: 1.35 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/µs)
0.7 140
0.6 120
0.5 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IM (µA)
Figure 56a. Current Limit vs. MULTI-FUNCTION Pin Current (TOP246P/G only).
PI-3725-110405
1.1
Scaling Factor:
1.0 TOP246P/G: 1.35 200
0.9 180
Current Limit (A)
0.8 160
di/dt (mA/µs)
Refer to MULTIFUNCTION (M) Pin
0.7 140
Operation section
0.6 120
0.5 Typical
100
0.4 80
Measured at 25 °C.
0.3 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 56b. Current Limit vs. External Current Limit Resistance (TOP246P/G only).
1.25
Current Limit (Normalized to 25 °C)
PI-3726-100703
1.20
1.15 0 °C
1.10
1.05
1.00
.95
25 °C
.90
.85
.80
100 °C
.75
.70
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
Figure 56c. External Current Limit vs. External Current Limit Resistance at 0 °C, 25 °C and 100 °C
Junction Temperature (TOP246P/G only).
42
TOP242-250
1.1 1.2
PI-176B-033001
PI-1123A-060794
1.0
(Normalized to 25 °C)
Output Frequency
Breakdown Voltage
0.8
1.0 0.6
0.4
0.2
0.9 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Junction Temperature (°C)
Figure 57. Breakdown Voltage vs. Temperature. Figure 58. Frequency vs. Temperature.
1.2 1.2
PI-2554-033015
PI-2555-040315
1.0 1.0
Current Limit
0.8
Current Limit
0.8
0.6 0.6
Use for TOP242-250 Y/R/F

0.4 0.4 packages and TOP242-244 P/G
packages only. See Figures 55c
and 56c for TOP245P/G and
0.2 0.2
TOP246P/G.
0 0
-50 -25 0 25 50 75 100 125 150
-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Figure 59. Internal Current Limit vs. Temperature. Figure 60. External Current Limit vs. Temperature with
RIL = 12 kW.
1.2 1.2
PI-2552-040315
PI-2553-040315
Undervoltage Threshold
1.0 1.0
Overvoltage Threshold
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 61. Overvoltage Threshold vs. Temperature. Figure 62. Undervoltage Threshold vs. Temperature.
43
TOP242-250
PI-2688-102700
PI-2689-102300
  Ω
LINE SENSE Pin Voltage (V)
EXTERNAL CURRENT LIMIT

µ ≤ ≤ µ
Pin Voltage (V)

LINE-SENSE Pin Current (µA) EXTERNAL CURRENT LIMIT Pin Current (µA)
Figure 63a. LINE-SENSE Pin Voltage vs. Current. Figure 63b. EXTERNAL CURRENT LIMIT Pin Voltage
vs. Current.
6 1.6
MULTI-FUNCTION Pin Voltage (V)
PI-2541-102700
PI-2542-040315
MULTI-FUNCTION Pin Voltage (V)

VM = 1.37 - IMx 1 kΩ
1.4
5 -200 µA ≤ IM ≤ -25 µA
1.2
4
1.0
3 0.8
0.6
2
See 0.4
1 Expanded
Version 0.2
0 0
-300 -200 -100 0 100 200 300 400 500 -300 -250 -200 -150 -100 -50 0
MULTI-FUNCTION Pin Current (µA) MULTI-FUNCTION Pin Current (µA)
Figure 64a. MULTI-FUNCTION Pin Voltage vs. Current. Figure 64b. MULTI-FUNCTION Pin Voltage vs. Current
(Expanded).
1.2 1.2
PI-2562-040315
PI-2563-040315
Onset Threshold Current
1.0 1.0
CONTROL Current
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 65. Control Current Out at 0% Duty Cycle Figure 66. Max. Duty Cycle Reduction Onset Threshold
vs. Temperaure. Current vs. Temperature.
44
TOP242-250
6 2
PI-2564-040315
PI-2645-033015
VC = 5 V
Charging Current (mA)

1.6
DRAIN Current (A)
CONTROL Pin
4
1.2
Scaling Factors:
3 TOP250 1.17
TOP249 1.00
TOP248 0.83 0.8
2 TOP247 0.67
TOP246 0.50
TOP245 0.33
1 TOP244 0.25
0.4
TCASE = 25 °C TOP243 0.17
TCASE = 100 °C TOP242 0.08
0 0
0 2 4 6 8 10 12 14 16 18 20 0 20 40 60 80 100
DRAIN Voltage (V) DRAIN Voltage (V)
Figure 67. Output Characteristics. Figure 68. IC vs. DRAIN Voltage.
10000 600
PI-2646-040215
PI-2650-052815
Scaling Factors: Scaling Factors:
TOP250 1.17 TOP250 1.17
DRAIN Capacitance (pF)
500 TOP249 1.00

TOP249 1.00
TOP248 0.83
TOP248 0.83
TOP247 0.67
TOP247 0.67
1000 400 TOP246 0.50
Power (mW)
TOP246 0.50 TOP245 0.33

TOP245 0.33 TOP244 0.25
TOP244 0.25 TOP243 0.17
TOP243 0.17 300 TOP242 0.08
TOP242 0.08
100 200
100
10 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600
Drain Voltage (V) DRAIN Voltage (V)
Figure 69. COSS vs. DRAIN Voltage. Figure 70. DRAIN Capacitance Power.
Remote OFF DRAIN Supply Current
PI-2690-102700

Figure 71. Remote OFF DRAIN Supply Current vs.
Temperature.
45
TOP242-250
PART ORDERING INFORMATION

TOPSwitch Product Family
GX Series Number
Package Identifier
G Plastic SMD-8B (TOP242-246 only)
P Plastic DIP-8B (TOP242-246 only)
Y Plastic TO-220-7C
R Plastic TO-263-7C (available only with TL option)
F Plastic TO-262-7C
Lead Finish
Blank Standard (Sn Pb)
N Pure Matte Tin (Pb-Free) (P, G, Y & F Packages)
Tape & Reel and Other Options
Blank Standard Configurations
TOP 242 G N - TL TL Tape & Reel, (G Package: 1000 min., R Package: 750 min.)
46
TOP242-250
TO-220-7C (Y Package)
.165 (4.19)
.185 (4.70)
.390 (9.91) .045 (1.14)
.146 (3.71) .420 (10.67) .055 (1.40)
.156 (3.96)
.108 (2.74) REF
+ .234 (5.94)
.261 (6.63)
.461 (11.71) .570 (14.48)

.495 (12.57) REF.
7° TYP. .670 (17.02)
.860 (21.84) REF.
.880 (22.35)
.080 (2.03)
.120 (3.05)
.068 (1.73) MIN PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61) .040 (1.02)

.010 (.25) M
.034 (.86) .060 (1.52)
.050 (1.27) BSC .012 (.30) .040 (1.02)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
.190 (4.83)
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes:
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue from left
to right when viewed from the front.
.050 (1.27) 3. Dimensions do not include mold flash or other
protrusions. Mold flash or protrusions shall not
exceed .006 (.15 mm) on any side.
.200 (5.08) .180 (4.58) 4. Minimum metal to metal spacing at the package
body for omitted pin locations is .068 in. (1.73 mm).
.100 (2.54)
5. Position of terminals to be measured at a location
PIN 1 PIN 7 .25 (6.35) below the package body.
6. All terminals are solder plated.
.150 (3.81) .150 (3.81)
Y07C MOUNTING HOLE PATTERN
PI-2644-040110
47
TOP242-250
PDIP-8B (P Package)
⊕D S .004 (.10)
.137 (3.48) Notes:
MINIMUM 1. Package dimensions conform to JEDEC specification
-E-
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
.240 (6.10) protrusions. Mold flash or protrusions shall not exceed
.260 (6.60) .006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
Pin 1 6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
.367 (9.32) perpendicular to plane T.
-D- .387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 6)
.125 (3.18) .015 (.38)

.145 (3.68) MINIMUM
-T-
SEATING .008 (.20)
PLANE .120 (3.05) .015 (.38)
.140 (3.56)
.300 (7.62) BSC

.100 (2.54) BSC .048 (1.22) (NOTE 7)
.014 (.36)
.053 (1.35)
.300 (7.62) P08B
.022 (.56) ⊕T E D S .010 (.25) M .390 (9.91)
PI-2551-040110
SMD-8B (G Package)
⊕ D S .004 (.10) .137 (3.48) Notes:
MINIMUM 1. Controlling dimensions are
inches. Millimeter sizes are
-E- shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
.372 (9.45) 3. Pin locations start with Pin 1,
.240 (6.10)
.388 (9.86) .420
.260 (6.60) and continue counter-clock-
⊕ E S .010 (.25) wise to Pin 8 when viewed
.046 .060 .060 .046 from the top. Pin 6 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
.080 is .137 inch (3.48 mm).
Pin 1 Pin 1
5. Lead width measured at
.086 package body.
.100 (2.54) (BSC) 6. D and E are referenced
.186
datums on the package
.286 body.
.367 (9.32)
-D- Solder Pad Dimensions
.387 (9.83)
.057 (1.45)
.125 (3.18) .068 (1.73)
.145 (3.68) (NOTE 5)
.004 (.10)
.032 (.81) .048 (1.22)
.053 (1.35)
.009 (.23) .004 (.10) .036 (0.91) 0°- 8°
.037 (.94)
.012 (.30) .044 (1.12) G08B
PI-2546-040110
48
TOP242-250
TO-263-7C (R Package)
.390 (9.91) .245 (6.22) .045 (1.14)
.420 (10.67) MIN .055 (1.40)
.055 (1.40)
.066 (1.68)
.225 (5.72)
.326 (8.28) MIN
.336 (8.53) .580 (14.73)
.620 (15.75)
.000 (0.00)
.010 (0.25)
.208 (5.28)
.090 (2.29)
Ref.
-A- .110 (2.79)
.010 (0.25)
0.68 (1.73)
LD #1 .012 (0.30)
MIN
.024 (0.61)
.024 (0.61) .100 (2.54) .050 (1.27)
.034 (0.86) 0°- 8°
REF
.315 (8.00)
.165 (4.19)
Solder Pad .185 (4.70)
Dimensions
.380 (9.65) .004 (0.10)
Notes:
1. Package outline exclusive of mold flash & metal burr.
.638 (16.21) 2. Package outline inclusive of plating thickness.
3. Foot length measured at intercept point between
datum A lead surface.
.128 (3.25) 4. Controlling dimensions are in inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27) 5. Minimum metal to metal spacing at the package body R07C
.038 (0.97) for the omitted pin locations is .068 in. (1.73 mm). PI-2664-040110
49
TOP242-250
TO-262-7C (F Package)
.045 (1.14)
.390 (9.91) .055 (1.40)
.420 (10.67) .165 (4.17)
.055 (1.40) .185 (4.70)
.066 (1.68)
.326 (8.28) .495 (12.56)

.336 (8.53) 7° TYP.
REF.
.795 (20.18) .595 (15.10)
REF. REF.
.080 (2.03)
.120 (3.05)
.068 (1.73) MIN PIN 1 & 7 PIN 2 & 4
PIN 1 .024 (.61) .040 (1.02)

.010 (.25) M
.034 (.86) .060 (1.52)
.050 (1.27) BSC .012 (.30) .040 (1.06)
.024 (.61) .060 (1.52)
.150 (3.81) BSC
.190 (4.83)
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes:
1. Controlling dimensions are inches. Millimeter dimensions
are shown in parentheses.
.050 (1.27) 2. Pin numbers start with Pin 1, and continue from left to
right when viewed from the front.
.050 (1.27) 3. Dimensions do not include mold flash or other protrusions.
Mold flash or protrusions shall not exceed .006 (.15 mm) on
any side.
.200 (5.08) .180 (4.58) 4. Minimum metal to metal spacing at the package body for
omitted pin locations is .068 inch (1.73 mm).
.100 (2.54)
5. Position of terminals to be measured at a location .25 (6.35)
PIN 1 PIN 7 below the package body.
6. All terminals are solder plated.
.150 (3.81) .150 (3.81)
F07C MOUNTING HOLE PATTERN
PI-2757-040110
50
TOP242-250
Revision Notes Date

D - 11/00
E Added R package (D2PAK). 7/01
Corrected abbreviations (s = seconds).
Corrected x-axis units in Figure 11 (mA).
Added missing external current limit resistor in Figure 25 (RIL).
Corrected spelling.
Added caption for Table 4.
Corrected Breakdown Voltage parameter condition (TJ = 25 °C).
Corrected font sizes in figures.
Figure 40 replaced.
Corrected schematic component values in Figure 44.
F Corrected Power Table value. 9/01
G Added TOP250 device and F package (TO-262). 1/02
Added R package Thermal Impedance parameters and adjusted Output Power values in Table 1.
Adjusted Off-State Current value.
H Added note to parameter table for Breakdown Voltage measurement. 9/02
Miscellaneous text corrections.
I Updated P, Y, R and F package information. 4/03
Revised thermal impedances (qJA) for all package types.
Expanded Maximum Duty Cycle and deleted Maximum Duty Cycle Reduction Slope parameters.
Corrected DIP-8B and SMD-8B Package Drawings.
J Added TOP245P. 8/03
Miscellaneous text corrections.
K Corrected typographic errors in Figures 4, 6, 20, 28 and 34; and in MULTI-FUNCTION (M) Pin 9/03
Operation section.
L Added TOP246P. 3/04
M Added lead-free ordering information. 12/04
N Updated Maximum Duty Cycle conditions. 4/05
Minor error corrections.
Added Note 4 to Absolute Maximum Ratings specification.
O Added TOP245G and TOP246G 11/05
P Updated with new Logo, headers and footers only. 05/15
51
TOP242-250
For the latest updates, visit our website: www.power.com

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power
Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES
NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
Patent Information
The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered
by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.
A complete list of Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under
certain patent rights as set forth at http://www.power.com/ip.htm.
Life Support Policy

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:
1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii)
whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant
injury or death to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
The PI logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero,
HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI FACTS are
trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2015, Power Integrations, Inc.
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52

Top242-250 Topswitch-Gx Family: Extended Power, Design Flexible, Ecosmart, Integrated Off-Line Switcher

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TOP242-250

• Externally programmable accurate current limit CONTROL

www.power.com May 2015

Functional Block Diagram ........................................................................................................................................ 3

Figure 2a. Functional Block Diagram (Y, R or F Package).

Figure 2b. Functional Block Diagram (P or G Package).

Pin Functional Description FREQUENCY (F) Pin: (Y, R or F package only)

disables all functions on this pin and makes TOPSwitch-GX DC

TOPSwitch-GX Family Functional

duty cycle of the power MOSFET decreases linearly with

In addition to the three terminal TOPSwitch features, such 30

Duty Cycle (%)

These terminals can be connected to the SOURCE pin IL < IL(DC)

2. DCMAX of 78% allows smaller input storage capacitor,

Auto-restart mode continues until output voltage regulation

The nominal switching frequency of 132 kHz was chosen to Time

Figure 10. Synchronization Timing Diagram.

LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

Three Terminal Operation 3

MULTI-FUNCTION PIN TABLE*

Three Terminal Operation 3

IREM(N) IUV IOV

Disabled when supply I

X and L Pins (Y, R or F Package) and M Pin (P or G Package) Current ( A)

(Negative Current Sense - ON/OFF,

LINE-SENSE (L) (Voltage Sense)

(Negative Current Sense - ON/OFF,

Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.

(+60 µA typical) to 38% at IOV (+225 µA). External current

Typical Uses of FREQUENCY (F) PIN

Figure 15. Half Frequency Standby Mode (For High Standby

+ + VUV = IUV x RLS

DC See Figure 54b for DC

+ VUV = IUV x RLS

DCMAX@100 VDC = 78%

Typical Uses of MULTI-FUNCTION (M) Pin

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

Figure 40. Active-off Remote ON/OFF with LINE-SENSE.

Application Examples provides line sensing, setting UV at 100 VDC and OV at

C7 2.2 nF PERFORMANCE SUMMARY

0V All resistor 1/8 W 5% unless

Figure 43. 250 W, 48 V Power Supply using TOP249.

Figure 44. 60 W Multiple Output Power Supply using TOP246.

LOGIC LOGIC 1N4148

Figure 45. Remote ON/OFF using Microcontroller.

Key Application Considerations

Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available

TOPSwitch-GX Layout Considerations When using a P (DIP-8), G (SMD-8) or R (TO-263)

Primary Side Connections In addition, sufficient copper area should be provided at

Safety Spacing Maximize hatched copper

Figure 47. Layout Consideratiions for TOPSwitch-GX using P or G Package.

Y1- Maximize hatched copper

Figure 48. Layout Consideratiions for TOPSwitch-GX using Y or F Package.

Solder Side Output Filter Capacitors

Figure 49. Layout Considerations for TOPSwitch-GX using R Package.

ABSOLUTE MAXIMUM RATINGS(1,4)

Frequency Jitter 132 kHz Operation ±4

X or M Pin Short IX(SC) or Normal Mode -300 -240 -180