Manual XBC

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Programmable Logic Controller

XBC Standard/Economic Type Main Unit

XGB Series
Main unit XBC-DR20SU XBC-DR10E
XBC-DN20S(U) XBC-DN10E
XBC-DP20SU XBC-DP10E
XBC-DR30SU XBC-DR14E
XBC-DN30S(U) XBC-DN14E
XBC-DP30SU XBC-DP14E
XBC-DR40SU XBC-DR20E
XBC-DN40SU XBC-DN20E
XBC-DP40SU XBC-DP20E
XBC-DR60SU XBC-DR30E
XBC-DN60SU XBC-DN30E
XBC-DP60SU XBC-DP30E
Safety Instruction

Before using the product …

For your safety and effective operation, please read the safety instructions
thoroughly before using the product.

► Safety Instructions should always be observed in order to prevent accident


or risk with the safe and proper use the product.

► Instructions are separated into “Warning” and “Caution”, and the meaning of
the terms is as follows;

This symbol indicates the possibility of serious injury


Warning or death if some applicable instruction is violated

This symbol indicates the possibility of slight injury


Caution or damage to products if some applicable instruction
is violated

► The marks displayed on the product and in the user’s manual have the
following meanings.

Be careful! Danger may be expected.

Be careful! Electric shock may occur.

► The user’s manual even after read shall be kept available and accessible to
any user of the product.
Safety Instruction

Safety Instructions when designing

Warning

 Please, install protection circuit on the exterior of PLC to protect


the whole control system from any error in external power or PLC
module. Any abnormal output or operation may cause serious problem
in safety of the whole system.
- Install applicable protection unit on the exterior of PLC to protect
the system from physical damage such as emergent stop switch,
protection circuit, the upper/lowest limit switch, forward/reverse
operation interlock circuit, etc.
- If any system error (watch-dog timer error, module installation error,
etc.) is detected during CPU operation in PLC, the whole output is
designed to be turned off and stopped for system safety. However,
in case CPU error if caused on output device itself such as relay or
TR can not be detected, the output may be kept on, which may
cause serious problems. Thus, you are recommended to install an
addition circuit to monitor the output status.

 Never connect the overload than rated to the output module nor
allow the output circuit to have a short circuit, which may cause a
fire.

 Never let the external power of the output circuit be designed to


be On earlier than PLC power, which may cause abnormal output or
operation.

 In case of data exchange between computer or other external


equipment and PLC through communication or any operation of
PLC (e.g. operation mode change), please install interlock in the
sequence program to protect the system from any error. If not, it
may cause abnormal output or operation.
Safety Instruction

Safety Instructions when designing

Caution
 I/O signal or communication line shall be wired at least 100mm
away from a high-voltage cable or power line. If not, it may cause
abnormal output or operation.

Safety Instructions when designing

Caution
 Use PLC only in the environment specified in PLC manual or
general standard of data sheet. If not, electric shock, fire, abnormal
operation of the product or flames may be caused.

 Before installing the module, be sure PLC power is off. If not,


electric shock or damage on the product may be caused.

 Be sure that each module of PLC is correctly secured. If the


product is installed loosely or incorrectly, abnormal operation, error or
dropping may be caused.

 Be sure that I/O or extension connecter is correctly secured. If


not, electric shock, fire or abnormal operation may be caused.

 If lots of vibration is expected in the installation environment,


don’t let PLC directly vibrated. Electric shock, fire or abnormal
operation may be caused.

 Don’t let any metallic foreign materials inside the product, which
may cause electric shock, fire or abnormal operation..
Safety Instruction

Safety Instructions when wiring

Warning
 Prior to wiring, be sure that power of PLC and external power is
turned off. If not, electric shock or damage on the product may be
caused.

 Before PLC system is powered on, be sure that all the covers of
the terminal are securely closed. If not, electric shock may be caused

Caution
 Let the wiring installed correctly after checking the voltage rated
of each product and the arrangement of terminals. If not, fire,
electric shock or abnormal operation may be caused.

 Secure the screws of terminals tightly with specified torque when


wiring. If the screws of terminals get loose, short circuit, fire or abnormal
operation may be caused.
*
 Surely use the ground wire of Class 3 for FG terminals, which is
exclusively used for PLC. If the terminals not grounded correctly,
abnormal operation may be caused.

 Don’t let any foreign materials such as wiring waste inside the
module while wiring, which may cause fire, damage on the product
or abnormal operation.
Safety Instruction

Safety Instructions for test-operation or repair

Warning
 Don’t touch the terminal when powered. Electric shock or abnormal
operation may occur.

 Prior to cleaning or tightening the terminal screws, let all the


external power off including PLC power. If not, electric shock or
abnormal operation may occur.

 Don’t let the battery recharged, disassembled, heated, short or


soldered. Heat, explosion or ignition may cause injuries or fire.

Caution
 Don’t remove PCB from the module case nor remodel the module.
Fire, electric shock or abnormal operation may occur.

 Prior to installing or disassembling the module, let all the external


power off including PLC power. If not, electric shock or abnormal
operation may occur.

 Keep any wireless installations or cell phone at least 30cm away


from PLC. If not, abnormal operation may be caused.

Safety Instructions for waste disposal

Caution
 Product or battery waste shall be processed as industrial waste.
The waste may discharge toxic materials or explode itself.
Revision History
Version Date Remark Page
V 1.0 2010.3 1. First Edition -
1. XGB output module added
(XBC-RY08B, XBE-DC16B)
V 1.1 2010.12 2. Error fixed
3. Sequence diagram on troubleshooting fixed
1. XGB SU type added -
V 1.2 2010.12 (XBC-DN20SU, XBC-DN30SU)
2. RTC option board added (XBO-RTCA) Chapter 9
1. XGB SU type added
(XBC-DN40SU, XBC-DN60SU, XBC-DR40SU, XBC-DR60SU) -
V 1.3 2011.06 2. XGB option module added Ch10, Ch11,
(XBO-DC04A, XBC-TN04A, XBO-M2MB) Ch12
1. XGB E type added
V1.4 2012.01 (XBC-DN10E, XBC-DN14E, XBC-DN20E, XBC-DN30E, -
XBC-DP10E, XBC-DP14E, XBC-DP20E, XBC-DP30E)
1. XGB SU type added -
V1.5 2013.01 (XBC-DP20SU, XBC-DP30SU, XBC-DP40SU, XBC-DP60SU)
2. Data Backup time modified 4-14
1. Domain of Homepage changed Front/Back
V1.6 2014.09 Cover
2. RTC Option specification added(Available on slot 9) 2-2,2-4,9-4
2015.02 1. Data backup time and available slot added 9-2, 9-5
2. Address& phone number changed BackCover
2015.07 3. Description of using Timer flag added . App1-2,App1-7
4.I/O(Input/Output) terminal error check and modification
V1.7 -Input terminal block error check 7-7~7-14
-Output terminal block error check, SG→PE 7-15~7-38
5.New PLC added
-XBF-TC04RT/ TC04TT, XBL-PMEC/ PSEA/DSEA 2-1~ 2-9,

※ The number of User’s manual is indicated the right side of the back cover.
ⓒ LSIS Co.,Ltd. 2010 All Rights Reserved.
About User’s Manual

About User’s Manual


Congratulations on purchasing PLC of LSIS Co.,Ltd.
Before use, make sure to carefully read and understand the User’s Manual about the functions,
performances, installation and programming of the product you purchased in order for correct use and
importantly, let the end user and maintenance administrator to be provided with the User’s Manual.

The Use’s Manual describes the product. If necessary, you may refer to the following description and order
accordingly. In addition, you may connect our website(http://www.lsis.com/) and download the information as
a PDF file.

Relevant User’s Manual


No. of User
Title Description
Manual
It describes how to use XG5000 software especially about
XG5000 User’s
online functions such as programming, printing, monitoring 10310000512
Manual
and debugging by using XGT series products.

XGK/XGB Series It describes how to use the instructions for programming

Instruction & using XGK/XGB series. 10310000510


Programming

It describes how to use the specification of analog


XGB Analog
input/analog output/temperature input module, system 10310000920
User’s Manual
configuration and built-in PID control for XGB main unit.

XGB Cnet I/F It describes how to use built-in communication function for
10310000816
User’s Manual XGB main unit and external Cnet I/F module.

XGB Fast Ethernet I/F


It describes how to use XGB FEnet I/F module. 10310000873
User’s Manual
◎ Contents ◎

Chapter 1 Introduction ............................................................................................. 1-1~1-5

1.1 Guide to Use This Manual ............................................................................................. 1-1


1.2 Features ........................................................................................................................ 1-2
1.3 Terminology ................................................................................................................... 1-4

Chapter 2 System Configuration ............................................................................... 2-1~2-14

2.1 XGB System Configuration ......................................................................................... 2-1


2.2 Product List .................................................................................................................. 2-3
2.3 Classification and Type of Product Name ................................................................... 2-5
2.3.1 Classification and type of basic unit ......................................................................... 2-5
2.3.2 Classification and type of expansion module ........................................................... 2-7
2.3.3 Classification and type of special module ................................................................ 2-8
2.3.4 Classification and type of communication module ..................................................... 2-9
2.4 System Configuration ................................................................................................ 2-11
2.4.1 Cnet I/F system ........................................................................................................ 2-11
2.4.2 Ethernet system ....................................................................................................... 2-14

Chapter 3 General Specifications ...................................................................................... 3-1

3.1 General Specifications .................................................................................................. 3-1

Chapter 4 CPU Specifications ................................................................................... 4-1~4-14

4.1 Performance Specifications ......................................................................................... 4-1


4.2 Names of Part and Function ........................................................................................ 4-7
4.3 Power Supply Specifications ..................................................................................... 4-10
4.4 Calculating Example of Consumption Current/Voltage .............................................4-13
4.5 Data Backup Time ..................................................................................................... 4-14
Chapter 5 Program Configuration and Operation Method ........................................ 5-1~5-37

5.1 Program Instruction ..................................................................................................... 5-1


5.1.1 Program execution methods .................................................................................... 5-1
5.1.2 Operation processing during momentary power failure ........................................... 5-2
5.1.3 Scan time .................................................................................................................. 5-3
5.1.4 Scan Watchdog timer ............................................................................................... 5-5
5.1.5 Timer processing ...................................................................................................... 5-6
5.1.6 Counter processing .................................................................................................. 5-9
5.2 Program Execution .................................................................................................... 5-11
5.2.1 Configuration of program ........................................................................................ 5-11
5.2.2 Program execution methods .................................................................................... 5-11
5.2.3 Interrupt . .................................................................................................................. 5-13
5.3 Operation Mode ......................................................................................................... 5-25
5.3.1 RUN mode .............................................................................................................. 5-25
5.3.2 STOP mode ............................................................................................................ 5-26
5.3.3 DEBUG mode ......................................................................................................... 5-26
5.3.4 Change operation mode ......................................................................................... 5-30
5.4 Memory ....................................................................................................................... 5-31
5.4.1 Data memory .......................................................................................................... 5-31
5.5 Configuration Diagram of Data Memory .................................................................... 5-33
5.5.1 “S” type ..................................................................................................................... 5-33
5.5.2 “H” type ..................................................................................................................... 5-34
5.5.3 Data latch area setting ............................................................................................. 5-35

Chapter 6 CPU Functions ......................................................................................... 6-1~6-25

6.1 Type Setting ................................................................................................................. 6-1


6.2 Parameter Setting ........................................................................................................ 6-2
6.2.1 Basic parameter setting ............................................................................................ 6-2
6.2.2 I/O parameter setting ................................................................................................ 6-3
6.3 Self-diagnosis Function ............................................................................................... 6-4
6.3.1 Saving of error log .................................................................................................... 6-4
6.3.2 Troubleshooting ........................................................................................................ 6-4
6.4 Remote Functions ......................................................................................................... 6-6
6.5 Forced Input/Output On and Off Function ..................................................................... 6-7
6.5.1 Force I/O setup ......................................................................................................... 6-7
6.5.2 Processing time and method of Forced Input/Output On and Off ............................ 6-8
6.6 Direct Input/Output Operation ..................................................................................... 6-9
6.7 Diagnosis of External Device .................................................................................... 6-10
6.8 Allocation of Input/Output Number ............................................................................ 6-11
6.9 Online Editing ............................................................................................................ 6-13
6.10 Reading Input/Output Information ............................................................................. 6-16
6.11 Monitoring ................................................................................................................ 6-17
6.12 Program Upload Prohibit ......................................................................................... 6-22
6.13 Clear All PLC ........................................................................................................... 6-23
6.14 Password Setting per Program Block ..................................................................... 6-24

Chapter 7 Input/Output Specifications ..................................................................... 7-1~7-74

7.1 Introduction .................................................................................................................. 7-1


7.2 Main Unit Digital Input Specifications .......................................................................... 7-7
7.2.1 XBC-DR10E/ DN10E/ DP10E 6 point DC24V input (Source/Sink type).................... 7-7
7.2.2 XBC-DR14E/ DN14E/ DP14E 8 point DC24V input (Source/Sink type).................... 7-8
7.2.3 XBC-DR20E/DN20E/DP20E 12 point DC24V input (Source/Sink type) .................... 7-9
7.2.4 XBC-DR30E/DN30E/ DP30E 18 point DC24V input (Source/Sink type).................7-10
7.2.5 XBC-DR20SU/DN20SU/DP20SU 12 point DC24V input (Source/Sink type) .......... 7-11
7.2.6 XBC- DR30SU/DN30SU/DP30SU 18 point DC24V input (Source/Sink type) .........7-12
7.2.7 XBC-DR40SU/DR40SU/ DR40SU 24 point DC24V input (Source/Sink Type) ........7-13
7.2.8 XBC-DR60SU/DN60SU/ DP60SU 36 point DC24V input (Source/Sink Type) ........7-14
7.3 Main Unit Digital Output Specifications ..................................................................... 7-15
7.3.1 XBC-DR10E 4 point relay output ............................................................................. 7-15
7.3.2 XBC-DR14E 6 point relay output ............................................................................. 7-16
7.3.3 XBC-DR20E 8 point relay output ............................................................................. 7-17
7.3.4 XBC-DR30E 12 point relay output ........................................................................... 7-18
7.3.5 XBC-DN10E 4 point transistor output (Sink type) ....................................................7-19
7.3.6 XBC-DN14E 6 point transistor output (Sink type) ....................................................7-20
7.3.7 XBC-DN20E 8 point transistor output (Sink type) ....................................................7-21
7.3.8 XBC-DN30E 12 point transistor output (Sink type) ..................................................7-22
7.3.9 XBC-DP10E 4 point transistor output (Source type)................................................7-23
7.3.10 XBC-DP14E 6 point transistor output (Source type)..............................................7-24
7.3.11 XBC-DP20E 8 point transistor output (Source type) ..............................................7-25
7.3.12 XBC-DP30E 12 point transistor output (Source type)............................................7-26
7.3.13 XBC-DR20SU 8 point relay output ......................................................................... 7-27
7.3.14 XBC-DR30SU 12 point relay output ....................................................................... 7-28
7.3.15 XBC-DR40SU 16 point relay output ....................................................................... 7-29
7.3.16 XBC-DR60SU 24 point relay output ....................................................................... 7-30
7.3.17 XBC-DN20S(U) 8 point transistor output (Sink type) .............................................7-31
7.3.18 XBC-DN30S(U) 12 point transistor output (Sink type) ...........................................7-32
7.3.19 XBC-DN40SU 16 point TR output (Sink type) .......................................................7-33
7.3.20 XBC-DN60SU 24 point TR output (Sink type) .......................................................7-34
7.3.21 XBC-DP20SU 8 point transistor output (Source type) ...........................................7-35
7.3.22 XBC-DP30SU 12 point transistor output (Source type) .........................................7-36
7.3.23 XBC-DP40SU 16 point TR output (Source type) ...................................................7-37
7.3.24 XBC-DP60SU 24 point TR output (Source type) ...................................................7-38
7.4 Digital Input Module Specifications ............................................................................ 7-39
7.4.1 8 point DC24V input module (Source/Sink type) ....................................................7-41
7.4.2 16 point DC24V input module (Source/Sink type) ..................................................7-42
7.4.3 32 point DC24V input module (Source/Sink type) ...................................................7-43
7.5 Digital Output Module Specifications ......................................................................... 7-44
7.5.1 8 point relay output module ...................................................................................... 7-45
7.5.2 8 point relay output module (independent point)......................................................7-46
7.5.3 16 point relay output module .................................................................................... 7-47
7.5.4 8 point transistor output module (Sink type) ............................................................ 7-48
7.5.5 16 point transistor output module (Sink type) ..........................................................7-49
7.5.6 32 point transistor output module (Sink type) ..........................................................7-50
7.5.7 8 point transistor output module (Source type) ........................................................7-51
7.5.8 16 point transistor output module (Source type) ......................................................7-52
7.5.9 32 point transistor output module (Source type) ......................................................7-53
7.6 Combined Digital I/O module Input Specification .......................................................7-51
7.6.1 8 point DC24V input (Source/Sink type) .................................................................. 7-51
7.7 Combined Digital I/O module Output Specification ....................................................7-52
7.7.1 8 point relay output ................................................................................................... 7-52
7.8 IO Wiring by Using Smart Link Board ....................................................................... 7-53
7.8.1 Smart link board ....................................................................................................... 7-53
Chapter 8 Built-in High-speed Counter Function .................................................... 8-1~8-54

8.1 High-speed Counter Specifications ............................................................................... 8-1


8.1.1 Performance specifications ...................................................................................... 8-1
8.1.2 Designation of parts .................................................................................................. 8-3
8.1.3 “E” type Functions .................................................................................................. 8-6
8.1.4 “S(U)” type Functions ........................................................................................... 8-23
8.2 Installation and Wiring ............................................................................................... 8-40
8.2.1 Precaution for wiring ............................................................................................... 8-40
8.2.2 Example of wiring ................................................................................................... 8-40
8.3 Internal Memory ......................................................................................................... 8-41
8.3.1 Special area for High-speed counter ...................................................................... 8-41
8.3.2 Error code ............................................................................................................... 8-49
8.4 Examples: Using High-speed Counter ...................................................................... 8-50

Chapter 9 RTC Option Board ...................................................................................... 9-1~9-5

9.1 Battery ........................................................................................................................... 9-1


9.1.1 Battery specification ................................................................................................. 9-1
9.1.2 Notice in using ............................................................................................................ 9-1
9.1.3 Life of battery.............................................................................................................. 9-1
9.1.4 How to change battery ............................................................................................... 9-2
9.2 RTC Function ................................................................................................................ 9-3
9.2.1 How to use ................................................................................................................. 9-3
9.3 Name and Function of Each Part .................................................................................. 9-5

Chapter 10 DC Input Option Function ................................................................... 10-1~10-15

10.1 DC input Option Board Specification ....................................................................... 10-1


10.1.1 DC input Option Board Specification ..................................................................... 10-1
10.2 High Speed Counter Specification ........................................................................... 10-2
10.2.1 Performance Specification .................................................................................... 10-2
10.2.2 Name of Each Part ............................................................................................... 10-3
10.2.3 Function.................................................................................................................. 10-5
10.3 Installation and Wiring ............................................................................................... 10-9
10.3.1 Power wiring ........................................................................................................... 10-9
10.3.2 Example of wiring ................................................................................................... 10-9
10.4 Internal Memory ...................................................................................................... 10-11
10.4.1 Special area for High-speed counter .................................................................... 10-11
10.5 Example using high-speed counter ......................................................................... 10-15

Chapter 11 TR Output Option Board ...................................................................... 11-1~11-16

11.1 TR Output Option Board Operation Sequence of Positioning ................................. 11-1


11.1.1 Operation Sequence of Positioning ....................................................................... 11-1
11.2 XBO-TN04A Specification ........................................................................................ 11-2
11.2.1 Output option board specification ......................................................................... 11-2
11.3 Positioning Specification ............................................................................................ 11-3
11.3.1 Performance Specification ...................................................................................... 11-3
11.3.2 Name of each part .................................................................................................. 11-3
11.3.3 Before Positioning .................................................................................................. 11-5
11.3.4 Positioning Stop Factor .......................................................................................... 11-7
11.3.5 Manual operation .................................................................................................... 11-8
11.3.6 Home return ............................................................................................................ 11-9
11.3.7 Positioning Basic Parameter Setup ...................................................................... 11-10
11.4 Positioning Instruction List ....................................................................................... 11-14
11.5 Positioning Example ................................................................................................ 11-15

Chapter 12 Memory Module .................................................................................... 12-1~12-9

12.1 Memory Module Specification ................................................................................... 12-1


12.1.1 Memory module specification ................................................................................ 12-1
12.1.2 Memory module structure...................................................................................... 12-1
12.1.3 How to use memory module.................................................................................. 12-2
12.1.4 How to use when password is set ......................................................................... 12-7

Chapter 13 Installation and Wiring ...................................................................... 13-1~13-18

13.1 Safety Instruction ..................................................................................................... 13-1


13.1.1 Fail safe circuit....................................................................................................... 13-3
13.1.2 PLC heat calculation .............................................................................................. 13-6
13.2 Attachment/Detachment of Modules ....................................................................... 13-8
13.2.1 Attachment/Detachment of modules ................................................................... 13-8
13.2.2 Caution in handling .............................................................................................. 13-13
13.3 Wire ......................................................................................................................... 13-14
13.3.1 Power wiring ......................................................................................................... 13-14
13.3.2 I/O Device wiring .................................................................................................. 13-17
13.3.3 Grounding wiring .................................................................................................. 13-17
13.3.4 Specifications of wiring cable ............................................................................... 13-18

Chapter 14 Maintenance ....................................................................................... 14-1~14-2

14.1 Maintenance and Inspection ................................................................................... 14-1


14.2 Daily Inspection ....................................................................................................... 14-1
14.3 Periodic Inspection .................................................................................................. 14-2

Chapter 15 Troubleshooting ................................................................................ 15-1~15-12

15.1 Basic Procedure of Troubleshooting ....................................................................... 15-1


15.2 Troubleshooting ......................................................................................................... 15-1
15.2.1 Troubleshooting flowchart used with when the PWR(Power) LED turns Off. ........15-2
15.2.2 Troubleshooting flowchart used with when the ERR(Error) LED is flickering ......15-3
15.2.3 Troubleshooting flowchart used with when the RUN,STOP LED turns Off. .........15-4
15.2.4 Troubleshooting flowchart used with when the I/O part doesn’t operate normally..15-5
15.3 Troubleshooting Questionnaire ............................................................................... 15-7
15.4 Troubleshooting Examples ...................................................................................... 15-8
15.4.1 Input circuit troubles and corrective actions .........................................................15-8
15.4.2 Output circuit and corrective actions ...................................................................... 15-9
15.5 Error Code List ........................................................................................................ 15-11

Appendix 1 Flag List ................................................................................ App. 1-1~App.1-13

Appendix 1.1 Special Relay (F) List ........................................................................... App. 1-1


Appendix 1.2 Communication Relay (L) List .............................................................. App. 1-6
Appendix 2 Dimension ................................................................................. App.2-1~App.2-4

Appendix 3 Compatibility with MASTER-K................................................... App.3-1~App.3-6

Appendix 4 Instruction List ......................................................................... App.4-1~App.4-40

Appendix 4.1 Classification of Instructions ................................................................. App.4-1


Appendix 4.2 Basic Instructions ................................................................................ App.4-2
Appendix 4.3 Application Instruction ......................................................................... App.4-5
Appendix 4.4 Special/Communication Instruction ................................................... App.4-37

Appendix 5 Installation Of Option Board ..................................................................... App.5-1


Chapter 1 Introduction

Chapter 1 Introduction
1.1 Guide to Use This Manual
This manual includes specifications, functions and handling instructions for the XGB series PLC.
This manual is divided up into chapters as follows.

No. Title Contents


Describes configuration of this manual, unit’s features and
Chapter 1 Introduction
terminology.
Describes available units and system configuration in the XGB
Chapter 2 System Configurations
series.
Describes general specifications of units used in the XGB
Chapter 3 General Specifications
series.

Chapter 4 CPU Specifications

Program Configuration and


Chapter 5 Describes performances, specifications and operations.
Operation Method

Chapter 6 CPU Module Functions

Chapter 7 Input/Output Specifications Describes operation of basic and input/output.

Built-in High-speed Counter


Chapter 8 Describes built-in high-speed counter functions.
Function
Describes installation, wiring and handling instructions for
Chapter 9 Installation and Wiring
reliability of the PLC system.
Describes the check items and method for long-term normal
Chapter 10 Maintenance
operation of the PLC system.

Chapter 11 Troubleshooting Describes various operation errors and corrective actions.

Appendix 1 Flag List Describes the types and contents of various flags.

Appendix 2 Dimension Shows dimensions of the main units and expansion modules.

Compatibility with
Appendix 3 Describes the compatibility with MASTER-K.
MASTER-K

Appendix 4 Instruction List Describes the special relay and instruction list.

1-1
Chapter 1 Introduction

1.2 Features
The features of XGB system are as follows.

(1) The system secures the following high performances.


(a) High Processing Speed
(b) Max. 284 I/O control supporting small & mid-sized system implementation
Type
Item Reference
XBC-DRxxE XBC-DxxxS(U)
Operation processing
0.24 ㎲ / Step 94ns / Step -
speed
In case of using option
Max IO contact point 38 points 284 points module 4 points
(Coming soon)
Program capacity 4kstep 15kstep -
Max. no. of expanded Option module 2 7 stages (including option
-
stage stages module 2 stages)
(c) Enough program capacity
(d) Expanded applications with the support of floating point.
(e) XBC-DRxxE is expressed as “E” type and XBC-DxxxS(U) is expressed as “S(U)” type.
(2) Compact : the smallest size comparing to the same class model of competitors.
(a) Compact panel realized through the smallest size.
(Unit: mm)

Item Type Size (W * H * D) Reference

XBC-Dx20S
“S” type
XBC-Dx30S
135*90*64
XBC-Dx20SU
XBC-Dx30SU
“SU” type
XBC-Dx40SU 161 * 90 * 64
Basic unit
XBC-Dx60SU 210 * 90 * 64
XBC-Dx10E
100*90*64
XBC-Dx14E
“E” type
XBC-Dx20E
135*90*64
XBC-Dx30E
Extension module XBE-,XBF-,XBL- 20 * 90 * 60 Basis of minimum size

(3) Easy attachable/extensible system for improved user convenience.


(a) By adopting a removable terminal block connector (M3 X 6 screw), convenience of wiring may be
increased. (“S(U)” type main unit)
(b) By adopting connector coupling method, modules may be easily connected and separated.

(4) Improved maintenance ability with kinds of register, RTC option, comment backup and etc
(a) Convenient programming environment by providing analogue register and index register.
(b) Improved maintenance ability by operating plural programs and task program through module program.
(c) Built-in Flash ROM enabling permanent backup of program without any separate battery.

1-2
Chapter 1 Introduction

(d) Improved maintenance ability by types of comment backup.


(e) Built-in RTC function enabling convenient history and schedule management

(5) Optimized communication environment.


(a) With max. 2 channels of built-in COM (1 channel for “E” type (except load port)), communication is
available without any expanded of module.
(b) Supporting various protocols to improve the convenience (leaseddedicated, Modbus, user-defined
communication)
(c) Communication module may be additionally increased by adding modules (up to 2 rackstages such as
Cnet, Enet and etc). (“S(U)” type main unit)
(d) Convenient network-diagnostic function through network & communication frame monitoring.
(e) Convenient networking to upper systems through Enet or Cnet. (“S(U)” type main unit)

(6) Applications expanded with a variety of I/O modules.


(a) 8, 16, 32 points modules provided (if relay output, 8/16 points module).
(b) Single input, single output and combined I/O modules supported.

(7) Applications expanded through analogue-exclusive dedicated register design and full attachable
mechanism.
(a) All analogue modules can be attachable on extension base. (“S(U)” type: up to 7 racks stages available)
(b) With analogue exclusive dedicated register(U) and monitoring exclusive dedicated function, convenient
use for I/O is maximized (can designate operations using easy programming of U area and monitoring
function)

(8) Integrated programming environment


(a) XG 5000: intensified program convenience, diverse monitoring, diagnosis and editing function
(b) XG - PD: COM/network parameters setting, frame monitoring, protocol analysis function

(9) Built-in high speed counter function


(a) Providing high High-speed counter 1phase, 2phase and more additional functions.
(b) Providing parameter setting, diverse monitoring and diagnosis function using XG5000.
(c) Monitoring function in XG5000 can inspect without program, inspecting external wiring, data setting and
others.
(마침표)
(10) Built-in position control function (“S(U)” type TR output main unit)
(a) Supporting max 100Kpps 2 axes.
(b) Providing parameter setting, operation data collection, diverse monitoring and diagnosis by using
XG5000.
(c) Commissioning by monitoring of XG5000, without program, inspecting external wiring and operation data
setting.

1-3
Chapter 1 Introduction

(11) Built-in PID (“S(U)” type main unit)


(a) Supporting max. 16 loops.
(b) Setting parameters by using XG5000 and supporting loop status monitoring conveniently with trend
monitor.
(c) Control constant setting through the improved automatic Auto-tuning function.
(d) With many other additional functions including PWM output, ∆MV, ∆PV and SV Ramp, improving the
control preciseness.
(e) Supporting types of control modes such as forward/backward mixed operation, 2-stage SV PID control,
cascade control and etc.
(f) A variety of warning functions such as PV MAX and PV variation warning securing the safety.

1.3 Terminology
The following table gives definition of terms used in this manual.

Terms Definition Remark


Example)
A standard element that has a specified function which configures Expansion module,
Module the system. Devices such as I/O board, which inserted onto the Special module,
mother board. Communication
module
Example)
A single module or group of modules that perform an Main unit,
Unit
independent operation as a part of PLC systems. Expansion unit

A system which consists of the PLC and peripheral devices.


PLC System -
A user program can control the system.

A program and debugging tool for the MASTER-K series.


XG5000 It executes program creation, edit, compile and debugging. -
(PADT: Programming Added Debugging Tool)
Software to execute description, edition of basic parameter, high
XG - PD speed link, P2P parameter, and function of communication
diagnosis -
Internal memory area of the CPU module which used to hold I/O
I/O image area
status.
Cnet Computer Network -

FEnet Fast Ethernet Network -


Pnet Profibus-DP Network -
Dnet DeviceNet Network -

Abbreviation of ‘Real Time Clock’. It is used to call general IC that


RTC -
contains clock function.

Supervisors the pre-set execution times of programs and warns if


Watchdog Timer -
a program is not competed within the pre-set time.

1-4
Chapter 1 Introduction

Terms Definition Remark

Current flows from the switch to the PLC input terminal if a input
signal turns on.

Z: Input
Sink Input
impedance

Current flows from the PLC input terminal to the switch after a
input signal turns on.

Source Input -

Current flows from the load to the output terminal and the PLC
output turn on.

Sink Output -
Output
Contact

Current flows from the output terminal to the load and the PLC
output turn on.

Source Output -

1-5
Chapter 2 System Configuration

Chapter 2 System Configuration


The XGB series has suitable to configuration of the basic, computer link and network systems.
This chapter describes the configuration and features of each system.

2.1 XGB System Configuration

XGB series System Configuration is as follows.


For “E” type, only option module can be attached
For “S” type, up to 7 stages connection is available. But in case of attaching 2 option modules, up to 5
stages connection is available. (For communication module, up to 2 connection is available.)

I/O Module Communication Module


Main Unit
Special Module

Item Description

• XBC-DxxxS (“S(U)” type): 20~284 points


Total I/O points
• XBC-DxxxE (“E” type): 10~38 points
Digital I/O module • “S(U)” type: Max. 7

Special module • “S(U)” type: Max. 7


Maximum number of Communication • “S(U)” type: Max. 2
expansion I/F module
modules • “S(U)” type: Max. 2
Option module • “E” type: Max. 2
(In case of 10/14 points, only one is available)
• XBC-DR20/30/40/60SU • XBC-DN20/30S
“S” type
• XBC-DN20/30/40/60SU • XBC-DP20/30/40/60SU
Items Main unit
• XBC-DR10/14/20/30E • XBC-DN10/14/20/30E
“E” type
• XBC-DP10/14/20/30E

2-1
Chapter 2 System Configuration

Item Description
• XBE-DC08/16A/B/32A • XBE-TN08/16/32A • XBE-TP08/16/32A
Digital I/O module • XBE-RY08A/B/16A • XBE-DR16A
• XBF-AD04A • XBF-DV04A • XBF-TC04RT
• XBF-AD08A • XBF-DV04C • XBF-TC04TT
Expansion Special module • XBF-AD04C • XBF-AH04A • XBF-PD02A
• XBF-DC04A • XBF-RD04A • XBF-HD02A
module • XBF-DC04C • XBF-TC04S • XBF-HO02A
• XBL-C41A • XBL-C21A • XBL-EIPT
Communication • XBL-EMTA • XBL-EIMT • XBL-CMEA
• XBL-CSEA • XBL-PMEC • XBL-PSEA
Items I/F module • XBL-DSEA
• XBO-DC04A(High speed counter is available on “SU ”type)
Digital I/O module • XBO-TN04A(Positioning is available on slot 9 of “SU ”type)
• XBO-AD02A • XBO-DA02A • XBO-AH02A
Option Special module • XBO-RD01A • XBO-TC02A

module RTC module • XBO-RTCA(available on slot 9)

Memory module • XBO-M2MB

2-2
Chapter 2 System Configuration

2.2 Product List


XGB series’ product list is as follows.
Types Model Description Remark
XBC-DR32H AC100~220V power supply, DC24V input 16 point, Relay output 16 point
XBC-DN32H AC100~220V power supply, DC24V input 16 point, Transistor output 16 point
XBC-DR64H AC100~220V power supply, DC24V input 32 point, Relay output 32 point
XBC-DN64H AC100~220V power supply, DC24V input 32 point, Transistor output 32 point
XBC-DR20SU AC100~220V power supply, DC 24V input 12 point, relay output 8 point
XBC-DN20S(U) AC100~220V power supply, DC24V input 12 point, transistor 8 point
XBC-DP20SU AC100~220V power supply, DC24V input 12 point, transistor 8 point
XBC-DR30SU AC100~220V power supply, DC 24V input 18 point, relay output 12 point
XBC-DN30S(U) AC100~220V power supply, DC 24V input 18 point, transistor output 12 point
XBC-DP30SU AC100~220V power supply, DC 24V input 18 point, transistor output 12 point
XBC-DR40SU AC100~220V power supply, DC 24V input 24 point, relay output 16 point
XBC-DN40SU AC100~220V power supply, DC 24V input 24 point, transistor output 16 point
XBC-DP40SU AC100~220V power supply, DC 24V input 24 point, transistor output 16 point
XBC-DR60SU AC100~220V power supply, DC 24V input 36 point, relay output 24 point
Main Unit

XBC-DN60SU AC100~220V power supply, DC 24V input 36 point, transistor output 24 point
XBC-DP60SU AC100~220V power supply, DC 24V input 36 point, transistor output 24 point
XBC-DR10E AC100~220V power supply, DC 24V input 6 point, relay output 4 point
XBC-DR14E AC100~220V power supply, DC 24V input 8 point, relay output 6 point
XBC-DR20E AC100~220V power supply, DC 24V input 12 point, relay output 8 point
XBC-DR30E AC100~220V power supply, DC 24V input 18 point, relay output 12 point
XBC-DN10E AC100~220V power supply, DC 24V input 6 point, transistor output 4 point
XBC-DN14E AC100~220V power supply, DC 24V input 8 point, transistor output 6 point
XBC-DN20E AC100~220V power supply, DC 24V input 12 point, transistor output 8 point
XBC-DN30E AC100~220V power supply, DC 24V input 18 point, transistor output 12 point
XBC-DP10E AC100~220V power supply, DC 24V input 6 point, transistor output 4 point
XBC-DP14E AC100~220V power supply, DC 24V input 8 point, transistor output 6 point
XBC-DP20E AC100~220V power supply, DC 24V input 12 point, transistor output 8 point
XBC-DP30E AC100~220V power supply, DC 24V input 18 point, transistor output 12 point
XBM-DN16S DC24V Power supply, DC24V Input 8 point, Transistor output 8 point
XBM-DN32S DC24V Power supply, DC24V Input 16 point, Transistor output 16 point
XBM-DR16S DC24V Power supply, DC24V Input 8 point, Relay output 8 point
XBE-DC08A DC24V Input 8 point
XBE-DC16A/B DC24V Input 16 point
XBE-DC32A DC24V Input 32 point
XBE-RY08A Relay output 8 point
Expansion Module

XBE-RY08B Relay output 8 point (independent point)


XBE-RY16A Relay output 16 point
XBE-TN08A Transistor output 8 point
XBE-TN16A Transistor output 16 point
XBE-TN32A Transistor output 32 point
XBE-TN64A Transistor output 64 point (sink type)
XBE-TP16A Transistor output 16 point (source type)
XBE-TP32A Transistor output 32 point (source type)
XBE-DR16A DC24V Input 8 point, Relay output 8 point

2-3
Chapter 2 System Configuration

Types Model Description Remark


XBF-AD04A Current/Voltage input 4 channel
XBF-AD04C Current/Voltage input 4 channel, High resolution
XBF-DC04A Current output 4 channel
XBF-DC04C Voltage output 4 channel, High resolution
XBF-DV04A Voltage output 4 channel
Special Module

XBF-DV04C Current output 4 channel, High resolution


XBF-AH04A Current/voltage input 2 channel, output 2 channel
XBF-RD04A RTD (Resistance Temperature Detector) input 4 channel
XBF-TC04S TC (Thermocouple) input 4 channel
XBF-TC04RT Temperature controller module (RTD input, 4 roof)
XBF-TC04TT Temperature controller module (TC input, 4 roof)
XBF-AD08A Current/voltage input 8 channel
XBF-PD02A 2 axes, line driver type
XBF-HD02A High Speed Counter 2channel, line driver type
XBF-HO02A High Speed Counter 2channel, open collector type
XBL-C21A Cnet (RS-232C/Modem) I/F
XBL-C41A Cnet (RS-422/485) I/F
XBL-EMTA Enet I/F
Communication

XBL-EIMT/F/H RAPIEnet I/F


Module

XBL-EIPT EtherNet/IP module


XBL-CMEA CANopen Master
XBL-CSEA CANOpen Slave
XBL-PMEC Profibus-DP, Master
XBL-PSEA Profibus-DP, Slave
XBL-DSEA DeviceNet, Slave
XBO-AD02A Current/voltage input 2channel
XBO-DA02A Current/voltage output 2 channel
XBO-AH02A Current/Voltage input 1 channel, output 1 channel
XBO-RD01A RTD input 1 channel
Module
Option

XBO-TC02A Thermocouple input 2 channel


XBO-DC04A DC 24V input 4 point(High speed counter is available on “SU ”type)
Sink type transistor output 4 channel
XBO-TN04A (Positioning is available on slot 9 of “SU ”type)
XBO-RTCA RTC module(available on slot 9)
XBO-M2MB Memory module
PMC-310S Connection cable (PC to PLC), 9pin(PC)-6pin(PLC)
cable

USB-301A Connection cable (PC to PLC), USB

Note
Download Cable (PMC-310S) Diagram

2-4
Chapter 2 System Configuration

2.3 Classification and Type of Product Name


2.3.1 Classification and type of basic unit
Name of basic unit is classified as follows.

X B M - D R XX S
XGB PLC economy (E)

XGB PLC standard (S)


XGB PLC XGB PLC High-end type (H)

No. of IO point
MK language supported (B)
IEC language supported (E)
Relay output (R)

Sink type transistor output (N)


Module type basic unit (M)
Source type transistor output (P)
Compact type basic unit(C)

DC input

2-5
Chapter 2 System Configuration

Classification Name DC input Relay output Transistor output Power

XBM-DR16S 8 point 8 point None


Modular type
XBM-DN16S 8 point None 8 point DC24V
main unit
XBM-DN32S 16 point None 16 point

XBC-DR32H 16 point 16 point None

XBC-DN32H 16 point None 16 point

XBC-DR64H 32 point 32 point None

XBC-DN64H 32 point None 32 point

XBC-DN20S(U) 12 point None 8 point

XBC-DN30S(U) 18 point None 12 point

XBC-DN40SU 24 point None 16 point

XBC-DN60SU 36 point None 24 point

XBC-DP20SU 12 point None 8 point

XBC-DP30SU 18 point None 12 point

XBC-DP40SU 24 point None 16 point

XBC-DP60SU 36 point None 24 point

XBC-DR20SU 12 point 8 point None

XBC-DR30SU 18 point 12 point None


Compact type
None AC110V~220V
main nit XBC-DR40SU 24 point 16 point

XBC-DR60SU 36 point 24 point None

XBC-DR10E 6 point 4 point None

XBC-DR14E 8 point 6 point None

XBC-DR20E 12 point 8 point None

XBC-DR30E 18 point 12 point None

XBC-DN10E 6 point None 4 point

XBC-DN14E 8 point None 6 point

XBC-DN20E 12 point None 8 point

XBC-DN30E 18 point None 12 point

XBC-DP10E 6 point None 4 point

XBC-DP14E 8 point None 6 point

XBC-DP20E 12 point None 8 point

XBC-DP30E 18 point None 12 point

2-6
Chapter 2 System Configuration

2.3.2 Classification and type of expansion module

Name of expansion module is classified as follows.

X B E - DC XX A

XGB series No. of IO point

I/O expansion module Relay output(RY)

Transistor output (TN/TP)

Digital input (DC)

Digital input+ sink type transistor output (DN)

Digital input+ source type transistor output (DP)

Name DC input Relay output Transistor output Reference

XBE-DC08A 8 point None None

XBE-DC16A/B 16 point None None

XBE-DC32A 32 point None None

XBE-RY08A/B None 8 point None

XBE-RY16A None 16 point None

XBE-TN08A None None 8 point

XBE-TN16A None None 16 point Sink type

XBE-TN32A None None 32 point

XBE-TP08A None None 8 point

XBE-TP16A None None 16 point Source type

XBE-TP32A None None 32 point

XBE-DR16A 8 point 8 point None

2-7
Chapter 2 System Configuration

2.3.3 Classification and type of special module

Special module is classified as follows.

X B F - AD XX A

Non-insulation type (A)

Insulation type (S)


XGB series
High resolution (C)

Expansion special module No. of IO point

Analog input (AD)

Analog voltage output (DC)

Analog current output (DV)

Voltage, current I/O (AH)

RTD input (RD)

Thermocouple input (TC)


Position (PD)
High Speed Counter (HD, HO)

No. of No. of
Classification Name Input type Output type
input ch. output ch.
XBF-AD04A/C 4 Voltage/Current None -
Analog input
XBF-AD08A 8 Voltage/Current None

XBF-DC04A/C None - 4 Current


Analog output
XBF-DV04A/C None - 4 Voltage

XBF-RD04A 4 PT100/JPT100 None -


RTD input
XBF-RD01A 1 PT100/JPT100 None -

XBF-TC04S 4 K, J, T, R None -

TC input XBF-TC04RT 4 PT100/JPT100 4 Transister

XBF-TC04TT 4 K, J, T, R 4 Transister

Positioning XBF-PD02A - Line Driver 2 Voltage

High Speed XBF-HD02A 2 Line Driver


Counter XBF-HO02A 2 Open Collector

2-8
Chapter 2 System Configuration

2.3.4 Classification and type of communication module

Name of communication module is classified as follows.

X B L - C21A

Cnet 1 channel (RS-232C): C21A


XGB series Cnet 1 channel (RS-422/485): C41A

FEnet 1 port: EMTA

RAPIEnet 2 port: EIMT/F/H


Expansion communication module
EtherNet/IP 2 port: EIPT

CANopen Master: CMEA


CANopen Slave: CSEA

Classification Name Type


XBL-C21A RS-232C, 1 channel
Cnet Comm. Module
XBL-C41A RS-422/485, 1 channel
FEnet Comm. Module XBL-EMTA Electricity, open type Ethernet
XBL- Comm. Module between PLCs, electric media,
RAPIEnet Comm. Module
EIMT/EIMF/EIMH 100 Mbps industrial Ethernet supported
EtherNet Comm. Module XBL-EIPT Open EtherNet I/P
XBL-CMEA CANopen Master
CANopen Comm. Module
XBL-CSEA CANopen Slave
XBL-PMEC Profibus-DP Master
Pnet Comm. Module
XBL-PSEA Profibus-DP Slave
Dnet Comm. Module XBL-DSEA DeviceNet Slave

2-9
Chapter 2 System Configuration

2.3.5 Classification and type of option module

Name of option module is classified as follows.

X B O - AD XX A

XGB PLC No. of IO point

Memory capacity

Option module DC input (DC)

TR output (TN)

Analog input (AD)

Analog output (DA)

Voltage, current I/O (AH)

RTD input (RD)

Thermocouple input (TC)

RTC module (RTC)

Memory module (M)

No. of input No. of


Classification Name Input type Output type
CH output CH
DC input XBO-DC04A 4 DC 24V None -
TR output XBO-TN04A None - 4 DC 24V
Analog input XBO-AD02A 2 Voltage/current None
Analog output XBO-DA02A None - 2 Voltage/current
Analog I/O XBO-AH02A 1 Voltage/current 1 Voltage/current
RTD input XBO-RD01A 1 PT100/JPT100 None -
TC input XBO-TC02A 2 K, J None -
RTC module XBO-RTCA None - None -
Memory module XBO-M2MB None - None -

2-10
Chapter 2 System Configuration

2.4 System Configuration


2.4.1 Cnet I/F system

Cnet I/F System is used for communication between the main unit and external devices using RS-
232C/RS-422 (485) Interface. The XGB series has a built-in RS-232C port, RS-485 port
For “E” type, only one communication port between RS-232C and RS-485 can be used and you can
specify at parameter setting window. For “S” type, RS-232C and RS-485 can be used independently
and add RS-232C dedicated Cnet I/F module (XBL-C21A) and RS-422/485 dedicated Cnet I/F module
(XBL-C41A). It is possible to configure the following communication system on demand

(1) 1:1 communication system

(a) 1:1 communication of an external device (computer) with main unit using a built-in port
(RS-232C/RS-485)

XBC-DN30S(U)

RS-232C / RS-485

(b) 1:1 communication with main unit using a built-in RS-485 port
(In case of built-in RS-232C,it is for connecting to HMI device.)

Built-in RS-485 Connection

XBC-DN30S(U) XBC-DN30S(U)

PADT
connection

Built-in RS-232C Connection

XP30-TTA

2-11
Chapter 2 System Configuration

(c) 1:1 RS-232C Communication with remote device via modem by Cnet I/F modules

XBC-DN30S(U) XBL-C21A XBM-DN32S XBL-C21A

Modem
Modem

XBC-DN30S(U) XBL-C21A

Modem

Modem

(d) 1:1 communication of an external device (monitoring unit) with main unit using a built-in RS-
232C/485 port.
XBC-DN30S(U)

XP30-TTA

Built-in RS-232C/485 connection

2-12
Chapter 2 System Configuration

(2) 1:n Communication system

(a) Using RS-485 built-in function can connect between one computer and multiple main units for up
to 32 stations.
XBC-DN30S(U) XBM-DN32S
XBC-DN30S(U)

PADT
Connection
Max. 32 stations

Built-in RS-232C connection


XBC-DN30S(U)

(b) Using RS-485 built-in function/expansion Cnet I/F module can be connect for up to 32 stations.

Max. 32 stations

XBC-DN30S(U) XBL-C41A XBC-DN30S(U) XBL-C41A

PADT
connection

Max. 32 stations
Built-in RS-232C connection

Note

1) Refer to ‘XGB Cnet I/F user manual’ for details

2-13
Chapter 2 System Configuration

2.4.2 Ethernet system

Ethernet made by cooperation of Xerox, Intel, DEC is standard LAN connection method (IEEE802.3),
which is network connection system using 1.5KB packet with 100Mbps transmission ability. Since
Ethernet can combine a variety of computer by network, it is called as standard specification of LAN and
diverse products. By adopting CSMA/CD method, it is easy to configure the network and collect large
capacity data.

Router or gateway
Hub

Public line

Hub
Router or gateway
H
HMI
Hub Hub

100Base-TX
HMI

Note

1) Refer to ‘XGB FEnet I/F user manual’ for details

2-14
Chapter 3 General Specifications

Chapter 3 General Specifications

3.1 General Specifications

The General specification of XGB series is as below.

No. Items Specification Reference


1 Ambient Temp. 0 ~ 55 °C
2 Storage Temp. −25 ~ +70 °C
3 Ambient humidity 5 ~ 95%RH (Non-condensing) -
4 Storage humidity 5 ~ 95%RH (Non-condensing)
Occasional vibration -
Frequency Acceleration Amplitude Times
10 ≤ f < 57Hz − 0.075mm
57 ≤ f ≤ 150Hz −
2
Vibration 9.8m/s (1G) 10 times
5
resistance Continuous vibration each
Frequency Acceleration Amplitude direction
IEC61131-2
10 ≤ f < 57Hz − 0.035mm (X,Y and Z)
57 ≤ f ≤ 150Hz −
2
4.9m/s (0.5G)
• Peak acceleration : 147 m/s (15G)
2

6 Shock resistance • Duration : 11ms


• Half-sine, 3 times each direction per each axis
Square wave AC: ±1,500 V
LSIS standard
impulse noise DC: ±900 V
Electrostatic IEC61131-2
Voltage: 4kV (Contact discharge)
discharge IEC61000-4-2
Radiated
7 Noise resistance IEC61131-2,
electromagnetic 80 ~ 1,000 MHz, 10V/m
IEC61000-4-3
field noise
Power supply Digital/Analog Input/Output,
Fast transient Segment IEC61131-2
module Communication Interface
/Burst noise IEC61000-4-4
Voltage 2kV 1kV
8 Environment Free from corrosive gases and excessive dust
9 Altitude Up to 2,000 ms
-
10 Pollution degree 2 or less
11 Cooling Air-cooling

Notes

1) IEC (International Electrotechnical Commission):


An international nongovernmental organization which promotes internationally cooperated standardization in
electric/electronic field, publishes international standards and manages applicable estimation system related
with.
2) Pollution degree:
An index indicating pollution degree of the operating environment which decides insulation performance of the
devices. For instance, Pollution degree 2 indicates the state generally that only non-conductive pollution occurs.
However, this state contains temporary conduction due to dew produced.

3-1
Chapter 4 CPU Specifications

Chapter 4 CPU Specifications


4.1 Performance Specifications
The following table shows the general specifications of the XGB compact type CPU
(XBC-Dx10/14/20/30E).
Specifications (“E” type)
XBC-DR10E XBC-DR14E XBC-DR20E XBC-DR30E
Items Remark
XBC-DN10E XBC-DN14E XBC-DN20E XBC-DN30E
XBC-DP10E XBC-DP14E XBC-DP20E XBC-DP30E

Program control method Reiterative operation, fixed cycle operation, constant scan

Scan synchronous batch processing method (Refresh method),


I/O control method
Directed by program instruction
Program language Ladder Diagram, Instruction List
Number of Basic 28
instructions Application 677
Processing speed
0.24 ㎲/Step
(Basic instruction)
Program capacity 4 k steps
14 point 18 point 28 point 38 point -
Max. I/O points
Main + 1 option Main + 1 option Main + 2 options Main + 2 options

P P0000 ~ P127F (2,048 point)


M M0000 ~ M255F (4,096 point)
K K00000 ~ K2559F (Special area: K2600~2559F) (40,960 point)
L L00000 ~ L1279F (20,480 point)
F F000 ~ F255F (4,096 point)
100ms, 10ms, 1ms : T000 ~ T255 (256 point)
T
(Adjustable by parameter setting)
Data area
C C000 ~ C255 (256 point)
S S00.00 ~ S127.99
D D0000 ~ D5119 (5120 word)

U00.00 ~ U07.31
U Word
(Analog data refresh area: 256 word, analog data refresh area)

Z Z000~Z127 (128 Word)


Total program 128
Initial task 1
Cyclic task Max. 8
I/O task Max. 4
Internal device task Max. 8 -
Operation mode RUN, STOP, DEBUG
Self-diagnosis function Detects errors of scan time, memory, I/O
Program port RS-232C (Loader)
Back-up method Latch area setting in basic parameter

4- 1
Chapter 4 CPU Specifications

Specifications (“E” type)


XBC-DR10E XBC-DR14E XBC-DR20E XBC-DR30E
Items Remark
XBC-DN10E XBC-DN14E XBC-DN20E XBC-DN30E
XBC-DP10E XBC-DP14E XBC-DP20E XBC-DP30E
250mA 280mA 350mA 470mA
Internal consumption current 180mA 190mA 200mA 210mA
180mA 190mA 200mA 210mA
330g 340g 450g 465 g
Weight 313g 315g 418g 423g
313g 315g 418g 423g

4- 2
Chapter 4 CPU Specifications

The following table shows the general specifications of the XGB compact type CPU (XBC-DN20/30S).

Specifications (“S” type)


Items Remark
XBC-DN20S XBC-DN30S

Program control method Reiterative operation, fixed cycle operation, constant scan

Scan synchronous batch processing method (Refresh method),


I/O control method
Directed by program instruction
Program language Ladder Diagram, Instruction List
Number of Basic 28
instructions Application 687
Processing speed
94 ns/Step
(Basic instruction)
Program capacity 15 k steps
-
Max. I/O points 244 point (Main + Expansion 7 stages) 254 point (Main + Expansion 7 stages)

P P0000 ~ P1023F (16,384 point)


M M0000 ~ M1023F (16,384 point)
K K0000 ~ K4095F (65,536 point)
L L0000 ~ L2047F (32,768 point)
F F0000 ~ F1023F (16,384 point)
100ms, 10ms, 1ms : T0000 ~ T1023 (1,024 point)
T
Data area (Adjustable by parameter setting)
C C0000 ~ C1023 (1,024)
S S00.00 ~ S127.99
D D0000 ~ D10239 (10,240 word)
U U00.00 ~ U0A.31 (Analog data refresh area: 352 word)
Word
Z Z000~Z127 (128 Word)
R R0000~R10239 (10,240 word)
Total program 128
Initial task 1
Cyclic task Max. 8
I/O task Max. 8
Internal device task Max. 8
Operation mode RUN, STOP, DEBUG -
Self-diagnosis function Detects errors of scan time, memory, I/O
Program port RS-232C 1 channel
Back-up method Latch area setting in basic parameter
Internal consumption current 240 mA 255 mA
Weight 470g 475g

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Chapter 4 CPU Specifications

The following table shows the general specifications of the XGB compact type CPU
(XBC-Dx20/30/40/60SU).

Specifications (“SU” type)


Items XBC-DR20SU XBC-DR30SU XBC-DR40SU XBC-DR60SU Remark
XBC-DN20SU XBC-DN30SU XBC-DN40SU XBC-DN60SU
XBC-DP20SU XBC-DP30SU XBC-DP40SU XBC-DP60SU
Program control method Reiterative operation, fixed cycle operation, constant scan
Scan synchronous batch processing method (Refresh method),
I/O control method
Directed by program instruction
Program language Ladder Diagram, Instruction List
Number of Basic 28
instructions Application 687
Processing speed
94 ns/Step
(Basic instruction)
Program capacity 15 k steps
244 point 254 point 264 point 284 point
Max. I/O points (Main + Expansion (Main + Expansion (Main + Expansion (Main + Expansion -
7 stages) 7 stages) 7 stages) 7 stages)
P P0000 ~ P1023F (16,384 point)
M M0000 ~ M1023F (16,384 point)
K K0000 ~ K4095F (65,536 point)
L L0000 ~ L2047F (32,768 point)
F F0000 ~ F1023F (16,384 point)
100ms, 10ms, 1ms : T0000 ~ T1023 (1,024 point)
T
Data area (Adjustable by parameter setting)
C C0000 ~ C1023 (1,024)
S S00.00 ~ S127.99
D D0000 ~ D10239 (10,240 word)
U U00.00 ~ U0A.31 (Analog data refresh area: 352 word)
Word
Z Z000~Z127 (128 Word)
R R0000~R10239 (10,240 word)
Total program 128
Initial task 1
Cyclic task Max. 8
I/O task Max. 8
Internal device task Max. 8 -
Operation mode RUN, STOP, DEBUG
Self-diagnosis function Detects errors of scan time, memory, I/O
Program port RS-232C 1 channel, USB 1 channel
Back-up method Latch area setting in basic parameter

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Chapter 4 CPU Specifications

Specifications (“SU” type)

Items XBC-DR20SU XBC-DR30SU XBC-DR40SU XBC-DR60SU Remark


XBC-DN20SU XBC-DN30SU XBC-DN40SU XBC-DN60SU
XBC-DP20SU XBC-DP30SU XBC-DP40SU XBC-DP60SU
478 mA 626 mA 684 mA 942 mA
Internal consumption current 252 mA 310 mA 288 mA 340 mA
305 mA 352 mA 355 mA 394 mA
514g 528g 594g 804g
Weight 475g 476g 578g 636g
442g 446g 544g 717g

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Chapter 4 CPU Specifications

Specifications
Items Remark
“E” type “S(U)” type
Controlled by instructions, Auto-tuning, PWM output,
Supported
Forced output, Adjustable operation scan time, Anti Windup, Delta
PID control function in “S(U)”
MV function, SV-Ramp function type
Max. 16 loops are supported
Dedicated protocol support
MODBUS protocol support
User defined protocol support
Cnet I/F function Select one port between RS-
RS-232C 1 port, RS-485 1 port
232C 1 port, RS-485 1 port by
respectively
parameter
1 phase: 100 kHz 2 channel,
1 phase: 4 kHz 4 channel 20kHz 6 channel
Capacity 2 phase: 2 kHz 2 channel 2 phase: 50 kHz 1 channel,
8kHz 3 channel
4 different counter modes according to input pulse and
addition/subtraction method
High-speed counter

• 1 phase pulse input: addition/subtraction counter


• 1 phase pulse input: addition/subtraction counter by B
Counter phase
mode • 2 phase pulse input: addition/subtraction counter
• 2 phase pulse input:
• 2 phase pulse input:
addition/subtraction by
addition/subtraction by rising
rising/falling pulse phase
pulse phase differences
differences
• Internal/External preset function
Built-in function

Additional • Latch counter function


function • Comparison output function
• Revolution number per unit time function
No. of control axis: 2 axes
Control method: position/speed control
Control unit: pulse
Basic function
Positioning data: 80 data/axis (operation step No. 1~80)
Operation mode: End/Keep/Continuous
Positioning function

Operation method: Single, Repeated operation


Positioning method: Absolute / Incremental Supported
in “S(U)”
Positioning Address range: -2,147,483,648 ~ 2,147,483,647 type
function Speed: Max. 100kpps(setting range 1 ~ 100,000pps) transistor
Acceleration / Deceleration method : trapezoidal method output
By Home and DOG (Off)
Return to Origin By Home and DOG (On)
By DOG
JOG operation Setting range: 1~100,000 ( High / Low speed)
Additional Inching operation, Speed synchronizing operation, Position
function synchronizing operation, linear interpolation operation etc.
10 ㎲ 2 point
50 ㎲ (P0000 ~ P0001)
Pulse catch
4 point (P0000 ~ P0003) 50 ㎲ 6 point
(P0002 ~ P0007)
10 ㎲ 2 point -
4 point: 50 ㎲ (P0000 ~ P0001)
External interrupt
(P0000 ~ P0003) 50 ㎲ 6 point
(P0002 ~ P0007)
Input filter Select among 1,3,5,10,20,70,100 ㎳ (Adjustable)

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Chapter 4 CPU Specifications

4.2 Names of Part and Function

“E” Type
⑧ ③


⑪ ⑪

⑤ ⑩


⑨ ④

No. Name Description

① Input indicator LED ▪ Input indicator LED


PADT connecting ▪ PADT connector

connector RS-232C 1 channel
③ Input terminal block ▪ Input terminal block
④ Output terminal block ▪ Output terminal block
▪ Sets the operation mode of main unit
RUN/STOP mode STOP → RUN: execute operation of program
⑤ switch RUN → STOP: stop operation of program
(In case of STOP, remote mode is available)
⑥ Output indicator LED ▪ Output indicator LED
It indicates CPU module’s status.
▪ PWR(Red on): Power status
⑦ Status indicator LED
▪ RUN(Green on): RUN status
▪ Error(Red flickering): In case of error, it is flickering.
Built-in communication
⑧  Built-in RS-232C/485 connecting connector
Connecting connector
Power supply
⑨ ▪ AC100~240V power supply connector
connector
▪ Dip switch for setting O/S download/Operation mode
⑩ OS mode dip switch On: Boot mode, available to download O/S
Off: User mode, available to download program using PADT
⑪ Option board holder ▪For connection option board

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Chapter 4 CPU Specifications

“S” Type
⑧ ③


⑥ ⑪ ⑪



⑨ ④
No. Name Description

① Input indicator LED ▪ Input indicator LED


PADT connecting ▪ PADT connector

connector RS-232C 1 channel
③ Input terminal block ▪ Input terminal block
④ Output terminal block ▪ Output terminal block
▪ Sets the operation mode of main unit
RUN/STOP mode STOP → RUN: execute operation of program
⑤ switch RUN → STOP: stop operation of program
(In case of STOP, remote mode is available)
⑥ Output indicator LED ▪ Output indicator LED
It indicates CPU module’s status.
▪ PWR(Red on): Power status
⑦ Status indicator LED
▪ RUN(Green on): RUN status
▪ Error(Red flickering): In case of error, it is flickering.
Built-in communication
⑧  Built-in RS-232C/485 connecting connector
Connecting connector
Power supply
⑨ ▪ AC100~240V power supply connector
connector
▪ Dip switch for setting O/S download/Operation mode
⑩ OS mode dip switch On: Boot mode, available to download O/S
Off: User mode, available to download program using PADT
⑪ Option board holder ▪ For connection option board

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Chapter 4 CPU Specifications

“SU” Type

⑧ ③


⑥ ⑪ ⑪



⑨ ④
No. Name Description

① Input indicator LED ▪ Input indicator LED


PADT connecting ▪ PADT connector

connector RS-232C 1 channel, USB 1 channel
③ Input terminal block ▪ Input terminal block
④ Output terminal block ▪ Output terminal block
▪ Sets the operation mode of main unit
RUN/STOP mode STOP → RUN: execute operation of program
⑤ switch RUN → STOP: stop operation of program
(In case of STOP, remote mode is available)
⑥ Output indicator LED ▪ Output indicator LED
It indicates CPU module’s status.
▪ PWR(Red on): Power status
⑦ Status indicator LED
▪ RUN(Green on): RUN status
▪ Error(Red flickering): In case of error, it is flickering.
Built-in communication
⑧  Built-in RS-232C/485 connecting connector
Connecting connector
Power supply
⑨ ▪ AC100~240V power supply connector
connector
▪ Dip switch for setting O/S download/Operation mode
⑩ OS mode dip switch On: Boot mode, available to download O/S
Off: User mode, available to download program using PADT
⑪ Option board holder ▪For connection option board

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Chapter 4 CPU Specifications

4.3 Power Supply Specifications


It describes the power supply specification of main unit.

Specification
Items XBC- XBC- XBC- XBC- XBC- XBC-
Dx10/14E Dx20/30E Dx20S(U) Dx30S(U) Dx40SU Dx60SU

Rated voltage
AC 100 ~ 240 V
(UL warranty voltage)

Input voltage range AC85~264V(-15%, +10%)

Inrush current 50APeak or less


Input
Input current 0.5A or less (220V), 1A or less (110V)

Efficiency 65% or more


Permitted momentary
Less than 10 ㎳
power failure

Rated DC5V 500mA 800mA 1.5A 1.5A 2.0A 2.5A

Output output DC24V 0.2A 0.2A 0.3A 0.3A 0.3A 0.5A

Output voltage ripple DC5V (±2%)

Power supply status indication LED On when power supply is normal


2
Cable specification 0.75 ~ 2 mm
* Use the power supply which has 4 A or more fuse for protecting power supply.

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Chapter 4 CPU Specifications

1) Consumption current (DC 5V)

Type Model Consumption current (Unit : ㎃)


XBM-DR16S 400
XBM-DN16S 250
XBM-DN32S 280
XBC-DR32H 660
XBC-DR64H 1,040
XBC-DN32H 260
XBC-DN64H 330
XBC-DN30S 255
XBC-DN20S 240
XBC-DN20SU 252
XBC-DN30SU 270
XBC-DN40SU 288
XBC-DN60SU 340
XBC-DP20SU 305
XBC-DP30SU 352
XBC-DP40SU 355
Main unit XBC-DP60SU 394
XBC-DR20SU 478
XBC-DR30SU 626
XBC-DR40SU 684
XBC-DR60SU 942
XBC-DR30E 470
XBC-DR20E 350
XBC-DR14E 280
XBC-DR10E 250
XBC-DN30E 210
XBC-DN20E 200
XBC-DN14E 190
XBC-DN10E 180
XBC-DP30E 210
XBC-DP20E 200
XBC-DP14E 190
XBC-DP10E 180
XBE-DC32A 50
XBE-DC16A/B 30
XBE-DC08A 20
XBE-RY16A 440
XBE-RY08A/B 240
XBE-TN32A 80
Expansion I/O module
XBE-TN16A 50
XBE-TN08A 40
XBE-TP32A 80
XBE-TP16A 50
XBE-TP08A 40
XBE-DR16A 250

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Chapter 4 CPU Specifications

Type Model Consumption current (Unit : ㎃)


XBF-AD04A 120
XBF-AD08A 105
XBF-AH04A 120
XBF-DV04A 110
XBF-DC04A 110
XBF-RD04A 100
Expansion special module XBF-TC04S 100
XBF-PD02A 500
XBF-HD02A 260
XBF-HO02A 200
XBF-AD04C 100
XBF-DC04C 160
XBF-DV04C 160
XBL-C21A 120
XBL-C41A 120
XBL-EMTA 300
XBL-EIMT 280
Expansion communication module XBL-EIMF 670
XBL-EIMH 480
XBL-EIPT 290
XBL-CMEA 211
XBL-CSEA 202
XBO-DC04A 80
XBO-TN04A 100
XBO-AD02A 50
XBO-DA02A 150
Option module XBO-AH02A 150
XBO-RD01A 30
XBO-TC02A 50
XBO-RTCA 30
XBO-M2MB -

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Chapter 4 CPU Specifications

4.4 Calculation Example of Consumption Current/Voltage


Calculate the consumption current and configure the system not to exceed the output current capacity of
basic unit.

(1) XGB PLC configuration example 1


Consumption of current/voltage is calculated as follows.
Internal 5V
consumption
Type Model Unit No. Remark
current
(Unit : ㎃)
Main unit XBC-DN20S 1 240
In case contact points are On.
XBE-DC32A 2 50
(Maximum consumption current)
XBE-TN32A 2 80
Expansion
XBF-AD04A 1 120
module
All channel is used.
XBF-DC04A 1 110
(Maximum consumption current)
XBL-C21A 1 110
Consumption
850 ㎃ -
current
Consumption
4.25 W 0.85 * 5V = 4.25W
voltage

In case system is configured as above, since 5V consumption current is total 850mA and 5V output of XGB
standard type main unit is maximum 1.5A, normal system configuration is available.

(2) XGB PLC configuration example 2


Internal 5V
consumption
Type Model Unit No. Remark
current
(Unit : ㎃)
Main unit XBC-DN30S 1 255
In case all contact points are On.
XBE-DR16A 2 250
(Maximum consumption current)
Expansion XBE-RY16A 2 440
module XBF-AD04A 2 120 All channel is used.
XBL-C21A 1 110 (Maximum consumption current)
Consumption
1,985 ㎃ -
current
Consumption
9.925 W 1.985ⅹ 5V = 9.925W
voltage

If system is configured as above, total 5V current consumption is exceeded 1,985 mA and it exceeds the 5V
output of XGB standard type main unit. Normal system configuration is not available. Although we assume
the above example that all contact points are on, please use high-end type main unit which 5V output
capacity is higher than standard type main unit.

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Chapter 4 CPU Specifications

(3) XGB PLC configuration example 3


Internal 5V
consumption
Type Model Unit No. Remark
current
(Unit : ㎃)
Main unit XBC-DN32H 1 260
In case of all contact points are
XBE-DR16A 2 250 On.
(Maximum consumption current)
Expansion XBE-RY16A 2 440
module XBF-AD04A 2 120 All channel is used.
XBL-C21A 1 110 (Maximum consumption current)
Consumption
1,990 ㎃ -
current
Consumption
9.95 W 1.99A ⅹ 5V = 9.95W
voltage

The above system is an example using XBC-DN32H about system example (2). Unlike (2) example, 5V
output capacity of XBC-DN32H is maximum 2A, normal configuration is available.

4.5 Data Backup Time


When RTC module is not installed with main unit, data is kept by super capacitor.
The following table shows the data backup time of the main unit,

Type Data backup time Remark


XBC backup by the Capacitor 18 Days
“S” type
“SU” type RTC module installed 3 Yeas
At normal temperature (25℃)
XBC backup by the Capacitor 5 Days
“E” type RTC module installed 3 Yeas

But charge super capacitor enough while power is on over 30 minute.

In case super capacitor is not charged enough or power is off more than data backup time, latch data is
not kept and warning occurs. At this time, phenomenon and measure are as follows.

(1) Phenomenon
(a) RUN mode
1) In case of Remote Run mode, operation mode changes to Stop mode. In case of Local Run
mode, it operates normally with abnormal data backup warning
2) In case of Stop mode, abnormal data backup warning occurs.
(b) Latch data
1) Latch area 1,2 : all data are cleared into “0”.
2) K area, F area : all data are cleared into “0”.
(2) Measure
(a) In case abnormal data backup warning occurs when turning off and turning on within data backup
time, technical assistance of main unit is necessary. Be careful data backup time is getting shorter at
high temperature.

Notice

Above data backup time can be different according to temperature condition.

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Chapter 5 Program Configuration and Operation Method

Chapter 5 Program Configuration and Operation Method

5.1 Program Instruction


5.1.1 Program execution methods
(1) Cyclic operation method (Scan)
This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared
program from the beginning to the last step, which is called ‘program scan’. The series of processing like
this is called ‘cyclic operation method’. The processing is divided per stage as below.

Stage Processing description

Start -

 A stage to start the scan processing which is executed once


when power is applied or Reset is executed, as below.
Initialization processing I/O module reset
Self-diagnosis execution
Data clear
Address allocation of I/O module and type register
 If initializing task is designated, Initializing program is executed.

 Reads the state of input module and saves it in input image


Input image area refresh area before starting the operation of program.

Program operation processing

Program start  Performs the operation in order from the program start to last
step.

Program last step

 Performs the operation in order from the program start to last step.
Output image area refresh

 A processing stage to return to the first step after CPU module


completes 1 scan processing and the processing performed is as
END below.
Update the current value of timer and counter etc.
User event, data trace service
Self-diagnosis
High speed link, P2P e-Service
Check the state of key switch for mode setting

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Chapter 5 Program Configuration and Operation Method

(2) Interrupt operation (Cycle time, Internal device)


This is the method that stops the program operation in proceeding temporarily and carries out the
operation processing which corresponds to interrupt program immediately in case that there occurs the
status to process emergently during PLC program execution.
The signal to inform this kind of urgent status to CPU module is called ‘interrupt signal’. There is a Cycle
time signal that operates program every appointed time and external interrupt signal that operates program
by external contact (“S” type: P000~P007, “E” type: P000~P003). Besides, there is an internal device start
program that starts according to the state change of device assigned inside.
(3) Constant Scan (Fixed Period)
This is the operation method that performs the scan program every appointed time. This stands by for a
while after performing all the scan program, and starts again the program scan when it reaches to the
appointed time. The difference from constant program is the update of input/output and the thing to
perform with synchronization.
At constant operation, the scan time indicates the net program processing time where the standby time is
deducted. In case that scan time is bigger than ‘constant’, [F0005C] ‘_CONSTANT_ER’ flag shall be ‘ON’.

5.1.2 Operation processing during momentary power failure


CPU module detects the momentary power failure when input power voltage supplied to power module is
lower than the standard. If CPU module detects the momentary power failure , it carries out the operation
processing as follows.
If momentary power failure within 10 ms is occurred, main unit (CPU) keeps the operation. But, if
momentary power failure above 10 ㎳, the operation is stop and the output is Off. Restart processing
like at power input shall be performed.

(1) Momentary power failure within 10 ms

 CPU keeps the operation.


Input power
Within 10 ms momentary
power failure

(2) Momentary power failure exceeding 10 ms

 Restart processing like at power input shall


Input power be performed.
Momentary power failure exceeding 20ms
momentary power failure exceed

Remark

1) Momentary power failure?


This means the state that the voltage of supply power at power condition designated by PLC is
lowered as it exceeds the allowable variable range and the short time (some ms ~ some dozens ms)
interruption is called ‘momentary power failure’ ).

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Chapter 5 Program Configuration and Operation Method

5.1.3 Scan time


The processing time from program step 0 to the next step 0 is called ‘Scan Time’.

(1) Scan time calculation expression


Scan time is the sum of the processing time of scan program and interrupt program prepared by the user
and PLC internal time, and is distinguished by the following formula.

(a) Scan time = Scan program processing time + Interrupt program processing time + PLC internal
processing time

 Scan program processing time = processing time of user program except interrupt program
 Interrupt program processing time = Sum of interrupt program proceeding time processed during 1 scan
 PLC internal processing time = Self-diagnosis time + I/O refresh time + Internal data processing time
+ Communication service processing time

(b) Scan time depends on whether to execute interrupt program and communication processing.

MPU processing time Expansion interface processing time


Type Executing PLC internal Comm. module
Digital I/O module Analog module
ladder processing (main/expansion)
(32 point, 1 unit) (8 channel, 1 unit)
(4Kstep) time (200 byte, 1 block)
“E” type 5.4 ㎳ 1.0 ㎳ - - 0.5 ㎳
“S” type 3.0 ㎳ 0.5 ㎳ 0.3 ㎳ 3.0 ㎳ 0.8 ㎳

The main unit executes controls along the following steps. A user can estimate the control performance of a
system that the user is to structure from the following calculation.

③I/O data Refresh

②System check & ④Network Service


Task processing
⑤ XG5000 Service

Program ①Ladder Scan Ladder Scan Ladder Scan


Scan
Output
Input

Expansion
Module
Interface
I/O Module Network Module
Data Refresh Data exchange

Scan time = ① Scan program process + ② System check & Task process + ③I/O data Refresh
+ ④ Network Service + ⑤ XG5000 Service + ⑥ User Task Program process

① Scan program process = no. of instruction x process speed per each instruction (refer to XGK/XGB
instruction user manual)
② System check & Task process: 600 ㎲ ~ 1.0 ms [varies depending on the usage of auxiliary functions]
③ XG5000 Service process time: 100 ㎲ at the max data monitor
④ Task Program process time: sum of task processing time that occurs within a scan; the time calculation
by task programs are as same as that of scan program.

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Chapter 5 Program Configuration and Operation Method

(2) Example

The scan time of a system consisting of main unit (program 4kstep) + five 32-point I/O modules + one analog
module + one communication modules (200 byte 1 block)

Scan time(㎲) = ladder execution time + system processing time + digital module I/O processing time +
analog I/O processing time + communication module processing time + XG5000 Service processing time
= (2047 x (0.67(LOAD)+ 0.80(OUT)) + (500) + (300 x 5) + (3000 x 1) + (800 x 1) + (100) ㎲
= 3009 + 500 + 1500 + 3000 + 800 + 100 ㎲ = 8909 ㎲
= 8.9 ㎳
(But, in case of online editing or writing XG-PD parameter, scan time increases temporary up to 100ms)

(3) Scan time monitor


(a) Scan time can be monitored 『Online』-『PLC Information』-『Performance』.

(b) Scan time is save in special relay (F) area as follows.


 F0050: max. value of scan time (unit: 0.1 ms)
 F0051: min. value of scan time (unit: 0.1 ms)
 F0052: current value of scan time (unit: 0.1 ms)

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Chapter 5 Program Configuration and Operation Method

5.1.4 Scan Watchdog timer


WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of
PLC CPU module.

(1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT is set
in Basic parameter of XG5000.

(2) If WDT detects the excess of detection setting time while watching the elapsed time of scan during
operation, it stops the operation of PLC immediately and keeps or clears the output according to
parameter setting

(3) If the excess of Scan Watchdog Time is expected in the program processing of specific part while performing
the user program (FOR ~ NEXT instruction, CALL instruction), clear the timer by using ‘WDT’ instruction.
‘WDT’ instruction initializes the elapsed time of Scan Watchdog Timer and starts the time measurement from
0 again.
(For further information of WDT instruction, please refer to Instruction.)

(4) To clear the error state of watchdog, we can use the following method : power re-supply, manipulation of
manual reset switch, mode conversion to STOP mode.

WDT
count(ms)0 1 2 3 ….. …8 9 0 1 2 … 012… …6 7 0 1 2 …

WDT Reset SCAN END WDT instruction SCAN END


execution

Remark

1) The setting range of Watchdog Timer is 10 ~ 1000ms (Unit: 1ms).

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Chapter 5 Program Configuration and Operation Method

5.1.5 Timer processing

The XGB series use up count timer. There are 5 timer instructions such as on-delay (TON), off-delay (TOFF),
integral (TMR), monostable (TMON), and re-triggerable (TRTG) timer.
The measuring range of 100msec timer is 0.1 ~ 6553.5 seconds, 10msec timer is 0.01 ~ 655.35 seconds,
and that of 1msec timer is 0.001 ~ 65.53 seconds. Please refer to the ‘XG5000 User manual’ for details.

Preset value
Timer output relay
Timer type
(1) On delay timer
The current value of timer starts to increase from 0 when the input condition of TON instruction turns on.
When the current value reaches the preset value (Current value=Preset value), the timer output relay
(Txxxx) turns on. When the timer input condition is turned off, the current value becomes 0 and the timer
output relay is turned off.

Input condition

t0 t1 t2 t3 t4 t5
Output relay

t0+PT t1 t4+PT t5
Preset value

Current value

t0 t1 t2 t3 t4 t5

(2) Off delay timer


The current value of timer set as preset value and the timer output relay is turned on when the input
condition of TOFF instruction turns on. When the input condition is turned off, the current value starts to
decrease. The timer output relay is turned off when the current value reaches 0.

Input condition

t0 t1 t2 t3 t5
Output relay

t0 t1+PT t2 t5+PT
Preset value

Current value
t0 t1 t2 t4 t5

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Chapter 5 Program Configuration and Operation Method

(3) Integral timer


In general, its operation is same as on-delay timer. Only the difference is the current value will not be clear
when the input condition of TMR instruction is turned off. It keeps the elapsed value and restart to
increase when the input condition is turned on again. When the current value reaches preset value, the
timer output relay is turned on.
The current value can be cleared by the RST instruction only.

Timer input
condition
t0 t1 t2 t4 t5

Timer output relay

Preset value PT = (t1-t0)+(t3-t2)

Current value
t0 t1 t2 t3 t5 t5+PT
Timer reset input

(4) Monostable timer


In general, its operation is same as off-delay timer. However, the change of input condition is ignored
while the timer is operating (decreasing). When current value reaches preset value the timer output relay
is turned off and current value is cleared.

Timer input
condition
t0 t1 t2 t3 t4

Timer output relay


t0 t0+PT t2 t2+PT t4 t4+PT
Preset value

Current value
t0 t1 t2 t4

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(5) Retriggerable timer


The operation of retriggerable timer is same as that of monostable timer. Only difference is that the
retriggerable timer is not ignore the input condition of TRTG instruction while the timer is operating
(decreasing). The current value of retriggerable timer will be set as preset value whenever the input
condition of TRTG instruction is turned on.

Timer input condition


(정 T t3

Timer output relay


t2
Preset value (PV)

Current value (ET)


t0 t0+PT t3

Remark
The Maximum timer error of timers of XGB series is ‘1 scan time + the time from 0 step to timer
instruction’

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5.1.6 Counter processing

The counter counts the rising edges of pulses driving its input signal and counts once only when the input
signal is switched from off to on. XGB series have 4 counter instructions such as CTU, CTD, CTUD, and
CTR. The followings shows brief information for counter operation. Refer to the ‘XGB Instruction Manual’ for
details.

• Up counter increases the current value.


• Down counter decreases the current value.
• Up/Down counter compares the input value from both counters input.
• Ring counter increase the current value and the current value is cleared as 0 when the current value
reaches the preset value.

(1) Renewal of counter’s current value and contact On/Off


(a) Up counter

• Up counter increases the current value at the rising edges of input.


• The counter output contact (Cxxx) is turned On when the current value reaches the preset value.
When the reset input is turned On, the counter output contact (Cxxx) is turned Off.

(b) Down counter

• Down counter decreases the current value at the rising edges of input.
• The counter output contact (Cxxx) is turned On when the current value reaches the preset value.
When the reset input is turned On, the counter output contact (Cxxx) is turned Off.

(c) Up/Down counter

• The current value is increased with the rising edge of up-count input signal, and decreased with the
rising edge of down-count input signal. The counter output contact (Cxxx) is turned On when the
current value is same as or more than current value. The counter output contact (Cxxx) is turned Off
when the current value is same as or less than current value.
• When the reset input is turned On, the current value is cleared as 0.

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(d) Ring counter

• The current value is increased with the rising edge of the counter input signal, and the counter output
contact (Cxxx) is turned on when the current value reaches the preset value. Then the current value and
counter output contact (Cxxx) is cleared as 0 when the next rising edge of the counter input signal is
applied.
• When the reset input is turned On, the counter output contact is cleared as 0.

(2) Maximum counting speed

The maximum counting speed of determined by the length of scan time. Counting is possible only when
the on/off switching time of the counter input signal is longer than scan time.

n 1 n : duty (%)
Maximum counting speed C max = ×( )
100 tS t S : scan time [s]

• Duty is the ratio of the input signal’s on time to off time as a percentage.

On

Off Off

T1 T2

T1 ≤ T2, n= x 100 [%]

T2
T1 > T2, n= x 100 [%]
T1+T2

Remark
1) Use of High Speed Counter
In order to counter pulse that is faster than maximum counting speed of normal counter, use
built-in High Speed counter function.

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Chapter 5 Program Configuration and Operation Method

5.2 Program Execution


5.2.1 Configuration of program
All functional elements need to execute a certain control process are called as a ‘program’. Program is stored in
the built-in RAM mounted on a CPU module or flash memory of a external memory module. The following table
shows the classification of the program.

Program type Description


• It will be executed till the specific Flag ‘INIT_DONE’ is on. And while the
initialization task is executed, cycle task, external interrupt task and internal
Initializing program
device task are not executed. I/O refresh, high speed counter and
communication are executed
Scan program • The scan program is executed regularly in every scan.

• The program is performed according to the fixed time interval in case that the
required processing time condition is as below.
 In case that the faster processing than 1 scan average processing time is
Cycle time interrupt
required
program
 In case that the longer time interval than 1 scan average processing time is
required
 In case that program is processed with the appointed time interval
External interrupt • The external interrupt program is performed process on external interrupt
program signal.
Subroutine • Only when some condition is satisfied.(in case that input condition of CALL
program instruction is On)

5.2.2 Program execution methods


Here describes the program proceeding method that is executed when the power is applied or key switch is ‘RUN’.
The program performs the operation processing according to the configuration as below.

Start processing

It executes up to execution of INIT_DONE instruction when initializing program is designated.


Initializing program

Subroutine program
External interrupt program

Scan program
Only when some
condition is satisfied.
Cycle time program

END processing

(1) Scan program

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(a) Function
• This program performs the operation repeatedly from 0 step to last step in order prepared by the program
to process the signal that is repeatedly regularly every scan.

• In case that the execution condition of interrupt by task interrupt or interrupt module while executing
program is established, stop the current program in execution and perform the related interrupt program.
(2) Interrupt program

(a) Function
• This program stops the operation of scan program and then processes the related function in prior to
process the internal/external signal occurred periodically/non-periodically.

(b) Type
• Task program is divided as below.
▶ Cycle time task program: available to use up to 8.
▶ Internal device task program: available to use up to 8.
▶ I/O (External contact task program): “S” type available to use up to 8. (P000 ~ P007)
“E” type available to use up to 4. (P000~P003)

• Cycle time task program


▶ Performs the program according to the fixed time internal.

• Internal device task program


▶ Performs the corresponding program when the start condition of internal device occurs.
▶ The start condition detection of device shall be performed after processing of scan program.

• I/O (External contact task program)


▶ Performs the program according to the input external signal (“S” type: P000~P007, “E” type:
P000~P003).

Remark
(1) Write the interrupt program as shortly as possible. In case same interrupt occurs repeatedly
before completion of interrupt, program is not executed and O/S watch dog error may occur.
(2) Though interrupt which has lower priority occurs many times during execution of interrupt
which has higher priority, interrupt which has lower priority occurs only one time.

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5.2.3 Interrupt
For your understanding of Interrupt function, here describes program setting method of XG5000 which is an XGB
programming S/W. Example of interrupt setting is as shown bellows.

• Interrupt setting
Interrupt source Interrupt name priority Task No. Program
Initializing Interrupt 0_ - - -
Cycle time 1 Interrupt 1_cycle time 2 0 Cycle time 1
External Interrupt 2_external 2 8 External
Internal device Interrupt 3_internal 3 14 Internal
Cycle time 2 Interrupt 4_cycle time 3 1 Cycle time 2

Scan program

Initializing
(Before INIT_DONE instruction)

Interrupt 1_Cycle time


Cycle time 1 execution
occur

Cycle time 1/
Cycle time 1 execution
external occur
simultaneously
External I/O execution

Internal device
Interrupt occur

Cycle time 2
Cycle time 2 execution
occur

Internal device interrupt


END execution

Cycle time 1 Timed-driven 1


execution execution

Remark
• In case that several tasks to be executed are waiting, execute from the highest Task Program in
priority. When the same priority tasks are waiting, execute from the order occurred.
• While interrupt executing, if the highest interrupt is occurred, the highest interrupt is executed earliest of
all.
• When power On, All interrupts are in the state ‘Enable’. In case you don’t use it, disable the
interrupts by using DI instruction. If you want to use it again, enable by using EI instruction.

• Internal device interrupt is executed after END instruction.

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Chapter 5 Program Configuration and Operation Method

(1) How to prepare interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each
task. For further information, please refer to XG5000 user’s manual.
(It can be additional when XG5000 is not connected with PLC.)

(a) Click right button of mouse on project name and click 『Add item』-『Task』.

(b) The screen of Task setting is shown. Click 『Initialization』 in Execution condition and make a Task
name.

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(c) Click right button of mouse at registered task and select『Add Item』-『Program』.

(d) Make initializing program. In initializing program, INIT_DONE instruction must be made. If not, Scan
program is not executed.

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(2) How to prepare Cycle interrupt program

Generate the task in the project window of XG5000 as below and add the program to be performed by each
task. For further information, please refer to XG5000 user’s manual.
(It can be additional when XG5000 is not connected with PLC)

(a) Click right button of mouse at registered task and select『Add Item』-『Task』.

• It shows setting screen of Task.

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Chapter 5 Program Configuration and Operation Method

(b) Task type


Classification Description Remark
Character, number
Task name Make Task name.
available
“2” is the highest
Priority Set the priority of task. (2~7)
priority number.
Set the Task number.
• Cycle time task (0 ~ 7): 8
Task number • External I/O task (8 ~ 15): “S” type: 8, -
“E” type: 4
• Internal device task (16 ~ 23): 8
Till the execution of
Initialization Set the initial program when running the project. INIT_DONE
instruction
0~4294967295 ㎳
Cycle time Set the cyclic interrupt.
Execution available
condition P000 ~ P007
I/O Set the external I/O.
available
Set the internal device to interrupt execution.
Internal
• Bit: Among Rising, Falling, Transition, On, Off -
device
• Word: Among >,>=,<,<=

(c) Click right button of mouse at registered task and select『Add Item』-『Program』.

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Chapter 5 Program Configuration and Operation Method

(d) Register the Program name and Program description.

(e) It is displayed the program window to write task program.

(f) It is displayed the setting in project window.

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Chapter 5 Program Configuration and Operation Method

(3) Task type

Task type and function is as follows.


I/O task
Type Cycle time task (Interrupt task) Internal device task
Spec. (Interval task) (Single task)
“S” type “E” type
Max. Task
8 8 4 8
number
Cyclic Rising or falling Rising or falling
(setting up to max. edge of main edge of main Internal device
Start condition
4,294,967.295 sec. by unit’s contact unit’s contact execution condition
1ms unit) P000 ~P007 P000 ~P003
Retrieve the condition
Detection and Cyclic execution per Immediate execution at the edge of and execute after
execution setting time main unit’s contact completing Scan
Program
Detection delay Delay as much as max.
Max. 1 ms delay Max. 0.05 ms delay
time scan time
2~7 level setting 2~7 level setting
Execution 2~7 level setting
(2 level is highest in (2 level is highest in
priority (2 level is highest in priority)
priority) priority)
Within 0~7 range
With 8~15 range without user Within 16~23 range
Task no. without user
duplication without user duplication
duplication

(4) Processing methods of task program

Here describes common processing method and notices for Task program.

(a) Feature of task program


1) Task Program is executed only when execution condition occurs without every scan repeat processing.
When preparing Task Program, please consider this point.
2) For example, if a timer and counter were used in cyclic task program of 10 second cycle, this timer
occurs the tolerance of max. 10 seconds and the counter and the timer and as the counter checks the
input status of counter per 10 seconds, the input changed within 10 seconds is not counted up.

(b) Execution priority


1) In case that several tasks to be executed are waiting, execute from the highest Task Program in priority.
When the same priority tasks are waiting, execute from the order occurred.
2) In case Cycle time task and external I/O task is occurred concurrently, execute from the highest task
program. (In sequence of XG5000 setting)
3) The task program priority should be set considering the program features, importance and the
emergency when the execution requested.

(c) Processing delay time


There are some causes for Task Program processing delay as below. Please consider this when task
setting or program preparation.
1) Task detection delay (Refer to detailed description of each task.)
2) Program proceeding delay caused by Priority Task Program proceeding
3) Input/output data refresh of expansion special module and using PUT, GET instruction.

(d) Relationship of initialize, Scan Program and Task Program


1) ser identification task does not start while performing Initialization Task Program.
2) As Scan Program is set as lowest priority, if task occurs, stop Scan Program and process Task Program
in advance. Accordingly, if task occurs frequently during 1 scan or concentrates intermittently, scan time
may extend abnormally. Cares should be taken in case of task condition setting.

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(e) Protection of Program in execution from Task Program


1) In case that the continuity of program execution is interrupted by high priority Task Program during
program execution, it is available to prohibit the execution of Task Program partially for the part in
problem. In this case, it is available to perform the program protection by ‘ DI (Task Program Start
Disabled) and ‘EI (Task Program Start Enabled)’ application instruction.
2) Insert ‘DI’ application instruction in the start position of the part requiring the protection and insert ‘EI’
application instruction in the position to release. Initialization Task is not influenced by ‘DI’, ‘EI’
application instruction.
3) If interrupt is occurred while ‘CALLP’ instruction executing, interrupt program is executed after ‘CALLP’
instruction execution.

(5) Cyclic task program processing method


Here describes the processing method in case that task (start condition) of Task program is set as Cycle
time.

(a) Items to be set in Task


Set the execution cycle and priority which are the start condition o f Task program to execution. Check the
task no. to manage the task.
(b) Cyclic task processing
Performance the corresponding cyclic task program per setting time interval (execution cycle).
(c) Notice in using cyclic task program
1) When cyclic task program is in execution currently or waiting for execution, if the demand to execute the
same task program occurs, the new occurred task shall be disregarded.
2) Timer that makes a demand to execute cyclic task program only while operation mode is Run mode,
shall be added. The shutdown time shall be all disregarded.
3) When setting the execution cycle of cyclic task program, consider the possibility that the demand to
execute several cyclic task program at the same time occurs.
If 4 cyclic task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of
execution per 20 seconds shall be occurred at the same time and scan time may extend
instantaneously.

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Chapter 5 Program Configuration and Operation Method

(6) I/O task program processing

It described the I/O task program processing. (“S” type: P000~P007, “E” type: P000~P003)

(a) Items to be set in Task


Set the execution condition and priority to the task being executed. Check the task no. to manage the task.
(b) I/O task processing
If interrupt signal from external signal (I/O) is occurred on main unit (“S” type: P000 ~ P007. “E” type:
P000~P003), task program is executed by external (I/O) signal.
(c) Precaution in using I/O task program
1) If task program which is executed by interrupt signal is on execution or standby status, new task
program which is requested by identical I/O is ignored.
2) Only operation mode is Run mode, execution request of task program is recognized. Namely, execution
request of task program is ignored when operation mode is Stop mode.

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Chapter 5 Program Configuration and Operation Method

(7) Internal device task program processing


Here describes the processing method of international device task program which extended the task (start
condition) of task program from contact point to device as execution range.

(a) Items to be set in Task


Set the execution condition and priority to the task being executed. Check the task no. for task
management.

(b) Internal device task processing


After completing the scan program execution in CPU module, if the condition that becomes the start
condition of internal device task program is met, according to the priority, it shall be executed.

(c) Precautions in using internal device task program


1) Accordingly, even if the execution condition of internal device task program occurs in Scan Program
or Task Program (Cycle time, I/O), it shall not be executed immediately but executed at the time of
completion of Scan Program.
2) If the demand to execute Internal Device Task Program occurs, the execution condition shall be
examined at the time of completion of Scan Program. Accordingly, if the execution condition of Internal
Device Task occurs by Scan Program or Task Program (Cycle time) during ‘1 scan’ and disappears, the
task shall not be executed as it is not possible to detect the execution at the time of examination of
execution condition.

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(8) Verification of task program

(a) Is the task setting proper?


If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time
may lengthen or be irregular. In case not possible to change the task setting, verify max. scan time.

(b) Is the priority of task arranged well?


The low priority task program shall be delayed by the high priority task program, which results in disabling
the processing within the correct time and even task collision may occur as next task occurs in the state
that the execution of previous task is delayed. Consider the emergency of task and execution time etc
when setting the priority.

(c) Are task programs made as shortly as possible?


Long running time of the task program can cause the long or irregular scan time or may lead to the conflict
of task programs. Make the task programs as shortly as possible.
Especially, when attaching expansion special module, or using PUT,GET instructions, program processing
might be delayed.( More than 10ms task cycle is recommended).

(d) Is program protection for the high priority task needed during program execution?
If other task is inserted during task program execution, complete the task in execution and operate the
standby tasks in the order of high priority. In case that it is not allowed to insert other task in Scan Program,
prevent the insert partially by using ‘DI’ and ‘EI’ application instruction. The problem may occur while
processing the global variables used commonly with other program or special or communication module.

(9) Program configuration and processing example

If task and program are registered as below.


Interrupt type Interrupt name Priority Task No. Program
Cycle time 10 ㎳_cycle time 3 0 Program 1
Internal device Internal device_M00 5 16 Program 2
I/O I/O_P00 2 8 Program 3
1) Scan program name: “ Scan Program”
2) Execution time respective program: Scan program = 17 ㎳, Program 1 = 2 ㎳, Program 2= 7 ㎳,
Program 3 = 2 ㎳

Scan started
(Initial operation started) Scan program stopped New scan started

Scan program

Program 1

10ms_Cycle time

Program 2

Internal device_M000

Program 3

External I/O_P000
Time
0 6 7 8 10 12 20 22 24 25 30 32 34

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Chapter 5 Program Configuration and Operation Method

Process per time

Time (㎳) Process

0 Scan started and scan program started to execute.


0~6 Scan program is executed.
Scan program is stop because execution external I/O (P000) is requested. And program
6~8 3 is executed. Request of execution at 7[ms] is ignored because program 3 has been
executing.
8~10 Program 3 is finished and Scan program is continued.
Scan program is stop by request of ‘10 ㎳_Cycle time’ interrupt signal and execute program
10~12
1.
12~20 Program 1 is finished and Scan program is continued.
Request of ‘Cycle time’ interrupt signal and ‘External I/O (P000)’ signal is occurred
20 concurrently but priority of ‘External I/O’ signal is higher than ‘Cycle time’ interrupt signal
so program 3 is executed and program 1 is standby.
20~22 Program 3 is finished and Scan program is continued.
22~24 After program 3 is completed, program 1 (the program of ‘10ms_Cycle time’ is executed.
24~25 P1 execution completed and the stopped scan program execution finished
At the finished point of scan program, check the request of Internal device ‘M000’
25
execution and execute program 2.
25~30 Program P2 is executed.
When ‘10 ㎳_Cycle time’ interrupt signal is occurred, the priority of that is higher than Internal
30~32
device ‘M000’ though program 2 is stopped and program 1 is executed.
32~34 P1 executed completed and the stopped P2 execution finished
34 New scan starts (Start scan program execution)

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Chapter 5 Program Configuration and Operation Method

5.3 Operation Mode


For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode..
Here describes the operation processing of each operation mode.

5.3.1 RUN mode


This is the mode to executed program operation normally.

RUN mode first scan start

Initialize data area

Examine Program effectiveness and judge the


possibility of execution

Execute input refresh

Program execute, Interrupt Program execute

Examine the normal operation or missing of


built-in module

Execute output refresh

Communication service and internal processing

RUN mode keep


Operation
mode change
Change to other mode
Operation by changed operation
mode

(1) Processing at mode change


At the beginning, execute initialization of data area and examine the effectiveness of program and judge the
possibility of execution.

(2) Operation processing contents


Execute I/O refresh and program operation.
(a) Detects the start condition of Interrupt Program and executes Interrupt Program.
(b) Examines the normal operation or missing of built-in module.
(c) Communication service and other internal processing.

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5.3.2 STOP mode


This is the mode in stop state without Program operation. It is available to transmit the program through XG5000
only in Remote STOP mode.

(1) Processing at Mode Change


Clear the output image area and execute output refresh.

(2) Operation Processing Contents


(a) Executes I/O refresh.
(b) Examines the normal operation or missing of built-in module.
(c) Communication service or other internal processing.

5.3.3 DEBUG mode (Supported at “S” type)


This is the mode to detect Program error or trace the operation process and the conversion to this mode is
available only in STOP mode. This is the mode to check the program execution state and the contents of each
data and verify the program.

(1) Processing at mode change


(a) Initializes the data area at the beginning of mode change.
(b) Clears the output image area and execute input refresh.

(2) Operation processing contents


(a) Executes I/O refresh.
(b) Debug operation according to setting state.
(c) After finishing Debug operation by the end of Program, execute output refresh.
(d) Examine the normal operation or missing of built-in module.
(e) Executes communication service or other service.

(3) Debug operation


 It describes debug mode.

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Chapter 5 Program Configuration and Operation Method

Item Description Remark


Start/Stop Debugging Change the debug ↔ stop mode
Go It starts debug operation.
Step Over It operates by 1 step.
Step Into It starts the subroutine program. Other operation is
identical to Step
Step Out It finished the subroutine program. Over.
Go to Cursor It operates to current cursor position.
Set/Removes current cursor position to break
Set/Remove Breakpoints
points.
Breakpoints List It displays list of breakpoints.
Breakpoint Conditions It specifies device value and number of scan.

(a) Set/Remove Breakpoints


▪ Sets breakpoint at current cursor position. After breakpoint setting, (breakpoint setting indicator) is
displayed.

(b) Go
▪ Run the program to breakpoint. At break-pointer (stop indicator) is displayed.

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Chapter 5 Program Configuration and Operation Method

(c) Step Over


▪ Run the program to next step. At break point, Step over indicator is displayed.

(d) Breakpoint List


▪ It displays current Breakpoint List. It supports Select All, Reset All, Goto, Remove, Remove All.

(e) Break condition


▪ It sets Device Break and Scan Break.

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Chapter 5 Program Configuration and Operation Method

Remark

1) Refer to XG5000 Users Manual ‘Chapter 12 Debugging’ for detailed information.

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Chapter 5 Program Configuration and Operation Method

5.3.4 Change operation mode


(1) Operation Mode Change Method

The method to change operation mode are as follows.

(a) By mode key of CPU module


(b) By connecting the programming tool (XG5000) to communication port of CPU
(c) By changing the operation mode of other CPU module connected to network by XG5000 connected to
communication port of CPU.
(d) By using XG5000, HMI, computer link module connected to network
(e) By ‘STOP‘ instruction during program execution

(2) Type of operation mode

The operation mode setting is as follows.

Operation mode switch XG5000 command Operation mode

RUN unchangeable Local Run


RUN Remote Run
STOP Remote Stop
STOP
Debug Debug Run
Mode change Previous operation mode
RUN -> STOP - Stop

(a) Remote mode conversion is available only in the state of ‘Remote Enabled: On’, ‘Mode switch: Stop’.
In case of changing the Remote ‘RUN’ mode to ‘STOP’ by switch, operate the switch as follows.
(STOP)  RUN  STOP.

Warning
In case of changing Remote RUN mode to RUN mode by switch, PLC operation continues the
operation without interruption.

It is available to modify during RUN in RUN mode by switch but the mode change operation by
XG5000 is limited. This should be set only in case that remote mode change is not allowed.

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5.4 Memory
There are two types of memory in CPU module that the user can use. One is Program Memory that saves the
user program written by the user to build the system, and the other is Data Memory that provides the device area
to save the data during operation.

5.4.1 Data memory

(1) Bit device area

Various Bit Device are provided per function. The indication method is indicated by device type for first digit,
word position by decimal for middle digit and bit position by hexadecimal for the last digit.

Area per device


Device features Description
“E” type “S” type
Image area to save the state of I/O device.
P0000 ~ P0000~ After reading the input module state, saves it in the
I/O device “P”
P127f P1023f corresponding P area and sends P area Data
saving the operation result to output module.

M0000 ~ M0000~ Internal Memory provided to save Bit Data in


Internal device “M”
M255f M1023f Program

L0000 ~ L0000~ Communication device Device to indicate high speed link/P2P service state
L1279f L2047f “L” information of communication module.

Device area to preserve the data during power


K00000 K00000~ shutdown, which is used without setting power
Preservation device “K”
~ K2559f K4095f shutdown preservation parameter separately. (Pay
attention to write in special area (K2600 ~ 2559F)).

F0000 ~ F0000~ System flag area that manages the flag necessary
Special device “F”
F255f F1023f for system operation in PLC.

T0000 ~ T0000~ Area to save the state of contact/current value/set


Timer device “T”
T255 T1023 value of timer device

C0000 ~ C0000~ Area to save the state of contact/current value/set


Counter device “C”
C255 C1023 value of counter device

S00.00 ~ S00.00~ Step controller “S”


Relay for step control
S127.99 S127.99 128 x 100 step

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(2) Word device area

Area per device


Device features Description
“E” type “S” type

D00000 ~ D0000~ Data register “D” Area to preserve the internal data.
D5119 D10239 Bit expression possible. (D0000.0)

U00.00 ~ U00.00~ Analog data Register used to read data from special module installed
U0A.31 U0A.31 register “U” in the slot. Bit expression possible

Z000 ~ Z000~ Index register Dedicated device to use Index function


Z127 Z127 “Z” Bit expression impossible

T0000 ~ T0000~ Timer current value


Area to indicate the current value of timer
T255 T1023 register “T”

C0000 ~ C0000~ Counter current


Area to indicate the current value of counter
C255 C1023 value register “C”

R0000~ Register for saving file


- File register “R”
R10239 Bit expression available (F0000.0)

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5.5 Configuration Diagram of Data Memory

5.5.1 “E” type


Bit data area W ord data area User Program area

0 ~ F 0000 ~ FFFF
P000 D0000
I/O Relay Data Register Parameter area
(2048 points) (5120 words)
P127 “P”
M000 D5119 “D” User Program area
Auxiliary Relay
U00.00 (4 K step)
(4096 points)
M255 “M” Analog Data
K000 Register
Keep Relay
U0A.31 (1024 words) “U”
(40960 points)
K2559 “K”
F000 Z000 Index Register
Special Relay
Z127 (128 words)
(4096 points) “Z”
F255 “F”
T000 Timer setting value
L0000
Link Relay T255 (256 words)
T000 Timer current value
(20480 points) “L”
L1279
T255 (256 words)
C000
T000 Counter setting value
Timer C255 (256 words)
C000
(256 points) Counter current value
T255 “T”
C000 C255 (256 words)
Counter
C255 (256 points) “C”

S000
Step controller
(128 x 100 step)
S00.00~S127.99 “S”
S127

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Chapter 5 Program Configuration and Operation Method

5.5.2 “S” type

Bit data area W ord data area User Program area

0 ~ F 0000 ~ FFFF
P0000 D0000
I/O Relay Data Register Parameter area
(16384 points) (10240 words)
P1023 “P”
M0000 D10239 “D” User Program area
Auxiliary Relay
U00.00 (15 K step)
(16384 points)
M1023 “M” Analog Data
K0000 Register
Keep Relay
U0A.31 (1024 words) “U”
(65536 points)
K4095 “K”
F0000 Z000 Index Register
Special Relay
Z127 (128 words)
(16384 points) “Z”
F1023 “F”

L0000 T0000 Timer setting value


Link Relay T1023 (1024 words)
(32768 points) T0000 Timer current value
L2047 “L”
T1023 (1024 words)
C0000
T0000 Counter setting value
Timer C1023 (1024 words)
(1023 points) C0000
T1023 “T” Counter current value
C0000 C1023 (1024 words)
Counter
(1023 points) “C” R0000
C1023
File register
(10240 words)
S000
Step controller
(128 x 100 step)
“R”
S00.00~S127.99 “S” R10239
S127

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Chapter 5 Program Configuration and Operation Method

5.5.3 Data latch area setting


When PLC stops and restarts the data required for operation or the data occurred during operation, if you
want to keep and use those data, data latch can be used and it is available to use a certain area of some
data device as latch area by parameter setting.

The below shows the features for latch device.


st nd
Device 1 latch 2 latch Features
P X X Image area to save the state of I/O device

M O O Internal device area

K X X Device keeping the device state during power shutdown

F X X System flag area

T O O Timer related area (Bit/words both)

C O O Counter related area (Bit/words both)

S O O Relay for step control

D O O General words data save area

U X X Analog Data Register (latch disabled )


High speed link/P2P Service state device of communication
L X X
module (latch enabled)
Z X X Index dedicated Register (latch disabled)

R O O File register (latch enabled)

Remark

▪ K, L, R devices are basically latched.

(1) Latch area setting


(a) Click Device Area Setup of Basic parameter settings.

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Chapter 5 Program Configuration and Operation Method

(2) Data latch area operation


(a) The method to delete the latched data is as below.
- latch 1, latch 2 clear operation by XG5000
- write by Program (initialization program recommended)
- write ‘0’ FILL from XG5000 monitor mode.

For keep or reset (clear) operation of latch area data according to PLC operation, please refer to the
below table.
No. Classification Detailed operation Latch 1 Latch 2
1 Power change Off/On Keep Keep
2 Reset by XG5000 Overall reset Reset Keep
3 Program write (online) - Keep Keep
SRAM broken by battery error Reset Reset
4 Data broken
Data broken by other reason Reset Reset
Clear Latch 1 Reset Keep
5 XG5000 online
Clear Latch 2 Reset Reset

(b) Latch 1 area is cleared by『Online』-『Reset PLC』- “Overall reset”.

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Chapter 5 Program Configuration and Operation Method

(c) Latch 1, 2 area is cleared by『Online』-『Clear PLC』.

(3) Data initialization

In case of Memory Delete state, the memory of all device shall be cleared as ‘0’. In case of giving the data
value at the beginning according to system, please use the initialization task.

(a) Device area is cleared by click ‘Clear’ in 『Online』-『Clear PLC』-『Clear Memory』.

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Chapter 6 CPU Functions

Chapter 6 CPU Functions

6.1 Type Setting


It describes setting of XGB PLC type.

PLC
CPU type Description Reference
Series
XGB-DR16C3 Dedicated product Modular type
XGB-DR32HL Dedicated product Modular type
XGB-XBCE “E” type : XBC-DR10/14/20/30E Compact type
XGB-XBCH “H” type : XBC-DR32/64H , XBC-DN32/64H Compact type
XGB
“S(U)” type : XBC-DR20/30/40/60SU,
XGB-XBCS Compact type
XBC-DN20/30S(U), XBC-DN40/60SU
XGB-XBMS “S” type : XBM-DN16/32S , XBM-DR16S Modular type
Compact type
XGB-XECH “H” type : XEC-DR32/64H, XEC-DN32/64H
IEC language

Remark

▪ In case type is different, connection is not available.

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Chapter 6 CPU Functions

6.2 Parameter Setting


This paragraph describes how to set parameters.

6.2.1 Basic parameter setting


Clicking Basic Parameter in the project window shows the following window.

There are three main options ; “Basic Operation Setup” , “Device Area Setup” and “Error Operation
Setup”.

Category Item Description Note


Fixed period
Set the time of fixed period operation. 1~999 ㎳
operation
Watchdog timer Set the time of scan watchdog. 10~1000 ㎳
Standard input filter Set the time of standard input filter. 1,3,5,10,20,70,100 ㎳
Basic Output during Set whether to allow output actually during
Allowance/Prohibition
operations debugging debugging operation.
Keep output when Set whether to preserve output holding
Allowance/Prohibition
an error occurs function set in I/O parameter in case of error.
Delete all areas
Set whether to clear each device that is not
except latch when an Allowance/Prohibition
designated as a latch area in case of error
error occurs
Device
Select latch area Set the latch area of each device. -
area
Operation resumes
Error Set whether to pause or resume operation in
in case of operation Pause/Resume
operation case of operation error.
error

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Chapter 6 CPU Functions

6.2.2 I/O parameter setting

This setting is to set and reserve each I/O information. Clicking 『I/O Parameter』 in the project
window shows the following setting window.

Clicking 『Module』 in 『Slot Position』 indicates a list of modules, in which you may set I/O
corresponding to the actual system. Then, the following window is displayed.

Clicking 『Details』 in 『Slot Position』 shows the following window to set filter and emergency output.

Remark

(1) If settings are different with I/O module actually accessed, “Inconsistent module type error” occurs,
displaying error.
(2) Without settings, CPU reads each I/O module information and operates.

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Chapter 6 CPU Functions

6.3 Self-diagnosis Function

6.3.1 Saving of error log


CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking
『Error/Warning』 of 『Online』 shows the current error and previous error log.

Item Description Remarks


Error/Warning Display the current error/warning. -
Error Log Display a log of error/warning occurred. Saving up to 100

Remark

(1) Saved data are not deleted until selecting a menu of XG5000 and clicking “Delete”.

6.3.2 Troubleshooting

(1) Trouble types


Trouble occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble
is divided into trouble mode stopping operation for the safety and warning mode generating alert to user
with a mode in trouble.

The causes troubling PLC system are as follows.

 PLC hardware trouble


 System configuration error
 Operation error while operating user program
 Error detected owing to external device in trouble

(2) Operation mode if trouble occurs


PLC system logs any trouble occurred in flag and determines whether to stop or resume operation
depending on trouble mode.

(a) PLC hardware trouble


In case an error occurs so that PLC such as CPU module and power module may not work normally,
the system is halted, but any warning may not interfere with the operation.

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Chapter 6 CPU Functions

(b) Operation error while operating user program


Representing an error occurred during operation of user program, in case of numeric operation error,
it displays the error in error flag but the system resumes operating. However, if the operation time
exceeds by the operation monitoring time limit and I/O module does not control it normally, the system
is halted.

(c) Error detected owing to external device in trouble


Representing the detection of external device to be controlled by users program of PLC, if an error is
detected, the system is halted, but any warning may not interfere with the operation.

Remark

(1) If any trouble occurs, the trouble number is saved in a special relay F002,003.
(2) For details of flag, refer to the appendix 1 Flag List.

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Chapter 6 CPU Functions

6.4 Remote Functions


CPU module may change operation by communication as well as by key switches mounted on the module. To
operate it remotely, it is necessary to set ‘RUN/STOP’ switch to ‘STOP’.

(1) Remote operations are as follows.


(a) Operable by accessing to XG5000 through RS-232C port mounted on CPU module.
(b) Can operate other PLC connected to PLC network with CPU module connected to XG5000.

(2) Remote RUN/STOP


(a) Remote RUN/STOP is the externally controlled RUN/STOP function.
(b) It is convenient when CPU module is located at a position hard to control or when CPU module
within control panel is to control RUN/STOP function remotely.
(3) Remote DEBUG
(a) It manages debugging remotely when remote mode is STOP. Namely, DEBUG operation is to execute
program operation depending on designated operation conditions.
(b) Remote DEBUG is a convenient function when confirming program operation status or data during
system debugging.
(4) Remote Reset
(a) Remote reset is to reset CPU module remotely if an error occurs at a place hard to directly control
CPU module.
(b) Like operation by switches, it supports ‘Reset’ and ‘Overall Reset’.

Remark

(1) For details regarding remote functions, refer to ‘Ch10 Online’ of XG5000 Users Manual.

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Chapter 6 CPU Functions

6.5 Forced Input/Output On and Off Function


Force I/O function is used to force to turn I/O areas on or off, regardless of program results.

6.5.1 Force I/O setup

Click『 Online 』-『 Force I/O 』.

Item Description
Move to the beginning and end of I/O area (P000↔P127)
Move address Move to ±8 of I/O area displayed at the very left.
Move to ±1 of I/O area.
Application Set whether to allow or not Force I/O
Flag Set whether to allow or not Force I/O by bits.
Single
Data Set Force I/O data on or off by bits.
Select All Set to allow Force I/O with all I/O area on

Delete to allow Force I/O with all I/O area off.


Delete All
Setting device Display I/O area set as a bit.

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Chapter 6 CPU Functions

6.5.2 Processing time and processing method of Force Input/Output On and Off
(1) Forced Input
Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among
data read from input module with the data as Force and updates input image area. Therefore, user
program executes operations with actual input data while Force input area is operated with data set as
Force.

(2) Forced Output


Regarding output, at the time of output refresh upon the execution user program operation, it replaces
the data of contact set as Force On/Off among data of output image area containing operation results
with data set as Force and outputs the data in output module. Unlike (Force) input, the output image
area is not changed by Force On/Off setting.

(3) Cautions when using Force I/O function


(a) It operates from the time when I/O is individually set as ‘Allow’ after setting Force data.
(b) It is possible to set Force input although I/O module is not actually mounted.
(c) Despite of the power changed Off -> On, operation mode changes or any operation by pressing reset
key, the data of which On/Off is set before is kept in CPU module.
(d) Even in STOP mode, Force I/O data is not removed.
(e) To set new data from the beginning, it is necessary to deselect all settings of I/O by using ‘Delete All’
option.

(4) Operation in case of error


(a) If error occurs after setting forced output, PLC operates based on “Keep output when an error occurs”
in Basic parameter and “Emergency output” in I/O parameter.
If you set “Emergency output” as “Clear” after setting “Keep output when an error occurs”, output is
cleared when an error occurs. If you set “Emergency output” as “Hold” after setting “Keep output when
an error occurs”, output is held when an error occurs.
(b) If you don’t set “Keep output when an error occurs”, output is off when an error occurs.

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Chapter 6 CPU Functions

6.6 Direct Input/Output Operation


Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is
scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after ‘END’ instruction
on program.

This function may be useful when directly reading the status of input contact during program operation by
refreshing I/O by means of ‘IORF’ instruction or outputting operation results to output contact.

‘IORF’ command is operated when M00000 is ON. First operand designates slot number. Second operand
designates the upper 32 bit data as mask data. Third operand designates the lower 32 bit data as mask data.
The bit to refresh set as 1 (hFF) and others set as 0 (h00) (not refreshed).

Remark
- When using IORF instruction to read/write data at expansion module, scan time increases by 2ms. So
when executing interrupt task program by external input less than 10ms or cycle time task less than 10ms,
task collision may occurs.
-For details regarding IORF instruction, refer to XGK/XGB Instructions List.

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Chapter 6 CPU Functions

6.7 Diagnosis of External Device

This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of
the system. Use of this flag displays faults of external device without any complicated program prepared and
monitors fault location without any specific device (XG5000 and etc) or source program.

(1) Detection and classification of faults in external device


(a) The trouble (fault) of external device may be detected by user program and largely divided, depending
on the type, into error and warning; the former requires halt of PLC operation and the latter simply
displays the status while PLC keeps working.
(b) ‘Error’ uses ‘F202 (_ANC_ERR)’ and ‘Warning’ uses ‘F203 (_ANC_WB) flag’.
(c) As the detection request flag, ’Error’ uses ‘F2002 (_CHK_ANC_ERR) flag’ while ‘Warning’ uses
‘F2003 (_CHK_ANC_WB) flag’.

(2) Troubleshooting external device


(a) When detecting any trouble of external device in user program, it writes a value except ‘0’ by classifying
the type, which is defined by a user in ‘F202 (_ANC_ERR)’ while the detection request flag checks it at
the time when the program ends with ‘F2002 (_CHK_ANC_ERR) On, and PLC outputs based on the
“Emergency Output” setting in I/O parameter, making it as the same error status as detected by PLC
itself.
(b) If any trouble occurs, a user may identify the cause by using XG5000 and alternatively by monitoring
‘F202 (_ANC_ERR) flag’.

 Example

M000
Error device bit On
FSET F2020

FSET F2002 Error detection request On

(c) If any trouble occurs, CPU is in error status and operation halts. At this moment, F2020 and F2002 flags
are off (error LED switches on and off every second.)

(3) Processing warning of external device


(a) When detecting any warning of external device in user program, it turns on a flag in the warning
position of system flag ‘F203 (_ANC_WB) and if turning on the detection request flag, ‘F2003
(_CHK_ANC_WB)’ , it displays warning at the time when scan program ends. If a warning occurs, the
detection request flag, ‘F2003 (_CHK_ANC_WB)’ is automatically off (F203 is not deleted).
(b) If a warning occurs, the LED switches on and off every other second.
(c) If turning off a bit in question of F203 and turning on F2003 bit after processing warning, warning is
cancelled and the LED turns off.

 Example

M000
FSET F2030 Warning device bit On

FSET F2003 Warning detection request On


M001
FRST F2030 Warning cancellation

FSET F2003 Warning detection request On


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Chapter 6 CPU Functions

6.8 Allocation of Input/Output Number


Allocation of I/O number is to allocate an address to every I/O of each module to read data from input module
and output data to output module when it executes operations.
XGB series adopts 64 points occupation to every module.

(1) Allocation of I/O number


124 points are allocated to main unit and 64 points are allocated to every module except main unit (incl.
special, communication).

System Configuration

Number of
Type I/O allocation Remarks
Connection stage
Input : P0000 ~ P003F
0 XBC-DN30S(U) Main unit fixed
Output : P0040 ~ P007F
1 XBE-DC32A Input : P0080~P011F Actual input: P0080 ~ P009F

2 XBE-TN32A Output : P0120 ~ P015F Actual output : P0120 ~ P013F

3 XBL-C21A P0160 ~ P019F -

4 XBF-AD04A P0200 ~ P023F -

5 XBF-DV04A P0240 ~ P027F -

6 XBE-DC32A Input : P0280 ~ P031F Actual input : P0280 ~ P029F

7 XBE-TN32A Output : P0320 ~ P035F Actual output : P0320 ~ P033F

Empty I/O point is available for internal relay.

(2) In case of allocating IO of IO parameter, allocation information is displayed.

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Chapter 6 CPU Functions

In case of using monitor function of XG5000, I/O allocation information is displayed.

I/O module allocation


information

Description of each module

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Chapter 6 CPU Functions

6.9 Online Editing


It is possible to modify program and communication parameter during operation of PLC without control
operation stopped. The following describes basic modification. For details of modifying program, refer to
XG5000 Users Manual.

Items to be modified during operation are as follows.


• Program
• Communication parameter

(1) It displays programs that are currently running.

(2) Click 『Online』-『Start Online Editing』.

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Chapter 6 CPU Functions

(3) It turns to program modification mode during run when the program background is changed.

(4) Modifying a program.

(5) Upon the modification of program, click 『Online』-『Write Modified Program』.

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Chapter 6 CPU Functions

(6) Upon the writing of program, click 『Online』-『End Online Editing』.

(7) The program background returns and the program modification during run is completed.

Remark

▪ For parameter modification during run, change each parameter on XG-PD and click『Online』-『Write
Modified Program 』.

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Chapter 6 CPU Functions

6.10 Reading Input/Output Information


It monitors information of individual modules consisted of XGB series system.

(1) Click『Online』-『I/O Info』. Then, information of each module connected to the system is monitored.

(2) If clicking Details after selecting a module, it displays detail information of a selected module.

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Chapter 6 CPU Functions

6.11 Monitoring
It monitors system information of XGB series system.

(1) Clicking『Monitor』 displays the following sub-menus.

(2) Items and descriptions

Item Description Remarks

Start/Stop Monitoring Designate the start and stop of monitor. Click for reverse turn.

Pause Pause monitoring. -

Resume Resume paused monitor. -


Pause monitoring if a preset value of device Monitor resumes;
Pausing Conditions
corresponds to condition. clicking for resume.
Change the present value of currently selected
Change Current Value -
device.
System Monitoring Monitor general system information. -

Device Monitoring Monitor by device (type). -

Trend Monitoring Monitor trend of device set in the system.


Monitor the value of device set when an event set
Custom Events For details, refer to
by a user occurs.
XG5000 Users Manual.
Data Traces Trace the value of device.

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Chapter 6 CPU Functions

(a) Change current value


▪It changes the current value of each device selected in the current program window.

(b) Device monitoring


▪It monitors by device (type).

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Chapter 6 CPU Functions

(c) Pausing conditions


▪It stops monitoring in case a device value set in the program corresponds.

(d) Trend monitoring

▪It displays device values graphically.

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Chapter 6 CPU Functions

(e) Custom events

1) It monitors detail information when an event set by a user occurs. Additional user event may be
registered.

2) It sets basic setting and relative device.


If rising edge of M0000 device occurs, it records the message of an alarm, “Out of order Water Tank 1”
and the device values of D0000,L0000,D0100,N1000 are recorded.

3) Set the relative device(s).

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Chapter 6 CPU Functions

4) Monitor event history of custom event.

5) Double-clicking a number produced monitors the relative values of device and the detail message as
follows.

Remark

▪For details of monitor, refer to XG5000 Users Manual.

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Chapter 6 CPU Functions

6.12 Program Upload Prohibit


Program Upload Prohibit function prohibits from uploading comment, parameter, program saved on PLC. If
Program Upload Prohibit function is set, you can’t open from PLC, read PLC and compare PLC.

(1) How to set


(a) Click 『Online』-『Write』

(b) Select “Program” to activate “Program Upload Prohibit”


(c) Select “Program Upload Prohibit” and click OK.

(2) When reading PLC is prohibited, if you try to read PLC, the following dialog box appears. After releasing
Program Upload Prohibit, execute reading.

(3) How to release Program Upload Prohibit


(a) Click 『Online』-『Write』.

(b) Release Program Upload Prohibit and click OK.

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Chapter 6 CPU Functions

6.13 Clear All PLC


Clear All PLC function clears parameter, program, data, password saved on PLC

(1) How to clear all PLC


(a) Click 『Online』-『Clear All PLC』.

(b) After selection connection method, click 『Connect』 or 『OK』.

(c) If you select 『Yes』 on the dialog box, PLC program, parameter, data, password will be deleted.

Note

•Clear All PLC function can be executed though not connected.


•If you use Clear All PLC function, password will be deleted. So be careful.
•In case you lose password, use this function to clear password.

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Chapter 6 CPU Functions

6.14 Password Setting per Program Block


Password Setting per Program Block function sets password for each program block. You should input
password to open program.

(1) How to set program block password


(a) Click 『Properties』 after selecting program in project window.
(b) Click password tap.

(c) Click 『OK』 after inputting new password.

(2) Opening password-set program


(a) When you open password-set program, the following window appears.

(b) After inputting correct password, click 『OK』 to open program.

(3) How to delete program block password


(a) After program in project window, click 『Properties』.
(b) Click password tap.

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Chapter 6 CPU Functions

(c) After inputting previous password, click 『Delete』.


(d) Click 『OK』.

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Chapter 7 Input/Output Specifications

Chapter 7 Input/Output Specifications


7.1 Introduction
Here describes the notices when selecting digital I/O module used for XGB series.

(1) For the type of digital input, there are two types such as current sink input and current source
input.

(2) The number of max. Simultaneous input contact point is different according to module type. It
depends on the input voltage, ambient temperature. Use input module after checking the
specification.

(3) When response to high speed input is necessary, use interrupt input contact point. Up to 8
interrupt points are supported.

(4) In case that open/close frequency is high or it is used for conductive load open/close, use
Transistor output module or triac output module as the durability of Relay Output Module shall
be reduced.

(5) For output module to run the conductive (L) load, max. open/close frequency should be used
by 1second On, 1 second Off.

(6) For output module, in case that counter timer using DC/DC Converter as a load was used,
Inrush current may flow in a certain cycle when it is ON or during operation. In this case, if
average current is selected, it may cause the failure. Accordingly, if the previous load was
used, it is recommended to connect resistor or inductor to the load in serial in order to reduce
the impact of Inrush current or use the large module having a max. load current value.

Resistor Load Inductor Load


module

module
Output

Output

7-1
Chapter 7 Input/Output Specifications

(7) Relay life of Relay output module is shown as below.


Max. life of Relay used in Relay output module is shown as below.

100
Open/Close times (× 10000)

50

30
20

10
AC 125V Resistive load

DC 30V Resistive load


AC 250V Resistive load

0.5 1 2 3 5 10 100

Open/Close current (A)

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Chapter 7 Input/Output Specifications

(8) A clamped terminal with sleeve can not be used for the XGB terminal strip. The clamped terminals
suitable for terminal strip are as follows (JOR 1.25-3:Daedong Electricity in Korea).

6.0mm or less 6.0mm or less

(9) The cable size connected to a terminal strip should be 0.3~0.75 ㎟ stranded cable and 2.8 ㎜ thick.
The cable may have different current allowance depending on the insulation thickness.

(10) The coupling torque available for fixation screw and terminal strip screw should follow the table below.

Coupling position Coupling torque range


IO module terminal strip screw (M3 screw) 42 ~ 58 N·㎝
IO module terminal strip fixation screw 66 ~ 89 N·㎝
(M3 screw)

(11) Relay life graph is not written based on real use. (This is not a guaranteed value). So consider margin.
Relay life is specified under following condition.
(a) Rated voltage, load: 3 million times: 100 million times
(b) 200V AC 1.5A, 240V AC 1A (COS¢ =0.7): 1 million times
(c) 200V AC 0.4A, 240V AC 0.3A (COS¢ =0.7): 3 million times
(d) 200V AC 1A, 240V AC 0.5A (COS¢ =0.35): 1 million times
(e) 200V AC 0.3A, 240V AC 0.15A (COS¢ =0.35): 3 million times
(f) 24V DC 1A, 100V DC 0.1A (L/R=7ms): 1million times
(g) 24V DC 0.3A, 100V DC 0.03A (L/R=7ms): 3million times
(12) Noise can be inserted into input module. To prevent this noise, the user can set filter for input delay in
parameter. Consider the environment and set the input filter time.

Input filter time (ms) Noise signal pulse size (ms) Reference
1 0.3
3 1.8 Initial value
5 3
10 6
20 12
70 45
100 60

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Chapter 7 Input/Output Specifications
(a) Setting input filter
1) Click I/O Parameter』in the project window of XG5000

2) Click『Module』 at the slot location.

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Chapter 7 Input/Output Specifications
3) Set I/O module really equipped.

4) After setting I/O module, click Input Filter.

5) Set filter value.

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Chapter 7 Input/Output Specifications
(b) Setting output status in case of error
1) Click Emergency Out in the I/O parameter setting window.

2) Click Emergency Output.

If it is selected as Clear, the output will be Off and if Hold is selected, the output will be kept.

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Chapter 7 Input/Output Specifications

7.2 Main Unit Digital Input Specifications


7.2.1 XBC-DR10E/ DN10E/ DP10E 6 point DC24V input (Source/Sink type)
Model Main unit

Specification XBC-DR10E XBC-DN10E XBC-DP10E


Input point 6 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (Contact point 0~3: about 7 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P03: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (Set by I/O parameter) Default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by MegOhmMeter
Common method 6 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED On when Input On
External connection
14 point terminal block connector (M3 X 6 screw)
method
Weight 330g 313g 313g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
DC5V TB3 TX
0 Photo coupler
TB6
R TB4 485-
LED TB5 SG
R TB6 00
5 Internal TB7 01
TB11
circuit TB8 02
TB14
TB9 03
COM
TB10 04
DC24V
TB11 05
Terminal block no. TB12 NC
TB13 NC
TB14 COM

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Chapter 7 Input/Output Specifications

7.2.2 XBC-DR14E/ DN14E/DP14E 8 point DC24V input (Source/Sink type)

Model Main unit

Specification XBC-DR14E XBC-DN14E XBC-DP14E


Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (Contact point 0~3: about 7 ㎃)
Operation voltage range DC20.4~28.8V (Within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P03: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by MegOhmMeter
Common method 8 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED On when Input On
External connection
14 point terminal block connector (M3 X 6 screw)
method
Weight 340g 313g 313g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
DC5V TB3 TX
0 Photo coupler
TB6
R TB4 485-
LED TB5 SG
R TB6 00
7 Internal TB7 01
TB13
circuit TB8 02
TB14
TB9 03
COM
TB10 04
DC24V
TB11 05
Terminal block no. TB12 06
TB13 07
TB14 COM

7-8
Chapter 7 Input/Output Specifications

7.2.3 XBC-DR20E/ DN20E/DP20E 12 point DC24V input (Source/Sink type)

Model Main unit

Specification XBC-DR20E XBC-DN20E XBC-DP20E


Input point 12 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (Contact point 0~3: about 7 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P07: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by MegOhmMeter
Common method 12 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED On When Input On
External connection
24 point terminal block connector (M3 X 6 screw)
method
Weight 450g 418g 418g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
DC5V TB6 00
0 Photo coupler TB7 01
TB6
R TB8 02
LED TB9 03
R
TB10 04
0B Internal
TB17 TB11 05
TB24
circuit TB12 06
COM TB13 07
TB14 08
DC24V TB15 09
Terminal block no. TB16 0A
TB17 0B
TB18 NC
TB19 NC
TB20 NC
TB21 NC
TB22 NC
TB23 NC
TB24 COM

7-9
Chapter 7 Input/Output Specifications

7.2.4 XBC-DR30E/ DR30E/DP30E 18 point DC24V input (Source/Sink type)

Model Main unit

Specification XBC-DR30E XBC-DN30E XBC-DP30E


Input point 18 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (Contact point 0~3: about 7 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P07: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or higher by MegOhmMeter
Common method 18 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED on when Input On
External connection
24 point terminal block connector (M3 X 6 screw)
method
Weight 465g 423g 423g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
Photo coupler DC5V TB6 00
0 TB7 01
TB6
R TB8 02
LED
TB9 03
R
TB10 04
11
TB23 Internal TB11 05
TB24
circuit TB12 06
COM TB13 07
TB14 08
DC24V TB15 09
Terminal block no. TB16 0A
TB17 0B
TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 10
TB23 11
TB24 COM

7-10
Chapter 7 Input/Output Specifications

7.2.5 XBC-DR20SU/DN20SU/DP20SU 12 point DC24V input (Source/Sink type)

Model Main unit

Specification XBC-DR20SU XBC-DN20SU XBC-DP20SU


Input point 12 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (point 0~1: about 16 ㎃, point 2~7: about 10 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P01: about 1.5 ㏀, P02~P07: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by MegOhmMeter
Common method 12 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED On When Input On
External connection
24 point terminal block connector (M3 X 6 screw)
method
Weight 514g 475g 475g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
DC5V TB6 00
0 Photo coupler TB7 01
TB6
R TB8 02
LED TB9 03
R
TB10 04
0B Internal
TB17 TB11 05
TB24
circuit TB12 06
COM TB13 07
TB14 08
DC24V TB15 09
Terminal block no. TB16 0A
TB17 0B
TB18 NC
TB19 NC
TB20 NC
TB21 NC
TB22 NC
TB23 NC
TB24 COM

7-11
Chapter 7 Input/Output Specifications

7.2.6 XBC-DR30SU/DN30SU/DP30SU 18 point DC24V input (Source/Sink type)

Model Main unit

Specification XBC-DN30SU XBC-DN30SU XBC-DN30SU


Input point 18 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (point 0~1: about 16 ㎃, point 2~7: about 10 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P01: about 1.5 ㏀, P02~P07: about 2.7 ㏀)

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or higher by MegOhmMeter
Common method 18 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED on when Input On
External connection
24 point terminal block connector (M3 X 6 screw)
method
Weight 528g 476g 476g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
Photo coupler DC5V TB6 00
0 TB7 01
TB6
R TB8 02
LED
TB9 03
R
TB10 04
11
TB23 Internal TB11 05
TB24
circuit TB12 06
COM TB13 07
TB14 08
DC24V TB15 09
Terminal block no. TB16 0A
TB17 0B
TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 10
TB23 11
TB24 COM

7-12
Chapter 7 Input/Output Specifications

7.2.7 XBC-DR40SU/DN40SU/DP40SU 24 point DC24V input (Source/Sink Type)


Model Main unit

Specification XBC-DR40SU XBC-DN40SU XBC-DP40SU


Input point 24 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (point 0~1: about 16 ㎃, point 2~7: about 10 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P01: about 1.5 ㏀, P02~P07: about 2.7 ㏀)
Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or higher by MegOhmMeter
Common method 24 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED on when Input On
External connection
30 point terminal block connector (M3 X 6 screw)
method
Weight 594g 578g 578g
Circuit configuration No. Contact No. Contact Type

TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
TB6 00
Photo-coupler
0
TB6 TB7 01
R
TB8 02
R TB9 03
TB10 04
11
TB23 Internal
circuit
TB11 05
TB24 TB12 06
COM
TB13 07
DC24V
TB14 08
TB15 09
Terminal block No. TB16 0A
TB17 0B
TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 10
TB23 11
TB24 12
TB25 13
TB26 14
TB27 15
TB28 16
TB29 17
TB30 COM

7-13
Chapter 7 Input/Output Specifications

7.2.8 XBC-DR60SU/DN60SU/DP60SU 36 point DC24V input (Source/Sink Type)

Model Main unit


XBC-DR60SU XBC-DN60SU XBC-DP60SU
Specification
Input point 36 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃ (point 0~1: about 16 ㎃, point 2~7: about 10 ㎃)
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On voltage / On current DC19V or higher / 3 ㎃ or higher
Off voltage / Off current DC6V or lower / 1 ㎃ or lower
Input resistance About 5.6 ㏀ (P00~P01: about 1.5 ㏀, P02~P07: about 2.7 ㏀)
Response Off → On
1/3/5/10/20/70/100 ㎳ (set by I/O parameter) default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3 cycle (altitude 2000m)
Insulation resistance 10 ㏁ or higher by MegOhmMeter
Common method 36 point / COM
Proper cable size 0.3 ㎟
Operation indicator LED on when Input On
External connection
42 point terminal block connector (M3 X 6 screw)
method
Weight 804g 636g 636g
Circuit configuration No. Contact No. Contact Type
TB1 RX
TB2 485+
TB3 TX
TB4 485-
TB5 SG
TB6 00
TB7 01
Photo-coupler
0
TB6
TB8 02
R TB9 03
TB10 04
R TB11 05
11 Internal TB12 06
TB23
circuit TB13 07
TB24 TB14 08
COM TB15 09
TB16 0A
DC24V TB17 0B
Terminal block no. TB18 0C
TB19 0D
TB20 0E
TB21 0F
TB22 10
TB23 11
TB24 12
TB25 13
TB26 14
TB27 15
TB28 16
TB29 17
TB30 18
TB31 19
TB32 1A
TB33 1B
TB34 1C
TB35 1D
TB36 1E
TB37 1F
TB38 20
TB39 21
TB40 22
TB41 23
TB42 COM

7-14
Chapter 7 Input/Output Specifications

7.3 Main Unit Digital Output Specification


7.3.1 XBC-DR10E 4 point relay output

Model Main unit

Specification XBC-DR10E
Output point 4 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10 ㎳ or less
time On → Off 12 ㎳ or less
Common method 2 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
14 point terminal block connector (M3 X 6 screw)
method
Weight 330g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
RY TB2 PE
~240V
TB3
COM0 TB4 TB4 COM0
TB7
Internal circuit

TB5 40
RY TB6 COM1
TB7 41
COM1 TB6 TB8 COM2
TB9 TB9 42
RY TB10 43
TB10 TB11 NC
COM2 TB8 TB12 NC
TB13 24V
Terminal no.
TB14 24G

7-15
Chapter 7 Input/Output Specifications

7.3.2 XBC-DR14E 6 point relay output

Model Main unit

Specification XBC-DR14E
Output point 6 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10 ㎳ or less
time On → Off 12 ㎳ or less
Common method 4 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
14 point terminal block connector (M3 X 6 screw)
method
Weight 340g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
RY TB2 PE
~240V
TB3
COM0 TB4 TB4 COM0
Internal circuit

TB7 TB5 40
RY TB6 COM1
TB7 41
COM1 TB6 TB8 COM2
TB9 TB9 42
RY TB10 43
TB12 TB11 NC
COM2 TB8 TB12 NC
TB13 24V
Terminal no.
TB14 24G

7-16
Chapter 7 Input/Output Specifications

7.3.3 XBC-DR20E 8 point relay output

Model Main unit


XBC-DR20E
Specification
Output point 8 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10ms or less
time On → Off 12ms or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
24 point terminal block connector (M3 X 6 screw)
method
Weight 450g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
TB2 PE
RY TB3 ~240V
TB4 COM0
COM0 TB4 TB5 40
TB7 TB6 COM1
TB7 41
RY
TB8 COM2
Internal circuit

TB6 TB9 42
COM1
TB10 43
TB9
TB11 NC
RY TB12 COM3
TB10 TB13 44
COM2 TB8 TB14 45
TB15 46
TB13 TB16 47
RY
TB17 NC
TB16 TB18 NC
COM3 TB12 TB19 NC
TB20 NC
Terminal No. TB21 NC
TB22 NC
TB23 24V
TB24 24G

7-17
Chapter 7 Input/Output Specifications

7.3.4 XBC-DR30E 12 point relay output

Model Main unit

Specification XBC-DR30E
Output point 12 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10 ㎳ or less
time On → Off 12 ㎳ or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
2 point terminal block connector (M3 X 6 screw)
method
Weight 465g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
TB2 PE
TB3 ~240V
COM0 TB4
TB4 COM0
TB7 TB5 40
TB6 COM1
TB7 41
COM1 TB6
Internal Circuit

TB8 COM2
TB9 TB9 42
TB10 TB10 43
TB11 NC
COM2 TB8 TB12 COM3
TB13 TB13 44
TB14 45
TB16
TB15 46
COM3 TB12 TB16 47
TB19 TB17 NC
TB22 TB18 COM4
TB19 48
COM4 TB18 TB20 49
Terminal No. TB21 4A
TB22 4B
TB23 24V
TB24 24G

7-18
Chapter 7 Input/Output Specifications

7.3.5 XBC-DN10E 4 point transistor output (Sink type)


Model Main unit

Specification XBC-DN10E
Output point 4 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage
DC 10.2 ~ 26.4V
range
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when
DC 0.4V or less
On
Surge absorber Zener diode
Response Off → On 1 ㎳ or less
time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)
power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection
14 point terminal block connector(M3 X 6 screw)
method
Weight 313g
Circuit configuration No. Contact No. Contact Type
TB1
AC100
TB2 PE
~240V
TB3
TB4 P
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 NC
TB13 24V
Terminal No.
TB14 24G

7-19
Chapter 7 Input/Output Specifications

7.3.6 XBC-DN14E 6 point transistor output (Sink type)

Model Main unit

Specification XBC-DN14E
Output point 6 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage
DC 10.2 ~ 26.4V
range
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when
DC 0.4V or less
On
Surge absorber Zener diode
Response Off → On 1 ㎳ or less
time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)
power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection
14 point terminal block connector(M3 X 6 screw)
method
Weight 315g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 P
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 44
TB12 45
TB13 24V
Terminal No. TB14 24G

7-20
Chapter 7 Input/Output Specifications

7.3.7 XBC-DN20E 8 point transistor output (Sink type)

Model Main unit

Specification XBC-DN20E
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 418g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 P
TB5 40
Internal Circuit

TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 COM2
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 NC
TB19 NC
TB20 NC
Terminal No. TB21 NC
TB22 NC
TB23 24V
TB24 24G

7-21
Chapter 7 Input/Output Specifications

7.3.8 XBC-DN30E 12 point transistor output (Sink type)

Model Main unit

Specification XBC-DN30E
Output point 12 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 423g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 P
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 COM2
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 COM3
TB19 48
TB20 49
TB21 4A
TB22 4B
TB23 24V
Terminal No.
TB24 24G

7-22
Chapter 7 Input/Output Specifications

7.3.9 XBC-DP10E 4 point transistor output (Source type)

Model Main unit

Specification XBC-DP10E
Output point 4 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage
DC 10.2 ~ 26.4V
range
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when
DC 0.4V or less
On
Surge absorber Zener diode
Response Off → On 1 ㎳ or less
time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)
power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection
14 point terminal block connector(M3 X 6 screw)
method
Weight 313g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 N
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 NC
Terminal No. TB13 24V
TB14 24G

7-23
Chapter 7 Input/Output Specifications

7.3.10 XBC-DP14E 6 point transistor output (Source type)

Model Main unit

Specification XBC-DP14E
Output point 6 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage
DC 10.2 ~ 26.4V
range
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when
DC 0.4V or less
On
Surge absorber Zener diode
Response Off → On 1 ㎳ or less
time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)
power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection
14 point terminal block connector(M3 X 6 screw)
method
Weight 315g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 N
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 44
TB12 45
Terminal No. TB13 24V
TB14 24G

7-24
Chapter 7 Input/Output Specifications

7.3.11 XBC-DP20E 8 point transistor output (Source type)

Model Main unit

Specification XBC-DP20E
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 418g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 N
TB5 40
Internal Circuit

TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 COM2
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 NC
TB19 NC
TB20 NC
Terminal No. TB21 NC
TB22 NC
TB23 24V
TB24 24G

7-25
Chapter 7 Input/Output Specifications

7.3.12 XBC-DP30E 12 point transistor output (Source type)

Model Main unit

Specification XBC-DP30E
Output point 12 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 423g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 N
Internal Circuit

TB5 40
TB6 COM0
TB7 41
TB8 COM1
TB9 42
TB10 43
TB11 NC
TB12 COM2
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 COM3
TB19 48
TB20 49
TB21 4A
TB22 4B
TB23 24V
Terminal No. TB24 24G

7-26
Chapter 7 Input/Output Specifications

7.3.13 XBC-DR20SU 8 point relay output

Model Main unit


XBC-DR20SU
Specification
Output point 8 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10ms or less
time On → Off 12ms or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
42 point terminal block connector (M3 X 6 screw)
method
Weight 450g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
TB2 PE
RY TB3 ~240V
TB4 COM0
COM0 TB4 TB5 40
TB7 TB6 COM1
TB7 41
RY
TB8 COM2
Internal circuit

TB6 TB9 42
COM1
TB10 43
TB9
TB11 NC
RY TB12 COM3
TB10 TB13 44
COM2 TB8 TB14 45
TB15 46
TB13 TB16 47
RY
TB17 NC
TB16 TB18 NC
COM3 TB12 TB19 NC
TB20 NC
Terminal No.
TB21 NC
TB22 NC
TB23 24V
TB24 24G

7-27
Chapter 7 Input/Output Specifications

7.3.14 XBC-DR30SU 12 point relay output

Model Main unit

Specification XBC-DR30SU
Output point 12 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10 ㎳ or less
time On → Off 12 ㎳ or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
42 point terminal block connector (M3 X 6 screw)
method
Weight 465g
Circuit configuration No. Contact No. Contact Type
TB5 TB1
AC100
TB2 PE
TB3 ~240V
COM0 TB4
TB4 COM0
TB7 TB5 40
TB6 COM1
TB7 41
COM1 TB6
Internal Circuit

TB8 COM2
TB9 TB9 42
TB10 TB10 43
TB11 NC
COM2 TB8 TB12 COM3
TB13 TB13 44
TB14 45
TB16
TB15 46
COM3 TB12 TB16 47
TB19 TB17 NC
TB22 TB18 COM4
TB19 48
COM4 TB18 TB20 49
Terminal No. TB21 4A
TB22 4B
TB23 24V
TB24 24G

7-28
Chapter 7 Input/Output Specifications

7.3.15 XBC-DR40SU 16 point relay output

Model Main unit


Specification XBC-DR40SU
Output point 16 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10ms or less
time On → Off 12ms or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
30 point terminal block connector (M3 X 6 screw)
method
Weight 594g
Circuit configuration No. Contact No. Contact Type

TB1 AC100
TB2 PE
TB5 TB3 ~240V
R
TB4 COM0
TB5 40
COM0 TB4
TB6 COM1
TB7 TB7 41
TB8 COM2
R TB9 42
COM1 TB6 TB10 43
TB11 NC
Internal circuit

TB9
TB12 COM3
R TB10 TB13 44
COM2
TB14 45
TB8
TB15 46
TB13 TB16 47
TB17 NC
R TB16 TB18 COM4
COM3 TB12 TB19 48
TB25 TB20 49
TB21 4A
R TB28 TB22 4B
COM5 TB24
TB23 NC
TB24 COM5
Terminal TB25 4C
block no. TB26 4D
TB27 4E
TB28 4F
TB29 24V
TB30 24G

7-29
Chapter 7 Input/Output Specifications

7.3.16 XBC-DR60SU 24 point relay output

Model Main unit


Specification XBC-DR60SU
Output point 24 point
Insulation method Relay insulation
Rated load
DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM
voltage/current
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times / hour
Surge absorber None
Mechanical 20 million times or more
Rated load voltage / Current 100,000 times or more
Service life AC200V / 1.5A, AC240V / 1A (COSΦ = 0.7) 100,000 times or more
Electrical
AC200V / 1A, AC240V / 0.5A (COSΦ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more
Response Off → On 10ms or less
time On → Off 12ms or less
Common method 4 point / COM (COM0~COM8), 8 point / COM (COM4~COM5)
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Operation indicator LED On when Output On
External connection
30 point terminal block connector (M3 X 6 screw)
method
Weight 804g
Circuit configuration No. Contact No. Contact Type
TB1 AC100
TB2 PE
TB3 ~240V
TB4 COM0
TB5 40
TB5
TB6 COM1
TB7 41
R
TB8 COM2
TB9 42
COM0 TB4 TB10 43
TB7 TB11 NC
TB12 COM3
R
TB13 44
TB14 45
COM1 TB6 TB15 46
TB16 47
Internal circuit

TB9
TB17 NC
TB18 COM4
R TB10 TB19 48
COM2 TB8 TB20 49
TB21 4A
TB13 TB22 4B
TB23 NC
R TB16 TB24 COM5
COM3 TB25 4C
TB12
TB26 4D
TB37 TB27 4E
TB28 4F
R TB40 TB29 NC
COM7 TB30 COM6
TB36 TB31 50
TB32 51
Terminal block TB33 52
no. TB34 53
TB35 NC
TB36 COM7
TB37 54
TB38 55
TB39 56
TB40 57
TB41 24V
TB42 24G

7-30
Chapter 7 Input/Output Specifications

7.3.17 XBC-DN20S(U) 8 point transistor output (Sink type)

Model Main unit

Specification XBC-DN20S(U)
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 470g
Circuit configuration No. Contact No. Contact Type

TB05 TB1
AC100
DC5V TB2 PE
R ~240V
TB3
TB07
TB4 COM0
TB04 TB5 40
DC12/24V TB6 COM1
TB9
TB7 41
R TB8 COM2
TB10 TB9 42
TB06 TB10 43
Internal circuit

DC12/24V TB11 P
TB13 TB12 COM3
TB13 44
R
TB14 TB14 45
TB15 46
TB08 TB16 47
DC12/24V TB17 NC
TB15
TB18 NC
R TB19 NC
TB16
TB20 NC
TB12 TB21 NC
DC12/24V TB22 NC
TB11
TB23 24V
Terminal no. TB24 24G

7-31
Chapter 7 Input/Output Specifications

7.3.18 XBC-DN30S(U) 12 point transistor output (Sink type)

Model Main unit

Specification XBC-DN30S(U)
Output point 12 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 475g
Circuit configuration No. Contact No. Contact Type

TB05 TB1
AC100
DC5V TB2 PE
R ~240V
TB3
TB07
TB4 COM0
TB04 TB5 40
DC12/24V TB6 COM1
TB10
TB7 41
R TB8 COM2
TB13 TB9 42
TB06 TB10 43
Internal circuit

TB11 P
DC12/24V
TB15 TB12 COM3
TB13 44
R
TB18 TB14 45
TB15 46
TB08 TB16 47
DC12/24V TB17 NC
TB20
TB18 COM4
R TB19 48
TB22
TB20 49
TB18 TB21 4A
DC12/24V TB22 4B
TB11
Terminal TB23 24V
block no. TB24 24G

7-32
Chapter 7 Input/Output Specifications

7.3.19 XBC-DN40SU 16 point TR output (Sink type)

Model Main unit


Specification XBC-DN40SU
Output point 16 point
Insulation method Photo-coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge killer Zener diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
supply power Current 25 ㎃ or less (when connecting DC24V)
Operation indicator LED On When Output On
External connection method 30 point terminal block connector (M3 X 6 screw)
Weight 578g
Circuit configuration No. Contact No. Contact Type

TB05
TB1 AC100
DC5V
TB2 PE
TB3 ~240V
R
TB4 COM0
TB5 40
TB04 TB6 COM1
DC12/24V TB7 41
TB9 TB8 COM2
R
TB9 42
TB10 TB10 43
TB11 P
TB08 TB12 COM3
Internal circuit

DC12/24V TB13 44
TB13 TB14 45
TB15 46
R TB16 47
TB16
TB17 NC
TB12
TB18 COM4
TB19 48
DC12/24V TB20 49
TB25
TB21 4A
R TB22 4B
TB28 TB23 NC
TB24 COM5
TB24 TB25 4C
DC12/24V TB26 4D
TB11
TB27 4E
Terminal block no. TB28 4F
TB29 24V
TB30 24G

7-33
Chapter 7 Input/Output Specifications

7.3.20 XBC-DN60SU 24 point TR output (Sink type)

Model Main unit


Specification XBC-DN60SU
Output point 24 point
Insulation method Photo-coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge killer Zener diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
supply power Current 25 ㎃ or less (when connecting DC24V)
Operation indicator LED On When Output On
External connection method 42 point terminal block connector (M3 X 6 screw)
Weight 636g
Circuit configuration No. Contact No. Contact Type
TB1 AC100
TB2 PE
TB3 ~240V
TB05 TB4 COM0
DC5V TB5 40
R TB6 COM1
TB7 41
TB8 COM2
TB04 TB9 42
TB10 43
DC12/24V TB11 P
TB9
TB12 COM3
R
TB13 44
TB10 TB14 45
TB15 46
TB08
TB16 47
TB17 NC
Internal circuit

DC12/24V TB18 COM4


TB13 TB19 48
TB20 49
R TB21 4A
TB16 TB22 4B
TB23 NC
TB12 TB24 COM5
DC12/24V TB25 4C
TB37 TB26 4D
TB27 4E
R TB28 4F
TB40 TB29 NC
TB30 COM6
TB36 TB31 50
TB32 51
DC12/24V TB33 52
TB11
TB34 53
TB35 NC
Terminal TB36 COM7
TB37 54
block no. TB38 55
TB39 56
TB40 57
TB41 24V
TB42
24G

7-34
Chapter 7 Input/Output Specifications

7.3.21 XBC-DP20SU 8 point transistor output (Source type)

Model Main unit

Specification XBC-DP20SU
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 470g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 COM0
TB5 40
TB6 COM1
TB7 41
TB8 COM2
TB9 42
TB10 43
TB11 N
TB12 COM3
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 NC
TB19 NC
TB20 NC
TB21 NC
TB22 NC
TB23 24V
TB24 24G

7-35
Chapter 7 Input/Output Specifications

7.3.22 XBC-DP30SU 12 point transistor output (Source type)

Model Main unit

Specification XBC-DP30SU
Output point 12 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operation load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge absorber Zener diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper wire size Stranded wire 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)

External Voltage DC12/24V ± 10% (Ripple voltage 4 Vp-p or less)


power Current 25 ㎃ or less (When connecting DC24V)
Operation indicator LED On when Output On
External connection method 24 point terminal block connector(M3 X 6 screw)
Weight 475g
Circuit configuration No. Contact No. Contact Type

TB1
AC100
TB2 PE
~240V
TB3
TB4 COM0
TB5 40
TB6 COM1
TB7 41
TB8 COM2
TB9 42
TB10 43
TB11 P
TB12 COM3
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 COM4
TB19 48
TB20 49
TB21 4A
TB22 4B
TB23 24V
TB24 24G

7-36
Chapter 7 Input/Output Specifications

7.3.23 XBC-DP40SU 16 point TR output (Source type)

Model Main unit


Specification XBC-DP40SU
Output point 16 point
Insulation method Photo-coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge killer Zener diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
supply power Current 25 ㎃ or less (when connecting DC24V)
Operation indicator LED On When Output On
External connection method 30 point terminal block connector (M3 X 6 screw)
Weight 578g
Circuit configuration No. Contact No. Contact Type

TB1 AC100
TB2 PE
TB3 ~240V
TB4 COM0
TB5 40
TB6 COM1
TB7 41
TB8 COM2
TB9 42
TB10 43
TB11 N
TB12 COM3
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 COM4
TB19 48
TB20 49
TB21 4A
TB22 4B
TB23 NC
TB24 COM5
TB25 4C
TB26 4D
TB27 4E
TB28 4F
TB29 24V
TB30 24G

7-37
Chapter 7 Input/Output Specifications

7.3.24 XBC-DP60SU 24 point TR output (Source type)

Model Main unit


Specification XBC-DP60SU
Output point 24 point
Insulation method Photo-coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point)
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop when On DC 0.4V or less
Surge killer Zener diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (rated load, resistive load)
Common method 4 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
supply power Current 25 ㎃ or less (when connecting DC24V)
Operation indicator LED On When Output On
External connection method 42 point terminal block connector (M3 X 6 screw)
Weight 636g
Circuit configuration No. Contact No. Contact Type
TB1 AC100
TB2 PE
TB3 ~240V
TB4 COM0
TB5 40
TB6 COM1
TB7 41
TB8 COM2
TB9 42
TB10 43
TB11 N
TB12 COM3
TB13 44
TB14 45
TB15 46
TB16 47
TB17 NC
TB18 COM4
TB19 48
TB20 49
TB21 4A
TB22 4B
TB23 NC
TB24 COM5
TB25 4C
TB26 4D
TB27 4E
TB28 4F
TB29 NC
TB30 COM6
TB31 50
TB32 51
TB33 52
TB34 53
TB35 NC
TB36 COM7
TB37 54
TB38 55
TB39 56
TB40 57
TB41 24V
TB42 24G

7-38
Chapter 7 Input/Output Specifications

7.4 Digital Input Module Specification


7.4.1 8 point DC24V input module (Source/Sink type)

Model DC input module

Specification XBE-DC08A
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
On Voltage/Current DC19V or higher / 3 ㎃ or higher
Off Voltage/Current DC6V or less / 1 ㎃ or less
Input resistance About 5.6 ㏀

Response Off → On
1/3/5/10/20/70/100 ㎳(set by CPU parameter) Default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by Megohmmeter
Common method 8 point / COM
Proper cable size Stranded pair 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 30 ㎃ (when all point On)
Operation indicator Input On, LED On
External connection
9 point terminal block connector
method
Weight 52 g
Circuit configuration No. Contact Type

TB1 0
TB2 1 TB1
0 Photo coupler TB3 2 TB2
TB1
R
TB3
R
TB4 3
TB4
7 Internal
TB8 TB5 4 TB5
TB9
circuit
COM TB6 5 TB6
TB7
DC24V TB7 6
Terminal block no.
TB8
TB8 7
TB9
TB9 COM

7-39
Chapter 7 Input/Output Specifications

7.4.2 16 point DC24V input module (Sink/Source type)

Model DC input module

Specification XBE-DC16A XBE-DC16B


Input point 16 point
Insulation method Photo coupler insulation
Rated input voltage DC24V DC12/24V
Rated input current About 4 ㎃ About 4/8 ㎃
DC20.4~28.8V
Operation voltage range DC9.5~30V (ripple rate < 5%)
(ripple rate < 5%)
DC19V or higher / 3 ㎃ or DC9V or higher / 3 ㎃ or
On Voltage/Current
higher higher
Off Voltage/Current DC6V or less / 1 ㎃ or less DC5V or less / 1 ㎃ or less
Input resistance About 5.6 ㏀ About 2.7 ㏀

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by CPU parameter) Default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by Megohmmeter
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 40 ㎃ (when all point On)
Operation indicator Input On, LED On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 53 g
Circuit configuration No. Contact Type

TB1 0
TB2 1 TB1
TB3 2 TB2
TB4 3 TB3
TB4
TB5 4
TB5
TB6 5
TB6
TB7 6 TB7
0
TB1 Photo coupler
R TB8 7 TB8
R TB1 8 TB1
7 Internal
TB8
circuit TB2 9 TB2
TB9
COM TB3 A TB3
DC24V TB4 B TB4
Terminal block no. TB5
TB5 C
TB6
TB6 D TB7
TB7 E TB8
TB8 F TB9
TB10
TB9 COM
TB10 COM

7-40
Chapter 7 Input/Output Specifications

7.4.3 32 point DC24V input module (Source/Sink type)

Model DC input module

Specification XBE-DC32A
Input point 32 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃
Operation voltage range DC20.4~28.8V (ripple rate < 5%)
Input Derating Refer to Derating diagram
On Voltage/Current DC 19V or higher / 3 ㎃ or higher
Off Voltage/Current DC 6V or less / 1 ㎃ or less
Input resistance About 5.6 ㏀

Response Off → On
1/3/5/10/20/70/100 ㎳ (set by CPU parameter) Default:3 ㎳
time On → Off
Insulation pressure AC 560Vrms / 3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by Megohmmeter
Common method 32 point / COM
Proper cable size 0.3 ㎟
Current consumption 50 ㎃ (when all point On)
Operation indicator Input On, LED On
External connection method 40 pin connector
Weight 60g
Circuit configuration No. Contact No. Contact Type
B20 00 A20 10
0
DC5V B19 01 A19 11
B20 R Photo coupler
LED B18 02 A18 12
R
B17 03 A17 13 B20 A20
1F A05 Internal B19 A19
B02 circuit B16 04 A16 14 B18 A18
COM
B15 05 A15 15 B17 A17
Terminal block no.
DC24V B16 A16
B14 06 A14 16
B15 A15
Input Derating diagram B13 07 A13 17 B14 A14
100 B13 A13
B12 08 A12 18
B12 A12
90 B11 09 A11 19 B11 A11
80 DC28.8V B10 0A A10 1A B10 A10
On rate (%)

B09 A09
70 B09 0B A09 1B B08 A08
60 B08 0C A08 1C B07 A07
B06 A06
50 B07 0D A07 1D B05 A05
40 B06 0E A06 1E B04 A04
0 10 20 30 40 50 55 ℃ B03 A03
Ambient temperature (℃) B05 0F A05 1F B02 A02
A01
B04 NC A04 NC B01

B03 NC A03 NC
B02 COM A02 COM
B01 COM A01 COM

7-41
Chapter 7 Input/Output Specifications
7.5 Digital Output Module Specification
7.5.1 8 point relay output module

Model Relay output module

Specification XBE-RY08A
Output point 8 point
Insulation method Relay insulation
Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM
Min. load voltage/Current DC5V / 1 ㎃
Max. load voltage/Current AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Mechanical 20 millions times or more
Rated load voltage / current 100,000 times or more
Service life AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more

Response Off → On 10 ㎳ or less


time On → Off 12 ㎳ or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 230 ㎃ (when all point On)
Operation indicator Output On, LED On
External connection method 9 point terminal block connector
Weight 80g

Circuit configuration No. Contact Type

TB1 0

DC5V TB2 1

TB1
TB3 2
TB1 TB2
TB4 3 TB3
Internal RY
circuit TB4
TB5 4
TB8 TB5

TB6 5 TB6
TB9
TB7
TB7 6 TB8
Terminal block no. TB9
TB8 7

TB9 COM

7-42
Chapter 7 Input/Output Specifications

7.5.2 8 point relay output module (Independent point)


Model Relay output module

Specification XBE-RY08B
Output point 8 point
Insulation method Relay insulation
Rated load voltage /
DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 2A/COM
Current
Min. load voltage/Current DC5V / 1 ㎃
Max. load
AC250V, DC125V
voltage/Current
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Mechanical 20 millions times or more
Rated load voltage / current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more

Response Off → On 10 ㎳ or less


time On → Off 12 ㎳ or less
Common method 1 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 230 ㎃ (when all point On)
Operation indicator Output On, LED On
External connection
9 point terminal block connector x 2
method
Weight 81g
configu
Circuit configuration No. No.
ration
TB1 0
TB2 COM0 TB1
TB2
DC5V
TB3 1
TB3
TB4 COM1
TB4
TB5 2 TB5
TB1
TB6 COM2 TB6
RY TB7 3 TB7
TB2 TB8 COM3 TB8
TB9 NC TB9

Internal TB1 4
TB1
circuit TB2 COM4
TB7 TB2
TB3 5 TB3
RY
TB8 TB4 COM5 TB4
TB5 6 TB5
TB6 COM6 TB6
Terminal no.
TB7
TB7 7
TB8
TB8 COM7
TB9
TB9 NC

7-43
Chapter 7 Input/Output Specifications

7.5.3 16 point relay output module

Model Relay output module

Specification XBE-RY16A
Output point 16 point
Insulation method Relay insulation
Rated load voltage/ current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM
Min. load voltage/current DC5V / 1 ㎃
Max. load voltage/current AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Mechanical 20 millions times or more
Rated load voltage / current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more

Response Off → On 10 ㎳ or less


time On → Off 12 ㎳ or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 420 ㎃ (when all point On)
Operation indicator Output On, LED On
External connection method 9 point terminal block connector x 2 ea
Weight 130g
Circuit configuration No. Contact Type
TB1 0
TB2 1 TB1
TB2
DC5V
TB3 2
TB3
TB4 3
TB4
TB5 4 TB5
TB1 TB6 5 TB6
Internal RY TB7 6 TB7
circuit TB8 7 TB8
TB8 TB9 COM TB9

TB9 TB1 8
TB1
TB2 9 TB2
TB3 A TB3
Terminal block no.
TB4 B TB4
TB5 C TB5
TB6 D TB6
TB7
TB7 E
TB8
TB8 F
TB9
TB9 COM

7-44
Chapter 7 Input/Output Specifications

7.5.4 8 point transistor output module (Sink type)

Model Transistor output module

Specification XBE-TN08A
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 40 ㎃ (when all point On)
External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
power
supply Current 10 ㎃ or less (DC24V connection)
Operation indicator Output On, LED On
External connection
10 point terminal block connector
method
Weight 53
Circuit configuration No. Contact Type
TB01 0

DC5V TB02 1
TB01 TB01
TB03 2 TB02
R
TB04 3 TB03
Internal TB04
circuit TB05 4 TB05
TB08
TB06 5 TB06
TB07
TB09 TB07 6
TB08
TB10 TB08 7 TB09
DC12/24V DC12 TB10
TB09
Terminal block no. /24V
TB10 COM

7-45
Chapter 7 Input/Output Specifications

7.5.5 16 point transistor output module (Sink type)

Model Transistor output module

Specification XBE-TN16A
Output point 16 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 60 ㎃ (when all point On)

External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)


power supply Current 10 ㎃ or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 54 g
Circuit configuration No. Contact Type
TB01 0
TB01
TB02 1
TB02
TB03 2 TB03
DC5V TB04 3 TB04
TB01 TB05 4 TB05
TB06 5 TB06
R TB07 6 TB07
Internal TB08 7 TB08
circuit TB01 8
TB01
TB08 TB02 9
TB02
TB03 A
TB03
TB09 TB04 B
TB04
TB05 C TB05
TB10
TB06 D TB06
DC12/24V TB07 E TB07
Terminal block no. TB08 F TB08
DC12 TB09
TB09
/24V
TB10
TB10 COM

7-46
Chapter 7 Input/Output Specifications

7.5.6 32 point transistor output module (Sink type)

Model Transistor output module

Specification XBE-TN32A
Output point 32 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 0.7A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 32 point / COM
Proper cable size 0.3 ㎟
Current consumption 120 ㎃ (when all point On)

External power Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)


supply Current 20 ㎃ or less (DC24V connection)
Operation indicator Output On, LED On
External connection method 40 pin connector
Weight 60g
Conta Conta Type
Circuit configuration No. ct
No. ct
B20 00 A20 10
B19 01 A19 11
DC5V B18 02 A18 12
B20 B20 A20
B17 03 A17 13 B19 A19
B18 A18
R
B16 04 A16 14
B17 A17
B15 05 A15 15 B16 A16
Internal
circuit B14 06 A14 16 B15 A15
A05 B13 07 A13 17 B14 A14
B13 A13
B12 08 A12 18 B12 A12
B01,B02 B11 A11
B11 09 A11 19
B10
A01,A02 A10
B10 0A A10 1A B09 A09
B08 A08
DC12/24V B09 0B A09 1B
Terminal block no.
B07 A07
B08 0C A08 1C B06 A06
B05 A05
B07 0D A07 1D
B04 A04
B06 0E A06 1E B03 A03
B02 A02
B05 0F A05 1F
B01 A01
B04 NC A04 NC
B03 NC A03 NC
B02 DC12/ A02
COM
B01 24V A01

7-47
Chapter 7 Input/Output Specifications

7.5.7 8 point transistor output module (Source type)

Model Transistor output module

Specification XBE-TP08A
Output point 8 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
Current consumption 40 ㎃ (when all outputs are on)

External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)


power Current 10 ㎃ or less (when connecting DC24V)
Operation indicator LED on when output on
External connection
10 pin terminal block connector
method
Weight 30g
Circuit configuration No. Contact Type
TB01 0
DC5V
TB09
TB02 1
TB01
TB03 2
TB02
TB10
Internal TB04 3 TB03
circuit
TB08 TB04
TB05 4
TB05
TB06 5 TB06
R TB07
TB07 6
TB08
TB01
TB08 7 TB09
Terminal TB10
TB09 COM
block no.
TB10 0V

7-48
Chapter 7 Input/Output Specifications

7.5.8 16 point transistor output module (Source type)

Model Transistor output module

Specification XBE-TP16A
Output point 16 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.5A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode

Response Off → On 1 ㎳ or less


time On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 16 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
Current consumption 60 ㎃ (When all outputs are on)

External Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)


power Current 10 ㎃ or less (connecting DC24V)
Operation indicator LED On when output On
External connection method 8 pin terminal block connector + 10 pin terminal block connector
Weight 40g
Circuit configuration No. Contact Type
TB01 0
TB01
TB02 1
TB02
DC5V TB03 2
TB09 TB03
LED TB04 3
TB04
DC12/24V TB05 4
TB10 TB05
Internal TB06 5 TB06
circuit
TB08 TB07 6
L TB07
TB08 7 TB08
TB01 8
TB01
R TB02 9
TB02
TB01 TB03 A
L TB03
TB04 B
TB04
Terminal TB05 C TB05
block no.
TB06 D TB06
TB07 E TB07
TB08 F TB08
TB09 COM TB09
TB10 0V TB10

7-49
Chapter 7 Input/Output Specifications

7.5.9 32 point transistor output module (Source type)

Model Transistor output module

Specification XBE-TP32A
Output point 32 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Load voltage range DC 10.2 ~ 26.4V
Max. load voltage 0.2A / 1 point, 2A / 1COM
Off leakage current 0.1 ㎃ or less
Max. inrush current 4A / 10 ㎳ or less
Max. voltage drop (On) DC 0.4V or less
Surge absorber Zener Diode
Off → On 1 ㎳ or less
Response time
On → Off 1 ㎳ or less (Rated load, resistive load)
Common method 32 point / COM
Proper cable size 0.3 ㎟
Current consumption 120 ㎃ (When all outputs are on)
Voltage DC12/24V ± 10% (ripple voltage 4 Vp-p or less)
External power
Current 20 ㎃ or less (connecting DC24V)
Operation indicator LED On when output On
External connection method 40 pin connector
Weight 60g
Circuit configuration No. Contact No. Contact Type
B20 00 A20 10
B19 01 A19 11
B18 02 A18 12
DC5V B20 A20
B17 03 A17 13
B02,B01 B19 A19
LED B16 04 A16 14 B18 A18
DC12/24V B15 05 A15 15 B17 A17
A02,A01 B16 A16
Internal B14 06 A14 16 B15 A15
circuit A05 B13 07 A13 17 B14 A14
L B13 A13
B12 08 A12 18 B12 A12
B11 09 A11 19 B11 A11
B10 A10
B10 0A A10 1A B09 A09
R
B09 0B A09 1B B08 A08
B07
B20 L B08 0C A08 1C
A07
B06 A06
B07 0D A07 1D B05 A05
Connector B04 A04
B06 0E A06 1E B03 A03
No.
B05 0F A05 1F B02 A02
B01 A01
B04 NC A04 NC
B03 NC A03 NC
B02 A02
COM 0V
B01 A01

7-50
Chapter 7 Input/Output Specifications

7.6 Combined Digital I/O module Input Specification


7.6.1 8 point DC24V input (Source/Sink type)

Model DC input module

Specification XBE-DR16A
Input point 8 point
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 4 ㎃
Operation voltage range DC20.4~28.8V (within ripple rate 5%)
On Voltage/Current DC19V or higher / 3 ㎃ or higher
Off Voltage/Current DC6V or less / 1 ㎃ or less
Input resistance About 5.6 ㏀

Response Off → On
1/3/5/10/20/70/100 ㎳(set by CPU parameter) Default: 3 ㎳
time On → Off
Insulation pressure AC560Vrms / 3Cycle (altitude 2000m)
Insulation resistance 10 ㏁ or more by Megohmmeter
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (External diameter 2.8 ㎜ or less)
Current consumption 280 ㎃ (When all inputs and outputs are on)
Operation indicator LED on when input on
External connection
9 pin terminal block connector
method
Weight 81g
Circuit configuration No. Contact Type

TB1 0
TB2 1 TB1
DC5V
0 Photo coupler TB3 2 TB2
TB1
R
LED TB3
R
TB4 3
TB4
7 Internal
TB8 TB5 4 TB5
TB9
circuit
COM TB6 5 TB6
TB7
DC24V TB7 6
Terminal TB8
block no.
TB8 7
TB9
TB9 COM

7-51
Chapter 7 Input/Output Specifications

7.7 Combined Digital I/O module Output Specification


7.7.1 8 point relay output

Model Relay output module

Specification XBE-DR16A
Output point 8 point
Insulation method Relay insulation
Rated load
DC24V 2A(Resistive load) / AC220V 2A(COSΨ = 1), 5A/COM
voltage / Current
Min. load voltage/Current DC5V / 1 ㎃
Max. load voltage AC250V, DC125V
Off leakage current 0.1 ㎃ (AC220V, 60 ㎐)
Max. On/Off frequency 3,600 times/hr
Surge absorber None
Mechanical 20 millions times or more
Rated load voltage / current 100,000 times or more
Service
AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100,000 times or more
life Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100,000 times or more
DC24V / 1A, DC100V / 0.1A (L / R = 7 ㎳) 100,000 times or more

Response Off → On 10 ㎳ or less


time On → Off 12 ㎳ or less
Common method 8 point / COM
Proper cable size Stranded cable 0.3~0.75 ㎟ (external diameter 2.8 ㎜ or less)
Current consumption 280 ㎃ (When all inputs and outputs are on)
Operation indicator LED on when output on
External connection
9 pin terminal block connector
method
Weight 81g

Circuit configuration No. Contact Type

TB1 0

DC5V TB2 1

LED TB1
TB3 2
TB1 TB2
L
Internal TB4 3 TB3
circuit RY
TB4
TB5 4
TB8 TB5
L
TB6 5 TB6
TB9
TB7
TB7 6 TB8
Terminal
block no. TB9
TB8 7

TB9 COM

7-52
Chapter 7 Input/Output Specifications

7.8 IO Wiring by Using Smart Link Board


7.8.1 Smart link board

Easy wiring is available by connecting the IO connector with smart link board.
The available smart link and IO cable are as follows.
XGB Smart link Connection cable
No. of
Item Model Model Model Length Contents
Pin
XBM-
DN32S SLP- SLT-CT101- For main unit connection
Main unit 40 1m
XBM- T40P XBM (20Pin + 20Pin)
DN16S
XBE- SLP- SLT-CT101-
40 1m
DC32A T40P XBE For expansion module
SLP- SLT-CT101- connection (40Pin)
40 1m
Expansion T40P XBE
module XBE- For expansion module
TN32A SLP- SLP-CT101- connection (40Pin)
40 1m
RY4A XBE Exclusive for relay built-in
SLP type

It describes wring of XGB, SLP-T40P and SLT-CT101-XBM.


For wring of other smart link boards or XGB extension module, refer to XGB user manual for hardware.

1) SLT-T40P terminal array

Terminal array of SLP-T40P is as follows.

Item Specification
Rated voltage AC/DC 125[V]
Rated current Max. 1[A]
Withstanding
600V 1min
voltage
Insulation
100 ㏁ (DC500V)
resistor
Cable
1.25[㎟] or below
specification
Terminal/screw M3 X 8L
6.2 ㎏f.㎝ or
Torque
above
Terminal
PBT, UL94V-0
material
Weight 186g

7-53
Chapter 7 Input/Output Specifications

2) Wiring of SLT-T40P and XGB extension modulet


Wiring of XGB extension module through SLP-T40P and SLT-CT101-XBE is as follows.

At this time, relationship of XGB IO signal and Smart link board terminal number is as follows.
The following figure describes signal allocation when SLT-CT101-XBE is used as connection cable.
When the user makes the cable, make sure that wring is done as figure below.

Terminal block Name


Terminal block board
Pin No. (SLP-T40P)

7-54
Chapter 7 Input/Output Specifications
3) I/O wiring
- XBE-DC32A (SLP-T40P)

- XBE-TN32A (SLP-T40P)

- XBE-TP32A (SLP-T40P)

- XBE-TN32A (SLP-RY4A)

7-55
Chapter 8 Built-in High-speed Counter Function

Chapter 8 Built-in High-speed Counter Function


XGB series have built-in function of High-speed counter in main unit. This chapter describes specifications
and usage of High-speed counter’s function.

8.1 High-speed Counter Specifications


 It describes specifications, setting and usage of function, programming and wiring with external
device of built-in main unit.

8.1.1 Performance specifications


(1) Performance specification
Description
Classification
“E” type “S(U)” type

Count input Signal A-phase, B-phase


Input type Voltage input (Open collector)
signal
Signal level DC 24V
Max. count speed 4kpps 100kpps
Number of 1 phase 4kpps 4 channels 100kpps 2 channels/ 20kpps 6 channels

channels 2 phase 2kpps 2 channels 50kpps 1 channel / 8kpps 3 channels

Count range Signed 32 Bit (-2,147,483,648 ~ 2,147,483,647)


Linear count (if 32-bit range exceeded, Carry/Borrow occurs)
Count mode
Counter max. and min. value is indicated
(Program setting)
Ring count (repeated count within setting range)

Input mode 1-phase input


2-phase input
(Program setting)
CW/CCW input
Signal type Voltage
Increasing/decreasing operation setting by B-phase input
1 phase input
Increasing/decreasing operation setting by program
Up/Down Operating setting by rising edge Operating setting by rising/falling
setting 2 phase input
phase difference edge phase difference

A-phase input: increasing operation


CW/CCW
B-phase input: decreasing operation
Multiplication 1 phase input 1 multiplication
2 phase input 2 multiplication 4 multiplication
function
CW/CCW 1 multiplication
Signal Preset instruction input
Control input Signal level DC 24V input type
Signal type Voltage

8-1
Chapter 8 Built-in High-speed Counter Function

Description
Classification
“E” type “S(U)” type
1 point/channel (for each channel) 2 point/channel (for each channel)
Output points :uses output contact point of main :use output contact point of main
External unit unit
output Selects single-compared (>, >=, =, =<, <) or section-compared output
Type
(included or excluded) (program setting)
Output type Relay, Open-collector output (Sink)

Count Enable To be set through program (count available only in enable status)

Preset function To be set through terminal (contact) or program


Auxiliary mode Count Latch
(Program setting) Count per unit time (time setting value: 1~60,000ms)

(2) Counter/Preset input specification


Classification Spcification

Input voltage 24V DC (20.4V ~ 28.8V)

Input current 4㎃

On guranteed voltage (min.) 20.4V

Off guranteed voltage (max.) 6V

Notice

If higher pulse than high speed counter input limit is inputted, 「abnormal operation stop」 error
may occur because MPU processing time increases to count fast and memory becomes full.
When using high speed counter, consider this.

8-2
Chapter 8 Built-in High-speed Counter Function

8.1.2 Designation of parts


(1) Designation of parts

(a) “E” type


Terminal Names Usage
No. 1-phase 2-phase 1-phase 2-phase
P000 Ch0 counter input Ch0 A-phase input Counter input terminal A-phase input
P001 Ch1 counter input Ch0 B-phase input Counter input terminal B-phase input
P002 Ch2 counter input Ch2 A-phase input Counter input terminal A-phase input
P003 Ch3 counter input Ch2 B-phase input Counter input terminal B-phase input
P004 Ch0 preset 24V Ch0 preset 24V Preset input terminal Preset input terminal
P005 Ch1 preset 24V - Preset input terminal No use
P006 Ch2 preset 24V Ch2 preset 24V Preset input terminal Preset input terminal
P007 Ch4 preset 24V - Preset input terminal No use
COM0 Input common Input common Common terminal Common terminal

(b) “S(U)” type

Terminal Names Usage


No. 1-phase 2-phase 1-phase 2-phase
P000 Ch0 counter input Ch0 A-phase input Counter input terminal A-phase input
P001 Ch1 counter input Ch0 B-phase input Counter input terminal B-phase input
P002 Ch2 counter input Ch2 A-phase input Counter input terminal A-phase input
P003 Ch3 counter input Ch2 B-phase input Counter input terminal B-phase input
P004 Ch4 counter input Ch4 A-phase input Counter input terminal A-phase input
P005 Ch5 counter input Ch4 B-phase input Counter input terminal B-phase input
P006 Ch6 counter input Ch6 A-phase input Counter input terminal A-phase input
P007 Ch7 counter input Ch6 B-phase input Counter input terminal B-phase input
P008 Ch0 preset 24V Ch0 preset 24V Preset input terminal Preset input terminal
P009 Ch1 preset 24V - Preset input terminal No use
P00A Ch2 preset 24V Ch2 preset 24V Preset input terminal Preset input terminal
P00B Ch4 preset 24V - Preset input terminal No use
P00C Ch5 preset 24V Ch4 preset 24V Preset input terminal Preset input terminal
P00D Ch6 preset 24V - Preset input terminal No use
P00E Ch7 preset 24V Ch6 preset 24V Preset input terminal Preset input terminal
P00F Ch8 preset 24V - Preset input terminal No use
COM0 Input common Input common Input common Input common

8-3
Chapter 8 Built-in High-speed Counter Function

(2) Interface with external devices


The internal circuit of High-speed counter is as shown below.
(a) “E” type
Signal On/Off

Operation
Terminal
I/O Internal circuit guaranteed
No. 1-phase 2-phase
voltage

Ch 0 Ch 0 On 20.4~28.8V
2.7 kΩ P00
Pulse input A-phase input Off 6V or less

Ch 1 Ch 0 On 20.4~28.8V
2.7 kΩ P01
Pulse input B-phase input Off 6V or less

Ch 2 Ch 2 On 20.4~28.8V
P02
2.7 kΩ Pulse input A-phase input Off 6V or less

Ch 3 Ch 2 On 20.4~28.8V
P03
2.7 kΩ Pulse input B-phase input Off 6V or less
Input
Ch 0 Ch 0 On 20.4~28.8V
P04
5.6 kΩ Preset input Preset input Off 6V or less

Ch 1 On 20.4~28.8V
P05 -
Preset input Off 6V or less
5.6 kΩ

Ch 2 Ch 2 On 20.4~28.8V
P06
5.6 kΩ Preset input Preset input Off 6V or less
Ch 3 On 20.4~28.8V
P07 -
5.6 kΩ Preset input Off 6V or less
COM0 COM (input common)

For XBC-DR10E, there is no physical circuit for P0006 ~ P0007. Turn on this contact
point by program.

8-4
Chapter 8 Built-in High-speed Counter Function
(b) “S(U)” type

Signal On/Off

Operation
Terminal
I/O Internal circuit guaranteed
No. 1-phase 2-phase
voltage
Ch 0 Ch 0 On 20.4~28.8V
P0000
2.7 kΩ Pulse input A-phase input Off 6V or less
Ch 1 Ch 0 On 20.4~28.8V
P0001
2.7 kΩ Pulse input B-phase input Off 6V or less
Ch 2 Ch 2 On 20.4~28.8V
P0002
2.7 kΩ Pulse input A-phase input Off 6V or less
Ch 3 Ch 2 On 20.4~28.8V
P0003
2.7 kΩ Pulse input B-phase input Off 6V or less
Ch 4 Ch 4 On 20.4~28.8V
P0004
2.7 kΩ Pulse input A-phase input Off 6V or less
Ch 5 Ch 4 On 20.4~28.8V
P0005
2.7 kΩ Pulse input B-phase input Off 6V or less
Ch 6 Ch 6 On 20.4~28.8V
P0006
2.7 kΩ Pulse input A-phase input Off 6V or less
Ch 7 Ch 6 On 20.4~28.8V
2.7 kΩ P0007
Pulse input B-phase input Off 6V or less
Input Ch 0 Ch 0 On 20.4~28.8V
5.6 kΩ P0008
Preset input Preset input Off 6V or less
Ch 1 On 20.4~28.8V
P0009 -
5.6 kΩ Preset input Off 6V or less
Ch 2 Ch 2 On 20.4~28.8V
P000A
5.6 kΩ Preset input Preset input Off 6V or less
Ch 3 On 20.4~28.8V
P000B -
5.6 kΩ Preset input Off 6V or less
Ch 4 Ch 4 On 20.4~28.8V
P000C
5.6 kΩ Preset input Preset input Off 6V or less
Ch 5 On 20.4~28.8V
P000D -
5.6 kΩ Preset input Off 6V or less
Ch 6 Ch 6 On 20.4~28.8V
P000E
5.6 kΩ Preset input Preset input Off 6V or less
Ch 7 On 20.4~28.8V
5.6 kΩ P000F -
Preset input Off 6V or less
COM0 COM(input common)

For XBC-DR/DN20S, there is no physical circuit for P000C ~ P000F. Turn on this
contact point by program.

8-5
Chapter 8 Built-in High-speed Counter Function

8.1.3 “E” type Functions


(1) Counter mode
(a) High Speed counter module can count High Speed pulses which can not be processed by
CPU module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-
2,147,483,648 ~ 2,147,483,647).
(b) Available input is 1-phase input, 2-phase input and CW/ CCW input.
(c) Count increasing/decreasing methods are as follows;
1) For 1-phase input: (1) Increasing/decreasing count operation by program setting
(2) Increasing/decreasing count operation by B-phase input signal
2) For 2-phase input: setting by difference in phase between A-phase and B-phase
3) For CW/CCW input: Increasing operation if B-phase is LOW with A-phase input, and
Decreasing operation if A-phase is LOW with B-phase input.
(d) Auxiliary modes are as follows;
1) Count Latch
2) Periodic Pulse Count
(e) Pulse input mode
1) 1-phase count mode
a) Increasing/decreasing count operation by program setting
● 1-phase 1-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by the
applicable program.

Increasing/Decreasing classification A-phase input pulse A-phase input pulse


rising falling
Increasing/decreasing count setting signal Off Increasing count -
Increasing/decreasing count setting signal On Decreasing count -

● Operation example

A-phase input pulse


Increasing/Decreasing On
count setting signal Off

Count value 10 11 12 13 12 11 10 11

Increasing Decreasing Increasing

b) Increasing/decreasing count operation by B-phase input signal

8-6
Chapter 8 Built-in High-speed Counter Function
● 1-phase 2-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by B-phase.
Increasing/Decreasing classification A-phase input pulse A-phase input pulse
rising falling

B-phase input pulse Off Increasing count -


B-phase input pulse On Decreasing count -

● Operation example

A-phase input pulse

B-phase input pulse Off On

Count value 7 8 9 10 9 8 7 8
Increasing Decreasing Increasing

2) 2-phase count mode


a) 2-phase 2-multiplication operation mode
A-phase input pulse and B-phase input pulse count at rising. If A-phase input is antecedent
to B-phase input, increasing operation starts, and if B-phase input is antecedent to A-phase
input, decreasing operation starts.

▪ Operation example

A-phase input pulse

B-phase input pulse

Count value 2 3 4 5 6 7 8 9 8 7 6 5 4 3

Increasing Decreasing

8-7
Chapter 8 Built-in High-speed Counter Function
3) CW(Clockwise)/CCW(Counter Clockwise) operation mode
A-phase input pulse counts at rising , or B-phase input pulse counts at rising.
Increasing operation executed when B-phase input pulse is Low with A-phase input pulse at
rising, and Decreasing operation executed when A-phase input pulse is Low with B-phase
input pulse at rising.
Increasing/Decreasing
A-phase input pulse High A-phase input pulse Low
classification
B-phase input pulse High - decreasing count

B-phase input pulse Low Increasing count -

▪ Operation example

A-phase input pulse

B-phase input pulse

7 8 9 10 11 10 9 8 7
Count value
Increasing Decreasing

(2) Counter type


2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on
functions.

▪ Counter mode is saved at the following special K area.


Area per each channel (word) *1)
Mode Reference
Ch.0 Ch.1 Ch.2 Ch.3
Counter 0 : linear
K300 K330 K360 K390
mode 1 : ring
*1) If counter mode is set as value other than 0, 1, error code ‘20’ will occur.

8-8
Chapter 8 Built-in High-speed Counter Function

2 types of count can be selected for the applicable use based on functions.
(a) Linear counter
1) Linear Count range: -2,147,483,648 ~ 2,147,483,647
2) If count value reaches the maximum value while increased, Carry will occur, and if count
value reaches the minimum value while decreased, Borrow will occur.
3) If Carry occurs, count stops and increasing is not available but decreasing is available.
4) If Borrow occurs, count stops and decreasing is not available but increasing is available.

+2,147,483,647

Decreasing Increasing

-2,147,483,648
Count start point
Borrow

Carry

(b) Ring count


■ Ring Count range: user-defined minimum value ~ user-defined maximum value
■ Count display: If Ring Counted, user-defined minimum value of Ring Count is counted and
displayed, but the value is not displayed.

• Ring counter value is saved at the following special K area.


Area per each channel (Double word)
type Reference
Ch.0 Ch.1 Ch.2 Ch.3
Ring counter
K310 K340 K270 K400
value

8-9
Chapter 8 Built-in High-speed Counter Function

1) During increasing count


■ Even if count value exceeds user-defined maximum value during increasing count,
Carry only occurs and count does not stop differently to Linear Count.

Carry occurred
Ring Count
maximum value

Preset value
Present position ○:Not included
●:Included
Ring Count
minimum value

2) During decreasing count


■ Even if count value exceeds user-defined minimum value during decreasing count,
Borrow only occurs and count does not stop differently to Linear Count.

Ring Count
maximum value
Present position
Preset value
○:Not included
●:Included

Ring Count
Minimum value (0)
Borrow occurred

3) Operation when setting Ring Count based on present count value (during increasing
count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to increase up to the user-defined maximum value and
down to the user-defined minimum value and keeps counting after Carry occurs.
- Not the maximum but the minimum value only is displayed with count kept on as
shown below.

8-10
Chapter 8 Built-in High-speed Counter Function

Carry occurred
2,147,483,647
Carry occurred
Ring Count
maximum value

Present position
Ring Count
minimum value (0) ○:Not included
●:Included
Present position
-2,147,483,648
※If out of the user-defined ※If within the user-defined range
range

4) Operation when setting Ring Count based on present count value (during decreasing count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to decrease down to the user-defined minimum value and up to
the user-defined maximum value and keeps counting after Borrow occurs.

2,147,483,647
Ring Count
maximum value Present position

Present
Ring Count position
minimum value Borrow occurred
○:Not included
●:Included
Borrow occurred
-2,147,483,648
※If out of the user- ※If within the user-
defined range defined range

Remark

(1) Based on count value within or out of user-defined range, count will be decided to be within or
out of the range when setting Ring Count.

(2) Ring Count setting when count value is out of the range is regarded as user’s mistake. The
count is not available within the Ring Count range.
(3) Use preset function or the like when using Ring Count so to surely position the count value
within the range.

8-11
Chapter 8 Built-in High-speed Counter Function

(3) Compared output


(a) High Speed counter module has a compared output function used to compare present count
value with compared value in size to output as compared.
(b) Available compared outputs are 2 for 1 channel, which can be used separately.
(c) Compared output conditions are 7 associated with >, =, < .
(d) Parameter setting
■ Compared output mode setting

■ Upper setting value is saved in special K area.


*2)
Compared output condition Memory address (word) Value
Present Value < Compared Value Set to “0”
Present Value ≤ Compared Value Set to “1”
Present Value = Compared Value Channel 0 : K302 Set to “2”
Channel 1 : K330
Present Value ≥ Compared Value Channel 2 : K358 Set to “3”
Present Value > Compared Value Channel 3 : K386 Set to “4”
Compared value 1 ≤ Count value ≤ Compared value 2 Set to “5”
Count value ≤ Compared value 1,
Set to “6”
Count value ≥ Compared value 2
*2) If compared output value not set to 0~6 using counter, error code ‘23’ will be occurred.

■ In order to make actual comparison enabled after compared output condition set, the
compared enable signal is to be On.
Area per channel
Classification Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3
Count enable signal K2600 K2700 K2800 K2900 0: N/A, 1: enable

Compared enable signal K2604 K2704 K2804 K2904 0: forbidden, 1: enable

8-12
Chapter 8 Built-in High-speed Counter Function

▪ In order to make external output, the compared equivalent output signal (P20~P27) must be
set. If Compared output contact is Off, Compared coincidence output signal (internal device)
is only output.
Area per channel
Classification Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3
0: Compared output not
Compared equivalent equivalent
K2612 K2712 K2812 K2912
output signal 1: Compared output
equivalent

• Comp output point (P40 ~ P43) setting

8-13
Chapter 8 Built-in High-speed Counter Function

(e) Detailed description for compared output


1) Mode 0 (Present value < Compared value)
■ If counted present value is less than compared value, output is sent out, and if present
value increases to be equal to or greater than compared value, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared output
Min. set value
123460

Compared Output
Enable

Compared Output
output signal

External output
(in case of
designated output)

2) Mode1 (Count value ≤ Compared value)


■ If present count value is less than or equal to compared value, output is sent out, and if
count value increases to be greater than compared value, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared Output
Min. set value 123460

Compared Output
Enable

Compared Output
output signal
External output
(in case of
designated output)

8-14
Chapter 8 Built-in High-speed Counter Function

3) Mode 2 (Count value = Compared value)


■ If present count value is equal to compared value, output is sent out. In order to turn the
output Off, Compared output Enable and Compared output signal is to be On.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared Output
Min. set value 123457

Compared Output
Enable

Compared Output
output signal
External output
(in case of
designated output)

4) Mode 3 (Count value ≥ Compared value)


■ If present count value is greater than or equal to compared value, output is sent out, and if
count value decreases to be less than compared value, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462

Compared Output
123460
Min. set value

Compared Output
Enable

Compared Output
output signal

External output
(in case of
designated output)

8-15
Chapter 8 Built-in High-speed Counter Function

5) Mode 4 (Count value > Compared value)


■ If present count value is greater than compared value, output is sent out, and if count value
decreases to be less than or equal to compared value, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462

Compared Output
123459
Min. set value

Compared Output
Enable
Compared Output
signal

External output
(in case of
designated output)

6) Mode 5 (Compared output Min. set value ≤ Count value ≤ Compared output Max. set value)
■ If present count value is greater than or equal to compared output Min. value and less than
or equal to compared output Max. set value, output is sent out, and if count value
increases/decreases to exceed compared value’s range, output is not sent out.

Count value
123456 123457 123458 123459 123460 123461 123462
Compared Output
Min. set value
123458
Compared Output
Max. set value 123460

Compared Output
Enable

Compared Output
signal

External Output
(in case of
designated output)

8-16
Chapter 8 Built-in High-speed Counter Function

7) Mode 6 (Count value ≤ Compared output Min. value, Count value ≥ Compared output
Max. value)
■ If present count value is less than or equal to compared output Min. value and greater than
or equal to compared output Max. value, output is sent out, and if count value
increases/decreases to exceed compared value’s range, output is not sent out.

Count value
123456 123457 123458 123459 123460 123461 123462
Compared Output
Min. set value
123457
Compared Output
Max. set value 123461
Compared Output
Enable

Compared Output
output signal

External output
(in case of
designated output)

8-17
Chapter 8 Built-in High-speed Counter Function

(4) Carry signal


(a) Carry signal occurs
1) When count range maximum value of 2,147,483,647 is reached during Linear Count.
2) When user-defined maximum value of Ring Count changed to the minimum value during Ring
Count.
(b) Count when Carry Signal occurs
1) Count stops if Carry occurs during Linear Count.
2) Count does not stop even if Carry occurs during Ring Count.
(c) Carry reset
1) The Carry generated can be cancelled by Carry/Borrow reset signal On.

Device area per channel


Classification
Channel 0 Channel 1 Channel 2 Channel 3
Carry signal K2610 K2710 K2810 K2910

(5) Borrow signal


(a) Borrow signal occurs
1) When count range minimum value of -2,147,483,648 is reached during Linear Count.
2) When user-defined minimum value of Ring Count changed to the maximum value during
Ring Count.
(b) Count when Borrow signal occurs
1) Count stops if Borrow occurs during Linear Count.
2) Count does not stop even if Borrow occurs during Ring Count.
(c) Borrow reset
1) The Borrow generated can be cancelled by Carry/Borrow reset signal On..

Device area per channel


Classification
Channel 0 Channel 1 Channel 2 Channel 3
Borrow signal K2611 K2711 K2811 K2911

8-18
Chapter 8 Built-in High-speed Counter Function

6) Revolution/Unit time
While auxiliary mode enable signal is On, it counts the number of input pulses for a specified time.
(a) Setting
1) Input unit time and pulse number per 1 revolution

Setting value is saved at the following special K are and user can designate it directly.
Device area per channel
Classification
Channel 0 Channel 1 Channel 2 Channel 3
*3)
Unit time (1~60000㎳) K322 K352 K382 K412
*3)
If revolution per unit time is enabled and unit time value is other than 1~60000ms, error code
‘34’ occurs.
2) Input pulse number per 1 revolution
Device area per channel
Classification
Channel 0 Channel 1 Channel 2 Channel 3
Pulse number /revolution
*4)
K323 K353 K383 K413
(1~60000)
*4)
If revolution per unit time is enabled and pulse number/revolution is other than 1~60000,
error code ‘35’ occurs.
3) If Count function of revolution per unit time is used, enable signal set by On.
Device area per channel
Classification
Channel 0 Channel 1 Channel 2 Channel 3
Revolution/unit time
K2605 K2705 K2805 K2905
command

(a) Count function of Revolution per Unit time is used to count the number of pulses for a
specified time while Enable signal is On.

8-19
Chapter 8 Built-in High-speed Counter Function

(b) With the displayed number of pulses updated for a specified time and the number of
pulses per revolution input, Revolution/Unit time can be counted.
(c) Number of Revolution per 1 second is indicated after number of pulse per 1 revolution is
set and time is set to 1 second (1000ms). In order to indicate by Revolutions per minute
(RPM), the operation is executed in program.
(d) The example that number of pulse per 1 revolution set to ‘1’ and time is set to 1000 ms is
as shown below. (Ch0)

Command

1000
700
Count value

500 500

400
300 350
0

Revolution 300 100 300 200


per time
(K264) 1000㎳ 1000㎳ 1000㎳ 1000㎳

(f) In order to indicate revolution per minute (RPM), the program is as shown below. In case
of DMUL operation, RPM value is saved 64 bit in D100~D103. If operated RPM value is
used, it can use to Word or Dword type according to system (case of RPM value is small
number).

8-20
Chapter 8 Built-in High-speed Counter Function

(g) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms
is as shown below.

Command

1000
700
Count value

500 500

400
300 350
0

Revolution 30 10 30 20
per time
60000㎳ 60000㎳ 60000㎳ 60000㎳

(7) Count latch


(a) When Count latch signal is On, present count value is latched.
(b) Setting
If present counter value is to latch, Count Latch function is set ‘Use’.
Device area per channel
Classification
Channel 0 Channel 1 Channel 2 Channel 3
Count latch command K2606 K2706 K2806 K2906

(c) Count latch function is operated when Count latch signal is On. Namely, counter value is not
cleared when power supply Off =>On and mode change, it is counted from previous value.
(d) In latch counter function, internal or external preset function has to use for clearing present
value.

8-21
Chapter 8 Built-in High-speed Counter Function

(8) Preset function


It changes the current value into preset value.
There are two types of preset function, internal preset and external preset. External preset is fixed
as input contact point.

• Preset setting value is saved at the following special K area.


Area per each channel (Double word)
Type Ref.
Ch.0 Ch.1 Ch.2 Ch.3
Internal preset K304 K334 K364 K394 -
External preset K306 K336 K366 K396 -

• Preset command is specified through the following special K area, external preset is used by
executing the designated input contact point after allowance bit is on.
Area per each channel (Bit)
Type Ref.
Ch.0 Ch.1 Ch.2 Ch.3
Internal preset
K2601 K2701 K2801 K2901 -
command
External preset
K2602 K2702 K2802 K2902 -
allowance
External preset
P004 P005 P006 P007 -
command

8-22
Chapter 8 Built-in High-speed Counter Function

8.1.4 “S(U)” type Functions


(1) Counter mode
(a) High Speed counter module can count High Speed pulses which can not be processed by
CPU module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-
2,147,483,648 ~ 2,147,483,647).
(b) Available input is 1-phase input, 2-phase input and CW/ CCW input.
(c) Count increasing/decreasing methods are as follows;
1) For 1-phase input: a) Increasing/decreasing count operation by program setting
b) Increasing/decreasing count operation by B-phase input signal
2) For 2-phase input: setting by difference in phase between A-phase and B-phase
3) For CW/CCW input: Increasing operation if B-phase is LOW with A-phase input, and
Decreasing operation if A-phase is LOW with B-phase input.
(d) Auxiliary modes are as follows;
1) Count Latch
2) Count function about the number of revolution per unit time

(e) Pulse input mode


1) 1 phase count mode
a) Increasing/decreasing count operation by program setting
● 1-phase 1-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by the
applicable program.

Increasing/Decreasing classification A-phase input pulse A-phase input pulse


rising falling
Increasing/decreasing count setting signal Off Increasing count -
Increasing/decreasing count setting signal On Decreasing count -

● Operation example

A-phase input pulse


Increasing/Decreasing On
count setting signal Off

Count value 10 11 12 13 12 11 10 11

Increasing Decreasing Increasing

8-23
Chapter 8 Built-in High-speed Counter Function

b) Increasing/decreasing count operation by B-phase input signal


● 1-phase 2-input 1-multiplication operation mode
A-phase input pulse counts at rising and increasing/decreasing will be decided by B-phase.
Increasing/Decreasing classification A-phase input pulse A-phase input pulse
rising falling

B-phase input pulse Off Increasing count -


B-phase input pulse On Decreasing count -

● Operation example

A-phase input pulse

B-phase input pulse Off On

Count value 7 8 9 10 9 8 7 8
Increasing Decreasing Increasing

2) 2-phase count mode


a) 2-phase 4-multiplication operation mode
A-phase input pulse and B-phase input pulse count at rising/falling respectively. If A-phase
input is antecedent to B-phase input, increasing operation starts, and if B-phase input is
antecedent to A-phase input, decreasing operation starts.

▪ Operation example

A-phase input pulse

B-phase input pulse

Count value 2 3 4 5 6 7 8 9 10 1112 1314 15 14 13121110 9 8 7 6 5 4 3 2

Increasing Decreasing

8-24
Chapter 8 Built-in High-speed Counter Function

3) CW(Clockwise)/CCW(Counter Clockwise) operation mode


A-phase input pulse counts at rising , or B-phase input pulse counts at rising.
Increasing operation executed when B-phase input pulse is Low with A-phase input pulse at
rising, and Decreasing operation executed when A-phase input pulse is Low with B-phase
input pulse at rising.
Increasing/Decreasing
A-phase input pulse High A-phase input pulse Low
classification
B-phase input pulse High - decreasing count
B-phase input pulse Low Increasing count -

▪ Operation example

A-phase input pulse

B-phase input pulse

7 8 9 10 11 10 9 8 7
Count value
Increasing Decreasing

(2) Counter mode


2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on
functions.

▪ Counter mode is saved at the following special K area.


Area per each channel (word)
Mode Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Counter 0 : linear
K300 K330 K360 K390 K2220 K2250 K2280 K2310
mode 1 : ring

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Chapter 8 Built-in High-speed Counter Function

(a) Linear counter


■ Linear Count range: -2,147,483,648 ~ 2,147,483,647
■ If count value reaches the maximum value while increased, Carry will occur, and if count
value reaches the minimum value while decreased, Borrow will occur.
■ If Carry occurs, count stops and increasing is not available but decreasing is available.
■ If Borrow occurs, count stops and decreasing is not available but increasing is available.

+2,147,483,647

Decreasing Increasing

-2,147,483,648
Count start point
Borrow

Carry

(b) Ring count


Set Ring Counter Min. Value and Max. value. Preset value and compared set value should
be in range of ring counter min. value and max. value.

• Ring counter max. and min value is saved at the following special K area.
Area per each channel (Double word)
type Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Ring counter
K308 K338 K368 K398 K2228 K2258 K2288 K2318 -
min. value
Ring counter
K310 K340 K270 K400 K2230 K2260 K2290 K2320 -
max. value

8-26
Chapter 8 Built-in High-speed Counter Function

▪ Range of Ring counter: user defined min. value ~ user defined max. value
▪ Counter display: in case of using ring counter, user defined max. value is not displayed.
1) During increasing count
■ Even if count value exceeds user-defined maximum value during increasing count,
Carry only occurs and count does not stop differently to Linear Count.

Carry occurred
Ring Count
maximum value

Preset value
Present position ○:Not included
●:Included
Ring Count
minimum value

2) During decreasing count


■ Even if count value exceeds user-defined minimum value during decreasing count,
Borrow only occurs and count does not stop differently to Linear Count.

Ring Count
maximum value
Present position
Preset value
○:Not included
●:Included

Ring Count
Minimum value (0)
Borrow occurred

3) Operation when setting Ring Count based on present count value (during increasing
count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to increase up to the user-defined maximum value and
down to the user-defined minimum value and keeps counting after Carry occurs.
- Not the maximum but the minimum value only is displayed with count kept on as
shown below.

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Chapter 8 Built-in High-speed Counter Function

Carry occurred
2,147,483,647
Carry occurred
Ring Count
maximum value

Present position
Ring Count
minimum value ○:Not included
●:Included
Present position
-2,147,483,648
※If out of the user-defined ※If within the user-defined range
range

4) Operation when setting Ring Count based on present count value (during decreasing count)
■ If present count value exceeds user-defined range when setting Ring Count
- Error (code no. 27) is occurred and it operates linear counter.
■ If present count value is within user-defined range when setting Ring Count
- Present count value starts to decrease down to the user-defined minimum value and up to
the user-defined maximum value and keeps counting after Borrow occurs.

2,147,483,647
Ring Count
maximum value
Present position

Ring Count
minimum value Present position Borrow occurred
○:Not included
●:Included
Borrow occurred
-2,147,483,648
※If out of the user- ※If within the user-defined
defined range
range

Remark

(1) Based on count value within or out of user-defined range, count will be decided to be within or
out of the range when setting Ring Count.

(2) Ring Count setting when count value is out of the range is regarded as user’s mistake. The
count is not available within the Ring Count range.
(3) Use preset function or the like when using Ring Count so to surely position the count value
within the range.

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Chapter 8 Built-in High-speed Counter Function

(3) Compared output


(a) High Speed counter module has a compared output function used to compare present count
value with compared value in size to output as compared.
(b) Available compared outputs are 2 for 1 channel, which can be used separately.
(c) Compared output conditions are 7 associated with >, =, < .
(d) Parameter setting
■ Comp. output mode setting

■ Upper setting value is saved in special K area.


Memory address (word) *2)
Compared output condition Value
Comp output 0 Comp output 1
Present Value < Compared Value Set to “0”
Present Value ≤ Compared Value Ch.0 K302 Ch.0 K303 Set to “1”
Ch.1 K332 Ch.1 K333
Present Value = Compared Value Ch.2 K362 Ch.2 K363 Set to “2”
Present Value ≥ Compared Value Ch.3 K392 Ch.3 K393 Set to “3”
Ch.4 K2222 Ch.4 K2223
Present Value > Compared Value Ch.5 K2252 Ch.5 K2253 Set to “4”
Compared value 1 ≤ Count value ≤ Compared value 2 Ch.6 K2282 Ch.6 K2283 Set to “5”
Ch.7 K2312 Ch.7 K2313
Count value ≤ Compared value 1,
Set to “6”
Count value ≥ Compared value 2
*2)
If compared output mode set value is other than 0~6 at using counter, error code ‘23’ occurs.

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Chapter 8 Built-in High-speed Counter Function

■ In order to output the compared output signal, compared output enable flag set to ‘1’ after
compared output condition set.
Area per channel
Classification Operation
Ch. 0 Ch. 1 Ch. 2 Ch. 3 Ch. 4 Ch. 5 Ch. 6 Ch. 7
Count enable 0:disable, 1:
K2600 K2700 K2800 K2900 K21800 K21900 K22000 K22100
signal enable

Compared 0 0: disable, 1:
K2604 K2704 K2804 K2904 K21804 K21904 K22004 K22104
enable signal enable

Compared 1 0: disable, 1:
K2607 K2707 K2807 K2907 K21807 K21907 K22007 K22107
enable signal enable

▪ In order to make external output, the compared coincidence output signal (P20~P2F) must
be set. If Compared output contact is ‘Off’ at Special Module Parameter Setting of XG5000,
Compared coincidence output signal (internal device) is only output.
Area per channel
Classification Operation
Ch. 0 Ch. 1 Ch. 2 Ch.4 Ch.5 Ch. 6 Ch.7
Compared coincidence 0: Compared output Off
K2612 K2712 K2812 K2912 K21812 K22012 K22112
output signal 0 1: Compared output On
Compared coincidence 0: Compared output Off
K2613 K2713 K2813 K2913 K21813 K22013 K22113
output signal 1 1: Compared output On

• Comp. output point (P40 ~ P4F) setting

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Chapter 8 Built-in High-speed Counter Function

(e) Detail of comparator output


It describes detail of comparator output (based on comparator output 0)
1) Mode 0 (Present value < Compared value)
■ If counted present value is less than the minimum value of compared output 0, output
is sent out, and if present value increases to be equal to or greater than the minimum
value of compared output 0, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared output 0
min. set value
123460

Compared output 0
Enable

Compared output 0
Output Signal

External output
(in case of
designated output)

2) Mode1 (Count value ≤ Compared value)


■ If present count value is less than or equal to the minimum set value of compared
output 0, output is sent out, and if count value increases to be greater than the
minimum set value of compared output 0, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared output 0
Min. set value 123460

Compared Output 0
Enable

Compared Output 0
output signal

External output
(in case of
designated output)

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Chapter 8 Built-in High-speed Counter Function

3) Mode 2 (Count value = Compared value)


■ If present count value is equal to the minimum set value of compared output 0, output is sent
out. In order to turn the output Off, Compared output Enable signal 0 or Compared
Coincidence Output Enable signal 0 is to be Off.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared output 0
Min. set value 123457

Compared Output 0
Enable

Compared Output 0
output signal
External output
(in case of designated output)

4) Mode 3 (Count value ≥ Compared value)


■ If present count value is greater than or equal to the minimum set value of compared output
0, output is sent out, and if count value decreases to be less than the minimum set value of
compared output 0, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared output 0
Min. set value 123460

Compared Output 0
Enable

Compared Output 0
Output signal
External output
(in case of designated output)

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Chapter 8 Built-in High-speed Counter Function

5) Mode 4 (Count value > Compared Output value)


■ If present count value is greater than the minimum set value of compared output 0, output is
sent out, and if count value decreases to be less than or equal to the minimum set value of
compared output 0, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared Output 0
Min. set value 123459

Compared Output 0
Output Enable

Compared Output 0
Output signal
External output
(in case of designated output)

6) Mode 5
(Section comparison: Min. set value of Compared Output 0 ≤ Count value ≤ Max. set value
of Compared Output 0)
■ If present count value is greater than or equal to the minimum set value of compared
output 0 and less than or equal to the maximum set value of compared output 0, output is
sent out, and if count value increases/decreases to exceed compared value’s range,
output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared Output 0
Min. set value
123458
Compared Output 0
123460
Max. set value
Compared Output 0
output Enable

Compared Output 0
output signal

External output
(in case of designated output)

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Chapter 8 Built-in High-speed Counter Function

7) Mode 6 (Count value ≤ Min. set value of Compared Output 0 or Count value ≥ Max. set
value of Compared Output 0)

■ If present count value is less than or equal to the minimum set value of compared 0 and
greater than or equal to the maximum set value of compared 0, output is sent out, and if
count value increases/decreases to exceed compared value’s range, output is not sent out.

Count value 123456 123457 123458 123459 123460 123461 123462


Compared Output 0
Min. set value 123457
Compared Output 0 123461
Max. set value
Compared Output 0
output Enable

Compared Output 0
output signal

External output
(in case of designated

8-34
Chapter 8 Built-in High-speed Counter Function

(4) Carry signal


(a) Carry signal occurs
1) When count range maximum value of 2,147,483,647 is reached during Linear Count.
2) When user-defined maximum value of Ring Count changed to the minimum value during Ring
Count.
(b) Count when Carry Signal occurs
1) Count stops if Carry occurs during Linear Count.
2) Count does not stop even if Carry occurs during Ring Count.
(c) Carry reset
1) The Carry generated can be cancelled by Carry/Borrow reset signal On.

Device area per channel


Classification
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Carry signal K2610 K2710 K2810 K2910 K21810 K21910 K22010 K22110

(5) Borrow signal


(a) Borrow signal occurs
1) When count range minimum value of -2,147,483,648 is reached during Linear Count.
2) When user-defined minimum value of Ring Count changed to the maximum value during
Ring Count.
(b) Count when Borrow signal occurs
1) Count stops if Borrow occurs during Linear Count.
2) Count does not stop even if Borrow occurs during Ring Count.
(c) Borrow reset
1) The Borrow generated can be cancelled by Carry/Borrow reset signal On.

Device area per channel


Classification
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Borrow signal K2611 K2711 K2811 K2911 K21811 K21911 K22011 K22111

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Chapter 8 Built-in High-speed Counter Function

(6) Revolution/Unit time


While the Flag about the number of revolution per unit time is On, it counts the number of input
pulses for a specified time.
(a) Setting
1) Set the unit time and the number of pulse per 1 revolution.

Setting value is saved at the following special K area and user can designate directly.

Device per each channel (Word) Setting


Class
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7 range
Unit time K322 K352 K382 K412 K2242 K2272 K2302 K2332 1~60000㎳
Pulse/Rev
K323 K353 K383 K413 K2243 K2273 K2303 K2333 1~60000
value

2) In case of using Rev/unit time function, enable the following special K area
Device per each channel (Word)
Class Operation
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Rev/unit
0: disable
time K2605 K2705 K2805 K2905 K21805 K21905 K22005 K22105
1: enable
command

3) Rev/unit time value is saved at the following special K area.


Device per each channel (Word)
Class Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Rev/unit
K264 K274 K284 K294 K2184 K2194 K2204 K2214 -
time

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Chapter 8 Built-in High-speed Counter Function

(b) Count function of Revolution/Unit time is used to count the number of pulses for a
specified time while auxiliary mode enable signal is On.
(c) With the displayed number of pulses updated for a specified time and the number of
pulses per revolution input, Revolution/Unit time can be counted.
(d) Number of Revolution per 1 second is indicated after number of pulse per 1 revolution is
set and time is set to 1 second (1000ms). In order to indicate by Revolutions per minute
(RPM), the operation is executed in program.
(e) The example that number of pulse per 1 revolution set to ‘1’ and time is set to 1000 ms is
as shown below. (Ch0)

Command

1000
700
Count value

500 500

400
300 350
0

Revolution 100 300 200 150


per time
1000㎳ 1000㎳ 1000㎳ 1000㎳

(f) In order to indicate revolution per minute (RPM), the program is as shown below. In case
of DMUL operation, RPM value is saved 64 bit in D100~D103. If operated RPM value is
used, it can use to Word or Dword type according to system (case of RPM value is small
number).

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Chapter 8 Built-in High-speed Counter Function

(g) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms
is as shown below.

Command

1000
700
Count value

500 500

400
300 350
0

Revolution 10 30 20 15
per time
60000㎳ 60000㎳ 60000㎳ 60000㎳

(7) Count latch

When Count latch signal is On, present count value is latched.


▪ Setting
If present counter value is to latch, Count Latch function is set ‘Use’.
Device area per channel
Class Operation
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Count latch 0: disable
K2606 K2706 K2806 K2906 K21806 K21906 K22006 K22106
command 1: enable

▪ Count latch function is operated when Count latch signal is On. Namely, counter value is not
cleared when power supply Off =>On and mode change, it is counted from previous value.
▪ In latch counter function, internal or external preset function has to use for clearing present
value.

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Chapter 8 Built-in High-speed Counter Function

(8) Preset function


It changes the current value into preset value.
There are two types of preset function, internal preset and external preset. External preset is fixed
as input contact point.

• Preset setting value is saved at the following special K area.


Area per each channel (Double word)
Type Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Internal
K304 K334 K364 K394 K2224 K2254 K2284 K2314 -
preset value
External
K306 K336 K366 K396 K2226 K2256 K2286 K2316 -
preset value

• Preset command is specified through the following special K area, external preset is used by
executing the designated input contact point after allowance bit is on.
Area per each channel (Bit)
Type Ref.
Ch.0 Ch.1 Ch.2 Ch.3 Ch.4 Ch.5 Ch.6 Ch.7
Internal
preset K2601 K2701 K2801 K2901 K21801 K21901 K22001 K22101 -
command
External
preset K2602 K2702 K2802 K2902 K21802 K21902 K22002 K22102 -
allowance
External
preset P008 P009 P00A P00B P00C P00D P00E P00F -
command

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Chapter 8 Built-in High-speed Counter Function

8.2 Installation and Wiring

8.2.1 Precaution for wiring


Pay attention to the counteractions against wiring noise especially for High-speed pulse input.
(1) Surely use twisted pair shielded cable, grounded with 3 class applied.
(2) Keep away from power cable or I/O line which may cause noise.
(3) Stabilized power should be used for filter.
▶ Connect A-phase only for 1-phase input.
▶ Connect A-phase and B-phase for 2-phase input.

8.2.2 Example of wiring


(1) In case of pulse generator (encoder) is voltage output type

24V
Pulse Generator

CHSC

COM

24VG High-speed counter input

(2) In case of pulse generator is open collector type

24V

Pulse Generator COM

High-speed counter input


24VG

8-40
Chapter 8 Built-in High-speed Counter Function

8.3 Internal Memory

8.3.1 Special area for High-speed counter


Parameter and operation command area of built-in high-speed counter use a special K device.
If values set in parameter are changed, it works with the changed values. At the moment, makes sure
to use WRT command to save the changed value to flash. If not saved in flash, the changed values
with the power off => on and mode changed may not be maintained.
▪ The following example shows that the internal preset values of CH1 set in parameter are changed by
program and saved in flash.
- Receiving an order command (M000), it moves (MOV) the new internal preset value (5000) to the 메모 [S1]:

CH1 present area (K332).


- To save the changed settings into flash, it uses WRT command. At the moment, slot information is
set to ’0’ in case of built-in function.

Slot info Unused

0: High speed counter


1: determining a location
2: PID

8-41
Chapter 8 Built-in High-speed Counter Function

(1) “E” type


(a) Parameter setting

Description Device area per channel


Parameter Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
h0000 Linear count
Counter
K300 K330 K360 K390 Word
mode h0001 Ring count

h0000 1 phase 1 input 1 multiplication

Pulse input h0001 1 phase 2 input 1 multiplication


K301 K331 K361 K391 Word
mode h0002 CW / CCW

h0003 2 phase 2 multiplication


h0000 (Magnitude) <
h0001 (Magnitude) ≤
h0002 (Magnitude) =
Comp.
h0003 (Magnitude) ≥ K302 K332 K362 K392 Word
Output mode
h0004 (Magnitude) >
h0005 (Range) Include

h0006 (Range) Exclude

Internal
preset value -2,147,483,648 ~ 2,147,483,647 K304 K334 K364 K394 DWord
setting
External
preset value -2,147,483,648 ~ 2,147,483,647 K306 K336 K366 K396 DWord
setting

8-42
Chapter 8 Built-in High-speed Counter Function

Description Device area per channel


Parameter Remark
Value Setting Ch 0 Ch 1 Ch 2 Ch 3
Ring counter
Max. value -2,147,483,648 ~ 2,147,483,647 K310 K340 K370 K400 DWord
setting
Comp. Output
Min. value -2,147,483,648 ~ 2,147,483,647 K312 K342 K372 K402 DWord
setting
Comp. output
Max. value -2,147,483,648 ~ 2,147,483,647 K314 K344 K374 K404 DWord
setting
HFFFF No use
h0000 P0020
h0001 P0021
Comp. output h0002 P0022
point h0003 P0023 K320 K350 K380 K410 Word
designation h0004 P0024
h0005 P0025
h0006 P0026
h0007 P0027

Unit time [ms] 1 ~ 60,000 K322 K352 K382 K412 DWord

1 ~ 60,000 DWord
Pulse/Rev.value K323 K353 K383 K413

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Chapter 8 Built-in High-speed Counter Function

(b) Operation command

Device area per channel


Parameter
Ch 0 Ch 1 Ch 2 Ch 3
Counter enabling K2600 K2700 K2800 K2900
Internal preset
K2601 K2701 K2801 K2901
designation of counter
External preset enabling
K2602 K2702 K2802 K2902
of counter
Designation of
K2603 K2703 K2803 K2903
decremental counter
Comp. output enabling K2604 K2704 K2804 K2904
Enabling of revolution
K2605 K2705 K2805 K2905
time per unit time
Designation of latch
K2606 K2706 K2806 K2906
counter
Carry signal (Bit) K2610 K2710 K2810 K2910
Borrow signal K2611 K2711 K2811 K2911
Comp. output signal K2612 K2712 K2812 K2912

(c) Area of monitoring

Device area per channel


Parameter Remark
Ch 0 Ch 1 Ch 2 Ch 3
Current counter value K262 K272 K282 K292 DWord
Revolution time per unit time K264 K274 K284 K294 DWord

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Chapter 8 Built-in High-speed Counter Function

(2) “S(U)” type


(a) Parameter setting

Description Device area per channel


Parameter Ch 0 Ch 1 Ch 2 Ch 3 Remark
Value Setting
Ch 4 Ch 5 Ch 6 Ch 7

Counter h0000 Linear count K300 K330 K360 K390


Word
mode h0001 Ring count K2220 K2250 K2280 K2310
h0000 1 phase 1 input 1 multiplication
Pulse input K301 K331 K361 K391 Word
h0001 1 phase 2 input 1 multiplication
mode
h0002 CW / CCW
setting K2221 K2251 K2281 K2311 Word
h0003 2 phase 4 multiplication
h0000 (Magnitude) <

h0001 (Magnitude) ≤
Comp. K302 K332 K362 K392
h0002 (Magnitude) =
Output 0
h0003 (Magnitude) ≥ Word
mode
h0004 (Magnitude) >
setting
h0005 (Range) Include K2222 K2252 K2282 K2312
h0006 (Range) Exclude
h0000 (Magnitude) <
h0001 (Magnitude) ≤
Comp. K303 K333 K363 K393
h0002 (Magnitude) =
Output 1
h0003 (Magnitude) ≥ Word
mode
h0004 (Magnitude) >
setting
h0005 (Range) Include K2223 K2253 K2283 K2313
h0006 (Range) Exclude
Internal K304 K334 K364 K394
preset value -2,147,483,648 ~ 2,147,483,647 DWord
K2224 K2254 K2284 K2314
setting
External K306 K336 K366 K396
preset value -2,147,483,648 ~ 2,147,483,647 DWord
K2226 K2256 K2286 K2316
setting

8-45
Chapter 8 Built-in High-speed Counter Function

Description Device area per channel


Parameter Ch 0 Ch 1 Ch 2 Ch 3 Remark
Value Setting
Ch 4 Ch 5 Ch 6 Ch 7
Ring counter K308 K338 K368 K398
min. value -2,147,483,648 ~ 2,147,483,645 DWord
K2228 K2258 K2288 K2318
setting
Ring counter K310 K340 K370 K400
max. value -2,147,483,646 2,147,483,647 DWord
K2230 K2260 K2290 K2320
setting
Comp. output K312 K342 K372 K402
min. value -2,147,483,648 ~ 2,147,483,647 DWord
K2232 K2262 K2292 K2322
setting
Comp. output K314 K344 K374 K404
max. value -2,147,483,648 ~ 2,147,483,647 DWord
K2234 K2264 K2294 K2324
setting
HFFFF No use
h0000 P0020
h0001 P0021
h0002 P0022
h0003 P0023 K320 K350 K380 K410
h0004 P0024
h0005 P0025
Comp. output 0 h0006 P0026
point h0007 P0027 Word
designation h0008 P0028
h0009 P0029
h000A P002A
h000B P002B
K2240 K2270 K2300 K2330
h000C P002C
h000D P002D
h000E P002E
h000F P002F

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Chapter 8 Built-in High-speed Counter Function

Description Device area per channel


Parameter Ch 0 Ch 1 Ch 2 Ch 3 Remark
Value Setting
Ch 4 Ch 5 Ch 6 Ch 7
HFFFF No use
h0000 P0020
h0001 P0021
h0002 P0022
h0003 P0023 K321 K351 K381 K411
h0004 P0024
h0005 P0025
Comp. output 1 h0006 P0026
point h0007 P0027 Word
designation h0008 P0028
h0009 P0029
h000A P002A
h000B P002B
K2241 K2271 K2301 K2331
h000C P002C
h000D P002D
h000E P002E
h000F P002F

K322 K352 K382 K412


Unit time [ms] 1 ~ 60,000 ms Word
K2242 K2272 K2302 K2332

K323 K353 K383 K413


Pulse/Rev.value 1 ~ 60,000 Word
K2243 K2273 K2303 K2333

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Chapter 8 Built-in High-speed Counter Function

(b) Operation command


Device area per channel
Parameter
Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7
Counter enabling K2600 K2700 K2800 K2900 K21800 K21900 K22000 K22100
Internal preset designation
K2601 K2701 K2801 K2901 K21801 K21901 K22001 K22101
of counter
External preset enabling of
K2602 K2702 K2802 K2902 K21802 K21902 K22002 K22102
counter
Designation of decremental
K2603 K2703 K2803 K2903 K21803 K21903 K22003 K22103
counter

Comp. output 0 enabling K2604 K2704 K2804 K2904 K21804 K21904 K22004 K22104

Comp. output 1 enabling K2607 K2707 K2807 K2907 K21807 K21907 K22007 K22107
Enabling of revolution time
K2605 K2705 K2805 K2905 K21805 K21905 K22005 K22105
per unit time
Designation of latch
K2606 K2706 K2806 K2906 K21806 K21906 K22006 K22100
counter
Carry signal (Bit) K2610 K2710 K2810 K29100 K21810 K21910 K22010 K22110
Borrow signal K2611 K2711 K2811 K29101 K21811 K21911 K22011 K22111
Comp. output 0 signal K2612 K2712 K2812 K29102 K21812 K21912 K22012 K22112
Comp. output 1 signal K2613 K2713 K2813 K29103 K21813 K21913 K22013 K22113

(c) Area of monitoring


Device area per channel
Parameter
Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7

Current counter value K262 K272 K282 K292 K2182 K2192 K2202 K2212
Revolution per unit time K264 K274 K284 K294 K2184 K2194 K2204 K2214

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Chapter 8 Built-in High-speed Counter Function

8.3.2 Error code


It describes errors of the built-in high-speed counter.
▪ Error occurred is saved in the following area.
Device area per channel
Category Remark
Ch0 Ch1 Ch2 Ch3 Ch4 Ch5 Ch6 Ch7
Error code K266 K276 K286 K296 K2186 K2196 K2206 K2216 Word

▪ Error codes and descriptions


Error code
Description
(Decimal)
20 Counter type is set out of range
21 Pulse input type is set out of range
Requesting #1(3,)channel Run during the operation of #0(2) channel 2 phase(
22
* During #0(2) channel 2 phase inputting, using #1(3)channel is not possible.
23 Compared output type setting is set out of range.
25 Internal preset value is set out of counter range
26 External present value is set out of counter range
Ring counter setting is set out of range
27
* Note ring counter setting should be 2 and more.
28 Compared output min. value is set out of permissible max. input range
29 Compared output max. value is set out of permissible max. input range
30 Error of Compared output min. value>Compared output max. value
31 Compared output is set out of the default output value
34 Set value of Unit time is out of the range
35 Pulse value per 1 revolution is set out of range

Remark
▪ If two and more errors occur, the module saves the latter error code and removes
the former one.

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Chapter 8 Built-in High-speed Counter Function

8.4 Examples: Using High-speed Counter

It describes examples of using high-speed counter.


(1) Setting high-speed counter parameter
How to set types of parameters to operate a high-speed counter is described as follows.
(a) Set 『Internal Parameters』 in the basic project window.

(b) Selecting high-speed counter opens a window to set high-speed counter parameters as follows.
For details regarding each parameter setting, refer to 8.1~8.3.
(Every parameter settings are saved in the special K device area.)

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Chapter 8 Built-in High-speed Counter Function

(c) Turn ‘ON’ the high-speed counter Enable signal (CH0:K2600) in the program.

(d) To use additional functions of the high-speed counter, you needs to turn on the flag allowing
an operation command.
* Refer to 2) Operation Command, <8.3.1 Special K Area for High-speed Counter>
For instance, turn on 2605 bit if among additional functions, rotation number function is used.

(e) Upon the setting, download program and parameter to PLC.

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Chapter 8 Built-in High-speed Counter Function

(2) Monitoring and setting command


Monitoring and command setting of high-speed counter are described as follows.
(a) If starting a monitor and clicking a Special Module Monitor, the following window is opened.

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Chapter 8 Built-in High-speed Counter Function

(b) Clicking 『Monitor』 shows monitor and test window of high-speed counter.

Item Description
FLAG Monitor Show flag monitoring and command window of high-speed counter
Start Monitoring Start monitoring each item (special K device area monitor).
Write each item setting to PLC.
Test
(Write the setting to special K device)
Close Close monitor

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Chapter 8 Built-in High-speed Counter Function

(c) Clicking 『Start Monitoring』shows the high-speed counter monitor display, in which you
may set each parameter. At this moment, if any, changed values are not saved if power off=>
on or mode is changed.

(d) Clicking『FLAG Monitor』 shows the monitor of each flag in high-speed counter, in which
you may direct operation commands by flags (clicking commands reverse turn).

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Chapter 9 RTC Option Board

Chapter 9 RTC Option Board

9.1 Battery

9.1.1 Battery specification

Item Specification
Voltage/Current DC 3V / 220 mA
Warranty period 3 years (ambient temp.)
Program and data backup,
Purpose
RTC operation in case of power failure
Specification Manganese Dioxide lithium battery
Dimension (mm) φ 20 X 3.2 mm

9.1.2 Notice in using


(1) Do not heat the battery or solder the polarity. ( It may cause the reduction of life.)
(2) Do not measure the voltage or short with tester. (It may cause the fire.)
(3) Do not disassemble the battery.

9.1.3 Life of battery


Life of battery depends on the power failure time and ambient temperature etc..
If battery is getting low, main unit cause the warning, ‘battery voltage low warning’. The user can check it
by error LED, flag and error message of XG5000.
Since battery works properly for long time, after battery voltage low warning, so the user can take the
action after battery voltage low warning occurred.

9-1
XGB RTC Option Board Manual

9.1.4 How to change battery

The user should change the battery used to save the program and backup the data in case of power
failure periodically. Though the user eliminate the battery, it works for 30 minute by super capacitor.
Change the battery as fast as possible.

Sequence changing battery is as follows.

Start of battery change

Open battery cover

Pick up using battery from holder and


disassemble the connector

Insert new battery and connect to


connector with proper direction

Check the LED whether ERR LED is off

Yes
ERR LED off?
No
Complete
Battery malfunction

Remark

1) Battery for Program and Data back- up can be used with RTC
- RTC provides advanced back-up function compare to without RTC
- Refer to 4.5 Data backup time for more details.

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Chapter 9 RTC Option Board

9.2 RTC Function


Economic type (XBC-DxxxE), standard type (XBC-DxxxS, XBC-DxxxSU) doesn’t support RTC
function. If you equip RTC option board, you can use this function for time management of system or
error log. RTC function is executed steadily when power is off or instantaneous power cut status.
Current time of RTC is renewed every scan by system operation status information flag.

9.2.1 How to use

(1) Reading/setting clock data


(a) Reading or setting from XG5000
1) Click『Online』의『PLC Information』.
2) Click PLC RTC tap of PLC Information』.

3) In case the user wants to send the clock of PC to PLC, press ‘Synchronize PLC with PC clock’.
4) In case the user wants to send the clock the user wants, change the setting value of Time box
and press ‘Send to PLC’.

(b) Reading by special relay


The user can monitor as follows by special relay.
Special relay area Data Contents
F053 H0710 10year 07month
F054 H1729 29date 17hour
F055 H1020 10second 20minute
F056 H2004 20XXyear, Thursday

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XGB RTC Option Board Manual

(c) Modification of clock data by program

area Content
M0000 Month, year
M0001 Hour, date
M0002 Second, minute
M0003 Centaury, day

Write clock data to temporary device (P, M, K, L, Z, U, D, R) and turn on/off input contact point
M0100. ( If date and day data is not matched, Write is not available.)
Monitor and check the above special area (F053~F056)

(d) How to express the day


Number 0 1 2 3 4 5 6

Day Sunday Monday Tuesday Wednesday Thursday Friday Saturday

(2) Deviation of clock data


±2. 2s / 1 d (normal temperature)
Operating temperature Max deviation (second/day)
0℃ -5.5 ~ 1.5
25 ℃ -2.2 ~ 2.2
55 ℃ -7 ~ 1

Remark

1) Initially, RTC may not have any clock data.


2) When using the product, first make sure to set the accurate clock data.
3) If any data out of the clock data range is written into RTC, it does not work properly.
i.e.) 14M 32D 25H
4) RTC may stop or have an error due to abnormal battery and other causes. The error is released if a
new clock data is written.
5) Be aware that margin of error depend on operating temperature.

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Chapter 9 RTC Option Board

9.3 Name and Function of Each Part


(1) Describes the name and function of each part

① Hook for fixation

② Option board cover

③ Battery cover

④ Hook for fixation

No. Name Contents


Hook for
①④ ▶ Hook for fixing the option board to main unit
fixation
Option board
② ▶Option board cover
cover
③ Battery cover ▶Battery cover

(2) RTC can operate only in 9th slot.

9-5
Chapter 10 DC Input Option Board

Chapter 10 DC Input Option Function


This chapter describes specifications and usage of input option board’s function.

10.1 DC input Option Board Specification

10.1.1 DC Input Option Board Specification

Specification of XGB input option board is as follows.

DC input specification
Item
XBO-DC04A Remark
4 points (supports high-speed counter function
Input point
when installed at standard type)
Insulation Method Photo coupler insulation
Rated input voltage DC24V
Rated input current About 10㎃
Voltage range DC20.4~28.8V (ripple rate within 5%)
On voltage / On current DC19V or above / 3㎃ or above
Off voltage / Off current DC6V or less / 1㎃ or less
Input resistance About 2.7㏀
Response Off → On 1/3/5/10/20/70/100㎳ (set through I/O parameter)
time On → Off Initial value: 3㎳
Common method 4 points / COM ″
High speed Performance 4kpps 4 channels (based on 1 phase) when installed at
counter Mode Linear counter standard type

Circuit configuration

Standard/
economic type

10 - 1
Chapter 10 DC Input Option Board

10.2 High Speed Counter Specification


High speed counter function is built in XGB input option board. It describes specifications, setting and usage
of function, programming and wiring with external device.

10.2.1 Performance Specification

(1) Performance Specification

Specification
Item
XBO-DC04A

Signal A-phase, B-phase


Count input
Input type Voltage input (Open collector)
signal
Signal level DC 24V
Max. count speed 4kpps

No. of 1 phase 4kpps 4 channels


channels 2 phase 2kpps 2 channels
Count range Signed 32 Bit (-2,147,483,648 ~ 2,147,483,647)
Count type
Linear count (if it exceeds 32-bit range, Carry/Borrow occurs)
(Program setting)
Input mode 1-phase input
(Program setting) 2-phase input
Signal type Voltage
Increasing/decreasing operation setting by B-phase input
Up/Down 1-phase input
Increasing/decreasing operation setting by program
setting
2-phase input Automatic setting by difference in phase

Multiplication 1 phase input 1 multiplication


function 2 phase input 2 multiplication
Count Enable Set by program (Counted on “Enable” statue)
Preset function Set by program

(2) Counter input specification

Item Specification

Input voltage 24V DC (20.4V ~ 28.8V)

Input current 10㎃

On guranteed voltage (min.) 20.4V

Off guranteed voltage (max.) 6V

10 - 2
Chapter 10 DC Input Option Board

10.2.2 Name of Each Part

(1) Name of each part

Name XBO-DC04A

Structure

Terminal Name Usage


No. 1-phase 2-phase 1-phase 2-phase

00 Ch0 counter input Ch0 A-phase input Counter input terminal A-phase input
terminal
01 Ch1 counter input Ch0 B-phase input Counter input terminal B-phase input
terminal
02 Ch2 counter input Ch2 A-phase input Counter input terminal A-phase input
terminal
03 Ch3 counter input Ch2 B-phase input Counter input terminal B-phase input
terminal
COM Input common Input common Common terminal Common terminal

10 - 3
Chapter 10 DC Input Option Board

(2) Interface with external devices

The following table describes interface with external devices

Operation
Signal Input
Terminal
I/O Internal circuit guaranteed
No. 1-phase 2-phase
voltage
CH0 On 20.4~28.8V
CH0
2.7 kΩ 00 A-phase
Pulse input Off 6V or less
input
CH0 On 20.4~28.8V
CH 1
2.7 kΩ 01 B-phase
Pulse input Off 6V or less
input

Input 2.7 kΩ CH2 On 20.4~28.8V


CH 2
02 A-phase
Pulse input Off 6V or less
input
2.7 kΩ
CH0 On 20.4~28.8V
CH 3
03 B-phase
Pulse input Off 6V or less
input

COM COM(Input common)

10 - 4
Chapter 10 DC Input Option Board

10.2.3 Function

(1) Counter mode

(a) High Speed counter module can count High Speed pulses which can not be processed by CPU module’s
counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-2,147,483,648 ~
2,147,483,647).
(b) Available input mode is 1-phase input, 2-phase input
(c) Count increasing/decreasing methods are as follows;
1) 1-phase input : a) Increasing/decreasing count operation by program setting
b) Increasing/decreasing count operation by B-phase input signal
2) 2-phase input : setting by difference in phase between A-phase and B-phase
(d) Auxiliary modes are as follows
1) Count Latch
(e) Input mode
1) 1-phase count mode
a) Increasing/decreasing count operation by program setting
• 1-phase 1-input 1-multiplication
A-phase input pulse is counted at rising and increasing/decreasing will be decided by the
program.
Increasing/Decreasing A-phase input pulse rising A-phase input pulse falling
classification
Increasing/decreasing count Increasing count -
setting signal Off
Increasing/decreasing count Decreasing count -
setting signal On

• Operation example

A-phase input pulse


Increasing/Decreasing On
count setting signal Off

Count value 10 11 12 13 12 11 10 11

Increasing Decreasing Increasing

10 - 5
Chapter 10 DC Input Option Board

b) Increasing/decreasing count operation by B-phase input signal


•1-phase 2-input 1-multiplication
A-phase input pulse is counted at rising and increasing/decreasing will be decided by B-phase.
Increasing/Decreasing A-phase input pulse A-phase input pulse
rising falling
classification
B-phase input pulse Off Increasing count -
B-phase input pulse On Decreasing count -
• Operation example

A-phase input pulse

B-phase input pulse Off On

Count value 7 8 9 10 9 8 7 8
Increasing Decreasing Increasing

2) 2-phase count mode


a) 2-phase 2-multiplication
A-phase input pulse and B-phase input pulse are counted at rising respectively. If A-phase input
is antecedent to B-phase input, increasing operation starts, and if B-phase input is antecedent to
A-phase input, decreasing operation starts.
• Operation example

A-phase input pulse

B-phase input pulse

Count value 2 3 4 5 6 4 3
7 8 9 8 7 6 5

Increasing Decreasing

10 - 6
Chapter 10 DC Input Option Board

(2) Counter type

Option board supports linear counter.


(a) Linear counter
1) Linear Count range: -2,147,483,648 ~ 2,147,483,647
2) If count value reaches the maximum value while increased, Carry will occur, and if count value
reaches the minimum value while decreased, Borrow will occur.
3) If Carry occurs, count stops and increasing is not available but decreasing is available.
4) If Borrow occurs, count stops and decreasing is not available but increasing is available.

+2,147,483,647

Decreasing Increasing

-2,147,483,648
Count start point
Borrow

Carry

(3) Carry signal

(a) When Carry signal occurs


1) When count range maximum value of 2,147,483,647 is reached during Linear Count
(b) Count when Carry Signal occurs
1) Count stops if Carry occurs during Linear Count.
(c) Carry reset
1) ‘Carry reset’ instruction is not supported at option board. Reset ‘Carry’ by using ‘Preset’ instruction
after making the counter value within counter range.

(4) Borrow signal

(a) When Count when Borrow signal occurs


1) When count range minimum value of -2,147,483,648 is reached during Linear Count.
(b) Count when Borrow signal occurs
1) Count stops if Borrow occurs during Linear Count.
(c) Borrow reset
1) ‘Carry reset’ instruction is not supported at option board. Reset ‘Carry’ by using ‘Preset’ instruction
after making the counter value within counter range.

10 - 7
Chapter 10 DC Input Option Board

(5) Count latch

(a) When Count latch signal is On, present count value is latched
(b) Setting
If present counter value is to latch, Count Latch function is set ‘Use’.
Device area per channel
Type Ref.
CH0 CH1 CH2 CH3
When mounted at slot
U9.0.6 U9.8.6 U9.16.6 U9.24.6
no.9 0: Disable
When mounted at slot 1: Enable
UA.0.6 UA.8.6 UA.16.6 UA.24.6
no.10
(c) Count latch function is operated when ‘Count latch’ signal is On. Namely, counter value is not cleared
when power supply Off =>On and mode change, it is counted from previous value.
(d) In latch counter function, internal preset function has to be used for clearing present value.

(6) Preset function

It changes the current value into preset value.


• Preset setting value is saved at the following U area.
Area per each channel (Double word)
Type Ref.
CH0 CH1 CH2 CH3
Slot no. 9 internal
U9.6 U9.14 U9.22 U9.30
preset value
Slot no. 10 internal
UA.6 UA.14 UA.22 UA.30
preset value

• Preset command is specified through the following U area


Area per each channel (bit)
Type Ref.
CH0 CH1 CH2 CH3
Internal preset 0:
U9.0.1 U9.8.1 U9.16.1 U9.24.1
command
Disable
Internal preset 1:
UA.0.1 UA.8.1 UA.16.1 UA.24.1
command Enable

10 - 8
Chapter 10 DC Input Option Board

10.3 Installation and Wiring


10.3.1 Precaution for wiring
Pay attention to the counteractions against wiring noise especially for High-speed pulse input

(1) Surely use twisted pair shielded cable, grounded with 3 class applied.

(2) Keep away from power cable or I/O line which may cause noise.

(3) Stabilized power should be used.

▶ Connect A-phase only for 1-phase input.


▶ Connect A-phase and B-phase for 2-phase input.

10.3.2 Example of wiring

(1) In case of pulse generator (encoder) is voltage output type

24V
Pulse generator
Pulse Generator

CHSC

COM

24VG High-speed counter input

10 - 9
Chapter 10 DC Input Option Board

(2) In case of pulse generator is open collector type

24V

CHSC
Pulse
Pulse generator
Generator COM

High-speed counter input

24VG

10 - 10
Chapter 10 DC Input Option Board

10.4 Internal Memory

10.4.1 Special area for High-speed counter


U device is used for parameter and operation command area of built-in high-speed counter.
This chapter describes on how to register basic paramter and each item.

(1) U device auto-registration

(a) Set the module at slot in [I/O parameter]

(b) Double-click [Variable/comment]

(c) Select ‘Register U device’ on menu ‘Edit’

10 - 11
Chapter 10 DC Input Option Board

(d) Click ‘Yes’.

(e) Variables are registered as follows.

Note
When registered by “auto-registration”, data type is expressed as BIT, WORD. If you want to
check with other types such as DINT, DWORD, change the type.

10 - 12
Chapter 10 DC Input Option Board

(2) No. 9 slot device area

(a) Action command


Device area per each channel
Type Ref.
CH0 CH1 CH2 CH3
Enable counter U9.0.0 U9.8.0 U9.16.0 U9.24.0 BIT
Enable internal preset U9.0.1 U9.8.1 U9.16.1 U9.24.1 BIT
Count inc/dec flag U9.0.3 U9.8.3 U9.16.3 U9.24.3 BIT
Latch counter enable U9.0.6 U9.8.6 U9.16.6 U9.24.6 BIT
Pulse input mode U9.5 U9.13 U9.21 U9.29 INT
Internal preset setting value U9.6 U9.14 U9.22 U9.30 DINT

(b) Monitor area

Device area per each channel


Type Ref.
CH0 CH1 CH2 CH3
Carry flag U9.1.0 U9.9.0 U9.17.0 U9.25.0 BIT
Borrow flag U9.1.1 U9.9.1 U9.17.1 U9.25.1 BIT
Current counter value U9.2 U9.10 U9.18 U9.26 DINT
Error code U9.4 U9.12 U9.20 U9.28 INT

(3) No. 10 slot device area

(a) Action command


Device area per each channel
Type Ref.
CH0 CH1 CH2 CH3
Enable counter UA.0.0 UA.8.0 UA.16.0 UA.24.0 BIT
Enable internal preset UA.0.1 UA.8.1 UA.16.1 UA.24.1 BIT
Count inc/dec flag UA.0.3 UA.8.3 U9.16.3 UA.24.3 BIT
Latch counter enable UA.0.6 UA.8.6 UA.16.6 UA.24.6 BIT
Pulse input mode UA.5 UA.13 UA.21 UA.29 INT
Internal preset setting value UA.6 UA.14 UA.22 UA.30 DINT

(b) Monitor area

Device area per each channel


Type Ref.
CH0 CH1 CH2 CH3
Carry flag UA.1.0 UA.9.0 UA.17.0 UA.25.0 BIT
Borrow flag UA.1.1 UA.9.1 UA.17.1 UA.25.1 BIT
Current counter value UA.2 UA.10 UA.18 UA.26 DINT
Error code UA.4 UA.12 UA.20 UA.28 INT

10 - 13
Chapter 10 DC Input Option Board

(4) Parameter setup

(a) Action command


Device status information (based on slot 9, ch0)
Type Ref.
CH0 Information
Enable counter U9.0.0 0: disable, 1: enable BIT
Enable internal preset U9.0.1 0: disable, 1: enable BIT
Count inc/dec flag U9.0.3 0: INC, 1: DEC BIT
Latch counter enable U9.0.6 0: disable, 1: enable BIT
0: 1-phase 1-input
Pulse input mode U9.5 1: 1-phase 2-input INT
2: 2-phase 2 multiplication
Internal preset setting value U9.6 -2,147,483,648 ~ 2,147,483,647 DINT

(b) Monitor area

Device status information (based on slot 9, ch0)


Type Ref.
CH0 Information
Carry flag U9.1.0 0: disable, 1: enable BIT
Borrow flag U9.1.1 0: disable, 1: enable BIT
Current counter value U9.2 -2,147,483,648 ~ 2,147,483,647 DINT
Error code U9.4 Indicates error code INT

10.4.2 Error code


Describes on error of option board high-speed counter
• Describes error code
Error
code Error contents Ref.
(Dec.)
21 Pulse input type range setting error
CH1(3) RUN request while CH0(2) 2-phase RUN
22
* CH1(3) is not available when CH0(2) operate as 2-phase mode
25 Internal preset value exceeded counter range

Note
If more than two errors occur, the latest error code is saved and previous error code is removed.

10 - 14
Chapter 10 DC Input Option Board

10.5 Example using high-speed counter

Describes on option board high-speed counter example

(1) High-speed counter setup

Set up option board high-speed counter operation by using U area.

(a) Select high-speed counter mode.

Set up high-speed counter mode

(b) If you need ‘Preset’ function, input ‘Preset value’ and turn on ‘Preset Enable” bit.

Input value to preset

Preset Enable signal ON

(c) Specify ‘Latch counter’ or ‘Up/Down counter’


(d) Turn on ‘High-speed counter enable’ signal

Turn on High-speed Counter Enable signal (No. 9 slot, No.0 ch) of input option board (XBO-DC04A)

(2) Monitoring

You can check option board high-speed counter value by registering U9.2 (no.0 slot, no.0 ch) at
variable mornitring window or program.

10 - 15
Chapter 11 TR Output Option Board

Chapter11 TR Output Option Board


This chapter describes specification and how to use the output option board.

11.1 TR Output Option Board Operation Sequence of Positioning

11.1.1 Operation Sequence of Positioning


Operation sequence is as follows. Positioning function of the option board operates only at slot number 9.

11 - 1
Chapter 11 TR Output Option Board

11.2 XBO-TN04A Specification

11.2.1 Output option board specification

Transistor output specification


Item
XBO-TN04A Remark
4 (Pulse output function is supported when
No. of output
mounted on standard type)
Insulation method Photo coupler insulation
Rated load voltage DC 24V
Max. load current 0.5A/point, 2A/COM
Surge killer Zener diode
Leakage current when Off 0.1㎃ or less
Voltage drop when On DC 1V or less
Inrush current 3A, 10㎳ or less
Off → On 1㎳ or less
Response time
On → Off 1㎳ or less
Operating indicator -
No. of axes 2
Output method Open collector method When mounted
Pulse output Control unit Pulse on standard
Control speed 10kpps (One option board supported _ No. 9 slot) type
Setting method Setup by DST instruction

Circuit configuration

11 - 2
Chapter 11 TR Output Option Board

11.3 Positioning Specification

Positioning function is built in XGB output option board. This describes specification, how-to-use, function,
programming and wiring of built-in positioning.

11.3.1 Performance Specification

(1) Performance Specification


Model
XBO-TN04A
Item
No. of axes 2
Control method Position control, speed control
Control unit Pulse
Method Incremental
Positioning

Address range -2,147,483,648 ∼ 2,147,483,647(pulse)


Speed range 1 ∼10,000pps(1pps unit)
Manual operation JOG operation
Home return By DOG
Max. connection
distance 2m

Connector 6 Pin connector

11.3.2 Name of each part

(1) Name of each part

XBO-TN04A
Item
Diagram

Inner
circuit

Structure

11 - 3
Chapter 11 TR Output Option Board

Connector Output point No. Description Remark


Positioning X-axis pulse string output point
X-axis 00
Pulse (Open collector output)
output Positioning Y-axis pulse string output point
Y-axis 01
(Open collector output) High
Positioning X-axis direction output point Active
X-axis 02
Direction (Open collector output)
output Positioning Y-axis direction output point
Y-axis 03
(Open collector output)
External
X/Y-axis 24V Terminal for external power supply for TR
power
Output
X/Y-axis COM Output common terminal
common

(2) Output pulse level

Basic option board output pulse is as follows.

Pulse output Output signal level


Output signal
method Forward Reverse

Pulse

Pulse+Direction
mode

Direction

11 - 4
Chapter 11 TR Output Option Board

11.3.3 Before Positioning

(1) Positioning function list

Positioning function of XGB option board built-in positioning is as follows.


Positioning
description Instruction Ref.
function
Speed DST

Operation
pattern Time
Start
command
Position control
Dec. stop

If the rising edge of start command is detected, it moves with designated


Operation speed to designated position, and complete signal is on (dwell is not
supported)

DST
Speed

Operation
pattern Start Time
command
Speed control
Dec. stop

If the rising edge of start command is detected, it moves with designated


Operation speed and stops after deceleration by stop command. At this time,
complete signal will not be not on.

11 - 5
Chapter 11 TR Output Option Board

(2) Position control

Position control is to move the designated axis from start address (present position) up to target address
(movement). There are two position control methods, absolute and incremental.

(a) Control by absolute coordinates (Absolute coordinates)


Object moves from start address to target address. Position control is performed, based on the address
designated in Home Return (home address).
Direction is determined by start address and target address.
• Start address < target address: forward positioning
• Start address > target address: reverse positioning

(b) Control by incremental coordinates (incremental coordinates)


Object moves from current position as far as the address set in operation data. At this time, target address
is based on start address. Direction is determined by sign (+,-).
• In case Address is positive number: forward positioning (Direction increasing address)
• In case Address is negative number: reverse positioning (Direction decreasing address)

(3) Speed control

Speed control means that object moves with steady speed (steady pulse string) until stop command.

• In case of speed control, direction is determined by sign of Address set in operation data.
Forward : Address is positive number
Reverse : Address is negative number
In the speed control, direction is determined by sign of target address regardless of current position and
target position.
For example, current position is 100 and target position is 90, though target position is less than current
position, since sign is positive, it moves forward.

Note
• For more information, refer to XGB positioning manual.

11 - 6
Chapter 11 TR Output Option Board

11.3.4 Positioning Stop Factor


(1) Stop factor and how to deal with stop factor
• If following factor occurs during positioning, it stops without completing positioning.
In case positioning stops by stop instruction (STP, EMG) or following stop factor, generally, the only axis
where stop instruction is executed or stop factor occurs stops.

Operation Axis operation


*1 Jog
status Positioning Homing status after stop
operation *2
Stop factor instruction

Error 322
Dec. stop
Dec. stop Dec. stop (Keep Decelerating
Stop by instruction
operating)
sequence
program
*3 Error status
Emg. Stop
Immediate stop (Error 481)
instruction
Output prohibited

Forward
External upper Error status
Immediate stop immediate
Stop by limit “On” (Error 492)
stop
external
signal Backward
External lower Error status
Immediate stop immediate
limit “On” (Erro 493)
stop

Note
*1 : Positioning refers to position control, speed control by positioning data.
*2 : If axis is ‘Output prohibited status’ after being stopped, run a instruction to cancel ‘Output
prohibited status’. (CLR instruction) .
*3 : Stop by sequence program refers to stop by “Stop instruction” at XGB program.

(2) Stop Process and Priority


(a) Dec. stop process
• If it stops due to deceleration stop instruction, since positioning operation is not complete, it does not
generate positioning completion signal.

(b) Process of emergency stop and external input upper/lower limits


• If emergency stop instruction or external input upper/lower limits are inputted during positioning control,
it stops positioning control and turns into ‘Output prohibited stats’, generating an error.

(c) Stop process priority


The priority of stop process is as follows.

Dec. stop < Emg. stop

11 - 7
Chapter 11 TR Output Option Board

(d) Emergency stop


• It immediately stops if it meets emergency stop while performing start-related instructions (indirect start,
direct start, Home Return start, jog start).
• Emergency stop generates Error 481.
• Since it turns into “Output prohibited status” and “un-defined origin status”, once emergency stop is
executed, execute origin determination (Home return, Current position preset) again to run an
instruction that requires defined origin status”

11.3.5 Manual operation


In general, manual operations refer to operation which doesn’t use operation data. In output option board,
JOG operation is supported.

(1) JOG operation


• Jog operation means positioning by jog operation stat contact point

Jog high speed/low


Jog forward start Jog backward start
speed

X-axis U9.1.8 U9.1.9 U9.1.A


XBO-
TN04A
Y-axis U9.17.8 U9.17.9 U9.17.A

• It is operated by jog speed set in positioning parameter.


• It can be executed when origin is not determined.
• Acceleration/deceleration process is controlled by the duration set in jog acceleration/deceleration time
among parameter settings of this software package.
• If jog speed is set out of allowable range, it generates an error and operation is not available

High speed jog


1 ∼1
operation
Range (Unit: 1pps)
Low speed jog
1 ∼
jog high speed
operation

Remark

• Make sure to follow the cautions

Bias speed ≤ Jog high speed ≤ Speed limit

11 - 8
Chapter 11 TR Output Option Board

11.3.6 Home return


XBO-TN04A supports only “Home return by DOG”.

(a) If homing command (ORG instruction) is executed, it accelerates to home direction set in Home
Parameter and it homes with high speed.
(The above figure is example when homing direction is forward)
(b) While target is homing with high speed, if rising edge of DOG (U9.1.B: X-axis) occurs, target speed
decreases and change its direction.
(c) When it accelerates after changing direction, if rising edge of DOG occurs, it homes with low speed.
(d) In the homing status with low speed, rising edge occurs of DOG third time, it stops and determines
the origin.
(e) When ‘On’ time of DOG signal is larger decreasing time, it changes the direction at the falling edge
of DOG and moves with low speed and stops at the rising edge of DOG and determines the origin.

11 - 9
Chapter 11 TR Output Option Board

11.3.7 Positioning Basic Parameter Setup


This chapter describes on how to register basic parameter of XGB main output option board positioning
function and each item.

(1) U device auto registration


(a) Set up the module at the slot in [I/O Parameter]

(b) Double-click [Variable/Comment].

(c) Select “Register U device” on menu ‘Edit’.

11 - 10
Chapter 11 TR Output Option Board

(d) Click ‘yes’.

(e) Variables are registered as the screen below.

Note
When variables are registered by above method, variables are expressed by BIT and WORD.
If you want to check them as DINT, DOWRD, change the data type.

11 - 11
Chapter 11 TR Output Option Board

(2) Positioning parameter of XBO-TN04A

U area of each item is as follows.


U area for
Signal
Item Data type Status information positioning
direction
X-axis Y-axis
BUSY 0: Stop, 1: Run U9.0.0 U9.16.0

Error 0: No error, 1: Error occurred U9.0.1 U9.16.1

Positioning complete 0: not complete, 1: complete U9.0.2 U9.16.2

Home determination 0: not determined, 1: determined U9.0.3 U9.16.3

0: output available,
Output prohibited U9.0.4 U9.16.4
1: output prohibited

Stop status 0: not stop status, 1: stop status U9.0.5 U9.16.5

Upper limit 0: not detect, 1: detect U9.0.6 U9.16.6

Lower limit 0: not detect, 1: detect U9.0.7 U9.16.7

0: normal status,
EMG. Stop U9.0.8 U9.16.8
1: EMG. Stop status

CW/CCW 0:CW, 1:CCW U9.0.9 U9.16.9

0: not accelerating ,
Operation status (accelerating) Output U9.0.A U9.16.A
1: accelerating
(monitoring)
0: not steady status,
Operation status (steady status) U9.0.B U9.16.B
1: steady status
BOOL
0: not decelerating ,
Operation status (decelerating) U9.0.C U9.16.C
1: decelerating

0: not under position control


Position control U9.0.D U9.16.D
1: under position control

0: not under speed control


Speed control U9.0.E U9.16.E
1: under speed control

0: not under home return


Home return U9.0.F U9.16.F
1:under home return

0: not under JOG low speed


JOG low speed U9.1.0 U9.17.0
1: under JOG low speed

0: not under JOG high speed


JOG high speed U9.1.1 U9.17.1
1: under JOG high speed

0: JOG stop,
Forward JOG start U9.1.8 U9.17.8
1: forward JOG start
Input
0: JOG stop,
Reverse JOG start U9.1.9 U9.17.9
1: Reverse JOG start

11 - 12
Chapter 11 TR Output Option Board

U area for
Signal
Item Data type Status information positioning
direction
X-axis Y-axis
0: JOG low speed,
JOG low/high speed U9.1.A U9.17.A
1: JOG high speed

DOG Operate at rising edge U9.1.B U9.17.B

Upper limit signal Detected at falling edge U9.1.C U9.17.C

Lower limit signal Detected at falling edge U9.1.D U9.17.D

Home return direction 0: CW, 1: CCW U9.1.E U9.17.E


BOOL Input
Positioning status 0: disable, 1: enable U9.1.F U9.17.F

Current position DINT -2,147,483,648 ~ 2,147,483,647 U9.2 U9.18

Current speed WORD Output 1 ~ 10,000[pulse/s] U9.4 U9.20

Error code WORD Indicates positioning error U9.5 U9.21

Bias speed WORD 1 ~ 10,000[pulse/s] U9.6 U9.22

Speed limit WORD 1 ~ 10,000[pulse/s] U9.7 U9.23

Acc. time WORD 0 ~ 10,000[unit: ms] U9.8 U9.24

Dec. time WORD 0 ~ 10,000[unit: ms] U9.9 U9.25

Home address DINT Input -2,147,483,648 ~ 2,147,483,647 U9.10 U9.26

Home return high speed WORD 1 ~ 10,000[pulse/s] U9.12 U9.28

Home return low speed WORD 1 ~ 10,000[pulse/s] U9.13 U9.29

JOG high speed WORD 1 ~ 10,000[pulse/s] U9.14 U9.30

JOG low speed WORD 1 ~ 10,000[pulse/s] U9.15 U9.31

Note
• For more information on positioning parameter item, refer to XGB built-in positioning manual.

11 - 13
Chapter 11 TR Output Option Board

11.4 Positioning Instruction List

Positioning instructions used in XBO-TN04A positioning are summarized as follows.

(1) XBO-TN04A positioning instruction


XGB built-in
Instructi
Command Command condition positioning
on
manual
ORG Home return Slot, command axis 5.2.1

Slot, command axis, position, speed, dwell time, M code,


DST Direct start 5.2.3
control word

STP Stop Slot, command axis, dec. time 5.2.9

PRS Current position preset Slot, command axis, position 5.2.18

EMG EMG. Stop Slot, command axis 5.2.19

Error reset, output


CLR Slot, command axis, disable/enable pulse output 5.2.20
prohibition cancel

Note
• XGB positioning instruction operates at rising edge. Namely, instruction is executed once when execution
contact point is on.
• For instruction, refer to XGB positioning manual.
• When using DST instruction in XBO-TN04A, dwell time and M code are not supported.

11 - 14
Chapter 11 TR Output Option Board

11.5 Positioning Example

This chapter describes positioning example of XBO-TN04A.

(1) Positioning setup

Option board positioning is set up by U area. Set up each parameter to use positioning function.

(a) Input each parameter value.

X-axis bias speed

Speed limit

X acc. time

X dec. time

X JOG high speed

X JOG low speed

Y-axis bias speed

Speed limit

Y acc. time

Y dec. time

Y JOG high speed

Y JOG low speed

(b) Turn On or Off according whether to use positioning

X positioning enable bit

Y positioning enable bit

11 - 15
Chapter 11 TR Output Option Board

(c) Set up the function as follows.

(2) Monitoring

You can check option board posioing speed, crrent position by regstering U9.2, U9.4(No. 9 slot, X-axis)
at variable monitor window or program

11 - 16
Chapter 12 Memory Module

Chapter12 Memory Module

12.1 Memory Module Specification

You can save user program safely or download user program to PLC without special handling when user
program is damaged by using external memory module in XGB PLC

12.1.1 Memory module specification

Item XBO-M2MB Ref.

Memory capacity 2MByte


Memory type Flash Memory
Specification USB supported, Program Read/Write
1. RUN
Indicator LED 2. WRITE
3. READ
Operating mode setup Mode setup by rotary switch
RS-232C communication connecter,
Operating power supply 5V
USB connector
Purpose For moving

12.1.2 Memory module structure

RUN LED
WRITE LED
READ LED

USB connector 1 : READ mode


RS-232C connector
3 : WRITE mode
5 : PADT I/F mode

Note
-.Memory module can be used for XGB (not supported for XGK/I/R)
-.Memory module is not supported at the version below
(XBMS: V2.5 or less, XBCH: V1.8 or less, XECH: V1.2 or less)

12-1
Chapter 12 Memory Module
12.1.3 How to use memory module

(1) Save program, parameter, communication parameter at external memory module


(a) Set the switch of memory module as 1
(b) Install memory module at the RS-232C port of main unit
- After installation, program and parameter (including communication) is saved into memory module
and READ LED is on
- If Saving program and parameter is complete, READ LED is off
(c) Separate memory module from main unit

(2) Save user program of external memory module at main unit


(a) Set the operating mode of main unit as STOP
- In RUN mode, you can’t save program
(b) Set the switch of memory module as 3
(c) Install the memory module
- Install it at the RS-232C port of the main unit.
- PLC program and parameter (including communication) is written and WRITE LED is on
- If saving program and parameter is complete, WRITE LED is off.
(d) If you change operation mode of PLC into RUN, PLC operates with program and parameter saved in
memory module.

With the above handling, you can run PLC with program saved in memory module

(3) Save program of XG5000at the memory module


(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select Project  Write to Memory on XG5000 menu.

(c) ‘Write’ window is created as follows.

(d) “Writing completed” window appears.


12-2
Chapter 12 Memory Module

(e) With above method, through PADT, you can save program, parameter, communication parameter at
XBO-M2MB

(4) Open from memory module


(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select “Project  Open from Memory” on XG5000 menu

(c) “Read” window is created as follows.

(d) “Reading is completed” window appears.


12-3
Chapter 12 Memory Module

(e) With above method, through PADT, you can save program, parameter, communication parameter
from XBO-M2MB

(5) Write to Memory module


(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port
(b) Click “Online  Write to Memory module” on XG-PD menu

(c) If you click “OK” button, it saves each parameter at the memory module.

12-4
Chapter 12 Memory Module

(d) If “Enable Link” window appears, check the item and press “Write”

(e) “Enable, Disable” window appears

12-5
Chapter 12 Memory Module

(6) Read from Memory module


(a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC
(b) Select “Online  Read from Memory module” on XG-PD menu.

(c) If you click “OK” button”, it read each parameter form the memory module.

Note
-. “Open from memory module” and “Write to Memory module” menus of PADT are activated when
PLC is Offline. They are deactivated when PLC is Online.
-. When connecting with PADT, connection type should be ‘USB’

12-6
Chapter 12 Memory Module

12.1.4 How to use when password is set

(1) When connecting PADT with memory module


(a) When setting password at program and writing program to memory module, it is saved according to
rotary switch operating mode without functions cancelling the password
1) When writing program, check whether to use password at ‘Write’ window.

2) If you press ‘OK’ after setting password, program is saved at memory module with that
password.

(b) When reading password-set program to PADT, screen appears, which is same as when password is
set in PLC.

1) “Password” window is created.

2) If you input password same as that in memory module, it reads program.


3) When password is incorrect, error message appears as follows.

12-7
Chapter 12 Memory Module

(2) Write to PLC by memory module

(a) When password of program in memory module is not set


1) When no password is set in PLC
- Saves program of the memory module in PLC
2) When password is set in PLC
- Writing is not executed

(b) When password of program in memory module is set


1) When no password is set in PLC
- Writing to PLC is executed
But, password of the memory module is not written to PLC.
2) When password is set in PLC
- When PLC password is same as that of the memory module, writing is executed.
- When PLC password is not same as that of the memory module, writing is not executed.
(WRITE LED flickers)

12-8
Chapter 12 Memory Module

(3) Reading program in PLC to memory module

(a) When password of program in PLC is not set


1) When no password is set in the memory module
- Reads program from PLC
2) When password is set in the memory module
- After reading, it clears password of the memory module

(b) When password of program in PLC is set


1) When no password is set in the memory module
- Writing is not executed
2) When password is set in the memory module
- When PLC password is same as that of the memory module, writing is executed.
- When PLC password is not same as that of the memory module, writing is not executed.

(4) When LED flickers

Condition LED
1 PLC type is not XGB RUN LED flickers
2 Operating mode changes while being connected to PADT or RUN LED flickers
PLC
3 Connected to PADT while mode switch is “1” READ LED flickers
4 PLC program upload is prohibited READ LED flickers
5 You execute reading when password is set in PLC READ LED flickers
(when password is not same as that of memory module)
6 Connected to PADT while mode switch is “3” WRITE LED flickers
7 You execute writing the memory module when PLC mode is WRITE LED flickers
RUN
8 Connected to the different type of PLC with the type set in the WRITE LED flickers
memory module
9 You executes writing when PLC password is not same as that of WRITE LED flickers
memory module

Note
-. Memory module can cancel PLC password and read/write but can’t set, delete and change the
password.
-. Do not run PLC while external memory module is connected to.
-. Do not remove memory module while READ/WRITE LED is on.

12-9
Chapter 9130 Installation and Wiring
스타일 정의: 본문설명3:
들여쓰기: 왼쪽 -0.31 글자, 첫
줄: 0 글자
Chapter 1309 Installation and Wiring 스타일 정의: 본문설명5:
들여쓰기: 왼쪽: 4.61 글자,
내어쓰기: 0.01 글자, 첫 줄:
-0.01 글자
9103.1 Safety Instruction 스타일 정의: 알아두기1:
들여쓰기: 왼쪽: 0.2", 내어쓰기:
2.83 글자

Danger
 Please design protection circuit at the external of PLC for entire system to operate safely because an
abnormal output or an malfunction may cause accident when any error of external power or malfunction
of PLC module.
(1) It should be installed at the external side of PLC to emergency stop circuit, protection circuit,
interlock circuit of opposition action such as forward /reverse operation and interlock circuit for
protecting machine damage such as upper/lower limit of positioning.
(2) If PLC detects the following error, all operation stops and all output is off.
(Available to hold output according to parameter setting)
(a) When over current protection equipment or over voltage protection operates
(b) When self diagnosis function error such as WDT error in PLC CPU occurs
 In case of error about IO control part that is not detected by PLC CPU, all output is off.
Design Fail Safe circuit at the external of PLC for machine to operate safely. Refer to 10.2 Fail Safe
circuit.
(1) Because of error of output device, Relay, TR, etc., output may not be normal. About output signal that
may cause the heavy accident, design supervisory circuit to external.
In case load current more than rating or over current by load short flows continuously, danger of heat, fire
may occur so design safety circuit to external such as fuse.
Design for external power supply to be done first after PLC power supply is done. If external power
supply is done first, it may cause accident by misoutput, misoperation.
In case communication error occurs, for operation status of each station, refer to each communication
manual.
In case of controlling the PLC while peripheral is connected to CPU module, configure the interlock circuit
for system to operate safely. During operation, in case of executing program change, operation status
change, familiarize the manual and check the safety status. Especially, in case of controlling long
distance PLC, user may not response to error of PLC promptly because of communication error or etc.
Limit how to take action in case of data communication error between PLC CPU and external device
adding installing interlock circuit at the PLC program.

9103 −1
Chapter 9130 Installation and Wiring

Danger

Don’t close the control line or communication cable to main circuit or power line. Distance should be more
than 100mm. It may cause malfunction by noise.

In case of controlling lamp load, heater, solenoid valve, etc. in case of Off -> On, large current (10 times of
normal current) may flows, so consider changing the module to module that has margin at rated current.

서식 있음: 들여쓰기: 왼쪽: 0",


Process output may not work properly according to difference of delay of PLC main power and external 내어쓰기: 0.98 글자, 첫 줄:
-0.98 글자
power for process (especially DC in case of PLC power On-Off and of start time.
For example, in case of turning on PLC main power after supplying external power for process, DC output
module may malfunction when PLC is on, so configure the circuit to turn on the PLC main power first
Or in case of external power error or PLC error, it may cause the malfunction.

Not to lead above error to entire system, part causing breakdown of machine or accident should be
configured at the external of PLC

서식 있음: 본문설명4, 들여쓰기:


왼쪽: 0.42"

9103 −2
Chapter 9130 Installation and Wiring

9130.1.1 Fail safe circuit 서식 있음: 들여쓰기: 왼쪽 2.1


글자
(1) example of system design (In case of not using ERR contact point of power module)

In case of AC In case of AC . DC 서식 있음: 들여쓰기: 첫 줄: 2.5


글자
Power

Power
서식 있음: 들여쓰기: 첫 줄: 0"

Check direct Trans Trans


Trans current 서식 있음: 왼쪽
Fuse Fuse
Fuse Signal input

F0045 DC power 서식 있음: 들여쓰기: 첫 줄: 0"


(2) 시스템
F0045 설계 회로 예 (전원모듈의 ERR 접점을 사용하지 않는Pm 경우)

서식 있음: 본문설명5

P080 은 0.5 초 간격으로 On/Off 를 반복하므로 무접점의 출력모듈을 사용하여 주십시오.

(5) 소비 전력 계산
PLC 제어반내의 온도는 사용주변 온도인 55℃이하로 억제할 필요가 있습니다.
제어반내의 방열 설계를 위하여 내부에 있는 각기긱들의 평균 소비 전력(발열량)
(a) PLC 시스템의 전력 소비 블록도

Pm Fuse 서식 있음: 들여쓰기: 왼쪽: 0",


F009C 첫 줄: 0"
F009C Pm Timer setting
Pm which DC input 서식 있음: 왼쪽
PLC RUN output Pm
Start
Program Tm signal is 서식 있음: 왼쪽
switch Start available as
RA1 configured.
서식 있음: 들여쓰기: 왼쪽: 0",
첫 줄: 0"
Stop
SW Input module
Pm Start Program
switch

Output for warning


(Lamp or buzzer)
Output module
Stop Voltage relay 서식 있음: 왼쪽
SW
equipped
Pm RUN by F009C

Power off to output Pm


Pnn
device

Emergency stop, 서식 있음: 들여쓰기: 왼쪽: 0",


Output module Output module Output for warning 첫 줄: 0"
Stop by limit (Lamp or buzzer)
서식 있음: 본문설명4, 들여쓰기:
왼쪽: 0.42"
Run by F009C
Configure part that 서식 있음: 왼쪽
lead opposite operation
or breakdown such as Output module
interlock circuit
forward, reverse
revolution by external Power Off to
interlock circuit output device
9103 −3
Chapter 9130 Installation and Wiring

(Emergency 서식 있음: 왼쪽
stop,
Start sequence of power stop by limit
In case of AC switch)
(1) Turn on power
(2) Run CPU.
(3) Turn on start switch
(4) Output device runs by program through Start sequence of power
magnetic contactor (MC) [On] In case of AC DC
(1) Run CPU after power is on 서식 있음: 들여쓰기: 첫 줄: 0.5
(1)(2) Turn on RA2 as DC power on 글자
(2)(3) Turn on timer after DC power is stable. 서식 있음: 들여쓰기: 왼쪽: 0.07"
(3)(4) Turn on start switch 서식 있음: 글머리 기호 및 번호
(4)(5) Output device runs by program through 매기기
magnetic contactor (MC) [On] 서식 있음: 들여쓰기: 내어쓰기:
1.5 글자, 왼쪽 0.5 글자, 첫 줄:
-1.5 글자

9103 −4
Chapter 9130 Installation and Wiring

(2) System design circuit example (In case of using ERR contact point of power module)
서식 있음: 본문설명5, 들여쓰기:
왼쪽: 0"
Power
서식 있음: 들여쓰기: 왼쪽: 0",
첫 줄: 0"

Checking DC Trans Trans 서식 있음: 들여쓰기: 왼쪽: 0",


Fuse Fuse 첫 줄: 0"
current
Signal input
서식 있음: 들여쓰기: 왼쪽: 0",
F0045 DC power 첫 줄: 0"
Pm
Start stop circuit F009C Fuse

Pm Timer setting 서식 있음: 왼쪽


PLC RUN output Pm which DC input
Available to start as Tm signal is
RA1 Tm configured.

서식 있음: 들여쓰기: 왼쪽: 0",


Start Program
첫 줄: 0"
SW

서식 있음: 들여쓰기: 왼쪽: 0",


Stop SW Voltage relay 첫 줄: 0"
equipped
서식 있음: 들여쓰기: 왼쪽: 0",
Pm 첫 줄: 0"

서식 있음: 들여쓰기: 왼쪽: 0",


Output module Output for warning 첫 줄: 0"
(Lamp or buzzer)
Pm

서식 있음: 들여쓰기: 왼쪽: 0",


Pn 첫 줄: 0"

Stop by ERR 서식 있음: 들여쓰기: 왼쪽: 0",


ERR 첫 줄: 0"
RA3
Error Off

Output module

Configure part that ERR contact point off 서식 있음: 오른쪽


lead opposite operation to output device 서식 있음: 왼쪽
or breakdown such as power off
interlock circuit 서식 있음: 들여쓰기: 왼쪽: 0",
첫 줄: 0"
forward, reverse (Emergency stop,
revolution by external stop by limit)
interlock circuit
서식 있음: 들여쓰기: 왼쪽: 0",
첫 줄: 0"

Start sequence of power


In case of AC DC
(1) Run CPU after turning on power.
(2) Turn on RA2 with DC power supplied
(3) Turn on timer after DC power is stable 서식 있음: 글머리 기호 및 번호
(4) Turn on start s/w 매기기
(4)(5) Turn on start switch Output device runs by program through 서식 있음: 글머리 기호 및 번호
magnetic contactor (MC) [On] 매기기
9103 −5
Chapter 9130 Installation and Wiring

(3) Fail safe countermeasure in case of PLC error 서식 있음: 들여쓰기: 첫 줄: 1.5
Error of PLC CPU and memory is detected by self diagnosis but in case error occurs in IO control part, etc., 글자
CPU can detect the error. At this case, though it is different according to status of error, all contact point is on 서식 있음: 들여쓰기: 내어쓰기:
or off, so safety may not be guaranteed. Though we do out best to our quality as producer, configure safety 2.5 글자, 왼쪽 -0.3 글자, 첫 줄:
circuit preparing that error occurs in PLC and it lead to breakdown or accident. -2.5 글자

System example

Input Input Input Input Output Output 서식 있음: 줄 간격: 1줄


Main
16 16 16 16 16 16 서식 있는 표
unit
point point point point point point

서식 있음: 들여쓰기: 첫 줄: 0"


Output module for fail safe

Equip output module for fail safe to last slot of system.

[Fail safe circuit example] 서식 있음: 들여쓰기: 첫 줄: 0"


On delay timer
서식 있음: 본문설명5, 들여쓰기:
T1 첫 줄: 0", 왼쪽 0 글자
P80
F0093 Off delay timer 서식 있음: 들여쓰기: 왼쪽: 0",
첫 줄: 0"
P80 T2
External load MC
P81 L
~ 서식 있음: 들여쓰기: 왼쪽: 0",
L 첫 줄: 0"
P8F
P80
24V

- +
0.5s 0.5s 0V
DC24
T1 T2
MC
CPU unit Output module
Since P80 turn on/off every 0.5s, use TR output.

9103 −6
Chapter 9130 Installation and Wiring

9103.1.2 PLC heat calculation 서식 있음: 들여쓰기: 첫 줄: 2


글자
(1) Power consumption of each part 서식 있음: 들여쓰기: 왼쪽 0.01
글자, 첫 줄: 2.5 글자
(a) Power consumption of module 서식 있음: 본문설명6, 들여쓰기:
The power conversion efficiency of power module is about 70% and the other 30% is gone with heat; 왼쪽: 1"
3/7 of the output power is the pure power consumption. Therefore, the calculation is as follows. 서식 있음: 들여쓰기: 왼쪽 3.2
• Wpw = 3/7 {(I5V X 5) + (I24V X 24)} (W) 글자
I5V : power consumption of each module DC5V circuit(internal current consumption) 서식 있음: 본문설명7, 들여쓰기:
I24V: the average current consumption of DC24V used for output module 내어쓰기: 0.02 글자, 왼쪽 5
(current consumption of simultaneous On point) 글자
서식 있음: 들여쓰기: 왼쪽 5 글자
If DC24V is externally supplied or a power module without DC24V is used, it is not applicable.

(b) Sum of DC5V circuit current consumption 서식 있음: 본문설명6, 들여쓰기:


The DC5V output circuit power of the power module is the sum of power consumption used by each 첫 줄: 0", 왼쪽 3.2 글자
module. 서식 있음: 본문설명7, 들여쓰기:
• W5V = I5V X 5 (W) 내어쓰기: 0.02 글자, 왼쪽 5
글자
서식 있음: 들여쓰기: 왼쪽 5 글자
(c) DC24V average power consumption(power consumption of simultaneous On point) 서식 있음: 본문설명6, 들여쓰기:
The DC24V output circuit’s average power of the power module is the sum of power consumption 첫 줄: 0", 왼쪽 3.2 글자
used by each module. 서식 있음: 본문설명7, 들여쓰기:
• W24V = I24V X 24 (W) 내어쓰기: 0.02 글자, 왼쪽 5
서식 있음: 들여쓰기: 왼쪽 5 글자

(d) Average power consumption by output voltage drop of the output module(power consumption of 서식 있음: 본문설명6, 들여쓰기:
simultaneous On point) 내어쓰기: 1.51 글자, 왼쪽 3.2
글자, 첫 줄: -1.51 글자
• Wout = Iout X Vdrop X output point X simultaneous On rate (W)
Iout : output current (actually used current) (A) 서식 있음: 들여쓰기: 왼쪽 5 글자
Vdrop: voltage drop of each output module (V)

I24V

DC24V

AC power Main unit Comm. Comm. output input Special input

100V~240V I5V
constant DC5V 서식 있음: 줄 간격: 고정 12 pt
Voltage
transformer
Iout Iin

load
AC power
DC 100V~240V
power
24V

9103 −7
Chapter 9130 Installation and Wiring

(e) Input average power consumption of input module 서식 있음: 본문설명6, 들여쓰기:
(power consumption of simultaneous On point) 첫 줄: 0", 왼쪽 3.2 글자
• W in = lin X E X input point X simultaneous On rate (W) 서식 있음: 들여쓰기: 왼쪽 3.2
Iin: input current (root mean square value in case of AC) (A) 글자, 첫 줄: 1 글자
E : input voltage (actually used voltage) (V) 서식 있음: 들여쓰기: 왼쪽 4.2
글자
(f) Power consumption of special module power assembly 서식 있음: 들여쓰기: 왼쪽 3.2
• W S = I5V X 5 + I24V X 24 + I100V X 100 (W) 글자
The sum of power consumption calculated by each block is the power consumption of the entire PLC 서식 있음: 본문설명6, 들여쓰기:
system. 첫 줄: 0", 왼쪽 3.2 글자
• W = WPW + W5V + W24V + Wout + W in + W s (W) 서식 있음: 본문설명7, 들여쓰기:
Calculate the heats according to the entire power consumption(W) and review the temperature increase 내어쓰기: 0.02 글자, 왼쪽 4.2
within the control panel. 글자
서식 있음: 들여쓰기: 왼쪽 4.2
The calculation of temperature rise within the control panel is displayed as follows. 글자
T = W / UA [°C] 서식 있음: 들여쓰기: 왼쪽 3.2
W : power consumption of the entire PLC system (the above calculated value) 글자
2
A : surface area of control panel [m ]
U : if equalizing the temperature of the control panel by using a fan and others - - - 6
If the air inside the panel is not ventilated - - - - - - - - - - 4
서식 있음: 본문설명6, 들여쓰기:
If installing the PLC in an air-tight control panel, it needs heat-protective(control) design considering the 첫 줄: 0", 왼쪽 3.2 글자
heat from the PLC as well as other devices. If ventilating by vent or fan, inflow of dust or gas may affect 서식 있음: 들여쓰기: 왼쪽 3.2
the performance of the PLC system. 글자

9103 −8
Chapter 9130 Installation and Wiring

1309.2 Attachment/Detachment of Modules

9103.2.1 Attachment/Detachment of modules

Caution in handling 서식 있음: 들여쓰기: 첫 줄: 1.5


Use PLC in the range of general specification specified by manual. 글자
In case of using out of range, it may cause electric shock, fire, malfunction, damage of product.

서식 있음: 들여쓰기: 첫 줄: 0"


Warning
서식 있음: 들여쓰기: 첫 줄: 0"
 Module must be mounted to hook for fixation properly before its fixation. The module may be damaged
from over-applied force. If module is not mounted properly, it may cause malfunction.

 Do not drop or impact the module case, terminal block connector. 서식 있음: 들여쓰기: 첫 줄: 2
글자
 Do not separate the PCB from case.

(1) Equipment of module 서식 있음: 들여쓰기: 첫 줄: 2


글자
• Eliminate the extension cover at the upper of module. 서식 있음: 본문설명5
• Push the module and connect it in agreement with hook for fixation of four edges and hook for 서식 있음: 본문설명4, 들여쓰기:
connection at the bottom. 왼쪽: 0.42", 첫 줄: 0"
• After connection, get down the hook for fixation at the upper part and lower part and fix it completely.

서식 있음: 들여쓰기: 첫 줄: 0"

서식 있음: 들여쓰기: 첫 줄: 0"

Module fixation (Hook)

9103 −9
Chapter 9130 Installation and Wiring

(2) Detachment of module 서식 있음: 들여쓰기: 첫 줄: 2


글자
• Get up the hook for fixation of upper part and lower part and disconnect it. 서식 있음: 본문설명4, 들여쓰기:
왼쪽: 0.42"
• Detach the module with two hands. (Don’t force over-applied force.)

Hook for module fixation

서식 있음: 들여쓰기: 첫 줄: 0"


Caution
서식 있음: 들여쓰기: 첫 줄: 0"
 When separating module, don’t force over-applied power. If so, hook may be damaged.
서식 있음: 본문설명4, 들여쓰기:
왼쪽: 0.42"

9103 −10
Chapter 9130 Installation and Wiring

(3) Installation of module 서식 있음: 들여쓰기: 첫 줄: 1.5


XGB PLC is having hook for DIN rail (rail width: 35mm) so that cab be installed at DIN rail. 글자
서식 있음: 글꼴: (영어) Arial
(a) In case of installing at DIN rail
• Pull hook for DIN rail at the bottom of module and install it at DIN rail 서식 있음: 본문설명4, 들여쓰기:
• Push hook to fix the module at DIN rail after installing module at DIN rail 왼쪽: 0.42"

서식 있음: 들여쓰기: 첫 줄: 5.5


글자

서식 있음: 글꼴: (영어) Arial


딘레일 설치용 훅(HOOK
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
(b) In case of installing at panel 서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
• You can install XGB compact type main unit at panel directly using screw hole 서식 있음: 글꼴: (영어) Arial
• Use M4 type screw to install the product at panel.
서식 있음: 글꼴: (영어) Arial
서식 있음: 들여쓰기: 첫 줄: 0
글자
서식 있음: 들여쓰기: 첫 줄: 2
글자
Panel 패널 서식 있음: 들여쓰기: 첫 줄: 0
글자
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
서식 있음: 들여쓰기: 첫 줄: 6
글자

서식 있음: 글꼴: (영어) Arial


2-Ø4.5 장착 구멍 screw
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial
서식 있음: 글꼴: (영어) Arial

9103 −11
Chapter 9130 Installation and Wiring

(34) Module equipment location 서식 있음: 들여쓰기: 첫 줄: 1


Keep the following distance between module and structure or part for well ventilation and easy detachment 글자
and attachment. 서식 있음: 들여쓰기: 왼쪽 1.61
글자, 첫 줄: 0 글자
서식 있음: 들여쓰기: 첫 줄: 0"
30 ㎜ or above *1 서식 있음: 들여쓰기: 첫 줄: 0"

Pane
PLC

서식 있음: 들여쓰기: 첫 줄: 0"


*3
20 ㎜ or above

30 ㎜ or above*1

서식 있음: 들여쓰기: 첫 줄: 0"


*1
5 ㎜ or above 5 ㎜ or above

*1 : In case height of wiring duct is less than 50 mm (except this 40mm or above)
*2 : In case of equipping cable without removing near module, 20mm or above
*3 : In case of connector type, 80mm or above

(54) Module equipment direction 서식 있음: 본문설명4, 들여쓰기:


(a) For easy ventilation, install like the following figure. 첫 줄: 1 글자
서식 있음: 들여쓰기: 왼쪽 3 글자,
첫 줄: 0 글자

9103 −12
Chapter 9130 Installation and Wiring

(b) Don’t install like the following figure

(56) Distance with other device 서식 있음: 들여쓰기: 첫 줄: 1.5


글자
To avoid radiation noise or heat, keep the distance between PLC and device (connector and relay) as far as 서식 있음: 들여쓰기: 내어쓰기: 1
the following figure. 글자, 왼쪽 0.66 글자, 첫 줄: -1
Device installed in front of PLC: 100 ㎜ or above 글자
Device installed beside PLC: 50 ㎜ or above 서식 있음: 글꼴: 10 pt
서식 있음: 들여쓰기: 첫 줄: 1.5
글자
서식 있음: 들여쓰기: 첫 줄: 1
글자
서식 있음: 글꼴: 10 pt
서식 있음: 들여쓰기: 첫 줄: 0"

100mm or above
서식 있음: 들여쓰기: 첫 줄: 0"

서식 있음: 들여쓰기: 첫 줄: 0"


50mm or above

서식 있음: 본문설명4, 들여쓰기:


왼쪽: 0.42"

50mm or above

9103 −13
Chapter 9130 Installation and Wiring

9103 −14
Chapter 9130 Installation and Wiring

9130.2.2 Caution in handling

Here describes caution from open to install 서식 있음: 들여쓰기: 첫 줄: 2


• Don’t drop or impact product. 글자
• Don’t disassemble the PCB from case. It may cause the error. 서식 있음: 본문설명4, 들여쓰기:
• In case of wiring, make sure foreign substance not to enter upper part of module. If it enters, eliminate it. 왼쪽: 0.42", 첫 줄: 0"

(1) Caution in handling IO module 서식 있음: 들여쓰기: 첫 줄: 2


It describes caution in handling IO module. 글자
서식 있음: 본문설명4, 들여쓰기:
(a) Recheck of IO module specification 왼쪽: 0.42"
For input module, be cautious about input voltage, for output module, if voltage that exceeds the max. 서식 있음: 본문설명5, 들여쓰기:
open/close voltage is induced, it may cause the malfunction, breakdown or fire. 왼쪽: 0"

(b) Used wire 서식 있음: 본문설명4, 들여쓰기:


When selecting wire, consider ambient temp, allowed current and minimum size of wire is 왼쪽: 0.42"
2
AWG22(0.3mm ) or above. 서식 있음: 본문설명5, 들여쓰기:
왼쪽: 0"
(c) Environment 서식 있음: 본문설명4, 들여쓰기:
In case of wiring IO module, if device or material that induce high heat is too close or oil contacts wire 왼쪽: 0.42"
too long time, it may cause short, malfunction or error. 서식 있음: 본문설명5, 들여쓰기:
왼쪽: 0"
(d) Polarity 서식 있음: 본문설명4, 들여쓰기:
Before supplying power of module which has terminal block, check the polarity. 왼쪽: 0.42"
서식 있음: 본문설명5, 들여쓰기:
(e) Wiring 왼쪽: 0"
• In case of wiring IO with high voltage line or power line, induced obstacle may cause error. 서식 있음: 본문설명4, 들여쓰기:
• Let no cable pass the IO operation indication part (LED). 왼쪽: 0.42"
(You can’t discriminate the IO indication.) 서식 있음: 본문설명5, 들여쓰기:
• In case induced load is connected with output module, connect the surge killer or diode load to load in 왼쪽: 0"
parallel. Connect cathode of diode to + side of power. 서식 있음: 들여쓰기: 왼쪽: 0",
. 첫 줄: 0"
서식 있음: 들여쓰기: 내어쓰기:
1.14 글자, 왼쪽 4.48 글자, 첫 줄:
Induced load -1.14 글자
OUT
서식 있음: 들여쓰기: 첫 줄: 0"
서식 있음: 들여쓰기: 첫 줄: 0"
Output module
Surge killer
COM
서식 있음: 들여쓰기: 첫 줄: 0"

OUT Induced load

+ 서식 있음: 들여쓰기: 첫 줄: 0"


Output module
-
Diode
COM
서식 있음: 본문설명4, 들여쓰기:
왼쪽: 0.42"
(f) Terminal block
Check close adhesion status. Let no foreign material of wire enter into PLC when wring terminal block 서식 있음: 본문설명5, 들여쓰기:
or processing screw hole. At this case, it may cause malfunction. 왼쪽: 0"

(g) Don’t impact to IO module or don’t disassemble the PCB from case. 서식 있음: 본문설명4, 들여쓰기:
왼쪽: 0.42"

9103 −15
Chapter 9130 Installation and Wiring

1309.3 Wire
서식 있음: 본문설명2, 들여쓰기:
In case using system, it describes caution about wiring. 왼쪽: 0.07"

Danger
When wiring, cut off the external power.
If all power is cut, it may cause electric shock or damage of product.
In case of flowing electric or testing after wiring, equip terminal cover included in product. It not, it may cause
electric shock.

Caution
 Do D type ground (type 3 ground) or above dedicated for PLC for FG and LG terminal. It may cause electric
shock or malfunction.
 When wiring module, check the rated voltage and terminal array and do properly.
If rating is different, it may cause fire, malfunction.
 For external connecting connector, use designated device and solder.
If connecting is not safe, it may cause short, fire, malfunction.
For screwing, use designated torque range. If it is not fit, it may cause short, fire, malfunction.
Let no foreign material enter such as garbage or disconnection part into module. It may cause fire, malfunction,
error.

9130.3.1Power wiring

(1) In case voltage regulation is larger than specified, connect constant voltage transformer. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
서식 있음: 들여쓰기: 첫 줄: 0"

BA BA
In:24 V D C , 7 m A 20 20
19 19
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 18 18
17 17
16 16
10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 15 15
XBC- DR64H IN 14 14
13 13
PWR

서식 있음: 들여쓰기: 첫 줄: 0"


12 12
OUT 11 11
RUN 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F RS-232C
10 10
ERR 09 09
30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 08 08

AC power 1 85 V A 50 /6 0H z
07
06
05
04
07
06
05
04
03 03

100V~240V 02
01
02
01

AC power AC100-240V
Constant
voltage
transformer

(2) Connect noise that include small noise between line and earth. 서식 있음: 들여쓰기: 첫 줄: 1.5
(When there are many noise, connect insulated transformer.) 글자
서식 있음: 들여쓰기: 첫 줄: 2.5
글자

9103 −16
Chapter 9130 Installation and Wiring

(3) Isolate the PLC power, I/O devices and power devices as follows. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
서식 있음: 들여쓰기: 첫 줄: 0"

서식 있음: 들여쓰기: 첫 줄: 0"

Main unit
Main PLC
power power Constant
AC220V Voltage
Transformer AC100-240V
서식 있음: 글꼴: (영어) Arial

IO power

Main circuit device 서식 있음: 들여쓰기: 첫 줄: 0"

(4) If using DC24V of the power modulemain unit 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
(a) Do not connect DC24V of several power modules in parallel. It may cause the destruction of a module. 서식 있음: 본문설명5
(b) If a power module can not meet the DC24V output capacity, supply DC24V externally as presented 서식 있음: 본문설명4, 들여쓰기:
below. 왼쪽: 0.42"

24V 24V I
I
O
CPU CPU
O 서식 있음: 들여쓰기: 첫 줄: 0"

DC 24V
24V
I
CPU Power
O
Supply

(5) AC110V/AC220V/DC24V cables should be compactly twisted and connected in the shortest distance. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
2
(6) AC110V/AC220V cable should be as thick as possible(2mm ) to reduce voltage drop. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
(7) AC110V/ DC24V cables should not be installed close to main circuit cable(high voltage/high current) and 서식 있음: 들여쓰기: 왼쪽 1.13
I/O signal cable. They should be 100mm away from such cables 글자

9103 −17
Chapter 9130 Installation and Wiring

(8) To prevent surge from lightning, use the lightning surge absorber as presented below. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
서식 있음: 들여쓰기: 첫 줄: 0"

PLC
I/O device

E1 E2

Surge absorber to prevent

Note
(1) Isolate the grounding(E1) of lightning surge absorber from the grounding(E2) of the PLC.
(2) Select a lightning surge absorber type so that the max. voltage may not the specified
allowable voltage of the absorber.

(9) When noise may be intruded inside it, use an insulated shielding transformer or noise filter. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
(10) Wiring of each input power should be twisted as short as possible and the wiring of shielding transformer 서식 있음: 들여쓰기: 내어쓰기: 2
or noise filter should not be arranged via a duct. 글자, 왼쪽 1.13 글자, 첫 줄: -2
글자

9103 −18
Chapter 910 Installation and Wiring

9130.3.2 I/O Device wiring


2 2
(1) The size of I/O device cable is limited to 0.3~2 mm but it is recommended to select a size(0.3 mm ) to use 서식 있음: 들여쓰기: 내어쓰기:
conveniently. 1.5 글자, 왼쪽 1.13 글자, 첫 줄:
-1.5 글자
(2) Please isolate input signal line from output signal line. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
(3) I/O signal lines should be wired 100mm and more away from high voltage/high current main circuit cable. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자
(4) Batch shield cable should be used and the PLC side should be grounded unless the main circuit cable and 서식 있음: 들여쓰기: 내어쓰기:
power cable can not be isolated. 1.5 글자, 왼쪽 1.13 글자, 첫 줄:
-1.5 글자
서식 있음: 들여쓰기: 첫 줄: 0"
PLC Shield cable

input
RA

output
DC

(5) When applying pipe-wiring, make sure to firmly ground the piping. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자

1309.3.3 Grounding wiring

(1) The PLC contains a proper noise measure, so it can be used without any separate grounding if there is a 서식 있음: 들여쓰기: 내어쓰기:
large noise. However, if grounding is required, please refer to the followings. 1.5 글자, 왼쪽 1.13 글자, 첫 줄:
-1.5 글자
(2) For grounding, please make sure to use the exclusive grounding. 서식 있음: 들여쓰기: 첫 줄: 1.5
For grounding construction, apply type 3 grounding(grounding resistance lower than 100 Ω) 글자
서식 있음: 들여쓰기: 첫 줄: 3
(3) If the exclusive grounding is not possible, use the common grounding as presented in B) of the figure below. 글자
서식 있음: 들여쓰기: 첫 줄: 1.5
글자
PLC Other devices PLC Other devices PLC Other devices 서식 있음: 들여쓰기: 첫 줄: 0"

Type 3 Grounding Type 3 Grounding

A) Exclusive grounding : best B) common grounding : good C) common grounding: defective 서식 있음: 들여쓰기: 첫 줄: 6.5
글자

2
(4) Use the grounding cable more than 2 mm . To shorten the length of the grounding cable, place the 서식 있음: 들여쓰기: 내어쓰기:
grounding point as close to the PLC as possible. 1.5 글자, 왼쪽 1.13 글자, 첫 줄:
-1.5 글자
(5) If any malfunction from grounding is detected, separate the FG of the base from the grounding. 서식 있음: 들여쓰기: 첫 줄: 1.5
글자

913 −19
Chapter 910 Installation and Wiring

1309.3.4 Specifications of wiring cable

The specifications of cable used for wiring are as follows. 서식 있음: 들여쓰기: 첫 줄: 2
글자
2
Types of external Cable specification (mm )
connection Lower limit Upper limit
Digital input 0.18 (AWG24) 1.5 (AWG16)
Digital output 0.18 (AWG24) 2.0 (AWG14)
Analogue I/O 0.18 (AWG24) 1.5 (AWG16)
Communication 0.18 (AWG24) 1.5 (AWG16)
Main power 1.5 (AWG16) 2.5 (AWG12)
Protective grounding 1.5 (AWG16) 2.5 (AWG12)

913 −20
Chapter 14 Maintenance

Chapter 14 Maintenance
Be sure to perform daily and periodic maintenance and inspection in order to maintain the PLC in the best
conditions.

14.1 Maintenance and Inspection


The I/O module mainly consist of semiconductor devices and its service life is semi-permanent. However,
periodic inspection is requested for ambient environment may cause damage to the devices. When inspecting
one or two times per six months, check the following items.

Check Items Judgment Corrective Actions


Within change rate of input
Change rate of input voltage voltage Hold it with the allowable range.
(Less than −15% to +20% )
Input/Output specification of
Power supply for input/output Hold it with the allowable range of each module.
each module

0 ~ + 55℃ Adjust the operating temperature and humidity with the


Temperature
Ambient defined range.
Humidity 5 ~ 95%RH
environment
Vibration Use vibration resisting rubber or the vibration prevention
No vibration
method.
Play of modules No play allowed Securely enrage the hook.
Connecting conditions of
No loose allowed Retighten terminal screws.
terminal screws
Check the number of
Spare parts Spare parts and their Cover the shortage and improve the conditions.
Store conditions

14.2 Daily Inspection


The following table shows the inspection and items which are to be checked daily.
Corrective
Check Items Check Points Judgment
Actions
Connection conditions of Retighten
Check the screws. Screws should not be loose.
base Screws.
Connection conditions of Check the connecting screws Retighten
Screws should not be loose.
Input/Output module Check module cover. Screws.
Check for loose mounting screws. Retighten
Screws should not be loose.
Connecting conditions of Screws.
terminal block or extension Check the distance between solderless
Proper clearance should be provided. Correct.
terminals.
cable
Connecting of expansion cable. Connector should not be loose. Correct.
PWR LED Check that the LED is On. On(Off indicates an error) See chapter 4.
On (flickering or On indicates an
Run LED Check that the LED is On during Run. See chapter 4.
error)
LED ERR LED Check that the LED is Off during Run. Flickering indicates an error See chapter 4.
indicator On when input is On,
Input LED Check that the LED turns On and Off. See chapter 4.
Off when input is off.
On when output is On,
Output LED Check that the LED turns On and Off See chapter 4.
Off when output is off

11−1
Chapter 14 Maintenance

14.3 Periodic Inspection


Check the following items once or twice every six months, and perform the needed corrective actions.

Corrective
Check Items Checking Methods Judgment
Actions
Ambient
0 ~ 55 °C Adjust to general
temperature -. Measure with thermometer
Ambient standard
Ambient Humidity and hygrometer 5 ~ 95%RH (Internal environmental
environment
Ambient pollution -. measure corrosive gas There should be no standard of control
level corrosive gases section)
Looseness, The module should be move The module should be
PLC Ingress the unit mounted securely.
Retighten screws
Conditions dust or foreign
Visual check No dust or foreign material
material
Loose terminal
Re-tighten screws Screws should not be loose Retighten
screws
Distance between
Connecting Visual check Proper clearance Correct
terminals
conditions
Retighten connector
Connectors should not be
Loose connectors Visual check mounting
loose.
screws
Measure voltage between
Line voltage check DC24V: DC20.4 ~ 28.8V Change supply power
input terminals

11−2
Chapter 15 Troubleshooting

Chapter 15 Troubleshooting
The following explains contents, diagnosis and corrective actions for various errors that can occur during system
operation.

15.1 Basic Procedure of Troubleshooting


System reliability not only depends on reliable equipment but also on short downtimes in the event of fault. The
short discovery and corrective action is needed for speedy operation of system. The following shows the basic
instructions for troubleshooting.

(1) Visual checks


Check the following points.
• Machine operating condition (in stop and operation status)
• Power On/Off
• Status of I/O devices
• Condition of wiring (I/O wires, extension and communications cables)
• Display states of various indicators (such as POWER LED, RUN LED, ERR LED and I/O LED)
After checking them, connect peripheral devices and check the operation status of the PLC and the
program contents.
(2) Trouble Check
Observe any change in the error conditions during the following.
• Switch to the STOP position, and then turn the power on and off.
(3) Narrow down the possible causes of the trouble where the fault lies, i.e.:
• Inside or outside of the PLC ?
• I/O module or another module?
• PLC program?

15.2 Troubleshooting
This section explains the procedure for determining the cause of troubles as well as the errors and corrective
actions.

Symptoms

Is the power LED turned Flowchart used when the POWER LED is turned Off.
Off ?

Is the ERR LED flickering ? Flowchart used when the ERR LED is flickering.

Are the RUN LED turned Flowchart used when the RUN turned Off.
Off ?

I/O module doesn’t operate Flowchart used when the output load of the output module
properly. doesn’t turn on.

Program cannot be written. Flowchart used when a program can’t be written to the
PLC.

15-1
Chapter 15 Troubleshooting

15.2.1 Troubleshooting flowchart used when the PWR (Power) LED turns Off.
The following flowchart explains corrective action procedure used when the power is supplied or the power LED
turns Off during operation.

Power LED is turned Off.

Is the power supply No


operating? Supply the power.

No Yes
Yes Does the power LED
turns On?

No
Is the voltage within the Supply the power
rated power? properly.

Yes

Yes Yes
Does the power LED
turns On?

Over current protection


device activated?

1) Eliminate the excess current


2) Switch the input power Off then
On.

No

No Yes
Does the power LED
turns On?

Write down the troubleshooting


Questionnaire and contact
the nearest service center.

Complete

15-2
Chapter 15 Troubleshooting

15.2.2 Troubleshooting flowchart used with when the ERR (Error) LED is flickering
The following flowchart explains corrective action procedure use when the power is supplied star
ts or the ERR LED is flickering during operation.

STOP LED goes flickering

Check the error code, with


connected XG5000.

No
See Appendix 1 Flag list
Warning error?
and remove the cause of
the error.

Yes

No
Is ERR LED still
flicking ?

Complete
Yes

Write down the Troubleshooting


Questionnaires and contact the nearest
service center.

Warning
Though warning error appears, PLC system doesn’t stop but corrective action is needed
promptly. If not, it may cause the system failure.

15-3
Chapter 15 Troubleshooting

15.2.3 Troubleshooting flowchart used with when the RUN , STOP LED turns Off.
The following flowchart explains corrective action procedure to treat the lights-out of RUN LED when the power
is supplied, operation starts or operation is in the process.

RUN, STOP LED is Off.

Turn the power unit Off and On.

No
Is RUN/ STOP LED Off?

Yes

Write down the Troubleshooting


Questionnaires and contact the nearest Complete
service center.

15-4
Chapter 15 Troubleshooting

15.2.4 Troubleshooting flowchart used when the I/O part doesn’t operate normally.

The following flowchart explains corrective action procedure used when the I/O module doesn’t
operate normally.

When the I/O module doesn’t work normally.

No
I\s the output LED of SOL1
On?

Yes

Measure the voltage of terminal Correct wiring. Replace the connector of Check the status of SOL1 by
in SOL1 by Tester. the terminal block.
XG5000.

No No
No
Yes Is the Yes Is it normal condition?
Is the measured value Is the output
terminal connector
normal? wiring correct? appropriate?
Yes
Yes
Yes
Separate the external
wiring than check the
condition of output module.
Continue

Yes No
Is it normal condition?

Check the status of SOL1. Replace the Unit

15-5
Chapter 15 Troubleshooting

Continue

No
Are the indicator LED of the
switch 1 and 2 on?

Yes

Check voltage of switch 1,2 Check voltage of switch 1,2


by tester by tester

Is the
Yes
Is the measured value Is the measured value terminal screw tighten
normal? normal? securely?
No No
Yes No Yes

Yes Is the condition


Is input wiring correct? of the terminal board connector
appropriate?

Separate the external No No


wiring witch then check
the status by forced input

Correct wiring Retighten the terminal Replace the terminal


Is the measured value screw. board connector.
normal?
No
Yes

Input unit replacement Check the status of the switch 1 Input unit replacement is
is Needed. and 2. Check from the beginning. Needed.

15-6
Chapter 15 Troubleshooting

15.3 Troubleshooting Questionnaire

When problems have been met during operation of the XGC series, please write down this Questionnaires and
contact the service center via telephone or facsimile.
 For errors relating to special or communication modules, use the questionnaire included in the User’s manual
of the unit.

1. Telephone & FAX No


Tell) FAX)
2. Using equipment model:

3. Details of using equipment


CPU model: ( ) OS version No.:( ) Serial No.( )
XG5000 (for program compile) version No.: ( )

4.General description of the device or system used as the control object:

5. The kind of the base unit:


− Operation by the mode setting switch ( ),
− Operation by the XG5000 or communications ( ),
− External memory module operation ( ),

6. Is the ERR. LED of the CPU module turned On ? Yes( ), No( )

7. XG5000 error message:

8. History of corrective actions for the error message in the article 7:

9. Other tried corrective actions:

10. Characteristics of the error


 Repetitive( ): Periodic( ), Related to a particular sequence( ), Related to environment( )
 Sometimes( ): General error interval:

11. Detailed Description of error contents:

12. Configuration diagram for the applied system:

15-7
Chapter 15 Troubleshooting

15.4 Troubleshooting Examples


Possible troubles with various circuits and their corrective actions are explained.

15.4.1 Input circuit troubles and corrective actions


The followings describe possible troubles with input circuits, as well as corrective actions.

Condition Cause Corrective Actions


Leakage current of external device
(Such as a drive by non-contact switch)  Connect an appropriate register and
Input signal capacity, which will make the voltage lower
doesn’t turn AC input across the terminals of the input module.
off. C Leakage current AC input
R
C
~
External device R
~
Leakage current of external device
Input signal (Drive by a limit switch with neon lamp)  CR values are determined by the leakage
doesn’t turn
current value.
off. AC input
− Recommended value C : 0.1 ~ 0.47 ㎌
C Leakage current
(Neon lamp
R R: 47 ~ 120 Ω (1/2W)
may be still Or make up another independent display
~ circuit.
External device
on)
Leakage current due to line capacity of wiring
Input signal cable.  Locate the power supply on the external
doesn’t turn device side as shown below.
off. AC input AC input
Leakage current

~ ~
External device External device

 Connect an appropriate register, which will make


Input signal Leakage current of external device (Drive by
doesn’t turn switch with LED indicator) the voltage higher than the OFF voltage across the
off.
input module terminal and common terminal.
DC input
DC input
Leakage current
R R

External device

Input signal  Sneak current due to the use of two  Use only one power supply.
 Connect a sneak current prevention diode.
doesn’t turn different power supplies.
off.
DC input
DC input
E E1
L L
E E

 E1 > E2, sneaked.

15-8
Chapter 15 Troubleshooting

15.4.2 Output circuit and corrective actions


The following describes possible troubles with output circuits, as well as their corrective actions.
Condition Cause Corrective Action

When the output Load is half-wave rectified inside (in some  Connect registers of tens to hundreds KΩ
is off, excessive cases, it is true of a solenoid) across the load in parallel.
voltage is When the polarity of the power supply is as
applied to the shown in ① R

load. as shown in ②
D
the line voltage are applied across D. Max.
voltage is approx. 2√2. C
R ~
Load

C D
~
R Load

*) If a resistor is used in this way, it does not


pose a problem to the output element. But it may
make the performance of the diode (D), which is
built in the load, drop to cause problems.
The load  Leakage current by surge absorbing circuit,  Connect C and R across the load, which are of
doesn’t which is connected to output element in parallel. registers of tens KΩ. When the wiring distance
turn off. from the output module to the load is long, there
Output
Load may be a leakage current due to the line
C capacity. C
R Leakage current ~ R R

Load Load

When the load  Leakage current by surge absorbing circuit,  Drive the relay using a contact and drive the
is C-R type which is connected to output element in parallel. C-R type timer using the since contact.
timer, time  Use other timer than the C−R contact some
Output
constant timers have half-ware rectified internal circuits
Load
fluctuates. C therefore, be cautious. Timer
~ T
R Leakage current

Output X
~

The load does  Sneak current due to the use of two different  Use only one power supply.
not turn off. power supplies.  Connect a sneak current prevention diode.

Output Output

Load Load

E1 E
E2 E

If the load is the relay, etc, connect a


E1<E2, sneaks. E1 is off (E2 is on), sneaks. counter-electromotive voltage absorbing code as
shown by the dot line.

15-9
Chapter 15 Troubleshooting

Output circuit troubles and corrective actions (continued).

Condition Cause Corrective actions


The load off  Over current at off state [The large  Insert a small L/R magnetic contact and
response solenoid current fluidic load (L/R is large) drive the load using the same contact.
time is long. such as is directly driven with the transistor
output. Outpu

Outpu
Off current
Loa
Loa
E

 The off response time can be delayed by


one or more second as some loads make
the current flow across the diode at the off
time of the transistor output.
Output Surge current of the white lamp  To suppress the surge current make the
transistor is dark current of 1/3 to 1/5 rated current flow.
destroyed. Output Output

E1 R E

A surge current of 10 times or more when Sink type transistor output

turned on.
Output

Source type transistor


output

15-10
Chapter 15 Troubleshooting

15.5 Error Code List


Error Action Operation LED Diagnosis
Error cause
code (restart mode after taking an action) status status point
Program to execute is 0.5 second RUN
23 Start after reloading the program Warning
abnormal Flicker mode
Start after reloading I/O parameter,
Reset
Battery change if battery has a problem.
0.5 second RUN
24 I/O parameter error Check the preservation status after I/O Warning
Flicker mode
parameter reloading and if error occurs,
switching
change the unit.
Start after reloading Basic parameter,
Reset
Change battery if it has a problem.
0.5 second RUN
25 Basic parameter error Check the preservation status after Basic Warning
Flicker mode
parameter reloading and if error occurs,
switching
change the unit.
Module set in
RUN
parameter and the modify the module or parameter and then 0.5 second
30 Warning mode
installed module does restart. Flicker
switching
not match
Module falling during After checking the position of
0.1 second Every
31 operation or additional attachment/detachment of expansion module Warning
Flicker scan
setup during Run mode
Data of I/O module
After checking the position of slot where the
does not access Heavy 0.1 second
33 access error occurs by XG5000, change the Scan end
normally during error Flicker
module and restart (acc.to parameter.)
operation.
Normal access of
After checking the position of slot that access
special/link module Heavy 0.1 second
34 error occurred by XG5000, change the Scan end
data during operation error Flicker
module and restart (acc.to parameter).
not available
Abnormal system end by noise or hard ware
error.
Abnormal stop of Heavy 0.1 second Ordinary
39 1) If it occurs repeatedly when power
CPU or malfunction error Flicker time
reinput, request service center
2) Noise measures
Scan time of program
during operation While
After checking the scan watchdog time
exceeds the scan 0.5 second running
40 designated by parameter, modify the Warning
watchdog time Flicker the
parameter or the program and then restart.
designated by program
parameter.
Operation error While
Remove operation error → reload the
occurs while 0.5 second running
41 program and restart. Warning
running the user Flicker the
program. program
Timer index user After reloading a timer index program 0.5 second
44 Warning Scan end
error modification, start Flicker
Refer to Heavy error detection flag and
Heavy error of Heavy 1 second
50 modifies the device and restart. (Acc. Scan end
external device error Flicker
Parameter)
While
E_STOP function After removing error causes which starts Heavy 1 second running
60
executed E_STOP function in program, power reinput error Flicker the
program

15-11
Chapter 15 Troubleshooting

Error Action Operation LED Diagnosis


Error cause
code (restart mode after taking an action) status status point
Data memory backup If not error in battery, power reinput 1 second
500 Warning Reset
not possible Remote mode is switched to STOP mode. Flicker
Setting the time by XG5000 if there is no 0.1 second Ordinary
501 Abnormal clock data Warning
error Flicker time
0.1 second Ordinary
502 Battery voltage falling Battery change at power On status Warning
Flicker time

15-12
Appendix 1 Flag List

Appendix 1 Flag List

Appendix 1.1 Special Relay (F) List


(1) “S(U)” type
Word Bit Variables Function Description
- _SYS_STATE Mode and state Indicates PLC mode and operation State.
F0000 _RUN Run Run state.
F0001 _STOP Stop Stop state.
F0002 _ERROR Error Error state.
F0003 _DEBUG Debug Debug state.
F0004 _LOCAL_CON Local control Local control mode.
F0006 _REMOTE_CON Remote mode Remote control mode.
F0008 _RUN_EDIT_ST Editing during RUN Editing program download during RUN.
F0009 _RUN_EDIT_CHK Editing during RUN Internal edit processing during RUN.
F000A _RUN_EDIT_DONE Edit done during RUN Edit is done during RUN.
F000B _RUN_EDIT_END Edit end during RUN Edit is ended during RUN.
F000C _CMOD_KEY Operation mode Operation mode changed by key.
F000D _CMOD_LPADT Operation mode Operation mode changed by local PADT.
F000~1 F000E _CMOD_RPADT Operation mode Operation mode changed by Remote PADT.
Operation mode changed by Remote
F000F _CMOD_RLINK Operation mode
communication module.
F0010 _FORCE_IN Forced input Forced input state.
F0011 _FORCE_OUT Forced output Forced output state.
F0014 _MON_On Monitor Monitor on execution.
F0015 _USTOP_On Stop Stop by Stop function.
F0016 _ESTOP_On EStop Stop by EStop function.
F0017 _CONPILE_MODE Compile Compile on execution.
F0018 _INIT_RUN Initialize Initialization task on execution.
F001C _PB1 Program Code 1 Program Code 1 selected.
F001D _PB2 Program Code 2 Program Code 2 selected.
F001E _CB1 Compile Code 1 Compile Code 1 selected.
F001F _CB2 Compile Code2 Compile Code 2 selected.
- _CNF_ER System error Reports heavy error state of system.
F0021 _IO_TYER Module Type error Module Type does not match.
Module detachment
F0022 _IO_DEER Module is detached.
error
F002~3
F0024 _IO_RWER Module I/O error Module I/O error.

F0025 _IP_IFER Module interface error Special/communication module interface error.


Detected heavy error in external
F0026 _ANNUM_ER External device error
Device.

App. 1-1
Appendix 1 Flag List

Word Bit Variable Function Description


F0028 _BPRM_ER Basic parameter Basic parameter error.
F0029 _IOPRM_ER IO parameter I/O configuration parameter error.
Special module parameter is
F002A _SPPRM_ER Special module parameter
Abnormal.
Communication module Communication module parameter
F002B _CPPRM_ER
F002~3 parameter is abnormal.
F002C _PGM_ER Program error Program error.
F002D _CODE_ER Code error Program Code error.
F002E _SWDT_ER System watchdog System watchdog operated.
F0030 _WDT_ER Scan watchdog Scan watchdog operated.
- _CNF_WAR System warning Reports light error state of system.
F0041 _DBCK_ER Backup error Data backup error.
F0043 _ABSD_ER Operation shutdown error Stop by abnormal operation.
F0046 _ANNUM_WAR External device error Detected light error of external device.
F0048 _HS_WAR1 High speed link 1 High speed link – parameter 1 error.
F004
F0049 _HS_WAR2 High speed link 2 High speed link – parameter 2 error.
F0054 _P2P_WAR1 P2P parameter 1 P2P – parameter 1 error.
F0055 _P2P_WAR2 P2P parameter 2 P2P – parameter 2 error.
F0056 _P2P_WAR3 P2P parameter 3 P2P – parameter 3 error.
F005C _CONSTANT_ER Constant error Constant error.
- _USER_F User contact Timer used by user.
F0090 _T20MS 20ms As a clock signal available at user program, it
reverses On/Off every half period. Since clock
F0091 _T100MS 100ms signal is dealt with at the end of scan, there may
be delay or distortion according to scan time. So
F0092 _T200MS 200ms use clock that’s longer than scan time. Clock
signal is Off status at the start of scan program
F0093 _T1S 1s Clock
and task program.
F0094 _T2S 2 s Clock _T100ms clock
50ms 50ms
F0095 _T10S 10 s Clock
F009
F0096 _T20S 20 s Clock
F0097 _T60S 60 s Clock
F0099 _On Ordinary time On Always On state Bit.
F009A _Off Ordinary time Off Always Off state Bit.
F009B _1On 1scan On First scan On Bit.
F009C _1Off 1scan Off First scan OFF bit.
F009D _STOG Reversal Reversal every scan.

App. 1-2
Appendix 1 Flag List

Word Bit Variable Function Description


- _USER_CLK User Clock Clock available for user setting.
F0100 _USR_CLK0 Setting scan repeat On/Off as much as set scan Clock 0.
F0101 _USR_CLK1 Setting scan repeat On/Off as much as set scan Clock 1.
F0102 _USR_CLK2 Setting scan repeat On/Off as much as set scan Clock 2.
F010 F0103 _USR_CLK3 Setting scan repeat On/Off as much as set scan Clock 3.
F0104 _USR_CLK4 Setting scan repeat On/Off as much as set scan Clock 4.
F0105 _USR_CLK5 Setting scan repeat On/Off as much as set scan Clock 5.
F0106 _USR_CLK6 Setting scan repeat On/Off as much as set scan Clock 6.
F0107 _USR_CLK7 Setting scan repeat On/Off as much as set scan Clock 7.
- _LOGIC_RESULT Logic result Indicates logic results.
On during 1 scan in case of operation
F0110 _LER operation error
error.
F0111 _ZERO Zero flag On when operation result is 0.
F011
F0112 _CARRY Carry flag On when carry occurs during operation.
F0113 _ALL_Off All output OFF On in case that all output is Off.
Operation error
F0115 _LER_LATCH Keeps On during operation error.
Latch
- _CMP_RESULT Comparison result Indicates the comparison result.
F0120 _LT LT flag On in case of “less than”.
F0121 _LTE LTE flag On in case of “equal or less than”.
F012 F0122 _EQU EQU flag On in case of “equal”.
F0123 _GT GT flag On in case of “greater than”.
F0124 _GTE GTE flag On in case of “equal or greater than”.
F0125 _NEQ NEQ flag On in case of “not equal”.
F014 - _FALS_NUM FALS no. Indicates FALS no.
F015 - _PUTGET_ERR0 PUT/GET error 0 Main base Put / Get error.
F023 - _PUTGET_NDR0 PUT/GET end 0 Main base Put/Get end.
F044 - _CPU_TYPE CPU Type Indicates information for CPU Type.
F045 - _CPU_VER CPU version Indicates CPU version.
F046 - _OS_VER OS version Indicates OS version.
F048 - _OS_DATE OS date Indicates OS distribution date.
F050 - _SCAN_MAX Max. scan time Indicates max. scan time.
F051 - _SCAN_MIN Min. scan time Indicates min. scan time.
F052 - _SCAN_CUR Current scan time Current scan time.
Clock data (month/year)
F0053 - _MON_YEAR Month/year Supported when using RTC option
module
Clock data (hour/date)
F0054 - _TIME_DAY Hour/date Supported when using RTC option
module
Clock data (Second/minute)
F0055 - _SEC_MIN Second/minute Supported when using RTC option
module

App. 1-4
Appendix 1 Flag List

Word Bit Variable Function Description


Clock data (Hundred year/week)
F0056 - _HUND_WK Hundred year/week Supported when using RTC option
module
- _FPU_INFO N/A -
F0570 _FPU_LFLAG_I N/A -
F0571 _FPU_LFLAG_U N/A -
F0572 _FPU_LFLAG_O N/A -
F0573 _FPU_LFLAG_Z N/A -
F0574 _FPU_LFLAG_V N/A -
F057
F057A _FPU_FLAG_I N/A -
F057B _FPU_FLAG_U N/A -
F057C _FPU_FLAG_O N/A -
F057D _FPU_FLAG_Z N/A -
F057E _FPU_FLAG_V N/A -
F057F _FPU_FLAG_E Irregular input Reports in case of irregular input.
F058 - _ERR_STEP Error step Saves error step.
F060 - _REF_COUNT Refresh Increase when module Refresh.
F062 - _REF_OK_CNT Refresh OK Increase when module Refresh is normal.
Increase when module Refresh is
F064 - _REF_NG_CNT Refresh NG
Abnormal.
Increase when module Refresh is
F066 - _REF_LIM_CNT Refresh Limit
abnormal (Time Out).
Increase when module Refresh is
F068 - _REF_ERR_CNT Refresh Error
Abnormal.
F070 - _MOD_RD_ERR_CNT - -
_MOD_WR_ERR_CN
F072 - - -
T
F074 - _CA_CNT - -
F076 - _CA_LIM_CNT - -
F078 - _CA_ERR_CNT - -
F080 - _BUF_FULL_CNT Buffer Full Increase when CPU internal buffer is full.
F082 - _PUT_CNT Put count Increase when Put count.
F084 - _GET_CNT Get count Increase when Get count.
F086 - _KEY Current key indicates the current state of local key.
F088 - _KEY_PREV Previous key indicates the previous state of local key
F090 - _IO_TYER_N Mismatch slot Module Type mismatched slot no.
F091 - _IO_DEER_N Detach slot Module detached slot no.
F093 - _IO_RWER_N RW error slot Module read/write error slot no.
F094 - _IP_IFER_N IF error slot Module interface error slot no.
F096 - _IO_TYER0 Module Type 0 error Main base module Type error.

App. 1-4
Appendix 1 Flag List

Word Bit Variable Function Description


F104 - _IO_DEER0 Module Detach 0 error Main base module Detach error.
F120 - _IO_RWER0 Module RW 0 error Main base module read/write error.
F128 - _IO_IFER_0 Module IF 0 error Main base module interface error.
F140 - _AC_FAIL_CNT Power shutdown times Saves the times of power shutdown.
F142 - _ERR_HIS_CNT Error occur times Saves the times of error occur.
F144 - _MOD_HIS_CNT Mode conversion times Saves the times of mode conversion.
F146 - _SYS_HIS_CNT History occur times Saves the times of system history.
F148 - _LOG_ROTATE N/A
F150 - _BASE_INFO0 Slot information 0 Main base slot information.
- _USER_WRITE_F Available contact point Contact point available in program.
F2000 _RTC_WR RTC RW Data write and read in RTC.
F2001 _SCAN_WR Scan WR Initializing the value of scan.
F200 Request detection of
F2002 _CHK_ANC_ERR Request detection of external error.
external serious error
Request detection of
Request detection of external slight error
F2003 _CHK_ANC_WAR external slight error
(warning).
(warning)
- _USER_STAUS_F User contact point User contact point.
F201
F2010 _INIT_DONE Initialization completed Initialization complete displayed.
Display information of Display information of external serious
F202 - _ANC_ERR
external serious error error
Display information of
Display information of external slight
F203 - _ANC_WAR external slight error
error (warning)
(warning)
Clock data (month/year)
F210 - _MON_YEAR_DT Month/year Supported when using RTC option
module
Clock data (hour/date)
F211 - _TIME_DAY_DT Hour/date Supported when using RTC option
module
Clock data (Second/minute)
F212 - _SEC_MIN_DT Second/minute Supported when using RTC option
module
Clock data (Hundred year/week)
F213 - _HUND_WK_DT Hundred year/week Supported when using RTC option
module

App. 1-1
Appendix 1 Flag List

(2) “E” type


Word Bit Variables Function Description
- _SYS_STATE Mode and state Indicates PLC mode and operation State.
F0000 _RUN Run Run state.
F0001 _STOP Stop Stop state.
F0002 _ERROR Error Error state.
F0003 _DEBUG N/A
F0004 _LOCAL_CON Local control Local control mode.
F0006 _REMOTE_CON Remote mode Remote control mode.
F0008 _RUN_EDIT_ST Editing during RUN Editing program download during RUN.
F0009 _RUN_EDIT_CHK Editing during RUN Internal edit processing during RUN.
F000A _RUN_EDIT_DONE Edit done during RUN Edit is done during RUN.
F000B _RUN_EDIT_END Edit end during RUN Edit is ended during RUN.
F000C _CMOD_KEY Operation mode Operation mode changed by key.
F000D _CMOD_LPADT Operation mode Operation mode changed by local PADT.
F000~1 F000E _CMOD_RPADT Operation mode Operation mode changed by Remote PADT.
Operation mode changed by Remote
F000F _CMOD_RLINK Operation mode
communication module.
F0010 _FORCE_IN Forced input Forced input state.
F0011 _FORCE_OUT Forced output Forced output state.
F0014 _MON_On Monitor Monitor on execution.
F0015 _USTOP_On Stop Stop by Stop function.
F0016 _ESTOP_On EStop Stop by EStop function.
F0017 _CONPILE_MODE Compile Compile on execution.
F0018 _INIT_RUN Initialize Initialization task on execution.
F001C _PB1 Program Code 1 Program Code 1 selected.
F001D _PB2 Program Code 2 Program Code 2 selected.
F001E _CB1 Compile Code 1 Compile Code 1 selected.
F001F _CB2 Compile Code2 Compile Code 2 selected.
- _CNF_ER System error Reports heavy error state of system.
F0021 _IO_TYER Module Type error Module Type does not match.
Module detachment
F0022 _IO_DEER Module is detached.
error
F002~3
F0024 _IO_RWER Module I/O error Module I/O error.

F0025 _IP_IFER Module interface error Special/communication module interface error.


Detected heavy error in external
F0026 _ANNUM_ER External device error
Device.

App. 1-1
Appendix 1 Flag List

Word Bit Variable Function Description


F0028 _BPRM_ER Basic parameter Basic parameter error.
F0029 _IOPRM_ER IO parameter I/O configuration parameter error.
Special module parameter is
F002A _SPPRM_ER Special module parameter
Abnormal.
Communication module Communication module parameter
F002B _CPPRM_ER
F002~3 parameter is abnormal.
F002C _PGM_ER Program error Program error.
F002D _CODE_ER Code error Program Code error.
F002E _SWDT_ER System watchdog System watchdog operated.
F0030 _WDT_ER Scan watchdog Scan watchdog operated.
- _CNF_WAR System warning Reports light error state of system.
F0041 _DBCK_ER Backup error Data backup error.
F0043 _ABSD_ER Operation shutdown error Stop by abnormal operation.
F0046 _ANNUM_WAR External device error Detected light error of external device.
F0048 _HS_WAR1 N/A
F004
F0049 _HS_WAR2 N/A
F0054 _P2P_WAR1 P2P parameter 1 P2P – parameter 1 error.
F0055 _P2P_WAR2 N/A
F0056 _P2P_WAR3 N/A
F005C _CONSTANT_ER Constant error Constant error.
- _USER_F User contact Timer used by user.
F0090 _T20MS 20ms As a clock signal available at user program, it
reverses On/Off every half period. Since clock
F0091 _T100MS 100ms signal is dealt with at the end of scan, there may
be delay or distortion according to scan time. So
F0092 _T200MS 200ms use clock that’s longer than scan time. Clock
signal is Off status at the start of scan program
F0093 _T1S 1s Clock
and task program.
F0094 _T2S 2 s Clock _T100ms clock
50ms 50ms
F0095 _T10S 10 s Clock
F009
F0096 _T20S 20 s Clock
F0097 _T60S 60 s Clock
F0099 _On Ordinary time On Always On state Bit.
F009A _Off Ordinary time Off Always Off state Bit.
F009B _1On 1scan On First scan On Bit.
F009C _1Off 1scan Off First scan OFF bit.
F009D _STOG Reversal Reversal every scan.

App. 1-2
Appendix 1 Flag List

Word Bit Variable Function Description


- _USER_CLK User Clock Clock available for user setting.
F0100 _USR_CLK0 Setting scan repeat On/Off as much as set scan Clock 0.
F0101 _USR_CLK1 Setting scan repeat On/Off as much as set scan Clock 1.
F0102 _USR_CLK2 Setting scan repeat On/Off as much as set scan Clock 2.
F010 F0103 _USR_CLK3 Setting scan repeat On/Off as much as set scan Clock 3.
F0104 _USR_CLK4 Setting scan repeat On/Off as much as set scan Clock 4.
F0105 _USR_CLK5 Setting scan repeat On/Off as much as set scan Clock 5.
F0106 _USR_CLK6 Setting scan repeat On/Off as much as set scan Clock 6.
F0107 _USR_CLK7 Setting scan repeat On/Off as much as set scan Clock 7.
- _LOGIC_RESULT Logic result Indicates logic results.
On during 1 scan in case of operation
F0110 _LER operation error
error.
F0111 _ZERO Zero flag On when operation result is 0.
F011
F0112 _CARRY Carry flag On when carry occurs during operation.
F0113 _ALL_Off All output OFF On in case that all output is Off.
Operation error
F0115 _LER_LATCH Keeps On during operation error.
Latch
- _CMP_RESULT Comparison result Indicates the comparison result.
F0120 _LT LT flag On in case of “less than”.
F0121 _LTE LTE flag On in case of “equal or less than”.
F012 F0122 _EQU EQU flag On in case of “equal”.
F0123 _GT GT flag On in case of “greater than”.
F0124 _GTE GTE flag On in case of “equal or greater than”.
F0125 _NEQ NEQ flag On in case of “not equal”.
F014 - _FALS_NUM FALS no. Indicates FALS no.
F015 - _PUTGET_ERR0 PUT/GET error 0 Main base Put / Get error.
F023 - _PUTGET_NDR0 PUT/GET end 0 Main base Put/Get end.
F044 - _CPU_TYPE CPU Type Indicates information for CPU Type.
F045 - _CPU_VER CPU version Indicates CPU version.
F046 - _OS_VER OS version Indicates OS version.
F048 - _OS_DATE OS date Indicates OS distribution date.
F050 - _SCAN_MAX Max. scan time Indicates max. scan time.
F051 - _SCAN_MIN Min. scan time Indicates min. scan time.
F052 - _SCAN_CUR Current scan time Current scan time.
Clock data (month/year)
F0053 - _MON_YEAR Month/year Supported when using RTC option
module
Clock data (hour/date)
F0054 - _TIME_DAY Hour/date Supported when using RTC option
module
Clock data (Second/minute)
F0055 - _SEC_MIN Second/minute Supported when using RTC option
module

App. 1-4
Appendix 1 Flag List

Word Bit Variable Function Description


Clock data (Hundred year/week)
F0056 - _HUND_WK Hundred year/week Supported when using RTC option
module
- _FPU_INFO N/A -
F0570 _FPU_LFLAG_I N/A -
F0571 _FPU_LFLAG_U N/A -
F0572 _FPU_LFLAG_O N/A -
F0573 _FPU_LFLAG_Z N/A -
F0574 _FPU_LFLAG_V N/A -
F057
F057A _FPU_FLAG_I N/A -
F057B _FPU_FLAG_U N/A -
F057C _FPU_FLAG_O N/A -
F057D _FPU_FLAG_Z N/A -
F057E _FPU_FLAG_V N/A -
F057F _FPU_FLAG_E Irregular input Reports in case of irregular input.
F058 - _ERR_STEP Error step Saves error step.
F060 - _REF_COUNT Refresh Increase when module Refresh.
F062 - _REF_OK_CNT Refresh OK Increase when module Refresh is normal.
Increase when module Refresh is
F064 - _REF_NG_CNT Refresh NG
Abnormal.
Increase when module Refresh is
F066 - _REF_LIM_CNT Refresh Limit
abnormal (Time Out).
Increase when module Refresh is
F068 - _REF_ERR_CNT Refresh Error
Abnormal.
F070 - _MOD_RD_ERR_CNT - -
_MOD_WR_ERR_CN
F072 - - -
T
F074 - _CA_CNT - -
F076 - _CA_LIM_CNT - -
F078 - _CA_ERR_CNT - -
F080 - _BUF_FULL_CNT Buffer Full Increase when CPU internal buffer is full.
F082 - _PUT_CNT Put count Increase when Put count.
F084 - _GET_CNT Get count Increase when Get count.
F086 - _KEY Current key indicates the current state of local key.
F088 - _KEY_PREV Previous key indicates the previous state of local key
F090 - _IO_TYER_N Mismatch slot Module Type mismatched slot no.
F091 - _IO_DEER_N Detach slot Module detached slot no.
F093 - _IO_RWER_N RW error slot Module read/write error slot no.
F094 - _IP_IFER_N IF error slot Module interface error slot no.
F096 - _IO_TYER0 Module Type 0 error Main base module Type error.

App. 1-4
Appendix 1 Flag List

Word Bit Variable Function Description


F104 - _IO_DEER0 Module Detach 0 error Main base module Detach error.
F120 - _IO_RWER0 Module RW 0 error Main base module read/write error.
F128 - _IO_IFER_0 Module IF 0 error Main base module interface error.
F140 - _AC_FAIL_CNT N/A
F142 - _ERR_HIS_CNT N/A
F144 - _MOD_HIS_CNT N/A
F146 - _SYS_HIS_CNT History occur times Saves the times of system history.
F148 - _LOG_ROTATE N/A
F150 - _BASE_INFO0 Slot information 0 Main base slot information.
- _USER_WRITE_F Available contact point Contact point available in program.
F2000 _RTC_WR RTC RW Data write and read in RTC.
F2001 _SCAN_WR Scan WR Initializing the value of scan.
F200 Request detection of
F2002 _CHK_ANC_ERR Request detection of external error.
external serious error
Request detection of
Request detection of external slight error
F2003 _CHK_ANC_WAR external slight error
(warning).
(warning)
- _USER_STAUS_F User contact point User contact point.
F201
F2010 _INIT_DONE Initialization completed Initialization complete displayed.
Display information of Display information of external serious
F202 - _ANC_ERR
external serious error error
Display information of
Display information of external slight
F203 - _ANC_WAR external slight error
error (warning)
(warning)
Clock data (month/year)
F210 - _MON_YEAR_DT Month/year Supported when using RTC option
module
Clock data (hour/date)
F211 - _TIME_DAY_DT Hour/date Supported when using RTC option
module
Clock data (Second/minute)
F212 - _SEC_MIN_DT Second/minute Supported when using RTC option
module
Clock data (Hundred year/week)
F213 - _HUND_WK_DT Hundred year/week Supported when using RTC option
module

App. 1-6
Appendix 1 Flag List

Appendix 1.2 Communication Relay (L) List

Here describes data link communication relay(L). (Supported in “S(U)” type)

(1) High-speed Link 1

Device Keyword Type Description


High speed link parameter 1 normal operation of all station
Indicates normal operation of all station according to parameter set
in High speed link, and On under the condition as below.
1. In case that all station set in parameter is RUN mode and no
L000 _HS1_RLINK Bit error,
2. All data block set in parameter is communicated normally, and
3. The parameter set in each station itself is communicated
normally.
Once RUN_LINK is On, it keeps On unless stopped by
LINK_DISABLE.
Abnormal state after _HS1RLINK On
In the state of _HSmRLINK flag On, if communication state of the
station set in the parameter and data block is as follows, this flag
shall be On.
1. In case that the station set in the parameter is not RUN mode, or
L001 _HS1_LTRBL Bit 2. There is an error in the station set in the parameter, or
3. The communication state of data block set in the parameter is not
good.
LINK TROUBLE shall be On if the above 1, 2 & 3 conditions occur,
and if the condition return to the normal state, it shall be OFF
again.
High speed link parameter 1, K block general state
L0020 ~ _HS1_STATE[k] Bit Indicates the general state of communication information for each
L005F (k = 00~63) Array data block of setting parameter.
_HS1_STATE[k] = HS1MOD[k]&_HS1TRX[k]&(~_HS1_ERR[k])
High speed link parameter 1, k block station RUN operation mode
L0060 ~ _HS1_MOD[k] Bit
L009F (k = 00~63) Array Indicates operation mode of station set in K data block of
parameter.
Normal communication with High speed link parameter 1, k block
L0100 ~ _HS1_TRX[k] Bit station
L013F (k = 00~63) Array Indicates if communication state of Kdata of parameter is
communicated smoothly according to the setting.
High speed link parameter 1, K block station operation error mode
L0140 ~ _HS1_ERR[k] Bit
L017F (k = 00~63) Array Indicates if the error occurs in the communication state of k data
block of parameter.
L0180 ~ Bit High speed link parameter 1, K block setting
_HS1_SETBLOCK[k]
L021F Array Indicates whether or not to set k data block of parameter.

App. 1-6
Appendix 1 Flag List

(2) High-speed Link2

Device Keyword Type Description


High-speed link parameter 2 normal operation of all station.
Indicates normal operation of all station according to parameter set in
High-speed link and On under the condition as below.
L0260 _HS2_RLINK Bit 1. In case that all station set in parameter is Run mode and no error
2. All data block set in parameter is communicated and
3.The parameter set in each station itself is communicated normally.
Once RUN_LINK is On, it keeps On unless stopped by LINK_DISABLE.
Abnormal state after _HS2RLINK On.
In the state of _HSmRLINK flag On, if communication state of the station
set in the parameter and data block is as follows, this flag shall be On.
1. In case that the station set in the parameter is not RUN mode, or
L0261 _HS2_LTRBL Bit 2. There is an error in the station set in the parameter, or
3. The communication state of data block set in the parameter is not
good.
LINK TROUBLE shall be On if the above 1, 2 & 3 conditions occur, and
if the condition return to the normal state, it shall be OFF again.
High speed link parameter 1, k block general state.
L0280 ~ _HS2_STATE[k] Bit Indicates the general state of communication information for each data
L031F (k = 00~63) Array block of setting parameter.
_HS2_STATE[k]=HS2MOD[k]&_HS2TRX[k]&(~_HS2_ERR[k])
L0320 ~ _HS2_MOD[k] Bit High speed link parameter 1, k block station RUN operation mode.
L035F (k = 00~63) Array Indicates operation mode of station set in k data block of parameter.
Normal communication with High speed link parameter 1, K block
L0360 ~ _HS2_TRX[k] Bit station.
L039F (k = 00~63) Array Indicates if communication state of K data of parameter is
communicated smoothly according to the setting.
High speed link parameter 1, K block station operation error mode.
L0400 ~ _HS2_ERR[k] Bit
L043F (k = 00~63) Array Indicates if the error occurs in the communication state of k data block of
parameter.
L0440 ~ Bit High speed link parameter 1, K block setting.
_HS2_SETBLOCK[k]
L047F Array Indicates whether or not to set k data block of parameter.

App. 1-7
Appendix 1 Flag List

(3) Common area

Communication flag list according to P2P service setting.


P2P parameter: “S” type 1~3, “E” type 1
P2P block: “S” type and “E” type 0~31

Device Keyword Type Description


Indicates P2P parameter 1, 0 Block service
L5120 _P2P1_NDR00 Bit
normal end.
Indicates P2P parameter 1, 0 Block service
L5121 _P2P1_ERR00 Bit
abnormal end.
Indicates error code in case of P2P parameter 1, 0 Block
L513 _P2P1_STATUS00 Word
service abnormal end.
Indicates P2P parameter 1, 0 Block service
L514 _P2P1_SVCCNT00 DWord
normal count.
Indicates P2P parameter 1, 0 Block service
L516 _P2P1_ERRCNT00 DWord
abnormal count.
L5180 _P2P1_NDR01 Bit P2P parameter 1, 1 Block service normal end.

L5181 _P2P1_ERR01 Bit P2P parameter 1, 1 Block service abnormal end.


Indicates error code in case of P2P parameter 1, 1 Block
L519 _P2P1_STATUS01 Word
service abnormal end.
Indicates P2P parameter 1, 1 Block service
L520 _P2P1_SVCCNT01 DWord
normal count.
Indicates P2P parameter 1, 1 Block service
L522 _P2P1_ERRCNT01 DWord
abnormal count.
L524~L529 - Word P2P parameter 1,2 Block service total.

L530~L535 - Word P2P parameter 1,3 Block service total.

L536~L697 - Word P2P parameter 1,4~30 Block service total.

L698~L703 - Word P2P parameter 1,31 Block service total.

App. 1-9
Appendix 2 Dimension

Appendix 2 Dimension (Unit: mm)


(1) Economy type main unit (“E” type)

-. XBC-DR10/14E, XBC-DN10/14E, XBC-DP10/14E

-. XBC-DR20/30E, XBC-DN20/30E, XBC-DP20/30E

App.2 −1
Appendix 2 Dimension

(2) Standard type main unit (“S(U)” type)


-. XBC-DN20/30S(U), XBC-DR20/30SU, XBC-DP20/30SU

- XBC-DN40SU, XBC-DR40SU¸ XBC-DP40SU

App.2 −2
Appendix 2 Dimension

- XBC-DN60SU, XBC-DR60SU, XBC-DP60SU

App.2 −3
Appendix 2 Dimension

(3) Extension I/O module

-. XBE-DC32A, XBE-TR32A

B A
20
19
18
17
16
15
14
13
12
11
10
09
08
07
06
05
04
03
02
01

-. XBE-RY16A

App.2 −4
Appendix 2 Dimension

-. XBE-DC08A, XBE-DC16A, XBE-TN08A, XBE-TN16A

-. XBE-DR16A, XBE-RY08A

App.2 −5
Appendix 3 Compatibility with MASTER-K (Special Relay)

Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Symbol
Device Function Device Function

F0000 RUN mode _RUN F0000 RUN Edit mode


F0001 Program mode _STOP F0001 Program mode
F0002 Pause mode _ERROR F0002 Error mode
F0003 Debug mode _DEBUG F0003 Debug mode
F0004 N/A _LOCAL_CON F0006 Remote mode
F0005 N/A _MODBUS_CON F0006 Remote mode
F0006 Remote mode _REMOTE_CON F0006 Remote mode
F0007 User memory setup - F0007 N/A
F0008 N/A _RUN_EDIT_ST F0008 Editing during RUN
F0009 N/A _RUN_EDIT_CHK F0009 Editing during RUN
F000A User memory operation _RUN_EDIT_DONE F000A Edit done during RUN
F000B N/A _RUN_EDIT_END F000B Edit end during RUN
F000C N/A _CMOD_KEY F000C Operation mode change by KEY
F000D N/A _CMOD_LPADT F000D Operation mode change by PADT
Operation mode change by Remote
F000E N/A _CMOD_RPADT F000E
PADT
Operation mode change cause by
F000F STOP command execution _CMOD_RLINK F000F
remote communication module
F0010 Ordinary time On _FORCE_IN F0010 Forced input
F0011 Ordinary time Off _FORCE_OUT F0011 Forced output
F0012 1 Scan On _SKIP_ON F0012 I/O Skip execution
F0013 1 Scan Off _EMASK_ON F0013 Error mask execution
F0014 Reversal every Scan _MON_ON F0014 Monitor execution
_USTOP_ON F0015 Stop by Stop Function
_ESTOP_ON F0016 Stop by ESTOP Function
_CONPILE_MODE F0017 Compile
F0015 ~
F001C N/A
_INIT_RUN F0018 Initialize
F0019 ~
- F001F N/A

_PB1 F001C Program Code 1


F001D N/A _PB2 F001D Program Code 2
F001E N/A _CB1 F001E Compile code 1
F001F N/A _CB2 F001F Compile code 2

App. 3-1
Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Symbol
Device Function Device Function

F0020 1 Step RUN _CPU_ER F0020 CPU configuration error


F0021 Break Point RUN _IO_TYER F0021 Module type mismatch error
F0022 Scan RUN _IO_DEER F0022 Module detach error
F0023 Contact value match RUN _FUSE_ER F0023 Fuse cutoff error
F0024 Word value match RUN _IO_RWER F0024 I/O module read/write error
Special/communication module interface
_IP_IFER F0025
error
Heavy error detection of external
_ANNUM_ER F0026
equipment error
- F0027 N/A
_BPRM_ER F0028 Basic parameter error
_IOPRM_ER F0029 I/O configuration parameter error
F0025 ~
N/A _SPPRM_ER F002A Special module parameter error
F002F
Communication module parameter
_CPPRM_ER F002B
error
_PGM_ER F002C Program error
_CODE_ER F002D Program Code error
_SWDT_ER F002E System watchdog error
_BASE_POWER_
F002F Base power error
ER
F0030 Heavy error _WDT_ER F0030 Scan watchdog
F0031 Light error - F0031 -
F0032 WDT error - F0032 -
F0033 I/O combination error - F0033 -
F0034 Battery voltage error - F0034 -
F0035 Fuse error - F0035 -
F0036 ~ F0036 ~
N/A - -
F0038 F0038
F0039 Backup normal - F0039 -
F003A Clock data error - F003A -
F003B Program change - F003B -
F003C Program change error - F003C -
F003D ~ F003D ~
N/A - N/A
F003F F003F
_RTC_ER F0040 RTC data error

_DBCK_ER F0041 Data backup error

_HBCK_ER F0042 Hot restart disabled error


F0040~ _ABSD_ER F0043 Abnormal operation stop
N/A
F005F
_TASK_ER F0044 Task collision

_BAT_ER F0045 Battery error


Light error detection of external
_ANNUM_ER F0046
equipment

App. 3-2
Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Symbol
Device Function Device Function

_LOG_FULL F0047 Log memory full warning

_HS_WAR1 F0048 High speed link parameter 1 error

_HS_WAR2 F0049 High speed link parameter 2 error

- F004A ~ F0053 N/A

_P2P_WAR1 F0054 P2P parameter 1 error


F0040 ~ F005F N/A
_P2P_WAR2 F0055 P2P parameter 2 error

_P2P_WAR3 F0056 P2P parameter 3 error

- F0057 ~ F005B N/A

_Constant_ER F005C Constant error

- F005D ~ F005F N/A

F0060 ~ F006F Error Code save - F0060 ~ F006F N/A

F0070 ~ F008F Fuse cutoff save - F0070 ~ F008F N/A

F0090 20ms cycle Clock _T20MS F0090 20ms cycle Clock

F0091 100ms cycle Clock _T100MS F0091 100ms cycle Clock

F0092 200ms cycle Clock _T200MS F0092 200ms cycle Clock

F0093 1s cycle Clock _T1S F0093 1s cycle Clock

F0094 2s cycle Clock _T2S F0094 2s cycle Clock

F0095 10s cycle Clock _T10S F0095 10s cycle Clock

F0096 20s cycle Clock _T20S F0096 20s cycle Clock

F0097 60s cycle Clock _T60S F0097 60s cycle Clock

- F0098 N/A

_ON F0099 Ordinary time On

_OFF F009A Ordinary time Off


F0098 ~F009F
N/A _1ON F009B 1 Scan On

_1OFF F009C 1 Scan Off

_STOG F009D Reversal every Scan

- F009B ~ F009F N/A

F0100 User Clock 0 - F0100 User Clock 0

F0101 User Clock 1 - F0101 User Clock 1

F0102 User Clock 2 - F0102 User Clock 2

F0103 User Clock 3 - F0103 User Clock 3

F0104 User Clock 4 - F0104 User Clock 4

F0105 User Clock 5 - F0105 User Clock 5

F0106 User Clock 6 - F0106 User Clock 6

F0107 User Clock 7 - F0107 User Clock 7

App. 3-3
Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Symbol
Device Function Device Function

F0108 ~ F010F - F0108 ~ F010F N/A

F0110 Operation error flag _Ler F0110 Operation error flag

F0111 Zero flag _Zero F0111 Zero flag

F0112 Carry flag _Carry F0112 Carry flag

F0113 Full output Off _All_Off F0113 Full output Off


Common RAM R/W
F0114 - F0114 N/A
error
Operation error flag
F0115 _Ler_Latch F0115 Operation error flag(latch)
(latch)
F0116 ~ F011F - F0116 ~ F011F N/A

F0120 LT flag _LT F0120 LT flag

F0121 LTE flag _LTE F0121 LTE flag

F0122 EQU flag _EQU F0122 EQU flag

F0123 GT flag _GT F0123 GT flag

F0124 GTE flag _GTE F0124 GTE flag

F0125 NEQ flag _NEQ F0125 NEQ flag

F0126 ~ F012F N/A - F0126 ~ F012F N/A

F0130~ F013F AC Down Count _AC_F_CNT F0130~ F013F AC Down Count

F0140~ F014F FALS no. _FALS_NUM F0140~ F014F FALS no.

_PUTGET_ERR F0150~ F030F PUT/GET error flag

CPU TYPE F0440 ~ F044F CPU TYPE


F0150~ F015F PUT/GET error flag
CPU VERSION F0450 ~ F045F CPU VERSION

OS version no. F0460 ~ F047F System OS version no.

F0160~ F049F N/A OS date F0480 ~ F049F System OS DATE

App. 3-4
Appendix 3 Compatibility with MASTER-K (Special Relay)

MASTER-K XGB
Symbol
Device Function Device Function

F0500~ F050F Max. Scan time _SCAN_MAX F0500~ F050F Max. Scan time

F0510~ F051F Min. Scan time _SCAN_MIN F0510~ F051F Min. Scan time

F0520~ F052F Current Scan time _SCAN_CUR F0520~ F052F Current Scan time
Clock data
F0530~ F053F _YEAR_MON F0530~ F053F Clock data (year/month)
(year/month)
F0540~ F054F Clock data (day/hr) _DAY_TIME F0540~ F054F Clock data(day/hr)

F0550~ F055F Clock data (min/sec) _MIN_SEC F0550~ F055F Clock data(min/sec)
Clock data
F0560~ F056F _HUND_WK F0560~ F056F Clock data(100year/weekday)
(100year/weekday)
_FPU_LFlag_I F0570 -

_FPU_LFlag_U F0571 -

_FPU_LFlag_O F0572 -

_FPU_LFlag_Z F0573 -

_FPU_LFlag_V F0574 -

- F0575 ~ F0579 N/A

F0570~ F058F N/A _FPU_Flag_I F057A -

_FPU_Flag_U F057B -

_FPU_Flag_O F057C -

_FPU_Flag_Z F057D -

_FPU_Flag_V F057E -

_FPU_Flag_E F057F -

Error Step F0580~ F058F Error step save

F0590~ F059F Error step save - F0590~ F059F N/A


FMM detailed error
F0600~ F060F _REF_COUNT F060~F061 Refresh Count
information
F0610~ F063F N/A _REF_OK_CNT F062~F063 Refresh OK Count

- - _REF_NG_CNT F064~F065 Refresh NG Count

- - _REF_LIM_CNT F066~F067 Refresh Limit Count

- - _REF_ERR_CNT F068~F069 Refresh Error Count

- - _MOD_RD_ERR_CNT F070~F071 MODULE Read Error Count

- - _MOD_WR_ERR_CNT F072~F073 MODULE Write Error Count

- - _CA_CNT F074~F075 Cmd Access Count

- - _CA_LIM_CNT F076~F077 Cmd Access Limit Count

- - _CA_ERR_CNT F078~F079 Cmd Access Error Count

- - _BUF_FULL_CNT F080~F081 Buffer Full Count

App. 3-5
Appendix 3 Compatibility with MASTER-K (Special Relay)

Note

1. When you convert the project written by KGLWIN in MASTER-K series (K80S, K200S, K300S, and
K1000S) into XG5000 project, some instructions used in only MASTER-K is not converted. And the
previous parameter used in MASTER-K is converted into default value.
2. XGB economy type project can be converted into XGB standard type project but parameter is converted
into default value.
3. When you convert the XGB standard type project into XGB economy type project, some instructions used
in only XGB standard type is not converted. And the parameter is converted into default value.

App. 3-6
Appendix 4 Instruction List

Appendix 4 Instruction List

Appendix 4.1 Classification of Instructions


Classification Instructions Details Remarks
Contact Point Instruction LOAD, AND, OR related Instructions
Unite Instruction AND LOAD, OR LOAD, MPUSH, MLOAD, MPOP
Reverse Instruction NOT
Master Control Instruction MCS, MCSCLR
OUT, SET, RST, 1 Scan Output Instruction, Output Reverse
Output Instruction
Basic Instruction (FF)
Instructions Sequence/Last-input
Step Control Instruction ( SET Sxx.xx, OUT Sxx.xx )
Preferred Instruction
End Instruction END
Non-Process Instruction NOP
Timer Instruction TON, TOFF, TMR, TMON, TRTG
Counter Instruction CTD, CTU, CTUD, CTR
4/8/64 Bits
Data Transfer Instruction Transfers specified Data, Group, String
available
4/8 Bits
Conversion Instruction Converts BIN/BCD of specified Data & Group
available
Data Type Conversion
Converts Integer/Real Number
Instruction
Output Terminal Compare Compare to
Saves compared results in special relay
Instruction Unsigned
Input Terminal Compare Saves compared results in BR. Compares Real Number, Compare to
Instruction String & Group. Compares 3 Operands Signed
Increase/Decrease 4/8 Bits
Increases or decreases specified data 1 by 1
Instruction available
Rotates specified data to the left and right, 4/8 Bits
Rotate Instruction
including Carry available
Moves specified data to the left and right, word by word, bit 4/8 Bits
Move Instruction
by bit available
Exchanges between devices, higher & lower byte, group
Exchange Instruction
data
Addition, Subtraction, Multiplication & Division for Integer/
BIN Operation Instruction Real Number, Addition for String, Addition & Subtraction for
Group
BCD Operation Instruction Addition, Subtraction, Multiplication, Division.
Logic Multiplication, Logic Addition, Exclusive OR, Exclusive
Application Logic Operation Instruction
NOR, Group Operation
Instructions Error Display, WDT Initialize, Output Control, Operation
System Instruction
Stop, etc.
Encode, Decode, Data Disconnect/Connect, Search, Align,
Data Process Instruction
Max., Min., Total, Average, etc.
Data Table Process
Data Input/Output of Data Table
Instruction
String related Convert, Comment Read, String Extract,
String Process Instruction
ASCII Convert, HEX Convert, String Search, etc.
Special Function Trigonometric Function, Exponential/Log Function, Angle/
Instruction Radian Convert, etc.
Data Control Instruction Max/Min Limit Control, Dead-zone Control, Zone Control
Time related Instruction Date Time Data Read/Write, Time Data Adjust & Convert
Diverge Instruction JMP, CALL
Loop Instruction FOR/NEXT/BREAK
Flag related Instruction Carry Flag Set/Reset, Error Flag Clear
Special/Communication
Data Read/Write by BUSCON Direct Access
related Instruction
Interrupt related Instruction Interrupt Enable/Disable
Signal Reverse Instruction Reverse Integer/Real Signals, Absolute Value Operation
Blcok Read/Write/Compare/Convert, Flash data
File related Instruction
Transmission

App. 4-1
Appendix 4 Instruction List

Appendix 4.2 Basic Instructions


(1) Contact point instruction
Support
Classification Designations Symbol Description
XGK XGB
LOAD A Contact Point Operation Start ○ ○

LOAD NOT B Contact Point Operation Start ○ ○


A Contact Point Series-
AND ○ ○
Connected
B Contact Point Series-
AND NOT ○ ○
Connected
A Contact Point Parallel-
OR ○ ○
Connected
B Contact Point Parallel-
OR NOT ○ ○
Contact Connected
Point Positive Convert Detected
LOADP P ○ ○
Contact Point
Negative Convert Detected
LOADN N ○ ○
Contact Point
Positive Convert Detected
ANDP P ○ ○
Contact Point Series-Connected
Negative Convert Detected
ANDN N ○ ○
Contact Point Series-Connected
Positive Convert Detected
ORP P Contact Point Parallel- ○ ○
C
Negativet Convert
d Detected
ORN N Contact Point Parallel- ○ ○
C t d
(2) Union instruction
Support
Classification Designations Symbol Description
XGK XGB

AND LOAD A B A,B Block Series-Connected ○ ○

A
OR LOAD B
A,B Block Parallel-Connected ○ ○

Unite Operation Result Push up to


MPUSH ○ ○
present
MPUSH
Operation Result Load
MLOAD MLOAD ○ ○
Previous to Diverge Point

Operation Result Pop Previous


MPOP MPOP ○ ○
to Diverge Point

App. 4-2
Appendix 4 Instruction List

(3) Reverse instruction


Support
Classification Designations Symbol Description
XGK XGB
Previous Operation results
Reverse NOT ○ ○
Reverse

(4) Master Control instruction


Support
Classification Designations Symbol Description
XGK XGB

MCS MCS n Master Control Setting (n:0~7) ○ ○


Master
Control
MCSCLR MCSCLR n Master Control Cancel (n:0~7) ○ ○

(5) Output instruction


Support
Classification Designations Symbol Description
XGK XGB

OUT Operation Results Output ○ ○

Operation Results Reverse


OUT NOT ○ ○
Output
1 Scan Output if Input
OUTP P ○ ○
Condition rises
1 Scan Output if Input
Output OUTN N ○ ○
Condition falls

SET S Contact Point Output ON kept ○ ○

Contact Point Output OFF


RST R ○ ○
kept
Output Reverse if Input
FF FF D ○ ○
Condition rises

(6) Sequence/Last-input preferred instruction


Support
Classification Designations Symbol Description
XGK XGB
Syy.xx
SET S Sequence Control ○ ○
S
Step
Control
Syy.xx
OUT S Last-input Preferred ○ ○

(7) End instruction


Support
Classification Designations Symbol Description
XGK XGB
End END END Program End ○ ○

(8) Non-process instruction


Support
Classification Designations Symbol Description
XGK XGB
Non-Process Instruction, used
Non-Process NOP Ladder not displayed ○ ○
in Nimonic

App. 4-3
Appendix 4 Instruction List

(9) Timer instruction


Support
Classification Designations Symbol Description
XGK XGB
Input
TON TON T t t ○ ○
T
Input
TOFF TOFF T t t ○ ○
T
Input t1+t2 = t

TMR TMR T t ← t1→ ← t2 →


○ ○
Timer
T
Input
t
TMON TMON T t ○ ○
T

Input
TRTG TRTG T t t ○ ○
T

(10) Counter instruction


Support
Classification Designations Symbol Description
XGK XGB

Reset
Count
Pulse Setting
CTD CTD C c ○ ○
Present

Output

Reset
Count
Pulse Setting
CTU CTU C c ○ ○
Present

Output

Counter Reset
Increased
Pulse
Decreased
Pulse
CTUD CTUD C U D c
Setting ○ ○

Present

Output

Reset
Count
Pulse Setting
CTR CTR C c ○ ○
Present

Output

App. 4-4
Appendix 4 Instruction List

Appendix 4.3 Application Instruction

(1) Data transfer instruction


Support
Classification Designations Symbol Description
XGK XGB
MOV MOV S D
16 bits
(S) (D) ○ ○
Transfer
MOVP MOVP S D

DMOV DMOV S D
32 bits
(S+1,S) (D+1,D ) ○ ○
Transfer
DMOVP DMOVP S D

Short RMOV RMOV S D


Real Number (S+1,S) (D+1,D ) ○ ○
Transfer RMOVP RMOVP S D

Long LMOV LMOV S D


(S+3,S+2,S+1,S)
Real Number ○ ○
Transfer LMOVP LMOVP S D (D+3,D+2,D+1,D)

(Sb): Bit Position


MOV4 MOV4 Sb Db b15 b0
4 bits 4bit trans ○ ○
Transfer
MOV4P MOV4P Sb Db
(Db): Bit Position

(Sb): Bit Position


MOV8 MOV8 Sb Db b15 b0
8 bits
8bit trans ○ ○
Transfer
MOV8P MOV8P Sb Db
(Db): Bit Position

CMOV CMOV S D 1’s complement


(S) (D) ○ ○
CMOVP CMOVP S D
1’s complement
Transfer
DCMOV DCMOV S D 1’s complement
○ ○
(S+1,S) (D+1,D )
DCMOVP DCMOVP S D

GMOV GMOV S D N (S) (D)


16 bits N ○ ○
Group Transfer
GMOVP GMOVP S D N

FMOV FMOV S D N (S) (D)


Multiple
N ○ ○
Transfer
FMOVP FMOVP S D N

b15 b0
BMOV BMOV S D N (S)
Specified Bits …
(D) ○ ○
Transfer
BMOVP BMOVP S D N * Z: Control Word

(S) b15 b0
GBMOV GBMOV S D Z N : N ○ ○
(S+N)
Specified Bits
(D)

Group Transfer
:
GBMOVP GBMOVP S D Z N
(D+N) ○ ○
* Z : Control W ord

App. 4-5
Appendix 4 Instruction List

(1) Data Transfer Instruction (continued)


Support
Classification Designations Symbol Description
XGK XGB
$MOV $MOV S D ○ ○
String String started from (S)
Transfer String started from (D)
$MOVP $MOVP S D ○ ○

(2) BCD/BIN conversion instruction


Support
Classification Designations Symbol Description
XGK XGB
To BCD
BCD BCD S D (S) (D)
○ ○
BCDP BCDP S D BIN( 0~9999 )
BCD
Conversion DBCD DBCD S D To BCD
(S+1,S) (D+1,D ) ○ ○
DBCDP DBCDP S D BIN( 0~99999999 )

BCD4 Sb Db
(Sb):Bit, BIN(0~9)
BCD4 b15 b0

To 4bit BCD
○ ○
BCD4P BCD4P Sb Db
4/8 Bits (Db): Bit
BCD
Conversion (Sb):Bit, BIN(0~99)
BCD8 BCD8 Sb Db
b15 b0
○ ○
To 8bit BCD
BCD8P BCD8P Sb Db
(Db):Bit
BIN BIN S D To BIN
(S) (D) ○ ○
BINP BINP S D BCD( 0~9999 )
BIN
Conversion DBIN DBIN S D To BIN
(S+1,S) (D+1,D ) ○ ○
DBINP DBINP S D
BCD( 0~99999999 )

BIN4 BIN4 Sb Db (Sb):Bit, BCD(0~9)


b15 b0

To 4bit BIN
○ ○
BIN4P BIN4P Sb Db
4/8 Bits (Db):Bit
BIN
Conversion (Sb):Bit, BCD(0~99)
BIN8 BIN8 Sb Db
b15 b0
○ ○
To bit BIN
BIN8P BIN8P Sb Db
(Db):Bit

GBCD GBCD S D N
Data (S) to N converted to BCD,
and (D) to N saved ○ ○
Group GBCDP GBCDP S D N
BCD,BIN
Conversion GBIN GBIN S D N
 Data (S) to N converted to BIN,
and (D) to N saved ○ ○
GBINP GBINP S D N

App. 4-6
Appendix 4 Instruction List

(3) Data type conversion instruction


Support
Classification Designations Symbol Description
XGK XGB
I2R I2R S D To Real
(S) (D+1,D) ○ ○
16 Bits I2RP I2RP S D Int( -32768~32767 )
Integer/Real
Conversion I2L I2L S D
To Long
(S) (D+3,D+2,D+1,D)
○ ○
I2LP S D
Int( -32768~32767 )
I2LP

D2R D2R S D To Real


(S+1,S) (D+1,D)
○ ○
32 Bits D2RP D2RP S D Dint(-2147483648~2147483647)
Integer/Real
Conversion D2L To Long
D2L S D (S+1,S) (D+3,D+2,D+1,D)
○ ○
D2LP D2LP S D Dint(-2147483648~2147483647)

R2I R2I S D To INT


(S+1,S) (D) ○ ○
Short R2IP R2IP S D Whole Sing Real Range
Real/Integer
Conversion R2D R2D S D To DINT
(S+1,S) (D+1,D) ○ ○
R2DP R2DP S D Whole Sing Real Range

L2I S D
To INT
L2I (S+3,S+2,S+1,S) (D)
○ ○
Whole Double Real Range
Long L2IP L2IP S D
Real/Integer
Conversion L2D L2D S D
To DINT
(S+3,S+2,S+1,S) (D+1,D)
○ ○
Whole Double Real Range
L2DP L2DP S D

Remark

Integer value and Real value will be saved respectively in quite different format. For such reason, Real Number
Data should be converted as applicable before used for Integer Operation.

App. 4-7
Appendix 4 Instruction List

(4) Comparison instruction


Support
Classification Designations Symbol Description
XGK XGB
CMP CMP S1 S2
CMP(S1,S2) and applicable Flag SET
Unsigned ○ ○
Compare CMPP S1 S2
(S1, S2 is Word)
CMPP
with Special
Relay DCMP DCMP S1 S2
CMP(S1,S2) and applicable Flag SET
used ○ ○
DCMPP S1 S2
(S1, S2 is Double Word)
DCMPP

CMP4 CMP4 S1 S2
CMP(S1,S2) and applicable Flag SET
○ ○
CMP4P S1 S2
(S1, S2 is Nibble)
CMP4P
4/8 Bits
Compare CMP8 S1 S2
CMP8
CMP(S1,S2) and applicable Flag SET
○ ○
CMP8P S1 S2
(S1, S2 is Byte)
CMP8P
CMP(S1,S2))
TCMP TCMP S1 S2 D
:
CMP(S1+15,S2+15) ○ ○
Table TCMPP TCMPP S1 S2 D Result:(D) ~ (D+15), 1 if identical
Compare
DTCMP DTCMP S1 S2 D CMP((S1+1,S1),(S2+1,S2))
:
CMP((S1+31,S1+30),(S2+31,S2+30)) ○ ○
DTCMPP DTCMPP S1 S2 D Result:(D) ~ (D+15)

GEQ GEQ S1 S2 D N

GEQP GEQP S1 S2 D N

GGT GGT S1 S2 D N

GGTP GGTP S1 S2 D N

GLT GLT S1 S2 D N
Compares S1 data to S2 data word
Group GLTP GLTP S1 S2 D N by word, and saves its result in
Compare Device (D) bit by bit from the lower ○ ○
(16 Bits) GGE GGE S1 S2 D N bit
( N ≤ 16 )
GGEP GGEP S1 S2 D N

GLE GLE S1 S2 D N

GLEP GLEP S1 S2 D N

GNE GNE S1 S2 D N

GNEP GNEP S1 S2 D N

Remark

CMP(P), DCMP(P), CMP4(P), CMP8(P), TCMP(P) & DTCMP(P) Instructions all process the results of
Unsigned Compare. All the other Compare Instructions will perform Signed Compare.

App. 4-8
Appendix 4 Instruction List

4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

GDEQ GDEQ S1 S2 D N ○ ○

GDEQP GDEQP S1 S2 D N ○ ○

GDGT GDGT S1 S2 D N ○ ○

GDGTP GDGTP S1 S2 D N ○ ○

GDLT GDLT S1 S2 D N ○ ○
Compares S1 data to S2 data 2 by
Group GDLTP GDLTP S1 S2 D N 2 words, and saves its result in ○ ○
Compare Device (D) bit by bit from the lower
(32 Bits) GDGE GDGE S1 S2 D N bit ○ ○
( N ≤ 16 )
GDGEP GDGEP S1 S2 D N ○ ○

GDLE GDLE S1 S2 D N ○ ○

GDLEP GDLEP S1 S2 D N ○ ○

GDNE GDNE S1 S2 D N ○ ○

GDNEP GDNEP S1 S2 D N ○ ○

App. 4-9
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB
LOAD= = S1 S2

LOAD> > S1 S2

16 Bits Compares (S1) to (S2), and saves


LOAD< < S1 S2
Data its result in Bit Result(BR) (Signed
○ ○
Compare LOAD>= >= S1 S2
Operation)
(LOAD)
LOAD<= <= S1 S2

LOAD<> <> S1 S2

AND= = S1 S2

AND> > S1 S2
Performs AND operation of (S1) &
16 Bits
AND< < S1 S2 (S2) Compare Result and Bit Result
Data
(BR), and then saves its result in BR ○ ○
Compare AND>= >= S1 S2 (Signed Operation)
(AND)
AND<= <= S1 S2

AND<> <> S1 S2

OR= = S1 S2
Performs OR operation of (S1) &
16 Bits
(S2) Compare Result and Bit Result
Data ○ ○
OR<= (BR), and then saves its result in BR
Compare <= S1 S2 ○ ○
(Signed Operation)
(OR)
OR<> <> S1 S2

LOADD= D= S1 S2

LOADD> D> S1 S2

32 Bits Compares (S1) to (S2), and saves


LOADD< D< S1 S2
Data its result in Bit Result(BR) (Signed
Compare LOADD>= D>= S1 S2
Operation)
(LOAD)
LOADD<= D<= S1 S2

LOADD<> D<> S1 S2

Remark

Comparison instruction for input process the result of Signed comparison instruction generally. To process
Unsigned comparison, Use comparison instruction for input.

App. 4-10
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB
ANDD= D= S1 S2

ANDD> D> S1 S2
32 Bits Performs AND operation of (S1) &
ANDD< D< S1 S2
Data (S2) Compare Result and Bit Result
○ ○
Compare ANDD>= D>= S1 S2
(BR), and then saves its result in
(AND) BR (Signed Operation)
ANDD<= D<= S1 S2

ANDD<> D<> S1 S2

ORD= D= S1 S2

ORD> D> S1 S2

32bt ORD< Performs OR operation of (S1) &


D< S1 S2
Data (S2) Compare Result and Bit Result
○ ○
Compare (BR), and then saves its result in
(OR) ORD>= D>= S1 S2 BR (Signed Operation)

ORD<= D<= S1 S2

ORD<> D<> S1 S2

LOADR= R= S1 S2

LOADR> R> S1 S2

Short LOADR< R< S1 S2


Performs OR operation of (S1) &
Real Number (S2) Compare Result and Bit Result
○ ○
Compare (BR), and then saves its result in
LOADR>= R>= S1 S2
(LOAD) BR (Signed Operation)

LOADR<= R<= S1 S2

LOADR<> R<> S1 S2

ANDR= R= S1 S2

ANDR> R> S1 S2

Short ANDR< R< S1 S2 Compares (S1+1,S) to (S2+1,S2)


Real Number
and saves its result in Bit Result ○ ○
Compare
ANDR>= R>= S1 S2 (BR) (Signed Operation)
(AND)

ANDR<= R<= S1 S2

ANDR<> R<> S1 S2

App. 4-11
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

ORR= R= S1 S2

ORR> R> S1 S2

ORR< R< S1 S2 Compares (S1+1,S1) to (S2+1,S2)


Real Number
and saves its result in Bit Result
Compare ○ ○
(BR) (Signed Operation)
(OR)
ORR>= R>= S1 S2

ORR<= R<= S1 S2

ORR<> R<> S1 S2

LOADL= L= S1 S2

LOADL> L> S1 S2

Long Compares (S1+3,S1+2,S1+1,S) to


Real Number LOADL< L< S1 S2 (S2+3,S2+2, S2+1,S2) and saves its
Compare result in Bit Result(BR) (Signed ○ ○
(LOAD) LOADL>= L>= S1 S2 Operation)

LOADL<= L<= S1 S2

LOADL<> L<> S1 S2

ANDL= L= S1 S2

ANDL> L> S1 S2

Performs AND operation of (S1+


Long ANDL< L< S1 S2 1,S1) & (S2+1,S2) Compare Result
Real Number
and Bit Result(BR), and then saves ○ ○
Compare
ANDL>= L>= S1 S2 its result in BR (Signed Operation)
(AND)

ANDL<= L<= S1 S2

ANDL<> L<> S1 S2

App. 4-12
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

ORL= L= S1 S2

ORL> L> S1 S2

Performs OR operation of (S1


Double Real ORL< L< S1 S2
+1,S1) & (S2+1,S2) Compare
Number Result and Bit Result(BR), and
○ ○
Compare then saves its result in BR
(OR) ORL>= L>= S1 S2
(Signed Operation)

ORL<= L<= S1 S2

ORL<> L<> S1 S2

LOAD$= $= S1 S2

LOAD$> $> S1 S2

String LOAD$< $< S1 S2 Compares (S1) to (S2) Starting


Compare String and saves its result in Bit ○ ○
(LOAD) LOAD$>= $>= S1 S2 Result(BR)

LOAD$<= $<= S1 S2

LOAD$<> $<> S1 S2

AND$= $= S1 S2

AND$> $> S1 S2

AND$< $< S1 S2
Performs AND operation of (S 1)
String
& (S2) Starting String Compare
Compare ○ ○
Result and Bit Result(BR), and
(AND) AND$>= $>= S1 S2
then saves its result in BR

AND$<= $<= S1 S2

AND$<> $<> S1 S2

App. 4-13
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

OR$= $= S1 S2

OR$> $> S1 S2

Performs OR operation of (S1)


OR$< $< S1 S2
String & (S2) Starting String Compare
Compare Result and Bit Result(BR), and ○ ○
(OR) then saves its result in BR
OR$>= $>= S1 S2

OR$<= $<= S1 S2

OR$<> $<> S1 S2

LOADG= G= S1 S2 N

LOADG> G> S1 S2 N
Compares (S1), (S1+1), …,
16 Bits LOADG< G< S1 S2 N (S1+N) to (S2), (S2+1), … ,
Data (S2+N) 1 to 1, and then saves
○ ○
Group Compare LOADG>= G>= S1 S2 N 1 in Bit Result(BR) if each
(LOAD) value compared meets given
condition
LOADG<= G<= S1 S2 N

LOADG<> G<> S1 S2 N

ANDG= G= S1 S1 N

ANDG> G> S1 S1 N
Performs AND operation of
16 Bits ANDG< G< S1 S1 N (S1), (S1+1), …, (S1+N) &
Data (S2), (S2+1), … , (S2+N) 1 to
○ ○
Group Compare 1 Compare Result and Bit
ANDG>= G>= S1 S1 N
(AND) Result (BR), and then saves its
result in BR
ANDG<= G<= S1 S1 N

ANDG<> G<> S1 S1 N

ORG= G= S1 S2 N

ORG> G> S1 S2 N

Performs OR operation of (S1),


16 Bits ORG< G< S1 S2 N (S1+1), …, (S1+N) & (S2),
Data (S2+1), … , (S2+N) 1 to 1
○ ○
Group Compare Compare Result and Bit Result
(OR) ORG>= G>= S1 S2 N (BR), and then saves its result
in BR

ORG<= G<= S1 S2 N

ORG<> G<> S1 S2 N

App. 4-14
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGX XGB
LOADDG= DG= S1 S2 N

LOADDG> DG> S1 S2 N
Compares (S1), (S1+1), …,
32 Bits
LOADDG< DG< S1 S2 N (S1+N) to (S2), (S2+1), … ,
Data
(S2+N) 1 to 1, and then saves
Group ○ ○
LOADDG>= DG>= S1 S2 N 1 in Bit Result(BR) if each
Compare value compared meets given
(LOAD) condition
LOADDG<= DG<= S1 S2 N

LOADDG<> DG<> S1 S2 N

ANDDG= DG= S1 S1 N

ANDDG> DG> S1 S1 N
Performs AND operation of
32 Bits
ANDDG< DG< S1 S1 N (S1), (S1+1), …, (S1+N) &
Data
(S2), (S2+1), … , (S2+N) 1 to
Group ○ ○
1 Compare Result and Bit
Compare ANDDG>= DG>= S1 S1 N
Result(BR), and then saves its
(AND) result in BR
ANDDG<= DG<= S1 S1 N

ANDDG<> DG<> S1 S1 N

ORDG= DG= S1 S2 N

ORDG> DG> S1 S2 N

32 Bits Performs OR operation of


ORDG< DG< S1 S2 N (S1), (S1+1), …, (S1+N) &
Data
(S2), (S2+1), … , (S2+N) 1 to
Group ○ ○
1 Compare Result and Bit
Compare DG>= S1 S2 N Result(BR), and then saves its
ORDG>=
(OR) result in BR

ORDG<= DG<= S1 S2 N

ORDG<> DG<> S1 S2 N

App. 4-15
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB
LOAD3= 3= S1 S2 S3

LOAD3> 3> S1 S2 S3

Three 16-Bit LOAD3< 3< S1 S2 S3 Saves 1 in Bit Result(BR) if each


Data Compare value of (S1), (S2), (S3) meets ○ ○
(LOAD) LOAD3>= 3>= S1 S2 S3 given condition

LOAD3<= 3<= S1 S2 S3

LOAD3<> 3<> S1 S2 S3

AND3= 3= S1 S2 S3

AND3> 3> S1 S2 S3
Performs AND operation of (S1),
Three 16-Bit AND3< 3< S1 S2 S3 (S2), (S3) Compare Result by
Data Compare given condition and Bit Result ○ ○
(AND) AND3>= 3>= S1 S2 S3 (BR), and then saves its result in
BR
AND3<= 3<= S1 S2 S3

AND3<> 3<> S1 S2 S3

OR3= 3= S1 S2 S3

OR3> 3> S1 S2 S3

Performs OR operation of (S1),


Three 32-Bit OR3< <3 S1 S2 S3 (S2), (S3) Compare Result by
Data Compare given condition and Bit Result ○ ○
(OR) OR3>= >=3 S1 S2 S3
(BR), and then saves its result in
BR

OR3<= 3<= S1 S2 S3

OR3<> 3<> S1 S2 S3

LOADD3= D3= S1 S2 S3

LOADD3> D3> S1 S2 S3

Three 16-Bit LOADD3< D3< S1 S2 S3 Saves 1 in Bit Result(BR) if each


Data Compare value of (S1+1,S1), (S2+ 1,S2), ○ ○
(LOAD) LOADD3>= D3>= S1 S2 S3 (S3+1,S3) meets given condition

LOADD3<= D3<= S1 S2 S3

LOADD3<> D3<> S1 S2 S3

App. 4-16
Appendix 4 Instruction List

(4) Comparison instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB
ANDD3= D3= S1 S2 S3

ANDD3> D3> S1 S2 S3

Performs AND operation of (S1+


Three 32-Bit ANDD3< D3< S1 S2 S3 1,S1), (S2+1,S2), (S3+1,S3) Compare
Data Compare Result by given condition and Bit ○ ○
(AND) ANDD3>= D3>= S1 S2 S3 Result (BR), and then saves its
result in BR
ANDD3<= D3<= S1 S2 S3

ANDD<> D3<> S1 S2 S3

ORD3= D3= S1 S2 S3

ORD3> D3> S1 S2 S3

Performs OR operation of (S1+1,


ORD3< D3< S1 S2 S3
Three 32-Bit S1), (S2+1,S2), (S3+1,S3) Compare
Data Compare Result by given condition and Bit ○ ○
(OR) Result (BR), and then saves its
ORD3>= D3>= S1 S2 S3 result in BR

ORD3<= D3<= S1 S2 S3

ORD3<> D3<> S1 S2 S3

App. 4-17
Appendix 4 Instruction List

(5) Increase/Decrease instruction

Support
Classification Designations Symbol Description
XGK XGB
INC INC D
(D)+1 (D) 2
INCP INCP D
4-94
DINC DINC D

BIN Data (D+1,D)+1 (D+1,D) 2


Increase DINCP DINCP D
/
Decrease DEC DEC D
(Signed) (D)-1 (D) 2
DECP DECP D
4-96
DDEC DDEC D
(D+1,D)-1 (D+1,D) 2
DDECP DDECP D

INC4 INC4 Db (D:x bit ~ D:x bit+4) + 1 2

INC4P INC4P Db (D:x bit ~ D:x bit+4) 3


4-95
INC8 INC8 Db (D:x bit ~ D:x bit+8) + 1 2
4/8 Bits Data (D:x bit ~ D:x bit+8)
Increase INC8P INC8P Db 3
/
Decrease DEC4 DEC4 Db (D:x bit ~ D:x bit+4) - 1 2
(Signed)
(D:x bit ~ D:x bit+4)
DEC4P DEC4P Db 3
4-97
DEC8 DEC8 Db (D:x bit ~ D:x bit+8) - 1 2
(D:x bit ~ D:x bit+8)
DEC8P DEC8P Db 3

INCU INCU D
(D)+1 (D)
2
INCUP INCUP D
4-98
DINCU DINCU D
(D+1,D)+1 (D+1,D)
BIN Data 2
Increase DINCUP DINCUP D
/
Decrease DECU DECU D
(D)-1 (D)
(Unsigned) 2
DECUP DECUP D
4-99
DDECU DDECU D
(D+1,D)-1 (D+1,D)
2
DDECUP DDECUP D

App. 4-18
Appendix 4 Instruction List

(6) Rotation instruction

Support
Classification Designations Symbol Description
XGK XGB
ROL ROL D n b15 b0
CY D
ROLP ROLP D n
Rotate to Left ○ ○
DROL DROL D n b31 b15 b0
CY D+1 D
DROLP DROLP D n

ROL4 ROL4 Db n b+3 b


CY D
ROL4P ROL4P Db n
4/8 Bits
○ ○
Rotate to Left ROL8 Db n
ROL8 b+7 b
CY D
ROL8P ROL8P Db n

ROR ROR D n
b15 b0
D CY
RORP RORP D n
Rotate to Right ○ ○
DROR DROR D n b31 b15 b0
D+1 D CY
DRORP DRORP D n
b+3 b
ROR4 ROR4 Db n D CY

ROR4P ROR4P Db n
4/8 Bits
b+7 b ○ ○
Rotate to Right ROR8 Db n
ROR8 D CY

ROR8P ROR8P Db n

RCL RCL D n
b15 b0
CY D
Rotate to Left RCLP RCLP D n
(including ○ ○
Carry) DRCL DRCL D n b31 b15 b0
CY D+1 D
DRCLP DRCLP D n
b+3 b
RCL4 RCL4 Db n CY D
4/8 Bits
RCL4P RCL4P Db n
Rotate to Left
b+7 b ○ ○
(including RCL8 Db n
RCL8 CY D
Carry)
RCL8P RCL8P Db n

RCR RCR D n
b15 b0
Rotate D CY
RCRP RCRP D n
to Right
○ ○
(including DRCR D n
DRCR b31 b15 b0
Carry) D+1 D CY
DRCRP DRCRP D n
b+3 b
RCR4 RCR4 Db n D CY

4/8 Bits
RCR4P RCR4P Db n
Rotate to Right
b+7 b ○ ○
(including
RCR8 RCR8 Db n D CY
Carry)
RCR8P RCR8P Db n

App. 4-19
Appendix 4 Instruction List

(7) Move instruction

Support
Classification Designations Symbol Description
XGK XGB
St Ed
BSFT BSFT St Ed b15 b0

Bits Move ○ ○
BSFTP BSFTP St Ed
0

b15 b0
BSFL BSFL D n
(D)

BSFLP BSFLP D n CY 0
Move to Higher
○ ○
Bit b31 b0
DBSFL DBSFL D n
(D+1, D) … …
DBSFLP DBSFLP D n CY 0

b+3 b
BSFL4 BSFL4 Db n
D

Move to Higher BSFL4P BSFL4P Db n CY 0


Bit within 4/8 ○ ○
b+7 b
Bits range BSFL8 BSFL8 Db n
D

BSFL8P BSFL8P Db n CY 0

b15 b0
BSFR BSFR D n (D)

0
BSFRP BSFRP D n CY
Move to Lower
○ ○
Bit b31 b0
DBSFR DBSFR D n (D+1, D) … …
0 CY
DBSFRP DBSFRP D n

b+3 b
BSFR4 BSFR4 Db n D

0 CY
Move to Lower BSFR4P BSFR4P Db n
Bit within 4/8 b+7 b ○ ○
Bits range BSFR8 BSFR8 Db n D

BSFR8P BSFR8P Db n 0 CY

WSFT WSFT Et Ed h0000 St (Start Word)

Word Move .. ○ ○
WSFTP Et Ed Ed (End Word)
WSFTP

WSFL WSFL D1 D2 N h0000 D1

..
N

WSFLP D1 D2 N D2
Word Data WSFLP
Move to ○ ○
Left/Right WSFR WSFR D1 D2 N D1

..
N

h0000 D2
WSFRP WSFRP D1 D2 N

Moves N bits starting from Db bit


Bit Move SR SR Db I D N along Input direction (I) and Move ○ ○
direction (D)

App. 4-20
Appendix 4 Instruction List

(8) Exchange instruction

Support
Classification Designations Symbol Description
XGK XGB

XCHG XCHG D1 D2
(D1) (D2)
XCHGP XCHGP D1 D2
Data
○ ○
Exchange
DXCHG DXCHG D1 D2
(D1+1, D1) (D2+1, D2)
DXCHGP DXCHGP D1 D2

Group GXCHG GXCHG D1 D2 N (D1) (D2)


Data : : N ○ ○
Exchange GXCHGP GXCHGP D1 D2 N

b15 b0
Higher/Lower SWAP SWAP D (D) Upper Byte Lower Byte

Byte ○ ○
Exchange SWAPP D (D) Lower Byte Upper Byte
SWAPP

GSWAP GSWAP D N
Group
Exchanges Higher/Lower
Byte ○ ○
Byte of Words N starting from D
Exchange GSWAPP GSWAPP D N

App. 4-21
Appendix 4 Instruction List

(9) BIN operation instruction

Support
Classification Designations Symbol Description
XGK XGB

ADD ADD S1 S2 D
(S1)+(S2) (D)
ADDP ADDP S1 S2 D
Integer Addition
○ ○
(Signed)
DADD DADD S1 S2 D
(S1+1,S1)+(S2+1,S2)

DADDP S1 S2 D
(D+1,D)
DADDP

SUB SUB S1 S2 D
(S1)-(S2) (D)
Integer SUBP SUBP S1 S2 D
Subtraction ○ ○
(Signed) DSUB DSUB S1 S2 D (S1+1,S1)-(S2+1,S2)
(D+1,D)
DSUBP DSUBP S1 S2 D

MUL MUL S1 S2 D
(S1)×(S2) (D+1,D)

Integer MULP MULP S1 S2 D


Multiplication ○ ○
(Signed) DMUL DMUL S1 S2 D (S1+1,S1)×(S2+1,S2)
(D+3,D+2,D+1,D)
DMULP DMULP S1 S2 D

DIV DIV S1 S2 D (D) Quotient


(S1)÷(S2)
(D+1) Remainder
DIVP DIVP S1 S2 D
Integer Division
○ ○
(Signed) (S1+1,S1)÷(S2+1,S2)
DDIV DDIV S1 S2 D
(D+1,D) Quotient

DDIVP S1 S2 D (D+3,D+2) Remainder


DDIVP

ADDU ADDU S1 S2 D
(S1)+(S2) (D)

ADDUP ADDUP S1 S2 D
Integer Addition
○ ○
(Unsigned)
DADDU DADDU S1 S2 D (S1+1,S1)+(S2+1,S2)
(D+1,D)
DADDUP DADDUP S1 S2 D

SUBU SUBU S1 S2 D
(S1)-(S2) (D)

Integer SUBUP SUBUP S1 S2 D


Subtraction ○ ○
(Unsigned) DSUBU DSUBU S1 S2 D (S1+1,S1)-(S2+1,S2)
(D+1,D)
DSUBUP DSUBUP S1 S2 D

MULU MULU S1 S2 D
(S1)×(S2) (D+1,D)

Integer MULUP MULUP S1 S2 D


Multiplication ○ ○
(Unsigned) DMULU DMULU S1 S2 D (S1+1,S1)×(S2+1,S2)
(D+3,D+2,D+1,D)
DMULUP DMULUP S1 S2 D

App. 4-22
Appendix 4 Instruction List

(9) BIN operation instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

DIVU DIVU S1 S2 D (D) Quotient


(S1)÷(S2)
(D+1) Remainder
DIVUP DIVUP S1 S2 D
Integer Division
○ ○
(Unsigned) (S1+1,S1)÷(S2+1,S2)
DDIVU DDIVU S1 S2 D
(D+1,D) Quotient

DDIVUP DDIVUP S1 S2 D (D+3,D+2) Remainder

RADD RADD S1 S2 D (S1+1,S1)+(S2+1,S2)


(D+1,D)
RADDP RADDP S1 S2 D
Real Number
○ ○
Addition (S1+3,S1+2,S1+1,S1)
LADD LADD S1 S2 D
+(S2+3,S2+2,S2+1,S2)

LADDP LADDP S1 S2 D (D+3,D+2,D+1,D)

RSUB RSUB S1 S2 D (S1+1,S1)-(S2+1,S2)


(D+1,D)
RSUBP RSUBP S1 S2 D
Real Number
○ ○
Subtraction (S1+3,S1+2,S1+1,S1)
LSUB LSUB S1 S2 D
-(S2+3,S2+2,S2+1,S2)

LSUBP LSUBP S1 S2 D (D+3,D+2,D+1,D)

RMUL RMUL S1 S2 D (S1+1,S1)×(S2+1,S2)


(D+1,D)
RMULP RMULP S1 S2 D
Real Number
○ ○
Multiplication (S1+3,S1+2,S1+1,S1)
LMUL LMUL S1 S2 D
×(S2+3,S2+2,S2+1,S2)

LMULP LMULP S1 S2 D (D+3,D+2,D+1,D)

RDIV RDIV S1 S2 D (S1+1,S1)÷(S2+1,S2)


(D+1,D)
RDIVP RDIVP S1 S2 D
Real Number
○ ○
Division (S1+3,S1+2,S1+1,S1)
LDIV LDIV S1 S2 D
÷(S2+3,S2+2,S2+1,S2)

LDIVP LDIVP S1 S2 D (D+3,D+2,D+1,D)

$ADD $ADD S1 S2 D
String Connects S1 String with S2 String
○ ○
Addition to save in D
$ADDP $ADDP S1 S2 D

(S1) (S2) (D)


GADD GADD S1 S2 D N
Group Addition + = N ○ ○
GADDP GADDP S1 S2 D N

(S1) (S2) (D)


GSUB GSUB S1 S2 D N
Group
- = N ○ ○
Subtraction
GSUBP GSUBP S1 S2 D N

App. 4-23
Appendix 4 Instruction List

(10) BCD operation instruction

Support
Classification Designations Symbol Description
XGK XGB
ADDB ADDB S1 S2 D
(S1)+(S2) (D)
ADDBP ADDBP S1 S2 D
BCD Addition ○ ○
DADDB DADDB S1 S2 D (S1+1,S1)+(S2+1,S2)
(D+1,D)
DADDBP DADDBP S1 S2 D

SUBB SUBB S1 S2 D
(S1)-(S2) (D)
SUBBP SUBBP S1 S2 D
BCD Subtraction ○ ○
DSUBB DSUBB S1 S2 D
(S1+1,S1)-(S2+1,S2)
(D+1,D)
DSUBBP DSUBBP S1 S2 D

MULB MULB S1 S2 D
(S1)×(S2) (D+1,D)
MULBP MULBP S1 S2 D
BCD
○ ○
Multiplication
DMULB DMULB S1 S2 D (S1+1,S1)×(S2+1,S2)
(D+3,D+2,D+1,D)
DMULBP DMULBP S1 S2 D

DIVB DIVB S1 S2 D (D) Quotient


(S1)÷(S2)
(D+1) Remainder
DIVBP DIVBP S1 S2 D
BCD Division ○ ○
DDIVB S1 S2 D
(S1+1,S1)÷(S2+1,S2)
DDIVB
(D+1,D) Quotient

(D+3,D+2) Remainder
DDIVBP DDIVBP S1 S2 D

App. 4-24
Appendix 4 Instruction List

(11) Logic operation instruction

Basic
Classification Designations Symbol Description Page
Steps

WAND WAND S1 S2 D Word AND


(S1) ∧ (S2) (D)
WANDP WANDP S1 S2 D
Logic
○ ○
Multiplication
DWAND DWAND S1 S2 D
DWord AND
(S1+1,S1)∧(S2+1,S2) (D+1,D)
DWANDP DWANDP S1 S2 D

WOR WOR S1 S2 D
Word OR
(S1) ∨ (S2) (D)
WORP WORP S1 S2 D
Logic Addition ○ ○
DWOR DWOR S1 S2 D DWord OR
(S1+1,S1)∨(S2+1,S2) (D+1,D)
DWORP DWORP S1 S2 D

WXOR WXOR S1 S2 D
Word Exclusive OR
(S1) ∨ (S2) (D)
WXORP WXORP S1 S2 D
Exclusive
○ ○
OR
DWXOR DWXOR S1 S2 D DWord Exclusive OR
(S1+1,S1)∨(S2+1,S2) (D+1,D)
DWXORP DWXORP S1 S2 D

WXNR WXNR S1 S2 D
Word Exclusive NOR
(S1) ∨ (S2) (D)
WXNRP WXNRP S1 S2 D
Exclusive
○ ○
NOR
DWXNR DWXNR S1 S2 D
DWord Exclusive NOR
(S1+1,S1)∨(S2+1,S2) (D+1,D)
DWXNRP DWXNRP S1 S2 D

(S1) (S2) (D)


GWAND GWAND S1 S2 D N
∧ = N ○ ○
GWANDP GWANDP S1 S2 D N

(S1) (S2) (D)


GWOR GWOR S1 S2 D N
∨ = N ○ ○
GWORP GWORP S1 S2 D N
Group
Logic Operation (S1) (S2) (D)
GWXOR GWXOR S1 S2 D N
∨ = N ○ ○
GWXORP GWXORP S1 S2 D N

(S1) (S2) (D)


GWXNR GWXNR S1 S2 D N
∨ = N ○ ○
GWXNRP GWXNRP S1 S2 D N

App. 4-25
Appendix 4 Instruction List

(12) Data process instruction

Support
Classification Designations Symbol Description
XGK XGB
b15 b0
BSUM BSUM S D S

1’s number
BSUMP BSUMP S D D
Bit Check b31 b15 b0
○ ○
DBSUM DBSUM S D S S

1’s number
DBSUMP DBSUMP S D D

BRST BRST D N
Bit Reset Resets N Bits (starting from D) to 0 ○ ○
BRSTP BRSTP D N

S D
ENCO ENCO S D n
... ...
Encode ○ ○
N bits
ENCOP ENCOP S D n N
2 bits 2binary

S D
DECO DECO S D n
... ...
Decode ○ ○
N bits
DECOP DECOP S D n 2N bits
2binary

DIS DIS S D n ... ... D


...
S .. D+1
D+N-1
Data DISP DISP S D n ...

Disconnect & ○ ○
Connect UNI UNI S D n D ...
D+1
D+N-1
.. ...
S
UNIP S D n ... ...
UNIP

S Lower D
..
WTOB WTOB S D n Higher Lower h00
h00 Higher D+1
S+N-1 Higher Lower h00 Lower
Word/ WTOBP WTOBP S D n h00 Higher
Byte ○ ○
Conversion BTOW BTOW S D n D
D+1
h00
h00
Lower
Higher
Higher Lower
.. S

h00 Lower Higher Lower S+N-1


BTOWP BTOWP S D n h00 Higher

IORF IORF S1 S2 S3 Right after masking I/O data (located


I/O
on S1) with S2 and S3 data, perform ○ ○
Refresh
IORFP IORFP S1 S2 S3 process

SCH SCH S1 S2 D N

SCHP SCHP S1 S2 D N Finds S1 value within S2 ~ N range


Data and saves the first identical valued
○ ○
Search position in D and S1’s identical valued
DSCH DSCH S1 S2 D N
total number in D+1

DSCHP DSCHP S1 S2 D N

MAX MAX S D n
Saves the max value in D among N
words starting from S
MAXP MAXP S D n
Max. Value
○ ○
Search
DMAX DMAX S D n
Saves the max value in D among N
double words starting from S
DMAXP DMAXP S D n

App. 4-26
Appendix 4 Instruction List

(12) Data process instruction (continued)

Designatio Support
Classification Symbol Description
ns XGK XGB

MIN MIN S D n
Saves the min value in D among N
words starting from S
MINP MINP S D n
Min. Value
○ ○
Search
DMIN DMIN S D n
Saves the min value in D among N
double words starting from S
DMINP DMINP S D n

SUM SUM S D n
Adds up N words starting from S to
save in D
SUMP SUMP S D n
Sum ○ ○
DSUM DSUM S D n
Adds up N double words starting
from S to save in D
DSUMP DSUMP S D n

AVE AVE S D n
Averages N words starting from S
to save in D
AVEP AVEP S D n
Average ○ ○
DAVE DAVE S D n
Averages N double words starting
from S to save in D
DAVEP DAVEP S D n

MUX MUX S1 S2 D N S2 S1st data

N D

MUXP MUXP S1 S2 D N
MUX ○ ○
DMUX DMUX S1 S2 D N S2+1 S2 S1st data

N D+1 D

DMUXP DMUXP S1 S2 D N

DETECT DETECT S1 S2 D N Detects N data from S1, to save the


Data
first value larger than S2 in D, and ○ ○
Detect
DETECTP DETECTP S1 S2 D N the extra number in D+1

Saves linear-changed value in D1


during n3 scanning of initial value
Ramp Signal
RAMP RAMP n1 n2 D1 n3 D2 n1 to final n2 and present scanning ○ ○
Output
number in D1+1, and changes D2
value to ON after completed

S : Head Address of Sort Data


SORT SORT S n1 n2 D1 D2 n1 : Number of Words to sort
Data n1+1 : Sorting Method
○ ○
Align n2: Operation number per Scan
SORTP SORTP S n1 n2 D1 D2 D1 : ON if complete
D2 : Auxiliary Area

App. 4-27
Appendix 4 Instruction List

(13) Data table process instruction

Support
Classification Designations Symbol Description
XGK XGB

FIWR FIWR S D Adds S to the last of Data Table D ~


Data
D+N, and increases Data Table ○ ○
Write
FIWRP FIWRP S D Length(N) saved in D by 1

FIFRD FIFRD S D Moves first data, S+1 of Data Table


First-input
S ~ S+N to D (pull 1 place after origin
Data ○ ○
deleted) and decreases Data Table
Read Length(N) saved in D by 1 S
FIFRDP FIFRDP S D

FILRD FILRD S D Moves last data, S+N of Data Table


Last-Input
S ~ S+N to D (origin deleted) and
Data ○ ○
decreases Data Table Length(N)
Read
FILRDP FILRDP S D saved in D by 1 S

FIINS FINS S D n Adds S to ‘N’th place of Data Table D


Data ~ D+N (origin data pulled by 1), and
○ ○
Insert increases Data Table Length(N)
FIINSP FINSP S D n saved in D by 1

FIDEL FDEL S D n Deletes ‘N’th data of Data Table S ~


Data S+N (pull 1 place) and decreases
○ ○
Pull Data Table Length(N) saved in D by
FIDELP FDELP S D n 1

(14) Display instruction

Support
Classification Designations Symbol Description
XGK XGB

SEG SEG S D Z
7 Segment Converts S Data to 7-Segment as
○ ○
Display adjusted in Z Format so to save in D
SEGP SEGP S D Z

App. 4-28
Appendix 4 Instruction List

(15) String Process instruction

Support
Classification Designations Symbol Description
XGK XGB

BINDA BINDA S D Converts S of 1-word BIN value to


Decimal ASCII Cord to save in
Convert to BINDAP BINDAP S D starting D
Decimal
○ ○
ASCII
DBINDA DBINDA S D Converts S of 2-word BIN value to
Cord
Decimal ASCII Cord to save in
DBINDAP DBINDAP S D starting D

BINHA BINHA S D Converts S of 1-word BIN value to


Hexadecimal ASCII Cord to save
Convert to BINHAP BINHAP S D in starting D
Hexadecimal
○ ○
ASCII
DBINHA DBINHA S D Converts S of 2-word BIN value to
Cord
Hexadecimal ASCII Cord to save in
DBINHAP DBINHAP S D starting D

BCDDA BCDDA S D
Converts S of 1-word BCD to ASCII
Convert BCD Cord to save in starting D
BCDDAP BCDDAP S D
to Decimal
○ ○
ASCII
DBCDDA DBCDDA S D
Cord Converts S of 2-word BCD to ASCII
Cord to save in starting D
DBCDDAP DBCDDAP S D

DABIN DABIN S D
Converts S S+2,S+1,S’s Decimal
ASCII Cord to BIN to save in D
Convert DABINP DABINP S D
Decimal ASCII ○ ○
to BIN DDABIN DDABIN S D Converts S+5~S’s Decimal ASCII
Cord to BIN value to save in D+1 &
DDABINP DDABINP S D D

HABIN HABIN S D
Converts S+1,S’s Hexadecimal ASCII
Cord to BIN value to save in D
Convert HABINP HABINP S D
Hexadecimal ○ ○
ASCII to BIN DHABIN DHABIN S D
Converts S+3~S’s Hexadecimal ASCII
Cord to BIN to save in D
DHABINP DHABINP S D

DABCD DABCD S D
Converts S+1,S’s Decimal ASCII
Cord to BCD to save in D
Convert DABCDP DABCDP S D
Decimal ASCII ○ ○
to BCD DDABCD DDABCD S D
Converts S+3~S’s Decimal ASCII
Cord to BCD to save in D
DDABCDP DDABCDP S D

LEN LEN S D
String Saves String Length with S starting
○ ○
Length Detect in D
LENP LENP S D

App. 4-29
Appendix 4 Instruction List

(15) String process instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

STR STR S1 S2 D Adjusts S2 saved word


data to S1 saved place
number to convert to String
STRP STRP S1 S2 D
Convert BIN16/32 to and save in D
○ ○
String Adjusts S2 saved double
DSTR DSTR S1 S2 D
word data to S1 saved
place number to convert to
DSTRP DSTRP S1 S2 D
String and save in D

VAL VAL S D1 D2 Adjusts S saved string to


number to save in word
D1 and saves the place
VALP VALP S D1 D2
Convert String to number in D2
○ ○
BIN16/32 Adjusts S saved string to
DVAL DVAL S D1 D2
number to save in double
word D1 and saves the
DVALP DVALP S D1 D2
place number in D2
Adjusts Floating decimal
RSTR RSTR S1 S2 D
point point Real Number
Data (S1: number, S2:
RSTRP RSTRP S1 S2 D places) to String format to
Convert Real Number to save in D
○ X
String Adjusts Floating decimal
LSTR LSTR S1 S2 D
point point Double Real
Number Data (S1:number,
LSTRP LSTRP S1 S2 D S2:places) to String format
to save in D
STRR STRR S D Converts String S to Floating
decimal point point Real
Convert String to Real STRRP STRRP S D Number Data to save in D
Number ○ X
STRL STRL S D Converts String S to
Floating decimal point
point Double Real Number
STRLP STRLP S D
Data to save in D

ASC ASC S D cw Converts BIN Data to


ASCII in Nibble unit,
ASCII Conversion ○ ○
based on cw’s format from
ASCP ASCP S D cw
S to save in D
Converts 2N ASCII saved
HEX HEX S D N
in N words from S in byte
HEX Conversion unit to Nibble unit of ○ ○
HEXP HEXP S D N Hexadecimal BIN so to
save in D
RIGHT RIGHT S D N Extracts n string from S
String Extract from
string’s final letter to save ○ ○
Right
RIGHTP RIGHTP S D N in starting D

LEFT LEFT S D N Extracts n string from S


String Extract from Left string’s first letter to save ○ ○
LEFTP LEFTP S D N in starting D

MID MID S1 S2 D Extracts string which


conforms to S2 condition
String Random Extract ○ ○
among S1 string to save in
MIDP MIDP S1 S2 D
starting D

App. 4-30
Appendix 4 Instruction List

(15) String process instruction (continued)

Basic
Classification Designations Symbol Description Page
Steps

REPLACE REPLACE S1 D S2 Processes S1 String as


String Random
applicable to S2 Condition to ○ ○
Replace
REPLACEP REPLACEP S1 D S2 save in D String

FIND FIND S1 S2 D N Finds identical String to S2 in


String Find S1 ~ N data to save the ○ ○
FINDP FINDP S1 S2 D N absolute position in D

RBCD RBCD S1 S2 D Adjusts Floating decimal point


point Real Number Data S1 to
S2 place to convert to BCD,
RBCDP RBCDP S1 S2 D
Parse Real and then to save in D
○ X
Number to BCD Adjusts Floating decimal point
LBCD LBCD S1 S2 D
point Double Real Number
Data S1 to S2 place to convert
LBCDP LBCDP S1 S2 D
to BCD, and then to save in D

BCDR BCDR S1 S2 D Adjusts BCD Data S1 to S2


place to convert to Floating
decimal point point Real
BCDRP BCDRP S1 S2 D
Convert BCD Number, and then to save in D
Data to Real Adjusts BCD Data S1 to S2 ○ X
Number BCDL BCDR S1 S2 D
place to convert to Floating
decimal point point Double
BCDLP BCDLP S1 S2 D Real Number, and then to
save in D

App. 4-31
Appendix 4 Instruction List

(16) Special function instruction

Basic
Classification Designations Symbol Description Page
Steps

SIN SIN S D
SIN Operation SIN(S+1,S) (D+1,D) ○ ○
SINP SINP S D

COS COS S D
COS COS(S+1,S) (D+1,D) ○ ○
Operation
COSP COSP S D

TAN TAN S D
TAN Operation TAN(S+1,S) (D+1,D) ○ ○
TANP TANP S D

RAD RAD S D (S+1,S) (D+1,D)


RAD
Converts angle to radian
Conversion ○ ○
RADP RADP S D

DEG DEG S D (S+1,S) (D+1,D)


Angle
Converts radian to angle
Conversion ○ ○
DEGP DEGP S D

SQRT SQRT S D
Square Root
○ ○
Operation (S+1,S) (D+1,D)
SQRTP SQRTP S D

App. 4-32
Appendix 4 Instruction List

(17) Data control instruction

Basic
Classification Designations Symbol Description Page
Steps

LIMIT LIMIT S1 S2 S3 D

If S1 < S2, then


LIMITP LIMITP S1 S2 S3 D D = S2
Limit If S2 < S1 < S3, then
○ ○
Control D = S1
DLIMIT DLIMIT S1 S2 S3 D If S3 < S1, then
D = S3
DLIMITP DLIMITP S1 S2 S3 D

DZONE DZONE S1 S2 S3 D

If S1 < -S2, then


DZONEP DZONEP S1 S2 S3 D D = S1+S2-S2(S3/100)
Dead-zone If –S2 < S1 < S2, then
○ ○
Control D = (S3/100)S1
DDZONE DDZONE S1 S2 S3 D If S1 < S2, then
D = S1-S2+S2(S3/100)
DDZONEP DDZONEP S1 S2 S3 D

VZONE VZONE S1 S2 S3 D
If S1 < -S2(S3/100), then
D = S1-S2+S2(S3/100)
VZONEP VZONEP S1 S2 S3 D
If –S2(S3/100) <S1< S2(S3/100),
Vertical-zone
then ○ ○
Control
DVZONE DVZONE S1 S2 S3 D
D = (100/S3)S1
If S1 < S2(S3/100), then
D = S1+S2-S2(S3/100)
DVZONEP DVZONEP S1 S2 S3 D

PIDRUN PIDRUN N Operates PID Loop N ○ ○

Stops PID Loop N


PIDPAUSE PIDPAUSE N ○ X
momentarily

Changes PID Loop N’s Parameter.


Built-in PIDPRMT PIDPRMT S N ( SV(word) / Ts(word) / Kp(real) ○ X
PID Control / Ti(real) / Td(real) )
Instruction

PIDAT PIDRUN N Start of PID loop Auto-tuning X ○

PIDCAS PIDPRMT S N Start of PID loop cascade operation X ○

Start of PID loop combination


PIDHBD PIDPRMT S N X ○
operation

App. 4-33
Appendix 4 Instruction List

(18) Time related instruction

Support
Classification Designations Symbol Description
XGK XGB

Date/Time DATERD DATERD D


Reads PLC Time to save in D ~ D+6
Data ○ X
(Yr/Mn/Dt/Hr/Mn/Sd/Day)
Read DATERDP DATERDP D

Date/Time DATEWR DATEWR S Input


Data S ~ S+6’s Time Data in PLC ○ X
Write DATEWRP DATEWRP S (Yr/Mn/Dt/Hr/Mn/Sd/Day)

ADDCLK ADDCLK S1 S2 D
Adds S1 ~ S1+2 & S2 ~ S2+2 Time
Time Data
Data to save in D ~ D+2 in Time ○ X
Increase
ADDCLKP ADDCLKP S1 S2 D
Data format (Hr/Mn/Sd)

SUBCLK SUBCLK S1 S2 D
Extracts S2 ~ S2+2’s Time Data from
Time Data
S1 ~ S1+2 to save in D ~ D+2 in ○ X
Decrease
SUBCLKP SUBCLKP S1 S2 D
Time Data format (Hr/Mn/Sd)

SECOND SECOND S D
Converts Time Data S ~ S+2 to
○ X
seconds to save in double word D
SECONDP SECONDP S D
Time Data
Format
Conversion HOUR HOUR S D
Converts the seconds saved in
double word S to Hr/Mn/Sd to save ○ X
HOURP HOURP S D
in D ~ D+2

(19) Divergence instruction

Support
Classification Designations Symbol Description
XGK XGB

JMP JMP LABEL Jumps to LABEL location


Divergence
○ ○
Instruction Jumps and designates the location
LABEL LABEL
to move to

CALL CALL LABEL

Calls Function applicable to LABEL


CALLP CALLP LABEL
Subroutine
○ ○
Call Functional Designates Function to be called by
SBRT SBRT LABEL
CALL

RET RET RETURN

App. 4-34
Appendix 4 Instruction List

(20) Loop instruction

Support
Classification Designations Symbol Description
XGK XGB

FOR FOR N
Operates FOR~NEXT section n
○ ○
Loop times
NEXT NEXT
Instruction
BREAK BREAK Escapes from FOR~NEXT section ○ ○

(21) Flag instruction

Support
Classification Designations Symbol Description
XGK XGB

Carry STC STC Carry Flag ( F0112 ) SET


Flag Set, ○ ○
Reset CLC CLC Carry Flag ( F0112 ) RESET
Error Flag
CLE CLE Error Latch Flag (F0115) RESET ○ ○
Clear

(22) System instruction

Support
Classification Designations Symbol Description
XGK XGB
Self Diagnosis
Error Display FALS FALS n ○ ○
(Error Display )
On during n1 Scan, Off during n2
Scan Cluck DUTY DUTY D n1 n2 ○ ○
Scan
On during S1 set time, Off during S2
Time Cluck TFLK TFLK D1 S1 S2 D2 ○ ○
set time

WDT WDT
WDT
Watch Dog Timer Clear ○ ○
Initialize
WDTP WDTP

Output Control OUTOFF OUTOFF All Output Off ○ ○


Finishes applicable scan to end PLC
Operation Stop STOP STOP ○ ○
Operation
Emergent Ends PLC operation right after
ESTOP ESTOP ○ ○
Operation Stop Instruction executed

(23) Interrupt related instruction

Support
Classification Designations Symbol Description
XGK XGB

All Channels EI EI All Channels Interrupt allowed


Interrupt ○ ○
Setting DI DI All Channel Interrupt prohibited
Individual
EIN EIN N Individual Channel Interrupt allowed
Channel
○ ○
Interrupt
DIN DIN N Individual Channel Interrupt prohibited
Setting

App. 4-35
Appendix 4 Instruction List

(24) Sign reversion instruction

Support
Classification Designations Symbol Description
XGK XGB

NEG NEG D
Saves D value again in D with 2’s
complement taken
NEGP NEGP D
2’s
○ ○
complement
DNEG DNEG D Saves (D+1,D) value again in
(D+1,D) with 2’s complement
DNEGP DNEGP D taken

RNEG RNEG D
Reverses D Real Number Sign then
to save again
Real Number RNEGP RNEGP D
Data Sign ○ ○
Reverse LNEGR LNEG D
Reverses D Double Real Number
Sign then to save again
LNEGP LNEGP D

ABS ABS D
Converts D highest Bit to 0
ABSP ABSP D
Absolute Value
○ ○
Operation
DABS DABS D
Converts (D+1,D)
highest Bit to 0
DABSP DABSP D

(25) File related instruction

Support
Classification Designations Symbol Description
XGK XGB

RSET RSET S
Block Changes Block Number of file register
○ X
Conversion to S Number
RSETP RSETP S

EMOV EMOV S1 S2 D
Flash
Transfers S2 word data in S1 Block
Word Data
to D
Transfer EMOVP EMOVP S1 S2 D

o X
Flash EDMOV EDMOV S1 S2 D
Double Word Transfers S2+1, S2 double word data
Data in S1 Block to D+1, D
Transfer EDMOVP EDMOVP S1 S2 D

Block Read EBREAD EBREAD S1 S2 Reads Flash Memory Block ○ X

Block Write EBWRITE EBWRITE S1 S2 Writes Flash Memory Block ○ X

Block Compares R Area’s Bank with Flash


EBCMP EBCMP S1 S2 D1 D2 ○ X
Compare Area’s Block

App. 4-36
Appendix 4 Instruction List

Appendix 4.4 Special/Communication Instruction


(1) Communication module related instruction

Support
Classification Designations Symbol Description
XGK XGB
Sets opposite station No. for P2P
Station No. Set P2PSN P2PSN n1 n2 n3 Communication. n1:P2P No., ○ X
n2:Block, n3:Station No.
Sets word data Read Area
Read Area Set n1:P2P No., n2:Block, n3:Variable
P2PWRD P2PWRD n1 n2 n3 n4 n5 ○ X
(WORD) sequence, n4:Variable Size,
n5:Device

Sets word data Write Area


Write Area Set n1:P2P No., n2:Block, n3:Variable
P2PWWR P2PWWR n1 n2 n3 n4 n5 ○ X
(WORD) sequence, n4:Variable Size,
n5:Device

Sets bit data Read Area


Read Area Set n1:P2P No., n2:Block, n3:Variable
P2PBRD P2PBRD n1 n2 n3 n4 n5 ○ X
(BIT) sequence, n4: Variable Size,
n5:Device

Sets bit data Write Area


Write Area Set n1:P2P No., n2:Block, n3:Variable
P2PBWR P2PBWR n1 n2 n3 n4 n5 ○ X
(BIT) sequence,n4:Variable Size,
n5:Device

(2) Special module common instruction

Support
Classification Designations Symbol Description
XGK XGB

GET GET sl S D N
Reads data of special module
○ ○
memory is installed on
GETP GETP sl S D N
Special
Module
Read/Write PUT PUT sl S1 S2 N
Writes data on special module
○ ○
memory is installed on
PUTP PUTP sl S1 S2 N

App. 4-37
Appendix 4 Instruction List

(3) Exclusive positioning instruction

Support
Classification Designations Symbol Description
XGK XGB
Instructions Positioning Module’s ax
Return to Origin
ORG ORG sl ax axis installed on sl slot to return to ○ ○
Point
Origin Point
Instructions Positioning Module’s ax
Floating Origin
FLT FLT sl ax axis installed on sl slot to set ○ ○
Point
Floating Origin Point
Instructions Positioning Module’s ax
axis installed on sl slot to start
Direct Start DST DST sl ax n1 n2 n3 n4 n5 directly with Target Position(n1), ○ ○
Target Speed(n2), Dwell Time(n3),
M Code(n4) & Control Word(n5)
Instructions Positioning Module’s ax
Indirect Start IST IST sl ax n axis installed on sl slot to start n ○ ○
step indirectly

Instructions Positioning Module’s ax


Linear
LIN LIN sl ax n1 n2 axis installed on sl slot to let n2 axes ○ ○
Interpolation
operate n1 step by Linear Interpolation

Instructions Positioning Module’s ax


Circular
CIN CIN sl ax n1 n2 axis installed on sl slot to let n2 axes ○ X
Interpolation
operate n1 step by Circular Interpolation

Instructions Positioning Module’s ax


Simultaneous axis installed on sl slot to let n4 axes
SST SST sl ax n1 n2 n3 n4 ○ ○
Start operate n1(X), n2(Y), n3(Z) steps by
Simultaneous Start
Instructions Positioning Module’s ax
Speed/Position axis installed on sl slot to switch
VTP VTP sl ax ○ ○
Control Switch Speed to Position
Control
Instructions Positioning Module’s ax
Position/Speed
PTV PTV sl ax axis installed on sl slot to switch ○ ○
Control Switch
Position to Speed Control
Instructions Positioning Module’s ax
Decelerated Stop STP STP sl ax axis installed on sl slot to stop as ○ ○
decelerated.

Instructions Positioning Module’s ax


Skip SKP SKP sl ax ○ X
axis installed on sl slot to skip

Instructions Positioning Module’s ax


axis installed on sl slot to do
Position
SSP SSP sl ax n1 n2 n3 Position Sync with main axis of n3, ○ ○
Synchronization
n1 sync-positioned and n2 step
operated
Instructions Positioning Module’s ax
Speed axis installed on sl slot to do Speed
SSS SSS sl ax n1 n2 n3 ○ ○
Synchronization Sync with main axis of n3, n1
master and n2 slave
Instructions Positioning Module’s ax
Position axis installed on sl slot to override
POR POR sl ax n ○ ○
Override Position to change the target
position to n

App. 4-38
Appendix 4 Instruction List

(4) Exclusive position control instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

Instructions Positioning Module’s ax axis


Speed
SOR SOR sl ax n installed on sl slot to override Speed to ○ ○
Override
change the target speed to n

Instructions Positioning Module’s ax axis


Position specified
installed on sl slot to override position
Speed PSO PSO sl ax n ○ ○
specified speed to change the target speed
Override
to n2 from n1 position

Instructions Positioning Module’s ax axis


Continuous
NMV NMV sl ax installed on sl slot to operate continuously ○ X
Operation
to n step

Instructions Positioning Module’s ax axis


Inching INCH INCH sl ax n ○ ○
installed on sl slot to inch to n position

Return to Position Instructions Positioning Module’s ax axis


Previous to Manual RTP RTP sl ax installed on sl slot to return to position ○ X
Operation previous to manual operation

Instructions Positioning Module’s ax axis


Operation
SNS SNS sl ax n installed on sl slot to change operation step ○ ○
Step Change to n

Repeated Instructions Positioning Module’s ax axis


Operation SRS SRS sl ax n installed on sl slot to change repeated ○ X
Step Change operation step to n

M Code Instructions Positioning Module’s ax axis


MOF MOF sl ax ○ ○
Off installed on sl slot to make M code off

Present Position Instructions Positioning Module’s ax axis to


PRS PRS sl ax n ○ ○
Change change present position to n

Zone Allows zone output of Positioning Module


ZOE ZOE sl ax ○ X
Allowed installed on sl slot

Zone Prohibits zone output of Positioning Module


ZOD ZOD sl ax ○ X
Prohibited installed on sl slot

Encoder Value Changes Encoder Value of Positioning


EPRS EPRS sl ax n ○ X
change Module installed on sl slot to n

Changes n1 step’s target position or speed


Teaching TEA TEA sl ax n1 n2 n3 n4 of Positioning Module’s ax axis installed ○ X
on sl slot

Changes multiple target positions or speed


Teaching
TEAA TEAA sl ax n1 n2 n3 n4 of Positioning Module’s ax axis installed ○ X
Array
on sl slot

Instructions Positioning Module installed on


Emergent Stop EMG EMG sl ax ○ ○
sl slot to perform Emergent Stop

App. 4-39
Appendix 4 Instruction List

(5) Exclusive position control instruction (continued)

Support
Classification Designations Symbol Description
XGK XGB

Resets Error originated from Positioning


Error Reset CLR CLR sl ax n ○ ○
Module’s ax axis installed on sl slot

Error Deletes Error History originated from


History ECLR ECLR sl ax Positioning Module’s ax axis installed on ○ X
Reset sl slot

Point Performs Point Operation of Positioning


PST PST sl ax n ○ X
Operation Module’s ax axis installed on sl slot

Changes n2 to n1 among basic


Basic Parameter
TBP TBP sl ax n1 n2 parameters of Positioning Module’s ax ○ X
Teaching
axis installed on sl slot

Extended Changes n2 to n1 among extended


Parameter TEP TEP sl ax n1 n2 parameters of Positioning Module’s ax ○ X
Teaching axis installed on sl slot

Return to Origin Changes n2 to n1 among returned


Point Parameter THP THP sl ax n1 n2 parameters to origin point of Positioning ○ X
Teaching Module’s ax axis installed on sl slot

Manual Changes n2 to n1 among manual


Operation
TMP TMP sl ax n1 n2 operation parameters of Positioning ○ X
Parameter
Teaching Module’s ax axis installed on sl slot

Input Signal Changes input signal parameter of


Parameter TSP TSP sl ax n Positioning Module’s ax axis installed on ○ X
Teaching sl slot to the value set in n1

Common Changes n2 to n1 among common


Parameter TCP TCP sl ax n1 n2 parameters of Positioning Module ○ X
Teaching installed on sl slot

Instructions Positioning Module’s ax axis


Parameter
WRT WRT sl ax n installed on sl slot to save present ○ ○
Save
parameter of n axis in flash ROM.

Reads and saves present state of


Present State
SRD SRD sl ax D Positioning Module’s ax axis installed on ○ X
Read
sl slot in D area of CPU

Writes value of S area of CPU on point


Point Operation
PWR PWR sl ax S n1 operation step area of Positioning ○ X
Step Write
Module’s ax axis installed on sl slot in

Plural Teaching Writes n value of S area of CPU on plural


Data TWR TWR sl ax S n1 teaching dada area of Positioning ○ X
Write Module’s ax axis installed on sl slot in

App. 4-40
Warranty

1. Warranty Period
The product you purchased will be guaranteed for 18 months from the date of manufacturing.

2. Scope of Warranty
Any trouble or defect occurring for the above-mentioned period will be partially replaced or repaired. However,
please note the following cases will be excluded from the scope of warranty.

(1) Any trouble attributable to unreasonable condition, environment or handling otherwise specified in the
manual,
(2) Any trouble attributable to others’ products,
(3) If the product is modified or repaired in any other place not designated by the company,
(4) Due to unintended purposes
(5) Owing to the reasons unexpected at the level of the contemporary science and technology when delivered.
(6) Not attributable to the company; for instance, natural disasters or fire

3. Since the above warranty is limited to PLC unit only, make sure to use the product considering the safety for
system configuration or applications.

Environmental Policy

LSIS Co.,Ltd. supports and observes the environmental policy as below.

Environmental Management About Disposal

LSIS considers the environmental LSIS’ PLC unit is designed to protect the
preservation as the preferential management environment. For the disposal, separate
subject and every staff of LSIS use the aluminum, iron and synthetic resin (cover)
reasonable endeavors for the pleasurably from the product as they are reusable.
environmental preservation of the earth.
10310001091

■ HEAD OFFICE ■ LS Hukai Electric(Hubei) Co., Ltd./CHINA


LS Tower, 127, LS-ro, Dongan-gu, Anyang-si, Gyeonggi-Do, 431-848, Korea No. 100, Tanjiahe Road, Dianjun District, Yichang City, Hubei Province, P.R. China
Tel : (82-2)2034-4870/Fax : 82-2-2034-4648 E-mail : [email protected] Tel : 86-717-667-7536 Fax : 86-717-667-7222 E-Mail : [email protected]
-Southeast Asia +82-2-2034-4888 [email protected] (Charles Hwang)
-Europe +82-2-2034-4676 [email protected] (Brian Choi) ■ LS-VINA Industrial Systems Co., Ltd./VIETNAM
-Turkey/Israel/CIS +82-2-2034-4879 [email protected] (Daniel Kim) Room 1311, 13th, M3-M4 Building 91 Nguyen Chi Thanh street, Hanoi, Vietnam
-Oceania +82-2-2034-4394 [email protected] (Kendra Cho) Tel : 84-4-6275-8055 Fax : 86-21-5237-7189
-North/Latin America +82-2-2034-4286 [email protected] (Hank Raul Chung)
-Southwest Asia/Africa +82-2-2034-4467 [email protected] (Henry Lee) ■ LSIS(ME) FZE/U.A.E.
-Middle East +971-4-886-5360 [email protected] (Lambert Choi) LOB 19-205, JAFZA View Tower, Jebel Ali Free Zone, Dubai, United Arab Emirates
Tel : 971-4-886-5360 Fax : 971-4-886-5361 E-Mail : [email protected]
■ LSIS(Shanghai) Co., Ltd. /CHINA
32nd Room 1~4, 32/F, Great Wall Building, No.3000 North Zhongshan Road, ■ LSIS Europe B.V./NETHERLANDS
Putuo District, Shanghai, P.R. China 1st. Floor, Tupolevlaan 48, 1119NZ,Schiphol-Rijk, The Netherlands
Tel : 86-21-5237-9977(609) Fax : 86-21-5237-7189 Tel : 31-20-654-1420 Fax : 31-20-654-1429 E-Mail : [email protected]

■ LSIS(Dalian) Co., Ltd. /CHINA ■ LSIS Japan Co., Ltd./JAPAN


No. 15, Liaohexi 3-Road, Economic and Technical Development zone, Dalian, P.R. 16th, Higashi-Kan, Akasaka Twin Tower, 2-17-22, Akasaka, Minato-ku, Tokyo, Japan
China Tel : 81-3-3582-9128 Fax : 81-3-3582-2667 E-Mail : [email protected]
Tel : 86-411-8731-7542 Fax : 86-411-8730-7560 E-Mail : [email protected]
■ LSIS USA Inc./U.S.A
■ LSIS(Wuxi) Co., Ltd./CHINA 2000 Millbrook Drive, Lincolnshire, Chicago, IL 60069, United States of America
102-A, National High & New Tech Industrial Development Area, Wuxi, Jiangsu, P.R. Tel : 847-941-8240 Fax : 847-941-8259 E-Mail : [email protected]
China
Tel : 86-510-8534-6666 Fax : 86-510-8534-4078 E-Mail : [email protected] ■ LSIS Gurgaon Office/INDIA
109 First Floor, Park Central, Sector-30, Gurgaon- 122 002, Haryana, India
Tel : +0091-124-493-0070 Fax : 91-1244-930-066 E-Mail : [email protected]

※ LSIS constantly endeavors to improve its product so that 2015. 7


information in this manual is subject to change without notice.
ⓒ LSIS Co., Ltd. 2010 All Rights Reserved.

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