Ferrites and accessories

U 93/76/30 with I 93/28/30

Core

Series/Type: B67345
Date: Oktober 2022

TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto
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 U 93/76/30 with I 93/28/30
Cores B67345

 Delivery mode: single units

28±0.5 34.6 min. 28±0.5 30±0.6
 For power transformers >1 kW (20 kHz)

Magnetic characteristics (per set)

48±0.9
UU UI

76±0.5
93/152/30 93/104/30
I/A 0.42 0.31 mm–1
Ie 354 258 mm
Ae 840 840 mm2
Amin 840 840 mm2
Ve 297000 217000 mm3 93±1.8

m 1500 1100 g/set Ground

28±0.5
93±1.8 30±0.6
FUS0013-R

The AL value in the table applies to a core set comprising two ungapped cores.

Material AL value e PV Ordering code

nH W/set
Combination UU 93/152/30
N27 5400 +30/–20% 1800 < 16.0 (100 mT, 25 kHz, 100 °C) B67345B0001X027
N87 5700 +30/–20% 1900 < 5.5 (100 mT, 25 kHz, 100 °C) B67345B0001X087
N97 5700 +30/–20% 1900 < 4.0 (100 mT, 25 kHz, 100 °C) B67345B0001X097
Combination UI 93/104/30
N27 7400 +30/–20% 1850 < 12.0 (100 mT, 25 kHz, 100 °C) B67345B0001X027 (U)
B67345B0002X027 (I)
N87 7900 +30/–20% 1930 < 4.0 (100 mT, 25 kHz, 100 °C) B67345B0001X087 (U)
B67345B0002X087 (I)
N97 8300 +30/–20% 2030 < 4.0 (100 mT, 25 kHz, 100 °C) B67345B0001X097 (U)
B67345B0002X097 (I)

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 Ferrites and accessories
Cautions and warnings
Cautions and warnings
Mechanical stress and mounting
Ferrite cores have to meet mechanical requirements during assembling and for a growing number
of applications. Since ferrites are ceramic materials one has to be aware of the special behavior
under mechanical load.
As valid for any ceramic material, ferrite cores are brittle and sensitive to any shock, fast tempera-
ture changing or tensile load. Especially high cooling rates under ultrasonic cleaning and high static
or cyclic loads can cause cracks or failure of the ferrite cores.
For detailed information see data book, chapter “General - Definitions, 8.1”.

Effects of core combination on AL value

Stresses in the core affect not only the mechanical but also the magnetic properties. It is apparent
that the initial permeability is dependent on the stress state of the core. The higher the stresses are
in the core, the lower is the value for the initial permeability. Thus the embedding medium should
have the greatest possible elasticity.
For detailed information see data book, chapter “General - Definitions, 8.1”.

Heating up
Ferrites can run hot during operation at higher flux densities and higher frequencies.

NiZn-materials
The magnetic properties of NiZn-materials can change irreversible in high magnetic fields.

Ferrite Accessories
Our ferrite accessories have been designed and evaluated only in combination with our ferrite
cores. We explicitly point out that our ferrite accessories or our ferrite cores may not be compatible
with those of other manufacturers. Any such combination requires prior testing by the customer and
will be at the customer‘s own risk.
We assume no warranty or reliability for the combination of our ferrite accessories with cores and
other accessories from any other manufacturer.

Processing remarks
The start of the winding process should be soft. Else the flanges may be destroyed.
– Too strong winding forces may blast the flanges or squeeze the tube that the cores can not be
mounted any more.
– Too long soldering time at high temperature (>300 °C) may effect coplanarity or pin arrange-
ment.
– Not following the processing notes for soldering of the J-leg terminals may cause solderability
problems at the transformer because of pollution with Sn oxyde of the tin bath or burned insula-
tion of the wire. For detailed information see chapter “Processing notes”, section 2.2.
– The dimensions of the hole arrangement have fixed values and should be understood as
a recommendation for drilling the printed circuit board. For dimensioning the pins, the group
of holes can only be seen under certain conditions, as they fit into the given hole arrangement.
To avoid problems when mounting the transformer, the manufacturing tolerances for positioning
the customers’ drilling process must be considered by increasing the hole diameter.

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 Ferrites and accessories
Cautions and warnings

Display of ordering codes for TDK Electronics products

The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website or in order-related documents such as shipping
notes, order confirmations and product labels. The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.

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 Ferrites and accessories
Symbols and terms
Symbols and terms

Symbol Meaning Unit

A Cross section of coil mm2
Ae Effective magnetic cross section mm2
AL Inductance factor; AL = L/N2 nH
AL1 Minimum inductance at defined high saturation ( a) nH
Amin Minimum core cross section mm2
AN Winding cross section mm2
AR Resistance factor; AR = RCu /N2  = 10–6
B RMS value of magnetic flux density Vs/m2, mT
B Flux density deviation Vs/m2, mT
B̂ Peak value of magnetic flux density Vs/m2, mT
B̂ Peak value of flux density deviation Vs/m2, mT
BDC DC magnetic flux density Vs/m2, mT
BR Remanent flux density Vs/m2, mT
BS Saturation magnetization Vs/m2, mT
C0 Winding capacitance F = As/ V
CDF Core distortion factor mm–4.5
DF Relative disaccommodation coefficient DF = d/i
d Disaccommodation coefficient
Ea Activation energy J
f Frequency s–1, Hz
fcutoff Cut-off frequency s–1, Hz
fmax Upper frequency limit s–1, Hz
fmin Lower frequency limit s–1, Hz
fr Resonance frequency s–1, Hz
fCu Copper filling factor
g Air gap mm
H RMS value of magnetic field strength A/m
Ĥ Peak value of magnetic field strength A/m
HDC DC field strength A/m
Hc Coercive field strength A/m
h Hysteresis coefficient of material 10–6 cm/A
h/i 2 Relative hysteresis coefficient 10–6 cm/A
I RMS value of current A
IDC Direct current A
Î Peak value of current A
J Polarization Vs/m2
k Boltzmann constant J/K
k3 Third harmonic distortion
k3c Circuit third harmonic distortion
L Inductance H = Vs/A

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 Ferrites and accessories
Symbols and terms

Symbol Meaning Unit

L/L Relative inductance change H
L0 Inductance of coil without core H
LH Main inductance H
Lp Parallel inductance H
Lrev Reversible inductance H
Ls Series inductance H
le Effective magnetic path length mm
lN Average length of turn mm
N Number of turns
PCu Copper (winding) losses W
Ptrans Transferrable power W
PV Relative core losses mW/g
PF Performance factor
Q Quality factor (Q = L/Rs = 1/tanL)
R Resistance 
RCu Copper (winding) resistance (f = 0) 
Rh Hysteresis loss resistance of a core 
Rh Rh change 
Ri Internal resistance 
Rp Parallel loss resistance of a core 
Rs Series loss resistance of a core 
Rth Thermal resistance K/W
RV Effective loss resistance of a core 
s Total air gap mm
T Temperature °C
T Temperature difference K
TC Curie temperature °C
t Time s
tv Pulse duty factor
tan Loss factor
tanL Loss factor of coil
tanr (Residual) loss factor at H  0
tane Relative loss factor
tanh Hysteresis loss factor
tan/i Relative loss factor of material at H  0
U RMS value of voltage V
Û Peak value of voltage V
Ve Effective magnetic volume mm3
Z Complex impedance 
Zn Normalized impedance |Z|n = |Z| /N 2   (le /Ae) /mm

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 Ferrites and accessories
Symbols and terms

Symbol Meaning Unit

 Temperature coefficient (TK) 1/K
F Relative temperature coefficient of material 1/K
e Temperature coefficient of effective permeability 1/K
r Relative permittivity
 Magnetic flux Vs
 Efficiency of a transformer
B Hysteresis material constant mT-1
i Hysteresis core constant A–1H–1/2
s Magnetostriction at saturation magnetization
 Relative complex permeability
0 Magnetic field constant Vs/Am
a Relative amplitude permeability
app Relative apparent permeability
e Relative effective permeability
i Relative initial permeability
 p' Relative real (inductive) component of  (for parallel components)
 p" Relative imaginary (loss) component of  (for parallel components)
r Relative permeability
rev Relative reversible permeability
s' Relative real (inductive) component of  (for series components)
s" Relative imaginary (loss) component of  (for series components)
tot Relative total permeability
derived from the static magnetization curve
 Resistivity m–1
l/A Magnetic form factor mm–1
Cu DC time constant Cu = L/RCu = AL/AR s
 Angular frequency; = 2 f s–1

All dimensions are given in mm.

Surface-mount device

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 Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical require-
ments that are often placed on our products in the areas of application concerned. We never-
theless expressly point out that such statements cannot be regarded as binding statements
about the suitability of our products for a particular customer application. As a rule, we
are either unfamiliar with individual customer applications or less familiar with them than the cus-
tomers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or fail-
ure before the end of their usual service life cannot be completely ruled out in the current
state of the art, even if they are operated as specified. In customer applications requiring a
very high level of operational safety and especially in customer applications in which the mal-
function or failure of an electronic component could endanger human life or health (e.g. in acci-
dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-
sign of the customer application or other action taken by the customer (e.g. installation of pro-
tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event
of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this pub-
lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-
cause they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequent-
ly, we cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing
for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.

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 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality manage-
ment system in the automotive industry. Referring to customer requirements and customer spe-
cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-
dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-
quirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we
like to point out that obligations from IATF 16949 shall only become legally binding if individually
agreed upon.
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,
CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, InsuGate, LeaXield,
MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod,
PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic,
SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or
pending in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.

Release 2022-07

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