OPTIMIZATION OF LASER SHOCK PEENING PROCESS USING

FINITE ELEMENT MODELING

A Thesis
Presented to
the Graduate School of
Clemson University

In Partial Fulfillment

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of the Requirements for the Degree
Master of Science
IE Mechanical Engineering

by
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Sai Hamsini Kosaraju
December 2018
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Accepted by:
Dr. Xin Zhao, Committee Chair
Dr. Oliver J. Myers
Dr. Hongseok Choi
 ProQuest Number: 13420106

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 ABSTRACT

Laser shock peening is a cold working process which is used to improve material properties

like surface hardness, fatigue life, wear and corrosion resistance, etc. It is widely used to treat

turbines, fans, compressor blades, aircraft and automotive parts. When the material is irradiated

by high power density laser beams, shock waves are generated, which plastically deforms the

material surface and induces high compressive stresses within subsurface area. The amount of

residual compressive stress and plastically affected depth depend on laser parameters (laser power

density, pulse duration, wavelength, repetition rate, spot size and shape), materials, ambient

environment, etc. To improve the application of laser shock peening, it is of critical importance to

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optimize the process by fully understanding the effects of different parameters. Extensive studies
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have been devoted to this area. Recently, thanks to the advance of laser technology, high repetition

rate lasers could significantly improve this technique by increasing compressive residual stress
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and plastically affected depth. This research studies the effect of laser repetition rate at different

spot sizes and different scanning patterns of shot application on the final shock peening results by

finite element modeling.

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A two-dimensional finite element model is developed to simulate the interaction between

metal samples and laser-induced shock waves. Multiple laser impacts are applied at each location

to increase plastically affected depth and compressive stress. The in-depth and surface residual

stress profiles are analyzed at various repetition rates and spot sizes. It is found that the residual

stress is not sensitive to repetition rate until it reaches a very high level. At extremely high

repetition rate (100 MHz), the delay between two shock waves is even shorter than their duration,

and there will be shock wave superposition. It is revealed that the interaction of metal with shock

wave is significantly different, leading to a different residual stress profiles. Stronger residual

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stress with deeper distribution will be obtained comparing with lower repetition rate cases. The

effect of repetition rate at different spot sizes is also studied. It is found that with larger laser spot,

the peak compressive residual stress decreases but the distribution is deeper at extremely high

repetition rates.

A three-dimensional finite element model is developed to study the effect of scanning

pattern and repetition rate. The final residual stress distributions are studied at repetition rates of

0.1 MHz, 1 MHz, 10 MHz and 20 MHz for 5 different patterns. It is found that there are no major

differences in residual stress profiles due to variation of scanning patterns except for circular

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pattern. It is also revealed that the minimum residual stress decreases and non-uniformity increases

with increase in repetition rate due to interaction of relaxation waves with incoming pressure
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pulses. To minimize the effect of relaxation waves, two zig-zag patterns are studied. The overlap

between successive spots is less in zig-zag pattern-1, and it is completely absent in zig-zag pattern-
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2. It is found that by applying the newly proposed zig-zag pattern-2, the residual stress uniformity

can be significantly improved at repetition rates higher than 0.1 MHz.

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 DEDICATION

I would like to dedicate this thesis to my grandparents, parents and friends, who are my

strength and always encouraged me throughout my graduate studies.

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 ACKNOWLEDGEMENTS

My sincere gratitude to my Advisor Dr. Xin Zhao for his constant guidance, motivation

and valuable inputs throughout my graduate study at Clemson University. I would like to thank

my committee members Dr. Oliver J. Myers and Dr. Hongseok Choi for being part of my research

committee and extending their support throughout this research work. I would like to acknowledge

Clemson University for the allotment of computational time on Palmetto cluster. I would also like

to thank all the staff members of Mechanical Department for their constant assistance. I would like

to extend my gratitude to my fellow research group members Ankit, Kewei, Yuxin and Xiao for

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their valuable inputs. I would also like to thank my family and friends for their constant support

and encouragement. IE
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 TABLE OF CONTENTS

ABSTRACT……………………………………………………………………………….ii

CHAPTER 1: INTRODUCTION TO LASER SHOCK PEENING………………………1

1.1 Introduction……………………………………………………………………1

1.2 Mechanical surface enhancement techniques………………………………….1

1.2.1 Shot peening…………………………………………………………1

1.2.2 Ultrasonic impact peening…………………………………………...2

1.2.3 Water jet peening…………………………………………………….3

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1.2.4 Low plasticity burnishing……………………………………………4
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1.3 Laser shock peening…………………………………………………………...4

1.3.1 Mechanism………………………………………………………......4
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1.3.2 Advantages of laser shock peening…………………………………..5

1.3.3 Applications of laser shock peening…………………………………6

1.4 Mechanism of residual stress generation………………………………………7

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1.5 Relaxation of residual stress…………………………………………………...8

CHAPTER 2: LITERATURE REVIEW…………………………………………………10

CHAPTER 3: NUMERICAL MODEL…………………………………………………..15

3.1 Introduction…………………………………………………………………..15

3.2 Finite element model………………………………………………………....17

3.2.1 2D model…………………………………………………………….17

3.2.2 3D model…………………………………………………………….19

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 3.2.3 Material model………………………………………………………21

CHAPTER 4: METHODOLOGY…………………………………………………..……23

4.1 Benchmark simulation…………………………………………………..……23

4.2 Repetition rate…………………………………………………………….….23

4.3 Scanning patterns…………………………………………………………….25

CHAPTER 5: RESULTS AND DISCUSSIONS………………………………………...33

5.1 Effect of repetition rate ………………………………………………………33

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5.2 Effect of spot size at constant repetition rate………………………………….40
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5.3 Effect of overlap angle………………………………………………………..41
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5.3.1 Introduction………………………………………………………...41

5.3.2 Straight overlap…………………………………………………….41

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5.3.3 Diagonal overlap…………………………………………………...42

5.4 Effect of sequence……………………………………………………………44

5.4.1 Paths………………………………………………………………..44

5.4.2 Effect of pattern at repetition rate of 0.1MHz……………………….46

5.4.3 Effect of pattern at repetition rate of 1MHz…………………………53

5.4.4 Effect of pattern at repetition rate of 10MHz………………………56

5.4.4 Effect of pattern at repetition rate of 20MHz………………………..58

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 5.4.5 Residual stress distributions without relaxation after each row……….60

5.5 8X8 pattern…………………………………………………………………...61

CHAPTER 6: CONCLUSIONS AND FUTURE WORK………………………………..89

REFERENCES …………………………………………………………………………..92

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 LIST OF TABLES

Table 1: Summary of mesh size used at various spot sizes……………………………………...18

Table 2: Material properties of 1045 steel [31,33]……………………………………………….22

Table 3: Comparing limits of S11 and S22 for different sequences at repetition rate of 0.1MHz…52

Table 4: Comparing limits of S11 and S22 for different sequences at repetition rate of 1MHz…55

Table 5: Comparing limits of S11 and S22 for different sequences at repetition rate of 10MHz….57

Table 6: Comparing limits of S11 and S22 for different sequences at repetition rate of 20MHz….59

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Table 7: Summary of residual stresses for sequence 1, zigzag pattern 1 and zigzag pattern 2……76
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Table 8: Summary of residual stresses for sequence 2, zigzag pattern 1 and zigzag pattern 2……86
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 LIST OF FIGURES

Figure 1.1: Illustration of shot peening and generation of residual stresses [37]…………………...2

Figure 1.2: Ultrasonic peening process representation [38]…………………………………….....3

Figure 1.3: Water jet peening process representation [43]…………………………………………3

Figure 1.4: Low plasticity burnishing process representation [39]………………………………..4

Figure 1.5: Laser shock peening process representation [40]……………………………………...5

Figure 1.6: Application of LSP in treating turbines and gears [40]………………………………..6

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Figure 1.7. Generation of residual stress………………………………………………………….7
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Figure 1.8. Residual stress distribution along depth for 1mm spot size predicted using axe-

symmetric model…………………………………………………………………………………..8
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Figure 1.9. Origin and path of relaxation waves for circular spot shapes…………………………9

Figure 3.1: Temporal profile of pressure for a laser with FWHM of 10ns, pulse energy of 3J and
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wave length of 1064nm…………………………………………………………………………..16

Figure 3.2: Gaussian spatial distribution of pressure…………………………………………......16

Figure 3.3: Axe-symmetric model set up for 1mm spot diameter………………………………...17

Figure 3.4: 3D model set up for 1mm spot diameter……………………………………………...20

Figure 3.5: Surface partitions for 8X8 pattern……………………………………………………21

Figure 4.1: Surface stress profile from benchmark simulation…………………………………...23

Figure 4.2: Overlap of pressure profiles at repetition rate of 33.3MHz…………………………...25

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Figure 4.3: Overlap of pressure profiles at repetition rate of 100 MHz…………………………...25

Figure 4.4: Sequence 1…………………………………………………………………………...26

Figure 4.5: Sequence 2 ………………………………………………………………………….27

Figure 4.6: Sequence 3…………………………………………………………………………...27

Figure 4.7: Sequence 4…………………………………………………………………………...28

Figure 4.8: Circular pattern………………………………………………………………………29

Figure 4.9: Zigzag pattern 1 for sequence 1……………………………………………………..31

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Figure 4.10: Zigzag pattern 1 for sequence 2…………………………………………………......31
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Figure 4.11: Zigzag pattern 2 for sequence 1……………………………………………………..32
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Figure 5.0: Illustration of surface and in-depth directions………………………………………..33

Figure 5.1: Comparing in-depth residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 0.1mm………………………………………………34

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Figure 5.2: Comparing surface residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 0.1mm……………………………………………..34

Figure 5.3: Comparing in-depth residual stress distributions at repetition rates of 33.3MHz,

50MHz, 10MHz, 100MHz 142.9 MHz and 200MHz for a spot diameter of 0.1mm……………36

Figure 5.4: Comparing surface residual stress distributions at repetition rates of 33.3MHz, 20MHz,

10MHz, 100MHz, 142.9MHz and 200MHz for a spot diameter of 0.1mm………………………36

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Figure 5.5: Comparing in-depth residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 1mm…………………………………………….......37

Figure 5.6: Comparing surface residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 1mm………………………………………………...38

Figure 5.7: Comparing in-depth residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 0.01mm……………………………………………..39

Figure 5.8: Comparing surface residual stress distributions at repetition rates of 0.1MHz, 1MHz,

10MHz and 100MHz for a spot diameter of 0.01mm……………………………………………..39

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Figure 5.9: Comparing in-depth residual stress distributions at repetition rate of 100MHz for a spot
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diameter of 1mm, 0.1mm, 0.01mm……………………………………………………………….40

Figure 5.10: Illustration of straight overlap………………………………………………………41

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Figure 5.11: Comparison of S11 after first and second pulse for straight overlap………………...42

Figure 5.12: Comparison of S22 after first and second pulse for straight overlap……………….42
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Figure 5.13: Illustration of diagonal overlap……………………………………………………...43

Figure 5.14: Comparison of S11 after first and second spot for diagonal overlap………………43

Figure 5.15: Comparison of S11 after first and second spot for diagonal overlap………………...44

Figure 5.16: Interaction of adjacent spots for sequence 1 and 2…………………………………..45

Figure 5.17: Paths for studying residual stress distribution……………………………………….46

Figure 5.18: Contour plot (S11) for sequence 1…………………………………………………..47

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Figure 5.19: S11 for sequence 1 at repetition rate of 0.1MHz (5X5)……………………………...47

Figure 5.20: S22 for sequence 1 at repetition rate of 0.1MHz (5X5)………………………….......48

Figure 5.21: S11 for sequence 2 at repetition rate of 0.1MHz (5X5)……………………………...48

Figure 5.22: S22 for sequence 2 at repetition rate of 0.1MHz (5X5)………………………….......49

Figure 5.23: S11 for sequence 3 at repetition rate of 0.1MHz…………………………………….49

Figure 5.24: S22 for sequence 3 at repetition rate of 0.1MHz…………………………………….50

Figure 5.25: S11 for sequence 4 at repetition rate of 0.1MHz…………………………………….50

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Figure 5.26: S22 for sequence 4 at repetition rate of 0.1MHz…………………………………….51
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Figure 5.27: S11 for circular sequence at repetition rate of 0.1MHz……………………………...51
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Figure 5.28: S22 for circular sequence at repetition rate of 0.1MHz………………………….......52

Figure 5.29: Comparison of S11 for sequence 1 at repetition rate of 1MHz………………………54

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Figure 5.30: Comparison of S22 for sequence 1 at repetition rate of 1MHz………………………54

Figure 5.31: Comparison of S11 for sequence 1 at repetition rate of 10MHz……………………..56

Figure 5.32: Comparison of S22 for sequence 1 at repetition rate of 10MHz……………………..57

Figure 5.33: Comparison of S11 for sequence 1 at repetition rate of 20MHz……………………..58

Figure 5.34: Comparison of S22 for sequence 1 at repetition rate of 20MHz……………………..59

Figure 5.35: Distribution of S11 at repetition rate of 20MHz for different sequences without

relaxation after each row…………………………………………………………………………60

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Figure 5.36: Distribution of S22 at repetition rate of 20MHz for different sequences without

relaxation after each row…………………………………………………………………............61

Figure 5.37: Paths along which S11 is plotted…………………………………………………....62

Figure 5.38: Paths along which S22 is plotted……………………………………………………62

Figure 5.39: S11 for sequence 1 at repetition rate of 0.1MHz (8X8)……………………………...63

Figure 5.40: S22 for sequence 1 at repetition rate of 0.1MHz (8X8) ……………………………..63

Figure 5.41: S11 for sequence 1 at repetition rate of 1MHz (8X8) ……………………………….64

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Figure 5.42: S22 for sequence 1 at repetition rate of 1MHz (8X8)………………………………..64
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Figure 5.43: S11 for sequence 1 at repetition rate of 10MHz (8X8)………………………………65

Figure 5.44: S22 for sequence 1 at repetition rate of 10MHz (8X8)………………………………65

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Figure 5.45: S11 for sequence 1 at repetition rate of 20MHz (8X8)………………………………66

Figure 5.46: S22 for sequence 1 at repetition rate of 20MHz (8X8) ……………………………...66
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Figure 5.47: S11 in zigzag pattern 1 for sequence 1 at repetition rate of 0.1MHz………………...67

Figure 5.48: S22 in zigzag pattern 1 for sequence 1 at repetition rate of 0.1MHz ………………...67

Figure 5.49: S11 in zigzag pattern 1 for sequence 1 at repetition rate of 1MHz…………………..68

Figure 5.50: S22 in zigzag pattern 1 for sequence 1 at repetition rate of 1MHz…………………..68

Figure 5.51: S11 in zigzag pattern 1 for sequence 1 at repetition rate of 10MHz…………………69

Figure 5.52: S22 in zigzag pattern 1 for sequence 1 at repetition rate of 10MHz…………………69

Figure 5.53: S11 in zigzag pattern 1 for sequence 1 at repetition rate of 20MHz…………………70
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Figure 5.54: S22 in zigzag pattern 1 for sequence 1 at repetition rate of 20MHz…………………70

Figure 5.55: S11 in zigzag pattern 2 for sequence 1 at repetition rate of 0.1MHz………………...71

Figure 5.56: S22 in zigzag pattern 2 for sequence 1 at repetition rate of 0.1MHz………………...71

Figure 5.57: S11 in zigzag pattern 2 for sequence 1 at repetition rate of 1MHz…………………72

Figure 5.58: S22 in zigzag pattern 2 for sequence 1 at repetition rate of 1MHz…………………..72

Figure 5.59: S11 in zigzag pattern 2 for sequence 1 at repetition rate of 10MHz…………………73

Figure 5.60: S22 in zigzag pattern 2 for sequence 1 at repetition rate of 10MHz…………………73

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Figure 5.61: S11 in zigzag pattern 2 for sequence 1 at repetition rate of 20MHz…………………74
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Figure 5.62: S22 in zigzag pattern 2 for sequence 1 at repetition rate of 20MHz…………………74
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Figure 5.63: Contour plot (S11) for sequence 1 at repetition rate of 20MHz……………………...75

Figure 5.64: Contour plot (S11) for zigzag pattern 2 at repetition rate of 20MHz………………...75
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Figure 5.65: S11 for sequence 2 at repetition rate of 10MHz (8X8)………………………………79

Figure 5.66: S22 for sequence 2 at repetition rate of 10MHz (8X8)………………………………80

Figure 5.67: S11 for sequence 2 at repetition rate of 20MHz (8X8)………………………………80

Figure 5.68: S22 for sequence 2 at repetition rate of 20MHz (8X8)………………………………81

Figure 5.69: S11 in zigzag pattern 1 for sequence 2 at repetition rate of 10MHz………………....81

Figure 5.70: S22 in zigzag pattern 1 for sequence 2 at repetition rate of 10MHz…………………82

Figure 5.71: S11 in zigzag pattern 1 for sequence 2 at repetition rate of 20MHz…………………82

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Figure 5.72: S22 in zigzag pattern 1 for sequence 2 at repetition rate of 20MHz…………………83

Figure 5.73: S11 in zigzag pattern 2 for sequence 2 at repetition rate of 10MHz………………....83

Figure 5.74: S22 in zigzag pattern 2 for sequence 2 at repetition rate of 10MHz…………………84

Figure 5.75: S11 in zigzag pattern 2 for sequence 2 at repetition rate of 20MHz…………………84

Figure 5.76: S22 in zigzag pattern 2 for sequence 2 at repetition rate of 20MHz…………………85

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 CHAPTER 1: INTRODUCTION TO LASER SHOCK PEENING

1.1 Introduction

Fatigue failure due to stress corrosion cracking, foreign object damage, corrosion and wear is a

common phenomenon which occur in mechanical structures. This degeneration of material mostly

starts on the surface. It is desired to increase the life of a mechanical component and decrease its

operation and maintenance costs. Hence surface enhancement techniques are employed to prevent

the degeneration of material. These techniques impart residual stresses on the surface which retards

crack initiation and propagation, increasing the life of a component. There are many thermal,

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chemical and mechanical ways for inducing residual stresses. Among these, laser shock peening

(LSP) is a promising technique to improve material properties like surface hardness, fatigue life,
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wear and corrosion resistance, etc. LSP is widely used to treat turbines, fans, compressor blades,

aircraft and automotive parts, due to its great advantages in high residual stress, deep stress
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distribution, high flexibility, and low cost. In this chapter, different mechanical processes for

inducing residual stresses on the surface are briefly explained followed by discussion of physical
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process, advantages and applications of laser shock peening. The mechanism of residual stress

generation and relaxation in LSP are explained.

1.2 Mechanical surface enhancement techniques

1.2.1. Shot peening

In this process, the surface of the workpiece is bombarded with spherical shots at high

pressure (Figure 1.1). This creates a dimple on the surface. The material under the dimple is

plastically deformed resulting in compressive residual stresses. Multiple spherical shots create

overlapping dimples and residual stresses throughout the surface. It is not controllable and hence

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cannot produce uniform residual stress distribution. Surface finish is compromised and hence it is

not suitable for all applications [1].

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Figure 1.1: Illustration of shot peening and generation of residual stresses [2]

1.2.2. Ultrasonic impact peening

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As shown in Figure 1.2, a frequency controller is calibrated, and steel pins are attached to

it. The vibrations of the controller cause pins to vibrate with high frequency. Plastic deformation
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of workpiece occurs when high energy pins strike the workpiece surface. The apparatus is

handheld and portable. The residual stresses are deeper than shot peening, but the surface is

roughened. Repeatability and flexibility are challenging because of handheld tools [3].

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 Figure 1.2: Ultrasonic peening process representation [3]

1.2.3. Water jet peening

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In this process, the surface of the workpiece is collided with high pressure water jet (Figure
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1.3). A pressure load that exceeds yield strength of the material is created by the water droplet.

This causes permanent plastic deformation and compressive residual stresses in the subsurface
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region of the workpiece. This process is environmentally friendly and surface finish is high. The

major disadvantages of this process are cavitation and erosion of workpiece.

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Figure 1.3: Water jet peening process representation [4]

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1.2.4. Low plasticity burnishing

In this process, a spherical ball supported in a hydrostatic bearing is used as the tool (Figure

1.4). A hydraulic cylinder is used to apply normal force between the tool and the workpiece. When

the ball is made to roll on the workpiece surface in required path, the pressure applied by ball

creates residual stresses within the subsurface region of workpiece. Deeper residual stress and fine

surface finish are achieved in this process. But the requirement of fluid between the ball and socket

makes it difficult to treat workpieces with complex and curved geometries.

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Figure 1.4: Low plasticity burnishing process representation [5]

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1.3 Laser shock peening

1.3.1 Mechanism

The work piece is first coated with aluminum or black paint and placed in transparent

overlay such as water or glass. When the material is irradiated by high power laser, the coating

vaporizes generating high energy plasma which expands in all directions. The expansion of plasma

is confined by the transparent overlay, which generates shock waves of high pressure and short

duration into the sample. The shock waves plastically deform the material surface and induce high

compressive stresses within subsurface area. The aluminum or black paint coating is used to

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protect the material surface from thermal damage. LSP can be performed without coating but low

power lasers must be used to prevent damage to the surface. Figure 1.5 illustrates laser shock

peening process.

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Figure 1.5: Laser shock peening process representation [6]

1.3.2 Advantages of laser shock peening

Laser shock peening improves the fatigue life of the component by increasing its resistance

to stress corrosion cracking, crack propagation, fretting fatigue, cavitation, foreign object damage,

stress concentration, pitting etc. Compared to shot peening and ultrasonic impact peening, the

compressive residual stress and plastically affected depth are much higher. Unlike shot peening,

this process is highly controllable and the effect on surface finish of the component is less. It can

be used to treat workpieces with complex geometries [6, 30, 42].

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1.3.4 Applications of laser shock peening

LSP is used in Aviation industry to treat blades of turbines, fans and compressors, engine

parts, fastener holes and fasteners, brakes, welded aircraft parts, wheels etc. In medical field, it is

used to improve fatigue performance of orthopedic implants. It is used in automotive industry to

treat engine parts, gears, transmission axles etc. In power generation industry, it is used to treat

components in steam and gas turbine engines. In tooling industry, it is used to treat drill bits and

components of other machine tools [6, 28, 40, 42].

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Figure 1.6: Application of LSP in treating turbines and gears [6]

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 1.4 Mechanism of residual stress generation

The propagation of shock waves through the metal causes it to deform plastically when the

pressure of shock wave is greater than Hugoniot limit of the material [7, 8, 9]. Hugoniot elastic

limit is the maximum stress a material can withstand in uniaxial direction without undergoing

plastic deformation. It is given by

1−2𝜈
σyd = σHEL( ) (1.1)
1−𝜈

where σyd is the dynamic yield stress, σHEL is the Hugoniot elastic limit and ν is the poisson’s ratio.

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Figure 1-7 shows the effect of shock waves on the material. The top layers of the material under

the influence of shock wave expand plastically. The expansion of material decreases with increase
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in depth and finally becomes zero. The tensile plastic deformation of the surface layers induces
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compressive residual stress which decreases with increase in depth. The expanded layers try to

push away the material surrounding it inducing compressive plastic deformation. The residual

stress becomes tensile around the affected area because of the compressive plastic deformation
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[15].

Figure 1-7. Generation of residual stress

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