Term Paper Physics
Term Paper Physics
3. It does not require any cathode heating for the production of charge
carriers. So it starts operating as soon as it is switched on.
Metals – These are solids which have very low resistivity or very
high conductivity). Hence,
σ ~ 102 – 108 S/m
ρ ~ 10-2 – 10-8 Ωm
Insulators – These are solids which have very high resistivity or
very low conductivity. Hence,
σ ~ 10-11 – 10-19 S/m
ρ ~ 1011 – 1019 Ωm
Semiconductors – These are solids which have resistivity or
conductivity values between those of Metals and insulators. Hence,
σ ~ 105 – 10-6 S/m
ρ ~ 10-5 – 106 Ωm
Classification of semiconductor
Elemental semiconductors – available naturally like Silicon (Si)
and Germanium (Ge)
Also, the above image shows the structure with all bonds intact. This
is possible only at low temperature. As the temperature increases and
more energy becomes available to the valence electrons, they break
away leading to an increase in conductivity of the element. Now, the
thermal energy ionizes only a few atoms. This ionization creates a
vacancy in the bond. When an electron, having charge –q, gets excited
due to the thermal energy, it breaks free from the bond. This leaves a
vacancy there with effective charge +q. This vacancy with an effective
positive electronic charge is a hole.The hole also behaves like a free
particle but with a positive charge. In intrinsic semiconductors, the
number of free electrons is equal to the number of holes and is called
the intrinsic carrier concentration.
Extrinsic semiconductors
Semiconductors can be broadly classified into Intrinsic and Extrinsic
Semiconductors. Intrinsic Semiconductors start conducting at
temperatures above the room temperature, developing important
electronic devices using these can pose a problem. This led to a need
for improving the conductivity of intrinsic semiconductors.After some
experiments, scientists observed an increase in the conductivity of a
Semiconductor when a small amount of impurity was added to it.
These materials are Extrinsic Semiconductors or impurity
Semiconductors. Another term for these materials is ‘Doped
Semiconductor’. The impurities are dopants and the process – Doping.
An important condition to doping is that the amount of impurity added
should not change the lattice structure of the Semiconductor. To
achieve this the size of the dopant and Semiconductor atoms should be
the same.
Doped Semiconductor
Methods of doping
To dope the semiconductor, you need to follow the below-given
methods:
1. Add the impurity atoms in the semiconductor in the molten state.
2. Heat the semiconductor in the atmosphere, which includes dopant
atoms or molecules. This must be done to make it easy for the dopant
molecules to diffuse into the semiconductor.
3. Implant the dopant atom by Bombarding the semiconductor with the
dopant atoms or molecules.
Types of Impurities
If we talk about impurities, two types of impurities can be added to
the semiconductor. They are pentavalent and trivalent impurities.
Pentavalent impurities
The pentavalent impurity atom has five valence electrons. These five
valence electrons are named Nitrogen (N), Phosphorus (P), Arsenic
(As), Antimony (Sb), and Bismuth (Bi).
Trivalent impurities
The Trivalent impurity atom has three valence electrons. The various
examples of trivalent impurities include Boron (B), Gallium (G),
Indium(In), and Aluminum(Al).
Difference between Pentavalent impurities and trivalent impurities.
Electro
Hole
Ban n
Mobilit Thermal
Semiconducto d Mobilit
Type y Conductivit
r Gap y
(cm²/Vs y (W/mK)
(eV) (cm²/Vs
)
)
Intrinsi
Silicon (Si) 1.12 1500 450 150
c
Germanium Intrinsi
0.67 3900 1900 60
(Ge) c
Gallium
Intrinsi
Arsenide 1.43 8500 400 46
c
(GaAs)
Boron-doped
p-type 1.12 1500 1800 150
Silicon (p-Si)
Aluminum-
doped Gallium
p-type 1.43 8500 200 46
Arsenide (p-
GaAs)
Silicon-doped
Gallium
n-type 1.43 8500
Arsenide (n-
GaAs)
The valence band comprises the highest energy electrons in the solid,
and the conduction band is the lowest empty belt where electrons can
remain. These bands are the permissible bands. The energy band
between the permissible bands is the band gap or forbidden band,
where the electrons cannot exist. Energies within the band gap are not
accessible for electron occupancy. The energy of the band gap is the
difference between the valence and the conduction bands.The energy
bands below the valence band (not shown) are all filled and do not
contribute to the material’s electrical characteristics. The electrical
properties of a solid strongly depend on the number of electrons in the
valence band.
In figure 1, the circles with a negative sign are the actual valence
electrons of one atom in a filled energy state. The empty circles
represent the available energy states for the electrons. The filled
valence band and empty conduction band assume a perfect crystal
lattice and a temperature of 0 K (-273°C) – the ground or lowest-
energy state.When the lattice spacing decreases from its initial value, a
single band appears as a combination of the valence and conduction
bands. Reducing the spacing, the band divides into different valence
and conduction bands with a bandgap in between.
Since no more than two interacting atoms can have the same energy
level, new levels take shape with infinitesimally different magnitudes.
This group of energy levels in a polyatomic material – the energy band
– represents an energy level in a single atom. Each band contains as
many discrete levels of energy as there are atoms in the crystal. Pauli’s
exclusion principle limits the number of electrons in a certain NL
atomic energy level in a single atom. Likewise, the principle limits the
maximum number of electrons contained in a lattice’s energy band.
Figure 2 compares atomic energy levels with energy bands in a lattice
via the electron energy band structure’s usual representation for solid
materials.
band.
Generally, we may conclude that the lower energy bands are filled, but
the valence band may or may not be filled.An electron in an atom
occupies one of a series of allowed orbital patterns, with expressly
permitted energies.
The valence orbitals are only the ground-state orbitals for the valence
electrons. There are many other vacant crystalline orbitals of higher
energy, where the allowed energy levels also fall in bands.
Characteristics of Holes:
4.The energy of a hole is higher, the farther below it is from the top of
the valence band.
The Mobility of a charge carrier like free electron, ions and holes is
defined as the magnitude of the drift velocity developed per unit
strength of the electric field applied across the conductor. Therefore,
mobility (u) = vd/E, where Vd is the drift velocity and E is the electric
field intensity. The SI unit of Mobility is m² /volt second.
Μ= (qV/ml)/E
⟹ μ=(q.E.l.t)/mlE = qt/m.
We know that for an electron, q = e, where e = charge of the electron.
Zener Diode
Avalanche Breakdown
The phenomenon of Avalanche breakdown occurs both in the ordinary
diode and Zener Diode at high reverse voltage. For a high value of
reverse voltage, the free electron in the PN junction diode gains
energy and acquires high velocity and these high-velocity electrons
collide with other atoms and knock electrons from that atoms. This
collision continues and new electrons are available for conducting
current thus the current increase rapidly in the diode.This phenomenon
of a sudden increase in the current is called the Avalanche breakdown.
This phenomenon damages the diode permanently whereas the Zener
diode is a specific diode that is made to operate in this reverse voltage
area. If the reverse voltage is greater than 6V the avalanche breakdown
happens in the Zener diode.
Avalanche breakdown is
Zener breakdown is observed in
observed in diodes that are
diodes that are highly doped.
lightly doped.
Photodiode
The symbol of photodiode is similar to the normal p-n junction diode
except that it contains arrows striking the diode. The arrows striking
the diode represent light or photons.
The external reverse voltage applied to the p-n junction diode will
supply energy to the minority carriers but not increase the population
of minority carriers.
Types of photodiodes
PN junction photodiode
PIN photodiode
Avalanche photodiode
free electrons reaches n region, they are attracted towards the positive
terminals of the battery. In the similar way, holes move in opposite
direction.
The strong depletion region electric field and the external electric field
increase the drift velocity of the free electrons. Because of this high
drift velocity, the minority carriers (free electrons and holes) generated
in the depletion region will cross the p-n junction before they
recombine with atoms. As a result, the minority carrier current
increases.
PIN photodiode.
P-type semiconductor
N-type semiconductor
However, the minority carriers will carry electric current because they
experience repulsive force from the external electric field.
In PIN photodiode, the charge carriers generated in the depletion
region carry most of the electric current. The charge carriers generated
in the p region or n region carry only a small electric current.
When light or photon energy is applied to the PIN diode, most part of
the energy is observed by the intrinsic or depletion region because of
the wide depletion width. As a result, a large number of electron-hole
pairs are generated.
When free electrons and holes reach n region and p region, they are
attracted to towards the positive and negative terminals of the battery.
Light Emitting Diodes or simply LED´s, are among the most widely
used of all the different types of semiconductor diodes available today
and are commonly used in TV’s and colour displays.The light emitting
diode is the most visible type of semiconductor diode. They emit a
fairly narrow bandwidth of either visible light at different coloured
wavelengths, invisible infra-red light for remote controls or laser type
light when a forward current is passed through them.The “Light
Emitting Diode” or LED as it is more commonly called, is basically
just a specialised type of diode as they have very similar electrical
characteristics to a PN junction diode. This means that an LED will
pass current in its forward direction but block the flow of current in
the reverse direction Light emitting diodes are made from a very thin
layer of fairly heavily doped semiconductor material and depending on
the semiconductor material used and the amount of doping, when
forward biased an LED will emit a coloured light at a particular
spectral wavelength.When the diode is forward biased, electrons from
the semiconductors conduction band recombine with holes from the
valence band releasing sufficient energy to produce photons which
emit a monochromatic (single colour) of light. Then we can say that
when operated in a forward biased direction Light Emitting Diodes are
semiconductor devices that convert electrical energy into light
energy.The construction of a Light Emitting Diode is very different
from that of a normal signal diode. The PN junction of an LED is
surrounded by a transparent, hard plastic epoxy resin hemispherical
shaped shell or body which protects the LED from both vibration and
shockSurprisingly, an LED junction does not actually emit that much
light so the epoxy resin body is constructed in such a way that the
photons of light emitted by the junction are reflected away from the
surrounding substrate base to which the diode is attached and are
focused upwards through the domed top of the LED, which itself acts
like a lens concentrating the amount of light. This is why the emitted
light appears to be brightest at the top of the LED.However, not all
LEDs are made with a hemispherical shaped dome for their epoxy
shell. Some indication LEDs have a rectangular or cylindrical shaped
construction that has a flat surface on top or their body is shaped into a
bar or arrow. Generally, all LED’s are manufactured with two legs
protruding from the bottom of the body.
Also, nearly all modern light emitting diodes have their cathode, ( – )
terminal identified by either a notch or flat spot on the body or by the
cathode lead being shorter than the other as the anode ( + ) lead is
longer than the cathode (k).Unlike normal incandescent lamps and
bulbs which generate large amounts of heat when illuminated, the light
emitting diode produces a “cold” generation of light which leads to
high efficiencies than the normal “light bulb” because most of the
generated energy radiates away within the visible spectrum. Because
LEDs are solid-state devices, they can be extremely small and durable
and provide much longer lamp life than normal light sources.
So how does a light emitting diode get its colour. Unlike normal signal
diodes which are made for detection or power rectification, and which
are made from either Germanium or Silicon semiconductor materials,
Light Emitting Diodes are made from exotic semiconductor
compounds such as Gallium Arsenide (GaAs), Gallium Phosphide
(GaP), Gallium Arsenide Phosphide (GaAsP), Silicon Carbide (SiC)
or Gallium Indium Nitride (GaInN) all mixed together at different
ratios to produce a distinct wavelength of colour.Different LED
compounds emit light in specific regions of the visible light spectrum
and therefore produce different intensity levels. The exact choice of
the semiconductor material used will determine the overall wavelength
of the photon light emissions and therefore the resulting colour of the
light emittedLight Emitting Diode Colours
Semiconductor
Wavelength Colour VF @ 20mA
Material
As can be seen in both the figures above, all three segments have
different thickness and doping levels. The schematic symbols of both
As can be seen above, the base is the common terminal for two power
supplies whose other terminals are connected to the emitter and
collector
Some Terminologies
Let us now study the path of the current carriers in the junction
transistor where –
p-n-p Transistor
The emitter has a large concentration of holes. The base, being an n-
type semiconductor will have electrons as its majority charge carriers.
When the majority carriers (holes) enter the base from the emitter,
they swamp the majority charge carriers of the base (electrons). The
base-collector junction is reverse biased.
Since the base is very thin, most of the holes find themselves near the
base-collector junction (reverse biased). Hence, they cross over to the
collector rather than move to the base terminal The forward bias leads
to a large current entering the emitter-base junction. However, most of
it diverts to the adjacent base-collector junction. Hence, the current
coming out of the base is a small fraction of that entering the junction.
The total current in a forward biased diode is Ih + Ie … where Ih is
the hole current and Ie is the electron current.
IE = IC + IB
Working
Photons in sunlight hit the solar panel and are absorbed by semi-
conducting materials.
Electrons (negatively charged) are knocked loose from their atoms
as they are excited. Due to their special structure and the materials
in solar cells, the electrons are only allowed to move in a single
direction. The electronic structure of the materials is very
important for the process to work, and often silicon incorporating
small amounts of boron or phosphorus is used in different layers.
An array of solar cells converts solar energy into a usable amount
of direct current (DC) electricity.
A photon only needs to have energy greater than that of the band gap
in order to excite an electron from the valence band into the
conduction band. However, the solar frequency spectrum
approximates a black body spectrum at about 5,800 K,[1] and as such,
much of the solar radiation reaching the Earth is composed of photons
with energies greater than the band gap of silicon (1.12eV), which is
near to the ideal value for a terrestrial solar cell (1.4eV). These higher
energy photons will be absorbed by a silicon solar cell, but the
difference in energy between these photons and the silicon band gap
is converted into heat (via lattice vibrations — called phonons) rather
than into usable electrical energy.
These two “forces” may work one against the other at any given point
in the cell. For instance, an electron moving through the junction from
the p region to the n region (as in the diagram at the beginning of this
article) is being pushed by the electric field against the concentration
gradient. The same goes for a hole moving in the opposite direction.
In thick solar cells there is very little electric field in the active region
outside the space charge zone, so the dominant mode of charge carrier
separation is diffusion. In these cells the diffusion length of minority
carriers (the length that photo-generated carriers can travel before
they recombine) must be large compared to the cell thickness. In thin
film cells (such as amorphous silicon), the diffusion length of
minority carriers is usually very short due to the existence of defects,
and the dominant charge separation is therefore drift, driven by the
electrostatic field of the junction, which extends to the whole
thickness of the cell.
Once the minority carrier enters the drift region, it is ‘swept’ across
the junction and, at the other side of the junction, becomes a majority
carrier. This reverse current is a generation current, fed both thermally
and (if present) by the absorption of light. On the other hand, majority
carriers are driven into the drift region by diffusion (resulting from the
concentration gradient), which leads to the forward current; only the
majority carriers with the highest energies (in the so-called Boltzmann
tail; cf. Maxwell–Boltzmann statistics) can fully cross the drift region.
Therefore, the carrier distribution in the whole device is governed by
a dynamic equilibrium between reverse current and forward current.
The voltage divider biassing used in the single stage common emitter
amplifier circuit depicted above is known as “Voltage Divider
Biasing.” Two resistors are used as a potential divider network across
the supply, with their centre point giving the requisite base bias
voltage to the transistor in this form of biassing configuration. In the
construction of bipolar transistor amplifier circuits, voltage divider
biassing is often used.
By keeping the Base bias at a constant stable voltage level, this
approach of biassing the transistor considerably decreases the impacts
of fluctuating Beta, , allowing for the best stability.The potential
divider network built by the two resistors R1, R2 and the power
supply voltage determines the quiescent Base voltage (), as seen with
current flowing through both resistors.The overall resistance RT will
then equal , resulting in a current of . The voltage generated at the
junction of resistors and maintains the Base voltage () at a value
lower than the supply voltage.The supply voltage is divided in
proportion to the resistance by the potential divider network in the
common emitter amplifier circuit. Using the basic voltage divider
formula below, you can simply compute the bias reference voltage.
Transistor Bias Voltage
When the transistor is fully “ON” (saturation), , the same supply
voltage, , also controls the maximum Collector current, . The
Collector current, , and the DC current gain Beta, of the transistor
are used to calculate the Base current .
Beta Value
Logic diagram
To represent a logic circuit graphically we design logic diagrams. This
displays the connection between each individual logic gate with the
wiring connection, represented using a specific graphical symbol for
each individual logic gate.
Logic Gates Types
The connection between the input and the output differs with a certain
type of logic circuit. Basically, there are seven types of logic gates:
AND gate: NAND gate OR gate NOR gate NOT gate XOR gate and
XNOR gate. There are two types of symbols which is commonly used
to represent logic gates. They are traditional symbols (the symbol
widely used in education and industry purposes) and
IEC(International ElectroTechnical Commission) symbol.
Logic AND Gate
The AND gate has two or more inputs connections attached to it. Its
logic works when all the inputs are True(high) then the output is High
(True), otherwise all the outputs are False(low).
Logic OR Gate
XOR gate is also known as EXclusive OR gate. This also looks like
an OR gate but when the both inputs have the same values (TRUE,
TRUE or FALSE, FALSE) the output is FALSE (low). When the both
inputs have different values (TRUE and FALSE) the output is TRUE
(high). This gate has only two inputs.
XOR gate is also known as EXclusive NOR gate. It has the same
parameters as the XOR gate, but the output is inverted. When the both
inputs have the same values (TRUE, TRUE or FALSE, FALSE) the
output is TRUE (high). When the both inputs have different values
(TRUE and FALSE) the output is FALSE (low). This gate has only
two inputs.
Buffer.:Buffers have only one input and one output. Buffer acts like
the negation of the NOT gate. This passes the input signal without
changing the input in anyways. The purpose of the buffer is to
increase the propagation delay of the logic circuit.
Logic gate truth tables
Truth table is a table which is used to help show the Boolean
expression of a logic gate. Therefore, it helps to understand the
behavior of logic gates. Truth table helps us see the connection
between its inputs and outputs by showing how the inputs of a logic
gate connected to its resultant outputs.
In the Truth table, the left columns denote the inputs for the gates and
right columns denote the outputs. Table consists of all the different
possible input combinations and all the possible outputs related to
that.
As an example, let’s consider a logic circuit having two variable
inputs. Since there are two variable inputs, we can get four different
combinations for those inputs {(HIGH, HIGH), (HIGH, LOW),
(LOW, HIGH), (LOW, LOW)}. For those four combinations there are
four outputs. When we write Boolean expressions and work with
logic truth tables we use 1’s and 0’s instead of HIGH and LOW
respectively.
Then, the tour different possible combinations of the two inputs can
be given as follows:
The truth table for the 2-input AND gate is as follows. Let’s label A,
B as inputs and the Q is the output.
Logic AND Truth table
The truth table for the 2-input OR gate is as follows.. Let’s label A, B
as inputs and the Q is the output.
Following is the truth table for NOT gate. Let’s label A as input and
the Q is the output.
The truth table for the 2-input NAND gate is as follows.. Let’s label
A, B as inputs and the Q is the output.
NAND
gate truth table
The truth table for the 2-input NOR gate is as follows. Let’s label A,
B as inputs and the Q is the output.
NOR gate truth table
The truth table for 2-input XOR gate is as follows. Let’s label A, B as
inputs and the Q is the output. Usually we express the Exclusive-OR
or Exclusive-NOR function by using a character with a plus sign
inside a circle
X
OR Gate truth table
XNOR Gate Truth table
The truth table for the 2-input XNOR gate is as follows. Let’s label A,
B as inputs and the Q is the output.
X
NOR gate truth table
Logic circuits
Logic IC