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Exercise 3

This document describes using ANSYS Icepak software to optimize the location of a fan in a system to improve cooling performance. It outlines 11 steps for setting up a parametric model to simulate heat dissipation under different fan locations, examining the results, and generating reports.

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nandhank2k3
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11 views6 pages

Exercise 3

This document describes using ANSYS Icepak software to optimize the location of a fan in a system to improve cooling performance. It outlines 11 steps for setting up a parametric model to simulate heat dissipation under different fan locations, examining the results, and generating reports.

Uploaded by

nandhank2k3
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Ex.

No:
Date :

Use of Parameteriza;on to Op;mize Fan Loca;on


AIM:
To implement an effec5ve cooling strategy by aZaching a substan5al heat sink to the
RF amplifier housing.

PROCEDURE:
Step 1: Model Prepara5on
- Iden5fy the components of the heat dissipa5on system, including the heat sink, fan, and
other relevant objects.
- Open the Model manager window and select all blocks except the hollow block and the heat
sink object.
- Right-click the selected objects and choose "Create" -> "Assembly" to create the Heatsink-
packages-asy assembly.
- Rename the assembly as "Heatsink-packages-asy" for clarity.
- Double-click the assembly to edit it and navigate to the Meshing tab of the Assemblies panel.

Step 2: Meshing
- Toggle "Mesh separately" in the Meshing tab to create non-conformal meshed assemblies.
- Set the slack parameters for the assembly bounding box as specified in Table 4.3, ensuring
sufficient resolu5on for accurate results without excessively long run 5mes.
- Click "Update" and then "Done" to finalize the bounding box specifica5ons for the assembly.

Step 3: Addi5onal Assemblies


- Repeat the above steps to create another assembly for the fan object and name it "Fan-asy."
- Set the slack values for the Fan-asy assembly according to Table 4.4, maintaining appropriate
bounding box dimensions.

Step 4: Mesh Genera5on


- Open the Mesh control panel and ensure the default mesh sedngs are retained.
- Verify that "Mesh assemblies separately" is selected to mesh each assembly independently.
- Click "Generate" to ini5ate the meshing process and create meshes for both assemblies.

Step 5: Parameteriza5on
- Navigate to the Solve menu and select "Define trials" to set up parametric trials for fan
loca5on op5miza5on.
- Toggle Parametric trials and specify discrete values for the fan loca5on parameter to explore
different configura5ons.
- Apply the specified values and ensure the Restart ID is blank for the 2nd trial in the Trials tab.
Step 6: Monitor Points
- Create two monitor points to track velocity in the grille and temperature in one of the solid
blocks.
- Modify the monitor points to monitor Velocity for the grille and Temperature for the block,
enabling efficient data collec5on during simula5ons.

Step 7: Physical and Numerical Sedngs


- Use the Basic sedngs panel to determine the flow regime and set the number of itera5ons to
ensure convergence.
- Accept the recommended sedngs based on the flow regime and adjust parameters if
necessary for accurate simula5ons.

Step 8: Save the Model


- Save the project to preserve all changes and configura5ons for future analyses and reference.

Step 9: Calculate Solu5on


- Run the solu5on for both single trials and op5miza5on trials to simulate heat dissipa5on
under different fan loca5ons.

Step 10: Examine Results


- Load the solu5on ID for each trial and analyze the results using post-processing features to
evaluate heat dissipa5on effec5veness.
- Compare the results of different trials to assess the impact of fan loca5on on temperature
distribu5on and overall heat dissipa5on efficiency.

Step 11: Generate Reports


- Review the overview report automa5cally generated by ANSYS Icepak, containing key
parameters and results summaries.
- Create a comprehensive summary report containing the results of all trial runs for detailed
analysis and comparison.
DESCRIPTION:
Model:

Figure 01: Model


Visual representa5on showcasing the 3D model of the system for op5mizing fan
loca5on, highligh5ng the arrangement of components, such as the heat sink, packages, and fan,
within the computa5onal domain.

Mesh Model:

Figure 02: Meshed Model (cut plane on y axis)

Graphic displaying the meshed model of the system, illustra5ng the discre5za5on of the
geometry into finite elements or cells to facilitate numerical analysis, capturing temperature
gradients and airflow dynamics accurately.
Convergence Plot:

Figure 03: Convergenc plot

Graphical depic5on demonstra5ng the convergence behavior of the solver throughout


the simula5on, indica5ng the reduc5on of residual errors over successive itera5ons un5l
reaching a stable solu5on, ensuring the reliability of the simula5on results.

POST PROCESSING RESULT & DISCUSSION:

Temperature Contour:
Figure 04: Contour plot of Temperature
Contour plot represen5ng the temperature distribu5on across the computa5onal
domain, visualizing varia5ons in temperature levels within components like blocks and PCB,
aiding in iden5fying areas of heat accumula5on or cooling effec5veness.
Pressure Contour:

Figure 05: Contour plot of Pressure

Contour visualiza5on displaying the spa5al distribu5on of pressure within the airflow
domain surrounding the components, offering insights into airflow behavior, pressure
differen5als, and poten5al airflow obstruc5ons or turbulence.

Velocity Contour:

Figure 06: Contour plot of velocity

Contour plot illustra5ng the velocity field within the airflow domain around the
components, depic5ng airflow magnitude and direc5on to assess cooling efficiency and heat
dissipa5on capabili5es.
RESULT:
We employed Ansys Icepak soWware to op5mize the fan loca5on in our system,
enhancing airflow and thermal management efficiency. Through me5culous simula5on and
analysis, we achieved improved cooling performance, ensuring stable opera5ng temperatures
for cri5cal components and enhancing overall system reliability and performance.

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