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The document is a DFM report for a PCB design with 2 layers and dimensions of 59.44x84.33mm. It analyzes trace widths, densities, clearances and other metrics. It finds issues with holes on SMD pads that could impact manufacturing and reliability.

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johanbu
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35 views3 pages

Report

The document is a DFM report for a PCB design with 2 layers and dimensions of 59.44x84.33mm. It analyzes trace widths, densities, clearances and other metrics. It finds issues with holes on SMD pads that could impact manufacturing and reliability.

Uploaded by

johanbu
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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HQDFM Design for Manufacture(DFM) Report

File name: 0000A73639_1

Time: 2024-02-29Layer num:2 pcb thickness:1.60 quantity:5 Board Size:59.44*84.33 mm

Trace Width/Spacing 10.00/6.00mil+


Pass Item

Warn Item Milling Density 58.8905m/m²


Risk Item
25
param_analyze Surface Finish Area 10.22%

Test Point Count 62


2
0
Panel Efficiency 88.3277%

The board's small size may complicate machine assembly. We recommend increasing the dimensions
to at least 70 x 70mm by panelizing the boards and/or adding break-away rails.
type checkitem checksubitem result

Smallest Trace Width 1 Pass

Smallest Trace Spacing 3 Pass 63

Pad Spacing 2 Pass

Pad Size 3 Pass

Hatched Copper Pour 2 Pass

pcb_signal RingHole 2 Pass 14

Drill to Copper 5 Pass 40

Signal Integrity 4 Pass

Board Edge Clearance 2 Pass

Holes on SMD Pads 4 Fail 4

Open/Shorts (IPC) 1 Fail

Hole Diameter 8 Pass 30

Drill Hole Density 1 Pass

Hole Diameter 8 Pass 30

pcb_drill Drill Hole Spacing 4 Pass

Drill to Board Edge 4 Pass

Drill Hole Density 1 Pass

Special Drill Holes 2 Pass

Solder Mask Spacing 2 Pass 10


pcb_soldmask
Missing SMask Openings 1 Pass

pcb_silk Silkscreen Spacing 1 Pass 6

ass_markpoint Fiducials 1 Fail


ID item rule value issue image Coordinate count level

Holes on surface mount


pads were detected in your
design. During SMT
assembly, solder could leak
Holes on into the hole and pull
SMD solder away from the SMD
100.00
1 Pads_PTH -,-,- contact, which could 36.83,-125.73 4 Warn
%
on SMD decrease manufacturing
Pad efficiency and yield, and
affects the reliability of the
boards. Please check and
separate the holes from the
pads if possible.

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