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CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low
Energy Companion IC
– Internal slow clock or external 32.768kHz slow
1 Features clock
Key Features • Small package size
• Wi-Fi 6 (802.11ax) – Easy to design with 40-pin, 5mm × 5mm quad
• Bluetooth® Low Energy 5.4 in CC33x1 devices flat no-leaded (QFN) package, 0.4mm pitch
• Companion IC to any processor or MCU host 2 Applications
capable of running a TCP/IP stack
• Integrated 2.4/5GHz PA for complete wireless • Grid infrastructure
solution with up to +20.5dBm output power. – Electricity meter
• Operating temperature: –40°C to +105°C – String inverter

ADVANCE INFORMATION
• Application throughput up to 50Mbps – Micro inverter
– Energy storage power conversion system
Extended Features (PCS)
• Wi-Fi 6 – EV charging infrastructure
– 2.4GHz and 5GHz, 20MHz, single spatial • Building and home automation
stream – HVAC controller
– MAC, baseband, and RF transceiver with – HVAC gateway
support for IEEE 802.11 a/b/g/n/ax – Thermostat
– OFDMA, Trigger frame, MU-MIMO (downlink), – Building security gateway
basic service set coloring, and target wake time – Garage door system
(TWT) for improved efficiency – IP network camera and video doorbell
– Hardware-based encryption and decryption – Wireless security camera
supporting WPA2 and WPA3 • Appliances
– Excellent interoperability – Refrigerator and freezer
– Support for 4-bit SDIO or SPI host interfaces – Oven
– Washer and dryer
• Bluetooth Low Energy 5.4 – Residential water heater and heating system
– LE coded PHYs (long range), LE 2M PHY (high – Air purifier and humidifier
speed) and advertising extension – Coffee machine
– Host controller interface (HCI) transport with – Air conditioner indoor unit
option for UART or shared SDIO – Vacuum robot
• Enhanced security – Robotic lawn mower
– Secured host interface • Medical
– Firmware authentication – Infusion pump
– Anti-rollback protection – Electronic hospital bed and bed control
– Multiparameter patient monitor
• Multirole support (for example, concurrent STA and – Blood pressure monitor
AP) to connect with Wi-Fi devices on different RF – CPAP machine
channels (Wi-Fi networks) – Telehealth systems
• Optional antenna diversity or selection – Ultrasound scanner
• 3-wire or 1-wire PTA for external coexistence with – Ultrasound smart probe
additional 2.4GHz radios (for example, Thread or – Electric toothbrush
Zigbee) • Retail automation and payment
• Printers
• Power management
– VMAIN, VIO, Vpp: 1.8V
– VPA: 3.3V
• Clock sources
– 40-MHz XTAL fast clock

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
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3 Description
The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers
to connect more applications with confidence. CC33xx are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4
devices. The CC3350 and CC3351 are the first dual-band devices in this pin-to-pin compatible family.
• CC3350: A 2.4GHz and 5GHz Wi-Fi 6 companion IC
• CC3351: A 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth low energy 5.4 companion IC
The CC335x offers Wi-Fi 6 and BLE while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5
(802.11ac). These CC335x are the 10th-generation connectivity combination chip from Texas Instruments. As
such, the CC335x is based on proven technology. These devices are ideal for use in cost-sensitive embedded
applications with a Linux or RTOS host running TCP/IP. CC335x brings the efficiency of Wi-Fi 6 to embedded
device applications for the internet of things (IoT), with a small PCB footprint and highly optimized bill of
materials.
ADVANCE INFORMATION

Device Information
BLUETOOTH LOW
PART NUMBER WI-FI 2.4/5-GHz SISO
ENERGY
CC3350ENJARSBR ✔
CC3351ENJARSBR ✔ ✔

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4 System Diagram
Figure 4-1 shows a basic system diagram for the CC3351.

CC335x 2.4/5GHz Wi-Fi and BLE Companion IC

Interfaces Wi-Fi & BLE Core

SDIO /SPI
DMA Crypto ELP
2.4GHz
UART ANT
Wi-Fi BLE
MAC / Modem MAC / Modem

ADVANCE INFORMATION
Coexistence

2.4/5GHz Wi-Fi / BLE RF

Antenna Diversity

nReset 5GHz
System
ANT
Power
User OTP Packet RAM Execution / Data RAM
Clock

CC3351 only
Figure 4-1. CC3351 High-Level System Diagram

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Table of Contents
1 Features............................................................................1 7.2 Device Nomenclature Boilerplate................................9
2 Applications..................................................................... 1 7.3 Tools and Software................................................... 10
3 Description.......................................................................2 7.4 Documentation Support............................................ 10
4 System Diagram.............................................................. 3 7.5 Support Resources................................................... 11
5 Pin Configuration and Functions...................................5 7.6 Trademarks............................................................... 11
5.1 Pin Diagram................................................................ 5 7.7 Electrostatic Discharge Caution................................ 11
5.2 Pin Attributes...............................................................6 7.8 Glossary.................................................................... 11
6 Applications, Implementation, and Layout................... 7 8 Revision History............................................................ 11
7 Device and Documentation Support..............................9 9 Mechanical, Packaging, and Orderable Information.. 12
7.1 Third-Party Products Disclaimer................................. 9
ADVANCE INFORMATION

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5 Pin Configuration and Functions

5.1 Pin Diagram
Figure 5-1 shows pin assignments for the 40-pin WQFN package.

30 HOST_IRQ_BLE
29 HOST_IRQ_WL
28 LOGGER

24 SDIO_D0
23 SDIO_D1
22 SDIO_D2
21 SDIO_D3
26 SWCLK
27 SWDIO

25 GND
DIG_LDO_OUT 31 20 GND
VDD_MAIN_IN 32 19 SDIO CLK

ADVANCE INFORMATION
NRESET 33 18 SDIO CMD
SLOW_CLK_IN 34 17 VIO
VPP_IN 35 16 GND
FAST_CLK_REQ 36 15 ANT_SEL
GND 37 14 UART TX
RF_A 38 13 UART RX
PA_LDO_IN 39 12 UART CTS
PA_LDO_IN 40 11 UART RTS

COEX_REQ 10
1
2
3
4
5
6
7
8
9
HFXT_P/EXT
VDDA_IN1
VDDA_IN2

HFXT_M
COEX_GRANT
COEX_PRIORITY
RF_BG
GND
PA_LDO_OUT

Figure 5-1. CC3351 Pin Diagram

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5.2 Pin Attributes

Table 5-1. Pin Attributes
STATE
VOLTAGE
PIN SIGNAL NAME TYPE DIR (I/O) SHUTDOWN STATE1 AFTER DESCRIPTION
LEVEL
POWER-UP
RF power amplifier LDO
1 PA_LDO_OUT Analog
output

Bluetooth Low Energy

2 RF_BG RF I/O and WLAN 2.4GHz RF
port

3 GND GND GND

1.8V supply for analog

4 VDDA_IN1 POW
domain
ADVANCE INFORMATION

1.8V supply for analog

5 VDDA_IN2 POW
domain

6 HFXT_P Analog Sine XTAL_P

7 HFXT_M Analog XTAL_N

External coexistence
8 COEX_GRANT2 Digital O VIO PD PD
interface - grant

External coexistence
9 COEX_PRIORITY2 Digital I VIO PU PU
interface - priority

External coexistence
10 COEX_REQ2 Digital I VIO PU PU
interface - request

Device RTS signal - flow

11 UART RTS Digital O VIO PU PU
control for BLE HCI

Device CTS signal - flow

12 UART CTS Digital I VIO PU PU
control for BLE HCI

13 UART RX Digital I VIO PU PU UART RX for BLE HCI

14 UART TX Digital O VIO PU PU UART TX for BLE HCI

Antenna select control

15 ANT_SEL2 Digital O VIO PD PD
line

16 GND GND GND

17 VIO POW 1.8V IO supply

SDIO command or SPI

18 SDIO CMD Digital I/O VIO HiZ HiZ
PICO

19 SDIO CLK Digital I VIO HiZ HiZ SDIO clock or SPI clock

20 GND GND GND

21 SDIO D3 Digital I/O VIO HiZ PU SDIO data D3 or SPI CS

22 SDIO D2 Digital I/O VIO HiZ HiZ SDIO data D2

23 SDIO D1 Digital I/O VIO HiZ HiZ SDIO data D1

SDIO data D0 or SPI

24 SDIO D0 Digital I/O VIO HiZ HiZ
POCI

25 GND GND GND

26 SWCLK Digital I VIO PD PD Serial wire debug clock

27 SWDIO Digital I/O VIO PU PU Serial wire debug I/O

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Table 5-1. Pin Attributes (continued)

STATE
VOLTAGE
PIN SIGNAL NAME TYPE DIR (I/O) SHUTDOWN STATE1 AFTER DESCRIPTION
LEVEL
POWER-UP
Tracer (UART TX debug
28 LOGGER3 Digital O VIO PU PU
logger)

Interrupt request to host

29 HOST_IRQ_WL3 Digital O VIO PD 0
for WLAN

Interrupt request to host

30 HOST_IRQ_BLE3 Digital O VIO PD PD for BLE (in shared SDIO
mode)

Digital LDO output to

31 DIG_LDO_OUT Analog O
decoupling capacitor

ADVANCE INFORMATION
1.8V supply input for
32 VDD_MAIN_IN POW
SRAM and digital

Reset line for enabling

33 nRESET Digital I VIO PD PD or disabling device
(active low)

32.768kHz RTC clock

34 SLOW_CLK_IN Digital I VIO PD PD
input

1.8V OTP programming

35 VPP_IN POW
input supply

Fast clock request from

36 FAST_CLK_REQ Digital O VIO PD PD
the device

37 GND GND GND

38 RF_A RF WLAN 5GHz RF port

39 PA_LDO_IN POW 3.3V supply for PA

40 PA_LDO_IN POW 3.3V supply for PA

1. All digital I/Os (with the exception of SDIO signals) are Hi-Z when the device is in Shutdown mode with
internal PU/PD according to the "shutdown state" column.
2. See software release notes for support level.
3. LOGGER and HOST_IRQ_WL pins are sensed by the device during boot, see CC33xx Hardware
Integration.
6 Applications, Implementation, and Layout
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

Figure 6-1 shows the reference schematic for the CC335x using an optimized bill of materials.

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VBAT_CC_1V8

VBAT_CC_1V8

Clocking C1
VBAT_CC_1V8
CC3351 IC
0.1uF
C2 C3
0.1uF 0.1uF
GND
HFXT_P HFXT_M
GND GND
VBAT_CC_1V8
R1
CC1 50Ohm
150
i RF_A
VBAT_CC_1V8 32 38
VDD_MAIN_IN RF_A 50Ohm
C4 4 i
0.1uF VDDA_IN1 RF_BG
Y1 5
VDDA_IN2 RF_BG
2

C5 17
1 3 VIO
GND 0.1uF 7
C6 C7 HFXT_M HFXT_M
6.8pF 6.8pF 35
VBAT_CC_3V3 VPP_IN 3
50V 2 50V GND
GND GND 39 15
0201 4 0201 PA_LDO_IN ANT_SEL ANT_SEL_1V8
GND 40
PA_LDO_IN 8 GND
TZ3877AAAO44 C8 COEX_GRANT COEX_GRANT_1V8
1.0uF VDDPA_OUT 1
PA_LDO_OUT COEX_PRIORITY
9
COEX_PRIORITY_1V8
10
DIG_LDO_OUT 31 COEX_REQ COEX_REQ_1V8
DIG_LDO_OUT
GND GND 19
SDIO_CLK SDIO_CLK_1V8
GND 18
C10 SDIO_CMD SDIO_CMD_1V8
34 24
1.0uF SLOW_CLK_IN_1V8 Slow_Clock_In SDIO_D0 SDIO_D0_1V8
23
SDIO_D1 SDIO_D1_1V8
33 22
nRESET_1V8 nReset SDIO_D2 SDIO_D2_1V8
C9 21
SDIO_D3 SDIO_D3_1V8
1.0uF GND LOGGER_1V8 28
Logger 26
VCC_BRD_1V8 SWCLK SWCLK_1V8
Y2 6 27
HFXT_P XTAL_P/EXT SWDIO SWDIO_1V8
4 3
+Vs Output SLOW_CLK_IN_1V8 36 30
FAST_CLK_REQ_1V8 FAST_CLK_REQ Host_IRQ_BLE IRQ_BLE_1V8
GND 37
GND Host_IRQ_WL
29
IRQ_WL_1V8
1 2
Standby/Operation GND 13 41
UART_RX_1V8 UART_RX EP
LFSPXO073707REEL GND 14
ADVANCE INFORMATION

UART_TX_1V8 UART_TX
GND 12 16
UART_CTS_1V8 UART_CTS GND
11 20
UART_RTS_1V8 UART_RTS GND
25
GND
*The slow clock can be generated internally. An external slow clock can be optionally used to save power.
CC3351ENJARSBR

GND

50Ohm 50Ohm
i FL1 i
RF_BG 1 3
IN OUT
2
GND
4
GND

DEA162450BT-1295A1
GND

E1
U1
BG_diplexer_in *Antenna Matching Network
5 4
GND Low-Band_Port
3 50Ohm

1
6
5
4

3
2
1
GND
GND i C11
2 diplexer_out
Common_Port
L1 50V L2
A_diplexer_in 3.9pF
6
High-Band_Port DNP DNP
GND GND
DPX167125DT-8197B1
GND
50Ohm
i GND GND
RF_A

RF SECTION
Figure 6-1. CC335x Reference Schematic

1. The slow clock can be generated internally. An external slow clock can be optionally used to save power.
2. For more information on antenna selection and matching, see the CC33xx Hardware Integration.

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7 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
7.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
7.2 Device Nomenclature Boilerplate
Device development evolutionary flow:

ADVANCE INFORMATION
X Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:
Device development evolutionary flow:

TMX Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
TMS Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.

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7.3 Tools and Software

Design Kits and Evaluation Modules

CC330x Reference CC330x reference design CAD source files. TI recommends using this design as a
Design Files reference when creating the layout in order to achieve the RF performance listed in
this data sheet.

CC3351 BoosterPack The CC3301 BoosterPack™ plug-in module (BP-CC3351) is a test and development
plug-in module board that can be easily connected to TI LaunchPad™ development kits or processor
boards; thus enabling rapid software development.
CC3351 M.2 card plug-in The CC3351 M.2 card plug-in module (M2-CC3351) is a test and development board
module that can be easily connected to TI processor boards or other processor boards with
an M.2 Key E interface support; thus enabling rapid software development.
ADVANCE INFORMATION

Software
SimpleLink Wi-Fi SimpleLink Wi-Fi Toolbox is a collection of tools to help development and testing of the
Toolbox CC33xx. The Wi-Fi toolbox package provides all the capabilities required to debug and
monitor WLAN/Bluetooth® Low Energy firmware with a host, perform RF validation tests,
run pretest for regulatory certification testing, and debug hardware and software platform
integration issues.

CC33xx device The CC33XX are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 companion devices
drivers suitable for both Linux and RTOS based systems. CC33XX-SOFTWARE is a collection of
software development sources aimed to facilitate quick setup, out-of-box experience, and
accelerate development in Linux or RTOS environments.
7.4 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.

Application Reports
CC33xx Production Texas Instruments™ provides many resources in order to assist users in quickly examining
Line Guide the functionality and performance of their devices. This document provides the necessary
information to guide the user in production line testing for CC33xx. The device's functions
can be checked using tools and software provided by Texas Instruments. Performance
testing is more involved as external equipment is required for thorough examination.
SimpleLink CC33xx This document describes the CC33xx security related features, which are made available
Security Features to vendors through an ecosystem that incorporates simple and concise APIs, tools, and
documentation

User's Guides
CC33xx WLAN This document provides information about CC33xx family of devices and Wi-Fi® features,
Features User's as well as TI proprietary enhancements. The document does not provide the complete
Guide application programming interface (API) set, but a high-level overview of the features.
CC33xx Hardware This document describes how to integrate the CC330x into any system and the hardware
Integration requirements for this device. Layout and schematic considerations are listed here as well,
which TI highly recommends following in order to achieve the device performance listed in
this datasheet.

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7.5 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
7.6 Trademarks
SimpleLink™ is a trademark of TI.
is a trademark of Ti.
TI E2E™ is a trademark of Texas Instruments.
Bluetooth® is a registered trademark of Bluetooth Sig, Inc.
is a registered trademark of Bluetooth SIG, Inc..
All trademarks are the property of their respective owners.

ADVANCE INFORMATION
7.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

7.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
April 2024 * Initial Release

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9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
ADVANCE INFORMATION

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PACKAGE OUTLINE
RSB0040B SCALE 3.000
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

5.15
B A
4.85

PIN 1 INDEX AREA

ADVANCE INFORMATION
5.15
4.85

0.8
0.7
C

SEATING PLANE

0.05 0.08 C
0.00
2X 3.6
SYMM (0.2) TYP
EXPOSED
THERMAL PAD 11 20

10 21

SYMM 41
2X 3.6 3.5 0.1

1 30
36X 0.4
0.25
40 31 40X
PIN 1 ID 0.15
0.5 0.1 C A B
40X
0.3 0.05 C
4219094/B 09/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

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EXAMPLE BOARD LAYOUT

RSB0040B WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

( 3.5)
SYMM
40 31 SEE SOLDER MASK
40X (0.6) DETAIL

40X (0.2) 1 30
ADVANCE INFORMATION

36X (0.4)

(R0.05) TYP (0.75) TYP

41
SYMM (4.8)

( 0.2) TYP
VIA

10 21

11 20
(0.75) TYP
(4.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 20X
0.05 MIN
0.05 MAX ALL AROUND
ALL AROUND
METAL UNDER
METAL EDGE SOLDER MASK

EXPOSED METAL SOLDER MASK EXPOSED SOLDER MASK

OPENING METAL OPENING

NON SOLDER MASK

DEFINED SOLDER MASK DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4219094/B 09/2023
NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGN

RSB0040B WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

(0.375) TYP (0.75) TYP

40 31
40X (0.6)

40X (0.2) 1 30

ADVANCE INFORMATION
36X (0.4)

(0.75) TYP

(R0.05) TYP
41 (0.375) TYP
SYMM (4.8)

METAL 16X ( 0.55)

TYP

10 21

11 20
SYMM

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL
SCALE: 20X

EXPOSED PAD 41
40% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

4219094/B 09/2023

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

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