VISVESVARAYA TECHNOLOGICAL UNIVERSITY

“Jnana Sangama”, Belagavi-590018, Karnataka

An Internship Report
On

“Product and Process Quality Department”

Submitted in partial fulfillment of the requirements for the award of the degree of

Bachelor of Engineering
In
ELECTRONICS AND COMMUNICATION ENGINEERING
For the Academic Year 2023-24
Submitted By
CHANDAN GOWDA K S: 4AD20EC011

Under the Guidance of

Mrs. JUSLIN F
Assistant Professor
Dept. of ECE

13th Kilometer, Mysore – Kanakapura – Bangalore Road,

Mysore – 570 028, Karnataka
Phone: +91-821-25 93 335
 Embedded Systems and IoT

ATME College of Engineering, Mysuru

13th Kilometer, Mysuru – Kanakapura – Bangalore Road, Mysuru – 570 028

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

ENGINEERING

CERTIFICATE
Certified that the Internship work entitled “Product and Process Quality Department”
carried out by CHANDAN GOWDA K S [4AD20EC011] student of ATME College of
Engineering, Mysuru in partial fulfillment for the award of Bachelor of Engineering in
Electronics and Communication Engineering, of the Visvesvaraya Technological University,
Belagavi during the year 2023-24. It is certified that all corrections/suggestions indicated for
Internal Assessment have been incorporated in the Report deposited in the departmental
library.
The Internship report has been approved as it satisfies the academic requirements in respect
of Internship work prescribed for the said Degree.

Name & Signature Name &

Signature
Guide HOD

Internship Viva-Voce

Name of the Examiners Signature with date

1.
2.

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 DEPARTMENT VISION AND MISSION

 To develop highly skilled and globally competent professionals in the field of

Electronics and Communication Engineering to meet industrial and social
requirements with ethical responsibility.

MISSION

 To provide State-of-art technical education in Electronics and Communication at

undergraduate and post-graduate levels, to meet the needs of the profession and
society and achieve excellence in teaching- learning and research.
 To develop talented and committed human resource, by providing an opportunity for
innovation, creativity and entrepreneurial leadership with high standards of
professional ethics, transparency and accountability.
 To function collaboratively with technical Institutes/Universities/Industries, offer
opportunities for interaction among faculty-students and promote networking with
alumni, industries and other stake-holders.

Program Specific Outcomes (PSOs)

At the end of Graduation the student will be able,

 To have the capability to understand and adopt the technological advancements with
the usage of modern tool to analyze and design embedded system or processes for
variety of applications.
 To work effectively in a group as an independent visionary, team member and leader
having the ability to understand the requirement and develop feasible solutions to
emerge as potential core or electronic engineer.
 ACKNOWLEDGEMENT

We would like to express our immense gratitude to Dr. A K MURTHY,

Principal, ATMECE, Mysuru for his timely help and inspiration during the course.

We would like to express our deep gratitude to Dr. BASAVARAJU L, Professor

and Head, Department of Electronics and Communication Engineering, ATMECE,
Mysuru for his timely co-operation while carrying the Internship work. His friendliness
made us learn more.

We would like to express our sincere thanks to the Internship guides Mrs. Juslin
F, Assistant Professor, Department of Electronics and Communication Engineering,
ATMECE, Mysuru for their guidance, encouragement and suggestions that helped us a lot
in completion of the internship.

We also extend our sincere thanks to the Internship coordinator Mrs. Chethana K
S and Dr. Shalini Hanok, and all the faculty members, Department of Electronics and
Communication Engineering, ATMECE, Mysuru who have encouraged us throughout the
course.

Last but not the least, we express our heartfelt gratitude to Almighty, our parents
for their love and blessings that helped us complete the Internship work successfully
 TABLE OF CONTENTS
Chapter No. Title Page No.
Chapter 1 INTRODUCTION
1.1 About the Company 02
1.2 About the EMS 03
1.3 Objectives of the Internship 04
Chapter 2 PRODUCTION DEPARTMENT
2.1 Pcb assembly 07

2.2 Pcb assembly process

Chapter 3 PROCESS OF PCB ASSEMBLY
3.1 Bill of Materials (BoM) 08

3.2 Designing 13

3.3 Testing 15
3.4 Distribution 17
3.5 PCB Assembly

3.6 Testing 18

3.7 Packing and Shipping

CONCLUSION
References
 Embedded Systems and IoT

Chapter 1

INTRODUCTION
In this chapter introduce about the company which has collaboration with Department of
Electronics and Communication Engineering, ATME College of Engineering, Mysuru
and provided the training..

1.1 About the Company

Marconics Technologies is is a budding EMS Company founded on December 12,
2022, with two employees.
The idea of Marconics Technologies comes from the fact that the worldwide
market is a determining force in digitalization through the production of electronic
products and now accounts for almost 30-40 percent of all assemblies; wherein the real
benefits to society comes through continuous technology development in various
infrastructure and demand for newer / smarter products and services.
Marconics Technologies was started with the aim of always staying at the cutting-
edge of automation technology and thereby providing the most appropriate technology for
every automation application. Marconics Technologies is focused on becoming a leader
in the development of test and measurement and industrial automation software and
systems. We are proud of the current products and services we offer and we look forward
to contribute to future innovations in virtual instrumentation and automation technology.
Vision of the Company
"To become the best Electronics Manufacturing Services company providing
Embedded design, automation, and PCB assembly services.”
Product & Services
At Marconics Technologies, our resources are focused on innovation, quality, and
superior value for our customers. We work closely with our customers to understand their
requirements, which enable us to provide innovative solutions to meet their specific
needs. Marconics Technologies significant growth is an indication of our track record of
success upon this commitment. We have separate business divisions with dedicated focus
to offer the best possible solutions.

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These are:
· Embedded Systems Division.
· Automated Test Equipment (ATE) and Data Acquisition Division.
· Electronic Manufacturing services.
· Product design
· Iot sollution

Objectives of the Company

· One -stop shop for electronic manufacturing solutions

· Competent services at competitive prices
· Custom-made solutions and products tailor made to customer requirement
· State-of-the-art infrastructure
· Strong commitment to quality
· A dedicated R&D team to support customer
· Cost-effective global sourcing
· Short lead time and adherence to delivery datesAbout the EMS
1.2 About the EMS
Electronics manufacturing services (EMS) is a term used for companies that design,
manufacture, test, distribute, and provide return/repair services for electronic components
and assemblies for original equipment manufacturers (OEMs). The concept is also
referred to as electronics contract manufacturing (ECM). . Manufacturers can benefit
from having their electronics designed and manufactured at an established, qualified
facility that utilizes global resources available from a facility in India rather than relying
solely on in-house capabilities.
Electronic Manufacturing Services are useful in any situation involving the manufacture
of technology where either time, quality or both are essential. Providers of Electronic
Manufacturing Services in India have facilities that are entirely dedicated to product
development from the ground up. However, they can also be used to supplement existing
production runs as internal manufacturing capacities are stretched.
For instance, when a product is already designed but a large order is needed, it would be
helpful to enlist Electronic Manufacturing Services from India.

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A variety of industries such as aerospace, medical, automotive, instrumentation,

emergency response, commercial and consumer products can benefit from the
incorporation of Electronic Manufacturing Services in India into their business plan.
Many consumer electronics are built in China, due to maintenance cost, availability of
materials, quality, and speed as opposed to other countries such as the United States.
Cities such as Shenzhen have become important production centres for the Industry,
attracting many consumer and electronics companies.

Benefits of EMS
· Cost Efficiency
· Flexibility and Scalability
· Focus on Core Competencies
· Quality Assurance
1.3 Objectives of the Internship
· To provide experiential education to students
· To rapidly develop prototypes using Test, Measurement, and Control
· To generate internship and recruitment opportunities based on LabVIEW
· To hands-on with live Industrial problems
· To Train with Professional Educators
· To Train the students to carry out projects and carryout the real-time projects

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Chapter 2

PRODUCTION
The main objective of production management is to produce goods and services of the
right quality, right quantity, at the right time and at minimum cost. It also tries to improve
the efficiency.
The production department activities has been conducted under the following process,
PCBPrinted circuit board) assembly, Coil winding and Wiring harness.

2.1 PCB assembly:

Marconics is equipped with latest equipments and competent people who can make things
happen Vasantha advanced systems provides PCB Assembly to a wide range of

customers within a variety of industries, whether customer require full turn key solution
from design to despatch as a finished product or simply to supplement their
manufacturing capability. The facilities as automated assembly systems will fulfill
customer requirements. They understand the pressures and demands on companies to
respond speedily to the ever changing need of production schedules and deadlines. This is
why we give you quality products through our precision manufacturing and assembly
when promised.
2.2 PCB assembly process:

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The various stages in the PCB assembly process including adding solder paste to the
board, pick and place of the components, soldering, inspection and test. All these
processes are required, and need to be monitored to ensure that product of the highest
quality is produced. The PCB assembly process described below assumes that surface
mount components are being used as virtually all PCB assembly these days uses surface
mount technology.2.1

SMT (SURFACE MOUNT TECHNOLOGY):

Surface mount technology (SMT) is the process wherein components are mounted onto
the surface of a printed circuit board. The components are designed specifically to be
directly mounted, rather than hardwired, onto the circuit board for the vast majority of
electronics.

BAKING:
The main purpose of PCB baking is to remove the moisture contained in the PCB because
some materials used in the PCB easily to absorbed water from the external environment
itself.

Numbering :
The part number on a PCB may identify the built-up circuit board. Sometimes there are
two numbers visible—One for identifying the bare circuit board

Solder paste:
Prior to the addition of the components to a board, solder paste needs to be added to those
areas of the board where solder is required. Typically these areas are the component pads.
This is achieved using a solder screen.
The solder paste is a paste of small grains of solder mixed with flux. This can be
deposited into place in a process that is very similar to some printing processes.

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Using the solder screen, placed directly onto the board and registered in the correct
position, a runner is moved across the screen squeezing a small mount of solder paste
through the holes in the screen and onto the board. As the solder screen has been
generated from the printed circuit board files, it has holes on the positions of the solder
pads, and in this way solder is deposited only on the solder pads.
The amount of solder that is deposited must be controlled to ensure the resulting joints
have the right amount of solder.

Pick and place:

During this part of the assembly process, the board with the added solder paste is then
passed into the pick and place process. Here a machine loaded with reels of components

picks the components from the reels or other dispensers and places them onto the correct
position on the board.
The components placed onto the board are held in place by the tension of the solder paste.
This is sufficient to keep them in place provided that the board is not jolted.
In some assembly processes, the pick and place machines add small dots of glue to secure
the components to the board. However this is normally done only if the board is to be
wave soldered. The disadvantage of the process is that any repair is made far more
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difficult by the presence of the glue, although some glues are designed to degrade during
the soldering process.
The position and component information required to programme the pick and place
machine is derived from the printed circuit board design information. This enables the
pick and place programming to be considerably simplified.

Pre reflow :
SMT lines usually conduct AOI before and after reflow soldering, where the cost of
correcting defects is the lowest and the efficiency is the highest. Pre-reflow AOI: If
component faults found before the boards go to the reflow oven, the manual inspectors
will review each fault and fix the component problems.

Reflow soldering :
The main objective is to achieve maximum soldering of a large number of components
while minimizing changeover times and to result with uniform, durable, and effective
solder joints. Others include minimization of the stress and any damage to the PCB and
SMD components, and minimization of parts movement during reflow.

Reflow soldering has 3 stages

• Pre heater:- Preheat ensures the board is evenly heated to a temperature to avoid
damage to the PCB or components.
• Soaking :- The thermal soak zone allows for the removal of volatiles within the solder
paste and activation of the flux.
• Reflow:- soldering is done.

Pin Through Hole (PTH)

Through-hole technology is the mounting process by which component leads are placed
into the drilled hole of a bare printed circuit board and soldered to the pads on the
opposite side. This can be achieved with either manual assembly or automated insertion
mount machines.

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• Paper tape :- Paper tape is widely used for color separation and painting made by hand
or by spray, furniture making, automobile, and aircraft painting, appliance
manufacturing, decorative glass making, powder coating, plating, and sandblasting.

• Rayon tape :- A few of Rayon adhesive tapes applications include : core insulation in
relay transformer solenoid coils, to hold down wire-leads in corrosive environments, for
coil winding, and holding wires in motors.

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• Kapton tape:- Kapton tape is also used all across electrical work, primarily as
insulation. This includes capacitor and transformer insulation, coil insulation, and
magnetic wire insulation.

Forming:
• The basic form of PCB comprises a laminate board whose core material is epoxy resin
and glass fiber that are also called substrate material. Laminate serves as an ideal body
for receiving the copper that structures the PCB.

Stuffing:
It is the rigid board made of FR-4 material onto which the components are “stuffed” or
soldered. This provides the rigidity to PCB. Printed circuit board assembly, also known
as stuffing

Wave soldering:-

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Wave soldering is a bulk soldering process that enables one to manufacture many circuit

boards in a very short amount of time. It works by passing each circuit board over a pan
of molten solder. A pump in the pan creates a “wave” of solder that washes over the
board, soldering the components to the board.
Soldering:

Once the components have been added to the board, the next stage of the assembly,
production process is to pass it through the soldering machine.
Although some boards may be passed through a wave soldering machine, this process is
not widely used for surface mount components these days. If wave soldering is used, then
solder paste is not added to the board as the solder is provided by the wave soldering
machine. Rather than using wave soldering, reflow soldering techniques are used more
widely.
Inspection:

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After the boards have been passed through the soldering process they are often inspected.

Manual inspection is not an option for surface mount boards employing a hundred or
more components. Instead automatic optical inspection is a far more viable solution.
Machines are available that are able to inspect boards and detect poor joints, misplaced
components, and under some instances the wrong component.

Test:It is necessary to test electronic products before they leave the factory. There are
several ways in which they may be tested. Further views of test strategies and methods
may be found on the "Test and Measurement" section of this website.
Feedback:
To ensure that the manufacturing process is running satisfactorily, it is necessary to
monitor the outputs. This is achieved by investigating any failures that are detected. The
ideal place is at the optical inspection stage as this generally occurs immediately after the
soldering stage. This means that process defects can be detected quickly and rectified
before too many boards are built with the same problem

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Coil Winding:
To explore the business potentials that exist for coils in the various applications like
Automotive, Pneumatics, Textiles, Telecommunication applications and variety of
Industrials needs Vasantha Advanced Systems has a wide focus over coil winding. They
manufacture's variety of high quality coils according to the customer needs and
satisfaction. Automatic coil winding machines and latest test equipments are used for
winding and testing of coils. They are having enough experience in indigenization of
coils.
· Adequate experience in indigenization of coils
· The latest testing equipments
· Capability to manufacture different types of coils like Solenoid coils,
Current transformers, Miniature coils, Ferrite transformer, Drum cores etc.

Wiring Harness:
Wiring harness has a well-established setup for manufacturing highly reliable wiring
harness based on customer requirements. Currently they manufacture wire harnesses for a
variety of industries including Automobiles, Compressors, Railways and Simulators.

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They are making different type of wiring harness / wiring kit as per the customer
Requirements for Screw Compressor, Car Driving Simulator, Gas Analyzer & Smoke

Meters, Ground

Power Supply for aircraft, Fuel Dispensing and many more.

· In house capability for processing different types of wiring harness
· Supply to engineering industries with high reliability
· Designing of test jigs and fixtures to test wiring harness

Chapter 3

PROCESS OF EMS

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3.1 Bill of Materials (BoM)

First, let’s understand about the bill of materials, or BOM. It is one section of the
product's technical documentation. It is a compiled information source with a list of every
component needed to create one unit of a finished product. Every manufacturing process's
final result, like the assembly of electronics, uses a certain combination of materials.

In the electronic manufacturing process — the first step includes the process of
determining an electronic bill of materials (BoM). It is settled upon long before an
electronic design plan is ever produced. During this process, manufacturers determine
their overall costs and the types of materials they need.

3.2 Designing

After the BOM is complete, the next step includes designing. Moreover, it is necessary to

develop a manufacturing and design blueprint. Note that it's also crucial to create multiple
designs in case something goes wrong.During the design phase, every part of the material
the manufacturer will employ to construct an electrical tool or device must be measured.

Product Requirements: The first step in the design phase is to determine the product
requirements. This includes defining the target market, the intended use of the product,
and the desired features and functions.The requirements are used to guide the design
process and to ensure that the final product meets the needs and expectations of the
customer.

3.3 Testing

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A device is tested after it is produced. It helps to ensure that it performs well in a range of
circumstances before it is put into production.

Additionally, this is crucial because any design error, no matter how small, will render the
entire output useless.

Therefore, you should start by making one item, test it, and then move on to mass
production.

3.4 Distribution

Once you've completed developing and testing it, then it's time to distribute it.

Moreover, before distributing your product, make a few last-minute tests to ensure that
your clients won't receive faulty things. You can be certain that your company's or
product's reputation won't suffer by doing this.

Repairs and returns of Printed Circuit Boards (PCBs) are also a component of the
electronics manufacturing process. It is because you have to deal with damaged
electronics that you have produced and distributed.

3.5 PCB Assembly

Assembling the Surface Mount Technology (SMT) board involves a number of different
techniques (pick and place).

Using a solder screen, the printed board is initially soldered to. The component pads often
receive a coating of solder paste. The flux and small solder grains are the only ingredients
in the solder paste.

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After the solder paste has been added, the board is then sent through a pick and place
machine, which chooses the component from a dispenser and places it in the right place
on the board.

After that, a soldering machine is utilized to ensure that the components are attached
perfectly. The assembled PCB, like the PCB that was made, is put through a number of
tests and inspections before being sold.

Electronic Packaging

Now, there’s the packaging for the item. The steps are straightforward:

• Select the material based on the environment and exposure to the elements,

• Construct the enclosure,

• Secure the PCB inside,

• Connect all cables to connectors on the enclosure's surface and seal the enclosure's
interior from the exterior (if necessary) with a protective film, coat, or foam.

It is important to ensure that the device container is up to code. Though, it may seem like
a minor step, but it is essential. It is because the finished device must be able to handle
specific strains and loads.

To name a few packaging options, it includes sealed metallic, ceramic, and glass
enclosures, sheet, cast, or machined metals or alloys, molded, extruded, or injected
plastic, and plastic or resin coating.

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Enclosing a device requires testing for various requirements in order to ensure

dependability and warranty. It is commonly known that the IP certification offers a
certain degree of resistance against the intrusion of solid and liquid particles; the first
digit denotes solid particle protection and the second, liquid particle protection.

Additionally, there are optional supplementary and additional letters with very specific
use-cases.

3.6 Testing

Each assembled PCB must undergo visual examinations. Using X-ray machines, short
circuits, discontinuities, and solder flaws are routinely found. After that, the PCBs must
pass functionality testing before being made ready for use.

Once mass-market manufacture of the electronic manufacturing equipment has begun,

testing also known as quality control in manufacturing or quality assurance is required to
ensure the items' quality. Any gadget will have a sticker that lists the testing requirements
it met as proof that it did so.

Tests are typically divided into four categories: physical, electrical, analogue, and/or
digital tests. To determine if a board can resist a given quantity of heat, it is put through
physical testing (checking if the board works as intended, logic-wise).

The equipment being tested is known as the DUT (Device Under Test), EUT (Equipment
Under Test), or UUT in the industry.

If the board was a prototype, the manufacturer can only choose to send it to large-scale
fabrication or to the assembly line, where it is assembled with the required cables,
connectors, and case(s) and supplied to the customer after passing all testing.

3.7 Packing and Shipping

After testing, the products are submitted for packaging and shipment to retailers. These
are finally sold to customers.

Packaging Design and Selection: The first step in the packing and shipping workflow is
the design and selection of the packaging materials. The packaging design must protect
the electronic products from physical damage, moisture, and other environmental factors
during transportation.

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The materials used for packaging should also meet industry standards for strength,
durability, and recyclability.

Packaging Preparation: Once the packaging materials are selected, the next step is to
prepare the products for shipment. The electronic products are carefully packed, ensuring
that there is enough cushioning and protection to prevent damage during transportation.

The packaging should also be labeled and marked with the necessary information, such as
the product name, weight, and destination.

Inspection and Testing: Before shipping, the packed electronic products undergo
inspection and testing to ensure they meet the necessary quality standards.

The inspection process checks for any physical damage, defects, or other issues that may
affect the performance of the product. If any issues are found, they are addressed and
resolved before shipping.

Shipping and Logistics: The final stage in the packing and shipping workflow is the
shipment of the electronic products. The products are carefully loaded onto trucks, trains,
or ships, and transported to the destination.

The logistics of the shipment are managed by logistics specialists, who coordinate the
transportation, customs clearance, and delivery of the products.

Delivery and Follow-Up: Once the products arrive at their destination, they are delivered
to the customer or warehouse. The delivery process includes unloading and unpacking the
products, and checking them for any damage or issues.

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The follow-up process involves tracking the delivery, resolving any issues that may arise,
and ensuring that the customer is satisfied with the delivery.

CONCLUSION

Industrial training is, makes to know about the various aspects of all the departments
practically and to improve knowledge by means of comparison with the
theoretical aspects study. It is opportunity to learn.

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On the concluding part of my study, I had learned many ideas and Techniques in this
field. The people in this firm had helped many more in every way to complete my
training. In this firm the relationship between the Management and labor is cordial. I
learned a practical knowledge about the functions of the various departments of electronic
manufacturing services.
The whole training period was very interesting, instructive and challenging.
Through this training I can able to gain new insights and more comprehensive
understanding about the real industry

REFERENCES
• [email protected]
• https://www.google.com/url?
sa=t&rct=j&q=&esrc=s&source=web&cd=&cad=rja&uact=8&ved=2ahUKEwixg4r9j_uEAxW
T9DgGHflHDkEQFnoECBcQAQ&url=https://marconics.in/
&usg=AOvVaw06pK0JmfNpW0GhsX20Ghb3&opi=89978449

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• Electronics Manufacturing Service A Complete Guide - Edition authored by Gerardus

Blokdyk and published by 5STARCooks (16 November 2020)

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