LPC2470

LPC2470
Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD,

USB 2.0 device/host/OTG, external memory interface
Rev. 4.2 — 15 October 2020 Product data sheet
1. General description
NXP Semiconductors designed the LPC2470 microcontroller, powered by the
ARM7TDMI-S core, to be a highly integrated microcontroller for a wide range of
applications that require advanced communications and high quality graphic displays. The
LPC2470 microcontroller is flashless. The LPC2470, with real-time debug interfaces that
include both JTAG and embedded trace, can execute both 32-bit ARM and 16-bit Thumb
instructions.
The LPC2470 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media

Access Controller (MAC), a USB full-speed device/host/OTG controller with 4 kB of
endpoint RAM, four UARTs, two Controller Area Network (CAN) channels, an SPI
interface, two Synchronous Serial Ports (SSP), three I2C interfaces, and an I2S interface.
Supporting this collection of serial communications interfaces are the following feature
components; an on-chip 4 MHz internal oscillator, 98 kB of total RAM consisting of 64 kB
of local SRAM, 16 kB SRAM for Ethernet, 16 kB SRAM for general purpose DMA, 2 kB of
battery powered SRAM, and an External Memory Controller (EMC). These features make
this device optimally suited for portable electronics and Point-of-Sale (POS) applications.
Complementing the many serial communication controllers, versatile clocking capabilities,
and memory features are various 32-bit timers, a 10-bit ADC, 10-bit DAC, two PWM units,
and up to 160 fast GPIO lines. The LPC2470 connects 64 of the GPIO pins to the
hardware based Vector Interrupt Controller (VIC), allowing the external inputs to generate
edge-triggered interrupts. All of these features make the LPC2470 particularly suitable for
industrial control and medical systems.
2. Features and benefits

 ARM7TDMI-S processor, running at up to 72 MHz.
 98 kB on-chip SRAM includes:
 64 kB of SRAM on the ARM local bus for high performance CPU access.
 16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
 16 kB SRAM for general purpose DMA use also accessible by the USB.
 2 kB SRAM data storage powered from the Real-Time Clock (RTC) power domain.
 LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film
Transistors (TFT) displays.
 Dedicated DMA controller.
 Selectable display resolution (up to 1024  768 pixels).
 Supports up to 24-bit true-color mode.
 Dual Advanced High-performance Bus (AHB) system allows simultaneous Ethernet
DMA, and USB DMA with no contention.
NXP Semiconductors LPC2470
Flashless 16-bit/32-bit microcontroller
 EMC provides support for asynchronous static memory devices such as RAM, ROM
and flash, as well as dynamic memories such as single data rate SDRAM.
 Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.
 General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP,
I2S-bus, and Secure Digital/MultiMediaCard (SD/MMC) interface as well as for
memory-to-memory transfers.
 Serial Interfaces:
 Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB.
 USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and
associated DMA controller.
 Four UARTs with fractional baud rate generation, one with modem control I/O, one
with IrDA support, all with FIFO.
 CAN controller with two channels.
 SPI controller.
 Two SSP controllers, with FIFO and multi-protocol capabilities. One is an alternate
for the SPI port, sharing its interrupt. SSPs can be used with the GPDMA controller.
 Three I2C-bus interfaces (one with open-drain and two with standard port pins).
 I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
 Other peripherals:
 SD/MMC memory card interface.
 160 General purpose I/O pins with configurable pull-up/down resistors.
 10-bit ADC with input multiplexing among 8 pins.
 10-bit DAC.
 Four general purpose timers/counters with 8 capture inputs and 10 compare
outputs. Each timer block has an external count input.
 Two PWM/timer blocks with support for three-phase motor control. Each PWM has
an external count inputs.
 RTC with separate power domain. Clock source can be the RTC oscillator or the
APB clock.
 2 kB SRAM powered from the RTC power pin, allowing data to be stored when the
rest of the chip is powered off.
 WatchDog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
 Single 3.3 V power supply (3.0 V to 3.6 V).
 4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as
the system clock.
 Four reduced power modes: idle, sleep, power-down, and deep power-down.
 Four external interrupt inputs configurable as edge/level sensitive. All pins on port 0
and port 2 can be used as edge sensitive interrupt sources.
 Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt, CAN bus activity, port 0/2 pin interrupt).
 Two independent power domains allow fine tuning of power consumption based on
needed features.
LPC2470 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product data sheet Rev. 4.2 — 15 October 2020 2 of 91

 Each peripheral has its own clock divider for further power saving. These dividers help
reduce active power by 20 % to 30 %.
 Brownout detect with separate thresholds for interrupt and forced reset.
 On-chip power-on reset.
 On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.
 On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
 Boundary scan for simplified board testing.
 Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
 Standard ARM test/debug interface for compatibility with existing tools.
 Emulation trace module supports real-time trace.
3. Applications
 Industrial control
 Medical systems
 Portable electronics
 Point-of-Sale (POS) equipment
4. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC2470FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; SOT950-1
body 15  15  0.7 mm
4.1 Ordering options

Table 2. Ordering options
Type number Flash SRAM (kB) External bus Ethernet USB SD/ GP Temp range
(kB) OTG/ MMC DMA
Ethernet buffer
CAN channels
ADC channels
DAC channels
OHCI/
device
Local bus
+ 4 kB
GP/USB
FIFO
Total
RTC
LPC2470FBD208 n/a 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 C to

+85 C
LPC2470FET208 n/a 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 C to
+85 C

5. Block diagram
XTAL1
TMS TDI trace signals XTAL2 VDD(3V3)
VDDA
TRST TCK TDO RESET
EXTIN0 DBGEN
VREF
LPC2470 SYSTEM
P0, P1, P2, 64 kB PLL VSSA, VSSCORE, VSSIO
TRACE MODULE
TEST/DEBUG FUNCTIONS
P3, P4 VDD(DCDC)(3V3)
EMULATION
SRAM INTERFACE
system INTERNAL RC
HIGH-SPEED clock
INTERNAL OSCILLATOR
GPIO ARM7TDMI-S
160 PINS SRAM
TOTAL CONTROLLER
EXTERNAL D[31:0]
16 kB
VIC MEMORY A[23:0]
SRAM
CONTROLLER control lines
AHB2 AHB1
AHB AHB
BRIDGE BRIDGE
16 kB USB DEVICE/ VBUS

MASTER AHB TO SLAVE
ETHERNET SRAM HOST/OTG WITH port1
MII/RMII PORT AHB BRIDGE PORT
MAC WITH 4 kB RAM AND DMA port2
DMA
AHB TO
APB BRIDGE GP DMA
CONTROLLER
EINT3 to EINT0 8 × LCD control

EXTERNAL INTERRUPTS LCD INTERFACE
P0, P2 LCDVD[23:0]
WITH DMA LCDCLKIN
2 × CAP0/CAP1/ CAPTURE/COMPARE
CAP2/CAP3 TIMER0/TIMER1/
4 × MAT2/MAT3, TIMER2/TIMER3
2 × MAT0, 3 × I2SRX
I2S INTERFACE 3 × I2STX
3 × MAT1
6 × PWM0/PWM1
PWM0, PWM1 SCK, SCK0
1 × PCAP0, MOSI, MOSI0
2 × PCAP1 SPI, SSP0 INTERFACE MISO, MISO0
SSEL, SSEL0
LEGACY GPI/O
P0, P1
64 PINS TOTAL SCK1
MOSI1
SSP1 INTERFACE
MISO1
8 × AD0 A/D CONVERTER SSEL1
MCICLK, MCIPWR
D/A CONVERTER SD/MMC CARD
AOUT MCICMD,
INTERFACE
MCIDAT[3:0]
VBAT 2 kB BATTERY RAM TXD0, TXD2, TXD3
UART0, UART2, UART3 RXD0, RXD2, RXD3
power domain 2
RTCX1 REAL-
RTC TXD1, DTR1, RTS1
RTCX2 TIME UART1
OSCILLATOR RXD1, DSR1, CTS1,
CLOCK
DCD1, RI1
ALARM
RD1, RD2
CAN1, CAN2
WATCHDOG TIMER TD1, TD2
SCL0, SCL1, SCL2

I2C0, I2C1, I2C2 SDA0, SDA1, SDA2
SYSTEM CONTROL
002aad317
Fig 1. LPC2470 block diagram

6. Pinning information
6.1 Pinning
208
157
1 156
LPC2470FBD208
52 105
104
53
002aad318
Fig 2. LPC2470 pinning LQFP208 package
ball A1
index area 2 4 6 8 10 12 14 16
1 3 5 7 9 11 13 15 17
A
B
C
D
E
F
G
H
J LPC2470FET208
K
L
M
N
P
R
T
U
002aad319
Transparent top view
Fig 3. LPC2470 pinning TFBGA208 package
Table 3. Pin allocation table

Pin Symbol Pin Symbol Pin Symbol Pin Symbol
Row A
1 P3[27]/D27/ 2 VSSIO 3 P1[0]/ENET_TXD0 4 P4[31]/CS1
CAP1[0]/PWM1[4]
5 P1[4]/ENET_TX_EN 6 P1[9]/ENET_RXD0 7 P1[14]/ENET_RX_ER 8 P1[15]/
ENET_REF_CLK/
ENET_RX_CLK
9 P1[17]/ENET_MDIO 10 P1[3]/ENET_TXD3/ 11 P4[15]/A15 12 VSSIO
MCICMD/PWM0[2]

Table 3. Pin allocation table …continued

13 P3[20]/D20/ 14 P1[11]/ENET_RXD2/ 15 P0[8]/I2STX_WS/ 16 P1[12]/ENET_RXD3/
PWM0[5]/DSR1 MCIDAT2/PWM0[6] LCDVD[16]/MISO1/ MCIDAT3/PCAP0[0]
MAT2[2]
17 P1[5]/ENET_TX_ER/ - - -
MCIPWR/PWM0[3]
Row B
1 P3[2]/D2 2 P3[10]/D10 3 P3[1]/D1 4 P3[0]/D0
5 P1[1]/ENET_TXD1 6 VSSIO 7 P4[30]/CS0 8 P4[24]/OE
9 P4[25]/WE 10 P4[29]/BLS3/MAT2[1]/ 11 P1[6]/ENET_TX_CLK/ 12 P0[4]/I2SRX_CLK/
LCDVD[7]/LCDVD[11]/ MCIDAT0/PWM0[4] LCDVD[0]/RD2/CAP2[0]
LCDVD[3]/RXD3
13 VDD(3V3) 14 P3[19]/D19/ 15 P4[14]/A14 16 P4[13]/A13
PWM0[4]/DCD1
17 P2[0]/PWM1[1]/TXD1/ - - -
TRACECLK/LCDPWR
Row C
1 P3[13]/D13 2 TDI 3 RTCK 4 P0[2]/TXD0
5 P3[9]/D9 6 P3[22]/D22/ 7 P1[8]/ENET_CRS_DV/ 8 P1[10]/ENET_RXD1
PCAP0[0]/RI1 ENET_CRS
9 VDD(3V3) 10 P3[21]/D21/ 11 P4[28]/BLS2/MAT2[0]/ 12 P0[5]/I2SRX_WS/
PWM0[6]/DTR1 LCDVD[6]/LCDVD[10]/ LCDVD[1]/TD2/CAP2[1]
LCDVD[2]/TXD3
13 P0[7]/I2STX_CLK/ 14 P0[9]/I2STX_SDA/ 15 P3[18]/D18/ 16 P4[12]/A12
LCDVD[9]/SCK1/ LCDVD[17]/MOSI1/ PWM0[3]/CTS1
MAT2[1] MAT2[3]
17 VDD(3V3) - - -
Row D
1 TRST 2 P3[28]/D28/ 3 TDO 4 P3[12]/D12
CAP1[1]/PWM1[5]
5 P3[11]/D11 6 P0[3]/RXD0 7 VDD(3V3) 8 P3[8]/D8
9 P1[2]/ENET_TXD2/ 10 P1[16]/ENET_MDC 11 VDD(DCDC)(3V3) 12 VSSCORE
MCICLK/PWM0[1]
13 P0[6]/I2SRX_SDA/ 14 P1[7]/ENET_COL/ 15 P2[2]/PWM1[3]/CTS1/ 16 P1[13]/ENET_RX_DV
LCDVD[8]/SSEL1/ MCIDAT1/PWM0[5] PIPESTAT1/LCDDCLK
MAT2[0]
17 P2[4]/PWM1[5]/ - - -
DSR1/TRACESYNC/
LCDENAB/LCDM
Row E
1 P0[26]/AD0[3]/ 2 TCK 3 TMS 4 P3[3]/D3
AOUT/RXD3
14 P2[1]/PWM1[2]/RXD1/ 15 VSSIO 16 P2[3]/PWM1[4]/DCD1/ 17 P2[6]/PCAP1[0]/RI1/
PIPESTAT0/LCDLE PIPESTAT2/LCDFP TRACEPKT1/
LCDVD[0]/LCDVD[4]
Row F
1 P0[25]/AD0[2]/ 2 P3[4]/D4 3 P3[29]/D29/ 4 DBGEN
I2SRX_SDA/TXD3 MAT1[0]/PWM1[6]


14 P4[11]/A11 15 P3[17]/D17/ 16 P2[5]/PWM1[6]/ 17 P3[16]/D16/
PWM0[2]/RXD1 DTR1/TRACEPKT0/ PWM0[1]/TXD1
LCDLP
Row G
1 P3[5]/D5 2 P0[24]/AD0[1]/ 3 VDD(3V3) 4 VDDA
I2SRX_WS/CAP3[1]
14 n.c. 15 P4[27]/BLS1 16 P2[7]/RD2/ 17 P4[10]/A10
RTS1/TRACEPKT2/
LCDVD[1]/LCDVD[5]
Row H
1 P0[23]/AD0[0]/ 2 P3[14]/D14 3 P3[30]/D30/ 4 VDD(DCDC)(3V3)
I2SRX_CLK/CAP3[0] MAT1[1]/RTS1
14 VSSIO 15 P2[8]/TD2/TXD2/ 16 P2[9]/ 17 P4[9]/A9
TRACEPKT3/ USB_CONNECT1/
LCDVD[2]/LCDVD[6] RXD2/EXTIN0/
LCDVD[3]/LCDVD[7]
Row J
1 P3[6]/D6 2 VSSA 3 P3[31]/D31/MAT1[2] 4 n.c.
14 P0[16]/RXD1/ 15 P4[23]/A23/ 16 P0[15]/TXD1/ 17 P4[8]/A8
SSEL0/SSEL RXD2/MOSI1 SCK0/SCK
Row K
1 VREF 2 RTCX1 3 RSTOUT 4 VSSCORE
14 P4[22]/A22/ 15 P0[18]/DCD1/ 16 VDD(3V3) 17 P0[17]/CTS1/
TXD2/MISO1 MOSI0/MOSI MISO0/MISO
Row L
1 P3[7]/D7 2 RTCX2 3 VSSIO 4 P2[30]/DQMOUT2/
MAT3[2]/SDA2
14 n.c. 15 P4[26]/BLS0 16 P4[7]/A7 17 P0[19]/DSR1/
MCICLK/SDA1
Row M
1 P3[15]/D15 2 RESET 3 VBAT 4 XTAL1
14 P4[6]/A6 15 P4[21]/A21/ 16 P0[21]/RI1/ 17 P0[20]/DTR1/
SCL2/SSEL1 MCIPWR/RD1 MCICMD/SCL1
Row N
1 ALARM 2 P2[31]/DQMOUT3/ 3 P2[29]/DQMOUT1 4 XTAL2
MAT3[3]/SCL2
14 P2[12]/EINT2/ 15 P2[10]/EINT0 16 VSSIO 17 P0[22]/RTS1/
LCDVD[4]/LCDVD[3]/ MCIDAT0/TD1
LCDVD[8]/LCDVD[18]/
MCIDAT2/I2STX_WS
Row P
1 P1[31]/USB_OVRCR2/ 2 P1[30]/USB_PWRD2/ 3 P2[27]/CKEOUT3/ 4 P2[28]/DQMOUT0
SCK1/AD0[5] VBUS/AD0[4] MAT3[1]/MOSI0
5 P2[24]/CKEOUT0 6 VDD(3V3) 7 P1[18]/USB_UP_LED1/ 8 VDD(3V3)
PWM1[1]/CAP1[0]


9 P1[23]/USB_RX_DP1/ 10 VSSCORE 11 VDD(DCDC)(3V3) 12 VSSIO
LCDVD[9]/LCDVD[13]/
PWM1[4]/MISO0
13 P2[15]/CS3/ 14 P4[17]/A17 15 P4[18]/A18 16 P4[19]/A19
CAP2[1]/SCL1
17 VDD(3V3) - - -
Row R
1 P0[12]/USB_PPWR2/ 2 P0[13]/USB_UP_LED2/ 3 P0[28]/SCL0 4 P2[25]/CKEOUT1
MISO1/AD0[6] MOSI1/AD0[7]
5 P3[24]/D24/ 6 P0[30]/USB_D1 7 P2[19]/CLKOUT1 8 P1[21]/USB_TX_DM1/
CAP0[1]/PWM1[1] LCDVD[7]/LCDVD[11]/
PWM1[3]/SSEL0
9 VSSIO 10 P1[26]/USB_SSPND1/ 11 P2[16]/CAS 12 P2[14]/CS2/CAP2[0]/
LCDVD[12]/LCDVD[20]/ SDA1
PWM1[6]/CAP0[0]
13 P2[17]/RAS 14 P0[11]/RXD2/SCL2/ 15 P4[4]/A4 16 P4[5]/A5
MAT3[1]
17 P4[20]/A20/SDA2/SCK1 - - -
Row T
1 P0[27]/SDA0 2 P0[31]/USB_D+2 3 P3[26]/D26/ 4 P2[26]/CKEOUT2/
MAT0[1]/PWM1[3] MAT3[0]/MISO0
5 VSSIO 6 P3[23]/D23/ 7 P0[14]/USB_HSTEN2/ 8 P2[20]/DYCS0
CAP0[0]/PCAP1[0] USB_CONNECT2/
SSEL1
9 P1[24]/USB_RX_DM1/ 10 P1[25]/USB_LS1/ 11 P4[2]/A2 12 P1[27]/USB_INT1/
LCDVD[10]/LCDVD[14]/ LCDVD[11]/LCDVD[15]/ LCDVD[13]/LCDVD[21]/
PWM1[5]/MOSI0 USB_HSTEN1/MAT1[1] USB_OVRCR1/CAP0[1]
13 P1[28]/USB_SCL1/ 14 P0[1]/TD1/RXD3/SCL1 15 P0[10]/TXD2/SDA2/ 16 P2[13]/EINT3/
LCDVD[14]/LCDVD[22]/ MAT3[0] LCDVD[5]/LCDVD[9]/
PCAP1[0]/MAT0[0] LCDVD[19]/MCIDAT3/
I2STX_SDA
17 P2[11]/EINT1/ - - -
LCDCLKIN/
MCIDAT1/I2STX_CLK
Row U
1 USB_D2 2 P3[25]/D25/ 3 P2[18]/CLKOUT0 4 P0[29]/USB_D+1
MAT0[0]/PWM1[2]
5 P2[23]/DYCS3/ 6 P1[19]/USB_TX_E1/ 7 P1[20]/USB_TX_DP1/ 8 P1[22]/USB_RCV1/
CAP3[1]/SSEL0 USB_PPWR1/CAP1[1] LCDVD[6]/LCDVD[10]/ LCDVD[8]/LCDVD[12]/
PWM1[2]/SCK0 USB_PWRD1/MAT1[0]
9 P4[0]/A0 10 P4[1]/A1 11 P2[21]/DYCS1 12 P2[22]/DYCS2/
CAP3[0]/SCK0
13 VDD(3V3) 14 P1[29]/USB_SDA1/ 15 P0[0]/RD1/TXD3/SDA1 16 P4[3]/A3
LCDVD[15]/LCDVD[23]/
PCAP1[1]/MAT0[1]
17 P4[16]/A16 - - -

6.2 Pin description

Table 4. Pin description
Symbol Pin Ball Type Description
P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each
bit. The operation of port 0 pins depends upon the pin function selected
via the pin connect block.
P0[0]/RD1/TXD3/ 94[1] U15[1] I/O P0[0] — General purpose digital input/output pin.
SDA1 I RD1 — CAN1 receiver input.
O TXD3 — Transmitter output for UART3.
I/O SDA1 — I2C1 data input/output (this is not an open-drain pin).
P0[1]/TD1/RXD3/ 96[1] T14[1] I/O P0[1] — General purpose digital input/output pin.
SCL1 O TD1 — CAN1 transmitter output.
I RXD3 — Receiver input for UART3.
I/O SCL1 — I2C1 clock input/output (this is not an open-drain pin).
P0[2]/TXD0 202[1] C4[1] I/O P0[2] — General purpose digital input/output pin.
P0[3]/RXD0 204[1] D6[1] I/O P0[3] — General purpose digital input/output pin.
P0[4]/I2SRX_CLK/ 168[1] B12[1] I/O P0[4] — General purpose digital input/output pin.
LCDVD[0]/RD2/ I/O I2SRX_CLK — I2S Receive clock. It is driven by the master and received
CAP2[0] by the slave. Corresponds to the signal SCK in the I2S-bus
specification.[2]
O LCDVD[0] — LCD data.[2]
I RD2 — CAN2 receiver input.
I CAP2[0] — Capture input for Timer 2, channel 0.
P0[5]/I2SRX_WS/ 166[1] C12[1] I/O P0[5] — General purpose digital input/output pin.
LCDVD[1]/TD2/ I/O I2SRX_WS — I2S Receive word select. It is driven by the master and
CAP2[1] received by the slave. Corresponds to the signal WS in the I2S-bus
specification.[2]
O TD2 — CAN2 transmitter output.
P0[6]/I2SRX_SDA/ 164[1] D13[1] I/O P0[6] — General purpose digital input/output pin.
LCDVD[8]/ I/O I2SRX_SDA — I2S Receive data. It is driven by the transmitter and read
SSEL1/MAT2[0] by the receiver. Corresponds to the signal SD in the I2S-bus
specification.[2]
I/O SSEL1 — Slave Select for SSP1.
O MAT2[0] — Match output for Timer 2, channel 0.

Table 4. Pin description …continued

P0[7]/I2STX_CLK/ 162[1] C13[1] I/O P0[7] — General purpose digital input/output pin.
LCDVD[9]/SCK1/ I/O I2STX_CLK — I2S transmit clock. It is driven by the master and received
MAT2[1] by the slave. Corresponds to the signal SCK in the I2S-bus
specification.[2]
I/O SCK1 — Serial Clock for SSP1.
P0[8]/I2STX_WS/ 160[1] A15[1] I/O P0[8] — General purpose digital input/output pin.
LCDVD[16]/ I/O I2STX_WS — I2S Transmit word select. It is driven by the master and
MISO1/MAT2[2] received by the slave. Corresponds to the signal WS in the I2S-bus
specification.[2]
I/O MISO1 — Master In Slave Out for SSP1.
P0[9]/I2STX_SDA/ 158[1] C14[1] I/O P0[9] — General purpose digital input/output pin.
LCDVD[17]/ I/O I2STX_SDA — I2S transmit data. It is driven by the transmitter and read
MOSI1/MAT2[3] by the receiver. Corresponds to the signal SD in the I2S-bus
specification.[2]
I/O MOSI1 — Master Out Slave In for SSP1.
P0[10]/TXD2/ 98[1] T15[1] I/O P0[10] — General purpose digital input/output pin.
SDA2/MAT3[0] O TXD2 — Transmitter output for UART2.
P0[11]/RXD2/ 100[1] R14[1] I/O P0[11] — General purpose digital input/output pin.
SCL2/MAT3[1] I RXD2 — Receiver input for UART2.
P0[12]/ 41[3] R1[3] I/O P0[12] — General purpose digital input/output pin.
USB_PPWR2/ O USB_PPWR2 — Port Power enable signal for USB port 2.
MISO1/AD0[6]
I AD0[6] — A/D converter 0, input 6.
USB_UP_LED2/ O USB_UP_LED2 — USB port 2 GoodLink LED indicator. It is LOW when
MOSI1/AD0[7] device is configured (non-control endpoints enabled), or when host is
enabled and has detected a device on the bus. It is HIGH when the
device is not configured, or when host is enabled and has not detected a
device on the bus, or during global suspend. It transitions between LOW
and HIGH (flashes) when host is enabled and detects activity on the bus.


P0[14]/ 69[1] T7[1] I/O P0[14] — General purpose digital input/output pin.
USB_HSTEN2/ O USB_HSTEN2 — Host Enabled status for USB port 2.
USB_CONNECT2/
SSEL1 O USB_CONNECT2 — SoftConnect control for USB port 2. Signal used to
switch an external 1.5 k resistor under software control. Used with the
SoftConnect USB feature.
P0[15]/TXD1/ 128[1] J16[1] I/O P0[15] — General purpose digital input/output pin.
SCK0/SCK O TXD1 — Transmitter output for UART1.
I/O SCK0 — Serial clock for SSP0.
I/O SCK — Serial clock for SPI.
P0[16]/RXD1/ 130[1] J14[1] I/O P0[16] — General purpose digital input/output pin.
SSEL0/SSEL I RXD1 — Receiver input for UART1.
I/O SSEL — Slave Select for SPI.
P0[17]/CTS1/ 126[1] K17[1] I/O P0[17] — General purpose digital input/output pin.
MISO0/MISO I CTS1 — Clear to Send input for UART1.
I/O MISO — Master In Slave Out for SPI.
P0[18]/DCD1/ 124[1] K15[1] I/O P0[18] — General purpose digital input/output pin.
MOSI0/MOSI I DCD1 — Data Carrier Detect input for UART1.
I/O MOSI — Master Out Slave In for SPI.
P0[19]/DSR1/ 122[1] L17[1] I/O P0[19] — General purpose digital input/output pin.
MCICLK/SDA1 I DSR1 — Data Set Ready input for UART1.
O MCICLK — Clock output line for SD/MMC interface.
P0[20]/DTR1/ 120[1] M17[1] I/O P0[20] — General purpose digital input/output pin.
MCICMD/SCL1 O DTR1 — Data Terminal Ready output for UART1.
I/O MCICMD — Command line for SD/MMC interface.
P0[21]/RI1/ 118[1] M16[1] I/O P0[21] — General purpose digital input/output pin.
MCIPWR/RD1 I RI1 — Ring Indicator input for UART1.
O MCIPWR — Power Supply Enable for external SD/MMC power supply.
I RD1 — CAN1 receiver input.
P0[22]/RTS1/ 116[1] N17[1] I/O P0[22] — General purpose digital input/output pin.
MCIDAT0/TD1 O RTS1 — Request to Send output for UART1.
I/O MCIDAT0 — Data line 0 for SD/MMC interface.
O TD1 — CAN1 transmitter output.


P0[23]/AD0[0]/ 18[3] H1[3] I/O P0[23] — General purpose digital input/output pin.
I2SRX_CLK/ I AD0[0] — A/D converter 0, input 0.
CAP3[0]
I/O I2SRX_CLK — Receive Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
P0[24]/AD0[1]/ 16[3] G2[3] I/O P0[24] — General purpose digital input/output pin.
I2SRX_WS/ I AD0[1] — A/D converter 0, input 1.
CAP3[1]
I/O I2SRX_WS — Receive Word Select. It is driven by the master and
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
P0[25]/AD0[2]/ 14[3] F1[3] I/O P0[25] — General purpose digital input/output pin.
I2SRX_SDA/ I AD0[2] — A/D converter 0, input 2.
TXD3
I/O I2SRX_SDA — Receive data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.
P0[26]/AD0[3]/ 12[3][4] E1[3][4] I/O P0[26] — General purpose digital input/output pin.
AOUT/RXD3 I AD0[3] — A/D converter 0, input 3.
O AOUT — D/A converter output.
P0[27]/SDA0 50[5] T1[5] I/O P0[27] — General purpose digital input/output pin.
I/O SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus
compliance).
P0[28]/SCL0 48[5] R3[5] I/O P0[28] — General purpose digital input/output pin.
I/O SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus
compliance).
P0[29]/USB_D+1 61[6] U4[6] I/O P0[29] — General purpose digital input/output pin.
I/O USB_D+1 — USB port 1 bidirectional D+ line.
P0[30]/USB_D1 62[6] R6[6] I/O P0[30] — General purpose digital input/output pin.
I/O USB_D1 — USB port 1 bidirectional D line.
P0[31]/USB_D+2 51[6] T2[6] I/O P0[31] — General purpose digital input/output pin.
I/O USB_D+2 — USB port 2 bidirectional D+ line.
P1[0] to P1[31] I/O Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each
P1[0]/ 196[1] A3[1] I/O P1[0] — General purpose digital input/output pin.
ENET_TXD0 O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface).
P1[1]/ 194[1] B5[1] I/O P1[1] — General purpose digital input/output pin.
ENET_TXD1 O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface).
P1[2]/ 185[1] D9[1] I/O P1[2] — General purpose digital input/output pin.
ENET_TXD2/ O ENET_TXD2 — Ethernet transmit data 2 (MII interface).
MCICLK/
PWM0[1] O MCICLK — Clock output line for SD/MMC interface.
O PWM0[1] — Pulse Width Modulator 0, output 1.


ENET_TXD3/ O ENET_TXD3 — Ethernet transmit data 3 (MII interface).
MCICMD/
PWM0[2] I/O MCICMD — Command line for SD/MMC interface.
ENET_TX_EN O ENET_TX_EN — Ethernet transmit data enable (RMII/MII interface).
ENET_TX_ER/ O ENET_TX_ER — Ethernet Transmit Error (MII interface).
MCIPWR/
PWM0[3] O MCIPWR — Power Supply Enable for external SD/MMC power supply.
P1[6]/ 171[1] B11[1] I/O P1[6] — General purpose digital input/output pin.
ENET_TX_CLK/ I ENET_TX_CLK — Ethernet Transmit Clock (MII interface).
MCIDAT0/
PWM0[4] I/O MCIDAT0 — Data line 0 for SD/MMC interface.
ENET_COL/ I ENET_COL — Ethernet Collision detect (MII interface).
MCIDAT1/
P1[8]/ 190[1] C7[1] I/O P1[8] — General purpose digital input/output pin.
ENET_CRS_DV/ I ENET_CRS_DV/ENET_CRS — Ethernet Carrier Sense/Data Valid (RMII
ENET_CRS interface)/ Ethernet Carrier Sense (MII interface).
ENET_RXD0 I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface).
P1[10]/ 186[1] C8[1] I/O P1[10] — General purpose digital input/output pin.
ENET_RXD1 I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface).
ENET_RXD2/ I ENET_RXD2 — Ethernet Receive Data 2 (MII interface).
MCIDAT2/
ENET_RXD3/ I ENET_RXD3 — Ethernet Receive Data (MII interface).
MCIDAT3/
PCAP0[0] I/O MCIDAT3 — Data line 3 for SD/MMC interface.
I PCAP0[0] — Capture input for PWM0, channel 0.
ENET_RX_DV I ENET_RX_DV — Ethernet Receive Data Valid (MII interface).
ENET_RX_ER I ENET_RX_ER — Ethernet receive error (RMII/MII interface).
ENET_REF_CLK/ I ENET_REF_CLK/ENET_RX_CLK — Ethernet Reference Clock (RMII
ENET_RX_CLK interface)/ Ethernet Receive Clock (MII interface).


ENET_MDC O ENET_MDC — Ethernet MIIM clock.
ENET_MDIO I/O ENET_MDIO — Ethernet MIIM data input and output.
P1[18]/ 66[1] P7[1] I/O P1[18] — General purpose digital input/output pin.
USB_UP_LED1/ O USB_UP_LED1 — USB port 1 GoodLink LED indicator. It is LOW when
PWM1[1]/CAP1[0] device is configured (non-control endpoints enabled), or when host is
enabled and has detected a device on the bus. It is HIGH when the
device is not configured, or when host is enabled and has not detected a
device on the bus, or during global suspend. It transitions between LOW
and HIGH (flashes) when host is enabled and detects activity on the bus.
O PWM1[1] — Pulse Width Modulator 1, channel 1 output.
P1[19]/ 68[1] U6[1] I/O P1[19] — General purpose digital input/output pin.
USB_TX_E1/ O USB_TX_E1 — Transmit Enable signal for USB port 1 (OTG
USB_PPWR1/ transceiver).
CAP1[1]
O USB_PPWR1 — Port Power enable signal for USB port 1.
USB_TX_DP1/ O USB_TX_DP1 — D+ transmit data for USB port 1 (OTG transceiver).[7]
LCDVD[6]/
LCDVD[10]/ O LCDVD[6]/LCDVD[10] — LCD data.[7]
PWM1[2]/SCK0 O PWM1[2] — Pulse Width Modulator 1, channel 2 output.
USB_TX_DM1/ O USB_TX_DM1 — D transmit data for USB port 1 (OTG transceiver).[7]
LCDVD[7]/
PWM1[3]/SSEL0 O PWM1[3] — Pulse Width Modulator 1, channel 3 output.
P1[22]/USB_RCV1/ 74[1] U8[1] I/O P1[22] — General purpose digital input/output pin.
LCDVD[8]/ I USB_RCV1 — Differential receive data for USB port 1 (OTG
LCDVD[12]/ transceiver).[7]
USB_PWRD1/
MAT1[0] O LCDVD[8]/LCDVD[12] — LCD data.[7]
I USB_PWRD1 — Power Status for USB port 1 (host power switch).
USB_RX_DP1/ I USB_RX_DP1 — D+ receive data for USB port 1 (OTG transceiver).[7]
LCDVD[9]/
PWM1[4]/MISO0 O PWM1[4] — Pulse Width Modulator 1, channel 4 output.


USB_RX_DM1/ I USB_RX_DM1 — D receive data for USB port 1 (OTG transceiver).[7]
LCDVD[10]/
PWM1[5]/MOSI0 O PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I/O MOSI0 — Master Out Slave in for SSP0.
P1[25]/USB_LS1/ 80[1] T10[1] I/O P1[25] — General purpose digital input/output pin.
LCDVD[11]/ O USB_LS1 — Low Speed status for USB port 1 (OTG transceiver).[7]
LCDVD[15]/
USB_HSTEN1/ O LCDVD[11]/LCDVD[15] — LCD data.[7]
MAT1[1] O USB_HSTEN1 — Host Enabled status for USB port 1.
USB_SSPND1/ O USB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver).[7]
LCDVD[12]/
PWM1[6]/CAP0[0] O PWM1[6] — Pulse Width Modulator 1, channel 6 output.
P1[27]/USB_INT1/ 88[1] T12[1] I/O P1[27] — General purpose digital input/output pin.
LCDVD[13]/ I USB_INT1 — USB port 1 OTG transceiver interrupt (OTG transceiver).[7]
LCDVD[21]/
USB_OVRCR1/ O LCDVD[13]/LCDVD[21] — LCD data.[7]
CAP0[1] I USB_OVRCR1 — USB port 1 Over-Current status.
P1[28]/USB_SCL1/ 90[1] T13[1] I/O P1[28] — General purpose digital input/output pin.
LCDVD[14]/ I/O USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver).[7]
LCDVD[22]/
PCAP1[0]/MAT0[0] O LCDVD[14]/LCDVD[22] — LCD data.[7]
P1[29]/USB_SDA1/ 92[1] U14[1] I/O P1[29] — General purpose digital input/output pin.
LCDVD[15]/ I/O USB_SDA1 — USB port 1 I2C serial data (OTG transceiver).[7]
LCDVD[23]/
PCAP1[1]/MAT0[1] O LCDVD[15]/LCDVD[23] — LCD data.[7]
USB_PWRD2/ I USB_PWRD2 — Power Status for USB port 2.
VBUS/AD0[4]
I VBUS — Monitors the presence of USB bus power.
Note: This signal must be HIGH for USB reset to occur.
USB_OVRCR2/ I USB_OVRCR2 — Over-Current status for USB port 2.
SCK1/AD0[5]


P2[0]/PWM1[1]/ 154[1] B17[1] I/O P2[0] — General purpose digital input/output pin.
TXD1/TRACECLK/ O PWM1[1] — Pulse Width Modulator 1, channel 1 output.
LCDPWR
O TRACECLK — Trace clock.[8]
O LCDPWR — LCD panel power enable.[8]
P2[1]/PWM1[2]/ 152[1] E14[1] I/O P2[1] — General purpose digital input/output pin.
RXD1/PIPESTAT0/ O PWM1[2] — Pulse Width Modulator 1, channel 2 output.
LCDLE
O PIPESTAT0 — Pipeline status, bit 0.[8]
O LCDLE — Line end signal.[8]
P2[2]/PWM1[3]/ 150[1] D15[1] I/O P2[2] — General purpose digital input/output pin.
CTS1/PIPESTAT1/ O PWM1[3] — Pulse Width Modulator 1, channel 3 output.
LCDDCLK
I CTS1 — Clear to Send input for UART1.
O LCDDCLK — LCD panel clock.[8]
P2[3]/PWM1[4]/ 144[1] E16[1] I/O P2[3] — General purpose digital input/output pin.
DCD1/PIPESTAT2/ O PWM1[4] — Pulse Width Modulator 1, channel 4 output.
LCDFP
I DCD1 — Data Carrier Detect input for UART1.
O LCDFP — Frame pulse (STN). Vertical synchronization pulse (TFT).[8]
P2[4]/PWM1[5]/ 142[1] D17[1] I/O P2[4] — General purpose digital input/output pin.
DSR1/ O PWM1[5] — Pulse Width Modulator 1, channel 5 output.
TRACESYNC/
LCDENAB/LCDM I DSR1 — Data Set Ready input for UART1.
O TRACESYNC — Trace Synchronization.[8]
O LCDENAB/LCDM — STN AC bias drive or TFT data enable output.[8]
P2[5]/PWM1[6]/ 140[1] F16[1] I/O P2[5] — General purpose digital input/output pin.
DTR1/ O PWM1[6] — Pulse Width Modulator 1, channel 6 output.
TRACEPKT0/
LCDLP O DTR1 — Data Terminal Ready output for UART1.
O TRACEPKT0 — Trace Packet, bit 0.[8]
O LCDLP — Line synchronization pulse (STN). Horizontal synchronization
pulse (TFT).[8]
P2[6]/PCAP1[0]/ 138[1] E17[1] I/O P2[6] — General purpose digital input/output pin.
RI1/ I PCAP1[0] — Capture input for PWM1, channel 0.
TRACEPKT1/
LCDVD[0]/ I RI1 — Ring Indicator input for UART1.
LCDVD[4] O TRACEPKT1 — Trace Packet, bit 1.[8]
O LCDVD[0]/LCDVD[4] — LCD data.[8]


P2[7]/RD2/ 136[1] G16[1] I/O P2[7] — General purpose digital input/output pin.
RTS1/ I RD2 — CAN2 receiver input.
TRACEPKT2/
LCDVD[1]/ O RTS1 — Request to Send output for UART1.
LCDVD[5] O TRACEPKT2 — Trace Packet, bit 2.[8]
P2[8]/TD2/TXD2/ 134[1] H15[1] I/O P2[8] — General purpose digital input/output pin.
TRACEPKT3/ O TD2 — CAN2 transmitter output.
LCDVD[2]/
LCDVD[6] O TXD2 — Transmitter output for UART2.
O TRACEPKT3 — Trace packet, bit 3.[8]
P2[9]/ 132[1] H16[1] I/O P2[9] — General purpose digital input/output pin.
USB_CONNECT1/ O USB_CONNECT1 — USB1 SoftConnect control. Signal used to switch
RXD2/EXTIN0/ an external 1.5 k resistor under the software control. Used with the
LCDVD[3]/ SoftConnect USB feature.
LCDVD[7]
I EXTIN0 — External Trigger Input.[8]
I LCDVD[3]/LCDVD[7] — LCD data.[8]
P2[10]/EINT0 110[9] N15[9] I/O P2[10] — General purpose digital input/output pin.
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to
take over control of the part after a reset.
I EINT0 — External interrupt 0 input.
P2[11]/EINT1/ 108[9] T17[9] I/O P2[11] — General purpose digital input/output pin.
LCDCLKIN/ I EINT1 — External interrupt 1 input.[10]
MCIDAT1/
I2STX_CLK O LCDCLKIN — LCD clock.[10]
I/O MCIDAT1 — Data line 1 for SD/MMC interface.
I/O I2STX_CLK — Transmit Clock. It is driven by the master and received by
the slave. Corresponds to the signal SCK in the I2S-bus specification.
P2[12]/EINT2/ 106[9] N14[9] I/O P2[12] — General purpose digital input/output pin.
LCDVD[4]/ I EINT2 — External interrupt 2 input.[10]
LCDVD[3]/
LCDVD[8]/ O LCDVD[4]/LCDVD[3]/LCDVD[8]/LCDVD[18] — LCD data.[10]
LCDVD[18]/ I/O MCIDAT2 — Data line 2 for SD/MMC interface.
MCIDAT2/
I/O I2STX_WS — Transmit Word Select. It is driven by the master and
I2STX_WS
received by the slave. Corresponds to the signal WS in the I2S-bus
specification.
P2[13]/EINT3/ 102[9] T16[9] I/O P2[13] — General purpose digital input/output pin.
LCDVD[5]/ I EINT3 — External interrupt 3 input.[10]
LCDVD[9]/
LCDVD[19]/ O LCDVD[5]/LCDVD[9]/LCDVD[19] — LCD data.[10]
MCIDAT3/ I/O MCIDAT3 — Data line 3 for SD/MMC interface.
I2STX_SDA
I/O I2STX_SDA — Transmit data. It is driven by the transmitter and read by
the receiver. Corresponds to the signal SD in the I2S-bus specification.


P2[14]/CS2/ 91[9] R12[9] I/O P2[14] — General purpose digital input/output pin.
CAP2[0]/SDA1 O CS2 — LOW active Chip Select 2 signal.
P2[15]/CS3/ 99[9] P13[9] I/O P2[15] — General purpose digital input/output pin.
CAP2[1]/SCL1 O CS3 — LOW active Chip Select 3 signal.
P2[16]/CAS 87[1] R11[1] I/O P2[16] — General purpose digital input/output pin.
O CAS — LOW active SDRAM Column Address Strobe.
P2[17]/RAS 95[1] R13[1] I/O P2[17] — General purpose digital input/output pin.
O RAS — LOW active SDRAM Row Address Strobe.
CLKOUT0 O CLKOUT0 — SDRAM clock 0.
CLKOUT1 O CLKOUT1 — SDRAM clock 1.
P2[20]/DYCS0 73[1] T8[1] I/O P2[20] — General purpose digital input/output pin.
O DYCS0 — SDRAM chip select 0.
P2[21]/DYCS1 81[1] U11[1] I/O P2[21] — General purpose digital input/output pin.
O DYCS1 — SDRAM chip select 1.
P2[22]/DYCS2/ 85[1] U12[1] I/O P2[22] — General purpose digital input/output pin.
CAP3[0]/SCK0 O DYCS2 — SDRAM chip select 2.
P2[23]/DYCS3/ 64[1] U5[1] I/O P2[23] — General purpose digital input/output pin.
CAP3[1]/SSEL0 O DYCS3 — SDRAM chip select 3.
CKEOUT0 O CKEOUT0 — SDRAM clock enable 0.
CKEOUT1 O CKEOUT1 — SDRAM clock enable 1.
CKEOUT2/ O CKEOUT2 — SDRAM clock enable 2.
MAT3[0]/MISO0
CKEOUT3/ O CKEOUT3 — SDRAM clock enable 3.
MAT3[1]/MOSI0


DQMOUT0 O DQMOUT0 — Data mask 0 used with SDRAM and static devices.
P2[29]/ 43[1] N3[1] I/O P2[29] — General purpose digital input/output pin.
DQMOUT1 O DQMOUT1 — Data mask 1 used with SDRAM and static devices.
P2[30]/ 31[1] L4[1] I/O P2[30] — General purpose digital input/output pin.
DQMOUT2/ O DQMOUT2 — Data mask 2 used with SDRAM and static devices.
MAT3[2]/SDA2
P2[31]/ 39[1] N2[1] I/O P2[31] — General purpose digital input/output pin.
DQMOUT3/ O DQMOUT3 — Data mask 3 used with SDRAM and static devices.
MAT3[3]/SCL2
P3[0]/D0 197[1] B4[1] I/O P3[0] — General purpose digital input/output pin.
I/O D0 — External memory data line 0.
P3[3]/D3 3[1] E4[1] I/O P3[3] — General purpose digital input/output pin.
P3[4]/D4 13[1] F2[1] I/O P3[4] — General purpose digital input/output pin.
P3[5]/D5 17[1] G1[1] I/O P3[5] — General purpose digital input/output pin.
P3[6]/D6 23[1] J1[1] I/O P3[6] — General purpose digital input/output pin.
P3[7]/D7 27[1] L1[1] I/O P3[7] — General purpose digital input/output pin.
P3[8]/D8 191[1] D8[1] I/O P3[8] — General purpose digital input/output pin.
P3[9]/D9 199[1] C5[1] I/O P3[9] — General purpose digital input/output pin.


P3[13]/D13 7[1] C1[1] I/O P3[13] — General purpose digital input/output pin.
P3[14]/D14 21[1] H2[1] I/O P3[14] — General purpose digital input/output pin.
I/O D14 — External memory data line 14. On POR, this pin serves as the
BOOT0 pin.
P3[15]/D15 28[1] M1[1] I/O P3[15] — General purpose digital input/output pin.
I/O D15 — External memory data line 15. On POR, this pin serves as the
BOOT1 pin.
BOOT[1:0] = 00 selects 8-bit external memory on CS1.
BOOT[1:0] = 01 is reserved. Do not use.
P3[16]/D16/ 137[1] F17[1] I/O P3[16] — General purpose digital input/output pin.
PWM0[1]/TXD1 I/O D16 — External memory data line 16.
PWM0[2]/RXD1 I/O D17 — External memory data line 17.
P3[18]/D18/ 151[1] C15[1] I/O P3[18] — General purpose digital input/output pin.
PWM0[3]/CTS1 I/O D18 — External memory data line 18.
I CTS1 — Clear to Send input for UART1.
P3[19]/D19/ 161[1] B14[1] I/O P3[19] — General purpose digital input/output pin.
PWM0[4]/DCD1 I/O D19 — External memory data line 19.
I DCD1 — Data Carrier Detect input for UART1.
P3[20]/D20/ 167[1] A13[1] I/O P3[20] — General purpose digital input/output pin.
PWM0[5]/DSR1 I/O D20 — External memory data line 20.
I DSR1 — Data Set Ready input for UART1.
PWM0[6]/DTR1 I/O D21 — External memory data line 21.
O DTR1 — Data Terminal Ready output for UART1.
PCAP0[0]/RI1 I/O D22 — External memory data line 22.
I RI1 — Ring Indicator input for UART1.


P3[23]/D23/ 65[1] T6[1] I/O P3[23] — General purpose digital input/output pin.
CAP0[0]/ I/O D23 — External memory data line 23.
PCAP1[0]
P3[24]/D24/ 58[1] R5[1] I/O P3[24] — General purpose digital input/output pin.
PWM1[1]
P3[25]/D25/ 56[1] U2[1] I/O P3[25] — General purpose digital input/output pin.
MAT0[0]/ I/O D25 — External memory data line 25.
PWM1[2]
P3[26]/D26/ 55[1] T3[1] I/O P3[26] — General purpose digital input/output pin.
PWM1[3]
P3[27]/D27/ 203[1] A1[1] I/O P3[27] — General purpose digital input/output pin.
PWM1[4]
P3[28]/D28/ 5[1] D2[1] I/O P3[28] — General purpose digital input/output pin.
PWM1[5]
PWM1[6]
P3[30]/D30/ 19[1] H3[1] I/O P3[30] — General purpose digital input/output pin.
RTS1
O RTS1 — Request to Send output for UART1.
P3[31]/D31/ 25[1] J3[1] I/O P3[31] — General purpose digital input/output pin.
MAT1[2] I/O D31 — External memory data line 31.
P4[0]/A0 75[1] U9[1] I/O P4[0] — ]General purpose digital input/output pin.
I/O A0 — External memory address line 0.


P4[1]/A1 79[1] U10[1] I/O P4[1] — General purpose digital input/output pin.
P4[2]/A2 83[1] T11[1] I/O P4[2] — General purpose digital input/output pin.
P4[4]/A4 103[1] R15[1] I/O P4[4] — General purpose digital input/output pin.
P4[5]/A5 107[1] R16[1] I/O P4[5] — General purpose digital input/output pin.
P4[6]/A6 113[1] M14[1] I/O P4[6] — General purpose digital input/output pin.
P4[7]/A7 121[1] L16[1] I/O P4[7] — General purpose digital input/output pin.
P4[8]/A8 127[1] J17[1] I/O P4[8] — General purpose digital input/output pin.
P4[9]/A9 131[1] H17[1] I/O P4[9] — General purpose digital input/output pin.
P4[10]/A10 135[1] G17[1] I/O P4[10] — General purpose digital input/output pin.
P4[11]/A11 145[1] F14[1] I/O P4[11] — General purpose digital input/output pin.
P4[12]/A12 149[1] C16[1] I/O P4[12] — General purpose digital input/output pin.
P4[13]/A13 155[1] B16[1] I/O P4[13] — General purpose digital input/output pin.
P4[14]/A14 159[1] B15[1] I/O P4[14] — General purpose digital input/output pin.
P4[15]/A15 173[1] A11[1] I/O P4[15] — General purpose digital input/output pin.
P4[17]/A17 104[1] P14[1] I/O P4[17] — General purpose digital input/output pin.


P4[20]/A20/ 109[1] R17[1] I/O P4[20] — General purpose digital input/output pin.
SDA2/SCK1 I/O A20 — External memory address line 20.
P4[21]/A21/ 115[1] M15[1] I/O P4[21] — General purpose digital input/output pin.
SCL2/SSEL1 I/O A21 — External memory address line 21.
P4[22]/A22/ 123[1] K14[1] I/O P4[22] — General purpose digital input/output pin.
TXD2/MISO1 I/O A22 — External memory address line 22.
P4[23]/A23/ 129[1] J15[1] I/O P4[23] — General purpose digital input/output pin.
RXD2/MOSI1 I/O A23 — External memory address line 23.
P4[24]/OE 183[1] B8[1] I/O P4[24] — General purpose digital input/output pin.
O OE — LOW active Output Enable signal.
P4[25]/WE 179[1] B9[1] I/O P4[25] — General purpose digital input/output pin.
O WE — LOW active Write Enable signal.
P4[26]/BLS0 119[1] L15[1] I/O P4[26] — General purpose digital input/output pin.
O BLS0 — LOW active Byte Lane Select signal 0.
P4[27]/BLS1 139[1] G15[1] I/O P4[27] — General purpose digital input/output pin.
O BLS1 — LOW active Byte Lane Select signal 1.
P4[28]/BLS2/ 170[1] C11[1] I/O P4[28] — General purpose digital input/output pin.
MAT2[0]/LCDVD[6]/ O BLS2 — LOW active Byte Lane Select signal 2.
LCDVD[10]/
LCDVD[2]/ O MAT2[0] — Match output for Timer 2, channel 0.[11]
TXD3 O LCDVD[6]/LCDVD[10]/LCDVD[2] — LCD data.[11]
P4[29]/BLS3/ 176[1] B10[1] I/O P4[29] — General purpose digital input/output pin.
MAT2[1] O BLS3 — LOW active Byte Lane Select signal 3.
LCDVD[7]/
LCDVD[11]/ O MAT2[1] — Match output for Timer 2, channel 1.[11]
LCDVD[3]/RXD3 O LCDVD[7]/LCDVD[11]/LCDVD[3] — LCD data.[11]
P4[30]/CS0 187[1] B7[1] I/O P4[30] — General purpose digital input/output pin.
O CS0 — LOW active Chip Select 0 signal.
P4[31]/CS1 193[1] A4[1] I/O P4[31] — General purpose digital input/output pin.
O CS1 — LOW active Chip Select 1 signal.
ALARM 37[13] N1[13] O ALARM — RTC controlled output. This is a 1.8 V pin. It goes HIGH when
a RTC alarm is generated.
USB_D2 52 U1 I/O USB_D2 — USB port 2 bidirectional D line.


DBGEN 9[1][16] F4[1][16] I DBGEN — JTAG interface control signal. Also used for boundary
scanning.
TDO 2[1][17] D3[1][17] O TDO — Test Data Out for JTAG interface.
TDI 4[1][16] C2[1][16] I TDI — Test Data In for JTAG interface.
TMS 6[1][16] E3[1][16] I TMS — Test Mode Select for JTAG interface.
TRST 8[1][16] D1[1][16] I TRST — Test Reset for JTAG interface.
TCK 10[1][17] E2[1][17] I TCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6
of the CPU clock (CCLK) for the JTAG interface to operate.
RTCK 206[1][16] C3[1][16] I/O RTCK — JTAG interface control signal.
Note: LOW on this pin while RESET is LOW enables ETM pins (P2[9:0])
to operate as Trace port after reset.
RSTOUT 29 K3 O RSTOUT — This is a 3.3 V pin. LOW on this pin indicates LPC2470
being in Reset state.
RESET 35[12] M2[12] I external reset input: A LOW on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and processor
execution to begin at address 0. TTL with hysteresis, 5 V tolerant.
XTAL1 44[13][14] M4[13][14] I Input to the oscillator circuit and internal clock generator circuits.
XTAL2 46[13][14] N4[13][14] O Output from the oscillator amplifier.
RTCX1 34[13][15] K2[13][15] I Input to the RTC oscillator circuit.
RTCX2 36[13][15] L2[13][15] O Output from the RTC oscillator circuit.
VSSIO 33, 63, L3, T5, I ground: 0 V reference for the digital IO pins.
77, 93, R9, P12,
114, N16,
133, H14,
148, E15,
169, A12, B6,
189, A2[13]
200[13]
VSSCORE 32, 84, K4, P10, I ground: 0 V reference for the core.
172[13] D12[13]
VSSA 22[13] J2[13] I analog ground: 0 V reference. This should nominally be the same
voltage as VSSIO/VSSCORE, but should be isolated to minimize noise and
error.
VDD(3V3) 15, 60, G3, P6, I 3.3 V supply voltage: This is the power supply voltage for the I/O ports.
71, 89, P8, U13,
112, P17,
125, K16,
146, C17,
165, B13, C9,
181, D7[13]
198[13]
n.c. 30, 117, J4, L14, I not connected pins: These pins must be left unconnected (floating).
141[13] G14[13]
VDD(DCDC)(3V3) 26, 86, H4, P11, I 3.3 V DC-to-DC converter supply voltage: This is the power supply for
174[13] D11[13] the on-chip DC-to-DC converter.
VDDA 20[13] G4[13] I analog 3.3 V pad supply voltage: This should be nominally the same
voltage as VDD(3V3) but should be isolated to minimize noise and error.
This voltage is used to power the ADC and DAC.


VREF 24[13] K1[13] I ADC reference: This should be nominally the same voltage as VDD(3V3)
but should be isolated to minimize noise and error. The level on this pin is
used as a reference for ADC and DAC.
VBAT 38[13] M3[13] I RTC power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
[1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2] Either the I2S function or the LCD function is selectable, see Table 19, Table 20, and Table 21.
[3] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
[4] 5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[5] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[6] Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
[7] Either the USB OTG function or the LCD function is selectable, see Table 19, Table 20, and Table 21.
[8] Either the trace function or the LCD function is selectable, see Table 19, Table 20, and Table 21.
[9] 5 V tolerant pad with 10 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[10] Either one of the external interrupts EINT1 to EINT3 or the LCD function is selectable, see Table 19, Table 20, and Table 21.
[11] Either one of the timer outputs MAT2[1] and MAT2[0] or the LCD function is selectable, see Table 19, Table 20, and Table 21.
[12] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[13] Pad provides special analog functionality.
[14] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
[15] If the RTC is not used, these pins can be left floating.
[16] This pin has a built-in pull-up resistor.
[17] This pin has no built-in pull-up and no built-in pull-down resistor.

7. Functional description
7.1 Architectural overview

The LPC2470 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2470 implements two AHBs in order to allow the Ethernet block to operate
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
In summary, bus masters with access to AHB1 are the ARM7 itself, the GPDMA function,
and the Ethernet block (via the bus bridge from AHB2). Bus masters with access to AHB2
are the ARM7 and the Ethernet block.
AHB peripherals are allocated a 2 MB range of addresses at the very top of the 4 GB
ARM memory space. Each AHB peripheral is allocated a 16 kB address space within the
AHB address space. Lower speed peripheral functions are connected to the APB. The
AHB to APB bridge interfaces the APB to the AHB. APB peripherals are also allocated a
2 MB range of addresses, beginning at the 3.5 GB address point. Each APB peripheral is
allocated a 16 kB address space within the APB address space.
The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers

high performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed complex
instruction set computers. This simplicity results in a high instruction throughput and
impressive real-time interrupt response from a small and cost-effective processor core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as

Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• the standard 32-bit ARM set

• a 16-bit Thumb set

The Thumb set’s 16-bit instruction length allows it to approach higher density compared to
standard ARM code while retaining most of the ARM’s performance.
7.2 On-chip SRAM

The LPC2470 includes a SRAM memory of 64 kB reserved for the ARM processor
exclusive use. This RAM may be used for code and/or data storage and may be accessed
as 8 bits, 16 bits, and 32 bits.
A 16 kB SRAM block serving as a buffer for the Ethernet controller and a 16 kB SRAM
associated with the second AHB can be used both for data and code storage, too. The
2 kB RTC SRAM can be used for data storage only. The RTC SRAM is battery powered
and retains the content in the absence of the main power supply.
7.3 Memory map

The LPC2470 memory map incorporates several distinct regions as shown in Table 5 and
Figure 4.
In addition, the CPU interrupt vectors may be remapped to allow them to reside in either
boot ROM or SRAM (see Section 7.26.6).
Table 5. LPC2470 memory usage and details

Address range General use Address range details and description
0x0000 0000 to Fast I/O 0x3FFF C000 - 0x3FFF FFFF Fast GPIO registers
0x3FFF FFFF
0x4000 0000 to On-chip RAM 0x4000 0000 - 0x4000 FFFF RAM (64 kB)
0x7FFF FFFF 0x7FE0 0000 - 0x7FE0 3FFF Ethernet RAM (16 kB)
0x7FD0 0000 - 0x7FD0 3FFF USB RAM (16 kB)
0x8000 0000 to Off-Chip Memory Four static memory banks, 16 MB each
0xDFFF FFFF 0x8000 0000 - 0x80FF FFFF Static memory bank 0
0x8100 0000 - 0x81FF FFFF Static memory bank 1
Four dynamic memory banks, 256 MB each

0xA000 0000 - 0xAFFF FFFF Dynamic memory bank 0
0xB000 0000 - 0xBFFF FFFF Dynamic memory bank 1
0xC000 0000 - 0xCFFF FFFF Dynamic memory bank 2
0xD000 0000 - 0xDFFF FFFF Dynamic memory bank 3
0xE000 0000 to APB Peripherals 36 peripheral blocks, 16 kB each
0xEFFF FFFF
0xF000 0000 to AHB peripherals
0xFFFF FFFF

4.0 GB 0xFFFF FFFF

AHB PERIPHERALS
3.75 GB 0xF000 0000
APB PERIPHERALS
3.5 GB 0xE000 0000
EXTERNAL STATIC AND DYNAMIC MEMORY
2.0 GB 0x8000 0000

0x7FFF FFFF
BOOT ROM
RESERVED ADDRESS SPACE
ON-CHIP STATIC RAM

1.0 GB 0x4000 0000
0x3FFF FFFF
SPECIAL REGISTERS
0x3FFF 8000
RESERVED ADDRESS SPACE
0.0 GB 0x0000 0000
002aad316
Fig 4. LPC2470 memory map
7.4 Interrupt controller

The ARM processor core has two interrupt inputs called Interrupt ReQuest (IRQ) and Fast
Interrupt ReQuest (FIQ). The VIC takes 32 interrupt request inputs which can be
programmed as FIQ or vectored IRQ types. The programmable assignment scheme
means that priorities of interrupts from the various peripherals can be dynamically
assigned and adjusted.
FIQs have the highest priority. If more than one request is assigned to FIQ, the VIC ORs
the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ
latency is achieved when only one request is classified as FIQ, because then the FIQ

service routine can simply start dealing with that device. But if more than one request is
assigned to the FIQ class, the FIQ service routine can read a word from the VIC that
identifies which FIQ source(s) is (are) requesting an interrupt.
Vectored IRQs, which include all interrupt requests that are not classified as FIQs, have a
programmable interrupt priority. When more than one interrupt is assigned the same
priority and occur simultaneously, the one connected to the lowest numbered VIC channel
will be serviced first.
The VIC ORs the requests from all of the vectored IRQs to produce the IRQ signal to the
ARM processor. The IRQ service routine can start by reading a register from the VIC and
jumping to the address supplied by that register.
7.4.1 Interrupt sources

Each peripheral device has one interrupt line connected to the VIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on port 0 and port 2 (total of 64 pins) regardless of the selected function, can be
programmed to generate an interrupt on a rising edge, a falling edge, or both. Such
interrupt request coming from port 0 and/or port 2 will be combined with the EINT3
interrupt requests.
7.5 Pin connect block

The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.6 External memory controller

The LPC2470 EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering
support for asynchronous static memory devices such as RAM, ROM, and flash. In
addition, it can be used as an interface with off-chip memory-mapped devices and
peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant
peripheral.
7.6.1 Features
• Dynamic memory interface support including single data rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and flash, with or
without asynchronous page mode.
• Low transaction latency.
• Read and write buffers to reduce latency and to improve performance.
• 8/16/32 data and 24 address lines wide static memory support.
• 16 bit and 32 bit wide chip select SDRAM memory support.
• Static memory features include:

– Asynchronous page mode read

– Programmable Wait States
– Bus turnaround delay
– Output enable and write enable delays
– Extended wait
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control CKE and CLKOUT to SDRAMs.
• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048, 4096, and 8192 row address synchronous memory parts.
That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per
device.
• Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.7 General purpose DMA controller

The GPDMA is an AMBA AHB compliant peripheral allowing selected LPC2470
peripherals to have DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,

peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
example, a bidirectional port requires one stream for transmit and one for receive. The
source and destination areas can each be either a memory region or a peripheral, and
can be accessed through the AHB master.
7.7.1 Features
• Two DMA channels. Each channel can support a unidirectional transfer.
• The GPDMA can transfer data between the 16 kB SRAM, external memory, and
peripherals such as the SD/MMC, two SSPs, and the I2S interface.
• Single DMA and burst DMA request signals. Each peripheral connected to the
GPDMA can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the GPDMA.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority. Each DMA channel has a specific hardware priority.
DMA channel 0 has the highest priority and channel 1 has the lowest priority. If
requests from two channels become active at the same time, the channel with the
highest priority is serviced first.
• AHB slave DMA programming interface. The GPDMA is programmed by writing to the
DMA control registers over the AHB slave interface.

• One AHB master for transferring data. This interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data. Usually the burst size is set to half the size of the FIFO in the
peripheral.
• Internal four-word FIFO per channel.
• Supports 8-bit, 16-bit, and 32-bit wide transactions.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Interrupt masking. The DMA error and DMA terminal count interrupt requests can be
masked.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.8 Fast general purpose parallel I/O

Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC2470 use accelerated GPIO functions:
• GPIO registers are relocated to the ARM local bus so that the fastest possible I/O
timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte and half-word addressable.
• Entire port value can be written in one instruction.
Additionally, any pin on port 0 and port 2 (total of 64 pins) that is not configured as an
analog input/output can be programmed to generate an interrupt on a rising edge, a falling
edge, or both. The edge detection is asynchronous, so it may operate when clocks are not
present such as during Power-down mode. Each enabled interrupt can be used to wake
the chip up from Power-down mode.
7.8.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Backward compatibility with other earlier devices is maintained with legacy port 0 and
port 1 registers appearing at the original addresses on the APB.

7.9 LCD controller

The LCD controller provides all of the necessary control signals to interface directly to a
variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT
panels can be operated. The display resolution is selectable and can be up to 1024  768
pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the
displayed data) while still supporting a large number of colors.
The LCD interface includes its own DMA controller to allow it to operate independently of
the CPU and other system functions. A built-in FIFO acts as a buffer for display data,
providing flexibility for system timing. Hardware cursor support can further reduce the
amount of CPU time needed to operate the display.
7.9.1 Features
• AHB bus master interface to access frame buffer.
• Setup and control via a separate AHB slave interface.
• Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.
• Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays
with 4-bit or 8-bit interfaces.
• Supports single and dual-panel color STN displays.
• Supports Thin Film Transistor (TFT) color displays.
• Programmable display resolution including, but not limited to: 320  200, 320  240,
640  200, 640  240, 640  480, 800  600, and 1024  768.
• Hardware cursor support for single-panel displays.
• 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.
• 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.
• 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.
• 16 bpp true-color non-palettized, for color STN and TFT.
• 24 bpp true-color non-palettized, for color TFT.
• Programmable timing for different display panels.
• 256 entry, 16-bit palette RAM, arranged as a 128  32-bit RAM.
• Frame, line, and pixel clock signals.
• AC bias signal for STN, data enable signal for TFT panels.
• Supports little and big-endian, and Windows CE data formats.
• LCD panel clock may be generated from the peripheral clock, or from a clock input
pin.
7.10 Ethernet
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.

The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access
the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic
in the LPC2470 takes place on a different AHB subsystem, effectively separating Ethernet
activity from the rest of the system. The Ethernet DMA can also access off-chip memory
via the EMC, as well as the SRAM located on another AHB. However, using memory
other than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to
memory and increase the loading of its AHB.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Media
Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media
Independent Interface Management (MIIM) serial bus.
7.10.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back
pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support.
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
• Enhanced Ethernet features:

– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic Frame Check Sequence (FCS) insertion with Circular
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.
• Physical interface:
– Attachment of external PHY chip through standard MII or RMII interface.
– PHY register access is available via the MIIM interface.

7.11 USB interface

The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports hot
plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The LPC2470 USB interface includes a device, host, and OTG controller. Details on
typical USB interfacing solutions can be found in Section 14.3 “Suggested USB interface
solutions” on page 73
7.11.1 USB device controller

The device controller enables 12 Mbit/s data exchange with a USB host controller. It
consists of a register interface, serial interface engine, endpoint buffer memory, and a
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate endpoint buffer. The status of a completed USB transfer or error
condition is indicated via status registers. An interrupt is also generated if enabled. When
enabled, the DMA controller transfers data between the endpoint buffer and the USB
RAM.
7.11.1.1 Features
• Fully compliant with USB 2.0 specification (full speed).

• Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.
• Supports Control, Bulk, Interrupt and Isochronous endpoints.
• Scalable realization of endpoints at run time.
• Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, LPC2470 can enter one of the reduced power
modes and wake up on USB activity.
• Supports DMA transfers with the DMA RAM of 16 kB on all non-control endpoints.
• Allows dynamic switching between CPU-controlled and DMA modes.
• Double buffer implementation for Bulk and Isochronous endpoints.
7.11.2 USB host controller

The host controller enables full- and low-speed data exchange with USB devices attached
to the bus. It consists of register interface, serial interface engine and DMA controller. The
register interface complies with the OHCI specification.
7.11.2.1 Features
• OHCI compliant
• Two downstream ports
• Supports per-port power switching

7.11.3 USB OTG controller

USB OTG is a supplement to the USB 2.0 specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG controller integrates the host controller, device controller, and a master-only I2C
interface to implement OTG dual-role device functionality. The dedicated I2C interface
controls an external OTG transceiver.
7.11.3.1 Features
• Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
• Hardware support for Host Negotiation Protocol (HNP).
• Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
• Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.12 CAN controller and acceptance filters

The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router between two of CAN buses in industrial
or automotive applications.
Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN
Library block, but the 8-bit registers of those devices have been combined in 32-bit words
to allow simultaneous access in the ARM environment. The main operational difference is
that the recognition of received Identifiers, known in CAN terminology as Acceptance
Filtering, has been removed from the CAN controllers and centralized in a global
Acceptance Filter.
7.12.1 Features
• Two CAN controllers and buses.
• Data rates to 1 Mbit/s on each bus.
• 32-bit register and RAM access.
• Compatible with CAN specification 2.0B, ISO 11898-1.
• Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN
buses.
• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• FullCAN messages can generate interrupts.

7.13 10-bit ADC

The LPC2470 contains one ADC. It is a single 10-bit successive approximation ADC with
eight channels.
7.13.1 Features
• 10-bit successive approximation ADC
• Input multiplexing among 8 pins
• Power-down mode
• Measurement range 0 V to Vi(VREF)
• 10-bit conversion time  2.44 s
• Burst conversion mode for single or multiple inputs
• Optional conversion on transition of input pin or Timer Match signal
• Individual result registers for each ADC channel to reduce interrupt overhead
7.14 10-bit DAC

The DAC allows the LPC2470 to generate a variable analog output. The maximum output
value of the DAC is Vi(VREF).
7.14.1 Features
• 10-bit DAC
• Resistor string architecture
• Buffered output
• Power-down mode
• Selectable output drive
7.15 UARTs
The LPC2470 contains four UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.15.1 Features
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).

• UART3 includes an IrDA mode to support infrared communication.
7.16 SPI serial I/O controller

The LPC2470 contains one SPI controller. SPI is a full duplex serial interface designed to
handle multiple masters and slaves connected to a given bus. Only a single master and a
single slave can communicate on the interface during a given data transfer. During a data
transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave
always sends 8 bits to 16 bits of data to the master.
7.16.1 Features
• Compliant with SPI specification
• Synchronous, Serial, Full Duplex Communication
• Combined SPI master and slave
• Maximum data bit rate of one eighth of the input clock rate
• 8 bits to 16 bits per transfer
7.17 SSP serial I/O controller

The LPC2470 contains two SSP controllers. The SSP controller is capable of operation on
a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the
bus. Only a single master and a single slave can communicate on the bus during a given
data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of
data flowing from the master to the slave and from the slave to the master. In practice,
often only one of these data flows carries meaningful data.
7.17.1 Features
• Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire
buses
• Synchronous serial communication
• Master or slave operation
• 8-frame FIFOs for both transmit and receive
• 4-bit to 16-bit frame
• Maximum SPI bus data bit rate of one half (Master mode) and one twelfth (Slave
mode) of the input clock rate
• DMA transfers supported by GPDMA
7.18 SD/MMC card interface

The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD
memory cards. The SD card interface conforms to the SD Multimedia Card Specification
Version 2.11.
7.18.1 Features
• The MCI provides all functions specific to the SD/MMC memory card. These include
the clock generation unit, power management control, and command and data
transfer.

• Conforms to Multimedia Card Specification v2.11.

• Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.
• Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital
memory card.
• DMA supported through the GPDMA controller.
7.19 I2C-bus serial I/O controller

The LPC2470 contains three I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line
(SCL), and a Serial Data Line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus and can
be controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2470 supports bit rates up to 400 kbit/s (Fast I2C-bus).
7.19.1 Features
• I2C0 is a standard I2C compliant bus interface with open-drain pins.
• I2C1 and I2C2 use standard I/O pins and do not support powering off of individual
devices connected to the same bus lines.
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
7.20 I2S-bus serial I/O controllers

The I2S-bus provides a standard communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S connection has one master, which is always the
master, and one slave. The I2S interface on the LPC2470 provides a separate transmit
and receive channel, each of which can operate as either a master or a slave.

7.20.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
• Configurable word select period in master mode (separately for I2S input and output).
• Two 8 word FIFO data buffers are provided, one for transmit and one for receive.
• Generates interrupt requests when buffer levels cross a programmable boundary.
• Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S input and I2S output.
7.21 General purpose 32-bit timers/external event counters

The LPC2470 includes four 32-bit Timer/Counters. The Timer/Counter is designed to
count cycles of the system derived clock or an externally-supplied clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. The Timer/Counter also includes four capture inputs to trap the timer
value when an input signal transitions, optionally generating an interrupt.
7.21.1 Features
• A 32-bit Timer/Counter with a programmable 32-bit prescaler.
• Counter or Timer operation.
• Up to four 32-bit capture channels per timer, that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.

7.22 Pulse width modulator

The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC2470. The Timer is designed to count
cycles of the system derived clock and optionally switch pins, generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is in addition to these features and is based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. A
dedicated match register controls the PWM cycle rate, by resetting the count upon match.
The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, a dedicated match register controls the PWM cycle rate. The other match registers
control the two PWM edge positions. Additional double edge controlled PWM outputs
require only two match registers each, since the repetition rate is the same for all PWM
outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.22.1 Features
• LPC2470 has two PWMs with the same operational features. These may be operated
in a synchronized fashion by setting them both up to run at the same rate, then
enabling both simultaneously. PWM0 acts as the master and PWM1 as the slave for
this use.
• Counter or Timer operation (may use the peripheral clock or one of the capture inputs
as the clock source).
• Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the
output is a constant LOW. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.

• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard timer if the PWM mode is not enabled.
• A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
7.23 Watchdog timer

The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
7.23.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 32-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  232  4) in
multiples of Tcy(WDCLK)  4.
• The Watchdog Clock (WDCLK) source can be selected from the RTC clock, the
Internal RC oscillator (IRC), or the APB peripheral clock. This gives a wide range of
potential timing choices of Watchdog operation under different power reduction
conditions. It also provides the ability to run the WDT from an entirely internal source
that is not dependent on an external crystal and its associated components and
wiring, for increased reliability.
7.24 RTC and battery RAM

The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. It uses little power in Power-down and Deep power-down modes. On the
LPC2470, the RTC can be clocked by a separate 32.768 kHz oscillator or by a
programmable prescale divider based on the APB clock. Also, the RTC is powered by its
own power supply pin, VBAT, which can be connected to a battery or to the same 3.3 V
supply used by the rest of the device.

The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that can be used by external hardware to restore chip power
and resume operation.
7.24.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
• Dedicated 32 kHz oscillator or programmable prescaler from APB clock.
• Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
• An alarm output pin is included to assist in waking up when the chip has had power
removed to all functions except the RTC and Battery RAM.
• Periodic interrupts can be generated from increments of any field of the time registers,
and selected fractional second values. This enhancement enables the RTC to be
used as a System Timer.
• 2 kB data SRAM powered by VBAT.
• RTC and Battery RAM power supply is isolated from the rest of the chip.
7.25 Clocking and power control
7.25.1 Crystal oscillators

The LPC2470 includes three independent oscillators. These are the Main Oscillator, the
Internal RC oscillator, and the RTC oscillator. Each oscillator can be used for more than
one purpose as required in a particular application. Any of the three clock sources can be
chosen by software to drive the PLL and ultimately the CPU.
Following reset, the LPC2470 will operate from the Internal RC oscillator until switched by
software. This allows systems to operate without any external crystal and the bootloader
code to operate at a known frequency.
7.25.1.1 Internal RC oscillator

The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is
trimmed to 1 % accuracy.
Upon power-up or any chip reset, the LPC2470 uses the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.25.1.2 Main oscillator

The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can
be boosted to a higher frequency, up to the maximum CPU operating frequency, by the
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of

PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.25.2 for additional information.
7.25.1.3 RTC oscillator

The RTC oscillator can be used as the clock source for the RTC and/or the WDT. Also, the
RTC oscillator can be used to drive the PLL and the CPU.
7.25.2 PLL
The PLL accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input
frequency is multiplied up to a high frequency, then divided down to provide the actual
clock used by the CPU and the USB block.
The PLL input, in the range of 32 kHz to 25 MHz, may initially be divided down by a value
‘N’, which may be in the range of 1 to 256. This input division provides a wide range of
output frequencies from the same input frequency.
Following the PLL input divider is the PLL multiplier. This can multiply the input divider
output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the
range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to
550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a
phase-frequency detector to compare the divided CCO output to the multiplier input. The
error value is used to adjust the CCO frequency.
The PLL is turned off and bypassed following a chip Reset and by entering Power-down
mode. PLL is enabled by software only. The program must configure and activate the PLL,
wait for the PLL to lock, then connect to the PLL as a clock source.
7.25.3 Wake-up timer

The LPC2470 begins operation at power-up and when awakened from Power-down and
Deep-power down modes by using the 4 MHz IRC oscillator as the clock source. This
allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the
application, software will need to enable these features and wait for them to stabilize
before they are used as a clock source.
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of Reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down and Deep power-down
modes, any wake-up of the processor from Power-down modes makes use of the
Wake-up Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.

7.25.4 Power control

The LPC2470 supports a variety of power control features. There are four special modes
of processor power reduction: Idle mode, Sleep mode, Power-down mode, and Deep
power-down mode. The CPU clock rate may also be controlled as needed by changing
clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This
allows a trade-off of power versus processing speed based on application requirements.
In addition, Peripheral power control allows shutting down the clocks to individual on-chip
peripherals, allowing fine tuning of power consumption by eliminating all dynamic power
use in any peripherals that are not required for the application. Each of the peripherals
has its own clock divider which provides even better power control.
The LPC2470 also implements a separate power domain in order to allow turning off
power to the bulk of the device while maintaining operation of the RTC and a small SRAM,
referred to as the Battery RAM.
7.25.4.1 Idle mode

In Idle mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Idle mode and may generate
interrupts to cause the processor to resume execution. Idle mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.25.4.2 Sleep mode

In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The
processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Sleep mode and the logic levels of chip pins remain static. The
output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The
32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
The Sleep mode can be terminated and normal operation resumed by either a Reset or
certain specific interrupts that are able to function without clocks. Since all dynamic
operation of the chip is suspended, Sleep mode reduces chip power consumption to a
very low value.
On the wake-up from Sleep mode, if the IRC was used before entering Sleep mode, the
code execution and peripherals activities will resume after 4 cycles expire. If the main
external oscillator was used, the code execution will resume when 4096 cycles expire.
The customers need to reconfigure the PLL and clock dividers accordingly.
7.25.4.3 Power-down mode

Power-down mode does everything that Sleep mode does but also turns off the IRC
oscillator.
On the wake-up from Power-down mode, if the IRC was used before entering
Power-down mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire
before the code execution can then be resumed if the code was running from SRAM. The
customers need to reconfigure the PLL and clock dividers accordingly after a wake-up
from Power-down mode.

7.25.4.4 Deep power-down mode

Deep power-down mode is similar to the Power-down mode, but now the on-chip
regulator that supplies power to the internal logic is also shut off. This produces the lowest
possible power consumption without removing power from the entire chip. Since the Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full chip
reset.
If power is supplied to the LPC2470 during Deep power-down mode, wake-up can be
caused by the RTC Alarm interrupt or by external Reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2470 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the Battery RAM, as long as the external power
to the VBAT pin is maintained.
7.25.4.5 Power domains

The LPC2470 provides two independent power domains that allow the bulk of the device
to have power removed while maintaining operation of the RTC and the Battery RAM.
On the LPC2470, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the
VDD(DCDC)(3V3) pins power the on-chip DC-to-DC converter which in turn provides power to
the CPU and most of the peripherals.
Although both the I/O pad ring and the core require a 3.3 V supply, different powering
schemes can be used depending on the actual application requirements.
The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(DCDC)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(DCDC)(3V3)). Having the on-chip DC-DC
converter powered independently from the I/O pad ring enables shutting down of the I/O
pad power supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC and the Battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that may be used by external hardware to restore chip power
and resume operation.
7.26 System control
7.26.1 Reset
Reset has four sources on the LPC2470: the RESET pin, the Watchdog reset, power-on
reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input
pin. Assertion of chip Reset by any source, once the operating voltage attains a usable

level, starts the wake-up timer (see description in Section 7.25.3 “Wake-up timer”),
causing reset to remain asserted until the external Reset is de-asserted, the oscillator is
running, and a fixed number of clocks have passed.
Once the internal reset is removed, all of the processor and peripheral registers have
been initialized to predetermined values and the LPC2470 continues with booting from an
external static memory.
7.26.2 Boot process

The processor always boots from the off-chip static memory bank 1, executing code from
address 0x8100 0000 (see Table 5 “LPC2470 memory usage and details”). During the
boot process initiated by POR, the boot pins P3[15]/D15 and P3[14]/D14 are sampled,
and the external memory banks 0 and 1 are configured with the same data bus width. The
data bus width is determined by the setting of the two boot pins. Unused address pins are
configured as GPIO. See Section 14.2 “Suggested boot memory interface solutions” for
address and data bus interface details.
Remark: After POR, the address ranges of chip select 1 and chip select 0 are swapped.
The user code residing in the external boot memory must be linked to execute from
address location 0x8000 0000.
When booting from external memory, the interrupt vectors are mapped to the bottom of
the external memory. Once booting is over, the application must map interrupt vectors to
the proper domain.
7.26.3 Brownout detection

The LPC2470 includes 2-stage monitoring of the voltage on the VDD(DCDC)(3V3) pins. If this
voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt
Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the
VIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a
dedicated status register.
The second stage of low-voltage detection asserts a BOD Reset and generates a Reset (if
this reset source is enabled in software) to inactivate the LPC2470 when the voltage on
the VDD(DCDC)(3V3) pins falls below 2.65 V. The BOD circuit maintains this reset down
below 1 V, at which point the power-on reset circuitry maintains the overall Reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly-executed event
loop to sense the condition.
7.26.4 AHB
The LPC2470 implements two AHB in order to allow the Ethernet block to operate without
interference caused by other system activity. The primary AHB, referred to as AHB1,
includes the Vectored Interrupt Controller, GPDMA controller, USB interface, and 16 kB
SRAM.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.

In summary, bus masters with access to AHB1 are the ARM7 itself, the USB block, the
GPDMA function, and the Ethernet block (via the bus bridge from AHB2). Bus masters
with access to AHB2 are the ARM7 and the Ethernet block.
7.26.5 External interrupt inputs

The LPC2470 includes up to 68 edge sensitive interrupt inputs combined with up to four
level sensitive external interrupt inputs as selectable pin functions. The external interrupt
inputs can optionally be used to wake up the processor from Power-down mode.
7.26.6 Memory mapping control

The memory mapping control alters the mapping of the interrupt vectors that appear at the
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the Boot
ROM, the SRAM, or external memory. This allows code running in different memory
spaces to have control of the interrupts.
When booting from an external memory the interrupt vectors are mapped to the bottom of
the external memory. Once booting is over the application must map interrupt vectors to
the proper domain.
7.27 Emulation and debugging

The LPC2470 support emulation and debugging via a JTAG serial port. A trace port allows
tracing program execution. Debugging and trace functions are multiplexed only with
GPIOs on P2[0] to P2[9]. This means that all communication, timer, and interface
peripherals residing on other pins are available during the development and debugging
phase as they are when the application is run in the embedded system itself.
7.27.1 EmbeddedICE
The EmbeddedICE logic provides on-chip debug support. The debugging of the target
system requires a host computer running the debugger software and an EmbeddedICE
protocol convertor. The EmbeddedICE protocol convertor converts the Remote Debug
Protocol commands to the JTAG data needed to access the ARM7TDMI-S core present
on the target system.
The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC
allows a program running on the target to communicate with the host debugger or another
separate host without stopping the program flow or even entering the debug state. The
DCC is accessed as a coprocessor 14 by the program running on the ARM7TDMI-S core.
The DCC allows the JTAG port to be used for sending and receiving data without affecting
the normal program flow. The DCC data and control registers are mapped in to addresses
in the EmbeddedICE logic.
The JTAG clock (TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG
interface to operate.
7.27.2 Embedded trace

Since the LPC2470 have significant amounts of on-chip memories, it is not possible to
determine how the processor core is operating simply by observing the external pins. The
ETM provides real-time trace capability for deeply embedded processor cores. It outputs

information about processor execution to a trace port. A software debugger allows

configuration of the ETM using a JTAG interface and displays the trace information that
has been captured.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
Trace Port Analyzer captures the trace information under software debugger control. The
trace port can broadcast the Instruction trace information. Instruction trace (or PC trace)
shows the flow of execution of the processor and provides a list of all the instructions that
were executed. Instruction trace is significantly compressed by only broadcasting branch
addresses as well as a set of status signals that indicate the pipeline status on a cycle by
cycle basis. Trace information generation can be controlled by selecting the trigger
resource. Trigger resources include address comparators, counters and sequencers.
Since trace information is compressed the software debugger requires a static image of
the code being executed. Self-modifying code can not be traced because of this
restriction.
7.27.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real-time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2470 contain a specific configuration of
RealMonitor software programmed into the on-chip ROM memory.

8. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter Conditions Min Max Unit
VDD(3V3) supply voltage (3.3 V) core and external 3.0 3.6 V
rail
VDD(DCDC)(3V3) DC-to-DC converter supply voltage 3.0 3.6 V
(3.3 V)
VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V
Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V
Vi(VREF) input voltage on pin VREF 0.5 +4.6 V
VIA analog input voltage on ADC related 0.5 +5.1 V
pins
VI input voltage 5 V tolerant I/O [2] 0.5 +6.0 V
pins; only valid
when the VDD(3V3)
supply voltage is
present
other I/O pins [2][3] 0.5 VDD(3V3) + V
0.5
IDD supply current per supply pin [4] - 100 mA
ISS ground current per ground pin [4] - 100 mA
Tstg storage temperature non-operating [5] 65 +150 C
Ptot(pack) total power dissipation (per package) based on package - 1.5 W
heat transfer, not
device power
consumption
VESD electrostatic discharge voltage human body [6] 2500 +2500 V
model; all pins
[1] The following applies to the limiting values:

a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSSIO/VSSCORE
unless otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
T j = T amb +  P D  R th  j – a   (1)
• Tamb = ambient temperature (C),

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 7. Thermal characteristics

VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol Parameter Conditions Min Typ Max Unit
Tj(max) maximum junction - - 125 C
temperature
Table 8. Thermal resistance value (C/W): ±15 %

VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
LQFP208 TFBGA208
ja ja
JEDEC (4.5 in  4 in) JEDEC (4.5 in  4 in)
0 m/s 27.4 0 m/s 41
1 m/s 25.7 1 m/s 35
2.5 m/s 24.4 2.5 m/s 31
Single-layer (4.5 in  3 in) 8-layer (4.5 in  3 in)
0 m/s 35.4 0 m/s 34.9
1 m/s 31.2 1 m/s 30.9
2.5 m/s 29.2 2.5 m/s 28
jc 8.8 jc 8.3
jb 15.4 jb 13.6

10. Static characteristics

Table 9. Static characteristics
Tamb = 40 C to +85 C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
VDD(3V3) supply voltage (3.3 V) core and external rail 3.0 3.3 3.6 V
VDD(DCDC)(3V3) DC-to-DC converter 3.0 3.3 3.6 V
supply voltage (3.3 V)
VDDA analog 3.3 V pad 3.0 3.3 3.6 V
supply voltage
Vi(VBAT) input voltage on pin [2] 2.0 3.3 3.6 V
VBAT
Vi(VREF) input voltage on pin 2.5 3.3 VDDA V
VREF
IDD(DCDC)act(3V3) active mode DC-to-DC VDD(DCDC)(3V3) = 3.3 V;
converter supply Tamb = 25 C; code
current (3.3 V) while(1){}
executed from the on-chip
SRAM; no peripherals
enabled; PCLK = CCLK / 8
CCLK = 12 MHz - 17.4 - mA
CCLK = 72 MHz - 66.1 - mA
IDD(DCDC)pd(3V3) Power-down mode VDD(DCDC)(3V3) = 3.3 V; [3] - 113 - A
DC-to-DC converter Tamb = 25 C
supply current (3.3 V)
IDD(DCDC)dpd(3V3) Deep power-down [3]
mode DC-to-DC
converter supply
current (3.3 V) - 20 - A
IBATact active mode battery [4]
supply current - 20 - A
IBAT battery supply current Deep power-down mode [3] - 20 - A
Standard port pins, RESET, RTCK
IIL LOW-level input VI = 0 V; no pull-up - - 3 A
current
IIH HIGH-level input VI = VDD(3V3); no pull-down - - 3 A
current
IOZ OFF-state output VO = 0 V; VO = VDD(3V3); - - 3 A
current no pull-up/down
Ilatch I/O latch-up current (0.5VDD(3V3)) < VI < - - 100 mA
(1.5VDD(3V3));
Tj < 125 C
VI input voltage pin configured to provide a [5][6][7] 0 - 5.5 V
digital function [8]
VO output voltage output active 0 - VDD(3V3) V

VIH HIGH-level input 2.0 - - V
voltage

Table 9. Static characteristics …continued

VIL LOW-level input - - 0.8 V
voltage
Vhys hysteresis voltage 0.4 - - V
VOH HIGH-level output IOH = 4 mA [9] VDD(3V3)  - - V
voltage 0.4
VOL LOW-level output IOL = 4 mA [9] - - 0.4 V
voltage
IOH HIGH-level output VOH = VDD(3V3)  0.4 V [9] 4 - - mA
current
IOL LOW-level output VOL = 0.4 V [9] 4 - - mA
current
IOHS HIGH-level VOH = 0 V [10] - - 45 mA
short-circuit output
current
IOLS LOW-level short-circuit VOL = VDDA [10] - - 50 mA
output current
Ipd pull-down current VI = 5 V [11] 10 50 150 A
Ipu pull-up current VI = 0 V 15 50 85 A
VDD(3V3) < VI < 5 V [11] 0 0 0 A
I2C-bus pins (P0[27]/SDA0 and P0[28]/SCL0)
VIH HIGH-level input 0.7VDD(3V3) - - V
voltage
VIL LOW-level input - - 0.3VDD(3V3) V
voltage
Vhys hysteresis voltage - 0.05VDD(3V3) - V
VOL LOW-level output IOLS = 3 mA [9] - - 0.4 V
voltage
ILI input leakage current VI = VDD(3V3) [12] - 2 4 A
VI = 5 V - 10 22 A

Table 9. Static characteristics …continued

Oscillator pins
Vi(XTAL1) input voltage on pin 0.5 +1.8 +1.95 V
XTAL1
Vo(XTAL2) output voltage on pin 0.5 +1.8 +1.95 V
XTAL2
Vi(RTCX1) input voltage on pin 0.5 +1.8 +1.95 V
RTCX1
Vo(RTCX2) output voltage on pin 0.5 +1.8 +1.95 V
RTCX2
USB pins
IOZ OFF-state output 0 V < VI < 3.3 V - - 10 A
current
VBUS bus supply voltage - - 5.25 V
VDI differential input (D+)  (D) 0.2 - - V
sensitivity voltage
VCM differential common includes VDI range 0.8 - 2.5 V
mode voltage range
Vth(rs)se single-ended receiver 0.8 - 2.0 V
switching threshold
voltage
VOL LOW-level output RL of 1.5 k to 3.6 V - - 0.18 V
voltage for
low-/full-speed
VOH HIGH-level output RL of 15 k to GND 2.8 - 3.5 V
voltage (driven) for
low-/full-speed
Ctrans transceiver pin to GND - - 20 pF
capacitance
ZDRV driver output with 33  series resistor; [13] 36 - 44.1 
impedance for driver steady state drive
which is not
high-speed capable
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages
[2] The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3] VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C.
[4] On pin VBAT.
[5] Including voltage on outputs in 3-state mode.
[6] VDD(3V3) supply voltages must be present.
[7] 3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[8] Please also see the errata note in errata sheet.
[9] Accounts for 100 mV voltage drop in all supply lines.
[10] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[11] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[12] To VSSIO.
[13] Includes external resistors of 33   1 % on D+ and D.

10.1 Power-down mode
002aae049
4
IDD(IO)
(μA)
2
VDD(3V3) = 3.3 V
VDD(3V3) = 3.0 V
−2
−4
−40 −15 10 35 60 85
temperature (°C)
Vi(VBAT) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.

Fig 5. I/O maximum supply current IDD(IO) versus temperature in Power-down mode
002aae050
40
IBAT
(μA)
30
Vi(VBAT) = 3.3 V
Vi(VBAT) = 3.0 V
20
10
0
−40 −15 10 35 60 85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.

Fig 6. RTC battery maximum supply current IBAT versus temperature in Power-down
mode

002aae051
800
IDD(DCDC)pd(3v3)
(μA)
600
400
VDD(DCDC)(3V3) = 3.3 V
200 VDD(DCDC)(3V3) = 3.0 V
0
−40 −15 10 35 60 85
temperature (°C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.

Fig 7. Total DC-to-DC converter supply current IDD(DCDC)pd(3V3) at different temperatures
in Power-down mode
10.2 Deep power-down mode
002aae046
300
IDD(IO)
(μA)
200
100
VDD(3V3) = 3.3 V
VDD(3V3) = 3.0 V
0
−40 −15 10 35 60 85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C.

Fig 8. I/O maximum supply current IDD(IO) versus temperature in Deep power-down
mode

002aae047
40
IBAT
(μA)
30
Vi(VBAT) = 3.3 V
Vi(VBAT) = 3.0 V
20
10
0
−40 −15 10 35 60 85
temperature (°C)
VDD(3V3) = VDD(DCDC)(3V3) = 3.3 V; Tamb = 25 C

Fig 9. RTC battery maximum supply current IBAT versus temperature in Deep
power-down mode
002aae048
100
IDD(DCDC)dpd(3v3)
(μA)
80
60
40
20
0
−40 −15 10 35 60 85
temperature (°C)
VDD(3V3) = Vi(VBAT) = 3.3 V; Tamb = 25 C.

Fig 10. Total DC-to-DC converter maximum supply current IDD(DCDC)dpd(3V3) versus
temperature in Deep power-down mode

10.3 Electrical pin characteristics
002aaf112
3.6
VOH
(V)
T = 85 °C
3.2 25 °C
−40 °C
2.8
2.4
2.0
0 8 16 24
IOH (mA)
Conditions: VDD(3V3) = 3.3 V; standard port pins.

Fig 11. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
002aaf111
15
IOL T = 85 °C
(mA) 25 °C
−40 °C
10
0
0 0.2 0.4 0.6
VOL (V)
Conditions: VDD(3V3) = 3.3 V; standard port pins.

Fig 12. Typical LOW-level output current IOL versus LOW-level output voltage VOL

11. Dynamic characteristics

Table 10. Dynamic characteristics
Tamb = 40 C to +85 C for commercial applications; VDD(3V3) over specified ranges.[1]
External clock
fosc oscillator frequency 1 - 25 MHz
Tcy(clk) clock cycle time 40 - 1000 ns
tCHCX clock HIGH time Tcy(clk)  0.4 - - ns
tCLCX clock LOW time Tcy(clk)  0.4 - - ns
tCLCH clock rise time - - 5 ns
tCHCL clock fall time - - 5 ns
I2C-bus pins (P0[27]/SDA0 and P0[28]/SCL0)
tf(o) output fall time VIH to VIL 20 + 0.1  Cb[3] - - ns
SSP interface
tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 C; - 11 - ns
measured in
SPI Master
mode; see
Figure 17
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3] Bus capacitance Cb in pF, from 10 pF to 400 pF.
tCHCX
tCHCL tCLCX tCLCH
Tcy(clk)
002aaa907
Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)

11.1 Internal oscillators

Table 11. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; 3.0 V  VDD(3V3)  3.6 V.[1]
fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz
fi(RTC) RTC input frequency - - 32.768 - kHz
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
11.2 I/O pins

Table 12. Dynamic characteristic: I/O pins[1]
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
tr rise time pin configured as output 3.0 - 5.0 ns
tf fall time pin configured as output 2.5 - 5.0 ns
[1] Applies to standard I/O pins and RESET pin.
11.3 USB interface

Table 13. Dynamic characteristics of USB pins
CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3),unless otherwise specified.
tr rise time 10 % to 90 % 8.5 - 13.8 ns
tf fall time 10 % to 90 % 7.7 - 13.7 ns
tFRFM differential rise and fall time tr / tf - - 109 %
matching
VCRS output signal crossover voltage 1.3 - 2.0 V
tFEOPT source SE0 interval of EOP see Figure 16 160 - 175 ns
tFDEOP source jitter for differential transition see Figure 16 2 - +5 ns
to SE0 transition
tJR1 receiver jitter to next transition 18.5 - +18.5 ns
tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns
tEOPR1 EOP width at receiver must reject as [1] 40 - - ns
EOP; see
Figure 16
tEOPR2 EOP width at receiver must accept as [1] 82 - - ns
EOP; see
Figure 16
[1] Characterized but not implemented as production test. Guaranteed by design.

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Product data sheet
LPC2470
NXP Semiconductors
11.4 Static external memory interface
Table 14. Dynamic characteristics: Static external memory interface
CL = 30 pF, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V
Common to read and write cycles[1]
tCSLAV CS LOW to address valid 0.29 0.20 2.54 ns
time
Read cycle parameters[1][2]
tOELAV OE LOW to address valid 0.29 0.20 2.54 ns
time
tCSLOEL CS LOW to OE LOW time 0.78 + Tcy(CCLK)  WAITOEN 0 + Tcy(CCLK)  WAITOEN 0.49 + Tcy(CCLK)  WAITOEN ns
tam memory access time [3][4] (WAITRD  WAITOEN + 1)  (WAITRD  WAITOEN + 1)  (WAITRD  WAITOEN + 1)  ns
All information provided in this document is subject to legal disclaimers.
Tcy(CCLK)  12.70 Tcy(CCLK)  9.57 Tcy(CCLK)  8.11

th(D) data input hold time [5] 0 - - ns
Rev. 4.2 — 15 October 2020
tCSHOEH CS HIGH to OE HIGH time 0.49 0 0.20 ns

tOEHANV OE HIGH to address invalid 0.20 0.20 2.44 ns
time
tOELOEH OE LOW to OE HIGH time 0.59 + (WAITRD  0 + (WAITRD  WAITOEN + 0.10 + (WAITRD 
WAITOEN + 1)  Tcy(CCLK) 1)  Tcy(CCLK) WAITOEN + 1)  Tcy(CCLK)
tBLSLAV BLS LOW to address valid 0.39 0 2.54 ns
time
tCSHBLSH CS HIGH to BLS HIGH time 0.88 0.49 0.68 ns
Write cycle parameters[1][6]

tCSLWEL CS LOW to WE LOW time 0.88 + Tcy(CCLK)  (1 + 0.10 + Tcy(CCLK)  (1 + 0.20 + Tcy(CCLK)  (1 + ns
WAITWEN) WAITWEN) WAITWEN)
tCSLBLSL CS LOW to BLS LOW time 0.88 0.49 0.98 ns
tWELDV WE LOW to data valid time 0.68 2.54 5.86 ns
tCSLDV CS LOW to data valid time 0 2.64 4.79 ns
tWELWEH WE LOW to WE HIGH time [3] 0.78 + Tcy(CCLK)  0 + Tcy(CCLK)  (WAITWR  0.10 + Tcy(CCLK)  ns
(WAITWR  WAITWEN + 1) (WAITWR  WAITWEN + 1)
LPC2470
WAITWEN + 1)
© NXP B.V. 2020. All rights reserved.
tBLSLBLSH BLS LOW to BLS HIGH [3] 0.88 + Tcy(CCLK)  0 + Tcy(CCLK)  (WAITWR  0.59 + Tcy(CCLK)  ns
time (WAITWR  WAITWEN + 3) WAITWEN + 3) (WAITWR  WAITWEN + 3)
tWEHANV WE HIGH to address invalid [3] 0 + Tcy(CCLK) 0.20 + Tcy(CCLK) 2.74 + Tcy(CCLK) ns
time
60 of 91
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Table 14. Dynamic characteristics: Static external memory interface …continued
Product data sheet
LPC2470
NXP Semiconductors
CL = 30 pF, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V
tWEHDNV WE HIGH to data invalid [3] 0.78 + Tcy(CCLK) 2.54 + Tcy(CCLK) 5.96 + Tcy(CCLK) ns
time
tBLSHANV BLS HIGH to address [3] 0.29 0.20 2.54 ns
invalid time
tBLSHDNV BLS HIGH to data invalid [3] 0 2.54 5.37 ns
time
[1] VOH = 2.5 V, VOL = 0.2 V.

[2] VIH = 2.5 V, VIL = 0.5 V.
[3] Tcy(CCLK) = 1⁄CCLK.
[4] Latest of address valid, CS LOW, OE LOW to data valid.
All information provided in this document is subject to legal disclaimers.
[5] Earliest of CS HIGH, OE HIGH, address change to data invalid.

[6] Byte lane state bit (PB) = 1.
Rev. 4.2 — 15 October 2020

LPC2470
61 of 91
11.5 Dynamic external memory interface

Table 15. Dynamic characteristics: Dynamic external memory interface
CL = 30 pF, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.0 V to 3.6 V, EMC Dynamic Read Config Register = 0x0
(RD = 00)
Common
td(SV) chip select valid delay time [1] - 1.05 1.76 ns
th(S) chip select hold time [1] 0.1 1.02 - ns
td(RASV) row address strobe valid delay time [1] - 1.51 1.95 ns
th(RAS) row address strobe hold time [1] 0.5 1.51 - ns
td(CASV) column address strobe valid delay time [1] - 0.98 1.27 ns
th(CAS) column address strobe hold time [1] 0.1 0.97 - ns
td(WV) write valid delay time [1] - 0.84 1.95 ns
th(W) write hold time [1] 0.1 0.84 - ns
td(GV) output enable valid delay time [1] - 0.95 1.86 ns
th(G) output enable hold time [1] 0.1 1 - ns
td(AV) address valid delay time [1] - 0.87 1.95 ns
th(A) address hold time [1] 0.1 0.81 - ns
Read cycle parameters
tsu(D) data input set-up time [1] 0.51 2.24 - ns
th(D) data input hold time [1] 0.57 2.41 - ns
Write cycle parameters
td(QV) data output valid delay time [1] - 2.65 4.36 ns
th(Q) data output hold time [1] 0.49 2.61 - ns
[1] See Figure 18.

Table 16. Dynamic characteristics: Dynamic external memory interface

CL = 30 pF on all pins, Tamb = 40 C to 85 C, VDD(DCDC)(3V3) = VDD(3V3) = 3.3 V, EMC Dynamic Read Config Register = 0x1
(RD = 01), Tcy(CCLK) = 1/CCLK
Common
td(SV) chip select valid delay [1] - 3 + Tcy(CCLK)/2 1.5 + Tcy(CCLK)/2 ns
time
th(S) chip select hold time [1] 4 + Tcy(CCLK)/2 3 + Tcy(CCLK)/2 - ns
td(RASV) row address strobe valid [1] - 3 + Tcy(CCLK)/2 1.5 + Tcy(CCLK)/2 ns
delay time
th(RAS) row address strobe hold [1] 3 + Tcy(CCLK)/2 2.3 + Tcy(CCLK)/2 - ns
time
td(CASV) column address strobe [1] - 3.4 + Tcy(CCLK)/2 2.1 + Tcy(CCLK)/2 ns
valid delay time
th(CAS) column address strobe [1] 4 + Tcy(CCLK)/2 3 + Tcy(CCLK)/2 - ns
hold time
td(WV) write valid delay time [1] - 3.4 + Tcy(CCLK)/2 2.1 + Tcy(CCLK)/2 ns
th(W) write hold time [1] 4 + Tcy(CCLK)/2 3 + Tcy(CCLK)/2 - ns
td(GV) output enable valid delay [1] - 3 + Tcy(CCLK) 1.3 + Tcy(CCLK) ns
time
th(G) output enable hold time [1] 4 + Tcy(CCLK)/2 2.1 + Tcy(CCLK)/2 - ns
td(AV) address valid delay time [1] - 2.6 + Tcy(CCLK)/2 1.4 + Tcy(CCLK)/2 ns
th(A) address hold time [1] 4 + Tcy(CCLK)/2 2.3 + Tcy(CCLK)/2 - ns
Read cycle parameters
tsu(D) data input set-up time [1] 2.6 1.5 - ns
th(D) data input hold time [1] 2.6 1.3 - ns
Write cycle parameters
td(QV) data output valid delay [1] - 2.6 + Tcy(CCLK)/2 4.8 + Tcy(CCLK)/2 ns
time
th(Q) data output hold time [1] 3.8 + Tcy(CCLK)/2 3.4 +Tcy(CCLK)/2 - ns
[1] See Figure 18.

11.6 Timing
tCSLAV tCSHOEH
CS
addr
tam th(D)
data
tCSLOEL
tOELAV tOEHANV
tOELOEH
OE
tBLSLAV tCSHBLSH
BLS
002aad955
Fig 14. External memory read access
CS
tCSLAV
tWELWEH
tCSLWEL
tBLSLBLSH
BLS/WE
tWEHANV
tCSLBLSL tWELDV tBLSHANV
addr
tWEHDNV
tCSLDV
tBLSHDNV
data
OE
002aad956
Fig 15. External memory write access

TPERIOD crossover point

extended
crossover point
differential
data lines
source EOP width: tFEOPT

differential data to
SE0/EOP skew
n × TPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 16. Differential data-to-EOP transition skew and EOP width
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 17. MISO line set-up time in SSP Master mode
reference
clock
td(XXX) th(XXX)
output signal (O)
tsu(D) th(D)
input signal (I)
002aad636
Fig 18. Signal timing

12. ADC electrical characteristics

Table 17. ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz.
VIA analog input voltage 0 - VDDA V
Cia analog input capacitance - - 1 pF
ED differential linearity error [1][2][3] - - 1 LSB
EL(adj) integral non-linearity [1][4] - - 2 LSB
EO offset error [1][5] - - 3 LSB
EG gain error [1][6] - - 0.5 %
ET absolute error [1][7] - - 4 LSB
Rvsi voltage source interface [8] - - 40 k
resistance
[1] Conditions: VSSA = 0 V, VDDA = 3.3 V.

[2] The ADC is monotonic, there are no missing codes.
[3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 19.
[4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 19.
[5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 19.
[6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 19.
[7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 19.
[8] See Figure 20.

offset gain
error error
EO EG
1023
1022
1021
1020
1019
1018
(2)
7
code (1)
out
6
(5)
4
(4)
3
(3)
2
1 1 LSB
(ideal)
0
1 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024
VIA (LSBideal)
offset error
EO Vi(VREF) − VSSA
1 LSB =
1024
002aae604
(1) Example of an actual transfer curve.

(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 19. ADC characteristics

LPC2XXX
20 kΩ Rvsi
AD0[y]
AD0[y]SAMPLE
3 pF 5 pF
VEXT
VSSIO, VSSCORE
002aad586
Fig 20. Suggested ADC interface - LPC2470 AD0[y] pin

13. DAC electrical characteristics

Table 18. DAC electrical characteristics
VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified
ED differential linearity error - 1 - LSB
EL(adj) integral non-linearity - 1.5 - LSB
EO offset error - 0.6 - %
EG gain error - 0.6 - %
CL load capacitance - 200 - pF
RL load resistance 1 - - k
14. Application information
14.1 LCD panel signal usage

Table 19. LCD panel connections for STN single panel mode
External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel
LPC2470 pin LCD function LPC2470 pin LCD function LPC2470 pin LCD function
used used used
LCDVD[23] - - - - - -
LCDVD[22] - - - - - -
LCDVD[21] - - - - - -
LCDVD[20] - - - - - -
LCDVD[19] - - - - - -
LCDVD[18] - - - - - -
LCDVD[17] - - - - - -
LCDVD[16] - - - - - -
LCDVD[15] - - - - - -
LCDVD[14] - - - - - -
LCDVD[13] - - - - - -
LCDVD[12] - - - - - -
LCDVD[11] - - - - - -
LCDVD[10] - - - - - -
LCDVD[9] - - - - - -
LCDVD[8] - - - - - -
LCDVD[7] - - P4[29][3] UD[7] P4[29][3] UD[7]
LCDVD[6] - - P4[28][3] UD[6] P4[28][3] UD[6]
LCDVD[5] - - P2[13][2] UD[5] P2[13][2] UD[5]
LCDVD[4] - - P2[12][2] UD[4] P2[12][2] UD[4]
LCDVD[3] P2[9][1] UD[3] P2[9][1] UD[3] P2[9][1] UD[3]
LCDVD[2] P2[8][1] UD[2] P2[8][1] UD[2] P2[8][1] UD[2]
LCDVD[1] P2[7][1] UD[1] P2[7][1] UD[1] P2[7][1] UD[1]
LCDVD[0] P2[6][1] UD[0] P2[6][1] UD[0] P2[6][1] UD[0]

Table 19. LCD panel connections for STN single panel mode
External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel
used used used
LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP
LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/
LCDM LCDM LCDM LCDM
LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP
LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK
LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE
LCDPWR P2[0][1] CDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR
LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[0][2] LCDPWR
[1] ETM replaced with LCD pins.

[2] External interrupt pins EINT1, EINT2, EINT3 replaced with LCD pins.
[3] Timer pins MAT2[0] and MAT2[1] replaced with LCD pins.
Table 20. LCD panel connections for STN dual panel mode
External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel
used used used
LCDVD[23] - - - - - -
LCDVD[22] - - - - - -
LCDVD[21] - - - - - -
LCDVD[20] - - - - - -
LCDVD[19] - - - - - -
LCDVD[18] - - - - - -
LCDVD[17] - - - - - -
LCDVD[16] - - - - - -
LCDVD[15] - - P1[29][4] LD[7] P1[29][4] LD[7]
LCDVD[14] - - P1[28][4] LD[6] P1[28][4] LD[6]
LCDVD[13] - - P1[27][4] LD[5] P1[27][4] LD[5]
LCDVD[12] - P1[26][4] LD[4] P1[26][4] LD[4]
LCDVD[11] P4[29][3] LD[3] P1[25][4] LD[3] P1[25][4] LD[3]
LCDVD[10] P4[28][3] LD[2] P1[24][4] LD[2] P1[24][4] LD[2]
LCDVD[9] P2[13][2] LD[1] P1[23][4] LD[1] P1[23][4] LD[1]
LCDVD[8] P2[12][2] LD[0] P1[22][4] LD[0] P1[22][4] LD[0]
LCDVD[7] - - P1[21][4] UD[7] P1[21][4] UD[7]
LCDVD[6] - - P1[20][4] UD[6] P1[20][4] UD[6]
LCDVD[5] - - P2[13][2] UD[5] P2[13][2] UD[5]
LCDVD[4] - - P2[12][2] UD[4] P2[12][2] UD[4]
LCDVD[3] P2[9][1] UD[3] P2[9][1] UD[3] P2[9][1] UD[3]
LCDVD[2] P2[8][1] UD[2] P2[8][1] UD[2] P2[8][1] UD[2]
LCDVD[1] P2[7][1] UD[1] P2[7][1] UD[1] P2[7][1] UD[1]

Table 20. LCD panel connections for STN dual panel mode
External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel
used used used
LCDVD[0] P2[6][1] UD[0] P2[6][1] UD[0] P2[6][1] UD[0]
LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP
LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/
LCDM LCDM LCDM LCDM
LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP
LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK
LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE
LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR
LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN

[4] USB OTG pins replaced by LCD pins.
Table 21. LCD panel connections for TFT panels

External TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit
pin
LPC2470 LCD LPC2470 LCD LPC2470 pin LCD LPC2470 LCD
pin used function pin used function used function pin used function
LCDVD[23] P1[29][4] BLUE3 P1[29][4] BLUE4 P1[29][4] BLUE4 P1[29][4] BLUE7
LCDVD[19] - - P2[13][2] BLUE0 P2[13][2] BLUE0 P2[13][2] BLUE3
LCDVD[18] - - - - P2[12][2] intensity P2[12][2] BLUE2
LCDVD[17] - - - - - - P0[9][5] BLUE1
LCDVD[16] - - - - - - P0[8][5] BLUE0
LCDVD[15] P1[25][4] GREEN3 P1[25][4] GREEN5 P1[25][4] GREEN4 P1[25][4] GREEN7
LCDVD[11] - - P1[21][4] GREEN1 P1[21][4] GREEN0 P1[21][4] GREEN3
LCDVD[10] - - P1[20][4] GREEN0 P1[20][4] intensity P1[20][4] GREEN2
LCDVD[9] - - - - - - P0[7][5] GREEN1
LCDVD[8] - - - - - - P0[6][5] GREEN0
LCDVD[7] P2[9][1] RED3 P2[9][1] RED4 P2[9][1] RED4 P2[9][1] RED7
LCDVD[3] - - P2[12][2] RED0 P4[29][3] RED0 P4[29][3] RED3

Table 21. LCD panel connections for TFT panels

External TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit
pin
LPC2470 LCD LPC2470 LCD LPC2470 pin LCD LPC2470 LCD
pin used function pin used function used function pin used function
LCDVD[2] - - - - P4[28][3] intensity P4[28][3] RED2
LCDVD[1] - - - - - - P0[5][5] RED1
LCDVD[0] - - - - - - P0[4][5] RED0
LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP P2[5][1] LCDLP
LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/ P2[4][1] LCDENAB/L
LCDM LCDM LCDM LCDM CDM
LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP P2[3][1] LCDFP
LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK P2[2][1] LCDDCLK
LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE P2[1][1] LCDLE
LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR P2[0][1] LCDPWR
LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN P2[11][2] LCDCLKIN

[4] USB OTG pins replaced with LCD pins.
[5] I2S pins replaced with LCD pins.
14.2 Suggested boot memory interface solutions

‘a_m’ and ‘a_b’ in the following figures refer to the highest order address line of the
memory chip and the highest order microcontroller’s address line used respectively.
CS1
OE
CE CE
OE OE
WE WE
BLS1 8-bit BLS0 8-bit
MEMORY MEMORY
IO[7:0] IO[7:0]
D[15:8] D[7:0]
A[a_m:0] A[a_m:0]
A[a_b:1]
002aad322
Fig 21. Booting from two 8-bit memory chips

CS1
OE
CE
WE
OE
WE
UB 16-bit
BLS1
LB MEMORY
BLS0
IO[15:0]
D[15:0]
A[a_m:0]
A[a_b:1] 002aad323
Fig 22. Booting from a single 16-bit memory chip
14.3 Suggested USB interface solutions
VDD(3V3)
USB_UP_LED
USB_CONNECT
LPC24XX
soft-connect switch
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω USB-B
connector
USB_D− RS = 33 Ω
VSSIO, VSSCORE
002aad587
Fig 23. LPC2470 USB interface on a self-powered device

VDD(3V3)
R2
LPC24XX R1
USB_UP_LED 1.5 kΩ
VBUS
USB_D+ RS = 33 Ω USB-B
connector
USB_D− RS = 33 Ω
VSSIO, VSSCORE
002aad588
Fig 24. LPC2470 USB interface on a bus-powered device

VDD
R1 R2 R3 R4
RSTOUT RESET_N VBUS

ADR/PSW ID
OE_N/INT_N DP 33 Ω
VDD Mini-AB
SPEED 33 Ω connector
DM
SUSPEND ISP1302
R4 R5 R6 VSSIO,
USB_SCL1 SCL VSSCORE
USB_SDA1 SDA
USB_INT1 INT_N
USB_D+1
USB_D−1
VDD
USB_UP_LED1 R7
LPC24XX 5V VDD
IN
OUTA
LM3526-L
USB_PPWR2 ENA
FLAGA
USB_OVRCR2
USB_PWRD2 VBUS
USB_D+2 33 Ω D+
USB-A
USB_D−2 33 Ω D− connector
VSSIO,
15 kΩ 15 kΩ
VSSCORE
VDD
USB_UP_LED2 R8
002aad589
Fig 25. LPC2470 USB OTG port configuration: USB port 1 OTG dual-role device, USB port 2 host

VDD
RSTOUT RESET_N
USB_TX_E1 OE_N/INT_N
USB_TX_DP1 DAT_VP
USB_TX_DM1 SE0_VM
USB_RCV1 RCV
USB_RX_DP1 VP VBUS
USB_RX_DM1 VM ID
VDD DP 33 Ω USB MINI-AB
ISP1302 connector
DM 33 Ω
LPC24XX
ADR/PSW VSSIO,
SPEED VSSCORE
SUSPEND
USB_SCL1 SCL
USB_SDA1 SDA
USB_INT1 INT_N
VDD
USB_UP_LED1
002aad590
Fig 26. LPC2470 USB OTG port configuration: VP_VM mode

VDD
USB_UP_LED1
VSSIO,
VSSCORE
USB_D+1 33 Ω D+
USB_D−1 33 Ω D−
USB-A
15 kΩ 15 kΩ connector
VDD
USB_PWRD1 VBUS
USB_OVRCR1
USB_PPWR1 ENA FLAGA

5V OUTA
LM3526-L
IN
LPC24XX
VDD
USB_UP_LED2
VDD
USB_CONNECT2
VSSIO,
VSSCORE
USB_D+2 33 Ω D+
33 Ω
USB-B
USB_D−2 D−
connector
VBUS VBUS
002aad595
Fig 27. LPC2470 USB OTG port configuration: USB port 2 device, USB port 1 host

VDD
USB_UP_LED1
VSSIO,
VSSCORE
USB_D+1 33 Ω D+
USB-A
15 kΩ 15 kΩ connector
VDD
USB_PWRD1 VBUS
USB_OVRCR1
USB_PPWR1 ENA FLAGA

5V OUTA VDD
IN
LM3526-L OUTB
LPC24XX
USB_PPWR2 ENB
FLAGB
USB_OVRCR2
USB_PWRD2 VBUS
USB_D+2 33 Ω D+ USB-A
connector
15 kΩ 15 kΩ VSSIO,
VSSCORE
VDD
USB_UP_LED2
002aad596
Fig 28. LPC2470 USB OTG port configuration: USB port 1 host, USB port 2 host
14.4 Crystal oscillator XTAL input and component selection

The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In
slave mode, a minimum of 200 mV (RMS) is needed.
LPC2xxx
XTAL1
Ci Cg
100 pF
002aae718
Fig 29. Slave mode operation of the on-chip oscillator

In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 29), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTAL2 pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 30 and in
Table 22 and Table 23. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 30 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
LPC2xxx
XTAL1 XTAL2
= CL CP
XTAL
RS
CX1 CX2
002aag469
Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 22. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation Crystal load Maximum crystal External load
frequency FOSC capacitance CL series resistance RS capacitors CX1/CX2
1 MHz to 5 MHz 10 pF < 300  18 pF, 18 pF
20 pF < 300  39 pF, 39 pF
30 pF < 300  57 pF, 57 pF
5 MHz to 10 MHz 10 pF < 300  18 pF, 18 pF
20 pF < 200  39 pF, 39 pF
30 pF < 100  57 pF, 57 pF
10 MHz to 15 MHz 10 pF < 160  18 pF, 18 pF
20 pF < 60  39 pF, 39 pF
15 MHz to 20 MHz 10 pF < 80  18 pF, 18 pF

Table 23. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation Crystal load Maximum crystal External load
frequency FOSC capacitance CL series resistance RS capacitors CX1, CX2
15 MHz to 20 MHz 10 pF < 180  18 pF, 18 pF
20 pF < 100  39 pF, 39 pF
20 MHz to 25 MHz 10 pF < 160  18 pF, 18 pF
20 pF < 80  39 pF, 39 pF
14.5 RTC 32 kHz oscillator component selection
LPC2xxx
RTCX1 RTCX2
= CL CP
32 kHz XTAL
RS
CX1 CX2
002aaf495
Fig 31. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for CX1/CX2 evaluation
The RTC external oscillator circuit is shown in Figure 31. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected
externally to the microcontroller.
Table 24 gives the crystal parameters that should be used. CL is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
CL influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in Table 24
that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in
this table are calculated from the internal parasitic capacitances and the CL. Parasitics
from PCB and package are not taken into account.
Table 24. Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components
Crystal load capacitance Maximum crystal series External load capacitors CX1/CX2
CL resistance RS
11 pF < 100 k 18 pF, 18 pF
13 pF < 100 k 22 pF, 22 pF
15 pF < 100 k 27 pF, 27 pF

14.6 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors CX1, CX2, and CX3 in case
of third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of CX1 and CX2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
14.7 Standard I/O pin configuration

Figure 32 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver

• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Analog input (for ADC input channels)
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
VDD
output enable ESD

pin configured
as digital output output PIN
driver
ESD
VDD VSS
weak
pull-up
pull-up enable
weak
pin configured pull-down
as digital input pull-down enable
data input
select analog input

pin configured
as analog input analog input 002aaf496
Fig 32. Standard I/O pin configuration with analog input

14.8 Reset pin configuration
VDD
VDD
VDD
Rpu ESD
20 ns RC
reset PIN
GLITCH FILTER
ESD
VSS
002aaf274
Fig 33. Reset pin configuration

15. Package outline
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1
c
y
X
A
105
156
157 104
ZE
E HE
A A2 A1 (A 3)
wM θ
bp Lp
L
pin 1 index detail X
53
208
1 52
wM ZD v M A
e bp
D B
HD v M B
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)

A
UNIT A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y ZD ZE θ
max.
o
0.15 1.45 0.27 0.20 28.1 28.1 30.15 30.15 0.75 1.43 1.43 7
mm 1.6 0.25 0.5 1 0.12 0.08 0.08 o
0.05 1.35 0.17 0.09 27.9 27.9 29.85 29.85 0.45 1.08 1.08 0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
00-02-06
SOT459-1 136E30 MS-026
03-02-20
Fig 34. Package outline SOT459-1 (LQFP208)


TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
D B A
ball A1
index area
A2
E A
A1 detail X
e1
C
∅v M C A B
e b
∅w M C y1 C y
U
T
R
P
N
M
L e
K
J e2
H
G
F
E
D
C
B
A
ball A1 1 3 5 7 9 11 13 15 17
index area 2 4 6 8 10 12 14 16 X
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 A2 b D E e e1 e2 v w y y1
max
0.4 0.8 0.5 15.1 15.1
mm 1.2 0.8 12.8 12.8 0.15 0.08 0.12 0.1
0.3 0.6 0.4 14.9 14.9
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
06-06-01
SOT950-1 ---
06-06-14
Fig 35. Package outline SOT950-1 (TFBGA208)

16. Abbreviations
Table 25. Acronym list
Acronym Description
ADC Analog-to-Digital Converter
AHB Advanced High-performance Bus
AMBA Advanced Microcontroller Bus Architecture
APB Advanced Peripheral Bus
BLS Byte Lane Select
BOD BrownOut Detection
CAN Controller Area Network
DAC Digital-to-Analog Converter
DCC Debug Communication Channel
DMA Direct Memory Access
EOP End Of Packet
ETM Embedded Trace Macrocell
GPIO General Purpose Input/Output
IrDA Infrared Data Association
JTAG Joint Test Action Group
LCD Liquid Crystal Display
MII Media Independent Interface
MIIM Media Independent Interface Management
OHCI Open Host Controller Interface
OTG On-The-Go
PHY Physical Layer
PLL Phase-Locked Loop
POR Power-On Reset
PWM Pulse Width Modulator
RMII Reduced Media Independent Interface
SD/MMC Secure Digital/MultiMediaCard
SE0 Single Ended Zero
SPI Serial Peripheral Interface
SSI Synchronous Serial Interface
SSP Synchronous Serial Port
TTL Transistor-Transistor Logic
UART Universal Asynchronous Receiver/Transmitter
USB Universal Serial Bus

17. Revision history

Table 26. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC2470 v.4.2 20201015 Product data sheet LPC2470 v.4.1
Table 16 “Dynamic characteristics: Dynamic external memory interface”: Updated Tcy(CCLK) to
Tcy(CCLK)/2 for most parameters.
LPC2470 v.4.1 20110908 Product data sheet - LPC2470 v.4
Modifications: • Table 4 “Pin description”, Table note 9: Changed glitch filter spec from 5 ns to 10 ns.
• Table 10 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40.
• Table 16 “Dynamic characteristics: Dynamic external memory interface”: Changed td(QV) typ
and max.
LPC2470 v.4 20110908 Product data sheet - LPC2470 v.3
Modifications: • Table 4 “Pin description”: Updated description for USB_UP_LED1 and USB_UP_LED2.
• Table 6 “Limiting values”: Added “non-operating” to conditions column of Tstg.
• Table 6 “Limiting values”: Updated Table note [5].
• Table 8 “Thermal resistance value (C/W): ±15 %”: Added new table.
• Table 14 “Dynamic characteristics: Static external memory interface”: Removed “AHB clock
= 1 MHz”.
• Table 14 “Dynamic characteristics: Static external memory interface”: Swapped min/max
values for tam.
• Table 14 “Dynamic characteristics: Static external memory interface”: Updated tWEHDNV
spec.
• Table 15 “Dynamic characteristics: Dynamic external memory interface”: Removed “AHB
clock = 1 MHz”.
• Table 16 “Dynamic characteristics: Dynamic external memory interface”: Added new table.
• Section 14.7 “Standard I/O pin configuration” Updated bullets.

Table 26. Revision history …continued

Document ID Release date Data sheet status Change notice Supersedes
LPC2470 v.3 20110214 Product data sheet - LPC2470 v.2
Modifications: • Changed data sheet status to Product data sheet.
• Table 4 “Pin description”: Added Table note 14 for XTAL1 and XTAL2 pins.
• Table 4 “Pin description”: Added Table note 15 for RTCX1 and RTCX2 pins.
• Table 4 “Pin description”: Added Table note 16 for DBGEN, TMS, TDI, TRST, and RTCK
pins.
• Table 4 “Pin description”: Added Table note 17 for TCK and TDO pins.
• Table 8 “Static characteristics”: Removed Rpu.
• Table 8 “Static characteristics”: Added Table note 3 to IDD(DCDC)pd(3V3), IDD(DCDC)dpd(3V3), and
IBAT.
• Table 8 “Static characteristics”: Changed Vhys typ for I2C-bus pins from 0.5VDD to 0.05VDD.
• Added Table 10 “Dynamic characteristic: internal oscillators”.
• Added Table 11 “Dynamic characteristic: I/O pins[1]”.
• Table 13 “Dynamic characteristics: Static external memory interface”: Updated min, typical
and max values for th(D).
• Table 14 “Dynamic characteristics: Dynamic external memory interface”: Added Table
note 1.
• Table 14 “Dynamic characteristics: Dynamic external memory interface”: Updated text
under caption.
• Added Table 16 “DAC electrical characteristics”.
• Added Section 9 “Thermal characteristics”.
• Added Section 10.3 “Electrical pin characteristics”
• Added Section 14.4 “Crystal oscillator XTAL input and component selection”.
• Added Section 14.5 “RTC 32 kHz oscillator component selection”.
• Added Section 14.7 “Standard I/O pin configuration”
• Added Section 14.8 “Reset pin configuration”
• Moved Figure 13 “External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)”
to below Table 9 “Dynamic characteristics”.
• Updated Figure 19 “ADC characteristics”.
LPC2470 v.2 20091015 Preliminary data sheet - LPC2470 v.1
Modifications: • Table 6: Changed ESD min/max to 2500/+2500.
• Table 8: Updated conditions and typical values for IDD(DCDC)act(3V3).
• Table 8: Updated Table note 13.
• Table 8: Updated min, typical and max values for oscillator pins.
• Added deep power-down mode information.
• Added Section 11.3 “XTAL1 input”.
• Figure 23: Changed ISP1301 to ISP1302.
• Figure 24: Changed ISP1301 to ISP1302.
• Section 7.26.3 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3).
LPC2470 v.1 20081027 Preliminary data sheet - -

18. Legal information
18.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
Draft — The document is a draft version only. The content is still under
NXP Semiconductors products in such equipment or applications and
internal review and subject to formal approval, which may result in
therefore such inclusion and/or use is at the customer’s own risk.
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these
information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no
use of such information. representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications
for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors
full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product
sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP
office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and
full data sheet shall prevail. products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their
data sheet shall define the specification of the product as agreed between applications and products.
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however, NXP Semiconductors does not accept any liability related to any default,
shall an agreement be valid in which the NXP Semiconductors product is damage, costs or problem which is based on any weakness or default in the
deemed to offer functions and qualities beyond those described in the customer’s applications or products, or the application or use by customer’s
Product data sheet. third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
18.3 Disclaimers the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly own risk, and (c) customer fully indemnifies NXP Semiconductors for any
states that this specific NXP Semiconductors product is automotive qualified, liability, damages or failed product claims resulting from customer design and
the product is not suitable for automotive use. It is neither qualified nor tested use of the product for automotive applications beyond NXP Semiconductors’
in accordance with automotive testing or application requirements. NXP standard warranty and NXP Semiconductors’ product specifications.
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in 18.4 Trademarks
automotive applications to automotive specifications and standards, customer
Notice: All referenced brands, product names, service names and trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
are the property of their respective owners.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond I2C-bus — logo is a trademark of NXP B.V.
NXP Semiconductors’ specifications such use shall be solely at customer’s
19. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 7.19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 38
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 38
7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3
7.21 General purpose 32-bit timers/external event
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 40
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 41
7 Functional description . . . . . . . . . . . . . . . . . . 26 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.1 Architectural overview . . . . . . . . . . . . . . . . . . 26 7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 41
7.2 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 27 7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7.3 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.25 Clocking and power control . . . . . . . . . . . . . . 42
7.4 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 28 7.25.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 42
7.4.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 29 7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 42
7.5 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 29 7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 42
7.6 External memory controller. . . . . . . . . . . . . . . 29 7.25.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 43
7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.7 General purpose DMA controller . . . . . . . . . . 30 7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 43
7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.8 Fast general purpose parallel I/O . . . . . . . . . . 31 7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.9 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 32 7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 44
7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 45
7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.25.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 45
7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 45
7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 34 7.26.2 Boot process . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.26.3 Brownout detection . . . . . . . . . . . . . . . . . . . . 46
7.11.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 34 7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 47
7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 35 7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 47
7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.27 Emulation and debugging . . . . . . . . . . . . . . . 47
7.12 CAN controller and acceptance filters . . . . . . 35 7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 47
7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 47
7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 49
7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 9 Thermal characteristics . . . . . . . . . . . . . . . . . 50
7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10 Static characteristics . . . . . . . . . . . . . . . . . . . 51
7.15 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 54
7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.2 Deep power-down mode . . . . . . . . . . . . . . . . 55
7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 37 10.3 Electrical pin characteristics. . . . . . . . . . . . . . 57
7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
11 Dynamic characteristics. . . . . . . . . . . . . . . . . 58
7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 37
11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 59
7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 37
11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 59
7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
continued >>

11.4 Static external memory interface . . . . . . . . . . 60

11.5 Dynamic external memory interface . . . . . . . . 62
11.6 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
12 ADC electrical characteristics . . . . . . . . . . . . 66
13 DAC electrical characteristics . . . . . . . . . . . . 69
14 Application information. . . . . . . . . . . . . . . . . . 69
14.1 LCD panel signal usage . . . . . . . . . . . . . . . . . 69
14.2 Suggested boot memory interface solutions. . 72
14.3 Suggested USB interface solutions . . . . . . . . 73
14.4 Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
14.5 RTC 32 kHz oscillator component selection . . 80
14.6 XTAL and RTCX Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . . 81
14.7 Standard I/O pin configuration . . . . . . . . . . . . 81
14.8 Reset pin configuration . . . . . . . . . . . . . . . . . . 82
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 83
16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 85
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 86
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 88
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 88
18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 89
19 Contact information. . . . . . . . . . . . . . . . . . . . . 89
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 October 2020
Document identifier: LPC2470

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LPC2470

Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD,

The LPC2470 microcontroller incorporates an LCD controller, a 10/100 Ethernet Media

2. Features and benefits

Product data sheet Rev. 4.2 — 15 October 2020 2 of 91

4.1 Ordering options

LPC2470FBD208 n/a 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1 40 C to

Product data sheet Rev. 4.2 — 15 October 2020 3 of 91

16 kB USB DEVICE/ VBUS

EINT3 to EINT0 8 × LCD control

SCL0, SCL1, SCL2

Fig 1. LPC2470 block diagram

Product data sheet Rev. 4.2 — 15 October 2020 4 of 91

Fig 2. LPC2470 pinning LQFP208 package

Transparent top view

Fig 3. LPC2470 pinning TFBGA208 package

Table 3. Pin allocation table

Product data sheet Rev. 4.2 — 15 October 2020 5 of 91

Table 3. Pin allocation table …continued

Product data sheet Rev. 4.2 — 15 October 2020 6 of 91

Table 3. Pin allocation table …continued

Product data sheet Rev. 4.2 — 15 October 2020 7 of 91

Table 3. Pin allocation table …continued

Product data sheet Rev. 4.2 — 15 October 2020 8 of 91

6.2 Pin description

Product data sheet Rev. 4.2 — 15 October 2020 9 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 10 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 11 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 12 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 13 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 14 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 15 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 16 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 17 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 18 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 19 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 20 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 21 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 22 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 23 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 24 of 91

Table 4. Pin description …continued

Product data sheet Rev. 4.2 — 15 October 2020 25 of 91

7.1 Architectural overview

The ARM7TDMI-S processor is a general purpose 32-bit microprocessor, which offers