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Question Bankemsfinal

The document contains a question bank for an emerging materials subject with questions ranging from defining concepts like grain boundaries and anelasticity to calculating properties like atomic packing factor. Questions cover topics such as bonding, crystal structures, defects, mechanical properties and more.

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dazzlingcolden
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65 views10 pages

Question Bankemsfinal

The document contains a question bank for an emerging materials subject with questions ranging from defining concepts like grain boundaries and anelasticity to calculating properties like atomic packing factor. Questions cover topics such as bonding, crystal structures, defects, mechanical properties and more.

Uploaded by

dazzlingcolden
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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QUESTION BANK FOR B.

TECH
SUBJECT CODE: UGE 21102
SUBJECT NAME: Emerging Material and its Applications
BRANCH: ME, CSE

Questions carrying 02 marks

1. Define grain boundaries in solid materials.


For crystalline materials(rather say polycrystalline), when liquid begin to solidify then the
atoms stop moving around much and starts to gather in smaller volume (get packed). During
this some atoms gather around and form small groups in such a way that in each group atoms
are arranged in a particular orientation and also translate in a particular manner. Thses groups
of ordered atoms forms a region called a grain and the area between these type of regions is
called a grain boundary. But we can’t see atoms that easily (or rather say we don’t), so
generally we see these grain boundaries as 2D-deffects in the crystal structure in the
microstructure of a material surfaces .

2. Define anelasticity in solid materials.

Anelasticity is a property of materials that describes their behavior when undergoing


deformation or stress
Tells us about the little bit permanent deformation that happens
3. State the difference between ionic, covalent and metallic bonding in solids?

/
4. Define ductility and malleability property of a material?

5. Write the different types of point defects present in crystal?

https://www.youtube.com/watch?v=Vccet890aC8

6. What is XRD? Define Bragg’s Law of diffraction?

X-ray diffraction (XRD) is a versatile non-destructive analytical technique used to analyze


physical properties such as phase composition, crystal structure and orientation of powder,
solid and liquid samples.

Brag’s Law states the following:


When the X-ray is incident onto a crystal surface, its angle of incidence, θ, will reflect with the
same angle of scattering, θ. And, when the path difference, d is equal to a whole number, n, of
wavelength, λ, constructive interference will occur.
nλ = 2d sinΘ

7. What types of interaction holds the molecules together in polar molecular solids?
The atoms or molecules that make up polar Molecular solids are kept together by
greater dipole-dipole interactions.

8. Explain the term Miller Indices of a lattice plane in Crystal System?

Are set off three number used to specify lattice plane.

9. What do you mean by Young Modulus?


*Stiffness of a material
**denoted by E

10. Write the different types of line defects present in crystal?


Types of line defects
(i)Edge dislocation: When defect in a crystal occurs due to absence of extra half plane of
atoms or presence of half plane of atoms then this type of line defect is called edge dislocation
or edge imperfection.

(ii)Screw dislocation: Screw dislocation can be formed in a crystal structure by applying


upward and downward shear stress to regions of a perfect crystal which have been separated
by a cutting plane.
11. What do you mean by Proportional limit and Elastic limit of materials?

The elastic limit differs from the proportional limit in that the elastic limit is the maximum
pressure that may be given to a material without it deforming. The proportional limit of a
material is defined as the point at which stress and strain are directly proportional to one
another.
12. A crystal plane intersects three coordinate axes at (1,0,0), (0,1,0),
(0,0,1) respectively. Calculate the miller indices of the crystal plane.
13. Define engineering stress and true stress.

Engineering stress = applied force/original cross section


True stress =applied force/changing cross section area
Questions carrying 05 marks

14. With suitable diagram discuss metallic, ionic, and covalent bonding in solids.
15. Define Young Modulus? Draw the stress-strain curve for materials and describe
the various regions of stress-strain curve?
Explaining Stress-Strain Graph
The different regions in the stress-strain diagram are:

(i) Proportional Limit


It is the region in the stress-strain curve that obeys Hooke’s Law. In this limit, the stress-
strain ratio gives us a proportionality constant known as Young’s modulus. The point OA in
the graph represents the proportional limit.

(ii) Elastic Limit


It is the point in the graph up to which the material returns to its original position when the
load acting on it is completely removed. Beyond this limit, the material doesn’t return to its
original position, and a plastic deformation starts to appear in it.

(iii) Yield Point


The yield point is defined as the point at which the material starts to deform plastically.
After the yield point is passed, permanent plastic deformation occurs. There are two yield
points (i) upper yield point (ii) lower yield point.

(iv) Ultimate Stress Point


It is a point that represents the maximum stress that a material can endure before failure.
Beyond this point, failure occurs.

(v) Fracture or Breaking Point


It is the point in the stress-strain curve at which the failure of the material takes place.

16. What do you mean by crystal defects? Describe in detail the various types of
line defects in crystal? Classify the various nanoparticle synthesis techniques
based on Physical and Chemical Methods?

crystal defect, imperfection in the regular geometrical arrangement of the atoms in a


crystalline solid

(i)Edge dislocation: When defect in a crystal occurs due to absence of extra half plane of
atoms or presence of half plane of atoms then this type of line defect is called edge dislocation
or edge imperfection.

(ii)Screw dislocation: Screw dislocation can be formed in a crystal structure by applying


upward and downward shear stress to regions of a perfect crystal which have been separated
by a cutting plane.

17. What is Atomic Packing Fraction? Calculate the atomic packing fraction of (i)
simple cubic crystal, (ii) base centered cubic crystal and (iii) face centered cubic
crystal?

https://testbook.com/question-answer/what-is-the-atomic-packing-factor-for-bcc-
and-fcc--608661f1a340fe6a240be2cc
18. Describe in detail the various types of point defects in crystal?

19. Discuss the various point defects with figures.

20. What is the difference between Hydrogen bonding and Vander wall bonding?
Mention with examples of materials.(copy)

Hydrogen bonding example


Water (H2O): In water molecules, hydrogen bonding occurs between the hydrogen atoms
of one molecule and the oxygen atom of another. This leads to the unique properties of
water, such as high boiling and melting points.

Vander der Waals forces


Noble Gases (e.g., helium, neon): London dispersion forces are the dominant intermolecular
forces in noble gases. These forces arise due to temporary fluctuations in electron
distribution, leading to temporary dipoles.

21. Define atomic factor? Calculate the atomic packing factor for BCC and FCC unit
cell.

22. Define the elastic limit, yield point, ultimate strength and fracture point related
to stress-strain curve of materials?

23. Define tensile, compressive and shear stress. A piece of copper originally 50 cm
long is pulled intension with a stress of 276 MPa. If the deformation is entirely
elastic, what will be the resultant elongation? (Given elastic modulus of Cu is 110
Gpa).

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