Example 2-Heat Conduction
Example 2-Heat Conduction
1. As shown in Fig. 1, a thin silicon chip and a 8-mm-thick aluminum substrate (k=
238 W/m-K) are separated by a 0.02-mm-thick epoxy joint (thermal resistance=
0.9x10-4 m2-K/W). The chip and substrate are each 10 mm on a side, and their
exposed surfaces are cooled by air which is at a temperature of 25 0C and provides
a convection coefficient of 100 W/m2-K. If the chip dissipates 104 W/m2 under
normal condition, will it operate below a maximum allowable temperature of 85
0
C?
Fig. 1
Fig. 2
1
self-cleaning oven design that involves use of a composite window separating the
oven cavity from the room air. The composite is to consist of two high-
temperature plastics (A and B) of thickness LA=2LB and thermal conductivities kA=
0.15 W/mK and kB=0.08 W/mK. During the self-cleaning process, the oven wall
and air temperatures, Tw and Ta, are 400 ℃, while the room air temperature T is
25 ℃. The inside convection and radiation heat transfer coefficients hi and hr, as
well as the outside convection coefficient ho, are each approximately 25 W/m2K.
What is the minimum window thickness, L=LA+LB, needed to ensure a
temperature that is 50 ℃ or less at the outer surface of the window? This
temperature must not be exceeded for safety reasons.
Fig. 3 Fig. 4
Fig. 5
2
air whereas the heat transfer coefficient hA for the combustion product is unknown.
The thickness of the slab is L= 0.8 m and the volumetric heat generation rate is =
5x103 W/m3. The thermal conductivity, k, of the slab is unknown and might vary
through its thickness.
(a) Assuming a one-dimensional steady-state process, write down the system of
equations governing the local temperature of the slab.
(b) Experimental data obtained at steady state indicates the temperature distribution
is linear as shown in the diagram. Using the data, determine the surface heat
fluxes and as well as the heat transfer coefficient hA.
(c) Find an expression for k(x) based on the experimental data.
Fig. 3
Fig. 6
Fig. 7
8.
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