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Lx3301a PB v2

The LX3301A is an integrated circuit that interfaces with inductive sensors and processes their output. It contains analog and digital processing circuits as well as an embedded microcontroller. The IC provides linearized sensor measurements with high accuracy and integrated memory to store calibration and configuration data.

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0% found this document useful (0 votes)
31 views2 pages

Lx3301a PB v2

The LX3301A is an integrated circuit that interfaces with inductive sensors and processes their output. It contains analog and digital processing circuits as well as an embedded microcontroller. The IC provides linearized sensor measurements with high accuracy and integrated memory to store calibration and configuration data.

Uploaded by

muyperezoso
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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LX3301A Inductive Sensor Interface IC with Embedded MCU

Description
The LX3301A is a member of Microsemi’s new family of smart sensor interface products. Designed to process inductive
sensors, which are based upon linear variable differential transformer (LVDT) principles, this new device integrates two complete
analog channels, oscillator/exciter, 32-bit RISC processor, non-volatile configuration memory, and analog or PWM outputs.

VDD
VIN
Clock/
Regulator Watchdog

OSC1 EEPROM
Feedback
OSC2
ROM
DOUT

EMI PWM
CL1 Filter
Demod AAF ADC Filter 32 - bit

MUX
AOUT
MCU
DAC
EMI
CL2 Demod AAF ADC Filter
Filter

EEWR
SUB

GND
GNDCL

Figure 1: Top-Level Block Diagram

In typical operation, inputs from the inductive sensor are conditioned, demodulated, and converted into 13-bit values. The
MCU processes these values to produce a linearized measurement value with either 12-bit accuracy (analog output) or 13-bit
accuracy (PWM output.) Internal non-volatile memory allows the user to configure various parameters within the IC, including
five (5) calibration points, origin/end points, and low and high plateau levels. The internal non-volatile memory is configured
via the VIN power pin, which allows a sensor assembly to be configured without the need for additional programming pins.

Key Features
• Embedded 32-bit processing engine with 12 kB • User-programmable 16 x 16-bit non-volatile
program memory configuration memory
• Two sensor input channels with integrated demodulator • Multiple diagnostics features (ISO 26262 compliant)
• Internal oscillator with frequency range of 1 to 5 MHz • Host interface: Analog output or PWM
• Dual 13-bit ADC with sample rates to 2 kHz • 4.5 V to 5.6 V input voltage; 8 mA (typical) operating current, not
• Linearization algorithm with: including exciter tail current
o Five user-defined linearization points • -40 to 125 °C operation, AEC-Q100 grade 1 certified
o Programmable origin and end points
o 6 segments linearization
o Programmable low and high plateau levels
LX3301A Inductive Sensor Interface IC with Embedded MCU

System Power

VIN
OSC1 GND SUB
OSC2 DOUT OSC1

LX3301A
VDD AOUT/DOUT AOUT OSC2
System VIN EEWR
Sensor LX3301A Controller
CL1
VDD CL2
NC GNDCL
CL2
EEWR NC CL1
GND
GNDCL

Figure 3: 14-TSSOP Pin Assignments

Figure 2: LVDT/Inductive Sensor Configuration


Target Applications
The LX3301A includes integrated diagnostics features, The LX3301A is an ideal solution for measuring mechanical
which regularly monitor various functions within the IC and movement (linear, angular/rotation, and proximity) in a wide
report conditions which are outside of specified parameters. variety of applications in automotive, industrial, aerospace,
In the event of a detect failure, the device drives the output and commercial applications including:
to a pre-defined diagnostics level. The internal diagnostics • Rotor position sensing (brushless DC motors)
information can also be output via SENT-compatible • Robotic arm positioning
protocol for system development and debug purposes. • Fluid level sensing
The LX3301A is compliant with ISO 26262 and rated for • Proximity detection (industrial automation)
ASIL C applications. Packaged in a 14-TSSOP package, the device • Gear position/travel (automotive)
operates (to specification) from -40 to 125 °C and maintains full
functionality to 150 °C. The LX3301A is certified to AEC-Q100 grade 1. For more information about Microsemi’s product portfolio for
automotive and industrial applications, visit

http://www.microsemi.com/applications/automotive
http://www.microsemi.com/applications/industrial

Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume
any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not
be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance
and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the
Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults,
and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with
regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the
information in this document or to any products and services at any time without notice.

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for com-
munications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened
analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization
devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete com-
ponents; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as
well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600
employees globally. Learn more at www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100 ©2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other
Sales: +1 (949) 380-6136 trademarks and service marks are the property of their respective owners.
Fax: +1 (949) 215-4996
email: [email protected]
www.microsemi.com

LX3301A Rev. 2.0 07-15

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