Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

LDC0851 Differential Inductive Switch

1 Features 3 Description
•
1 Threshold tolerance: <1 % of coil diameter The LDC0851 is a close range inductive switch ideal
for contactless and robust applications such as
• Temperature stable switching operation presence detection, event counting, and simple
• Average Supply Current: < 20 µA @ 10 sps buttons.
• Shutdown Supply Current: 140 nA The switch is triggered when a conductive object
• Push-pull output comes within close proximity of the sensing coil.
• Resistor Programmable Threshold Hysteresis is included to ensure a reliable switching
threshold immune to mechanical vibration. The
• Insensitive to DC Magnetic Fields
differential implementation prevents false triggering
• Contactless Switching Operation over environmental factors such as temperature
• Sample Rate up to 4 ksps variation or humidity effects.
• Supply Voltage: 1.8 V – 3.3 V Inductive sensing technology provides reliable and
• Operating Temperature Range: -40 to 125 °C accurate sensing even in the presence of dirt, oil, or
moisture making it ideal for use in harsh or dirty
2 Applications environments. The solid state switching eliminates
the failures due to reed, mechanical, or contact
• Open/Close Switches switching. Unlike competitive products, the LDC0851
– Home Security and Tamper Detection does not require magnets, nor is it affected by DC
– Printers magnetic fields.
– Personal Electronics Device Information(1)
• Event Counting PART NUMBER PACKAGE BODY SIZE (NOM)
– Fan Speed RPM Detection LDC0851 WSON-8 2mm x 2mm
– Rotary Encoder (1) For all available packages, see the orderable addendum at
– Flow Meters the end of the data sheet.

– Incremental Knob / Dial

• Simple Buttons
– Industrial Keypads
– Personal Electronics
• Industrial Proximity Switch

4 Simplified Schematic

LDC0851 Output High

Differential (LS > LR)
LDC Core
LSENSE
Inductance LS
Converter
+
OUT
LCOM
Sensor Output Low
LR
Approaching Cap + ± (LS < LR)
Metal Target LREF Inductance
Converter ± dswitch
Sense Reference
Coil Coil
1.8 V
dswitch 1.8 V
Offset Adjust VDD
R1
ADJ
4-bit ADC Power EN
Management
R2 CBYP
GND

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 10
2 Applications ........................................................... 1 8.3 Feature Description................................................. 11
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 18
4 Simplified Schematic............................................. 1 9 Application and Implementation ........................ 19
9.1 Application Information............................................ 19
5 Revision History..................................................... 2
9.2 Typical Application ................................................. 21
6 Pin Configuration and Functions ......................... 3
10 Power Supply Recommendations ..................... 28
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 29
11.1 Layout Guidelines ................................................. 29
7.2 ESD Ratings ............................................................ 4
11.2 Layout Example .................................................... 29
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 31
7.5 Electrical Characteristics........................................... 5 12.1 Device Support...................................................... 31
7.6 Interface Voltage Levels ........................................... 5 12.2 Community Resources.......................................... 31
7.7 Timing Requirements ................................................ 6 12.3 Trademarks ........................................................... 31
7.8 Typical Characteristics .............................................. 7 12.4 Electrostatic Discharge Caution ............................ 31
12.5 Glossary ................................................................ 31
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10 13 Mechanical, Packaging, and Orderable
Information ........................................................... 31

5 Revision History
Changes from Original (December 2015) to Revision A Page

• Product Preview to Production Data Release ....................................................................................................................... 1

2 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

6 Pin Configuration and Functions

DSG Package
8-Pin WSON with DAP
Top View

LCOM 1 8 VDD

LSENSE 2 7 GND
DAP
LREF 3 6 EN

ADJ 4 5 OUT

Pin Functions
PIN (1)
TYPE DESCRIPTION
NAME NO.
LCOM 1 A Common coil input
LSENSE 2 A Sense coil input
LREF 3 A Reference coil input
ADJ 4 A Threshold adjust pin
OUT 5 O Switch output
EN 6 I Enable input
GND 7 G Ground
VDD 8 P Power Supply
DAP DAP G Connect to Ground for improved thermal performance (2)

(1) I = Input, O = Output, P = Power, A = Analog, G = Ground

(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP
can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the
DAP as the primary ground for the device. The device GND pin must always be connected to ground.

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Supply Voltage Range 3.6 V
Voltage on LSENSE, LREF, and EN -0.3 3.6 V
Vi
Voltage on ADJ and LCOM -0.3 2 V
IA Current LSENSE, LREF, and VOUT 5 mA
TJ Junction Temperature -55 150 °C
Tstg Storage Temperature -65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±1000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±250

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply Voltage 1.71 3.46 V
TA Operating Temperature -40 125 °C

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
LDC0851
THERMAL METRIC (1) DSG (WSON) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 67.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 89.3 °C/W
RθJB Junction-to-board thermal resistance 37.3 °C/W
ψJT Junction-to-top characterization parameter 2.4 °C/W
ψJB Junction-to-board characterization parameter 37.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).

4 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

7.5 Electrical Characteristics (1)

Over recommended operating conditions unless otherwise noted. VDD= 3.3 V, EN tied to 3.3 V, TA=25 °C, ADJ tied to GND.
PARAMETER TEST CONDITIONS MIN (2) TYP (3) MAX (2) UNIT
POWER
VDD Supply Voltage 1.71 3.46 V
(4)
ISTATIC Static Supply Current 0.70 mA
Dynamic Supply Current (not including ƒSENSOR = 15 MHz
IDYN 0.66 mA
sensor current) (4) CPARASITIC = 22 pF
ISD Shutdown Mode Supply Current 0.14 1 µA
SENSOR
VDD = 1.71 V 4.35 mA
ISENSOR_MAX Maximum sensor current (4)
VDD = 3.3 V 6 mA
CTOTAL = 33 pF
2.5
(5)
VDD = 1.71 V
LSENSOR_MIN Sensor Minimum Inductance
CTOTAL = 33 pF
1.8 µH
VDD = 3.3 V
Sensor inductance = 2 µH
ƒSENSOR_MAX Max Sensor Resonant Frequency (5) 19 MHz
CTOTAL = 33 pF
Minimum total capacitance on LCOM (5)
CTOTAL Includes parasitic pin capacitance and 33 pF
PCB parasitic capacitance
Pin parasitic capacitance on LCOM 12 pF
CIN Pin parasitic capacitance on LREF and
8 pF
LSENSE
DETECTION
dHYST Switching distance hysteresis (6) 2.5 %
dTOL Switching threshold tolerance (6) 0.1 %
THRESHOLD ADJUST
VADJ Adjust input range 0 VDD/2 V
VADJ_TOL Adjust threshold tolerance ±6 mV

(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Limits are ensured by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(4) Refer to section Active Mode for a description and calculation of the various supply currents.
(5) See Sensor Design for sensor guidance.
(6) Two matched 10 mm diameter sensors were used with a switching distance of 3 mm. See Hysteresis for more information.

7.6 Interface Voltage Levels

PARAMETER MIN TYP MAX UNIT
VIH Input High Voltage 0.8ˣVDD V
VIL Input Low Voltage 0.2ˣVDD V
VOH Output High Voltage(1mA source current) VDD-0.4 V
VOL Output Low Voltage (1mA sink current) 0.4 V

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

7.7 Timing Requirements

Over recommended operating conditions unless otherwise noted. VDD= 3.3 V, EN tied to 3.3 V, TA=25 °C, ADJ tied to GND.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOLTAGE LEVELS
tCONVERSION Conversion time ƒSENSOR = 15 MHz 290 µs
tDELAY Output delay time (Response time) ƒSENSOR = 15 MHz 580 µs
tSTART Start-up time 450 µs
tAMT Shutdown-to-active mode transition time 450 µs
tSMT Active-to-shutdown mode transition time <1 µs

VDD

tD

EN

tD

LREF

tD

No metal Metal Metal

LSENSE Present Present Present
fsense = fref fsense > fref fsense > fref
tD

OUT Power-on Start State 1st Sample Output 2nd Sample Output

tCONVERSION tCONVERSION tCONVERSION tD

ttSTARTt
t(1st Sample)t t(2nd Sample)t t(3rd Sample)t

ttDELAYt

Figure 1. Start-up and Delay Time Diagram

Refer to Power-Up Conditions for more information on the Power-On Start State.

VDD
t

LCOM

EN

Metal
1st Sample Output
OUT
Detected
Power Down State (HIGH) 1st sample in progress
Metal Detected (LOW)
(LOW) (HIGH)
t
tCONVERSION
ttAMTt
t(1st Sample)t
ttSMTt

Figure 2. Shutdown and Resume Active Mode Timing Diagram

6 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

7.8 Typical Characteristics

Common test conditions (unless specified otherwise): VDD = 3.3 V, Sense coil diameter = reference coil diameter, Target:
Aluminum, 1.5 mm thickness, Target area / Coil area > 100%

12 4
Switch ON Switch ON
Switch OFF 3.5 Switch OFF
10
Switching Distance (mm)

Switching Distance (mm)

3
8
2.5

6 2

1.5
4
1
2
0.5

0 0
1 2 3 4 5 6 7 8 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Target Distance to LREF Coil (mm) D001
ADJ Code D002
Basic Operation Mode ADJ Code = 0 Threshold Adjust Mode No reference target
Coil diameter = 10 mm Coil diameter = 10 mm

Figure 3. Switching Distance vs. LREF Target Distance Figure 4. Switching Distance vs. ADJ code
120 80
Switch ON (dcoil = 6 mm) Switch ON (dcoil = 6 mm)
Switching Distance (% of coil diameter)

Switching Distance (% of coil diameter)

Switch ON (dcoil = 15 mm) 70 Switch ON (dcoil = 15 mm)

100 Switch ON (dcoil = 29 mm) Switch ON (dcoil = 29 mm)
Switch OFF (dcoil = 6 mm) 60 Switch OFF (dcoil = 6 mm)
Switch OFF (dcoil = 15 mm) Switch OFF (dcoil = 15 mm)
80 Switch OFF (dcoil = 29 mm) 50 Switch OFF (dcoil = 29 mm)

60 40

30
40
20
20
10

0 0
0 20 40 60 80 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Target Distance to LREF Coil (% of coil diameter) D003
ADJ Code D004
Basic Operation Mode ADJ Code = 0 Threshold Adjust Mode No reference target
Coil diameter = 6 mm, 15 mm, 29 mm Coil diameter = 6 mm, 15 mm, 29 mm

Figure 5. Normalized Switching Distance vs. LREF Target Figure 6. Normalized Switching Distance vs. ADJ Code
Distance
240 100
dcoil = 29 mm
dcoil = 15 mm 90
220
dcoil = 6 mm
Sensor Inductance (Ls / Lr%)

80
Sensor Frequency (fs / fr%)

200 70
60
180
50
160
40

140 30
20 dcoil = 29 mm
120 dcoil = 15 mm
10
dcoil = 6 mm
100 0
0 20 40 60 80 100 0 20 40 60 80 100
Target Distance to LSENSE Coil (% of coil diameter) D005
Target Distance to LSENSE Coil (% of coil diameter) D006
LSENSE frequency (fs) varied LREF frequency (fr) fixed LSENSE inductance (Ls) varied LREF inductance (Lr) fixed

Figure 7. Frequency vs. Distance Figure 8. Inductance vs. Distance

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Typical Characteristics (continued)

Common test conditions (unless specified otherwise): VDD = 3.3 V, Sense coil diameter = reference coil diameter, Target:
Aluminum, 1.5 mm thickness, Target area / Coil area > 100%
20 20
CTOTAL < 33 pF CTOTAL < 33 pF
18 18
16 16
14 14

Inductance (µH)
Inductance (µH)

12 12
10 Valid Region 10 Valid Region
8 8
6 6
4 4
2 2
ISENSOR > 4.35 mA ISENSOR > 6 mA
0 0
0 5 10 15 20 0 5 10 15 20
Sensor Frequency (MHz) D007
Sensor Frequency (MHz) D008

ISENSOR_MAX = 4.35 mA ISENSOR_MAX = 6 mA

Specified for closest target proximity or minimum inductance in the Specified for closest target proximity or minimum inductance in the
application. application.

Figure 9. Sensor Design Space for VDD = 1.8 V Figure 10. Sensor Design Space for VDD = 3.3 V
10 1.5
2 µH
20 µH
Dynamic Supply Current (mA)

200 µH 1.4
Sensor Current (mA)

1.3
1
1.2

-40°C 50°C
1.1 -25°C 75°C
0°C 100°C
25°C 125°C
0.1 1
1.7 2.2 2.7 3.2 3.7 1.7 2.2 2.7 3.2 3.7
VDD (V) D009
VDD (V) D010
CTOTAL = 100 pF CBOARD = 12 pF
ƒSENSOR = 30 MHz
Figure 11. ISENSOR vs. VDD
Figure 12. IDYN vs. VDD
0.7 10
-40°C 50°C d 25°C 75 - 100°C
-25°C 75°C 25 - 50°C 100 - 125°C
0.65 0°C 100°C 50 - 75°C
Static Supply Current (mA)

25°C 125°C 1
Shutdown Current (µA)

0.6

0.55 0.1

0.5
0.01
0.45

0.4 0.001
1.7 2.2 2.7 3.2 3.7 1.7 2.1 2.5 2.9 3.3 3.7
VDD (V) D011
VDD (V) D012
Figure 13. ISTATIC vs. VDD Figure 14. ISD vs. VDD

8 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Typical Characteristics (continued)

Common test conditions (unless specified otherwise): VDD = 3.3 V, Sense coil diameter = reference coil diameter, Target:
Aluminum, 1.5 mm thickness, Target area / Coil area > 100%
100 0
2 µH
5 µH
10 µH

Sensor Frequency Shift (%)

-2
20 µH
Sensor Current (µA)

10
-4

-6
1

-8 fSENSOR = 0.5 MHz

fSENSOR = 4 MHz
fSENSOR = 12 MHz
0.1 -10
0 5 10 15 20 1.7 2.2 2.7 3.2 3.7
Sensor Frequency (MHz) D013
VDD (V) D014
See Equation 4 Normalized to frequency at VDD = 3.6 V

Figure 15. ISENSOR vs. ƒSENSOR Figure 16. ƒSENSOR Shift vs. VDD

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

8 Detailed Description

8.1 Overview
The LDC0851 is an inductance comparator with push/pull output. It utilizes a sensing coil and a reference coil to
determine the relative inductance in a system. The push/pull output (OUT) switches low when the sense
inductance drops below the reference and returns high when the reference inductance is higher than the sense
inductance. Matching the sense and reference coils is important to maintain a consistent switching distance over
temperature and to compensate for other environmental factors. The LDC0851 features internal hysteresis to
prevent false switching due to noise or mechanical vibration at the switching threshold. The switching threshold is
set by the sensor characteristics and proximity to conductive objects, which is considered Basic Operation Mode
described further in section Basic Operation Mode. The LDC0851 also features a Threshold Adjust Mode where
an offset is subtracted from the reference inductance to change the effective switching point as described in
section Threshold Adjust Mode.
The sensing coil is connected across the LSENSE and LCOM pins and the reference coil is connected across
the LREF and LCOM pins. A sensor capacitor is connected from LCOM to GND to set the sensor oscillation
frequency. The sensor capacitor is common to both LSENSE and LREF making the inductance measurement
differential.

8.2 Functional Block Diagram

LDC0851
Differential
LDC Core
Sense Output High
Coil LSENSE (LS > Adjusted LR)
Inductance
LS
Converter
+
LCOM OUT

Sensor
Cap
+ Adjusted LR
±
Inductance
LREF Output Low
Converter ± (LS < Adjusted LR)
Reference
Coil
Switch

Mode Select

0: Basic Operation VDD

VDD
1 ± 15: Threshold Adjust
VDD
R1
ADJ Offset
4-bit ADC Power EN
Management
R2 CBYP
GND

10 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

8.3 Feature Description

8.3.1 Basic Operation Mode
The LDC0851 is configured for Basic Operation mode when the ADJ pin is tied to ground. Two identical coils
should be used for LSENSE and LREF. The switching point occurs when the inductances of both coils are equal.
Basic Operation mode can be used for a wide variety of applications including event counting or proximity
sensing. An example showing gear tooth counting can be found in section Event Counting.
For proximity sensing the switching point can be set by placing a conductive target at a fixed distance from the
reference coil as shown in Figure 17. The output will switch when a conductive target approaches LSENSE and
reaches the same distance set by the fixed reference target. For reliable and repeatable switching it is
recommended to place the reference target at a distance less than 40% of the coil diameter from the reference
coil.
Output High
(LS > LR)
LS (Inductance)

LR (Inductance)

Output Low
(LS < LR)
Target Distance
’ 0
dswitch = d

Differential LDC0851
Sense
LDC Core
Movable
Coil LSENSE
Metal Target
Inductance
LS
Converter
+
LCOM OUTPUT

Sensor
Fixed Cap + LR
±
Reference LREF Inductance
Converter ±
Reference
Coil

Switching distance set

by Reference Target Mode Select

0: Basic Operation VDD

1 ± 15: Threshold Adjust
VDD

ADJ Offset
4-bit ADC Power EN
Management
CBYP
GND

Figure 17. Basic Operation Mode Diagram for Distance Sensing With Reference Target

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Feature Description (continued)

In some systems adding a reference target at a fixed height to set the switching distance is not feasible.
Therefore to set the switching distance a small amount of mismatch between the sense and reference coils can
be introduced. To achieve the maximum switching distance the reference inductance should be approximately
0.4% less than the sense inductance as shown in Figure 18 below. The 0.4% mismatch will ensure that the
output will switch off when the target is removed.
Output High
(LS > LR)

LR (Inductance)
LS (Inductance)

Output Low
(LS < LR)

Target Distance
’ 0
dswitch § 0.8 x dcoil
Differential LDC0851
Sense
LDC Core
Movable
Metal Target Coil LSENSE
Inductance
LS
Converter
+
LCOM OUTPUT

Sensor
Cap + LR
±
LREF Inductance
Converter ±
Reference
Coil

Switching distance set by

mismatch of Sense and Mode Select
Reference Coils
0: Basic Operation VDD
1 ± 15: Threshold Adjust
VDD

ADJ Offset
4-bit ADC Power EN
Management
CBYP
GND

Figure 18. Basic Operation Mode Diagram for Distance Sensing With Mismatched Coils

12 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Feature Description (continued)

8.3.2 Threshold Adjust Mode
In Threshold Adjust mode, an offset inductance is subtracted from LREF to alter the switching threshold without
the use of a reference target. In order to configure the LDC0851 for Threshold Adjust mode, place a resistor
divider between VDD and GND as shown in Figure 19. The threshold adjust values can then be easily changed
as described in section Setting the Threshold Adjust Values. Threshold adjust mode can be used in a variety of
applications including coarse proximity sensing and simple button applications as shown in Coarse Position
Sensing. Two example coil configurations for proximity sensing are shown below for side by side coil orientation
in Figure 19 as well as stacked configuration in Figure 20.
Output High
(LS > Adjusted LR)
LSENSE
...
Adjusted LR
(ADJ = 1)

Adjusted LR
(ADJ = 15) Output Low
(LS < Adjusted LR)
Target Distance
’ 0
dswitch § 0.4x(dcoil) dswitch
(ADJ = 1) (ADJ = 15)

... Differential
LDC Core
LDC0851
Movable Sense
Metal Target Coil LSENSE
Inductance LS
Converter
+
LCOM OUTPUT
Switching distance set
by ADJ Value Sensor
Cap Adjusted LR
+ ±
LREF Inductance
No Target on
Converter ±
Reference Reference
Coil

Mode Select
VDD 0: Basic Operation VDD
1 ± 15: Threshold Adjust VDD
R1
ADJ Offset
4-bit ADC Power EN
Management
R2 CBYP
GND

Figure 19. Threshold Adjust Mode for Distance Sensing Using Side by Side Coils

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Feature Description (continued)

Stacked coils can be utilized in designs where PCB space is a concern or if the user only wants to detect
proximity to metal from one side of the PCB such as a button application. The sensing range is slightly reduced
due to the fact that both the sense and the reference coil are affected by same conductive target, however since
the sense coil is closer to the target its respective inductance decreases more than the reference inductance
allowing the output to switch as shown in Figure 20.
Output High
(LS > Adjusted LR)
LS
...
Adjusted LR
(ADJ = 1)

Adjusted LR
(ADJ = 15) Output Low
(LS < Adjusted LR)
Target Distance
’ 0
dswitch § 0.3x(dcoil) dswitch
(ADJ = 1) (ADJ = 15)

LDC0851
... Differential
LDC Core
LSENSE
Inductance LS
Converter
Movable +
LCOM OUTPUT
Metal Target
Sensor
Adjusted LR
Sense Ref Cap + ±
Coil Coil LREF Inductance
Converter ±
Switching distance set by ADJ
Value and separation between
Mode Select
Sense and Ref coils
VDD 0: Basic Operation VDD
1 ± 15: Threshold Adjust
VDD
R1
ADJ Offset EN
4-bit ADC Power
Management
R2 CBYP
GND

Figure 20. Threshold Adjust Mode for Distance Sensing Using Stacked Coils

To get the most sensing range with stacked coils the spacing between the sensing coil and reference coil (height
= h) should be maximized as shown in Figure 21. See section Stacked Coils for more information on the layout
of stacked coils.
Layers 1, 2
Sense Coil

Layers 3, 4
Reference Coil

Figure 21. Stacked Coil Separation (PCB Side View)

14 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Feature Description (continued)

8.3.3 Setting the Threshold Adjust Values
To configure a threshold setting, connect a 49.9 kΩ resistor (R1) between VDD and the ADJ pin as shown in
Figure 20. The threshold is determined by the value of R2 as shown in the Table 1 below. R1 and R2 should be
1% or tighter tolerance resistors with a temperature coefficient of <50 ppm/°C.

Table 1. Resistor Values for

ADJ Code
ADJ Code R2 (kΩ)
1 3.32
2 5.11
3 7.15
4 9.31
5 11.5
6 14
7 16.5
8 19.6
9 22.6
10 26.1
11 30.1
12 34
13 39
14 44.2
15 49.9

The switching distance for each ADJ code can be approximated with the following formula:
§ ADJCode ·
dswitch dcoil u 0.4 u ¨ 1 ¸
© 16 ¹
where:
• dswitch is the approximated switching distance threshold
• dcoil is the coil diameter, in the same units as dswitch
• ADJCode is the desired value from Table 1 (1)
For example, consider a coil with a diameter of 10 mm: An ADJ code of 1 will yield a switching distance of 3.75
mm and for a code of 15 a switching distance of 0.25 mm. This method helps reduce the effort needed to design
the coil ratio precisely for a specific switching distance. It should be noted that the maximum sensing distance is
determined almost entirely by the diameter of the coil for circular coils or by the minimum outer dimension for
rectangular coils.

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

8.3.4 Hysteresis
The LDC0851 includes hysteresis for the switching threshold. The switch point is determined by the inductance
ratio between LSENSE and LREF. When the ratio of LSENSE to LREF drops below 99.6%, the device switches
ON (output low). When LSENSE/LREF becomes greater than 100.4% it switches OFF (output high). The
hysteresis window is therefore specified 0.8% from the switch ON point.
Output
State

VOH

VOL
LSENSE / LREF
tLHYSTt

Switch ON Switch OFF

(LS /LR = 0.996) (LS /LR = 1.004)

Figure 22. Inductance Hysteresis

For proximity sensing, hysteresis may also be approximated in terms of distance as shown in Figure 23.
Output
State tdTOLt

VOH

VOL
Target
Distance
tdHYSTt
Switch ON Switch OFF
(dswitch) (drelease)

Figure 23. Switching Distance Hysteresis and Threshold Tolerance

16 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

8.3.5 Conversion Time

The length of time for the LDC0851 to complete one conversion and update the output is called the conversion
time and is a function of sensor frequency. The conversion time is calculated with the following equation:
1
t CONVERSION
231. u 0 6 u ¦SENSOR
where:
• tCONVERSION is the conversion time interval
• ƒSENSOR is the sensor frequency given by Equation 6 (2)
It is important to note that the frequency of the sensor increases in the presence of conductive objects. Therefore
the worst case conversion time is calculated with no target present or when the target is at the maximum
distance from the sensor.

8.3.6 Power-Up Conditions

This indicates the switch output state when there is no metal target within the switching distance of LDC0851. On
power-up the LDC0851 output will be held HIGH until the part performs the sensor test and is ready for normal
operation. This remains true even if the enable pin (EN) is pulled low. A HIGH to LOW transition on the OUT line
occurs when the metal target comes within the switching distance of LDC0851. In the case of any sensor fault
condition the LDC0851 maintains a HIGH state. An example of a sensor fault is if the sensor gets disconnected
or damaged.
OUT NH Type

No No Metal/
Metal
Metal Sensor Fault
HIGH

LOW
tstart + tconversion t

Figure 24. Output Status at Power up and in Presence of Metal Target

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

8.4 Device Functional Modes

8.4.1 Shutdown Mode
To save power, the LDC0851 has a shutdown mode. In order to place the LDC0851 in shutdown mode set the
EN (Enable) pin low. This mode is useful for low power applications where the EN pin can be duty cycled at a
low rate for wake-up applications to achieve a very low average supply current. An example of a duty-cycled
application can be found in the applications section Low Power Operation. To resume active operation, set EN
high and wait tAMT + tDELAY for valid output data. The current consumption in this mode is given in the electrical
table as ISD. Note that the output will remain high (OFF) when EN is low. See Power-Up Conditions for more
information on the startup conditions.

8.4.2 Active Mode

When the LDC0851 EN pin is pulled high, the LDC0851 is put into active mode. The active supply current (IDD) is
broken up into three pieces: Static current (Istatic), Dynamic current (Idyn), and Sensor current (Isensor).
Static current is the DC device current given in the electrical characteristics and does not vary over frequency.
Dynamic current is the AC device current which varies with both sensor frequency (ƒSENSOR) and board parasitic
capacitance (CBOARD). Dynamic current can be computed with the following equation:
12
, dyn (24.262 u 10 ) u ¦SENSOR u ¦SENSOR u &BOARD

where:
• Idyn is the dynamic current drawn by the device and board parasitics
• ƒSENSOR is the sensor frequency calculated from Equation 6
• CBOARD is the parasitic capacitance of the board, see Figure 25 (3)
Sensor current is the AC current required to drive an external LC sensor. Sensor current varies with both the
frequency and inductance of the sensor and is given by the following equation:
1
Isensor
u /SENSOR u ¦SENSOR
where:
• ISENSOR is current required to drive the sensor
• LSENSOR is the measured inductance of the sensor
• ƒSENSOR is the sensor frequency calculated from Equation 6 (4)
The total active supply current is given by the following equation:
I DD Idyn Istatic Isensor

where:
• IDD is the total active supply current
• Idyn is the dynamic current drawn by the device as given by Equation 3
• Istatic is the static current as given in the electrical table
• ISENSOR is current required to drive the sensor as given by Equation 4 (5)

18 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

9 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Sensor Design

The LDC0851 relies on two externally placed sensors (LSENSE and LREF) and a capacitor (CSENSOR) for proper
operation. The design and matching of the coils is very critical to ensure a proper switching occurrence. It is also
important to note that the parasitic capacitance of the board (CBOARD) and of the LCOM input pin (CIN_COM) are in
parallel with CSENSOR, and the sum of all three capacitances create a total capacitance (CTOTAL) which is
considered part of the system. CTOTAL must be greater than 33 pF to be considered in the valid design space.

Board Pin
Sensor Components
Parasitic Parasitic
LSENSE LDC0851

LSENSE CBOARD CIN_SENSE

LCOM Inductive Switch

Core
CSENSOR CBOARD CIN_COM

LREF
LREF

CBOARD CIN_REF

Figure 25. Sensor Components, Board Parasitics, and Package Parasitics Diagram

9.1.1.1 Sensor Frequency

The sensor frequency is calculated with the following equation.
2
¦SENSOR
2S u LSENSOR u CTOTAL

where:
• ƒSENSOR is the calculated oscillation frequency with no target present
• LSENSOR is the inductance of the sense coil or reference coil
• CTOTAL is sum of external sensor, board parasitic, and pin parasitic capacitances connected to LCOM, refer to
Figure 25 (6)

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Application Information (continued)

9.1.1.2 Sensor Design Procedure
The following procedure should be followed for determining the sensor characteristics:
1. Determine the diameter of coil (dcoil), which should be 3 times larger than the desired switching distance
(dswitch)
2. Determine the desired frequency (ƒSENSOR) which should be between 300 kHz and 19 MHz
3. Calculate the range of allowable inductance from the following equation:
1
LSENSOR t
4.83 u ( ¦SENSOR u ISENSOR_MAX )

where:
• LSENSOR is the inductance of the LSENSE coil or LREF coil
• ISENSOR_MAX is given in the electrical table (7)
4. Calculate the externally placed sensor capacitor:
1
CSENSOR CBOARD CIN_COM
( S u ¦SENSOR 2 2 u LSENSOR )
where:
• CBOARD is the parasitic capacitance introduced by the board layout (~4 pF for good layout)
• CIN_COM is the parasitic pin capacitance of LCOM specified as 12 pF in the electrical table (8)

20 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

9.2 Typical Application

9.2.1 Event Counting
The LDC0851 can be used for event counting applications such gear tooth detection or rotational speed
measurements. An example of gear tooth detection using side by side coils is shown below where the gear is
made of a conductive material and rotates over the coils. Two identical coils can be placed such that when one
of the coils is covered by a gear tooth, the other is uncovered. The output will toggle when the inductance values
of both coils are equal as the gear passes by.

Rotation (,)

LS LR

LC

ADJ LDC Output

LDC0851

Figure 26. Gear Tooth Functional Diagram

9.2.1.1 Design Requirements

Assume a gear with 8 conductive teeth is used in a system to determine flow rate. Determine the maximum
speed that can be reliably detected by the LDC0851 using a sensor frequency of 15 MHz.

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 21

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Typical Application (continued)

9.2.1.2 Detailed Design Procedure
To ensure a reliable reading an event must be sampled twice when the gear tooth covers more of the LSENSE
coil than the LREF coil (LS<LR) producing a LOW output and equivalently twice when the gear tooth covers
more of LREF than LSENSE (LR<LS) producing a HIGH output. The maximum speed can be achieved when the
output toggles at a duty cycle rate of 50%. This can be achieved by using a gear where the width of each tooth is
the same as the width of the gaps between the teeth. For asymmetric systems, the minimum width of either the
gap or the gear tooth determines the maximum detectable speed. For symmetrical systems, the maximum
rotational speed that can be reliably detected in revolutions per minute (rpm) for a given number of gear teeth
can be determined by the following formula:
1 ª 6 º § 60 ·
Gear Speed (rpm) u ¦SENSOR u u u
4 ¬ ¼ ¨© # gear teeth ¸¹

where:
• Gear Speed (rpm) is the calculated speed of the gear
• ƒ SENSOR is the sensor frequency given by Equation 6
• # gear teeth is the total number of events per rotation (9)
A gear with 8 teeth and sensor frequency of 15MHz could reliably measure a gear rotational speed of 6500 rpm.

9.2.1.3 Application Curves

The metal coverage has an inverse relationship to coil inductance. Figure 27 shows the relationship between the
output of the LDC0851 and relative inductance of the coils as the gear is rotating.
Coil Inductance (L)

Reference coil inductance exceeds Sense coil

inductance which causes output to switch low
LDC Output
Max inductance
(Metal Coverage = 0%)

Equal Inductance
(Metal Coverage = 50%)

LR LS
Min inductance
(Metal Coverage = 100%)

Sense coil inductance exceeds Reference coil

inductance which causes output to switch low

Rotation Angle (,)

Figure 27. Angular Position vs Coil Inductance

22 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Typical Application (continued)

9.2.2 Coarse Position Sensing
The LDC0851 may be used for coarse proximity sensing such as a push button application. A conductive target
may be added to the underside of a mechanical push button as shown below.

Figure 28. Coarse Position Sensing Side View

9.2.2.1 Design Requirements

A push button that is made of flexible material has a conductive target attached to the underside and a
contactless solution using the LDC0851 is required for reliability purposes. Determine the coil characteristics as
well as the threshold adjust setting if the following conditions are true:
1. The target is made of a conductive material, such as aluminum foil or copper tape
2. The conductive target is circular and measures 10 mm in diameter
3. The resting height of the conductive target is 2.5 mm above the PCB when no button push
4. The maximum travel distance when pressed is 2 mm, leaving an airgap of 0.5mm above the PCB

9.2.2.2 Detailed Design Procedure

To conserve PCB area, a 4 layer stacked coil approach is used with the sense coil on the top 2 layers and
reference on the bottom 2 layers. The LDC0851 switching threshold is then determined by following parameters:
1. Conductive Target Size: The best response is achieved when the target area is ≥100% compared to the coil
area.
2. Coil diameter: The diameter of the coil should be at least 3x greater than the desired switching distance.
3. ADJ code: Increasing ADJ code linearly scales down the switching distance estimated by Equation 1.
The coil diameter should not exceed the diameter of the conductive target of 10mm in order to keep the target-to-
coil coverage ≥100%. Additionally, in order to detect the lightest button pushes where the conductive target rests
at a height of 2.5 mm, the coil should be at least 3 times greater giving a minimum size of 7.5 mm. The user may
therefore select a coil size between 7.5 mm and 10 mm. A coil diameter of 10mm is chosen for the most
flexibility and tuning range. The response versus ADJ code is shown below in Figure 29.
In this example the deflection caused by the button press (∆d) is 2mm. Note that the ∆d must be enough to cross
the “Switch ON” threshold and return past “Switch OFF” threshold of the LDC0851 for a given ADJ code to be
considered a valid code. Codes 0 through 6 should not be used because the conductive target has already
crossed the "Switch ON" thresholds and would always be in the ON state without a button push. Similarly code
15 should not be used because the output would always be in an OFF state regardless of how hard the button is
pushed. Therefore codes 8 through 14 are clearly inside the travel distance of the button. Select code 8 to detect
light button pushes, code 11 for medium button pushes, or code 14 to only detect strong button pushes. Once
the ADJ code is selected based on user preference, set the resistor divider R1 and R2 values according to
section Setting the Threshold Adjust Values.

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 23

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Typical Application (continued)

9.2.2.3 Application Curves

Figure 29. Threshold Adjust Design Space for 10mm Coil Example

24 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Typical Application (continued)

9.2.3 Low Power Operation
It may be desirable to operate the LDC0851 on battery power and take samples at a very low sample rate, such
as portable sensor devices or intruder detection systems. By using a nanotimer (ultra low power timer) such as
the TPL5110 or a microcontroller such as the MSP430F5500 it is possible to duty cycle the EN pin of the
LDC0851 as shown in the application schematic in Figure 30.

3-V Battery

Wake up LDC
VDD EN
Sense
Coil
LSENSE R1

ADJ

LDC0851 R2
µC
LCOM
Sensor
Cap

High/Low Output
LREF OUT
Reference GND
Coil

Figure 30. Application Schematic Showing Low Power Operation

9.2.3.1 Design Requirements

The LDC0851 is used in a low power, battery operated system to detect when a window is opened. Determine
the average supply current of the LDC0851 if following requirements exist:
1. A lifetime of greater than 10 years is required from a single CR2032 battery which supplies the power for the
LDC0851.
2. A microcontroller can be used to wakeup the LDC0851 and capture the high/low output state.
3. At least 1 sample per second (ƒSAMPLE) is required to detect if the window is open or closed.

9.2.3.2 Detailed Design Procedure

In order to achieve 10 year lifetime out of a single CR2032 battery, the enable pin (EN) of the LDC0851 can be
duty cycled to achieve a low average supply current. Refer to Figure 31 to see the three different states of
LDC0851 supply current during duty cycle operation. The sum of the Standby, Ramp, and On currents can be
used to calculate the average supply current of the LDC0851, which needs to be below 2.5 µA to achieve a 10
year lifetime from a 220 mAh CR2032 battery.
The average supply current can be calculated in the following steps:
1. Select desired system sample rate (ƒSAMPLE) based on the given application. In this example, ƒSAMPLE is 1
sample per second.
2. Select the sensor characteristics (ƒSENSOR, LSENSOR, CSENSOR) based on conversion time and current
consumption.
(a) ƒSENSOR should be increased as much as possible to minimize the conversion time. 10 MHz is chosen as
a starting point.
(b) LSENSOR should be increased as much as possible to decrease the sensor current (ISENSOR). Based on a
reasonable PCB area, 10 µH is a good starting point.
(c) CSENSOR is calculated to be 34.5 pF from Equation 8 using the inputs above. This makes CTOTAL equal to
50.5 pF which meets the requirement of greater than 33 pF to be inside the design space.
3. Calculate the average active current:
, ON ¦SAMPLE u u WCONVERSION u ,DD

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Typical Application (continued)

where:
• ƒSAMPLE is the number of samples per second given from step 1. In this example, ƒSAMPLE is equal to 1.
• tCONVERSION is calculated from Equation 2 to give a conversion time of 433 µs.
• IDD is the total active supply current given by Equation 5 to be 1.587 mA.
• ION is the active current consumed by the LDC0851 which comes to be 1.37 µA. (10)
4. Calculate the average ramp current:
§I ·
, RAMP ¦SAMPLE u W AMT u ¨ DD ¸
© 2 ¹
where:
• ƒSAMPLE is the number of samples per second given from step 1. In this example, ƒSAMPLE is equal to 1.
• tAMT is the active mode transition time given in the electrical table as typically 450µs.
• IDD is the total active supply current given by Equation 5 to be 1.587 mA.
• IRAMP is the current consumed by the LDC0851 before a conversion has started which comes to be 0.357 µA.
(11)
5. Calculate the average standby current:
, OFF (1 ¦SAMPLE u W AMT u WCONVERSION )) u ,SD
where:
• ƒSAMPLE is the number of samples per second given from step 1. In this example, ƒSAMPLE is equal to 1.
• tAMT is the active mode transition time given in the electrical table as typically 450µs.
• tCONVERSION is calculated from Equation 2 to give a conversion time of 433 µs.
• ISD is the shutdown current of the LDC0851 given in the electrical table as typically 140nA.
• IOFF is the standby current of the LDC0851 which comes to be 0.140 µA. (12)
6. Calculate the total average supply current:
I AVG ION IRAMP IOFF
where:
• ION is the active supply current given from Equation 10 to be 1.37 µA.
• IRAMP is the ramp current given by Equation 11 to be 0.357 µA.
• IOFF is the standby current given by Equation 12 to be 0.140 µA.
• IAVG is the average supply current consumed per second which comes to 1.867 µA. (13)
7. Finally the lifetime of the battery can be calculated:
Battery Capacity
Battery Lifetime (years)
IAVG
where:
• Battery Capacity is the amount of charge x time that the battery can hold in mAh. This example uses a
CR2032 battery with 220 mAh.
• IAVG is the value reported in Equation 13 to be 1.867 µA.
• Battery Lifetime (years) is how long the battery will last reported in years which comes out to be 13.5 years
with the inputs from above. (14)
For example, using a sensor frequency of 10 MHz, sensor inductance of 10 µH, and 1 sample per second yields
a lifetime of 13.5 years for a single CR2032 battery.

26 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

Typical Application (continued)

9.2.3.3 Application Curves
I

IDD

IDD
2

ISD ISD

tOFF tAMT tON t

(Standby) (Ramp) (On)

Figure 31. LDC0851 Supply Current vs. Time During Duty Cycle Operation

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 27

Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

10 Power Supply Recommendations

A 0.1 µF capacitor should be used to bypass VDD. If multiple bypass capacitors are used in the system, then the
smallest value capacitor should be placed as close as possible to the VDD pin. A ground plane is recommended
to connect both the ground and the Die Attach Pad (DAP). If the supply ramp rate must be faster than 4.2 mV/µs
the enable pin (EN) may be tied directly to VDD as shown in Figure 32.

VDD
LDC0851
Fast 0.1 µF
Supply
(> 4.2 mV / µs)

EN Power
Management

GND DAP

Figure 32. Supply Connections for Fast Ramp Rate

For supply ramp rates slower than 4.2 mV/µs, an RC low pass filter must be added to the enable input (EN) as
shown in Figure 33. Alternatively, the EN pin may be tied to a nanotimer or microcontroller to wake up the
LDC0851 after VDD has ramped to its nominal value.

VDD
LDC0851
Slow 0.1 µF
Supply
(< 4.2 mV / µs)

R EN Power
Management
C

GND DAP

Figure 33. Supply Connections for Slow Ramp Rate

For applications that require low power, the EN pin may toggled with a GPIO or nanotimer to duty cycle the
device and achieve ultra-low power consumption. Although the device may be power cycled to achieve a similar
effect, some systems may not have a clean GPIO to supply the LDC0851 or the filtering on the supply may add a
time constant delay which can make the use of the EN pin much more efficient and desirable for duty cycled
applications. Refer to Low Power Operation for a detailed design example.

28 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

11 Layout

11.1 Layout Guidelines

The LDC0851 requires minimal external components for effective operation. An LDC0851 design should follow
good layout techniques - providing good grounding and clean supplies are critical for optimum operation. Due to
the small physical size of the LDC0851, use of surface mount 0402 or smaller components can ease routing. It is
important to keep the routing symmetrical and minimize parasitic capacitances for LSENSE and LREF. The
sensor capacitor should be placed close to the IC and keep traces far apart to minimize the effects of parasitic
capacitance. For optimum performance, it is recommended to use a C0G/NP0 for the sensor capacitor.

11.2 Layout Example

11.2.1 Side by Side Coils
The use of side by side coils is recommended for many applications that require a 2 layer PCB or that require
very accurate temperature compensation. For side by side coils it is recommended to put them on the same
PCB, even if using a remote sensing application. This will keep the tolerances and mismatch between the coils
as small as possible. An example layout of side by side coils is shown in Figure 34.

Figure 34. Side by Side Coil Layout Example

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 29
Product Folder Links: LDC0851
LDC0851
SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016 www.ti.com

Layout Example (continued)

11.2.2 Stacked Coils
Use of stacked coils may be desirable to conserve board space and to prevent false triggering when a target
approaches from the bottom. A 4 layer PCB with a thick inner layer is recommended to achieve the best results.
It is important to note the direction and polarity of the sense coil and reference coils with respect to each other.
The recommended configuration is shown below.

LSENSE Counter-Clockwise
Out Spiral on Layer 1

Via from Layer 1 to

Layer 2

LCOM
Clockwise Out
Spiral on Layer 2
Sensor
Capacitor Via from Layer 2 to
Layer 3

Clockwise Out
Spiral on Layer 3
Via from Layer 3 to
Layer 4
LREF
Counter-Clockwise
Out Spiral on Layer 4

Figure 35. Stacked Coil Recommended Connections and Direction

30 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated

Product Folder Links: LDC0851

 LDC0851
www.ti.com SNOSCZ7A – DECEMBER 2015 – REVISED JANUARY 2016

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support
For on-line LDC system design tools, see Texas Instruments' Webench® tool
The LDC Calculator tools provides a collection of calculation tools which run under MS Excel® useful for LDC
system development.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

12.3 Trademarks
E2E is a trademark of Texas Instruments.
Webench is a registered trademark of Texas Instruments.
Excel is a registered trademark of Microsoft Corporation.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 31

Product Folder Links: LDC0851
 PACKAGE OPTION ADDENDUM

www.ti.com 13-Nov-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LDC0851HDSGR ACTIVE WSON DSG 8 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 0851 Samples

LDC0851HDSGT LIFEBUY WSON DSG 8 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 0851

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 2-Dec-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LDC0851HDSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
LDC0851HDSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 2-Dec-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LDC0851HDSGR WSON DSG 8 3000 182.0 182.0 20.0
LDC0851HDSGT WSON DSG 8 250 182.0 182.0 20.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
DSG 8 WSON - 0.8 mm max height
2 x 2, 0.5 mm pitch PLASTIC SMALL OUTLINE - NO LEAD

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224783/A

www.ti.com
 PACKAGE OUTLINE
DSG0008A SCALE 5.500
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

2.1 B
A
1.9

0.32
PIN 1 INDEX AREA 0.18
2.1
1.9

0.4
0.2

ALTERNATIVE TERMINAL SHAPE

TYPICAL

0.8 C
0.7

SEATING PLANE
0.05 SIDE WALL
0.08 C
0.00 METAL THICKNESS
DIM A
OPTION 1 OPTION 2
0.1 0.2

EXPOSED
THERMAL PAD 0.9 0.1 (DIM A) TYP

4 5

6X 0.5

2X
9
1.5 1.6 0.1

8
1

PIN 1 ID 0.32
8X
(45 X 0.25) 0.4 0.18
8X
0.2 0.1 C A B
0.05 C

4218900/E 08/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com
 EXAMPLE BOARD LAYOUT
DSG0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

(0.9) ( 0.2) VIA

8X (0.5)
TYP
1
8

8X (0.25)
(0.55)
SYMM 9
(1.6)

6X (0.5)
5
4

(R0.05) TYP SYMM

(1.9)

LAND PATTERN EXAMPLE

SCALE:20X

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

SOLDER MASK METAL METAL UNDER SOLDER MASK

OPENING SOLDER MASK OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)

SOLDER MASK DETAILS

4218900/E 08/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com
 EXAMPLE STENCIL DESIGN
DSG0008A WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD

8X (0.5) SYMM METAL

1
8

8X (0.25)
(0.45)
SYMM
9

6X (0.5) (0.7)

5
4

(R0.05) TYP (0.9)

(1.9)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 9:
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X

4218900/E 08/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated