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What Is ABF PCB

The document discusses Ajinomoto Build-up Film (ABF) PCBs, which are a major component in chip manufacturing. ABF PCBs offer electrical insulation and have been used in devices like personal computers and routers since the 1990s. The ABF PCB market is expected to grow due to demand for technologies like 5G, and there are challenges around limited capacity and defects affecting yield.

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61 views4 pages

What Is ABF PCB

The document discusses Ajinomoto Build-up Film (ABF) PCBs, which are a major component in chip manufacturing. ABF PCBs offer electrical insulation and have been used in devices like personal computers and routers since the 1990s. The ABF PCB market is expected to grow due to demand for technologies like 5G, and there are challenges around limited capacity and defects affecting yield.

Uploaded by

jack
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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RAYMING PCB & ASSEMBLY

What is ABF PCB?


The Ajinomoto Group does not only offer a component of computers, it is the heart of most personal
computers in the world. ABF stands for Ajinomoto Build-up Film. Also, this film comprises a series of film
dielectrics. This thin film of dielectrics offers electrical insulation of circuit substrate for high-performance
CPUs.

ABF PCB is a major component in chip manufacturing. Since the advent of ABF PCB, it has been popularly
used in chip manufacturing. Substrates that comprise ABF film are usually found in base stations, personal
computers, and routers.

ABF has a long standing history which starts in the 1970s. Also, ABF was first integrated in personal
computers in the1990s. It has continued to evolve since then. The ABF substrate is a major component in
chip manufacturing.

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Table of Contents

The Challenges in the ABF PCB Market

ABF simply refers to Ajinomoto Buildup Film. Moving forward, the ABF PCB market will keep growing
with increase in revenue as a result of strong demand for 5G and servers. Also, the strong demand for
high-performance computing (HPC) and graphic processing units (GPU) from the automotive industry
contributed to this increasing revenue.

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Goldman Sachs claimed that the aggregate demand for the ABF market should be a CAGR of 28 percent.
Furthermore, there is a short supply of ABF substrates. The increasing demand and supply chain issues
contribute to the shortage of ABF PCBs. Also, increasing number of layers and larger package sizes for
these high-tech products contribute to this shortage.

In the long run, these bigger packaging sizes lead to fewer packages for each ABF substrate. Also, ABF PCB
manufacturing involves build-up layer. Therefore, any defect in a layer can jeopardize the final outcome of
the whole substrate. With these factors, this makes yield control more crucial.

Yield control is an important project that must account for all the steps involved in the ABF process. Also,
ABF PCB suppliers have depended on the ability to repair RDL defects to improve yield. However,
high-performance chips that result in smaller sizes of RDL will make repairing RDL defects a challenge.

Intel revealed that an added challenge of ABF PCB manufacturing is that the films are decentralized. For
instance, capacitors, a major element of the ABF substrate, are widely used for decoupling.

What does an ABF PCB Offer?

The Ajinomoto build-up film (ABF) substrate is one of the most crucial components in manufacturing
processing units. In today’s world, semiconductor-based processing units are now more highly integrated to
get to nanometer processes. This integration has complicated the information of interconnection.

Furthermore, interconnecting electronics to system level and board is more popular on the millimeter
scale. Therefore, to achieve these interconnections, most major semiconductor manufacturers must
integrate an ABF. Furthermore, ABF functions as a bed within the device package. Also, it comprises
several layers of microcircuits that interface between the nanoscale CPU and PCB.

The Ajinomoto Group designs the thermosetting film that offers insulation to the processing unit. Also, this
film features crucial properties like low thermal expansion and high durability.

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Impact of ABF PCBs on Semiconductors Manufacturing

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Semiconductors are the basis of ICT infrastructure. Also, downsizing semiconductor and high-level
multifunctional performance will allow smarter cell phones and some related devices. Furthermore, it will
enable functions for safety, communication, and control of several devices in home and automobiles.

In addition, the Ajinomoto Group keeps improving its ABF technology. Also, it specialization will help to
drive further downsizing and as well as spread of semiconductors. ABF is crucial in several sectors.
Therefore, its evolution will improve the society.

ABF substrate is a crucial component for chip making. Also, it is the most recent bottleneck
for electronic companies experiencing semiconductor shortages. The ABF substrate is part of the packaging
that shields some chips that need to power your car or computer.

Most advanced semiconductors in the world can’t function without these substrates. Therefore, whole giant
companies such as Intel Corp spend billions to reduce chip shortages, the lack of ABF substrate could hinder
manufacturing. As a result of limited capacity, there could still be supply constraints.

Most semiconductor companies such as Nvidia and AMD rely on ABF substrates to manufacture the world’s
most powerful chips. However, substrate manufacturers are reluctant to invest in capacity due to the
money-losing slumps they experienced in the past.

Furthermore, the introduction of 5G increased the demand for stronger server chips that could hand AI,
cloud-computing, and other smart-driving technologies. ABF substrate was initially integrated as the ideal
packaging technology for CPUs in servers and personal computers. This is because it enhances faster
computations by high-end chips.

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The Use of Organics and Inorganics in a Microfilm

The discovery of a resin composition that determines the functioning of insulation material is the main
objective of R&D that resulted in ABF. The expertise of the Ajinomoto Group in chemistry was fully
integrated to create a formulation that comprise microparticle filler, organic epoxy resins, inorganic, and
hardener.

Furthermore, the major challenges were the formulation of a methodology for combining inorganic and
organic substances and offering great insulating properties. Therefore, the R&D team developed a
thermosetting film to overcome these challenges. Also, this thermosetting film features low thermal
expansion, high durability, and ease of processing.

The film was initially integrated by a semiconductor manufacturer in the year 1999. This film has become a
highly preferred product for almost all high-performance CPUs since its integration. Also, this film has
continually evolved to meet the demands of rapid development in circuit integration.

Furthermore, the development in circuit integration has resulted in the development of CPUs that comprise
nanometer scale electronics circuits. ABF keeps improving its quality in line with upgrades in CPU

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functioning. Therefore, this requires the integration of R&D in insulating resins with processing technologies
to meet the requirements of customers.

Conclusion

The ABF PCB market will keep experiencing growth over some years. This is because the market is majorly
driven by 5G, HPC, and AI. Also, ABF substrate manufacturers will take advantage of this demand by
increasing their capacity. IC substrate suppliers are planning to allocate a portion of their SLP (substrate-kike
PCB) to aid the manufacturing of ABF substrates.

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3. All you need to know about the SMT File Format and SMT software

4. Why the Arlon 49N PCB Material Is Useful In High Temperature or High Performance
Applications

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