WT12

D a t a S h e e t

V e r s i o n 2 . 5

W e d n e s d a y , S e p t e m b e r 0 3 , 2 0 0 8
Copyright © 2000-2008 Bluegiga Technologies

All rights reserved.

Bluegiga Technologies assumes no responsibility for any errors, which may appear in this manual.
Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or
specifications detailed herein at any time without notice, and does not make any commitment to
update the information contained herein. Bluegiga Technologies’ products are not authorized for use
as critical components in life support devices or systems.

The WRAP is a registered trademark of Bluegiga Technologies

The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA, and is licensed to Bluegiga
Technologies.

All other trademarks listed herein are owned by their respective owners.
Contents:
1. Block Diagram and Descriptions ...................................................................6

2. Electrical Characteristics ..............................................................................8

2.1 Radio Characteristics – Basic Data Rate ........................................................ 11

2.2 Radio Characteristics – Enhanced Data Rate .................................................. 14

3. WT12 Pin Description .................................................................................16

4. Physical Interfaces .....................................................................................19

4.1 UART Interface.......................................................................................... 19

4.1.1 UART Configuration While RESET is Active ............................................... 20

4.1.2 UART Bypass Mode............................................................................... 20

4.2 USB Interface ........................................................................................... 22

4.2.1 USB Pull-Up Resistor ............................................................................ 22

4.2.2 Self Powered Mode ............................................................................... 22

4.2.3 Bus Powered Mode ............................................................................... 23

4.2.4 Suspend Current .................................................................................. 24

4.2.5 Detach and Wake-Up Signaling .............................................................. 24

4.2.6 USB Driver .......................................................................................... 25

4.2.7 USB 1.1 Compliance ............................................................................. 25

4.2.8 USB 2.0 Compatibility ........................................................................... 25

4.3 SPI Interface ............................................................................................ 26

4.4 PCM Interface ........................................................................................... 27

4.4.1 PCM Interface Master/Slave ................................................................... 27

4.4.2 Long Frame Sync ................................................................................. 28

4.4.3 Short Frame Sync ................................................................................ 28

4.4.4 Multi Slot Operation.............................................................................. 29

4.4.5 GCI Interface ...................................................................................... 29

4.4.6 Slots and Sample Formats ..................................................................... 30

4.4.7 Additional Features .............................................................................. 31

4.4.8 PCM Configuration ................................................................................ 31

2
5. I/O Parallel Ports .......................................................................................33

6. Software Stacks .........................................................................................34

6.1 iWRAP Stack ............................................................................................. 34

6.2 HCI Stack ................................................................................................. 35

6.3 RFCOMM Stack .......................................................................................... 38

6.4 VM Stack .................................................................................................. 39

6.5 HID Stack ................................................................................................ 40

7. Enhanced Data Rate ...................................................................................42

7.1 Enhanced Data Rate Baseband .................................................................... 42

7.2 Enhanced Data Rate /4 DQPSK .................................................................. 42

7.3 8DQPSK ................................................................................................... 42

8. Layout and Soldering Considerations .........................................................44

8.1 Soldering recommendations ........................................................................ 44

8.2 Layout guidelines ...................................................................................... 44

9. WT12 physical dimensions .........................................................................47

10. Package ......................................................................................................49

11. Certifications ..............................................................................................51

11.1 Bluetooth ............................................................................................ 51

11.2 FCC.................................................................................................... 52

11.3 CE ..................................................................................................... 52

11.4 Industry Canada (IC)............................................................................ 53

12. RoHS Statement with a List of Banned Materials ........................................54

13. Contact Information ...................................................................................55

3
TERMS & ABBREVIATIONS

Term or Abbreviation: Explanation:

Set of technologies providing audio and data transfer over short-range

Bluetooth
radio connections

CE Conformité Européene

DFU Device Firmware Upgrade

EDR Enhanced Data Rate

FCC Federal Communications Commission

HCI Host Controller Interface

HID Human Interface Device

iWRAP Interface for WRAP

PCB Printed Circuit Board

PCM Pulse Code Modulation

The Restriction of Hazardous Substances in Electrical and Electronic

RoHS
Equipment Directive (2002/95/EC)

SPI Serial Peripheral Interface

UART Universal Asynchronous Transmitter Receiver

USB Universal Serial Bus

VM Virtual Machine

WRAP Wireless Remote Access Platform

4
 
WT12 Bluetooth module

DESCRIPTION FEATURES:

WT12 is a next-generation, class 2,  Fully Qualified Bluetooth system v2.0 +

Bluetooth® 2.0+EDR (Enhanced Data Rates) EDR, CE and FCC
module. It introduces three times faster data  Integrated chip antenna
rates compared to existing Bluetooth® 1.2  Industrial temperature range from -40oC
modules even with lower power consumption! to +85oC
WT12 is a highly integrated and sophisticated  Enhanced Data Rate (EDR) compliant with
Bluetooth® module, containing all the v2.0.E.2 of specification for both 2Mbps
necessary elements from Bluetooth® radio to and 3Mbps modulation modes
antenna and a fully implemented protocol  RoHS Compliant
stack. Therefore WT12 provides an ideal  Full Speed Bluetooth Operation with Full
solution for developers who want to integrate Piconet
Bluetooth® wireless technology into their  Scatternet Support
design with limited knowledge of Bluetooth®  USB version 2.0 compatible
and RF technologies.  UART with bypass mode
 Support for 802.11 Coexistence
By default WT12 module is equipped with  8Mbits of Flash Memory
powerful and easy-to-use iWRAP firmware.
iWRAP enables users to access Bluetooth®
functionality with simple ASCII commands
delivered to the module over serial interface -
it's just like a Bluetooth® modem.

APPLICATIONS:

 Hand held terminals

 Industrial devices
 Point-of-Sale systems
 PCs
 Personal Digital Assistants (PDAs)
 Computer Accessories
 Access Points
 Automotive Diagnostics Units
Figure 1: Physical outlook of WT12

ORDERING INFORMATION:

Internal chip antenna

iW RAP firmware W T12-A-AI
HCI firmaware W T12-A-HCI
Custom firmware W T12-A-C (*

Table 1: Ordering information

*) Custom firmware means any standard firmware with custom parameters (like UART baud rate), custom
firmware developer by customer or custom firmware developed by Bluegiga for the customer.

To order custom firmware you must have a properly filled Custom Firmware Order From and unique ordering
code issued by Bluegiga.

Contact [email protected] for more information.

5
1. BLOCK DIAGRAM AND DESCRIPTIONS

Figure 2: Block Diagram of WT12

BlueCore04

BlueCore4 is a single chip Bluetooth solution which implements the Bluetooth radio
transceiver and also an on chip microcontroller. BlueCore4 implements Bluetooth®
2.0+EDR (Enhanced Data Rate) and it can deliver data rates up to 3 Mbps.

The microcontroller (MCU) on BlueCore04 acts as interrupt controller and event timer run
the Bluetooth software stack and control the radio and host interfaces. A 16-bit reduced
instruction set computer (RISC) microcontroller is used for low power consumption and
efficient use of memory.

BlueCore04 has 48Kbytes of on-chip RAM is provided to support the RISC MCU and is
shared between the ring buffers used to hold voice/data for each active connection and
the general purpose memory required by the Bluetooth stack.

Crystal

The crystal oscillates at 26MHz.

6
Flash

Flash memory is used for storing the Bluetooth protocol stack and Virtual Machine
applications. It can also be used as an optional external RAM for memory intensive
applications.

Balun / filter

Combined balun and filter changes the balanced input/output signal of the module to
unbalanced signal of the monopole antenna. The filter is a band pass filter (ISM band).

Matching

Antenna matching components match the antenna to 50 Ohms.

Antenna

The antenna is ACX AT3216 chip antenna.

USB

This is a full speed Universal Serial Bus (USB) interface for communicating with other
compatible digital devices. WT12 acts as a USB peripheral, responding to requests from a
Master host controller such as a PC.

Synchronous Serial Interface

This is a synchronous serial port interface (SPI) for interfacing with other digital devices.
The SPI port can be used for system debugging. It can also be used for programming the
Flash memory.

UART

This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for

communicating with other serial devices.

Audio PCM Interface

The audio pulse code modulation (PCM) Interface supports continuous transmission and
reception of PCM encoded audio data over Bluetooth.

Programmable I/O

WT12 has a total of 6 digital programmable I/O terminals. These are controlled by
firmware running on the device.

Reset

This can be used to reset WT12.

802.11 Coexistence Interface

Dedicated hardware is provided to implement a variety of coexistence schemes. Channel

skipping AFH (Adaptive Frequency Hopping), priority signaling, channel signaling and host
passing of channel instructions are all supported. The features are configured in firmware.
Since the details of some methods are proprietary (e.g. Intel WCS) please contact
Bluegiga Technologies for details.

7
2. ELECTRICAL CHARACTERISTICS

Absolute maximum ratings

Min Max Unit

Storage temperature -40 85 °C
Operating temperature -40 85 °C
Supply voltage -0,3 3,6 V
Terminal voltages -0,4 Vdd + 0,4 V
Output current from PIOS 35 mA
The module should not continuously run under these conditions. Exposure to absolute maximum rating conditions for
extended periods of time may affect reliability and cause permanent damage to the device.

Table 2: Absolute maximum ratings

Recommended operating conditions

Min Max Unit

Operating temperature -40 85 °C
(1)
Supply voltage 3,1 3,6 V
Terminal voltages 0 Vdd V

Table 3: Recommended operating conditions

1)
WT12 operates as low as 2,7 V supply voltage. However, to safely meet the USB specification for minimum voltage for
USB data lines, minimum of 3,1 V supply is required.

Terminal characteristics

Min Typ Max Unit

I/O voltage levels
V IL input logic level low -0,4 - 0,8 V
V IH input logic level high 0,7Vdd - Vdd + 0,4 V
V OL output logic level low - - 0,2 V
V OH output logic level high Vdd - 0,2 - - V
Reset terminal
V TH,res threshold voltage 0,64 0,85 1,5 V
R IRES input resistance 220 k
C IRES input capacitance 220 nF
Input and tri-state current with
Strong pull-up -100 -40 -10 
Strong pull-down 10 40 100 
W eak pull-up -5 -1 -0,2 
W eak pull-down 0,2 1 5 
I/O pad leakage current -1 0 1 
Vdd supply current
TX mode - - 70 mA
RX mode - - 70 mA

Table 4: Terminal characteristics

8
Current consumption
Test conditions: Room temperature, Vdd = 3,3 V, iWRAP firmware

Peak AVG
OPERATION MODE supply supply Unit Notes
current current
Peak current at TX mode 70 - mA -
Peak current at RX mode 70 - mA -
IDLE - 3 mA Module is idle Default settings
IDLE, Deep Sleep ON - 1,2 mA Module is idle
IDLE, Deep Sleep ON
Module is idle (Minimum consumption),
NOT visible, NOT - 0,4 mA
SET BT PAGEMODE 0 2000 1
connectable
INQUIRY - 44,7 mA Device discovery with INQUIRY command
NAME - 44,7 mA Name resolution
CALL - 44,7 mA CALL [ADDR] 1101 RFCOMM
CONNECT
- 6,2 mA No data was transmitted, Default settings
Master
CONNECT
- 22,4 mA No data was transmitted, Default settings
Slave
CONNECT + Sniff, Master - 4,7 mA Connected (SET BT SNIFF 40 20 1 8)
CONNECT + Sniff, Slave - 4,6 mA Connected (SET BT SNIFF 40 20 1 8)
No data transmitted
CONNECT + sniff, Master - 2,3 mA
(SET BT SNIFF 1000 20 1 8)
No data transmitted
CONNECT + sniff, Slave - 2,3 mA
(SET BT SNIFF 1000 20 1 8)
CONNECT + park, Master - 3,1 mA No data transmittedPark parameter 1000
CONNECT + park, Slave - 2,3 mA No data transmittedPark parameter 1000
DATA, Master - 31,5 mA Data transmitted @ 115200bps
DATA, Slave - 29,2 mA Data transmitted @ 115200bps
Data transmitted @ 115200bps
DATA + Sniff, Master - 19,6 mA
(SET BT SNIFF 40 20 1 8)
Data transmitted @ 115200bps
DATA + Sniff, Slave - 22,6 mA
(SET BT SNIFF 40 20 1 8)
Data transmitted
DATA + Sniff, Master - 3,9 mA
(SET BT SNIFF 1000 20 1 8)

Table 5: Current consumption

9
Radio characteristics and general specifications

Specification Note
Operating
(2400 ... 2483,5) MHz ISM Band
frequency range
Lower quard
2 MHz
band
Upper quard
3,5 MHz
band
f = 2402 + k,
Carrier frequency 2402 MHz ... 2480 MHz
k = 0...78
Modulation GFSK (1 Mbps)
method P/4 DQPSK (2Mbps)
Hopping 1600 hops/s, 1 MHz channel space
Asynchronous, 723.2 kbps / 57.6 kbps
GFSK:
Synchronous: 433.9 kbps / 433.9 kbps
Maximum data P/4 Asynchronous, 1448.5 kbps / 115.2 kbps
rate DQPSK: Synchronous: 869.7 kbps / 869.7 kbps
Asynchronous, 2178.1 kbps / 177.2 kbps
8DQPSK:
Synchronous: 1306.9 kbps / 1306.9 kbps
Receiving signal Typical
-82 to -20 dBm
range condition
Receiver IF Center
1.5 MHz
frequency frequency
Transmission Min -11 ... -9 dBm
power Max +1 ... +3 dBm
RF input
50 
impedance
Compliance Bluetooth specification, version 2.0 + EDR
USB specification USB specification, version 1.1 (USB 2.0 compliant)

Table 6: Radio characteristics and general specifications

10
2.1 Radio Characteristics – Basic Data Rate

Transmitter radio characteristics

WT12 meets the Bluetooth v2.0+EDR specification between -40°C and +85°C. TX output is guaranteed to be
unconditionally stable over the guaranteed temperature range.

Measurement conditions: T = 20C, Vdd = 3,3V

Item Typical value Bluetooth specification Unit

1,2 3
Maximum output power +2.5 -6 to 4 dBm
Variation in RF power over
temperature range with 1.5 - dB
4
compensation enabled
Variation in RF power over
temperature range with 2.0 - dB
4
compensation disabled
RF power control range 35 16 dB
RF power range control
5 0.5 - dB
resolution
20dB bandwidth for modulated
780  1000 kHz
carrier
Adjacent channel transmit power
6,7 -40  20 dBm
F = F0 ± 2MHz
Adjacent channel transmit power
6,7 -45  -40 dBm
F = F0 ± 3MHz
Adjacent channel transmit power
6,7 -50  -40 dBm
F = F0 ± > 3MHz
f1avg Maximum Modulation 165 140<f1avg<175 kHz
f2max Maximum Modulation 150 115 kHz
f1avg / f2avg 0.97 0.80 -
Initial carrier frequency tolerance 6  75 kHz
Drift Rate 8  20 kHz/50s
Drift (single slot packet) 7  25 kHz
Drift (five slot packet) 9  40 kHz
nd
2 Harmonic content -65  -30 dBm
rd
3 Harmonic content -45  -30 dBm

Table 7: Transmitter radio characteristics at basic data rate and temperature 20C

Notes:

1. WT12 firmware maintains the transmit power to be within the Bluetooth v2.0+EDR specification limits.

2. Measurement made using a PSKEY_LC_MAX_TX_POWER setting corresponds to a

PSKEY_LC_POWER_TABLE power table entry of 63.

3. Class 2 RF-transmit power range, Bluetooth v2.0+EDR specification.

4. To some extent these parameters are dependent on the matching circuit used, and its behavior over
temperature. Therefore these parameters may be beyond CSR’s direct control.

5. Resolution guaranteed over the range -5dB to -25dB relative to maximum power for TX Level >20.

11
 6. Measured at F0= 2441MHz.

7. Up to three exceptions are allowed in the Bluetooth v2.0+EDR specification. WT12s guaranteed to meet
the ACP performance as specified by the Bluetooth v2.0+EDR specification.

Frequency (GHz) Typ Unit Cellular band

0.869 – 0.8941 -145 GSM 850

Emitted power in 0.869 – 0.8942 -145 CDMA 850
cellular bands 0.925 – 0.9601 -145 GSM 900
measured at the 1.570 – 1.5803 -145 GPS
unbalanced port of GSM 1800 / DCS
1.805 – 1.8801 -145
the balun. dBm/kHz 1800
1.930 – 1.9904 -145 PSC 1900
Output power 4dBm 1.930 – 1.9901 -145 GSM 1900
1.930 – 1.9902 -145 CDMA 1900
2.110 – 2.1702 -142 W-CDMA 2000
2.110 – 2.1702 -144 W-CDMA 2000

Table 8: Transmitter radio characteristics at basic data rate and temperature 20C

Notes:

1. Integrated in 200kHz bandwidth and then normalized to a 1Hz bandwidth.

2. Integrated in 1.2MHz bandwidth and then normalized to a 1Hz bandwidth.

3. Integrated in 1MHz bandwidth. and then normalized to a 1Hz bandwidth.

4. Integrated in 30kHz bandwidth and then normalized to a 1Hz bandwidth.

5. Integrated in 5MHz bandwidth and then normalized to a 1Hz bandwidth.

Receiver radio characteristics

Measurement conditions: T = 20C, Vdd = 3,3V

Frequency Bluetooth
Typ Unit
(GHz) specification
2.402 -84
Sensitivity at 0.1% BER
2.441 -84  75 dBm
for all packet types
2.480 -84
Maximum received signal at 0.1% BER 10 -20 dBm

Table 9: Receiver radio characteristics at basic data rate and temperature 20C

12
 Frequency Bluetooth
Typ Unit
(GHz) specification
Continuous power required to block 30-2000 TBD -10
Bluetooth reception (for sensitivity of - 2000-2400 TBD -27
dBm
67dBm with 0.1% BER) measured at 2500-3000 TBD -27
the unbalanced port of the balun. 3000-3300 TBD -27
C/I co-channel 6  11 dB
Adjacent channel selectivity C/I F=F0 + 1MHz1,2 -5 0 dB
Adjacent channel selectivity C/I F=F0 - 1MHz1,2 -4 0 dB
Adjacent channel selectivity C/I F=F0 + 2 MHz1,2 -38  -30 dB
Adjacent channel selectivity C/I F=F0 - 2 MHz1,2 -23  -20 dB
Adjacent channel selectivity C/I F=F0 + 3 MHz1,2 -45  -40 dB
Adjacent channel selectivity C/I F=F0 - 5 MHz1,2 -44  -40 dB
Adjacent channel selectivity C/I F=FImage1,2 -22 9 dB
Maximum level of intermodulation interferers3 -30 -39 dBm
Spurious output level4 TBD - dBm/Hz

Table 10: Receiver radio characteristics at basic data rate and temperature 20C

Notes:

1 Up to five exceptions are allowed in the Bluetooth v2.0 + EDR specification. BlueCore4 is guaranteed to
meet the C/I performance as specified by the Bluetooth v2.0 + EDR specification.

2 Measured at F = 2441MHz

3 Measured at f1-f2 = 5MHz. Measurement is performed in accordance with Bluetooth RF test

RCV/CA/05/c. i.e. wanted signal at -64dBm

4 Measured at the unbalanced port of the balun. Integrated in 100kHz bandwidth and then normalized to
1Hz. Actual figure is typically below TBD dBm/Hz except for peaks of -52dBm in band at 2.4GHz and
d80dBm at 3.2GHz

Frequency
Typ Unit Cellular band
(GHz)
Emitted power in cellular 0.824 – 0.849 2.0 GSM 850
bands required to block 0.824 – 0.849 TBD CDMA
Bluetooth reception (for 0.880 – 0.915 5.0 GSM 900
sensitivity of -67dBm with 1.710 – 1.785 4.0 dBm GSM 1800 / DCS 1800
0.1% BER) measured at the 1.710 – 1.785 3.0 GSM 1900 / PCS 1900
unbalanced port of the 1.850 – 1.910 TBD CDMA 1900
balun. 1.920 – 1.980 TBD W-CDMA 2000
Continuous power in cellular 0.824 – 0.849 -10 GSM 850
bands required to block 0.824 – 0.849 TBD CDMA
Bluetooth reception (for 0.880 – 0.915 -10 GSM 900
sensitivity of-72dBm with 1.710 – 1.785 -9 dBm GSM 1800 / DCS 1800
0.1% BER) measured at the 1.850 – 1.910 -9 GSM 1900 / PCS 1900
unbalanced port of the 1.850 – 1.910 TBD CDMA 1900
balun. 1.920 – 1.980 TBD W-CDMA 2000

Table 11: Receiver radio characteristics at basic data rate and temperature 20C

13
2.2 Radio Characteristics – Enhanced Data Rate

Transmitter radio characteristics

Measurement conditions: T = 20C, Vdd = 3,3V

Typ Bluetooth specification Unit

Maximum output power1 +1 -6 to 42 dBm
Relative transmit power3 -1 -4 to 1 dB
Carrier frequency stability3 3  10 kHz
RMS DEV -  13
5
%
Modulation
99% DEV -  20
5
%
accuracy3,4
Peak DEVM -  25
5
%

Table 12: Transmitter radio characteristics at enhanced data rate and temperature 20C

Notes:

Results shown are referenced to input of the RF balun.

1 WT12 firmware maintains the transmit power to be within the Bluetooth v2.0+EDR specification limits

2 Class 2 RF transmit power range, Bluetooth v2.0 + EDR specification

3 Measurements methods are in accordance with the EDR RF Test Specification v2.0.E.2

4 Modulation accuracy utilizes differential error vector magnitude (DEVM) with tracking of the carrier
frequency drift.

5 The Bluetooth specification values are for 8DPSK modulation (values for the S/4 DQPSK modulation are
less stringent)

14
Receiver radio characteristics
Measurement conditions: T = 20C, Vdd = 3,3V

Bluetooth
Modulation Typ Unit
specification
Sensitivity at 0.1% BER for /4 DQPSK -87  -70
all packet types1 8DQPSK -79  -70
dBm
Maximum received signal at /4 DQPSK -7 -20
0.1% BER1 8DQPSK -7 -20
/4 DQPSK +11  13
C/I co-channel at 0.1% BER1
8DQPSK +19  21
Adjacent channel selectivity /4 DQPSK -8 0
C/I F = F0 + 1MHz1,2,3 8DQPSK -2 5
Adjacent channel selectivity /4 DQPSK -8 0
C/I F = F0 - 1MHz1,2,3 8DQPSK -2 5
Adjacent channel selectivity /4 DQPSK -35  -30
C/I F=F0 + 2MHz1,2,3 8DQPSK -35  -25
Adjacent channel selectivity dB
/4 DQPSK -23  -20
C/I F = F0 - 2MHz1,2,3 8DQPSK -19  -13
Adjacent channel selectivity /4 DQPSK -43  -40
C/I F = F0 + 3MHz1,2,3 8DQPSK -40  -33
Adjacent channel selectivity /4 DQPSK -43  -40
C/I F = F0 - 5MHz1,2,3 8DQPSK -38  -33
Adjacent channel selectivity /4 DQPSK -17  -7
C/I F = FImage1,2,3 8DQPSK -11 0

Table 13: Receiver radio characteristics at enhanced data rate and temperature 20C

Notes:

Results shown are referenced to input of the RF balun

1 Measurements methods are in accordance with the EDR RF Test Specification v2.0.E.2

2 Up to five exceptions are allowed in EDR RF Test Specification v2.0.E.2. WT12 is guaranteed to meet the
C/I performance as specified by the EDR RF Test Specification v2.0.E.2.

3 Measured at F0 = 2405MHz, 2441MHz, 2477MHz

15
3. WT12 PIN DESCRIPTION

WT12
31 30 29

GND RF GND
1 GND GND 28
2 VDD NC 27
3 PIO2 TXD 26
4 PIO3 PIO5 25
5 NRTS MOSI 24
6 RXD MISO 23
7 PCMO SCLK 22
8 USB_D+ NCSB 21
9 USB_D- PIO4 20
10 NCTS PIO7 19
11 PCMI PIO6 18
12 PCMC RES 17
13 PCMS VDD 16
14 GND GND 15

Figure 3: WT12 connection diagram

GND (pins 1, 14, 15, 28, 29 and 31)

Connect GND pins to the ground plane of PCB.

VDD (pins 2 and 16)

3.3 V supply voltage connection. WT12 has an internal decoupling capacitor and LC filter
to block high frequency disturbances. Thus external filtering is usually not needed. It is
however recommended to leave an option for an external high Q 10pF decoupling
capacitor in case EMC problems arise.

RES (pin 17)

The RESET pin is an active high reset and is internally filtered using the internal low
frequency clock oscillator. A reset will be performed between 1.5 and 4.0ms following
RESET being active. It is recommended that RESET be applied for a period greater than
5ms.

WT12 has an internal reset circuitry, which keeps reset pin active until supply voltage has
reached stability in the start up. This ensures that supply for the flash memory inside the
WT12 will reach stability before BC4 chip fetches instructions from it. Schematic of the
reset circuitry is shown in figure 4. Rising supply voltage charges the capacitor, which will
activate the reset of WT12. The capacitor discharges through 220 k resistor, which
eventually deactivates the reset. Time constant of the RC circuitry is set such that the
supply voltage is safely stabilized before reset deactivates. Pull-up or pull-down resistor
should not be connected to the reset pin to ensure proper star up of WT12.

16
 Figure 4: WT12 internal reset circuitry

PIO2 – PIO7 (pins 3, 4, 18, 19, 20 and 25)

Programmable digital I/O lines. All PIO lines can be configured through software to have
either weak or strong pull-ups or pull-downs. Configuration for each PIO line depends on
the application. See section 10 “I/O parallel ports” for detailed descriptions for each
terminal. Default configuration for all of the PIO lines is input with weak internal pull-up.

NC (pin 27)

This pin is internally connected to PIO1.

NRTS (pin 5)

CMOS output with weak internal pull-up. Can be used to implement RS232 hardware flow
control where RTS (request to send) is active low indicator. UART interface requires
external RS232 transceiver chip.

NCTS (pin 10)

CMOS input with weak internal pull-down. Can be used to implement RS232 hardware flow
control where CTS (clear to send) is active low indicator. UART interface requires external
RS232 transceiver chip.

RXD (pin 6)

CMOS input with weak internal pull-down. RXD is used to implement UART data transfer
from another device to WT12. UART interface requires external RS232 transceiver chip.

TXD (pin 26)

CMOS output with weak internal pull-up. TXD is used to implement UART data transfer
from WT12 to another device. UART interface requires external RS232 transceiver chip.

PCMO (pin 7)

CMOS output with weak internal pull-down. Used in PCM (pulse code modulation) interface
to transmit digitized audio.

PCMI (pin 11)

CMOS input with weak internal pull-down. Used in PCM interface to receive digitized audio.

17
PCMC (pin 12)

Bi-directional synchronous data clock signal pin with weak internal pull-down. PCMC is
used in PCM interface to transmit or receive CLK signal. When configured as a master,
WT12 generates clock signal for the PCM interface. When configured as a slave PCMC is an
input and receives the clock signal from another device.

PCMS (pin 13)

Bi-directional synchronous data strobe with weak internal pull-down. When configured as
a master, WT12 generates SYNC signal for the PCM interface. When configured as a slave
PCMS is an input and receives the SYNC signal from another device.

USB_D+ (pin 8)

Bi-directional USB data line with a selectable internal 1.5 k pull-up implemented as a
current source (compliant with USB specification v1.2) External series resistor is required
to match the connection to the characteristic impedance of the USB cable.

USB_D- (pin 9)

Bi-directional USB data line. External series resistor is required to match the connection to
the characteristic impedance of the USB cable.

NCSB (pin 21)

CMOS input with weak internal pull-down. Active low chip select for SPI (serial peripheral
interface).

SCLK (pin 22)

CMOS input for the SPI clock signal with weak internal pull-down. WT12 is the slave and
receives the clock signal from the device operating as a master.

MISO (pin 23)

SPI data output with weak internal pull-down.

MOSI (pin 24)

SPI data input with weak internal pull-down.

RF (pin 30)

Connect external RF-transceiver antenna to this pin when chip antenna is not in use.

18
4. PHYSICAL INTERFACES

4.1 UART Interface

WT12 Universal Asynchronous Receiver Transmitter (UART) interface provides a simple

mechanism for communicating with other serial devices using the RS232 standard. The
UART interface of WT12 uses voltage levels of 0 to Vdd and thus external transceiver IC is
required to meet the voltage level specifications of UART.

UART_TX

UART_RX
WT12

UART_RTS

UART_CTS

Figure 5: WT12 UART interface

Four signals are used to implement the UART function, as shown in Figure 6. When WT12
is connected to another digital device, UART_RX and UART_TX transfer data between the
two devices. The remaining two signals, UART_CTS and UART_RTS, can be used to
implement RS232 hardware flow control where both are active low indicators. DTR, DSR
and DCD signals can be implemented using PIO terminals of WT12. All UART connections
are implemented using CMOS technology and have signaling levels of 0V and VDD.

In order to communicate with the UART at its maximum data rate using a standard PC, an
accelerated serial port adapter card is required for the PC.

Parameter Possible values

1200 baud (d2%Error)
Minimum
Baud rate 9600 baud (d1%Error)
Maximum 3.0Mbaud (d1%Error)
Flow control RTS/CTS, none
Parity None, Odd, Even
Number of stop bits 1 or 2
Bits per channel 8
Table 14: Possible UART settings

The UART interface is capable of resetting WT12 upon reception of a break signal. A Break
is identified by a continuous logic low (0V) on the UART_RX terminal, as shown in Figure
7. If tBRK is longer than the value, defined by the PS Key
PSKEY_HOST_IO_UART_RESET_TIMEOUT, (0x1a4), a reset will occur. This feature allows
a host to initialize the system to a known state. Also, WT12 can emit a Break character
that may be used to wake the Host.

Since UART_RX terminal includes weak internal pull-down, it can’t be left open unless
disabling UART interface using PS_KEY settings. If UART is not disabled, a pull-up resistor

19
has to be connected to UART_RX. UART interface requires external RS232 transceiver,
which usually includes the required pull-up.

UART_RX tBRK

Figure 6: Break signal

Note:

Table 15 shows a list of commonly used Baud rates and their associated values for the
Persistent Store Key PSKEY_UART_BAUD_RATE (0x204). There is no requirement to use
these standard values. Any Baud rate within the supported range can be set in the
Persistent Store Key according to the formula in Equation below.

PSKEY_UART_BAUD_RATE
Baud Rate =
0.004096

Figure 7: Baud rate calculation formula

Persistent store values

Baud rate Error
Hex Dec
1200 0x0005 5 1.73%
2400 0x000a 10 1.73%
4800 0x0014 20 1.73%
9600 0x0027 39 -0.82%
19200 0x004f 79 0.45%
38400 0x009d 157 -0.18%
57600 0x00ec 263 0.03%
76800 0x013b 315 0.14%
115200 0x01d8 472 0.03%
230400 0x03b0 944 0.03%
460800 0x075f 1887 -0.02%
921600 0x0ebf 3775 0.00%
1382400 0x161e 5662 -0.01%
1843200 0x1d7e 7550 0.00%
2765800 0x2c3d 11325 0.00%

Table 15: UART baud rates and error values

4.1.1 UART Configuration While RESET is Active

The UART interface for WT12 while the chip is being held in reset is tri-state. This will
allow the user to daisy chain devices onto the physical UART bus. The constraint on this
method is that any devices connected to this bus must tri-state when WT12reset is de-
asserted and the firmware begins to run.

4.1.2 UART Bypass Mode

Alternatively, for devices that do not tri-state the UART bus, the UART bypass mode on
WT12 can be used. The default state of WT12 after reset is de-asserted, this is for the host

20
UART bus to be connected to the WT12 UART, thereby allowing communication to WT12
via the UART.

In order to apply the UART bypass mode, a BCCMD command will be issued to WT12 upon
this, it will switch the bypass to PIO[7:4] as shown in Figure 9. Once the bypass mode has
been invoked, WT12 will enter the deep sleep state indefinitely.

In order to re-establish communication with WT12, the chip must be reset so that the
default configuration takes affect.

It is important for the host to ensure a clean Bluetooth disconnection of any active links
before the bypass mode is invoked. Therefore it is not possible to have active Bluetooth
links while operating the bypass mode.

The current consumption for a device in UART Bypass Mode is equal to the values quoted
for a device in standby mode.

RESET

UART_TX PIO4
RXD TX

Host CTS UART_RTS PIO5

RTS
processor Another
UART_CTS PIO6 device
RTS CTS

UART_RX PIO7
TXD RX

Test UART
interface

WT12

Figure 8: UART bypass mode

21
4.2 USB Interface

WT12 USB devices contain a full speed (12Mbits/s) USB interface that is capable of driving
a USB cable directly. No external USB transceiver is required. To match the connection to
the characteristic impedance of the USB cable, series resistors must be included to both of
the signal lines. These should be of 1% tolerance and the value required may vary
between 0 and 20 ohm with 10 ohm being nominal. The resistors should be placed close to
the USB pins of the module in order to avoid reflections. The module has internally 22 ohm
resistors in series. The total input impedance seen by the cable is affected by the IC
characteristics, track layout and the connector. The cable impedance is approximately 40
ohm.

The device operates as a USB peripheral, responding to requests from a master host
controller such as a PC. Both the OHCI and the UHCI standards are supported. The set of
USB endpoints implemented can behave as specified in the USB section of the Bluetooth
v2.0 + EDR specification or alternatively can appear as a set of endpoint appropriate to
USB audio devices such as speakers.

As USB is a Master/Slave oriented system (in common with other USB peripherals), WT12
only supports USB Slave operation.

4.2.1 USB Pull-Up Resistor

WT12 features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high
when WT12 is ready to enumerate. It signals to the PC that it is a full speed (12Mbit/s)
USB device.

The USB internal pull-up is implemented as a current source, and is compliant with Section
7.1.5 of the USB specification v1.2. The internal pull-up pulls USB_D+ high to at least
2.8V when loaded with a 15k +/-5% pull-down resistor (in the hub/host). This presents a
Therein resistance to the host of at least 900. Alternatively, an external 1.5k pull-up
resistor can be placed between a PIO line and D+ on the USB cable. The firmware must be
alerted to which mode is used by setting PS Key PSKEY_USB_PIO_PULLUP appropriately.
The default setting uses the internal pull-up resistor.

4.2.2 Self Powered Mode

In self powered mode, the circuit is powered from its own power supply and not from the
VBUS (5V) line of the USB cable. It draws only a small leakage current (below 0.5mA)
from VBUS on the USB cable. This is the easier mode for which to design for, as the design
is not limited by the power that can be drawn from the USB hub or root port. However, it
requires that VBUS be connected to WT12 via a voltage devider (Rvb1 and Rvb2), so
WT12 can detect when VBUS is powered up. Voltage divider is essential to drop the 5V
voltage at the VBUS to 3,3V expected at the USB interface of WT12. WT12 will not pull
USB_DP high when VBUS is off.

Self powered USB designs (powered from a battery or PSU) must ensure that a PIO line is
allocated for USB pull-up purposes. A 1.5K 5% pull-up resistor between USB_DP and the
selected PIO line should be fitted to the design. Failure to fit this resistor may result in the
design failing to be USB compliant in self powered mode. The internal pull-up in WT12 is
only suitable for bus powered USB devices i.e. dongles.

22
 PIO

R =1.5k
USB_D+
WT12

USB_D-

Rvb1
USB_ON

Rvb2

Figure 9: USB in self powered mode

The terminal marked USB_ON can be any free PIO pin. The PIO pin selected must be
registered by setting PSKEY_USB_PIO_VBUS to the corresponding pin number. In self
powered mode PSKEY_USB_PIO_PULLUP must be set to match with the PIO selected.

Note:

USB_ON is shared with WT12 PIO terminals (PIO2-PIO7).

4.2.3 Bus Powered Mode

In bus powered mode the application circuit draws its current from the 5V VBUS supply on
the USB cable. WT12 negotiates with the PC during the USB enumeration stage about how
much current it is allowed to consume.

For WT12 Bluetooth applications, it is recommended that the regulator used to derive 3.3V
from VBUS is rated at 100mA average current and should be able to handle peaks of
120mA without fold back or limiting. In bus powered mode, WT12 requests 100mA during
enumeration.

When selecting a regulator, be aware that VBUS may go as low as 4.4V. The inrush
current (when charging reservoir and supply decoupling capacitors) is limited by the USB
specification (see USB specification v1.1, Section 7.2.4.1). Some applications may require
soft start circuitry to limit inrush current if more than 10pF is present between VBUS and
GND.

The 5V VBUS line emerging from a PC is often electrically noisy. As well as regulation
down to 3.3V, applications should include careful filtering of the 5V line to attenuate noise
that is above the voltage regulator bandwidth.

In bus powered mode PSKEY_USB_PIO_PULLUP must be set to 16 for internal pull-up

(default configuration in WT12).

23
 USB_D+

WT12
USB_D-

VBUS
USB_ON

GND
Voltage
regulator

Figure 10: USB in bus powered mode

4.2.4 Suspend Current

All USB devices must permit the USB controller to place them in a USB Suspend mode.
While in USB Suspend, bus powered devices must not draw more than 0.5mA from USB
VBUS (self powered devices may draw more than 0.5mA from their own supply). This
current draw requirement prevents operation of the radio by bus powered devices during
USB Suspend.

The voltage regulator circuit itself should draw only a small quiescent current (typically
less than 100uA) to ensure adherence to the suspend current requirement of the USB
specification. This is not normally a problem with modern regulators. Ensure that external
LEDs and/or amplifiers can be turned off by WT12. The entire circuit must be able to enter
the suspend mode. (For more details on USB Suspend, see separate CSR documentation).

4.2.5 Detach and Wake-Up Signaling

WT12 can provide out-of-band signaling to a host controller by using the control lines
called ‘USB_DETACH’ and ‘USB_WAKE_UP’. These are outside the USB specification (no
wires exist for them inside the USB cable), but can be useful when embedding WT12 into a
circuit where no external USB is visible to the user. Both control lines are shared with PIO
pins and can be assigned to any PIO pin by setting the PS Keys PSKEY_USB_PIO_DETACH
and PSKEY_USB_PIO_WAKEUP to the selected PIO number.

USB_DETACH is an input which, when asserted high, causes WT12 to put USB_D- and
USB_D+ in high impedance state and turned off the pull-up resistor on D+. This detaches
the device from the bus and is logically equivalent to unplugging the device. When
USB_DETACH is taken low, WT12 will connect back to USB and await enumeration by the
USB host.

USB_WAKE_UP is an active high output (used only when USB_DETACH is active) to wake
up the host and allow USB communication to recommence. It replaces the function of the
software USB WAKE_UP message (which runs over the USB cable), and cannot be sent
while WT12 is effectively disconnected from the bus.

24
 10ms max
10ms max

USB_DETACH

10ms max No max

USB_WAKE_UP

Port_Imbedance
USB_DPUSB_DN
USB_PULL_UP

Disconnected

Figure 11: USB_DETACH and USB_WAKE_UP Signal

4.2.6 USB Driver

A USB Bluetooth device driver is required to provide a software interface between WT12
and Bluetooth software running on the host computer. Suitable drivers are available from
www.bluegiga.com/techforum/.

4.2.7 USB 1.1 Compliance

WT12 is qualified to the USB specification v1.1, details of which are available from
http://www.usb.org. The specification contains valuable information on aspects such as PCB
track impedance, supply inrush current and product labeling.

Although WT12 meets the USB specification, Bluegiga Technologies cannot guarantee that
an application circuit designed around the module is USB compliant. The choice of
application circuit, component choice and PCB layout all affect USB signal quality and
electrical characteristics. The information in this document is intended as a guide and
should be read in association with the USB specification, with particular attention being
given to Chapter 7. Independent USB qualification must be sought before an application is
deemed USB compliant and can bear the USB logo. Such qualification can be obtained
from a USB plug fest or from an independent USB test house.

Terminals USB_D+ and USB_D- adhere to the USB specification 2.0 (Chapter 7) electrical
requirements.

4.2.8 USB 2.0 Compatibility

WT12 is compatible with USB v2.0 host controllers; under these circumstances the two
ends agree the mutually acceptable rate of 12Mbits/s according to the USB v2.0
specification.

25
4.3 SPI Interface

The synchronous serial port interface (SPI) is for interfacing with other digital devices. The
SPI port can be used for system debugging. It can also be used for programming the Flash
memory. SPI interface is connected using the MOSI, MISO, CSB and CLK pins.

The module operates as a slave and thus MISO is an output of the module. MISO is not in
high-impedance state when CSB is pulled high. Instead, the module outputs 0 if the
processor is running and 1 if it is stopped. Thus WT11 should not be connected in a multi-
slave arrangement by simple parallel connection of slave MISO lines.

26
4.4 PCM Interface

Pulse Code Modulation (PCM) is a standard method used to digitize audio (particularly
voice) patterns for transmission over digital communication channels. Through its PCM
interface, WT12 has hardware support for continual transmission and reception of PCM
data, thus reducing processor overhead for wireless headset applications. WT12 offers a bi
directional digital audio interface that routes directly into the baseband layer of the on chip
firmware. It does not pass through the HCI protocol layer.

Hardware on WT12 allows the data to be sent to and received from a SCO connection. Up
to three SCO connections can be supported by the PCM interface at any one time.

WT12 can operate as the PCM interface Master generating an output clock of 128, 256 or
512kHz. When configured as PCM interface slave it can operate with an input clock up to
2048kHz. WT12 is compatible with a variety of clock formats, including Long Frame Sync,
Short Frame Sync and GCI timing environments.

It supports 13 or 16-bit linear, 8-bit -law or A-law companded sample formats at

8ksamples/s and can receive and transmit on any selection of three of the first four slots
following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PS
KEY_PCM_CONFIG32 (0x1b3). WT12 interfaces directly to PCM audio devices including the
following:

 Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices
 OKI MSM7705 four channel A-law and -law CODEC
 Motorola MC145481 8-bit A-law and -law CODEC
 Motorola MC145483 13-bit linear CODEC
 STW 5093 and 5094 14-bit linear CODECs
 BlueCore4-External is also compatible with the Motorola SSI™ interface


4.4.1 PCM Interface Master/Slave

When configured as the Master of the PCM interface, WT12 generates PCM_CLK and
PCM_SYNC.

PCM_OUT

PCM_IN
WT12

PCM_CLK 128/256/512 kHz

PCM_SYNC 8kHz

Figure 12: WT12 as PCM master

When configured as the Slave of the PCM interface, WT12 accepts PCM_CLK and
PCM_SYNC. PCM_CLK rates up to 2048kHz are accepted.

27
 PCM_OUT

PCM_IN
WT12

PCM_CLK Up to 2048kHz

PCM_SYNC 8kHz

Figure 13: WT12 as PCM slave

4.4.2 Long Frame Sync

Long Frame Sync is the name given to a clocking format that controls the transfer of PCM
data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the
start of the PCM word. When WT12 is configured as PCM Master, generating PCM_SYNC
and PCM_CLK, then PCM_SYNC is 8-bits long. When BlueCore4-External is configured as
PCM Slave, PCM_SYNC may be from two consecutive falling edges of PCM_CLK to half the
PCM_SYNC rate, i.e. 62.5s long.

WT12 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the
rising edge. PCM_OUT may be configured to be high impedance on the falling edge of
PCM_CLK in the LSB position or on the rising edge.

PCM_SYNC

PCM_CLK

PCM_OUT 1 2 3 4 5 6 7 8

PCM_IN undefined 1 2 3 4 5 6 7 8 undefined

Figure 14: Long frame sync (shown with 8-bit Companded Sample)

4.4.3 Short Frame Sync

In Short Frame Sync the falling edge of PCM_SYNC indicates the start of the PCM word.
PCM_SYNC is always one clock cycle long.

28
 PCM_SYNC

PCM_CLK

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

PCM_IN undefined 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 undefined

Figure 15: Short frame sync (shown with 16-bit Companded Sample)

As with Long Frame Sync, WT12 samples PCM_IN on the falling edge of PCM_CLK and
transmits PCM_OUT on the rising edge. PCM_OUT may be configured to be high
impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.

4.4.4 Multi Slot Operation

More than one SCO connection over the PCM interface is supported using multiple slots.
Up to three SCO connections can be carried over any of the first four slots.

SHORT_PCM_SYNC

OR

LONG_PCM_SYNC

PCM_CLK

PCM_OUT 1 2 3 4 5 6 7 8

PCM_IN undefined 1 2 3 4 5 6 7 8 undefined

Figure 16: Multi Slot Operation with Two Slots and 8-bit Companded Samples

4.4.5 GCI Interface

WT12 is compatible with the General Circuit Interface, a standard synchronous 2B+D ISDN
timing interface. The two 64Kbps B channels can be accessed when this mode is
configured.

29
 PCM_SYNC

PCM_CLK

PCM_OUT 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8

PCM_IN undefined 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 undefined

Figure 17: GCI Interface

The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz. With
WT12 in Slave mode, the frequency of PCM_CLK can be up to 4.096MHz.

4.4.6 Slots and Sample Formats

WT12 can receive and transmit on any selection of the first four slots following each sync
pulse. Slot durations can be either 8 or 16 clock cycles. Duration’s of 8 clock cycles may
only be used with 8-bit sample formats. Durations of 16 clocks may be used with 8, 13 or
16-bit sample formats.

WT12 supports 13-bit linear, 16-bit linear and 8-bit -law or A-law sample formats. The
sample rate is 8ksamples/s. The bit order may be little or big Endian. When 16-bit slots
are used, the 3 or 8 unused bits in each slot may be filled with sign extension, padded
with zeros or a programmable 3-bit audio attenuation compatible with some Motorola
CODECs.

Sign extension

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

8-bit sample

Figure 18: 16-bit slot with 8-bit companded sample and sign extension selected

8-bit sample

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Zeros padding

Figure 19: 16-bit slot with 8-bit companded sample and zeros padding selected
3-bit sign
extension
PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

13-bit sample

Figure 20: 16-bit slot with 13-bit linear sample and sign extension selected

30
 13-bit sample

PCM_OUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Audio gain

Figure 21: 16-bit slot with 13-bit linear sample and audio gain selected

4.4.7 Additional Features

WT12 has a mute facility that forces PCM_OUT to be 0. In Master mode, PCM_SYNC may
also be forced to 0 while keeping PCM_CLK running which some CODECS use to control
power down.

4.4.8 PCM Configuration

The PCM configuration is set using two PS Keys, PSKEY_PCM_CONFIG32 and

PSKEY_PCM_LOW_JITTER_CONFIG. The following tables detail these PS Keys. The default
for PSKEY_PCM_CONFIG32 key is 0x00800000 i.e. first slot following sync is active, 13-bit
linear voice format, long frame sync and interface master generating 256kHz PCM_CLK
from 4MHz internal clock with no tri-stating of PCM_OUT.
PSKEY_PCM_LOW_JITTER_CONFIG is described in Table 17.

31
 Name Bit position Description
- 0 Set to 0
0 selects Master mode with internal generation of PCM_CLK and
PCM_SYNC. 1 selects Slave mode requiring externally generated
SLAVE MODE EN 1
PCM_CLK and PCM_SYNC. This should be set to 1 if
48M_PCM_CLK_GEN_EN (bit 11) is set.
0 selects long frame sync (rising edge indicates start of frame), 1
SHORT SYNC EN 2
selects short frame sync (falling edge indicates start of frame).
- 3 Set to 0
0 selects padding of 8 or 13-bit voice sample into a 16- bit slot by
SIGN EXTENDED inserting extra LSBs, 1 selects sign extension. When padding is
4
EN selected with 3-bit voice sample, the 3 padding bits are the audio gain
setting; with 8-bit samples the 8 padding bits are zeroes.
LSB FIRST EN 5 0 transmits and receives voice samples MSB first, 1 uses LSB first.
0 drives PCM_OUT continuously, 1 tri-states PCM_OUT immediately
TX TRISTATE EN 6 after the falling edge of PCM_CLK in the last bit of an active slot,
assuming the next slot is not active.
0 tristates PCM_OUT immediately after the falling edge of PCM_CLK
TX TRISTATE
7 in the last bit of an active slot, assuming the next slot is also not active.
RISING EDGE EN
1 tristates PCM_OUT after the rising edge of PCM_CLK.
0 enables PCM_SYNC output when master, 1 suppresses PCM_SYNC
SYNC SUPPRESS
8 whilst keeping PCM_CLK running. Some CODECS utilize this to enter
EN
a low power state.
GCI MODE EN 9 1 enables GCI mode.
MUTE EN 10 1 forces PCM_OUT to 0.
0 sets PCM_CLK and PCM_SYNC generation via DDS from internal 4
48M PCM CLK GEN
11 MHz clock, as for BlueCore4-External. 1 sets PCM_CLK and
EN
PCM_SYNC generation via DDS from internal 48 MHz clock.
0 sets PCM_SYNC length to 8 PCM_CLK cycles and 1 sets length to
LONG LENGTH
12 16 PCM_CLK cycles. Only applies for long frame sync and with
SYNC EN
48M_PCM_CLK_GEN_EN set to 1.
- [20:16] Set to 0b00000.
Selects 128 (0b01), 256 (0b00), 512 (0b10) kHz PCM_CLK frequency
MASTER CLK RATE [22:21]
when master and 48M_PCM_CLK_GEN_EN (bit 11) is low.

Table 16: PSKEY_PCM_CONFIG32 description

Name Bit position Description

CNT LIMIT [12:0] Sets PCM_CLK counter limit
CNT RATE [23:16] Sets PCM_CLK count rate.
SYNC LIMIT [31:24] Sets PCM_SYNC division relative to PCM_CLK.

Table 17: PSKEY_PCM_LOW_JITTER_CONFIG Description

32
5. I/O PARALLEL PORTS

The Parallel Input Output (PIO) Port is a general-purpose I/O interface to WT12. The port
consists of six programmable, bi-directional I/O lines, PIO[2:7]. Programmable I/O lines
can be accessed either via an embedded application running on WT12 or via private
channel or manufacturer-specific HCI commands.

All PIO lines are configured as inputs with weak pull downs at reset.

PIO[2] / USB_PULL_UP (1)

The function depends on whether WT12 is a USB or UART capable version. On UART
versions, this terminal is a programmable I/O. On USB versions, it can drive a pull-up
resistor on USB_D+. For application using external RAM this terminal may be programmed
for chip select.

PIO[3] / USB_WAKE_UP (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, its
function is selected by setting the Persistent Store Key PSKEY_USB_PIO_WAKEUP (0x2cf)
either as a programmable I/O or as a USB_WAKE_UP function.

PIO[4] / USB_ON (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, the
USB_ON function is also selectable.

PIO[5] / USB_DETACH (1)

On UART versions of WT12 this terminal is a programmable I/O. On USB versions, the
USB_DETACH function is also selectable.

PIO[6] / CLK_REQ

Function is determined by Persistent Store Keys. Using PSKEY_CLOCK_REQUEST_ENABLE,

(0x246) this terminal can be configured to be low when WT12 is in deep sleep and high
when a clock is required. The clock must be supplied within 4ms of the rising edge of
PIO[6] to avoid losing timing accuracy in certain Bluetooth operating modes.

PIO[7]

Programmable I/O terminal.

33
6. SOFTWARE STACKS

WT12 is supplied with Bluetooth v2.0 + EDR compliant stack firmware, which runs on the
internal RISC microcontroller.

The WT12 software architecture allows Bluetooth processing and the application program
to be shared in different ways between the internal RISC microcontroller and an external
host processor (if any). The upper layers of the Bluetooth stack (above HCI) can be run
either on-chip or on the host processor.

6.1 iWRAP Stack

iWRAP

RFCOMM SDP

L2CAP

HCI

LM

LC

48kB RAM Baseband MCU

UART
Host I/O

Host I/O
Radio

PCM
PCM I/O

Figure 22: WRAP THOR VM Stack

In figure 23 above, the iWRAP software solution is described. In this version of the stack
firmware shown no host processor is required to run the Bluetooth protocol stack. All
software layers, including application software, run on the internal RISC processor in a
protected user software execution environment known as a Virtual Machine (VM).

The host processor interfaces to iWRAP software via one or more of the physical
interfaces, which are also shown in the figure 23. The most common interfacing is done via
UART interface using the ASCII commands supported by the iWRAP software. With these
ASCII commands the user can access Bluetooth functionality without paying any attention
to the complexity, which lies in the Bluetooth protocol stack.

The user may write applications code to run on the host processor to control iWRAP
software with ASCII commands and to develop Bluetooth powered applications.

34
Notes:

More details of iWRAP software and it’s features can be found from iWRAP User Guide
which can be downloaded from www.bluegiga.com.

6.2 HCI Stack

HCI

LM

LC

48kB RAM Baseband MCU

USB

UART
Host Host I/O
I/O
Radio
PCM
PCM I/O

Figure 23: WRAP THOR HCI Stack

In the implementation shown in figure 24 the internal processor runs the Bluetooth stack
up to the Host Controller Interface (HCI). The Host processor must provide all upper layers
including the application.

Features of HCI Stack

1. New Bluetooth v2.0 + EDR Mandatory Functionality:

 (AFH), including classifier

 Faster connection – enhanced inquiry scan (immediate FHS response)
 LMP improvements
 Parameter ranges

2. Optional v2.0 functionality supported:

 Adaptive Frequency Hopping (AFH) as Master and Automatic Channel Classification

 Fast Connect – Interlaced Inquiry and Page Scan plus RSSI during Inquiry
 Extended SCO (eSCO), eV3 +CRC, eV4, eV5
 SCO handle
 Synchronization

35
The firmware has been written against the Bluetooth v2.0 + EDR Specification.

 Bluetooth components:
o Baseband (including LC)
o LM
o HCI

 Standard USB v2.0 (full speed) and UART HCI Transport Layers
 All standard radio packet types
 Full Bluetooth data rate, enhanced data rates of 2 and 3Mbps(1)
 Operation with up to seven active slaves(1)
 Scatternet v2.5 operation
 Maximum number of simultaneous active ACL connections: 7(2)
 Maximum number of simultaneous active SCO connections: 3(2)
 Operation with up to three SCO links, routed to one or more slaves
 All standard SCO voice coding, plus “transparent SCO”
 Standard operating modes: page, inquiry, page-scan and inquiry-scan
 All standard pairing, authentication, link key and encryption operations
 Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including
Forced Hold”
 Dynamic control of peers’ transmit power via LMP
 Master/Slave switch
 Broadcast
 Channel quality driven data rate
 All standard Bluetooth Test Modes

The firmware’s supported Bluetooth features are detailed in the standard Protocol
Implementation Conformance (PICS) documents. They can be asked separately form
[email protected].

Extra functionality:
 Supports BlueCore Serial Protocol (BCSP) – a proprietary, reliable alternative to the
standard Bluetooth UART Host Transport
 Provides a set of approximately 50 manufacturer-specific HCI extension commands.
This command set (called BCCMD – “BlueCore Command”), provides:
 Access to the chip’s general-purpose PIO port
 The negotiated effective encryption key length on established Bluetooth links
 Access to the firmware’s random number generator
 Controls to set the default and maximum transmit powers – these can help minimize
interference between overlapping, fixed-location piconets
 Dynamic UART configuration

36
 Radio transmitter enable/disable – a simple command connects to a dedicated
hardware switch that determines whether the radio can transmit
 The firmware can read the voltage on a pair of the chip’s external pins. This is normally
used to build a battery monitor, using either VM or host code
 A block of BCCMD commands provides access to the chip’s “persistent store”
configuration database (PS). The database sets the device’s Bluetooth address, Class
of Device, radio (transmit class) configuration, SCO routing, LM, USB and DFU
constants, etc.
 A UART “break” condition can be used in three ways:
 Presenting a UART break condition to the chip can force the chip to perform a hardware
reboot
 Presenting a break condition at boot time can hold the chip in a low power state,
preventing normal initialization while the condition exists
 With BCSP, the firmware can be configured to send a break to the host before sending
data – normally used to wake the host from a deep sleep state
 The DFU standard has been extended with public/private key authentication, allowing
manufacturers to control the firmware that can be loaded onto their Bluetooth modules
 A modified version of the DFU protocol allows firmware upgrade via the chip’s UART
 A block of “radio test” or BIST commands allows direct control of the chip’s radio. This
aids the development of modules’ radio designs, and can be used to support Bluetooth
qualification.
 Virtual Machine (VM). The firmware provides the VM environment in which to run
application-specific code. Although the VM is mainly used with BlueLab and “RFCOMM
builds” (alternative firmware builds providing L2CAP, SDP and RFCOMM), the VM can
be used with this build to perform simple tasks such as flashing LED’s via the chip’s
PIO port.
 Hardware low power modes: shallow sleep and deep sleep. The chip drops into modes
that significantly reduce power consumption when the software goes idle.
 SCO channels are normally routed via HCI (over BCSP). However, up to three SCO
channels can be routed over the chip’s single PCM port (at the same time as routing
any remaining SCO channels over HCI).
 Co-operative existence with 802.11b/g chipsets. The device can be optionally
configured to support a number of different co-existence schemes including:
o TDMA - Bluetooth and WLAN avoid transmitting at the same time.
o FDMA - Bluetooth avoids transmitting within the WLAN channel
o Combination TDMA & FDMA - Bluetooth avoids transmitting in the WLAN
channel only when WLAN is active.
 Please refer to separate documentation for full details of the co-existence schemes that
CSR supports.

Notes:

1. Supports basic data rate up to 723.2kbps asymmetric, maximum allowed by

Bluetooth v2.0 + EDR specification

2. WT12 supports all combinations of active ACL and SCO channels for both Master
and

3. Always refer to the Firmware Release Note for the specific functionality of a
particular build.

37
6.3 RFCOMM Stack

RFCOMM SDP

L2CAP

HCI

LM

LC

48kB RAM Baseband MCU

USB

Host I/O
UART
Host Radio
I/O

PCM I/O
PCM

Figure 24: WRAP THOR RFCOMM stack

In the version of the firmware, shown in Figure 25, the upper layers of the Bluetooth stack
up to RFCOMM are run on-chip. This reduces host-side software and hardware
requirements at the expense of some of the power and flexibility of the HCI only stack.

Features of RFCOMM Stack

Interfaces to Host:

 RFCOMM, an RS-232 serial cable emulation protocol

 SDP, a service database look-up protocol

Connectivity:

 Maximum number of active slaves: 3

 Maximum number of simultaneous active ACL connections: 3
 Maximum number of simultaneous active SCO connections: 3
 Data Rate: up to 350kbps1

Security:

 Full support for all Bluetooth security features up to and including strong (128-bit)

 encryption.

38
Power Saving:

 Full support for all Bluetooth power saving modes (Park, Sniff and Hold).

Data Integrity:

 CQDDR increases the effective data rate in noisy environments.

 RSSI used to minimize interference to other radio devices using the ISM band.

Notes:

1. The data rate is with respect to WT12 with basic data rate packets.

6.4 VM Stack

VM Application Software

RFCOMM SDP

L2CAP

HCI

LM

LC

48kB RAM Baseband MCU

USB

Host I/O
UART
Host Radio
I/O

PCM I/O
PCM

Figure 25: WRAP THOR VM Stack

In figure 26, this version of the stack firmware shown requires no host processor (but can
use a host processor for debugging etc.). All software layers, including application
software, run on the internal RISC processor in a protected user software execution
environment known as a Virtual Machine (VM).

The user may write custom application code to run on the BlueCore VM using BlueLab™
software development kit (SDK) supplied with the Casira development kit, available
separately from Bluegiga or directly form CSR. This code will then execute alongside the

39
main WRAP THOR firmware. The user is able to make calls to the WRAP THOR firmware for
various operations. WRAP THOR firmware is not equal to iWRAP firmware, which on the
contrary does not allow user to run own firmware in the module.

The execution environment is structured so the user application does not adversely affect
the main software routines, thus ensuring that the Bluetooth stack software component
does not need re-qualification when the application is changed.

Using the VM and the BlueLab SDK the user is able to develop applications such as a
cordless headset or other profiles without the requirement of a host controller. BlueLab is
supplied with example code including a full implementation of the headset profile.

Notes:

Sample applications to control PIO lines can also be written with BlueLab SDK and the VM
for the HCI stack.

6.5 HID Stack

VM Application Software

HID SDP

L2CAP

HCI

LM

LC

48kB RAM Baseband MCU

Host I/O
UART
Sensing
Hardware Radio
I/O

PCM I/O

Figure 26: WRAP THOR HID stack

This version of the stack firmware requires no host processor. All software layers,
including application software, run on the internal RISC microcontroller in a protected user
software execution environment known as a virtual machine (VM).

The user may write custom application code to run on the BlueCore VM using BlueLab
Professional software development kit (SDK) supplied with the BlueLab Professional and
Casira development kits, available separately from CSR. This code will then execute

40
alongside the main BlueCore firmware. The user is able to make calls to the BlueCore
firmware for various operations.

The execution environment is structured so the user application does not adversely affect
the main software routines, thus ensuring that the Bluetooth stack software component
does not need re-qualification when the application is changed.

Using the VM and the BlueLab Professional SDK the user is able to develop Bluetooth HID
devices such as an optical mouse or keyboard. The user is able to customize features
such as power management and connect/reconnect behavior.

The HID I/O component in the HID stack controls low latency data acquisition from
external sensor hardware. With this component running in native code, it does not incur
the overhead of the VM code interpreter. Supported external sensors include 5 mouse
buttons, the Agilent ADNS-2030 optical sensor, quadrature scroll wheel, direct coupling to
a keyboard matrix and a UART interface to custom hardware.

A reference schematic for implementing a three button, optical mouse with scroll wheel is
available separately.

Software Development

WT12 Evaluation Kits are available to allow the evaluation of the WT12 hardware and
software as well CSR BlueLab toolkit for developing on-chip and host software.

41
7. ENHANCED DATA RATE

EDR has been introduced to provide 2x and optionally 3x data rates with minimal
disruption to higher layers of the Bluetooth stack. CSR supports both of the new data
rates, with WT12. WT12 is compliant with revision v2.0.E.2 of the specification.

7.1 Enhanced Data Rate Baseband

At the baseband level EDR uses the same 1.6kHz slot rate as basic data rate and therefore
the packets can be 1, 3, or 5 slots long as per the basic data rate. Where EDR differs from
the basic data rate is that in the same 1MHz symbol rate 2 or 3bits are used per symbol,
compared to 1bit per symbol used by the basic data rate. To achieve the increase in
number of bits symbol, two new modulation schemes have been introduced as
summarized in Table 18 presented below and the modulation schemes are explained in the
further sections.

Scheme Bits per symbol Modulation

Basic data rate 1 GFSK
Enhanced data rate 2 P/4 DQPSK
Enhanced data rate 3 8DPSK (optional)

Table 18: Data rate schemes

Although the EDR uses new packets Link establishment and management are unchanged
and still use Basic Rate packets.

7.2 Enhanced Data Rate /4 DQPSK

4-state Differential Phase Shift Keying

2 bits determine phase shift between consecutive symbols

2 bits determine phase shift between consecutive symbols

S/4 rotation avoids phase shift of S, which would cause large amplitude variation

Raised Cosine pulse shaping filter to further reduce side band emissions

Bit pattern Phase shift

00 
01 
10 
11 

Table 19: 2 bits determine phase shift between consecutive symbols

7.3 8DQPSK

8-state Differential Phase-Shift Keying

Three bits determine phase shift between consecutive symbols.

42
 Bit pattern Phase shift
 
 
 
 
 
 
 
 

Table 20: 3 bits determine phase shift between consecutive symbols

Figure 27: 8DQPSK

43
8. LAYOUT AND SOLDERING CONSIDERATIONS

8.1 Soldering recommendations

WT12 is compatible with industrial standard reflow profile for Pb-free solders. The reflow
profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Consult the datasheet of
particular solder paste for profile configurations.

Bluegiga Technologies will give following recommendations for soldering the module to
ensure reliable solder joint and operation of the module after soldering. Since the profile
used is process and layout dependent, the optimum profile should be studied case by case.
Thus following recommendation should be taken as a starting point guide.

 Refer to technical documentations of particular solder paste for profile configurations

 Avoid using more than one flow.

 Reliability of the solder joint and self-alignment of the component are dependent on
the solder volume. Minimum of 150m stencil thickness is recommended.

 Aperture size of the stencil should be 1:1 with the pad size.

 A low residue, “no clean” solder paste should be used due to low mounted height of
the component.

8.2 Layout guidelines

It is strongly recommended to use good layout practices to ensure proper operation of the
module. Placing copper or any metal near antenna deteriorates its operation by having
effect on the matching properties. Metal shield around the antenna will prevent the
radiation and thus metal case should not be used with the module. Use grounding vias
separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating
inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB
edges. Figure 5 illustrates recommended PCB design around the antenna of WT12 when
the module is placed at the edge of a PCB.

Do not place copper on the top layer under the module, as shown in figure 5. The module
has vias on the area shown, which can cause short circuit if there is copper underneath.
Any metal placed closer than 20 mm in any direction from the antenna changes the
matching properties and thus will considerably deteriorate the RF performance of the
module.

44
 Figure 28: Suggested PCB design around ACX antenna with the module at the edge of PCB

Following recommendations helps to avoid EMC problems arising in the design. Note that
each design is unique and the following list do not consider all basic design rules such as
avoiding capacitive coupling between signal lines. Following list is aimed to avoid EMC
problems caused by RF part of the module. Use good consideration to avoid problems
arising from digital signals in the design.

 Do not remove copper from the PCB more than needed. Use ground filling as much
as possible. However remove small floating islands after copper pour.

 Do not place a ground plane underneath the antenna. The grounding areas under
the module should be designed as shown in Figure 5.

 Use conductive vias separated max. 3 mm apart at the edge of the ground areas.
This prevents RF to penetrate inside the PCB. Use ground vias extensively all over
the PCB. If you allow RF freely inside the PCB, you have a potential resonator in
your hand. All the traces in (and on) the PCB are potential antennas.

 Avoid loops.

 Ensure that signal lines have return paths as short as possible. For example if a
signal goes to an inner layer through a via, always use ground vias around it. Locate
them tightly and symmetrically around the signal vias.

45
 Routing of any sensitive signals should be done in the inner layers of the PCB.

 Sensitive traces should have a ground area above and under the line. If this is not
possible make sure that the return path is short by other means (for example using
a ground line next to the signal line).

46
9. WT12 PHYSICAL DIMENSIONS

WT12-A Dimensions
Tol. +/- 0.2mm

25.0 mm

20.0 mm
<

ant

14 mm
10.0 mm
BLUEGIGA

0.5mm 5.0 mm

PCB thickness 0.8mm

2.4 mm ant
2.0 mm

ant 1.6 +/- 0.2 mm

3.2 +/- 0.2mm

Figure 29: WT12 dimensions

47
Figure 30: WT12 foot print and dimension (top view)

Figure 31: WT12 pad dimensions

48
10. PACKAGE

Figure 32: Reel information

49
Figure 33: Tape information

50
11. CERTIFICATIONS

WT12 is compliant to the following specifications

11.1 Bluetooth

WT12 module is Bluetooth qualified and listed as an end product. If not modified in any
way, it is a complete Bluetooth entity, containing software and hardware functionality as
well as the whole RF-part including the antenna. This practically translates to that if the
module is used without modification of any kind, it does not need any Bluetooth approval
work. If changes are made in the parameter set, added profiles or in the antenna design,
it is required to be submitted to a BQB (Bluetooth Qualification Body) for evaluation on
what needs to be tested.

With HCI firmware WT12 will not meet the requirements of end product qualification.

WT12 is Bluetooth compliant to the following specifications

1. RF as defined in Part A of the Bluetooth specification v2.0+EDR, Vol.2 Core System

Package [Controller volume] (Class 1 operation) with all optional and mandatory
features supported.

2. BB as defined in Part B of the Bluetooth specification v2.0+EDR, Vol.2 Core System

Package [Controller volume], and specified in the covered functionality of the
Software Integrated Component (Bluetooth ID: B01294)

3. LM as defined in Part C of the Bluetooth specification v2.0+EDR, Vol.2 Core System

Package [Controller volume], and specified in the covered functionality of the
Software Integrated Component (Bluetooth ID: B01294)

4. L2CAP as defined in Part A of the Bluetooth specification v2.0+EDR, Vol.3 Core

System Package [Controller volume], and specified in the covered functionality of
the Software Integrated Component (Bluetooth ID: B00477)

5. SDP as defined in Part B of the Bluetooth specification v2.0+EDR, Vol.3 Core

System Package [Controller volume], and specified in the covered functionality of
the Software Integrated Component (Bluetooth ID: B00477)

6. RFCOMM as defined in PART F:1 of the Bluetooth Core Specification v1.1 and
specified in the covered functionality of the Software Integrated Component
(Bluetooth ID: B00047).

7. Generic Access GAP as defined in PART C of the Bluetooth Core Specification

v2.0+EDR, Vol.3 Core Systems Package [Host Volume], and specified in the
covered functionality of the Software Integrated Component (Bluetooth ID:
B00047).

8. Serial Port Profile (SPP) as defined in PART K:5 of the Bluetooth Profile Specification
v1.1, and specified in the covered functionality of the Software Integrated
Component (Bluetooth ID: B00047).

Bluetooth identifier: B03005

51
11.2 FCC

Federal Communications Commission (FCC) Statement

15.21

You are cautioned that changes or modifications not expressly approved by the part
responsible for compliance could void the user’s authority to operate the equipment.

15.105(b)

This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

Operation is subject to the following two conditions:

 This device may not cause interference and

 This device must accept any interference, including interference that may cause
undesired operation of the device.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. End users must follow the specific operating instructions for satisfying RF
exposure compliance. This transmitter must not be co-located or operating in conjunction
with any other antenna or transmitter.

Note: The end product shall has the words “Contains Transmitter Module FCC ID:
QOQWT12”

WT12-A FCC ID: QOQWT12

11.3 CE

WT12 meets the requirements of the standards below and hence fulfills the requirements
of EMC Directive 89/336/EEC as amended by Directives 92/31/EEC and 93/68/EEC within
CE marking requirement.

 Electromagnetic emission EN 301 489-17 V.1.2.1

52
 o EN 55022:1998+A

o EN 55022:2000+A3

o EN 55022:2003 Class B

o EN 61000-3-2:2001

o EN 61000-3-3:1995 A1:2001

o EN 61000-4-3:2002

o EN 61000-4-4:1995 A1:2000

o EN 61000-4-5:1995 A1:2000

o EN 61000-4-6:1996 A1:2000

o EN 61000-4-11:1994 A1:2000

 ETSI EN 300.328 V1.6.1:2004

11.4 Industry Canada (IC)

WT12 meets Industry Canada’s procedural and specification requirements for certification.

Industry Canada ID: 5123A-BGTWT12A

53
12. ROHS STATEMENT WITH A LIST OF BANNED MATERIALS

WT12 meets the requirements of Directive 2002/95/EC of the European Parliament and of
the Council on the Restriction of Hazardous Substance (RoHS)

The following banned substances are not present in WT11, which is compliant with RoHS:

 Cadmium

 Lead

 Mercury

 Hexavalent chromium

 PBB (Polybrominated Bi-Phenyl)

 PBDE (Polybrominated Diphenyl Ether)

54
13. CONTACT INFORMATION
Sales: [email protected]

Technical support: [email protected]

http://www.bluegiga.com/techforum/

Orders: [email protected]

Head Office / Finland

Phone: +358-9-4355 060

Fax: +358-9-4355 0660

Street Address:
Sinikalliontie 11
02630 ESPOO
FINLAND

Postal address:
P.O. BOX 120
02631 ESPOO, FINLAND

Sales Office / USA

Phone: (781) 556-1039

Bluegiga Technologies, Inc.

99 Derby Street, Suite 200
Hingham, MA 02043

55