NXP Semiconductors Document Number: IMX6SDLIEC

Rev. 9, 11/2018
Data Sheet: Technical Data

MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB
MCIMX6SxCxxxxxC MCIMX6UxCxxxxxC
MCIMX6SxCxxxxxD MCIMX6UxCxxxxxD

i.MX 6Solo/6DualLite
Applications Processors
for Industrial Products

Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 3

1 Introduction 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
The i.MX 6Solo/6DualLite processors represent the 1.3 Updated Signal Naming Convention . . . . . . . . . . . .8
latest achievement in integrated multimedia-focused 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
products offering high-performance processing with a 3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
high degree of functional integration to meet the 3.1 Special Signal Considerations . . . . . . . . . . . . . . . .20
3.2 Recommended Connections for Unused Analog
demands of high-end, advanced industrial and medical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
applications requiring graphically rich and highly 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .22
responsive user interfaces. 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .22
4.2 Power Supplies Requirements and Restrictions . .32
4.3 Integrated LDO Voltage Regulator Parameters . . .33
The processors feature advanced implementation of 4.4 PLL’s Electrical Characteristics . . . . . . . . . . . . . . .35
single/dual Arm® Cortex®-A9 core, which operates at 4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .36
speeds of up to 800 MHz. They include 2D and 3D 4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .38
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .42
graphics processors, 1080p video processing, and 4.8 Output Buffer Impedance Parameters . . . . . . . . . .46
integrated power management. Each processor provides 4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . .48
4.10 General-Purpose Media Interface (GPMI) Timing .61
a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory 4.11 External Peripheral Interface Parameters . . . . . . .69
interface and a number of other interfaces for connecting 5 Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .127
peripherals, such as WLAN, Bluetooth®, GPS, hard 5.1 Boot Mode Configuration Pins . . . . . . . . . . . . . . .127
5.2 Boot Device Interface Allocation . . . . . . . . . . . . .128
drive, displays, and camera sensors. 6 Package Information and Contact Assignments . . . . . .129
6.1 Updated Signal Naming Convention . . . . . . . . . .129
6.2 21x21 mm Package Information. . . . . . . . . . . . . .130
7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .155

NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products
Introduction

The i.MX 6Solo/6DualLite processors are specifically useful for applications such as:
• Graphics rendering for Human Machine Interfaces (HMI)
• High-performance speech processing with large databases
• Video processing and display
• Portable medical
• Home energy management systems
• Industrial control and automation
The i.MX 6Solo/6DualLite applications processors feature:
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, DDR3L, LPDDR2, NOR Flash,
PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed NAND,
including eMMC up to rev 4.4/4.41.
• Smart speed technology—The processors have power management throughout the IC that enables
the rich suite of multimedia features and peripherals to consume minimum power in both active
and various low power modes. Smart speed technology enables the designer to deliver a
feature-rich product, requiring levels of power far lower than industry expectations.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a multi-standard
hardware video codec, an image processing unit (IPU), a programmable smart DMA (SDMA)
controller, and an asynchronous sample rate converter.
• Powerful graphics acceleration—Each processor provides two independent, integrated graphics
processing units: an OpenGL® ES 2.0 3D graphics accelerator with a shader and a 2D graphics
accelerator.
• Interface flexibility—Each processor supports connections to a variety of interfaces: LCD
controller for up to two displays (including parallel display, HDMI1.4, MIPI display, and LVDS
display), dual CMOS sensor interface (parallel or through MIPI), high-speed USB on-the-go with
PHY, high-speed USB host with PHY, multiple expansion card ports (high-speed MMC/SDIO host
and other), 10/100/1000 Mbps Gigabit Ethernet controller two CAN ports, ESAI audio interface,
and a variety of other popular interfaces (such as UART, I2C, and I2S serial audio, and PCIe-II).
• Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the i.MX 6Solo/6DualLite
Security Reference Manual (IMX6DQ6SDLSRM).
• Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.

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2 NXP Semiconductors
 Introduction

1.1 Ordering Information

Table 1 provides examples of orderable part numbers covered by this data sheet. Table 1 does not include
all possible orderable part numbers. The latest part numbers are available on the web page
nxp.com/imx6series. If the desired part number is not listed in Table 1, go to nxp.com/imx6series or
contact a NXP representative for details.
Table 1. Example Orderable Part Numbers

i.MX6 CPU
Speed Temperature
Part Number Solo/ Options Package
DualLite
Grade1 Grade

MCIMX6U7CVM08AB DualLite With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm,
2x Arm Cortex-A9 64-bit DDR 0.8 mm pitch, MAPBGA

MCIMX6U7CVM08AC DualLite With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm,
2x Arm Cortex-A9 64-bit DDR 0.8 mm pitch, MAPBGA

MCIMX6U7CVM08AD DualLite With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm, 0.8 mm
2x Arm Cortex-A9 64-bit DDR pitch, MAPBGA

MCIMX6S7CVM08AB Solo With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm,
1x Arm Cortex-A9 32-bit DDR 0.8 mm pitch, MAPBGA

MCIMX6S7CVM08AC Solo With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm,
1x Arm Cortex-A9 32-bit DDR 0.8 mm pitch, MAPBGA

MCIMX6S7CVM08AD Solo With VPU, GPU, no EPDC, no MLB 800 MHz Industrial 21 mm x 21 mm, 0.8 mm
1x Arm Cortex-A9 32-bit DDR pitch, MAPBGA
1 If a 24 MHz clock is used (required for USB), then the maximum SoC speed is limited to 792 MHz.

Figure 1 describes the part number nomenclature to identify the characteristics of a specific part number
(for example, cores, frequency, temperature grade, fuse options, and silicon revision).
The primary characteristic that differentiates which data sheet applies to a specific part is the temperature
grade (junction) field. The following list describes the correct data sheet to use for a specific part:
• The i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors data sheet
(IMX6SDLAEC) covers parts listed with an “A (Automotive temp)”
• The i.MX 6Solo/6DualLite Applications Processors for Consumer Products data sheet
(IMX6SDLCEC) covers parts listed with a “D (Commercial temp)” or “E (Extended Commercial
temp)”
• The i.MX 6Solo/6DualLite Applications Processors for Industrial Products data sheet
(IMX6SDLIEC) covers parts listed with “C (Industrial temp)”
For more information go to nxp.com/imx6series or contact a NXP representative for details.

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NXP Semiconductors 3
Introduction

MC IMX6 X @ + VV $$ % A

Silicon revision1 A
Qualification level MC
Rev 1.1 B
Prototype Samples PC
Rev 1.2 (Maskset ID: 2N81E) C
Mass Production MC
Rev 1.3 (Maskset ID: 3N81E)
Special SC Rev 1.4 (Maskset ID: 4N81E) D

Fusing %
Part # series X
Default settings A
i.MX 6DualLite U
HDCP enabled C
2x ARM Cortex-A9, 64-bit DDR
i.MX 6Solo S Frequency $$
1x ARM Cortex-A9, 32-bit DDR
800 MHz 2 08

1 GHz 3 10
Part differentiator @
Package type RoHS
Consumer VPU GPU EPDC MLB 8
Temperature Tj MAPBGA 21 x 21 0.8mm VM
+
Industrial VPU GPU – – 7
°
Automotive VPU GPU – MLB 6 Commercial: 0 to + 95 C D

Consumer VPU GPU – MLB 5 Extended commercial: -20 to + 105°C E

Automotive – GPU – MLB 4 Industrial: -40 to +105°C C

Automotive – – – MLB 1 Automotive: -40 to + 125°C A

1. See the nxp.com\imx6series Web page for latest information on the available silicon revision.
2. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 792 MHz.
3. If a 24 MHz input clock is used (required for USB), the maximum SoC speed is limited to 996 MHz.

Figure 1. Part Number Nomenclature—i.MX 6Solo and 6DualLite

Figure 2. Example Part Marking

1.2 Features
The i.MX 6Solo/6DualLite processors are based on Arm Cortex-A9 MPCore Platform, which has the
following features:
• The i.MX 6Solo supports single Arm Cortex-A9 MPCore (with TrustZone)
• The i.MX 6DualLite supports dual Arm Cortex-A9 MPCore (with TrustZone)
• The core configuration is symmetric, where each core includes:
— 32 KByte L1 Instruction Cache
— 32 KByte L1 Data Cache
— Private Timer and Watchdog

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 Introduction

— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor

The Arm Cortex-A9 MPCore complex includes:
• General Interrupt Controller (GIC) with 128 interrupt support
• Global Timer
• Snoop Control Unit (SCU)
• 512 KB unified I/D L2 cache:
— Used by one core in i.MX 6Solo
— Shared by two cores in i.MX 6DualLite
• Two Master AXI bus interfaces output of L2 cache
• Frequency of the core (including NEON and L1 cache), as per Table 8.
• NEON MPE coprocessor
— SIMD Media Processing Architecture
— NEON register file with 32x64-bit general-purpose registers
— NEON Integer execute pipeline (ALU, Shift, MAC)
— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)
— NEON load/store and permute pipeline
The SoC-level memory system consists of the following additional components:
— Boot ROM, including HAB (96 KB)
— Internal multimedia / shared, fast access RAM (OCRAM, 128 KB)
— Secure/non-secure RAM (16 KB)
• External memory interfaces: The i.MX 6Solo/6DualLite processors support latest, high volume,
cost effective handheld DRAM, NOR, and NAND Flash memory standards.
— 16/32-bit LP-DDR2-800, 16/32-bit DDR3-800 and DDR3L-800 in i.MX 6Solo; 16/32/64-bit
LP-DDR2-800, 16/32/64-bit DDR3-800 and DDR3L-800, supporting DDR interleaving mode
for 2x32 LPDDR2-800 in i.MX 6DualLite
— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size,
BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.
— 16/32-bit NOR Flash. All WEIMv2 pins are muxed on other interfaces.
— 16/32-bit PSRAM, Cellular RAM
Each i.MX 6Solo/6DualLite processor enables the following interfaces to external devices (some of them
are muxed and not available simultaneously):
• Displays—Total of four interfaces available. Total raw pixel rate of all interfaces is up to 450
Mpixels/sec, 24 bpp. Up to two interfaces may be active in parallel.
— One Parallel 24-bit display port, up to 225 Mpixels/sec (for example, WUXGA at 60 Hz or dual
HD1080 and WXGA at 60 Hz)
— LVDS serial ports—One port up to 165 Mpixels/sec or two ports up to 85 MP/sec (for example,
WUXGA at 60 Hz) each
— HDMI 1.4 port

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NXP Semiconductors 5
Introduction

— MIPI/DSI, two lanes at 1 Gbps

• Camera sensors:
— Two parallel Camera ports (up to 20 bit and up to 240 MHz peak)
— MIPI CSI-2 Serial port, supporting from 80 Mbps to 1 Gbps speed per data lane. The CSI-2
Receiver core can manage one clock lane and up to two data lanes. Each i.MX 6Solo/6DualLite
processor has two lanes.
• Expansion cards:
— Four MMC/SD/SDIO card ports all supporting:
– 1-bit or 4-bit transfer mode specifications for SD and SDIO cards up to UHS-I SDR-104
mode (104 MB/s max)
– 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 52 MHz in both SDR
and DDR modes (104 MB/s max)
• USB:
— One high speed (HS) USB 2.0 OTG (Up to 480 Mbps), with integrated HS USB Phy
— Three USB 2.0 (480 Mbps) hosts:
– One HS host with integrated High Speed Phy
– Two HS hosts with integrated HS-IC USB (High Speed Inter-Chip USB) Phy
• Expansion PCI Express port (PCIe) v2.0 one lane
— PCI Express (Gen 2.0) dual mode complex, supporting Root complex operations and Endpoint
operations. Uses x1 PHY configuration.
• Miscellaneous IPs and interfaces:
— SSI block is capable of supporting audio sample frequencies up to 192 kHz stereo inputs and
outputs with I2S mode
— ESAI is capable of supporting audio sample frequencies up to 260 kHz in I2S mode with 7.1
multi channel outputs
— Five UARTs, up to 5.0 Mbps each:
– Providing RS232 interface
– Supporting 9-bit RS485 multidrop mode
– One of the five UARTs (UART1) supports 8-wire while others four supports 4-wire. This is
due to the SoC IOMUX limitation, since all UART IPs are identical.
— Four eCSPI (Enhanced CSPI)
— Four I2C, supporting 400 kbps
— Gigabit Ethernet Controller (IEEE1588 compliant), 10/100/10001 Mbps
— Four Pulse Width Modulators (PWM)
— System JTAG Controller (SJC)
— GPIO with interrupt capabilities
— 8x8 Key Pad Port (KPP)
1. The theoretical maximum performance of 1 Gbps ENET is limited to 470 Mbps (total for Tx and Rx) due to internal bus
throughput limitations. The actual measured performance in optimized environment is up to 400 Mbps. For details, see the
ERR004512 erratum in the i.MX 6Solo/6DualLite errata document (IMX6SDLCE).

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 Introduction

— Sony Philips Digital Interconnect Format (SPDIF), Rx and Tx

— Two Controller Area Network (FlexCAN), 1 Mbps each
— Two Watchdog timers (WDOG)
— Audio MUX (AUDMUX)
The i.MX 6Solo/6DualLite processors integrate advanced power management unit and controllers:
• Provide PMU, including LDO supplies, for on-chip resources
• Use Temperature Sensor for monitoring the die temperature
• Support DVFS techniques for low power modes
• Use SW State Retention and Power Gating for Arm and MPE
• Support various levels of system power modes
• Use flexible clock gating control scheme
The i.MX 6Solo/6DualLite processors use dedicated hardware accelerators to meet the targeted
multimedia performance. The use of hardware accelerators is a key factor in obtaining high performance
at low power consumption numbers, while having the CPU core relatively free for performing other tasks.
The i.MX 6Solo/6DualLite processors incorporate the following hardware accelerators:
• VPU—Video Processing Unit
• IPUv3H—Image Processing Unit version 3H
• GPU3Dv5—3D Graphics Processing Unit (OpenGL ES 2.0) version 5
• GPU2Dv2—2D Graphics Processing Unit (BitBlt)
• ASRC—Asynchronous Sample Rate Converter
Security functions are enabled and accelerated by the following hardware:
• Arm TrustZone including the TZ architecture (separation of interrupts, memory mapping, etc.)
• SJC—System JTAG Controller. Protecting JTAG from debug port attacks by regulating or blocking
the access to the system debug features.
• CAAM—Cryptographic Acceleration and Assurance Module, containing cryptographic and hash
engines, 16 KB secure RAM, and True and Pseudo Random Number Generator (NIST certified).
• SNVS—Secure Non-Volatile Storage, including Secure Real Time Clock
• CSU—Central Security Unit. Enhancement for the IC Identification Module (IIM). Will be
configured during boot and by eFUSEs and will determine the security level operation mode as
well as the TZ policy.
• A-HAB—Advanced High Assurance Boot—HABv4 with the new embedded enhancements:
SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization.
NOTE
The actual feature set depends on the part numbers as described in Table 1,
"Example Orderable Part Numbers," on page 3. Functions, such as video
hardware acceleration, and 2D and 3D hardware graphics acceleration may
not be enabled for specific part numbers.

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NXP Semiconductors 7
Introduction

1.3 Updated Signal Naming Convention

The signal names of the i.MX6 series of products have been standardized to better align the signal names
within the family and across the documentation. Some of the benefits of these changes are as follows:
• The names are unique within the scope of an SoC and within the series of products
• Searches will return all occurrences of the named signal
• The names are consistent between i.MX 6 series products implementing the same modules
• The module instance is incorporated into the signal name
This change applies only to signal names. The original ball names have been preserved to prevent the need
to change schematics, BSDL models, IBIS models, etc.
Throughout this document, the updated signal names are used except where referenced as a ball name
(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal
name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to
map the signal names used in older documentation to the new standardized naming conventions.

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8 NXP Semiconductors
 Architectural Overview

2 Architectural Overview
The following subsections provide an architectural overview of the i.MX 6Solo/6DualLite processor
system.

2.1 Block Diagram

Figure 3 shows the functional modules in the i.MX 6Solo/6DualLite processor system.

Raw / ONFI 2.2 LPDDR2/DDR3 NOR Flash Battery Ctrl 2x Camera 1 / 2 LVDS 1 / 2 LCD HDMI 1.4 MIPI
NAND Flash 400 MHz (DDR800) PSRAM Device Parallel/MIPI (WUXGA+) Displays Display Display

Application Processor CSI2/MIPI LDB HDMI DSI/MIPI

External
Domain (AP)
Digital GPMI
Audio Memory I/F
MMDC Internal
EIM RAM Image Processing
(144 KB)
1
Subsystem
Boot IPUv3H
ROM
2xCAN i/f (96KB)
Smart DMA Arm Cortex-A9
(SDMA) MPCore Platform
Debug
DAP 1x/2x A9-Core
PCIe Bus L1 I/D Cache
AXI and AHB Switch Fabric

SPBA TPIU Timer, WDOG MMC/SD

CTIs AP Peripherals eMMC/eSD
512K L2 cache
SJC uSDHC (4)
SCU, Timer
Shared Peripherals MMC/SD
GPS PTM’s CTI’s
SDXC
AUDMUX
Security
SSI (3) eCSPI (4) Video I2C(4)
CAAM
Proc. Unit
5xFast-UART ESAI (16KB Ram) Modem IC
(VPU + Cache) PWM (4)
SPDIF Rx/Tx ASRC SNVS
Audio, (SRTC) OCTP_CTRL
Power 3D Graphics
CSU IOMUXC
Mngmnt. Power Management Proc. Unit
Unit (LDOs) Fuse Box (GPU3D)
KPP
Keypad
Clock and Reset 2D Graphics GPIO
Timers/Control Proc. Unit
PLL (8) CAN(2)
WDOG (2) (GPU2D)
Crystals CCM 1-Gbps ENET
GPT
& Clock sources GPC
EPIT (2) HSI/MIPI Ethernet
SRC 10/100/1000
XTALOSC Temp Monitor USB OTG +
OTG PHY1 Mbps
OSC32K 2xHSIC 3 HS Ports
Host PHY2 PHY

JTAG USB OTG

Bluetooth WLAN
(IEEE1149.6) (dev/host)

1
144 KB RAM including 16 KB RAM inside the CAAM.
2 For i.MX 6Solo, there is only one A9-core platform in the chip; for i.MX 6DualLite, there are two A9-core platforms.
Figure 3. i.MX 6Solo/6DualLite System Block Diagram

NOTE
The numbers in brackets indicate number of module instances. For example,
PWM (4) indicates four separate PWM peripherals.

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NXP Semiconductors 9
Modules List

3 Modules List
The i.MX 6Solo/6DualLite processors contain a variety of digital and analog modules. Table 2 describes
these modules in alphabetical order.
Table 2. i.MX 6Solo/6DualLite Modules List

Block Mnemonic Block Name Subsystem Brief Description

APBH-DMA NAND Flash and BCH System Control DMA controller used for GPMI2 operation
ECC DMA controller Peripherals
Arm Arm Platform Arm The Arm Core Platform includes 1x (Solo) Cortex-A9
core for i.MX 6Solo and 2x (Dual) Cortex-A9 cores for
i.MX 6DualLite. It also includes associated sub-blocks,
such as the Level 2 Cache Controller, SCU (Snoop
Control Unit), GIC (General Interrupt Controller), private
timers, watchdog, and CoreSight debug modules.
ASRC Asynchronous Sample Multimedia The Asynchronous Sample Rate Converter (ASRC)
Rate Converter Peripherals converts the sampling rate of a signal associated to an
input clock into a signal associated to a different output
clock. The ASRC supports concurrent sample rate
conversion of up to 10 channels of about -120dB
THD+N. The sample rate conversion of each channel is
associated to a pair of incoming and outgoing sampling
rates. The ASRC supports up to three sampling rate
pairs.
AUDMUX Digital Audio Mux Multimedia The AUDMUX is a programmable interconnect for voice,
Peripherals audio, and synchronous data routing between host
serial interfaces (for example, SSI1, SSI2, and SSI3)
and peripheral serial interfaces (audio and voice
codecs). The AUDMUX has seven ports with identical
functionality and programming models. A desired
connectivity is achieved by configuring two or more
AUDMUX ports.
BCH40 Binary-BCH ECC System Control The BCH40 module provides up to 40-bit ECC for
Processor Peripherals NAND Flash controller (GPMI)
CAAM Cryptographic Security CAAM is a cryptographic accelerator and assurance
accelerator and module. CAAM implements several encryption and
assurance module hashing functions, a run-time integrity checker, and a
Pseudo Random Number Generator (PRNG). The
pseudo random number generator is certified by
Cryptographic Algorithm Validation Program (CAVP) of
National Institute of Standards and Technology (NIST).
Its DRBG validation number is 94 and its SHS validation
number is 1455.
CAAM also implements a Secure Memory mechanism.
In i.MX 6Solo/6DualLite processors, the security
memory provided is 16 KB.
CCM Clock Control Module, Clocks, Resets, and These modules are responsible for clock and reset
GPC General Power Controller, Power Control distribution in the system, and also for the system power
SRC System Reset Controller management.
CSI MIPI CSI-2 i/f Multimedia The CSI IP provides MIPI CSI-2 standard camera
Peripherals interface port. The CSI-2 interface supports from 80
Mbps to 1 Gbps speed per data lane.

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 Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

CSU Central Security Unit Security The Central Security Unit (CSU) is responsible for
setting comprehensive security policy within the i.MX
6Solo/6DualLite platform.
CTI-0 Cross Trigger Interfaces Debug / Trace Cross Trigger Interfaces allows cross-triggering based
CTI-1 on inputs from masters attached to CTIs. The CTI
CTI-2 module is internal to the Cortex-A9 Core Platform.
CTI-3
CTI-4
CTM Cross Trigger Matrix Debug / Trace Cross Trigger Matrix IP is used to route triggering events
between CTIs. The CTM module is internal to the
Cortex-A9 Core Platform.
DAP Debug Access Port System Control The DAP provides real-time access for the debugger
Peripherals without halting the core to:
• System memory and peripheral registers
• All debug configuration registers
The DAP also provides debugger access to JTAG scan
chains. The DAP module is internal to the Cortex-A9
Core Platform.
DCIC-0 Display Content Integrity Automotive IP The DCIC provides integrity check on portion(s) of the
DCIC-1 Checker display. Each i.MX 6Solo/6DualLite processor has two
such modules.
DSI MIPI DSI i/f Multimedia The MIPI DSI IP provides DSI standard display port
Peripherals interface. The DSI interface support 80 Mbps to 1 Gbps
speed per data lane.
eCSPI1-4 Configurable SPI Connectivity Full-duplex enhanced Synchronous Serial Interface. It is
Peripherals configurable to support Master/Slave modes, four chip
selects to support multiple peripherals.
ENET Ethernet Controller Connectivity The Ethernet Media Access Controller (MAC) is
Peripherals designed to support 10/100/1000 Mbps Ethernet/IEEE
802.3 networks. An external transceiver interface and
transceiver function are required to complete the
interface to the media. The module has dedicated
hardware to support the IEEE 1588 standard. See the
ENET chapter of the reference manual for details.

Note: The theoretical maximum performance of 1 Gbps

ENET is limited to 470 Mbps (total for Tx and Rx) due to
internal bus throughput limitations. The actual
measured performance in optimized environment is up
to 400 Mbps. For details, see the ERR004512 erratum
in the i.MX 6Solo/6DualLite errata document
(IMX6SDLCE).
EPIT-1 Enhanced Periodic Timer Peripherals Each EPIT is a 32-bit “set and forget” timer that starts
EPIT-2 Interrupt Timer counting after the EPIT is enabled by software. It is
capable of providing precise interrupts at regular
intervals with minimal processor intervention. It has a
12-bit prescaler for division of input clock frequency to
get the required time setting for the interrupts to occur,
and counter value can be programmed on the fly.

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NXP Semiconductors 11
Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

ESAI Enhanced Serial Audio Connectivity The Enhanced Serial Audio Interface (ESAI) provides a
Interface Peripherals full-duplex serial port for serial communication with a
variety of serial devices, including industry-standard
codecs, SPDIF transceivers, and other processors.
The ESAI consists of independent transmitter and
receiver sections, each section with its own clock
generator. All serial transfers are synchronized to a
clock. Additional synchronization signals are used to
delineate the word frames. The normal mode of
operation is used to transfer data at a periodic rate, one
word per period. The network mode is also intended for
periodic transfers; however, it supports up to 32 words
(time slots) per period. This mode can be used to build
time division multiplexed (TDM) networks. In contrast,
the on-demand mode is intended for non-periodic
transfers of data and to transfer data serially at high
speed when the data becomes available.
The ESAI has 12 pins for data and clocking connection
to external devices.
FlexCAN-1 Flexible Controller Area Connectivity The CAN protocol was primarily, but not only, designed
FlexCAN-2 Network Peripherals to be used as a vehicle serial data bus, meeting the
specific requirements of this field: real-time processing,
reliable operation in the Electromagnetic interference
(EMI) environment of a vehicle, cost-effectiveness and
required bandwidth. The FlexCAN module is a full
implementation of the CAN protocol specification,
Version 2.0 B, which supports both standard and
extended message frames.
512x8 Fuse Box Electrical Fuse Array Security Electrical Fuse Array. Enables to setup Boot Modes,
Security Levels, Security Keys, and many other system
parameters.
The i.MX 6Solo/6DualLite processors consist of
512x8-bit fuse fox accessible through OCOTP_CTRL
interface.
GPIO-1 General Purpose I/O System Control Used for general purpose input/output to external ICs.
GPIO-2 Modules Peripherals Each GPIO module supports 32 bits of I/O.
GPIO-3
GPIO-4
GPIO-5
GPIO-6
GPIO-7
GPMI General Purpose Connectivity The GPMI module supports up to 8x NAND devices.
Media Interface Peripherals 40-bit ECC encryption/decryption for NAND Flash
controller (GPMI2). The GPMI supports separate DMA
channels per NAND device.

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12 NXP Semiconductors
 Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

GPT General Purpose Timer Timer Peripherals Each GPT is a 32-bit “free-running” or “set and forget”
mode timer with programmable prescaler and compare
and capture register. A timer counter value can be
captured using an external event and can be configured
to trigger a capture event on either the leading or trailing
edges of an input pulse. When the timer is configured to
operate in “set and forget” mode, it is capable of
providing precise interrupts at regular intervals with
minimal processor intervention. The counter has output
compare logic to provide the status and interrupt at
comparison. This timer can be configured to run either
on an external clock or on an internal clock.
GPU3Dv5 Graphics Processing Multimedia The GPU3Dv5 provides hardware acceleration for 3D
Unit, ver.5 Peripherals graphics algorithms with sufficient processor power to
run desktop quality interactive graphics applications on
displays up to HD1080 resolution. The GPU3D provides
OpenGL ES 2.0, including extensions, OpenGL ES 1.1,
and OpenVG 1.1
GPU2Dv2 Graphics Processing Multimedia The GPU2Dv2 provides hardware acceleration for 2D
Unit-2D, ver 2 Peripherals graphics algorithms, such as Bit BLT, stretch BLT, and
many other 2D functions.
HDMI Tx HDMI Tx i/f Multimedia The HDMI module provides HDMI standard i/f port to an
Peripherals HDMI 1.4 compliant display.
HSI MIPI HSI i/f Connectivity The MIPI HSI provides a standard MIPI interface to the
Peripherals applications processor.
I2C-1 I2C Interface Connectivity I2C provide serial interface for external devices. Data
I2C-2 Peripherals rates of up to 400 kbps are supported.
I2C-3
I2C-4
IOMUXC IOMUX Control System Control This module enables flexible IO multiplexing. Each IO
Peripherals pad has default and several alternate functions. The
alternate functions are software configurable.

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Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

IPUv3H Image Processing Unit, Multimedia IPUv3H enables connectivity to displays and video
ver.3H Peripherals sources, relevant processing and synchronization and
control capabilities, allowing autonomous operation.
The IPUv3H supports concurrent output to two display
ports and concurrent input from two camera ports,
through the following interfaces:
• Parallel Interfaces for both display and camera
• Single/dual channel LVDS display interface
• HDMI transmitter
• MIPI/DSI transmitter
• MIPI/CSI-2 receiver
The processing includes:
• Image conversions: resizing, rotation, inversion, and
color space conversion
• A high-quality de-interlacing filter
• Video/graphics combining
• Image enhancement: color adjustment and gamut
mapping, gamma correction, and contrast
enhancement
• Support for display backlight reduction
KPP Key Pad Port Connectivity KPP Supports 8x8 external key pad matrix. KPP
Peripherals features are:
• Open drain design
• Glitch suppression circuit design
• Multiple keys detection
• Standby key press detection
LDB LVDS Display Bridge Connectivity LVDS Display Bridge is used to connect the IPU (Image
Peripherals Processing Unit) to External LVDS Display Interface.
LDB supports two channels; each channel has following
signals:
• One clock pair
• Four data pairs
Each signal pair contains LVDS special differential pad
(PadP, PadM).
MMDC Multi-Mode DDR Connectivity DDR Controller has the following features:
Controller Peripherals • Supports 16/32-bit DDR3-800 (LV) or LPDDR2-800
in i.MX 6Solo
• Supports 16/32/64-bit DDR3-800 (LV) or
LPDDR2-800 in i.MX 6DualLite
• Supports 2x32 LPDDR2-800 in i.MX 6DualLite
• Supports up to 4 GByte DDR memory space

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 Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

OCOTP_CTRL OTP Controller Security The On-Chip OTP controller (OCOTP_CTRL) provides
an interface for reading, programming, and/or overriding
identification and control information stored in on-chip
fuse elements. The module supports
electrically-programmable poly fuses (eFUSEs). The
OCOTP_CTRL also provides a set of volatile
software-accessible signals that can be used for
software control of hardware elements, not requiring
non-volatility. The OCOTP_CTRL provides the primary
user-visible mechanism for interfacing with on-chip fuse
elements. Among the uses for the fuses are unique chip
identifiers, mask revision numbers, cryptographic keys,
JTAG secure mode, boot characteristics, and various
control signals, requiring permanent non-volatility.
OCRAM On-Chip Memory Data Path The On-Chip Memory controller (OCRAM) module is
controller designed as an interface between system’s AXI bus and
internal (on-chip) SRAM memory module.
In i.MX 6Solo/6DualLite processors, the OCRAM is
used for controlling the 128 KB multimedia RAM through
a 64-bit AXI bus.
OSC32KHz OSC32KHz Clocking Generates 32.768 KHz clock from external crystal.
PCIe PCI Express 2.0 Connectivity The PCIe IP provides PCI Express Gen 2.0 functionality.
Peripherals
PMU Power-Management Data Path Integrated power management unit. Used to provide
functions power to various SoC domains.
PWM-1 Pulse Width Modulation Connectivity The pulse-width modulator (PWM) has a 16-bit counter
PWM-2 Peripherals and is optimized to generate sound from stored sample
PWM-3 audio images and it can also generate tones. It uses
PWM-4 16-bit resolution and a 4x16 data FIFO to generate
sound.
RAM Internal RAM Internal Memory Internal RAM, which is accessed through OCRAM
128 KB memory controller.
RAM Secure/non-secure RAM Secured Internal Secure/non-secure Internal RAM, interfaced through
16 KB Memory the CAAM.
ROM Boot ROM Internal Memory Supports secure and regular Boot Modes. Includes read
96KB protection on 4K region for content protection.
ROMCP ROM Controller with Data Path ROM Controller with ROM Patch support
Patch

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NXP Semiconductors 15
Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

SDMA Smart Direct Memory System Control The SDMA is multi-channel flexible DMA engine. It
Access Peripherals helps in maximizing system performance by off-loading
the various cores in dynamic data routing. It has the
following features:
• Powered by a 16-bit Instruction-Set micro-RISC
engine
• Multi-channel DMA supporting up to 32 time-division
multiplexed DMA channels
• 48 events with total flexibility to trigger any
combination of channels
• Memory accesses including linear, FIFO, and 2D
addressing
• Shared peripherals between Arm and SDMA
• Very fast Context-Switching with 2-level priority
based preemptive multi-tasking
• DMA units with auto-flush and prefetch capability
• Flexible address management for DMA transfers
(increment, decrement, and no address changes on
source and destination address)
• DMA ports can handle unit-directional and
bi-directional flows (copy mode)
• Up to 8-word buffer for configurable burst transfers
• Support of byte-swapping and CRC calculations
• Library of Scripts and API is available
SJC System JTAG Controller System Control The SJC provides JTAG interface, which complies with
Peripherals JTAG TAP standards, to internal logic. The i.MX
6Solo/6DualLite processors use JTAG port for
production, testing, and system debugging. In addition,
the SJC provides BSR (Boundary Scan Register)
standard support, which complies with IEEE1149.1 and
IEEE1149.6 standards.
The JTAG port must be accessible during platform initial
laboratory bring-up, for manufacturing tests and
troubleshooting, as well as for software debugging by
authorized entities. The i.MX 6Solo/6DualLite SJC
incorporates three security modes for protecting against
unauthorized accesses. Modes are selected through
eFUSE configuration.
SNVS Secure Non-Volatile Security Secure Non-Volatile Storage, including Secure Real
Storage Time Clock, Security State Machine, Master Key
Control, and Violation/Tamper Detection and reporting.
SPDIF Sony Philips Digital Multimedia A standard audio file transfer format, developed jointly
Interconnect Format Peripherals by the Sony and Phillips corporations. Has Transmitter
and Receiver functionality.

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 Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

SSI-1 I2S/SSI/AC97 Interface Connectivity The SSI is a full-duplex synchronous interface, which is
SSI-2 Peripherals used on the AP to provide connectivity with off-chip
SSI-3 audio peripherals. The SSI supports a wide variety of
protocols (SSI normal, SSI network, I2S, and AC-97), bit
depths (up to 24 bits per word), and clock / frame sync
options.
The SSI has two pairs of 8x24 FIFOs and hardware
support for an external DMA controller in order to
minimize its impact on system performance. The
second pair of FIFOs provides hardware interleaving of
a second audio stream that reduces CPU overhead in
use cases where two time slots are being used
simultaneously.
TEMPMON Temperature Monitor System Control The Temperature sensor IP is used for detecting die
Peripherals temperature. The temperature read out does not reflect
case or ambient temperature. It reflects the temperature
in proximity of the sensor location on the die.
Temperature distribution may not be uniformly
distributed, therefore the read out value may not be the
reflection of the temperature value of the entire die.
TZASC Trust-Zone Address Security The TZASC (TZC-380 by Arm) provides security
Space Controller address region control functions required for intended
application. It is used on the path to the DRAM
controller.
UART-1 UART Interface Connectivity Each of the UARTv2 modules support the following
UART-2 Peripherals serial data transmit/receive protocols and
UART-3 configurations:
UART-4 • 7- or 8-bit data words, 1 or 2 stop bits, programmable
UART-5 parity (even, odd or none)
• Programmable baud rates up to 5 Mbps.
• 32-byte FIFO on Tx and 32 half-word FIFO on Rx
supporting auto-baud
• IrDA 1.0 support (up to SIR speed of 115200 bps)
• Option to operate as 8-pins full UART, DCE, or DTE
USBOH3 USB 2.0 High Speed Connectivity USBOH3 contains:
OTG and 3x HS Hosts Peripherals • One high-speed OTG module with integrated HS
USB PHY
• One high-speed Host module with integrated HS
USB PHY
• Two identical high-speed Host modules connected to
HSIC USB ports.

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Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

uSDHC-1 SD/MMC and SDXC Connectivity i.MX 6Solo/6DualLite specific SoC characteristics:
uSDHC-2 Enhanced Multi-Media Peripherals All four MMC/SD/SDIO controller IPs are identical and
uSDHC-3 Card / Secure Digital Host are based on the uSDHC IP. They are:
uSDHC-4 Controller • Conforms to the SD Host Controller Standard
Specification version 3.0.
• Fully compliant with MMC command/response sets
and Physical Layer as defined in the Multimedia Card
System Specification, v4.2/4.3/4.4/4.41 including
high-capacity (size > 2 GB) cards HC MMC.
• Fully compliant with SD command/response sets and
Physical Layer as defined in the SD Memory Card
Specifications, v3.0 including high-capacity SDHC
cards up to 32 GB and SDXC cards up to 2 TB.
• Fully compliant with SDIO command/response sets
and interrupt/read-wait mode as defined in the SDIO
Card Specification, Part E1, v3.0
All four ports support:
• 1-bit or 4-bit transfer mode specifications for SD and
SDIO cards up to UHS-I SDR104 mode (104 MB/s
max)
• 1-bit, 4-bit, or 8-bit transfer mode specifications for
MMC cards up to 52 MHz in both SDR and DDR
modes (104 MB/s max)
However, the SoC level integration and I/O muxing logic
restrict the functionality to the following:
• Instances #1 and #2 are primarily intended to serve
as external slots or interfaces to on-board SDIO
devices. These ports are equipped with “Card
detection” and “Write Protection” pads and do not
support hardware reset.
• Instances #3 and #4 are primarily intended to serve
interfaces to embedded MMC memory or interfaces
to on-board SDIO devices. These ports do not have
“Card detection” and “Write Protection” pads and do
support hardware reset.
• All ports can work with 1.8 V and 3.3 V cards. There
are two completely independent I/O power domains
for Ports #1 and #2 in four bit configuration (SD
interface). Port #3 is placed in his own independent
power domain and port #4 shares power domain with
some other interfaces.
VDOA VDOA Multimedia Video Data Order Adapter (VDOA): used to re-order
Peripherals video data from the “tiled” order used by the VPU to the
conventional raster-scan order needed by the IPU.
VPU Video Processing Unit Multimedia A high-performing video processing unit (VPU), which
Peripherals covers many SD-level and HD-level video decoders and
SD-level encoders as a multi-standard video codec
engine as well as several important video processing,
such as rotation and mirroring.
See the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM) for complete list of VPU’s
decoding/encoding capabilities.

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 Modules List

Table 2. i.MX 6Solo/6DualLite Modules List (continued)

Block Mnemonic Block Name Subsystem Brief Description

WDOG-1 Watch Dog Timer Peripherals The Watch Dog Timer supports two comparison points
during each counting period. Each of the comparison
points is configurable to evoke an interrupt to the Arm
core, and a second point evokes an external event on
the WDOG line.
WDOG-2 Watch Dog (TrustZone) Timer Peripherals The TrustZone Watchdog (TZ WDOG) timer module
(TZ) protects against TrustZone starvation by providing a
method of escaping normal mode and forcing a switch
to the TZ mode. TZ starvation is a situation where the
normal OS prevents switching to the TZ mode. Such
situation is undesirable as it can compromise the
system’s security. Once the TZ WDOG module is
activated, it must be serviced by TZ software on a
periodic basis. If servicing does not take place, the timer
times out. Upon a time-out, the TZ WDOG asserts a TZ
mapped interrupt that forces switching to the TZ mode.
If it is still not served, the TZ WDOG asserts a security
violation signal to the CSU. The TZ WDOG module
cannot be programmed or deactivated by a normal
mode SW.
WEIM NOR-Flash /PSRAM Connectivity The WEIM NOR-FLASH / PSRAM provides:
interface Peripherals • Support 16-bit (in muxed IO mode only) PSRAM
memories (sync and async operating modes), at slow
frequency
• Support 16-bit (in muxed IO mode only) NOR-Flash
memories, at slow frequency
• Multiple chip selects
XTALOSC Crystal Oscillator I/F Clocks, Resets, and The XTALOSC module enables connectivity to external
Power Control crystal oscillator device. In a typical application
use-case, it is used for 24 MHz oscillator to provide USB
required frequency.

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NXP Semiconductors 19
Modules List

3.1 Special Signal Considerations

Table 3 lists special signal considerations for the i.MX 6Solo/6DualLite processors. The signal names are
listed in alphabetical order.
The package contact assignments can be found in Section 6, “Package Information and Contact
Assignments.” Signal descriptions are provided in the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM).
Table 3. Special Signal Considerations

Signal Name Remarks

CLK1_P/CLK1_N Two general purpose differential high speed clock Input/outputs are provided.
CLK2_P/CLK2_N Any or both of them could be used:
• To feed external reference clock to the PLLs and further to the modules inside SoC, for example
as alternate reference clock for PCIe, Video/Audio interfaces, etc.
• To output internal SoC clock to be used outside the SoC as either reference clock or as a
functional clock for peripherals, for example it could be used as an output of the PCIe master
clock (root complex use)
See the i.MX 6Solo/6DualLite reference manual for details on the respective clock trees.
The clock inputs/outputs are LVDS differential pairs compatible with TIA/EIA-644 standard, the
maximum frequency range supported is 0...600 MHz.
Alternatively one may use single ended signal to drive CLKx_P input. In this case corresponding
CLKx_N input should be tied to the constant voltage level equal 1/2 of the input signal swing.
Termination should be provided in case of high frequency signals.
See LVDS pad electrical specification for further details.
After initialization, the CLKx inputs/outputs could be disabled (if not used). If unused any or both of
the CLKx_N/P pairs may remain unconnected.

XTALOSC_RTC_XTALI/ If the user wishes to configure XTALOSC_RTC_XTALI and RTC_XTALO as an RTC oscillator, a
RTC_XTALO 32.768 kHz crystal, (≤100 kΩ ESR, 10 pF load) should be connected between
XTALOSC_RTC_XTALI and RTC_XTALO. Remember that the capacitors implemented on either
side of the crystal are about twice the crystal load capacitor. To hit the exact oscillation frequency,
the board capacitors need to be reduced to account for board and chip parasitics. The integrated
oscillation amplifier is self biasing, but relatively weak. Care must be taken to limit parasitic leakage
from XTALOSC_RTC_XTALI and RTC_XTALO to either power or ground (>100 MΩ). This will
debias the amplifier and cause a reduction of startup margin. Typically XTALOSC_RTC_XTALI and
RTC_XTALO should bias to approximately 0.5 V.
If it is desired to feed an external low frequency clock into XTALOSC_RTC_XTALI the RTC_XTALO
pin must remain unconnected or driven with a complimentary signal. The logic level of this forcing
clock must not exceed VDD_SNVS_CAP level and the frequency must be <100 kHz under typical
conditions.

XTALI/XTALO • A 24.0 MHz crystal should be connected between XTALI and XTALO level and the frequency
should be <32 MHz under typical conditions. See the Hardware Development Guide
(IMX6DQ6SDLHDG), Design Checklist chapter, for details on crystal selection.
• NXP BSP (board support package) software requires 24 MHz on XTALI/XTALO.
• The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this
case, XTALI must be directly driven by the external oscillator and XTALO remains unconnected.
• The XTALI signal level must swing from ~0.8 x NVCC_PLL_OUT to ~0.2 V. If this clock is used
as a reference for USB and PCIe, then there are strict frequency tolerance and jitter
requirements. See OSC24M chapter and relevant interface specifications chapters for details.

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 Modules List

Table 3. Special Signal Considerations (continued)

Signal Name Remarks

DRAM_VREF When using DDR_VREF with DDR I/O, the nominal reference voltage must be half of the
NVCC_DRAM supply. The user must tie DDR_VREF to a precision external resistor divider. Use a
1 kΩ 0.5% resistor to GND and a 1 kΩ 0.5% resistor to NVCC_DRAM. Shunt each resistor with a
closely-mounted 0.1 µF capacitor.

To reduce supply current, a pair of 1.5 kΩ 0.1% resistors can be used. Using resistors with
recommended tolerances ensures the ± 2% DDR_VREF tolerance (per the DDR3 specification) is
maintained when four DDR3 ICs plus the i.MX 6Solo/6DualLite are drawing current on the resistor
divider.

It is recommended to use regulated power supply for “big” memory configurations (more that eight
devices).

ZQPAD DRAM calibration resistor 240 Ω 1% used as reference during DRAM output buffer driver
calibration should be connected between this pad and GND.

NVCC_LVDS_2P5 The DDR pre-drivers share the NVCC_LVDS_2P5 ball with the LVDS interface. This ball can be
shorted to VDD_HIGH_CAP on the circuit board.

VDD_FA These signals are reserved for NXP manufacturing use only. User must tie both connections to
FA_ANA GND.

GPANAIO Analog output for NXP use only. This output must remain unconnected.

JTAG_nnnn The JTAG interface is summarized in Table 4. Use of external resistors is unnecessary. However,
if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is
followed. For example, do not use an external pull down on an input that has on-chip pull-up.

JTAG_TDO is configured with a keeper circuit such that the non-connected condition is eliminated
if an external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and
must be avoided.

JTAG_MOD is referenced as SJC_MOD in the i.MX 6Solo/6DualLite reference manual. Both

names refer to the same signal. JTAG_MOD must be externally connected to GND for normal
operation. Termination to GND through an external pull-down resistor (such as 1 kΩ) is allowed.
JTAG_MOD set to hi configures the JTAG interface to mode compliant with IEEE1149.1 standard.
JTAG_MOD set to low configures the JTAG interface for common SW debug adding all the system
TAPs to the chain.
NC These signals are not functional and must remain unconnected by the user.

SRC_POR_B This cold reset negative logic input resets all modules and logic in the IC.

ONOFF In normal mode may be connected to ON/OFF button (De-bouncing provided at this input).
Internally this pad is pulled up. Short connection to GND in OFF mode causes internal power
management state machine to change state to ON. In ON mode short connection to GND
generates interrupt (intended to SW controllable power down). Long above ~5s connection to GND
causes “forced” OFF.

TEST_MODE TEST_MODE is for NXP factory use. This signal is internally connected to an on-chip pull-down
device. This signal must either be tied to Vss or remain unconnected.

PCIE_REXT The impedance calibration process requires connection of reference resistor 200 Ω 1% precision
resistor on PCIE_REXT pad to ground.

CSI_REXT MIPI CSI PHY reference resistor. Use 6.04 KΩ 1% resistor connected between this pad and GND

DSI_REXT MIPI DSI PHY reference resistor. Use 6.04 KΩ 1% resistor connected between this pad and GND

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Electrical Characteristics

Table 4. JTAG Controller Interface Summary

JTAG I/O Type On-Chip Termination

JTAG_TCK Input 47 kΩ pull-up

JTAG_TMS Input 47 kΩ pull-up

JTAG_TDI Input 47 kΩ pull-up

JTAG_TDO 3-state output Keeper

JTAG_TRSTB Input 47 kΩ pull-up

JTAG_MOD Input 100 kΩ pull-up

3.2 Recommended Connections for Unused Analog Interfaces

The recommended connections for unused analog interfaces can be found in the section, “Unused analog
interfaces,” of the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of
Applications Processors (IMX6DQ6SDLHDG).

4 Electrical Characteristics
This section provides the device and module-level electrical characteristics for the i.MX 6Solo/6DualLite
processors.

4.1 Chip-Level Conditions

This section provides the device-level electrical characteristics for the IC. See Table 5 for a quick reference
to the individual tables and sections.
Table 5. i.MX 6Solo/6DualLite Chip-Level Conditions

For these characteristics, … Topic appears …

Absolute Maximum Ratings on page 23

BGA Case 2240 Package Thermal Resistance on page 24

Operating Ranges on page 25

External Clock Sources on page 27

Maximum Supply Currents on page 28

Low Power Mode Supply Currents on page 29

USB PHY Current Consumption on page 31

PCIe 2.0 Power Consumption on page 31

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 Electrical Characteristics

4.1.1 Absolute Maximum Ratings

CAUTION
Stresses beyond those listed under Table 6 may cause permanent damage to
the device. These are stress ratings only. Functional operation of the device
at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device
reliability.
Table 6 shows the absolute maximum operating ratings.
Table 6. Absolute Maximum Ratings

Parameter Description Symbol Min Max Unit

Core supply input voltage (LDO enabled) VDD_ARM_IN
-0.3 1.6 V
VDD_SOC_IN
Core supply input voltage (LDO bypass) VDD_ARM_IN
-0.3 1.4 V
VDD_SOC_IN
Core supply output voltage (LDO enabled) VDD_ARM_CAP
VDD_SOC_CAP -0.3 1.4 V
VDD_PU_CAP
VDD_HIGH_IN supply voltage (LDO enabled) VDD_HIGH_IN -0.3 3.7 V
VDD_HIGH_CAP supply output voltage VDD_HIGH_CAP -0.3 2.85 V
DDR I/O supply voltage NVCC_DRAM -0.4 1.975 (See note 1) V
GPIO I/O supply voltage NVCC_CSI
NVCC_EIM
NVCC_ENET
NVCC_GPIO
-0.5 3.7 V
NVCC_LCD
NVCC_NAND
NVCC_SD
NVCC_JTAG
HDMI and PCIe high PHY VPH supply voltage HDMI_VPH
-0.3 2.85 V
PCIE_VPH
HDMI and PCIe low PHY VP supply voltage HDMI_VP
-0.3 1.4 V
PCIE_VP
LVDS and MIPI I/O supply voltage (2.5V supply) NVCC_LVDS_2P5
-0.3 2.85 V
NVCC_MIPI
PCIe PHY supply voltage PCIE_VPTX -0.3 1.4 V
RGMII I/O supply voltage NVCC_RGMII -0.5 2.725 V
SNVS IN supply voltage VDD_SNVS_IN -0.3 3.4 V
(Secure Non-Volatile Storage and Real Time Clock)
USB I/O supply voltage USB_H1_DN
USB_H1_DP
USB_OTG_DN -0.3 3.73 V
USB_OTG_DP
USB_OTG_CHD_B
USB VBUS supply voltage USB_H1_VBUS
— 5.35 V
USB_OTG_VBUS
Vin/Vout input/output voltage range (non-DDR pins) Vin/Vout -0.5 OVDD+0.3 (See note 2) V

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Electrical Characteristics

Table 6. Absolute Maximum Ratings (continued)

Parameter Description Symbol Min Max Unit

(See notes 1 & 2)
Vin/Vout input/output voltage range (DDR pins) Vin/Vout -0.5 OVDD+0.4 V
ESD immunity (HBM) Vesd_HBM — 2000 V
ESD immunity (CDM) Vesd_CDM — 500 V
Storage temperature range Tstorage -40 150 °C
1
The absolute maximum voltage includes an allowance for 400 mV of overshoot on the IO pins. Per JEDEC standards, the
allowed signal overshoot must be derated if NVCC_DRAM exceeds 1.575V.
2
OVDD is the I/O supply voltage.

4.1.2 Thermal Resistance

NOTE
Per JEDEC JESD51-2, the intent of thermal resistance measurements is
solely for a thermal performance comparison of one package to another in a
standardized environment. This methodology is not meant to and will not
predict the performance of a package in an application-specific
environment.

4.1.2.1 BGA Case 2240 Package Thermal Resistance

Table 7 displays the thermal resistance data.
Table 7. Thermal Resistance Data

Rating Test Conditions Symbol Value Unit

Junction to Ambient1 Single-layer board (1s); natural convection2 RθJA 38 oC/W

Four-layer board (2s2p); natural convection2 RθJA 23 oC/W

Junction to Ambient1 Single-layer board (1s); airflow 200 ft/min2,3 RθJA 30 oC/W

Four-layer board (2s2p); airflow 200 ft/min2,3 RθJA 20 oC/W

Junction to Board1,4 — RθJB 14 oC/W

Junction to Case1,5 — RθJC 6 oC/W

Junction to Package Top1,6 Natural convection ΨJT 2 oC/W

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2 Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified
package.
3 Per JEDEC JESD51-6 with the board horizontal.
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

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 Electrical Characteristics

4.1.3 Operating Ranges

Table 8 provides the operating ranges of the i.MX 6Solo/6DualLite processors. For details on the chip's
power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM).

Table 8. Operating Ranges

Parameter
Symbol Min Typ Max1 Unit Comment2
Description
Run mode: LDO VDD_ARM_IN 1.2753 — 1.5 V LDO Output Set Point (VDD_ARM_CAP) =
enabled 1.150 V minimum for operation up to 792MHz.
1.253 — 1.5 V LDO Output Set Point (VDD_ARM_CAP) =
1.125 V minimum for operation up to 396MHz.
VDD_SOC_IN 1.2753,4 — 1.5 V VPU ≤ 328 MHz, VDD_SOC and VDD_PU
LDO outputs (VDD_SOC_CAP and
VDD_PU_CAP) = 1.225 V5 maximum and
1.15 V minimum.
Run mode: LDO VDD_ARM_IN 1.150 — 1.3 V LDO bypassed for operation up to 792 MHz
bypassed 1.125 — 1.3 V LDO bypassed for operation up to 396 MHz
6
VDD_SOC_IN 1.150 — 1.215 V LDO bypassed for operation VPU ≤ 328 MHz
Standby/DSM mode VDD_ARM_IN 0.9 — 1.3 V Refer to Table 11, "Stop Mode Current and
Power Consumption," on page 29.
VDD_SOC_IN 0.9 — 1.2255 V —
VDD_HIGH internal VDD_HIGH_IN 2.8 — 3.3 V Must match the range of voltages that the
regulator rechargeable backup battery supports.
Backup battery supply VDD_SNVS_IN7 2.9 — 3.3 V Must be supplied from the same supply as
range VDD_HIGH_IN if the system does not require
keeping real time and other data on OFF
state.
USB supply voltages USB_OTG_VBUS 4.4 — 5.25 V —
USB_H1_VBUS 4.4 — 5.25 V —
DDR I/O supply NVCC_DRAM 1.14 1.2 1.3 V LPDDR2
voltage 1.425 1.5 1.575 V DDR3
1.283 1.35 1.45 V DDR3L
Supply for RGMII I/O NVCC_RGMII 1.15 — 2.625 V 1.15 V–1.30 V in HSIC 1.2 V mode
power group8 1.43 V–1.58 V in RGMII 1.5 V mode
1.70 V–1.90 V in RGMII 1.8 V mode
2.25 V–2.625 V in RGMII 2.5 V mode

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Electrical Characteristics

Table 8. Operating Ranges (continued)

Parameter
Symbol Min Typ Max1 Unit Comment2
Description
GPIO supply NVCC_CSI, 1.65 1.8, 3.6 V —
voltages8 NVCC_EIM, 2.8,
NVCC_ENET, 3.3
NVCC_GPIO,
NVCC_LCD,
NVCC_NANDF,
NVCC_SD1,
NVCC_SD2,
NVCC_SD3,
NVCC_JTAG
NVCC_LVDS_2P59 2.25 2.5 2.75 V —
NVCC_MIPI
HDMI supply voltages HDMI_VP 0.99 1.1 1.3 V —
HDMI_VPH 2.25 2.5 2.75 V —
PCIe supply voltages PCIE_VP 1.023 1.1 1.21 V —
PCIE_VPH 2.325 2.5 2.75 V —
PCIE_VPTX 1.023 1.1 1.21 V —
T oC
Junction temperature J -40 — 105 See i.MX 6Solo/6DualLite Product Lifetime
Usage Estimates Application Note, AN4725,
for information on product lifetime for this
processor.
1
Applying the maximum voltage results in maximum power consumption and heat generation. NXP recommends a voltage set
point = (Vmin + the supply tolerance). This results in an optimized power/speed ratio.
2
See the Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG) for bypass capacitors requirements for each of the *_CAP supply outputs.
3
VDD_ARM_IN and VDD_SOC_IN must be 125 mV higher than the LDO Output Set Point for correct regulator supply voltage.
4 In LDO enabled mode, the internal LDO output set points must be configured such that the:
• VDD_ARM LDO output set point does not exceed the VDD_SOC LDO output set point by more than 100 mV.
• VDD_SOC LDO output set point is equal to the VDD_PU LDO output set point.
The VDD_ARM LDO output set point can be lower than the VDD_SOC LDO output set point, however, the minimum output set
points shown in this table must be maintained.
5 When using VDD_SOC_CAP to supply the PCIE_VP and PCIE_VPTX, the maximum setting is 1.175V. If VDD_SOC_CAP
requires setting to 1.2V or higher, the PCIE_VP and PCIE_VPTX must use an external supply to guarantee not to exceed the
1.21V maximum operating voltage.
6 In LDO bypassed mode, the external power supply must ensure that VDD_ARM_IN does not exceed VDD_SOC_IN by more
than 100 mV. The VDD_ARM_IN supply voltage can be lower than the VDD_SOC_IN supply voltage. The minimum voltages
shown in this table must be maintained.
7
While setting VDD_SNVS_IN voltage with respect to Charging Currents and RTC, refer to Hardware Development Guide for i.MX
6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).
8
All digital I/O supplies (NVCC_xxxx) must be powered under normal conditions whether the associated I/O pins are in use or not
and associated IO pins need to have a pull-up or pull-down resistor applied to limit any non-connected gate current.
9
This supply also powers the pre-drivers of the DDR IO pins, hence, it must be always provided, even when LVDS is not used.

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 Electrical Characteristics

4.1.4 External Clock Sources

Each i.MX 6Solo/6DualLite processor has two external input system clocks: a low frequency
(RTC_XTALI) and a high frequency (XTALI).
The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,
power-down real time clock operation, and slow system and watch-dog counters. The clock input can be
connected to either external oscillator or a crystal using internal oscillator amplifier. Additionally, there is
an internal ring oscillator, which can be used instead of the RTC_XTALI if accuracy is not important.
NOTE
The internal RTC oscillator does not provide an accurate frequency and is
affected by process, voltage, and temperature variations. NXP strongly
recommends using an external crystal as the RTC_XTALI reference. If the
internal oscillator is used instead, careful consideration must be given to the
timing implications on all of the SoC modules dependent on this clock.
The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other
peripherals. The system clock input can be connected to either external oscillator or a crystal using internal
oscillator amplifier.
Table 9 shows the interface frequency requirements.
Table 9. External Input Clock Frequency

Parameter Description Symbol Min Typ Max Unit

RTC_XTALI Oscillator1,2 fckil — 32.7683/32.0 — kHz

XTALI Oscillator2,4 fxtal — 24 — MHz

1
External oscillator or a crystal with internal oscillator amplifier.
2
The required frequency stability of this clock source is application dependent. For recommendations, see the Hardware
Development Guide for i.MX 6Dual, 6Quad, 6Solo, 6DualLite Families of Applications Processors (IMX6DQ6SDLHDG).
3 Recommended nominal frequency 32.768 kHz.
4 External oscillator or a fundamental frequency crystal with internal oscillator amplifier.

The typical values shown in Table 9 are required for use with NXP BSPs to ensure precise time keeping
and USB operation. For XTALOSC_RTC_XTALI operation, two clock sources are available.
• On-chip 40 kHz ring oscillator—this clock source has the following characteristics:
— Approximately 25 µA more Idd than crystal oscillator
— Approximately ±50% tolerance
— No external component required
— Starts up quicker than 32 kHz crystal oscillator
• External crystal oscillator with on-chip support circuit:
— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit
switches over to the crystal oscillator automatically.
— Higher accuracy than ring oscillator
— If no external crystal is present, then the ring oscillator is used

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Electrical Characteristics

The choice of a clock source must be based on real-time clock use and precision timeout.

4.1.5 Maximum Supply Currents

The Power Virus numbers shown in Table 10 represent a use case designed specifically to show the
maximum current consumption possible. All cores are running at the defined maximum frequency and are
limited to L1 cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a
very limited practical use case, if at all, and be limited to an extremely low duty cycle unless the intention
was to specifically show the worst case power consumption.
The NXP power management IC, MMPF0100xxxx, which is targeted for the i.MX 6 series processor
family, supports the power consumption shown in Table 10, however a robust thermal design is required
for the increased system power dissipation.
See the i.MX 6Solo/6DualLite Power Consumption Measurement Application Note (AN4576) for more
details on typical power consumption under various use case definitions.
Table 10. Maximum Supply Currents

Power Line Conditions Max Current Unit

VDD_ARM_IN i.MX 6DualLite: 996 MHz Arm clock based on 2200 mA

Power Virus operation

i.MX 6Solo: 996 MHz Arm clock based on Power 1320 mA

Virus operation

VDD_SOC_IN 996 MHz Arm clock 1260 mA

1
VDD_HIGH_IN — 125 mA

VDD_SNVS_IN — 2752 μA

USB_OTG_VBUS/ — 253 mA
USB_H1_VBUS (LDO 3P0)

Primary Interface (IO) Supplies

NVCC_DRAM — —4 —
5
NVCC_ENET N=10 Use maximum IO equation —

NVCC_LCD N=29 Use maximum IO equation5 —

NVCC_GPIO N=24 Use maximum IO equation5 —

NVCC_CSI N=20 Use maximum IO equation5 —

NVCC_EIM N=53 Use maximum IO equation5 —

NVCC_JTAG N=6 Use maximum IO equation5 —

NVCC_RGMII N=6 Use maximum IO equation5 —

NVCC_SD1 N=6 Use maximum IO equation5 —

NVCC_SD2 N=6 Use maximum IO equation5 —

NVCC_SD3 N=11 Use maximum IO equation5 —

NVCC_NANDF N=26 Use maximum IO equation5 —

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Table 10. Maximum Supply Currents (continued)

Power Line Conditions Max Current Unit

NVCC_LVDS2P56 — NVCC_LVDS2P5 is connected to —

VDD_HIGH_CAP at the board level.
VDD_HIGH_CAP is capable of
handing the current required by
NVCC_LVDS2P5.

MISC

DDR_VREF — 1 mA
1
The actual maximum current drawn from VDD_HIGH_IN will be as shown plus any additional current drawn from the
VDD_HIGH_CAP outputs, depending upon actual application configuration (for example, NVCC_LVDS_2P5, NVCC_MIPI, or
HDMI and PCIe VPH supplies).
2
Under normal operating conditions, the maximum current on VDD_SNVS_IN is shown in Table 10. The maximum
VDD_SNVS_IN current may be higher depending on specific operating configurations, such as BOOT_MODE[1:0] not equal
to 00, or use of the Tamper feature. During initial power on, VDD_SNVS_IN can draw up to 1 mA if the supply is capable of
sourcing that current. If less than 1 mA is available, the VDD_SNVS_CAP charge time will increase.
3 This is the maximum current per active USB physical interface.
4 The DRAM power consumption is dependent on several factors, such as external signal termination. DRAM power calculators

are typically available from the memory vendors. They take in account factors, such as signal termination. See the i.MX
6Solo/DualLite Power Consumption Measurement Application Note (AN4576) for examples of DRAM power consumption
during specific use case scenarios.
5 General equation for estimated, maximum power consumption of an IO power supply:

Imax = N x C x V x (0.5 x F)
Where:
N—Number of IO pins supplied by the power line
C—Equivalent external capacitive load
V—IO voltage
(0.5 xF)—Data change rate. Up to 0.5 of the clock rate (F)
In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.
6 NVCC_LVDS2P5 is supplied by VDD_HIGH_CAP (by external connection) so the maximum supply current is included in the

current shown for VDD_HIGH_IN. The maximum supply current for NVCC_LVDS2P5 has not been characterized separately.

4.1.6 Low Power Mode Supply Currents

Table 11 shows the current core consumption (not including I/O) of i.MX 6Solo/6DualLite processors in
selected low power modes.
Table 11. Stop Mode Current and Power Consumption

Mode Test Conditions Supply Typical1 Units

WAIT • Arm, SoC, and PU LDOs are set to 1.225 VDD_ARM_IN (1.4V) 4.5
• HIGH LDO set to 2.5 V
• Clocks are gated. VDD_SOC_IN (1.4V) 23 mA
• DDR is in self refresh. VDD_HIGH_IN (3.0V) 13.5
• PLLs are active in bypass (24MHz)
• Supply Voltages remain ON Total 79 mW

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Electrical Characteristics

Table 11. Stop Mode Current and Power Consumption (continued)

Mode Test Conditions Supply Typical1 Units

STOP_ON • Arm LDO set to 0.9V VDD_ARM_IN (1.4V) 4

• SoC and PU LDOs set to 1.225 V
• HIGH LDO set to 2.5 V VDD_SOC_IN (1.4V) 22 mA
• PLLs disabled VDD_HIGH_IN (3.0V) 8.5
• DDR is in self refresh.
Total 61.9 mW

STOP_OFF • Arm LDO set to 0.9V VDD_ARM_IN (1.4V) 4

• SoC LDO set to: 1.225 V
• PU LDO is power gated VDD_SOC_IN (1.4V) 13.5 mA
• HIGH LDO set to 2.5 V VDD_HIGH_IN (3.0V) 7.5
• PLLs disabled
• DDR is in self refresh Total 47 mW

STANDBY • Arm and PU LDOs are power gated VDD_ARM_IN (0.9V) 0.1
• SoC LDO is in bypass
• HIGH LDO is set to 2.5V VDD_SOC_IN (0.9V) 5 mA
• PLLs are disabled VDD_HIGH_IN (3.0V) 5
• Low Voltage
• Well Bias ON Total 19.6 mW
• Crystal oscillator is enabled

Deep Sleep Mode • Arm and PU LDOs are power gated VDD_ARM_IN (0.9V) 0.1
(DSM) • SoC LDO is in bypass
• HIGH LDO is set to 2.5V VDD_SOC_IN (0.9V) 2 mA
• PLLs are disabled VDD_HIGH_IN (3.0V) 0.5
• Low Voltage
• Well Bias ON Total 3.4 mW
• Crystal oscillator and bandgap are disabled

SNVS only • VDD_SNVS_IN powered VDD_SNVS_IN (2.8V) 41 μA

• All other supplies off
• SRTC running Total 115 mW
1 The typical values shown here are for information only and are not guaranteed. These values are average values measured
on a typical wafer at 25°C.

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 Electrical Characteristics

4.1.7 USB PHY Current Consumption

4.1.7.1 Power Down Mode

In power down mode, everything is powered down, including the USB_VBUS valid detectors in typical
condition. Table 12 shows the USB interface current consumption in power down mode.
Table 12. USB PHY Current Consumption in Power Down Mode

VDD_USB_CAP (3.0 V) VDD_HIGH_CAP (2.5 V) NVCC_PLL_OUT (1.1 V)

Current 5.1 μA 1.7 μA <0.5 μA

NOTE
The currents on the VDD_HIGH_CAP and VDD_USB_CAP were
identified to be the voltage divider circuits in the USB-specific level shifters.

4.1.8 PCIe 2.0 Power Consumption

Table 13 provides PCIe PHY currents under certain Tx operating modes.
Table 13. PCIe PHY Current Drain

Mode Test Conditions Supply Max Current Unit

P0: Normal Operation 5G Operations PCIE_VP (1.1 V) 40 mA

PCIE_VPTX (1.1 V) 20

PCIE_VPH (2.5 V) 21

2.5G Operations PCIE_VP (1.1 V) 27

PCIE_VPTX (1.1 V) 20

PCIE_VPH (2.5 V) 20

P0s: Low Recovery Time 5G Operations PCIE_VP (1.1 V) 30 mA

Latency, Power Saving State
PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 18

2.5G Operations PCIE_VP (1.1 V) 20

PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 18

P1: Longer Recovery Time — PCIE_VP (1.1 V) 12 mA

Latency, Lower Power State
PCIE_VPTX (1.1 V) 2.4

PCIE_VPH (2.5 V) 12

Power Down — PCIE_VP (1.1 V) 1.3 mA

PCIE_VPTX (1.1 V) 0.18

PCIE_VPH (2.5 V) 0.36

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Electrical Characteristics

4.1.9 HDMI Power Consumption

Table 14 provides HDMI PHY currents for both Active 3D Tx with LFSR15 data and power-down modes.
Table 14. HDMI PHY Current Drain

Mode Test Conditions Supply Max Current Unit

Active Bit rate 251.75 Mbps HDMI_VPH 14 mA

HDMI_VP 4.1 mA

Bit rate 279.27 Mbps HDMI_VPH 14 mA

HDMI_VP 4.2 mA

Bit rate 742.5 Mbps HDMI_VPH 17 mA

HDMI_VP 7.5 mA

Bit rate 1.485 Gbps HDMI_VPH 17 mA

HDMI_VP 12 mA

Bit rate 2.275 Gbps HDMI_VPH 16 mA

HDMI_VP 17 mA

Bit rate 2.97 Gbps HDMI_VPH 19 mA

HDMI_VP 22 mA

Power-down — HDMI_VPH 49 μA

HDMI_VP 1100 μA

4.2 Power Supplies Requirements and Restrictions

The system design must comply with power-up sequence, power-down sequence, and steady state
guidelines as described in this section to guarantee the reliable operation of the device. Any deviation
from these sequences may result in the following situations:
• Excessive current during power-up phase
• Prevention of the device from booting
• Irreversible damage to the processor (worst-case scenario)

4.2.1 Power-Up Sequence

The restrictions that follow must be observed:
• VDD_SNVS_IN supply must be turned on before any other power supply or be connected
(shorted) with VDD_HIGH_IN supply.
• If a coin cell is used to power VDD_SNVS_IN, then ensure that it is connected before any other
supply is switched on.
• The SRC_POR_B signal controls the processor POR and must be immediately asserted at
power-up and remain asserted until the VDD_ARM_CAP, VDD_SOC_CAP, and VDD_PU_CAP
supplies are stable. VDD_ARM_IN and VDD_SOC_IN may be applied in either order with no
restrictions.

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 Electrical Characteristics

NOTE
Ensure that there is no back voltage (leakage) from any supply on the board
towards the 3.3 V supply (for example, from the external components that
use both the 1.8 V and 3.3 V supplies).
NOTE
USB_OTG_VBUS and USB_H1_VBUS are not part of the power supply
sequence and may be powered at any time.

4.2.2 Power-Down Sequence

No special restrictions for i.MX 6Solo/6DualLite IC.

4.2.3 Power Supplies Usage

All I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx) is OFF.
This can cause internal latch-up and malfunctions due to reverse current flows. For information about I/O
power supply of each pin, see “Power Rail” columns in pin list tables of Section 6, “Package Information
and Contact Assignments.”
NOTE
When the PCIE interface is not used, the PCIE_VP, PCIE_VPH, and
PCIE_VPTX supplies must be powered or grounded. The input and output
supplies for the remaining ports (PCIE_REXT, PCIE_RX_N, PCIE_RX_P,
PCIE_TX_N, and PCIE_TX_P) can remain unconnected. It is
recommended not to turn the PCIE_VPH supply OFF while the PCIE_VP
supply is ON, as it may lead to excessive power consumption. If boundary
scan test is used, PCIE_VP, PCIE_VPH, and PCIE_VPTX must remain
powered.

4.3 Integrated LDO Voltage Regulator Parameters

Various internal supplies can be powered ON from internal LDO voltage regulators. All the supply pins
named *_CAP must be connected to external capacitors. The onboard LDOs are intended for internal use
only and should not be used to power any external circuitry. See the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM) for details on the power tree scheme.
NOTE
The *_CAP signals must not be powered externally. These signals are
intended for internal LDO or LDO bypass operation only.

4.3.1 Digital Regulators (LDO_ARM, LDO_PU, LDO_SOC)

There are three digital LDO regulators (“Digital”, because of the logic loads that they drive, not because
of their construction). The advantages of the regulators are to reduce the input supply variation because of

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Electrical Characteristics

their input supply ripple rejection and their on-die trimming. This translates into more stable voltage for
the on-chip logics.
These regulators have three basic modes:
• Bypass. The regulation FET is switched fully on passing the external voltage, to the load unaltered.
The analog part of the regulator is powered down in this state, removing any loss other than the IR
drop through the power grid and FET.
• Power Gate. The regulation FET is switched fully off limiting the current draw from the supply.
The analog part of the regulator is powered down here limiting the power consumption.
• Analog regulation mode. The regulation FET is controlled such that the output voltage of the
regulator equals the programmed target voltage. The target voltage is fully programmable in 25 mV
steps.
For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.3.2 Regulators for Analog Modules

4.3.2.1 LDO_1P1
The LDO_1P1 regulator implements a programmable linear-regulator function from VDD_HIGH_IN (see
for minimum and maximum input requirements). Typical Programming Operating Range is 1.0 V to 1.2
V with the nominal default setting as 1.1 V. The LDO_1P1 supplies the USB Phy, LVDS Phy, HDMI Phy,
MIPI Phy, and PLLs. A programmable brown-out detector is included in the regulator that can be used by
the system to determine when the load capability of the regulator is being exceeded to take the necessary
steps. Current-limiting can be enabled to allow for in-rush current requirements during start-up, if needed.
Active-pull-down can also be enabled for systems requiring this feature.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual (IMX6SDLRM).

4.3.2.2 LDO_2P5
The LDO_2P5 module implements a programmable linear-regulator function from VDD_HIGH_IN (see
for minimum and maximum input requirements). Typical Programming Operating Range is 2.25 V to
2.75 V with the nominal default setting as 2.5 V. LDO_2P5 supplies the USB Phy, LVDS Phy, HDMI Phy,
MIPI Phy, E-fuse module, and PLLs. A programmable brown-out detector is included in the regulator that
can be used by the system to determine when the load capability of the regulator is being exceeded, to take
the necessary steps. Current-limiting can be enabled to allow for in-rush current requirements during
start-up, if needed. Active-pull-down can also be enabled for systems requiring this feature. An alternate
self-biased low-precision weak-regulator is included that can be enabled for applications needing to keep
the output voltage alive during low-power modes where the main regulator driver and its associated global
bandgap reference module are disabled. The output of the weak-regulator is not programmable and is a

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 Electrical Characteristics

function of the input supply as well as the load current. Typically, with a 3 V input supply the
weak-regulator output is 2.525 V and its output impedance is approximately 40 Ω.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.3.2.3 LDO_USB
The LDO_USB module implements a programmable linear-regulator function from the
USB_OTG_VBUS and USB_H1_VBUS voltages (4.4 V–5.25 V) to produce a nominal 3.0 V output
voltage. A programmable brown-out detector is included in the regulator that can be used by the system to
determine when the load capability of the regulator is being exceeded, to take the necessary steps. This
regulator has a built in power-mux that allows the user to select to run the regulator from either
USB_VBUS supply, when both are present. If only one of the USB_VBUS voltages is present, then, the
regulator automatically selects this supply. Current limit is also included to help the system meet in-rush
current targets.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
(IMX6DQ6SDLHDG).
For additional information, see the i.MX 6Solo/6DualLite reference manual.

4.4 PLL’s Electrical Characteristics

4.4.1 Audio/Video PLL’s Electrical Parameters

Table 15. Audio/Video PLL’s Electrical Parameters

Parameter Value

Clock output range 650 MHz ~1.3 GHz

Reference clock 24 MHz

Lock time <11250 reference cycles

4.4.2 528 MHz PLL

Table 16. 528 MHz PLL’s Electrical Parameters

Parameter Value

Clock output range 528 MHz PLL output

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Electrical Characteristics

Table 16. 528 MHz PLL’s Electrical Parameters (continued)

Parameter Value

Reference clock 24 MHz

Lock time <11250 reference cycles

4.4.3 Ethernet PLL

Table 17. Ethernet PLL’s Electrical Parameters

Parameter Value

Clock output range 500 MHz

Reference clock 24 MHz

Lock time <11250 reference cycles

4.4.4 480 MHz PLL

Table 18. 480 MHz PLL’s Electrical Parameters

Parameter Value

Clock output range 480 MHz PLL output

Reference clock 24 MHz

Lock time <383 reference cycles

4.4.5 Arm PLL

Table 19. Arm PLL’s Electrical Parameters

Parameter Value

Clock output range 650 MHz ~ 1.3 GHz

Reference clock 24 MHz

Lock time <2250 reference cycles

4.5 On-Chip Oscillators

4.5.1 OSC24M
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements an oscillator. The oscillator is powered from NVCC_PLL_OUT.

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 Electrical Characteristics

The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight
forward biased-inverter implementation is used.

4.5.2 OSC32K
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements a low power oscillator. It also implements a power mux such that it can be powered
from either a ~3 V backup battery (VDD_SNVS_IN) or VDD_HIGH_IN such as the oscillator consumes
power from VDD_HIGH_IN when that supply is available and transitions to the back up battery when
VDD_HIGH_IN is lost.
In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 kHz
clock will automatically switch to the internal ring oscillator.
CAUTION
The internal RTC oscillator does not provide an accurate frequency and is
affected by process, voltage, and temperature variations. NXP strongly
recommends using an external crystal as the RTC_XTALI reference. If the
internal oscillator is used instead, careful consideration must be given to the
timing implications on all of the SoC modules dependent on this clock.
The OSC32k runs from VDD_SNVS_CAP supply, which comes from VDD_HIGH_IN/VDD_SNVS_IN.
Table 20. OSC32K Main Characteristics

Characteristic Min Typ Max Comments

Fosc — 32.768 KHz — This frequency is nominal and determined mainly by the crystal selected.
32.0 K will work as well.

Current consumption — 4 μA — The 4 μA is the consumption of the oscillator alone (OSC32k). Total supply
consumption will depend on what the digital portion of the RTC consumes.
The ring oscillator consumes 1 μA when ring oscillator is inactive, 20 μA
when the ring oscillator is running. Another 1.5 μA is drawn from vdd_rtc
in the power_detect block. So, the total current is 6.5 μA on vdd_rtc when
the ring oscillator is not running.

Bias resistor — 14 MΩ — This the integrated bias resistor that sets the amplifier into a high gain
state. Any leakage through the ESD network, external board leakage, or
even a scope probe that is significant relative to this value will debias the
amp. The debiasing will result in low gain, and will impact the circuit's ability
to start up and maintain oscillations.

Crystal Properties

Cload — 10 pF — Usually crystals can be purchased tuned for different Cloads. This Cload
value is typically 1/2 of the capacitances realized on the PCB on either side
of the quartz. A higher Cload will decrease oscillation margin, but
increases current oscillating through the crystal.

ESR — 50 kΩ 100 kΩ Equivalent series resistance of the crystal. Choosing a crystal with a higher
value will decrease the oscillating margin.

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Electrical Characteristics

4.6 I/O DC Parameters

This section includes the DC parameters of the following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2 and DDR3 modes
• LVDS I/O
NOTE
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output.
ovdd

pmos (Rpu) Voh min

1 Vol max
or pdat pad
0 Predriver

nmos (Rpd)

ovss
Figure 4. Circuit for Parameters Voh and Vol for I/O Cells

4.6.1 XTALI and RTC_XTALI (Clock Inputs) DC Parameters

Table 21 shows the DC parameters for the clock inputs.
Table 21. XTALI and RTC_XTALI DC Parameters

Parameter Symbol Test Conditions Min Typ Max Unit

XTALI high-level DC input voltage Vih — 0.8 x NVCC_PLL — NVCC_PLL V

XTALI low-level DC input voltage Vil — 0 — 0.2V V

RTC_XTALI high-level DC input voltage Vih — 0.8 — 1.11 V

RTC_XTALI low-level DC input voltage Vil — 0 — 0.2 V

Input capacitance CIN Simulated data — 5 — pF

XTALI input leakage current at startup IXTALI_STARTUP Power-on startup for — — 600 μA
0.15msec with a driven
24 MHz clock at 1.1 V.2

DC input current IXTALI_DC — — — 2.5 μA

1 This voltage specification must not be exceeded and, as such, is an absolute maximum specification.
2 This current draw is present even if an external clock source directly drives XTALI. The 24 MHz oscillator cell is powered from
NVCC_PLL_OUT.

NOTE
The Vil and Vih specifications only apply when an external clock source is
used. If a crystal is used, Vil and Vih do not apply.

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 Electrical Characteristics

4.6.2 General Purpose I/O (GPIO) DC Parameters

Table 22 shows DC parameters for GPIO pads. The parameters in Table 22 are guaranteed per the
operating ranges in Table 8, unless otherwise noted.
Table 22. GPIO DC Parameters

Parameter Symbol Test Conditions Min Max Units

1
High-level output voltage VOH Ioh= -0.1mA (DSE=001,010) OVDD - 0.15 — V
Ioh= -1mA
(DSE=011,100,101,110,111)
Low-level output voltage1 VOL Iol= 0.1mA (DSE=001,010) — 0.15 V
Iol= 1mA
(DSE=011,100,101,110,111)
High-Level input voltage1,2 VIH — 0.7 × OVDD OVDD V
Low-Level input voltage1,2 VIL — 0 0.3 × OVDD V
Input Hysteresis (OVDD= 1.8V) VHYS_LowVDD OVDD=1.8V 250 — mV
Input Hysteresis (OVDD=3.3V VHYS_HighVDD OVDD=3.3V 250 — mV
Schmitt trigger VT+2,3 VTH+ — 0.5 × OVDD — mV
Schmitt trigger VT-2,3 VTH- — — 0.5 × OVDD mV
Pull-up resistor (22_kΩ PU) RPU_22K Vin=0V — 212 uA
Pull-up resistor (22_kΩ PU) RPU_22K Vin=OVDD — 1 uA
Pull-up resistor (47_kΩ PU) RPU_47K Vin=0V — 100 uA
Pull-up resistor (47_kΩ PU) RPU_47K Vin=OVDD — 1 uA
Pull-up resistor (100_kΩ PU) RPU_100K Vin=0V — 48 uA
Pull-up resistor (100_kΩ PU) RPU_100K Vin=OVDD — 1 uA
Pull-down resistor (100_kΩ PD) RPD_100K Vin=OVDD — 48 uA
Pull-down resistor (100_kΩ PD) RPD_100K Vin=0V — 1 uA
Input current (no PU/PD) IIN VI = 0, VI = OVDD -1 1 uA
Keeper Circuit Resistance R_Keeper VI = 0.3 × OVDD, VI = 0.7 × OVDD 105 175 kΩ
1
Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,
and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must be
controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other methods.
Non-compliance to this specification may affect device reliability or cause permanent damage to the device.
2
To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC
level through to the target DC level, Vil or Vih. Monotonic input transition time is from 0.1 ns to 1 s.
3 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

4.6.3 DDR I/O DC Parameters

The DDR I/O pads support LPDDR2 and DDR3/DDR3L operational modes.

4.6.3.1 LPDDR2 Mode I/O DC Parameters

For details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller
(MMDC).

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Table 23. LPDDR2 I/O DC Electrical Parameters1

Parameters Symbol Test Conditions Min Max Unit

High-level output voltage VOH Ioh= -0.1mA 0.9 × OVDD — V

Low-level output voltage VOL Iol= 0.1mA — 0.1 × OVDD V

Input Reference Voltage Vref — 0.49 × OVDD 0.51 × OVDD V

DC High-Level input voltage Vih_DC — Vref+0.13 OVDD V

DC Low-Level input voltage Vil_DC — OVSS Vref-0.13 V

Differential Input Logic High Vih_diff — 0.26 Note2

Differential Input Logic Low Vil_diff — Note3 -0.26

Pull-up/Pull-down Impedance Mismatch Mmpupd — -15 15 %

240 Ω unit calibration resolution Rres — — 10 Ω

Keeper Circuit Resistance Rkeep — 110 175 kΩ

Input current (no pull-up/down) Iin VI = 0, VI = OVDD -2.5 2.5 μA

1 Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.
2
The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.
3 The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

4.6.3.2 DDR3/DDR3L Mode I/O DC Parameters

The parameters in Table 24 are guaranteed per the operating ranges in Table 8, unless otherwise noted. For
details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller
(MMDC).
Table 24. DDR3/DDR3L I/O DC Electrical Characteristics1

Parameters Symbol Test Conditions Min Max Unit

High-level output voltage VOH Ioh= -0.1mA 0.8 × OVDD2 — V

Voh (for DSE=001)
Low-level output voltage VOL Iol= 0.1mA — 0.2 × OVDD V
Vol (for DSE=001)

High-level output voltage VOH Ioh= -1mA 0.8 × OVDD — V

Voh (for all except DSE=001)

Low-level output voltage VOL Iol= 1mA — 0.2 × OVDD V

Vol (for all except DSE=001)

Input Reference Voltage Vref — 0.49 × OVDD 0.51 × OVDD V

3+0.1
DC High-Level input voltage Vih_DC — Vref OVDD V

DC Low-Level input voltage Vil_DC — OVSS Vref-0.1 V

Differential Input Logic High Vih_diff — 0.2 See Note4 V

Differential Input Logic Low Vil_diff — See Note3 -0.2 V

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Table 24. DDR3/DDR3L I/O DC Electrical Characteristics1 (continued)

Parameters Symbol Test Conditions Min Max Unit

Termination Voltage Vtt Vtt tracking OVDD/2 0.49 × OVDD 0.51 × OVDD V

Pull-up/Pull-down Impedance Mismatch Mmpupd — -10 10 %

240 Ω unit calibration resolution Rres — — 10 Ω

Keeper Circuit Resistance Rkeep — 105 165 kΩ

Input current (no pull-up/down) Iin VI = 0,VI = OVDD -2.9 2.9 μA

1
Note that the JEDEC DDR3 specification (JESD79_3D) supersedes any specification in this document.
2
OVDD – I/O power supply (1.425 V–1.575 V for DDR3 and 1.283 V–1.45 V for DDR3L)
3
Vref – DDR3/DDR3L external reference voltage.
4
The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as
the limitations for overshoot and undershoot.

4.6.4 RGMII I/O 2.5V I/O DC Electrical Parameters

The RGMII interface complies with the RGMII standard version 1.3. The parameters in Table 25 are
guaranteed per the operating ranges in Table 8, unless otherwise noted.
Table 25. RGMII I/O 1.8V and 2.5V mode DC Electrical Characteristics1

Parameters Symbol Test Conditions Min Max Unit

High-level Output Voltage1 VOH Ioh= -0.1mA (DSE=001,010) OVDD-0.15 — V

Ioh= -1mA (DSE=011,100,101,110,111)

Low-level Output Voltage1 VOL Iol= 0.1mA (DSE=001,010) — 0.15 V

Iol= 1mA (DSE=011,100,101,110,111)

Input Reference Voltage Vref — 0.49 × OVDD 0.51 × OVDD V

High-Level Input Voltage2 3 VIH — 0.7 × OVDD OVDD V

Low-Level Input Voltage2 3 VIL — 0 0.3 × OVDD V

Input Hysteresis VHYS_HighVDD OVDD=1.8V 250 — mV

(OVDD=1.8V)
Input Hysteresis VHYS_HighVDD OVDD=2.5V 250 — mV
(OVDD=2.5V)

Schmitt Trigger VT+3 4 VTH+ — 0.5 × OVDD — mV

Schmitt Trigger VT-3 4 VTH -

— — 0.5 × OVDD mV

Pull-up Resistor (22 kΩ PU) RPU_22K Vin=0V — 212 μA

Pull-up Resistor (22 kΩ PU) RPU_22K Vin=OVDD -— 1 μA

Pull-up Resistor (47 kΩ PU) RPU_47K Vin=0V — 100 μA

Pull-up Resistor (47 kΩ PU) RPU_47K Vin=OVDD — 1 μA

Pull-up Resistor (100 kΩ PU) RPU_100K Vin=0V — 48 μA

Pull-up Resistor (100 kΩ PU) RPU_100K Vin=OVDD — 1 μA

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Table 25. RGMII I/O 1.8V and 2.5V mode DC Electrical Characteristics1 (continued)

Parameters Symbol Test Conditions Min Max Unit

Pull-down Resistor (100 kΩ RPD_100K Vin=OVDD — 48 μA

PD)

Pull-down Resistor (100 kΩ RPD_100K Vin=0V — 1 μA

PD)
Keeper Circuit Resistance Rkeep 105 165 kΩ

Input Current (no Iin VI = 0, VI = OVDD -2.9 2.9 μA

pull-up/down)
1
Input Mode Selection "SW_PAD_CTL_GRP_DDR_TYPE_RGMII"='10' (1.8V Mode)
"SW_PAD_CTL_GRP_DDR_TYPE_RGMII"='11' (2.5V Mode).
2
Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6
V, and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must
be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other
methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.
3 To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s.
4 Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled (register

IOMUXC_SW_PAD_CTL_PAD_RGMII_TXC[HYS]= 0).

4.6.5 LVDS I/O DC Parameters

The LVDS interface complies with TIA/EIA 644-A standard. See TIA/EIA STANDARD 644-A,
“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.
Table 26 shows the Low Voltage Differential Signaling (LVDS) I/O DC parameters.
Table 26. LVDS I/O DC Characteristics

Parameter Symbol Test Conditions Min Typ Max Unit

Output Differential Voltage VOD Rload-100 Ω Diff 250 350 450 mV

Output High Voltage VOH IOH = 0 mA 1.25 1.375 1.6 V

Output Low Voltage VOL IOL = 0 mA 0.9 1.025 1.25 V

Offset Voltage VOS — 1.125 1.2 1.375 V

4.7 I/O AC Parameters

This section includes the AC parameters of the following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2 and DDR3/DDR3L modes
• LVDS I/O
The GPIO and DDR I/O load circuit and output transition time waveforms are shown in Figure 5 and
Figure 6.

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 Electrical Characteristics

From Output Test Point

Under Test
CL

CL includes package, probe and fixture capacitance

Figure 5. Load Circuit for Output

OVDD
80% 80%

20% 20%
Output (at pad) 0V
tr tf

Figure 6. Output Transition Time Waveform

4.7.1 General Purpose I/O AC Parameters

The I/O AC parameters for GPIO in slow and fast modes are presented in the Table 27 and Table 28,
respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bits in the
IOMUXC control registers.
Table 27. General Purpose I/O AC Parameters 1.8 V Mode

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 2.72/2.79
— —
(Max Drive, DSE=111) 15 pF Cload, fast slew rate 1.51/1.54

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 3.20/3.36
— —
(High Drive, DSE=101) 15 pF Cload, fast slew rate 1.96/2.07
ns
Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 3.64/3.88
— —
(Medium Drive, DSE=100) 15 pF Cload, fast slew rate 2.27/2.53

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 4.32/4.50
— —
(Low Drive. DSE=011) 15 pF Cload, fast slew rate 3.16/3.17
Input Transition Times1 trm — — — 25 ns
1 Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

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Electrical Characteristics

Table 28. General Purpose I/O AC Parameters 3.3 V Mode

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 1.70/1.79
— —
(Max Drive, DSE=101) 15 pF Cload, fast slew rate 1.06/1.15

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 2.35/2.43
— —
(High Drive, DSE=011) 15 pF Cload, fast slew rate 1.74/1.77
ns
Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 3.13/3.29
— —
(Medium Drive, DSE=010) 15 pF Cload, fast slew rate 2.46/2.60

Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 5.14/5.57
— —
(Low Drive. DSE=001) 15 pF Cload, fast slew rate 4.77/5.15
Input Transition Times1 trm — — — 25 ns
1
Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

4.7.2 DDR I/O AC Parameters

Table 29 shows the AC parameters for DDR I/O operating in LPDDR2 mode. For details on supported
DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller (MMDC).
Table 29. DDR I/O LPDDR2 Mode AC Parameters1

Parameter Symbol Test Condition Min Max Unit

AC input logic high Vih(ac) — Vref + 0.22 OVDD V

AC input logic low Vil(ac) — 0 Vref - 0.22 V

AC differential input high voltage2 Vidh(ac) — 0.44 — V

AC differential input low voltage Vidl(ac) — — 0.44 V

Input AC differential cross point voltage3 Vix(ac) Relative to Vref -0.12 0.12 V

Over/undershoot peak Vpeak — — 0.35 V

Over/undershoot area (above OVDD Varea 400 MHz — 0.3 V-ns

or below OVSS)

tsr 50 Ω to Vref. 1.5 3.5

5 pF load.
Drive impedance = 40 Ω
Single output slew rate, measured between ± 30%
V/ns
Vol(ac) and Voh(ac) 50 Ω to Vref. 1 2.5
5pF load.Drive
impedance = 60 Ω ±
30%

Skew between pad rise/fall asymmetry + skew tSKD clk = 400 MHz — 0.1 ns
caused by SSN
1 Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.
2
Vid(ac) specifies the input differential voltage | Vtr - Vcp | required for switching, where Vtr is the “true” input signal and Vcp
is the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

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 Electrical Characteristics

3
The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)
indicates the voltage at which differential input signal must cross.

Table 30 shows the AC parameters for DDR I/O operating in DDR3/DDR3L mode.
Table 30. DDR I/O DDR3/DDR3L Mode AC Parameters1

Parameter Symbol Test Condition Min Typ Max Unit

AC input logic high Vih(ac) — Vref + 0.175 — OVDD V

AC input logic low Vil(ac) — 0 — Vref - 0.175 V

AC differential input voltage2 Vid(ac) — 0.35 — — V

Input AC differential cross point voltage3, 4 Vix(ac) Relative to Vref Vref - 0.15 — Vref + 0.15 V

Over/undershoot peak Vpeak — — — 0.4 V

Over/undershoot area (above OVDD Varea 400 MHz — — 0.5 V-ns

or below OVSS)

Single output slew rate, measured between tsr Driver impedance = 34 Ω 2.5 — 5 V/ns
Vol(ac) and Voh(ac)

Skew between pad rise/fall asymmetry + skew tSKD clk = 400 MHz — — 0.1 ns
caused by SSN
1 Note that the JEDEC JESD79_3C specification supersedes any specification in this document.
2 Vid(ac) specifies the input differential voltage | Vtr-Vcp | required for switching, where Vtr is the “true” input signal and Vcp is
the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).
3 The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

4 Extended range for Vix is only allowed for the clock and when the single-ended clock input signals CK and CK# are:

• monotonic with a single-ended swing VSEL/VSEH of at least VDD/2 ± 250 mV, and
• the differential slew rate of CK - CK# is larger than 3 V/ns

4.7.3 LVDS I/O AC Parameters

The differential output transition time waveform is shown in Figure 7.
padp VOH
0V (Differential) 0V
padn VOL

80% 80%

VDIFF 0V 0V

20% VDIFF = {padp} - {padn}

20%
tTLH tTHL
Figure 7. Differential LVDS Driver Transition Time Waveform

Table 31 shows the AC parameters for LVDS I/O.

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Electrical Characteristics

Table 31. I/O AC Parameters of LVDS Pad

Parameter Symbol Test Condition Min Typ Max Unit

Differential pulse skew1 tSKD — — 0.25

Rload = 100 Ω,
Transition Low to High Time2 tTLH — — 0.5 ns
Cload = 2 pF
Transition High to Low Time2 tTHL — — 0.5

Operating Frequency f — — 600 800 MHz

Offset voltage imbalance Vos — — — 150 mV

1
tSKD = | tPHLD - tPLHD |, is the magnitude difference in differential propagation delay time between the positive going edge and
the negative going edge of the same channel.
2 Measurement levels are 20-80% from output voltage.

4.8 Output Buffer Impedance Parameters

This section defines the I/O impedance parameters of the i.MX 6Solo/6DualLite processors for the
following I/O types:
• General Purpose I/O (GPIO)
• Double Data Rate I/O (DDR) for LPDDR2, and DDR3/DDR3L modes
• LVDS I/O
NOTE
GPIO and DDR I/O output driver impedance is measured with “long”
transmission line of impedance Ztl attached to I/O pad and incident wave
launched into transmission line. Rpu/Rpd and Ztl form a voltage divider that
defines specific voltage of incident wave relative to OVDD. Output driver
impedance is calculated from this voltage divider (see Figure 8).

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 Electrical Characteristics

OVDD

PMOS (Rpu)

Ztl Ω, L = 20 inches
ipp_do pad
predriver

Cload = 1p
NMOS (Rpd)

U,(V) OVSS
Vin (do)
VDD

t,(ns)
0

U,(V)
Vout (pad)
OVDD

Vref1 Vref2
Vref

t,(ns)
0

Vovdd – Vref1
Rpu = × Ztl
Vref1

Vref2
Rpd = × Ztl
Vovdd – Vref2
Figure 8. Impedance Matching Load for Measurement

4.8.1 GPIO Output Buffer Impedance

Table 32 shows the GPIO output buffer impedance (OVDD 1.8 V).
Table 32. GPIO Output Buffer Average Impedance (OVDD 1.8 V)

Parameter Symbol Drive Strength (DSE) Typ Value Unit

001 260
010 130
011 90
Output Driver
Rdrv 100 60 Ω
Impedance
101 50
110 40
111 33

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Electrical Characteristics

Table 33 shows the GPIO output buffer impedance (OVDD 3.3 V).
Table 33. GPIO Output Buffer Average Impedance (OVDD 3.3 V)

Parameter Symbol Drive Strength (DSE) Typ Value Unit

001 150
010 75
011 50
Output Driver
Rdrv 100 37 Ω
Impedance
101 30
110 25
111 20

4.8.2 DDR I/O Output Buffer Impedance

For details on supported DDR memory configurations, see Section 4.9.4, “Multi-Mode DDR Controller
(MMDC).
Table 34 shows DDR I/O output buffer impedance of i.MX 6Solo/6DualLite processors.
Table 34. DDR I/O Output Buffer Impedance

Typical
Test Conditions DSE
Parameter Symbol NVCC_DRAM=1.5 V NVCC_DRAM=1.2 V Unit
(Drive Strength) (DDR3) (LPDDR2)
DDR_SEL=11 DDR_SEL=10

000 Hi-Z Hi-Z

001 240 240
010 120 120
Output Driver 011 80 80
Rdrv Ω
Impedance 100 60 60
101 48 48
110 40 40
111 34 34

Note:
1. Output driver impedance is controlled across PVTs using ZQ calibration procedure.
2. Calibration is done against 240 Ω external reference resistor.
3. Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs.

4.8.3 LVDS I/O Output Buffer Impedance

The LVDS interface complies with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A,
“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

4.9 System Modules Timing

This section contains the timing and electrical parameters for the modules in each i.MX 6Solo/6DualLite
processor.

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 Electrical Characteristics

4.9.1 Reset Timings Parameters

Figure 9 shows the reset timing and Table 35 lists the timing parameters.

SRC_POR_B
(Input)
CC1

Figure 9. Reset Timing Diagram

Table 35. Reset Timing Parameters

ID Parameter Min Max Unit

CC1 Duration of SRC_POR_B to be qualified as valid. 1 — XTALOSC_RTC_XTALI cycle

4.9.2 WDOG Reset Timing Parameters

Figure 10 shows the WDOG reset timing and Table 36 lists the timing parameters.

WDOG1_B
(Output)
CC3
Figure 10. WDOG1_B Timing Diagram

Table 36. WDOG1_B Timing Parameters

ID Parameter Min Max Unit

CC3 Duration of WDOG1_B Assertion 1 — XTALOSC_RTC_XTALI cycle

NOTE
XTALOSC_RTC_XTALI is approximately 32 kHz.
XTALOSC_RTC_XTALI cycle is one period or approximately 30 μs.
NOTE
WDOG1_B output signals (for each one of the Watchdog modules) do not
have dedicated pins, but are muxed out through the IOMUX. See the
IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM).

4.9.3 External Interface Module (EIM)

The following subsections provide information on the EIM. Maximum operating frequency for EIM data
transfer is 104 MHz. Two system clocks are used with the EIM:
• ACLK_EIM_SLOW_CLK_ROOT is used to clock the EIM module.
The maximum frequency for CLK_EIM_SLOW_CLK_ROOT is 132 MHz.
• ACLK_EXSC is also used when the EIM is in synchronous mode.
The maximum frequency for ACLK_EXSC is 104 MHz.

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Electrical Characteristics

Timing parameters in this section that are given as a function of register settings.

4.9.3.1 EIM Interface Pads Allocation

EIM supports 32-bit, 16-bit and 8-bit devices operating in address/data separate or multiplexed modes.
Table 37 provides EIM interface pads allocation in different modes.
Table 37. EIM Internal Module Multiplexing1
Multiplexed
Non Multiplexed Address/Data Mode
Address/Data mode
Setup 8 Bit 16 Bit 32 Bit 16 Bit 32 Bit
MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 0, MUM = 1, MUM = 1,
DSZ = 100 DSZ = 101 DSZ = 110 DSZ = 111 DSZ = 001 DSZ = 010 DSZ = 011 DSZ = 001 DSZ = 011
EIM_ADDR EIM_AD EIM_AD EIM_AD EIM_AD EIM_AD EIM_AD EIM_AD EIM_AD EIM_AD
[15:00] [15:00] [15:00] [15:00] [15:00] [15:00] [15:00] [15:00] [15:00] [15:00]
EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_ADDR EIM_DATA
[25:16] [25:16] [25:16] [25:16] [25:16] [25:16] [25:16] [25:16] [25:16] [09:00]
EIM_DATA EIM_DATA — — — EIM_DATA — EIM_DATA EIM_AD EIM_AD
[07:00], [07:00] [07:00] [07:00] [07:00] [07:00]
EIM_EB0_B
EIM_DATA — EIM_DATA — — EIM_DATA — EIM_DATA EIM_AD EIM_AD
[15:08], [15:08] [15:08] [15:08] [15:08] [15:08]
EIM_EB1_B
EIM_DATA — — EIM_DATA — — EIM_DATA EIM_DATA — EIM_DATA
[23:16], [23:16] [23:16] [23:16] [07:00]
EIM_EB2_B
EIM_DATA — — — EIM_DATA — EIM_DATA EIM_DATA — EIM_DATA
[31:24], [31:24] [31:24] [31:24] [15:08]
EIM_EB3_B
1
For more information on configuration ports mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.

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 Electrical Characteristics

4.9.3.2 General EIM Timing-Synchronous Mode

Figure 11, Figure 12, and Table 38 specify the timings related to the EIM module. All EIM output control
signals may be asserted and deasserted by an internal clock synchronized to the EIM_BCLK rising edge
according to corresponding assertion/negation control fields.
,

WE2

EIM_BCLK
... WE3

WE4 WE1 WE5

EIM_ADDRxx
WE6 WE7
EIM_CSx_B

WE8 WE9
EIM_WE_B

WE10 WE11
EIM_OE_B

WE12 WE13
EIM_EBx_B

WE14 WE15
EIM_LBA_B

WE16 WE17
Output Data

Figure 11. EIM Outputs Timing Diagram

EIM_BCLK

WE18
Input Data
WE19
WE20
EIM_WAIT_B
WE21

Figure 12. EIM Inputs Timing Diagram

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Electrical Characteristics

4.9.3.3 Examples of EIM Synchronous Accesses

Table 38. EIM Bus Timing Parameters 1

BCD = 0 BCD = 1 BCD = 2 BCD = 3

ID Parameter
Min Max Min Max Min Max Min Max
WE1 EIM_BCLK Cycle t — 2xt — 3xt — 4xt —
time2
WE2 EIM_BCLK Low 0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —
Level Width
WE3 EIM_BCLK High 0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —
Level Width
WE4 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 -t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
address valid3 1.25 1.25 +1.75 1.25
WE5 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
address invalid 1.25
WE6 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
EIM_CSx_B valid 1.25 1.25 +1.75 1.25
WE7 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
EIM_CSx_B invalid 1.25
WE8 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
EIM_WE_B Valid 1.25 1.25 +1.75 1.25
WE9 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
EIM_WE_B Invalid 1.25
WE10 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
EIM_OE_B Valid 1.25 1.25 +1.75 1.25
WE11 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
EIM_OE_B Invalid 1.25
WE12 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
EIM_EBx_B Valid 1.25 1.25 +1.75 1.25
WE13 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
EIM_EBx_B Invalid 1.25
WE14 Clock rise to -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
EIM_LBA_B Valid 1.25 1.25 +1.75 1.25
WE15 Clock rise to 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
EIM_LBA_B Invalid 1.25
WE16 Clock rise to Output -0.5 x t - -0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t - -1.5 x t -2 x t - -2 x t + 1.75
Data Valid 1.25 1.25 +1.75 1.25
WE17 Clock rise to Output 0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t - 1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75
Data Invalid 1.25
WE18 Input Data setup 2 — 4 — — — — —
time to Clock rise
WE19 Input Data hold time 2 — 2 — — — — —
from Clock rise
WE20 EIM_WAIT_B setup 2 — 4 — — — — —
time to Clock rise
WE21 EIM_WAIT_B hold 2 — 2 — — — — —
time from Clock rise

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1
t is the maximum EIM logic (ACLK_EXSC) cycle time. The maximum allowed axi_clk frequency depends on the fixed/non-fixed
latency configuration, whereas the maximum allowed EIM_BCLK frequency is:
—Fixed latency for both read and write is 104 MHz.
—Variable latency for read only is 104 MHz.
—Variable latency for write only is 52 MHz.
In variable latency configuration for write, if BCD = 0 & WBCDD = 1 or BCD = 1, axi_clk must be 104 MHz.Write BCD = 1 and
104 MHz ACLK_EXSC, will result in a EIM_BCLK of 52 MHz. When the clock branch to EIM is decreased to 104 MHz, other
buses are impacted which are clocked from this source. See the CCM chapter of the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM) for a detailed clock tree description.
2
EIM_BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is
defined as 50% as signal value.
3
For signal measurements, “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

Figure 13 to Figure 16 provide few examples of basic EIM accesses to external memory devices with the
timing parameters mentioned previously for specific control parameters settings.

EIM_BCLK WE4 WE5

EIM_ADDRxx Last Valid Address Address v1
WE6 WE7
EIM_CSx_B

EIM_WE_B
WE14
EIM_LBA_B WE15
WE10 WE11
EIM_OE_B
WE12 WE13
EIM_EBx_B
WE18
EIM_DATAxx D(v1)
WE19
Figure 13. Synchronous Memory Read Access, WSC=1

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Electrical Characteristics

EIM_BCLK
WE4 WE5
EIM_ADDRxx Last Valid Address Address V1
WE6 WE7
EIM_CSx_B
WE8 WE9
EIM_WE_B
WE14
EIM_LBA_B
WE15

EIM_OE_B
WE13
WE12
EIM_EBx_B
WE16 WE17
EIM_DATAxx D(V1)

Figure 14. Synchronous Memory, Write Access, WSC=1, WBEA=0 and WADVN=0

EIM_BCLK
WE5 WE16 WE17
EIM_ADDRxx/ WE4
EIM_ADxx Last Valid Address Address V1 Write Data
WE6 WE7
EIM_CSx_B
WE8 WE9
EIM_WE_B
WE14 WE15

EIM_LBA_B

EIM_OE_B
WE10 WE11
EIM_EBx_B
Figure 15. Muxed Address/Data (A/D) Mode, Synchronous Write Access, WSC=6,ADVA=0, ADVN=1, and
ADH=1

NOTE
In 32-bit muxed address/data (A/D) mode the 16 MSBs are driven on the
data bus.

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 Electrical Characteristics

EIM_BCLK
WE4 WE5 WE19
EIM_ADDRxx/ Last Valid Address Address V1 Data
EIM_ADxx WE6 WE18

EIM_CSx_B
WE7

EIM_WE_B
WE14 WE15

EIM_LBA_B WE10
WE11
EIM_OE_B
WE12 WE13
EIM_EBx_B
Figure 16. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, OEA=0

4.9.3.4 General EIM Timing-Asynchronous Mode

Figure 17 through Figure 21, and Table 39 help you determine timing parameters relative to the chip
select (CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the
timing parameters mentioned above.
Asynchronous read & write access length in cycles may vary from what is shown in Figure 17 through
Figure 20 as RWSC, OEN and CSN is configured differently. See the i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM) for the EIM programming model.
start of end of
access access

INT_CLK
EIM_CSx_B MAXCSO

EIM_ADDRxx/ WE31 WE32

EIM_ADxx Last Valid Address Address V1 Next Address

EIM_WE_B
WE39 WE40
EIM_LBA_B
WE35 WE36
EIM_OE_B
WE37 WE38
EIM_EBx_B
WE44
EIM_DATAxx[7:0] MAXCO
D(V1)
WE43 MAXDI
Figure 17. Asynchronous Memory Read Access (RWSC = 5)

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Electrical Characteristics

start of end of
access access

INT_CLK
MAXCSO
EIM_CSx_B
EIM_ADDRxx/ WE31 MAXDI
EIM_ADxx Addr. V1 D(V1)
WE32A
WE44
EIM_WE_B
WE40A
WE39
EIM_LBA_B
WE35A WE36
EIM_OE_B
WE37 WE38
EIM_EBx_B
MAXCO
Figure 18. Asynchronous A/D Muxed Read Access (RWSC = 5)

EIM_CSx_B
WE31 WE32
EIM_ADDRxx Last Valid Address Address V1 Next Address
WE33 WE34
EIM_WE_B
WE39 WE40
EIM_LBA_B

EIM_OE_B
WE45 WE46
EIM_EBx_B
WE42
EIM_DATAxx D(V1)
WE41
Figure 19. Asynchronous Memory Write Access

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 Electrical Characteristics

EIM_CSx_B
WE41A
WE31
EIM_ADDRxx/
Addr. V1 D(V1)
EIM_DATAxx WE42
WE32A
WE33 WE34
EIM_WE_B
WE40A
WE39
EIM_LBA_B

EIM_OE_B
WE45 WE46
EIM_EBx_B
Figure 20. Asynchronous A/D Muxed Write Access

EIM_CSx_B
EIM_ADDRxx WE31 WE32
Last Valid Address Address V1 Next Address

EIM_WE_B
WE39 WE40
EIM_LBA_B
WE35 WE36
EIM_OE_B
WE37 WE38
EIM_EBx_B WE44

D(V1)
EIM_DATAxx[7:0] WE43
WE48
EIM_DTACK_B
WE47

Figure 21. DTACK Mode Read Access (DAP=0)

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Electrical Characteristics

EIM_CSx_B
WE31 WE32
EIM_ADDRxx Last Valid Address Address V1 Next Address
WE33 WE34
EIM_WE_B
WE39 WE40
EIM_LBA_B

EIM_OE_B
WE45 WE46
EIM_EBx_B
WE42
EIM_DATAxx D(V1)
WE41 WE48
EIM_DTACK_B
WE47
Figure 22. DTACK Mode Write Access (DAP=0)

Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select

Determination by
Ref No. Parameter Synchronous measured Min Max Unit
parameters1

WE31 EIM_CSx_B valid to WE4 - WE6 - CSA2 — 3 - CSA ns

Address Valid
WE32 Address Invalid to WE7 - WE5 - CSN3 — 3 - CSN ns
EIM_CSx_B invalid

WE32A EIM_CSx_B valid to t4 + WE4 - WE7 + (ADVN5 + -3 + (ADVN + — ns

(muxed A/D Address Invalid ADVA6 + 1 - CSA) ADVA + 1 - CSA)

WE33 EIM_CSx_B Valid to WE8 - WE6 + (WEA - WCSA) — 3 + (WEA - WCSA) ns

EIM_WE_B Valid

WE34 EIM_WE_B Invalid to WE7 - WE9 + (WEN - WCSN) — 3 - (WEN_WCSN) ns

EIM_CSx_B Invalid

WE35 EIM_CSx_B Valid to WE10 - WE6 + (OEA - RCSA) — 3 + (OEA - RCSA) ns

EIM_OE_B Valid

WE35A EIM_CSx_B Valid to WE10 - WE6 + (OEA + RADVN -3 + (OEA + 3 + (OEA + ns

(muxed A/D) EIM_OE_B Valid + RADVA + ADH + 1 - RCSA) RADVN+RADVA+ RADVN+RADVA+ADH
ADH+1-RCSA) +1-RCSA)

WE36 EIM_OE_B Invalid to WE7 - WE11 + (OEN - RCSN) — 3 - (OEN - RCSN) ns

EIM_CSx_B Invalid

WE37 EIM_CSx_B Valid to WE12 - WE6 + (RBEA - RCSA) — 3 + (RBEA - RCSA) ns

EIM_EBx_B Valid
(Read access)

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Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)

Determination by
Ref No. Parameter Synchronous measured Min Max Unit
parameters1

WE38 EIM_EBx_B Invalid to WE7 - WE13 + (RBEN - RCSN) — 3 - (RBEN- RCSN) ns

EIM_CSx_B Invalid (Read
access)

WE39 EIM_CSx_B Valid to WE14 - WE6 + (ADVA - CSA) — 3 + (ADVA - CSA) ns

EIM_LBA_B Valid

WE40 EIM_LBA_B Invalid to WE7 - WE15 - CSN — 3 - CSN ns

EIM_CSx_B Invalid (ADVL is
asserted)

WE40A EIM_CSx_B Valid to WE14 - WE6 + (ADVN + ADVA + -3 + (ADVN + 3 + (ADVN + ADVA + 1 ns
(muxed A/D) EIM_LBA_B Invalid 1 - CSA) ADVA + 1 - CSA) - CSA)

WE41 EIM_CSx_B Valid to Output WE16 - WE6 - WCSA — 3 - WCSA ns

Data Valid

WE41A EIM_CSx_B Valid to Output WE16 - WE6 + (WADVN + — 3 + (WADVN + WADVA ns

(muxed A/D) Data Valid WADVA + ADH + 1 - WCSA) + ADH + 1 - WCSA)

WE42 Output Data Invalid to WE17 - WE7 - CSN — 3 - CSN ns

EIM_CSx_B Invalid

MAXCO Output maximum delay from 10 — — ns

internal driving
EIM_ADDRxx/control FFs to
chip outputs

MAXCSO Output maximum delay from 10 — — ns

CSx internal driving FFs to CSx
out

MAXDI EIM_DATAxx maximum delay 5 — — ns

from chip input data to its
internal FF

WE43 Input Data Valid to EIM_CSx_B MAXCO - MAXCSO + MAXDI MAXCO - — ns

Invalid MAXCSO +
MAXDI

WE44 EIM_CSx_B Invalid to Input 0 0 — ns

Data invalid

WE45 EIM_CSx_B Valid to WE12 - WE6 + (WBEA - WCSA) — 3 + (WBEA - WCSA) ns

EIM_EBx_B Valid (Write
access)

WE46 EIM_EBx_B Invalid to WE7 - WE13 + (WBEN - WCSN) — -3 + (WBEN - WCSN) ns

EIM_CSx_B Invalid (Write
access)

MAXDTI MAXIMUM delay from 10 — — —

EIM_DTACK_B to its internal FF
+ 2 cycles for synchronization

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Table 39. EIM Asynchronous Timing Parameters Table Relative Chip to Select (continued)

Determination by
Ref No. Parameter Synchronous measured Min Max Unit
parameters1

WE47 EIM_DTACK_B Active to MAXCO - MAXCSO + MAXDTI MAXCO - — ns

EIM_CSx_B Invalid MAXCSO +
MAXDTI

WE48 EIM_CSx_B Invalid to 0 0 — ns

EIM_DTACK_B Invalid
1
For more information on configuration parameters mentioned in this table, see the i.MX 6Solo/6DualLite reference manual.
2
In this table, CSA means WCSA when write operation or RCSA when read operation.
3
In this table, CSN means WCSN when write operation or RCSN when read operation.
4
t is ACLK_EIM_SLOW_CLK_ROOT cycle time.
5
In this table, ADVN means WADVN when write operation or RADVN when read operation.
6
In this table, ADVA means WADVA when write operation or RADVA when read operation.

4.9.4 Multi-Mode DDR Controller (MMDC)

The Multi-Mode DDR Controller is a dedicated interface to DDR3/DDR3L/LPDDR2 SDRAM.

4.9.4.1 MMDC Compatibility with JEDEC-compliant SDRAMs

The i.MX 6Solo/6DualLite MMDC supports the following memory types:
• LPDDR2 SDRAM compliant to JESD209-2B LPDDR2 JEDEC standard release June, 2009
• DDR3/DDR3L SDRAM compliant to JESD79-3D DDR3 JEDEC standard release April, 2008
MMDC operation with the standards stated above is contingent upon the board DDR design adherence to
the DDR design and layout requirements stated in the Hardware Development Guide for i.MX 6Quad,
6Dual, 6DualLite, 6Solo Families of Applications Processors (IMX6DQ6SDLHDG).

4.9.4.2 MMDC Supported DDR3/DDR3L/LPDDR2 Configurations

Table 40 and Table 41 show the supported DDR3/DDR3L/LPDDR2 configurations.
Table 40. i.MX 6Solo Supported DDR3/DDR3L/LPDDR2 Configurations

Parameter LPDDR2 DDR3 DDR3L

Clock frequency 400 MHz 400 MHz 400 MHz

Bus width 16/32-bit 16/32-bit 16/32-bit

Channel Single Single Single

Chip selects 2 2 2

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Table 41. i.MX 6DualLite Supported DDR3/DDR3L/LPDDR2 Configurations

LPDDR2 LPDDR2
Parameter DDR3 DDR3L
(Dual channel) (Single channel)

Clock frequency 400 MHz 400 MHz 400 MHz 400 MHz

Bus width 32-bit per channel 16/32-bit 16/32/64-bit 16/32/64-bit

Channel Dual Single Single Single

Chip selects 2 per channel 2 2 2

4.10 General-Purpose Media Interface (GPMI) Timing

The i.MX 6Solo/6DualLite GPMI controller is a flexible interface NAND Flash controller with 8-bit data
width, up to 200 MB/s I/O speed and individual chip select.
It supports Asynchronous timing mode, Source Synchronous timing mode and Samsung Toggle timing
mode separately described in the following subsections.

4.10.1 Asynchronous Mode AC Timing (ONFI 1.0 Compatible)

Asynchronous mode AC timings are provided as multiplications of the clock cycle and fixed delay. The
maximum I/O speed of GPMI in asynchronous mode is about 50 MB/s. Figure 23 through Figure 26
depicts the relative timing between GPMI signals at the module level for different operations under
asynchronous mode. Table 42 describes the timing parameters (NF1–NF17) that are shown in the figures.

.!.$?#,% NF1 NF2

NF3 NF4
.!.$?#%?"

.!.$?7%?" NF5

.!.$?!,% NF6 NF7

NF8 NF9
.!.$?$!4!XX Command

Figure 23. Command Latch Cycle Timing Diagram

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Electrical Characteristics

NF1
.!.$?#,%

NF3
.!.$?#%?"
NF10
.!.$?7%?" NF5 NF11

.!.$?!,% NF6 NF7

NF8 NF9
NAND_DATAxx Address

Figure 24. Address Latch Cycle Timing Diagram

.!.$?#,% NF1

.!.$?#%?" NF3
NF10
.!.$?7%?" NF5 NF11

.!.$?!,% NF6 NF7

NF8 NF9
.!.$?$!4!XX Data to NF

Figure 25. Write Data Latch Cycle Timing Diagram

.!.$?#,%

.!.$?#%?"
NF14
.!.$?2%?" NF13 NF15

.!.$?2%!$9?" NF12
NF16 NF17

.!.$?$!4!XX Data from NF

Figure 26. Read Data Latch Cycle Timing Diagram (Non-EDO Mode)

.!.$?#,%

.!.$?#%?"
NF14

.!.$?2%?" NF13 NF15

.!.$?2%!$9?" NF12 NF17

NF16
NAND_DATAxx Data from NF

Figure 27. Read Data Latch Cycle Timing Diagram (EDO Mode)

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 Electrical Characteristics

Table 42. Asynchronous Mode Timing Parameters1

Timing
T = GPMI Clock Cycle
ID Parameter Symbol Unit
Min Max

NF1 NAND_CLE setup time tCLS (AS + DS) × T - 0.12 [see 2,3] ns
2
NF2 NAND_CLE hold time tCLH DH × T - 0.72 [see ] ns
3,2
NF3 NAND_CE0_B setup time tCS (AS + DS + 1) × T [see ] ns
2
NF4 NAND_CE0_B hold time tCH (DH+1) × T - 1 [see ] ns
NF5 NAND_WE_B pulse width tWP DS × T [see ] 2
ns
3,2
NF6 NAND_ALE setup time tALS (AS + DS) × T - 0.49 [see ] ns
2
NF7 NAND_ALE hold time tALH (DH × T - 0.42 [see ] ns
NF8 Data setup time tDS DS × T - 0.26 [see 2]
ns
2]
NF9 Data hold time tDH DH × T - 1.37 [see ns
NF10 Write cycle time tWC (DS + DH) × T [see 2] ns
NF11 NAND_WE_B hold time tWH DH × T [see 2]
ns
NF12 Ready to NAND_RE_B low tRR4 (AS + 2) × T [see 3,2]
— ns
NF13 NAND_RE_B pulse width tRP DS × T [see 2] ns
NF14 READ cycle time tRC (DS + DH) × T [see 2]
ns
2]
NF15 NAND_RE_B high hold time tREH DH × T [see ns
NF16 Data setup on read tDSR — (DS × T -0.67)/18.38 [see 5,6]
ns
5,6]
NF17 Data hold on read tDHR 0.82/11.83 [see — ns
1
GPMI’s Async Mode output timing can be controlled by the module’s internal registers
HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.
This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.
2 AS minimum value can be 0, while DS/DH minimum value is 1.
3
T = GPMI clock period -0.075ns (half of maximum p-p jitter).
4
NF12 is guaranteed by the design.
5 Non-EDO mode.
6
EDO mode, GPMI clock ≈ 100 MHz
(AS=DS=DH=1, GPMI_CTL1 [RDN_DELAY] = 8, GPMI_CTL1 [HALF_PERIOD] = 0).

In EDO mode (Figure 26), NF16/NF17 are different from the definition in non-EDO mode (Figure 25).
They are called tREA/tRHOH (RE# access time/RE# HIGH to output hold). The typical value for them
are 16 ns (max for tREA)/15 ns (min for tRHOH) at 50 MB/s EDO mode. In EDO mode, GPMI will
sample NAND_DATAxx at rising edge of delayed NAND_RE_B provided by an internal DPLL. The delay
value can be controlled by GPMI_CTRL1.RDN_DELAY (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). The typical value of this control register is 0x8 at 50 MT/s EDO mode.
But if the board delay is big enough and cannot be ignored, the delay value should be made larger to
compensate the board delay.

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NXP Semiconductors 63
Electrical Characteristics

4.10.2 Source Synchronous Mode AC Timing (ONFI 2.x Compatible)

Figure 28 to Figure 30 show the write and read timing of Source Synchronous Mode.
NF19
NF18
.!.$?#%?"

NF23
NAND_CLE
NF25 NF26

NF24
NAND_ALE
NF25 NF26

NAND_WE/RE_B

NF22

NAND_CLK

NAND_DQS

NAND_DQS
Output enable

NF20 NF20

NF21 NF21

NAND_DATA[7:0] CMD ADD

NAND_DATA[7:0]
Output enable

Figure 28. Source Synchronous Mode Command and Address Timing Diagram

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 Electrical Characteristics

NF19
NF18
.!.$?#%?"

NF23 NF24
.!.$?#,% NF25 NF26

NF23 NF24
.!.$?!,% NF25 NF26

NAND_WE/RE_B

NF22

.!.$?#,+

NF27

.!.$?$13 NF27

.!.$?$13
Output enable

NF29 NF29

.!.$?$1;=

NF28 NF28

.!.$?$1;=
Output enable

Figure 29. Source Synchronous Mode Data Write Timing Diagram

NF18
.!.$?#%?" NF19

NF23 NF24
.!.$?#,% NF25 NF26

NF23 NF24
NAND_ALE NF25 NF26

.!.$?7%2% NF25
NF25

NF22
NF26

.!.$?#,+

.!.$?$13

.!.$?$13
/UTPUT ENABLE

.!.$?$!4!;=

.!.$?$!4!;=
/UTPUT ENABLE

Figure 30. Source Synchronous Mode Data Read Timing Diagram

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Electrical Characteristics

.!.$?$13

NF30

.!.$?$!4!;= D0 D1 D2 D3

NF30 NF31 NF31

Figure 31. NAND_DQS/NAND_DQ Read Valid Window

Table 43. Source Synchronous Mode Timing Parameters1

Timing
T = GPMI Clock Cycle
ID Parameter Symbol Unit
Min Max
NF18 NAND_CE0_B access time tCE CE_DELAY × T - 0.79 [see 2] ns
NF19 NAND_CE0_B hold time tCH 0.5 × tCK - 0.63 [see 2] ns
NF20 Command/address NAND_DATAxx setup time tCAS 0.5 × tCK - 0.05 ns
NF21 Command/address NAND_DATAxx hold time tCAH 0.5 × tCK - 1.23 ns
NF22 clock period tCK — ns
NF23 preamble delay tPRE PRE_DELAY × T - 0.29 [see 2] ns
NF24 postamble delay tPOST POST_DELAY × T - 0.78 [see 2] ns
NF25 NAND_CLE and NAND_ALE setup time tCALS 0.5 × tCK - 0.86 ns
NF26 NAND_CLE and NAND_ALE hold time tCALH 0.5 × tCK - 0.37 ns
NF27 NAND_CLK to first NAND_DQS latching transition tDQSS T - 0.41 [see 2] ns
NF28 Data write setup — 0.25 × tCK - 0.35
NF29 Data write hold — 0.25 × tCK - 0.85
NF30 NAND_DQS/NAND_DQ read setup skew — — 2.06
NF31 NAND_DQS/NAND_DQ read hold skew — — 1.95
1
GPMI’s source synchronous mode output timing can be controlled by the module’s internal registers
GPMI_TIMING2_CE_DELAY, GPMI_TIMING_PREAMBLE_DELAY, GPMI_TIMING2_POST_DELAY. This AC timing depends
on these registers settings. In the table, CE_DELAY/PRE_DELAY/POST_DELAY represents each of these settings.
2
T = tCK(GPMI clock period) -0.075ns (half of maximum p-p jitter).

For DDR Source sync mode, Figure 31 shows the timing diagram of NAND_DQS/NAND_DATAxx read
valid window. The typical value of tDQSQ is 0.85ns (max) and 1ns (max) for tQHS at 200MB/s. GPMI
will sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which
can be provided by an internal DPLL. The delay value can be controlled by GPMI register
GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). Generally, the typical delay value of this register is equal to 0x7 which
means 1/4 clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay
value should be made larger to compensate the board delay.

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 Electrical Characteristics

4.10.3 Samsung Toggle Mode AC Timing

4.10.3.1 Command and Address Timing

NOTE
Samsung Toggle Mode command and address timing is the same as ONFI
1.0 compatible Async mode AC timing. See Section 4.10.1, “Asynchronous
Mode AC Timing (ONFI 1.0 Compatible),” for details.

4.10.3.2 Read and Write Timing

DEV?CLK

.!.$?#%X?" 


.!.$?#,%

.!.$?!,% 

.!.$?7%?" 


.!.$?2%?"
.& .&

.!.$?$13  T#+

 T#+
.!.$?$!4!;=

Figure 32. Samsung Toggle Mode Data Write Timing

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Electrical Characteristics

DEV?CLK

.!.$?#%X?"

.& 

.!.$?#,%

.!.$?!,%

  T #+
.!.$?7%?" .&  T #+

.!.$?2%?" .& 

 T #+
 T #+
 T #+

.!.$?$13

.!.$?$!4!;=

Figure 33. Samsung Toggle Mode Data Read Timing

Table 44. Samsung Toggle Mode Timing Parameters1

Timing
T = GPMI Clock Cycle
ID Parameter Symbol Unit
Min Max

NF1 NAND_CLE setup time tCLS (AS + DS) × T - 0.12 [see 2,3]
NF2 NAND_CLE hold time tCLH DH × T - 0.72 [see 2]
NF3 NAND_CE0_B setup time tCS (AS + DS) × T - 0.58 [see 3,2]
NF4 NAND_CE0_B hold time tCH DH × T - 1 [see 2]
NF5 NAND_WE_B pulse width tWP DS × T [see 2]
NF6 NAND_ALE setup time tALS (AS + DS) × T - 0.49 [see 3,2]
NF7 NAND_ALE hold time tALH DH × T - 0.42 [see 2]
NF8 Command/address NAND_DATAxx setup time tCAS DS × T - 0.26 [see 2]
NF9 Command/address NAND_DATAxx hold time tCAH DH × T - 1.37 [see 2]
NF18 NAND_CEx_B access time tCE CE_DELAY × T [see 4,2] — ns
NF22 clock period tCK — — ns
NF23 preamble delay tPRE PRE_DELAY × T [see 5,2] — ns
NF24 postamble delay tPOST POST_DELAY × T +0.43 [see 2]
— ns

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 Electrical Characteristics

Table 44. Samsung Toggle Mode Timing Parameters1 (continued)

Timing
T = GPMI Clock Cycle
ID Parameter Symbol Unit
Min Max
6
NF28 Data write setup tDS 0.25 × tCK - 0.32 — ns
NF29 Data write hold tDH6 0.25 × tCK - 0.79 — ns
NF30 NAND_DQS/NAND_DQ read setup skew tDQSQ7 — 3.18
NF31 NAND_DQS/NAND_DQ read hold skew tQHS7 — 3.27
1
The GPMI toggle mode output timing can be controlled by the module’s internal registers
HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.
This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.
2
AS minimum value can be 0, while DS/DH minimum value is 1.
3
T = tCK (GPMI clock period) -0.075ns (half of maximum p-p jitter).
4
CE_DELAY represents HW_GPMI_TIMING2[CE_DELAY]. NF18 is guaranteed by the design. Read/Write operation is started
with enough time of ALE/CLE assertion to low level.
5
PRE_DELAY+1) ≥ (AS+DS).
6 Shown in Figure 32, Samsung Toggle Mode Data Write Timing diagram.
7
Shown in Figure 31, NAND_DQS/NAND_DQ Read Valid Window.

For DDR Toggle mode, Figure 31 shows the timing diagram of NAND_DQS/NAND_DATAxx read valid
window. The typical value of tDQSQ is 1.4 ns (max) and 1.4 ns (max) for tQHS at 133 MB/s. GPMI will
sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which is
provided by an internal DPLL. The delay value of this register can be controlled by GPMI register
GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX
6Solo/6DualLite reference manual). Generally, the typical delay value is equal to 0x7 which means 1/4
clock cycle delay expected. But if the board delay is big enough and cannot be ignored, the delay value
should be made larger to compensate the board delay.

4.11 External Peripheral Interface Parameters

The following subsections provide information on external peripheral interfaces.

4.11.1 AUDMUX Timing Parameters

The AUDMUX provides a programmable interconnect logic for voice, audio, and data routing between
internal serial interfaces (SSIs) and external serial interfaces (audio and voice codecs). The AC timing of
AUDMUX external pins is governed by the SSI module. For more information, see the respective SSI
electrical specifications found within this document.

4.11.2 ECSPI Timing Parameters

This section describes the timing parameters of the ECSPI blocks. The ECSPI have separate timing
parameters for master and slave modes.

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Electrical Characteristics

4.11.2.1 ECSPI Master Mode Timing

Figure 34 depicts the timing of ECSPI in master mode. Table 45 lists the ECSPI master mode timing
characteristics.

ECSPIx_RDY_B

ECSPIx_SS_B CS10 CS5

CS3 CS2 CS6
CS1
CS4
ECSPIx_SCLK
CS2
CS7 CS3

ECSPIx_MOSI

CS9
CS8
ECSPIx_MISO

Note: ECSPIx_MOSI is always driven (not tri-stated) between actual data transmissions. This limits the ECSPI to be
connected between a single master and a single slave.
Figure 34. ECSPI Master Mode Timing Diagram

Table 45. ECSPI Master Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read tclk 43 — ns

ECSPIx_SCLK Cycle Time–Write 15

CS2 ECSPIx_SCLK High or Low Time–Read tSW 21.5 — ns

ECSPIx_SCLK High or Low Time–Write 7

CS3 ECSPIx_SCLK Rise or Fall1 tRISE/FALL — — ns

CS4 ECSPIx_SS_B pulse width tCSLH Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) tSCS Half ECSPIx_SCLK period - 4 — ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) tHCS Half ECSPIx_SCLK period - 2 — ns

CS7 ECSPIx_MOSI Propagation Delay (CLOAD = 20 pF) tPDmosi -1 1 ns

CS8 ECSPIx_MISO Setup Time tSmiso 18 — ns

•
CS9 ECSPIx_MISO Hold Time tHmiso 0 — ns

CS10 RDY to ECSPIx_SS_B Time2 tSDRY 5 — ns

1 See specific I/O AC parameters Section 4.7, “I/O AC Parameters.”
2
SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

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 Electrical Characteristics

4.11.2.2 ECSPI Slave Mode Timing

Figure 35 depicts the timing of ECSPI in slave mode. Table 46 lists the ECSPI slave mode timing
characteristics.

ECSPIx_SS_B CS5
CS1 CS2 CS6
CS4
ECSPIx_SCLK
CS2
CS9
ECSPIx_MISO

CS7 CS8
ECSPIx_MOSI

Note: ECSPIx_MISO is always driven (not tri-stated) between actual data transmissions. This limits the ECSPI to be con-
nected between a single master and a single slave.
Figure 35. ECSPI Slave Mode Timing Diagram

Table 46. ECSPI Slave Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read tclk 43 — ns

ECSPIx_SCLK Cycle Time–Write 15

CS2 ECSPIx_SCLK High or Low Time–Read tSW 21.5 — ns

ECSPIx_SCLK High or Low Time–Write 7

CS4 ECSPIx_SS_B pulse width tCSLH Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) tSCS 5 — ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) tHCS 5 — ns

CS7 ECSPIx_MOSI Setup Time tSmosi 4 — ns

CS8 ECSPIx_MOSI Hold Time tHmosi 4 — ns

CS9 ECSPIx_MISO Propagation Delay (CLOAD = 20 pF) tPDmiso 4 19 ns

•

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Electrical Characteristics

4.11.3 Enhanced Serial Audio Interface (ESAI) Timing Parameters

The ESAI consists of independent transmitter and receiver sections, each section with its own clock
generator. Table 47 shows the interface timing values. The number field in the table refers to timing
signals found in Figure 36 and Figure 37.
Table 47. Enhanced Serial Audio Interface (ESAI) Timing Parameters

No. Characteristics1,2 Symbol Expression2 Min Max Condition3 Unit

62 Clock cycle4 tSSICC 4 × Tc 30.0 — i ck ns

4 × Tc 30.0 — i ck

63 Clock high period: ns

• For internal clock — 2 × Tc − 9.0 6 — —
• For external clock — 2 × Tc 15 — —

64 Clock low period: ns

• For internal clock — 2 × Tc − 9.0 6 — —
• For external clock — 2 × Tc 15 — —

65 ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) high — — — 17.0 x ck ns

— — — 7.0 i ck a

66 ESAI_RX_CLK rising edge to ESAI_RX_FS out (bl) low — — — 17.0 x ck ns

— — — 7.0 i ck a

67 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr) — — — 19.0 x ck ns

high5 — — — 9.0 i ck a

68 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wr) low5 — — — 19.0 x ck ns

— — — 9.0 i ck a

69 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) high — — — 16.0 x ck ns

— — — 6.0 i ck a

70 ESAI_RX_CLK rising edge to ESAI_RX_FS out (wl) low — — — 17.0 x ck ns

— — — 7.0 i ck a

71 Data in setup time before ESAI_RX_CLK (SCK in — — 12.0 — x ck ns

synchronous mode) falling edge — — 19.0 — i ck

72 Data in hold time after ESAI_RX_CLK falling edge — — 3.5 — x ck ns

— — 9.0 — i ck

73 ESAI_RX_FS input (bl, wr) high before ESAI_RX_CLK — — 2.0 — x ck ns

falling edge5 — — 12.0 — i ck a

74 ESAI_RX_FS input (wl) high before ESAI_RX_CLK — — 2.0 — x ck ns

falling edge — — 12.0 — i ck a

75 ESAI_RX_FS input hold time after ESAI_RX_CLK falling — — 2.5 — x ck ns

edge — — 8.5 — i ck a

78 ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) high — — — 18.0 x ck ns

— — — 8.0 i ck

79 ESAI_TX_CLK rising edge to ESAI_TX_FS out (bl) low — — — 20.0 x ck ns

— — — 10.0 i ck

80 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr) — — — 20.0 x ck ns

high5 — — — 10.0 i ck

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 Electrical Characteristics

Table 47. Enhanced Serial Audio Interface (ESAI) Timing Parameters (continued)

No. Characteristics1,2 Symbol Expression2 Min Max Condition3 Unit

81 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wr) low5 — — — 22.0 x ck ns

— — — 12.0 i ck

82 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) high — — — 19.0 x ck ns

— — — 9.0 i ck

83 ESAI_TX_CLK rising edge to ESAI_TX_FS out (wl) low — — — 20.0 x ck ns

— — — 10.0 i ck

84 ESAI_TX_CLK rising edge to data out enable from high — — — 22.0 x ck ns

impedance — — — 17.0 i ck

86 ESAI_TX_CLK rising edge to data out valid — — — 18.0 x ck ns

— — — 13.0 i ck

87 ESAI_TX_CLK rising edge to data out high impedance 67 — — — 21.0 x ck ns

— — — 16.0 i ck

89 ESAI_TX_FS input (bl, wr) setup time before — — 2.0 — x ck ns

ESAI_TX_CLK falling edge5 — — 18.0 — i ck

90 ESAI_TX_FS input (wl) setup time before ESAI_TX_CLK — — 2.0 — x ck ns

falling edge — — 18.0 — i ck

91 ESAI_TX_FS input hold time after ESAI_TX_CLK falling — — 4.0 — x ck ns

edge — — 5.0 — i ck

95 ESAI_RX_HF_CLK/ESAI_TX_HF_CLK clock cycle — 2 x TC 15 — — ns

96 ESAI_TX_HF_CLK input rising edge to ESAI_TX_CLK — — — 18.0 — ns

output

97 ESAI_RX_HF_CLK input rising edge to ESAI_RX_CLK — — — 18.0 — ns

output
1
i ck = internal clock
x ck = external clock
i ck a = internal clock, asynchronous mode
(asynchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are two different clocks)
i ck s = internal clock, synchronous mode
(synchronous implies that ESAI_TX_CLK and ESAI_RX_CLK are the same clock)
2
bl = bit length
wl = word length
wr = word length relative
3 ESAI_TX_CLK(SCKT pin) = transmit clock
ESAI_RX_CLK(SCKR pin) = receive clock
ESAI_TX_FS(FST pin) = transmit frame sync
ESAI_RX_FS(FSR pin) = receive frame sync
ESAI_TX_HF_CLK(HCKT pin) = transmit high frequency clock
ESAI_RX_HF_CLK(HCKR pin) = receive high frequency clock
4 For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
5 The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync
signal waveform, but it spreads from one serial clock before the first bit clock (like the bit length frame sync signal), until the
second-to-last bit clock of the first word in the frame.
6 Periodically sampled and not 100% tested.

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Electrical Characteristics

62
63 64
ESAI_TX_CLK
(Input/Output)

78 79

ESAI_TX_FS
(Bit)
Out 82 83

ESAI_TX_FS
(Word) 86 86
Out
84 87

First Bit Last Bit

Data Out

89

91

ESAI_TX_FS
(Bit) In
90 91

ESAI_TX_FS
(Word) In
Figure 36. ESAI Transmitter Timing

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 Electrical Characteristics

62

63

ESAI_RX_CLK 64
(Input/Output)

65 66
ESAI_RX_FS
(Bit)
Out
69 70
ESAI_RX_FS
(Word)
Out
72
71
Data In
First Bit Last Bit

73 75
ESAI_RX_FS
(Bit)
In
74 75
ESAI_RX_FS
(Word)
In
Figure 37. ESAI Receiver Timing

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Electrical Characteristics

4.11.4 Ultra High Speed SD/SDIO/MMC Host Interface (uSDHC) AC

Timing
This section describes the electrical information of the uSDHC, which includes SD/eMMC4.3 (Single
Data Rate) timing, eMMC4.4/4.41 (Dual Date Rate) timing and SDR104/50(SD3.0) timing.

4.11.4.1 SD/eMMC4.3 (Single Data Rate) AC Timing

Figure 38 depicts the timing of SD/eMMC4.3, and Table 48 lists the SD/eMMC4.3 timing characteristics.
SD4

SD2
SD1
SD5

SDx_CLK
SD3
SD6

Output from uSDHC to card

SDx_DATA[7:0]
SD7 SD8

Input from card to uSDHC

SDx_DATA[7:0]

Figure 38. SD/eMMC4.3 Timing

Table 48. SD/eMMC4.3 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (Low Speed) fPP1 0 400 kHz

Clock Frequency (SD/SDIO Full Speed/High Speed) fPP2 0 25/50 MHz

Clock Frequency (MMC Full Speed/High Speed) fPP3 0 20/52 MHz

Clock Frequency (Identification Mode) fOD 100 400 kHz

SD2 Clock Low Time tWL 7 — ns

SD3 Clock High Time tWH 7 — ns

SD4 Clock Rise Time tTLH — 3 ns

SD5 Clock Fall Time tTHL — 3 ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD6 uSDHC Output Delay tOD -6.6 3.6 ns

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 Electrical Characteristics

Table 48. SD/eMMC4.3 Interface Timing Specification (continued)

ID Parameter Symbols Min Max Unit

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD7 uSDHC Input Setup Time tISU 2.5 — ns

4
SD8 uSDHC Input Hold Time tIH 1.5 — ns
1
In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.
2
In normal (full) speed mode for SD/SDIO card, clock frequency can be any value between 0–25 MHz. In high-speed mode,
clock frequency can be any value between 0–50 MHz.
3
In normal (full) speed mode for MMC card, clock frequency can be any value between 0–20 MHz. In high-speed mode, clock
frequency can be any value between 0–52 MHz.
4
To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.

4.11.4.2 eMMC4.4/4.41 (Dual Data Rate) AC Timing

Figure 39 depicts the timing of eMMC4.4/4.41. Table 49 lists the eMMC4.4/4.41 timing characteristics.
Be aware that only DATA is sampled on both edges of the clock (not applicable to CMD).
SD1

SDx_CLK

SD2 SD2

Output from eSDHCv3 to card

......
SDx_DATA[7:0]
SD3 SD4

Input from card to eSDHCv3

SDx_DATA[7:0] ......

Figure 39. eMMC4.4/4.41 Timing

Table 49. eMMC4.4/4.41 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock1

SD1 Clock Frequency (eMMC4.4/4.41 DDR) fPP 0 52 MHz

SD1 Clock Frequency (SD3.0 DDR) fPP 0 50 MHz

uSDHC Output / Card Inputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD2 uSDHC Output Delay tOD 2.8 6.8 ns

uSDHC Input / Card Outputs SDx_CMD, SDx_DATAx (Reference to CLK)

SD3 uSDHC Input Setup Time tISU 1.7 — ns

SD4 uSDHC Input Hold Time tIH 1.5 — ns

1
1 Clock duty cycle will be in the range of 47% to 53%.

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4.11.4.3 SDR50/SDR104 AC Timing

Figure 40 depicts the timing of SDR50/SDR104, and Table 50 lists the SDR50/SDR104 timing
characteristics.

Figure 40. SDR50/SDR104 Timing

Table 50. SDR50/SDR104 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency Period tCLK 4.8 — ns

SD2 Clock Low Time tCL 0.46 × tCLK 0.54 × tCLK ns

SD3 Clock High Time tCH 0.46 × tCLK 0.54 × tCLK ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD4 uSDHC Output Delay tOD –3 1 ns

uSDHC Output/Card Inputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)

SD5 uSDHC Output Delay tOD –1.6 0.74 ns

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD6 uSDHC Input Setup Time tISU 2.5 — ns

SD7 uSDHC Input Hold Time tIH 1.5 — ns

uSDHC Input/Card Outputs SDx_CMD, SDx_DATAx in SDR104 (Reference to CLK)1

SD8 Card Output Data Window tODW 0.5 × tCLK — ns

1Data window in SDR100 mode is variable.

4.11.4.4 Bus Operation Condition for 3.3 V and 1.8 V Signaling

Signaling level of SD/eMMC4.3 and eMMC4.4/4.41 modes is 3.3 V. Signaling level of SDR104/SDR50
mode is 1.8 V. The DC parameters for the NVCC_SD1, NVCC_SD2 and NVCC_SD3 supplies are
identical to those shown in Table 22, "GPIO DC Parameters," on page 39.

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4.11.5 Ethernet Controller (ENET) AC Electrical Specifications

The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive
at timing specs/constraints for the physical interface.

4.11.5.1 ENET MII Mode Timing

This subsection describes MII receive, transmit, asynchronous inputs, and serial management signal
timings.

4.11.5.1.1 MII Receive Signal Timing (ENET_RX_DATA3,2,1,0, ENET_RX_EN,

ENET_RX_ER, and ENET_RX_CLK)
The receiver functions correctly up to an ENET_RX_CLK maximum frequency of 25 MHz + 1%. There
is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the
ENET_RX_CLK frequency.
Figure 41 shows MII receive signal timings. Table 51 describes the timing parameters (M1–M4) shown in
the figure.

M3

ENET_RX_CLK (input)

M4
ENET_RX_DATA3,2,1,0
(inputs)
ENET_RX_EN
ENET_RX_ER
M1 M2
Figure 41. MII Receive Signal Timing Diagram

Table 51. MII Receive Signal Timing

ID Characteristic1 Min Max Unit

M1 ENET_RX_DATA3,2,1,0, ENET_RX_EN, ENET_RX_ER to 5 — ns
ENET_RX_CLK setup
M2 ENET_RX_CLK to ENET_RX_DATA3,2,1,0, ENET_RX_EN, 5 — ns
ENET_RX_ER hold
M3 ENET_RX_CLK pulse width high 35% 65% ENET_RX_CLK period
M4 ENET_RX_CLK pulse width low 35% 65% ENET_RX_CLK period
1
ENET_RX_EN, ENET_RX_CLK, and ENET0_RXD0 have the same timing in 10 Mbps 7-wire interface mode.

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4.11.5.1.2 MII Transmit Signal Timing (ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER, and ENET_TX_CLK)
The transmitter functions correctly up to an ENET_TX_CLK maximum frequency of 25 MHz + 1%.
There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed
twice the ENET_TX_CLK frequency.
Figure 42 shows MII transmit signal timings. Table 52 describes the timing parameters (M5–M8) shown
in the figure.

M7

ENET_TX_CLK (input)

M5
M8
ENET_TX_DATA3,2,1,0
(outputs)
ENET_TX_EN
ENET_TX_ER
M6

Figure 42. MII Transmit Signal Timing Diagram

Table 52. MII Transmit Signal Timing

ID Characteristic1 Min Max Unit

M5 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN, 5 — ns

ENET_TX_ER invalid
M6 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN, — 20 ns
ENET_TX_ER valid
M7 ENET_TX_CLK pulse width high 35% 65% ENET_TX_CLK period
M8 ENET_TX_CLK pulse width low 35% 65% ENET_TX_CLK period

1 ENET_TX_EN, ENET_TX_CLK, and ENET0_TXD0 have the same timing in 10-Mbps 7-wire interface mode.

4.11.5.1.3 MII Asynchronous Inputs Signal Timing (ENET_CRS and ENET_COL)

Figure 43 shows MII asynchronous input timings. Table 53 describes the timing parameter (M9) shown in
the figure.

ENET_CRS, ENET_COL

M9

Figure 43. MII Async Inputs Timing Diagram

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Table 53. MII Asynchronous Inputs Signal Timing

ID Characteristic Min Max Unit

1
M9 ENET_CRS to ENET_COL minimum pulse width 1.5 — ENET_TX_CLK period

1 ENET_COL has the same timing in 10-Mbit 7-wire interface mode.

4.11.5.1.4 MII Serial Management Channel Timing (ENET_MDIO and ENET_MDC)

The MDC frequency is designed to be equal to or less than 2.5 MHz to be compatible with the IEEE 802.3
MII specification. However the ENET can function correctly with a maximum MDC frequency of
15 MHz.
Figure 44 shows MII asynchronous input timings. Table 54 describes the timing parameters (M10–M15)
shown in the figure.

M14

M15
ENET_MDC (output)

M10

ENET_MDIO (output)

M11

ENET_MDIO (input)

M12 M13

Figure 44. MII Serial Management Channel Timing Diagram

Table 54. MII Serial Management Channel Timing

ID Characteristic Min Max Unit

M10 ENET_MDC falling edge to ENET_MDIO output invalid (min. 0 — ns

propagation delay)
M11 ENET_MDC falling edge to ENET_MDIO output valid (max. — 5 ns
propagation delay)
M12 ENET_MDIO (input) to ENET_MDC rising edge setup 18 — ns
M13 ENET_MDIO (input) to ENET_MDC rising edge hold 0 — ns
M14 ENET_MDC pulse width high 40% 60% ENET_MDC period
M15 ENET_MDC pulse width low 40% 60% ENET_MDC period

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4.11.5.2 RMII Mode Timing

In RMII mode, ENET_CLK is used as the REF_CLK, which is a 50 MHz ± 50 ppm continuous reference
clock. ENET_RX_EN is used as the ENET_RX_EN in RMII. Other signals under RMII mode include
ENET_TX_EN, ENET_TX_DATA[1:0], ENET_RX_DATA[1:0] and ENET_RX_ER.
Figure 45 shows RMII mode timings. Table 55 describes the timing parameters (M16–M21) shown in the
figure.

M16

M17
ENET_CLK (input)

M18

ENET_TX_DATA (output)
ENET_TX_EN

M19

ENET_RX_EN (input)
ENET_RX_DATA[1:0]
ENET_RX_ER
M20 M21

Figure 45. RMII Mode Signal Timing Diagram

Table 55. RMII Signal Timing

ID Characteristic Min Max Unit

M16 ENET_CLK pulse width high 35% 65% ENET_CLK period

M17 ENET_CLK pulse width low 35% 65% ENET_CLK period
M18 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA invalid 4 — ns
M19 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA valid — 15 ns
M20 ENET_RX_DATAD[1:0], ENET_RX_EN(ENET_RX_EN), ENET_RX_ER to 4 — ns
ENET_CLK setup
M21 ENET_CLK to ENET_RX_DATAD[1:0], ENET_RX_EN, ENET_RX_ER hold 2 — ns

4.11.5.3 Signal Switching Specifications

The following timing specifications meet the requirements for RGMII interfaces for a range of transceiver
devices.

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 Electrical Characteristics

Table 56. RGMII Signal Switching Specifications1

Symbol Description Min Max Unit

2
Tcyc Clock cycle duration 7.2 8.8 ns
TskewT3 Data to clock output skew at transmitter -500 500 ps
3
TskewR Data to clock input skew at receiver 1 2.6 ns
Duty_G4 Duty cycle for Gigabit 45 55 %
Duty_T4 Duty cycle for 10/100T 40 60 %
Tr/Tf Rise/fall time (20–80%) — 0.75 ns
1
The timings assume the following configuration:
DDR_SEL = (11)b
DSE (drive-strength) = (111)b
2
For 10 Mbps and 100 Mbps, Tcyc will scale to 400 ns ±40 ns and 40 ns ±4 ns respectively.
3 For all versions of RGMII prior to 2.0; This implies that PC board design will require clocks to be routed such that an additional

trace delay of greater than 1.5 ns and less than 2.0 ns will be added to the associated clock signal. For 10/100, the Max value
is unspecified.
4 Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domain as long

as minimum duty cycle is not violated and stretching occurs for no more than three Tcyc of the lowest speed transitioned
between.

2'-))?48# AT TRANSMITTER

4SKEW4

2'-))?48$N N   TO 

2'-))?48?#4, 48%. 48%22

4SKEW2

2'-))?48# AT RECEIVER

Figure 46. RGMII Transmit Signal Timing Diagram Original

2'-))?28# AT TRANSMITTER

4SKEW4

2'-))?28$N N   TO 

2'-))?28?#4, 28$6 28%22

4SKEW2

2'-))?28# AT RECEIVER

Figure 47. RGMII Receive Signal Timing Diagram Original

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Electrical Characteristics

)NTERNAL DELAY
2'-))?28# SOURCE OF DATA

4SETUP 4 4 HOLD 4

2'-))?28$N N   TO 

2'-))?28?#4, 28$6 28%22

4 SETUP 2 4 HOLD 2

2'-))?28# AT RECEIVER

Figure 48. RGMII Receive Signal Timing Diagram with Internal Delay

4.11.6 Flexible Controller Area Network (FLEXCAN) AC Electrical

Specifications
The Flexible Controller Area Network (FlexCAN) module is a communication controller implementing
the CAN protocol according to the CAN 2.0B protocol specification. The processor has two CAN modules
available for systems design. Tx and Rx ports for both modules are multiplexed with other I/O pins. See
the IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM) to see which pins
expose Tx and Rx pins; these ports are named FLEXCAN_TX and FLEXCAN_RX, respectively.

4.11.7 HDMI Module Timing Parameters

4.11.7.1 Latencies and Timing Information

Power-up time (time between TX_PWRON assertion and TX_READY assertion) for the HDMI 3D Tx
PHY while operating with the slowest input reference clock supported (13.5 MHz) is 3.35 ms.
Power-up time for the HDMI 3D Tx PHY while operating with the fastest input reference clock supported
(340 MHz) is 133 μs.

4.11.7.2 Electrical Characteristics

The table below provides electrical characteristics for the HDMI 3D Tx PHY. The following three figures
illustrate various definitions and measurement conditions specified in the table below.

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 Electrical Characteristics

Figure 49. Driver Measuring Conditions

Figure 50. Driver Definitions

($-)?48?$!4!;=?0
2 4%2-

($-)?48?#,+?0
2 4%2-

($-)?48?$!4!;=?.
($-)?48?#,+?.

Figure 51. Source Termination

Table 57. Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

Operating conditions for HDMI

avddtmds Termination supply voltage — 3.15 3.3 3.45 V

RT Termination resistance — 45 50 55 Ω

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Table 57. Electrical Characteristics (continued)

Symbol Parameter Condition Min Typ Max Unit

TMDS drivers DC specifications

VOFF Single-ended standby voltage RT = 50 Ω avddtmds ± 10 mV mV

For measurement conditions
VSWING Single-ended output swing and definitions, see the first 400 — 600 mV
voltage two figures above.
Compliance point TP1 as
defined in the HDMI
specification, version 1.3a,
section 4.2.4.
VH Single-ended output high If attached sink supports avddtmds ± 10 mV mV
voltage TMDSCLK < or = 165 MHz
For definition, see the second
figure above If attached sink supports avddtmds — avddtmds mV
TMDSCLK > 165 MHz - 200 mV + 10 mV
VL Single-ended output low If attached sink supports avddtmds — avddtmds mV
voltage TMDSCLK < or = 165 MHz - 600 mV - 400mV
For definition, see the second
figure above If attached sink supports avddtmds — avddtmds mV
TMDSCLK > 165 MHz - 700 mV - 400 mV
RTERM Differential source termination — 50 — 200 Ω
load (inside HDMI 3D Tx PHY)
Although the HDMI 3D Tx
PHY includes differential
source termination, the
user-defined value is set for
each single line (for
illustration, see Figure 51).
Note: RTERM can also be
configured to be open and not
present on TMDS channels.

Hot plug detect specifications

HPDVH Hot plug detect high range — 2.0 — 5.3 V

VHPD
VL Hot plug detect low range — 0 — 0.8 V
HPD
Z Hot plug detect input — 10 — — kΩ
impedance
HPD Hot plug detect time delay — — — 100 µs
t

4.11.8 Switching Characteristics

Table 58 describes switching characteristics for the HDMI 3D Tx PHY. Figure 52 to Figure 56 illustrate
various parameters specified in table.
NOTE
All dynamic parameters related to the TMDS line drivers’ performance
imply the use of assembly guidelines.

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 Electrical Characteristics

0PHDMI_TX_CLK



T#0, T#0(

Figure 52. TMDS Clock Signal Definitions

Figure 53. Eye Diagram Mask Definition for HDMI Driver Signal Specification at TP1

4-$3$!4!0


AVDDTMDS  637).' TYP

4-$3$!4!.
T 3+ P )NTRA PAIR SKEW

Figure 54. Intra-Pair Skew Definition

0REVIOUS CYCLE ;N = #URRENT CYCLE ;N=

4-$3$!4!;= B;N = B;N = B;N = B;N= B;N=

4-$3$!4!;= B;N = B;N = B;N = B;N= B;N=

4-$3$!4!;= B;N = B;N = B;N = B;N= B;N=

T 3+ PP )NTER PAIR SKEW

Figure 55. Inter-Pair Skew Definition

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Electrical Characteristics

Figure 56. TMDS Output Signals Rise and Fall Time Definition

Table 58. Switching Characteristics

Symbol Parameter Conditions Min Typ Max Unit

TMDS Drivers Specifications

— Maximum serial data rate — — — 3.4 Gbps

F
TMDSCLK TMDSCLK frequency On TMDSCLKP/N outputs 25 — 340 MHz
P
TMDSCLK TMDSCLK period RL = 50 Ω 2.94 — 40 ns
See Figure 52.
t
TMDSCLK duty cycle t =t /P 40 50 60 %
CDC CDC CPH TMDSCLK
RL = 50 Ω
See Figure 52.
t
CPH TMDSCLK high time RL = 50 Ω 4 5 6 UI1
See Figure 52.
t
CPL TMDSCLK low time RL = 50 Ω 4 5 6 UI1
See Figure 52.
— TMDSCLK jitter2 RL = 50 Ω — — 0.25 UI1
t
SK(p) Intra-pair (pulse) skew RL = 50 Ω — — 0.15 UI1
See Figure 54.
t
SK(pp) Inter-pair skew RL = 50 Ω — — 1 UI1
See Figure 55.
tR Differential output signal rise 20–80% 75 — 0.4 UI ps
time RL = 50 Ω
See Figure 56.
tF Differential output signal fall time 20–80% 75 — 0.4 UI ps
RL = 50 Ω
See Figure 56.

— Differential signal overshoot Referred to 2x VSWING — — 15 %

— Differential signal undershoot Referred to 2x VSWING — — 25 %

1
UI means TMDS clock unit.
2 Relative to ideal recovery clock, as specified in the HDMI specification, version 1.4a, section 4.2.3.

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4.11.9 I2C Module Timing Parameters

This section describes the timing parameters of the I2C module. Figure 57 depicts the timing of I2C
module, and Table 59 lists the I2C module timing characteristics.

I2Cx_SDA IC10 IC11 IC9

I2Cx_SCL IC2 IC8 IC4 IC7 IC3

START IC10 IC11 START STOP START

IC6 IC5
IC1
Figure 57. I2C Bus Timing

Table 59. I2C Module Timing Parameters

Standard Mode Fast Mode

ID Parameter Unit
Min Max Min Max

IC1 I2Cx_SCL cycle time 10 — 2.5 — µs

IC2 Hold time (repeated) START condition 4.0 — 0.6 — µs
IC3 Set-up time for STOP condition 4.0 — 0.6 — µs
IC4 Data hold time 01 3.452 01 0.92 µs
IC5 HIGH Period of I2Cx_SCL Clock 4.0 — 0.6 — µs
IC6 LOW Period of the I2Cx_SCL Clock 4.7 — 1.3 — µs
IC7 Set-up time for a repeated START condition 4.7 — 0.6 — µs
IC8 Data set-up time 250 — 1003 — ns

IC9 Bus free time between a STOP and START condition 4.7 — 1.3 — µs
IC10 Rise time of both I2Cx_SDA and I2Cx_SCL signals — 1000 20 + 0.1Cb4 300 ns

IC11 Fall time of both I2Cx_SDA and I2Cx_SCL signals — 300 20 + 0.1Cb 4 300 ns

IC12 Capacitive load for each bus line (Cb) — 400 — 400 pF
1
A device must internally provide a hold time of at least 300 ns for I2Cx_SDA signal to bridge the undefined region of the falling
edge of I2Cx_SCL.
2
The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2Cx_SCL signal.
3 A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)

of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2Cx_SCL signal.
If such a device does stretch the LOW period of the I2Cx_SCL signal, it must output the next data bit to the I2Cx_SDA line
max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification)
before the I2Cx_SCL line is released.
4
Cb = total capacitance of one bus line in pF.

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4.11.10 Image Processing Unit (IPU) Module Parameters

The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor
and/or to a display device. This support covers all aspects of these activities:
• Connectivity to relevant devices—cameras, displays, graphics accelerators, and TV encoders.
• Related image processing and manipulation: sensor image signal processing, display processing,
image conversions, and other related functions.
• Synchronization and control capabilities, such as avoidance of tearing artifacts.

4.11.10.1 IPU Sensor Interface Signal Mapping

The IPU supports a number of sensor input formats. Table 60 defines the mapping of the Sensor Interface
Pins used for various supported interface formats.
Table 60. Camera Input Signal Cross Reference, Format, and Bits Per Cycle

RGB565 RGB5652 RGB6663 RGB888 YCbCr4 RGB5655 YCbCr6 YCbCr7 YCbCr8

Signal
8 bits 8 bits 8 bits 8 bits 8 bits 16 bits 16 bits 16 bits 20 bits
Name1
2 cycles 3 cycles 3 cycles 3 cycles 2 cycles 1 cycle 1 cycle 1 cycle 1 cycle

IPUx_CSIx_ — — — — — — — 0 C[0]
DATA00

IPUx_CSIx_ — — — — — — — 0 C[1]
DATA01

IPUx_CSIx_ — — — — — — — C[0] C[2]

DATA02

IPUx_CSIx_ — — — — — — — C[1] C[3]

DATA03

IPUx_CSIx_ — — — — — B[0] C[0] C[2] C[4]

DATA04

IPUx_CSIx_ — — — — — B[1] C[1] C[3] C[5]

DATA05

IPUx_CSIx_ — — — — — B[2] C[2] C[4] C[6]

DATA06

IPUx_CSIx_ — — — — — B[3] C[3] C[5] C[7]

DATA07
IPUx_CSIx_ — — — — — B[4] C[4] C[6] C[8]
DATA08

IPUx_CSIx_ — — — — — G[0] C[5] C[7] C[9]

DATA09

IPUx_CSIx_ — — — — — G[1] C[6] 0 Y[0]

DATA10

IPUx_CSIx_ — — — — — G[2] C[7] 0 Y[1]

DATA11

IPUx_CSIx_ B[0], G[3] R[2],G[4],B[2] R/G/B[4] R/G/B[0] Y/C[0] G[3] Y[0] Y[0] Y[2]
DATA12

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Table 60. Camera Input Signal Cross Reference, Format, and Bits Per Cycle (continued)

RGB565 RGB5652 RGB6663 RGB888 YCbCr4 RGB5655 YCbCr6 YCbCr7 YCbCr8

Signal
8 bits 8 bits 8 bits 8 bits 8 bits 16 bits 16 bits 16 bits 20 bits
Name1
2 cycles 3 cycles 3 cycles 3 cycles 2 cycles 1 cycle 1 cycle 1 cycle 1 cycle

IPUx_CSIx_ B[1], G[4] R[3],G[5],B[3] R/G/B[5] R/G/B[1] Y/C[1] G[4] Y[1] Y[1] Y[3]
DATA13

IPUx_CSIx_ B[2], G[5] R[4],G[0],B[4] R/G/B[0] R/G/B[2] Y/C[2] G[5] Y[2] Y[2] Y[4]
DATA14

IPUx_CSIx_ B[3], R[0] R[0],G[1],B[0] R/G/B[1] R/G/B[3] Y/C[3] R[0] Y[3] Y[3] Y[5]
DATA15

IPUx_CSIx_ B[4], R[1] R[1],G[2],B[1] R/G/B[2] R/G/B[4] Y/C[4] R[1] Y[4] Y[4] Y[6]
DATA16

IPUx_CSIx_ G[0], R[2] R[2],G[3],B[2] R/G/B[3] R/G/B[5] Y/C[5] R[2] Y[5] Y[5] Y[7]
DATA17

IPUx_CSIx_ G[1], R[3] R[3],G[4],B[3] R/G/B[4] R/G/B[6] Y/C[6] R[3] Y[6] Y[6] Y[8]
DATA18

IPUx_CSIx_ G[2], R[4] R[4],G[5],B[4] R/G/B[5] R/G/B[7] Y/C[7] R[4] Y[7] Y[7] Y[9]
DATA19
1
IPUx_CSIx stands for IPUx_CSI0 or IPUx_CSI1.
2
The MSB bits are duplicated on LSB bits implementing color extension.
3 The two MSB bits are duplicated on LSB bits implementing color extension.
4
YCbCr, 8 bits—Supported within the BT.656 protocol (sync embedded within the data stream).
5
RGB 16 bits—Supported in two ways: (1) As a “generic data” input, with no on-the-fly processing; (2) With on-the-fly
processing, but only under some restrictions on the control protocol.
6
YCbCr 16 bits—Supported as a “generic-data” input, with no on-the-fly processing.
7 YCbCr 16 bits—Supported as a sub-case of the YCbCr, 20 bits, under the same conditions (BT.1120 protocol).
8
YCbCr, 20 bits—Supported only within the BT.1120 protocol (syncs embedded within the data stream).

4.11.10.2 Sensor Interface Timings

There are three camera timing modes supported by the IPU.

4.11.10.2.1 BT.656 and BT.1120 Video Mode

Smart camera sensors, which include imaging processing, usually support video mode transfer. They use
an embedded timing syntax to replace the IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals. The
timing syntax is defined by the BT.656/BT.1120 standards.
This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only
control signal used is IPUx_CSIx_PIX_CLK. Start-of-frame and active-line signals are embedded in the
data stream. An active line starts with a SAV code and ends with a EAV code. In some cases, digital
blanking is inserted in between EAV and SAV code. The CSI decodes and filters out the timing-coding
from the data stream, thus recovering IPUx_CSIx_VSYNC and IPUx_CSIx_HSYNC signals for internal
use. On BT.656 one component per cycle is received over the IPUx_CSIx_DATA_EN bus. On BT.1120
two components per cycle are received over the IPUx_CSIx_DATA_EN bus.

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Electrical Characteristics

4.11.10.2.2 Gated Clock Mode

The IPUx_CSIx_VSYNC, IPUx_CSIx_HSYNC, and IPUx_CSIx_PIX_CLK signals are used in this
mode. See Figure 58.
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Figure 58. Gated Clock Mode Timing Diagram

A frame starts with a rising edge on IPUx_CSIx_VSYNC (all the timings correspond to straight polarity
of the corresponding signals). Then IPUx_CSIx_HSYNC goes to high and hold for the entire line. Pixel
clock is valid as long as IPUx_CSIx_HSYNC is high. Data is latched at the rising edge of the valid pixel
clocks. IPUx_CSIx_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI
stops receiving data from the stream. For the next line, the IPUx_CSIx_HSYNC timing repeats. For the
next frame, the IPUx_CSIx_VSYNC timing repeats.

4.11.10.2.3 Non-Gated Clock Mode

The timing is the same as the gated-clock mode (described in Section 4.11.10.2.2, “Gated Clock Mode,”)
except for the IPUx_CSIx_HSYNC signal, which is not used (see Figure 59). All incoming pixel clocks
are valid and cause data to be latched into the input FIFO. The IPUx_CSIx_PIX_CLK signal is inactive
(states low) until valid data is going to be transmitted over the bus.
Start of Frame n+1th frame
nth frame

IPUx_CSIx_VSYNC

IPUx_CSIx_PIX_CLK

IPUx_CSIx_DATA_EN[19:0] invalid invalid

1st byte 1st byte

Figure 59. Non-Gated Clock Mode Timing Diagram

The timing described in Figure 59 is that of a typical sensor. Some other sensors may have a slightly
different timing. The CSI can be programmed to support rising/falling-edge triggered
IPUx_CSIx_VSYNC; active-high/low IPUx_CSIx_HSYNC; and rising/falling-edge triggered
IPUx_CSIx_PIX_CLK.

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4.11.10.3 Electrical Characteristics

Figure 60 depicts the sensor interface timing. IPUx_CSIx_PIX_CLK signal described here is not
generated by the IPU. Table 61 lists the sensor interface timing characteristics.

IPUx_CSIx_PIX_CLK
(Sensor Output)
IP3 IP2 1/IP1

IPUx_CSIx_DATA_EN,
IPUx_CSIx_VSYNC,
IPUx_CSIx_HSYNC

Figure 60. Sensor Interface Timing Diagram

Table 61. Sensor Interface Timing Characteristics

ID Parameter Symbol Min Max Unit

IP1 Sensor output (pixel) clock frequency Fpck 0.01 180 MHz

IP2 Data and control setup time Tsu 2 — ns

IP3 Data and control holdup time Thd 1 — ns

4.11.10.4 IPU Display Interface Signal Mapping

The IPU supports a number of display output video formats. Table 62 defines the mapping of the Display
Interface Pins used during various supported video interface formats.
Table 62. Video Signal Cross-Reference

i.MX 6Solo/6DualLite LCD

RGB, RGB/TV Signal Allocation (Example) Comment1,2

Port Name Signal
(x=0, 1) Name 16-bit 18-bit 24 Bit 8-bit 16-bit 20-bit
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb

IPUx_DISPx_DAT00 DAT[0] B[0] B[0] B[0] Y/C[0] C[0] C[0] —

IPUx_DISPx_DAT01 DAT[1] B[1] B[1] B[1] Y/C[1] C[1] C[1] —

IPUx_DISPx_DAT02 DAT[2] B[2] B[2] B[2] Y/C[2] C[2] C[2] —

IPUx_DISPx_DAT03 DAT[3] B[3] B[3] B[3] Y/C[3] C[3] C[3] —

IPUx_DISPx_DAT04 DAT[4] B[4] B[4] B[4] Y/C[4] C[4] C[4] —

IPUx_DISPx_DAT05 DAT[5] G[0] B[5] B[5] Y/C[5] C[5] C[5] —

IPUx_DISPx_DAT06 DAT[6] G[1] G[0] B[6] Y/C[6] C[6] C[6] —

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Table 62. Video Signal Cross-Reference (continued)

i.MX 6Solo/6DualLite LCD

RGB, RGB/TV Signal Allocation (Example) Comment1,2

Port Name Signal
(x=0, 1) Name 16-bit 18-bit 24 Bit 8-bit 16-bit 20-bit
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb

IPUx_DISPx_DAT07 DAT[7] G[2] G[1] B[7] Y/C[7] C[7] C[7] —

IPUx_DISPx_DAT08 DAT[8] G[3] G[2] G[0] — Y[0] C[8] —

IPUx_DISPx_DAT09 DAT[9] G[4] G[3] G[1] — Y[1] C[9] —

IPUx_DISPx_DAT10 DAT[10] G[5] G[4] G[2] — Y[2] Y[0] —

IPUx_DISPx_DAT11 DAT[11] R[0] G[5] G[3] — Y[3] Y[1] —

IPUx_DISPx_DAT12 DAT[12] R[1] R[0] G[4] — Y[4] Y[2] —

IPUx_DISPx_DAT13 DAT[13] R[2] R[1] G[5] — Y[5] Y[3] —

IPUx_DISPx_DAT14 DAT[14] R[3] R[2] G[6] — Y[6] Y[4] —

IPUx_DISPx_DAT15 DAT[15] R[4] R[3] G[7] — Y[7] Y[5] —

IPUx_DISPx_DAT16 DAT[16] — R[4] R[0] — — Y[6] —

IPUx_DISPx_DAT17 DAT[17] — R[5] R[1] — — Y[7] —

IPUx_DISPx_DAT18 DAT[18] — — R[2] — — Y[8] —

IPUx_DISPx_DAT19 DAT[19] — — R[3] — — Y[9] —

IPUx_DISPx_DAT20 DAT[20] — — R[4] — — — —

IPUx_DISPx_DAT21 DAT[21] — — R[5] — — — —

IPUx_DISPx_DAT22 DAT[22] — — R[6] — — — —

IPUx_DISPx_DAT23 DAT[23] — — R[7] — — — —

DIx_DISP_CLK PixCLK —

DIx_PIN1 — May be required for anti-tearing

DIx_PIN2 HSYNC —
DIx_PIN3 VSYNC VSYNC out

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Table 62. Video Signal Cross-Reference (continued)

i.MX 6Solo/6DualLite LCD

RGB, RGB/TV Signal Allocation (Example) Comment1,2

Port Name Signal
(x=0, 1) Name 16-bit 18-bit 24 Bit 8-bit 16-bit 20-bit
3
(General) RGB RGB RGB YCrCb YCrCb YCrCb

DIx_PIN4 — Additional frame/row synchronous

signals with programmable timing
DIx_PIN5 —
DIx_PIN6 —
DIx_PIN7 —
DIx_PIN8 —
DIx_D0_CS — —
DIx_D1_CS — Alternate mode of PWM output for
contrast or brightness control
DIx_PIN11 — —
DIx_PIN12 — —
DIx_PIN13 — Register select signal
DIx_PIN14 — Optional RS2
DIx_PIN15 DRDY/DV Data validation/blank, data enable
DIx_PIN16 — Additional data synchronous
signals with programmable
DIx_PIN17 Q
features/timing
1 Signal mapping (both data and control/synchronization) is flexible. The table provides examples.
2
Restrictions for ports IPUx_DISPx_DAT00 through IPUx_DISPx_DAT23 are as follows:
• A maximum of three continuous groups of bits can be independently mapped to the external bus. Groups must not overlap.
• The bit order is expressed in each of the bit groups, for example, B[0] = least significant blue pixel bit.
3 This mode works in compliance with recommendation ITU-R BT.656. The timing reference signals (frame start, frame end, line

start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data
during blanking intervals is not supported.

NOTE
Table 62 provides information for both the DISP0 and DISP1 ports.
However, DISP1 port has reduced pinout depending on IOMUXC
configuration and therefore may not support all the above configurations.
See the IOMUXC chapter of the i.MX 6Solo/6DualLite Reference Manual
(IMX6SDLRM).

4.11.10.5 IPU Display Interface Timing

The IPU Display Interface supports two kinds of display accesses: synchronous and asynchronous. There
are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.

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4.11.10.5.1 Synchronous Controls

The synchronous control changes its value as a function of a system or of an external clock. This control
has a permanent period and a permanent wave form.
There are special physical outputs to provide synchronous controls:
• The IPP_DISP_CLK is a dedicated base synchronous signal that is used to generate a base display
(component, pixel) clock for a display.
• The IPUx_DIx_PIN01—IPUx_DIx_PIN07 are general purpose synchronous pins, that can be used
to provide HSYNC, VSYNC, DRDY or any other independent signal to a display.
The IPU has a system of internal binding counters for internal events (such as, HSYNC/VSYNC)
calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control
starts from the local start point with predefined UP and DOWN values to calculate control’s changing
points with half DI_CLK resolution. A full description of the counters system can be found in the IPU
chapter of the i.MX 6Solo/6DualLite Reference Manual (IMX6SDLRM).

4.11.10.5.2 Asynchronous Controls

The asynchronous control is a data-oriented signal that changes its value with an output data according to
additional internal flags coming with the data.
There are special physical outputs to provide asynchronous controls, as follows:
• The IPUx_DIx_D0_CS and IPUx_DIx_D1_CS pins are dedicated to provide chip select signals to
two displays.
• The IPUx_DIx_PIN11—IPUx_DIx_PIN17 are general purpose asynchronous pins, that can be
used to provide WR. RD, RS or any other data oriented signal to display.
NOTE
The IPU has independent signal generators for asynchronous signals
toggling. When a DI decides to put a new asynchronous data in the bus, a
new internal start (local start point) is generated. The signals generators
calculate predefined UP and DOWN values to change pins states with half
DI_CLK resolution.

4.11.10.6 Synchronous Interfaces to Standard Active Matrix TFT LCD Panels

4.11.10.6.1 IPU Display Operating Signals

The IPU uses four control signals and data to operate a standard synchronous interface:
• IPP_DISP_CLK—Clock to display
• HSYNC—Horizontal synchronization
• VSYNC—Vertical synchronization
• DRDY—Active data
All synchronous display controls are generated on the base of an internally generated “local start point”.
The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters.

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The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved
relative to the local start point. The data bus of the synchronous interface is output direction only.

4.11.10.6.2 LCD Interface Functional Description

Figure 61 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure,
signals are shown with negative polarity. The sequence of events for active matrix interface timing is:
• DI_CLK internal DI clock is used for calculation of other controls.
• IPP_DISP_CLK latches data into the panel on its negative edge (when positive polarity is selected).
In active mode, IPP_DISP_CLK runs continuously.
• HSYNC causes the panel to start a new line. (Usually IPUx_DIx_PIN02 is used as HSYNC.)
• VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse.
(Usually IPUx_DIx_PIN03 is used as VSYNC.)
• DRDY acts like an output enable signal to the CRT display. This output enables the data to be
shifted onto the display. When disabled, the data is invalid and the trace is off.
(DRDY can be used either synchronous or asynchronous generic purpose pin as well.)

VSYNC

HSYNC
LINE 1 LINE 2 LINE 3 LINE 4 LINE n-1 LINE n

HSYNC

DRDY

1 2 3 m-1 m
IPP_DISP_CLK

IPP_DATA

Figure 61. Interface Timing Diagram for TFT (Active Matrix) Panels

4.11.10.6.3 TFT Panel Sync Pulse Timing Diagrams

Figure 62 depicts the horizontal timing (timing of one line), including both the horizontal sync pulse and
the data. All the parameters shown in the figure are programmable. All controls are started by

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Electrical Characteristics

corresponding internal events—local start points. The timing diagrams correspond to inverse polarity of
the IPP_DISP_CLK signal and active-low polarity of the HSYNC, VSYNC, and DRDY signals.
IP13o IP7

IP5o IP8o IP8 IP5

DI clock

IPP_DISP_ CLK

VSYNC

HSYNC

DRDY

IPP_DATA D0 D1 Dn

IP9 IP9o IP10

IP6
local start point
local start point

local start point

Figure 62. TFT Panels Timing Diagram—Horizontal Sync Pulse

Figure 63 depicts the vertical timing (timing of one frame). All parameters shown in the figure are
programmable.
Start of frame End of frame
IP13

VSYNC

HSYNC

DRDY

IP11 IP14 IP15

IP12

Figure 63. TFT Panels Timing Diagram—Vertical Sync Pulse

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Table 63 shows timing characteristics of signals presented in Figure 62 and Figure 63.
Table 63. Synchronous Display Interface Timing Characteristics (Pixel Level)

ID Parameter Symbol Value Description Unit

1
IP5 Display interface clock period Tdicp ( ) Display interface clock. IPP_DISP_CLK ns
IP6 Display pixel clock period Tdpcp DISP_CLK_PER_PIXEL Time of translation of one pixel to display, ns
× Tdicp DISP_CLK_PER_PIXEL—number of pixel
components in one pixel (1.n). The
DISP_CLK_PER_PIXEL is virtual
parameter to define Display pixel clock
period.
The DISP_CLK_PER_PIXEL is received by
DC/DI one access division to n
components.
IP7 Screen width time Tsw (SCREEN_WIDTH) SCREEN_WIDTH—screen width in, ns
× Tdicp interface clocks. horizontal blanking
included.
The SCREEN_WIDTH should be built by
suitable DI’s counter2.
IP8 HSYNC width time Thsw (HSYNC_WIDTH) HSYNC_WIDTH—Hsync width in DI_CLK ns
with 0.5 DI_CLK resolution. Defined by DI’s
counter.
IP9 Horizontal blank interval 1 Thbi1 BGXP × Tdicp BGXP—width of a horizontal blanking ns
before a first active data in a line (in
interface clocks). The BGXP should be built
by suitable DI’s counter.
IP10 Horizontal blank interval 2 Thbi2 (SCREEN_WIDTH - Width a horizontal blanking after a last ns
BGXP - FW) × Tdicp active data in a line (in interface clocks)
FW—with of active line in interface clocks.
The FW should be built by suitable DI’s
counter.
IP12 Screen height Tsh (SCREEN_HEIGHT) SCREEN_HEIGHT— screen height in lines ns
× Tsw with blanking.
The SCREEN_HEIGHT is a distance
between 2 VSYNCs.
The SCREEN_HEIGHT should be built by
suitable DI’s counter.
IP13 VSYNC width Tvsw VSYNC_WIDTH VSYNC_WIDTH—Vsync width in DI_CLK ns
with 0.5 DI_CLK resolution. Defined by DI’s
counter
IP14 Vertical blank interval 1 Tvbi1 BGYP × Tsw BGYP—width of first Vertical ns
blanking interval in line. The BGYP should
be built by suitable DI’s counter.
IP15 Vertical blank interval 2 Tvbi2 (SCREEN_HEIGHT - Width of second Vertical ns
BGYP - FH) × Tsw blanking interval in line. The FH should be
built by suitable DI’s counter.
IP5o Offset of IPP_DISP_CLK Todicp DISP_CLK_OFFSET DISP_CLK_OFFSET—offset of ns
× Tdiclk IPP_DISP_CLK edges from local start
point, in DI_CLK×2
(0.5 DI_CLK Resolution).
Defined by DISP_CLK counter

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Table 63. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)

ID Parameter Symbol Value Description Unit

IP13o Offset of VSYNC Tovs VSYNC_OFFSET VSYNC_OFFSET—offset of Vsync edges ns

× Tdiclk from a local start point, when a Vsync
should be active, in DI_CLK×2
(0.5 DI_CLK Resolution). The
VSYNC_OFFSET should be built by
suitable DI’s counter.
IP8o Offset of HSYNC Tohs HSYNC_OFFSET HSYNC_OFFSET—offset of Hsync edges ns
× Tdiclk from a local start point, when a Hsync
should be active, in DI_CLK×2
(0.5 DI_CLK Resolution). The
HSYNC_OFFSET should be built by
suitable DI’s counter.
IP9o Offset of DRDY Todrdy DRDY_OFFSET DRDY_OFFSET—offset of DRDY edges ns
× Tdiclk from a suitable local start point, when a
corresponding data has been set on the
bus, in DI_CLK×2
(0.5 DI_CLK Resolution).
The DRDY_OFFSET should be built by
suitable DI’s counter.
1Display
interface clock period immediate value.
 DISP_CLK_PERIOD
 T diclk × ----------------------------------------------------, for integer DISP_CLK_PERIOD
----------------------------------------------------
 DI_CLK_PERIOD DI_CLK_PERIOD
Tdicp = 
DISP_CLK_PERIOD
T  ----------------------------------------------------
 diclk  floor DI_CLK_PERIOD + 0.5 ± 0.5 ,
 for fractional DISP_CLK_PERIOD
----------------------------------------------------
DI_CLK_PERIOD

DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK.
DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency
Display interface clock period average value.
DISP_CLK_PERIOD
Tdicp = T diclk × ----------------------------------------------------
DI_CLK_PERIOD
2
DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the
counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by
corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance
between HSYNCs is a SCREEN_WIDTH.

The maximum accuracy of UP/DOWN edge of controls is:

Accuracy = ( 0.5 × T diclk ) ± 0.62ns

The maximum accuracy of UP/DOWN edge of IPP_DATA is:

Accuracy = T diclk ± 0.62ns

The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed through the registers.

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 Electrical Characteristics

Figure 64 depicts the synchronous display interface timing for access level. The DISP_CLK_DOWN and
DISP_CLK_UP parameters are set through the Register. Table 64 lists the synchronous display interface
timing characteristics.
IP20o IP20
VSYNC
HSYNC
DRDY
other controls

IPP_DISP_CLK

Tdicu Tdicd

IPP_DATA

IP16 IP17 IP19 IP18

local start point

Figure 64. Synchronous Display Interface Timing Diagram—Access Level

Table 64. Synchronous Display Interface Timing Characteristics (Access Level)

ID Parameter Symbol Min Typ1 Max Unit

IP16 Display interface clock low Tckl Tdicd-Tdicu-1.24 Tdicd2-Tdicu3 Tdicd-Tdicu+1.24 ns

time

IP17 Display interface clock Tckh Tdicp-Tdicd+Tdicu-1.24 Tdicp-Tdicd+Tdicu Tdicp-Tdicd+Tdicu+1.2 ns

high time

IP18 Data setup time Tdsu Tdicd-1.24 Tdicu — ns

IP19 Data holdup time Tdhd Tdicp-Tdicd-1.24 Tdicp-Tdicu — ns

IP20o Control signals offset Tocsu Tocsu-1.24 Tocsu Tocsu+1.24 ns

times (defines for each pin)

IP20 Control signals setup time Tcsu Tdicd-1.24-Tocsu%Tdicp Tdicu — ns

to display interface clock
(defines for each pin)
1
The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.
These conditions may be chip specific.
2
Display interface clock down time
2 × DISP_CLK_DOWN
Tdicd = 1---  T diclk × ceil ----------------------------------------------------------- 
2 DI_CLK_PERIOD 
3 Display interface clock up time where CEIL(X) rounds the elements of X to the nearest integers towards infinity.

2 × DISP_CLK_UP
Tdicu = 1---  T diclk × ceil ------------------------------------------------ 
2 DI_CLK_PERIOD

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Electrical Characteristics

4.11.11 LVDS Display Bridge (LDB) Module Parameters

The LVDS interface complies with TIA/EIA 644-A standard. For more details, see TIA/EIA STANDARD
644-A, “Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits”.
Table 65. LVDS Display Bridge (LDB) Electrical Specification

Parameter Symbol Test Condition Min Max Units

Differential Voltage Output Voltage VOD 100 Ω Differential load 250 450 mV

Output Voltage High Voh 100 Ω differential load (0 V Diff—Output High 1.25 1.6 V
Voltage static)

Output Voltage Low Vol 100 Ω differential load (0 V Diff—Output Low 0.9 1.25 V
Voltage static)

Offset Static Voltage VOS Two 49.9 Ω resistors in series between N-P 1.15 1.375 V
terminal, with output in either Zero or One state, the
voltage measured between the 2 resistors.

VOS Differential VOSDIFF Difference in VOS between a One and a Zero state -50 50 mV

Output short circuited to GND ISA ISB With the output common shorted to GND -24 24 mA

VT Full Load Test VTLoad 100 Ω Differential load with a 3.74 kΩ load between 247 454 mV
GND and IO Supply Voltage

4.11.12 MIPI D-PHY Timing Parameters

This section describes MIPI D-PHY electrical specifications, compliant with MIPI CSI-2 version 1.0,
D-PHY specification Rev. 1.0 (for MIPI sensor port x2 lanes) and MIPI DSI Version 1.01, and D-PHY
specification Rev. 1.0 (and also DPI version 2.0, DBI version 2.0, DSC version 1.0a at protocol layer) (for
MIPI display port x2 lanes).

4.11.12.1 Electrical and Timing Information

Table 66. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

Input DC Specifications - Apply to DSI_CLK_P/DSI_CLK_N and DSI_DATA_P/DSI_DATA_N inputs

VI Input signal voltage range Transient voltage range is -50 — 1350 mV

limited from -300 mV to
1600 mV

VLEAK Input leakage current VGNDSH(min) = VI = -10 — 10 mA

VGNDSH(max) +
VOH(absmax)
Lane module in LP Receive
Mode

VGNDSH Ground Shift — -50 — 50 mV

VOH(absmax) Maximum transient output — — — 1.45 V

voltage level

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 Electrical Characteristics

Table 66. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

tvoh(absmax) Maximum transient time — — — 20 ns

above VOH(absmax)

HS Line Drivers DC Specifications

|VOD| HS Transmit Differential 80 Ω<= RL< = 125 Ω 140 200 270 mV

output voltage magnitude

Δ|VOD| Change in Differential output 80 Ω<= RL< = 125 Ω — — 10 mV

voltage magnitude between
logic states

VCMTX Steady-state common-mode 80 Ω<= RL< = 125 Ω 150 200 250 mV

output voltage.

ΔVCMTX(1,0) Changes in steady-state 80 Ω<= RL< = 125 Ω — — 5 mV

common-mode output voltage
between logic states

VOHHS HS output high voltage 80 Ω<= RL< = 125 Ω — — 360 mV

ZOS Single-ended output — 40 50 62.5 Ω

impedance.

ΔZOS Single-ended output — — — 10 %

impedance mismatch.

LP Line Drivers DC Specifications

VOL Output low-level SE voltage — -50 50 mV

VOH Output high-level SE voltage — 1.1 1.2 1.3 V

ZOLP Single-ended output — 110 — — Ω

impedance.

ΔZOLP(01-10) Single-ended output — — — 20 %

impedance mismatch driving
opposite level

ΔZOLP(0-11) Single-ended output — — — 5 %

impedance mismatch driving
same level

HS Line Receiver DC Specifications

VIDTH Differential input high voltage — — — 70 mV

threshold

VIDTL Differential input low voltage — -70 — — mV

threshold

VIHHS Single ended input high — — — 460 mV

voltage

VILHS Single ended input low — -40 — — mV

voltage

VCMRXDC Input common mode voltage — 70 — 330 mV

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Electrical Characteristics

Table 66. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

ZID Differential input impedance — 80 — 125 Ω

LP Line Receiver DC Specifications

VIL Input low voltage — — — 550 mV

VIH Input high voltage — 920 — — mV

VHYST Input hysteresis — 25 — — mV

Contention Line Receiver DC Specifications

VILF Input low fault threshold — 200 — 450 mV

4.11.12.2 MIPI D-PHY Signaling Levels

The signal levels are different for differential HS mode and single-ended LP mode. Figure 65 shows both
the HS and LP signal levels on the left and right sides, respectively. The HS signaling levels are below
the LP low-level input threshold such that LP receiver always detects low on HS signals.
VOH,MAX
LP
VOL
VOH,MIN
LP
VIH
VIH

LP Threshold
Region

VIL

VOHHS
Max VOD
HS Vout HS Vcm VCMTX,MAX LP VIL
Range Range VGNDSH,MA
VCMTX,MIN
Min VOD
VOLHS LP VOL GND
X

VGNDSH,MIN

HS Differential Signaling LP Single-ended Signaling

Figure 65. D-PHY Signaling Levels

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 Electrical Characteristics

4.11.12.3 MIPI HS Line Driver Characteristics

Ideal Single-Ended High Speed Signals

VDN
VCMTX = (VDP + VDN)/2
VOD(0) VOD(1)
VDP

Ideal Differential High Speed Signals

VOD(1)
0V
(Differential)
VOD(0)
VOD = VDP - VDN

Figure 66. Ideal Single-ended and Resulting Differential HS Signals

4.11.12.4 Possible ΔVCMTX and ΔVOD Distortions of the Single-ended HS Signals

ΔVOD (SE HS Signals) ΔVOD/2

VD N V OD (1)
VCM TX
VOD(0)
VD P

ΔV OD /2
Static ΔV CMT X (SE HS Signals)
VD N
VC MTX
V DP VOD(0)

DynamicΔVCMT X (SE HS Signals)

VDN
VCM TX

VD P

Figure 67. Possible ΔVCMTX and ΔVOD Distortions of the Single-ended HS Signals

4.11.12.5 MIPI D-PHY Switching Characteristics

Table 67. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

HS Line Drivers AC Specifications

— Maximum serial data rate (forward On DATAP/N outputs. 80 — 1000 Mbps

direction) 80 Ω <= RL <= 125 Ω

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Electrical Characteristics

Table 67. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

FDDRCLK DDR CLK frequency On DATAP/N outputs. 40 — 500 MHz

PDDRCLK DDR CLK period 80 Ω<= RL< = 125 Ω 2 — 25 ns

tCDC DDR CLK duty cycle tCDC = tCPH / PDDRCLK — 50 — %

tCPH DDR CLK high time — — 1 — UI

tCPL DDR CLK low time — — 1 — UI

— DDR CLK / DATA Jitter — — 75 — ps pk–pk

tSKEW[PN] Intra-Pair (Pulse) skew — — 0.075 — UI

tSKEW[TX] Data to Clock Skew — 0.350 — 0.650 UI

tr Differential output signal rise time 20% to 80%, RL = 50 Ω 150 — 0.3UI ps

tf Differential output signal fall time 20% to 80%, RL = 50 Ω 150 — 0.3UI ps

ΔVCMTX(HF) Common level variation above 450 MHz 80 Ω<= RL< = 125 Ω — — 15 mVrms

ΔVCMTX(LF) Common level variation between 50 80 Ω<= RL< = 125 Ω — — 25 mVp

MHz and 450 MHz.

LP Line Drivers AC Specifications

trlp,tflp Single ended output rise/fall time 15% to 85%, CL<70 pF — — 25 ns

treo 30% to 85%, CL<70 pF — — 35 ns

δV/δtSR Signal slew rate 15% to 85%, CL<70 pF — — 120 mV/ns

CL Load capacitance — 0 — 70 pF

HS Line Receiver AC Specifications

tSETUP[RX] Data to Clock Receiver Setup time — 0.15 — — UI

tHOLD[RX] Clock to Data Receiver Hold time — 0.15 — — UI

ΔVCMRX(HF) Common mode interference beyond — — — 200 mVpp

450 MHz

ΔVCMRX(LF) Common mode interference between — -50 — 50 mVpp

50 MHz and 450 MHz.

CCM Common mode termination — — — 60 pF

LP Line Receiver AC Specifications

eSPIKE Input pulse rejection — — 300 Vps

TMIN Minimum pulse response — 50 — ns

VINT Pk-to-Pk interference voltage — — — 400 mV

fINT Interference frequency — 450 — — MHz

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 Electrical Characteristics

Table 67. Electrical and Timing Information (continued)

Symbol Parameters Test Conditions Min Typ Max Unit

Model Parameters used for Driver Load switching performance evaluation

CPAD Equivalent Single ended I/O PAD — — — 1 pF

capacitance.

CPIN Equivalent Single ended Package + — — — 2 pF

PCB capacitance.

LS Equivalent wire bond series inductance — — — 1.5 nH

RS Equivalent wire bond series resistance — — — 0.15 Ω

RL Load resistance — 80 100 125 Ω

4.11.12.6 High-Speed Clock Timing

#,+P

#,+N
$ATA "IT 4IME  5) $ATA "IT 4IME  5)
5) ).34  5) ).34 
 $$2 #LOCK 0ERIOD  5) ).34  5) ).34 

Figure 68. DDR Clock Definition

4.11.12.7 Forward High-Speed Data Transmission Timing

The timing relationship of the DDR Clock differential signal to the Data differential signal is shown in
Figure 69:
2EFERENCE 4IME
4 3%450 4 (/,$

5) ).34
43+%7
#,+P

#,+N
 5) ).34
4#,+P

Figure 69. Data to Clock Timing Definitions

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Electrical Characteristics

4.11.12.8 Reverse High-Speed Data Transmission Timing

44$

.2: $ATA

#,+?.

#,+?0 #LOCK TO $ATA

3KEW
5) 5)

Figure 70. Reverse High-Speed Data Transmission Timing at Slave Side

4.11.12.9 Low-Power Receiver Timing

2*TLPX 2*TLPX
eSPIKE
VIH
Input
VIL
eSPIKE
TMIN-RX TMIN-RX

Output

Figure 71. Input Glitch Rejection of Low-Power Receivers

4.11.13 HSI Host Controller Timing Parameters

This section describes the timing parameters of the HSI Host Controller which are compliant with
High-speed Synchronous Serial Interface (HSI) Physical Layer specification version1.01.

4.11.13.1 Synchronous Data Flow

&IRST BIT OF ,AST BIT OF
FRAME FRAME &IRST BIT OF ,AST BIT OF
FRAME FRAME
T .OM"IT

(3)?$!4!

(3)?&,!'

. BITS &RAME . BITS &RAME

(3)?2%!$9

2ECEIVER HAS 2ECEIVER HAS CAPTURED

DETECTED THE START AND STORED A COMPLETE &RAME
OF THE &RAME

Figure 72. Synchronized Data Flow READY Signal Timing (Frame and Stream Transmission)

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 Electrical Characteristics

4.11.13.2 Pipelined Data Flow

&IRST BIT OF ,AST BIT OF &IRST BIT OF ,AST BIT OF ,AST BIT OF
FRAME FRAME FRAME FRAME FRAME
T .OM"IT

$!4!

&,!'

. BITS &RAME . BITS &RAME

2%!$9

! 2EADY CAN CHANGE " 2EADY SHALL NOT # 2EADY CAN CHANGE $ 2EADY SHALL % 2EADY &2EADY '2EADY
CHANGE TO ZERO MAINTAIN ZERO IF CAN SHALL CAN CHANGE
RECEIVER DOES NOT CHANGE MAINTAIN
HAVE FREE SPACE ITS VALUE

Figure 73. Pipelined Data Flow Ready Signal Timing (Frame Transmission Mode)

4.11.13.3 Receiver Real-Time Data Flow

&IRST BIT OF ,AST BIT OF &IRST BIT OF ,AST BIT OF
FRAME FRAME FRAME FRAME
T .OM"IT

$!4!

&,!'

. BITS &RAME . BITS &RAME

2%!$9

2ECEIVER HAS DETECTED THE 2ECEIVER HAS CAPTURED A

START OF THE &RAME COMPLETE &RAME

Figure 74. Receiver Real-Time Data Flow READY Signal Timing

4.11.13.4 Synchronized Data Flow Transmission with Wake

48 STATE ! " # $ !
0(9 &RAME 0(9 &RAME

$!4!

&,!'
 &IRST BIT
RECEIVED
2%!$9
2ECEIVER IN ACTIVE  2ECEIVED  2ECEIVER CAN NO
START STATE FRAME STORED LONGER RECEIVE DATE

 TRANSMITTER HAS
7!+% NO MORE DATA TO
4RANSMITTER HAS TRANSMIT
! " DATA TO TRANSMIT #
28 STATE $ !
! 3LEEP STATE " 7AKE UP STATE # !CTIVE STATE $ $ISABLE 3TATE
NON OPERATIONAL FULL OPERATIONAL .O COMMUNICATION ABILITY

Figure 75. Synchronized Data Flow Transmission with WAKE

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Electrical Characteristics

4.11.13.5 Stream Transmission Mode Frame Transfer

#HANNEL
$ESCRIPTION 0AYLOAD $ATA "ITS
BITS

$!4!

&,!'

#OMPLETE . BITS &RAME #OMPLETE . BITS &RAME

2%!$9

Figure 76. Stream Transmission Mode Frame Transfer (Synchronized Data Flow)

4.11.13.6 Frame Transmission Mode (Synchronized Data Flow)

&RAME
START BIT #HANNEL
$ESCRIPTION 0AYLOAD $ATA "ITS
BITS

$!4!

&,!'

#OMPLETE . BITS &RAME #OMPLETE . BITS &RAME

2%!$9

Figure 77. Frame Transmission Mode Transfer of Two Frames (Synchronized Data Flow)

4.11.13.7 Frame Transmission Mode (Pipelined Data Flow)

&RAME
START BIT #HANNEL 0AYLOAD
$ESCRIPTION $ATA "ITS
BITS
$!4!

&,!'

#OMPLETE . BITS &RAME #OMPLETE . BITS &RAME

2%!$9

Figure 78. Frame Transmission Mode Transfer of Two Frames (Pipelined Data Flow)

4.11.13.8 DATA and FLAG Signal Timing Requirement for a 15 pF Load

Table 68. DATA and FLAG Timing

Parameter Description 1 Mbit/s 100 Mbit/s 200 Mbit/s

tBit, nom Nominal bit time 1000 ns 10.0 ns 5.00 ns

tRise, min and Minimum allowed rise and fall time 2.00 ns 2.00 ns 1.00 ns
tFall, min

tTxToRxSkew, maxfq Maximum skew between transmitter and receiver package pins 50.0 ns 0.5.0 ns 0.25 ns

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 Electrical Characteristics

Table 68. DATA and FLAG Timing (continued)

Parameter Description 1 Mbit/s 100 Mbit/s 200 Mbit/s

tEageSepTx, min Minimum allowed separation of signal transitions at transmitter 400 ns 4.00 ns 2.00 ns
package pins, including all timing defects, for example, jitter
and skew, inside the transmitter.

tEageSepRx, min Minimum separation of signal transitions, measured at the 350 ns 3.5 ns 1.75 ns
receiver package pins, including all timing defects, for example,
jitter and skew, inside the receiver.

T %DGE3EP4X

$!4!   

48
.OTE  T 2ISE .OTE 
 
&,!'    
48 T"IT
T &ALL
T 4X4O2X3KEW T %DGE3EP2X

$!4!   

28
.OTE  .OTE 

&,!'  

28

1
This case shows that the DATA signal has slowed down more compared to the FLAG signal
2 This case shows that the FLAG signal has slowed down more compared to the DATA signal.

Figure 79. DATA and FLAG Signal Timing

4.11.14 PCIe PHY Parameters

The PCIe interface complies with PCIe specification Gen2 x1 lane and supports the PCI Express 1.1/2.0
standard.

4.11.14.1 PCIE_REXT Reference Resistor Connection

The impedance calibration process requires connection of reference resistor 200 Ω. 1% precision resistor
on PCIE_REXT pads to ground. It is used for termination impedance calibration.

4.11.15 Pulse Width Modulator (PWM) Timing Parameters

This section describes the electrical information of the PWM. The PWM can be programmed to select one
of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before
being input to the counter. The output is available at the pulse-width modulator output (PWMO) external
pin.

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Electrical Characteristics

Figure 80 depicts the timing of the PWM, and Table 69 lists the PWM timing parameters.

0 0

07-N?/54

Figure 80. PWM Timing

Table 69. PWM Output Timing Parameters

ID Parameter Min Max Unit

PWM Module Clock Frequency 0 ipg_clk MHz

P1 PWM output pulse width high 15 — ns

P2 PWM output pulse width low 15 — ns

4.11.16 SCAN JTAG Controller (SJC) Timing Parameters

Figure 81 depicts the SJC test clock input timing. Figure 82 depicts the SJC boundary scan timing.
Figure 83 depicts the SJC test access port. Signal parameters are listed in Table 70.

SJ1
SJ2 SJ2
JTAG_TCK
(Input) VIH VM VM
VIL
SJ3 SJ3

Figure 81. Test Clock Input Timing Diagram

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 Electrical Characteristics

JTAG_TCK
(Input) VIH
VIL

SJ4 SJ5

Data
Inputs Input Data Valid

SJ6

Data
Output Data Valid
Outputs

SJ7

Data
Outputs

SJ6

Data
Outputs Output Data Valid

Figure 82. Boundary Scan (JTAG) Timing Diagram

JTAG_TCK
(Input) VIH
VIL
SJ8 SJ9
JTAG_TDI
JTAG_TMS Input Data Valid
(Input)
SJ10

JTAG_TDO
(Output) Output Data Valid

SJ11

JTAG_TDO
(Output)

SJ10

JTAG_TDO
(Output) Output Data Valid

Figure 83. Test Access Port Timing Diagram

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Electrical Characteristics

JTAG_TCK
(Input)
SJ13
JTAG_TRST_B
(Input)

SJ12
Figure 84. JTAG_TRST_B Timing Diagram

Table 70. JTAG Timing

All Frequencies
ID Parameter1,2 Unit
Min Max

SJ0 JTAG_TCK frequency of operation 1/(3•TDC)1 0.001 22 MHz

SJ1 JTAG_TCK cycle time in crystal mode 45 — ns

SJ2 JTAG_TCK clock pulse width measured at VM 2 22.5 — ns

SJ3 JTAG_TCK rise and fall times — 3 ns

SJ4 Boundary scan input data set-up time 5 — ns

SJ5 Boundary scan input data hold time 24 — ns

SJ6 JTAG_TCK low to output data valid — 40 ns

SJ7 JTAG_TCK low to output high impedance — 40 ns

SJ8 JTAG_TMS, JTAG_TDI data set-up time 5 — ns

SJ9 JTAG_TMS, JTAG_TDI data hold time 25 — ns

SJ10 JTAG_TCK low to JTAG_TDO data valid — 44 ns

SJ11 JTAG_TCK low to JTAG_TDO high impedance — 44 ns

SJ12 JTAG_TRST_B assert time 100 — ns

SJ13 JTAG_TRST_B set-up time to JTAG_TCK low 40 — ns

1 TDC = target frequency of SJC
2
VM = mid-point voltage

4.11.17 SPDIF Timing Parameters

The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When
encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.
Table 71 and Figure 85 and Figure 86 show SPDIF timing parameters for the Sony/Philips Digital
Interconnect Format (SPDIF), including the timing of the modulating Rx clock (SPDIF_SR_CLK) for
SPDIF in Rx mode and the timing of the modulating Tx clock (SPDIF_ST_CLK) for SPDIF in Tx mode.

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 Electrical Characteristics

Table 71. SPDIF Timing Parameters

Timing Parameter Range

Characteristics Symbol Unit
Min Max

SPDIF_IN Skew: asynchronous inputs, no specs apply — — 0.7 ns

SPDIF_OUT output (Load = 50pf)

• Skew — — 1.5
ns
• Transition rising — — 24.2
• Transition falling — — 31.3

SPDIF_OUT output (Load = 30pf)

• Skew — — 1.5
ns
• Transition rising — — 13.6
• Transition falling — — 18.0

Modulating Rx clock (SPDIF_SR_CLK) period srckp 40.0 — ns

SPDIF_SR_CLK high period srckph 16.0 — ns

SPDIF_SR_CLK low period srckpl 16.0 — ns

Modulating Tx clock (SPDIF_ST_CLK) period stclkp 40.0 — ns

SPDIF_ST_CLK high period stclkph 16.0 — ns

SPDIF_ST_CLK low period stclkpl 16.0 — ns

srckp

srckpl srckph
SPDIF_SR_CLK
VM VM
(Output)

Figure 85. SPDIF_SR_CLK Timing Diagram

stclkp

stclkpl stclkph
SPDIF_ST_CLK
VM VM
(Input)

Figure 86. SPDIF_ST_CLK Timing Diagram

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Electrical Characteristics

4.11.18 SSI Timing Parameters

This section describes the timing parameters of the SSI module. The connectivity of the serial
synchronous interfaces are summarized in Table 72.
Table 72. AUDMUX Port Allocation

Port Signal Nomenclature Type and Access

AUDMUX port 1 SSI 1 Internal

AUDMUX port 2 SSI 2 Internal

AUDMUX port 3 AUD3 External—AUD3 I/O

AUDMUX port 4 AUD4 External—EIM or CSPI1 I/O through IOMUXC

AUDMUX port 5 AUD5 External—EIM or SD1 I/O through IOMUXC

AUDMUX port 6 AUD6 External—EIM or DISP2 through IOMUXC

AUDMUX port 7 SSI 3 Internal

NOTE
The terms WL and BL used in the timing diagrams and tables refer to
Word Length (WL) and Bit Length (BL).

4.11.18.1 SSI Transmitter Timing with Internal Clock

Figure 87 depicts the SSI transmitter internal clock timing and Table 73 lists the timing parameters for
the SSI transmitter internal clock.
.

SS1
SS5 SS3

SS2 SS4

AUDx_TXC
(Output)

SS6 SS8
AUDx_TXFS (bl)
(Output)
SS10 SS12
AUDx_TXFS (wl)
(Output) SS14
SS15
SS16 SS17 SS18
AUDx_TXD
(Output)

SS43
SS19
SS42
AUDx_RXD
(Input)

Note: AUDx_RXD input in synchronous mode only

Figure 87. SSI Transmitter Internal Clock Timing Diagram

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 Electrical Characteristics

Table 73. SSI Transmitter Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 AUDx_TXC/AUDxRXC clock period 81.4 — ns

SS2 AUDx_TXC/AUDxRXC clock high period 36.0 — ns

SS4 AUDx_TXC/AUDxRXC clock low period 36.0 — ns

SS6 AUDx_TXC high to AUDx_TXFS (bl) high — 15.0 ns

SS8 AUDx_TXC high to AUDx_TXFS (bl) low — 15.0 ns

SS10 AUDx_TXC high to AUDx_TXFS (wl) high — 15.0 ns

SS12 AUDx_TXC high to AUDx_TXFS (wl) low — 15.0 ns

SS14 AUDx_TXC/AUDxRXC Internal AUDx_TXFS rise time — 6.0 ns

SS15 AUDx_TXC/AUDxRXC Internal AUDx_TXFS fall time — 6.0 ns

SS16 AUDx_TXC high to AUDx_TXD valid from high impedance — 15.0 ns

SS17 AUDx_TXC high to AUDx_TXD high/low — 15.0 ns

SS18 AUDx_TXC high to AUDx_TXD high impedance — 15.0 ns

Synchronous Internal Clock Operation

SS42 AUDx_RXD setup before AUDx_TXC falling 10.0 — ns

SS43 AUDx_RXD hold after AUDx_TXC falling 0.0 — ns

NOTE
• All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
• All timings are on Audiomux Pads when SSI is being used for data
transfer.
• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
• For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).

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Electrical Characteristics

4.11.18.2 SSI Receiver Timing with Internal Clock

Figure 88 depicts the SSI receiver internal clock timing and Table 74 lists the timing parameters for the
receiver timing with the internal clock.
SS1
SS5 SS3
SS2 SS4

AUDx_TXC
(Output)

SS7 SS9
AUDx_TXFS (bl)
(Output)
SS11 SS13
AUDx_TXFS (wl)
(Output)
SS20
SS21
AUDx_RXD
(Input)

SS47 SS51
SS49
SS48 SS50

AUDx_RXC
(Output)

Figure 88. SSI Receiver Internal Clock Timing Diagram

Table 74. SSI Receiver Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS2 AUDx_TXC/AUDx_RXC clock high period 36.0 — ns

SS3 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS4 AUDx_TXC/AUDx_RXC clock low period 36.0 — ns

SS5 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS7 AUDx_RXC high to AUDx_TXFS (bl) high — 15.0 ns

SS9 AUDx_RXC high to AUDx_TXFS (bl) low — 15.0 ns

SS11 AUDx_RXC high to AUDx_TXFS (wl) high — 15.0 ns

SS13 AUDx_RXC high to AUDx_TXFS (wl) low — 15.0 ns

SS20 AUDx_RXD setup time before AUDx_RXC low 10.0 — ns

SS21 AUDx_RXD hold time after AUDx_RXC low 0.0 — ns

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 Electrical Characteristics

Table 74. SSI Receiver Timing with Internal Clock (continued)

ID Parameter Min Max Unit

Oversampling Clock Operation

SS47 Oversampling clock period 15.04 — ns

SS48 Oversampling clock high period 6.0 — ns

SS49 Oversampling clock rise time — 3.0 ns

SS50 Oversampling clock low period 6.0 — ns

SS51 Oversampling clock fall time — 3.0 ns

NOTE
• All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
• All timings are on Audiomux Pads when SSI is being used for data
transfer.
• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
• For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).

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Electrical Characteristics

4.11.18.3 SSI Transmitter Timing with External Clock

Figure 89 depicts the SSI transmitter external clock timing and Table 75 lists the timing parameters for
the transmitter timing with the external clock.
SS22
SS23 SS25
SS26 SS24

AUDx_TXC
(Input)
SS27 SS29

AUDx_TXFS (bl)
(Input) SS31 SS33

AUDx_TXFS (wl)
(Input) SS39
SS37 SS38

AUDx_TXD
(Output)
SS45
SS44
AUDx_RXD
(Input)

SS46
Note: AUDx_RXD Input in Synchronous mode only
Figure 89. SSI Transmitter External Clock Timing Diagram

Table 75. SSI Transmitter Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS23 AUDx_TXC/AUDx_RXC clock high period 36.0 — ns

SS24 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS25 AUDx_TXC/AUDx_RXC clock low period 36.0 — ns

SS26 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS27 AUDx_TXC high to AUDx_TXFS (bl) high -10.0 15.0 ns

SS29 AUDx_TXC high to AUDx_TXFS (bl) low 10.0 — ns

SS31 AUDx_TXC high to AUDx_TXFS (wl) high -10.0 15.0 ns

SS33 AUDx_TXC high to AUDx_TXFS (wl) low 10.0 — ns

SS37 AUDx_TXC high to AUDx_TXD valid from high impedance — 15.0 ns

SS38 AUDx_TXC high to AUDx_TXD high/low — 15.0 ns

SS39 AUDx_TXC high to AUDx_TXD high impedance — 15.0 ns

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 Electrical Characteristics

Table 75. SSI Transmitter Timing with External Clock (continued)

ID Parameter Min Max Unit

Synchronous External Clock Operation

SS44 AUDx_RXD setup before AUDx_TXC falling 10.0 — ns

SS45 AUDx_RXD hold after AUDx_TXC falling 2.0 — ns

SS46 AUDx_RXD rise/fall time — 6.0 ns

NOTE
• All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
• All timings are on Audiomux Pads when SSI is being used for data
transfer.
• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).
• For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).

4.11.18.4 SSI Receiver Timing with External Clock

Figure 90 depicts the SSI receiver external clock timing and Table 76 lists the timing parameters for the
receiver timing with the external clock.
SS22
SS26 SS24

SS23 SS25

AUDx_TXC
(Input)
SS28 SS30

AUDx_TXFS (bl)
(Input) SS32 SS34

AUDx_TXFS (wl) SS35

(Input) SS41
SS36
SS40
AUDx_RXD
(Input)

Figure 90. SSI Receiver External Clock Timing Diagram

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Electrical Characteristics

Table 76. SSI Receiver Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 AUDx_TXC/AUDx_RXC clock period 81.4 — ns

SS23 AUDx_TXC/AUDx_RXC clock high period 36 — ns

SS24 AUDx_TXC/AUDx_RXC clock rise time — 6.0 ns

SS25 AUDx_TXC/AUDx_RXC clock low period 36 — ns

SS26 AUDx_TXC/AUDx_RXC clock fall time — 6.0 ns

SS28 AUDx_RXC high to AUDx_TXFS (bl) high -10 15.0 ns

SS30 AUDx_RXC high to AUDx_TXFS (bl) low 10 — ns

SS32 AUDx_RXC high to AUDx_TXFS (wl) high -10 15.0 ns

SS34 AUDx_RXC high to AUDx_TXFS (wl) low 10 — ns

SS35 AUDx_TXC/AUDx_RXC External AUDx_TXFS rise time — 6.0 ns

SS36 AUDx_TXC/AUDx_RXC External AUDx_TXFS fall time — 6.0 ns

SS40 AUDx_RXD setup time before AUDx_RXC low 10 — ns

SS41 AUDx_RXD hold time after AUDx_RXC low 2 — ns

NOTE
• All the timings for the SSI are given for a non-inverted serial clock
polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have
been inverted, all the timing remains valid by inverting the clock signal
AUDx_TXC/AUDx_RXC and/or the frame sync
AUDx_TXFS/AUDx_RXFS shown in the tables and in the figures.
• All timings are on Audiomux Pads when SSI is being used for data
transfer.
• The terms, WL and BL, refer to Word Length (WL) and Bit Length(BL).
• For internal Frame Sync operation using external clock, the frame sync
timing is same as that of transmit data (for example, during AC97 mode
of operation).

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 Electrical Characteristics

4.11.19 UART I/O Configuration and Timing Parameters

4.11.19.1 UART RS-232 I/O Configuration in Different Modes

The i.MX 6Solo/6DualLite UART interfaces can serve both as DTE or DCE device. This can be
configured by the DCEDTE control bit (default 0—DCE mode). Table 77 shows the UART I/O
configuration based on the enabled mode.
Table 77. UART I/O Configuration vs. Mode

DTE Mode DCE Mode

Port
Direction Description Direction Description

UARTx_RTS_B Output RTS from DTE to DCE Input RTS from DTE to DCE

UARTx_CTS_B Input CTS from DCE to DTE Output CTS from DCE to DTE

UARTx_DTR_B Output DTR from DTE to DCE Input DTR from DTE to DCE

UARTx_DSR_B Input DSR from DCE to DTE Output DSR from DCE to DTE

UARTx_DCD_ B Input DCD from DCE to DTE Output DCD from DCE to DTE

UARTx_RI_B Input RING from DCE to DTE Output RING from DCE to DTE

UARTx_TX_DATA Input Serial data from DCE to DTE Output Serial data from DCE to DTE

UARTx_RX_DATA Output Serial data from DTE to DCE Input Serial data from DTE to DCE

4.11.19.2 UART RS-232 Serial Mode Timing

The following sections describe the electrical information of the UART module in the RS-232 mode.

4.11.19.2.1 UART Transmitter

Figure 91 depicts the transmit timing of UART in the RS-232 serial mode, with 8 data bit/1 stop bit
format. Table 78 lists the UART RS-232 serial mode transmit timing characteristics.
Possible
UA1 UA1 Parity
Bit
Next
Start Start
UARTx_TX_DATA Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Par Bit STOP Bit
(output) BIT

UA1 UA1
Figure 91. UART RS-232 Serial Mode Transmit Timing Diagram

Table 78. RS-232 Serial Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Unit

UA1 Transmit Bit Time tTbit 1/Fbaud_rate1 - Tref_clk2 1/Fbaud_rate + Tref_clk —

1
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
2
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

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Electrical Characteristics

4.11.19.2.2 UART Receiver

Figure 92 depicts the RS-232 serial mode receive timing with 8 data bit/1 stop bit format. Table 79 lists
serial mode receive timing characteristics.
Possible
UA2 UA2 Parity
Bit
Next
Start Start
UARTx_RX_DATA Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Par Bit STOP Bit
(input) BIT

UA2 UA2
Figure 92. UART RS-232 Serial Mode Receive Timing Diagram

Table 79. RS-232 Serial Mode Receive Timing Parameters

ID Parameter Symbol Min Max Unit

UA2 Receive Bit Time1 tRbit 1/Fbaud_rate2 - 1/(16 x Fbaud_rate) 1/Fbaud_rate + 1/(16 x Fbaud_rate) —
1 The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 x Fbaud_rate).
2 F
baud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

4.11.19.2.3 UART IrDA Mode Timing

The following subsections give the UART transmit and receive timings in IrDA mode.

UART IrDA Mode Transmitter

Figure 93 depicts the UART IrDA mode transmit timing, with 8 data bit/1 stop bit format. Table 80 lists
the transmit timing characteristics.
UA3 UA3 UA4 UA3 UA3

UARTx_TX_DATA
(output)
Start Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Possible STOP
Bit Parity BIT
Bit
Figure 93. UART IrDA Mode Transmit Timing Diagram

Table 80. IrDA Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Unit

UA3 Transmit Bit Time in IrDA mode tTIRbit 1/Fbaud_rate1 - Tref_clk 2
1/Fbaud_rate + Tref_clk —
UA4 Transmit IR Pulse Duration tTIRpulse (3/16) x (1/Fbaud_rate) - Tref_clk (3/16) x (1/Fbaud_rate) + Tref_clk —
1
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
2
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

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 Electrical Characteristics

UART IrDA Mode Receiver

Figure 94 depicts the UART IrDA mode receive timing, with 8 data bit/1 stop bit format. Table 81 lists
the receive timing characteristics.
UA5 UA5 UA6 UA5 UA5

UARTx_RX_DATA
(input)

Start Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Possible STOP
Bit Parity BIT
Bit
Figure 94. UART IrDA Mode Receive Timing Diagram

Table 81. IrDA Mode Receive Timing Parameters

ID Parameter Symbol Min Max Unit

UA5 Receive Bit Time1 in IrDA mode tRIRbit 1/Fbaud_rate2 - 1/(16 x Fbaud_rate) 1/Fbaud_rate + 1/(16 x Fbaud_rate) —

UA6 Receive IR Pulse Duration tRIRpulse 1.41 μs (5/16) x (1/Fbaud_rate) —

1
The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 x Fbaud_rate).
2 F
baud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

4.11.20 USB HSIC Timings

This section describes the electrical information of the USB HSIC port.
NOTE
HSIC is DDR signal, following timing spec is for both rising and falling
edge.

4.11.20.1 Transmit Timing

Tstrobe

USB_H_STROBE

Todelay
Todelay
USB_H_DATA

Figure 95. USB HSIC Transmit Waveform

Table 82. USB HSIC Transmit Parameters

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.166 4.167 ns —

Todelay data output delay time 550 1350 ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points

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Electrical Characteristics

4.11.20.2 Receive Timing

Tstrobe

USB_H_STROBE
Thold

USB_H_DATA
Tsetup

Figure 96. USB HSIC Receive Waveform

Table 83. USB HSIC Receive Parameters1

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.166 4.167 ns —

Thold data hold time 300 — ps Measured at 50% point

Tsetup data setup time 365 — ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points
1 The timings in the table are guaranteed when:
—AC I/O voltage is between 0.9x to 1x of the I/O supply
—DDR_SEL configuration bits of the I/O are set to (10)b

4.11.21 USB PHY Parameters

This section describes the USB-OTG PHY and the USB Host port PHY parameters.
The USB PHY meets the electrical compliance requirements defined in the Universal Serial Bus Revision
2.0 OTG, USB Host with the amendments below (On-The-Go and Embedded Host Supplement to the USB
Revision 2.0 Specification is not applicable to Host port).
• USB ENGINEERING CHANGE NOTICE
— Title: 5V Short Circuit Withstand Requirement Change
— Applies to: Universal Serial Bus Specification, Revision 2.0
• Errata for USB Revision 2.0 April 27, 2000 as of 12/7/2000
• USB ENGINEERING CHANGE NOTICE
— Title: Pull-up/Pull-down resistors
— Applies to: Universal Serial Bus Specification, Revision 2.0
• USB ENGINEERING CHANGE NOTICE
— Title: Suspend Current Limit Changes
— Applies to: Universal Serial Bus Specification, Revision 2.0
• USB ENGINEERING CHANGE NOTICE
— Title: USB 2.0 Phase Locked SOFs
— Applies to: Universal Serial Bus Specification, Revision 2.0
• On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification

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 Boot Mode Configuration

— Revision 2.0 plus errata and ecn June 4, 2010

• Battery Charging Specification (available from USB-IF)
— Revision 1.2, December 7, 2010
— Portable device only

5 Boot Mode Configuration

This section provides information on boot mode configuration pins allocation and boot devices interfaces
allocation.

5.1 Boot Mode Configuration Pins

Table 84 provides boot options, functionality, fuse values, and associated pins. Several input pins are also
sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.
The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an
unblown fuse). For detailed boot mode options configured by the boot mode pins, see the i.MX
6Solo/6DualLite Fuse Map document and the System Boot chapter in i.MX 6Solo/6DualLite Reference
Manual (IMX6SDLRM).
Table 84. Fuses and Associated Pins Used for Boot

Pin Direction at Reset eFuse Name

Boot Mode Selection

BOOT_MODE1 Input N/A

BOOT_MODE0 Input N/A

Boot Options1

EIM_DA0 Input BOOT_CFG1[0]

EIM_DA1 Input BOOT_CFG1[1]

EIM_DA2 Input BOOT_CFG1[2]

EIM_DA3 Input BOOT_CFG1[3]

EIM_DA4 Input BOOT_CFG1[4]

EIM_DA5 Input BOOT_CFG1[5]

EIM_DA6 Input BOOT_CFG1[6]

EIM_DA7 Input BOOT_CFG1[7]

EIM_DA8 Input BOOT_CFG2[0]

EIM_DA9 Input BOOT_CFG2[1]

EIM_DA10 Input BOOT_CFG2[2]

EIM_DA11 Input BOOT_CFG2[3]

EIM_DA12 Input BOOT_CFG2[4]

EIM_DA13 Input BOOT_CFG2[5]

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Boot Mode Configuration

Table 84. Fuses and Associated Pins Used for Boot (continued)

Pin Direction at Reset eFuse Name

EIM_DA14 Input BOOT_CFG2[6]

EIM_DA15 Input BOOT_CFG2[7]

EIM_A16 Input BOOT_CFG3[0]

EIM_A17 Input BOOT_CFG3[1]

EIM_A18 Input BOOT_CFG3[2]

EIM_A19 Input BOOT_CFG3[3]

EIM_A20 Input BOOT_CFG3[4]

EIM_A21 Input BOOT_CFG3[5]

EIM_A22 Input BOOT_CFG3[6]

EIM_A23 Input BOOT_CFG3[7]

EIM_A24 Input BOOT_CFG4[0]

EIM_WAIT Input BOOT_CFG4[1]

EIM_LBA Input BOOT_CFG4[2]

EIM_EB0 Input BOOT_CFG4[3]

EIM_EB1 Input BOOT_CFG4[4]

EIM_RW Input BOOT_CFG4[5]

EIM_EB2 Input BOOT_CFG4[6]

EIM_EB3 Input BOOT_CFG4[7]

1
Pin value overrides fuse settings for BT_FUSE_SEL = ‘0’. Signal Configuration as Fuse Override Input at Power
Up. These are special I/O lines that control the boot up configuration during product development. In production,
the boot configuration can be controlled by fuses.

5.2 Boot Device Interface Allocation

Table 85 lists the interfaces that can be used by the boot process in accordance with the specific boot
mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,
which are configured during boot when appropriate.
Table 85. Interface Allocation During Boot

Interface IP Instance Allocated Pads During Boot Comment

SPI ECSPI-1 EIM_D17, EIM_D18, EIM_D16, EIM_EB2, EIM_D19, —

EIM_D24, EIM_D25

SPI ECSPI-2 CSI0_DAT10, CSI0_DAT9, CSI0_DAT8, CSI0_DAT11, —

EIM_LBA, EIM_D24, EIM_D25

SPI ECSPI-3 DISP0_DAT2, DISP0_DAT1, DISP0_DAT0, —

DISP0_DAT3, DISP0_DAT4, DISP0_DAT5, DISP0_DAT6

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 Package Information and Contact Assignments

Table 85. Interface Allocation During Boot (continued)

Interface IP Instance Allocated Pads During Boot Comment

SPI ECSPI-4 EIM_D22, EIM_D28, EIM_D21, EIM_D20, EIM_A25, —

EIM_D24, EIM_D25

EIM EIM EIM_DA[15:0], EIM_D[31:16], CSI0_DAT[19:4], Used for NOR, OneNAND boot
CSI0_DATA_EN, CSI0_VSYNC Only CS0 is supported

NAND Flash GPMI NANDF_CLE, NANDF_ALE, NANDF_WP_B, 8 bit

SD4_CMD, SD4_CLK, NANDF_RB0, SD4_DAT0, Only CS0 is supported
NANDF_CS0, NANDF_CS1, NANDF_CS2,
NANDF_CS3, NANDF_D[7:0]

SD/MMC USDHC-1 SD1_CLK, SD1_CMD, SD1_DAT0, SD1_DAT1, 1, 4, or 8 bit

SD1_DAT2, SD1_DAT3, GPIO_1, NANDF_D0,
NANDF_D1, NANDF_D2, NANDF_D3, KEY_COL1

SD/MMC USDHC-2 SD2_CLK, SD2_CMD, SD2_DAT0, SD2_DAT1, 1, 4, or 8 bit

SD2_DAT2, SD2_DAT3, GPIO_4, NANDF_D4,
NANDF_D5, NANDF_D6, NANDF_D7, KEY_ROW1

SD/MMC USDHC-3 SD3_CLK, SD3_CMD, SD3_DAT0, SD3_DAT1, 1, 4, or 8 bit

SD3_DAT2, SD3_DAT3, SD3_DAT4, SD3_DAT5,
SD3_DAT6, SD3_DAT7, SD3_RST, GPIO_18

SD/MMC USDHC-4 SD4_CLK, SD4_CMD, SD4_DAT0, SD4_DAT1, 1, 4, or 8 bit

SD4_DAT2, SD4_DAT3, SD4_DAT4, SD4_DAT5,
SD4_DAT6, SD4_DAT7, NANDF_ALE, NANDF_CS1

I2C I2C-1 EIM_D28, EIM_D21 —

I2C I2C-2 EIM_D16, EIM_EB2 —

I2C I2C-3 EIM_D18, EIM_D17 —

USB USB-OTG USB_OTG_DP —

PHY USB_OTG_DN
USB_OTG_VBUS

6 Package Information and Contact Assignments

This section includes the contact assignment information and mechanical package drawing.

6.1 Updated Signal Naming Convention

The signal names of the i.MX6 series of products have been standardized to better align the signal names
within the family and across the documentation. Some of the benefits of these changes are as follows:
• The names are unique within the scope of an SoC and within the series of products
• Searches will return all occurrences of the named signal
• The names are consistent between i.MX 6 series products implementing the same modules
• The module instance is incorporated into the signal name
This change applies only to signal names. The original ball names have been preserved to prevent the need
to change schematics, BSDL models, IBIS models, etc.

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Package Information and Contact Assignments

Throughout this document, the updated signal names are used except where referenced as a ball name
(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal
name changes is in the document, IMX 6 Series Signal Name Mapping (EB792). This list can be used to
map the signal names used in older documentation to the new standardized naming conventions.

6.2 21x21 mm Package Information

6.2.1 Case 2240, 21 x 21 mm, 0.8 mm Pitch, 25 x 25 Ball Matrix

Figure 97 shows the top, bottom, and side views of the 21×21 mm BGA package.

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 Package Information and Contact Assignments

Figure 97. 21 x 21 mm BGA, Case 2240 Package Top, Bottom, and Side Views

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Package Information and Contact Assignments

Table 86 shows the 21 × 21 mm BGA package details.

Table 86. 21 x 21, 0.8 mm BGA Package Details

Common Dimensions
Parameter Symbol
Minimum Normal Maximum

Total Thickness A — — 1.6

Stand Off A1 0.36 — 0.46

Substrate Thickness A2 0.26 REF

Mold Thickness A3 0.7 REF

Body Size D 21 BSC

E 21 BSC

Ball Diameter — 0.5

Ball Opening — 0.4

Ball Width b 0.44 — 0.64

Ball Pitch e 0.8 BSC

Ball Count n 624

Edge Ball Center to Center D1 19.2 BSC

E1 19.2 BSC

Body Center to Contact Ball SD —

SE —

Package Edge Tolerance aaa 0.1

Mold Flatness bbb 0.2

Coplanarity ddd 0.15

Ball Offset (Package) eee 0.15

Ball Offset (Ball) fff 0.08

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 Package Information and Contact Assignments

6.2.2 21 x 21 mm Supplies Contact Assignments and Functional Contact

Assignments
Table 87 shows supplies contact assignments for the 21 x 21 mm package.
Table 87. 21 x 21 mm Supplies Contact Assignments

Supply Rail Name Ball(s) Position(s) Remark

CSI_REXT D4 —

DRAM_VREF AC2 —

DSI_REXT G4 —

GND A4, A8, A13, A25, B4, C1, C4, C6, C10, D3, D6, D8, E5, —
E6, E7, F5, F6, F7, F8, G3, G10, G19, H8, H12, H15,
H18, J2, J8, J12, J15, J18, K8, K10, K12, K15, K18, L2,
L5, L8, L10, L12, L15, L18, M8, M10, M12, M15, M18,
N8, N10, N15, N18, P8, P10, P12, P15, P18, R8, R12,
R15, R17, T8, T11, T12, T15, T17, T19, U8, U11, U12,
U15, U17, U19, V8, V19, W3, W7, W8, W9, W10, W11,
W12, W13, W15, W16, W17, W18, W19, Y5, Y24, AA7,
AA10, AA13, AA16, AA19, AA22, AB3, AB24, AD4,
AD7, AD10, AD13, AD16, AD19, AD22, AE1, AE25

HDMI_REF J1 —

HDMI_VP L7 —

HDMI_VPH M7 —

NVCC_CSI N7 Supply of the camera sensor interface

NVCC_DRAM R18, T18, U18, V9, V10, V11, V12, V13, V14, V15, V16, Supply of the DDR interface
V17, V18

NVCC_EIM K19, L19, M19 Supply of the EIM interface

NVCC_ENET R19 Supply of the ENET interface

NVCC_GPIO P7 Supply of the GPIO interface

NVCC_JTAG J7 Supply of the JTAG tap controller interface

NVCC_LCD P19 Supply of the LCD interface

NVCC_LVDS2P5 V7 Supply of the LVDS display interface and DDR

pre-drivers

NVCC_MIPI K7 Supply of the MIPI interface

NVCC_NANDF G15 Supply of the raw NAND Flash memories

interface

NVCC_PLL_OUT E8 —

NVCC_RGMII G18 Supply of the ENET interface

NVCC_SD1 G16 Supply of the SD card interface

NVCC_SD2 G17 Supply of the SD card interface

NVCC_SD3 G14 Supply of the SD card interface

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Package Information and Contact Assignments

Table 87. 21 x 21 mm Supplies Contact Assignments (continued)

Supply Rail Name Ball(s) Position(s) Remark

PCIE_REXT A2 —

PCIE_VP H7 —

PCIE_VPH G7 PCI PHY supply

PCIE_VPTX G8 PCI PHY supply

VDD_SNVS_CAP G9 Secondary supply for the SNVS (internal

regulator output—requires capacitor if internal
regulator is used)

VDD_SNVS_IN G11 Primary supply for the SNVS regulator

VDDARM_CAP H11, H13, J11, J13, K11, K13, L11, L13, M11, M13, Secondary supply for core (internal regulator
N11, N13, P11, P13, R11, R13 output—requires capacitor if internal regulator
is used)

VDDARM_IN H14, J14, K9, K14, L9, L14, M9, M14, N9, N14, P9, Primary supply for the Arm core’s regulator
P14, R9, R14, T9, U9

VDDHIGH_CAP H10, J10 Secondary supply for the 2.5 V domain

(internal regulator output—requires capacitor
if internal regulator is used)

VDDHIGH_IN H9, J9 Primary supply for the 2.5 V regulator

VDDPU_CAP H17, J17, K17, L17, M17, N17, P17 Secondary supply for VPU and GPUs
(internal regulator output—requires capacitor
if internal regulator is used)

VDDSOC_CAP R10, T10, T13, T14, U10, U13, U14 Secondary supply for SoC and PU regulators
(internal regulator output—requires capacitor
if internal regulator is used)

VDDSOC_IN H16, J16, K16, L16, M16, N16, P16, R16, T16, U16 Primary supply for SoC and PU regulators

VDDUSB_CAP F9 Secondary supply for the 3 V Domain (internal

regulator output—requires capacitor if internal
regulator is used)

USB_H1_VBUS D10 Primary supply for the 3 V regulator

USB_OTG_VBUS E9 Primary supply for the 3 V regulator

HDMI_DDCCEC K2 Analog Ground (Ground reference for the Hot

Plug Detect signal)

FA_ANA A5 —

GPANAIO C8 Analog output for NXP use only. This output

must remain unconnected.

VDD_FA B5 —

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 Package Information and Contact Assignments

Table 87. 21 x 21 mm Supplies Contact Assignments (continued)

Supply Rail Name Ball(s) Position(s) Remark

ZQPAD AE17 Connect ZQPAD to an external 240 Ω 1%

resistor to GND. This is a reference used
during DRAM output buffer driver calibration.

NC For i.MX 6DualLite: These signals are not functional and must
A9, A10, A11, A12, A14, B9, B10, B11, B12, B14, C14, remain unconnected by the user.
E1, E2, F1, F2, G12, G13, N12

For i.MX 6Solo:

A9, A10, A11, A12, A14, B9, B10, B11, B12, B14, C14,
E1, E2, F1, F2, G12, G13, N12, W25, Y17, Y18, Y19,
Y20, Y21, Y22, Y23, Y25, AA17, AA18, AA20, AA21,
AA23, AA24, AA25, AB18, AB19, AB20, AB21, AB22,
AB23, AB25, AC18, AC19, AC20, AC21, AC22, AC23,
AC24, AC25, AD18, AD20, AD21, AD23, AD24, AD25,
AE18, AE19, AE20, AE21, AE22, AE23, AE24

Table 88 shows an alpha-sorted list of functional contact assignments for the 21 x 21 mm package.
Table 88. 21 x 21 mm Functional Contact Assignments

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
BOOT_MODE0 C12 VDD_SNVS_IN GPIO ALT0 SRC_BOOT_MODE0 Input 100 kΩ pull-down
BOOT_MODE1 F12 VDD_SNVS_IN GPIO ALT0 SRC_BOOT_MODE1 Input 100 kΩ pull-down
CLK1_N C7 VDDHIGH_CAP — — CLK1_N — —
CLK1_P D7 VDDHIGH_CAP — — CLK1_P — —
CLK2_N C5 VDDHIGH_CAP — — CLK2_N — —
CLK2_P D5 VDDHIGH_CAP — — CLK2_P — —
CSI_CLK0M F4 NVCC_MIPI ANALOG — CSI_CLK_N — —
CSI_CLK0P F3 NVCC_MIPI ANALOG — CSI_CLK_P — —
CSI_D0M E4 NVCC_MIPI ANALOG — CSI_DATA0_N — —
CSI_D0P E3 NVCC_MIPI ANALOG — CSI_DATA0_P — —
CSI_D1M D1 NVCC_MIPI ANALOG — CSI_DATA1_N — —
CSI_D1P D2 NVCC_MIPI ANALOG — CSI_DATA1_P — —
CSI0_DAT10 M1 NVCC_CSI GPIO ALT5 GPIO5_IO28 Input 100 kΩ pull-up
CSI0_DAT11 M3 NVCC_CSI GPIO ALT5 GPIO5_IO29 Input 100 kΩ pull-up
CSI0_DAT12 M2 NVCC_CSI GPIO ALT5 GPIO5_IO30 Input 100 kΩ pull-up
CSI0_DAT13 L1 NVCC_CSI GPIO ALT5 GPIO5_IO31 Input 100 kΩ pull-up
CSI0_DAT14 M4 NVCC_CSI GPIO ALT5 GPIO6_IO00 Input 100 kΩ pull-up
CSI0_DAT15 M5 NVCC_CSI GPIO ALT5 GPIO6_IO01 Input 100 kΩ pull-up
CSI0_DAT16 L4 NVCC_CSI GPIO ALT5 GPIO6_IO02 Input 100 kΩ pull-up

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Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
CSI0_DAT17 L3 NVCC_CSI GPIO ALT5 GPIO6_IO03 Input 100 kΩ pull-up
CSI0_DAT18 M6 NVCC_CSI GPIO ALT5 GPIO6_IO04 Input 100 kΩ pull-up
CSI0_DAT19 L6 NVCC_CSI GPIO ALT5 GPIO6_IO05 Input 100 kΩ pull-up
CSI0_DAT4 N1 NVCC_CSI GPIO ALT5 GPIO5_IO22 Input 100 kΩ pull-up
CSI0_DAT5 P2 NVCC_CSI GPIO ALT5 GPIO5_IO23 Input 100 kΩ pull-up
CSI0_DAT6 N4 NVCC_CSI GPIO ALT5 GPIO5_IO24 Input 100 kΩ pull-up
CSI0_DAT7 N3 NVCC_CSI GPIO ALT5 GPIO5_IO25 Input 100 kΩ pull-up
CSI0_DAT8 N6 NVCC_CSI GPIO ALT5 GPIO5_IO26 Input 100 kΩ pull-up
CSI0_DAT9 N5 NVCC_CSI GPIO ALT5 GPIO5_IO27 Input 100 kΩ pull-up
CSI0_DATA_EN P3 NVCC_CSI GPIO ALT5 GPIO5_IO20 Input 100 kΩ pull-up
CSI0_MCLK P4 NVCC_CSI GPIO ALT5 GPIO5_IO19 Input 100 kΩ pull-up
CSI0_PIXCLK P1 NVCC_CSI GPIO ALT5 GPIO5_IO18 Input 100 kΩ pull-up
CSI0_VSYNC N2 NVCC_CSI GPIO ALT5 GPIO5_IO21 Input 100 kΩ pull-up
DI0_DISP_CLK N19 NVCC_LCD GPIO ALT5 GPIO4_IO16 Input 100 kΩ pull-up
DI0_PIN15 N21 NVCC_LCD GPIO ALT5 GPIO4_IO17 Input 100 kΩ pull-up
DI0_PIN2 N25 NVCC_LCD GPIO ALT5 GPIO4_IO18 Input 100 kΩ pull-up
DI0_PIN3 N20 NVCC_LCD GPIO ALT5 GPIO4_IO19 Input 100 kΩ pull-up
DI0_PIN4 P25 NVCC_LCD GPIO ALT5 GPIO4_IO20 Input 100 kΩ pull-up
DISP0_DAT0 P24 NVCC_LCD GPIO ALT5 GPIO4_IO21 Input 100 kΩ pull-up
DISP0_DAT1 P22 NVCC_LCD GPIO ALT5 GPIO4_IO22 Input 100 kΩ pull-up
DISP0_DAT10 R21 NVCC_LCD GPIO ALT5 GPIO4_IO31 Input 100 kΩ pull-up
DISP0_DAT11 T23 NVCC_LCD GPIO ALT5 GPIO5_IO05 Input 100 kΩ pull-up
DISP0_DAT12 T24 NVCC_LCD GPIO ALT5 GPIO5_IO06 Input 100 kΩ pull-up
DISP0_DAT13 R20 NVCC_LCD GPIO ALT5 GPIO5_IO07 Input 100 kΩ pull-up
DISP0_DAT14 U25 NVCC_LCD GPIO ALT5 GPIO5_IO08 Input 100 kΩ pull-up
DISP0_DAT15 T22 NVCC_LCD GPIO ALT5 GPIO5_IO09 Input 100 kΩ pull-up
DISP0_DAT16 T21 NVCC_LCD GPIO ALT5 GPIO5_IO10 Input 100 kΩ pull-up
DISP0_DAT17 U24 NVCC_LCD GPIO ALT5 GPIO5_IO11 Input 100 kΩ pull-up
DISP0_DAT18 V25 NVCC_LCD GPIO ALT5 GPIO5_IO12 Input 100 kΩ pull-up
DISP0_DAT19 U23 NVCC_LCD GPIO ALT5 GPIO5_IO13 Input 100 kΩ pull-up
DISP0_DAT2 P23 NVCC_LCD GPIO ALT5 GPIO4_IO23 Input 100 kΩ pull-up
DISP0_DAT20 U22 NVCC_LCD GPIO ALT5 GPIO5_IO14 Input 100 kΩ pull-up
DISP0_DAT21 T20 NVCC_LCD GPIO ALT5 GPIO5_IO15 Input 100 kΩ pull-up
DISP0_DAT22 V24 NVCC_LCD GPIO ALT5 GPIO5_IO16 Input 100 kΩ pull-up
DISP0_DAT23 W24 NVCC_LCD GPIO ALT5 GPIO5_IO17 Input 100 kΩ pull-up
DISP0_DAT3 P21 NVCC_LCD GPIO ALT5 GPIO4_IO24 Input 100 kΩ pull-up

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 Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
DISP0_DAT4 P20 NVCC_LCD GPIO ALT5 GPIO4_IO25 Input 100 kΩ pull-up
DISP0_DAT5 R25 NVCC_LCD GPIO ALT5 GPIO4_IO26 Input 100 kΩ pull-up
DISP0_DAT6 R23 NVCC_LCD GPIO ALT5 GPIO4_IO27 Input 100 kΩ pull-up
DISP0_DAT7 R24 NVCC_LCD GPIO ALT5 GPIO4_IO28 Input 100 kΩ pull-up
DISP0_DAT8 R22 NVCC_LCD GPIO ALT5 GPIO4_IO29 Input 100 kΩ pull-up
DISP0_DAT9 T25 NVCC_LCD GPIO ALT5 GPIO4_IO30 Input 100 kΩ pull-up
DRAM_A0 AC14 NVCC_DRAM DDR ALT0 DRAM_ADDR00 Output Low
DRAM_A1 AB14 NVCC_DRAM DDR ALT0 DRAM_ADDR01 Output Low
DRAM_A10 AA15 NVCC_DRAM DDR ALT0 DRAM_ADDR10 Output Low
DRAM_A11 AC12 NVCC_DRAM DDR ALT0 DRAM_ADDR11 Output Low
DRAM_A12 AD12 NVCC_DRAM DDR ALT0 DRAM_ADDR12 Output Low
DRAM_A13 AC17 NVCC_DRAM DDR ALT0 DRAM_ADDR13 Output Low
DRAM_A14 AA12 NVCC_DRAM DDR ALT0 DRAM_ADDR14 Output Low
DRAM_A15 Y12 NVCC_DRAM DDR ALT0 DRAM_ADDR15 Output Low
DRAM_A2 AA14 NVCC_DRAM DDR ALT0 DRAM_ADDR02 Output Low
DRAM_A3 Y14 NVCC_DRAM DDR ALT0 DRAM_ADDR03 Output Low
DRAM_A4 W14 NVCC_DRAM DDR ALT0 DRAM_ADDR04 Output Low
DRAM_A5 AE13 NVCC_DRAM DDR ALT0 DRAM_ADDR05 Output Low
DRAM_A6 AC13 NVCC_DRAM DDR ALT0 DRAM_ADDR06 Output Low
DRAM_A7 Y13 NVCC_DRAM DDR ALT0 DRAM_ADDR07 Output Low
DRAM_A8 AB13 NVCC_DRAM DDR ALT0 DRAM_ADDR08 Output Low
DRAM_A9 AE12 NVCC_DRAM DDR ALT0 DRAM_ADDR09 Output Low
DRAM_CAS AE16 NVCC_DRAM DDR ALT0 DRAM_CAS Output Low
DRAM_CS0 Y16 NVCC_DRAM DDR ALT0 DRAM_CS0 Output Low
DRAM_CS1 AD17 NVCC_DRAM DDR ALT0 DRAM_CS1 Output Low
DRAM_D0 AD2 NVCC_DRAM DDR ALT0 DRAM_DATA00 Input 100 kΩ pull-up
DRAM_D1 AE2 NVCC_DRAM DDR ALT0 DRAM_DATA01 Input 100 kΩ pull-up
DRAM_D10 AA6 NVCC_DRAM DDR ALT0 DRAM_DATA10 Input 100 kΩ pull-up
DRAM_D11 AE7 NVCC_DRAM DDR ALT0 DRAM_DATA11 Input 100 kΩ pull-up
DRAM_D12 AB5 NVCC_DRAM DDR ALT0 DRAM_DATA12 Input 100 kΩ pull-up
DRAM_D13 AC5 NVCC_DRAM DDR ALT0 DRAM_DATA13 Input 100 kΩ pull-up
DRAM_D14 AB6 NVCC_DRAM DDR ALT0 DRAM_DATA14 Input 100 kΩ pull-up
DRAM_D15 AC7 NVCC_DRAM DDR ALT0 DRAM_DATA15 Input 100 kΩ pull-up
DRAM_D16 AB7 NVCC_DRAM DDR ALT0 DRAM_DATA16 Input 100 kΩ pull-up
DRAM_D17 AA8 NVCC_DRAM DDR ALT0 DRAM_DATA17 Input 100 kΩ pull-up
DRAM_D18 AB9 NVCC_DRAM DDR ALT0 DRAM_DATA18 Input 100 kΩ pull-up

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Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
DRAM_D19 Y9 NVCC_DRAM DDR ALT0 DRAM_DATA19 Input 100 kΩ pull-up
DRAM_D2 AC4 NVCC_DRAM DDR ALT0 DRAM_DATA02 Input 100 kΩ pull-up
DRAM_D20 Y7 NVCC_DRAM DDR ALT0 DRAM_DATA20 Input 100 kΩ pull-up
DRAM_D21 Y8 NVCC_DRAM DDR ALT0 DRAM_DATA21 Input 100 kΩ pull-up
DRAM_D22 AC8 NVCC_DRAM DDR ALT0 DRAM_DATA22 Input 100 kΩ pull-up
DRAM_D23 AA9 NVCC_DRAM DDR ALT0 DRAM_DATA23 Input 100 kΩ pull-up
DRAM_D24 AE9 NVCC_DRAM DDR ALT0 DRAM_DATA24 Input 100 kΩ pull-up
DRAM_D25 Y10 NVCC_DRAM DDR ALT0 DRAM_DATA25 Input 100 kΩ pull-up
DRAM_D26 AE11 NVCC_DRAM DDR ALT0 DRAM_DATA26 Input 100 kΩ pull-up
DRAM_D27 AB11 NVCC_DRAM DDR ALT0 DRAM_DATA27 Input 100 kΩ pull-up
DRAM_D28 AC9 NVCC_DRAM DDR ALT0 DRAM_DATA28 Input 100 kΩ pull-up
DRAM_D29 AD9 NVCC_DRAM DDR ALT0 DRAM_DATA29 Input 100 kΩ pull-up
DRAM_D3 AA5 NVCC_DRAM DDR ALT0 DRAM_DATA03 Input 100 kΩ pull-up
DRAM_D30 AD11 NVCC_DRAM DDR ALT0 DRAM_DATA30 Input 100 kΩ pull-up
DRAM_D31 AC11 NVCC_DRAM DDR ALT0 DRAM_DATA31 Input 100 kΩ pull-up
Note: DRAM_D32 to DRAM_D63 are only available for i.MX 6DualLite chip; for i.MX 6Solo chip, these pins are NC.
DRAM_D32 AA17 NVCC_DRAM DDR ALT0 DRAM_DATA32 Input 100 kΩ pull-up
DRAM_D33 AA18 NVCC_DRAM DDR ALT0 DRAM_DATA33 Input 100 kΩ pull-up
DRAM_D34 AC18 NVCC_DRAM DDR ALT0 DRAM_DATA34 Input 100 kΩ pull-up
DRAM_D35 AE19 NVCC_DRAM DDR ALT0 DRAM_DATA35 Input 100 kΩ pull-up
DRAM_D36 Y17 NVCC_DRAM DDR ALT0 DRAM_DATA36 Input 100 kΩ pull-up
DRAM_D37 Y18 NVCC_DRAM DDR ALT0 DRAM_DATA37 Input 100 kΩ pull-up
DRAM_D38 AB19 NVCC_DRAM DDR ALT0 DRAM_DATA38 Input 100 kΩ pull-up
DRAM_D39 AC19 NVCC_DRAM DDR ALT0 DRAM_DATA39 Input 100 kΩ pull-up
DRAM_D40 Y19 NVCC_DRAM DDR ALT0 DRAM_DATA40 Input 100 kΩ pull-up
DRAM_D41 AB20 NVCC_DRAM DDR ALT0 DRAM_DATA41 Input 100 kΩ pull-up
DRAM_D42 AB21 NVCC_DRAM DDR ALT0 DRAM_DATA42 Input 100 kΩ pull-up
DRAM_D43 AD21 NVCC_DRAM DDR ALT0 DRAM_DATA43 Input 100 kΩ pull-up
DRAM_D44 Y20 NVCC_DRAM DDR ALT0 DRAM_DATA44 Input 100 kΩ pull-up
DRAM_D45 AA20 NVCC_DRAM DDR ALT0 DRAM_DATA45 Input 100 kΩ pull-up
DRAM_D46 AE21 NVCC_DRAM DDR ALT0 DRAM_DATA46 Input 100 kΩ pull-up
DRAM_D47 AC21 NVCC_DRAM DDR ALT0 DRAM_DATA47 Input 100 kΩ pull-up
DRAM_D48 AC22 NVCC_DRAM DDR ALT0 DRAM_DATA48 Input 100 kΩ pull-up
DRAM_D49 AE22 NVCC_DRAM DDR ALT0 DRAM_DATA49 Input 100 kΩ pull-up
DRAM_D50 AE24 NVCC_DRAM DDR ALT0 DRAM_DATA50 Input 100 kΩ pull-up
DRAM_D51 AC24 NVCC_DRAM DDR ALT0 DRAM_DATA51 Input 100 kΩ pull-up

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 Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
DRAM_D52 AB22 NVCC_DRAM DDR ALT0 DRAM_DATA52 Input 100 kΩ pull-up
DRAM_D53 AC23 NVCC_DRAM DDR ALT0 DRAM_DATA53 Input 100 kΩ pull-up
DRAM_D54 AD25 NVCC_DRAM DDR ALT0 DRAM_DATA54 Input 100 kΩ pull-up
DRAM_D55 AC25 NVCC_DRAM DDR ALT0 DRAM_DATA55 Input 100 kΩ pull-up
DRAM_D56 AB25 NVCC_DRAM DDR ALT0 DRAM_DATA56 Input 100 kΩ pull-up
DRAM_D57 AA21 NVCC_DRAM DDR ALT0 DRAM_DATA57 Input 100 kΩ pull-up
DRAM_D58 Y25 NVCC_DRAM DDR ALT0 DRAM_DATA58 Input 100 kΩ pull-up
DRAM_D59 Y22 NVCC_DRAM DDR ALT0 DRAM_DATA59 Input 100 kΩ pull-up
DRAM_D60 AB23 NVCC_DRAM DDR ALT0 DRAM_DATA60 Input 100 kΩ pull-up
DRAM_D61 AA23 NVCC_DRAM DDR ALT0 DRAM_DATA61 Input 100 kΩ pull-up
DRAM_D62 Y23 NVCC_DRAM DDR ALT0 DRAM_DATA62 Input 100 kΩ pull-up
DRAM_D63 W25 NVCC_DRAM DDR ALT0 DRAM_DATA63 Input 100 kΩ pull-up
DRAM_D4 AC1 NVCC_DRAM DDR ALT0 DRAM_DATA04 Input 100 kΩ pull-up
DRAM_D5 AD1 NVCC_DRAM DDR ALT0 DRAM_DATA05 Input 100 kΩ pull-up
DRAM_D6 AB4 NVCC_DRAM DDR ALT0 DRAM_DATA06 Input 100 kΩ pull-up
DRAM_D7 AE4 NVCC_DRAM DDR ALT0 DRAM_DATA07 Input 100 kΩ pull-up
DRAM_D8 AD5 NVCC_DRAM DDR ALT0 DRAM_DATA08 Input 100 kΩ pull-up
DRAM_D9 AE5 NVCC_DRAM DDR ALT0 DRAM_DATA09 Input 100 kΩ pull-up
DRAM_DQM0 AC3 NVCC_DRAM DDR ALT0 DRAM_DQM0 Output Low
DRAM_DQM1 AC6 NVCC_DRAM DDR ALT0 DRAM_DQM1 Output Low
DRAM_DQM2 AB8 NVCC_DRAM DDR ALT0 DRAM_DQM2 Output Low
DRAM_DQM3 AE10 NVCC_DRAM DDR ALT0 DRAM_DQM3 Output Low
DRAM_DQM4 AB18 NVCC_DRAM DDR ALT0 DRAM_DQM4 Output Low
DRAM_DQM5 AC20 NVCC_DRAM DDR ALT0 DRAM_DQM5 Output Low
DRAM_DQM6 AD24 NVCC_DRAM DDR ALT0 DRAM_DQM6 Output Low
DRAM_DQM7 Y21 NVCC_DRAM DDR ALT0 DRAM_DQM7 Output Low
DRAM_RAS AB15 NVCC_DRAM DDR ALT0 DRAM_RAS Output Low
DRAM_RESET Y6 NVCC_DRAM DDR ALT0 DRAM_RESET Output Low
DRAM_SDBA0 AC15 NVCC_DRAM DDR ALT0 DRAM_SDBA0 Output Low
DRAM_SDBA1 Y15 NVCC_DRAM DDR ALT0 DRAM_SDBA1 Output Low
DRAM_SDBA2 AB12 NVCC_DRAM DDR ALT0 DRAM_SDBA2 Output Low
DRAM_SDCKE0 Y11 NVCC_DRAM DDR ALT0 DRAM_SDCKE0 Output Low
DRAM_SDCKE1 AA11 NVCC_DRAM DDR ALT0 DRAM_SDCKE1 Output Low
DRAM_SDCLK_0 AD15 NVCC_DRAM DDRCLK ALT0 DRAM_SDCLK0_P Output Low
DRAM_SDCLK_0_B AE15 NVCC_DRAM — — DRAM_SDCLK0_N — —
DRAM_SDCLK_1 AD14 NVCC_DRAM DDRCLK ALT0 DRAM_SDCLK1_P Output Low

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Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
DRAM_SDCLK_1_B AE14 NVCC_DRAM — — DRAM_SDCLK1_N — —
DRAM_SDODT0 AC16 NVCC_DRAM DDR ALT0 DRAM_ODT0 Output Low
DRAM_SDODT1 AB17 NVCC_DRAM DDR ALT0 DRAM_ODT1 Output Low
DRAM_SDQS0 AE3 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS0_P Input Hi-Z
DRAM_SDQS0_B AD3 NVCC_DRAM — — DRAM_SDQS0_N — —
DRAM_SDQS1 AD6 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS1_P Input Hi-Z
DRAM_SDQS1_B AE6 NVCC_DRAM — — DRAM_SDQS1_N — —
DRAM_SDQS2 AD8 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS2_P Input Hi-Z
DRAM_SDQS2_B AE8 NVCC_DRAM — — DRAM_SDQS2_N — —
DRAM_SDQS3 AC10 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS3_P Input Hi-Z
DRAM_SDQS3_B AB10 NVCC_DRAM — — DRAM_SDQS3_N — —
DRAM_SDQS4 AD18 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS4_P Input Hi-Z
DRAM_SDQS4_B AE18 NVCC_DRAM — — DRAM_SDQS4_N — —
DRAM_SDQS5 AD20 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS5_P Input Hi-Z
DRAM_SDQS5_B AE20 NVCC_DRAM — — DRAM_SDQS5_N — —
DRAM_SDQS6 AD23 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS6_P Input Hi-Z
DRAM_SDQS6_B AE23 NVCC_DRAM — — DRAM_SDQS6_N — —
DRAM_SDQS7 AA25 NVCC_DRAM DDRCLK ALT0 DRAM_SDQS7_P Input Hi-Z
DRAM_SDQS7_B AA24 NVCC_DRAM — — DRAM_SDQS7_N — —
DRAM_SDWE AB16 NVCC_DRAM DDR ALT0 DRAM_SDWE Output Low
DSI_CLK0M H3 NVCC_MIPI ANALOG — DSI_CLK_N — —
DSI_CLK0P H4 NVCC_MIPI ANALOG — DSI_CLK_P — —
DSI_D0M G2 NVCC_MIPI ANALOG — DSI_DATA0_N — —
DSI_D0P G1 NVCC_MIPI ANALOG — DSI_DATA0_P — —
DSI_D1M H2 NVCC_MIPI ANALOG — DSI_DATA1_N — —
DSI_D1P H1 NVCC_MIPI ANALOG — DSI_DATA1_P — —
EIM_A16 H25 NVCC_EIM GPIO ALT0 EIM_ADDR16 Output Low
EIM_A17 G24 NVCC_EIM GPIO ALT0 EIM_ADDR17 Output Low
EIM_A18 J22 NVCC_EIM GPIO ALT0 EIM_ADDR18 Output Low
EIM_A19 G25 NVCC_EIM GPIO ALT0 EIM_ADDR19 Output Low
EIM_A20 H22 NVCC_EIM GPIO ALT0 EIM_ADDR20 Output Low
EIM_A21 H23 NVCC_EIM GPIO ALT0 EIM_ADDR21 Output Low
EIM_A22 F24 NVCC_EIM GPIO ALT0 EIM_ADDR22 Output Low
EIM_A23 J21 NVCC_EIM GPIO ALT0 EIM_ADDR23 Output Low
EIM_A24 F25 NVCC_EIM GPIO ALT0 EIM_ADDR24 Output Low
EIM_A25 H19 NVCC_EIM GPIO ALT0 EIM_ADDR25 Output Low

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 Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
EIM_BCLK N22 NVCC_EIM GPIO ALT0 EIM_BCLK Output Low
EIM_CS0 H24 NVCC_EIM GPIO ALT0 EIM_CS0 Output High
EIM_CS1 J23 NVCC_EIM GPIO ALT0 EIM_CS1 Output High
EIM_D16 C25 NVCC_EIM GPIO ALT5 GPIO3_IO16 Input 100 kΩ pull-up
EIM_D17 F21 NVCC_EIM GPIO ALT5 GPIO3_IO17 Input 100 kΩ pull-up
EIM_D18 D24 NVCC_EIM GPIO ALT5 GPIO3_IO18 Input 100 kΩ pull-up
EIM_D19 G21 NVCC_EIM GPIO ALT5 GPIO3_IO19 Input 100 kΩ pull-up
EIM_D20 G20 NVCC_EIM GPIO ALT5 GPIO3_IO20 Input 100 kΩ pull-up
EIM_D21 H20 NVCC_EIM GPIO ALT5 GPIO3_IO21 Input 100 kΩ pull-up
EIM_D22 E23 NVCC_EIM GPIO ALT5 GPIO3_IO22 Input 100 kΩ pull-down
EIM_D23 D25 NVCC_EIM GPIO ALT5 GPIO3_IO23 Input 100 kΩ pull-up
EIM_D24 F22 NVCC_EIM GPIO ALT5 GPIO3_IO24 Input 100 kΩ pull-up
EIM_D25 G22 NVCC_EIM GPIO ALT5 GPIO3_IO25 Input 100 kΩ pull-up
EIM_D26 E24 NVCC_EIM GPIO ALT5 GPIO3_IO26 Input 100 kΩ pull-up
EIM_D27 E25 NVCC_EIM GPIO ALT5 GPIO3_IO27 Input 100 kΩ pull-up
EIM_D28 G23 NVCC_EIM GPIO ALT5 GPIO3_IO28 Input 100 kΩ pull-up
EIM_D29 J19 NVCC_EIM GPIO ALT5 GPIO3_IO29 Input 100 kΩ pull-up
EIM_D30 J20 NVCC_EIM GPIO ALT5 GPIO3_IO30 Input 100 kΩ pull-up
EIM_D31 H21 NVCC_EIM GPIO ALT5 GPIO3_IO31 Input 100 kΩ pull-down
EIM_DA0 L20 NVCC_EIM GPIO ALT0 EIM_AD00 Input 100 kΩ pull-up
EIM_DA1 J25 NVCC_EIM GPIO ALT0 EIM_AD01 Input 100 kΩ pull-up
EIM_DA10 M22 NVCC_EIM GPIO ALT0 EIM_AD10 Input 100 kΩ pull-up
EIM_DA11 M20 NVCC_EIM GPIO ALT0 EIM_AD11 Input 100 kΩ pull-up
EIM_DA12 M24 NVCC_EIM GPIO ALT0 EIM_AD12 Input 100 kΩ pull-up
EIM_DA13 M23 NVCC_EIM GPIO ALT0 EIM_AD13 Input 100 kΩ pull-up
EIM_DA14 N23 NVCC_EIM GPIO ALT0 EIM_AD14 Input 100 kΩ pull-up
EIM_DA15 N24 NVCC_EIM GPIO ALT0 EIM_AD15 Input 100 kΩ pull-up
EIM_DA2 L21 NVCC_EIM GPIO ALT0 EIM_AD02 Input 100 kΩ pull-up
EIM_DA3 K24 NVCC_EIM GPIO ALT0 EIM_AD03 Input 100 kΩ pull-up
EIM_DA4 L22 NVCC_EIM GPIO ALT0 EIM_AD04 Input 100 kΩ pull-up
EIM_DA5 L23 NVCC_EIM GPIO ALT0 EIM_AD05 Input 100 kΩ pull-up
EIM_DA6 K25 NVCC_EIM GPIO ALT0 EIM_AD06 Input 100 kΩ pull-up
EIM_DA7 L25 NVCC_EIM GPIO ALT0 EIM_AD07 Input 100 kΩ pull-up
EIM_DA8 L24 NVCC_EIM GPIO ALT0 EIM_AD08 Input 100 kΩ pull-up
EIM_DA9 M21 NVCC_EIM GPIO ALT0 EIM_AD09 Input 100 kΩ pull-up
EIM_EB0 K21 NVCC_EIM GPIO ALT0 EIM_EB0 Output High

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Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
EIM_EB1 K23 NVCC_EIM GPIO ALT0 EIM_EB1 Output High
EIM_EB2 E22 NVCC_EIM GPIO ALT5 GPIO2_IO30 Input 100 kΩ pull-up
EIM_EB3 F23 NVCC_EIM GPIO ALT5 GPIO2_IO31 Input 100 kΩ pull-up
EIM_LBA K22 NVCC_EIM GPIO ALT0 EIM_LBA Output High
EIM_OE J24 NVCC_EIM GPIO ALT0 EIM_OE Output High
EIM_RW K20 NVCC_EIM GPIO ALT0 EIM_RW Output High
EIM_WAIT M25 NVCC_EIM GPIO ALT0 EIM_WAIT Input 100 kΩ pull-up
ENET_CRS_DV U21 NVCC_ENET GPIO ALT5 GPIO1_IO25 Input 100 kΩ pull-up
ENET_MDC V20 NVCC_ENET GPIO ALT5 GPIO1_IO31 Input 100 kΩ pull-up
ENET_MDIO V23 NVCC_ENET GPIO ALT5 GPIO1_IO22 Input 100 kΩ pull-up
3
ENET_REF_CLK V22 NVCC_ENET GPIO ALT5 GPIO1_IO23 Input 100 kΩ pull-up
ENET_RX_ER W23 NVCC_ENET GPIO ALT5 GPIO1_IO24 Input 100 kΩ pull-up
ENET_RXD0 W21 NVCC_ENET GPIO ALT5 GPIO1_IO27 Input 100 kΩ pull-up
ENET_RXD1 W22 NVCC_ENET GPIO ALT5 GPIO1_IO26 Input 100 kΩ pull-up
ENET_TX_EN V21 NVCC_ENET GPIO ALT5 GPIO1_IO28 Input 100 kΩ pull-up
ENET_TXD0 U20 NVCC_ENET GPIO ALT5 GPIO1_IO30 Input 100 kΩ pull-up
ENET_TXD1 W20 NVCC_ENET GPIO ALT5 GPIO1_IO29 Input 100 kΩ pull-up
GPIO_0 T5 NVCC_GPIO GPIO ALT5 GPIO1_IO00 Input 100 kΩ pull-down
GPIO_1 T4 NVCC_GPIO GPIO ALT5 GPIO1_IO01 Input 100 kΩ pull-up
GPIO_16 R2 NVCC_GPIO GPIO ALT5 GPIO7_IO11 Input 100 kΩ pull-up
GPIO_17 R1 NVCC_GPIO GPIO ALT5 GPIO7_IO12 Input 100 kΩ pull-up
GPIO_18 P6 NVCC_GPIO GPIO ALT5 GPIO7_IO13 Input 100 kΩ pull-up
GPIO_19 P5 NVCC_GPIO GPIO ALT5 GPIO4_IO05 Input 100 kΩ pull-up
GPIO_2 T1 NVCC_GPIO GPIO ALT5 GPIO1_IO02 Input 100 kΩ pull-up
GPIO_3 R7 NVCC_GPIO GPIO ALT5 GPIO1_IO03 Input 100 kΩ pull-up
GPIO_4 R6 NVCC_GPIO GPIO ALT5 GPIO1_IO04 Input 100 kΩ pull-up
GPIO_5 R4 NVCC_GPIO GPIO ALT5 GPIO1_IO05 Input 100 kΩ pull-up
GPIO_6 T3 NVCC_GPIO GPIO ALT5 GPIO1_IO06 Input 100 kΩ pull-up
GPIO_7 R3 NVCC_GPIO GPIO ALT5 GPIO1_IO07 Input 100 kΩ pull-up
GPIO_8 R5 NVCC_GPIO GPIO ALT5 GPIO1_IO08 Input 100 kΩ pull-up
GPIO_9 T2 NVCC_GPIO GPIO ALT5 GPIO1_IO09 Input 100 kΩ pull-up
HDMI_CLKM J5 HDMI — — HDMI_TX_CLK_N — —
HDMI_CLKP J6 HDMI — — HDMI_TX_CLK_P — —
HDMI_D0M K5 HDMI — — HDMI_TX_DATA0_N — —
HDMI_D0P K6 HDMI — — HDMI_TX_DATA0_P — —
HDMI_D1M J3 HDMI — — HDMI_TX_DATA1_N — —

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 Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
HDMI_D1P J4 HDMI — — HDMI_TX_DATA1_P — —
HDMI_D2M K3 HDMI — — HDMI_TX_DATA2_N — —
HDMI_D2P K4 HDMI — — HDMI_TX_DATA2_P — —
HDMI_HPD K1 HDMI — — HDMI_TX_HPD — —
JTAG_MOD H6 NVCC_JTAG GPIO ALT0 JTAG_MODE Input 100 kΩ pull-up
JTAG_TCK H5 NVCC_JTAG GPIO ALT0 JTAG_TCK Input 47 kΩ pull-up
JTAG_TDI G5 NVCC_JTAG GPIO ALT0 JTAG_TDI Input 47 kΩ pull-up
JTAG_TDO G6 NVCC_JTAG GPIO ALT0 JTAG_TDO Output Low
JTAG_TMS C3 NVCC_JTAG GPIO ALT0 JTAG_TMS Input 47 kΩ pull-up
JTAG_TRSTB C2 NVCC_JTAG GPIO ALT0 JTAG_TRSTB Input 47 kΩ pull-up
KEY_COL0 W5 NVCC_GPIO GPIO ALT5 GPIO4_IO06 Input 100 kΩ pull-up
KEY_COL1 U7 NVCC_GPIO GPIO ALT5 GPIO4_IO08 Input 100 kΩ pull-up
KEY_COL2 W6 NVCC_GPIO GPIO ALT5 GPIO4_IO10 Input 100 kΩ pull-up
KEY_COL3 U5 NVCC_GPIO GPIO ALT5 GPIO4_IO12 Input 100 kΩ pull-up
KEY_COL4 T6 NVCC_GPIO GPIO ALT5 GPIO4_IO14 Input 100 kΩ pull-up
KEY_ROW0 V6 NVCC_GPIO GPIO ALT5 GPIO4_IO07 Input 100 kΩ pull-up
KEY_ROW1 U6 NVCC_GPIO GPIO ALT5 GPIO4_IO09 Input 100 kΩ pull-up
KEY_ROW2 W4 NVCC_GPIO GPIO ALT5 GPIO4_IO11 Input 100 kΩ pull-up
KEY_ROW3 T7 NVCC_GPIO GPIO ALT5 GPIO4_IO13 Input 100 kΩ pull-up
KEY_ROW4 V5 NVCC_GPIO GPIO ALT5 GPIO4_IO15 Input 100 kΩ pull-down
LVDS0_CLK_N V4 NVCC_LVDS2P5 — — LVDS0_CLK_N — —
LVDS0_CLK_P V3 NVCC_LVDS2P5 — ALT0 LVDS0_CLK_P Input Keeper
LVDS0_TX0_N U2 NVCC_LVDS2P5 — — LVDS0_TX0_N — —
LVDS0_TX0_P U1 NVCC_LVDS2P5 — ALT0 LVDS0_TX0_P Input Keeper
LVDS0_TX1_N U4 NVCC_LVDS2P5 — — LVDS0_TX1_N — —
LVDS0_TX1_P U3 NVCC_LVDS2P5 — ALT0 LVDS0_TX1_P Input Keeper
LVDS0_TX2_N V2 NVCC_LVDS2P5 — — LVDS0_TX2_N — —
LVDS0_TX2_P V1 NVCC_LVDS2P5 — ALT0 LVDS0_TX2_P Input Keeper
LVDS0_TX3_N W2 NVCC_LVDS2P5 — — LVDS0_TX3_N — —
LVDS0_TX3_P W1 NVCC_LVDS2P5 — ALT0 LVDS0_TX3_P Input Keeper
LVDS1_CLK_N Y3 NVCC_LVDS2P5 — — LVDS1_CLK_N — —
LVDS1_CLK_P Y4 NVCC_LVDS2P5 — ALT0 LVDS1_CLK_P Input Keeper
LVDS1_TX0_N Y1 NVCC_LVDS2P5 — — LVDS1_TX0_N — —
LVDS1_TX0_P Y2 NVCC_LVDS2P5 — ALT0 LVDS1_TX0_P Input Keeper
LVDS1_TX1_N AA2 NVCC_LVDS2P5 — — LVDS1_TX1_N — —
LVDS1_TX1_P AA1 NVCC_LVDS2P5 — ALT0 LVDS1_TX1_P Input Keeper

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Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
LVDS1_TX2_N AB1 NVCC_LVDS2P5 — — LVDS1_TX2_N — —
LVDS1_TX2_P AB2 NVCC_LVDS2P5 — ALT0 LVDS1_TX2_P Input Keeper
LVDS1_TX3_N AA3 NVCC_LVDS2P5 — — LVDS1_TX3_N — —
LVDS1_TX3_P AA4 NVCC_LVDS2P5 — ALT0 LVDS1_TX3_P Input Keeper
NANDF_ALE A16 NVCC_NANDF GPIO ALT5 GPIO6_IO08 Input 100 kΩ pull-up
NANDF_CLE C15 NVCC_NANDF GPIO ALT5 GPIO6_IO07 Input 100 kΩ pull-up
NANDF_CS0 F15 NVCC_NANDF GPIO ALT5 GPIO6_IO11 Input 100 kΩ pull-up
NANDF_CS1 C16 NVCC_NANDF GPIO ALT5 GPIO6_IO14 Input 100 kΩ pull-up
NANDF_CS2 A17 NVCC_NANDF GPIO ALT5 GPIO6_IO15 Input 100 kΩ pull-up
NANDF_CS3 D16 NVCC_NANDF GPIO ALT5 GPIO6_IO16 Input 100 kΩ pull-up
NANDF_D0 A18 NVCC_NANDF GPIO ALT5 GPIO2_IO00 Input 100 kΩ pull-up
NANDF_D1 C17 NVCC_NANDF GPIO ALT5 GPIO2_IO01 Input 100 kΩ pull-up
NANDF_D2 F16 NVCC_NANDF GPIO ALT5 GPIO2_IO02 Input 100 kΩ pull-up
NANDF_D3 D17 NVCC_NANDF GPIO ALT5 GPIO2_IO03 Input 100 kΩ pull-up
NANDF_D4 A19 NVCC_NANDF GPIO ALT5 GPIO2_IO04 Input 100 kΩ pull-up
NANDF_D5 B18 NVCC_NANDF GPIO ALT5 GPIO2_IO05 Input 100 kΩ pull-up
NANDF_D6 E17 NVCC_NANDF GPIO ALT5 GPIO2_IO06 Input 100 kΩ pull-up
NANDF_D7 C18 NVCC_NANDF GPIO ALT5 GPIO2_IO07 Input 100 kΩ pull-up
NANDF_RB0 B16 NVCC_NANDF GPIO ALT5 GPIO6_IO10 Input 100 kΩ pull-up
NANDF_WP_B E15 NVCC_NANDF GPIO ALT5 GPIO6_IO09 Input 100 kΩ pull-up
ONOFF D12 VDD_SNVS_IN GPIO ALT0 SRC_ONOFF Input 100 kΩ pull-up
PCIE_RXM B1 PCIE_VPH — — PCIE_RX_N — —
PCIE_RXP B2 PCIE_VPH — — PCIE_RX_P — —
PCIE_TXM A3 PCIE_VPH — — PCIE_TX_N — —
PCIE_TXP B3 PCIE_VPH — — PCIE_TX_P — —
PMIC_ON_REQ D11 VDD_SNVS_IN GPIO ALT0 SNVS_PMIC_ON_REQ Output Open drain with
PU(100K) enable
PMIC_STBY_REQ F11 VDD_SNVS_IN GPIO ALT0 CCM_PMIC_STBY_REQ Output Low
POR_B C11 VDD_SNVS_IN GPIO ALT0 SRC_POR_B Input 100 kΩ pull-up
RGMII_RD0 C24 NVCC_RGMII DDR ALT5 GPIO6_IO25 Input 100 kΩ pull-up
RGMII_RD1 B23 NVCC_RGMII DDR ALT5 GPIO6_IO27 Input 100 kΩ pull-up
RGMII_RD2 B24 NVCC_RGMII DDR ALT5 GPIO6_IO28 Input 100 kΩ pull-up
RGMII_RD3 D23 NVCC_RGMII DDR ALT5 GPIO6_IO29 Input 100 kΩ pull-up
RGMII_RX_CTL D22 NVCC_RGMII DDR ALT5 GPIO6_IO24 Input 100 kΩ pull-down
RGMII_RXC B25 NVCC_RGMII DDR ALT5 GPIO6_IO30 Input 100 kΩ pull-down
RGMII_TD0 C22 NVCC_RGMII DDR ALT5 GPIO6_IO20 Input 100 kΩ pull-up

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 Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
RGMII_TD1 F20 NVCC_RGMII DDR ALT5 GPIO6_IO21 Input 100 kΩ pull-up
RGMII_TD2 E21 NVCC_RGMII DDR ALT5 GPIO6_IO22 Input 100 kΩ pull-up
RGMII_TD3 A24 NVCC_RGMII DDR ALT5 GPIO6_IO23 Input 100 kΩ pull-up
RGMII_TX_CTL C23 NVCC_RGMII DDR ALT5 GPIO6_IO26 Input 100 kΩ pull-down
RGMII_TXC D21 NVCC_RGMII DDR ALT5 GPIO6_IO19 Input 100 kΩ pull-down
RTC_XTALI D9 VDD_SNVS_CAP — — RTC_XTALI — —
RTC_XTALO C9 VDD_SNVS_CAP — — RTC_XTALO — —
SD1_CLK D20 NVCC_SD1 GPIO ALT5 GPIO1_IO20 Input 100 kΩ pull-up
SD1_CMD B21 NVCC_SD1 GPIO ALT5 GPIO1_IO18 Input 100 kΩ pull-up
SD1_DAT0 A21 NVCC_SD1 GPIO ALT5 GPIO1_IO16 Input 100 kΩ pull-up
SD1_DAT1 C20 NVCC_SD1 GPIO ALT5 GPIO1_IO17 Input 100 kΩ pull-up
SD1_DAT2 E19 NVCC_SD1 GPIO ALT5 GPIO1_IO19 Input 100 kΩ pull-up
SD1_DAT3 F18 NVCC_SD1 GPIO ALT5 GPIO1_IO21 Input 100 kΩ pull-up
SD2_CLK C21 NVCC_SD2 GPIO ALT5 GPIO1_IO10 Input 100 kΩ pull-up
SD2_CMD F19 NVCC_SD2 GPIO ALT5 GPIO1_IO11 Input 100 kΩ pull-up
SD2_DAT0 A22 NVCC_SD2 GPIO ALT5 GPIO1_IO15 Input 100 kΩ pull-up
SD2_DAT1 E20 NVCC_SD2 GPIO ALT5 GPIO1_IO14 Input 100 kΩ pull-up
SD2_DAT2 A23 NVCC_SD2 GPIO ALT5 GPIO1_IO13 Input 100 kΩ pull-up
SD2_DAT3 B22 NVCC_SD2 GPIO ALT5 GPIO1_IO12 Input 100 kΩ pull-up
SD3_CLK D14 NVCC_SD3 GPIO ALT5 GPIO7_IO03 Input 100 kΩ pull-up
SD3_CMD B13 NVCC_SD3 GPIO ALT5 GPIO7_IO02 Input 100 kΩ pull-up
SD3_DAT0 E14 NVCC_SD3 GPIO ALT5 GPIO7_IO04 Input 100 kΩ pull-up
SD3_DAT1 F14 NVCC_SD3 GPIO ALT5 GPIO7_IO05 Input 100 kΩ pull-up
SD3_DAT2 A15 NVCC_SD3 GPIO ALT5 GPIO7_IO06 Input 100 kΩ pull-up
SD3_DAT3 B15 NVCC_SD3 GPIO ALT5 GPIO7_IO07 Input 100 kΩ pull-up
SD3_DAT4 D13 NVCC_SD3 GPIO ALT5 GPIO7_IO01 Input 100 kΩ pull-up
SD3_DAT5 C13 NVCC_SD3 GPIO ALT5 GPIO7_IO00 Input 100 kΩ pull-up
SD3_DAT6 E13 NVCC_SD3 GPIO ALT5 GPIO6_IO18 Input 100 kΩ pull-up
SD3_DAT7 F13 NVCC_SD3 GPIO ALT5 GPIO6_IO17 Input 100 kΩ pull-up
SD3_RST D15 NVCC_SD3 GPIO ALT5 GPIO7_IO08 Input 100 kΩ pull-up
SD4_CLK E16 NVCC_NANDF GPIO ALT5 GPIO7_IO10 Input 100 kΩ pull-up
SD4_CMD B17 NVCC_NANDF GPIO ALT5 GPIO7_IO09 Input 100 kΩ pull-up
SD4_DAT0 D18 NVCC_NANDF GPIO ALT5 GPIO2_IO08 Input 100 kΩ pull-up
SD4_DAT1 B19 NVCC_NANDF GPIO ALT5 GPIO2_IO09 Input 100 kΩ pull-up
SD4_DAT2 F17 NVCC_NANDF GPIO ALT5 GPIO2_IO10 Input 100 kΩ pull-up
SD4_DAT3 A20 NVCC_NANDF GPIO ALT5 GPIO2_IO11 Input 100 kΩ pull-up

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Package Information and Contact Assignments

Table 88. 21 x 21 mm Functional Contact Assignments (continued)

Out of Reset Condition1

Default
Ball Name Ball Power Group Ball Type Mode Input/
Default Function Value2
(Reset Output
Mode)
SD4_DAT4 E18 NVCC_NANDF GPIO ALT5 GPIO2_IO12 Input 100 kΩ pull-up
SD4_DAT5 C19 NVCC_NANDF GPIO ALT5 GPIO2_IO13 Input 100 kΩ pull-up
SD4_DAT6 B20 NVCC_NANDF GPIO ALT5 GPIO2_IO14 Input 100 kΩ pull-up
SD4_DAT7 D19 NVCC_NANDF GPIO ALT5 GPIO2_IO15 Input 100 kΩ pull-up
TAMPER E11 VDD_SNVS_IN GPIO ALT0 SNVS_TAMPER Input 100 kΩ pull-down
TEST_MODE E12 VDD_SNVS_IN GPIO ALT0 TCU_TEST_MODE Input 100 kΩ pull-down
USB_H1_DN F10 VDDUSB_CAP — — USB_H1_DN — —
USB_H1_DP E10 VDDUSB_CAP — — USB_H1_DP — —
USB_OTG_CHD_B B8 VDDUSB_CAP — — USB_OTG_CHD_B — —
USB_OTG_DN B6 VDDUSB_CAP — — USB_OTG_DN — —
USB_OTG_DP A6 VDDUSB_CAP — — USB_OTG_DP — —
XTALI A7 NVCC_PLL_OUT — — XTALI — —
XTALO B7 NVCC_PLL_OUT — — XTALO — —
1
The state immediately after reset and before ROM firmware or software has executed.
2 Variance of the pull-up and pull-down strengths are shown in the tables as follows:
• Table 22, "GPIO DC Parameters," on page 39
• Table 23, "LPDDR2 I/O DC Electrical Parameters," on page 40
• Table 24, "DDR3/DDR3L I/O DC Electrical Characteristics," on page 40
3 ENET_REF_CLK is used as a clock source for MII and RGMII modes only. RGMII mode uses either GPIO_16 or

RGMII_TX_CTL as a clock source. For more information on these clocks, see the device Reference Manual and the Hardware
Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors (IMX6DQ6SDLHDG).

Table 89. Signals with Differing Before Reset and After Reset States

Before Reset State

Ball Name
Input/Output Value

EIM_A16 Input PD (100K)

EIM_A17 Input PD (100K)

EIM_A18 Input PD (100K)

EIM_A19 Input PD (100K)

EIM_A20 Input PD (100K)

EIM_A21 Input PD (100K)

EIM_A22 Input PD (100K)

EIM_A23 Input PD (100K)

EIM_A24 Input PD (100K)

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146 NXP Semiconductors
 Package Information and Contact Assignments

Table 89. Signals with Differing Before Reset and After Reset States (continued)

Before Reset State

Ball Name
Input/Output Value

EIM_A25 Input PD (100K)

EIM_DA0 Input PD (100K)

EIM_DA1 Input PD (100K)

EIM_DA2 Input PD (100K)

EIM_DA3 Input PD (100K)

EIM_DA4 Input PD (100K)

EIM_DA5 Input PD (100K)

EIM_DA6 Input PD (100K)

EIM_DA7 Input PD (100K)

EIM_DA8 Input PD (100K)

EIM_DA9 Input PD (100K)

EIM_DA10 Input PD (100K)

EIM_DA11 Input PD (100K)

EIM_DA12 Input PD (100K)

EIM_DA13 Input PD (100K)

EIM_DA14 Input PD (100K)

EIM_DA15 Input PD (100K)

EIM_EB0 Input PD (100K)

EIM_EB1 Input PD (100K)

EIM_EB2 Input PD (100K)

EIM_EB3 Input PD (100K)

EIM_LBA Input PD (100K)

EIM_RW Input PD (100K)

EIM_WAIT Input PD (100K)

GPIO_17 Output Drive state unknown (x)

GPIO_19 Output Drive state unknown (x)

KEY_COL0 Output Drive state unknown (x)

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NXP Semiconductors 147
 G F E D C B A

148
DSI_D0P NC NC CSI_D1M GND PCIE_RXM
6.2.3
1
DSI_D0M NC NC CSI_D1P JTAG_TRSTB PCIE_RXP PCIE_REXT 2
GND CSI_CLK0P CSI_D0P GND JTAG_TMS PCIE_TXP PCIE_TXM 3
DSI_REXT CSI_CLK0M CSI_D0M CSI_REXT GND GND GND 4
JTAG_TDI GND GND CLK2_P CLK2_N VDD_FA FA_ANA 5
JTAG_TDO GND GND GND GND USB_OTG_DN USB_OTG_DP 6

PCIE_VPH GND GND CLK1_P CLK1_N XTALO XTALI 7

PCIE_VPTX GND NVCC_PLL_OUT GND GPANAIO USB_OTG_CHD_B GND 8
VDD_SNVS_CAP VDDUSB_CAP USB_OTG_VBUS RTC_XTALI RTC_XTALO NC NC 9
GND USB_H1_DN USB_H1_DP USB_H1_VBUS GND NC NC 10
Package Information and Contact Assignments

VDD_SNVS_IN PMIC_STBY_REQ TAMPER PMIC_ON_REQ POR_B NC NC 11

NC BOOT_MODE1 TEST_MODE ONOFF BOOT_MODE0 NC NC 12
NC SD3_DAT7 SD3_DAT6 SD3_DAT4 SD3_DAT5 SD3_CMD GND 13
NVCC_SD3 SD3_DAT1 SD3_DAT0 SD3_CLK NC NC NC 14
21 x 21 mm, 0.8 mm Pitch Ball Map

NVCC_NANDF NANDF_CS0 NANDF_WP_B SD3_RST NANDF_CLE SD3_DAT3 SD3_DAT2 15

NVCC_SD1 NANDF_D2 SD4_CLK NANDF_CS3 NANDF_CS1 NANDF_RB0 NANDF_ALE 16

NVCC_SD2 SD4_DAT2 NANDF_D6 NANDF_D3 NANDF_D1 SD4_CMD NANDF_CS2 17

NVCC_RGMII SD1_DAT3 SD4_DAT4 SD4_DAT0 NANDF_D7 NANDF_D5 NANDF_D0 18

Table 90 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6Solo.

GND SD2_CMD SD1_DAT2 SD4_DAT7 SD4_DAT5 SD4_DAT1 NANDF_D4 19

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo

EIM_D20 RGMII_TD1 SD2_DAT1 SD1_CLK SD1_DAT1 SD4_DAT6 SD4_DAT3 20

EIM_D19 EIM_D17 RGMII_TD2 RGMII_TXC SD2_CLK SD1_CMD SD1_DAT0 21
EIM_D25 EIM_D24 EIM_EB2 RGMII_RX_CTL RGMII_TD0 SD2_DAT3 SD2_DAT0 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

EIM_D28 EIM_EB3 EIM_D22 RGMII_RD3 RGMII_TX_CTL RGMII_RD1 SD2_DAT2 23
EIM_A17 EIM_A22 EIM_D26 EIM_D18 RGMII_RD0 RGMII_RD2 RGMII_TD3 24
EIM_A19 EIM_A24 EIM_D27 EIM_D23 EIM_D16 RGMII_RXC GND 25

G F E D C B A

NXP Semiconductors
 R P N M L K J H
GPIO_17 CSI0_PIXCLK CSI0_DAT4 CSI0_DAT10 CSI0_DAT13 HDMI_HPD HDMI_REF DSI_D1P 1
GPIO_16 CSI0_DAT5 CSI0_VSYNC CSI0_DAT12 GND HDMI_DDCCEC GND DSI_D1M 2
GPIO_7 CSI0_DATA_EN CSI0_DAT7 CSI0_DAT11 CSI0_DAT17 HDMI_D2M HDMI_D1M DSI_CLK0M 3

NXP Semiconductors
GPIO_5 CSI0_MCLK CSI0_DAT6 CSI0_DAT14 CSI0_DAT16 HDMI_D2P HDMI_D1P DSI_CLK0P 4
GPIO_8 GPIO_19 CSI0_DAT9 CSI0_DAT15 GND HDMI_D0M HDMI_CLKM JTAG_TCK 5
GPIO_4 GPIO_18 CSI0_DAT8 CSI0_DAT18 CSI0_DAT19 HDMI_D0P HDMI_CLKP JTAG_MOD 6
GPIO_3 NVCC_GPIO NVCC_CSI HDMI_VPH HDMI_VP NVCC_MIPI NVCC_JTAG PCIE_VP 7
GND GND GND GND GND GND GND GND 8
VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDHIGH_IN VDDHIGH_IN 9
VDDSOC_CAP GND GND GND GND GND VDDHIGH_CAP VDDHIGH_CAP 10

VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP 11

GND GND NC GND GND GND GND GND 12

VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP 13

VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN 14

GND GND GND GND GND GND GND GND 15
VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN 16
GND VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP 17
NVCC_DRAM GND GND GND GND GND GND GND 18
NVCC_ENET NVCC_LCD DI0_DISP_CLK NVCC_EIM NVCC_EIM NVCC_EIM EIM_D29 EIM_A25 19
DISP0_DAT13 DISP0_DAT4 DI0_PIN3 EIM_DA11 EIM_DA0 EIM_RW EIM_D30 EIM_D21 20
DISP0_DAT10 DISP0_DAT3 DI0_PIN15 EIM_DA9 EIM_DA2 EIM_EB0 EIM_A23 EIM_D31 21
Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

DISP0_DAT8 DISP0_DAT1 EIM_BCLK EIM_DA10 EIM_DA4 EIM_LBA EIM_A18 EIM_A20 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

DISP0_DAT6 DISP0_DAT2 EIM_DA14 EIM_DA13 EIM_DA5 EIM_EB1 EIM_CS1 EIM_A21 23
DISP0_DAT7 DISP0_DAT0 EIM_DA15 EIM_DA12 EIM_DA8 EIM_DA3 EIM_OE EIM_CS0 24
DISP0_DAT5 DI0_PIN4 DI0_PIN2 EIM_WAIT EIM_DA7 EIM_DA6 EIM_DA1 EIM_A16 25

R P N M L K J H

149
Package Information and Contact Assignments
 AC AB AA Y W V U T

150
DRAM_D4 LVDS1_TX2_N LVDS1_TX1_P LVDS1_TX0_N LVDS0_TX3_P LVDS0_TX2_P LVDS0_TX0_P GPIO_2 1
DRAM_VREF LVDS1_TX2_P LVDS1_TX1_N LVDS1_TX0_P LVDS0_TX3_N LVDS0_TX2_N LVDS0_TX0_N GPIO_9 2
DRAM_DQM0 GND LVDS1_TX3_N LVDS1_CLK_N GND LVDS0_CLK_P LVDS0_TX1_P GPIO_6 3
DRAM_D2 DRAM_D6 LVDS1_TX3_P LVDS1_CLK_P KEY_ROW2 LVDS0_CLK_N LVDS0_TX1_N GPIO_1 4
DRAM_D13 DRAM_D12 DRAM_D3 GND KEY_COL0 KEY_ROW4 KEY_COL3 GPIO_0 5
DRAM_DQM1 DRAM_D14 DRAM_D10 DRAM_RESET KEY_COL2 KEY_ROW0 KEY_ROW1 KEY_COL4 6
DRAM_D15 DRAM_D16 GND DRAM_D20 GND NVCC_LVDS2P5 KEY_COL1 KEY_ROW3 7
DRAM_D22 DRAM_DQM2 DRAM_D17 DRAM_D21 GND GND GND GND 8
DRAM_D28 DRAM_D18 DRAM_D23 DRAM_D19 GND NVCC_DRAM VDDARM_IN VDDARM_IN 9
DRAM_SDQS3 DRAM_SDQS3_B GND DRAM_D25 GND NVCC_DRAM VDDSOC_CAP VDDSOC_CAP 10
Package Information and Contact Assignments

DRAM_D31 DRAM_D27 DRAM_SDCKE1 DRAM_SDCKE0 GND NVCC_DRAM GND GND 11

DRAM_A11 DRAM_SDBA2 DRAM_A14 DRAM_A15 GND NVCC_DRAM GND GND 12
DRAM_A6 DRAM_A8 GND DRAM_A7 GND NVCC_DRAM VDDSOC_CAP VDDSOC_CAP 13

DRAM_A0 DRAM_A1 DRAM_A2 DRAM_A3 DRAM_A4 NVCC_DRAM VDDSOC_CAP VDDSOC_CAP 14

DRAM_SDBA0 DRAM_RAS DRAM_A10 DRAM_SDBA1 GND NVCC_DRAM GND GND 15

DRAM_SDODT0 DRAM_SDWE GND DRAM_CS0 GND NVCC_DRAM VDDSOC_IN VDDSOC_IN 16

DRAM_A13 DRAM_SDODT1 NC NC GND NVCC_DRAM GND GND 17

NC NC NC NC GND NVCC_DRAM NVCC_DRAM NVCC_DRAM 18

NC NC GND NC GND GND GND GND 19

NC NC NC NC ENET_TXD1 ENET_MDC ENET_TXD0 DISP0_DAT21 20

NC NC NC NC ENET_RXD0 ENET_TX_EN ENET_CRS_DV DISP0_DAT16 21

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

NC NC GND NC ENET_RXD1 ENET_REF_CLK DISP0_DAT20 DISP0_DAT15 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NC NC NC NC ENET_RX_ER ENET_MDIO DISP0_DAT19 DISP0_DAT11 23

NC GND NC GND DISP0_DAT23 DISP0_DAT22 DISP0_DAT17 DISP0_DAT12 24

NC NC NC NC NC DISP0_DAT18 DISP0_DAT14 DISP0_DAT9 25

AC AB AA Y W V U T

NXP Semiconductors
 D C B A AE AD
CSI_D1M GND PCIE_RXM 1 1 GND DRAM_D5 1
CSI_D1P JTAG_TRSTB PCIE_RXP PCIE_REXT 2 2 DRAM_D1 DRAM_D0 2
GND JTAG_TMS PCIE_TXP PCIE_TXM 3 3 DRAM_SDQS0 DRAM_SDQS0_B 3

NXP Semiconductors
CSI_REXT GND GND GND 4 4 DRAM_D7 GND 4
CLK2_P CLK2_N VDD_FA FA_ANA 5 5 DRAM_D9 DRAM_D8 5
GND GND USB_OTG_DN USB_OTG_DP 6 6 DRAM_SDQS1_B DRAM_SDQS1 6
CLK1_P CLK1_N XTALO XTALI 7 7 DRAM_ GND 7
GND GPANAIO USB_OTG_CHD_B GND 8 8 DRAM_SDQS2_B DRAM_SDQS2 8
RTC_XTALI RTC_XTALO NC NC 9 9 DRAM_D24 DRAM_D29 9
USB_H1_VBUS GND NC NC 10 10 DRAM_DQM3 GND 10
PMIC_ON_REQ POR_B NC NC 11 11 DRAM_D26 DRAM_D30 11
ONOFF BOOT_MODE0 NC NC 12 12 DRAM_A9 DRAM_A12 12
SD3_DAT4 SD3_DAT5 SD3_CMD GND 13 13 DRAM_A5 GND 13
SD3_CLK NC NC NC 14 14 DRAM_SDCLK_1_B DRAM_SDCLK_1 14
SD3_RST NANDF_CLE SD3_DAT3 SD3_DAT2 15 15 DRAM_SDCLK_0_B DRAM_SDCLK_0 15
NANDF_CS3 NANDF_CS1 NANDF_RB0 NANDF_ALE 16 16 DRAM_CAS GND 16
NANDF_D3 NANDF_D1 SD4_CMD NANDF_CS2 17 17 ZQPAD DRAM_CS1 17
SD4_DAT0 NANDF_D7 NANDF_D5 NANDF_D0 18 18 NC NC 18
SD4_DAT7 SD4_DAT5 SD4_DAT1 NANDF_D4 19 19 NC GND 19
Table 91 shows the 21 x 21 mm, 0.8 mm pitch ball map for the i.MX 6DualLite.

SD1_CLK SD1_DAT1 SD4_DAT6 SD4_DAT3 20 20 NC NC 20

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite

RGMII_TXC SD2_CLK SD1_CMD SD1_DAT0 21 21 NC NC 21

Table 90. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo (continued)

RGMII_RX_CTL RGMII_TD0 SD2_DAT3 SD2_DAT0 22 22 NC GND 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

RGMII_RD3 RGMII_TX_CTL RGMII_RD1 SD2_DAT2 23 23 NC NC 23
EIM_D18 RGMII_RD0 RGMII_RD2 RGMII_TD3 24 24 NC NC 24
EIM_D23 EIM_D16 RGMII_RXC GND 25 25 GND NC 25

D C B A AE AD

151
Package Information and Contact Assignments
 M L K J H G F E

152
CSI0_DAT10 CSI0_DAT13 HDMI_HPD HDMI_REF DSI_D1P DSI_D0P NC NC 1
CSI0_DAT12 GND HDMI_DDCCEC GND DSI_D1M DSI_D0M NC NC 2
CSI0_DAT11 CSI0_DAT17 HDMI_D2M HDMI_D1M DSI_CLK0M GND CSI_CLK0P CSI_D0P 3
CSI0_DAT14 CSI0_DAT16 HDMI_D2P HDMI_D1P DSI_CLK0P DSI_REXT CSI_CLK0M CSI_D0M 4
CSI0_DAT15 GND HDMI_D0M HDMI_CLKM JTAG_TCK JTAG_TDI GND GND 5
CSI0_DAT18 CSI0_DAT19 HDMI_D0P HDMI_CLKP JTAG_MOD JTAG_TDO GND GND 6
HDMI_VPH HDMI_VP NVCC_MIPI NVCC_JTAG PCIE_VP PCIE_VPH GND GND 7
GND GND GND GND GND PCIE_VPTX GND NVCC_PLL_OUT 8
VDDARM_IN VDDARM_IN VDDARM_IN VDDHIGH_IN VDDHIGH_IN VDD_SNVS_CAP VDDUSB_CAP USB_OTG_VBUS 9

GND GND GND VDDHIGH_CAP VDDHIGH_CAP GND USB_H1_DN USB_H1_DP 10

Package Information and Contact Assignments

VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDD_SNVS_IN PMIC_STBY_REQ TAMPER 11

GND GND GND GND GND NC BOOT_MODE1 TEST_MODE 12
VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP NC SD3_DAT7 SD3_DAT6 13
VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN NVCC_SD3 SD3_DAT1 SD3_DAT0 14
GND GND GND GND GND NVCC_NANDF NANDF_CS0 NANDF_WP_B 15
VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN NVCC_SD1 NANDF_D2 SD4_CLK 16
VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP VDDPU_CAP NVCC_SD2 SD4_DAT2 NANDF_D6 17
GND GND GND GND GND NVCC_RGMII SD1_DAT3 SD4_DAT4 18
NVCC_EIM NVCC_EIM NVCC_EIM EIM_D29 EIM_A25 GND SD2_CMD SD1_DAT2 19
EIM_DA11 EIM_DA0 EIM_RW EIM_D30 EIM_D21 EIM_D20 RGMII_TD1 SD2_DAT1 20
EIM_DA9 EIM_DA2 EIM_EB0 EIM_A23 EIM_D31 EIM_D19 EIM_D17 RGMII_TD2 21
Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

EIM_DA10 EIM_DA4 EIM_LBA EIM_A18 EIM_A20 EIM_D25 EIM_D24 EIM_EB2 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

EIM_DA13 EIM_DA5 EIM_EB1 EIM_CS1 EIM_A21 EIM_D28 EIM_EB3 EIM_D22 23
EIM_DA12 EIM_DA8 EIM_DA3 EIM_OE EIM_CS0 EIM_A17 EIM_A22 EIM_D26 24
EIM_WAIT EIM_DA7 EIM_DA6 EIM_DA1 EIM_A16 EIM_A19 EIM_A24 EIM_D27 25

M L K J H G F E

NXP Semiconductors
 Y W V U T R P N
LVDS1_TX0_N LVDS0_TX3_P LVDS0_TX2_P LVDS0_TX0_P GPIO_2 GPIO_17 CSI0_PIXCLK CSI0_DAT4 1
LVDS1_TX0_P LVDS0_TX3_N LVDS0_TX2_N LVDS0_TX0_N GPIO_9 GPIO_16 CSI0_DAT5 CSI0_VSYNC 2
LVDS1_CLK_N GND LVDS0_CLK_P LVDS0_TX1_P GPIO_6 GPIO_7 CSI0_DATA_EN CSI0_DAT7 3

NXP Semiconductors
LVDS1_CLK_P KEY_ROW2 LVDS0_CLK_N LVDS0_TX1_N GPIO_1 GPIO_5 CSI0_MCLK CSI0_DAT6 4
GND KEY_COL0 KEY_ROW4 KEY_COL3 GPIO_0 GPIO_8 GPIO_19 CSI0_DAT9 5
DRAM_RESET KEY_COL2 KEY_ROW0 KEY_ROW1 KEY_COL4 GPIO_4 GPIO_18 CSI0_DAT8 6
DRAM_D20 GND NVCC_LVDS2P5 KEY_COL1 KEY_ROW3 GPIO_3 NVCC_GPIO NVCC_CSI 7
DRAM_D21 GND GND GND GND GND GND GND 8
DRAM_D19 GND NVCC_DRAM VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN VDDARM_IN 9
DRAM_D25 GND NVCC_DRAM VDDSOC_CAP VDDSOC_CAP VDDSOC_CAP GND GND 10
DRAM_SDCKE0 GND NVCC_DRAM GND GND VDDARM_CAP VDDARM_CAP VDDARM_CAP 11

DRAM_A15 GND NVCC_DRAM GND GND GND GND NC 12

DRAM_A7 GND NVCC_DRAM VDDSOC_CAP VDDSOC_CAP VDDARM_CAP VDDARM_CAP VDDARM_CAP 13

DRAM_A3 DRAM_A4 NVCC_DRAM VDDSOC_CAP VDDSOC_CAP VDDARM_IN VDDARM_IN VDDARM_IN 14

DRAM_SDBA1 GND NVCC_DRAM GND GND GND GND GND 15
DRAM_CS0 GND NVCC_DRAM VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN VDDSOC_IN 16
DRAM_D36 GND NVCC_DRAM GND GND GND VDDPU_CAP VDDPU_CAP 17
DRAM_D37 GND NVCC_DRAM NVCC_DRAM NVCC_DRAM NVCC_DRAM GND GND 18
DRAM_D40 GND GND GND GND NVCC_ENET NVCC_LCD DI0_DISP_CLK 19

DRAM_D44 ENET_TXD1 ENET_MDC ENET_TXD0 DISP0_DAT21 DISP0_DAT13 DISP0_DAT4 DI0_PIN3 20

DRAM_DQM7 ENET_RXD0 ENET_TX_EN ENET_CRS_DV DISP0_DAT16 DISP0_DAT10 DISP0_DAT3 DI0_PIN15 21
Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

DRAM_D59 ENET_RXD1 ENET_REF_CLK DISP0_DAT20 DISP0_DAT15 DISP0_DAT8 DISP0_DAT1 EIM_BCLK 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

DRAM_D62 ENET_RX_ER ENET_MDIO DISP0_DAT19 DISP0_DAT11 DISP0_DAT6 DISP0_DAT2 EIM_DA14 23
GND DISP0_DAT23 DISP0_DAT22 DISP0_DAT17 DISP0_DAT12 DISP0_DAT7 DISP0_DAT0 EIM_DA15 24
DRAM_D58 DRAM_D63 DISP0_DAT18 DISP0_DAT14 DISP0_DAT9 DISP0_DAT5 DI0_PIN4 DI0_PIN2 25

Y W V U T R P N

153
Package Information and Contact Assignments
 AE AD AC AB AA

154
1 GND DRAM_D5 DRAM_D4 LVDS1_TX2_N LVDS1_TX1_P 1

2 DRAM_D1 DRAM_D0 DRAM_VREF LVDS1_TX2_P LVDS1_TX1_N 2

3 DRAM_SDQS0 DRAM_SDQS0_B DRAM_DQM0 GND LVDS1_TX3_N 3

4 DRAM_D7 GND DRAM_D2 DRAM_D6 LVDS1_TX3_P 4

5 DRAM_D9 DRAM_D8 DRAM_D13 DRAM_D12 DRAM_D3 5

6 DRAM_SDQS1_B DRAM_SDQS1 DRAM_DQM1 DRAM_D14 DRAM_D10 6

7 DRAM_D11 GND DRAM_D15 DRAM_D16 GND 7

8 DRAM_SDQS2_B DRAM_SDQS2 DRAM_D22 DRAM_DQM2 DRAM_D17 8

9 DRAM_D24 DRAM_D29 DRAM_D28 DRAM_D18 DRAM_D23 9

10 DRAM_DQM3 GND DRAM_SDQS3 DRAM_SDQS3_B GND 10

Package Information and Contact Assignments

11 DRAM_D26 DRAM_D30 DRAM_D31 DRAM_D27 DRAM_SDCKE1 11

12 DRAM_A9 DRAM_A12 DRAM_A11 DRAM_SDBA2 DRAM_A14 12

13 DRAM_A5 GND DRAM_A6 DRAM_A8 GND 13

14 DRAM_SDCLK_1_B DRAM_SDCLK_1 DRAM_A0 DRAM_A1 DRAM_A2 14

15 DRAM_SDCLK_0_B DRAM_SDCLK_0 DRAM_SDBA0 DRAM_RAS DRAM_A10 15

16 DRAM_CAS GND DRAM_SDODT0 DRAM_SDWE GND 16

17 ZQPAD DRAM_CS1 DRAM_A13 DRAM_SDODT1 DRAM_D32 17

18 DRAM_SDQS4_B DRAM_SDQS4 DRAM_D34 DRAM_DQM4 DRAM_D33 18

19 DRAM_D35 GND DRAM_D39 DRAM_D38 GND 19

20 DRAM_SDQS5_B DRAM_SDQS5 DRAM_DQM5 DRAM_D41 DRAM_D45 20

21 DRAM_D46 DRAM_D43 DRAM_D47 DRAM_D42 DRAM_D57 21

Table 91. 21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite (continued)

22 DRAM_D49 GND DRAM_D48 DRAM_D52 GND 22

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

23 DRAM_SDQS6_B DRAM_SDQS6 DRAM_D53 DRAM_D60 DRAM_D61 23

24 DRAM_D50 DRAM_DQM6 DRAM_D51 GND DRAM_SDQS7_B 24

25 GND DRAM_D54 DRAM_D55 DRAM_D56 DRAM_SDQS7 25

AE AD AC AB AA

NXP Semiconductors
 Revision History

7 Revision History
Table 92 provides the current revision history for this data sheet. Table 93 provides a revision history for
previous revisions.
Table 92. i.MX 6Solo/6DualLite Data Sheet Document Rev. 9 History

Rev.
Date Substantive Changes
Number
9 10/2018 Changes to Revision 9 include the following:
• Table 3, "Special Signal Considerations," on page 20: Corrected,
– Row: NC, from “These signals are No Connected …” to read, “These signals are not functional and
must remain unconnected by the user.”
• Table 8, "Operating Ranges," on page 25: Corrected, Run Mode LDO enabled: VDD_ARM_IN; Corrected
minimum for operation up to 396 MHz LDO from 1.275 V to 1.25 V.
• Table 8, "Operating Ranges," on page 25: Corrected footnote 5:
– Changed from: “When VDD_SOC_IN does not supply… then maximum setting can be 1.3V.”
– Changed to: “When using VDD_SOC_CAP to supply the PCIE_VP and PCIE_VPTX, the maximum
setting is 1.175V. …”
• Table 49, "eMMC4.4/4.41 Interface Timing Specification," on page 77,
– Row: SD2, uSDHC Output Delay: Changed tOD from 2.5ns minimum to 2.8ns and 7.1ns maximum to
6.8ns.
• Table 87, "21 x 21 mm Supplies Contact Assignments," on page 133: Corrected,
– Last row: NC, from “—” to read, These signals are not functional and must remain unconnected by the
user.
8 09/2017 • Replaced ipp_dse with DSE throughout.
• Section 1, “Introduction: Replaced text “low voltage DDR3” with “DDR3L” in the features list of i.MX
6Solo/6DualLite applications processors.
• Table 1, "Example Orderable Part Numbers," on page 3: Added orderable part numbers.
• Figure 1: Updated to include Rev 1.4 in Silicon Revision section.
• Section 2.1, “Block Diagram: Updated WEIM with EIM in the block diagram.
• Table 2, "i.MX 6Solo/6DualLite Modules List," on page 10: Rearranged alphabetically.
• Table 6, "Absolute Maximum Ratings," on page 23:
– Removed VDD_HIGH_IN supply voltage (LDO bypass) parameter.
– Max. value of VDD_HIGH_CAP supply output voltage corrected to 2.85V.
• Table 21: Updated test condition of “XTALI input leakage current at startup” parameter; replaced 32KHz RTC
with 24MHz.
• Added Section 4.6.4, “RGMII I/O 2.5V I/O DC Electrical Parameters.
• Section 4.8.2, “DDR I/O Output Buffer Impedance: Modified introductory text.
• Corrected Figure 20, "Asynchronous A/D Muxed Write Access," on page 57.
• Table 49, "eMMC4.4/4.41 Interface Timing Specification," on page 77:
– Added the following footnote to Card Input Clock section: 1 Clock duty cycle will be in the range of 47% to
53%.
– Min. value of uSDHC Input Setup Time reduced to 1.7ns.

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 155
Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories

Rev.
Date Substantive Changes
Number

7 10/2016 • Table 1, "Example Orderable Part Numbers," on page 3: Added footnote.

• Figure 1, "Part Number Nomenclature—i.MX 6Solo and 6DualLite," on page 4: Added to Silicon
Revision block: Revision 1.2 and 1.3 and associated Mask ID.
• Table 6, "Absolute Maximum Ratings," on page 23:
– NVCC_DRAM maximum value changed to 1.975 V.
– Included footnote to NVCC_DRAM maximum value regarding maximum voltage allowance.
– Added row to Vin/Vout I/O supply voltage, separating DDR pins and non-DDR pins and included
footnote regarding maximum voltage allowance.
• Table 8, "Operating Ranges," on page 25: Added footnotes within the Comments column for the Run
Mode, LDO Enabled row; VDD_SOC_IN maximum values.
• Section 4.6.3, “DDR I/O DC Parameters: Added reference for more DDR details to see the MMDC
section.
Moved JEDEC standard information to footnote.
• Section 4.7.2, “DDR I/O AC Parameters: Added reference for more DDR details to see the MMDC
section.
Moved JEDEC standard information to footnote.
• Table 40, "i.MX 6Solo Supported DDR3/DDR3L/LPDDR2 Configurations," on page 60: Changed
LPDDR2 Channel column from “Dual” to “Single.”
• Table 41, "i.MX 6DualLite Supported DDR3/DDR3L/LPDDR2 Configurations," on page 61: Added
LPDDR2 Dual Channel column.
• Table 86, "21 x 21, 0.8 mm BGA Package Details," on page 132: Correction to package total thickness.
• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135: DRAM_SDCKLn rows, reverted
to “Low” rather than “0” in the Value column.

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156 NXP Semiconductors
 Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.
Date Substantive Changes
Number

6 8/2016 • Changed throughout:

- LVDDR3 to DDR3L
- Changed terminology from “floating” to “not connected”.
• Table 2, "i.MX 6Solo/6DualLite Modules List," on page 10:
- uSDHC1–4, SD/MMC and SDXC Enhanced Multi-Media Card/Secure Digital Host Controller row:
Added new bullet at top: “Conforms to the SD Host Controller…”.
- eCSPI1-4 row: removed from the Brief Description column, “with data rate up to 52Mbit/s.”
- BCH row, removed from Brief Description column, “encryption/decryption”.
• Table 3, "Special Signal Considerations," on page 20:
- GPANAIO row, modified remarks to be NXP use only.
- SRC_POR_B row: removed reference to internal POR which is not supported on device.
- TEST_MODE row: modified remarks to be NXP use only and added tie to Vss or remain unconnected.
• Table 6, "Absolute Maximum Ratings," on page 23” throughout table: clarified parameter descriptions
including adding LDO state. Clarified symbol names.
- Added row, RGMII I/O supply voltage.
- Added VDD_HIGH_CAP supply voltage row for LDO output.
- Added to USB supply voltage row: USB_OTG_CHD_B.
- All maximum voltages increased (improved).
• Section 4.1.2, “Thermal Resistance: added NOTE.
• Table 8, "Operating Ranges," on page 25: Changed minimum parameter of Run mode: LDO enabled
from 1.175 to 1.25 V.
• Section 4.2.1, “Power-Up Sequence”: Removed references to the internal POR function. Internal POR
is not supported. Removed fourth and fifth bullets.
• Section 4.2.3, “Power Supplies Usage”: Added NOTE, “When the PCIE interface is not used…”.
• Section 4.5.2, “OSC32K”: Removed battery resistor (coin cell) calculation.
• Section 4.6.1, “XTALI and RTC_XTALI (Clock Inputs) DC Parameters”:
- Added 3 rows: Input capacitance; Startup current; and DC input current.
- Added footnote to RTC_XTALI high-level DC input voltage at the Max parameter.
- Added NOTE following table: “The Vil and Vih only apply when external clock source is used…”.
• Section 4.9.4, “Multi-Mode DDR Controller (MMDC)”: this new section added, replacing the original
section 4.9.4 “DDR SRAM Specific Parameters (DDR3/DDR3L and LPDDR2)”.
• Figure 34, "ECSPI Master Mode Timing Diagram," on page 70: Added note, “ECSPI_MOSI always…”.
• Figure 35, "ECSPI Slave Mode Timing Diagram," on page 71: Added note, “ECSPI_MOSI always
driven…”.
• Figure 40, "SDR50/SDR104 Timing," on page 78: Aligned SD4 and SD5.
• Table 50, "SDR50/SDR104 Interface Timing Specification," on page 78:
- Corrected Clock High Time ID to SD3.
- Changed SD2 and SD3 Min and max values to 0.46 and 0.54.
- Changed SD5 Max to 0.74.
• Table 60, "Camera Input Signal Cross Reference, Format, and Bits Per Cycle," on page 90: Changed
RGB565 column heading from 2 to 1 cycle.
• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135:
- Table row: DRAM_SDCLK0 and DRAM_SDCLK1 changed Out of Reset Condition from Low to 0.
- Added to ZQPAD row: requirement to add resistor to GND.

5 6/2015 • Table 8, “Operating Ranges,” Run mode: LDO enabled row; Changed comments for VDD_ARM_IN,
from “1.05V minimum for operation up to 396MHz” to “1.125V minimum for operation up to 396MHz”.
• Table 3, “Special Signal Considerations,” XTALI/XTALO row: Changed from “The crystal must be
rated...”, to “See Hardware Development Guide”.

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NXP Semiconductors 157
Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.
Date Substantive Changes
Number

Rev. 4 12/2014 • Figure 1, “Part Number Nomenclature—i.MX 6Solo and 6DualLite”: Added Silicon Rev 1.3. to diagram
• Table 2, Modules List, UART 1–5 Description changed: baud rate up from 5MHz to 5Mbps.
• Added Figure 2, "Example Part Marking," on page 4.
• Section 1.2, “Features”: under, Miscellaneous IPs and interfaces: Changed UARTs bullet, from “up to
4.0 Mbps”, to “up to 5.0 Mbps”.
• Table 8, “Operating Ranges,” on page 29:
— Changed Run mode: VDD_ARM_IN minimum value from 1.05 to 1.125V; for operation up to 396
MHz. and changed LDO bypassed maximum value from 1.225V to 1.21V; for VDD_SOC_IN.
— Changed PCIe supply voltages; PCIE_VP/PCIE_VPTX maximum value from 1.225V to 1.21V
• Table 10, "Maximum Supply Currents," on page 28;
— Changed VDD_ARM_IN from single condition to include DualLite and Solo conditions with Maximum
current values of 2200 and 1320 mA, respectively.
— Added footnote for NVCC_LVDS2P5 supply.
• Table 38, “Reset Timing Parameters”: Removed footnote regarding SRC_POR_B rise and fall times.
• Section 4.9.3, “External Interface Module (EIM)”: Changed first paragraph to describe two systems
clocks used with EIM: ACLK_EIM_SLOW_CLK_ROOT and ACLK_EXSC (for synchronous mode).
• Table 31, “DDR I/O DDR3/DDR3L Mode AC Parameters”; Added footnote about extended range for Vix.
• Table 48, “DDR3/DDR3L Timing Parameter Table,” on page 76; Added DDR0, tCK(avg) and parameter
values. Changed symbol names DDR1 through DDR7 to include avg or base; changed minimum
parameter values for DDR4–DDR7. Added footnote about tIS and tIH base values.
• Figure 25, “DDR3 Command and Address Timing Parameters,” on page 76; Added DDR0.
• Table 49, “DDR3/DDR3L Write Cycle,” on page 77; Changed symbol names of DDR17 and DDR18 to
include base(AC150/DC100); Changed Units from tCK to tCK(avg).
• Table 46, “LPDDR2 Write Cycle,” on page 64; Changed LP21 min/max parameter values from
-0.25/+0.25 to 0.75/1.25.
• Table 38, "EIM Bus Timing Parameters," on page 52: Changed footnotes regarding the system clocks
used with EIM: from axi_clk to ACLK_EXSC or ACLK_EIM_SLOW_CLK_ROOT.
• Table 49, “DDR3/DDR3L Write Cycle,” on page 77: Changed DDR17 minimum value from 420 ps to
125 ps and DDR18 from 345 ps to 150 ps.
• Table 49, “DDR3/DDR3L Write Cycle,” on page 77: Added footnote 4.
• Table 65, "LVDS Display Bridge (LDB) Electrical Specification," on page 102: Corrected Units for Output
Voltage High and Output Voltage Low from mV to V.
• Table 67, "Electrical and Timing Information," on page 105: Moved rows tSETUP[RX] and tHOLD[RX]
to be directly under HS Line Receiver AC Specifications heading row.
• Table 87, "21 x 21 mm Supplies Contact Assignments," on page 133: Removed A1 pin.
• Table 88, "21 x 21 mm Functional Contact Assignments," on page 135: Moved rows DRAM_4,
DRAM_5, and DRAM_6 out of the i.MX 6DualLite section (shaded gray) to the i.MX 6Solo section above
DRAM_7 and (unshaded).
• Table 90, "21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6Solo," on page 148: Removed “NC” from A1 pin
location.
• Table 91, "21 x 21 mm, 0.8 mm Pitch Ball Map i.MX 6DualLite," on page 151: Removed “NC” from A1
pin location.

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158 NXP Semiconductors
 Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.
Date Substantive Changes
Number

Rev. 3 02/2014 • Updates throughout for Silicon revision C, including:

- Figure 1 Part number nomenclature diagram
- Table 1 Example Orderable Part Numbers
• Feature descriptions updated for:
- Camera sensors: updated from one to two ports at up to 240 MHz peak.
- Miscellaneous IPs and interfaces; SSI and ESAI.
• Table 2, Modules List, uSDHC 1–4 description change: including SDXC cards up to 2 TB.
• Table 2, Modules List, UART 1–5 description change: programmable baud rate up to 5 MHz.
• Table 3, Special Signal Considerations: XTALOSC_RTC_XTALI/RTC_XTALO: ending paragraph
removed. Was: “In case when high accuracy real time clock are not required system may use internal
low frequency ring oscillator. It is recommended to connect XTALOSC_RTC_XTALI to GND and keep
RTC_XTALO floating.”
• Table 8, Operating Ranges for Run mode LDO bypassed: Added footnote regarding alternate maximum
voltage on VDD_SOC_IN … this maximum can be 1.3V.
• Table 8, Operating Ranges Standby/DSM mode: Added footnote regarding alternate maximum voltage
on VDD_SOC_IN … this maximum can be 1.3V.
• Table 8, Operating Ranges GPIO supply voltages: Corrected supply name to NVCC_NANDF
• Table 8, Operating ranges: updated table footnotes for clarity.
• Removed table “On-Chip LDOs and their On-Chip Loads.”
• Section 4.1.4, External Clock Sources; added Note, “The internal RTC oscillator does not...”.
• Section 4.1.5, Maximum Supply Currents: Reworded second paragraph about the power management
IC to explain that a robust thermal design is required for the increased system power dissipation.
• Table 10, Maximum Supply Currents: NVCC_RGMII Condition value corrected to N=6.
• Table 10, Maximum Supply Currents: Corrected supply name NVCC_NANDF.
• Table 10, Maximum Supply currents: Added row NVCC_LVDS2P5
• Section 4.2.1, Power-Up Sequence: Clarified wording of third bulleted item regarding POR control.
• Section 4.2.1, Power-Up Sequence: Removed Note.
• Section 4.2.1, Power-Up Sequence: Corrected bullet regarding VDD_ARM_CAP / VDD_SOC_CAP
difference from 50 mV to 100 mV.
• Section 4.5.2, OSC32K, second paragraph reworded to describe OSC32K automatic switching.
• Section 4.5.2, OSC32K, added Note following second paragraph to caution use of internal oscillator.
• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih minimum value to 0.8.
• Table 23, XTALI and RTC_XTALI DC parameters; changed RTC_XTALI Vih maximum value to 1.1.
• Table 35, Reset Timing Parameters; removed rise/fall time requirement
• Section 4.9.3, External Interface Module; enhanced wording to first paragraph to describe operating
frequency for data transfers, and to explain register settings are valid for entire range of frequencies.
Rev. 3 2/2014 • Table 38, EIM Bus Timing Parameters; reworded footnotes for clarity.
continued • Table 38, EIM Asynchronous Timing Parameters; removed comment from the Max heading cell.
• Figure 58, Gated Clock Mode Timing Diagram: Corrected HSYNC trace behavior
• Table 62, Video Signal Cross-Reference: Corrected naming of HSYNC and VSYNC
• Section 4.11.21, USB PHY Parameters: Updated Battery Charging Specification bullet
• Table 86, BGA Package Details: Corrected to read “21 x 21, 0.8 mm”.
• Table 87, Supplies Contact Assignments: Corrected supply name NVCC_NANDF
• Table 87, Supplies Contact Assignments: Updated NC rows to show i.MX 6DualLite vs. i.MX 6Solo
• Table 88, Functional Contact Assignments: ALT5 Default function signal names corrected
• Table 88, Functional Contact Assignments: PMIC_ON_REQ Out of Reset value corrected to “Open
Drain with PU (100K) enabled”
• Table 88, Functional Contact Assignments: TEST_MODE row included
• Table 88, Functional Contact Assignments: VDD_ARM_IN and ZQPAD row removed

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

NXP Semiconductors 159
Revision History

Table 93. i.MX 6Solo/6DualLite Data Sheet Document Past Revision Histories (continued)

Rev.
Date Substantive Changes
Number

Rev. 2.2 8/2013 • 21x21 functional contact table: changed from NAND to NANDF
• System Timing Parameters Table 35, Reset timing parameter, CC1 description, change from:
“Duration of SRC_POR_B to be qualified as valid (<= 5 ns)” to:
“Duration of SRC_POR_B to be qualified as valid”
and added a footnote to the parameter with the following text:
“SRC_POR_B rise and fall times must be 5 ns or less.”

Rev. 2.1 5/2013 Substantive changes throughout this document are as follows:
• Incorporated standardized signal names. This change is extensive throughout.
• Added reference to EB792, i.MX Signal Name Mapping.
• Figures updated to align to standardized signal names.
• Updated references to eMMC standard to include 4.41.
• Figure 1 Part Number Nomenclature: Updates to Part differentiator section to align with Table 1.
• Table 1 “Orderable Part Numbers,” added Arm core information to the Options column:
2x “Arm Cortex-A9” 64-bit to 6DualLite
1x “Arm Cortex -A9” 32-bit to 6Solo
• Table 2 Changed reference to Global Power Controller to read General Power Controller.
• Table 8 “Operating Ranges,” added reference for information on product lifetime: i.MX 6Dual/6Quad
Product Usage Lifetime Estimates Application Note, AN4725.
• Table 10 “Maximum Supply Currents,” updated footnote 2.
• Table 11 Stop Mode Current and Power Consumption: Added SNVS Only mode.
• Table 56 RGMII parameter TskewT minimum and maximum values corrected.
• Table 56 RGMII parameter TskewR units corrected.
• Table 88 Clarification of ENET_REF_CLK naming.
• Added Table 89, "Signals with Differing Before Reset and After Reset States," on page 146.
• Removed section, EIM Signal Cross Reference. Signal names are now aligned with reference manual.
• Removed table from Section 3.2, “Recommended Connections for Unused Analog Interfaces and
referenced the Hardware Development Guide.
• Section 1.2, “Features added bulleted item regarding the SOC-level memory system.
• Section 1.2, “Features Camera sensors: Changed Camera port to be up to 180 MHz peak.
• Added Section 1.3, “Updated Signal Naming Convention
• Section 4.2.1, “Power-Up Sequence” updated wording.
• Section 4.3.2, “Regulators for Analog Modules” section updates.
• Added Section 4.6.1, “XTALI and RTC_XTALI (Clock Inputs) DC Parameters.”
• Section 4.10, “General-Purpose Media Interface (GPMI) Timing” figures replaced, tables revised.

i.MX 6Solo/6DualLite Applications Processors for Industrial Products, Rev. 9, 11/2018

160 NXP Semiconductors
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Document Number: IMX6SDLIEC

Rev. 9
11/2018