SN75ALS172A
SN75ALS172A
SN75ALS172A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 1998, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each driver)
INPUT ENABLES OUTPUTS
A G G Y Z
H H X H L
L H X L H
H X L H L
L X L L H
X L H Z Z
H = high level, L = low level, X = irrelevant,
Z = high impedance (off)
logic symbol†
4
G ≥1
12 EN
G
2
1 1Y
1A 3
1Z
6
7 2Y
2A 5
2Z
10
9 3Y
3A 11
3Z
14
15 4Y
4A 13
4Z
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the N package.
2
1 1Y
1A 3
1Z
6
7 2Y
2A 5
2Z
10
9 3Y
3A 11
3Z
14
15 4Y
4A 13
4Z
Pin numbers shown are for the N package.
Input
Output
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –9 V to 14 V
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to network ground terminal.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VIK Input clamp voltage II = –18 mA –1.5 V
VO Output voltage IO = 0 0 6 V
|VOD1| Differential output voltage IO = 0 1.5 6 V
VCC = 5 V, RL = 100 Ω, See Figure 1 1/2 VOD1 or 2‡
|VOD2| Differential output voltage V
RL = 54 Ω, See Figure 1 1.5 2.5 5
|VOD3| Differential output voltage See Note 2 1.5 5 V
Change in magnitude of
∆|VOD| RL = 54 Ω or 100 Ω, See Figure 1 ±0.2 V
differential output voltage§
3
VOC Common-mode output voltage¶ RL = 54 Ω or 100 Ω, See Figure 1 V
–1
Change in magnitude of
∆|VOC| RL = 54 Ω or 100 Ω, See Figure 1 ±0.2 V
common-mode output voltage§
IO Output current with power off VCC = 0, VO = –7 V to 12 V ±100 µA
High-impedance-state
IOZ VO = –7 V to 12 V ±100 µA
output current
IIH High-level input current VI = 2.7 V 20 µA
IIL Low-level input current VI = 0.4 V –100 µA
IOS Short-circuit output current VO = –7 V to 12 V ±250 mA
Outputs enabled 36 55
ICC Supply current (all drivers) No load mA
Outputs disabled 15 30
† All typical values are at VCC = 5 V and TA = 25°C.
‡ The minimum VOD2 with a 100-Ω load is either 1/2 VOD1 or 2 V, whichever is greater.
§ ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low
level.
¶ In ANSI Standard EIA/TIA-422-B, VOC, which is the average of the two output voltages with respect to ground, is called output offset voltage,
VOS.
NOTE 2: See EIA Standard RS-485, Figure 3-5, Test Termination Measurement 2.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
td(OD) Differential-output delay time RL = 54 Ω, See Figure 2 9 15 22 ns
tPZH Output enable time to high level RL = 110 Ω, See Figure 3 30 45 70 ns
tPZL Output enable time to low level RL = 110 Ω, See Figure 4 25 40 65 ns
tPHZ Output disable time from high level RL = 110 Ω, See Figure 3 10 20 35 ns
tPLZ Output disable time from low level RL = 110 Ω, See Figure 4 10 30 45 ns
† All typical values are at VCC = 5 V and TA = 25°C.
RL
2
VOD2
RL
VOC
2
Y
3V
CL RL = Input 1.5 V 1.5 V
Generator 54 Ω 0V
50 Ω td(ODL)
(see Note A) 3V Z td(ODH)
CL = 50 pF Output Z
(see Note B)
Output Y
TEST CIRCUIT VOLTAGE WAVEFORMS
NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, ZO = 50 Ω, duty cycle = 50%, tf ≤ 5 ns,
tr ≤ 5 ns.
B. CL includes probe and stray capacitance.
Output 3V
Input 1.5 V 1.5 V
0 V or 3 V S1
0V
CL = 50 pF tPZH 0.5 V
Generator 50 Ω (see Note B) RL = 110 Ω
(see Note A) VOH
Output
3V 2.3 V
Voff ≈ 0
(see Note C) tPHZ
RL = 110 Ω
3V
S1 Output Input 1.5 V 1.5 V
0 V or 3 V
0V
tPZL tPLZ
CL = 50 pF
Generator 50 Ω
(see Note B) 5V
(see Note A) 2.3 V
Output
3V VOL
(see Note C)
0.5 V
TEST CIRCUIT VOLTAGE WAVEFORMS
NOTES: A. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, ZO = 50 Ω, duty cycle = 50%, tf ≤ 5 ns,
tr ≤ 5 ns.
B. CL includes probe and stray capacitance.
C. To test the active-low enable G, ground G and apply an inverted input waveform to G.
www.ti.com 18-Nov-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE OUTLINE
DW0020A SCALE 1.200
SOIC - 2.65 mm max height
SOIC
13.0 2X
12.6 11.43
NOTE 3
10
11
0.51
20X
7.6 0.31 2.65 MAX
B 0.25 C A B
7.4
NOTE 4
0.33
TYP
0.10
0.25
SEE DETAIL A GAGE PLANE
1.27 0.3
0 -8 0.40 0.1
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
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EXAMPLE BOARD LAYOUT
DW0020A SOIC - 2.65 mm max height
SOIC
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10 11
(9.3)
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EXAMPLE STENCIL DESIGN
DW0020A SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
10 11
(9.3)
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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