Stusb 4500
Stusb 4500
Datasheet
Features
Description
The STUSB4500 is a USB power delivery controller that addresses sink up to 100 W
(20 V; 5 A). It implements a proprietary algorithm to allow the negotiation of a power
delivery contract with a source without MCU support (auto-run mode). PDO profiles
are configured in an integrated non-volatile memory.
The device supports dead battery mode and is suited for sink devices powered from
dead battery state and requiring high power charging profile to be fully operational.
Thanks to its 20 V technology, it implements high voltage features to protect the CC
pins against short-circuits to VBUS up to 22 V and to support high voltage on the
VBUS pins directly connected to the VBUS power path up to 28 V.
1 Functional description
The STUSB4500 is a USB Type-C™ and power delivery controller IC for sink applications. It is able to negotiate
a power delivery contract with a source without MCU support (auto-run mode). It relies on proprietary algorithms
and configurable PDO (power data objects) thanks to an integrated non-volatile memory. It supports dead battery
mode to allow a system to be powered from an external source directly. Combined with its capability to negotiate
directly a power contract, the STUSB4500 is the ideal controller device for autonomous systems requiring high
power charging profile to be fully operational.
The STUSB4500 major role is to:
1. Detect the connection between two USB Type-C ports (attach detection)
2. Establish a valid source-to-sink connection
3. Determine the attached device mode: source or debug accessory
4. Resolve cable orientation and twist connections to establish USB data routing (MUX control)
5. Negotiate a USB power delivery (PD) contract with a PD capable source device
6. Configure the incoming VBUS power path and the charging paths accordingly
7. Monitor the VBUS power path and manage the VBUS voltage transitions
8. Handle the high voltage protections
The STUSB4500 also provides:
• Dead battery mode
• PDO (power data object) customization through NVM
• Internal and/or external VBUS discharge paths
• Dual high power charging path support
• Debug accessory mode detection
• Customization of the device configuration through NVM to support specific applications
RESET POR
VBUS_EN_SNK
A_B_SIDE
DISCH CC1DB
CC CC1
Port C line
controller CC2
ADDR[1..0] access CC2DB
SCL I²C
SDA slave Port status
ALERT
ATTACH
POWER_OK2
Control Device
POWER_OK3 Policy Protocol Physical
Policy
GPIO Engine Layer Layer
Manager
GND
2 Inputs/outputs
2.1 Pinout
POWER_OK2
VREG_2V7
VREG_1V2
ALERT
VSYS
VDD
24 23 22 21 20 19
CC1DB 1 18 VBUS_VS_DISCH
CC1 2 17 A_B_SIDE
NC 3 16 VBUS_EN_SNK
EP
CC2 4 15 GPIO
CC2DB 5 14 POWER_OK3
RESET 6 13 ADDR1
7 8 9 10 11 12
DISCH
ATTACH
SCL
GND
SDA
ADDR0
1 2 3 4 5
C VBUS_ A_B_
EN_SNK SIDE
- CC2DB CC2
E POWER
_OK3
ATTACH GND DISCH SDA
1 B4 CC1DB HV AIO Dead battery enable on CC1 pin To CC1 pin if used or ground
2 B5 CC1 HV AIO Type-C configuration channel 1 To Type-C receptacle A5
3 B3, C3 NC - - Floating
4 C5 CC2 HV AIO Type-C configuration channel 2 To Type-C receptacle B5
5 C4 CC2DB HV AIO Dead battery enable on CC2 pin To CC2 pin if used or ground
6 D4 RESET DI Reset input, active high From system
8 E5 SDA DI/OD I2C data input/output, active low open drain To I²C master, ext. pull-up
Internal discharge path or external From power system (internal
discharge path enable, active low open path) or to the discharge path
9 E4 DISCH HV AI/OD
drain switch (external path), ext. pull-
up
10 E3 GND GND Ground Ground
Attachment detection, active low open To MCU if any, ext. pull-up
11 E2 ATTACH OD
drain
I²C device address setting Static, to ground or ext. pull-up
for address selection,
12 D3 ADDR0 DI
to ground if no connection to
MCU
I²C device address setting Static, to ground or ext. pull-up
for address selection,
13 D2 ADDR1 DI
to ground if no connection to
MCU
14 E1 POWER_OK3 OD Power contract flag, active low open drain To power system, ext. pull-up
General purpose output, active low open To system, ext. pull-up
15 D1 GPIO OD
drain
VBUS sink power path enable, active low To power switch or to power
16 C1 VBUS_EN_SNK HV OD
open drain system, ext. pull-up
Cable orientation, active low open drain USB super speed MUX select,
17 C2 A_B_SIDE OD
ext. pull-up
VBUS voltage monitoring and discharge From VBUS, receptacle side
18 A1 VBUS_VS_DISCH HV AI
path
19 B2 ALERT OD I2C interrupt, active low open drain To I²C master, ext. pull-up
Power contract flag, active low open drain To power switch or to power
20 A2 POWER_OK2 HV OD
system, ext. pull-up
21 A3 VREG_1V2 PWR 1.2 V internal regulator output 1 µF typ. decoupling capacitor
Power supply from system From power system, connect
22 B1 VSYS PWR
to ground if not used
23 A4 VREG_2V7 PWR 2.7 V internal regulator output 1 µF typ. decoupling capacitor
24 A5 VDD HV PWR Power supply from USB power line From VBUS, receptacle side
Type Description
D Digital
A Analog
O Output pad
I Input pad
IO Bidirectional pad
OD Open drain output
PD Pull-down
PU Pull-up
HV High voltage
PWR Power
GND Ground
2.2.3 RESET
Active high reset.
Name Description
• Warning:
– ADDR0 and ADDR1 pins must be connected to ground when there is no connection to an MCU
– SCL and SDA are pulled down when none of VDD or VSYS is present
2.2.5 DISCH
This input/output pin can be used to implement a discharge path for highly capacitive VBUS line on power system
side.
When used as input, the discharge is internal and a serial resistor must connected to the pin to limit the discharge
current through the pin. Maximum discharge current is 500 mA.
The pin can be also used as an open drain output to control an external VBUS discharge path when higher
discharge current is required by the application, for instance.
The pin is activated at the same time as the internal discharge path on VBUS_VS_DISCH pin. The discharge
is activated automatically during cable disconnection, transition to a lower PDO voltage, hard reset and error
recovery state. The discharge time is programmable by NVM (see Section 5 Start-up configuration).
2.2.6 GND
Ground.
2.2.7 ATTACH
This pin is asserted when a valid source-to-sink connection is established. It is also asserted when a connection
to a debug accessory device is detected.
Configuration ID
/NVM parameter Pin name Value Description
PWR_OK_CFG[1:0]
• At detachment the POWER_OK pins remain enabled (if already asserted), whereas VBUS_EN_SNK is
disabled (Hi-Z) to deactivate the VBUS power path from the USB Type-C receptacle. The POWER_OK pins
state is reinitialized (Hi-Z) after new attachment or after a reset
2.2.9 GPIO
This pin is an active low open drain output that can be configured by NVM as per table below (see
Section 5 Start-up configuration).
NVM parameter
Pin name Pin function Value Description
GPIO_CFG[1:0]
2.2.10 VBUS_EN_SNK
This pin allows the incoming VBUS power from the USB Type-C receptacle to be enabled when a source is
connected according to different operating conditions stated in the table below. The default behavior of the pin
can be changed by NVM programming (see Section 5 Start-up configuration).
NVM parameter
POWER_ONLY Pin function Value Description Comment
_ABOVE_5V
When POWER_ONLY_ABOVE_5V bit is set to logic level high, the VBUS_EN_SNK pin is asserted only when a
PDO2 or PDO3 explicit contract is established with the source (see Section 3.3 Auto-run mode).
This feature is suited for sink devices requiring high power charging profile above 5 V to be fully operational (see
Section 6.1.2 Powering a system under high charging profile only).
VBUS_EN_SNK pin is a high voltage open drain output that allows a PMOS transistor to be directly driven to
enable the VBUS power path.
2.2.11 A_B_SIDE
This output pin provides the cable orientation. It is used to establish USB SuperSpeed signal routing. This signal
is not required in case of USB 2.0 support.
Value Description
2.2.12 VBUS_VS_DISCH
This input pin is used to sense VBUS presence, monitor VBUS voltage, and discharge VBUS from the USB Type-C
receptacle side.
A serial resistor connected to the pin must be used to limit the discharge current through the pin. Maximum
discharge current is 50 mA.
The discharge is activated automatically during cable disconnection, transition to a lower PDO voltage, hard reset
and error recovery state. The discharge time is programmable by NVM (see Section 5 Start-up configuration).
2.2.13 VREG_1V2
This pin is used only for external decoupling of the 1.2 V internal regulator. The recommended decoupling
capacitor is: 1 µF typ. (0.5 µF min., 10 µF max.)
2.2.14 VSYS
This is the low power supply from the system, if there is any. It can be connected directly to a single cell Lithium
battery or to the system power supply delivering 3.3 V or 5 V. It is recommended to connect the pin to ground
when it is not used.
2.2.15 VREG_2V7
This pin is used only for external decoupling of the 2.7 V internal regulator. The recommended decoupling
capacitor is: 1 µF typ. (0.5 µF min., 10 µF max.)
2.2.16 VDD
This is the power supply from the USB power line for applications powered by VBUS.
3.1 CC interface
The STUSB4500 controls the connection to the configuration channel (CC) pins, CC1 and CC2, through two main
blocks: the CC line interface block and the CC control logic block.
The CC line interface block is used to:
• Set pull-down termination mode on the CC pins
• Monitor the CC pin voltage values related to the attachment detection thresholds
• Protect the CC pins against overvoltage
The CC control logic block is used to:
• Execute the Type-C FSM related to the sink power role with debug accessory support
• Determine the electrical state for each CC pin related to the detected thresholds
• Evaluate the conditions relative to the CC pin states and the VBUS voltage value to transition from one state
to another in the Type-C FSM
• Advertise a valid source-to-sink connection
• Determine the attached device mode: source or debug accessory
• Determine cable orientation to allow external routing of the USB data
• Manage USB Type-C power capability on VBUS: USB default, medium or high current mode
• Handle hardware faults
It makes the STUSB4500 a plug-and-play, autonomous and effective solution to develop USB PD sink systems
operating in standalone.
In case the sink is not able to consume more power than requested, this option must not be used. It avoids
allocating by the source a power reserve that is not used, thus limiting the overall power system optimization.
At attachment, the valid VBUS voltage range is defined by VMONUSBH and VMONUSBL limits to establish a valid
source-to-sink connection. After attachment and during system operations, the valid VBUS voltage range is
automatically adjusted to VMONUSBH and VTHUSB limits when VBUS voltage is at 5 V (USB Type-C or PDO1),
or to VMONUSBH and VMONUSBL limits when VBUS operates under PDO2 or PDO3 voltage.
The VBUS voltage value is automatically adjusted to 5 V (USB Type-C) at attachment and to the negotiated PDO
voltage after PDO transition. During each PDO transition, the VBUS monitoring is disabled for tSrcReady (285 ms
max.) as per USB PD standard specifications. Then the new limits applicable to the negotiated PDO voltage are
monitored.
The threshold limits are preset by default in the NVM with different shift coefficients (see Section 7.3 Electrical
and timing characteristics). The threshold limits can be changed independently through NVM programming (see
Section 5 Start-up configuration).
Operating conditions
NVM parameter
Value Connection VBUS monitoring conditions on
POWER_ONLY VBUS voltage from source Type-C state
stage VBUS_VS_DISCH pin
_ABOVE_5V
Before
0b or 1b N.A. N.A. Unattached.SNK
attachment
VBUS < VMONUSBH1 Attached.SNK
Hi-Z
5V
1b At attachment and or
(USB Type-C)
VBUS > VMONUSBL1 Debug Accessory.SNK
Operating conditions
NVM parameter
Value Connection VBUS monitoring conditions on
POWER_ONLY VBUS voltage from source Type-C state
stage VBUS_VS_DISCH pin
_ABOVE_5V
Type-C state column refers to the Type-C FSM states as defined in the USB Type-C standard specification.
Figure 4. Short-to-VBUS
Table 11. Orientation and current capability detection in sink power role
A_B_SIDE pin
CC1 pin CC2 pin Charging current
# CC1/CC2
(CC2 pin) (CC1 pin) configuration
(CC2/CC1)
Rp Rp
4 Default Hi-Z (Hi-Z)
def/1.5 A/3 A def/1.5 A/3 A
4 I²C Interface
Start Device addr W A Reg address A Restart Device addr R A Reg data A Reg data A Reg data Ᾱ Stop
Address Address
Start bit = SDA falling when SCL = 1 n+1 n+2
Stop bit = SDA rising when SCL = 1
Restart bit = start after a start
Acknowledge = SDA forced low during a SCL clock
Start Device addr W A Reg address A Reg data A Reg data A Reg data A Stop
Address Address
Start bit = SDA falling when SCL = 1 n+1 n+2
Stop bit = SDA rising when SCL = 1
Restart bit = start after a start
tsu,dat -
Data setup time 100 -
Vih
SDA
Vil
thd,sta
tr tsu,dat thigh
SCL
5 Start-up configuration
Reset
Parameter name Parameter description value Value Description
(default)
00b 1 PDO
Reset
Parameter name Parameter description value Value Description
(default)
0101b
I_SNK_PDO2 Current value for SNK_PDO2 1111b
(1.5 A)
I_SNK_PDO_LUT[3:0] flexible current
value from look-up table (see
0000b
Table 17. Look-up table for sink PDO
0011b current configuration)
I_SNK_PDO3 Current value for SNK_PDO3
(1.0 A) 0001b I_SNK_PDO_LUT[3:0] pre-defined current
values from look-up table (see
to
Table 17. Look-up table for sink PDO
1111b current configuration)
1 ≤ TDISPAR0V ≤ 15 by increment of 1
0001b
Coefficient used to compute VBUS 1001b Unit discharge time: 84 ms (typ.)
VBUS_DISCH_TIME_TO_0V to
discharge time to 0V (9) Default coefficient TDISPAR0V = 9,
1111b
discharge time TDISUSB0V = 756 ms
1 ≤ TDISPARPDO ≤ 15 by increment of 1
0001b
Coefficient used to compute VBUS 1100b Unit discharge time: 24 ms (typ.)
VBUS_DISCH_TIME_TO_PDO discharge time when transitioning to to
lower PDO voltage (12) Default coefficient TDISPARPDO = 12,
1111b
discharge time TDISUSBPDO = 288 ms
Reset
Parameter name Parameter description value Value Description
(default)
Parameter
Parameter name PDO current value Description
value
Parameter
Parameter name PDO current value Description
value
3.3 V (detachment)
PDO1 Fixed voltage Low 5 V / 1.5 A +15 %
-20 % (attachment)
Flexible
PDO2 Medium 15 V / 1.5 A -20 % +10 %
voltage
Flexible
PDO3 High 20 V / 1.0 A -20 % +10 %
voltage
See Section 7.3 Electrical and timing characteristics for parameters related to VBUS.
6 Applications
The sections below are not part of the ST product specification. They are intended to give a generic application
overview to be used by the customer as a starting point for further implementations and customizations. ST does
not warrant compliance with customer specifications. Full system implementation and validation are under the
customer’s responsibility.
At power-up or after a reset, the first software access to the I2C registers of the STUSB4500 can be done only
after TLOAD as shown in the figure below. TLOAD corresponds to the time required to initialize the I2C registers with
the default values from the embedded NVM. At power-up, the loading phase starts when the voltage level on the
VREG_1V2 output pin of the 1.2 V internal regulator reaches 1.08 V to release the internal POR signal. After a
reset, the loading phase starts when the signal on the RESET pin is released.
Power On Reset I2C registers loading from NVM I2C access Reset I2C registers loading from NVM I2C access
1.08 V
VREG_1V2 VREG_1V2
POR RESET
TLOAD TLOAD
Vbus T1
STL6P3LLH6 Vsnk
MPT_0.5_2 -2.54
D11
R10 C10 ESDA25P35
100k R13 100nF
J10
A1 GND GND
B12 J1
A2 Tx+1 B11 100
Rx+1 D4 R1 R11
A3 Tx-1 B10 470 22k
Rx-1
A4 Vbus Vbus
B9
C4 R4
CC1 A5 CC1 B8
Sbu2 1µF 1k
A6 D+1 D-2
B7
A7 D-1 D+2
B6
A8 Sbu1 CC2
B5 CC2
2V7
A9 Vbus B4
USB 3.1 Vbus
A10 Rx-2 TYPE C Tx-2 B3 C3 1µF
A11 Rx+2 Tx+2
B2 C1 1µF
A12 B1 D50 C2 1µF
C50 GND GND
4.7µF ESDA25P35
R2
U1
23 21 3 22 24 STUSB4500 1k
VReg_2V7
VReg_1V2
VSYS
Not_used
VDD
16
VBus_EN_SNK
9 Disch
Disch
18 15
VBUS_VS_Disch GPIO
20
Power_OK2
1 14
CC1DB Power_OK3
CC1 2 17
CC1 A_B_Side
CC2 4
CC2 STUSB4500 Attach
11
D1 5 7
CC2DB SCL
ESDA25W
2V7 8
SDA
R51 NC 13 19
Addr1 ALERT#
R52 NC 12 6 Reset
Addr0 Reset
GND ExpPAD
10 0
Table 19. Configuration examples (assuming an application requiring 12 W input power or more)
5 V, 9 V and 12 V
5 V only charging 15 V only charging
charging
SNK_PDO_NUMB 1 2 3
POWER_ONLY_ABOVE_5V 0 1 0
PDO1 5 V; 2.4 A 5 V; - 5 V; 2.40 A
PDO2 15 V; 0.8 A 9 V; 1.33 A
PDO3 12 V; 1.00 A
• As per USB PD standard, 5 V is always the first object, therefore PDO1 = always 5 V
• In case 5 V is not used by the application, POWER_ONLY_ABOVE_5V must be set to 1 (see
Section 2.2.10 VBUS_EN_SNK and Section 6.1.2 Powering a system under high charging profile only)
Vbus T4 T1
STL6P3LLH6 STL6P3LLH6 Vsnk
MPT_0.5_2-2.54
D11
R10 C10 ESDA25P35
100k R13 100nF
J10
A1 GND GND
B12 J1
A2 Tx+1 B11 100
Rx+1 D4 R1 R11
A3 Tx-1 B10 470 22k
Rx-1
A4 Vbus Vbus
B9
C4 R4
CC1 A5 CC1 B8
Sbu2 1µF 1k
A6 D+1 D-2
B7
A7 D-1 D+2
B6
A8 Sbu1 CC2
B5 CC2
2V7
A9 Vbus B4
USB 3.1 Vbus
A10 Rx-2 TYPE C Tx-2 B3 C3 1µF
A11 Rx+2 Tx+2
B2 C1 1µF
A12 B1 D50 C2 1µF
C50 GND GND
4.7µF ESDA25P35
R2
U1
23 21 3 22 24 STUSB4500 1k
Not_used
VReg_2V7
VReg_1V2
VSYS
VDD
16
VBus_EN_SNK
9 Disch
Disch
18 15
VBUS_VS_Disch GPIO
20 Vmcu
Power_OK2
1 14
CC1DB Power_OK3
CC1 2
CC1 STUSB4500 A_B_Side
17
CC2 4 11 R3 R5 R6
CC2 Attach
4.7k 4.7k 4.7k
D1 5 7 SCL
CC2DB SCL
ESDA25W
2V7 8 SDA
SDA
R51 NC 13 19 Al ert#
Addr1 ALERT#
R52 NC 12 6 Reset
Addr0 Reset
GND ExpPAD
10 0 MCU
R53 R54 R55
100k 100k 10k
7 Electrical characteristics
VCC1, VCC2
High voltage on CC pins 22
VCC1DB, VCC2DB
VVBUS_EN_SNK
VVBUS_VS_DISCH
High voltage on VBUS pins 28
VDISCH
VPOWER_OK2
V
VSCL, VSDA
VALERT
VRESET
VATTACH
Operating voltage on I/O pins -0.3 to 6
VA_B_SIDE
VPOWER_OK3
VGPIO
VADDR0, VADDR1
HBM 3
ESD kV
CDM 1.5
VVBUS_EN_SNK
VVBUS_VS_DISCH
High voltage pins 0 to 22
VDISCH
VPOWER_OK2
V
VSCL, VSDA
VALERT
VRESET
VATTACH
Operating voltage on I/O pins 0 to 4.5
VA_B_SIDE
VPOWER_OK3
VGPIO
VADDR0, VADDR1
VTH1.23 Detection threshold 3 Min. I P_3.0 detection by sink on Rd 1.16 1.23 1.31 V
VTH2.6 Detection threshold 4 Max. CC voltage for connected sink 2.45 2.60 2.75 V
Overvoltage
VOVP protection on CC 5.82 6 6.18 V
pins
VBUS_VS_DISCH pin monitoring and driving
VBUS disconnection
VTHUSB threshold (5 V USB VSYS = 3.0 to 5.5 V 3.2 3.3 3.4 V
Type-C or PDO1
selected)
VBUS safe 0 V
VTH0V VSYS = 3.0 to 5.5 V 0.5 0.6 0.7 V
threshold (vSafe0V)
VBUS discharge Through external resistor connected
IDISUSB 50 mA
current to VBUS_VS_DISCH pin
Write cycles
Cycling TA = 105 °C 1000 cycles
endurance
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
E
TOP VIEW
A1
C
A
SEATING
PLANE
e
b
K
E2
Pin#1 ID
L
D2
BOTTOM VIEW
mm Inches
Ref.
Min. Typ Max. Min. Typ. Max.
mm
Symbol
Min. Typ. Max.
Note: WLCSP stands for wafer level chip scale package. The typical ball diameter before mounting is 0.25 mm. The
terminal A1 corner must be identified on the top surface by using a laser marking dot.
Junction-to-ambient thermal
RθJA 37
resistance
°C/W
Junction-to-case thermal
RθJC 5
resistance
Term Description
Revision history
Table 27. Document revision history
Contents
1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Block overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Inputs/outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2.1 CC1 / CC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2.2 CC1DB / CC2DB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2.3 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2.4 I²C interface pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.5 DISCH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.6 GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.7 ATTACH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2.8 POWER_OK2 / POWER_OK3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2.9 GPIO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.10 VBUS_EN_SNK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.11 A_B_SIDE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.12 VBUS_VS_DISCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.13 VREG_1V2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.14 VSYS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.15 VREG_2V7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2.16 VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Description of the features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.1 CC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 Power delivery blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.1 Physical layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.2 Protocol layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.3 Policy engine. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.4 Device policy manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Auto-run mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3.1 Sink PDO configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.2 Decision algorithm description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.3 Requesting maximum source current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.4 Decision algorithm application with examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 VBUS power path control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.1 VBUS monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4.2 VBUS discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
List of tables
Table 1. Pin function list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 2. Pin function descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. I2C interface pin list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. POWER_OK pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. GPIO pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. VBUS_EN_SNK pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. USB data MUX select. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Sink PDO description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Decision algorithm results for different cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. VBUS_EN_SNK pin behavior depending on the operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Orientation and current capability detection in sink power role . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 12. Device address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 13. Register address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 14. Register data format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 15. I²C timing parameters - VDD = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 16. STUSB4500 user-defined parameters and default settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 17. Look-up table for sink PDO current configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 18. STUSB4500 default sink PDO programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 19. Configuration examples (assuming an application requiring 12 W input power or more) . . . . . . . . . . . . . . . . . . 25
Table 20. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 21. Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 22. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 23. QFN-24 EP (4x4) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 24. WLCSP (2.6x2.6x0.5) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 25. Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 26. List of terms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 27. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
List of figures
Figure 1. Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Figure 2. QFN-24 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 3. WLCSP-25 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 4. Short-to-VBUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 5. Read operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 6. Write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 7. I²C timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. I2C register initialization sequence at power-up or after a reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 9. STUSB4500 schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10. Typical schematic with MCU. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11. QFN-24 EP (4x4) package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 12. QFN-24 EP (4x4) recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 13. WLCSP (2.6x2.6x0.5) package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 14. WLCSP (2.6x2.6x0.5) recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34