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Skill Lab Report Group-B (HK)

The document provides a summary of the Phase-1 Skill Lab conducted in March 2024. It covered four components: [1] Skill building using EasyEDA for PCB design and prototyping. [2] Hands-on experience with the STM32F407VG MCU using Keil uVision IDE. [3] Application development using Simulink. [4] CPU design using Logisim. Students learned how to design circuits and PCBs, program microcontrollers, model applications, and design processors. The one-week training provided an exciting hands-on learning experience for the students.

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Harsh Kumar
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50 views12 pages

Skill Lab Report Group-B (HK)

The document provides a summary of the Phase-1 Skill Lab conducted in March 2024. It covered four components: [1] Skill building using EasyEDA for PCB design and prototyping. [2] Hands-on experience with the STM32F407VG MCU using Keil uVision IDE. [3] Application development using Simulink. [4] CPU design using Logisim. Students learned how to design circuits and PCBs, program microcontrollers, model applications, and design processors. The one-week training provided an exciting hands-on learning experience for the students.

Uploaded by

Harsh Kumar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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A Report on

II year Skill Lab (Phase-1) March 2024

PCB Design, Electronics Circuits and


Systems Simulation

Submitted by,

Harsh Kumar 1RV22EC064


Junaid Ahmed 1RV22EC074
Harshit Thakkar 1RV22EC067
Suryaansh Kerni 1RV22EC165

Bachelor of Engineering in
Electronics and Communication Engineering

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2023-24

CONTENTS

INTRODUCTION

1. Chapter I: Skill Building Through EasyEDA with Prototype Development


and Testing
2. Chapter II: Hands on using STM32F407VG MCU

3. Chapter III: Application Development using Simulink

4. Chapter IV: CPU Design using Logisim

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INTRODUCTION
Phase-1 of the Second year Skill Lab was organized in the department between March 4th – 9th. In
the first day morning session Dr. Ravish Aradhya H V Prof. and Head address the students by
highlighting importance of skill lab followed by an expert talk on PCB materials and
Terminologies By Mr. Raghavendra Rao, Principal Engineer, Intel Technology India Pvt Ltd and
Mr. Shashidhar K R, Engineering Manager, Intel Technology India Pvt Ltd. From the afternoon
session onwards the topics were divided into Four components and were conducted in three
exclusive labs (Venues): Skill building through EasyEDA with Prototype Development and
Testing, Hands on using STM32F407VG MCU, Application development using Simulink and
CPU design using Logisim.

In every lab there were teaching faculty and technical staff to help the students to understand the
basic concepts. First elaborate theoretical concepts were discussed by the teaching faculty and then
technical staff were there to clear any doubts to realize these theoretical concepts into actual
realization.

In total, the one week training was an exciting learning experience.

Online Feedback was also taken.

On the last day, the student’s understanding was evaluated by the Quizzes in all the four domains.

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CHAPTER-I
Skill Building Through EasyEDA with Prototype
Development and Testing

5th, 6th & 7th March, 2024

 We were introduced on designing the PCB’s (Printed Circuit Boards)


Using the online version of EasyEDA tool.

 The subsequent process involved schematic circuital diagram on the


sheet and conversion of schematic to PCB.

 2nd step involves setting the dimension of area of PCB in ‘mm’ and
implement a compact sized design. Upcoming process is wire
connection in top layer (Vcc) and bottom layer (Ground) for Through
Hole Connection (THC). Wire connection rearrangement has to be
done in order to avoid any intersection of wire within a layer, for this
auto-routing can also be deployed instead of manual operation.

 3rd step involves the DRC (Design Rule Check) which confirms
whether the PCB design conforms to all the basic requirements and is
ready to be viewed in 2D and 3D along with the creation and
download of ‘Gerber file’ as ZIP format.

 The circuit comprised of different configurations such as RC Coupled


Amplifiers, High Pass/Low Pass Second Order Filters and LED’s
(Light Emitting Diodes). Also selection of different connectors,
LED’s/diodes, OpAmps, resistor, capacitor are utilized as per
requirement.

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CHAPTER-II
Hands on using STM32F407VG MCU

4th, 6th & 7th March, 2024

 Hands on-experience was provided on basics of Embedded C language


using ‘Keil uVision IDE’.

 Operation on Intel’s 8051 MCU was done using various operators,


datatypes. In subsequent sessions, conversion of binary, hexadecimal,
decimal and octal into other forms were revised along with the detailed
working of a compiler, linker, machine code, object code, preprocessor.

 The board selected as target was ATMEL with ID: AT89C51ED2. Code
execution, code build and code debugging was deployed in order to
correct any errors or bugs.

 The function of an IC was discussed as in performing arithmetic and


logical operations for storing values in terms of voltages.

 The computer stores data in binary i.e. 0 and 1, where 0 represents


low/zero voltage and 1 represents high voltage (3V, 5V, 1.5V).

 Introduction of registers was given as in how memory is stored as


registers are cascaded form of flip-flops.

 Bit pattern of serial control (SCON) register of 8051 MCU and bit
pattern of timer mode control (TMOD) register of 8051 MCU was
introduced along with practice of questions based on the 8 bits, such as,
SM0, SM1, SM2, REN, TB8, RB8, TI, RI – SCON & GATE, C/T’,
M1, M0 (for Timer 0 & Timer 1) – TMOD.

 The respective operations were performed for UART mode in SCON


and as reload counter for TMOD.
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CHAPTER-III
Application Development using Simulink

5th & 6th March, 2024

 We started work of Simulink in MATLAB with the schematic design


of circuit and observation of AC signal conversion to Pulsated DC
signals using scope element.

 Various components such as solver configuration, resistors, diodes,


AC voltage source, scope, OpAmp, voltage sensor, PS Simulink
converter were used and the respective applications were noted.

 Setting of stop time (=0.1 sec) was involved to view the graph
generated.

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CHAPTER-IV
CPU Design using Logisim

5th March, 2024

 Introductory information regarding the working of a processor was


provided along with the basics of ALU (Arithmetic Logic Unit).

 Working of a CPU (Central Processing Unit) was explained along with


the design of 4-bit Arithmetic Circuit in Logisim software.

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