1. _____ is also known as Visual Processing Unit.

a. Central Processing Unit

b. Graphics Processing Unit.
c. Floating Point Coprocessor
d. Digital Signal Processor
2. Default bootloader for the Arduino UNO is_______.
a. Opti boot loader
b. AIR-boot
c. Bare box
d. GAG
3. A program written with the IDE for Arduino is called _______.
a. IDE source
b. Cryptography
c. Sketch
d. Source code
4. Arduino IDE consists of 2 functions namely:
a. Build () and loop ()
b. Setup () and build ()
c. Setup () and loop ()
d. Loop () and build and setup ()
5. The command which is called once when the program starts:
a. Loop ()
b. Setup ()
c. input ()
d. output ()
6. A normal human eye can process around_____ frames per second
a. 25
b. 50
c. 60
d. 70
7. A process in which the video data is prepared and formatted prior to playback is known as:
a. 3D graphics rendering
b. Video Editing
c. Graphics Processing
d. Signal Processing.
8. The processor that can process large amount of data suited for Machine learning and
Cryptocurrency mining is:
a. IO processor
b. Digital Signal Processor
c. Graphics Processor
d. Coprocessor
9. Compared to other batteries, nuclear batteries are very ____ but have an extremely
____and high energy density
a. Cheap, long life
b. Costly, long life
 c. Cheap short life
d. Costly, short life
10. In Li-ion battery, the ______________is/are lithium ion-based
a. Positive electrode
b. Negative electrode
c. Positive and negative electrode
d. Electrolyte
11. The main benefit of solid electrolytes is that there is no ______ which is a serious
_______for batteries with liquid electrolytes.
a. Risk of leak, safety issue
b. Conductivity, conduction issue
c. Non-conductivity, non-conductivity issue
d. Conductivity, non-conductivity issue
12. Wearing a _____________is highly recommended to reduce the risk of creating an ESD
incident.
a. band
b. sweatshirts
c. shoes
d. grounded wrist strap
13. Both glassy and ceramic electrolytes can be made more ionically conductive by
substituting _______for oxygen.
a. Nitrogen
b. Carbon dioxide
c. Sulphur
d. Hydrogen
14. SMD has largely replaced the ________________ especially in devices that need to be
small or flat.
a. pin technology
b. through-hole technology
c. plated technology
d. hole technology
15. _______________is a more appropriate inspection method for larger batches of PCB
Assembly.
a. Automatic optical inspection
b. Manual inspection
c. Automatic X-ray inspection.
d. Operator inspection
16. With growing global manufacturing waste of electronics manufacturing _______________
has to be addressed on priority.
a. Environmental impact.
b. political impact
c. social impact
d. financial impact
17. Fast action games must process at least _____ frames per for smooth game scroll and flow.
a. 25
 b. 50
c. 60
d. 70
18. In the PCB assembly process, in the solder paste printer, a mechanical fixture holds the
PCB and _________in place.
a. Solder stencil
b. Solder paste
c. Solder flux
d. Solder gun
19. Select proper microcontroller used in Arduino UNO.
a. ATmega32114
b. ATmega2560
c. ATmega328p
d. AT91SAM3x8E
20. GPU stands for:
a. Grouped Processing Unit
b. Graphics Processing Unit
c. Graphical Performance Utility
d. Graphical Portable Unit
21. _________account for most non-connector components on PCBs today.
a. SIP
b. SMD
c. Pin- up components
d. Plug -in components
22. ________ and ________standards are used for certifying manufacturing material.
a. RoHS and EPEAT
b. FPEAT and RoHS
c. IEEE and ASCII
d. TRIA and EPEAT
23. EPEAT evaluates products into three tiers of environmental performance:
a. Bronze, Silver and Mercury
b. Bronze, Nickel and Gold.
c. Bronze, Silver and Gold.
d. Bronze, Platinum and Gold.
24. ALU of ARM7TDMI is_____bit.
a. 8
b. 32
c. 64
d. 10
25. The GPIO stand for__________________.
a. General Purpose Inner Outer Propeller
b. General Purpose Input Output Processor
c. General Purpose Interested Old People
d. General Purpose Input Output Pins
26. ARM stands for _____________
a. Advanced Rate Machines
b. Advanced RISC Machines
c. Artificial Running Machines
d. Aviary Running Machines
27. WEEE or e-waste is –
a. The amount of waste mechanical and electronic equipment
b. The amount of waste biological and electronic equipment
c. The amount of waste surgical and electronic equipment
d. The amount of waste electrical and electronic equipment
28. The function of link register in ARM7TDMI is__________
a. To store return address whenever subroutine is called
b. To store address of I/O device
c. Multiplex the address and data lines
d. Perform addition.
29. ____ number of digital pins are there on the UNO board.
a. 14
b. 12
c. 16
d. 20
30. Batteries are classified as either primary or secondary batteries, according to the type of:
a. mechanical part
b. electrical assembly
c. instruments used
d. electrochemical cells
31. The most common batteries used in drones are ____________batteries.
a. Sodium polymer (PbPo)
b. cadmium polymer (CdPo)
c. Nickel polymer (NiPo)
d. lithium polymer (LiPo)
32. Using SMD _________density components can be placed on both sides of the circuit
board.
a. higher
b. Lower
c. Medium
d. none of above
33. In RISC Processors configuration status of control unit is_______.
a. Hardwired
b. Micro programmed
c. Both A and B
d. None of the above
34. A function is a series of programming statements that can be called by name. Which
command is called once when the program starts:
a. Loop ()
b. Setup ()
 c. Output ()
d. Input ()
35. The ________check looks at all the design specifications of a PCB.
a. AOI
b. DFM
c. ESD
d. SMD
36. The throughput of a super scalar processor is _______.
a. less than 1
b. 1
c. More than 1
d. Not Known
37. In ATmega328p ‘p’ refers to?
a. Production
b. Pico-Power
c. Peripheral
d. Programmable on chip
38. The function of register r15 in ARM7TDMI is as ______.
a. Program Counter (PC)
b. Current Program Status Register (CPSR)
c. Saved Program Status Register (SPSR)
d. Arithmetic Logic Unit (ALU)
39. Each stage in pipelining should be completed within ____ cycle.
a. 1
b. 2
c. 3
d. 4
40. In ARM processor when Interrupt occurs ARM processor goes into following mode
a. FIQ mode
b. Abort mode
c. Supervisor mode
d. Undefined mode
41. Wearables use a rigid flexible PCB for interconnection of points or mechanical _parts.
a. Moving
b. Stationary
c. Both a & b
d. None of above
42. In the ARM Nomenclature ARMxTDMI, D and M signifies
a. Division and Multiplier units are not present
b. Division and Multiplier units are present
c. Debugger and Multiplier units are not present
d. Debug and Fast Multiplier units are present
43. The computer architecture aimed at reducing the time of execution of instructions is
________
a. CISC
 b. RISC
c. ISA
d. ANNA
44. In CISC processor the nature of instruction size is
a. Fixed
b. Variable
c. Both A and B
d. None of the above
45. The function of Barrel shifter is
a. Shift Operation in same instruction cycle
b. Shift operation in 2 instruction cycle
c. Shift operation in 3 instruction cycle
d. Shift operation in 3 instruction cycle
46. If the three stages of execution in pipelining are overlapped, how would be the speed of
execution?
a. Higher
b. Moderate
c. Lower
d. Unpredictable
47. EPEAT do not audits which of the following product categories:
a. Computers and Displays
b. Imaging Equipment
c. Mobile Vanity
d. Mobile Phones
48. If SMD component has two leads and for placement it is specified as 0603, then 0603
means
a. Length is 06 mm with width 3mm
b. Length is 03 mm with width 6 mm
c. 06 Ohm with 03 A rating
d. 06 Volt with 03 A rating
49. _______ and _______ architecture improve the performance of the processor.
a. Pipelining, super-scalar
b. cost, size
c. memory, size
d. peripherals, operating voltage
50. Evaluate the following statements
I. R13 is traditionally used as the stack pointer and stores the head of the stack in the
current processor mode
II. R14 is the link register where the core puts the return address on executing a
subroutine
III. R15 is the program counter and contains the address of the next instruction to be
fetched
a. All the options are true
b. I and II are true
c. II and III are true
d. I and III are true