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Some well-known structures like grounded coplanar waveguides and their variants are known for
providing low loss single-ended and differential mode routing. The proposed antenna systems are
composed of a Vivaldi array and an H-plane right-angled corner power divider which includes an
over-moded waveguide section. In the development of TGVs of the glass interposers, micro drilling
of the glass substrate and metallization of the micro holes in the glass with conductive materials are
important factors. Please visit the Instructions for Authors page before submitting a manuscript. A
guide for authors and other relevant information for submission of manuscripts is available on the
Instructions for Authors page. The size of the shadow mask is designed to be smaller than the area of
the shallow cavity, so that the top silicon surface required for subsequent bonding of the glass wafer
can be protected from metallization by this sputtering process. Journal of Pharmaceutical and
BioTech Industry (JPBI). Big dots show the points used for spline approximation. For these reasons,
we previously demonstrated micromachined versions of SIWs to improve integration capability of
the SIW with semiconductor or MEMS devices for tunable SIW-based circuits at millimeter-wave
frequencies. The thickness of the glass substrate of the SIW is decided to be 350 ?m here,
considering ease of wafer handling during the fabrication process. During this process, the melted
glass is reflowed and filled into the trench due to the pressure difference between the inside of the
trench and atmosphere. The silicon wafer plays a role of a carrier substrate accepting the reflowed
glass as well as a via core material. Journal of Manufacturing and Materials Processing (JMMP).
Substrate integrated waveguides reduce the losses and increase the quality factor of resonators in
communication filters when compared with traditional planar technologies, while maintaining their
low-cost and low-profile characteristics. Big dots show the points used for spline approximation.
Journal of Low Power Electronics and Applications (JLPEA). Feature papers are submitted upon
individual invitation or recommendation by the scientific editors and must receive. As this structure
is forced with a specific frequency, the propagation constant along the z direction is defined in terms
of the source frequency and the integers n and m. Department of Electrical Engineering and
Information, Entries Polytechnic University of Bari, Via Orabona, 4-70125 Bari, Italy Interests:
fiber optics; long period grating (LPG) fiber devices; rare-earth doped fiber laser; microwave
photonics; microwave devices Special Issues, Collections and Topics in MDPI journals. To address
these problems, a routing scheme named Mobility, Residual energy and Link quality Aware
Multipath (MRLAM) is proposed for routing in MANETs. Although silicon wafer with low
resistivity is used, pure silicon has a conductivity four orders of magnitude smaller than conventional
via metals (e.g., copper), therefore is not adequate for a via material of the SIW. A hybrid design
procedure based on circuit simulation and full-wave optimization is outlined and adopted to
synthesize three matching networks with respectively one, two, and three irises, according to the
bandwidth to be covered. The influence of the design parameters on the insertion losses and
fractional bandwidth is discussed. Two-step deep reactive ion etching (DRIE) of silicon vias and
selective tungsten coating onto them using a shadow mask are combined with glass reflow
techniques to realize a glass substrate with metal-coated TGSVs for millimeter-wave applications.
Simulated S -parameters of the SIWs with three different via structures: tungsten-coated low-
resistive silicon, copper, and pure low-resistive silicon. In this case, using four points was enough for
high accuracy results. FR4 substrates (green), Prepreg (dark red), and copper (orange). As we are
only dealing with TE modes, we can choose to excite a specific set of modes in the structure simply
choosing the particular frequency. The COMSOL Sales and Support teams are available for
answering any questions you may have regarding this. The photograph of the fabricated SIW is
shown in Figure 4 b.
Detailed dimensions of the designed SIW are summarized in Table 1. Once you are registered, click
here to go to the submission form. This article is an open access article distributed under the terms
and conditions of the Creative Commons Attribution (CC BY) license ( ). The design processes of
all devices are exposed, and the experimental results of prototypes show the feasibility of these
solutions. Empty substrate integrated waveguides go one step further, removing the dielectric of the
substrate. The backing cavity was designed under each patch antenna of the array in order to increase
the bandwidth and minimize the intercoupling among the radiating elements. Comparison between
scattering parameters of the filter with nominal value of the width of the inner conductor of the
ESICL (. A sharp cutoff is shown at the expected frequency. The corresponding normalized delay-
bandwidth products remain around 0.32 for all cases, which are higher than previously reported
works based on rod radius adjustment. Paper should be a substantial original Article that involves
several techniques or approaches, provides an outlook for. Journal of Pharmaceutical and BioTech
Industry (JPBI). Substrate integrated waveguide design and fabrication planning is much easier
when you work with a knowledgeable research and design firm. In this way, the response of each
block along the whole frequency band is obtained efficiently and accurately with as many frequency
points as desired. Journal of Otorhinolaryngology, Hearing and Balance Medicine (JOHBM).
Schematic view of the proposed substrate integrated waveguide (SIW) with tungsten-coated through
glass silicon via (TGSV). In this paper, embedded coaxial substrate integrated waveguide (CSIW)
filters with innovative magnetic couplings are presented and studied. Moreover, a new magnetic
coupling scheme consisting of short-ended stripline probes is proposed and analyzed in detail, both
for direct and external couplings. A review of substrate integrated waveguide (SIW) components
designed for the use in beam-forming networks working in X-Band is presented. The level of
confinement depends primarily on the via diameter ( d ) and the via spacing ( s ). Particular
functionality may be common to several products. A review of substrate integrated waveguide (SIW)
components designed for the use in beam-forming networks working in X-Band is presented. The
application to other frequency bands is straightforward. Fabricated on standard alumina substrate, the
design of the filter and the biasing network enabled fine digital frequency control of up to four
functional states by the inclusion of wire bondings between each switch and the substrate. The new
fast frequency sweep was successfully applied to the analysis of different types of devices (all
metallic rectangular waveguide filter, dielectric loaded rectangular waveguide filter, and substrate
integrated waveguide filter). European Journal of Investigation in Health, Psychology and Education
(EJIHPE). Accepted papers will be published continuously in the journal (as soon as accepted) and
will be listed together on the special issue website. We use cookies on our website to ensure you get
the best experience. As we are only dealing with TE modes, we can choose to excite a specific set of
modes in the structure simply choosing the particular frequency. Subscribe to receive issue release
notifications and newsletters from MDPI journals. Substrate Integrated Waveguide (SIW) and Its
Applications.
All manuscripts are thoroughly refereed through a single-blind peer-review process. Existing fast
frequency sweep techniques are either complex or specific for a certain electromagnetic solver. The
proposed structure is applicable as an alternative to the existing radial stub used for bias T to prevent
the reverse flow of the Radio frequency (RF) signal to direct current (DC) source. In order to be
human-readable, please install an RSS reader. ISPRS International Journal of Geo-Information
(IJGI). In order to overcome the limitations in slow light systems, we propose a backscattering-
immune slow light waveguide design. Schematic view of the proposed substrate integrated
waveguide (SIW) with tungsten-coated through glass silicon via (TGSV). Dipartimento di
Ingegneria dell'Informazione, Universita Politecnica delle Marche, Ancona, Italy Interests: modeling
and design of passives, such as filters; multiplexers; switches and array antennas. Remaining silicon
and part of the glass at the backside of the wafer are also mechanically lapped and polished down to
planarize and set the final thickness of the wafer to be 350 ?m. Note that from the first issue of
2016, this journal uses article numbers instead of page numbers. The results are compared with the
well-known radial stub. International Journal of Translational Medicine (IJTM). The top surface of
the tungsten-coated silicon vias does not touch the glass substrate during the subsequent anodic
bonding process because the height of the silicon vias is slightly lower than the top surface of the
silicon wafer because of the first cavity etching. FR4 substrates (green), Prepreg (dark red), and
copper (orange). In this work, SIW is demonstrated by combining the metal-coated silicon via
concept and thermally reflowed glass substrate. International Journal of Environmental Research and
Public Health (IJERPH). Schematic view of the proposed substrate integrated waveguide (SIW) with
tungsten-coated through glass silicon via (TGSV). In addition to the decoupling structure a dumbbell
shaped stub has also been introduced to the partial ground plane to suppress the mutual coupling. A
standard SOLT (Short-Open-Load-Thru) calibration process is performed with a commercial
calibration kit (36804B-10M, Anritsu Corp.) for calibration. The measured S -parameters of the
fabricated SIW are compared with the simulation results as shown in Figure 5. Some well-known
structures like grounded coplanar waveguides and their variants are known for providing low loss
single-ended and differential mode routing. Thus, it propagates a transversal electric and magnetic
(TEM) mode, which reduces the dispersion and the bandwidth limitation of other one conductor
empty substrate integrated waveguides. Subscribe to receive issue release notifications and
newsletters from MDPI journals. The structures were molded, drilled, and metalized with a laser
direct structuring (LDS) process. The thickness of the glass substrate of the SIW is decided to be 350
?m here, considering ease of wafer handling during the fabrication process. Please note that many of
the page functionalities won't work as expected without javascript enabled. Feature papers represent
the most advanced research with significant potential for high impact in the field. A Feature.
Different MIMO performance parameters have also been investigated from the measured results.
Based on the number of antennas in the Vivaldi array, mode converter sections at K-band and Ka-
band frequencies are designed, fabricated, and measured when feeding Vivaldi antenna arrays with
two, three, and four antennas. International Journal of Turbomachinery, Propulsion and Power
(IJTPP). By creating the loading capacitance of a combline topology using inner layers of a low-
temperature co-fired ceramic (LTCC) stack-up, it is possible to achieve resonator miniaturization
while improving the spurious-free band and providing full-packaged solutions.