Dell PowerEdge R660

Technical Guide

Regulatory Model: E83S

Regulatory Type: E83S001
February 2023
Rev. A00
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2022 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: System overview.......................................................................................................... 5

Key workloads...................................................................................................................................................................... 5
New technologies................................................................................................................................................................ 5

Chapter 2: System features and generational comparison............................................................. 7

Chapter 3: Chassis views and features.........................................................................................10

Chassis views......................................................................................................................................................................10
Front view of the system........................................................................................................................................... 10
Rear view of the system.............................................................................................................................................10
Inside the system.......................................................................................................................................................... 11
Quick Resource Locator............................................................................................................................................. 12

Chapter 4: Processor................................................................................................................... 13
Processor features ........................................................................................................................................................... 13
Supported processors................................................................................................................................................. 13

Chapter 5: Memory subsystem.................................................................................................... 15

Supported memory............................................................................................................................................................ 15

Chapter 6: Storage...................................................................................................................... 16
Storage controllers............................................................................................................................................................ 16
Supported Drives............................................................................................................................................................... 16
Internal storage configuration......................................................................................................................................... 17
External Storage.................................................................................................................................................................17

Chapter 7: Networking.................................................................................................................18
Overview.............................................................................................................................................................................. 18
OCP 3.0 support................................................................................................................................................................ 18
Supported OCP cards................................................................................................................................................. 18

Chapter 8: PCIe subsystem......................................................................................................... 20

PCIe risers...........................................................................................................................................................................20

Chapter 9: Power, thermal, and acoustics................................................................................... 27

Power................................................................................................................................................................................... 27
Power Supply Units.....................................................................................................................................................28
Thermal................................................................................................................................................................................ 29
Thermal design............................................................................................................................................................. 29
Acoustics............................................................................................................................................................................. 30
Acoustical performance............................................................................................................................................. 30
PowerEdge acoustical specifications...................................................................................................................... 31

Contents 3
 Chapter 10: Rack, rails, and cable management........................................................................... 36
Rails and cable management information....................................................................................................................36

Chapter 11: Supported Operating Systems.................................................................................. 46

Chapter 12: Dell OpenManage Systems Management................................................................... 47

Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 47
Systems Management software support matrix....................................................................................................... 48

Chapter 13: Appendix D: Service and support.............................................................................. 50

Default support levels...................................................................................................................................................... 50
Default deployment levels......................................................................................................................................... 50
Other services and support information......................................................................................................................50
Dell deployment services........................................................................................................................................... 50
Dell custom deployment Services........................................................................................................................... 54
Dell Residency Services............................................................................................................................................. 54
Dell Data Migration Services.................................................................................................................................... 54
Dell Enterprise Support Services.............................................................................................................................55
Enterprise connectivity.............................................................................................................................................. 57
Dell TechDirect.............................................................................................................................................................58
Dell Technologies Consulting Services...................................................................................................................58

Chapter 14: Appendix A: Additional specifications....................................................................... 60

Chassis dimension............................................................................................................................................................. 60
Chassis weight....................................................................................................................................................................61
NIC port specifications..................................................................................................................................................... 61
Video specifications.......................................................................................................................................................... 62
USB ports specifications................................................................................................................................................. 62
PSU rating...........................................................................................................................................................................63
Environmental Specifications......................................................................................................................................... 63
Thermal air restrictions.............................................................................................................................................. 65

Chapter 15: Appendix B. Standards compliance........................................................................... 69

Chapter 16: Appendix C Additional resources...............................................................................70

4 Contents
 1
System overview
The PowerEdge R660 system is a 1U server that supports:
The system features:
● Up to two 4 th Generation Intel Xeon Scalable processors with up to 56 cores and optional Intel ® QuickAssist Technology
● Up to 32 RDIMMs with up to 8 TB of memory and speed up to 4800 MT/s
● Optional Direct Liquid Cooling
● Two redundant AC or DC power supply units
● Up to 10 x 2.5-inch or 8 x 2.5-inch SATA/SAS/NVMe (HDD/SSD) drives
NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe
PCIe SSD User's Guide at https://www.dell.com/support > Browse all Products > Data Center Infrastructure >
Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals
and Documents.

NOTE: All instances of SAS, SATA drives are referred to as drives in this document, unless specified otherwise.

Topics:
• Key workloads
• New technologies

Key workloads
The versatile R660 is designed to address data-intensive, diverse workloads including:
● High Density Virtualization
● Dense Database Analytics(VDI)
● Mixed Workload Standardization

New technologies
The table lists the new technologies that are featured on R660.

Table 1. New technologies

Technology Detailed Description
Intel Sapphire Rapids Processor (Socket E) Up to 56 core processor
3 x Intel® Ultra Path Interconnect (UPI) per CPU at
12.8GT/s, 14.4GT/s, 16GGT/s
80 PCIe Gen4 lanes at 32 GT/s per processor
Up to 3.6 GHz
Maximum TDP: 350 W
4800 MT/s DDR5 Memory Max 16 DIMM per CPU and 32 DIMMs per System.
Supports DDR5 ECC RDIMM up to 4800 MT/s (1 DPC) /
4400 MT/s (2 DPC)
Flex I/O LOM board (optional), 2x1Gb with BCM5720 LAN controller

System overview 5
Table 1. New technologies (continued)
Technology Detailed Description
Rear I/O with:
● 1 x Dedicated iDRAC Ethernet port
● 1 x USB 3.0
● 1 x USB 2.0
● 1 x VGA port (optional for liquid cooling configuration)
Serial Port Option with STD RIO board
OCP Mezz 3.0 (supported by x8 PCIe lanes)
Front I/O with:
● 1 x Dedicated iDRAC Direct micro-USB
● 1 x USB 2.0
● 1 x VGA port
CPLD 1-wire Support payload data of Front PERC, Riser, BP, and Rear I/O
to BOSS-N1 and iDRAC.
Dedicated PERC Front Storage module PERC with Front PERC11 & PERC12
Software RAID OS RAID/S160
Power Supplies 60 mm dimension is the new PSU form factor with 15G on 16G
design.
Titanium 700 W AC/HVDC
Platinum 800 W AC/HVDC
Titanium 1100 W AC/HVDC
Platinum 1400 W AC/HVDC
1100 W LVDC -48- -60 VDC
Titanium 1800 W AC/HVDC

6 System overview
 2
System features and generational
comparison
The following table shows the comparison between the PowerEdge R660 with the PowerEdge R650.

Table 2. Features comparison

Features PowerEdge R660 PowerEdge R650
Processors Two 4th Generation Intel® Xeon® (Socket Two 3 rd Generation Intel® Xeon® (Socket P14)
E) processors processors
CPU interconnect Intel Ultra Path Interconnect (UPI) Intel Ultra Path Interconnect (UPI)
Memory ● 32 DDR5 DIMM slots supports RDIMM 8 ● 32 DDR4 DIMM slots supports RDIMM 2 TB max
TB max, speeds up to 4800 MT/s. or LRDIMM 8 TB max, speeds up to 3200 MT/s.
● Up to 16 Intel Persistent Memory 200 series (BPS)
slots, 12 TB max
Storage Controllers ● Internal: PERC H965i, PERC H755, PERC ● Internal: PERC H755, PERC H755N, PERC H745,
H755N, PERC H355, HBA355i PERC H355, PERC H345, HBA355I
● External: HBA355e ● External: PERC H840, HBA355E
● Software RAID: S160 ● Software RAID: S150
● BOSS-N1 ● BOSS-S1
● BOSS-S2
Drive Bays Front bays: Front bays: Front bays: Front bays:
● Up to 8 x 2.5-inch NVMe SSD max 122.88 ● Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 64
TB TB
● Up to 10 x 2.5-inch SAS/SATA/NVMe ● Up to 8 x 2.5-inch NVMe SSD max 122.88 TB
(HDD/SSD) max 153.6 TB ● Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD)
Rear bays: max 153.6 TB
● Up to 2 x 2.5-inch SAS4/SATA (HDD/ Rear bays:
SSD) max 30.72 TB ● Up to 2 x 2.5-inch SAS4/SATA (HDD/SSD) max
30.72 TB
Power Supplies ● 1800 W Titanium 200-240 VAC or 240 ● 1400 W Platinum 100-240 VAC or 240 HVDC
HVDC ● 1100 W Titanium 100-240 VAC or 240 HVDC
● 1400 W Platinum 100-240 VAC or 240 ● 1100 W LVDC -48 - -60 VDC
HVDC ● 800 W Platinum 100-240 VAC or 240 HVDC
● 1100 W Titanium 100-240 VAC or 240 Hot swap PSUs with full redundancy.
HVDC
● 1100 W LVDC -48 - -60 VDC
● 800 W Platinum 100-240 VAC or 240
HVDC
● 700 W Titanium 200-240 VAC or 240
HVDC
Hot swap PSUs with full redundancy.
Cooling Options ● Air Cooling ● Air Cooling
● Optional Direct Liquid Cooling (DLC) ● Optional Direct Liquid Cooling (DLC)
NOTE: DLC is a rack solution and NOTE: DLC is a rack solution and requires rack
requires rack manifolds and a cooling manifolds and a cooling distribution unit (CDU) to
distribution unit (CDU) to operate. operate.

System features and generational comparison 7

Table 2. Features comparison (continued)
Features PowerEdge R660 PowerEdge R650
Fans Standard (STD) fans /High performance Gold Standard (STD) fans /High performance Silver (HPR)
(VHP) fans fans/ High performance Gold (VHP) fans
Up to 4 sets (dual fan module) hot plug fans Up to 4 sets (dual fan module) hot plug fans
Dimension Height — 42.8 mm (1.68 inches) Height — 42.8 mm (1.68 inches)
Width — 482 mm (18.97 inches) Width — 482 mm (18.97 inches)
Depth — 822.88 mm (32.39 inches) with Depth — 772.11 (30.39 inches) with bezel
bezel
Depth — 809.04 mm (31.85 inches) without Depth — 758.27 mm (29.85 inches) without bezel
bezel
Form Factor 1U rack server 1U rack server
Embedded ● iDRAC9 ● iDRAC9
Management ● iDRAC Direct ● iDRAC Direct
● iDRAC RESTful with Redfish ● iDRAC Service Module
● iDRAC Service Manual ● Quick Sync 2 wireless module
● Quick Sync 2 wireless module
Bezel Optional LCD bezel or security bezel Optional LCD bezel or security bezel
OpenManage ● OpenManage Enterprise ● OpenManage Enterprise
Software ● OpenManage Power Manager plug-in ● OpenManage Power Manager plug-in
● OpenManage SupportAssist plug-in ● OpenManage SupportAssist plug-in
● OpenManage Update Manager plug-in ● OpenManage Update Manager plug-in
Mobility OpenManage Mobile OpenManage Mobile
Integrations and OpenManage Integrations OpenManage ● IBM Tivoli Netcool/
Connections ● BMC TrueSight Integrations OMNIbus
● Microsoft System Center ● BMC TrueSight ● IBM Tivoli Network
● Red Hat Ansible Modules ● Microsoft System Manager IP Edition
● VMware vCenter and vRealize Operations Center ● Micro Focus Operations
Manager ● Red Hat Ansible Manager
Modules ● Nagios Core
● VMware vCenter ● Nagios XI
Security ● Cryptographically signed firmware ● Cryptographically signed firmware
● Data at Rest Encryption (SEDs with local ● Secure Boot
or external key mgmt) ● Secure Erase
● Secure Boot ● Silicon Root of Trust
● Secure Erase ● System Lockdown (requires iDRAC9 Enterprise or
● Secured Component Verification Datacenter)
(Hardware integrity check) ● TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0
● Silicon Root of Trust China NationZ
● System Lockdown (requires iDRAC9
Enterprise or Datacenter)
● TPM 2.0 FIPS, CC-TCG certified, TPM
2.0 China NationZ
Embedded NIC 2 x 1GbE LOM card (optional) 2 x 1GbE LOM card (optional)
Networking Options 1 x OCP card 3.0 (optional) 1 x OCP card 3.0 (optional)
NOTE: The system allows either LOM
card or OCP card or both to be installed
in the system.

GPU Options Up to 3 x 75 W SW Up to 3 x 75 W SW

8 System features and generational comparison

Table 2. Features comparison (continued)
Features PowerEdge R660 PowerEdge R650
Ports Front Ports Rear Ports Front Ports Rear Ports
● 1 x Dedicated ● 1 x USB 2.0 ● 1 x Dedicated iDRAC ● 1 x USB 2.0
iDRAC Direct ● 1 x Serial port Direct micro-USB ● 1 x Serial port (optional)
micro-USB (optional) ● 1 x USB 2.0 ● 1 x USB 3.0
● 1 x USB 2.0 ● 1 x USB 3.0 ● 1 x VGA ● 2 x RJ45
● 1 x VGA ● 1 x Dedicated ● 1 x VGA (optional
iDRAC Ethernet for liquid cooling
port configuration)
● 1 x VGA (optional
for liquid cooling
configuration)
Internal Port: 1 x USB 3.0 (optional) Internal Port: 1 x USB 3.0 (optional)
PCIe Up to three PCIe slots Up to three PCIe slots
● 2 x PCIe Gen5 slots ● 3 x PCIe Gen4 slots
● 3 x PCIe Gen4 slots
Operating System and ● Canonical Ubuntu Server LTS ● Canonical Ubuntu Server LTS
Hypervisors ● Windows Server with Hyper-V ● Citrix Hypervisor
● Red Hat Enterprise Linux ● Windows Server LTSC with Hyper-V
● SUSE Linux Enterprise Server ● Red Hat Enterprise Linux
● VMware ESXi ● SUSE Linux Enterprise Server
For specifications and interoperability details, ● VMware ESXi
see Dell Enterprise Operating Systems on For specifications and interoperability details, see Dell
Servers, Storage, and Networking page at Enterprise Operating Systems on Servers, Storage,
Dell.com/OSsupport. and Networking page at Dell.com/OSsupport.

System features and generational comparison 9

 3
Chassis views and features
Topics:
• Chassis views

Chassis views

Front view of the system

Figure 1. Front view of 8 x 2.5-inch drive system

Figure 2. Front view of 10 x 2.5-inch drive system

Rear view of the system

Rear view of the system

Figure 3. Rear view of the R660 with 3x LP

Figure 4. Rear view of the R660 with 2x 2.5 inches Storage drives, 1x LP

10 Chassis views and features

Inside the system

Figure 5. Inside view of the chassis without risers

Chassis views and features 11

Figure 6. Inside view of the chassis with riser 2

Quick Resource Locator

The QRL on everything (SILs, GSG, Installation and Service Manual except on the EST) is a generic QRL for R660 that leads to
a webpage for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things
that apply to the platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag
number and the iDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL
links to a webpage that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one
click away from the same content of generic information that applies to R660 that is available in the other QRLs.

Figure 7. R660 Quick Resource Locator

12 Chassis views and features

 4
Processor

Topics:
• Processor features

Processor features
The Intel 4 th Generation Xeon ® Scalable Processors stack is the next generation data center processor offering with significant
performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids accelerate customer
usages with unique workload optimizations.
The following lists the features and functions that are in the upcoming 4 th Generation Intel ® Xeon Scalable Processor offering:
● Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multisocket bandwidth
● More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
● Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC)
and 4400 MT/s in two DIMM per channel (2DPC)
● New built-in accelerators for data analytics, networking, storage, crypto, and data compression

Supported processors
The following table shows the Intel Sapphire Rapids SKUs that are supported on the R660.

Table 3. Supported Processors for R660

Proces Clock Speed Cache UPI Cores Threads Turbo Memory Memory TDP
sor (GHz) (M) (GT/s) Speed Capacity
(MT/s)
8480+ 2 105 16 56 112 Turbo 4800 6 TB 350 W
8471N 1.8 98 16 52 104 Turbo 4800 6 TB 300 W
8470Q 2.1 98 16 52 104 Turbo 4800 6 TB 350 W
*
8470N 1.7 98 16 52 104 Turbo 4800 6 TB 300 W
8470 2 98 16 52 104 Turbo 4800 6 TB 350 W
8468 2.1 90 16 48 96 Turbo 4800 6 TB 350 W
8460Y+ 2 75 16 40 80 Turbo 4800 6 TB 300 W
8452Y 2 68 16 36 72 Turbo 4800 6 TB 300 W
6454S 2.2 60 16 32 64 Turbo 4800 6 TB 270 W
6430 2.1 60 16 32 64 Turbo 4800 6 TB 270 W
6414U 2 60 16 32 64 Turbo 4800 6 TB 250 W

Processor 13
 NOTE: *8470Q and 6458Q are supported only in liquid cooling configuration.

NOTE: Mixing of the processors are not recommended. If a liquid cooled processor is installed in one socket, then the
second processor used must be of the same type.

14 Processor
 5
Memory subsystem
Topics:
• Supported memory

Supported memory
Table 4. Memory technology comparison
Feature PowerEdge R660 (DDR5)
DIMM type RDIMM
Transfer speed 4800 MT/s for 1 DIMM per channel, 4400 MT/s for 2 DIMMs
per channel
Voltage 1.1 V

The following table lists the supported DIMMs for the R660. For the latest information about supported memory and memory
configurations, reference the latest SDL.

Table 5. Supported DIMMs

DIMM Type Max DIMM Speed DIMM Ranks Data Width DIMM Volts (V)
(MT/s) Capacity (GB) per DIMM
RDIMM 4800 16 1 x8 1.1
RDIMM 4800 32 2 x8 1.1
RDIMM 4800 64 2 x4 1.1
RDIMM 4800 128 4 x4 1.1
RDIMM 4800 256 8 x4 1.1

Memory subsystem 15
 6
Storage
Topics:
• Storage controllers
• Supported Drives
• Internal storage configuration
• External Storage

Storage controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.
16G PERC Controller offerings are a heavy leverage of 15G PERC family. The Value and Value Performance levels carry over
to 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs
performance and enhanced SSD performance.

Table 6. PERC Series controller offerings

Performance Level Controller and Description
Entry S160
Value H355, HBA355 (internal/external)
Value Performance H755, H755N
Premium Performance H965i,

Avenger 1

Memory: 8GB DDR4 NV cache

72-bit memory 2133 MHz

Low profile form factors

Dual A15 1.2 GHz CPU

X8PCIe 3.0, x8 12Gb SAS

NOTE: For more information about the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at www.dell.com/
storagecontrollermanuals.

NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

Supported Drives
The table shown below lists the internal drives supported by the R660.

16 Storage
Table 7. Supported Drives
Form Factor Type Speed Rotational Capacities
Speed
2.5 inches vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5 inches SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5 inches SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB,
2.5 inches NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800
GB, 400 GB
2.5 inches DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5 inches SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB

Internal storage configuration

R660 available internal storage configurations:
● Zero drives (no backplane)
● 8x2.5" (NVMe)
● 8x2.5" (NVMe RAID)
● 8x2.5" (SAS4/SATA)
● 8x2.5" Universal
● 10x2.5" (SAS4/SATA)
● 10x2.5" (SAS4/SATA) + 2x2.5" (SAS4/SATA)
● 10x2.5" (SAS4/SATA w/ 4 Universal
● 10x2.5" (NVMe)
● 10x2.5" (NVMe) + 2x2.5" (NVMe)
● 10x2.5" (SAS4/SATA w/ 2 Universal

External Storage
The R660 support the external storage device types listed in the table below.

Table 8. Support External Storage Devices

Device Type Description
External Tape Supports connection to external USB tape products
NAS/IDM appliance software Supports NAS software stack
JBOD Supports connection to 12Gb MD-series JBODs

Storage 17
 7
Networking
Topics:
• Overview
• OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support

Table 9. OCP 3.0 feature list
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen4
Max PCIe width x16
Max no.of ports 4
Port type BT/SFP56
Max port speed 100 GbE
NC-SI Yes
SNAPI Yes
WoL Yes
Power consumption 15 W - 75W

Supported OCP cards

Table 10. Supported OCP cards

Form factor Vendor Port type Port speed Port count
OCP 3.0 Intel SFP28 25 GbE 4
Broadcom SFP28 25 GbE 4
Intel SFP28 25 GbE 2
Broadcom SFP28 25 GbE 2
Broadcom BT 10 GbE 4
Intel BT 10 GbE 2

18 Networking
Table 10. Supported OCP cards (continued)
Form factor Vendor Port type Port speed Port count
Intel BT 10 GbE 4
Broadcom BT 1 GbE 4
Intel BT 1 GbE 4

OCP NIC 3.0 vs. rack Network Daughter Card comparisons

Table 11. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor Dell rNDC OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen 3 Gen 3 Gen 4 Supported OCP3 are
SFF (small form factor)
Max PCIe Lanes x8 Up to x16 Up to x8 See server slot priority
matrix
Shared LOM Yes Yes Yes This is iDRAC port
redirect
Aux Power Yes Yes Yes Used for Shared LOM

Networking 19
 8
PCIe subsystem
The R660 supports up to 3 x16 low profile slots by riser2 and riser3. All PCIe ports are 75W card edge delivered power per slot.

Figure 8. PCIe connection diagram

Topics:
• PCIe risers

PCIe risers
The PowerEdge R660 have a no riser option. Shown below are the riser offerings for the PowerEdge R660.

20 PCIe subsystem
Figure 9. Riser 1P
1. Slot 1

Figure 10. Riser 2P

1. Slot 1
2. Slot 2

PCIe subsystem 21
Figure 11. Riser 2A
1. Slot 1
2. Slot 2

Figure 12. Riser 2Q

1. Slot 1
2. Slot 2

22 PCIe subsystem
Figure 13. Riser 3P
1. Slot 3

Figure 14. Riser 4P

1. Slot 2

PCIe subsystem 23
Figure 15. Riser 2R
1. Slot 1

Figure 16. Riser 2S

1. Slot 1

24 PCIe subsystem
Figure 17. Riser 3Q
1. Slot 3

Figure 18. Riser 3S

1. Slot 3

PCIe subsystem 25
Figure 19. Riser 3R
1. Slot 3

Table 12. PCIe Riser Configuration

Config Riser configuration No. of PERC type supported Rear Storage Possible
No. Processor
s
0 No RSR 2 Front PERC No
1 R2A+R3A 2 Front PERC / PERC Adapter No
2 R2P+R3P 2 Front PERC No
3 R1P+R4P 2 Front PERC / PERC Adapter No
4 R2R+R3R 1 N/A No
5 R2A+R3Q 2 Front PERC / PERC Adapter No
6-1 R2Q (non A2) 2 Front PERC No
6 -2 R2Q (only for A2) 2 Front PERC No
7 R3P 2 Front PERC Yes
8 R2A 1 Front PERC / PERC Adapter No

26 PCIe subsystem
 9
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption. The table below lists the tools and technologies Dell offers
to lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics

Power
Table 13. Power tools and technologies
Feature Description
Power Supply Units(PSU) Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
portfolio maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption
of your hardware, power infrastructure, and storage at a given workload. Learn more at
www.dell.com/calc.
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:

● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
● Better performance under a power cap
Power capping Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverage
Intel Node Manager for circuit-breaker fast capping.
Systems Management iDRAC Enterprise and Datacenter provides server-level management that monitors, reports and
controls power consumption at the processor, memory and system level.

Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.

Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Fresh Air cooling Refer to ASHRAE A3/A4 Thermal Restriction.

Power, thermal, and acoustics 27

Table 13. Power tools and technologies (continued)
Feature Description
Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
Find additional information at: https://www.delltechnologies.com/en-us/servers/power-and-
cooling.htm.

Power Supply Units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining
availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency
power conversion and advanced thermal-management techniques, and embedded power-management features, including high-
accuracy power monitoring. The table below shows the power supply unit options that are available for the R660.

Table 14. Power Supply Unit Options

Wattage Frequency Voltage/Current Class Heat
dissipation
700 W mixed 50/60Hz 200-240 V AC/4.1 A Titanium 2625 BTU/hr
mode
N/A 240 V DC/3.4 A N/A 2625 BTU/hr
800 W mixed 50/60Hz 100–240 V AC/ 9.2-4.7 A Platinum 3000 BTU/hr
mode
N/A 240 V DC/3.8 A N/A 3000 BTU/hr
1100 W mixed 50/60 Hz 100–240 V AC/ 12-3.6 A Titanium 4100 BTU/hr
mode
N/A 240 V DC/5.2 A N/A 4100 BTU/hr
1100 W -48 N/A -48 - -60 V DC/27A N/A 4625 BTU/hr
VDC
1400 W mixed 50/60 Hz 100–240 V AC/ 12-8 A Platinum 5250 BTU/hr
mode
N/A 240 V DC/6.6 A N/A 5250 BTU/hr
1800 W mixed 50/60 Hz 200-240 V AC/10 A Titanium 6610 BTU/hr
mode
N/A 240 V DC/8.2 A N/A 6610 BTU/hr

NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is
degraded to 1050 W.

Figure 20. PSU power cords

Table 15. PSU power cords

Form factor Output Power cord
Redundant 60 mm 700 W AC C13
800 W AC C13
1100 W AC C13

28 Power, thermal, and acoustics

Table 15. PSU power cords (continued)
Form factor Output Power cord
1100 W -48 V DC C13
1400 W AC C13
1800 W AC C15

NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.

Figure 21. Thermal design characteristics

The thermal design of the PowerEdge R660 reflects the following:

● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.
● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, as well as inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine
fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user- configurable settings residing
in the iDRAC BIOS setup screen. For more information, see the Dell PowerEdge R660 Installation and Service Manual at
www.dell.com/poweredgemanuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on
Dell.com.

Power, thermal, and acoustics 29

● Cooling redundancy: The R660 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R660 reliable under a wide range of operating
environments.

Acoustics
Acoustical performance
Dell PowerEdge R660 is a rack-mount server appropriate for attended data center environment. However, lower acoustical
output is attainable with proper hardware or software configurations.

Table 16. Acoustical Configurations of R660

Configuration Volume - 1 (HPC) Margin Rich
Acoustical Category Category 4 Category 5
CPU TDP 165 W 300 W
CPU Quantity 2 2
Memory Type 64 GB DDR5 RDIMM 128 GB DDR5 RDIMM
DIMM Quantity 16 32
Backplane Type 10 x 2.5 inches 10 x 2.5 inches
HDD Type 2.5 inches NVMe SSD 2.5 inches NVMe SSD
HDD Quantity 10 10
PSU Type 1400 W 1400 W
PSU Quantity 2 2
PCI 1 Dual Port 25 GbE N/A
PCI 2 Dual Port 25 GbE N/A
Front PERC N/A N/A
OCP Dual Port 25GbE Dual Port 200GbE
M.2 Boss-N1 BOSS-N1

Table 17. Acoustical experience of R660 configurations

Configuration Volume - 1 (HPC) Feature Rich
Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B) Idle (4) 5.3 6.4
Operating/Customer usage operating (5) 5.3 6.5
(6)

K (B) Idle (4) 0.4 0.4

v

Operating/Customer usage operating (5) 0.4 0.4

(6)

L pA,m (dB) Idle (4) 41.3 52.3

Operating/Customer usage operating (5) 41.3 52.5
(6)

Prominent tones (3) Acoustical Performance: Idle @ 28°C Ambient

L (1) (B) 1/6~1/13 7.0
wA,m

30 Power, thermal, and acoustics

Table 17. Acoustical experience of R660 configurations (continued)
Configuration Volume - 1 (HPC) Feature Rich
K v (B) 0.4 0.4
L (2) (dB) 1/6~1/13 55.4
pA,m

Acoustical Performance: Max. loading @ 35°C Ambient

L (1) (B) 1/6~1/13 8.5
wA,m

K v (B) 0.4 0.4

L (2) (dB) 1/6~1/13 72.2
pA,m

(1) LwA,m:The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 (2017) with data
collected using the methods that are described in ISO 7779 (2010). Engineering data presented here may not be fully compliant
with ISO 7779 declaration requirement.
(2) LpA,m:The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
(2017) and measured using methods that are described in ISO 7779 (2010). The system is placed in a 24U rack enclosure, 75 cm
above a reflective floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirement.
(3) Prominent tones: Criteria of Annex D of ECMA-74 and Prominence Ratio method of ECMA-418 are followed to determine if

discrete tones are prominent and to report them, if so.

(4) Idle mode: The steady-state condition in which the server is energized but not operating any intended function.
(5) Operatingmode: The maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for the
respective sections of Annex C of ECMA-74.
(6)Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 25%~30% of CPU TDP, 2.5%~10% IOPs load, and >80% GPU load as the components showed in the above configurations.

PowerEdge acoustical specifications

For more information on acoustical specifications, see ENG0019663. (See the category definitions.)
Dell typically categorizes servers in five categories of acoustically acceptable usage:
● Category 1: Table-top in Office Environment
● Category 2: Floor-standing in Office Environment
● Category 3: General Use Space
● Category 4: Attended Data Center
● Category 5: Unattended Data Center

Category 2: Floor-standing in Office Environment

When Dell determines that a specific Enterprise product is to be used primarily when it is sitting on the floor, that is, next to a
user’s feet, then the acoustical specification in the table below applies. Noise from the product should not annoy or otherwise
interfere with the user’s thoughts or speech, for example, on the telephone.

Power, thermal, and acoustics 31

Table 18. Dell Enterprise Category 2, “Floor-standing in Office Environment” acoustical specification
category
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, except where
Position re AC0159 noted below)
AC0158
Standby in Idle in 23±2° C Operating in Simulate (that is, set fan
23±2° C Ambient 23±2° C speeds representative) for Idle
Ambient Ambient – if at 28° C & 35° C Ambient,
not otherwise and for 100% loading and
specified in maximum configuration, at 35°
the program’s C Ambient
configuration
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B ≤ 4.9 ≤ 5.1 ≤ 5.4 Report
Sound Quality Tones, Hz, dB No prominent tones per criteria D.10.6 and D.10.8 of Report tones
(both positions ECMA-74
must meet
limits): Front Tonality, tu ≤ 0.35 ≤ 0.35 ≤ 0.35 Report
Binaural HEAD Dell Modulation, ≤ 35 ≤ 35 ≤ 35 Report
and Rear %
Microphone
Loudness, sones Report Report Report Report
LpA-single Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if observed, during 20- N/A
HEAD minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”
● Acoustical Jump (see AC0159), during air mover
speed transition from Idle to Operating Mode
must be ≤ 15 dB.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, that is, no
sudden or large jumps, and fan speed during
startup must not exceed 50% of its maximum
● Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”
Any Other ● No rattles, squeaks, or unexpected noises
● Sound should be “even” around the EUT (one side should not be dramatically louder
than another)
● Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.
● Specific operating conditions are defined in “Configurations and Configuration
Dependencies” for each platform.
Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all mics
dBA, re AC0158 mics mics mics
and program
configuration
document

32 Power, thermal, and acoustics

Category 4: Attended Data Center
When Dell determines that a specific Enterprise product is to be predominantly used in an attended data center, then the
acoustical specification of the table applies. The phrase “attended data center” is used to mean a space in which many (from
tens to 1000s) of Enterprise products are deployed in proximity (that is, in the same room) to personnel whose speech (perhaps
with raised voices) is expected to be intelligible over the data center noise. Hearing protection or hearing monitoring programs
are not expected in these areas. Examples in this category include monolithic rack products. When Dell determines that a
specific Enterprise product is to be predominantly used in a general use space, then the acoustical specification of the above
table applies. These products could be found in laboratories, schools, restaurants, open office space layouts, small ventilated
closets, etc., though not in close proximity to any particular person nor in quantities greater than a few in any location. People
within proximity of a few of these products should not experience any impact to speech intelligibility or annoyance from the
noise of the product. A rack product sitting on a table in a common area is an example.

Table 19. Dell Enterprise Category 4, “Attended Data Center” acoustical specification category.
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see Simulate (that
Position re AC0159 AC0159, except where noted below) is, set fan
AC0158 speeds
Standby in Idle in 23±2° C Operating in Simulate (that representative
23±2° C Ambient 23±2° C is, set fan ) for 100%
Ambient Ambient – if speeds loading and
not otherwise representative maximum
specified in ) for Idle at configuration,
the program’s 28° C & 35° C at 35° C
configuration Ambient Ambient
document,
then processor
and hard drive
operating
modes are
required
Sound Power LWA,m, B Report ≤ 6.9 ≤ 7.1 Report ≤ 8.5
Front Binaural Tones, Hz, dB Report < 15 dB < 15 dB Report < 20 dB
HEAD
Tonality, tu Report Report Report Report Report
Dell Modulation, Report Report Report Report Report
%
Loudness, sones Report Report Report Report Report
LpA-single Report Report Report Report Report
point, dBA
Transients ● Oscillation (see AC0159), if observed, during 20- N/A
minute steady-state observation, must adhere to
the following two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA < 3.0 dB”
○ Acoustical Jump (see AC0159), during air
mover speed transition from Idle to Operating
Mode must be ≤ 15 dB.
○ Startup behavior
￭ Report Startup behavior re. AC0159
￭ Startup must proceed smoothly, that is,
no sudden or large jumps, and fan speed
during startup must not exceed 50% of its
maximum
∞ Transient inputs: Report time-history sound
pressure levels re AC0159 “Train of Step
Functions on Processor”

Any Other No rattles, squeaks, or unexpected noises

Sound should be “even” around the EUT (one side should not be dramatically louder than
another)

Power, thermal, and acoustics 33

Table 19. Dell Enterprise Category 4, “Attended Data Center” acoustical specification
category. (continued)
Measurement Metric, re Test Modes, re AC0159 (note must be in steady state, see Simulate (that
Position re AC0159 AC0159, except where noted below) is, set fan
AC0158 speeds
Standby in Idle in 23±2° C Operating in Simulate (that representative
23±2° C Ambient 23±2° C is, set fan ) for 100%
Ambient Ambient – if speeds loading and
not otherwise representative maximum
specified in ) for Idle at configuration,
the program’s 28° C & 35° C at 35° C
configuration Ambient Ambient
document,
then processor
and hard drive
operating
modes are
required

Unless otherwise specified, the “default” thermal-related settings shall be selected for
BIOS and iDRAC.

Specific operating conditions will be defined in “Configurations & Configuration

Dependencies” for each platform.

Sound Pressure LpA-reported, Report for all Report for all Report for all Report for all Report for all
dBA mics mics mics mics mics

Category 5: Unattended Data Center

When Dell determines that a specific Enterprise product is to be predominantly used in an unattended data center (and not
blades or blade enclosures; these have their own category), then the acoustical specification in the table below applies. The
phrase “unattended data center” is used to mean a space in which many (from tens to 1000s) of Enterprise products are
deployed together, its own heating and cooling systems condition the space, and operators or servicers of equipment enter
generally only to deploy, service, or decommission equipment. Hearing protection or hearing monitoring programs may be
expected (per government or company guidelines) in these areas. Examples in this category include monolithic rack products.

Table 20. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification category
Measuremen Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, Simulate (that
t Position re AC0159 except where noted below) is, set air
AC0158 mover speeds
Standby in Idle in 23±2° Operating in Simulate (that is, representative
23±2° C C Ambient 23±2° C set air mover speeds ) for 100%
Ambient Ambient – if representative) for Idle at loading and
not 28° C & 35° C Ambient maximum
otherwise configuration,
specified in at 35° C
the Ambient
program’s
configuratio
n document,
then
processor
and hard
drive
operating
modes are
required
Sound Power LWA,m, B Report ≤ 7.5 ≤ 7.7 Report ≤ 8.7
Front Binaural Tones, Hz, dB Report < 15 dB < 15 dB Report < 20 dB
HEAD
Tonality, tu Report Report Report Report Report
Dell Report Report Report Report Report
Modulation,
%

34 Power, thermal, and acoustics

Table 20. Dell Enterprise Category 5, “Unattended Data Center” acoustical specification
category (continued)
Measuremen Metric, re Test Modes, re AC0159 (note must be in steady state, see AC0159, Simulate (that
t Position re AC0159 except where noted below) is, set air
AC0158 mover speeds
Standby in Idle in 23±2° Operating in Simulate (that is, representative
23±2° C C Ambient 23±2° C set air mover speeds ) for 100%
Ambient Ambient – if representative) for Idle at loading and
not 28° C & 35° C Ambient maximum
otherwise configuration,
specified in at 35° C
the Ambient
program’s
configuratio
n document,
then
processor
and hard
drive
operating
modes are
required
Loudness, Report Report Report Report Report
sones
LpA-single Report Report Report Report Report
point, dBA
Front Binaural Transients ● Oscillation (see AC0159), if N/A
HEAD observed, during 20-minute steady-state
observation, must adhere to the following
two criteria:
○ Max. {ΔLpA} < 3.0 dB
○ Event count < 3 for “1.5 dB < ΔLpA <
3.0 dB”
● Report Acoustical Jump (see AC0159)
during air mover speed transition from
Idle to Operating Mode.
● Startup behavior
○ Report Startup behavior re. AC0159
○ Startup must proceed smoothly, that
is, no sudden or large jumps, and air
mover speed during startup must not
exceed 50% of its maximum
● Transient inputs: Report time-history
sound pressure levels re AC0159 “Train of
Step Functions on Processor”
Any Other No rattles, squeaks, or unexpected noises

Sound should be “even” around the EUT (one side should not be dramatically louder than
another)

Unless otherwise specified, the “default” thermal-related settings shall be selected for BIOS
and iDRAC.

Specific operating conditions will be defined in “Configurations & Configuration Dependencies”

for each platform.

Sound LpA-reported, Report for all Report for all Report for all Report for all mics Report for all
Pressure dBA, re mics mics mics mics
AC0158 and
program
configuration
document

Power, thermal, and acoustics 35

 10
Rack, rails, and cable management
Topics:
• Rails and cable management information

Rails and cable management information

The rail offerings for the PowerEdge R660 consist of two general types: sliding and static. The cable management offerings
consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB).
See the Dell Technologies Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at https://i.dell.com/sites/
csdocuments/Business_solutions_engineering-Docs_Documents/en/rail-rack-matrix.pdf for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types.
● Rail depth with and without cable management accessories.
● Rack types that are supported for various rack mounting flange types.
Key factors governing proper rail selection include the following:
● Spacing between the front and rear mounting flanges of the rack.
● Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs).
● Overall depth of the rack

Sliding rails features summary

The sliding rails allow the system to be fully extended out of the rack for service. There are two types of sliding rails available,
ReadyRails II sliding rails and Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable
management arm (CMA) or strain relief bar (SRB).
A15 ReadyRails II sliding rails for 4-post racks
● Supports drop-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square or un-threaded round hole 4-post racks including all
generations of the Dell racks.
● Support for tooled installation in 19" EIA-310-E compliant threaded hole 4-post racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional strain relief bar (SRB).
● Support for optional cable management arm (CMA).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from
the sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted
PDUs or the rear rack door.

36 Rack, rails, and cable management

Figure 22. Sliding rails with optional CMA

Figure 23. Sliding rails with optional SRB

A16 Stab-in/Drop-in sliding rails for 4-post racks

● Supports drop-in or stab-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square, un-threaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks.
● Support for tool-less installation in Dell Titan or Titan-D racks
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional cable management arm (CMA).
● Support for optional strain relief bar (SRB).

Rack, rails, and cable management 37

 NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from
the sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted
PDUs or the rear rack door.
Scan the QRL code for the documentation and trouble-shooting information regarding the installation procedures for Drop-in/
Stab-in rail types.

Figure 24. Quick resource locator for combo rails

A14 static rails summary

The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their
reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails.
However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not
compatible with SRB.

Figure 25. Static rails

Static rails features summary

Static rails for 4-post and 2-post racks:
● Supports Stab-in installation of the chassis to the rails.
● Support tool-less installation in 19" EIA-310-E compliant square or un-threaded round hole 4-post racks including all
generations of Dell racks.
● Support tooled installation in 19" EIA-310-E compliant threaded hole 4-post and 2-post racks.
● Support for tooled installation in Dell Titan or Titan-D rack.
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges.
● Screw head diameter should be 10 mm or less.
2-Post racks installation

38 Rack, rails, and cable management

If installing to 2-Post (Telco) racks, the ReadyRails II static rails (A14) must be used. Sliding rails support mounting in 4-post
racks only.

Figure 26. Static rails in 2-post center mount configuration

Installation in the Dell Titan or Titan-D racks

For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (A16) must be used. This rail collapses down
sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The Stab-in/
Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For tooled
installation, Stab-in static rails (A14) must be used for bezel alignment with storage systems.

Cable management arm (CMA)

The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It
unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA
include:
● Large U-shaped baskets to support dense cable loads.
● Open vent pattern for optimal airflow.
● Ability to mount on either side by swinging the spring-loaded brackets from one side to the other.
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling.
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position.
● Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs.
● CMA is not supported in Direct Liquid Cooling (DLC) configuration.
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.

Figure 27. Sliding rails with CMA

Rack, rails, and cable management 39

Figure 28. CMA Cabling

Strain Relief Bar (SRB)

The optional strain relief bar (SRB) for the PowerEdge R660 organizes and supports cable connections at the rear end of the
server to avoid damage from bending.

Figure 29. Cabled strain relief bar

● Tool-less attachment to the rails

● Two depth positions to accommodate various cable loads and rack depths
● Supports cable loads and controls stresses on server connectors
● Cables can be segregated into discrete purpose-specific bundles

40 Rack, rails, and cable management

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing system into the rack (option A: Drop-In)

1. Pull the inner rails out of the rack until they lock into place.

Figure 30. Pull out inner rail

2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Rack, rails, and cable management 41

 Figure 31. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Figure 32. Slide system into the rack

Installing the system into the rack (option B: Stab-In)

1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

42 Rack, rails, and cable management

 Figure 33. Pull out the intermediate rail

Table 21. Rail component label

Number Component
1 Intermediate rail
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.

Rack, rails, and cable management 43

 Figure 34. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.

Figure 35. Install system into the extended rails

5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

44 Rack, rails, and cable management

Figure 36. Slide system into the rack

Rack, rails, and cable management 45

 11
Supported Operating Systems
The PowerEdge system supports the following operating systems:
● Canonical® Ubuntu® Server LTS
● Microsoft® Windows Server® with Hyper-V
● Red Hat® Enterprise Linux
● SUSE® Linux Enterprise server
● VMware® ESXi®
Links to specific OS versions and editions, certification matrices, Hardware Compatibility Lists (HCL) portal, and Hypervisor
support are available at Dell Enterprise Operating Systems.

46 Supported Operating Systems

 12
Dell OpenManage Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently;
in physical, virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:
● Innovative embedded management tools - integrated Dell Remote Access Controller (iDRAC)
● Consoles - OpenManage Enterprise
● Extensible with plug-ins - OpenManage Power Manager
● Update tools - Repository Manager
Dell has developed comprehensive systems management solutions that are based on open standards and has integrated with
management consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dell
management capabilities extend to offerings from the industry's top systems management vendors and frameworks such as
Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities along
with powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
● The latest Dell Systems Management Overview Guide.
Topics:
• Integrated Dell Remote Access Controller (iDRAC)
• Systems Management software support matrix

Integrated Dell Remote Access Controller (iDRAC)

iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management
of PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-free
management puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,
with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 and
the host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is
configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

Dell OpenManage Systems Management 47

Table 22. iDRAC9 license tiers
License Description
iDRAC9 Basic ● Available only on 100-500 series rack/tower
● Basic instrumentation with iDRAC web UI
● For cost conscious customers that see limited value in management
iDRAC9 ● Default on 600+ series rack/tower, modular, and XR series
Express ● Includes all features of Basic
● Expanded remote management and server life-cycle features
iDRAC9 ● Available as an upsell on all servers
Enterprise ● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities
iDRAC9 ● Available as an upsell on all servers
Datacenter ● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, and
thermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at Dell.com.
For more details on iDRAC9 including white papers and videos, see:
● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at Dell.com

Systems Management software support matrix

Table 23. Systems Management software support matrix
Categories Features PE mainstream
Embedded Management and In-band iDRAC9 (Express, Enterprise, and Datacenter licenses) Supported
Services
OpenManage Mobile Supported
OM Server Administrator (OMSA) Supported
iDRAC Service Module (iSM) Supported
Driver Pack Supported
Change Management Update Tools (Repository Manager, DSU, Catalogs) Supported
Server Update Utility Supported
Lifecycle Controller Driver Pack Supported
Bootable ISO Supported
Console and Plug-ins OpenManage Enterprise Supported
Power Manager Plug-in Supported
Update Manager Plug-in Supported
SupportAssist Plug-in Supported
CloudIQ Supported
Integrations and connections OM Integration with VMware Vcenter/vROps Supported
OM Integration with Microsoft System Center (OMIMSC) Supported
Integrations with Microsoft System Center and Windows Supported
Admin Center (WAC)

48 Dell OpenManage Systems Management

Table 23. Systems Management software support matrix (continued)
Categories Features PE mainstream
ServiceNow Supported
Ansible Supported
Third-party Connectors (Nagios, Tivoli, Microfocus) Supported
Security Secure Enterprise Key Management Supported
Secure Component Verification Supported
Standard operating system Red Hat Enterprise Linux, SUSE, Windows Server 2021 Supported (Tier-1)
Ubuntu, CentOS

Dell OpenManage Systems Management 49

 13
Appendix D: Service and support
Topics:
• Default support levels
• Other services and support information

Default support levels

This system offers 3 years Dell ProSupport Next Business Day (NBD), including 24x7 phone support and NBD parts and labor
support.

Default deployment levels

This system is defaulted to ProDeploy Dell Server which includes onsite hardware installation and software configuration.
Optionally, the customer may choose to any of the factory or field deployment offers listed below.

Other services and support information

Dell Technologies Services include a wide, customizable range of service options to simplify the assessment, design,
implementation, management and maintenance of IT environments and to help transition from platform to platform.
Depending on the current business requirements and correct level of service for customers, we provide factory, onsite, remote,
modular, and specialized services that fit the customer requirements and budget. We will help with a little or a lot, based on the
customers choice, and provide access to our global resources.

Dell deployment services

Dell ProDeploy Infrastructure Suite

ProDeploy Infrastructure Suite provides a variety of deployment offerings that satisfy a customer's unique needs. It is made
up of 5 offers: ProDeploy Configuration Services, ProDeploy Rack Integration Services, Basic Deployment, ProDeploy, and
ProDeploy Plus.

50 Appendix D: Service and support

Figure 37. ProDeploy Infrastructure Suite for servers

The new Factory Services consist of two tiers of deployment that happen prior to shipping to the customer's site.
Factory Based Services:
● ProDeploy Factory Configuration - Ideal for customers buying servers in volume and seeking pre-configuration prior to
shipping such as: custom image, system settings, and asset tagging so it arrives ready to use out of the box. Furthermore,
servers can be packaged and bundled to meet specific shipping and distribution requirements for each customer location to
facilitate the rollout process. Upsell one of the field based services (below) if a customer needs assistance with the final
server installation.
● ProDeploy Rack Integration - Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack
builds include hardware install, cabling, and full system configuration. You can also add-on a factory stress test and optional
on-site final rack configuration to complete the rack installation.
○ STANDARD SKUs for Rack Integration is available in US only and requires:
￭ 20 or more devices (R and C series servers and all Dell or non-Dell switches). Use Informational SKUs for Dell
switches or 3rd party products
￭ Shipping to contiguous US
○ USE CUSTOM QUOTE for Rack Integration for:
￭ All countries except USA
￭ Racks containing less than 20 servers
￭ Any rack that includes VxRail or Storage
￭ Shipping outside contiguous US
￭ Shipping to multiple locations
Field Based Services:
● Basic Deployment consists of the hardware installation, cabling and firmware update during normal standard business hours.
Basic Deployment is traditionally sold to Competency Enabled Partners. Competency enabled partners often have Dell do the
hardware installation while they complete the software configuration.
● ProDeploy consists of your hardware installation and configuration of the software using offshore resources. ProDeploy is
great for customers who are price sensitive or who are remote from their data centers and don't require an onsite presence.
● ProDeploy Plus will give you in-region or onsite resources to complete the engagement for the customer. It also comes with
additional features such as Post Deployment Configuration Assistance and Training Credits.

Appendix D: Service and support 51

Figure 38. ProDeploy Infrastructure Suite - Factory services

Figure 39. ProDeploy Infrastructure Suite - Field services

Dell ProDeploy Plus for Infrastructure

From beginning to end, ProDeploy Plus provides the skill and scale that is must successfully perform demanding deployments in
today's complex IT environments. Certified Dell experts start with extensive environmental assessments and detailed migration

52 Appendix D: Service and support

planning and recommendations. Software installation includes set up of our enterprise connectivity solution (secure connect
gateway) and OpenManage system management utilities.
Postdeployment configuration assistance, testing, and product orientation services are also available.

Dell ProDeploy for Infrastructure

ProDeploy provides full-service installation and configuration of both server hardware and system software by certified
deployment engineers including set up of leading operating systems and hypervisors as well our enterprise connectivity solution
(secure connect gateway) and OpenManage system management utilities. To prepare for the deployment, we conduct a
site readiness review and implementation planning exercise. System testing, validation, and full project documentation with
knowledge transfer complete the process.

Dell Basic Deployment

Basic Deployment delivers worry-free professional installation by experienced technicians who know Dell servers inside and out.

Additional Deployment Services

You can tailor the ProDeploy Infrastructure Suite offer to meet your customer's unique needs by leveraging "Additional
Deployment Time." ADT will cover additional tasks above the normal scope of the standard offers. ADT can be sold for Project
Management or Technical Resources and is sold as blocks of four hours remote or eight hours on-site.

Dell ProDeploy for HPC (available in US/Canada only. All other regions use custom)
HPC deployments require specialists that understand that cutting edge is yesterday's news. Dell deploys the world 's fastest
systems and understands the nuances that make them perform. ProDeploy for HPC provides:
● Global team of dedicated HPC specialists
● Proven track record, thousands of successful HPC deployments
● Design validation, benchmarking, and product orientation
Learn more at Dell.com/HPC-Services.

Appendix D: Service and support 53

Figure 40. ProDeploy Expansion for HPC

Dell custom deployment Services

Dell custom rack integration and other Dell configuration services help customers save time by providing systems that are
racked, cabled, tested, and ready to be integrated into the data center. Dell support preconfigure RAID, BIOS and iDRAC
settings, install system images, and even install third-party hardware and software.
For more information, see Server Configuration Services.

Dell Residency Services

Residency Services help customers transition to new capabilities quickly with the assistance of onsite or remote Dell experts
whose priorities and time they control.
Residency experts can provide post implementation management and knowledge transfer that is related to a new technology
acquisition or day-to-day operational management of the IT infrastructure.

Dell Data Migration Services

Protect business and data of the customer with our single point of contact to manage data migration projects.
A customer project manager works with our experienced team of experts to create a plan using industry-leading tools and
proven processes that are based on global best practices to migrate existing files and data, so business systems are up and
running quickly and smoothly.

54 Appendix D: Service and support

Dell Enterprise Support Services

Dell ProSupport Enterprise Suite

With the ProSupport Enterprise Suite, we help keep IT systems running smoothly, so customers can focus on running their
business. We help maintain peak performance and availability of the most essential workloads. ProSupport Enterprise Suite is a
suite of support services that enable customers to build the solution that is right for their organization. They choose support
models that are based on how they use technology and where they want to allocate resources. From the desktop to the data
center, address everyday IT challenges, such as unplanned downtime, mission-critical needs, data and asset protection, support
planning, resource allocation, software application management and more. Optimize customer IT resources by choosing the right
support model.

Table 24. ProSupport Enterprise Suite

Service Support model Description
ProSupport Enterprise Suite ProSupport Plus for Enterprise Proactive, predictive, and reactive
support for systems that look after
your business-critical applications and
workloads
ProSupport for Enterprise Comprehensive 24 x 7 support
Basic hardware support Reactive hardware support during
normal business hours

Dell ProSupport Plus for Enterprise

When customers purchase PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service
for business-critical systems. ProSupport Plus provides all the benefits of ProSupport, plus the following:
● An assigned Services Account Manager who knows their business and environment
● Immediate advanced troubleshooting from an engineer
● Personalized, preventive recommendations that are based on analysis of support trends and best practices from across the
Dell Technologies infrastructure solutions customer base to reduce support issues and improve performance
● Predictive analysis for issue prevention and optimization that is enabled by secure connect gateway technology
● Proactive monitoring, issue detection, notification, and automated case creation for accelerated issue resolution enabled by
secure connect gateway
● On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect

Dell ProSupport for Enterprise

ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● Predictive, automated tools and innovative technology
● A central point of accountability for all hardware and software issues
● Collaborative third-party support
● Hypervisor, operating system and application support
● Consistent experience regardless of where customers are located or what language they speak
NOTE: Subject to service offer country or region availability.
● Optional onsite parts and labor response options including next business day or four-hour mission critical

Appendix D: Service and support 55

Figure 41. ProSupport Enterprise Suite

Dell ProSupport One for Data Center

ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000
assets. This offering is built on standard ProSupport components that leverage our global scale but are tailored to a customer's
needs. While not for everyone, this service option offers a truly unique solution for Dell Technologies largest customers with the
most complex environments.
● Team of assigned Services Account Managers with remote, on-site options
● Assigned ProSupport One technical and field engineers who are trained on the customer’s environment and configurations
● On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect
● Flexible on-site support and parts options that fit their operational model
● A tailored support plan and training for their operations staff

Dell ProSupport Add-on for HPC

The ProSupport Add-on for HPC provides solution-aware support including:
● Access to senior HPC experts
● Advanced HPC cluster assistance: performance, interoperability, and configuration
● Enhanced HPC solution level end-to-end support
● Remote presupport engagement with HPC Specialists during ProDeploy implementation
Learn more at Dell.com/HPC-Services.

56 Appendix D: Service and support

Figure 42. ProSupport Add-on for HPC is an add-on to PS or PSP

Support Technologies
Powering the support experience with predictive, data-driven technologies.

NOTE: SupportAssist Enterprise capabilities are now part of the secure connect gateway technology.

Enterprise connectivity
The best time to solve a problem is before it happens. The automated proactive and predictive support features enabled by the
secure connect gateway technology helps reduce steps and time to resolution, often detecting issues before they become a
crisis. The gateway technology is available in virtual and application editions. It is also implemented as a direct connect version
for select Dell hardware and a Services plugin within OpenManage Enterprise for PowerEdge servers. The legacy SupportAssist
Enterprise solution has been retired and is now replaced by the secure connect gateway solutions.
Benefits include:
● Value: Our connectivity solutions are available to all customers at no additional charge
● Improve productivity: Replace manual, high-effort routines with automated support
● Accelerate time to resolution: Receive issue alerts, automatic case creation, and proactive contact from Dell experts
● Gain insight and control: Optimize enterprise devices with insights in portals reporting like TechDirect, and get predictive
issue detection before the problem starts
NOTE: Connect devices can access these features. Features vary depending on the service level agreement for the
connected device. ProSupport Plus customers experience the full set of automated support capabilities.

Table 25. Features enabled by connectivity

— Basic hardware ProSupport ProSupport Plus
warranty
Automated issue detection and system Supported Supported Supported
state information collection
Proactive, automated case creation and Not supported Supported Supported
notification

Appendix D: Service and support 57

Table 25. Features enabled by connectivity (continued)
— Basic hardware ProSupport ProSupport Plus
warranty
Predictive issue detection for failure Not supported Not supported Supported
prevention

Get started at DellTechnologies.com/secureconnectgateway.

Dell TechDirect
TechDirect helps boost IT team productivity when supporting Dell systems.
Boost your productivity with online servoce for Dell products from TechDirect. From deployment to technical support,
TechDirect lets you do more with less effort and faster resolution. You can:
● OPen and manage support requests or in-warranty systems
● Execute online self-service for parts dispatch
● Collaborate on ProDeploy infrastructure deployment projects online
● Manage proactive and preditive alerts from secure connect gateway technology that help maximize uptime
● Integrate services functionality into your help desk with TechDirect APIs
● Join over 10,000 companies that choose TechDirect
Register at TechDirect.Dell.com.

Dell Technologies Consulting Services

Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can
help determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. From multi cloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center
modernization, analytics, workforce collaboration, and user experiences-we are here to help.

Dell Managed Services

Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive,
AI enabled delivery operations and modern automation to help customers realize desired business outcomes from their
infrastructure investments. With these technologies, our experts run, update and fine-tune customer environments aligned
with service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed service
offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people and
tools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the
management of it. Many customers will have a blend of the two management types depending on the goals of the organization.

58 Appendix D: Service and support

Figure 43. Dell Managed Services

Dell Technologies Education Services

Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com.

Appendix D: Service and support 59

 14
Appendix A: Additional specifications
Topics:
• Chassis dimension
• Chassis weight
• NIC port specifications
• Video specifications
• USB ports specifications
• PSU rating
• Environmental Specifications

Chassis dimension
The R660 has the following dimensions:

Figure 44. Chassis dimensions

60 Appendix A: Additional specifications

Table 26. PowerEdge R660 system chassis dimension
Drives Xa Xb Y Za Zb Zc
8x2.5" drives / 482.0 mm (18.97 434.0 mm 42.8 mm (1.68 35.84 mm (1.41 751.47 mm (17 787.04 mm
10x2.5" drives inches) (17.08 inches) inches) inches) With inches) Ear to (30 inches)
bezel rear wall Ear to PSU
handle
22 mm (0.86
inches)
Without bezel

0 drive 482.0 mm (18.97 434.0 mm 42.8 mm (1.68 35.84 mm (1.41 700.7 mm (27.5 736.27 mm
inches) (17.08 inches) inches) inches) With inches) Ear to (28 inches)
bezel rear wall Ear to rear
wall
22 mm (0.86
inches)
Without bezel

14xE3.S drives / 482.0 mm (18.97 434.0 mm 42.8 mm (1.68 35.84 mm (1.41 751.47 mm (17 787.04 mm
16xE3.S drives inches) (17.08 inches) inches) inches) With inches) Ear to (30 inches)
bezel rear wall Ear to PSU
handle
22 mm (0.86
inches)
Without bezel

NOTE: E3.S drives are supported post RTS.

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight
Table 27. PowerEdge R660 system weight
System configuration Maximum weight (with all drives/SSDs)
A server with fully populated drives 22.51 kg (49.62 lbs)
A server without drives and PSU installed 18.5 kg (40.78 lbs)

NIC port specifications

The system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on
Motherboard (LOM) and integrated on the optional OCP cards.

Table 28. NIC port specification for the system

Feature Specifications
LOM card (optional) 1 GB x 2
OCP card (OCP 3.0) (optional) 1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

NOTE: The system allows either LOM card or an OCP card or both to be installed in the system.

NOTE: On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8.

Appendix A: Additional specifications 61

Video specifications
The platform supports the following video resolution and refresh rates:

Table 29. Video specifications for R660

Resolution Refresh Rate Freq. Pixel Clock DVO DisplayPort
1024 x 768 60 Hz 48.4 kHz 65.0 MHz Yes*
1280 x 800 60 Hz 49.7 kHz 83.5 MHz Yes*
1280 x 1024 60 Hz 64.0 kHz 108.0 MHz Yes*
1360 x 768 60 Hz 47.71 kHz 85.5 MHz Yes*
1440 x 900 60 Hz 55.9 kHz 106.5 MHz Yes*
1600 x 900 60 Hz 55.54 kHz 97.75 MHz Yes*
1600 x 1200 60 Hz 75.0 kHz 162.0 MHz Yes*
1680 x 1050 60 Hz 64.7 kHz 119.0 MHz Yes*
1920 x 1080 60 Hz (RB) 67.158 kHz 173.0 MHz No
1920 x 1200 60 Hz (RB) 74.556 kHz 193.25 MHz No

*DVO - DP is for investigation only, dependent on Nuvoton DVO capabilities to support up to 165MHz. Rear Panel Performance
is TBD subject to final board design and losses to rear VGA connector.
*(RB) - Reduced Blanking for Digital Displays requiring less blank time. This was introduced for Signal Integrity improvements by
reducing Pixel Clock rates for VGA- Analog input devices.

USB ports specifications

Table 30. PowerEdge R660 USB specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0- One USB 2.0- One Internal USB 3.0- One
compliant port compliant port compliant port
iDRAC Direct port One USB 3.0- One
(Micro-AB USB compliant port
2.0-compliant
port)

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

Front USB 2.0 port only supports output current up to 0.5A and can't support high power consumption devices such as
CD-ROM. The bottom port of the rear USB connector can support USB3.0 to supply output current up to 0.9A.

Figure 45. R660 Front USB

62 Appendix A: Additional specifications

Figure 46. R660 Rear USB

PSU rating
Table 31. PSUs Highline and Lowline ratings
Features 700 W 800 W 1100 W 1100 W 1400 W 1800 W
Titanium Platinum Titanium -48VDC Platinum Platinum

Peak Power 1190 W 1360 W 1870 W 1870 W 2380 W 3060 W

(Highline/-72 VDC)
Highline /-72 VDC 700 W 800 W 1100 W 1100 W 1400 W 1800 W
Peak Power N/A 1360 W 1785 W N/A 1785 W N/A
(Lowline/-40 VDC)
Lowline /-40 VDC N/A 800 W 1050 W N/A 1050 W N/A
Highline 240 VDC 700 W 800 W 1100 W N/A 1400 W 1800 W
DC -48- -60 V N/A N/A N/A 1100 W N/A N/A

The PowerEdge R660 supports up to two AC or DC power supplies with 1+1 redundancy, autosensing, and auto-switching
capability.
If two PSUs are present during POST, a comparison is made between the wattage capacities of the PSUs. In the event that the
PSU wattages don’t match, the larger of the two PSU’s is enabled. Also, there is a PSU mismatch warning displayed in BIOS,
iDRAC, or on the System LCD.
If a second PSU is added at run-time, in order for that particular PSU to be enabled, the wattage capacity of the first PSU must
equal the second PSU. Otherwise, the PSU will be flagged as unmatched in iDRAC and the second PSU will not be enabled.
Dell PSUs have achieved Platinum efficiency levels as shown in the table below.

Table 32. PSU Efficiency Levels

Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
Redundant 700 W AC Titanium 90.00% 94.00% 96.00% 91.50%
60mm
800 W AC Platinum 89.00% 93.00% 94.00% 91.50%
1100 W AC Titanium 90.00% 94.00% 96.00% 91.50%
1100 W -48 N/A 85.00% 90.00% 92.00% 90.00%
VDC
1400 W AC Platinum 89.00% 93.00% 94.00% 91.50%
1800 W AC Titanium 90.00% 94.00% 96.00% 94.00%

Environmental Specifications
See the PowerEdge R660 Technical Specifications on www.dell.com/poweredgemanuals for detailed environmental
specifications.
The table below details the environmental specifications for the platform. For additional information about environmental
measurements for specific system configurations, see Product Safety, and Environmental datasheets.

Appendix A: Additional specifications 63

An important feature of having a broad menu of different categories is to allow the same platform model to have different
operational ranges depending on the MRD defined.
A list of range categories for different configurations shall be identified by thermal team as early in the project as possible. Post
release, it may be found in the Dell PowerEdge R660 Installation and Service Manual.

Table 33. Operational climatic range categories

Category A2 Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 10 to 35°C (50 to 95°F) with no direct sunlight on the
platform
Humidity Percent Ranges (Non-Condensing at all times) 8%RH with -12°C minimum dew point to 80%RH with 21°C
(69.8°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/300 meters
(1.8°F/984 feet) above 900 meters (2,953 feet)
Table 33. Operational climatic range categories
Category A3 Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 5 to 40°C (41 to 104°F) with no direct sunlight on the
platform
Humidity Percent Ranges (Non-Condensing at all times) 8%RH with -12°C minimum dew point to 85%RH with 24°C
(75.2°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/175 meters
(1.8°F/574 feet) above 900 meters (2,953 feet)
Table 33. Operational climatic range categories
Category A4 Allowable Operation
Temperature Ranges (For Altitude <900 meters or 2953 feet) 5 to 40°C (41 to 104°F) with no direct sunlight on the
platform
Humidity Percent Ranges (Non-Condensing at all times) 8%RH with -12°C minimum dew point to 85%RH with 24°C
(75.2°F) maximum dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/175 meters
(1.8°F/574 feet) above 900 meters (2,953 feet)

The table below shows the requirements shared across all environmental categories

Table 34. Shared requirements

Allowable Operation
Maximum Temperature Gradient (applies to both operation 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes
and non-operation) (9°F in 15 minutes),

5°C in an hour* (9°F in an hour) for tape hardware

Non-Operational Temperature Limits -40 to 65°C (-40 to 149°F)

Non-Operational Humidity Limits (Non-Condensing at all 5% to 95%RH with 27°C (80.6°F) maximum dew point.
times)
Maximum Non-Operational Altitude 12,000 meters (39,370 feet)
Maximum Operational Altitude 3,048 meters (10,000 feet)

Table 35. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.26Grms at 5Hz to 350Hz for 10min (all x, y, and z axes)
Storage 1.88Grms at 10Hz to 500Hz for 15min (all six sides tested)

64 Appendix A: Additional specifications

Table 36. Maximum shock specifications
Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axes of 6G for up to 11ms
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal air restrictions

ASHRAE A2 environment
● CPU > 300W are not supported in 10 x 2.5 inch storage configuration.
● CPU > 270W are not supported in 10 x 2.5 inch storage with rear drive configuration.
● Maximum 30°C (86°F) for CPU > 270 W in10 x 2.5 inch storage configuration..
● Maximum 30°C (86°F) for CPU > 250 W with rear drive in 10 x 2.5 inch storage configuration.
● Maximum 30°C (86°F) for CPU > 250 W with 256G RDIMM in 10 x 2.5 inch storage configuration.
● Maximum 30°C (86°F) for CPU > 225 W with 256G RDIMM in 10 x 2.5 rear drive configuration.
● CPU > 350W are not supported in no BP chassis storage configuration.
● Maximum 30°C (86°F) for CPU > 300W in no BP chassis storage configuration.
● CPU > 350W are not supported in 8 x 2.5 inch storage configuration.
● Maximum 30°C (86°F) for CPU > 300 W in 8 x 2.5 inch storage configuration.

ASHRAE A3 environment
● CPU > 185W are not supported in 10 x 2.5 inch storage configuration.
● CPU > 205W are not supported in 8 x 2.5 inch and no BP chassis storage configuration.
● 128 GB or greater capacity RDIMMs are not supported.
● 2.5 inch NVMe storage are not supported in a 8 x 2.5 inch and 10 x 2.5 inch storage configuration.
● Rear drives are not supported.
● Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● A2 GPU is not supported.
● 85°C (185°F) active optics cable is required.
● Two power supplies are required. System performance may be reduced in the event of a PSU failure.

ASHRAE A4 environment
● CPU > 125W are not supported in 10 x 2.5 inch storage configuration.
● 128 GB or greater capacity RDIMMs are not supported.
● Rear drives are not supported.
● 2.5 inch NVMe storage are not supported.
● BOSS N1 is not supported.
● A2 GPU is not supported.
● Two power supplies are required. System performance may be reduced in the event of a PSU failure.
● Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● OCP 3.0 card is not supported.
● 85°C (185°F) active optics cable is required.

ASHRAE A3 environment for liquid cooling configuration

● 128 GB or greater capacity RDIMMs are not supported.
● Rear drives are not supported.
● A2 GPU is not supported.

Appendix A: Additional specifications 65

● Two power supplies are required. System performance may be reduced in the event of a PSU failure.
● Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● 85°C (185°F) active optics cable is required.

ASHRAE A4 environment for liquid cooling configuration

● 128 GB or greater capacity RDIMMs are not supported.
● Rear drives are not supported.
● 2.5 inch NVMe storage are not supported.
● BOSS N1 is not supported.
● A2 GPU is not supported.
● Two power supplies are required. System performance may be reduced in the event of a PSU failure.
● Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● OCP 3.0 card is not supported.
● 85°C (185°F) active optics cable is required.

Thermal restriction matrix

Table 37. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HSK > 185 W

Table 38. Label reference

Label Description
STD Standard
HPR (Gold) High performance (gold grade)
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling

Table 39. Thermal restriction matrix for air cooled configuration

8 x 2.5-inch 10x 2.5- 10x 2.5- 10 x 2.5-

inch 10 x 2.5-
No Backplane NVMe / inch SAS/ inch
SAS/ inch NVMe
SAS/SATA SATA NVMe
SATA
Configuration C04-01,C04 C05-01,
-02,C04-03, C05-03
C04-04,C04 ,C05-0 C05-02,C0 C05-07,C
C0 C05-10 Ambient
-05,C04-06, 4,C05- 5-05 05-09
C04-07,C04 06,C05 temperatur
-08,C04-09 -13 e
No Rear No Rear No Rear 2 x 2.5- No Rear
Rear storage 2 x 2.5-inch
Drives Drives Drives inch Drives
T-Case
max
CPU TDP/cTDP Fan
center
(°C)
HPR Gold HPR Gold 35°C
125 W 79 STD fan STD fan STD fan STD fan
fan fan (95°F)

66 Appendix A: Additional specifications

Table 39. Thermal restriction matrix for air cooled configuration (continued)

8 x 2.5-inch 10x 2.5- 10x 2.5- 10 x 2.5-

inch 10 x 2.5-
No Backplane NVMe / inch SAS/ inch
SAS/ inch NVMe
SAS/SATA SATA NVMe
SATA
Configuration C04-01,C04 C05-01,
-02,C04-03, C05-03
C04-04,C04 ,C05-0 C05-02,C0 C05-07,C
C0 -05,C04-06, 4,C05- 5-05 05-09 C05-10 Ambient
C04-07,C04 06,C05 temperatur
-08,C04-09 -13 e
No Rear No Rear No Rear 2 x 2.5- No Rear
Rear storage 2 x 2.5-inch
Drives Drives Drives inch Drives
T-Case
max
CPU TDP/cTDP Fan
center
(°C)
HPR Gold HPR Gold 35°C
150 W 78/79 STD fan STD fan STD fan STD fan
fan fan (95°F)
HPR Gold HPR Gold 35°C
165 W 82/84 STD fan STD fan STD fan STD fan
fan fan (95°F)
80/81/8 HPR Gold HPR Gold 35°C
185 W STD fan STD fan STD fan STD fan
5 fan fan (95°F)
HPR HPR Gold HPR Gold HPR Gold 35°C
195 W 64 HPR Gold fan HPR Gold fan
Gold fan fan fan fan (95°F)
76/84/8 HPR HPR Gold HPR Gold HPR Gold 35°C
205 W HPR Gold fan HPR Gold fan
5 Gold fan fan fan fan (95°F)
HPR HPR Gold HPR Gold HPR Gold 35°C
225 W 79 HPR Gold fan HPR Gold fan
Gold fan fan fan fan (95°F)
HPR HPR Gold HPR Gold HPR Gold 35°C
250 W 76 HPR Gold fan HPR Gold fan
Gold fan fan fan fan (95°F)
HPR HPR Gold HPR Gold HPR Gold 35°C
270 W 75 HPR Gold fan HPR Gold fan
Gold fan fan* fan fan* (95°F)
HPR HPR Gold HPR Gold HPR Gold 35°C
270 W 71 HPR Gold fan HPR Gold fan
Gold fan fan* fan fan* (95°F)
HPR
Required HPR Gold Required 35°C
300 W 81 HPR Gold fan HPR Gold fan Gold
DLC fan* DLC (95°F)
fan*
HPR
Required HPR Gold Required 35°C
300 W 76 HPR Gold fan HPR Gold fan Gold
DLC fan* DLC (95°F)
fan*
HPR
Required HPR Gold Required 35°C
300 W 77 HPR Gold fan HPR Gold fan Gold
DLC fan* DLC (95°F)
fan*
HPR
Required HPR Gold Required 35°C
300 W 75 HPR Gold fan HPR Gold fan Gold
DLC fan* DLC (95°F)
fan*
HPR
Required HPR Gold Required 35°C
300 W 76 HPR Gold fan HPR Gold fan Gold
DLC fan* DLC (95°F)
fan*
HPR Gold HPR Gold Required Required Required Required 35°C
330 W 77
fan* fan* DLC DLC DLC DLC (95°F)
HPR Gold HPR Gold Required Required Required Required 35°C
350 W 79
fan* fan* DLC DLC DLC DLC (95°F)

Appendix A: Additional specifications 67

Table 39. Thermal restriction matrix for air cooled configuration (continued)

8 x 2.5-inch 10x 2.5- 10x 2.5- 10 x 2.5-

inch 10 x 2.5-
No Backplane NVMe / inch SAS/ inch
SAS/ inch NVMe
SAS/SATA SATA NVMe
SATA
Configuration C04-01,C04 C05-01,
-02,C04-03, C05-03
C04-04,C04 ,C05-0 C05-02,C0 C05-07,C
C0 -05,C04-06, 4,C05- 5-05 05-09 C05-10 Ambient
C04-07,C04 06,C05 temperatur
-08,C04-09 -13 e
No Rear No Rear No Rear 2 x 2.5- No Rear
Rear storage 2 x 2.5-inch
Drives Drives Drives inch Drives
T-Case
max
CPU TDP/cTDP Fan
center
(°C)
HPR Gold HPR Gold Required Required Required Required 35°C
350 W 78
fan* fan* DLC DLC DLC DLC (95°F)

NOTE:
● *Supported ambient temperature is 30°C (86°F) .
● Required DLC requires <30°C (86°F)

Table 40. Thermal restriction for memory

8 x 2.5-inch 10x 2.5-inch 10x 2.5-inch 10 x 2.5-inch 10 x 2.5-inch
No Backplane NVMe /SAS/ SAS/SATA SAS/SATA NVMe NVMe
SATA
C04-01,C04-
Configuration 02,C04-03,C C05-01,C05-03,C
04-04,C04-0 C05-02,C05- C05-07,C05-0
C0 5,C04-06,C0 05-04,C05-06,C0 C05-10
05 9
5-13
4-07,C04-08,
C04-09
No Rear
Rear storage No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch
Drives
30°C (86°F)
30°C (86°F) 30°C (86°F)
NOTE:
NOTE: NOTE:
30°C (86°F) 30°C
30°C 30°C
NOTE: 30°C (86°F) for
(86°F) for (86°F) for
(86°F) for CPU>225
CPU>250W CPU>225W
256 GB RDIMM 35°C (95°F) 35°C (95°F) CPU>250W W
(CPU<=250 (CPU<=225
(CPU<=250W (CPU<=22
W could W could
could support 5W could
support support
35°C (95°F) ) support
35°C 35°C
35°C
(95°F) ) (95°F) )
(95°F) )

NOTE:
● Install all fan modules for single CPU configuration.
NOTE: Not required for C04-08 configuration.
● All air-cooling configurations require a CPU shroud.
● Install PCH shroud for no riser configuration.
● Install Rear drive shroud for air-cooling with 2x 2.5-inch rear drive configuration.
● Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
● Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250W.

68 Appendix A: Additional specifications

 15
Appendix B. Standards compliance
The system conforms to the following industry standards.

Table 41. Industry standard documents

Standard URL for information and specifications
ACPIAdvance Configuration and Power Interface https://uefi.org/specsandtesttools
Specification, v2.0c
Ethernet IEEE 802.3-2005 https://standards.ieee.org/
HDGHardware Design Guide Version 3.0 for Microsoft microsoft.com/whdc/system/platform/pcdesign/desguide/
Windows Server serverdg.mspx
IPMI Intelligent Platform Management Interface, v2.0 intel.com/design/servers/ipmi
DDR5 Memory DDR5 SDRAM Specification jedec.org/standards-documents/docs/jesd79-4.pdf
PCI Express PCI Express Base Specification Rev. 2.0 and 3.0 pcisig.com/specifications/pciexpress
PMBus Power System Management Protocol Specification, http://pmbus.org/Assets/PDFS/Public/
v1.2 PMBus_Specification_Part_I_Rev_1-1_20070205.pdf
SAS Serial Attached SCSI, v1.1 http://www.t10.org/
SATA Serial ATA Rev. 2.6; SATA II, SATA 1.0a Extensions, sata-io.org
Rev. 1.2
SMBIOS System Management BIOS Reference Specification, dmtf.org/standards/smbios
v2.7
TPM Trusted Platform Module Specification, v1.2 and v2.0 trustedcomputinggroup.org
UEFI Unified Extensible Firmware Interface Specification, v2.1 uefi.org/specifications
USB Universal Serial Bus Specification, Rev. 2.7 usb.org/developers/docs

Appendix B. Standards compliance 69

 16
Appendix C Additional resources
Table 42. Additional resources
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format, Dell.com/Support/Manuals
provides the following information:

● Chassis features
● System Setup program
● System indicator codes
● System BIOS
● Remove and replace procedures
● Diagnostics
● Jumpers and connectors
Getting Started Guide This guide ships with the system, and is Dell.com/Support/Manuals
also available in PDF format. This guide
provides the following information:

● Initial setup steps

Rack Installation Guide This document ships with the rack kits, Dell.com/Support/Manuals
and provides instructions for installing a
server in a rack.
System Information Label The system information label documents Inside the system chassis cover
the system board layout and system
jumper settings. Text is minimized due
to space limitations and translation
considerations. The label size is
standardized across platforms.
Quick Resource Locator (QRL) This code on the chassis can be scanned Inside the system chassis cover
by a phone application to access
additional information and resources for
the server, including videos, reference
materials, service tag information, and
Dell contact information.
Enterprise Infrastructure Planning Tool The Dell online EIPT enables easier Dell.com/calc
(EIPT) and more meaningful estimates to
help you determine the most efficient
configuration possible. Use EIPT to
calculate the power consumption of
your hardware, power infrastructure, and
storage.

70 Appendix C Additional resources