Tencor™ P-7

Stylus Profiler
Advantages Tencor™ P-7
▪ Excellent repeatability and reproducibility
Stylus Profiler
▪ Measures up to 150mm scan length without
the need for stitching

▪ Direct, material-independent
measurements

▪ Automatically maintains the applied force

regardless of the feature height

▪ Pattern recognition enables automated

measurements, increasing productivity

▪ SECS/GEM enables automated sequencing,

results reporting and recipe database
control
The P-7 stylus profiler builds on the success of the market leading
P-17 benchtop stylus profiling system. It includes the superior
Applications measurement performance of the P-17 technology in a platform
that offers a great price-to-features ratio for a benchtop stylus
▪ High resolution 2D and 3D scanning of profiler.
surface topography
The P-7 system benefits include a 150mm scan stage for
▪ Step heights from nanometers to 1mm measurement of the entire substrate without the need to stitch.
An UltraLite® sensor assembly combines a large, linear vertical
▪ Roughness and waviness of smooth and range with constant force control to measure a wide variety of
rough textures materials and topographies. Top view optics enable easy site
teaching and pattern recognition, or the user can configure the
▪ Bow and radius of curvature
system with side view optics to enable visualization of the stylus
during a measurement.
▪ Thin film stress using Stoney’s equation
The P-7 combines automation with high reliability for addressing
▪ Defect characterization using KLARF files
production applications where a wafer handler is not a
and the Defect Review application
requirement. These applications include step height, roughness,
and stress metrology for AlTiC, GaAs, Si, SiC, and sapphire wafers
for use in semiconductors, power devices, wireless, LED, and data
storage.
Features and Options Overview

UltraLite® sensor for 5MP high resolution color

constant force control video camera
from 0.03 to 50mg

Top or side view optics: top

Vertical range up to 1mm view for pattern recognition
or side view for
measurement visualization
Ultra-flat scanning stage

SEMI S2-0715, S8-0715,

S14-0309, and CE compliant

Fully motorized 150mm XY

stage, Z stage, and 360°
theta stage

Linear Variable Differential Capacitor (LVDC) design generates no heat Optical reference flat and decoupled leadscrew motion achieve ultra-flat
or friction scans, improving measurement precision
Applications

Step Height

Measure 2D and 3D step heights from nanometers to 1mm, depending on the

sensor assembly dynamic range. Quantify the material deposited or removed
during etch, sputter, SIMS, deposition, spin coating, CMP and other processes.

Texture: Roughness and Waviness

Measure 2D and 3D texture while quantifying the sample’s roughness and waviness.
Distinguish between roughness and waviness components using software filters and
calculate parameters such as the root mean square (RMS) roughness.

Form: Bow and Shape

Measure the 2D shape or bow of a surface, including wafer bow resulting from
layer mismatch during the device fabrication process, such as deposition of
multiple layers in the production of semiconductor or compound semiconductor
devices. Quantify the height and radius of curved structures, such as a lens.

Thin Film Stress

Measure 2D and 3D stress induced during the manufacture of semiconductor or

compound semiconductor devices having multiple process layers. 2D stress mode
uses a single scan across the sample diameter whereas 3D stress mode rotates the
theta stage between 2D scans to measure the full sample surface.

Defect Review

Measure the topography of defects, such as the depth of a scratch. Import KLARF
location coordinates from a defect inspection tool to automatically navigate to a
specific defect. Select individual defects for 2D or 3D measurement using the
Defect Review application.
Broad Range of Industries

General Purpose Applications

Use the P-7 stylus profiler in a wide range of industries for production or R&D.
Examples include measurement of textile security features or roughness
correlating to absorbency. Biomedical examples include the measurements of
catheter surface texture, medical stent reservoir depth, and the topography of
metal cardiac implants. Consumer electronics applications include measurement
of touch screen topography or measurement of thin film step heights on glass
Zero Layer Alignment Pattern screens.

SIMS Craters

Measure SIMS (Secondary Ion Mass Spectrometry) crater depth with high precision
to determine ion concentration as a function of crater depth. Measure the roughness
of the bottom surface of the crater to provide information on beam scan uniformity.
Use the top or side view optics to optimize the scan position.
SIMS Crater

LED and Power Devices

Measure step heights for patterning processes including MESA step height, ITO
step height, and contact depth. Measure substrate roll off, bow, epitaxial
roughness, and epitaxial thin film stress that can lead to cracks and defects. Use
the Defect Review application to distinguish between a nuisance or a killer defect.
MESA Step Height

MEMS and Optical Electronics

Measure step height, radius of curvature and 3D topography for macro and micro
lenses. Measure etch depth and surface roughness for wave guide and dense
wavelength division multiplexing (DWDM) structures.

Microlens 3D Profile

Semiconductor and Compound Semiconductor

Measure surface topography for front end through back end and packaging
processes. These applications include the measurement of the photoresist
thickness, etch depth, sputter height, post-CMP topography, roughness, sample
bow and stress. Measurement precision is optimized using pattern recognition
Backside Wafer Thinning and automated analysis for improved production process control.
Hardware Features

Stylus Options

The P-7 offers a variety of styli to support the measurement of step heights, high
aspect ratio steps, roughness, sample bow, and stress. The tip radius ranges from
100nm to 50µm and determines the lateral resolution of the measurement. The
included angle ranges from 20 to 100 degrees and determines the maximum
aspect ratio of the measured feature. All styli are manufactured from diamond to
minimize stylus wear and increase stylus lifetime.

Sample Chucks

The P-7 has a range of chucks available to support multiple applications. The
standard is a universal vacuum chuck with precision locating pins for samples
from 50 to 150mm. The universal chuck supports bow and stress measurements
using 3-point locators to support the sample in a neutral position for accurate
bow measurements. Additional options for solar samples, HDD disks, and 200mm
universal chucks are available.

Isolation Tables

The P-7 offers both tabletop and free-standing passive isolation options. The
tabletop Granite Isolator™ Series combine granite with high grade silicone gel; the
Onyx Series tabletop isolation systems use pneumatic air isolators, and the TMC
63-500 Series isolation tables consist of a free-standing steel frame table with
pneumatic air isolators.

Step Height Standards

The P-7 uses thin and thick film NIST-traceable step height standards offered by VLSI
Standards. The standards feature an oxide step on a silicon die mounted on a quartz
block, or an etched quartz step with a chrome coating. Available step height
standards range from 8nm to 250µm.

Top or Side View Optics

The P-7 can be configured with either top view or side view optics. The top view
enables easy sample positioning with the stylus offset from the field of view, as
well as pattern recognition. The side view provides real-time viewing for
verification of the scan position. Both top and side views enable point-and-click
operation and incorporate an automated stylus lift for increased sample
protection.
Software Features

Apex Software

The Apex software platform extends the analysis and reporting capabilities of the P-7
system. Apex is fully integrated into the profiler software, with a simple and intuitive format
that allows for easy creation of customized reports and automatic processing of data.

▪ Multiple language support

▪ Advanced filtering, leveling and analysis functions
▪ Over forty surface parameters including slope, flatness, bearing ratio and volume
▪ Extensive suite of roughness parameters supporting ISO, ASME and additional
region-specific standards
▪ Histogram of the surface topography, including peak count distribution
▪ Annotation and pass/fail criteria on documents

Offline Analysis Software

The P-7 software supports data analysis and recipe generation either on the system or on an
offline computer.

▪ 2D and 3D step heights with cursors and histography analysis

▪ 2D profiles and 3D views of the measurements
▪ 2D and 3D roughness and waviness analysis
▪ 2D and 3D filtering and leveling techniques
▪ Thin film stress and sample bow calculation

Productivity Options
Pattern recognition and advanced calibrations enable seamless recipe transfer while
removing operator error by fully automating measurement and data analysis.

▪ Pattern recognition automatically aligns the sample

▪ Feature Detection automatically measures up to 30 steps in a single scan
▪ SECS/GEM communications for remote control and results reporting to host SPC
systems

Optical and Stylus Profilers

Measure the topography of any surface with our range of benchtop and automated wafer handling optical and stylus profilers. Find out
more at kla.com/profilers.

Profilm3D ® Zeta-20 Zeta-300, Zeta-388 Tencor™ P-170 Tencor™ P-7, Alpha-Step ® D-500
Profilm3D-200 HRP ® -260 P-17, P-17OF Alpha-Step ® D-600
 KLA Corporation
KLA SUPPORT One Technology Drive
Maintaining system productivity is an integral part of KLA’s yield optimization solution. Efforts in this area Milpitas, CA 95035
include system maintenance, global supply chain management, cost reduction and obsolescence mitigation, www.kla.com/profilers
system relocation, performance and productivity enhancements, and certified tool resale. [email protected]
© 2020 KLA Corporation. All brands or product names may be trademarks of their respective companies. Printed in the USA
KLA reserves the right to change the hardware and/or software specifications without notice. Rev 1_2020-8-17