BRITISH STANDARD BS EN

61192-2:2003

Workmanship
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requirements for
soldered electronic
assemblies —
Part 2: Surface-mount assemblies

The European Standard EN 61192-2:2003 has the status of a

British Standard

ICS 31.190

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 BS EN 61192-2:2003

National foreword
This British Standard is the official English language version of
EN 61192-2:2003. It is identical with IEC 61192-2:2003.
The UK participation in its preparation was entrusted to Technical Committee
EPL/501, Electronic assembly technology, which has the responsibility to:
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— aid enquirers to understand the text;

— present to the responsible international/European committee any

enquiries on the interpretation, or proposals for change, and keep the
UK interests informed;
— monitor related international and European developments and
promulgate them in the UK.

A list of organizations represented on this committee can be obtained on

request to its secretary.
Cross-references
The British Standards which implement international or European
publications referred to in this document may be found in the BSI Catalogue
under the section entitled “International Standards Correspondence Index”, or
by using the “Search” facility of the BSI Electronic Catalogue or of
British Standards Online.
This publication does not purport to include all the necessary provisions of a
contract. Users are responsible for its correct application.
Compliance with a British Standard does not of itself confer immunity
from legal obligations.

Summary of pages
This document comprises a front cover, an inside front cover, the EN title page,
pages 2 to 65 and a back cover.
The BSI copyright date displayed in this document indicates when the
document was last issued.
This British Standard was
published under the authority
of the Standards Policy and
Strategy Committee on
25 June 2003

Amendments issued since publication

© BSI 25 June 2003

Amd. No. Date Comments

ISBN 0 580 42113 9

 EUROPEAN STANDARD EN 61192-2
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2003
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ICS 31.190

English version

Workmanship requirements for soldered electronic assemblies

Part 2: Surface-mount assemblies
(IEC 61192-2:2003)

Exigences relatives à la qualité Anforderungen an die Ausführungsqualität

d'exécution des assemblages von Lötbaugruppen
électroniques brasés Teil 2: Baugruppen
Partie 2: Assemblage par montage in Oberflächenmontage
en surface (IEC 61192-2:2003)
(CEI 61192-2:2003)

This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61192-2:2003 E

 Page 2
EN 61192−2:2003

Foreword

The text of document 91/357/FDIS, future edition 1 of IEC 61192-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
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CENELEC as EN 61192-2 on 2003-04-01.

The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01

– latest date by which the national standards conflicting

with the EN have to be withdrawn (dow) 2006-04-01

This standard should be used in conjunction with the following parts of EN 61192, under the general title
Workmanship requirements for soldered electronic assemblies:
Part 1: General
Part 2: Surface-mount assemblies
Part 4: Terminal assemblies

Annexes designated "normative" are part of the body of the standard.

In this standard, annexes A and ZA are normative.
Annex ZA has been added by CENELEC.
__________

Endorsement notice

The text of the International Standard IEC 61192-2:2003 was approved by CENELEC as a European
Standard without any modification.
__________
 Page 3
EN 61192−2:2003
61192-2  IEC:2003 –3–

CONTENTS

INTRODUCTION .....................................................................................................................7
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1 Scope ...............................................................................................................................8
2 Normative references........................................................................................................8
3 Terms and definitions .......................................................................................................9
4 General requirements .......................................................................................................9
4.1 Classification ...........................................................................................................9
4.2 Conflict ....................................................................................................................9
4.3 Interpretation of requirements ................................................................................ 10
4.4 Antistatic precautions ............................................................................................ 10
5 Component preparation processes .................................................................................. 10
6 Solder paste deposition process qualification .................................................................. 10
6.1 Solder paste characteristics ................................................................................... 10
6.2 Assessment of the process .................................................................................... 10
6.3 Solder paste deposition – Screen and stencil printing methods –
Process control limits............................................................................................. 11
7 Non-conductive adhesive deposition process .................................................................. 13
7.1 Pot life................................................................................................................... 13
7.2 Inter-stage storage and handling ............................................................................ 13
7.3 Adhesive tackiness ................................................................................................ 14
7.4 Assessment of the adhesive attachment process ................................................... 14
7.5 Adhesive deposition – Syringe dispensing method – Small components –
Process control limits............................................................................................. 14
8 Temporary masking processes ....................................................................................... 17
9 Component placement processes ................................................................................... 17
9.1 Assessment of the process .................................................................................... 17
9.2 Discrete components with gull-wing leads .............................................................. 19
9.3 IC components with flat-ribbon, L- or gull-wing leads on two sides .......................... 22
9.4 IC components with flat-ribbon, L- or gull-wing leads on four sides, for
example, quad flat packs ....................................................................................... 25
9.5 Components with round or flattened (coined) leads ................................................ 28
9.6 IC component packages with J-leads on two and four sides, for example,
SOJ, PLCC ............................................................................................................ 29
9.7 Leadless rectangular components with metallized terminations .............................. 32
9.8 Components with cylindrical endcap terminations ................................................... 35
9.9 Bottom-only terminations on leadless components ................................................. 37
9.10 Leadless chip carriers with castellated terminations ............................................... 39
9.11 Components with butt leads ................................................................................... 41
9.12 Components with inward L-shaped ribbon leads ..................................................... 44
9.13 Flat-lug leads on power dissipating components..................................................... 45
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10 Post-placement rework ................................................................................................... 46

10.1 Rework of components placed on solder paste....................................................... 47
10.2 Rework of components placed on non-conductive adhesive.................................... 47
11 Adhesive curing .............................................................................................................. 47
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12 Soldering processes ....................................................................................................... 48

13 Cleaning processes ........................................................................................................ 49
14 Hand placement and hand soldering, including hand rework/repair .................................. 49
15 Electrical test .................................................................................................................. 49

Annex A (normative) ............................................................................................................. 50

A.1 Introduction.................................................................................................................. 50
A.2 Example solder fillets and alignment:
flat-ribbon, L- and gull-wing leads ................................................................................. 50
A.3 Example solder fillets and alignment:
round or flattened (coined) leads .................................................................................. 52
A.4 Example solder fillets and alignment:
J-leads......................................................................................................................... 53
A.5 Example solder fillets and alignment:
rectangular or square end leadless components ........................................................... 54
A.6 Example solder fillets and alignment:
cylindrical end cap terminations, for example, MELFs ................................................... 55
A.7 Example solder fillets and alignment:
bottom-only terminations on leadless components ........................................................ 57
A.8 Example solder fillets and alignment:
leadless chip carriers with castellated terminations ....................................................... 59
A.9 Example solder fillets and alignment:
butt joints ..................................................................................................................... 61
A.10 Example solder fillets and alignment:
inward L-shaped flat ribbon leads ................................................................................. 62
A.11 Example solder fillets and alignment:
flat-lug leads on power dissipating components ............................................................ 63
Annex ZA (normative) Normative references to international publications with their
corresponding European publications ........................................................................... 64

Figure 1 – Solder paste contour and cross-section – Target................................................... 11

Figure 2 – Solder paste contour and cross-section – Acceptable............................................ 12
Figure 3 – Solder paste contour and cross-section – Nonconforming ..................................... 12
Figure 4 – Insufficient paste quantity – Nonconforming .......................................................... 13
Figure 5 – Smudged paste – Nonconforming ......................................................................... 13
Figure 6 – Adhesive contour and quantity – Target ................................................................ 15
Figure 7 – Adhesive placement – Acceptable......................................................................... 16
Figure 8 – Adhesive placement – Nonconforming .................................................................. 17
Figure 9 – Discrete component placement – Target ............................................................... 19
Figure 10 – Discrete component placement – Acceptable ...................................................... 20
Figure 11 – Discrete component placement – Nonconforming ................................................ 21
Figure 12 – IC gull-wing component, 2 sides – Target ............................................................ 22
Figure 13 – IC gull-wing component, 2 sides – Acceptable ..................................................... 23
Figure 14 – IC gull-wing component, 2 sides – Nonconforming............................................... 24
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61192-2  IEC:2003 –5–

Figure 15 – IC gull-wing component, 4 sides – Target ............................................................ 25

Figure 16 – IC gull-wing component, 4 sides – Acceptable ..................................................... 26
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Figure 17 – IC gull-wing component, 4 sides – Nonconforming............................................... 27

Figure 18 – Flattened lead target centered on land ................................................................ 28
Figure 19 – Flattened lead offset on land – Acceptable .......................................................... 28
Figure 20 – Flattened lead excessively offset on land – Nonconforming ................................. 28
Figure 21 – IC component, J-leads on two or four sides – Target ........................................... 29
Figure 22 – IC component, J-leads on two or four sides – Acceptable .................................... 30
Figure 23 – IC component, J-leads on two or four sides – Nonconforming.............................. 31
Figure 24 – Rectangular component with metallized terminations – Target ............................. 32
Figure 25 – Rectangular component with metallized terminations – Acceptable ...................... 33
Figure 26 – Rectangular component with metallized terminations – Nonconforming................ 34
Figure 27 – Cylindrical endcap component – Target............................................................... 35
Figure 28 – Cylindrical endcap component – Acceptable........................................................ 36
Figure 29 – Cylindrical endcap component – Nonconforming ................................................. 37
Figure 30 – Bottom-only leadless component – Target ........................................................... 37
Figure 31 – Bottom-only leadless component – Acceptable .................................................... 38
Figure 32 – Bottom-only leadless component – Nonconforming.............................................. 38
Figure 33 – Leadless chip carrier – Target............................................................................. 39
Figure 34 – Leadless chip carrier – Acceptable...................................................................... 40
Figure 35 – Leadless chip carrier – Nonconforming ............................................................... 40
Figure 36 – Butt lead component mounting – Target .............................................................. 41
Figure 37 – Butt-lead component mounting – Acceptable ....................................................... 42
Figure 38 – Butt-lead component mounting – Nonconforming................................................. 43
Figure 39 – Inward L-shaped ribbon leaded component – Target ........................................... 44
Figure 40 – Inward L-shaped ribbon leaded component – Acceptable .................................... 44
Figure 41 – Inward L-shaped ribbon leaded component – Nonconforming .............................. 45
Figure 42 – Flat-lug component – Target ............................................................................... 45
Figure 43 – Flat-lug component – Acceptable ........................................................................ 46
Figure 44 – Flat-lug component – Nonconforming .................................................................. 46
Figure A.1 – Target solder fillet, levels A, B, C...................................................................... 50
Figure A.2 – Target alignment, levels A, B, C........................................................................ 50
Figure A.3 – Solder fillet, level B............................................................................................ 51
Figure A.4 – Alignment, level B.............................................................................................. 51
Figure A.5 – Target solder fillet, levels A, B, C...................................................................... 52
Figure A.6 – Target alignment, levels A, B, C........................................................................ 52
Figure A.7 – Solder fillet, level B............................................................................................ 52
Figure A.8 – Alignment, level B.............................................................................................. 52
Figure A.9 – Target solder fillet, levels A, B, C...................................................................... 53
Figure A.10 – Target alignment, levels A, B, C...................................................................... 53
Figure A.11 – Solder fillet, level B.......................................................................................... 53
Figure A.12 – Alignment, level B............................................................................................ 53
Figure A.13 – Target solder fillet, levels A, B, C .................................................................... 54
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61192-2  IEC:2003 –6–

Figure A.14 – Target alignment, levels A, B, C...................................................................... 54

Figure A.15 – Solder fillet, level B.......................................................................................... 54
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Figure A.16 – Alignment, level B............................................................................................ 54

Figure A.17 – Target solder fillet, levels A, B, C .................................................................... 55
Figure A.18 – Target alignment, levels A, B, C...................................................................... 55
Figure A.19 – Solder fillet, level B.......................................................................................... 56
Figure A.20 – Alignment, level B............................................................................................ 56
Figure A.21 – Target solder fillet, levels A, B, C .................................................................... 57
Figure A.22 – Target alignment, levels A, B, C...................................................................... 57
Figure A.23 – Solder fillet, level B.......................................................................................... 58
Figure A.24 – Alignment, level B............................................................................................ 58
Figure A.25 – Target solder fillet, levels A, B, C .................................................................... 59
Figure A.26 – Target alignment, levels A, B, C...................................................................... 59
Figure A.27 – Solder fillet, level B.......................................................................................... 60
Figure A.28 – Alignment, level B............................................................................................ 60
Figure A.29 – Target solder fillet, levels A, B, C .................................................................... 61
Figure A.30 – Target alignment, levels A, B, C...................................................................... 61
Figure A.31 – Solder fillet, level B.......................................................................................... 61
Figure A.32 – Alignment, level B............................................................................................ 61
Figure A.33 – Target solder fillet, levels A, B, C .................................................................... 62
Figure A.34 – Target alignment, levels A, B, C...................................................................... 62
Figure A.35 – Solder fillet, level B.......................................................................................... 62
Figure A.36 – Alignment, level B............................................................................................ 62
Figure A.37 – Target solder fillet, levels A, B, C .................................................................... 63
Figure A.38 – Target alignment, levels A, B, C...................................................................... 63
Figure A.39 – Solder fillet, level B.......................................................................................... 63
Figure A.40 – Alignment, level B............................................................................................ 63
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EN 61192−2:2003
61192-2  IEC:2003 –7–

INTRODUCTION

This part of IEC 61192, combined with IEC 61192-1, is used to meet the end-product
requirements defined in IEC 61191-1 and IEC 61191-2.
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This standard may be used to enable the suppliers and users of surface-mount electronic
assemblies to specify good manufacturing practices as part of a contract.

The respective requirements for through-hole assemblies, terminal attachment and the
mounting of bare semiconductor die and carrier-mounted die, are included in separate but
related standards.
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EN 61192−2:2003
61192-2  IEC:2003 –8–

WORKMANSHIP REQUIREMENTS
FOR SOLDERED ELECTRONIC ASSEMBLIES –

Part 2: Surface-mount assemblies

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1 Scope

This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted
electronic assemblies and multichip modules on organic substrates, on printed boards, and on
similar laminates attached to the surface(s) of inorganic substrates.

It applies to assemblies that are totally surface-mounted and to the surface-mount portions of
assemblies that include other related assembly technologies, for example, through-hole
mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor
metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal
substrate.

2 Normative references

The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.

IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly
technologies

IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for
surface mount soldered assemblies

IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for
through-hole mount soldered assemblies

IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for
terminal soldered assemblies

IEC 61192-1, Workmanship requirements for soldered electronic assemblies – Part 1: General

IEC 61192-3, Workmanship requirements for soldered electronic assemblies – Part 3: Through-
hole mount assemblies

IEC 61192-4, Workmanship requirements for soldered electronic assemblies – Part 4: Terminal
assemblies

IEC 61193-1: Quality assessment systems – Part 1: Registration and analysis of defects on
printed board assemblies

ISO 9001, Quality management systems – Requirements

ISO 9002, Quality systems – Model for quality assurance in production, installation and
servicing
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EN 61192−2:2003
61192-2  IEC:2003 –9–

3 Terms and definitions

For the purposes of this part of IEC 61192, the definitions of IEC 60194 apply.
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4 General requirements

The requirements of IEC 61192-1 are mandatory for this standard.

4.1 Classification

The classification of assemblies is divided into three levels, that is levels A, B, and C.
Definitions of the classification categories and the status of product for each level are given in
IEC 61192-1. In general, status is divided into three workmanship conditions as follows:

a) target;
b) acceptable;
c) nonconforming.

4.2 Conflict

Unless the user specifies compliance with all of the requirements (or with specific items) in this
standard, for example, as part of a supply contract, the mandatory clauses and subclauses
herein may be interpreted as guidance.

When the user elects to specify compliance with all or some of the mandatory requirements of
this standard:

a) In the event of conflict between the requirements of this standard and the applicable
documents cited herein, refer to IEC 61191-1 for the relevant priorities and to IEC 61191-2
and IEC 61192-1 for technical requirements. However, nothing in this standard supersedes
applicable laws and regulations.
b) In the event of conflict between the requirements of this standard and the applicable user
assembly drawing(s) and specifications, the latter shall govern.
When the conflict is between the requirements of this document and drawing(s) or specifi-
cation(s) that have not been approved by the user, the latter shall be submitted to the user
for approval. Upon such approval, the acceptance (or changes) shall be documented,
for example, by official revision note or equivalent on the drawing(s) or specification(s)
which shall then govern.
c) Where the applicable user documentation requirements are less stringent than the appli-
cable mandatory items in IEC 61191-1, IEC 61191-2, or in this standard, neither the
supplier nor the user shall claim compliance with this or any of the standards listed in this
clause, without identifying the specific clauses and related relaxations in each and every
such claim.
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EN 61192−2:2003
61192-2  IEC:2003 – 10 –

4.3 Interpretation of requirements

Unless otherwise specified by the user, the word "shall", signifies that the requirement is
mandatory. Deviation from any "shall" requirement requires written acceptance by the user, for
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example, via assembly drawing, specification or contract provision.

The words "should" and "may" reflect recommendations and guidance, respectively, and are
used whenever it is intended to express non-mandatory provisions.

4.4 Antistatic precautions

All operators using workstations and assembly or cleaning equipment and carrying out inter-
process handling shall strictly observe antistatic precautions at all times. Refer to 4.2.6 and 5.7
of IEC 61192-1.

5 Component preparation processes

Component preparation processes shall be carried out in accordance with the requirements of
IEC 61192-1 using the methods described therein.

6 Solder paste deposition process qualification

Solder paste deposition processes are described in IEC 61192-1 and workmanship should
enable the requirements stated therein to be met.

6.1 Solder paste characteristics

Solder paste is required to maintain a level of tackiness to ensure good physical contact with
component leads or terminations and to prevent placed components from slipping or being
accidentally dislodged from the paste mound(s) during board handling or mechanized transit
into the soldering equipment. The length of time over which the paste retains adequate
tackiness is specified by the supplier and all placement operations should be carried out well
within this stated limit.
NOTE Where pastes designed to allow extended times between their deposition and component placement are
used, for example, longer than 2 h, care should be taken to ensure that the required longer pre-heat time and
temperature in reflow mass soldering are programmed. In some cases this may require physical extension of the
pre-heat zones on standard reflow soldering machines.

6.2 Assessment of the process

The parameters requiring inspection are the amount, shape and position of the solder paste on
the land patterns of the board or substrate. These are assessed using visual inspection, laser
scan, or X-ray as appropriate.

The deposited area and mean height are used to monitor the quantity of paste deposited and
act as an indicator of its viscosity and the board surface condition. The wetted area is also
used to monitor screen/stencil or syringe tip condition and the incidence of unwanted smudges.
Positional measurement assesses the accuracy of deposition and monitors machine set-up
and, if applicable, screen/stencil design.
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EN 61192−2:2003
61192-2  IEC:2003 – 11 –

The standard PPM baseline for solder paste deposition operations is the number of paste
mound deposits attempted. Guideline assessment attributes and the method of calculating
PPM are given in IEC 61193-1.
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Target, accept and reject (nonconforming) criteria for solder paste deposition are given as
process control limits in 6.3. These are the same for levels A, B and C.

6.3 Solder paste deposition – Screen and stencil printing methods –

Process control limits

In all cases, the accept and reject criteria shown in Figures 1 through 3 refer to the solder
paste printing operation.

Target – Levels A, B, C
1 Paste contour sits central within land area.
2 Paste cross-section is mesa-shaped.
3 Designed quantity is achieved.

Cross-section
IEC 574/03

Figure 1 – Solder paste contour and cross-section – Target

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EN 61192−2:2003
61192-2  IEC:2003 – 12 –
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Acceptable – Levels A, B, C
1 Paste contour slumped.
2 Overhang A is less than 25 % of the
related X or Y dimension, or 0,2 mm,
whichever is smaller.
3 Paste volume ±20 % of designed quantity.

A
Y

IEC 575/03

Figure 2 – Solder paste contour and cross-section – Acceptable

Nonconforming – Levels A, B, C
1 Paste quantity and/or overhang A exceeds
acceptable limits.
2 Paste overhang A is more than 25 % of
related x or y dimension or 0,2 mm which-
ever is smaller.
3 Paste quantity is more than 120 % or less
than 80 % of designed quantity.

IEC 576/03

Figure 3 – Solder paste contour and cross-section – Nonconforming

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EN 61192−2:2003
61192-2  IEC:2003 – 13 –

A
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Nonconforming – Levels A, B, C
Paste quantity below acceptable limits.
Height B less than 80 % of stencil thickness.
B

Partial coverage
IEC 577/03

Figure 4 – Insufficient paste quantity – Nonconforming

Nonconforming – Levels A, B, C
Smudging/smearing of solder paste.

IEC 578/03

Figure 5 – Smudged paste – Nonconforming

7 Non-conductive adhesive deposition process

Adhesive deposition workmanship is described in IEC 61192-1, Clause 9 and shall be carried
out in accordance with the requirements stated therein.

7.1 Pot life

The time elapsed between the first exposure of the adhesive to the ambient factory
atmosphere and the start of curing should be well within the suppliers' stated maximum.

7.2 Inter-stage storage and handling

Boards that have received deposited adhesive and require brief inter-stage storage should be
handled with care to avoid component movement. Some adhesive materials cause dermatitis.
Boards stored temporarily should be kept separate and in clean, dry conditions, or as specified
by the adhesive manufacturer.
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EN 61192−2:2003
61192-2  IEC:2003 – 14 –

7.3 Adhesive tackiness

Adhesive is required to maintain a level of tackiness to assure good contact with placed
components prior to curing. The length of time over which the adhesive retains adequate
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tackiness (the 'pot life') is specified by the supplier and all placement operations should be
carried out well within this stated limit. Handling should avoid the risk of component movement.

7.4 Assessment of the adhesive attachment process

Assessment of the adhesive deposition process in production can be by manual or automatic

visual inspection for positional and deposited area aspects; optical non-contact methods or
laser scan for adhesive dot height.

The deposited area and mean height are used to monitor the quantity of adhesive deposited
and act as an indicator of its viscosity and the board surface condition. The wetted area is also
used to monitor screen/stencil or syringe tip condition and the incidence of unwanted smudges.
Positional measurement assesses the accuracy of deposition and monitors machine set-up
and, if applicable, screen/stencil design.

Adhesive dot height, shape and volume are key parameters because if the underside of the
component does not make contact with the dot, adhesion will not occur. A suitable way of
assessing the correctness of adhesive quantity is to pull off a component after curing. Refer to
item d) of Clause 11.

When adhesive deposition equipment uses an optical view of the deposited area of the
adhesive dot to monitor its height, the deposition head and any associated time-pressure pulse
system should be kept at a constant temperature. The wetted area on the component may be
determined by examining the underside after placement and curing using a cross-section
method.

The standard PPM baseline for adhesive deposition operations is the number of adhesive dot
deposits attempted. Guideline assessment attributes and the method of calculation are given in
IEC 61193-1.

Target, accept and reject (nonconforming) criteria for small components are given as process
control limits in 7.5. These are the same for all levels.

7.5 Adhesive deposition – Syringe dispensing method – Small components –

Process control limits

In all cases, accept and reject refer to the dispensing operation.

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Target – Levels A, B, C
1 Adhesive contour central within designed
area.
2 Adhesive quantity correct.
3 Cross-section not slumped or tailed.
NOTE When UV curing, design may require
adhesive to appear outside component contour.

IEC 579/03

Figure 6 – Adhesive contour and quantity – Target

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EN 61192−2:2003
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Acceptable – Levels A, B, C
1 Adhesive placement eccentric.
2 Dot touches but does not overlap land or
component metallization.

IEC 580/03

Figure 7 – Adhesive placement – Acceptable

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EN 61192−2:2003
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Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Nonconforming – Levels A, B, C
1 Adhesive dot overlaps land.
2 Adhesive overlaps component metallization.
3 Adhesive reduces solder joint wetting
ability below specified limits.

IEC 581/03

Figure 8 – Adhesive placement – Nonconforming

8 Temporary masking processes

Printed board temporary masking processes shall be carried out in accordance with the
requirements of IEC 61192-1.

9 Component placement processes

Surface-mount component placement processes are described in IEC 61192-1 and shall be
carried out in accordance with the requirements stated therein.

9.1 Assessment of the process

The following visual attributes apply to the component placement process, using manual or
automatic inspection:

a) the presence or absence of components;

b) the location correctness of component types and correctness of their relevant parametric
value(s);
c) the relative x, y and rotational alignment of component terminations and leads with
matching conductor footprint pads;
 Page 18
EN 61192−2:2003
61192-2  IEC:2003 – 18 –

d) the orientation of components for example, pin 1 on ICs, polarity of electrolytic capacitors
and diodes;
e) the z axis condition of components for example, cant (non-parallelism), component on
edge;
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

f) physical damage to components, for example, cracked or chipped component bodies,

distorted leads;
g) unwanted movement or excessive deformation of deposited solder paste or adhesive;
h) location of adhesive after placement, for example, squeeze-out, spread.
NOTE 1 In no case should the deviation in placement accuracy exceed the product requirement. Refer to
IEC 61191-2. Reliance on surface tension effects to correct placement errors should not be assumed.
NOTE 2 Correction of placement ‘process indicator’ errors within the prescribed post-soldering alignment accuracy
tolerance limits is optional but not recommended.

The standard PPM baseline for surface-mounted component placement operations is the
number of placements attempted. Guideline assessment attributes and details of the method of
calculation are given in IEC 61193-1.

Target, accept and reject (nonconforming) criteria for placement of surface-mounted

components are given as process control limits in 9.2 through 9.13. In each case, the limits are
given separately for levels A, B and C.
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EN 61192−2:2003
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9.2 Discrete components with gull-wing leads

Discrete components with gull-wing leads are usually transistor or IC components, for example,
SOT 23. Components may be shifted in X or Y or rotation direction. The accept and reject
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

criteria relate to placement accuracy.

Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 582/03

Figure 9 – Discrete component placement – Target

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EN 61192−2:2003
61192-2  IEC:2003 – 20 –

Acceptable – Level A
1 All lead heels within the land.
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2 No lead side overhang exceeds ½ W or

0,5 mm, whichever is less.
Acceptable – Level B
1 All lead heels within the land.
2 No lead side overhang exceeds ½ W or
0,5 mm, whichever is less.
Acceptable – Level C
1 All lead heels within the land.
2 No lead side overhang exceeds ¼ W or
0,5 mm, whichever is less.
3 No lead toe overhang.

IEC 583/03

Figure 10 – Discrete component placement – Acceptable

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EN 61192−2:2003
61192-2  IEC:2003 – 21 –

Nonconforming – Level A
1 Any lead heel overhangs land.
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2 Any lead side overhang exceeds ½ W or

0,5 mm, whichever is less.
Nonconforming – Level B
1 Any lead heel overhangs land.
2 Any lead side overhang exceeds ½ W or
0,5 mm, whichever is less.
Nonconforming – Level C
1 Any lead heel overhangs land.
2 Any lead side overhang exceeds ¼ W or
0,5 mm, which is less.
3 Any lead toe overhangs land.

IEC 584/03

Figure 11 – Discrete component placement – Nonconforming

 Page 22
EN 61192−2:2003
61192-2  IEC:2003 – 22 –

9.3 IC components with flat-ribbon, L- or gull-wing leads on two sides

IC components with flat-ribbon, L- or gull-wing leads on two sides are usually small outline
(SO) packages. Components may be shifted in X or Y or rotation direction. The accept and
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

reject criteria relate to placement accuracy.

Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 585/03

Figure 12 – IC gull-wing component, 2 sides – Target

 Page 23
EN 61192−2:2003
61192-2  IEC:2003 – 23 –

Acceptable – Level A
1 X-direction: no lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
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less.
2 Y-direction: no lead toe overhang exceeds
½ W.
3 All lead heels within lands.
Acceptable – Level B
1 X-direction: no lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
less.
2 Y-direction: all lead toes and heels within
lands.
Acceptable – Level C
1 X-direction: no lead foot side overhang A
exceeds ¼ W or 0,5 mm, whichever is
less.
2 Y-direction: all lead toes and heels within
lands.
a ⅓ W when lead pitch is 0,5 mm or less.

W
IEC 586/03

Figure 13 – IC gull-wing component, 2 sides – Acceptable

 Page 24
EN 61192−2:2003
61192-2  IEC:2003 – 24 –

Nonconforming – Level A
1 X-direction: any lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
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less.
2 Y-direction: any lead toe overhang exceeds
½ W, or any lead heel overhanging land.
Nonconforming – Level B
1 X-direction: any lead foot side overhang A
exceeds ½ W a or 0,5 mm whichever is less.
2 Y-direction: any lead toe or heel over-
hanging land.
Nonconforming – Level C
1 X-direction: any lead foot side overhang A
exceeds ¼ W or 0,5 mm, whichever is less.
2 Y-direction: any lead toe or heel over-
hanging land.
NOTE When the land width P is narrower than
the component lead width W, the land edge
shall not protrude outside the lead edge in
Y-direction by more than ¼ P or 0,1 mm,
whichever is greater. See notes 1 and 2 in 9.1.
a ⅓ W when lead pitch is 0,5 mm or less.

P
A
Y

IEC 587/03

Figure 14 – IC gull-wing component, 2 sides – Nonconforming

 Page 25
EN 61192−2:2003
61192-2  IEC:2003 – 25 –

9.4 IC components with flat-ribbon, L- or gull-wing leads on four sides,

for example, quad flat packs

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

to placement accuracy.

Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 588/03

Figure 15 – IC gull-wing component, 4 sides – Target

 Page 26
EN 61192−2:2003
61192-2  IEC:2003 – 26 –

Acceptable – Level A
1 X-direction: no lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

less.
2 Y-direction: no lead toe overhang exceeds
½ W.
3 All lead heels within lands.
Acceptable – Level B
1 X-direction: no lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
less.
2 Y-direction: no lead toes or heels overhang
lands.
Acceptable – Level C
1 X-direction: no lead foot side overhang A
exceeds ¼ W or 0,5 mm, whichever is
less.
2 Y-direction: all lead toes and heels within
lands.
a ⅓ W when lead pitch is 0,5 mm or less.

IEC 589/03

Figure 16 – IC gull-wing component, 4 sides – Acceptable

 Page 27
EN 61192−2:2003
61192-2  IEC:2003 – 27 –

Nonconforming – Level A
1 X-direction: any lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

less.
2 Y-direction: lead toe overhang exceeds ½ W.
Nonconforming – Level B
1 X-direction: lead foot side overhang A
exceeds ½ W a or 0,5 mm, whichever is
less.
2 Y-direction: any lead toe or heel overhangs
land.
Nonconforming – Level C
1 X-direction: lead foot side overhang A
exceeds ¼ W or 0,5 mm, whichever is
less.
2 Y-direction: any lead toe or heel overhangs
land.
NOTE When the land width P is narrower than
the component lead width W, the land edge
shall not protrude outside the lead edge in
Y-direction by more than ¼ P or 0,1 mm,
whichever is greater. See notes 1 and 2 in 9.1.
a ⅓ W when lead pitch is 0,5 mm or less.

Y W

IEC 590/03

Figure 17 – IC gull-wing component, 4 sides – Nonconforming

 Page 28
EN 61192−2:2003
61192-2  IEC:2003 – 28 –

9.5 Components with round or flattened (coined) leads

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 591/03

Figure 18 – Flattened lead target centered on land

Acceptable – Levels A, B
1 X-direction: no lead side overhang A
exceeds ⅓ W.
W W 2 Y-direction: no lead toe overhang violates
minimum design clearance.
3 All lead heels within lands.
Acceptable – Level C
A Side A 1 X-direction: no lead side overhang A
exceeds ¼ W.
X 2 Y-direction: no lead toe overhang violates
the minimum design clearance.
3 All lead heels within lands.
Y
IEC 592/03

Figure 19 – Flattened lead offset on land – Acceptable

Nonconforming – Levels A, B
1 X-direction: any lead side overhang A
exceeds ⅓ W.
2 Y-direction: any lead toe overhang B
Toe violates minimum design clearance.
overhang 3 Any lead heel overhangs land.
Nonconforming – Level C
W 1 X-direction: any lead foot side overhang A
exceeds ¼ W.
B X
2 Y-direction: any toe overhang B violates
the minimum design clearance.
3 Any lead heel overhangs land.
Y
IEC 593/03

Figure 20 – Flattened lead excessively offset on land – Nonconforming

 Page 29
EN 61192−2:2003
61192-2  IEC:2003 – 29 –

9.6 IC component packages with J-leads on two and four sides,

for example, SOJ, PLCC

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

to placement accuracy.

Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

Outer heel
of J-lead

IEC 594/03

Figure 21 – IC component, J-leads on two or four sides – Target

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EN 61192−2:2003
61192-2  IEC:2003 – 30 –
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Acceptable – Levels A, B
1 X-direction: no lead side overhang A
exceeds ½ W.
2 Y-direction: no lead outer heel overhang
exceeds W.
Acceptable – Level C
1 X-direction: no lead side overhang A
exceeds ¼ W.
2 Y-direction: no lead outer heel overhang
exceeds W.

W
A

Y
X

Outer heel
of J-lead

IEC 595/03

Figure 22 – IC component, J-leads on two or four sides – Acceptable

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EN 61192−2:2003
61192-2  IEC:2003 – 31 –
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Nonconforming – Levels A, B
1 X-direction: any lead side overhang A
exceeds ½ W.
2 Y-direction: any lead heel overhang exceeds
W.
Nonconforming – Level C
1 X-direction: any lead foot side overhang A
exceeds ¼ W.
2 Y-direction: any lead heel overhang exceeds
W.

W
A

Y
X
Outer heel
of J-lead

IEC 596/03

Figure 23 – IC component, J-leads on two or four sides – Nonconforming

 Page 32
EN 61192−2:2003
61192-2  IEC:2003 – 32 –

9.7 Leadless rectangular components with metallized terminations

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Target – Levels A, B, C
1 The component body sits centrally on lands
in both X and Y directions.
2 Body not rotated.

IEC 597/03

Figure 24 – Rectangular component with metallized termination – Target

 Page 33
EN 61192−2:2003
61192-2  IEC:2003 – 33 –

Acceptable – Level A
1 X-direction: no end overhang.
2 Termination/land overlap J is ⅔ T or more.
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3 Y-direction: termination side overhang A

does not exceed ½ W.
Acceptable – Level B
1 X-direction: no end overhang.
2 Termination/land overlap J is ⅔ T or more.
3 Y-direction: termination side overhang A
does not exceed ⅓ W.
Acceptable – Level C
1 X-direction: no end overhang.
2 Termination/land overlap J is ¾ T or more.
3 Y-direction: termination side overhang A
does not exceed ¼ W.

Y W

J
IEC 598/03

Figure 25 – Rectangular component with metallized terminations – Acceptable

 Page 34
EN 61192−2:2003
61192-2  IEC:2003 – 34 –

Nonconforming – Level A
1 X-direction: component body overhangs
land, or termination/land overlap J is less
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

than ⅔ T.
2 Y-direction: termination side overhang A is
greater than ½ W.
Nonconforming – Level B
1 X-direction: component body overhangs
land, or termination/land overlap J is less
than ⅔ T.
2 Y-direction: termination side overhang A is
greater than ⅓ W.
Nonconforming – Level C
1 X-direction: component body overhangs
land, or termination/land overlap J is less
than ¾ T.
2 Y-direction: termination side overhang A is
greater than ¼ W.

A
W

J
IEC 599/03

Figure 26 – Rectangular component with metallized terminations – Nonconforming

 Page 35
EN 61192−2:2003
61192-2  IEC:2003 – 35 –

9.8 Components with cylindrical endcap terminations

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Target – Levels A, B, C
1 The component body sits centrally on lands
in both X and Y directions.
2 Body not rotated.

IEC 600/03

Figure 27 – Cylindrical endcap component – Target

 Page 36
EN 61192−2:2003
61192-2  IEC:2003 – 36 –
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Acceptable – Levels A, B
1 X-direction: no end overhang.
2 Termination/land overlap J is ⅔ T or more.
3 Y-direction: termination side overhang A
does not exceed ⅓ W.
Acceptable – Level C
1 X-direction: no end overhang.
2 Termination/land overlap J is T or more.
3 Y-direction: termination side overhang A
does not exceed ¼ W.

X
J
IEC 601/03

Figure 28 – Cylindrical endcap component – Acceptable

 Page 37
EN 61192−2:2003
61192-2  IEC:2003 – 37 –
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

W Nonconforming – Levels A, B
1 X-direction: the component body over-
hangs land, or termination/land overlap J is
less than ⅔ T.

A 2 Y-direction: termination side overhang A is

greater than ⅓ W.
P Nonconforming – Level C
1 X-direction: the component body over-
hangs land, or termination/land overlap J is
less than T.
2 Y-direction: Termination side overhang A
exceeds ¼ W.
T

IEC 602/03

Figure 29 – Cylindrical endcap component – Nonconforming

9.9 Bottom-only terminations on leadless components

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.

Target – Levels A, B, C
1 The component body sits centrally on lands
in both X and Y directions.
2 Component body not rotated.

J
P
IEC 603/03

Figure 30 – Bottom-only leadless component – Target

 Page 38
EN 61192−2:2003
61192-2  IEC:2003 – 38 –

Acceptable – Level A
1 X-direction: no end overhang.
2 Termination/land overlap J is ⅔ T or more.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

3 Y-direction: termination side overhang A

does not exceed ½ W.
Acceptable – Level B
1 X-direction: no end overhang.
A 2 Termination overlap J of both inner land
edges is ⅔ T or more.
J
W 3 Y-direction: Termination side overhang A
does not exceed ⅓ W.
T
Acceptable – Level C
X 1 X-direction: no end overhang.
Y IEC 604/03 2 Termination overlap J of both inner land
edges is T or more.
3 Y-direction: no termination side overhangs
land.

Figure 31 – Bottom-only leadless component – Acceptable

Nonconforming – Level A
1 X-direction: the component body over-
hangs land, or termination/land overlap J is
less than ¾ T.
2 Y-direction: termination side overhang A is
greater than ½ W.
Nonconforming – Level B
1 X-direction: the component body over-
hangs land end, or termination/land
overlap J is less than ⅔ T.
2 Y-direction: termination side overhang A is
greater than ½ W.
Nonconforming – Level C
P 1 X-direction: the component body overhangs
Y land end, or termination/land overlap J is
W less than ⅔ T.
X
2 Y-direction: termination side overhangs
land.
IEC 605/03 NOTE When the land width P is narrower than
termination width W, the land edge shall not
protrude outside the termination edge in
Y-direction by more than ¼ P or 0,1 mm,
whichever is greater. See notes 1 and 2 in 9.1.

Figure 32 – Bottom-only leadless component – Nonconforming

 Page 39
EN 61192−2:2003
61192-2  IEC:2003 – 39 –

9.10 Leadless chip carriers with castellated terminations

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Target – Levels A, B, C
1 The component body sits centrally on
lands in both X and Y directions.
2 Body not rotated.

C Land pattern

Castellated
termination

See detail A Detail A

IEC 606/03

Figure 33 – Leadless chip carrier – Target

 Page 40
EN 61192−2:2003
61192-2  IEC:2003 – 40 –

W Acceptable – Levels A,B

1 X and Y directions: termination side over-
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

hang A does not exceed ½ W.

H 2 The body outline does not overhang the
land outline.
Acceptable – Level C
1 X and Y directions: termination side over-
hang A does not exceed ¼ W.
2 The body outline does not overhang the
land outline.
A
A

W A

See detail A Detail A

IEC 607/03

Figure 34 – Leadless chip carrier – Acceptable

Nonconforming – Levels A, B, C
1 X and Y directions: termination side over-
hang A exceeds ½ W.
2 The body outline overhangs the land out-
line in any direction.

Y
A
X

See detail A Detail A

IEC 608/03

Figure 35 – Leadless chip carrier – Nonconforming

 Page 41
EN 61192−2:2003
61192-2  IEC:2003 – 41 –

9.11 Components with butt leads

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Target – Levels A, B, C
1 All lead feet sit centrally on lands.
2 Component body not rotated.

IEC 609/03

Figure 36 – Butt lead component mounting – Target

 Page 42
EN 61192−2:2003
61192-2  IEC:2003 – 42 –

Acceptable – Level A
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1 X-direction: no lead side overhang A

exceeds ¼ W.
2 Y-direction: all land protrusions B exceed T.
Acceptable – Levels B,C
1 X-direction: no lead side overhangs.
2 Y-direction: all land protrusions B exceed T.
A

Y
B
X

A T

View A
IEC 610/03

Figure 37 – Butt-lead component mounting – Acceptable

 Page 43
EN 61192−2:2003
61192-2  IEC:2003 – 43 –

Nonconforming – Levels A, B
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1 X-direction: any lead side overhang A

exceeds ¼ W.
2 Y-direction: any land protrusion B is less
than T.
Nonconforming – Level C
1 X-direction: any lead side overhang.
2 Y-direction: any land protrusion B is less
than T.
B

W A

IEC 611/03

Figure 38 – Butt-lead component mounting – Nonconforming

 Page 44
EN 61192−2:2003
61192-2  IEC:2003 – 44 –

9.12 Components with inward L-shaped ribbon leads

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.
Licensed Copy: x x, Hampshire Libraries, Thu Apr 19 09:19:13 GMT+00:00 2007, Uncontrolled Copy, (c) BSI

Y
X Target – Levels A, B, C
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 612/03

Figure 39 – Inward L-shaped ribbon leaded component – Target

P
W Acceptable – Levels A, B
A
1 X-direction: all heels within lands.
2 Y-direction: no lead side overhang exceeds
B ½ W.
Y Acceptable – Level C

X 1 X-direction: no lead side overhang exceeds

¼ W or ¼ P (whatever is less).
H
2 Y-direction: land protrusion B not less
than ½ H or 0,5 mm (whatever is less).

IEC 613/03

Figure 40 – Inward L-shaped ribbon leaded component – Acceptable

 Page 45
EN 61192−2:2003
61192-2  IEC:2003 – 45 –

Nonconforming – Levels A,B

P
1 X-direction: any lead heel overhangs land.
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A W X 2 Y-direction: any lead side overhang A

exceeds ½ W.
Y
Nonconforming – Level C
1 X-direction: any lead heel overhangs land.
2 Y-direction: any lead side overhang A
exceeds ½ W or ¼ P (whatever is less).
NOTE When the land width P is narrower than
the component the lead width W, the land edge
shall not protrude outside the lead edge in
Y-direction by more than ¼ P or 0,1 mm,
B whichever is greater. See notes 1 and 2 in 9.1.

IEC 614/03

Figure 41 – Inward L-shaped ribbon leaded component – Nonconforming

9.13 Flat-lug leads on power dissipating components

Components may be shifted in X or Y or rotation direction. The accept and reject criteria relate
to placement accuracy.

Target – Levels A, B, C
Y
1 All lead feet, including heel regions and
toes, sit centrally on lands.
2 Component body not rotated.

IEC 615/03

Figure 42 – Flat-lug component – Target

 Page 46
EN 61192−2:2003
61192-2  IEC:2003 – 46 –

Acceptable – Level A
J 1 X-direction: no lead toe overhangs land.
Y 2 Y-direction: no lead side overhangs land.
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W Acceptable – Level B
1 X-direction: no lead toe overhangs land.
X
Gap K is 2 T or less.
2 Y-direction: no lead side overhangs land.
Acceptable – Level C
T
1 X-direction: land protrusion B not less than T.
K Gap K not greater than T.
IEC 616/03
2 Y-direction: no lead side overhangs land.

Figure 43 – Flat-lug component – Acceptable

Nonconforming – Level A
1 X-direction: any lead toe overhangs land.
J
Y 2 Y-direction: any lead side overhangs
land.
Nonconforming – Level B
W
1 X-direction: any lead toe overhangs land.
X
Gap K greater than 2 T.
2 Y-direction: any lead side overhangs
land.
T Nonconforming – Level C
K 1 X-direction: any lead toe overhangs land.
IEC 617/03
Gap K greater than T.
2 Y-direction: any lead side overhangs land.

Figure 44 – Flat-lug component – Nonconforming

10 Post-placement rework

Data on the performance of placement equipment should be based on process deviations and
defects recorded before any rework is applied.

For components that have been placed on the board away from their intended land pattern
position during the placement operation, their value and correct location should be checked
before replacing them manually with new ones. Damaged components should not be used for
checking purposes.
 Page 47
EN 61192−2:2003
61192-2  IEC:2003 – 47 –

Pre-reflow rework should be carried out while the paste or adhesive surface retains its
tackiness.

Non-metallic conductive tweezers should be used for all post-placement rework involving
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movement or replacement of components.

10.1 Rework of components placed on solder paste

10.1.1 Local placement errors

Correction of minor surface-mount placement errors by careful movement of the component

body is not recommended.

10.1.2 General placement errors

Where there is general misplacement of all components in the same direction, action must be
taken to correct placement error. The coplanarity of multi-lead fine pitch component leads
requires careful checking.

10.2 Rework of components placed on non-conductive adhesive

Provided the component body is in contact with the adhesive, correction of minor surface
mount component placement errors by careful movement of the body is acceptable. Horizontal
movement can be applied without any lifting action. Should the component accidentally be
parted from the adhesive mound, a small amount of additional adhesive should be applied
to the underside of the component before replacing it. Care must be taken to avoid smudging
the adhesive onto nearby test points, vacant lands or components.

11 Adhesive curing

To avoid re-evaporation of adhesive material contaminating solderable surfaces, curing and

soldering should not take place using the same pass-through equipment.

The time-temperature profile used for curing should comply with the adhesive manufacturer’s
recommendations.

The following attributes can apply to the adhesive curing process, using manual or automatic
inspection:

a) the presence or absence of components;

b) the post-cure position of components;
c) the cross-section shape of the joint and relative size of wetted areas on the upper and
lower faces of the joint;
d) post-cure adhesion (shear or torsion) strength in N/mm 2 , for example, for each component
type, and
e) any unwanted post-cure spreading of the adhesive.
 Page 48
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12 Soldering processes

Soldering processes are described in IEC 61192-1 and shall be carried out in accordance with
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the requirements of the relevant paragraphs therein, as applicable.

Immediate post-operation assessment of the soldering process(es) in production can be

performed in several ways for example, by manual or automatic visual inspection, laser scan,
measuring the thermal properties of the joint, or X-ray. Analysis using other techniques may be
required for more detailed examination of metallurgical attributes.

The following attributes apply to the component soldering processes, using manual or auto-
matic visual inspection to meet requirements defined in Figure 1 through Figure 44:

a) presence or absence of components;

b) relative x, y and rotational alignment of component terminations and leads with matching
conductor lands;
c) the z axis condition of components for example, cant, component on edge;
d) the quantity, surface contour and surface condition of solder present at the joints;
e) the proportions of solderable areas on components and lands that have been wetted by
solder;
f) physical damage to printed board, for example, delamination, swelling, discolouration,
charring, cracking, land lift;
g) physical damage to components, for example, cracking, chipping, melting, deformation,
swelling, parametric change;
h) unwanted solder for example, solder balls, icicles, spikes, bridges;
i) other soldering defects, for example, leaching, dewetting, pits, voids, blowholes, wicking,
webs and skins, disturbed joints;
j) clarity of marking.

Other attributes applying to the component soldering processes that are not normally exposed
by post-soldering visual inspection or electrical test are:

k) cracking of plastic encapsulated ICs beneath the component body (‘popcorning’);

l) internal microcracking of ceramic components arising from thermal shock;
m) excessive growth of intermetallic compounds at the solder-copper interface;
n) gold embrittlement of the solder, and
o) excessive crystal growth in solder arising from excess time above its melting point.
NOTE Some of the above defects may arise from attributes other than those of the soldering operation,
for example, from defective materials, components or printed boards, or from the effects of previous processes.

The standard PPM baseline for surface-mounted component soldering operations is the
number of solder joints attempted. Guideline assessment attributes and details of the method
of calculation of PPM values are given in IEC 61193-1.

Guidance in interpreting the accept/reject criteria of the post-soldering requirements of

IEC 61191-2, is given in Annex A to this standard.
 Page 49
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61192-2  IEC:2003 – 49 –

13 Cleaning processes

The following attributes can apply to the post-soldering cleaning processes, using manual or
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automatic visual inspection and subsequent electrical testing:

a) visible residues, harmless and harmful;

b) visible tidemarks;
c) invisible ionic and non-ionic contamination;
d) residual solder balls and splashes;
e) damaged connections, visible and invisible;
f) trapped liquid that has not been removed by drying.
NOTE Some of the above defects may arise from attributes other than those of the soldering operation,
for example, from defective materials, components or printed boards, or from the effects of previous processes.

The standard PPM baseline for surface-mounted component soldering operations is twice the
printed board size in cm 2 . Guideline assessment attributes and details of the method of
calculation of PPM values are given in IEC 61193-1.

14 Hand placement and hand soldering, including hand rework/repair

Rework requirements are given in IEC 61192-1, Clause 18 and shall be carried out in
accordance with the relevant paragraphs therein.

The immediate post-operation assessment of rework and repair processes in production can
be performed in several ways, for example, by manual or automatic visual inspection, laser
scan, measuring the thermal properties of the joint, X-ray.

The attributes that can apply to the rework soldering processes, using manual or automatic
visual inspection and electrical test are given in Clause 12 above.

The standard PPM baseline for surface-mounted component manual or rework soldering
operations is the number of solder joints soldered. Guideline assessment attributes and details
of the method of calculation of PPM values are given in IEC 61193-1.

Minimum acceptance criteria for post-soldering component alignment and solder joints on
assembled boards are given in IEC 61191-2.

15 Electrical test

The recommended workmanship procedures are given in IEC 61191-1. Care should be taken
to ensure that the testing does not itself cause harm to the assembly, either through
mechanical damage (for example, arising from deformation of the printed board under pressure
from probe systems) or from electrical overstress.
 Page 50
EN 61192−2:2003
61192-2  IEC:2003 – 50 –

Annex A
(normative)
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A.1 Introduction

This annex contains illustrated examples of ‘target’ and ‘acceptable’ conditions for alignment
between surface-mounted components and their related land patterns and for the solder joint
fillets on their leads and terminations. They are intended solely to assist interpretation of the
post-soldering inspection requirements given in IEC 61191-2.

The following pictures and diagrams do not represent all potential process deviations and do
not show any examples of defects.

A.2 Example solder fillets and alignment: flat-ribbon, L- and gull-wing leads

The examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 3.
NOTE The cut end of the toe need not be wetted.

Target: height of concave fillets a at lead edges equal Target: all component lead feet, including heel regions
to lead thickness T along entire length L. and toes, sit central relative to land width and length.
Heel region filled to a height of G + T. Land completely
wetted.
a Solder fillets along lead foot edges are not required
on the overhung edge, or where the lead width is
equal to or greater than the land width, or when
lead edges are cropped from sheet metal.

T
L
Optimal joint
Meniscus not
required
G

IEC 619/03

IEC 618/03

Figure A.1 – Target solder fillet, Figure A.2 – Target alignment,

levels A, B, C levels A, B, C
 Page 51
EN 61192−2:2003
61192-2  IEC:2003 – 51 –

Acceptable: wetting of both lead side edges a evident Acceptable: lead foot side overhang A is less than ½ W b .
along more than ½ L. Fillet height at heel is greater No toe overhang. Heel region is within land.
than G + ⅔ T. b ⅓ lead width when lead pitch is less than 0,5 mm.
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a Solder fillets along lead foot edges are not required

on the overhung edge, or where the lead width is
equal to or greater than the land width, or when L
Minimum joint
lead edges are cropped from sheet metal.
Meniscus not
required

T Minimum joint

Meniscus not
required
G

IEC 620/03 IEC 621/03

Figure A.3 – Solder fillet, level B Figure A.4 – Alignment, level B

 Page 52
EN 61192−2:2003
61192-2  IEC:2003 – 52 –

A.3 Example solder fillets and alignment:

round or flattened (coined) leads
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 4.

Target: height of concave fillets a at lead edges equal Target: all component lead feet, including heel regions
to lead thickness T along entire length L. and toes, sit central relative to land width and length.
Heel region filled to a height of G + T.
W
Land completely wetted.
W
a Solder fillets along lead foot edges are not required
on the overhung edge, nor where the lead width is
equal to or greater than the land width.

C C
D D
IEC 622/03 IEC 623/03

Figure A.5 – Target solder fillet, Figure A.6 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: wetting of both lead side edges a evident Acceptable: lead foot side overhang A in side direction
along more then ⅔ L. Fillet height at heel is greater and toe overhang B in length direction are both less
than G + ½ T or 0,5 mm whichever is less. than ⅓ W b . Heel region is within land.
a Solder fillets along lead foot edges are not required b ⅓ lead width when the lead pitch is less than 0,5 mm.
on the overhung edge, nor where the lead width is
equal to or greater than the land width.

G
G

Q Q
G G

G
G
IEC 624/03
IEC 625/03

Figure A.7 – Solder fillet, level B Figure A.8 – Alignment, level B

 Page 53
EN 61192−2:2003
61192-2  IEC:2003 – 53 –

A.4 Example solder fillets and alignment: J-leads

Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 5.
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Target: inner and outer heel fillets soldered to start of Target: all component lead feet, including heel regions
lower J-lead radius. Side fillets on J-lead are at lead and toes, sit central relative to land width and length.
thickness T. No solder touching component body. Land
completely wetted.

Optimal joint

IEC 627/03

IEC 626/03

Figure A.9 – Target solder fillet, Figure A.10 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: inner and outer heel fillet heights greater Acceptable: lead foot side overhang A is less than
than G + ½ T. ½ W b . No toe overhang. Heel region is within land.
a Solder fillets along lead foot edges are not required b ⅓ lead width when lead pitch is less than 0,5 mm.
on the overhung edge, or where the lead width is
equal to or greater than the land width, or when lead
edges are cropped from sheet metal.

A IEC 629/03

IEC 628/03

Figure A.11 – Solder fillet, level B Figure A.12 – Alignment, level B

 Page 54
EN 61192−2:2003
61192-2  IEC:2003 – 54 –

A.5 Example solder fillets and alignment:

rectangular or square end leadless components
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 6.

Target: concave end face fillet has height G + ¾ H, is Target: component body sits centrally on lands in both
wetted to entire width of end face surface and extends length and width directions. Termination side face
outward on land ¾ W beyond termination. Side fillet completely on land.
heights at ½ H minimum over entire length T. Land
completely wetted.

D
C

IEC 630/03
P
IEC 631/03

Figure A.13 – Target solder fillet, Figure A.14 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: end-face fillet height is greater than G + ¼ H Acceptable: side overhang A is less than ⅓ W a .
or G + 0,5 mm, whichever is greater. Side fillet height is Component body overlaps land by more than ⅔ T b .
greater than ½ T. End joint width C is greater than ½ W. No end overhang of termination beyond land.
No solder on body beyond termination. a Or 1,5 mm, whichever is less.
b Not applicable to 1-face (end-face only) termi-
nations.

E H

G
G
IEC 632/03

IEC 633/03

Figure A.15 – Solder fillet, level B Figure A.16 – Alignment, level B

 Page 55
EN 61192−2:2003
61192-2  IEC:2003 – 55 –

A.6 Example solder fillets and alignment: cylindrical end cap terminations,
for example, MELFs
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 7.

Target: concave end-face fillet has height W, is wetted Target: component body sits centrally on lands in both
to entire width of end face-surface and extends outward length and width directions. Termination side face
on land ¾ W beyond termination end face. Side fillet completely on land.
heights at ½ W minimum over entire length T. Land
completely wetted.

W
T

C
P

P D

Solder
T ¾W

Device
IEC 635/03

IEC 634/03

Figure A.17 – Target solder fillet, Figure A.18 – Target alignment,

levels A, B, C levels A, B, C
 Page 56
EN 61192−2:2003
61192-2  IEC:2003 – 56 –

Acceptable: end-face fillet height is greater than G + ¼ H Acceptable: side overhang A is less than ⅓ W.
or G + 0,5 mm, whichever is greater. Side fillet height is Component body overlaps land by more than ⅔ T.
greater than ½ T. End joint width C is greater than ½ W. No end overhang of termination beyond land.
No solder on body beyond termination.
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T
W

A
¼G

IEC 637/03

IEC 636/03

Figure A.19 – Solder fillet, level B Figure A.20 – Alignment, level B

 Page 57
EN 61192−2:2003
61192-2  IEC:2003 – 57 –

A.7 Example solder fillets and alignment: bottom-only terminations on

leadless components
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 8.

Target: solder wetting to underside of component and Target: termination areas on underside of component
land at each end is evident as a continuous joint along sit centrally within lands in both length and width
all three visible edges. All visible parts of land wetted. directions.

F
G

IEC 639/03

IEC 638/03

Figure A.21 – Target solder fillet, Figure A.22 – Target alignment,

levels A, B, C levels A, B, C
 Page 58
EN 61192−2:2003
61192-2  IEC:2003 – 58 –

Acceptable: end joint width exceeds ½ W. Acceptable: no end overhang. Side overhang is less
than ⅓ W.

W
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C
P
A
C

IEC 640/03 IEC 641/03

Figure A.23 – Solder fillet, level B Figure A.24 – Alignment, level B

 Page 59
EN 61192−2:2003
61192-2  IEC:2003 – 59 –

A.8 Example solder fillets and alignment: leadless chip carriers with
castellated terminations
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 9.

Target: concave fillets on all castellations. Fillet Target: all castellations sit centrally on lands. All land
heights are G + H and cover full width of each land and projections outside component body are equal and not
castellation. Visible evidence of wetting to all termi- less than ¾ H.
nation areas beneath component body. Land areas
outside body completely wetted. D

Concave solder fillet

IEC 642/03 IEC 643/03

Figure A.25 – Target solder fillet, Figure A.26 – Target alignment,

levels A, B, C levels A, B, C
 Page 60
EN 61192−2:2003
61192-2  IEC:2003 – 60 –

Acceptable: end joint width C is greater than ½ W. Acceptable: castellation side overhang from land A is
Fillet height F is greater than G + ¼ H. less than ½ W. No end overhang of component body
outline beyond any land.
Side joint length D is greater than ½ F.
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W C

A A

IEC 645/03

IEC 644/03

Figure A.27 – Solder fillet, level B Figure A.28 – Alignment, level B

 Page 61
EN 61192−2:2003
61192-2  IEC:2003 – 61 –

A.9 Example solder fillets and alignment: butt joints

Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 10.
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Target: fillet height 2,5 W. Land completely wetted. Target: lead toes, sit central within each land. Land
protrusion B outside each toe end face is 2 W.
W
Lead

Land
F

IEC 647/03
C
IEC 646/03

Figure A.29 – Target solder fillet, Figure A.30 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: fillet heights greater than G + 0,5 mm. Acceptable: no side overhang outside land. Land
End joint width greater than ¾ W. Solder thickness protrusion B outside each toe face (except end face) is
under toe is less than 0,1 mm. greater than lead thickness T.

IEC 649/03
D
IEC 648/03

Figure A.31 – Solder fillet, level B Figure A.32 – Alignment, level B

 Page 62
EN 61192−2:2003
61192-2  IEC:2003 – 62 –

A.10 Example solder fillets and alignment: inward L-shaped flat ribbon leads

Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 11.
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Target: height of concave fillet at lead end face is G + ¾ H Target: component lead feet, including heel regions
along entire lead width W. Signs of wetting between and toes, sit central relative to land width and length.
underside of foot and land along entire length of inward L
lead sides a. Visible parts of land completely wetted.
a Or 0,5 mm, whichever is greater.

L H

IEC 650/03
IEC 651/03

Figure A.33 – Target solder fillet, Figure A.34 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: end-face fillet height greater than G + ¼ H a Acceptable: lead foot side overhang A is less than ½ W.
across more than ½ lead width W. Joint to land extends
outward beyond lead end face by more than ½ H b.
a Or 0,5 mm, whichever is greater.
b Or 0,5 mm, whichever is less.

L
G

½ L ou 0,5 mm
IEC 652/03
IEC 653/03

Figure A.35 – Solder fillet, level B Figure A.36 – Alignment, level B

 Page 63
EN 61192−2:2003
61192-2  IEC:2003 – 63 –

A.11 Example solder fillets and alignment: flat-lug leads on power

dissipating components
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Examples furnished are to assist in interpreting the requirements of IEC 61191-2, Figure 12.

Target: side joint length extends over entire length of Target: lead completely on land so that land projects
lead/land interface. End joint width is equal to lead outside lead sides and toe end by lead thickness T.
width W. Fillets at lead sides and at toe end are at full Dimension K is less than lead thickness.
lead thickness. G is less than 0,1 mm. Visible land
areas are completely wetted.

IEC 654/03

IEC 655/03

Figure A.37 – Target solder fillet, Figure A.38 – Target alignment,

levels A, B, C levels A, B, C

Acceptable: end joint width greater than ½ W. Side joint Acceptable: no side or toe overhang. K is less than T.
length not less than L – K.

IEC 656/03

IEC 657/03

Figure A.39 – Solder fillet, level B Figure A.40 – Alignment, level B

___________
 Page 64
EN 61192−2:2003

Annex ZA
(normative)

Normative references to international publications

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with their corresponding European publications

This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

Publication Year Title EN/HD Year

1)
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
1) 2)
IEC 61191-1 - Printed board assemblies EN 61191-1 1998
Part 1: Generic specification -
Requirements for soldered electrical
and electronic assemblies using surface
mount and related assembly
technologies
1) 2)
IEC 61191-2 - Part 2: Sectional specification - EN 61191-2 1998
Requirements for surface mount
soldered assemblies
1) 2)
IEC 61191-3 - Part 3: Sectional specification - EN 61191-3 1998
Requirements for through-hole mount
soldered assemblies
1) 2)
IEC 61191-4 - Part 4: Sectional specification - EN 61191-4 1998
Requirements for terminal soldered
assemblies
1) 2)
IEC 61192-1 - Workmanship requirements for soldered EN 61192-1 2003
electronic assemblies
Part 1: General
1) 2)
IEC 61192-3 - Part 3: Through-hole mount assemblies EN 61192-3 2003
1) 2)
IEC 61192-4 - Part 4: Terminal assemblies EN 61192-4 2003
1) 2)
IEC 61193-1 - Quality assessment systems EN 61193-1 2002
Part 1: Registration and analysis of
defects on printed board assemblies

1)
Undated reference.
2)
Valid edition at date of issuie.
 Page 65
EN 61192−2:2003

Publication Year Title EN/HD Year

1) 2)
ISO 9001 - Quality management systems - EN ISO 9001 2000
Requirements
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1) 2)
ISO 9002 - Quality systems - Model for quality EN ISO 9002 1994
assurance in production, installation and
servicing
 BS EN
61192-2:2003
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