5B MRF
5B MRF
5B MRF
(Lecture Notes)
We have found indirect evidence that, upon coming into contact with the work piece surface in the region of high
magnetic field, the converging ribbon of MR fluid separates into layers. The top layer seems to be composed of
the carrier liquid and the polishing abrasives, while the bottom layer consists of compacted chains of magnetic
particles attached to the rotating wheel. In this condition, fluid flow in the polishing interface for the two
commercially available MR fluids described above is optimal for promoting a high removal rate and smooth
surfaces.
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
expensive. It is apparent that more applications would quickly become commercial if the material cost could be
reduced. Not unrelated to the cost issue is the desire to obtain the largest field-induced change in viscosity with
the smallest particle concentration and applied field strength possible. Simply, the material cost could be reduced
by reducing the amount of iron employed. Unfortunately, the magnitude of the MR effect increases with particle
concentration, and thus there is a trade-off between cost and performance. This trade-off currently prohibits some
applications. Iron oxidizes spontaneously, and in devices at elevated temperatures wherein the particles are
exposed to the atmosphere, oxidation can be a problem. As the particles oxidize, they become less magnetizable,
diminishing the MR effect. Colloidal forces acting between the particles can cause aggregation, which can
negatively affect the fluid rheology in the absence of the applied field, can increase the rate of sedimentation, and
can severely inhibit the ability to re-disperse particles that have settled. Very little is known about these
phenomena in MR fluids.
6. Magneto Rheological Abrasive flow Machining (MRAFM): A solution!!
The recent increase in the use of hard, high strength and temperature resistant materials in engineering
necessitated the development of newer machining techniques. Conventional machining or finishing methods are
not readily applicable to the materials like carbides; ceramics. Conventional machining processes when applied
to these newer materials are uneconomical, Produce poor degree of surface finish and accuracy, Produce some
stress, highly insufficient. Newer machining processes may be classified on the basis of nature of energy
employed. Abrasive flow machining (AFM) is relatively new process among non-conventional machining
processes. Low material removal rate happens to be one serious limitation of almost all processes. Magneto
Rheological abrasive flow machining is a new development in AFM. With the use of magnetic field around the
work piece in abrasive flow machining, we can increase the material removal rate as well as the surface finish.
Traditional finishing processes like grinding, lapping, honing use abrasives as cutting tools for getting the desired
surface accuracy and geometry and are incapable of achieving high precision. It is also needed to automate the
processes where the desired surface can be obtained as a function of time. So new precision finishing processes
like MRAFF are developed for nano finishing of the parts even with complicated geometry.
Properties of surface play an important role in the service life of engineering components. Fatigue life of the
components is strongly affected by surface finish and surface treatment. Fatigue failures generally nucleate at
irregular and rough surfaces of engineering components.
o As surface roughness increases, problems such as flow resistance, wear, and optical loss increase
resulting in a decrease in efficiency. Single crystal silicon is widely used material in semiconductor
industries. Furthermore, it is also used in cryogenic applications and synchrotron beam line as a silicon
strip mirror due to its favorable properties. Single crystal silicon has been the primary material for both
internally and contact cooled x-ray mirrors.
o The above mentioned applications of silicon require surface finish of the order of nanometer.
Therefore, in some applications, a surface polishing is required during or after fabrication processes.
Majority of the traditional MNM processes are embedded abrasive or fixed geometry cutting tool type processes.
Conversely, majority of the advanced MNM processes are loose flowing abrasive based processes in which
abrasive orientation and its geometry at the time of interaction with the workpiece is not fixed. all other processes
mentioned above use a medium whose properties can be controlled externally with the help of magnetic field.
This permits to control the forces acting on an abrasive particle hence the amount of material removed is also
controlled. This class of processes is capable to produce surface roughness value of 8 nm or lower. Using better
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
force control and still finer abrasive particles, some of these processes may result in the sub-nanometer surface
roughness value on the finished part.
6.1 MRAFM PROCESS:
MRAF is the hybridization of AFM and MRF. By MRAF the finishing becomes controllable and selectable.
The abrading forces in AFM process are least controllable by external means, hence lack of determinism. To
preserve the versatility of AFF process and at the same time to have determinism and controllability of rheological
properties of abrasive laden medium, a hybrid process termed as Magnetorheological Abrasive Flow Finishing
(MRAFF) has been developed by combining AFF and MRF . Abrasive mixed viscous base medium acts as a “self
deformable stone” and overthrows shape limitation inherent in almost all traditional finishing processes. This
process has the capability of finishing complex internal and external geometries up to nano-level surface
roughness value. It imparts better control on the process performance as compared to AFF process due to in-
process control over abrading medium’s rheological behavior through magnetic field. MRAFF process comprises
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
MR-polishing fluid having fine abrasive particles dispersed in it. On the application of magnetic field, the CIPs
form a chain like columnar structure with abrasives embedded in between and within the chains.
In MRAFF process, a magnetically stiffened slug of magnetorheological polishing fluid is extruded back and
forth through or across the passage formed by workpiece and fixture. Abrasion occurs selectively only where the
magnetic field is applied across the workpiece surface, keeping the other areas unaffected. The mechanism of the
process is shown in figure below. The rheological behaviour of polishing fluid changes from nearly Newtonian
to Bingham plastic upon entering and Bingham to Newtonian upon exiting the finishing zone. The abrasive
(cutting edges) held by carbonyl iron chains rub the workpiece surface and shear the peaks from it . The amount
of material sheared from the peaks of the workpiece surface by abrasive grains depends on the bonding strength
provided by field-induced structure of MR-polishing fluid and the extrusion pressure applied through piston. In
this way magnetic field strength controls the extent of abrasion of peaks by abrasives.
6.2 EQUIPMENTS:
Electromagnet and DC power source, 3 phase AC motor and ultra-high pressure pumps, Workpiece fixture.
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
boron carbide (B4C) and diamond abrasives proved MRAFF capability in nano-finishing hard ceramics. This
process has immense possibilities of applications especially in case of finishing of complex shaped 3D
components.
Formation of CIPs chain structure (a) in absence of magnetic field and (b) on the application of magnetic field.
In MRAFF process, Magnetorheological Polishing fluid (MRPF) is used as polishing medium to give nanofinish.
MRPF is the homogeneous mixture of CIPs and abrasive particles in the base medium of grease and paraffin
liquid. When an external magnetic field is applied, the CIPs in the fluid form the chain like structure along the
lines of magnetic field in between the poles of electromagnet. Surrounding CIPs chain give the bonding strength
to the embedded abrasive particles. When the MRPF is extruded through the passage formed by workpiece and
the fixture, abrasive particles embedded into the chains of CIPs do cutting action by shearing off the peaks of the
surface undulations from the workpiece surface. Magnetic field and the extrusion pressure are the parameters
that determine the material removal rate.
6.3 MECHANISM OF MATERIAL REMOVAL
Solid particle erosion proposed by Finnie is considered as the basic mechanism of material removal in MRAFF
with some modifications. In abrasive jet machining the energy of the striking abrasive particle is imparted by the
high speed of the medium stream, but in MRAFF the required energy to the abrasive particles is provided by high
pressure acting on the viscoelastic carrier medium. The medium dilates and the abrasive particles come under a
high level of strain due to the pressure acting in the restriction. The momentum that abrasive particles acquire due
to these conditions can be considered to be responsible for micro ploughing and microchipping of the surface in
contact with the abrasive. Micro ploughing causes plastic deformation on the surface of the metal. Initially no
material removal takes place. However, the surface atoms become more vulnerable to removal by subsequent
abrasive grains. More abrasive particles attack the surface repeatedly, which causes the detachment of material
often referred to as ‘cutting wear’. When a strong magnetic field is applied around the work piece, the flowing
abrasive particles (which must essentially be magnetic in nature) experience a sideways pull that causes a
deflection in their path of movement to get them to impinge on to the work surface with a small angle, thereby
resulting in microchipping of the surface. The magnetic field is also expected to affect the abrasive distribution
pattern at the machining surface of the work piece. The particles that otherwise would have passed without striking
the surface now change their path and take an active part in the abrasion process, thus causing an enhancement
in material removal. It is to be mentioned here that although the mechanical pull generated by the
magnetic field is small, it is sufficient to deflect the abrasive particles, which are already moving at
considerable speed. Therefore it appears that, by virtue of the application of the magnetic field, more abrasive
particles strike the surface. Simultaneously, some of them impinge on the surface at small angles, resulting
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
in an increased amount of cutting wear and thereby giving rise to an overall enhancement of material removal
rate.
6.4 Analysis of selected abrasive based MRAFF and process parameters:
6.4.1 Critical surface roughness:
During MAF, AFM and MRAFF processes, it has been observed that with the increase in finishing time, the
surface roughness value (Ra value) keeps on decreasing. Beyond a certain finishing time, the relationship between
the finishing time and surface roughness. Relation between surface roughness and finishing time value (Ra value)
becomes asymptotic except the minor fluctuations within a small band of Ra value. This behavior was observed
while comparing experimental and computational results obtained for MAF process. The downward or indenting
force is a normal component of magnetic force in MAF and MRAFF processes, and radial force (Fr) in AFM
process. Because of the cutting force (axial in AFM and MRAFF, and tangential in MAF), this bunch of iron and
abrasive particles moves in the forward direction and shears/removes a very small amount of material in the form
of micro-chip. The size of the chip removed depends on the magnitude of radial force, axial force, and the ratio
of axial force and the force required to shear off the roughness peaks. When this bunch of iron and abrasive
particles moves further, it separates the micro-/nano-chip (MNC) from the workpiece.
Similar mechanism of material removal with minor modifications works in case of MAF process. In the same
way, material is removed in the form of micro-chip in case of AFM. This phenomenon of removal of material in
the form of MNC is repeated by each bunch of iron/abrasive particles. As a result, the height of the surface
irregularities keeps decreasing. It also suggests that the iron and abrasive particles size should be larger than the
top width of a valley. At this point, the pre-finished marks/scratches are completely removed and the abrasives
create their own finishing marks (peaks and valleys). The abrasive particles further penetrate into the workpiece
and their depth of penetration depends upon the radial force, and the ratio of axial force and the force required to
shear off the surface peaks. This indentation depth decides the critical surface roughness value attainable in these
processes. Unless finishing conditions are changed, the value of (critical) surface roughness remains unchanged
with time. However, real life situation is slightly different because the size of iron and abrasive particles varies in
a range hence the depth of penetration also as shown in. It shows different depth of penetration for different size
of abrasive particles depending upon the penetrating force acting on a particular abrasive particle. As a result of
this, the critical surface roughness value obtained after finishing is not a unique number rather it fluctuates over
a small range or band. This fluctuation in critical surface roughness value can also be caused due to the non-
homogeneous mixture of the iron and abrasive particles (MAF and MRAFF processes), or viscoelastic medium
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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Advanced Manufacturing Processes (AMP)
(Lecture Notes)
and abrasive particles (in AFM). This variation may also result due to the inclusions of MNC in the medium
before it is replaced by the fresh medium.
Initial surface finish (Ra: 0.28 µm). (a) Finished surface after MRAFF for 2000 cycles with SiC abrasive (Ra:
0.10 µm), and (b) finished surface after MRAFF with diamond abrasive (Ra: 0.10 µm)
©Dr. Harlal Singh Mali, Asso. Professor, Department of Mechanical Engineering, MNIT Jaipur
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