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How to Plan PCB Projects from Design to Examples ?

Developing a new electronics product with a custom printed circuit board

(PCB) involves extensive planning even before schematic entry begins. A

systematic approach to planning PCB projects helps avoid costly mistakes

and delays down the line.

This comprehensive guide covers how to effectively plan a PCB project

end-to-end – starting from the product requirements all the way through

fabrication, assembly, and testing. Read on to learn planning best

practices that will set your next PCB project up for success.

Table of Contents

Gathering Requirements

The critical first step is gathering detailed requirements that will drive

the PCB design, manufacturing, and testing. Key requirements to obtain:

 Input/output interfaces – What types of wired or wireless interfaces

are needed? Common standards like USB, Ethernet, WiFi determine

layout constraints.

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 Component selection – Will high power, high frequency, or

space-grade components be used? Component sizes and pinouts

affect PCB design.

 Functional modes – What modes of operation are needed? This

defines use cases to design and test for.

 Performance criteria – What are the critical performance metrics

like data rates, accuracy, response times, power consumption, etc?

 Environmental factors – What environments will the product

operate in – indoor/outdoor, temperature range, vibration, etc? This

influences design ruggedness.

 Compliance – What regulatory standards like UL, FCC, CE must be

met? Compliance needs drive certain design and test criteria.

 Manufacturing volume – Will this be a short prototype run or mass

production? Manufacturing and inspection processes depend on

volumes.

 Budget constraints – What are cost targets for BOM, PCB fabrication,

assembly, etc? Costs depend heavily on design choices.

Documenting all requirements creates a product requirements

specification (PRS) that aligns cross-functional teams and ensures no gaps

in planning the PCB project stages.

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Selecting Components

With requirements defined, appropriate integrated circuits, discrete

semiconductors, passives, connectors, and other components can be

selected.

 Review datasheets for specifications like performance, operating

ranges, packaging, pin counts, etc.

 Prefer use of standard components that are readily available and

qualified. Custom or obsolete parts often delay projects.

 Consider environmental needs like temperature tolerance, radiation

resistance, etc.

 Model board space needed for placements based on component

dimensions.

 Check that packaging and pinouts are compatible with PCB

assembly processes.

 Minimize different component types to reduce BOM cost and

complexity.

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Judicious component selection while meeting technical requirements

optimizes downstream PCB design.

Schematic Design

The schematic captures the circuit architecture and connectivity on paper

before physical implementation.

Schematic design tips:

 Use top-down hierarchical blocks for major subsystems. This

simplifies complex designs.

 Adhere to logical grouping and naming conventions for nets and

components.

 Include test points to facilitate hardware debugging and

characterization.

 Design with manufacturability in mind. Schematics tightly

constrain PCB layout options.

 Simulate circuit performance to verify operation before prototyping.

A complete schematic allows progressing to PCB layout with all interfaces,

components, and nets logically defined.

PCB Layout

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pcb layout design

With the schematic complete, PCB layout can begin. This maps the logical

schematic onto a physical board template.

Best practices for layout:

 Group related components together for efficient local routing.

 Ensure high speed paths have impedance control and isolation.

 Include modest spare board area for last minute layout changes.

 Follow all manufacturers’ design rules for trace spacing, hole sizes,

etc.

 Design for thermal management with adequate copper heat sinks.

 Minimize trace lengths for critical signals like clocks and high speed

buses.

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 Review layouts regularly against requirements to avoid missing key

features or constraints.

Careful schematic-driven PCB layout avoids costly respins due to

functional or manufacturing issues.

Design Reviews

At multiple points during schematic capture and PCB layout, formal design

reviews should be conducted.

Typical design reviews:

 Requirements Review – Verify all defined requirements are properly

translated into the design.

 Schematic Review – Assess circuit correctness, manufacturability,

testability.

 Layout Review – Check form fit, tolerances, serviceability,

manufacturability.

 Safety Review – Ensure regulatory and safety standards compliance.

 Quality Review – Confirm adherence to quality processes and

documentation.

Reviews help identify issues early when they can be readily addressed,

reducing costly redesigns later.

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Thermal Analysis

Thermal design is a critical aspect of PCB layouts. Excessive temperatures

can cause failures.

Thermal analysis process:

 Power Maps – Estimate power dissipation for each component.

 Heat Spreading – Ensure power planes and thermal vias distribute

heat.

 Thermal Simulation – Model temperature rises with finite element

analysis.

 Heatsinking – Add copper pads, planes, and thermal reliefs to

dissipate heat.

 Cooling – Evaluate need for fans, heat pipes, liquid cold plates, or

other cooling.

Detailed thermal design improves reliability and prevents hot spots on the

PCB.

Design for Manufacturing (DFM)

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PCBs must be designed not just for function but also for

manufacturability.

Key DFM considerations:

 Manufacturer Capabilities – Understand minimum trace widths,

hole sizes, spacing, etc.

 Tolerances – Account for tolerances of ±10% or more in fabrication

and assembly.

 Panel Utilization – Layout board shape and placement for efficient

panel use.

 Split Planes – Avoid large copper fills which are prone

to etching artifacts.

 Test Points – Include test pads connected to nets for

characterization.

 Chamfers/Fillets – Use smooth corners on cutouts and pads for

better fabrication.

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Early DFM analysis avoids delays and costs of design re-spins to fix

manufacturability issues.

Design for Assembly (DFA)

In parallel with DFM, assembly factors must be addressed:

 Component Placement – Ensure they are accessible by

pick-and-place machines.

 Rotation/Orientation – Define component rotation to match

assembly processes.

 Picker Access – Account for clearances required for vacuum picker

heads.

 Adhesives – Plan locations of epoxies, tapes, staking compounds.

 Standoffs – Include standoff locations for securing components.

 Test Points – Provide adequate test points for in-circuit testing.

DFA techniques result in PCBs that transition smoothly from fabrication to

automated assembly.

Cost Analysis

Performing cost analysis during the design process helps avoid cost

overruns:

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 BOM Cost – Calculate total component cost based on volumes,

sourcing options.

 PCB Cost – Estimate board fabrication cost per units for chosen

manufacturer.

 Assembly Cost – Project expenses for population based on

complexity, lead times.

 Test Cost – Budget for test fixture development and unit testing

time.

 Compliance Cost – Factor in costs to achieve regulatory certification.

 Tooling Cost – Account for any custom tooling like molds, jigs,

fixtures.

Adjusting the design to align with target costs prevents budget surprises

later.

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Documentation

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Maintaining up-to-date documentation is crucial for smooth PCB project

execution:

 Requirements – PRS provides the foundation for development.

 Schematics – Fully detailed schematics essential for layout, BOMs,

service.

 PCB Drawings – Manufacturing drawings with dimensions, notes,

finishes.

 BOMs – Component lists with approved manufacturer parts and

volumes.

 Assembly Drawings – Mechanical assembly diagrams, staking

drawings.

 Test Procedures – Documented pass/fail criteria for every

production test performed.

Complete documentation enables clear hand-off between teams and

traceability.

Manufacturing and Assembly

With design complete, planning shifts to manufacturing and assembly.

Key planning activities:

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 Fabrication Quotes – Get quotes from 2-3 manufacturers for

cost/lead time comparison.

 Assembly Quotes – Same process for assembly houses to find best

value.

 Contract Negotiation – Finalize volume pricing and terms with

chosen vendors.

 Quality Agreements – Define defect limits, corrective actions,

reliability metrics.

 Process Qualification – Audit and certify the PCB fabrication and

assembly processes.

 Logistics – Determine shipment methods and schedules to

synchronize supply chain.

Thorough planning with manufacturing partners results in quality product

build at scale.

Test Strategy

Lastly, the overall test strategy must be defined:

 Inspection Testing – Optical, x-ray inspection to check assembled

boards.

 Functional Testing – Validate operation against defined use cases.

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 Environmental Stress Testing – Test under temperature,

vibration, humidity extremes per requirements.

 Compliance Testing – Certify boards meet EMI, safety standards like

CE, FCC.

 Quality Audits – Sampling based audits to confirm manufacturing

quality.

 Test Jigs/Fixtures – Design any custom rigs needed to accurately

stimulate and measure.

 Problem Reporting – Implement tracking for yield fallout and field

failures.

 Test Documentation – Detail procedures, pass/fail criteria,

equipment used.

Formal test planning reduces escaping defects and ensures robust,

reliable products for customers.

Conclusion

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Planning is the foundation of PCB project success. A structured approach

spanning requirements gathering, design reviews, analysis, costing,

documentation, manufacturing coordination, and test planning prevents

problems downstream. Applying best practice project planning principles

will lead to executing complex PCB programs on time and on budget.

Frequently Asked Questions

What are some key questions to ask PCB manufacturers during the planning

stage?

Key questions are: capabilities and tolerances, lead times, change order

rules, packaging methods, quality certifications, UL listing status, design

for manufacturing (DFM) guidance, and available testing services.

What are some strategies to reduce costs during PCB projects?

Cost reduction strategies include: component standardization, dual

sourcing components, value engineering design changes, negotiating

vendor volume discounts, optimizing test coverage, and designing for

automated assembly and inspection.

How early should compliance requirements like CE/FCC be considered?

Regulatory requirements should be analyzed right at project inception to

assess needed design considerations, testing, and certification timelines

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which can impact schedules. Last minute certification fails can delay

product release.

What are some pitfalls to avoid during requirements gathering?

Pitfalls include: unclear or conflicting requirements, leaving requirements

unvalidated, excluding stakeholders, siloed teams lacking alignment,

scope creep due to late additions, and failure to baseline requirements.

How can Fabrication and Assembly process capabilities be accounted for?

Engage vendors early for capabilities guidance. Perform process

qualification audits. Review DFx guidelines. Define quality agreements

clearly. Implement change control systems. Utilize manufacturability

simulation tools during design.

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4. Top Examples and Applications of IIoT Manufacturing

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