ALPHA® CVP-390

NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,

EXCELLENT PIN TEST PERFORMANCE, SAC305 & LOW AG CAPABLE.
DESCRIPTION
ALPHA CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue
with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.

This product is also designed to enable consistent fine pitch printing capability, down to 180m circle printed with
100m thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects
associated with print process variability. Additionally, ALPHA CVP-390 achieves IPC7095 Class III voiding
performance.

FEATURES & BENEFITS

 Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new
paste
 Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
 Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies
in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
 Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
 Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak
profile environment
 Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal
soaking, without charring or burning
 Excellent Voiding Performance: Meets IPC7095 Class III Requirement
 Halogen Content: Zero Halogen, no halogen intentionally added
 Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
 Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table
below), as well as TOSCA & EINECS

PRODUCT INFORMATION
Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu)
SACX Plus™ 0307 SMT (99%Sn/0.3%Ag/0.7%Cu)
SACX Plus™ 0807 SMT (98.5%Sn/0.8%Ag/0.7%Cu)
TM
InnoLot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi)
Sn99.3/Cu0.7
For other alloys, contact your local Cookson Electronics Sales Office
Powder Size: Type 3 (25 - 45μm per IPC J-STD-005)
Type 4 (20 - 38μm per IPC J-STD-005)
Type 4.5 (Proprietary powder size distribution) – available upon request
Type 5 (15 - 25μm per IPC J-STD-005) – available upon request
Packaging Sizes: 500 gram jars, 6” & 12” cartridges
Flux Gel: Flux gel is available in 10 and 30 cc syringes for rework applications
Lead Free: Complies with RoHS Directive 2002/95/EC

SM1068-7 2014-09-29 an Alent plc Company

ALPHA Global Headquarters

300 Atrium Drive, Somerset, NJ 08873 USA  1-800-367-5460  www.alpha.alent.com

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is
expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.

ALPHA is a registered trademark of Alpha Metals, Inc.

© 2014 ALPHA
 ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305 & LOW AG CAPABLE.
APPLICATION
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec
(6”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with
ALPHA Stencils. Blade pressures should be 0.21-0.36 kg/cm of blade (1.25 -1.5 Ibs/inch), depending upon the print speed.
The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give
high soldering yield with good cosmetics and minimized rework.

HALOGEN STATUS
ALPHA CVP-390 is a Zero Halogen product and passes the standards listed in the Table below:

Halogen Standards
Standard Requirement Test Method Status
JEITA ET-7304
< 1000 ppm Br, Cl, F in solder material
Definition of Halogen Free Pass
solids
Soldering Materials

Post Soldering Residues contain

IEC 612249-2-21 < 900 ppm each or total of < 1500 ppm Br or TM EN 14582 Pass
Cl from flame retardant source

JEDEC Post soldering residues contain

A Guideline for Defining "Low < 1000 ppm Br or Cl from flame retardant Pass
Halogen" Electronics source
Zero Halogen: No halogenated compounds have been intentionally added to this product

CATEGORY RESULTS PROCEDURES/REMARKS

CHEMICAL PROPERTIES
Activity Level ROL0 IPC J-STD-004B
Halide Content Halide free (by titration). IPC J-STD-004B
Fluoride Spot Test Pass JIS-Z-3197-1999 8.1.4.2.4
Pass, Zero Halogen - No EN14582, by oxygen bomb combustion,
Halogen Test
halogen intentionally added Non-detectable (ND) at < 50 ppm

Ag Chromate Test Pass IPC J-STD-004B

Pass JIS-Z-3197-1999 8.1.4.2.3
Pass IPC J-STD-004B
Copper Mirror Test
Pass JIS-Z-3197-1999 8.4.2
Pass (No evidence of Corrosion) IPC J-STD-004B
Copper Corrosion Test
Pass (No evidence of Corrosion) JIS-Z-3197-1999 8.4.1
ELECTRICAL PROPERTIES
Water Extract Resistivity 13,400 ohm-cm JIS-Z-3197-1999 8.1.1
SIR IPC J-STD-004B TM-650 2.6.3.7
Pass 8
(7 days, 40°C/90%RH, 12 V bias) (Pass ≥ 1 x 10 ohm)
Electromigration Bellcore GR78-CORE
(Bellcore 500 hours @ 65°C/85%RH Pass
10V)
(Pass=final > initial/10)
JIS Electromigration
Pass JIS-Z-3197-1999 8.5.4
(1000 hours @ 85°C/85%RH 48V)

SM1068-7 2014-09-29
 ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305 & LOW AG CAPABLE.

PHYSICAL PROPERTIES
Color Clear, Colorless Flux Residue
Pass, > 100gf over 24 hours at 25%,
JIS Z-3284-1994, Annex 9
50% and 75 % Relative Humidity
Tack Force vs. Humidity Pass, Change of <1g/mm2 over 24
IPC J-STD-005
hours at 25% and 75 % Relative
TM-650 2.4.44
Humidity

Tack Force at 32°C/35%RH,

measured after 0, 1, 2, 3 & 4 hours > 100gf JIS Z-3284-1994, Annex 9
print duration
88.8% metal load, Type 4 designated
M17 for printing
Viscosity (Typical) 1700 poise at 10
RPM Malcom
89% metal load, Type 4 designated
M20 for printing Malcom Spiral Viscometer;
Viscosity
Viscosity (Typical) 2000 poise at 10 J-STD-005
RPM Malcom
88.8% metal load, Type 4.5 designated
M20 for printing
Viscosity (Typical) 2000 poise at 10
RPM Malcom
Viscosity Stability at 25ºC for 20
Pass Malcom Spiral Viscometer
days
Continuous Viscosity
Measurement at 25ºC for 24 Pass Malcom Spiral Viscometer
hours
Able to reflow at < 200 μm Cu pad
Coalescence Test Internal
circle size
IPC J-STD-005
Solder Ball Preferred
TM-650 2.4.43
Rhesca Test, Test Time T2 , 3
Wetting Time Pass 0.34 second
seconds
Spread 80% JIS-Z-3197-1999 8.3.1.1
Stencil Life >8 hours @ 50% RH 23°C (74°C)
No bridge for 0.2 mm space JIS-Z-3284-1994 Annex 7
Cold Slump IPC J-STD-005
Not tested
TM-650 2.4.35
No bridge for 0.4 mm space JIS-Z-3284-1994 Annex 8
Hot Slump IPC J-STD-005
Pass
TM-650 2.4.35
Dryness Test (Talc) Pass JIS-Z-3197-1999 8.5.1

SM1068-7 2014-09-29
 ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305 & LOW AG CAPABLE.
SAFETY
While the ALPHA CVP-390 flux system is not considered toxic, its use in typical reflow will generate a small
amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work
area. Consult the MSDS (available at www.alpha.alent.com) for additional safety information.

STORAGE
ALPHA CVP-390 should be stored in a refrigerator upon receipt at 0 to 10C (32-50°F).
ALPHA CVP-390 should be permitted to reach room temperature before unsealing its package prior to use (see
handling procedures on page 4). This will prevent moisture condensation build up in the solder paste.

STORAGE & HANDLING PRINTING REFLOW (see Fig. 1) CLEANING

1. Refrigerate to guarantee STENCIL: Recommend ATMOSPHERE: Clean-dry air ALPHA CVP-390
stability @ 0-10°C (32-50°F). ALPHA CUT™, ALPHA or nitrogen atmosphere. residue is designed
When stored under these NICKEL-CUT™, ALPHA PROFILE (SAC Alloys): to remain on the
conditions, the shelf life of CVP- TETRABOND™, or ALPHA Straight Ramp: 0.7°C/sec & board after reflow. If
390 is 6 months. FORM stencils @ 1.3°C/sec ramp profiles, 45 - reflowed residue
0.100mm - 0.150 mm (4-6 60 TAL. cleaning is required,
2. Paste can be stored for 2 mil) thick for 0.4 - 0.5 mm Soak: 155 – 175 °C, 60 to 100 Vigon A201 (in line
weeks at room temperature up (0.016” or 0.020”) pitch. sec soak profiles have been cleaning), Vigon A
to 25°C(77°F) prior to use Stencil design is subject to determined to give optimal 250 (Batch
many process variables. results. If required, good Cleaning) or Vigon
3. When refrigerated, warm up Contact your local Cookson results are also achievable US (Ultrasonic
paste container to room Electronics stencil site for with high soak temperature Cleaning) are
temperature for up to 4 hours. advice. profiles of 175 – 185°C for 60 recommended.
Paste must be 19°C (66°F) SQUEEGEE: Metal s. Typical peak temperature is Vigon is a registered
before processing. Verify paste (recommended) 235 to 245°C. trademark of Zestron
temperature with a thermometer PRESSURE: 0.21 - 0.36
to ensure paste is at 19°C kg/cm of blade (1.25 -2.0 Note 1: Keeping the peak Misprints and stencil
(66°F) or greater before set up Ibs/inch) temperature below 241ºC cleaning may be
of printer. SPEED: 25 – 150 mm per may reduce the number and done with IPA,
second (1 – 6 inches per size of BGA and QFN voids. ALPHA SM-110E,
4. Paste can be manually stirred second). Note 2: Refer to component ALPHA SM-440, and
before use. A PASTE ROLL: 1.5-2.0 cm and board supplier data for Bioact™ SC-10E
rotating/Centrifugal force mixing diameter and make thermal properties at elevated cleaners.
operation is not required. If a additions when roll reaches temperatures. Lower peak Bioact is a registered
rotating/centrifugal force mixing 1-cm (0.4”) diameter (min). temperatures require longer trademark of
is used, 30 - 60 seconds at 300 Max roll size will depend TAL for improved joint Petroferm.
RPM is adequate. upon blade. cosmetics.
STENCIL RELEASE
5. Do not remove worked paste SPEED: 1 – 5 mm/sec.
from stencil and mix with LIFT HEIGHT: 8 – 14mm
unused paste in jar. This will (0.31- 0.55”)
alter the rheology of unused
paste.

6. These are starting

recommendations and all
process settings should be
reviewed independently.

SM1068-7 2014-09-29
 ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE,
EXCELLENT PIN TEST PERFORMANCE, SAC305 & LOW AG CAPABLE.

Fig 1: ALPHA® CVP-390 SAC305 Typical Reflow Profile

General Reflow Profile Guidelines

Parameter Guideline Additional Information
Atmosphere Air or N2
217 -221°C
SAC305
Melting Range
217 -225°C
SACX Plus™ 0807 SMT
Melting Range
217 - 227°C
SACX Plus™ 0307 SMT
Melting Range
Setting Zone* Optimal Dwell Period Extended window
40°C to 221oC 2:30 to 4:30 min. < 5:00 min.
170°C to 221°C 0:30 to 2:00 min < 2:30 min.
120°C to 221°C 1:25 to 3:00 min. < 3:30 min.
TAL (217 - 221°C) 45 - 90 sec. Not Recommended
Compatible with most common surface finishes.
(Entek HT, Entek OM, Alpha Star, ENIG, SACX
Peak temperature 235 - 245°C
HASL). Coldest point on the PCB can be as low as
230°C. Paste can withstand 250°C during reflow.
Recommended to prevent surface cracking
Joint cool down rate 1 - 6°C/second issues.
Above recommendations are for SAC305.
For alternative alloys, please follow the liquidus temperature of the respective alloy

SM1068-7 2014-09-29