APX8132H

Hall Effect Micro Switch IC

Features General Description

• Micro Power Operation for Battery Applications The APX8132H, integrated circuit, is an ultra-sensitive,
• Chopper Stabilized Amplifier pole independent Hall-effect switch with a latched digital
• Independent of North or South Pole Magnet, output. A 2.5 volt to 3.5 volt operation and an unique clock-
ing scheme reduce the average operating power
Easy for Manufacture
requirements, either a north or a south pole of sufficient
• Small Size Package
flux will turn the output on; in the absence of a magnetic
• Lead Free and Green Devices Available
field, the output is off. The polarity independence and
(RoHS Compliant) minimal power requirement allow this device to be easily
replaced reed switch for superior for signal conditioning.
Applications Advanced CMOS processing is used to take advantage of
low-voltage and low-power requirements, SOT-23 pack-
• Micro Switch
age provides an optimized package for most applications.
• Handheld Wireless Application Wake Up Switch
• Clamp Shell Type Application Switch Pin Configuration
• Magnet Switch in Low Duty Cycle Applications

GND

APX8132H

VDD VOUT
SOT-23-3 (Top View)

Ordering and Marking Information

APX8132H Package Code
A : SOT-23-3 AT : TSOT-23
Assembly Material Temperature Range
Handling Code I : -40 to 85 oC
Handling Code
Temperature Range TR : Tape & Reel
Package Code Assembly Material
G : Halogen and Lead Free Device
APX8132H A/AT: X32X X - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.

Copyright  ANPEC Electronics Corp. 1 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Absolute Maximum Ratings

(Note1)
TA = 25°C unless otherwise noted

Symbol Parameter Rating Unit

VDD Supply Voltage 5 V

VOUT Output Voltage 5 V

IOUT Output Current ±1 mA

TJ Junction Temperature Range 150

°C
TSTG Storage Temperature Range -65 to +150

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.

Thermal Characteristics
Symbol Parameter Typical Value Unit
(Note 2)
Junction-to-Ambient Resistance in Free Air
ο
θJA SOT-23 260 C/W
TSOT-23 275
Junction-to-Case Resistance in Free Air (Note 2)
ο
θJC SOT-23 145 C/W
TSOT-23 152
Power Dissipation, TA=25oC
PD SOT-23 0.385 W
TSOT-23 0.364
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

Electrical Characteristics TA = 25°C, VDD=3V unless otherwise noted

APX8132H
Symbol Characteristic Test Conditions Unit
Min. Typ. Max.

VDD Supply Voltage Range Operating 2.5 - 3.5 V

Average - 5 10 µA

IDD Supply Current Awake - 1.2 2 mA

Sleep - 2 8 µA

IOFF Output Leakage Current VOUT= VDD, BRPN<B<BRPS - - 1.0 µA

VDD
VOH Output High Voltage IOUT=-1mA - VDD V
-0.4
VOL Output Low Voltage IOUT=1mA 0 20 40 mV

tawake Wake up Time - 180 - µs

tperiod Period - 60 - ms

d.c. Duty Cycle - 0.3 - %

fc Chopping Frequency - 11 - kHz

Copyright  ANPEC Electronics Corp. 2 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Magnetic Characteristics TA = 25°C, VDD=3V unless otherwise noted

APX8132H
Symbol Characteristic Test Conditions Unit
Min. Typ. Max.

BOPS 22 - 28 G
Operate Points
BOPN -28 - -22 G

BRPS 10 - 23 G
Release Points
BRPN -23 - -10 G

Bhys Hysteresis - 10 - G

Copyright  ANPEC Electronics Corp. 3 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Pin Description
PIN
NO. FUNCTION
NAME
SOT-23-3
1 VDD Power input.
When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than
2 VOUT BOPN), the output turns on (output is low). When the magnetic field is below the release point BRPS
(or above BRPN), the output turns off (output is high).
3 GND Ground Connection.

Copyright  ANPEC Electronics Corp. 4 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Block Diagram
VDD

Awake & Sleep Timing

Logic

Hall Plane
Dynamic Offset
Cancellation

VOUT
Latch
Circuit

Chopper GND
Amplifier Hysteresis Control

Typical Application Circuit

OUT VDD
+
2.5V~3.5V
0.1µF -

GND

Copyright  ANPEC Electronics Corp. 5 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Function Description
Operation

The output of APX8132H switches low (turn-on) when in

presence of strong flux density facing the marked side of
package exceeds the operate point BOPS (or is less than
BOPN). After turn-on, the output is capable of sinking up to
1mA and the output voltage is low (turn-on). In absence of
flux density is below the release point BRPS (or increases
above BRPN), the APX8132H output switches high (turns
off). After turn-off, the output is capable of sourcing up to
1mA and the output voltage is high (turn-off). The differ-
ence in the magnetic operated and released point is the
hysteresis (Bhys) of the device. This built-in hysteresis al-
lows clean switching of the output even in the presence
of external mechanical bouncing vibration and electrical
noise.

OUTPUT OFF
5V
MAX BOPN BOPS
OUTPUT VOLTAGE

BRPN BRPS OUTPUT ON

0
-B 0 +B
MAGNETIC FLUX

Copyright  ANPEC Electronics Corp. 6 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Application Information
It is strongly recommended that an external bypass ca-
pacitor can be connected (is close to the Hall sensor)
between the supply and the ground of the device to re-
duce both external noise and noise generated by the chop-
per-stabilization technique. This is especially true due to
the relatively high impedance of battery supplies.

Pole-independent

The pole-independent sensing technique allows for op-

eration with either a north or a south pole magnet
orientation, enhancing the manufacturability of the device.
The state-of-the-art technology provides the same output
polarity for either pole in presence.

Awake & Sleep

Internal awake & sleep timing block circuit activates the

sensor for 180 µs and deactivates it for the remainder of
the period (60 ms). A short “awake” time allows for stabi-
lization prior to the sensor sampling and data latching on
the falling edge of the timing pulse. While in sleep cycle,
the output is latched in its previous state.

Chopper Stabilized Technique

The chopper stabilized technique cancels the mismatch-

ing of the hall element, the amplifier offset voltage and
temperature sensitive drift by the dynamic offset cancel-
lation and switched capacitor technique. This technique
produces devices has an extremely stable Hall output
voltage, therefore, the magnetic switch points are stable.

Recommended Minimum Footprint

0.037
0.057

0.024
0.102

0.074
Unit : Inch

SOT-23-3

Copyright  ANPEC Electronics Corp. 7 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Package Information
SOT-23-3
D
e

SEE
VIEW A

E1

E
b c

e1

0.25
A2

GAUGE PLANE
A1

SEATING PLANE
L

0
VIEW A

S SOT-23-3
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.30 0.035 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.

Copyright  ANPEC Electronics Corp. 8 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Package Information
TSOT-23-3

D
e

SEE VIEW A

E1

E
b c

e1

0.25
A2

GAUGE PLANE
SEATING PLANE
L
A1

VIEW A

S TSOT-23-3
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 0.70 0.90 0.028 0.035
A1 0.00 0.10 0.000 0.004
A2 0.70 0.80 0.028 0.032
b 0.30 0.50 0.012 0.020
c 0.08 0.20 0.003 0.008
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°

Note : Dimension D and E1 do not include mold flash, protrusions or gate

burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.

Copyright  ANPEC Electronics Corp. 9 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Carrier Tape & Reel Dimensions

OD0 P0 P2 P1 A

E1
F

W
B0

K0 A0 OD1 A
B B
SECTION A-A

T
SECTION B-B

d
H
A

T1

Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
SOT-23-3 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.05 1.0 MIN. 3.20±0.20 3.10±0.20 1.50±0.20
-0.00 -0.40
Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
TSOT-23-3 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.10 1.0 MIN. 3.20±0.20 3.10±0.20 1.20±0.20
-0.00 -0.40

(mm)

Devices Per Unit

Package Type Unit Quantity
SOT-23-3 Tape & Reel 3000
TSOT-23-3 Tape & Reel 3000

Copyright  ANPEC Electronics Corp. 10 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Taping Direction Information

(T)SOT-23-3

USER DIRECTION OF FEED

Classification Profile

Copyright  ANPEC Electronics Corp. 11 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
100 °C 150 °C
Temperature min (Tsmin)
150 °C 200 °C
Temperature max (Tsmax)
60-120 seconds 60-120 seconds
Time (Tsmin to Tsmax) (ts)

Average ramp-up rate

3 °C/second max. 3°C/second max.
(Tsmax to TP)
Liquidous temperature (TL) 183 °C 217 °C
Time at liquidous (tL) 60-150 seconds 60-150 seconds
Peak package body Temperature
See Classification Temp in table 1 See Classification Temp in table 2
(Tp)*
Time (tP)** within 5°C of the specified
20** seconds 30** seconds
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3 3
Package Volume mm Volume mm
Thickness <350 ≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C

Table 2. Pb-free Process – Classification Temperatures (Tc)

3 3 3
Package Volume mm Volume mm Volume mm
Thickness <350 350-2000 >2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C

Reliability Test Program

Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
HBM MIL-STD-883-3015.7 VHBM≧2KV
MM JESD-22, A115 VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA

Copyright  ANPEC Electronics Corp. 12 www.anpec.com.tw

Rev. A.1 - Aug., 2014
APX8132H

Customer Service

Anpec Electronics Corp.

Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050

Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

Copyright  ANPEC Electronics Corp. 13 www.anpec.com.tw

Rev. A.1 - Aug., 2014