INDIANINSTITUTE OF MECHNOLOGY, BOMBAY, RESEARCH! FACILITIES:oe TMU Am canara etait} Ra ea eae eet et Ca : een eee ese waa Industrial Research and Consultancy Centre (IRC), IRCC-SOM Building, Tian sa ea alee 0E) Pee ee LYELL Pd Cees tele Credits Pra cn IVER ig et ae eC LETC) = Boe Rota ee Dee ae Sard Rr Mar Rags Meena cen ecDirector's Message A) Indian Institute of Technology Bombay continues to hold its position among the top-notch Institutes and Universities of the country. Established about six decades ago with the mandate of undergraduate education in engineering and technology, the Institute has expanded its focus to research and development (R & D) in engineering, pure sciences, social sciences, management and design. A variety of metrics point to the successful shift towards R&D:nearly 55-60% of 10,000 students are pursuing a post-graduate academic program and 3000 PhD students are on roll. The R&D activities are driven by 625 full-time and 100 adjunct and visiting faculty members. The number of academic units has increased to 26, some of which are in inter-disciplinary areas; in addition, there are 6 research centres. Last year, IIT Bombay published 1370 research articles in peer-reviewed journals, and this is not counting conference publications. The total number of citations, in 2016, to IIT Bombay publications was close to 37,500, IIT Bombay maintains a healthy interaction with Industry and last year, out of the total extra-mural fund receipts (approximately Rs. 393 crores) nearly 18% is from the industry. High-end equipment and state-of-the-art laboratories are an integral part of research infrastructure needed to support the research activities at the Institute. In the last 5 years, Institute has spent nearly Rs. 160 crores to augment this infrastructure. A number of these facilities are open to researchers outside of IIT Bombay; other facilities have restricted access. This “Research Facilities” booklet is a compilation of the high-end equipment and contains details of the equipment, its location and contact details. Itis hoped that this compilation will be useful to researchers both within and outside of IIT Bombay and will serve as a quick reference guide. Prof. Devang V. KhakharAccessing Research Facilities @ IT Bombay Information about the facility Each research facility has a faculty member as the facility in-charge and is managed by a facility management committee. This information, along with the location of the facility, specifications of the equipment, instructions for sample preparation, contact details, etc. are given in the facility web pages; URLis givenat the bottom of the page for each facility. Internal users Faculty, technical staff, post-doctoral fellows, research project staff and students of IIT Bombay, and students who are doing internship at IIT Bombay have to use the DRONA interface to access Central Facilities and contact the concerned faculty in-charge to access National and Department Facilities. Details of usage charges, mode of payment are available on DRONA. External users Users from other academic entities, industry, national research laboratories, etc. have to contact the respective facility in-charge. Contact details are given at the bottom of the page for each facility. Facility usage charges vary for different facilities. These are indicated in the respective web pages. Note that statutory levies suchas service tax are applicable at prevailing rates. Users may opt for one of the following two services: (i) Only data acquisition (ii) Data acquisition + analysis / interpretation Charges for both these options are given in respective web pages. Payments may be made through the payment gateway (preferred) or demand draft. Acknowledgement of payment will be given along with data / analysis report.TABLE OF CONTENTS Bio- atomic force microscope facility Conductive atomic force microscope facility Confocal laser scanning microscope facility Laser scanning confocal facility Cryo high resolution transmission electron microscope facility Spinning disc confocal microscope facility Cryo transmission electron microscope facility Environmental scanning electron microscope facility Field emission gun based scanning electron microscope facility Field emission gun-transmission electron microscope facility-200 kV facility Field emission gun-transmission electron microscope-300 kV facility Fluorescence microscope facility Four dimensional X-ray microscope facility Scanning electron microscope facility Scanning probe microscope facility Scanning probe microscope facility Texture and orientation imaging microscope facil Transmission electron microscope facility Transmission electron microscopy- sample preparation facility Transmission electron microscopy -sample preparation facility Argon-argon geochronology facility Atomic layer deposition system Battery characterisation study system Bio-safety level 2 facility Carbon, hydrogen, nitrogen, sulphur and oxygen analyser facility ‘Chemical vapour deposition system Chemical vapour deposition system Diffusion furnace system Digital signal scopecorder system Double sided aligner systemTABLE OF CONTENTS Edge isolation tool Electrical discharge machining facility - | Electrical discharge machining facility - It Electron beam evaporator system Electron beam lithography system Etch system Fluorescence activated cell sorting /flow cytometer facility Geotechnical centrifuge facility Glove box system Glove box setup Image based spray diagnostic facility Liquid Helium plant Helium plant and Nitrogen plant Liquid Nitrogen plant Magneto resistance measurement system Micro system analyser facility Microcompounder and mini injection moulding facility Module solar simulator facility Molecular beam epitaxial growth system Nanoindentor facility Photoluminescence measurement setup Physical property measurement system Profilometer system Quantum efficiency measurement system Rapid thermal processing system Screen printer facility Solar cell current-voltage measurement system Specialised furnace facility Sputter deposition system Surface plasmon resonance facilityTABLE OF CONTENTS Hall measurement system Variable temperature hall measurement system Central surface analytical facility Contact resistance scan system Current-voltage characterisation system Dielectric broadband spectrometer facility Electron spin resonance spectrometer Electron spin resonance spectrometer Multi frequency electron paramagnetic resonance spectroscopy Environmental chamber for stress testing facility Fourier transform infrared spectroscopy system Gas chromatograph with high resolution mass spectrometer facility High resolution liquid chromatograph mass spectrometer facil High resolution mass spectrometer facility Time-of-flight secondary ion mass spectrometer facility Two-dimensional gas chromatography with time of flight mass spectrometer facility Inductively coupled plasma mass spectrometer system Liquid chromatography mass spectroscopy system X-ray diffractometer facility High resolution X-ray diffraction system High resolution X-ray diffraction system Hot wire chemical vapour deposition system Inductively coupled plasma atomic emission spectroscopy system Inductively coupled plasma chemical vapour deposition system Inductively coupled plasma reactive ion etching system Laser doping tool Laser Raman spectrometer Matrix assisted laser desorption / ionisation-time of flight facility Nuclear magnetic resonance spectrometer-300 MHz Nuclear magnetic resonance spectrometer-500 MHzTABLE OF CONTENTS Nuclear magnetic resonance spectrometer-750 MHz Photoluminescence spectroscope system Physical vapour deposition system Plasma immersion ion implantation system Potentiostat spectroscopy system Protein crystallography facility Pulsed laser deposition system Radio frequency cryogenic device characterisation system Thermal analysis system Transient absorption spectroscopy setup UV-VIS-near IR spectrometer facility X-ray fluorescence spectrometer facility X-ray photoelectron spectroscopy Department of Biosciences and Bioengineering Centre for Environmental Science and Engineering and Department of Chemical Engineering Department of Chemistry Department of Civil Engineering Department of Earth Sciences Department of Energy Science and Engineering Department of Metallurgical Engineering & Materials ScienceBIO-ATOMIC FORCE MICROSCOPE FACILITY This facility measures the topography, morphology and mechanical and electrical properties of samples and is specifically designed to work with soft and wetsamples, ie, biological cells and tissues. Make and Model: Asylum Research, USA. MFP-3D BIO Specifications/Features: + No pre-processing of materials/cells is required for imaging + Ability to image structure/ morphology of live cells and tissues under wet conditions * Ability to combine AFM measurements with images obtained in inverted microscope Applications: * Useful in the fields of biological sciences, physical sciences, materials science and nanotechnology Available modes for use: + Contact mode AFM (under dry and wet conditions) + Tapping mode AFM (under dry and wet conditions) + Other advanced modes of operation include = Force model AFM (under dry and wet conditions) * Conductive AFM * Piezo-force microscopy + Nano-indentation Available for external users Location: Room No. 3, Ground Floor, Common Instrumentation Room, Department of Biosciences and Bioengineering Contact: Prof. Shamik Sen, Department of Biosciences and Bioengineering, [email protected] wwew ited ac in/IRCC-Webpage/d /CentralFaclityRegistraton jsp 1‘This facility helps to map topography and morphology of samples. It can measure electrical, magnetic and piezo-electric behaviour of the surface using suitable probes. Make and Model: Asylum/ Oxford Instruments, MFP3D Origin Specification/Features: + Has a maximum scan area of 90x90 pim2 and minimum sean area is around 10 to 30nm. Maximum scan depth is 14m and ‘minimum can be a few nanometres + Good external noise isolation ‘+ High speed pulse measurement capability through tip Applications: + Material characterization applications including thin dielectric films, nanotubes, conductive polymers, and others + Characterize ferroelectric and Piezoelectric materials Available modes for use: + Contact mode + Non contact mode Pulsed Measurement of RRAM Sons Pulse response 100 ns Pulse response Location: Characterisation -2 Lab., Second Floor, Electrical Engineering Annex., Department of Blectrical EngineeringConfocal laser scanning microscope facility is used for high quality multi wavelength fluorescence image and able to, a) three dimensional information, b) Optical section through thick section, ¢) Co localization and d) Fluorescence recovery after photo bleaching. It has capability to collect ‘serial optical sections from the thick specimens or 3D viewing, It facilitates marginal improvement in both axial (z direction) and lateral resolution (XY plane). Make and Model: Olympus (IX 81) & Fluoview 500. Specification/Features: + Complies with wide range of laser light sources from UV to near infrared lasers, + Up to 5 detectors (4 fluorescence and 1 transmitted light) available for simultaneous acquisition + Fully motorized compact system when combined with Ix81 + Equipped with 3 laser port systems Available modes for use: + Disabled = Bleach Fluorescent and Bioluminescent Proteins Location: Room No. 310, Sophisticated Analytical Instrument Facility, ntre for Research in Nanotechnology & ScienceLASER SCANNING CONFOCAL FACILITY Laser scanning confocal microscopy employs spatial filtering techniques to eliminate any out-of- focus light in specimens with finite thickness and leads to the formation of high-resolution images. Make and Model: Carl Zeiss, LSM 780 cation/Features: Travel range of 250 jim. + Objectives: Plan-apochromat 10X/0.45 NA. (air), 20X/0.8 NA (air), C-apochromat 40x/1.2 NA (water) for FCS measurements, Plan-Apochromat 40x/1.3 NA (oil) iPlan- apochromat 63x/1.4 NA (oil), iPlan- apochromat 100x/1.4 (oil). DIC imaging is possible with the last three objectives. + Lasers: Artlaser, DPSS laser and HeNe laser, Titanium sapphire multiphoton laser + Zen 2012 acquisition software + Temperature and CO,-controlled Spe: incubation stage for long term live cell imaging. + Lifetime imaging through a FLIM attachment + Non de-scanned detector available for use with the multiphoton laser for deep tissue imaging Available modes for use: ‘+ Single colour and two-colour imaging and brightfield imaging + Zstacks + Time series (with or without Z-stack) Toxoplasma gondii showing endoplasmic reticulum (red), the cytosol (red) and the nuclei (blue) Available for external users Location: Ground Floor Equipment Facility, Department of Biosciences and Bioengineering, Contact: Prof, Santanu Ghosh, Department of Biosciences and Bioengineering [email protected] www ireesith.ac in/IRCC-Webpage/ nd CentralFacilityRegistration sp 04This facility facilitates TEM analysis of biological as well as soft solids on cryo mode or normal mode This facility works on cryo EM_ technique where biological samples are preserved in vitreous ice and imaged by EM at cryogenic temperatures. High contrast helps in imaging biological samples without staining, Make and Model: JEOL, JEM 2100, HRTEM Specification/Features: + With ultra-clean high vacuum for contamination free observation + Compustage for accurate specimen control. + Especially fits the need for cryo- observation, + Low temperature observation is possible due to installation of a specific cold-trap, which is effective for the preventing vapour deposition on cryo holders and their specimens while in the column, Applications: + Nanotechnology, Biology and Life sciences, Material science, Pharmaceutical analysis, Semiconductors. Available modes for use: + Room temperature imaging of dry samples + Cryo mode-Imaging of vitrified samples + EDS-Elemental mapping and quantification + EELS-Electron energy loss spectroscopy + STEM-Brightfield and darkfield images + Electron diffraction for crystallography studies Location: Room No. 110, Ground Floor, Silicate Lab, Department of Chemical Engineering.SPINNING DISC CONFOCAL MICROSCOPE FACILITY Spinning-disk confocal microscope facility is suitable for capturing fast changing phenomena, such as, imaging swimming bacteria, etc. Most powerful tools for live cell imaging. Make and Model: Yokogawa Electric Corporation, CSU-X1 Specification/Features: + Microscope and spinning disc: Zeiss observer Z1 inverted motorized and computer-controlled fluorescence microscope fitted with high speed microlens-enchanced Nipkow spinning dise + Objectives: 10X/0.45 NA (air), 20 X/0.8 NA (air), 40 X/1.2.NA (air), 40X/1.3 NA (oil), 63 X/14 NA (oil) & 100 X 1.4 NA (oil). DIC imaging is possible with all the objectives + Lasers: 488nm and 561 nm solid state lasers as excitation sources + Image acquisition at 50 fps at full resolution. + Suitable for observing fast dynamic cell processes + Two colour (alexa fluor 488 and rhodamine) fluorescence imaging possible. Available modes for use: + Single colour and two-colour imaging and brightfield imaging. + Zstacks ‘+ Time series (with or without Z-stack) albicans growth overtime Human Mesenchymal Stem Cells {hMscs) ona glass substrate with long, actin fibres (Stained with Alex flour 488) and strong focal Adhesion Points {Vineutn: Alexa flour586), Available for external users Location: Ground Floor, Equipment Facility, Department of Biosciences and Bioengineering Contact: Prof. Debjani Paul, Department of Biosciences and Bioengineering [email protected]. ‘www ieesitb ac in/IRCC-Webpage/end /CentralFacilityRegistraton jsp 06‘This facility enables to explore the native state of a low-contrast, beam-sensitive biological specimens, or other soft materials like polymers. Make and Model: FEI TECNAI, 12 BioTwin Specit Available modes for use: ffication/Features: TEM analysis of biological as well as soft solids can be done High contrast imaging With ultra-clean high vacuum for contamination free observation The compustage for accurate specimen. control. Low temperature observation Magnification: -22 to 3,40,000 Bright field Dark field Electron diffraction pattern Cryo-imaging Bacteriophage T4 Location: Lab. No. 306 & 309, Sophisticated Analytical Instrument Facility, Centre for Research in Nanotechnology and ScienceEnvironmental scanning electron microscope this facility is used to study the characterization (composition, surface topography, etc.) of heterogeneous materials and surfaces Make and Model: FEI, QUANTA 200 Specification/Features: + Resolution: 3.5 nm + Accelerating voltage: 0.2KV to 30kV + Emission current: 100uA ‘+ Magnification range: low 20X, High 50,000X Applications: + Life sciences + Material science/Metallurgy + Nanotechnology + Pharmaceutical + Medical sciences Available modes for use: + High vacuum mode + Low vacuum mode + Environmental scanning electron microscope mode EDS analysis Mappinglo} lis Une profile ofa) Locatior Room No. 305, Ground Floor, Sophisticated Analytical Instrument Facility, Cenire for Research in Nanotechnology and 08FIELD EMISSION GUN BASED SCANNING ELECTRON MICROSCOPE FACILITY Field emission gun based scanning electron microscope facility is used to obtain high resolution images of materials, cells, and tissues at the micron, sub-micron, and nanometer scale. This facility be integrated with a serial sectioning device to achieve sequential SEM images of materials following serial sectioning, Make and Model: JEOL, JSM 7600F Specification/Features: ‘+ Magnification: 25 to 1000000x Resolution : 1.2nm Accelerating voltage: 0.1 to 30kV Beam current: 1pA to 200nA at 15kV Working distance: 1.5mm to 1mm Variable temperature conduction cooled specimen stage (-185°C to 50°C), temperature stability of > 1°C + Fully automatic, high resolution sputter coater with platinum (Pt) target Cryo Preparation System (PP3000T): + Variable temperature conduction cooled specimen stage (-185°C to 50°C) + Gas-cooled nitrogen cold stage assembly (192°C to 50°C) + Temperature stability of > 1°C Applications: + Nanotechnology, Biology and Life sciences, Material science, Pharmaceutical analysis, Semiconductors. Available modes for use: + Cryo mode: Hydrated samples + Normal mode: Dry samples “Available for external users Location: Chemical Engineering- Sophisticated Instrument Laboratory, Near CAD Centre (TCS Area) Contact: Prof. Mahesh S Tirumkudulu, ‘Department of Chemical Engineering [email protected] ‘whet scin/IRCC Webpage/nd/ Centraal Registration jp 08FIELD EMISSION GUN-TRANSMISSION ELECTRON MICROSCOPE-200 kV FACILITY Field emission gun-transmission electron microscope is a 200kV high-resolution microscope with excellent analytical performance. This facility is used for analysis of elemental composition by X- ray energy dispersive spectroscopy and diffraction for crystal structure determination and crystallographic studies Make and Model : JEOL, JEM-2100F Specification/Features : + EM-20014 ultrahigh resolution Point resolution :0.19nm_ Lattice resolution : 0.1nm Magnification : 50x to 1,500,000 Ace. voltage : 160kV, 200kV Electron gun emitter : ZrO/W(100) Brightness : 24x 10°A/(cm2.st) Pressure : On the order of 10° Pa + Probe current : 20.5nA for Inm probe Available modes for use: + Bright field and dark field imaging + Diffraction and EDS analysis Applications: Materials science/ Metallurgy, Biological science, Nano technology, Ceramics, Pharmaceuticals, Thin films, Polymer ete. hea i Bright FieldImage Dark Fiee-Image Available for external users Location : Room No. 315 A, Ground Floor, Centre for Research in Nanotechnology and Science Contact : The Head, Centre for Research in Nanotechnology and Science [email protected] www jrcesitbacin/ IRCC-Wedpage/md/ CentralFacilityRegistraton sp 10FIELD EMISSION GUN-TRANSMISSION ELECTRON MICROSCOPE- 300kV FACILITY This microscope provides higher resolution for a given objective lens geometry, a higher beam current and better sample penetration compared to a 200kV TEM. It has the ability to image thicker samples when compared with lower voltage instruments. An effective increase in brightness, as well as beam current gives better analytical performance by improving signal to noise ratios. Make and Model: FEL, Tecnai G2, F30 Specification/Features: + Resolution: Point 2.0 A’, Line 1.0A° + Magnification: 58x to 1 million x + Accelerating voltage: 50-300kV + Lens: Super twin lens Available modes for use: Bright field and dark field imaging, diffraction analysis Applications: Nano science and Nano technology, Micro/Nano electronics, Thin films, Catalysis, Semiconductors, Corrosion, Polymer science, Energy science/ Engineering, Biological and Life sciences Available for external users Location : Room No. 315 A, Ground Floor, Centre for Research in Nanotechnology and Science Contact : ‘The Head, Centre for Research in Nanotechnology and Science office [email protected] www ssesitbacin/indexchtmlFluorescence microscope is a trinocular, fully motorized, PC controlled high performance research, microscope with transmittance and reflectance modes for optical imaging Make and Model: Carl Zeiss, Axio Imager ZI Specification/Features: Filter sets for fluorescence: DAPI, FITC, GFP, Cy3 and Rhodamine Light sources: Two halogen lamps (100W) each, for reflectance and transmittance and ‘metal halide lamp for fluorescence Other reflector modules: RGB filter set, dark field, cireular-DIC Camera: Peltier cooled CCD camera with 16- bit pixels (AxioCam HRm Rev 2.0) Axiovision software: 3D image visualization and analysis is possible Location Bio Sensors Lab, Nano - F Bldg, 7th floor, Department of Electrical Engineering,FOUR DIMENSIONAL X-RAY MICROSCOPE FACILITY Four dimensional X-ray microscope facility is a submicron resolution 3D X-ray microscope with insitu temperature controlled tensile and compression capability. This is a scintillator based multi-objective magnification X-ray microscope capable of multi-contrast imaging and 3D tomographicrendering. Make and Model Zeiss, Xradia Versa 520 Specification/Features: ‘+ True spatial resolution <700nm below 70nm minimum achievable voxel + Enhanced absorption contrast detectors maximize collection of contrast + Nondestructive X-ray microscopes uniquely characterize the microstructure of materials in simulated conditions-in situ-as well as the evolution of properties over time + Dual scan contrast visualizer provides flexible side-by-side tuning of two distinct tomographies at different imaging conditions or sample conditions. + Provides higher throughput imaging for flat samples such as those found with semiconductor packages and boards. Applications: + Materials research, + Natural resources + Life sciences + Electronics Available modes for use: High aspect ratio tomography mode B @ 2.2 mm Compression Available for external users Location: Room No. 103, Sophisticated Analytical Instrument Facility Centre for Research in Nanotechnology and Science Contact: Prof. Asim Tewari, Centre for Research in Nanotechnology and Science fdxm [email protected] ww wirecit acin/IRCC-Webpage/maé/CentralFaciltyRepstration jpSCANNING ELECTRON MICROSCOPE FACILITY ‘Scanning electron microscope facility (SEM) is able to scan a sample with a focused electron beam and deliver images with information about the sample's topography and composition, It is a highly flexible high definition imaging and analysis tool delivering fast, accurate and repeatable results acrossall samples Make and Model: Carl Zeiss SMT Ltd,, Zeiss EVO 18 Specification/Features: Filament: Tungsten Secondary e-image resolution: 50nm (depends on sample) BSD detector Tilt: 0-60 degree Rotation: 360 degree EHT: 200V-30kV Magnification: Up to 50K~100K (depends on sample) Available for external users Location: Micro 1 Lab, Ground floor, Electrical Engineering Annex Building, Department of Electrical Engineering Contact: Prof. Dipankar Saha, Department of Electrical Engineering, [email protected] ‘wwwenepresitbacin roySCANNING PROBE MICROSCOPE FACILITY Scanning probe microscopy facility allows researchers to observe and manipulate molecular and atomic level features. This technique helps to study a3D profile of the surface on a nanoscale. Make and Model: Agilent, Switzerland, Model: 5500 Specification/Features: + Highly modular microscope and scanner + Optional integrated environmental & temperature control + Easy sample access with top-down scanning + Environmental chamber allows imaging in. controlled atmospheres. Ports and fittings enable gases, liquids and probes to be introduced to the chamber + Scanners ¥ Lateral range X-Y imaging area up to 901m square; Lateral noise X-Y 0.05nm Y Vertical (Z) range | Sum; Vertical (Z) noise Level <0.05nm Applications: + Life science + Materials science + Polymer science + Electrical characterization + Nanolithography + Nanografting, + Biotechnology Available modes for use: + Atomic force microscopy-contact, non- contact and tapping mode + Lateral force microscopy-stiffness, frictional forces ‘+ Magnetic force microscopy-changes in the phase of the cantilever due to interatomic magnetic force + Scanning tunneling microscopy + Electrostatic force microscopy-Phase response of the cantilever induced by the interaction of the conducting tip and the electrostatic field of the sample surface + Kelvin force microscopy-contact potential difference between tip and sample Available for external users Location: ‘Nanoindentation Laboratory, Basement, Department of Metallurgical Engineering and. Material Science, Contact: Prof. Dipti Gupta, Department of Metallurgical Engineering and Materials Science [email protected] ‘wwwreith ac in/IRCC-Webpage md CentralFacilityRegitration jsp 15Scanning probe microscope facility is used to characterize surfaces and structures at nanoscale using variety of physical probes. The facility includes atomic force microscope (AFM), scanning tunneling microscope (STM) etc. Make and Model: Bruker (Previously Veeco), Multimode Nanoscope Vv jication/Features: + Versatile multimode system for high resolution microscopy + Vibration isolation table & acoustic isolation hood + Scan size: 0.4 jum to 125 um + 10x optical microscope for selected area AFM + Image processing and analysis software Applications: + Surface topography and roughness + Particle size analysis + Atomic resolution imaging + Electrical mapping + Magnetic mapping + Mechanical properties Available modes for use: + Contact mode AFM + Tapping mode AFM + Lateral force microscopy + Force modulation microscopy + Magnetic force microscopy + Electric force microscopy + Surface potential microscopy + Conductive AFM + Electrochemical AFM + Scanning tunneling microscopy + Scanning tunneling spectroscopy + Low current STM + Electrochemical STM + Nanoindentation STM Analysis STS Analysis, Current Voltage “ reat “Noliage | isterential Conductance characteristics Location: Room No. 14, Department of PhysicsTEXTURE AND ORIENTATION IMAGING MICROSCOPE FACILITY 20 Quanta Fel Quanta 30 FES This facility in-depth study of crystallographic orientations and for micro-texture measurements Make and Model: + Fei Quanta 3D FEG + Fei Qunata 200HV SEM with TSL-EDX OIM system + Panalytical MRD system Specifications/Features: + Bulk texture + Residual stress (spot size up to 50mm with, laser tracking) Orientation imaging microscopy maps + EDAX, WDX, FIB and pico-indentation Available modes for use: + Solid state Nova Nano Sem 450 Available for external users Location: Room No. 7, Ground Floor, Department of Metallurgical Engineering and Materials Science Contact: Prof. I. Samajdar, Department of Metallurgical Engineering and Materials Science [email protected] wwewriceitb ac webnew/ REDSpectrum/ national faci sshimi#0IM v7Transmission electron microscope (TEM) is capable of imaging with 2.4A' resolution. It is operated at 200kV and is optimized for bright field/dark field imaging and diffraction analysis. Make and Model: Philips, CM 200 Specification/Features: + Resolution: 244" Allows large tilt angles of the specimen Operating voltage: 20-200kV Magnification: 25xto 750Kx Lens: Super twin lens Available modes for use: Bright field and dark field imaging, diffraction analysis. Applications: Materials science, Metallurgy, Biological science, Nanotechnology, Ceramics, Pharmaceuticals Location: Room No. 311, Ground Floor, Centre for Research in Nanotechnology and ScienceIt is used for precision thinning of samples (at final stages) to electron transparency for imaging with transmission electron microscope (TEM). Make and Model: GATAN Inc. USA, Model 691 Specification/Features: + Precision ion polishing system used to polish/thin down the samples to 80-100nm, thin regions for TEM imaging. + Itused to do polishing of most kinds of samples e.g. metallic, semiconductors and composites etc for TEM with energy 5keV and 40-50A current under dual mode. + It can do polishing of heat sensitive samples under chill conditions with the use of liquid nitrogen, Applications: + Used to make thin samples, which are electron transparent when viewed with a ‘TEM. + Houses equipments that can make planar, as well as cross-sectional TEM samples from most materials types. Available modes for use: + Planar samples and cross sectional samples under dual mode. f MgO-MgAl204 bulk ‘ceramic alloys’ developed via ‘solic state preciptation’ Location: Room No. G-13, Ground Floor, Department of Metallurgical Engineering and Material ScienceTRANSMISSION ELECTRON MICROSCOPY - SAMPLE PREPARATION FACILITY This system contains four units tune piezo electric '™ cutting tool, dise grinder, precision ion polishing le system and dimple grinder to prepare samples for Transmission electron microscopy (EM) analysis. Samples made of Si/Ge/Ga Ascanbe processed. Make and Model: 1) Tune piezo cutting tool, Gatan Model 601 2) Dise grinder, Gatan Model 623 3) Dimple grinder, Gatan Model 656 4) Precision ion polishing system, Gatan Model 691 Specification/Features: 1) Cross TEM: Tune piezo cutting tool + Rectangular cutting tool is used to cut out the wafer sample (34mm) + Cylindrical tool is used to cut the cylindrical sample containing sample and dummies (mm) 2) Cross TEM: Disc grinder + Used to cut the discs of 250-400microns + Rate of cutting of 400microns thick discs of silicon is 0.0040 in/min 3) Cross TEM: Dise grinder + The sample thickness from 400microns is brought to about 25-30microns by grinding the sample at the interface + Diamond paste of 2-4um is used for friction, 4) Cross TEM: Precision ion polishing system + Thickness from about 25-30microns is brought down to near Imicron + Bean energy range used is 2kev to 5kev + Gun angles can be set to mill the sample at a specific angle to control the thinning Available for external users “Floor, Electrical Engineering Annex Building, Department of Electrical Engineering. Contact: Prof. Anil Kottantharayil, Department of Electrical Engineering [email protected] ibn ac in iba /ndex php inrastructurelayouteditidet8 20ARGON - ARGON GEOCHRONOLOGY FACILITY This facility for"Ar-"Ar ges and thermo chronology is a multicollector noble-gas mass. spectrometer. This facilitates dating it variety of samples that contain reasonable amounts of potassium. Make and Model: Thermo Scientific Argus VI Specification/Features: + Controlled heating at variable temperatures up to 1800 degree Celsius + Used for bulk sample analysis. + A vacuum crushing system for analyzing trapped gases. + Types of samples: = Whole rock = Mineral ensemble Single grain Fluid inclusions The Gas extraction systems: + Conventional dual vacuum resistance heating, + Laser ablation and laser heating + Insitu vacuum crushing Applications: + Geo and thermochronology + Ore petrology + Fluid and melt inclusion studies + Geothermal research Available modes for Use: + Multi collector mode + Peak switching ion counting mode + Combination mode Argon Laboratory, Department of Earth Sciences Contact: Prof. Kanchan Pande, Department of Farth Sciences ae en ean penny eat net ere ee atATOMIC LAYER DEPOSITION SYSTEM Atomic layer deposition system uses reactive chemistry to generate thin films of one atomic layer thickness at a time and has a remote inductively coupled plasma source to allow for low temperature depositions. Make and Model: Cambridge Nanotech, Fiji 200 Specification/Features: + Type of deposition: HfO, Al,0, TiO, TiN, AIN + Type of substrate: Silicon, Germanium ‘+ Temperature for deposition: 100 to 300°C + Process gas used: Oxygen, Argon, Nitrogen, Ammonia ears Location: Nano Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering Contact: eae eee Perens TSW Cae) toni acini 2bw yo e ae FV Tornoe Rebs a) cy This system is a multiple independent-channel testing system used for the lithium-ion batteries characterisation. Make and Model: Arbin Instruments, Arbin BT2000 Specification/Features: + Experiments can be performed in the temperature range from 20-80°C + Battery cycling performance for secondary and primary batteries + Potentiostat and galvanostat provides voltage and current control for all charging and discharging requirements + Can handle both rechargeable and primary battery applications for all material chemistries Reroeoe Location: Flectrochemical energy laboratory (short circuit lab), Nanoelectronics Building Department of Energy Science and Engineering rnd Prof. Sagar Mitra, Department of Energy Science eee Baar oan SO et eatBIO - SAFETY LEVEL 2 FACILITY This facility helps to perform experiments on infectious microorganisms (viruses as well as bacteria) that are classified as Category-2 pathogens by Department of Biotechnology, Ministry of Science & Technology, Govt. of India It maintains desired level of negative pressure and has multiple layers of HEPA filter based exhaust systems for higher containment. Make and Model: Klenzaids Contamination Control Pvt. Ltd. fication/Features: + Animal cell culture room + Bacterial culture/Infection room + Biosafety cabinets (Iype-lI A2 and Type-Il B2) ‘+ Incubators to grow mammalian cells as well as bacteria + Centrifuges + -80'C freezer to store pathogenic microorganisms + Autoclave for bio-hazard disposal Available modes for use: For Category-2 pathogens only oe Location: Room No. 201 Department of Biosciences and Bioengineering, ne: eee Onn Department of Biosciences and Bioengineering Peery eer ey concn vat eae erates 24‘The elemental CHNSO analyser finds utility in determining the percentages of Carbon, Hydrogen, Nitrogen, Sulphur and Oxygen of organic compounds, based on the principle of "Dumas method’, Make and Model: ‘Thermo finnigan, Italy, FLASH EA 1112 series SpecificationyFeatures: Estimation of CHN/CHNS/O in percentage level to high concentration level. Available modes for use: + CHNS + Oxygen CARBON, HYDROGEN, NITROGEN, SULPHUR AND OXYGEN ANALYSER FACILITY Rg oo Location: Room No. 112, Ground floor, Centre for Research in Nanotechnology and Science ey Sscre eadCHEMICAL VAPOUR DEPOSITION SYSTEM Chemical vapour deposition system is a cluster tool which is currently configured with three process chambers for sputter deposition of metal thin films ina state of the art, CMOS manufacturing process. Make and Model: Applied Materials Inc., FEP Centura Specification/Features: Three chambers include decoupled plasma nitridation (DPN), Polygen (MOCVD) and RTP units. + Wafer Size: 8” . 1, PH, NH, B, HN, ‘+ Substrate temperature: upto 800°C + Doping and intrinsic polySi deposition, and annealing can be done ArNF, Peo Location: Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering er Peat eC Las aes Bee can eat Prof. Udayan Ganguly, Department of Electrical Engine Renee st sar ny pearance 26CHEMICAL VAPOUR DEPOSITION SYSTEM ‘The system enables the chemical vapour deposition at low temperatures. Can deposit silicon nitride and amorphous silicon. Make and Model: ‘Oxford Instruments, Plasmalab 100 Specification/Features: ‘The Following gases are used: Silane for Si,N, , a-Si Nitrogen for Si,N, Ammonia for Si,N, Argon for Plasma. CE,/O, for Plasma clean gas Load lock chamber vacuum: 10°Torr. Process chamber vacuum: 10° Torr. Available modes for use: The types of Si and glass substrates allowed are 2", 4", 8" small pieces of wafers. Location: SB scion nor SCRE aah ‘Department of Electrical Engineering eee Sear eb cree treet Department of Electrical Engineering res eerieDIFFUSION ‘This tool is capable of carrying out diffusion in silicon substrates using liquid sources. The furnace hhas three zones and can reach to a temperature of, 12000°C. Make and Model: Protemp, USA, SIRIUS™ PRO-200S Specification/Features: Liquid dopant sources: POCI, BBr, System temperature capal 00-1100°C Temperature repeatability: #1.0, type "R" TC 18" (46cm) thermal flatzone Temperature stability full length of flatzone 1.00C + Mass flow controlled gas systems + Liquid source temperature controllers on. POCI, and BBr, tube levels + Digital process and temperature controllers per tube level + HOST computer included stainless steel scavenger per tube level + Digital temperature/ process sequence controller Available modes for use: Ne-type deposition (POC), dry oxidation, P-type deposition (BBr,) Grote Locatior NCPRE Fabrication Lab, 2nd Floor, Nanoelectronics Building, Department of Electrical Engineering oa eects Dee esos arena pees Soccer etecy 28DIGITAL SIGNAL SCOPECORDER SYSTEM The instrument is a portable data acquisition recorder that can capture and analyse both transient events and trends upto 200 days. Using flexible modular inputs, it can combine measurements of electrical signals, physical (sensors) and CAN/LIN serial buses, It can be triggered on electrical power and also other calculations (signals) in real-time. Make and Model: ‘Yokogawa, DL850 Specification/Features: Flexible inputs and built in signal conditioning for voltage and current ‘measurement; sensor outputs; temperature; logic inputs and CAN/LIN with expandable input modules up to 16 channels Real time hard disk recording for measurement of data Capability to capture high speed transients using dual capture Large and fast acquisition memory up to 2G point and enables high sample rates of up to 100MS/s on multiple channels simultaneously Automatic waveform parameter measurement like RMS value, peak value, frequency, ete. with cycle statistics and cursor based measurements User defined computations like FFT analysis Location: Power Electronics Lab-I, Ground Floor, Department of Electrical Engineering ens va em LOT Pee eea seed eee Sse 29LUBE) PNB Cee alg This alignment system helps in high-precision single and double sided alignment for optical lithography It also aids in wafer-to-wafer alignment for wafer bonding applications, Make and Model: EV Group, EVG620 Specification/Features: + Exposure modes: hard, soft, vacuum contact Separation distance: 0-300microns Wafer thickness: 0.1-10mm. Lamp: 500W Hg lamp Wavelength range: 350-450nm Alignment accuracy: 0.5micron for top side and 1.0 micron for bottom side + Minimum feature size achievable: 2micron Availabl So Location: Nano Litho Lab, Electrical Engineering Annex Building, Department of Electrical Engineering, ares ea eee Deeg eee ses cree one eee eee ee 30EDGE ISOLATION TOOL Edge isolation tool is used for isolating the edge of diffused Si wafers and dry texturing, Make and Model: BSETEQ, NT-2 Specifications/Features + Wafer loading capacity: single wafer to stack of 150 wafers + Wafer size: 125x125mm, 156x156mm, smaller wafers + Gases:SF,CF, /O,N, + RF powersupply: 600W, 13.56MHz + Platform: rotating modem Location NCPRE Fabrication Lab, 2nd Floor, ‘Nanoelectronics Building, Department of Electrical Engineering eee Prof. Anil Kottantharayil, Department of Electrical Engineering poser end Recent!ELECTRICAL DISCHARGE MACHINING FACILITY The wire electrical discharge machining is a thermo-electrical process in which electrically z conductive work material is eroded by a series of ne separate sparks between the tool (wire) and work material, separated by a thin film of dielectric fluid (distilled water oil) Make and Model: Accutex AU-300i Specification/Features: + Maximum work piece size (LxWxH) mm: 765x535x215 Maximum work piece weight:300kg, (XxY) stroke (mm): 350x250 UxV stroke (mm): 80x80 mm Wire spool weight: 10kg, Wire material: Brass Machine weight: 3000kg, Water system capacity: 501 Available modes for use: Submerged mode Location: Mechanical /Machine tools lab/S3 bay, Department of Mechanical Engineering, eee bay Deed Come oon any Sear 32ELECTRICAL DISCHARGE MACHINING FACILITY - II The wire EDM is a thermo-electrical process in Which electrically conductive work material isto be croded by a series of separate sparks between the tool (wire) and work material, separated by a thin film of dielectric fluid (distilled water oil). Make and Model: SUZHOU BAOMA, BMW-3000 Specification/Features: ‘+ Maximum work piece size (LxWxH) mm: 380x525x300 Maximum work piece weight: 300kg, XxY stroke (mm): 250x320 Wire spool weight: 5kg Wire material: Molybdenum. Machine weight: 1600kg Water system capacity: 551 Available modes for use: Flushing mode Location: Machine Tools Lab, $3 bay, Department of Mechanical Engineering one Prof, Suhas S. Josh Department of Mechanical Engineering Sree PeeryELECTRON BEAM EVAPORATOR SYSTEM The system is an electron beam evaporator for depositing metals. Stacking of metal layers can be done without breaking vacuum, Make and Model: Oerlikon Solutions, Univex 350 Specification/Features: + Box coater with 350mm wide vacuum chamber + High vacuum pump connection allows to achieve 10°mbar PLC controlled system operation Allowed substrates: GaN Maximum substrate diameter: 320mm. Ti, Al, Ni and Au can be deposited Available for external ui Location Micro 1 Yellow Room, Ground Floor, Blectrical Engineering Annex Building, Department of Electrical Engineering, ere ee ny eteEy Preteen anor Oe eee 34Electron beam lithography system is used for ultra- high resolution patterning, pattern inspection and dimensional metrology. It has the ability to handle wide range of samples including up to 8 inch wafers. Make and Model: Raith GmbH, 150-Two Specification/Features: TFE filament with Beam size < 2 nm at 20kV Beam current range 5pA-20nA, Beam energy 100 eV-30keV Stage travel range 150x150x20mm Current density < 20,000A//em Current stability < 0.5 %/Shours Minimum line width < 20nm. Stitching accuracy < 40nm (mean +3 sigma) Overlay accuracy < 40nm (mean +3 sigma) peso tT Location: Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering. eee Prof. Dipankar Saha, Peres Pree eer ete caer est ey eee ees eee eee onearardETCH SYSTEM Etch system is a cluster tool which is configured with two process chambers for reactive ion etching (RIE) and plasmaashing. Make and Model: Applied Materials Inc., Eich Centura Specification/Features: Two chambers include RIE and plasma asher units + Wafer Size: 8” + Gases: O, Ny SF, BCI, CI2, CHF, + Gate stack etching (Al, Ti, Si, and SiO,) and plasma ashing of resists can be done. fee Location: Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, roms Sea Tere Department of Electrical Engineering Pesaran feed een et ee eee 36FLUORESCENCE ACTIVATED CELL SORTING / FLOW CYTOMETER FACILITY Fluorescence activated cell sorting/Flow cytometer facility enables sorting of heterogeneous mixture of biological cells depending upon the specific light scattering characteristics and/or fluorescent characteristics of each cell in population. Make and Model: Becton Dickinson, FACS Aria SORP Specification/Features: + Designed to sort cells at high flow speed. + The sorted cells can be collected in a variety of vessels including 15ml Falcon tubes for 2-waysort, 5ml FACS tubes for 4-way or 2- way sort & 12 well, 24 well, 48 well & 96 well plates for plate sort. The collection vessels should contain media or buffer. + Four lasers-UV laser (355nm) Blue (488nm), Yellow-Green (561nm) & Red laser (633nm). + 13 parameters can be detected including scatter properties. Applications: + Cell cycle analysis Apoptosis assays Immuno-phenotyping Intra-cellular staining Cell viability assay Available modes for use: + Cell segregation based on scatter/ fluorescence properties Availabl or external uf Location: Room No. 113, Centre for Research in Nanotechnology and Science en Peer RCCL on ears [email protected] eneeorriee See aS Oceans Dee etGEOTECHNICAL CENTRIFUGE FACILITY This facility is used for basic and applied research on modeling of geotechnical structures. Make and Model: Indigenously fabricated and commissioned at IIT Bombay Specification/Features: + Configuration: Beam type + Platform radius: 4.5m + Model area: 1.0m x 1.2m (up to 0.66m height) 0.7m x 1.2m (up to 1.2m height) + Acceleration range: 10 gravities to 200 gravities Payload: 2.5 tons at 100 gravities Capacity: 250 g-tons Run-up time to 200 gravities: 6 minutes In-flight balancing range: 0 to + 100kN, In-flight balancing time: 60 seconds Good swing-out at g-level Available modes for use: Allows testing of 1/N times reduced small-scale physical models of geotechnical structures subjected to various types of loadings at N times gravity (N = scale factor or gravity level). Centrifuge experiments combine in them labour- intensive model preparation for faithful simulation of prototype conditions and skill-intensive high- precision instrumentation and data acquisition. Hence, there is a requirement of collaborating with a faculty, who has an adequate exposure in centrifuge-based physical modeling at IIT Bombay. Location: Behind Heavy Structures Laboratory, Department of Civil Engineering arene Sa ACR eT Perens arse ersten traits Cos GET erry ee ee ey 38GLOVE BOX SYSTEM Use of glove box allows for research and development of emerging technologies including lithium batteries, chemical, organic light-emitting diode/ polymer light-emitting diodes Make and Model: M. Braun Inertgas-Systeme GmbH, Germany, Unilab Plus glove box workstation Specification/Features: + Stainless steel design with polycarbonate window + Closed loop recirculation + DN40KF ports and electrical ports + Large ante chamber with sliding tray + Unilab inert gas purification with foot switch + Vacuum pump + High efficiency box filters Hepa H13 + Analogue box pressure sensor + Adjustable shelving + Light hood with anti-reflection film Available modes for use: + Inert gas atmosphere to fabricate lithium. ion, sodium ion and magnesium ion batteries + Keeping moisture sensitive chemicals, preparing lithium and sodium based electrolytes for both rechargeable and primary batteries Location: Electrochemical Energy laboratory (short circuit lab) Department of Energy Science and Engineering Contact: eae Deen Ener gS eae Ceara @iitb.ac.in Aad eaterGLOVE Bt Glove box and metal evaporator facility is used for organic device fabrication e.g. organic solar cell, organic light emitting diode, organic field effect transistor, organic sensor, organic photo detector and perovskite optoelectronics devices. Make and Model: MBRAON, MB20G+MB-EVAP Specification/Features: +O, and H,0 level at 0.1ppm to prevent degradation of organic materials in open atmosphere. + Spin coater with step and dynamic spin coating in N, ambience. ‘+ Metal evaporator connected with spin coater glove box via big anti chamber in order to transfer device from one glove box to another without exposing to atmosphere. + In metal evaporator glove box, Au, Ag, Al, Ca, MoO, are deposited for top electrode contact. + Metal-evaporator connected with two vacuum pumps: Dry rotary pump and turbo molecular pump (TMP). + Maximum vacuum 10°mbar. ero mo Location: EA 118, Organic Device Lab, Electrical Engineering Annex Building, Department of Electrical Engineering, ee eee cee Peas Sao ee eee eeIMAGE BASED SPRAY DIAGNOSTIC FACILITY This facility helps in studying characterisation of fuel sprays using laser based optical diagnostics This system works based on the two optical techniques i.e. Particle image velocimetry (PIV) and shadowgraphy technique (backlighting). Make and Model: LAVISION, Qm1 Specification/Features: + Complete hardware control using DaVis, software + Flexible beam delivery and sheet forming optics + Accurate hardware and size calibration ‘+ Comprehensive on-line image evaluation and data processing + Flexible definition of image acquisition sequences including delays, trigger bursts and synchronizing to external events + 2D and 3D visualization of image data, combination of vector data and images, extraction of profiles, user defined color lookup tables, variable color resolution and zoom function + Smoothing and many other filter operations for image and vector data (Gauss, Laplace, Sobel, Erosion, customizable filters ..) + Data import / export to TecPlot, ASCII, BMP, JPG, TIFF, VI, PS, FTS, Applications: ‘+ Investigation of combustion phenomenon in flames, burners, jet engines, furnaces, propulsion systems, chemical reactors, shock tubes + Investigation of droplet or particle size distributions in various applications such as spray atomization, bubbles, particle flows, visualizing particles and droplet and gathering following properties Available modes for use: + Particle size velocimetry Combustion Research Laboratory, + Shadowgraphy Department of Acrospace Engincering Peete en crt Pee eee ester etree ce at eeeLOCO UR Are In this liquid helium plant, the helium gas is compressed to high pressure of ~230psi and allowed to expand in the cold box. With proper heat exchangers and valves, the helium gas finally cools below 4.2K and gets liquefied. This liquid is collected in a separate container (helium dewar) for storage and transfer. Make and Model: LINDE Cryogenics USA, Model 1410 Specification/Features: ‘+ Pure gas with/without pre-cooling : 35/19 lit/hour + Impure gas with/without pre-cooling : 25/ 15 lit/hour Applications: ‘+ The liquid helium produced can be used for cooling purposes down to 2K for doing various experiments at low temperatures Liquid helium can also be used for cooling superconducting magnets such as the ones used in NMR machines, MRI machines, ete. Location: Room No. 1, Department of Physics (rend RON AC Aon as Percent eae eet eet eee Kee ere a2Helium plant: Helium gas cools below 4.2 K and gets liquefied with heat exchangers and valves. This liquid is collected in a separate container (helium dewar) for storage and transfer. Nitrogen plant: Nitrogen is separated from compressed ambient air (consisting of 78% nitrogen) using adsorption desorption process. Subsequently, the nitrogen is condensed and stored as liquid in storage container under positive pressure. Make and Model: Helium plant : LINDE, 1410 Nitrogen plant: Stirling Cryogenic Pvt. Ltd, StirLIN-4 Specification/Features: Nitrogen plant Cryogenerator Cryogenerator power 45kW Production capacity SOlph Refrigeration capacity 4AKW@66K Working gas Helium Filling pressure 22dar@S0Hz Liquid nitrogen purity 299% Helium plant Liquefier Expander type Reciprocating RPM ~200 Main Compressor 3 stage, 4 cylinders, reciprocating Pressure ratio: ~17 Recovery Compressor 3 stage, 3 cylinders, reciprocating, Pressure ratio: ~140 Chiller Cooling capacity 48kW Refrigerant R47C Suction/Discharge pressure 4.2/14bar Suction temperature 17 LIQUID HELIUM AND NITROGEN PLANT cryoprobe Re-condensation of helium Applications: + Liquid nitrogen is used for Low temperature sampleanalysis + Liquid helium is used for cooling purposes down to 2K for doing various experiments at low temperatures. Liquid helium is also used for cooling superconducting magnets such as the ones used in NMR machines, MRI machines, etc Location: Room No. N-4 & 5 Bay, Refrigeration and Cryogenics Lab, Department of Mechanical Engineering, aren eae errs Department of Mechanical Engineering peelsLIQUID NITROGEN PLANT Liquid nitrogen is produced industrially by fractional distillation of liquid air and is utilised for various experimental purposes. Make and Model Stirling, StirLI 1 Compact Specification/Features: + Capacity: 10 1/h at atmospheric pressure + Purity: >99% + Liquid nitrogen storage capacity: 250litres + Liquid nitrogen production start-up time: <20min + Maintenance interval: Once in a year Location: Room No. 318, Ground Floor, Centre for Research in Nanotechnology and Science Contact: ssc y ‘entre for Research in Nanotechnology and Breer ety Peres eSey een iitMAGNETO RESISTANCE MEASUREMENT SYSTEM This physical property measurement system is an. integrated cryogen-free system for the measurement of physical properties at low temperatures and high magnetic fields, Make and Model: DynaCool, 9T Specification/Features: + 9 Tesla cryogen free PPMS base system with a long magnet and power supply + Temperature range of 1.9K - 400K + Measurement options: i) Vibrating sample magnetometer ii) Heat capacity iii) Electrical transport Iv) Thermal transport \vailable for external users Location Characterisation Lab 2, 2nd Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, ae ee nero} Perse secant Seay ae a eee fee ete)MICRO SYSTEM ANALYZER FACILITY Micro. system analyzer facility is for static and dynamic characterization of micro-components. It can be used for non contact measurement, analysis and visualization of structural vibrations (both in- plane and out-of-plane) and surface topography of microstructures. Make and Model: Polytec, MSA 500 ppm Specification/Features: Surface metrology: + Envelope evaluation (for rough surfaces) or phase evaluation (even more accurate, for smooth surfaces) + Facilitates evaluation of certain portions of surface. ‘+ Automation and customization of routine measurements, ‘+ Data can be exported for CAD comparison and reverse engineering Scanning laser doppler vibrometry and stroboscopic video microscopy: + Non contact, zero mass loading, + Full-field vibration mapping and broadband, out of plane frequency response information in real time. + Versatile vibration and geometry data import and export interfaces to validate FE models. ‘+ Submicron-sized laser spot probes microstructures + Laser dimmer for optimized measurement conditions Application: * Obtain surface profile, form and shape information of the microstructure + Non contact measurement, analysis and visualization of ‘in-plane’ and ‘out-of-plane! vibration response at resonance as well as, transient states, + Amplitude and phase data for vibration response = Transient measurements Available modes for use: + Ineplane and out of plane vibration analysis of micro-components like micro cantilevers, diaphragms and similar structural components, etc. + Surface topography measurement fee Location: Suman Mashruwala Advanced Micro-Engineering Laboratory, Department of Mechanical Engineering fern Prof. Prasanna S. Gandhi, Penta ennai eer Tee a eee eee 46MICROCOMPOUNDER AND MINI INJECTION MOULDING FACILITY The microcompounder has a capacity of making polymer nanocomposites. Mini-injection molding machine can subsequently prepare tensile/ flexural specimen from the blends/nanocomposites. Thus, the facility offers an option to effectively blend as well as mold smaller quantity of polymeric materials, and prepare test specimens for tensile and flexur Make and Model: DSM Xplore™ Sm’ twin-screw extruder Specification/Features: + Capacity of mixing few grams of polymeric materials (up to Smil) during melt- mixing of polymer blends or making polymer nano- composites. + Extruded strand (diameter ~2mm) Applications: ‘+ Thermoplastics (with or without fillers or additives) are processed above their melting point (up to 350°C) in the micro- compounder Available modes for use: + Mixing of 2 or more polymers + Mixing of polymers with additives + Molding in different cavities + Filament extrusion Neonsorsi2 MWNTs rich areas Available for external use Location: Polymer Engineering Lab, Department of Chemical Engineering, aren Prof. Rohit Srivastava, et ch PSS oeeeny Sean eaters eee ae elenaMODULE SOLAR SIMULATOR FACILITY The solar simulator helps to test large area PV ‘modules. This simulator can produce the AM 1.5G solar spectrum to characterise PV modules. Make and Model Spire USA, SPISUN 5600SLP BLUE Specification/Features: Classification: A+A+A+ Spectral range: 300nm-1100nm. Pulse duration (adjustable): 20-130ms Range of light intensity: 200-1100 W/m’ Maximum size of module: 2mx1.3m Available modes for use: L-V curve sweep from V,, to 1. LV curve sweep from I. to V. Cea Location: NCPRE Solar Module Lab-1, Room No.: Transit Building, Ground Floor, Department of Electrical Engineering, mere Prof. Anil Kottantharayil, Department of Electrical Engineering potest eal Reser!MOLECULAR BEAM EPITAXIAL GROWTH S' Three molecular beam epitaxial (MBE) growth systems are available which can grow different kinds of samples (III-V compounds, III Nitrides, Si, Ge, Sn). MBE works in ultra high vacuum. It’s slow deposition rate allows the films to grow epitaxially. Make and Model: Riber France, EPINEAT, Compact 21/N, Compact 12 Specification/Features: + Ultra high vacuum: 10" Torr + Dopant sources available (P-type and N-type) + Tools for in-situ monitoring available (RHEED, QMS, RGA) + Diameter of wafers that can be grown: 1",3"4" + Optical pyrometer available to detect surface temperature of substrates, + Effusion cells (sources): In, Ga, Al, valved As cracker, N,, Si, Be, Mg, Ge, B, Sn, Sb Location: MBE Clean Room 1, Nano - E building, Ground Floor, Department of Electrical Engineering meee Sea een e cacy Department of Electrical Engineering subhanandachakrabarti@ yahoo.com eae ee pees sa ecerce reer ssnT ete eeay eae Ne ee Perea gers Sear eee een tee ice Pere reNanoindentation is the technique for assessing the mechanical properties of materials at the nano/ micro scale. Hardness is measured as the area of the contact at the maximum load and reduced modulus iscalculated from the slope of the load-displacements graph obtained. The Young's modulus of the material can be calculated if the poison's ratio of the material is known. Make and Model: Hysitron Inc Minneapolis USA, TI-900 Specification/Features: Load control and displacement control capabilities + The tip used for indentation is also used for scanning the sample. + Can be used for testing thin films and small structures Applications: Bulk materials, + Multiphase materials + MEMS devices + Nanostructured materials + Protective coatings + Depth profiling of layered materials Available modes for use: + Indentation : Used primarily for measuring hardness and reduced modulus, + Scratch tests : For measuring coefficient of friction, + Nano-DMA : Measurement of the storage and loss moduli for polymers. Locatio: Room No. - Room No, B-14, Basement, Department of Metallurgical Engineering and Materials Science 50Photoluminescence spectroscopy, a characterization method for the materials (like III-V semiconductors) is a contactless, nondestructive but at the same time very effective and useful experiment to investigate electronic structure of materials, Make and Model: Princeton Instruments Acton, SP2300 Specification/Features: Materials: I1I-V compounds + Sample size: 2mm minimum to 10mm. maximum wafer. + No liquid/powder volatile compounds allowed. + Temperature range: ~19K to 300K + PL wavelength range: 350nm to 950nm and 900nm to 1600nm. + Excitation wavelength: 532nm upto 25mW + Spectral resolution: 0.05nm to 0.Inm depending on wavelength Location: Micro 2 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, 51PSO Oa RMU ae Physical property measurement system is used for the magnetization measurement of a matter. Magnetic moment/Magnetization/DC susceptibility / AC Susceptibility of a sample can be measured as a function of temperature and/or magnetic field Make and Model: Quantum Design, USA. SQUID VSM & PPMS VSM, Specification/Features: VSM: ‘+ Magnetic field (superconducting magnet) :- 90kOe to + 90kO€ + Temp. range (stable or continuous): 1.8K- 400K + Resolution : 10°emu + Sample : bulk/thin film/powder SVSM: + Magnetic field (superconducting magnet) : ~ 7OkOeto +70kOe 20 og + Temp. range (stable or continuous): 1.8K- 400K Size dependent Magnetization Shape dependent Magnetization + Resolution:10°emu + Sample: bulk/thin film/powder Available modes for use: Two types of measurements possible: +” Mvs Hi Field is varied at a fixed temperature and magnetization is measured + Mvs T: Temperature is varied at a fixed field roe Location: Room No. 10, Ground Floor, Department of Physics Contact: Prof. C. V. Tomy, Pega sed Se ees etal ee eerie enn ee ea 52PROFILOMETER SYSTEM The profiler system is an advanced thin and thick film step height measurement tool. This tool can profile surface topography as well as measure surface roughness. It also has thin film stress analysis software and 3D mapping capabilities. Make and Model: Bruker Dektak, XT Specification/Features: ‘+ Equipment compatible with 2”, 4”, 6” and 8” wafers + Stylus, LIS3, 2um radius-type B + Scan length: upto 30mm + Vertical resolution: less than or equal to 1A" for 2um vertical step + Step height repeatability: 6" or lower for a1 um step + Stylus size: 2um and 12.5um + Capable of measuring samples up to 50mm thick + Field of view: Imm to 4mm. + Profile auto-leveling and stitching software + Stylus force: Img-15mg Micro 2 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, eres jae a Department of Electrical Engineering Peres nee eC era oon aePUNE s sels ea alae The photovoltaic characterization system can be used for external quantum efficiency (FQE) measurement and internal quantum efficiency {IQE) calculation with the help of reflectance measurement, ‘The system can be used for reflectance transmittance measurements Make and Model: Bentham, PVE300 Specification/Features: ‘+ Wavelength range: 300nm-1100nm, + Wavelength resolution: Inm. + Source: Xenon lamp, QTH lamp. Available modes for use: + Transformer mode + DC mode with zero chopper frequency + AC mode with current pre-amplifier NCPRE Characterization Lab, 3rd Floor, Nano Electronics Building Department of Electrical Engineering Contact: em Occurs peer Seseeee crann eer eal Peet 54RAPID THERMAL PROCESSING TOO! Rapid thermal processing tool is capable of manual loading of single wafer processing, Make and Model: Allwin 21, AW 610 Specifications and Capabilities: + Wafer sizes: 2°, 3", 4", 5° and 6" wafers (Gi wafer only) + Ramp up rate: Programmable, 10°C to 200°C per second + Recommended steady state duration: 0-300 seconds per step + Ramp down rate: Non-programmable, 25°C to 50°C per second. + Thermocouple temperature accuracy: #0.5°C + Temperature uniformity: +5°C across a 6” (150 mm) wafer at 1100°C + Temperature repeatability: +0.5°C or better at 1100°C wafer-to-wafer. (Repetition specifications are based on a 100-wafer set.) + Process/ purge gas inputs: Nitrogen (N,), Oxygen (O,), Argon (Ar) Wate Location NCPRE Fabrication Lab, 2nd Floor, Nanoelectronics Building, Department of Electrical Engineering, ees Sea enna Department of Electrical Engineering ea SLy een)ONE sia ere neg The screen printer is used for solar cell front and back side metallisation Make and Model: Semi-Automated P-200, Screen printer Specification/Features: + Substrate handling: Manual loading and unloading at operator side, + Print speed: Squeegee movement by servomotor 2-320mm/sec, free adjustable. + Snap off: Adjustable 0-Smm. + Alignment: Screen to substrate repeatability 45 microns + Cycle time: Typical 4-10 sec (table in, print, table out) ‘+ Screen frame: Max. 550x550mm to be fixed when ordering + Camera system: Two video cameras connected to PC. ailable for external users Location NCPRE Fabrication Lab, 2nd Floor, Nanoelectronics Building Department of Electrical Engineering. ae ea GI cren tas Peers acer y scat pees ead Peete! 56SOLAR CELL CURRENT - VOLTAGE MEASUREMENT The solar cell current-voltage measurement system can measure current-voltage (I-V) of cells under both, dark and illuminated conditions. It extracts the important solar cells parameters (ley Voor leas Vues Pyxy FE, efficiency, Ry, R) as per IEC 60891/87 standard. The system consists of solar simulator, I-V measurement units and custom-made solar cell probe station for measuring I-V of different types of solarcells, Make and Model: Abet Technologies Inc., Sun 3000 Solar Simulator Specification/Features: + Class AAA solar simulator DC xenon are lamp Mumination: up to 155 mm x 155 mm Tune light intensity: from 700 to 1000 W/m? Current capability: + 10A Voltage capability: + 20V Temperature control: -20°C to + 85°C Probe micro contacts Custom-made probe station Measure I-V of various cell structures Available modes for use: 5x5 inch and 6 x 6 inch Si solar cell ero Location NCPRE Characterisation Lab, 3rd Floor, Nano Electronics Building Department of Electrical Engineering reese Perea eens eee Peet) 572c O Rea et eee ee There are three stacks of furnaces with each stack having 3 tubes. There are four low pressure chemical vapour deposition (LPCVD) tubes and five atmospheric furnace tubes. Each tube has three temperature zones that can be controlled in order to have uniform temperature throughout the tube, Make and Model: Ultech Specification/Features: + Substrate dimension: 2” and 4” Si wafers can be processed. + LPCVD tubes (low temperature oxide (SiO,), silicon nitride (SiN), intrinsic polysilicon, N- type doped polysilicon) + Atmospheric tubes (silicon dioxide, silicon oxynitride, annealing, wet oxide and drive in) For LPCVD tubes: ‘+ Substrate temperature range: Upto 800°C + Chamber base vacuum: 1 mT + Gases: SiH, PH, NH, H, For atmospheric tubes: + Temperature range: Upto 110°C + Gases: N,0, O, H, At, Ny lab) nal users Locatior Nano Lab, Ground Floor, Electrical Engineering Annex Building, Departmentof Electrical Engineering Contact: aera Den ae as eastern Soiree ey ee eee 58Reactive sputtering is a process where a target of one chemical composition (e.g, elemental Si) is sputtered in the presence of a gas or a mixture of gasses (e.g. AT or N,) that will react with the target material to forma coating of a different chemical composition. Argon is in most cases the main gas and the amount of a reactive gas introduced into a process chamber is controlled to either achieve certain amount of doping or producea fully reacted compound. Make and Model: AJA International, Phase II-J Specification/Features: + Target Size: 2” + Gases used in the system: CDA, O,, Ar, Pn, + Substrates used: Si, Ge, quartz ‘+ Substrate size: Small samples, 2" and 4” diameter wafer. ‘+ Substrate temperature: Room temperature to 850°C ‘+ Materials that can be deposited: Cr, Au, Ti, Pt, Fe, Co, Ag, W, Ta, Ni, SiO, MgO ro no Locatior Nano Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, Contact: aoe Deen rtsa neers Peer oeany ee ey eee ieeeSURFACE PLASMON RESONANCE FACILITY Surface plasmon resonance (SPR) isa label-free, real- time technique capable of measuring binding affinities and kinetics for bio-molecular interactions. SPR has become a key bio-sensing technology in the areas of biological research and medical sciences. Make and Model: GE Healthcare, Biacore T200 Specification/Features: + Can study interactions at physiological temperatures. Analysis temperature range 4°C to 45°C, + Rapid buffer scouting application for fast assay development. + Integrated buffer degasser ensures data quality at elevated temperatures + Designed to support large-scale research applications Applications: + Screening for binding partners and ranking of binding ability, for instance in drug, discovery and biopharmaceutical development + Determination of simultaneous interaction a onmrcmanees ros capabilities, for example epitope mapping, : y with monoclonal antibodies 7 + Detection of specific molecules suchasanti- | |= drug antibodies in immunogenicity studies + Determination of interactant concentration, > in samples, from measurements under i conditions where interaction levels can be related to concentration + Measurement of interaction kinetics and affinity, made possible by real-time detection of interaction events SSRs Se eae ee 60HALL MEASUREMENT SYSTEM Temperature dependent hall measurement can be performed using this instrument with temperature variance from 80K to 350K. The system also provides the facility to perform IV and IR measurementsalong with graph plotting, Make and Model ECOPIA, HMS 5000 Specification/Features: The system can be used to find the following parameters of a film or the substrate + Bulk/sheet concentration + Mobility + Resistivity + Type of semiconductor (n-type or p-type) + Conductivit + Magneto-resistance ar oo Location: Applied Quantum Mechanics Lab 1, Nano - E building, 5th Floor, Department of Electrical Engineering, Contact: Peete Re ct ce PP Umea ecu orem ie en eee! ne ev age? eeeAARP ORO Oey Hall effect measurement system (HMS) provides a full range of hall measurements using van der Pauw or hall probe sample geometries. Options include high resistance and low resistance samples, low mobility samples and variable temperature ‘measurement. Make and Model: LakeShore, 8404 Specification/Features: + Measurement of low mobilities down to 0.001 cm’/v.s, much lower than ever possible using traditional DC field hall measurement techniques. —= + High resistance option to measure samples Surent | Volt with resistance as high as 200GQ in van der Betee Pauw geometry Applications: Available modules and measurement platforms extend the utility HMS to meet the specificneeds fora large variety of applications + Solar cells: OPVs, a‘Si, u-Si, CdTe, Model for te 3 paint probs <{ieet CulnGaSe (CIGS) (for an infinite sheet) + Organic electronics: OTFTs, Pentacene, Chalcogenides, OLED oer + Transparent conducting oxides: InSnO (ITO), ZnO, GaZnO, InGaZnO (IGZO) + TI-V semiconductors: InP, InSb, InAs, GaN, GaP, GaSb, AIN based devices, high electron mobility transistors (HEMTs) and heterojunction bipolar transistors + I-VI semiconductors: CdS, CdSe, ZnS, ZnSe, ZnTe, HgCdTe + Elemental semiconductors: Ge, Sion insulator devices (SON), SiC, doped diamond SiGe based devices: HBTs and FETs + Dilute magnetic semiconductors: LGaMnAs, MnZnO + Other conducting materials: Metal oxides, Organic and inorganic conductors + High temperature superconductors Location: Room No. 14, Department of Physics Available modes for use: + Normal (room temperature) mode Contact + Low temperature mode Sea Re Pe entos enterica! Nese ost enone) See eS cen a en ee 62Electron spectroscopy for chemical analysis instrument is used for characterisation of surfaces, and interfaces. It can provide great deal of information such as elemental composition, chemical state composition of elements present, spatial distribution of elements and their chemical state, composition as a function of depth, thickness ofthin filmsetc, Make and Model : Kratos Analytical, AXIS Supra Specification/Features : High transmission electron energy analyzer + High flux dual anode X-ray, high flux UV source and monochromatic X-ray source + AES/SEM/SAM electron gun + Low energy charge neutralisation source + Broad spot sample cleaning source Applications: Elemental composition of surface and quantification of relative concentrations + Chemical states of elements and their relative quantification + Thickness of thin films + Depth profiling, + Spatial distribution of material Satellite peak Satellite peak. 110 718-720-725 730 Confirmation of phase Conversion from magnetite B.FeOO! to Fe304 Location: Room No. 2, Ground Floor, Department of PhysicsThis solar cell characterisation instrument allows the visualization of various energy loss locations across the cell and helps in optimisation of various process parameters. Make and Model : Mechatronics Manufac turing, BV/SCRA 10: 9001 Specification/Features : + Solar cell dimensions: 50-215mm + Solar cell shapes: round, semi-square, and rectangular ‘+ Maximum probe speed: 20mm/s + Special resolution: 0.1mm + Lamp intensity: 150-300mW /em* + Lamp homogeneity: >95 + Voltage range: 0-1000mV. Available modes for use : + Core (contact resistance) scan: Full surface measurement of contact resistance of front side metallisation + Shunt scan: Locates shunts on solar cells and finds out about their nature + Open circuit voltage (Voc) scan: Finds the locations of increased recombination + LBIC (Light beam induced current) scan: Finds the regions on a solar cell with reduced short-circuit current density. Location: NCPRE Characterisation Lab, 3rd Floor, Nano Electronics Building Department of Electrical EngineeringCURRENT - VOLTAGE CHARACTERISATION SYSTEM This integrated measurement system is used for current-voltage (I-V) characterisation of multiple photovoltaic modules under natural or simulated sunlight. Make and Model Daystar USA, MTS Specification/Features : + PV module channels: 16 nos, ‘Total power rating (all channels): 3200Wp Aunillary input ports: 8 nos. ‘Thermocouple ports: 40 nos. ‘Type of load: Electronic Available modes for use : PV Module can be maintained at MPPT, open circuit or constant voltage modes ‘Available for external users Location: Department of Mechanical Engineering terrace Contact: Prof. Anil Kottantharayil, Department of Electrical Engineering, anilkg@ee iitb.ac.in www.nepreiitb.acin 65This facility is a tool for investigating a variety of dielectric processes for both electrical and non- electrical applications. It measures electrical properties of materials over a wide frequency and temperature range. Make and Model: Novocontrol Technologies, Germany, Concept 80 Specification/Features: It has two separate analyzers: ‘+ From 3MHz to 20MHz working on gain phase measurement method + From IMHz to 3GHz. working on coaxial line reflectometry method, + Permittivity, modulus, conductivity (AC), specific resistance (resistivity), tan 5, capacity, impedance, admittance, inductivity, measured temperature, measured time, measured AC volt, measured DC volt, measured AC current, measured DC current + Magneto dielectric measurement (For bulk and thin film sample) + P-E loop measurement (For bulk and thin film sample) + Piezoelectric measurement (only for bulk sample) Applications : Polymers, rubbers, liquid crystals, ferroelectrics, ceramics, dielectric spectra, molecular relaxation and dynamics, glass transition, + Pharmaceutical applications, characterization of drugs. ‘+ Structural material properties like phase transitions, phase compositions and crystallization processes + Semiconductors, organic crystals: charge transport, activation energy, charge mobility. + Civil engincering, characterization of concrete. Available modes for use : + Low/high temperature (-150°C to 900°C), magnetodielectric measurements, piezoelectric measurements, ferroelectric loop measurements. [AC and DC conductivity analysis ')0.90120.10Fe0.95N4n0.0503 ceramics with temperature Locati Room No. 2, Ground Floor, Department of Metallurgical Engineering and Materials Science 6sElectron spin resonance, spectroscopy is based on the absorption of microwave radiation by an unpaired electron when it is exposed to a strong magnetic field. Species that contain unpaired electrons such as free radicals, odd-electron molecules, transition metal complexes and rare earth ionscan be detected by this instrument. Make and Model: VARIAN, USA, E-112 ESR Spectrometer Specification/Features : * Performs ESR operation at X-band microwave frequencies (9.5GHz] with a sensitivity of 5 x 1010 AH spins * Choice of modulation of frequencies from. 100KHz to 35Hz, + Analysis of samples at room temperature and liquid nitrogen temperature Location: Room No. 110 A, Ground floor, Centre for Research in Nanotechnology and ScienceElectron spin resonance spectroscopy is based on the absorption of microwave radiation by an unpaired electron when it is exposed toa strong magnetic field Species that contain unpaired electrons such as free radicals, odd-electron molecules, transition metal complexesand rare earth ions can be detected by ESR. Make and Model: JEOL, Japan, JES-FA200 ESR spectrometer with X and Q band Specification/Features: + Standard frequency (X band)-8.75-9.65GHz + Sensitivity: 7x109spins/0.1mT + Resolution: 2.35(micro)T or better + Temperature study: Any temperature from +200°C to liquid nitrogen temperature + Available accessories: Aqueous cell, sample angular rotation device, electrochemical cell, UV irradiation, sample mixing cell Available modes for use: + X-Band routine use + Q.Band with sample pooling Location Room No. 110, Ground floor Centre for Research in Nanotechnology and Science 68Electron Paramagnetic Resonance (EPR) is the method for the direct detection of paramagnetic species. This facility works effective on the basis of CW-EPR and it is corroborated with multiple features of 2D operation mode, where the second axis can be time, temperature and microwave power. Model: Bruker, EMXplus Specification and feature: + Variable temperature EPR (X and Q-band) measurement(5K-300K) + Single crystal measurement + Finger dewar Applications: + To study free radicals, transition metal complexes + To study rate of electron exchange reaction and reaction mechanism + Tostudy biological system Available mode for use: + X-band measurement at R.T. and 100K + Qband measurement at R.T. and 100K Structure and temperature dependent EPR spectra of [ceiidyis(oH)afortne-tol)12{NO3)(MeOH)s} seo Location: Ground floor, Near Solvent Shed Behind Chemistry DepartmentThis environmental chamber is used for environmental stress testing of large area PV modules. Make and Model Ballice Systems and Controls India, BS-4500-WC Specification/Features: ‘+ Temperature control range: 40°C to 100°C + Humidity control range: 30%RH to 98%RH + Working space: 2.5m x 1.5m x 1.2m Available modes for use: + Damp heat, + Temperature cycling + Humidity freeze Location: NCPRE Solar Module Lab Il, N-1 Bay, Department of Chemical Engineering,Infrared spectroscopy gives information on the vibrational and rotational modes of motion of a molecule and hence an important technique for identification and characterisation of a functional group. The infrared spectrum of an organic compound provides a unique fingerprint, which is readily distinguished from the absorption patterns ofall othercompounds. FTIR imaging is a versatile complimentary imaging tool and an analytical technique for spectrochemical imaging. The advantage of chemical imaging compared to other sensor technologies is the ability to analyse the spatial distribution of the component materials in blends, granules or finished dosage forms. Make and Model: Bruker, Germany, 3000 Hyperion microscope with Vertex 80 FTIR System Specification/Features: + Focal plane array: 128 x 128, range of 4000 -900em" + Single point detector: range: 7500-450cm" + Analysis area: 128 x 128 in 2D format on the sample plane 300 x 300m + Accessories: Micro ATR, grazing angle + Spatial resolution with 15 x objective: 2.7um + 20x objective (ATR): 0.5m + Temperature controlled sample stage + Spectral resolution of FTIR 0.2cm* + Rapid scan and step scan available; rapid scan 65 spectra/sec at 16cm + Library search for organic compounds and Polymers Location: Room No. 413, First Floor, Centre for Research in Nanotechnology and ScienceThe gas-chromatograph coupled with high resolution mass spectrometer(GC-HRMS) is a combined analyser with a superior ability in analysing organic compounds qualitatively and quantitatively. It features high resolution and accurate mass measurement with simple operation and high sensitivity, Make and Model: MS: Jeol; Model: AccuTOF GCV GC: Agilent; 7890 Specification/Features: Mass spectrometer: + EI/CI source + Time of flight analyser + Mass range:10-1000 amu + Mass resolution: 6000 Location: Room No. Ground Floor, Centre for Research in Nanotechnology and ScienceHigh resolution liquid chromatography/mass spectroscopy (LC/MS) is a technique which combines high performance liquid chromatography (HPLC), a powerful analytical separation technique with mass spectroscopy, powerful analysis and detection technique. The two common soft ionisation techniques used are electrospray ionisation (ESI) andatmospheric pressure chemical ionisation (APCI) Make and Model : Agilent Technologies, USA, 1290 Infinity UltraHPLC system, 1260 Infinity Nano HPLC with Chipcube, 6550 iFunnel Q-TOFs Specification/Features: + Ultra HPLC andnano HPLC for small and large molecules ‘+ Direct infusion mass and MS/MS with ESI and APCI (positive and negative mode ionisation) + Mass range: 50-3200 amu + Resolution: 40000 FWHM + High mass accuracy (typically less than ‘Ippm) + Sensitivity (1 pg. Reserpine S/N 100:1) Location Room No. 110 B, Ground Floor Centre for Research in Nanotechnology and ScienceThis facility is a hybrid quadrupole/atmospheric pressure ionisation orthogonal accelerated time-of- flight mass spectrometer. Mass spectrometry is an analytical technique that can provide both qualitative (structure) and quantitative (molecular mass or concentration) information on analyte molecules after their conversion to ions. Make and Model: Bruker, Maxis Impact Specification/Features: + Sub-ppm mass accuracy and 40,000 FSR full sensitivity resolution. + Extreme sensitivity across the entire mass range from very small molecules to intact proteins + High speed MS/MS capabilities with full U -HPLC compatibility + Simultaneous analysis of major and trace sample components + Isotopic fidelity for definitive molecular formulae determination + Robust and easy to operate system + Certainty in identification in combination with smart formula 3DTM - unequivocal formula generation with superb mass accuracy. + Better than 0.8 ppm mass accuracy Applications: + Proteins/Peptides + In-depth qualitative analysis of complex samples + Intact mass measurement + Small Molecules + Identification and characterization + Metabolite analysis: targeted and non -targeted approaches. Available modes for use: + LRMS: + HRMS: “Mol. Wt. = 676.1454 ‘ca9Ha0NaoPdNa Location: Room No. 370, Second Floor, Department of ChemistryTime-of-flight secondary ion mass spectrometer is a surface analytical tool to detect all elements, their isotopes and fragments. It is used to study surface spectra, ion map imaging, depth profiling and 3D imaging of solid samples. Make and Model: Physical Electronics, PHI TRIET V NANO TOF Specification/Features: + Uses a pulsed primary ion beam to induce thedesorption and ionisation of atomic and molecularspecies from asolid sample surface + Ton guns: LMIG, cesium and gas ion guns + Capabilities: Analysis of all conducting, semi conducting and insulating solids; detection of all elements and isotopes, atomic and molecular species, both organic and inorganic; sensitivities down to parts per bi Location: Room No. 413A, First Floor, Centre for Research in Nanotechnology and ScienceTwo-dimensional Gas Chromatography with time of flight mass spectrometer (GC-GC-TOF-MS) system with gerstel auto sampler can facilitate high end separation of volatile organic compounds in highly complex mixtures and environmental samples. The two-dimensional output helps in resolving the peak of target analytes even when matrix interferences are present. The enhanced spectral collection rate of the TOF-MS detector together with the software capabilities can help in de-convolution of co-eluting compounds. Make and Model : Leco, Pegasus 4D with Agilent 7890B GC Specification and features : ‘+ High resolution gas chromatographic separation can be achieved for complex samples, when operated in 2-D mode + Independent temperature programming for each of the columns possible + MS can collect > 20 full range spectra across a 50ms GC peak ‘+ High dynamic range can be achieved Available modes for use: Following injection modes are possible: + Liquid/gas injection + Cooled injection system and thermal desorption unit (CIS-TDU) + Headspace injection + Stir bar sorptive extraction (twister) and solid phase micro-extraction (SPME) + Pyrolysis Applications: The system is particularly suitable for applications from following fields: + Environmental + Geochemistry + Biological + Chemical/Chemistry Location: Room No. 114, Ground floor, Centre for Research in Nanotechnology and Science 78Inductively coupled plasma mass spectrometry (ICP- MS) is an analytical technique used for elemental determination, Aerosol samples are transported into the core of the inductively coupled argon plasma which generates temperatures of 6000-10000°C, where they are completely desolated and ionised. The resultant ions are separated and collected by massto charge ratios. Make and Model: Thermo Fisher Scientific, Germany, Element XR Specification/Features: Quantification limit: Better than 1 ppt ‘+ Dynamic range: Linear for 12 decades, ie. 10° + Dark noise: Less than 0.2 counts per second + Signal stability: Better than <0.5 % RSD over 30 minutes; better than <1 % RSD over 1 hour + Mass stability: <10 ppm over one hour; <20 ppm over 10 hours |: (Magnetic) 1 to 240amu in less + Plasma torch: Full demountable torch with sample tube (ceramic / sapphire injector) suitable for HF based solutions and additional injector for organic solvents + Nebuliser: Concentric nebuliser for normal acid based solution suitable nebuliser for HF based solution * Spray chambers: Dual cyclone double pass quartz spray chamber - PFA spray chamber for ultra trace analysis and HF based solutions ~ Peristaltic pump for constant (regulated) sample flow and drain Location: Room No. 405, First Floor, Centre for Research in Nanotechnology and ScienceLiquid chromatography and mass spectroscopy (LC & MS) technique combines high performance liquid chromatography analytical separation technique with mass spectroscopy analysis and detection technique. Make and Model: Varian Inc, USA, Model: 410 Prostar Binary LC with 500 MS IT PDA detectors. Specification/Features: Direct infusion mass with ESI and APCI negative andpositive mode ionisation, mass ranging from 50 to 2000m/e + LCMS/MS andMS“nion trap * HPLC with PDA detector * HPLC PDA detector-massspectrometer Location: Room No. 307, Ground Floor, Centre for Research in Nanotechnology and ScienceX-ray diffraction (XRD) is an instrumental technique to study crystalline materials. On diffraction of the X-ray beam from the sample, the distances between the planes of the atoms constituting the sample can be obtained by applying the Bragg’slaw Make and Model: Rigaku, Smartlab Specification/Features: + X-Ray reflectivity measurement + In-situ electrochemical measurements + In-situ high temperature XRD measurement Applications: * Identification of unknown crystalline materials + Characterization of crystalline materials + Determination of crystal structures using Rietveld refinement + Thin film characterization + Determining thickness, roughness and density of thin films Available modes for use: + Powder XRD + Thin film XRD and GIXRD + High temperature XRD + Xray reflectivity ‘Temperature dependent in-situ powder XRD of (CH,NH).Pb1,2H,0 perovskite Location: Short Circuit Lab (Near Powerhouse),HIGH RESOLUTION X-RAY DIFFRACTION SYSTEM This diffraction system can be used for analysis of epitaxial and polycrystalline thin films, Make and Model Rigaku Smart lab, 3KW Specification/Features : X-ray Generator: + 3KW solid state x-ray generator X-ray tube : + Anode: Copper (Cu) sealed type, ceramic insulation, long fine focus type with at least 0.4mm focal spot and high resolution type Goniometer : + Operating Mode: Horizontal theta/2theta decoupled + Minimum step size: +/- 0.0001 deg. + Angle reproducibility: +/- 0.0001 deg. + Goniometer diameter: >500mm Conditional availability to external users Available for external users Location: Micro 1 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering, Contact: Prof. Apurba Laha, Department of Electrical Engineering [email protected] wwwwatt ib ac in/itbn index php infrastructureYlayout-edithid-18 80This facility enables to obtain information about the lattice structure as well as crystalline quality of a material by measuring the angular distribution of intensity about the maxima. Make and Model : Smartlab, Rigaku diffractometer Specification/Features : ‘+ High intensity X-ray source (9kW rotating anode source) + Parallel beam optics. (useful for microstructural characterization) + High resolution goniometer + In-plane goniometer (useful for in-plane microstructural studies for the thinfilms) Applications: + Microstructural characterization of epitaxial films + Phase determination and texture analysis of polycrystalline samples with higher accuracy. + Reflectivity measurements: layer thickness, composition, roughness of thinfilms Available modes for use: Bragg -Brentano optics (Conventional divergent beam) ¥ Johnson mirror and Ni filter Parallel beam optics Y Horizontal and vertical goniometer ¥ Soller slits: Horizontal and vertical (medium. resolution) Y 2&4 Bounce Ge(220), Ge(400) channel-cut monochromators and analyzers (high resolution) Gorn WANN gana “oso a 3 oe Fett ‘year Location: Room No. 016, Ground Floor, Department of PhysicsThis deposition technique involves thermal decomposition of precursor gases at the surface of resistively heated filament (usually tungsten) to formradicals. These radicals form other species and getadsorbed on the heated substrate. Make and Model: The system was designed and assembled at IIT Bombay Specification/Features: + Substrate size: 2 inches to smaller pieces of, wafer + Type of depositions: Intrinsic polysilicon, boron doped polysilicon, silicon nitride ‘+ Substrate temperature: Room temperature to 800°C ‘+ Filament temperature: Up to 2000°C + Process gases used: Silane, ammonia, hydrogen, diborane, nitrogen + Chamber base pressure: Up to 10” mbar + Allowed substrates: Silicon, glass, wafers coated with SUS or oxide deposited wafers Location: Micro 2 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering.Inductively coupled plasma-atomic emission spectrometry (ICP-AES) is an emission spectrophotometric technique, exploiting the fact that excited electrons emit energy at a given wavelength (based on their atomic character) as they return to ground state after excitation by high temperature argon plasma. This analytical technique isused for the detection of trace metals. Make and Model: SPECTRO Analytical Instruments GmbH, Germany, ARCOS, Simultaneous ICP Spectrometer Specification/Features: + Plasma: Radial plasma, having capability to analyse aqueous solutions with high dissolved solid content even up to 30wt %. + Wavelength range: 130nm to 770nm. + Resolution: Approx. 9 picometer + Detector: Charge coupled devices + Vertical torch assembly having fully demountable quartz torch for HF based solutions + Nebulisers: Concentric, cross flow, organic nebuliser, and cross flow nebuliser + Spray chambers: HF resistant cyclonic chamber and hydrocarbon solution spray chamber Locatio; Room No. 409, First Floor, Centre for Research in Nanotechnology and ScienceThe presence of remote plasma on this facility enables chemical vapour depositions at low temperatures. Types of depositions are silicon dioxide, silicon nitride, silicon oxynitrideand amorphoussilicon. Make and Model: Oxford Instruments, Plasma lab system100 ICP 180 Specification/Features: ICP source: Alumina tube surrounded by a copper coil; connected to RF, 13.56MHz. He pressure applied to the back of wafers to provide good thermal contact between lower electrode and wafer. Types of substrates: 2”, 4”, 8”, small pieces of wafers-Si and glas Temperature of substrate: room temp to 350°C Process gases used: Silane, nitrogen, ammonia, hydrogen, argon and CF,/O, Load lock chamber vacuum: 10e" Torr Process chamber vacuum: 10e* Torr Locati Nano Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering,This system enables the application of a wide range of plasma etching processes. Make and Model : Sentech Instruments GmbH, $1 500 Specification/Features : ICP source (13.56MHz, 1200W) with integrated automatic matching network RF bias: 13.56MHz, 600W Useful for III-V and metal etching Substrates used: III-V (GaAs, GaN on sapphire) Gases used: BCI, Cl,, Ar, SF, and ©, Chamber base vacuum: Up to 10* Pa Location: Nanoelectronics Processing Lab, Nano - E Building, 1st Floor, Department of Electrical Engineering,The laser doping tool is used for deep diffusion of phosphorus into silicon (from pre-deposited source) and SiNxablation for contact patterning, Make and Model Scantech Laser Pvt. Ltd Specification: Wavelength 1070 10nm Beam mode TEM 00 (CW and Modulated Pulse mode (-100i#2) Laser Power output 25W.25W Minimum pulse, duration Tops Movement (teanslation) along ** ¥ and Z Raster scanning, Sone Xand Y Maximum line to Voltageot Minimum linet 10,000Da) + Reflectron mode- For low molecular weight analytes (<10,000Da) Location: Room No. 307, Central Instrumentation Facility, Department of Biosciences and Bioengineering,Nuclear magnetic resonance spectroscopy is a research technique that exploits the magnetic properties of certain atomic nuclei. It determines the physical and chemical properties of atoms or the molecules in which they are contained. Make and Model: VARIAN, USA, Mercury Plus 300MHz NMR spectrometer Specification/Features: 5mm auto switchable probe with PFG (‘H/ PCy "P/F 5mm dual broad band probe with PEG for multinuclear NMR (°C, "N, "Al,"P, °Si, "Se, “Sn, "Te, "Hg, “V, 'Liete,) VT accessory: Variable temperature facility is available from -80 degree to +130 degree with suitable solvent ‘The NMR probe is switch-able between high frequency range (H, "F) and broad band frequency range ("C, "N, “Al, "P, *Si, “Se, “Sn, “Te ete.) In case of solids, only broad band frequency range is available and the sample can be spun up to a maximum of SKHz at the magic angle High power decoupling in case of solids is limited to a power of 100W Total spectral width is limited to 100KHz Available modes for use: Liquid state:"H, "C,"P, “E, "Se, Te ete. Solid state: “P, "AL, "Si, "V ete. (1H, "C not available in solids) Location: Room No. 312, Ground Floor, Centre for Research in Nanotechnology and ScienceNuclear magnetic resonance spectroscopy is a research technique that exploits the magnetic properties of certain atomic nuclei. It determines the physical and chemical properties of atoms or the molecules in which they are contained. Make and Model: BRUKER, Switzerland, AVANCE II HD Specification/Features: + Variable temperature facility is available. Samples can be recorded in the temperature range from -40°C to + 60°C with suitable solvent. + Along with the routine 1D experiment of nuclei like 1H,"C,"F, "P, other nuclei = ™B, “Al, "Se, "Te, Hg etc can be recorded. + With 5mm multinuclear probe (BBFO s probe), analysis of liquid samples of nuclei like"H, "P,"C, "Se, "5Te, “Hg etc can be recorded. Applications: =F + Molecular conformation in solution “I “ + Quantitative analysis of mixtures containing, known compounds + Determining the content and purity of a sample + Through space connectivity (overhauser effect) Available modes for use: + 1D experiments eg 1D NOE, APT, DEPT can be recorded + 2D experiments eg COSY, NOESY, TOCSY, HSQC, HMBC can be done. + Solid state samples for "C,"P etc nuclei can be recorded. + Variable temperature experiment can be recorded Location: Room No. CL-16, Gr. Floor, Department of ChemistryNuclear magnetic resonance spectroscopy is a research technique that exploits the magnetic properties of certain atomic nuclei. The facility helps to determine the physical and chemical properties of atoms or the molecules in which they are contained. ‘This high magnetic field facility is suited for biological macro-molecular characterization. Experiments can be performed in solid as well as in liquid phase. Make and Model : Bruker Biospin Switzerland, Ascend 750MHz. Specifications : + Forsolution-state NMR ¥ 5mm triple resonance H/C/N nuclei with 2H lock and 50G/cm gradient along Z. axis. + For solid-state NMR ¥ 3.2mm CP-MAS DVT triple resonance H/X/Y probe with max spinning speed of 24KHz. ¥ 3.2mm CP-MAS triple resonance (H/C/N) E-free probe (Bio-solid) with max. spinning speed of 24KHz ¥ 19mm H/C/N CP MAS triple resonance (H/C/N) probe with max. spinning speed of 42KHz + For wide-line static probes : Y Low-temperature wide-line probe, solenoid coil ¥_ 5mm and 7.5mm, can be tuned to various nuclei and can go upto 20K. Features : + Experiments can be performed with wide temperature range. + Aseries on nD experiments can be performed in the liquid phase. + Suitable for multi-nuclei, multi-dimensional MAS experiments, + Static solids can be investigated at various temperature (up to 20K) Available modes for use : + Liquid state + Solid state Location: Room No. 304, Ground Floor, Sophisticated Analytical Instrument Facility, Centre for Research in Nanotechnology and SciencePhotoluminescence spectroscopy system allows the use of an efficient, contactless and non-destructive technique for the analysis of the opto electronic properties of semiconductors. Make and Model: Dongwoo Optron Co. Ltd., Low temperature (10K) macro assembled Specification/Features: + Excitation wavelength: 325nm + Detection wavelength: visible range + Temperature range: 10K to 300K + Sample requirement: No powder, liquid and sticky samples allowed + Sample size: 5mm to lem Location: Applied Quantum Mechanics Lab 1, Nano - E building, 5th Floor, Department of Flectrical Engineering,The physical vapour deposition system is a cluster tool which is configured with three process chambers for sputter deposition of metal thin films in a state of the art, 8 inch CMOS manufacturing proces: Make and Model : Applied Materials Inc,Endura Specification/Features : Three chambers include pre-clean chamber, PVD. chamber and cool down chamber, + Wafer size: 8” + Gases: N,, Ar, O, + DC sputtering of metal + Substrate temperature: Upto 150°C + Currently Ti, TIN, Al and Al,O, can be deposited + Available targets: Ti, Al Location Ground Floor, Electrical Engineering Annex Building, Departmentof Electrical Engineering,Plasma immersion ion implantation system is used for doping of boron and phosphorous into silicon wafers. This system uses B2H6 and PH3 gases for boron (p-type) and phosphorus (n-type) implants inSiwafers Make and Model: This system has been built at IIT Bombay. Specification/Features: + ICP source: 0-1200W, 13.56MHz. + High voltage: (-5 to 0V) negative bias applied to grid + Wafer placed on 10” chuck which is grounded Location Micro 2 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering,This high end, high current potentiostat/ galvanostat, facility with a compliance voltage of 30V and a bandwidth of IMHz, combined with FRA32M module is specially designed for electrochemical impedance spectroscopy. The system is suited for the electrochemical methods. Make and Model: Metrohm Instruments-302N Specification/Features: ‘+ Multi channel with EQCM module + Suited for the electrochemical methods of interest for surface science. + Composition, roughness, structure and growth mode of deposited materials can be controlled + EQCM allows detecting the formation of the very first atomic layers on the surface of a piezo-electric quartz sensor. + Formation of metallic deposits during electrolytic or electroless processes can be monitored in situ. Available for external users: Multi channel (liquid form) Location: Room No. 101, Nanomaterials Lab, Department of PhysicsX-ray crystallography technique helps to determine biological macromolecule structures that provide a detailed understanding of the interactions occurring at the molecular levels. Structure based. drug design, study of protein-ligand interactions and structure-function relationships are the major fields where X-ray crystallography acts as a major tool. Make and Model: Detector : Rigaku, R-Axis IV" Specification/Features: + X-Ray diffraction + Automated crystallization set up facility + Automate crystal visualization camera Applications: + Crystal structure determination of proteins and their complexes by molecular replacement method + Crystal structure determination of proteins by heavy atom isomorphous replacement Available modes for use: + Screen protein and DNA/RNA crystals for preliminary diffraction to improve quality + Solve structure of know protein structures with ligands (molecular replacement) (inhibitors, substrates, nucleic acids etc.) + Solve structure of new bio-molecules by using heavy atom derivatization (Hg, lanthanides etc.) (isomorphous replacement) + Fibre diffraction of bio-fibres (amyloids). + Difficult small molecule structure, source is CuKa Structure of Histo-Asparti protease zymogen from Plasmodium Faciparum solved at 2.0. Data were collected at 23.8,2.5 Aand 3.0.4, Location: Room No. 103, Ground Floor, Centre for Research in Nanotechnology and SciencePulsed laser deposition (PLD) isa thin film deposition technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. PLD is applicable to almost any material and in particular to compounds that are difficult or impossible to produce in thin-film form by other techniques. Make and Model: The system was designed and assembled at IIT Bombay. Specification/Features: Laser source used: Coherent compex Pro 201 model from laser science Wave length: 248nm (KrF) Pulse energy: 700m] Max. repetition rate: 10H Pulse duration: 30ns Location: Nanoelectronics Processing Lab, Nano- E building, 1st Floor, Department of Electrical Engineering,This system isa cryogen-free closed cycle refrigerant probe station with a #0.6 T horizontal, n-plane electromagnet. All standard electrical characterisation (CV, IV), microwave and electro- optical probing, plus in-plane horizontal field electromagnetic measurements can be performed on this versatile probe station. Make and Model: LakeShore, CRX-EM-HF Specification/Features: On-wafer device can be charaterised using this tool (1e. HEMT, LED, ete.) Allows standard probing plus in-plane horizontal field electromagnetic measurements RF range 10Mhz to 43.5GHz Optical probe can be inserted for electromagnetic measurement Sample can be rotated upto 360° Location: Applied Quantum Mechanics Lab 1, Nano -E building, 5th Floor, Department of Electrical Engineering 98Thermal analysis involves the study of physical properties of materials as a function of temperature. Simultaneous application of thermogravimetry (IGA) and differential thermal analysis (DGA) to one and the same sample in a single instrument is possible. The test conditions are perfectly identical for TGA and DTA signals. Make and Model: PERKIN ELMER,USA, Diamond TG/DTA Specification/Features: Available modes for use: Simultaneous TGA and DTA Temp. range: Ambient to 150°C Heating rate: 0.01°-100°C/ min. Balance type: Horizontal differential type Atmosphere: Air, inert gas Purge gas flow rate: 20-1000ml/min Location: Room No. 417, First Floor, Centre for Research in Nanotechnology and ScienceThis spectroscopy set up uses pump probe technique. A Ti-sapphire laser is split into two beams using a beam splitter. One beam is used to excite the sample (pumping) and the other beam is, used to detect the changes due to excitation (probing). There is a delay stage which introduces a time shiftbetween the pumping and probing. Make and Model: Coherent systems Inc., Assembled Specification/Features: Low profile direct-drive ultra-high speed optical delay line integrated in the spectrometerhousing, + Time window: 3ns Resolution: 50fs Minimum step size: 100 Max. speed: >10ns/s ‘Acceleration: >260ns/s*2 Probe spectral range: 350-750nm and 800nm, Locatior Applied Quantum Mechanics Lab 1, Nano - E building, 5th Floor, Department of Electrical EngineeringThe UV-Vis-near IR-spectrometer has double beam, double monochromatorand ratio recording UV-Vis-near IR spectrophotometer with microcomputer electronics, controlled by a compatible personal computer. Photomultiplier R6872 for high energy in the whole UV/Vis wavelength range. Make and Model: PerkinElmer, Lambda 950 Specification/Features: + Wavelength range: 175nm - 3300nm + Source: Pre-aligned tungsten-halogen and deuterium + Detector: Photomultiplier R955 for UV/Vis wavelength Peltier cooled PbS detector for near IR InGaAs detector for integrating sphere module + Photometric range: 8A (using reference- beam attenuation) Available modes for use: + Total reflectance measurement + Total transmittance measurement + Diffuse transmittance measurement + Diffuse reflectance measurement Locati NCPRE Characterisation Lab, 3rd Floor, New Nano Building Department of Electrical Engineering,X-Ray fluorescence is an analytical method to determine the chemical composition of all kinds of materials. The materials can be in solid, liquid, powder form. XRF can also be used to determine the thickness of layers and coating, XRFis fast, accurate and non-destructive technique with a high level of precision and reproducibility. Make and Model: Phillips, PW 2404 Specification/Features: X-Ray tube with Rh target. ‘The proportional detector ‘The scintillation detector Xenon filled detector for mid rangein tandem with proportional counter. Available modes for use: + Helium mode (liquid samples) + Vacuum mode (powered samples) Location: Room No.308, Ground Floor, Centre for Research in Nanotechnology and Science “102The X-Ray photoelectron spectroscopy system is used to measure the elemental composition, empirical formula, chemical state and electronic state of the elements that exist within a material. It has the ability to image and analyze features as small as 10pm in diameter. Make and Model: ULVAC - PHIPHI5000, Versa Probe II Specification/Features: + X-ray beam diameter: <10pm to 200pm + Ton beam energies: 5eV to 5keV + Ultra high vacuum (UHV) Micro 2 Lab, Ground Floor, Electrical Engineering Annex Building, Department of Electrical Engineering,DEPARTMENT FACILITIESDepartment of Biosciences and Bioengineering, > v v Circular dichroism spectroscopy Flow cytometer system Parimal and Pramod Chaudhari cell culture laboratory Preparatory ultra-centrifuge facility Centre for Environmental Science and Engineering Inductively coupled plasma atomic emission spectroscopy Department of Chemical Engineering Dynamic vapour sorption facility Mercury porosimeter facility Spectroscopicellipsometer Supercritical carbon dioxide pilot plant > > 105Department of Chemistry > Atomic force microscopy Attenuated total reflection spectrometer Circular dichroism spectrophotometer Differential scanning calorimeter Electron paramagnetic resonance Elemental analyser FluorescenceSpectrophotometer Gas chromatography-Mass spectrometry High performance liquid chromatography High resolution mass spectrometry High-performance computing cluster Nanosecond Laser Facility Nuclear magnetic resonance Spectrometer (400 MHZ) single Crystal X-Ray Diffractometer Superconducting quantum interference device Surface areaanalyzer ‘Thermo gravimetric differential thermal analyser Ultra Violet-Vis-NIR Spectrophotometer VV VY VV VV VV 106Department of Civil Engineering > vVvvvVVVVVY Double wall Triaxial test system Driving simulator facility Linear servo hydraulic actuator system Particle image velocimetry for fluid flow Uni-axial shake table facility Advanced fully automatic cyclicsimple shear apparatus Aggregate image measurementsystem Bending beam Rheometer Cyclic triaxial testing system Dynamicshear Rheometer Rolling thin film oven 107Department of Earth Sciences > Broadband seismograph Electron probe micro-analyzer Field fourier transform infra-red radiometer Fourier transform Infra-red radiometer Fission track dating, Five-channel broad-band magnetotelluric equipment Gas chromatograph-mass spectrometer Gravimeter Inductively coupled plasma - optical emission spectrometer Laserraman spectrometer Multi-electrode resistivity imaging system Permeability meter NMR rock core analyzer Rock-eval pyrolyzer Scanning electron microscope with energy dispersive spectrometer Unmanned aerial vehicle with hyperspectral and photogrammetric payloads, X-ray powder diffractometer VY VV VV VV Broadband Seismograph (8) Data Acquisition System 108Department of Energy Science and Engineering > Advanced electrochemical system > Atomiclayer deposition system Boilers-Steam generators facility Climate test chamber Electrode coating machine Flectro-photo-luminescence imaging system Field emission electronic microscopy Fourier transform infrared spectrometry Fuel cell test station facility High speed camera facility Metal sputtering system Modular compact Rheometer Potentiostat spectroscopy Quantum efficiency measurementsystem Solar simulator facility Spray pyrolysis facility Thermal evaporator system Thermography imaging system ‘Thermogravimetric analyser coupled with Mass Spectrometer Work function analysis system VV VV VV YVV VY VV 109Department of Metallurgical Engineering and Materials Science > Accelerated weathering facility Confocal Raman, AFM andSNOM {facility Creep testing machine Current-voltage measurement system, Differential scanning calorimetry facilities Digital image correlation based gom software Dilatometer system Electricresistance measuring system Focused ion beam -Field emission gun Scanning Electron Microscopy High performance computing facility High temperature high vacuum furnace facility High vacuum aremelting system Hot wire chemical vapour deposition system. Hydraulic friction testing machine Hyperspectral imaging system Laser based lithography setup ‘Magnetic properties measurement system ‘Metal forming research Facility Micro-torsion testing machine facility Multi-beam optical Stress Sensor System Physical properties measurement system (magnetisation study) Precision ion polishing system Rollingmill facility Scanning Electrochemical Microscope facility Scanning Electron Microscopy Simultaneous Thermal Analysis System Steady-state analysis system Surface profiler Tensile testing facility ‘Thermal diffusivity measurement system ‘Thermal-mechanical simulator facility Universal hardness tester facility Universal testing machine Vibrating sample magnetometer facility Wire bonder facility X-ray diffractometer-Phase analysis & crystallography X-ray diffractometer-Grazing incidence diffraction and Small-angle XRD VV VV VV 110- = = Address for Correspondence The Dean (Research & Development), Industrial Research and Consultancy IRCC-SOM Building, ‘entre (IRCC), Indian Institute of Technology Bombay, Powai, Mumbai-400076. Tel: + 91-22-2576 7039 Fax: + 91-22-2572 3702 [email protected] www.ircelitb.2c.in A