I251B

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Tg≥130℃（DSC） 适合于2-6层PCB、计算机及外围设备、通讯设备、办
UV Blocking与 AOI兼容可提高PCB生产效率 公自动设备等。
UV Blocking and AOI compatible,so as to Suitable for medium multilayer printed circuit board,
increase productivity efficiency computer, communication equipment, OA equipment,
可依需求提供不具UV阻挡功能的自然色板材（白料） etc.
No UV Blocking and natural color CCL upon request 不建议使用于有CAF需求的应用；
Not suggested for application with CAF requirement.
不建议使用于>2OZ铜厚、HDI和12L应用；
Not suggested for>2OZ copper、
HDI and ≥12L application.
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沿致贄圉 法柄 沿致晓毕 致場维这 簇焦炒

玻璃化转变温度/Tg ℃ DSC 2.4.25 134.3

剥离强度/1oz Peel Strength N/mm 288℃, 10S 2.4.8 1.81

120s
热应力/Thermal stress S 288℃,solder dip 2.4.13.1 No delamination

弯曲强度/Flexural Strength N/mm 2 LW/CW 2.4.4 580/485

燃烧性/Flammability Rating E 24/125 UL94 V-0

表面电阻/Surface Resistivity MΩ After moisture 2.5.17.1 5.16×10 7

体积电阻/Volume Resistivity MΩ·cm After moisture 2.5.17.1 5.07×10 8

1GHz
介电常数/Dielectric Constant --- 2.5.5.9 4.8
C 24/23/50
1GHz
介质损耗角正切/Loss Tangent --- 2.5.5.9 0.015
C 24/23/50

耐电弧/Arc Resistance S D48/50＋D0.5/23 2.5.1 125

击穿电压/Dielectric Breakdown KV D48/50＋D0.5/23 2.5.6 58

吸水率/Moisture Absorption % D24/23 2.6.2.1 0.15

热分解温度/Td ℃ Weight Loss 5% 2.2.24.6 310

Alpha 1 ppm/℃ 2.4.24 60

CTE
Alpha 2 ppm/℃ TMA 2.4.24 300
Z-axis

50 - 260 ℃ % 2.4.24 4.3

相比漏电起痕指数/CTI Rating C-96/20/65 IEC-60112 PLC 3

Specimen Thickness : 1.6mm； Specification sheet：IPC-4101/21，is for your reference only

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二夹朵圹背槊.I251BQ
Prepreg instruction

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Resin Content(%) 压合厚度Cured thickness(mm/mil)

prepreg type 含量R/C(%) 公差Tolerance Nominal Range(±)mil

% ± mm mil mm mil
52 2 0.247 9.72 0.025 1.00
7628HRC 50 2 0.234 9.21 0.023 0.90
48 2 0.224 8.82 0.023 0.90
45 2 0.207 8.15 0.021 0.80
7628
43 2 0.197 7.76 0.02 0.80
50 2 0.184 7.24 0.018 0.70
1506 48 2 0.173 6.81 0.017 0.70
45 2 0.163 6.42 0.016 0.60
60 2 0.155 6.10 0.015 0.60
58 2 0.147 5.79 0.015 0.60
2116
55 2 0.135 5.31 0.014 0.50
53 2 0.127 5.00 0.013 0.50
68 2 0.094 3.70 0.009 0.40
1080 66 2 0.088 3.46 0.008 0.30
63 2 0.079 3.11 0.008 0.30

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210 420 Heat-up rate:1.0~2.5℃/min(80~140℃)
180 360 Curing time:>30min(>170℃)
150 300 The hot pressing parameters is for your
reference only,please turn to Huazheng
120 240
New Materials .Co.,Ltd for detailed
90 180
Platen Temp/℃ information.
Laminate Pressure/psi
60 120

30 60
0 0
1 11 21 31 41 51 61 71 81 91 101 111 121

耻连晓毕倸温度≤23℃、湿度≤50%，保存时间3个月；温度≤5℃、密封条件下，保存时间6个月.
Tupsbhf!Dpoejujpo;!T≤23℃& ≤50%RH,Within 3 months; T≤5 ℃ Within 6 months (seal condition).
在上述要求内，我司可立即安排PP送样；若有特殊要求，由供需双方商定。Follow above condition,
Our company will arrange sample immediately. We can disscuss if you have special requirement.

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