MCR100 Series

Preferred Device

Sensitive Gate Silicon Controlled Rectifiers

Reverse Blocking Thyristors
PNPN devices designed for high volume, line-powered consumer applications such as relay and lamp drivers, small motor controls, gate drivers for larger thyristors, and sensing and detection circuits. Supplied in an inexpensive plastic TO-226AA package which is readily adaptable for use in automatic insertion equipment.
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SCRs 0.8 A RMS 100 thru 600 V

Sensitive Gate Allows Triggering by Microcontrollers and Other

Logic Circuits Blocking Voltage to 600 V OnState Current Rating of 0.8 Amperes RMS at 80C High Surge Current Capability 10 A Minimum and Maximum Values of IGT, VGT and IH Specified for Ease of Design Immunity to dV/dt 20 V/msec Minimum at 110C Glass-Passivated Surface for Reliability and Uniformity PbFree Packages are Available*
G A K

MARKING DIAGRAM
MCR 100x AYWW 1 TO92 (TO226) CASE 029 STYLE 10

x A Y WW

= Specific Device Code = Assembly Location = Year = Work Week

PIN ASSIGNMENT
1 2 3 Cathode Gate Anode

ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value.

*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005

January, 2005 Rev. 6

Publication Order Number: MCR100/D

MCR100 Series
ORDERING INFORMATION
Device MCR100003 MCR100004 MCR100006 MCR100008 MCR1003RL MCR1006RL MCR1006RLRA MCR1006RLRM MCR1006ZL1 MCR1008RL MCR100003G MCR100006G MCR100008G MCR1003RLG MCR1006RLG MCR1006RLRAG MCR1006RLRMG MCR1006ZL1G MCR1008RLG 2000 Units / Tape & Ammunition Box 2000 Units / Tape & Reel TO92 (TO226) TO 92 (TO 226) (PbFree) 2000 Units / Tubes 2000 Units / Tape & Reel 5000 Units / Bulk 2000 Units / Tape & Ammunition Box 2000 Units / Tape & Reel TO92 (TO226) TO 92 (TO 226) 2000 Units / Tape & Reel 5000 Units / Bulk Package Code Shipping

For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

MAXIMUM RATINGS (TJ = 25C unless otherwise noted)

Rating Peak Repetitive OffState Voltage (Note 1) (TJ = *40 to 110C, Sine Wave, 50 to 60 Hz; Gate Open) MCR1003 MCR1004 MCR1006 MCR1008 On-State RMS Current, (TC = 80C) 180 Conduction Angles Peak Non-Repetitive Surge Current, (1/2 Cycle, Sine Wave, 60 Hz, TJ = 25C) Circuit Fusing Consideration, (t = 8.3 ms) Forward Peak Gate Power, (TA = 25C, Pulse Width v 1.0 ms) Forward Average Gate Power, (TA = 25C, t = 8.3 ms) Forward Peak Gate Current, (TA = 25C, Pulse Width v 1.0 ms) Reverse Peak Gate Voltage, (TA = 25C, Pulse Width v 1.0 ms) Operating Junction Temperature Range @ Rate VRRM and VDRM Storage Temperature Range IT(RMS) ITSM I2t PGM PG(AV) IGM VGRM TJ Tstg Symbol VDRM, VRRM 100 200 400 600 0.8 10 0.415 0.1 0.10 1.0 5.0 40 to 110 40 to 150 A A A2s W W A V C C Value Unit V

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.

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MCR100 Series
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance,JunctiontoCase JunctiontoAmbient Lead Solder Temperature (t1/16 from case, 10 secs max) Symbol RqJC RqJA TL Max 75 200 260 Unit C/W C

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current (Note 2) TC = 25C TC = 110C (VD = Rated VDRM and VRRM; RGK = 1 kW) IDRM, IRRM 10 100 mA

ON CHARACTERISTICS
Peak Forward OnState Voltage* (ITM = 1.0 A Peak @ TA = 25C) Gate Trigger Current (Continuous dc) (Note 3) (VAK = 7.0 Vdc, RL = 100 W) Holding Current(2) (VAK = 7.0 Vdc, Initiating Current = 20 mA) Latch Current (VAK = 7.0 V, Ig = 200 mA) Gate Trigger Voltage (Continuous dc) (Note 3) (VAK = 7.0 Vdc, RL = 100 W) TC = 40C TC = 25C TC = 25C TC = 40C TC = 25C TC = 40C TC = 25C VTM IGT IH IL VGT 40 0.5 0.6 0.62 1.7 200 5.0 10 10 15 0.8 1.2 V mA mA mA V

DYNAMIC CHARACTERISTICS
Critical Rate of Rise of OffState Voltage (VD = Rated VDRM, Exponential Waveform, RGK = 1000 W,TJ = 110C) Critical Rate of Rise of OnState Current (IPK = 20 A; Pw = 10 msec; diG/dt = 1 A/msec, Igt = 20 mA) *Indicates Pulse Test: Pulse Width 1.0 ms, Duty Cycle 1%. 2. RGK = 1000 W included in measurement. 3. Does not include RGK in measurement. dV/dt di/dt 20 35 50 V/ms A/ms

Voltage Current Characteristic of SCR

+ Current Anode + VTM on state IRRM at VRRM IH

Symbol
VDRM IDRM VRRM IRRM VTM IH

Parameter
Peak Repetitive Off State Forward Voltage Peak Forward Blocking Current Peak Repetitive Off State Reverse Voltage Peak Reverse Blocking Current Peak on State Voltage Holding Current Reverse Blocking Region (off state) Reverse Avalanche Region Anode

+ Voltage IDRM at VDRM Forward Blocking Region (off state)

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MCR100 Series
100 GATE TRIGGER VOLTAGE (VOLTS) 95 90 GATE TRIGGER CURRENT ( m A) 80 70 60 50 40 30 20 10 40 25 10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 110 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 40 25 10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C) 95 110

Figure 1. Typical Gate Trigger Current versus Junction Temperature

Figure 2. Typical Gate Trigger Voltage versus Junction Temperature

1000

1000

100

LATCHING CURRENT ( m A) 95 110

HOLDING CURRENT (m A)

100

10 40 25 10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C)

10 40 25 10 5 20 35 50 65 80 TJ, JUNCTION TEMPERATURE (C)

95

110

Figure 3. Typical Holding Current versus Junction Temperature

Figure 4. Typical Latching Current versus Junction Temperature

TC, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)

I T, INSTANTANEOUS ONSTATE CURRENT (AMPS)

120 110 100 90 DC 80 70 60 50 40 0 0.1 30 60 90 120 0.5 180

10 MAXIMUM @ TJ = 25C MAXIMUM @ TJ = 110C

0.2 0.3 0.4 IT(RMS), RMS ON-STATE CURRENT (AMPS)

0.1

0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)

Figure 5. Typical RMS Current Derating

Figure 6. Typical OnState Characteristics

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MCR100 Series TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A H2B H2B

H W2 H4 H5 L1 L F1 P2 P1 P H1 W1 W T T2 P2 D T1

F2

Figure 7. Device Positioning on Tape

Specification Inches Symbol
D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1 P2 T T1 T2 W W1 W2

Millimeter Max Min

3.8 0.38 2.4 1.5 8.5 0 0 18 15.5 8.5 2.5 12.5 5.95 3.55 0.15 0.35 17.5 5.5 .15

Item Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Bottom of Component to Seating Plane Feedhole Location Deflection Left or Right Deflection Front or Rear Feedhole to Bottom of Component Feedhole to Seating Plane Defective Unit Clipped Dimension Lead Wire Enclosure Feedhole Pitch Feedhole Center to Center Lead First Lead Spacing Dimension Adhesive Tape Thickness Overall Taped Package Thickness Carrier Strip Thickness Carrier Strip Width Adhesive Tape Width Adhesive Tape Position

Min
0.1496 0.015 0.0945 .059 0.3346 0 0 0.7086 0.610 0.3346 0.09842 0.4921 0.2342 0.1397 0.06 0.014 0.6889 0.2165 .0059

Max
4.2 0.51 2.8 4.0 9.5 1.0 1.0 19.5 16.5 11 12.9 6.75 3.95 0.20 1.44 0.65 19 6.3 0.5

0.1653 0.020 0.110 .156 0.3741 0.039 0.051 0.768 0.649 0.433 0.5079 0.2658 0.1556 0.08 0.0567 0.027 0.7481 0.2841 0.01968

NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes.

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MCR100 Series
PACKAGE DIMENSIONS

TO92 (TO226) CASE 02911 ISSUE AL

A R P L
SEATING PLANE

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 0.250 0.080 0.105 0.100 0.115 0.135 MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 6.35 2.04 2.66 2.54 2.93 3.43

X X G H V
1

D J C SECTION XX N N

DIM A B C D G H J K L N P R V

STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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MCR100/D

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.