IMXRT1010CEC

NXP Semiconductors Document Number: IMXRT1010CEC
Data Sheet: Technical Data Rev. 0, 09/2019
MIMXRT1011DAE5A
i.MX RT1010 Crossover

Processors Data Sheet
for Consumer Products
Package Information
Plastic Package
80-Pin LQFP, 12 x 12 mm, 0.5 mm pitch
Ordering Information
See Table 1 on page 4
1 i.MX RT1010 introduction

The i.MX RT1010 is a member of i.MX RT real-time 1. i.MX RT1010 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
processor family based on the Arm® Cortex®-M7 core, 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4
which operates at speeds up to 500 MHz to provide high 2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
CPU performance and best real-time response. 2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
The i.MX RT1010 processor has 128 KB on-chip RAM, 3.1. Special signal considerations . . . . . . . . . . . . . . . 12
3.2. Recommended connections for unused analog
which can be flexibly configured as TCM or interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
general-purpose on-chip RAM. The i.MX RT1010 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15
integrates advanced power management module with 4.2. System power and clocks . . . . . . . . . . . . . . . . . . 21
DCDC and LDO that reduces complexity of external 4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 27
power supply and simplifies power sequencing. The 4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5. External memory interface . . . . . . . . . . . . . . . . . 34
i.MX RT1010 also provides various memory interfaces, 4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
including Quad SPI, and a wide range of connectivity 4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 49
interfaces, including UART, SPI, I2C, and USB; for 4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
connecting peripherals including WLAN, Bluetooth™, 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 55
and GPS. The i.MX RT1010 also has rich audio features, 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 55
5.2. Boot device interface allocation . . . . . . . . . . . . . . 55
including SPDIF and I2S audio interface. Various analog 6. Package information and contact assignments . . . . . . . 57
IP integration, including ADC, temperature sensor, and 6.1. 12 x 12 mm package information . . . . . . . . . . . . 57
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
etc.
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
i.MX RT1010 introduction
The i.MX RT1010 is specifically useful for applications, such as:

• Audio
• Industrial
• Motor Control
• Home Appliance
• IoT
1.1 Features
The i.MX RT1010 processors are based on Arm Cortex-M7 MPCore™ Platform, which has the
following features:
• Supports single Arm® Cortex®-M7 with:
— 16 KB L1 Instruction Cache
— 8 KB L1 Data Cache
— Full featured Floating Point Unit (FPU) with support of the VFPv5 architecture
— Support the Armv7-M Thumb instruction set, defined in the ARM v7-M architecture
• Integrated MPU, up to 16 individual protection regions
• Up to 128 KB I-TCM and D-TCM in total
• Up to 500 MHz frequency
• Cortex® M7 CoreSight™ components integration for debug
• Frequency of the core, as per Table 9, "Operating ranges," on page 16.
The SoC-level memory system consists of the following additional components:
— Boot ROM (64 KB)
— On-chip RAM (128 KB)
– Configurable RAM size up to 128 KB shared with CM7 TCM
• External memory interfaces:
— SPI NOR FLASH
— Single/Dual channel Quad SPI FLASH with XIP support and on-the-fly decryption
— Octal flash
• Timers and PWMs:
— Two General Programmable Timers (GPT)
– 4-channel generic 32-bit resolution timer for each
– Each support standard capture and compare operation
— Periodical Interrupt Timer (PIT)
– Generic 32-bit resolution timer
– Periodical interrupt generation
— FlexPWM
– Up to 4 submodules
i.MX RT1010 Crossover Processors Data Sheet for Consumer Products, Rev. 0, 09/2019
2 NXP Semiconductors
– 16-bit resolution PWM suitable for Motor Control applications

Each i.MX RT1010 processor enables the following interfaces to external devices (some of them are
muxed and not available simultaneously):
• Audio:
— SPDIF input and output
— Two synchronous audio interface (SAI) modules, which support I2S, AC97, TDM, and
codec/DSP interfaces
— MQS interface for medium quality audio via GPIO pads
• Connectivity:
— One USB 2.0 OTG controller with integrated PHY interface
— Four universal asynchronous receiver/transmitter (UART) modules
— Two I2C modules
— Two SPI modules
• GPIO and Pin Multiplexing:
— General-purpose input/output (GPIO) modules with interrupt capability
— Input/output multiplexing controller (IOMUXC) to provide centralized pad control
— 44 GPIOs for 80-pin LQFP package
— FlexIO
The i.MX RT1010 processors integrate advanced power management unit and controllers:
• Full PMIC integration, including on-chip DCDC and LDOs
• Temperature sensor with programmable trim points
• GPC hardware power management controller
The i.MX RT1010 processors support the following system debug:
• Arm® Cortex®-M7 CoreSight debug and trace architecture
• Trace Port Interface Unit (TPIU) to support off-chip real-time trace
• Support for 5-pin JTAG and SWD debug interfaces1
Security functions are enabled and accelerated by the following hardware:
• High Assurance Boot (HAB)
• Data Co-Processor (DCP):
— AES-128, ECB, and CBC mode
— SHA-1 and SHA-256
— CRC-32
• FlexSPI with On-The-Fly AES Decryption (OTFAD)
— AES-128, CTR mode
— On-the-fly QSPI Flash decryption
• True random number generation (TRNG)
1. SWD is the default debug interface.
NXP Semiconductors 3
• Secure Non-Volatile Storage (SNVS)

— Secure real-time clock (RTC)
— Zero Master Key (ZMK)
• Secure JTAG Controller (SJC)
NOTE
The actual feature set depends on the part numbers as described in Table 1.
Functions such as connectivity interfaces, and security features are not
offered on all derivatives.
1.2 Ordering information

Table 1 provides orderable part numbers covered by this data sheet.
Table 1. Ordering information
Junction
Part Number Features Package Temperature
Tj (C)
MIMXRT1011DAE5A • 500 MHz, consumer • SPI x2 12 x 12 mm 80-pin LQFP, 0.5 0 to 95

grade for general • KPP mm pitch
purpose • ADC x1
• DMA • FlexSPI
• Boot ROM (64KB) • FLEXIO
• On-chip RAM • GPIO
(128KB) • HAB/DCP/OTFAD
• USB OTG x1 • TRNG
• SAI x2 • SNVS
• SPDIF x1 • SJC
• MQS x1 • DCDC
• GPT x2 • Temperature sensor
• PWM x1 • GPC hardware power
• 4-channel PIT management
• WDOG x4 controller
• UART x4
• I2C x2
Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be
identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The
primary characteristic which describes which data sheet applies to a specific part is the temperature grade
(junction) field.
Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field
and matching it to the proper data sheet. If there are any questions, visit the web page nxp.com/IMXRT or
contact an NXP representative for details.
M IMX XX @ ## % + VV $ A
Qualification Level M Silicon Rev A
Prototype Samples P A0 A
Mass Production M
Special S
Frequency $
Part # series XX
400 MHz 4
i.MX RT RT
500 MHz 5
Family @ 600 MHz 6
First Generation RT family 1 700 MHz 7

Reserved 2 800 MHz 8
3
1000 MHz A
4
5
6 VV Package Type
7 AE 80-pin LQFP, 12 x 12 mm, 0.5 mm pitch
8
Sub-Family ## Temperature +
01 RT1010
02 RT1020 Tie % Consumer: 0 to + 95 °C D
05 RT1050 1 Standard Feature General Purpose

Industrial: -40 to +105 °C C
06 RT1060 5 Enhanced Feature
Figure 1. Part number nomenclature—i.MX RT1010
Architectural overview
2 Architectural overview
The following subsections provide an architectural overview of the i.MX RT1010 processor system.
2.1 Block diagram

Figure 2 shows the functional modules in the i.MX RT1010 processor system1.
System Control CPU Platform

Connectivity
ARM Cortex-M7
Security JTAG UART x4
16 KB I-cache 8 KB D-cache
PLL / OSC 4 x 4 Keypad
FPU NVIC
RTC and Reset HSGPIO MPU I2C x2
128K I-TCM and D-TCM

Embedded DMA SPI x2
IOMUX FlexIO
External Memory
Dual-Channel Quad-SPI GPIO

GP Timer x3
Octal/Hyper Flash/RAM
FlexSPI with on-the-fly AES decryption I2S / SAI x2
FlexPWM x1
SPDIF Tx/Rx
Watch Dog x4 Security
MQS
HAB
Power Management
DCDC USB2.0 OTG with PHY x1
LDO Ciphers RNG

Internal Memory
Temp Monitor
128 KB SRAM shared with TCM
ADC Secure RTC eFuse
ADC (15-ch) x1 64 KB ROM
Figure 2. i.MX RT1010 system block diagram
1. Some modules shown in this block diagram are not offered on all derivatives. See Table 1 for details.
Modules list
3 Modules list
The i.MX RT1010 processors contain a variety of digital and analog modules. Table 2 describes these
modules in alphabetical order.
Table 2. i.MX RT1010 modules list
Block mnemonic Block name Subsystem Brief description
ADC1 Analog to Digital Analog The ADC is a 12-bit general purpose analog to digital
Converter converter.
ADC_ETC ADC External Trigger Analog The ADC_ETC enables multiple users to share an ADC
Control module in a Time-Division-Multiplexing (TDM) way.
AOI And-Or-Inverter Cross Trigger The AOI provides a universal boolean function
generator with using a four team sum of products
expression, for each product term containing true or
complement values of the four selected inputs (A, B, C,
D).
Arm Arm Platform Arm The Arm Core Platform includes 1x Cortex-M7 core. It
also includes associated sub-blocks, such as Nested
Vectored Interrupt Controller (NVIC), Floating-Point
Unit (FPU), Memory Protection Unit (MPU), and
CoreSight debug modules.
CCM Clock Control Module, Clocks, Resets, and These modules are responsible for clock and reset
GPC General Power Power Control distribution in the system, and also for the system
SRC Controller, System Reset power management.
Controller
CSU Central Security Unit Security The Central Security Unit (CSU) is responsible for
setting comprehensive security policy within the i.MX
RT1010 platform.
DAP Debug Access Port System Control The DAP provides real-time access for the debugger
Peripherals without halting the core to:
• System memory and peripheral registers
• All debug configuration registers
The DAP also provides debugger access to JTAG scan
chains. The DAP module is internal to the Cortex-M7
Core Platform.
DCDC DCDC Converter Analog The DCDC module is used for generating power supply
for core logic. Main features are:
• Adjustable high efficiency regulator
• Supports 3.3 V input voltage
• Supports nominal run and low power standby modes
• Supports at 0.9 ~ 1.3 V output in run mode
• Supports at 0.9 ~ 1.0 V output in standby mode
• Over current and over voltage detection
Modules list
Table 2. i.MX RT1010 modules list (continued)
eDMA enhanced Direct Memory System Control There is an enhanced DMA (eDMA) engine and
Access Peripherals DMA_MUX.
• The eDMA is a 16-channel DMA engine, which is
capable of performing complex data transfers with
minimal intervention from a host processor.
• The DMA_MUX is capable of multiplexing up to 128
DMA request sources to the 16 DMA channels of
eDMA.
EWM External Watchdog Timer Peripherals The EWM modules is designed to monitor external
Monitor circuits, as well as the software flow. This provides a
back-up mechanism to the internal WDOG that can
reset the system. The EWM differs from the internal
WDOG in that it does not reset the system. The EWM,
if allowed to time-out, provides an independent trigger
pin that when asserted resets or places an external
circuit into a safe mode.
FlexIO1 Flexible Input/output Connectivity and The FlexIO is capable of supporting a wide range of
Communications protocols including, but not limited to: UART, I2C, SPI,
I2S, camera interface, display interface, PWM
waveform generation, etc. The module can remain
functional when the chip is in a low power mode
provided the clock it is using remain active.
FlexPWM1 Pulse Width Modulation Timer Peripherals The pulse-width modulator (PWM) contains four PWM
sub-modules, each of which is set up to control a single
half-bridge power stage. Fault channel support is
provided. The PWM module can generate various
switching patterns, including highly sophisticated
waveforms.
FlexRAM RAM Memories The i.MX RT1010 has 128 KB of on-chip RAM which
could be flexible allocated to I-TCM, D-TCM, and
on-chip RAM (OCRAM) in a 32 KB granularity. The
FlexRAM is the manager of the 128 KB on-chip RAM
array. Major functions of this blocks are: interfacing to
I-TCM and D-TCM of Arm core and OCRAM controller;
dynamic RAM arrays allocation for I-TCM, D-TCM, and
OCRAM.
FlexSPI Quad Serial Peripheral Connectivity and FlexSPI acts as an interface to one or two external
Interface Communications serial flash devices, each with up to four bidirectional
data lines.
GPIO1 General Purpose I/O System Control Used for general purpose input/output to external ICs.
GPIO2 Modules Peripherals Each GPIO module supports up to 32 bits of I/O.
GPIO5
Modules list
GPT1 General Purpose Timer Timer Peripherals Each GPT is a 32-bit “free-running” or “set and forget”
GPT2 mode timer with programmable prescaler and compare
and capture register. A timer counter value can be
captured using an external event and can be configured
to trigger a capture event on either the leading or trailing
edges of an input pulse. When the timer is configured to
operate in “set and forget” mode, it is capable of
providing precise interrupts at regular intervals with
minimal processor intervention. The counter has output
compare logic to provide the status and interrupt at
comparison. This timer can be configured to run either
on an external clock or on an internal clock.
KPP Keypad Port Human Machine The KPP is a 16-bit peripheral that can be used as a
Interfaces keypad matrix interface or as general purpose
input/output (I/O). It supports 8 x 8 external key pad
matrix. Main features are:
• Multiple-key detection
• Long key-press detection
• Standby key-press detection
• Supports a 2-point and 3-point contact key matrix
LPI2C1 Low Power Connectivity and The LPI2C is a low power Inter-Integrated Circuit (I2C)
LPI2C2 Inter-integrated Circuit Communications module that supports an efficient interface to an I2C bus
as a master.
The I2C provides a method of communication between
a number of external devices. More detailed
information, see Section 4.8.2, "LPI2C module timing
parameters".
LPSPI1 Low Power Serial Connectivity and The LPSPI is a low power Serial Peripheral Interface
LPSPI2 Peripheral Interface Communications (SPI) module that support an efficient interface to an
SPI bus as a master and/or a slave.
• It can continue operating while the chip is in stop
mode, if an appropriate clock is available.
• Designed for low CPU overhead, with DMA off
loading of FIFO register access.
LPUART1 UART Interface Connectivity Each of the UART modules support the following serial
LPUART2 Peripherals data transmit/receive protocols and configurations:
LPUART3 • 7- bit or 8-bit data words, 1 or 2 stop bits,
LPUART4 programmable parity (even, odd or none)
• Programmable baud rates up to 5 Mbps.
OTFAD On-the-Fly AES Security OTFAD co-works with FlexSPI to provide superior
Decryption cryptographic decryption capabilities without
compromising system performance.
PIT Periodical Interrupt Timer Timer Peripherals The PIT features 32-bit counter timer, programmable
count modules, clock division, interrupt generation, and
a slave mode to synchronize count enable for multiple
PITs.
MQS Medium Quality Sound Multimedia MQS is used to generate 2-channel medium quality
Peripherals PWM-like audio via two standard digital GPIO pins.
Modules list
ROMCP ROM Controller with Memories and The ROMCP acts as an interface between the Arm
Patch Memory Controllers advanced high-performance bus and the ROM. The
on-chip ROM is only used by the Cortex-M7 core during
boot up. Size of the ROM is 64 KB.
RTC OSC Real Time Clock Clock Sources and The RTC OSC provides the clock source for the
Oscillator Control Real-Time Clock module. The RTC OSC module, in
conjunction with an external crystal, generates a 32.678
kHz reference clock for the RTC.
RTWDOG Watch Dog Timer Peripherals The RTWDG module is a high reliability independent
timer that is available for system to use. It provides a
safety feature to ensure software is executing as
planned and the CPU is not stuck in an infinite loop or
executing unintended code. If the WDOG module is not
serviced (refreshed) within a certain period, it resets the
MCU. Windowed refresh mode is supported as well.
SAI1 Synchronous Audio Multimedia The SAI module provides a synchronous audio
SAI3 Interface Peripherals interface (SAI) that supports full duplex serial interfaces
with frame synchronization, such as I2S, AC97, TDM,
and codec/DSP interfaces.
SA-TRNG Standalone True Random Security The SA-TRNG is hardware accelerator that generates
Number Generator a 512-bit entropy as needed by an entropy consuming
module or by other post processing functions.
SJC Secure JTAG Controller System Control The SJC provides JTAG interface, which complies with
Peripherals JTAG TAP standards, to internal logic. The i.MX
RT1010 processors use JTAG port for production,
testing, and system debugging. In addition, the SJC
provides BSR (Boundary Scan Register) standard,
which complies with IEEE1149.1 and IEEE1149.6.
The JTAG port is accessible during platform initial
laboratory bring-up, for manufacturing tests and
troubleshooting, as well as for software debugging by
authorized entities. The i.MX RT1010 SJC incorporates
three security modes for protecting against
unauthorized accesses. Modes are selected through
eFUSE configuration.
SNVS Secure Non-Volatile Security Secure Non-Volatile Storage, including Secure Real
Storage Time Clock, Security State Machine, and Master Key
Control.
SPDIF Sony Philips Digital Multimedia A standard audio file transfer format, developed jointly
Interconnect Format Peripherals by the Sony and Phillips corporations. It has Transmitter
and Receiver functionality.
Temp Monitor Temperature Monitor Analog The temperature sensor implements a temperature
sensor/conversion function based on a
temperature-dependent voltage to time conversion.
Modules list
USB 2.0 Universal Serial Bus 2.0 Connectivity USB 2.0 (USB OTG1) contains:
Peripherals • One high-speed OTG 2.0 module with integrated HS
USB PHY
• Support eight Transmit (TX) and eight Receive (RX)
endpoints, including endpoint 0
WDOG1 Watch Dog Timer Peripherals The Watch Dog Timer supports two comparison points
WDOG2 during each counting period. Each of the comparison
WDOG3 points is configurable to evoke an interrupt to the Arm
core, and a second point evokes an external event on
the WDOG line.
XBAR Cross BAR Cross Trigger Each crossbar switch is an array of muxes with shared
inputs. Each mux output provides one output of the
crossbar. The number of inputs and the number of
muxes/outputs are user configurable and registers are
provided to select which of the shared inputs are routed
to each output.
Modules list
3.1 Special signal considerations

Table 3 lists special signal considerations for the i.MX RT1010 processors. The signal names are listed in
alphabetical order.
The package contact assignments can be found in Section 6, "Package information and contact
assignments".” Signal descriptions are provided in the i.MX RT1010 Reference Manual
(IMXRT1010RM).
Table 3. Special signal considerations
Signal name Remarks
DCDC_PSWITCH PAD is in DCDC_IN domain and connected the ground to bypass DCDC.
To enable DCDC function, assert to DCDC_IN with at least 1 ms delay for DCDC_IN rising edge.
RTC_XTALI/RTC_XTALO If the user wishes to configure RTC_XTALI and RTC_XTALO as an RTC oscillator, a 32.768 kHz
crystal, (100 k ESR, 10 pF load) should be connected between RTC_XTALI and RTC_XTALO.
Keep in mind the capacitors implemented on either side of the crystal are about twice the crystal
load capacitor. To hit the exact oscillation frequency, the board capacitors need to be reduced to
account for board and chip parasitics. The integrated oscillation amplifier is self biasing, but
relatively weak. Care must be taken to limit parasitic leakage from RTC_XTALI and RTC_XTALO
to either power or ground (>100 M). This will debias the amplifier and cause a reduction of
startup margin. Typically RTC_XTALI and RTC_XTALO should bias to approximately 0.5 V.
If it is desired to feed an external low frequency clock into RTC_XTALI, the RTC_XTALO pin must
remain unconnected or driven with a complimentary signal. The logic level of this forcing clock
should not exceed VDD_SNVS_CAP level and the frequency should be <100 kHz under typical
conditions.
In case when high accuracy real time clock are not required, system may use internal low
frequency ring oscillator. It is recommended to connect RTC_XTALI to GND and keep
RTC_XTALO unconnected.
XTALI/XTALO A 24.0 MHz crystal should be connected between XTALI and XTALO. External load capacitance
value depends on the typical load capacitance of crystal used and PCB design.
The crystal must be rated for a maximum drive level of 250 W. An ESR (equivalent series
resistance) of typical 80  is recommended. NXP SDK software requires 24 MHz on
XTALI/XTALO.
The crystal can be eliminated if an external 24 MHz oscillator is available in the system. In this
case, XTALO must be directly driven by the external oscillator and XTALI mounted with 18 pF
capacitor. The logic level of this forcing clock cannot exceed NVCC_PLL level.
If this clock is used as a reference for USB, then there are strict frequency tolerance and jitter
requirements. See OSC24M chapter and relevant interface specifications chapters for details.
If driving the chip with an external clock source, then a 24 MHz oscillator can be driven in one of
three configurations using a nominal 1.1 V source.
• A single ended external clock source can be used to overdrive the output of the amplifier
(XTALO). Since the oscillation sensing amplifier is differential, the XTALI pin should be
externally floating and capacitively loaded. The combination of the internal biasing resistor and
the external capacitor will filter the signal applied to the XTALO pin and develop a rough
reference for the sensing amplifier to compare.
• A single ended external clock source can be used to drive XTALI. In this configuration, XTALO
should be left externally unconnected.
• A differential external clock source can be used to drive both XTALI and XTALO.
Generally, second configuration is anticipated to be the most used configuration, but all three
configurations may be utilized.
GPANAIO This signal is reserved for NXP manufacturing use only. This output must remain unconnected.
Modules list
Table 3. Special signal considerations (continued)
Signal name Remarks
JTAG_nnnn The JTAG interface is summarized in Table 4. Use of external resistors is unnecessary. However,
if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is
followed. For example, do not use an external pull down on an input that has on-chip pull-up.
JTAG_TDO is configured with a keeper circuit such that the non-connected condition is eliminated
if an external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and
should be avoided.
JTAG_MOD is referenced as SJC_MOD in the i.MX RT1010 reference manual. Both names refer
to the same signal. JTAG_MOD must be externally connected to GND for normal operation.
Termination to GND through an external pull-down resistor (such as 1 k) is allowed. JTAG_MOD
set to hi configures the JTAG interface to mode compliant with IEEE1149.1 standard. JTAG_MOD
set to low configures the JTAG interface for common SW debug adding all the system TAPs to the
chain.
NC These signals are No Connect (NC) and should be disconnected by the user.
POR_B This cold reset negative logic input resets all modules and logic in the IC.
May be used in addition to internally generated power on reset signal (logical AND, both internal
and external signals are considered active low).
ONOFF ONOFF can be configured in debounce, off to on time, and max time-out configurations. The
debounce and off to on time configurations supports 0, 50, 100, and 500 ms. Debounce is used to
generate the power off interrupt. While in the ON state, if ONOFF button is pressed longer than
the debounce time, the power off interrupt is generated. Off to on time supports the time it takes
to request power on after a configured button press time has been reached. While in the OFF
state, if ONOFF button is pressed longer than the off to on time, the state will transition from OFF
to ON. Max time-out configuration supports 5, 10, 15 seconds, and disable. Max time-out
configuration supports the time it takes to request power down after ONOFF button has been
pressed for the defined time.
TEST_MODE TEST_MODE is for NXP factory use. The user must tie this pin directly to GND.
Table 4. JTAG controller interface summary
JTAG I/O type On-chip termination
JTAG_TCK Input 100 kpull-down

JTAG_TMS Input 47 kpull-up
JTAG_TDI Input 47 kpull-up

JTAG_TDO 3-state output Keeper
JTAG_TRSTB Input 47 kpull-up
JTAG_MOD Input 100 kpull-down
3.2 Recommended connections for unused analog interfaces

Table 5 shows the recommended connections for unused analog interfaces.
Modules list
Table 5. Recommended connections for unused analog interfaces
Recommendations
Module Pad name
if unused
USB USB_OTG1_CHD_B, USB_OTG1_DN, USB_OTG1_DP, USB_OTG1_VBUS Not connected
ADC VDDA_ADC_3P3 VDDA_ADC_3P3

must be powered
even if the ADC is
not used.
Electrical characteristics
4 Electrical characteristics
This section provides the device and module-level electrical characteristics for the i.MX RT1010
processors.
4.1 Chip-level conditions

This section provides the device-level electrical characteristics for the IC. See Table 6 for a quick reference
to the individual tables and sections.
Table 6. i.MX RT1010 chip-Level conditions
For these characteristics Topic appears
Absolute maximum ratings on page 15
Thermal resistance on page 16
Operating ranges on page 16
External clock sources on page 18
Maximum supply currents on page 18
Low power mode supply currents on page 20
USB PHY current consumption on page 20
4.1.1 Absolute maximum ratings

CAUTION
Stress beyond those listed under Table 7 may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any other conditions beyond those indicated
under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 7 shows the absolute maximum operating ratings.
Table 7. Absolute maximum ratings
Parameter Description Symbol Min Max Unit
Core supplies input voltage VDD_SOC_IN -0.3 1.6 V
VDD_HIGH_IN supply voltage VDD_HIGH_IN -0.3 3.7 V
Power for DCDC DCDC_IN -0.3 3.6 V
Supply input voltage to Secure Non-Volatile Storage VDD_SNVS_IN -0.3 3.6 V

and Real Time Clock
USB VBUS supply USB_OTG1_VBUS — 5.5 V
Supply for 12-bit ADC VDDA_ADC -0.3 3.6 V
IO supply for GPIO bank (3.3 V mode) NVCC_GPIO -0.3 3.6 V
Table 7. Absolute maximum ratings (continued)
ESD Damage Immunity: Vesd
Human Body Model (HBM) — 1000 V

Charge Device Model (CDM) — 500
Input/Output Voltage range Vin/Vout -0.5 OVDD + 0.31 V

o
Storage Temperature range TSTORAGE -40 150 C
1
OVDD is the I/O supply voltage.
4.1.2 Thermal resistance

Following sections provide the thermal resistance data.
4.1.2.1 Package thermal characteristics

Table 8 displays the 12 x 12 mm LQFP package thermal resistance data.
Table 8. 12 x 12 mm package thermal resistance data
Rating Board type1 Symbol Value Unit

oC/W
Junction to Ambient JESD51-9, 2s2p RJA 46.5
Thermal Resistance2
oC/W
Junction to Package Top JESD51-9, 2s2p JT 2.0
Thermal Resistance2
Junction to Case Thermal Resistance3 JESD51-9, 1s RJC 22.1 oC/W
1
Thermal test board meets JEDEC specification for this package (JESD51-9)
2 Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is
solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not
meant to predict the performance of a package in an application-specific environment.
3 Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold surface
temperature at the package top side dead centre.
4.1.3 Operating ranges

Table 9 provides the operating ranges of the i.MX RT1010 processors. For details on the chip's power
structure, see the “Power Management Unit (PMU)” chapter of the i.MX RT1010 Reference Manual
(IMXRT1010RM).
Table 9. Operating ranges
Parameter Operating
Symbol Min Typ Max1 Unit Comment
Description Conditions
Table 9. Operating ranges (continued)
Run Mode VDD_SOC_IN Overdrive 1.25 — 1.3 V —
VDD_SOC_IN M7 core at 396 1.15 — 1.3 V —

MHz
M7 core at 132 1.15 — 1.3

MHz
M7 core at 24 0.925 — 1.3

MHz
IDLE Mode VDD_SOC_IN M7 core 1.15 — 1.3 V —

operation at 396
MHz or below
SUSPEND (DSM) VDD_SOC_IN — 0.925 — 1.3 V Refer to Table 12 Low power mode
Mode current and power consumption
SNVS Mode VDD_SOC_IN — 0 1.3 V —
Power for DCDC DCDC_IN — 3.0 3.3 3.6 —
VDD_HIGH VDD_HIGH_IN2 — 3.0 — 3.6 V Must match the range of voltages

internal regulator that the rechargeable backup
battery supports.
Backup battery VDD_SNVS_IN3 — 2.40 — 3.6 V Can be combined with

supply range VDDHIGH_IN, if the system does
not require keeping real time and
other data on OFF state.
USB supply USB_OTG1_VBUS — 4.40 — 5.5 V —

voltages
A/D converter VDDA_ADC_3P3 — 3.0 3.3 3.6 V VDDA_ADC_3P3 must be

powered even if the ADC is not
used.
VDDA_ADC_3P3 cannot be
powered when the other SoC
supplies (except VDD_SNVS_IN)
are off.
Temperature Operating Ranges

oC
Junction Tj Standard 0 — 95 See the application note, i.MX
temperature Commercial RT1010 Product Lifetime Usage
Estimates for information on
product lifetime (power-on years)
for this processor.
1 Applying the maximum voltage results in maximum power consumption and heat generation. NXP recommends a voltage set
point = (Vmin + the supply tolerance). This result in an optimized power/speed ratio.
2 Applying the maximum voltage results in shorten lifetime. 3.6 V usage limited to < 1% of the use profile. Reset of profile limited
to below 3.49 V.
3 In setting VDD_SNVS_IN voltage with regards to Charging Currents and RTC, refer to the i.MX RT1010 Hardware
Development Guide (IMXRT1010HDG).
4.1.4 External clock sources

Each i.MX RT1010 processor has two external input system clocks: a low frequency (RTC_XTALI) and
a high frequency (XTALI).
The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,
power-down real time clock operation, slow system and watch-dog counters. The clock input can be
connected to either external oscillator or a crystal using internal oscillator amplifier. Additionally, there is
an internal ring oscillator, which can be used instead of the RTC_XTALI if accuracy is not important.
The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other
peripherals. The system clock input can be connected to either external oscillator or a crystal using internal
oscillator amplifier.
Table 10 shows the interface frequency requirements.
Table 10. External input clock frequency
Parameter Description Symbol Min Typ Max Unit
RTC_XTALI Oscillator1,2 fckil — 32.7683/32.0 — kHz
XTALI Oscillator2,4 fxtal — 24 — MHz

1 External oscillator or a crystal with internal oscillator amplifier.
2
The required frequency stability of this clock source is application dependent. For recommendations, see the Hardware
Development Guide for i.MX RT1010 Crossover Processors (IMXRT1010HDG).
3 Recommended nominal frequency 32.768 kHz.
4 External oscillator or a fundamental frequency crystal with internal oscillator amplifier.
The typical values shown in Table 10 are required for use with NXP SDK to ensure precise time keeping
and USB operation. For RTC_XTALI operation, two clock sources are available.
• External crystal oscillator with on-chip support circuit:
— At power up, ring oscillator is utilized. After crystal oscillator is stable, the clock circuit
switches over to the crystal oscillator automatically.
— Higher accuracy than ring oscillator
— If no external crystal is present, then the ring oscillator is utilized
The decision of choosing a clock source should be taken based on real-time clock use and precision
time-out.
4.1.5 Maximum supply currents

The data shown in Table 11 represent a use case designed specifically to show the maximum current
consumption possible. All cores are running at the defined maximum frequency and are limited to L1
cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a very limited
practical use case, if at all, and be limited to an extremely low duty cycle unless the intention was to
specifically show the worst case power consumption.
See the i.MX RT1010 Power Consumption Measurement Application Note for more details on typical
power consumption under various use case definitions.
Table 11. Maximum supply currents
Power Rail Conditions Max Current Unit
DCDC_IN Max power for chip at 125 oC 200 mA
VDD_HIGH_IN Include internal loading in analog 75 mA
VDD_SNVS_IN — 57.5 A
USB_OTG1_VBUS 25 mA for each active USB interface 25 mA
VDDA_ADC_3P3 3.3 V power supply for 12-bit ADC, 600 34.5 mA

A typical, 750 A max, for each ADC.
100 Ohm max loading for touch panel,
cause 33 mA current.
4.1.6 Low power mode supply currents

Table 12 shows the current core consumption (not including I/O) of i.MX RT1010 processors in selected
low power modes.
Table 12. Low power mode current and power consumption
Mode Test Conditions Supply Typical1 Units
SYSTEM IDLE • SOC_VDD_IN set to 1.1 V for SOG and ARM DCDC_IN (3.3 V) 2.09 mA
• CPU in WFI, CPU clock gated
• 24 MHz XTAL is ON VDD_HIGH_IN (3.3 V) 6.58
• System PLL is active, other PLLs are power down VDD_SNVS_IN (3.3 V) 0.019
• Peripheral clock gated, but remain powered
Total 28.67 mW
LOW POWER IDLE • SOC_VDD_IN set to Weak mode DCDC_IN (3.3 V) 0.778 mA
• CPU in Power Gate mode
• All PLLs are power down VDD_HIGH_IN (3.3 V) 0.245
• 24 MHz XTAL is off, 24 MHz RCOSC used as VDD_SNVS_IN (3.3 V) 0.042
clock source
• Peripheral are powered off Total 3.51 mW
SUSPEND • SOC_VDD_IN is shut off DCDC_IN (3.3 V) 0.10 mA

(DSM) • CPU in Power Gate mode
• All PLLs are power down VDD_HIGH_IN (3.3 V) 0.02
• 24 MHz XTAL is off, 24 MHz RCOSC is off VDD_SNVS_IN (3.3 V) 0.015
• All clocks are shut off, except 32 kHz RTC
• Peripheral are powered off Total 0.45 mW
SNVS (RTC) • All SOC digital logic, analog module are shut off DCDC_IN (0 V) 0 mA
• 32 kHz RTC is alive
VDD_HIGH_IN (0 V) 0
VDD_SNVS_IN (3.3 V) 0.015
Total 0.05 mW
1
The typical values shown here are for information only and are not guaranteed. These values are average values measured
on a typical process wafer at 25oC.
4.1.7 USB PHY current consumption
4.1.7.1 Power down mode

In power down mode, everything is powered down, including the USB VBUS valid detectors in typical
condition. Table 13 shows the USB interface current consumption in power down mode.
Table 13. USB PHY current consumption in power down mode
VDD_USB_CAP (3.0 V) VDD_HIGH_CAP (2.5 V) NVCC_PLL (1.1 V)
Current 5.1 A 1.7 A < 0.5 A
NOTE
The currents on the VDD_HIGH_CAP and VDD_USB_CAP were
identified to be the voltage divider circuits in the USB-specific level
shifters.
4.2 System power and clocks

This section provide the information about the system power and clocks.
4.2.1 Power supplies requirements and restrictions

The system design must comply with power-up sequence, power-down sequence, and steady state
guidelines as described in this section to guarantee the reliable operation of the device. Any deviation
from these sequences may result in the following situations:
• Excessive current during power-up phase
• Prevention of the device from booting
• Irreversible damage to the processor (worst-case scenario)
Power On Run Mode <-> Standby Mode Run Mode <-> SNVS Mode
TSNVSDly
VDD_SNVS_IN
VDD_SNVS_CAP
DCDC_IN
VDD_HIGH_CAP
NVCC_PLL
POR_B
PMIC_ON_REQ TStbyExt
1ms
PMIC_STBY_REQ
DCDC_PSWITCH
ON_OFF
VDD_SOC_IN 1ms
DCDC_OK
TDCDCSetup
Signal Floating DCDC_LP power rail VDD_SNVS_IN power rail
LEGEND VDD_SOC power rail DCDC_IN power rail VDD_SNVS_CAP power rail VDDA_2P5_CAP power rail
Signal in VDD_SOC power Signal in DCDC_IN power Signal in VDD_SNVS_CAP

domain domain power domain VDDA_1P1_CAP power rail
Figure 3. Power sequence
4.2.1.1 Power-up sequence

The below restrictions must be followed:
• VDD_SNVS_IN supply must be turned on before any other power supply or be connected
(shorted) with VDD_HIGH_IN supply.
• If a coin cell is used to power VDD_SNVS_IN, then ensure that it is connected before any other
supply is switched on.
• When internal DCDC is enabled, external delay circuit is required to delay the
“DCDC_PSWITCH” signal at least 1 ms after DCDC_IN is stable.
• POR_B should be held low during the entire power up sequence.
NOTE
The POR_B input (if used) must be immediately asserted at power-up and
remain asserted until after the last power rail reaches its working voltage. In
the absence of an external reset feeding the POR_B input, the internal POR
module takes control. It is recommended to reset IC. See the i.MX RT1010
Reference Manual (IMXRT1010RM) for further details and to ensure that
all necessary requirements are being met.
NOTE
Need to ensure that there is no back voltage (leakage) from any supply on
the board towards the 3.3 V supply (for example, from the external
components that use the 3.3 V supply).
NOTE
USB_OTG1_VBUS and VDDA_ADC_3P3 are not part of the power
supply sequence and may be powered at any time.
4.2.1.2 Power-down sequence

The following restrictions must be followed:
• VDD_SNVS_IN supply must be turned off after any other power supply or be connected (shorted)
with VDD_HIGH_IN supply.
• If a coin cell is used to power VDD_SNVS_IN, then ensure that it is removed after any other supply
is switched off.
4.2.1.3 Power supplies usage

All I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx) is OFF.
This can cause internal latch-up and malfunctions due to reverse current flows. For information about I/O
power supply of each pin, see “Power Rail” columns in pin list tables of Section 6, "Package information
and contact assignments".”
4.2.2 Integrated LDO voltage regulator parameters

Various internal supplies can be powered ON from internal LDO voltage regulators. All the supply pins
named *_CAP must be connected to external capacitors. The onboard LDOs are intended for internal use
only and should not be used to power any external circuitry. See the i.MX RT1010 Reference Manual
(IMXRT1010RM) for details on the power tree scheme.
NOTE
The *_CAP signals should not be powered externally. These signals are
intended for internal LDO operation only.
4.2.2.1 Digital regulators (LDO_SNVS)

There are one digital LDO regulator (“Digital”, because of the logic loads that they drive, not because of
their construction). The advantages of the regulator is to reduce the input supply variation because of its
input supply ripple rejection and its on-die trimming. This translates into more stable voltage for the
on-chip logics.
The regulator has two basic modes:
• Power Gate. The regulation FET is switched fully off limiting the current draw from the supply.
The analog part of the regulator is powered down here limiting the power consumption.
• Analog regulation mode. The regulation FET is controlled such that the output voltage of the
regulator equals the programmed target voltage. The target voltage is fully programmable in 25 mV
steps.
For additional information, see the i.MX RT1010 Reference Manual (IMXRT1010RM).
4.2.2.2 Regulators for analog modules
4.2.2.2.1 LDO_1P1
The LDO_1P1 regulator implements a programmable linear-regulator function from VDD_HIGH_IN (see
Table 9 for minimum and maximum input requirements). Typical Programming Operating Range is 1.0 V
to 1.2 V with the nominal default setting as 1.1 V. The LDO_1P1 supplies the USB Phy, and PLLs. A
programmable brown-out detector is included in the regulator that can be used by the system to determine
when the load capability of the regulator is being exceeded to take the necessary steps. Current-limiting
can be enabled to allow for in-rush current requirements during start-up, if needed. Active-pull-down can
also be enabled for systems requiring this feature.
For information on external capacitor requirements for this regulator, see the Hardware Development
Guide for i.MX RT1010 Crossover Processors (IMXRT1010HDG).
4.2.2.2.2 LDO_2P5
The LDO_2P5 module implements a programmable linear-regulator function from VDD_HIGH_IN (see
Table 9 for minimum and maximum input requirements). Typical Programming Operating Range is 2.25 V
to 2.75 V with the nominal default setting as 2.5 V. LDO_2P5 supplies the USB PHY, E-fuse module, and
PLLs. A programmable brown-out detector is included in the regulator that can be used by the system to
determine when the load capability of the regulator is being exceeded, to take the necessary steps.
Current-limiting can be enabled to allow for in-rush current requirements during start-up, if needed.
Active-pull-down can also be enabled for systems requiring this feature. An alternate self-biased
low-precision weak-regulator is included that can be enabled for applications needing to keep the output
voltage alive during low-power modes where the main regulator driver and its associated global bandgap
reference module are disabled. The output of the weak-regulator is not programmable and is a function of
the input supply as well as the load current. Typically, with a 3 V input supply the weak-regulator output
is 2.525 V and its output impedance is approximately 40 .
4.2.2.2.3 LDO_USB
The LDO_USB module implements a programmable linear-regulator function from the USB VUSB
voltages (4.4 V–5.5 V) to produce a nominal 3.0 V output voltage. A programmable brown-out detector
is included in the regulator that can be used by the system to determine when the load capability of the
regulator is being exceeded, to take the necessary steps. This regulator has a built in power-mux that allows
the user to select to run the regulator from either USB VBUS supply, when both are present. If only one
of the USB VBUS voltages is present, then, the regulator automatically selects this supply. Current limit
is also included to help the system meet in-rush current targets.
4.2.2.2.4 DCDC
DCDC can be configured to operate on power-save mode when the load current is less than 50 mA. During
the power-save mode, the converter operates with reduced switching frequency in PFM mode and with a
minimum quiescent current to maintain high efficiency.
DCDC can detect the peak current in the P-channel switch. When the peak current exceeds the threshold,
DCDC will give an alert signal, and the threshold can be configured. By this way, DCDC can roughly
detect the current loading.
DCDC also includes the following protection functions:
• Over current protection. In run mode, DCDC shuts down when detecting abnormal large current in
the P-type power switch. In power save mode, DCDC stop charging inductor when detecting large
current in the P-type power switch. The threshold is also different in run mode and in power save
mode: the former is 1 A–2A, and the latter is 200 mA–250 mA.
• Over voltage protection. DCDC shuts down when detecting the output voltage is too high.
• Low voltage detection. DCDC shuts down when detecting the input voltage is too low.
NOTE
It is recommended that using the internal DCDC as core supply for cost
solution.
If the DCDC bypass mode is used, it is not recommended to switch back to
the internal DCDC mode.
4.2.3 PLL’s electrical characteristics

This section provides PLL electrical characteristics.
4.2.3.1 Audio PLL’s electrical parameters
Table 14. Audio PLL’s electrical parameters
Parameter Value
Clock output range 650 MHz ~1.3 GHz
Reference clock 24 MHz
Lock time < 11250 reference cycles
4.2.3.2 System PLL
Table 15. System PLL’s electrical parameters
Parameter Value
Clock output range 528 MHz PLL output
4.2.3.3 Ethernet PLL
Table 16. Ethernet PLL’s electrical parameters
Parameter Value
Clock output range 1 GHz
4.2.3.4 USB PLL
Table 17. USB PLL’s electrical parameters
Parameter Value
Clock output range 480 MHz PLL output
4.2.4 On-chip oscillators
4.2.4.1 OSC24M
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implement an oscillator. The oscillator is powered from NVCC_PLL.
The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight
forward biased-inverter implementation is used.
4.2.4.2 OSC32K
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implement a low power oscillator. It also implements a power mux such that it can be powered
from either a ~3 V backup battery (VDD_SNVS_IN) or VDD_HIGH_IN such as the oscillator consumes
power from VDD_HIGH_IN when that supply is available and transitions to the backup battery when
VDD_HIGH_IN is lost.
In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 K
will automatically switch to a crude internal ring oscillator. The frequency range of this block is
approximately 10–45 kHz. It highly depends on the process, voltage, and temperature.
The OSC32k runs from VDD_SNVS_CAP supply, which comes from the
VDD_HIGH_IN/VDD_SNVS_IN. The target battery is a ~3 V coin cell. Proper choice of coin cell type
is necessary for chosen VDD_HIGH_IN range. Appropriate series resistor (Rs) must be used when
connecting the coin cell. Rs depends on the charge current limit that depends on the chosen coin cell. For
example, for Panasonic ML621:
• Average Discharge Voltage is 2.5 V
• Maximum Charge Current is 0.6 mA
For a charge voltage of 3.2 V, Rs = (3.2-2.5)/0.6 m = 1.17 k.
Table 18. OSC32K main characteristics
Min Typ Max Comments
Fosc — 32.768 KHz — This frequency is nominal and determined mainly by the crystal selected.
32.0 K would work as well.
Current consumption — 4 A — The 4 A is the consumption of the oscillator alone (OSC32k). Total supply
consumption will depend on what the digital portion of the RTC consumes.
The ring oscillator consumes 1 A when ring oscillator is inactive, 20 A
when the ring oscillator is running. Another 1.5 A is drawn from vdd_rtc in
the power_detect block. So, the total current is 6.5 A on vdd_rtc when the
ring oscillator is not running.
Bias resistor — 14 M — This integrated bias resistor sets the amplifier into a high gain state. Any
leakage through the ESD network, external board leakage, or even a
scope probe that is significant relative to this value will debias the amp. The
debiasing will result in low gain, and will impact the circuit's ability to start
up and maintain oscillations.
Crystal Properties
Table 18. OSC32K main characteristics
Min Typ Max Comments
Cload — 10 pF — Usually crystals can be purchased tuned for different Cloads. This Cload
value is typically 1/2 of the capacitances realized on the PCB on either side
of the quartz. A higher Cload will decrease oscillation margin, but
increases current oscillating through the crystal.
ESR — 50 k 100 k Equivalent series resistance of the crystal. Choosing a crystal with a higher
value will decrease the oscillating margin.
4.3 I/O parameters

This section provide parameters on I/O interfaces.
4.3.1 I/O DC parameters

This section includes the DC parameters of the following I/O types:
• XTALI and RTC_XTALI (Clock Inputs) DC Parameters
• General Purpose I/O (GPIO)
NOTE
The term ‘NVCC_XXXX’ in this section refers to the associated supply rail
of an input or output.
Figure 4. Circuit for parameters Voh and Vol for I/O cells
4.3.1.1 XTALI and RTC_XTALI (clock inputs) DC parameters

Table 19 shows the DC parameters for the clock inputs.
Table 19. XTALI and RTC_XTALI DC parameters1
Parameter Symbol Test Conditions Min Max Unit
XTALI high-level DC input voltage Vih — 0.8 x NVCC_PLL NVCC_PLL V
XTALI low-level DC input voltage Vil — 0 0.2 V
Table 19. XTALI and RTC_XTALI DC parameters1 (continued)
Parameter Symbol Test Conditions Min Max Unit
RTC_XTALI high-level DC input voltage Vih — 0.8 x NVCC_PLL NVCC_PLL V
RTC_XTALI low-level DC input voltage Vil — 0 0.2 V

1
The DC parameters are for external clock input only.
4.3.1.2 Single voltage general purpose I/O (GPIO) DC parameters

Table 20 shows DC parameters for GPIO pads. The parameters in Table 20 are guaranteed per the
operating ranges in Table 9, unless otherwise noted.
Table 20. Single voltage GPIO DC parameters
Parameter Symbol Test Conditions Min Max Units
High-level output voltage1 VOH Ioh= -0.1mA (ipp_dse=001,010) NVCC_XXXX - – V

Ioh= -1mA 0.2
(ipp_dse=011,100,101,110,111)
Low-level output voltage1 VOL Iol= 0.1mA (ipp_dse=001,010) – 0.2 V

Iol= 1mA
(ipp_dse=011,100,101,110,111)
High-Level input voltage1,2 VIH — 0.7 x NVCC_XXXX V

NVCC_XXXX
Low-Level input voltage1,2 VIL — 0 0.3 x V

NVCC_XXXX
Input Hysteresis VHYS_High NVCC_XXXX=3.3V 250 — mV

(NVCC_XXXX=3.3V) VDD
Schmitt trigger VT+2,3 VTH+ — 0.5 x — mV

NVCC_XXXX
Schmitt trigger VT-2,3 VTH- — — 0.5 x mV

NVCC_XXXX
Pull-up resistor (22_k PU) RPU_22K Vin=0V — 212 A
Pull-up resistor (22_k PU) RPU_22K Vin=NVCC_XXXX — 1 A
Pull-down resistor (100_k PD) RPD_100K Vin=NVCC_XXXX — 48 A
Pull-down resistor (100_k PD) RPD_100K Vin=0V — 1 A
Input current (no PU/PD) IIN VI = 0, VI = NVCC_XXXX -1 1 A
Keeper Circuit Resistance R_Keeper VI =0.3 x NVCC_XXXX, VI = 0.7 105 175 k

x NVCC_XXXX
1
Overshoot and undershoot conditions (transitions above NVCC_XXXX and below GND) on switching pads must be held
below 0.6 V, and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/
undershoot must be controlled through printed circuit board layout, transmission line impedance matching, signal line
termination, or other methods. Non-compliance to this specification may affect device reliability or cause permanent damage
to the device.
2
To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC
level through to the target DC level, Vil or Vih. Monotonic input transition time is from 0.1 ns to 1 s.
3
Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.
4.3.2 I/O AC parameters

This section includes the AC parameters of the following I/O types:
• General Purpose I/O (GPIO)
Figure 5 shows load circuit for output, and Figure 6 show the output transition time waveform.
From Output Test Point
Under Test
CL
CL includes package, probe and fixture capacitance
Figure 5. Load circuit for output
OVDD
80% 80%
20% 20%
Output (at pad) 0V
tr tf
Figure 6. Output transition time waveform
4.3.2.1 General purpose I/O AC parameters

The I/O AC parameters for GPIO are presented in the Table 21, respectively. Note that the fast or slow I/O
behavior is determined by the appropriate control bits in the IOMUXC control registers.
Table 21. General purpose I/O AC parameters 3.3 V mode
Parameter Symbol Test condition Min Typ Max Unit
Output Pad Transition Times, rise/fall tr, tf 15 pF Cload, slow slew rate 1.70/1.79
— —
(Max Drive, ipp_dse=101) 15 pF Cload, fast slew rate 1.06/1.15
— —
(High Drive, ipp_dse=011) 15 pF Cload, fast slew rate 1.74/1.77 ns
— —
(Medium Drive, ipp_dse=010) 15 pF Cload, fast slew rate 2.46/2.60
— —
(Low Drive. ipp_dse=001) 15 pF Cload, fast slew rate 4.77/5.15 ns
Input Transition Times1 trm — — — 25 ns
1
Hysteresis mode is recommended for inputs with transition times greater than 25 ns.
4.4 System modules

This section contains the timing and electrical parameters for the modules in the i.MX RT1010 processor.
4.4.1 Reset timings parameters

Figure 7 shows the reset timing and Table 22 lists the timing parameters.
POR_B
(Input)
CC1
Figure 7. Reset timing diagram
Table 22. Reset timing parameters
ID Parameter Min Max Unit
CC1 Duration of POR_B to be qualified as valid. 1 — RTC_XTALI cycle
4.4.2 WDOG reset timing parameters

Figure 8 shows the WDOG reset timing and Table 23 lists the timing parameters.
WDOGn_B
(Output)
CC3
Figure 8. WDOGn_B timing diagram
Table 23. WDOGn_B timing parameters
ID Parameter Min Max Unit
CC3 Duration of WDOGn_B Assertion 1 — RTC_XTALI cycle
NOTE
RTC_XTALI is approximately 32 kHz. RTC_XTALI cycle is one period or
approximately 30 s.
NOTE
WDOGn_B output signals (for each one of the Watchdog modules) do not
have dedicated pins, but are muxed out through the IOMUX. See the IOMUX
manual for detailed information.
4.4.3 Secure JTAG Controller (SJC) timing parameters

Figure 9 depicts the SJC test clock input timing. Figure 10 depicts the SJC boundary scan timing.
Figure 11 depicts the SJC test access port. Signal parameters are listed in Table 24.
SJ1
SJ2 SJ2
JTAG_TCK
(Input) VIH VM VM
VIL
SJ3 SJ3
Figure 9. Test clock input timing diagram
JTAG_TCK
(Input) VIH
VIL
SJ4 SJ5
Data
Inputs Input Data Valid
SJ6
Data
Output Data Valid
Outputs
SJ7
Data
Outputs
SJ6
Data
Outputs Output Data Valid
Figure 10. Boundary secure (JTAG) timing diagram
JTAG_TCK
(Input) VIH
VIL
SJ8 SJ9
JTAG_TDI
JTAG_TMS Input Data Valid
(Input)
SJ10
JTAG_TDO
(Output) Output Data Valid
SJ11
JTAG_TDO
(Output)
SJ10
JTAG_TDO
Output Data Valid
(Output)
Figure 11. Test access port timing diagram
JTAG_TCK
(Input)
SJ13
JTAG_TRST_B
(Input)
SJ12
Figure 12. JTAG_TRST_B timing diagram
Table 24. JTAG timing
All frequencies
ID Parameter1,2 Unit
Min Max
SJ0 JTAG_TCK frequency of operation 1/(3•TDC)1 0.001 22 MHz
SJ1 JTAG_TCK cycle time in crystal mode 45 — ns
SJ2 JTAG_TCK clock pulse width measured at VM2 22.5 — ns
SJ3 JTAG_TCK rise and fall times — 3 ns
SJ4 Boundary scan input data set-up time 5 — ns
SJ5 Boundary scan input data hold time 24 — ns
SJ6 JTAG_TCK low to output data valid — 40 ns
SJ7 JTAG_TCK low to output high impedance — 40 ns
SJ8 JTAG_TMS, JTAG_TDI data set-up time 5 — ns
Table 24. JTAG timing (continued)
All frequencies
ID Parameter1,2 Unit
Min Max
SJ9 JTAG_TMS, JTAG_TDI data hold time 25 — ns
SJ10 JTAG_TCK low to JTAG_TDO data valid — 44 ns
SJ11 JTAG_TCK low to JTAG_TDO high impedance — 44 ns
SJ12 JTAG_TRST_B assert time 100 — ns
SJ13 JTAG_TRST_B set-up time to JTAG_TCK low 40 — ns

1
TDC = target frequency of SJC
2
VM = mid-point voltage
4.4.4 Debug trace timing specifications

Table 25. Debug trace operating behaviors
Symbol Description Min Max Unit
T1 ARM_TRACE_CLK frequency of operation — 70 MHz
T2 ARM_TRACE_CLK period 1/T1 — s
T3 Low pulse width 6 — ns
T4 High pulse width 6 — ns
T5 Clock and data rise time — 1 ns
T6 Clock and data fall time — 1 ns
T7 Data setup 2 — ns
T8 Data hold 0.7 — ns
!2-?42!#%?#,+
4 T6
T4 4
4
Figure 13. ARM_TRACE_CLK specifications
ARM_TRACE_CLK
T7 T8 T7 T8
ARM_TRACE0-3
Figure 14. Trace data specifications
4.4.5 Power mode transition operating behaviors

Table 26 shows the power mode transition operating behaviors.
Table 26. Power mode transition operating behaviors1
Core, memory
Description System clock Min. Typ.2 Max. Unit
frequency (MHz)
SUSPEND to RUN3 ENET PLL 0, 0 ->500, 500 — 532.04 — s

1
Typical value is the average value of total test.
2
The temperature is at 25oC.
3 The code runs in the ITCM.
4.5 External memory interface

The following sections provide information about external memory interfaces.
4.5.1 FlexSPI parameters

Measurements are with a load 15 pf and input slew rate of 1 V/ns.
4.5.1.1 FlexSPI input/read timing

There are three sources for the internal sample clock for FlexSPI read data:
• Dummy read strobe generated by FlexSPI controller and looped back internally
(FlexSPIn_MCR0[RXCLKSRC] = 0x0)
• Dummy read strobe generated by FlexSPI controller and looped back through the
DQS pad (FlexSPIn_MCR0[RXCLKSRC] = 0x1)
• Read strobe provided by memory device and input from DQS pad
(FlexSPIn_MCR0[RXCLKSRC] = 0x3)
The following sections describe input signal timing for each of these four internal sample clock sources.
4.5.1.1.1 SDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x0, 0x1

Table 27. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X0
Symbol Parameter Min Max Unit
— Frequency of operation — 60 MHz
TIS Setup time for incoming data 8.67 — ns
TIH Hold time for incoming data 0 — ns
Table 28. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X1
TIS Setup time for incoming data 2 — ns
SCK
TIS TIH TIS TIH
SIO[0:7]
Internal Sample Clock
Figure 15. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X0, 0X1
NOTE
Timing shown is based on the memory generating read data on the SCK
falling edge, and FlexSPI controller sampling read data on the falling edge.
4.5.1.1.2 SDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x3

There are two cases when the memory provides both read data and the read strobe in SDR mode:
• A1–Memory generates both read data and read strobe on SCK rising edge (or falling
edge)
• A2–Memory generates read data on SCK falling edge and generates read strobe on
SCK rising edgeSCK rising edge
Table 29. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case A1)
Value
Symbol Parameter Unit
Min Max
TSCKD Time from SCK to data valid — — ns
TSCKDQS Time from SCK to DQS — — ns
TSCKD - TSCKDQS Time delta between TSCKD and TSCKDQS -2 2 ns
SCK
TSCKD TSCKD
SIO[0:7]
TSCKDQS TSCKDQS
DQS
Figure 16. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X3 (Case A1)
NOTE
Timing shown is based on the memory generating read data and read strobe
on the SCK rising edge. The FlexSPI controller samples read data on the
DQS falling edge.
Table 30. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case A2)
Value
Symbol Parameter Unit
Min Max
SCK
TSCKD TSCKD TSCKD
SIO[0:7]
TSCKDQS TSCKDQS TSCKDQS
DQS
Figure 17. FlexSPI input timing in SDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0X3 (Case A2)
NOTE
Timing shown is based on the memory generating read data on the SCK
falling edge and read strobe on the SCK rising edge. The FlexSPI controller
samples read data on a half cycle delayed DQS falling edge.
4.5.1.1.3 DDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x0, 0x1
Table 31. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x0
TIS Setup time for incoming data 8.67 — ns
Table 32. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x1
TIS Setup time for incoming data 2 — ns
SCLK
TIS TIH TIS TIH
SIO[0:7]
Figure 18. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x0, 0x1
4.5.1.1.4 DDR mode with FlexSPIn_MCR0[RXCLKSRC] = 0x3

There are two cases when the memory provides both read data and the read strobe in DDR mode:
• B1–Memory generates both read data and read strobe on SCK edge
• B2–Memory generates read data on SCK edge and generates read strobe on SCK2
edge
Table 33. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case B1)
SCK
TSCKD
SIO[0:7]
TSCKDQS
DQS
Figure 19. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case B1)
Table 34. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case B2)
SCK
TSCKD
SIO[0:7]
SCK2
TSCK2DQS
DQS
Figure 20. FlexSPI input timing in DDR mode where FlexSPIn_MCR0[RXCLKSRC] = 0x3 (Case B2)
4.5.1.2 FlexSPI output/write timing

The following sections describe output signal timing for the FlexSPI controller including control signals
and data outputs.
4.5.1.2.1 SDR mode

Table 35. FlexSPI output timing in SDR mode
Tck SCK clock period 6.0 — ns
TDVO Output data valid time — 1 ns
TDHO Output data hold time -1 — ns
TCSS Chip select output setup time 3 x TCK -1 — ns
TCSH Chip select output hold time 3 x TCK + 2 — ns

1
The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. Please refer to the FlexSPI SDR input timing
specifications.
NOTE
TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1
register, the default values are shown above. Please refer to the i.MX
RT1010 Reference Manual (IMXRT1010RM) for more details.
SCK
TCSH
T CSS T CK
CS
TDVO TDVO
SIO[0:7]
TDHO TDHO
Figure 21. FlexSPI output timing in SDR mode
4.5.1.2.2 DDR mode

Table 36. FlexSPI output timing in DDR mode
— Frequency of operation1 — 133 MHz
Tck SCK clock period (FlexSPIn_MCR0[RXCLKSRC] = 0x0) 6.0 — ns
TDVO Output data valid time — 2.2 ns
TDHO Output data hold time 0.8 — ns
TCSS Chip select output setup time 3 x TCK / 2 - 0.7 — ns
TCSH Chip select output hold time 3 x TCK / 2 + 0.8 — ns

1
The actual maximum frequency supported is limited by the FlexSPIn_MCR0[RXCLKSRC] configuration used. Please refer to the FlexSPI SDR input timing
specifications.
NOTE
TCSS and TCSH are configured by the FlexSPIn_FLSHAxCR1
register, the default values are shown above. Please refer to the i.MX
RT1010 Reference Manual (IMXRT1010RM) for more details.
SCK
T CSS T CK
TCSH
CS
TDVO TDVO
SIO[0:7]
TDHO TDHO
Figure 22. FlexSPI output timing in DDR mode
4.6 Audio
This section provide information about SAI/I2S and SPDIF.
4.6.1 SAI/I2S switching specifications

This section provides the AC timings for the SAI in master (clocks driven) and slave (clocks input) modes.
All timings are given for non-inverted serial clock polarity (SAI_TCR[TSCKP] = 0, SAI_RCR[RSCKP]
= 0) and non-inverted frame sync (SAI_TCR[TFSI] = 0, SAI_RCR[RFSI] = 0). If the polarity of the clock
and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal
(SAI_BCLK) and/or the frame sync (SAI_FS) shown in the figures below.
Table 37. Master mode SAI timing
Num Characteristic Min Max Unit
S1 SAI_MCLK cycle time 2 x tsys — ns
S2 SAI_MCLK pulse width high/low 40% 60% MCLK period
S3 SAI_BCLK cycle time 4 x tsys — ns
S4 SAI_BCLK pulse width high/low 40% 60% BCLK period
S5 SAI_BCLK to SAI_FS output valid — 15 ns
S6 SAI_BCLK to SAI_FS output invalid 0 — ns
S7 SAI_BCLK to SAI_TXD valid — 15 ns
S8 SAI_BCLK to SAI_TXD invalid 0 — ns
S9 SAI_RXD/SAI_FS input setup before SAI_BCLK 15 — ns
S10 SAI_RXD/SAI_FS input hold after SAI_BCLK 0 — ns
Figure 23. SAI timing—master modes
Table 38. Slave mode SAI timing
S11 SAI_BCLK cycle time (input) 4 x tsys — ns
S12 SAI_BCLK pulse width high/low (input) 40% 60% BCLK period
S13 SAI_FS input setup before SAI_BCLK 10 — ns
S14 SAI_FA input hold after SAI_BCLK 2 — ns
S15 SAI_BCLK to SAI_TXD/SAI_FS output valid — 20 ns
S16 SAI_BCLK to SAI_TXD/SAI_FS output invalid 0 — ns
Table 38. Slave mode SAI timing
S17 SAI_RXD setup before SAI_BCLK 10 — ns
S18 SAI_RXD hold after SAI_BCLK 2 — ns
Figure 24. SAI timing—slave modes
4.6.2 SPDIF timing parameters

The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When
encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.
Table 39 and Figure 25 and Figure 26 show SPDIF timing parameters for the Sony/Philips Digital
Interconnect Format (SPDIF), including the timing of the modulating Rx clock (SPDIF_SR_CLK) for
SPDIF in Rx mode and the timing of the modulating Tx clock (SPDIF_ST_CLK) for SPDIF in Tx mode.
Table 39. SPDIF timing parameters
Timing parameter range

Characteristics Symbol Unit
Min Max
SPDIF_IN Skew: asynchronous inputs, no specs apply — — 0.7 ns
SPDIF_OUT output (Load = 50pf)

• Skew — — 1.5 ns
• Transition rising — — 24.2
• Transition falling — — 31.3
SPDIF_OUT1 output (Load = 30pf)

• Skew — ns
• Transition rising — — 1.5
• Transition falling — — 13.6
— 18.0
Modulating Rx clock (SPDIF_SR_CLK) period srckp 40.0 — ns
Table 39. SPDIF timing parameters (continued)
Timing parameter range

Characteristics Symbol Unit
Min Max
SPDIF_SR_CLK high period srckph 16.0 — ns
SPDIF_SR_CLK low period srckpl 16.0 — ns
Modulating Tx clock (SPDIF_ST_CLK) period stclkp 40.0 — ns
SPDIF_ST_CLK high period stclkph 16.0 — ns
SPDIF_ST_CLK low period stclkpl 16.0 — ns
srckp
srckpl srckph
SPDIF_SR_CLK
VM VM
(Output)
Figure 25. SPDIF_SR_CLK timing diagram
stclkp
stclkpl stclkph
SPDIF_ST_CLK
VM VM
(Input)
Figure 26. SPDIF_ST_CLK timing diagram
4.7 Analog
The following sections provide information about analog interfaces.
4.7.1 DCDC
Table 40 introduces the DCDC electrical specification.
Table 40. DCDC electrical specifications
Mode Buck mode only, one output Notes
Input voltage 3.3 V ± 10%
Output voltage 1.1 V Configurable 0.8 ~ 1.575 with 25 mV one step
Max loading 500 mA —
Loading in low power modes 200 A ~ 30 mA —
Efficiency 90% max @150 mA
Table 40. DCDC electrical specifications (continued)
Mode Buck mode only, one output Notes
Low power mode Open loop mode Ripple is about 15 mV
Run mode • Always continuous mode Configurable by register

• Support discontinuous mode
Inductor 4.7 H —
Capacitor 33 F —
Over voltage protection 1.6 V Detect VDDSOC, when the voltage is higher
than 1.6 V, shutdown DCDC.
Over Current protection 1A Detect the peak current

• Run mode: when the current is larger than
1 A, shutdown DCDC.
• Stop mode: when the current is larger than
250 mA, stop charging the inductor.
Low battery detection 2.6 V Detect the battery, when battery is lower than
2.6 V, shutdown DCDC.
4.7.2 A/D converter

This section introduces information about A/D converter.
4.7.2.1 12-bit ADC electrical characteristics

The section provide information about 12-bit ADC electrical characteristics.
4.7.2.1.1 12-bit ADC operating conditions

Table 41. 12-bit ADC operating conditions
Characteristic Conditions Symb Min Typ1 Max Unit Comment
Supply voltage Absolute VDDA 3.0 - 3.6 V —
Delta to VDD VDDA -100 0 100 mV —

(VDD-VDDA)2
Ground voltage Delta to VSS VSSAD -100 0 100 mV —

(VSS-VSSAD)
Ref Voltage High — VDDA 1.13 VDDA VDDA V —
Ref Voltage Low — VSS VSS VSS VSS V —
Input Voltage — VADIN VSS — VDDA V —
Input Capacitance 8/10/12 bit modes CADIN — 1.5 2 pF —
Input Resistance ADLPC=0, ADHSC=1 RADIN — 5 7 kohms —
ADLPC=0, ADHSC=0 — 12.5 15 kohms —
ADLPC=1, ADHSC=0 — 25 30 kohms —
Table 41. 12-bit ADC operating conditions (continued)
Characteristic Conditions Symb Min Typ1 Max Unit Comment
Analog Source 12 bit mode fADCK = RAS — — 1 kohms Tsamp=150

Resistance 40MHz ADLSMP=0, ns
ADSTS=10, ADHSC=1
RAS depends on Sample Time Setting (ADLSMP, ADSTS) and ADC Power Mode (ADHSC, ADLPC). See charts for Minimum
Sample Time vs RAS
ADC Conversion Clock ADLPC=0, ADHSC=1 fADCK 4 — 40 MHz —
Frequency 12 bit mode
ADLPC=0, ADHSC=0 4 — 30 MHz —

12 bit mode
ADLPC=1, ADHSC=0 4 — 20 MHz —

12 bit mode
1
Typical values assume VDDAD = 3.0 V, Temp = 25°C, fADCK=20 MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
2 DC potential differences
Figure 27. 12-bit ADC input impedance equivalency diagram
12-bit ADC characteristics

Table 42. 12-bit ADC characteristics (VREFH = VDDA, VREFL = VSSAD)
Characteristic Conditions1 Symb Min Typ2 Max Unit Comment
Supply Current ADLPC=1, IDDA — 250 — µA ADLSMP = 0, ADSTS

ADHSC=0 = 10, ADCO = 1
ADLPC=0, 350
ADHSC=0
ADLPC=0, 400
ADHSC=1
Supply Current Stop, Reset, Module IDDA — 0.01 0.8 µA —

Off
ADC Asynchronous ADHSC=0 fADACK — 10 — MHz tADACK = 1/fADACK
Clock Source
ADHSC=1 — 20 —
Sample Cycles ADLSMP=0, Csamp — 2 — cycles —

ADSTS=00
ADLSMP=0, 4
ADSTS=01
ADLSMP=0, 6
ADSTS=10
ADLSMP=0, 8
ADSTS=11
ADLSMP=1, 12
ADSTS=00
ADLSMP=1, 16
ADSTS=01
ADLSMP=1, 20
ADSTS=10
ADLSMP=1, 24
ADSTS=11
Table 42. 12-bit ADC characteristics (VREFH = VDDA, VREFL = VSSAD) (continued)
Conversion Cycles ADLSMP=0 Cconv — 28 — cycles —

ADSTS=00
ADLSMP=0 30
ADSTS=01
ADLSMP=0 32
ADSTS=10
ADLSMP=0 34
ADSTS=11
ADLSMP=1 38
ADSTS=00
ADLSMP=1 42
ADSTS=01
ADLSMP=1 46
ADSTS=10
ADLSMP=1, 50
ADSTS=11
Conversion Time ADLSMP=0 Tconv — 0.7 — µs Fadc = 40 MHz

ADSTS=00
ADLSMP=0 0.75
ADSTS=01
ADLSMP=0 0.8
ADSTS=10
ADLSMP=0 0.85
ADSTS=11
ADLSMP=1 0.95
ADSTS=00
ADLSMP=1 1.05
ADSTS=01
ADLSMP=1 1.15
ADSTS=10
ADLSMP=1, 1.25
ADSTS=11
Total Unadjusted 12 bit mode TUE — 3.4 — LSB AVGE = 1, AVGS = 11

Error 1 LSB =
10 bit mode — 1.5 — (VREFH -
8 bit mode — 1.2 — VREFL)/2
N
Differential 12 bit mode DNL — 0.76 — LSB AVGE = 1, AVGS = 11

Non-Linearity
10bit mode — 0.36 —
8 bit mode — 0.14 —
Table 42. 12-bit ADC characteristics (VREFH = VDDA, VREFL = VSSAD) (continued)
Integral Non-Linearity 12 bit mode INL — 2.78 — LSB AVGE = 1, AVGS = 11
10bit mode — 0.61 —
8 bit mode — 0.14 —
Zero-Scale Error 12 bit mode EZS — -1.14 — LSB AVGE = 1, AVGS = 11
10bit mode — -0.25 —
8 bit mode — -0.19 —
Full-Scale Error 12 bit mode EFS — -1.06 — LSB AVGE = 1, AVGS = 11
10bit mode — -0.03 —
8 bit mode — -0.02 —
Effective Number of 12 bit mode ENOB 10.1 10.7 — Bits AVGE = 1, AVGS = 11
Bits
Signal to Noise plus See ENOB SINAD SINAD = 6.02 x ENOB + 1.76 dB AVGE = 1, AVGS = 11
Distortion
1
All accuracy numbers assume the ADC is calibrated with VREFH=VDDAD
2
Typical values assume VDDAD = 3.0 V, Temp = 25°C, Fadck=20 MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
NOTE
The ADC electrical spec is met with the calibration enabled configuration.
Figure 28. Minimum Sample Time Vs Ras (Cas = 2 pF)
4.8 Communication interfaces

The following sections provide the information about communication interfaces.
4.8.1 LPSPI timing parameters

The Low Power Serial Peripheral Interface (LPSPI) provides a synchronous serial bus with master and
slave operations. Many of the transfer attributes are programmable. The following tables provide timing
characteristics for classic LPSPI timing modes.
All timing is shown with respect to 20% VDD and 80% VDD thresholds, unless noted, as well as input
signal transitions of 3 ns and a 30 pF maximum load on all LPSPI pins.
Table 43. LPSPI Master mode timing
Number Symbol Description Min. Max. Units Note

1
1 fSCK Frequency of operation — fperiph / 2 MHz
2 tSCK 2
SCK period 2 x tperiph — µs
3 tLead Enable lead time 1 — tperiph —
4 tLag Enable lag time 1 — tperiph —
5 tWSCK Clock (SCK) high or low time tSCK / 2 - 3 — ns —
6 tSU Data setup time (inputs) 10 — ns —
7 tHI Data hold time (inputs) 2 — ns —
8 tV Data valid (after SCK edge) — 8 ns —
9 tHO Data hold time (outputs) 0 — ns —
1
Absolute maximum frequency of operation (fop) is 30 MHz. The clock driver in the LPSPI module for fperiph must be
guaranteed this limit is not exceeded.
2 t
periph = 1000 / fperiph
1
PCS
(OUTPUT)
3 2 4
SCK 5
(CPOL=0)
(OUTPUT) 5
SCK
(CPOL=1)
(OUTPUT)
6 7
SIN 2 LSB IN
MSB IN BIT 6 . . . 1
(INPUT)
8 9
SOUT 2
(OUTPUT) MSB OUT BIT 6 . . . 1 LSB OUT
1. If configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure 31. LPSPI Master mode timing (CPHA = 0)
1
PCS
(OUTPUT)
2
3 4
SCK
(CPOL=0)
(OUTPUT)
5 5
SCK
(CPOL=1)
(OUTPUT)
6 7
SIN 2
(INPUT) MSB IN BIT 6 . . . 1 LSB IN
8 9
SOUT 2
(OUTPUT) PORT DATA MASTER MSB OUT BIT 6 . . . 1 MASTER LSB OUT PORT DATA
1.If configured as output

2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure 32. LPSPI Master mode timing (CPHA = 1)

s
Table 44. LPSPI Slave mode timing
Number Symbol Description Min. Max. Units Note

1
1 fSCK Frequency of operation 0 fperiph / 2 MHz
2 tSCK 2
SCK period 2 x tperiph — µs
3 tLead Enable lead time 1 — tperiph —
4 tLag Enable lag time 1 — tperiph —
5 tWSCK Clock (SCK) high or low time tSCK / 2 - 5 — ns —
6 tSU Data setup time (inputs) 2.7 — ns —
7 tHI Data hold time (inputs) 3.8 — ns —
8 ta Slave access time — tperiph ns 3
4
9 tdis Slave MISO disable time — tperiph ns
10 tV Data valid (after SCK edge) — 14.5 ns —
11 tHO Data hold time (outputs) 0 — ns —
1
Absolute maximum frequency of operation (fop) is 30 MHz. The clock driver in the LPSPI module for fperiph must be
guaranteed this limit is not exceeded.
2
tperiph = 1000 / fperiph
3 Time to data active from high-impedance state
4 Hold time to high-impedance state
PCS
(INPUT)
2 4
SCK
(CPOL=0)
(INPUT)
3 5 5
SCK
(CPOL=1)
(INPUT)
9
8 10 11 11
SIN see SEE

note SLAVE MSB BIT 6 . . . 1 SLAVE LSB OUT
(OUTPUT) NOTE
6 7
SOUT
MSB IN BIT 6 . . . 1 LSB IN
(INPUT) NOTE: Not defined
Figure 33. LPSPI Slave mode timing (CPHA = 0)
PCS
(INPUT)
2 4
3
SCK
(CPOL=0)
(INPUT)
5 5
SCK
(CPOL=1)
(INPUT)
10 11 9
SIN see
SLAVE MSB OUT BIT 6 . . . 1 SLAVE LSB OUT
(OUTPUT) note
8 6 7
SOUT
(INPUT) MSB IN BIT 6 . . . 1 LSB IN
NOTE: Not defined
Figure 34. LPSPI Slave mode timing (CPHA = 1)
4.8.2 LPI2C module timing parameters

This section describes the timing parameters of the LPI2C module.
Table 45. LPI2C module timing parameters
Symbol Description Min Max Unit Notes

1, 2
fSCL SCL clock frequency Standard mode (Sm) 0 100 kHz
Fast mode (Fm) 0 400
Fast mode Plus (Fm+) 0 1000
Ultra Fast mode (UFm) 0 5000
High speed mode (Hs-mode) 0 3400

1
Hs-mode is only supported in slave mode.
2
See General switching specifications.
4.8.3 LPUART electrical specifications

Please refer to Section 4.3.2.1, "General purpose I/O AC parameters".
4.8.4 USB PHY parameters

This section describes the USB-OTG PHY parameters.
The USB PHY meets the electrical compliance requirements defined in the Universal Serial Bus Revision
2.0 OTG with the following amendments.
• USB ENGINEERING CHANGE NOTICE
— Title: 5V Short Circuit Withstand Requirement Change
— Applies to: Universal Serial Bus Specification, Revision 2.0
• Errata for USB Revision 2.0 April 27, 2000 as of 12/7/2000
— Title: Pull-up/Pull-down resistors
— Title: Suspend Current Limit Changes
— Title: USB 2.0 Phase Locked SOFs
• On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification
— Revision 2.0 plus errata and ecn June 4, 2010
• Battery Charging Specification (available from USB-IF)
— Revision 1.2, December 7, 2010

— Portable device only
4.9 Timers
This section provide information on timers.
4.9.1 Pulse Width Modulator (PWM) characteristics

This section describes the electrical information of the PWM.
Table 46. PWM timing parameters
Parameter Symbo Min Typ Max Unit
PWM Clock Frequency — — — 132 MHz
Power-up Time tpu — 25 — s
Boot mode configuration
5 Boot mode configuration

This section provides information on boot mode configuration pins allocation and boot devices interfaces
allocation.
5.1 Boot mode configuration pins

Table 47 provides boot options, functionality, fuse values, and associated pins. Several input pins are also
sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.
The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an
unblown fuse). For detailed boot mode options configured by the boot mode pins, see the i.MX RT1010
Fuse Map document and the System Boot chapter in i.MX RT1010 Reference Manual (IMXRT1010RM).
Table 47. Fuses and associated pins used for boot
Pad Default setting on reset eFuse name Details
GPIO_SD_04 100 K pull-down src.BOOT_MODE[0]
GPIO_SD_03 100 K pull-down src.BOOT_MODE[1]
GPIO_SD_02 100 K pull-down src.BT_CFG[0] Boot Options, Pin value overrides fuse
settings for BT_FUSE_SEL = ‘0’.
GPIO_SD_01 100 K pull-down src.BT_CFG[1] Signal Configuration as Fuse Override
GPIO_SD_00 100 K pull-down src.BT_CFG[2] Input at Power Up.
These are special I/O lines that control
the boot up configuration during
product development. In production,
the boot configuration can be
controlled by fuses.
5.2 Boot device interface allocation

The following tables list the interfaces that can be used by the boot process in accordance with the specific
boot mode configuration. The tables also describe the interface’s specific modes and IOMUXC allocation,
which are configured during boot when appropriate.
Table 48. Boot through FlexSPI
PAD Name IO Function Mux Mode Comments
GPIO_SD_04 flexspi.B_DATA[3] ALT 0 —
GPIO_SD_13 flexspi.B_SCLK ALT 0 —
GPIO_00 flexspi.B_DQS ALT 0 —
GPIO_SD_00 flexspi.B_SS0_B ALT 0 —
GPIO_SD_12 flexspi.A_DQS ALT 0 —
GPIO_SD_06 flexspi.A_SS0_B ALT 0 —
Boot mode configuration
Table 48. Boot through FlexSPI (continued)
GPIO_SD_05 flexspi.A_SS1_B ALT 0 —
GPIO_SD_10 flexspi.A_SCLK ALT 0 —
GPIO_SD_09 flexspi.A_DATA[0] ALT 0 —
Table 49. FlexSPI reset
GPIO_13 gpiomux.IO[13] ALT 5 —
Table 50. Boot through UART1
GPIO_10 lpuart1.TX ALT 0 —
GPIO_09 lpuart1.RX ALT 0 —
GPIO_08 lpuart1.CTS_B ALT 6 —
GPIO_07 lpuart1.RTS_B ALT 6 —
Package information and contact assignments
6 Package information and contact assignments

This section includes the contact assignment information and mechanical package drawing.
6.1 12 x 12 mm package information
6.1.1 12 x 12 mm, 0.5 mm pitch, ball matrix

Figure 35 shows the top, bottom, and side views of the 12 x 12 mm LQFP package.
Figure 35. 12 x 12 mm LQFP, case x package top and side views
6.1.2 12 x 12 mm supplies contact assignments and functional contact

assignments
Table 51 shows the device connection list for ground, sense, and reference contact signals.
Table 51. 12 x 12 mm supplies contact Assignment
Supply Rail Name Pin(s) Position(s) Remark
DCDC_IN 18 —
DCDC_IN_Q 17 —
DCDC_GND 20 —
DCDC_LP 19 —
DCDC_PSWITCH 15 —
NGND_KEL0 34 —
NVCC_GPIO 7, 50, 63, 71 —
NVCC_PLL 40 —
VDDA_ADC_3P3 42 —
VDD_HIGH_CAP 35 —
VDD_HIGH_IN 39 —
VDD_SNVS_CAP 26 —
VDD_SNVS_IN 25 —
VDD_SOC_IN 14, 53, 77 —
VDD_USB_CAP 31 —
VSS 16, 54, 30, 78 —
VSSA_ADC_3P3 41
Table 52 shows an alpha-sorted list of functional contact assignments for the 12 x 12 mm package.
Table 52. 12 x 12 mm functional contact assignments
Default Setting Default setting

12 x 12 Power Pin on Reset
Pin Name
Pin Group Type
Default Default Input/ Input/
Value Value
Mode Function Output Output
GPIO_00 13 NVCC_GPIO Digital Alt 5 GPIOMUX_IO00 Input Keeper Input 100K PD

GPIO
GPIO_01 12 NVCC_GPIO Digital Alt 5 GPIOMUX_IO01 Input Keeper Input Keeper

GPIO

GPIO

GPIO
Table 52. 12 x 12 mm functional contact assignments (continued)

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO
GPIO_AD_00 60 NVCC_GPIO Digital Alt 5 GPIOMUX_IO14 Input Keeper Input Keeper

GPIO

GPIO

GPIO

GPIO
GPIO_AD_04 56 NVCC_GPIO Digital Alt 5 GPIOMUX_IO18 Input Keeper Output1 Keeper

GPIO

GPIO

GPIO

GPIO
GPIO_AD_08 49 NVCC_GPIO Digital Alt 7 JTAG_TRSTB Input 47K PU Input 47K PU

GPIO
GPIO_AD_09 48 NVCC_GPIO Digital Alt 7 JTAG_TDO Input Keeper Input Keeper

GPIO
GPIO_AD_10 47 NVCC_GPIO Digital Alt 7 JTAG_TDI Input 47K PU Input 47K PU

GPIO
GPIO_AD_11 46 NVCC_GPIO Digital Alt 7 JTAG_MOD Input 100K PD Input 100K PD

GPIO
GPIO_AD_12 45 NVCC_GPIO Digital Alt 7 JTAG_TCK Input 100K PD Input 100K PD

GPIO
GPIO_AD_13 44 NVCC_GPIO Digital Alt 7 JTAG_TMS Input 47K PU Input 47K PU

GPIO

GPIO
GPIO_SD_00 76 NVCC_GPIO Digital Alt 5 GPIO2_IO00 Input Keeper Input 100K PD

GPIO

GPIO

GPIO
GPIO_SD_03 73 NVCC_GPIO Digital Alt 6 SRC_BOOT_MOD Input 100K PD Input 100K PD

GPIO E1
GPIO_SD_04 72 NVCC_GPIO Digital Alt 6 SRC_BOOT_MOD Input 100K PD Input 100K PD

GPIO E0
GPIO_SD_05 70 NVCC_GPIO Digital Alt 5 GPIO2_IO05 Input Keeper Input Keeper

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO
ONOFF 21 VDD_SNVS_I Digital Alt 0 SRC_RESET_B Input 100K PU Input 100K PU

N GPIO
PMIC_ON_REQ 24 VDD_SNVS_I Digital Alt 0 SNVS_PMIC_ON_ Output 100K PU Output 100K PU

N GPIO REQ
POR_B 22 VDD_SNVS_I Digital Alt 0 SRC_POR_B Input 100K PU Input 100K PU

N GPIO
RTC_XTALI 27 — — — — — — — —
RTC_XTALO 28 — — — — — — — —
TEST_MODE 23 VDD_SNVS_I Digital Alt 0 TCU_TEST_MOD Input 100K PD Input 100K PD

N GPIO E
USB_OTG1_CH 36 — — — — — — — —
D_B
USB_OTG1_DN 32 — — — — — — — —
USB_OTG1_DP 33 — — — — — — — —
USB_OTG1_VB 29 — — — — — — — —
US
XTALI 37 — — — — — — — —
XTALO 38 — — — — — — — —
1
This pin output is in a high level until the system reset is complete.
6.1.3 12 x 12 mm package pin assignments

Figure 36 shows the pin assignments of the 12 x 12 mm package.
VDD_SOC_IN
GPIO_SD_13
GPIO_SD_04
GPIO_SD_12
GPIO_SD_00
GPIO_SD_01
GPIO_SD_06
GPIO_SD_07
GPIO_SD_10
GPIO_SD_02
GPIO_SD_05
GPIO_SD_09
GPIO_SD_03
GPIO_SD_08
GPIO_SD_11
NVCC_GPIO
NVCC_GPIO
GPIO_12
GPIO_13
VSS
71
61
72
62
80
79
78
76
75
69
68
66
65
77
74
73
70
67
64
63
GPIO_11 1 60 GPIO_AD_00
NVCC_GPIO 7 54 VSS
GPIO_05 8 53 VDD_SOC_IN
GPIO_02 11 50 NVCC_GPIO
VDD_SOC_IN / DCDC_SENSE 14 47 GPIO_AD_10
DCDC_PSWITCH 15 46 GPIO_AD_11
VSS 16 45 GPIO_AD_12
DCDC_IN_Q 17 44 GPIO_AD_13
DCDC_IN 18 43 GPIO_AD_14
DCDC_LP 19 42 VDDA_ADC_3P3 / ADC_VREFH
DCDC_GND 20 41 VSSA_ADC_3P3 / ADC_VREFL

21
31
22
25
26
28
29
40
23
24
27
32
35
30
36
38
39
33
34
37
ONOFF
VDD_USB_CAP
POR_B
VDD_SNVS_IN
RTC_XTALO
PMIC_ON_REQ
RTC_XTALI
USB_OTG1_VBUS
NVCC_PLL
TEST_MODE
VDD_SNVS_CAP
USB_OTG1_DN
VDD_HIGH_IN
VSS
NGND_KEL0
VDD_HIGH_CAP
XTALO
USB_OTG1_DP
USB_OTG1_CHD_B
XTALI
Figure 36. The pin assignments of the 12 x 12 mm package
Revision history
7 Revision history
Table 53 provides a revision history for this data sheet.
Table 53. i.MX RT1010 data sheet document revision history
Rev.
Date Substantive Change(s)
Number
Rev. 0 09/2019 • Initial version
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NXP Semiconductors Document Number: IMXRT1010CEC

Data Sheet: Technical Data Rev. 0, 09/2019

i.MX RT1010 Crossover

See Table 1 on page 4

1 i.MX RT1010 introduction

The i.MX RT1010 is specifically useful for applications, such as:

– 16-bit resolution PWM suitable for Motor Control applications

• Secure Non-Volatile Storage (SNVS)

1.2 Ordering information

MIMXRT1011DAE5A • 500 MHz, consumer • SPI x2 12 x 12 mm 80-pin LQFP, 0.5 0 to 95

Qualification Level M Silicon Rev A

Family @ 600 MHz 6

First Generation RT family 1 700 MHz 7

05 RT1050 1 Standard Feature General Purpose

Figure 1. Part number nomenclature—i.MX RT1010

2.1 Block diagram

System Control CPU Platform

RTC and Reset HSGPIO MPU I2C x2

128K I-TCM and D-TCM

Dual-Channel Quad-SPI GPIO

DCDC USB2.0 OTG with PHY x1

LDO Ciphers RNG

ADC Secure RTC eFuse

ADC (15-ch) x1 64 KB ROM

Figure 2. i.MX RT1010 system block diagram

Block mnemonic Block name Subsystem Brief description

Table 2. i.MX RT1010 modules list (continued)

Block mnemonic Block name Subsystem Brief description

Table 2. i.MX RT1010 modules list (continued)

Block mnemonic Block name Subsystem Brief description

Table 2. i.MX RT1010 modules list (continued)

Block mnemonic Block name Subsystem Brief description

Table 2. i.MX RT1010 modules list (continued)

Block mnemonic Block name Subsystem Brief description

3.1 Special signal considerations

Signal name Remarks

Table 3. Special signal considerations (continued)

Signal name Remarks

Table 4. JTAG controller interface summary

JTAG I/O type On-chip termination

JTAG_TCK Input 100 kpull-down

JTAG_TDI Input 47 kpull-up

JTAG_TRSTB Input 47 kpull-up

JTAG_MOD Input 100 kpull-down

3.2 Recommended connections for unused analog interfaces

Table 5. Recommended connections for unused analog interfaces

USB USB_OTG1_CHD_B, USB_OTG1_DN, USB_OTG1_DP, USB_OTG1_VBUS Not connected

ADC VDDA_ADC_3P3 VDDA_ADC_3P3

4.1 Chip-level conditions

For these characteristics Topic appears

Absolute maximum ratings on page 15

Thermal resistance on page 16

Operating ranges on page 16

External clock sources on page 18

Maximum supply currents on page 18

Low power mode supply currents on page 20

USB PHY current consumption on page 20

4.1.1 Absolute maximum ratings

Table 7. Absolute maximum ratings

Parameter Description Symbol Min Max Unit