ME30604 Nontraditional Manufacturing Processes
ME30604 Nontraditional Manufacturing Processes
ME30604 Nontraditional Manufacturing Processes
lIT Kharagpur
Nontraditional Manufacturing Processes: Mf30604
End Sem. Examination: Spring 2017-18 Time: 3 hours FilII marks: 100
2. a. Derive an expression for the material removal rate of a brittle material in abrasive
jet machining. (5)
b. A workpiece has a 10 urn thick ceramic coating on its surface. The strength of
coating is 4 Gpa. This coating is to be removed by abrasive jet having average grit
diameter of 50 urn and grit density of 4000 kg/rrr'. IftheIO urn thick coating is to
be removed in a single impact of grit what should be its velocity? Estimate the
AJ mass flow rate to remove ceramic coating over a 10 em xl 0 em area in one
minute machining time. (3+4=7)
The sheet thickness is 5 rnrn and the severance energy for O2 assisted laser cutting
of steel is 8 J/mm2. What will be the maximum cutting speed'!
What is the role of O2 in this cutting process? (3+2+1=6)
II. Full penetration butt welding of two 6 mrn thick titanium plates is to be done at 3
mlmin speed with an electron beam focused to 600 urn diameter spot at the plate
surface. What will be the e-beam power required to perform the welding and what
will be the actual weld-bead width? During the welding process ~5% material is
evaporated and the e- beam power coupling efficiency including conduction loss
is 0.1.
The thermo-physical properties of aluminum are given as the following:
Density = 4510 kg m', Latent heat of fusion=
437 kJ kg-I, Latent heat of
vaporization =9000 kJ kg", Specific heat = 520 J kg' K-I, Melting temperature
=1670°C, Boiling temperature = 3260°C, Thermal conductivity =19 W m-IK-I
You may assume constant properties over the whole temperature range. PI
4(a) Explain the functions of servo reference voltage and servo sensitivity in relation to
maintaining the inter-electrode gap in EDM.
4(b) Explain with simple diagram how the effect of variation of electrolyte temperature
{between exit and entry side) in the inter-electrode gap is taken care of during designing for
tool in ECM.
4(c) The composition (% by weight) of Nimonic 75 alloy is given in the table below:
Element Ni Cr Fe Ti Si Mn Cu
% presence by 72 20 5 0.5 I 1 0.5
weight
Atomic weight 58.7 52 56 48 28 54 63
Valency 2, 3 2,3,4 2, 3 3,4 4 2,4,6,7 1,2
Density (g/crrr') 8.9 7.2 7.9 4.5 2.3 7.4 9
5.(a) What are the reasons for developing a hybrid manufacturing process?
S.(c) Write short notes on the following two hybrid processes highlighting process mechanism
with schematic diagrams and their advantages in terms of process capabi lities ..
I. Abrasive electro-discharge grinding (AEDG)
II. Lase,' assisted chemical etching
(I+l+2x4 = 10 Marks)
6(a) Highlight two application areas where electrochemical honing process may be useful.
6(a) With a neat diagram explain the different interaction phases of the rotating grinding
wheel with moving job and corresponding material removal mechanisms during electro-
chemical grinding (ECG) process.
6(c) In a photochemical blanking operation a rectangular slit 300 micron width was attempted
to be made on a copper-beryllium sheet of 200 micron thickness by selectively exposing
only the top surface with a mask. It resulted in a tapered slit for which the dimension at
the top was more than the dimension at the bottom.
Suggest some change in the approach while continuing with the same process so that a
near-vertical slit could be obtained. (Use suitable diagram for explanation)
(2+6+2 = 10 Marks)
7(a) Prove that buckling strength to weight ratio of an Euler column increases if its linear
dimensions are scaled down.
7(b) With the help of diagram explain the process sequences for a optical lithography process
on a silicon wafer.
7(c) Why is an X-ray source more suitable for high resolution lithography?
(3+6+1 = 10 Marks)
8(a) What .·~e of power supply one should use for electro-chemical-discharge
machining \.ECDM) and why?
8(b) Why is the manufacture of the micro-electrode tools essentially carried out in situ in a
micro-EDM set up itself?
8(c) Explain with a schematic diagram the way a micro-tool (for subsequent use micro-
EDMing operation) can be fabricated in-situ in a micro-EDM set up by wire
electrodischarge grinding (WEDG) process?
8(d) What are the possible sources of stray capacitance in a micro-EDM set up?
(3+2+4+1 = 10 Marks)