Semikron SKKT 250-12E
Semikron SKKT 250-12E
Semikron SKKT 250-12E
./-0 .//0 .&/0 1/0- 2 3%4 + )5 , *
. . 1+. 2 %$4 + ) 6748 2 7$ 9'*
:44 744 -;; %$4<47! -;; %$4<47!
6#44 6%44 -;; %$4<6%! -;; %$4<6%!
6=44 6"44 -;; %$4<6"! -;; %$4<6"!
6:44 6744 -;; %$4<67! -;; %$4<67!
SKKT SKKH
1 27-10-2020 MS © by SEMIKRON
RECTIFIER,DIODE,THYRISTOR,MODULE
Fig. 1L Power dissipation per thyristor vs. on-state current Fig. 1R Power dissipation per thyristor vs. ambient temp.
Fig. 2L Power dissipation per module vs. rms current Fig. 2R Power dissipation per module vs. case temp.
Fig. 3L Power dissipation of two modules vs. direct current Fig. 3R Power dissipation of two modules vs. case temp.
Fig. 4L Power dissipation of three modules vs. direct and rms current Fig. 4R Power dissipation of three modules vs. case temp.
Fig. 5 Recovered charge vs. current decrease Fig. 6 Transient thermal impedance vs. time
Dimensions in mm
* The specifications of our components may not be considered as an assurance of component characteristics.
Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON
Fig. 2L Power dissipation per module vs. rms current Fig. 2R Power dissipation per module vs. case temp.
Fig. 3L Power dissipation of two modules vs. direct current Fig. 3R Power dissipation of two modules vs. case temp.
2 27-10-2020 MS © by SEMIKRON
SKKT 250, SKKH 250
Fig. 4L Power dissipation of three modules vs. direct and rms current Fig. 4R Power dissipation of three modules vs. case temp.
Fig. 5 Recovered charge vs. current decrease Fig. 6 Transient thermal impedance vs. time
3 27-10-2020 MS © by SEMIKRON
Fig. 9 Gate trigger characteristics
Dimensions in mm
SKKT
SKKH
Semipack 3
4 27-10-2020 MS © by SEMIKRON