LMR33610 Datasheet

LMR33610
SNVSBI9A – OCTOBER 2019 – REVISED JUNE 2022
LMR33610 SIMPLE SWITCHER 3.8-V to 36-V, 1-A

Synchronous Step-Down Converter
1 Features 3 Description
• Configured for rugged industrial applications The LMR33610 SIMPLE SWITCHER® regulator is
– Input voltage range: 3.8 V to 36 V an easy-to-use, synchronous, step-down DC/DC
– Output voltage range: 1 V to 24 V converter that delivers best-in-class efficiency for
– Peak-current mode control rugged industrial applications. The LMR33610 drives
– Junction temperature range: –40°C to +125°C up to 1 A of load current from an input of up
– Ease of use SOIC package to 36 V. The LMR33610 provides high light-load
• Well-suited for scalable industrial power supplies efficiency and output accuracy. Features such as a
– Pin compatible with: power-good flag and precision enable provide both
• LMR33620, LMR33630, and LMR33640 flexible and easy-to-use solutions for a wide range
(36 V, 2 A, 3 A, or 4 A) of applications. The LMR33610 automatically folds
• LMR36510 and LMR36520 back frequency at light load to improve efficiency.
(65 V, 1 A or, 2 A) Protection features include thermal shutdown, input
– 400-kHz and 1.4-MHz frequency undervoltage lockout, cycle-by-cycle current limit, and
– Integrated compensation helps reduce solution hiccup short-circuit protection. Integration and internal
size, cost, and design complexity compensation eliminates many external components
• High-efficiency solution and provides a pinout designed for a simple PCB
layout. The feature set of the device is designed
– Peak efficiency > 95%
to simplify implementation for a wide range of end
– Low shutdown quiescent current of 5 µA
equipment. The LMR33610 is pin-to-pin compatible
– Low operating quiescent current of 25 µA
with the LMR33620, LMR33630, LMR33640 (36 V, 2
• Flexible system interface
A,3 A, 4 A), LMR36510 (65 V, 1 A), and LMR36520
– Power-good flag and precision enable (65 V, 2 A), completing the family of scalable SIMPLE
• Create a custom design using the LMR33610 with SWITCHER power supplies. This minimizes the cost
the WEBENCH® Power Designer and effort associated with board layout modifications.
2 Applications The LMR33610 is available in an 8-pin HSOIC
package.
• Motor drive systems: drones, AC inverters,
VF drives, servos Device Information
(1)
• Factory and building automation systems: Part Number Package Body Size (NOM)
PLC, HMI, HVAC systems, elevator main control LMR33610 HSOIC (8) 5.00 mm × 4.00 mm
panel
• Wide VIN DC/DC power supply (1) For all available packages, see the orderable addendum at
the end of the data sheet.
100
BOOT 95
VIN VIN
CBOOT 90
CIN EN SW VOUT 85
L1
COUT 80
Efficiency (%)
PGND 75
70
65
VCC PG
60
RFBT
CVCC 55 8V
FB 50 12V
RFBB 24V
45 36V
AGND
40
0.001 0.01 0.1 1
Output Current (A) eff_
Simplified Schematic Efficiency vs Output Current VOUT = 5 V, 400 kHz
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMR33610
SNVSBI9A – OCTOBER 2019 – REVISED JUNE 2022 www.ti.com
Table of Contents
1 Features............................................................................1 8.4 Device Functional Modes..........................................13
2 Applications..................................................................... 1 9 Application and Implementation.................................. 16
3 Description.......................................................................1 9.1 Application Information............................................. 16
4 Revision History.............................................................. 2 9.2 Typical Application.................................................... 16
5 Device Comparison......................................................... 3 9.3 What to Do and What Not to Do............................... 26
6 Pin Configuration and Functions...................................3 10 Power Supply Recommendations..............................27
7 Specifications.................................................................. 4 11 Layout........................................................................... 28
7.1 Absolute Maximum Ratings........................................ 4 11.1 Layout Guidelines................................................... 28
7.2 ESD Ratings............................................................... 4 11.2 Layout Example...................................................... 30
7.3 Recommended Operating Conditions.........................4 12 Device and Documentation Support..........................31
7.4 Thermal Information....................................................5 12.1 Device Support....................................................... 31
7.5 Electrical Characteristics.............................................5 12.2 Documentation Support.......................................... 31
7.6 Timing Characteristics.................................................6 12.3 Receiving Notification of Documentation Updates..31
7.7 System Characteristics............................................... 7 12.4 Support Resources................................................. 31
7.8 Typical Characteristics................................................ 8 12.5 Trademarks............................................................. 32
8 Detailed Description........................................................9 12.6 Electrostatic Discharge Caution..............................32
8.1 Overview..................................................................... 9 12.7 Glossary..................................................................32
8.2 Functional Block Diagram........................................... 9 13 Mechanical, Packaging, and Orderable
8.3 Feature Description...................................................10 Information.................................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (October 2019) to Revision A (June 2022) Page
• Updated the numbering format for tables, figures and cross-references throughout the document...................1
• Replaced thermal information.............................................................................................................................5
• Added HS current limit, LS current limit, and Ipeak-min, and f SW in Section 7.5 ..................................................5
• Added Rdson for HS and LS FETs, ton-min and ton-max in Section 7.6 ................................................................ 6
2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: LMR33610

LMR33610
www.ti.com SNVSBI9A – OCTOBER 2019 – REVISED JUNE 2022
5 Device Comparison
Device Option Package Frequency Rated Current Output Voltage
LMR33610ADDAR DDA (8-pin HSOIC) 400 kHz 1A
Adjustable
LMR33610BDDAR 5 mm × 4 mm 1400 kHz 1A
6 Pin Configuration and Functions
PGND 1 8 SW
VIN 2 7 BOOT
THERMAL PAD
EN 3 6 VCC
PG 4 5 FB
Not to scale
Figure 6-1. 8-Pin HSOIC With PowerPAD™ DDA Package (Top View)
Table 6-1. Pin Functions

PIN
TYPE DESCRIPTION
NO. NAME
Power ground pin. Connect to system ground and AGND. Connect to a bypass
1 PGND G
capacitor with short wide traces.
Input supply to regulator. Connect a high-quality bypass capacitor or capacitors
2 VIN P
directly to this pin and PGND.
Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; Do
3 EN A
not float.
Open-drain power-good flag output. Connect to a suitable voltage supply through a
4 PG A current limiting resistor. High = power OK, low = power bad. Flag pulls low when EN =
low. Can be left open when not used.
Feedback input to the regulator. Connect to a tap point of the feedback voltage divider.
5 FB A
Do not float. Do not ground.
Internal 5-V LDO output. Used as supply to internal control circuits. Do not connect
6 VCC P to external loads. Can be used as logic supply for power-good flag. Connect a high-
quality 1-µF capacitor from this pin to GND.
Bootstrap supply voltage for an internal high-side driver. Connect a high-quality 100-
7 BOOT P nF capacitor from this pin to the SW pin. This simplifies the connection from the CBOOT
capacitor to the SW pin.
Regulator switch node. Connect to the power inductor, which simplifies the connection
8 SW P
from the CBOOT capacitor to the SW pin.
Analog ground for regulator and system. Ground reference for internal references
and logic. All electrical parameters are measured with respect to this pin. Connect to
THERMAL system ground on the PCB. For the HSOIC package, the pad on the bottom of the
AGND G
PAD device serves as both the AGND connection and a thermal connection to the heat sink
ground plane. This pad must be soldered to a ground plane to achieve good electrical
and thermal performance.
A = Analog, P = Power, G = Ground
Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

LMR33610
7 Specifications
7.1 Absolute Maximum Ratings
Over the recommended operating junction temperature range(1)
PARAMETER MIN MAX UNIT
VIN to PGND –0.3 38
EN to AGND(2) –0.3 VIN + 0.3
FB to AGND –0.3 5.5 V
PG to AGND(2) 0 22
Voltages AGND to PGND –0.3 0.3
SW to PGND –0.3 VIN + 0.3
SW to PGND less than 100-ns transients –3.5 38
V
BOOT to SW –0.3 5.5
VCC to AGND(4) –0.3 5.5
TJ Junction temperature(3) –40 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V
(3) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.
(4) Under some operating conditions the VCC LDO voltage may increase beyond 5.5 V.
7.2 ESD Ratings

VALUE UNIT
Human-body model (HBM) (1) ±2500
V(ESD) Electrostatic discharge V
Charged-device model (CDM)(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of –40°C to 125°C (unless otherwise noted) (1)
MIN MAX UNIT
VIN to PGND 3.8 36
Input voltage EN (2) 0 VIN V
PG(2) 0 18
Adjustable output voltage VOUT (3) 1 24 V
Output current IOUT 0 1 A
Temperature Operating junction temperature, TJ (4) –40 125 °C
(1) Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not ensure specific
performance limits. For compliant specifications, see the Electrical Characteristics.
(2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.
(3) The maximum output voltage can be extended to 95% of VIN; contact TI for details. Under no conditions should the output voltage be
allowed to fall below 0 V.
(4) Operating at junction temperatures greater than 125℃, although possible, degrades the lifetime of the device.

LMR33610
7.4 Thermal Information

LMR33610
THERMAL METRIC(1) (2) DDA (HSOIC) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 42.9(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54 °C/W
RθJB Junction-to-board thermal resistance 13.6 °C/W
ψJT Junction-to-top characterization parameter 4.3 °C/W
ψJB Junction-to-board characterization parameter 13.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application
Report.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes.
These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the
performance obtained in an actual application. For design information, please see Section 9.2.2.11.
7.5 Electrical Characteristics

Limits apply over the recommended operating junction temperature (TJ) range of –40°C to +125°C, unless otherwise stated.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following
conditions apply: VIN = 12 V, VEN = 4 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE
Minimum operating input
VIN 3.8 V
voltage
Non-switching input current;
IQ VFB = 1.2 V 24 34 µA
measured at VIN pin (2)
Shutdown quiescent current;
ISD EN = 0 5 10 µA
measured at VIN pin
ENABLE
EN input level required to turn
VEN-VCC-H Rising threshold 1 V
on internal LDO
EN input level required to turn
VEN-VCC-L Falling threshold 0.3 V
off internal LDO
EN input level required to start
VEN-H Rising threshold 1.2 1.231 1.26 V
switching
VEN-HYS Hysteresis below VEN-H Hysteresis below VEN-H; falling 100 mV
ILKG-EN Enable input leakage current VEN = 3.3 V 0.2 nA
INTERNAL SUPPLIES
Internal LDO output voltage
VCC 6 V ≤ VIN ≤ 36 V 4.75 5 5.25 V
appearing at the VCC pin
Bootstrap voltage
VBOOT-UVLO undervoltage lock-out 2.2 V
threshold(3)
VOLTAGE REFERENCE (FB PIN)
VFB Feedback voltage 0.985 1 1.015 V
IFB Current into FB pin FB = 1 V 0.2 50 nA
CURRENT LIMITS(4)
ISC High-side current limit LMR33610 2.9 3.4 4 A
ILIMIT Low-side current limit LMR33610 1.95 2.35 2.9 A
IPEAK-MIN Minimum peak inductor current LMR33610 0.6 A
IZC Zero current detector threshold 0.01 A
SOFT START
tSS Internal soft-start time 2.9 4 6 ms
POWER GOOD (PG PIN)

LMR33610
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
Power-good upper threshold -
VPG-HIGH-UP % of FB voltage 105% 107% 110%
rising
Power-good upper threshold –
VPG-HIGH-DN % of FB voltage 103% 105% 108%
falling
Power-good lower threshold –
VPG-LOW-UP % of FB voltage 92% 94% 97%
rising
Power-good lower threshold –
VPG-LOW-DN % of FB voltage 90% 92% 95%
falling
Power-good glitch filter
tPG 60 170 µs
delay(1)
VIN = 12 V, VEN = 4 V 76 150
RPG Power-good flag RDSON Ω
VEN = 0 V 35 60
Minimum input voltage for
VIN-PG 50-µA, EN = 0 V 2 V
proper PG function
VPG PG logic low output 50-µA, EN = 0 V, VIN = 2V 0.2 V
OSCILLATOR
ƒSW Switching frequency "A" version 340 400 460 kHz
ƒSW Switching frequency "B" version 1.2 1.4 1.6 MHz
ƒSW Switching frequency "C" version, DDA package 1.8 2.1 2.4 MHz
MOSFETS
High-side MOSFET ON-
RDS-ON-HS DDA package 95 160 mΩ
resistance
Low-side MOSFET ON-
RDS-ON-LS DDA package 66 110 mΩ
resistance
(1) See Section 8.3.1 for details.

(2) This is the current used by the device open loop. It does not represent the total input current of the system when in regulation.
(3) When the voltage across the CBOOT capacitor falls below this voltage, the low-side MOSFET is turned on to recharge CBOOT.
(4) The current limit values in this table are tested, open loop, in production. They can differ from those found in a closed loop application.
7.6 Timing Characteristics

Minimum and maximum limits are specified through test, design or statistical correlation. Typical values represent the most
MIN NOM MAX UNIT
tON-MIN Minimum switch on time DDA package 75 108 ns
tOFF-MIN Minimum switch off time DDA package 50 85 ns
tON-MAX Maximum switch on time 7 9 µs

LMR33610
7.7 System Characteristics

The following specifications apply to a typical applications circuit, with nominal component values. Specifications in the
typical (TYP) column apply to TJ = 25°C only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to
the case of typical components over the temperature range of TJ = –40°C to 125°C. These specifications are not ensured by
production testing.
VIN Operating input voltage range VOUT = 3.3 V, IOUT= 0 A 3.8 36 V
VOUT = 5 V, VIN = 7 V to 36 V, IOUT = 0 A to
–1.5% 2.5%
Output voltage regulation for VOUT = 5 max. load
V(1) VOUT = 5 V, VIN = 7 V to 36 V, IOUT = 1 A to
–1.5% 1.5%
max. load
VOUT
VOUT = 3.3 V, VIN = 3.8 V to 36 V, IOUT = 0 A
–1.5% 2.5%
Output voltage regulation for VOUT = 3.3 to max. load
V(1) VOUT = 3.3 V, VIN = 3.8 V to 36 V, IOUT = 1 A
–1.5% 1.5%
to max. load
VIN = 12 V, VOUT = 3.3 V, IOUT = 0 A,
ISUPPLY Input supply current when in regulation 25 µA
RFBT = 1 MΩ
VOUT = 5 V, IOUT = 1A
VDROP Dropout voltage; (VIN – VOUT) Dropout at –1% of regulation, 150 mV
ƒSW = 140 kHz
DMAX Maximum switch duty cycle(2) VIN = VOUT = 12 V, IOUT = 1 A 98%
FB pin voltage required to trip short-circuit
VHC 0.4 V
hiccup mode
tHC Time between current-limit hiccup burst 94 ms
tD Switch voltage dead time 2 ns
Shutdown temperature 165 °C
TSD Thermal shutdown temperature
Recovery temperature 148 °C
(1) Deviation is with respect to VIN =12 V, IOUT = 1 A.

(2) In dropout the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: ƒMIN =
1 / (tON-MAX + tOFF-MIN). DMAX = tON-MAX /(tON-MAX + tOFF-MIN).

LMR33610
7.8 Typical Characteristics

Unless otherwise specified the following conditions apply: TA = 25°C and VIN = 12 V
36 12
11
34
10
Quiescent Current (µA)
Shutdown Current (µA)

32 9
8
30
7
28 6
5
26
4
24 -40C 3 -40C
25C 2 25C
22
1
125C 125C
20 0
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
Input Voltage (V) C005 Input Voltage (V) C003
VFB = 1.2 V EN = 0 V
Figure 7-1. Non-Switching Input Supply Current Figure 7-2. Shutdown Supply Current
600 1.35
590
1.30
580
EN Threshold Voltage (V)
Output Current (mA)
570 1.25
560
1.20
550
1.15
540
530 1.10
-40C
520
25C 1.05 UP
510
125C DN
500 1.00
0 5 10 15 20 25 30 35 40 ±40 ±20 0 20 40 60 80 100 120 140
Input Voltage (V) C007 Temperature (C) C006
VOUT = 0 V ƒS = 400 kHz See Figure 9-20 Figure 7-4. Precision Enable Thresholds
Figure 7-3. Short-Circuit Output Current
700
650
OUTPUT VOLTAGE (0.8V/Div)
Peak Inductor Current (mA)
600
550
500
-40C
DN UP 450 25C
125C
400
0 0 5 10 15 20 25 30 35 40
INPUT VOLTAGE (1V/Div) Input Voltage (V) C008
IOUT = 1 mA See Figure 9-20 IOUT = 0 A VOUT = 5 V See Figure 9-20

ƒSW = 400 kHz
Figure 7-5. UVLO Thresholds
Figure 7-6. IPEAK-MIN

LMR33610
8 Detailed Description
8.1 Overview
The LMR33610 is a synchronous peak-current-mode buck regulator designed for a wide variety of industrial
applications. Advanced high speed circuitry allows the device to regulate from an input voltage of 20 V, while
providing an output voltage of 3.3 V at a switching frequency of 1.4 MHz. The innovative architecture allows
the device to regulate a 3.3-V output from an input of only 3.8 V. The regulator automatically switches modes
between PFM and PWM, depending on load. At heavy loads, the device operates in PWM at a constant
switching frequency. At light loads, the mode changes to PFM with diode emulation allowing DCM, which
reduces the input supply current and keeps efficiency high. The device features internal loop compensation,
which reduces design time and requires fewer external components than externally compensated regulators.
8.2 Functional Block Diagram
VCC VIN
INT. REG.
OSCILLATOR
BIAS BOOT
ENABLE
EN LOGIC
HS CURRENT
SENSE
1.0V
Reference
ERROR PWM
AMPLIFIER COMP.
CONTROL
+ LOGIC DRIVER SW
+
-
FB -
LS CURRENT
PG PFM MODE
CONTROL
SENSE
POWER GOOD
CONTROL
AGND PGND

LMR33610
8.3 Feature Description

8.3.1 Power-Good Flag Output
The power-good flag function (PG output pin) of the LMR33610 can be used to reset a system microprocessor
whenever the output voltage is out of regulation. This open-drain output goes low under fault conditions, such as
current limit and thermal shutdown, as well as during normal start-up. A glitch filter prevents false flag operation
for short excursions of the output voltage, such as during line and load transients. The timing parameters of the
glitch filter are found in the Electrical Characteristics. Output voltage excursions lasting less than tPG do not trip
the power-good flag. Power-good operation can best be understood by reference to Figure 8-1 and Figure 8-2.
Note that during initial power-up a delay of about 4 ms (typical) is inserted from the time that EN is asserted
to the time that the power-good flag goes high. This delay only occurs during start-up and is not encountered
during normal operation of the power-good function.
The power-good output consists of an open-drain NMOS, requiring an external pullup resistor to a suitable logic
supply. The power-good output can also be pulled up to either VCC or VOUT through a 100-kΩ resistor, as
desired. If this function is not needed, the PG pin must be left floating. When EN is pulled low, the flag output
is also forced low. With EN low, power good remains valid as long as the input voltage is ≥ 2 V (typical). Limit
the current into the power-good flag pin to less than 5 mA D.C. The maximum current is internally limited to
approximately 35 mA when the device is enabled and approximately 65 mA when the device is disabled. The
internal current limit protects the device from any transient currents that can occur when discharging a filter
capacitor connected to this output.
VOUT
VPG-HIGH_UP (107%)
VPG-HIGH-DN (105%)
VPG-LOW-UP (95%)
VPG-LOW-DN (93%)
PG
High = Power Good
Low = Fault
Figure 8-1. Static Power-Good Operation

LMR33610
Glitches do not cause false operation nor reset timer

VOUT
VPG-LOW-UP (95%)
VPG-LOW-DN (93%)
< tPG
PG
tPG tPG tPG
Figure 8-2. Power-Good Timing Behavior
8.3.2 Enable and Start-up

Start-up and shutdown are controlled by the EN input. This input features precision thresholds, allowing the use
of an external voltage divider to provide an adjustable input UVLO (see External UVLO). Applying a voltage of
≥ VEN-VCC_H causes the device to enter standby mode, powering the internal VCC, but not producing an output
voltage. Increasing the EN voltage to VEN-H fully enables the device, allowing it to enter start-up mode and begin
the soft-start period. When the EN input is brought below VEN-H by VEN-HYS, the regulator stops running and
enters standby mode. Further decrease in the EN voltage to below VEN-VCC-L completely shuts down the device.
Figure 8-3 shows this behavior. The EN input can be connected directly to VIN if this feature is not needed.
This input must not be allowed to float. The values for the various EN thresholds can be found in the Electrical
Characteristics.
The LMR33630 uses a reference-based soft start that prevents output voltage overshoots and large inrush
currents as the regulator is starting up. Figure 8-4 shows a typical start-up waveform, indicating typical timings.
The rise time of the output voltage is approximately 4 ms (see the Electrical Characteristics).

LMR33610
EN
VEN-H
VEN-H ± VEN-HYS
VEN-VCC-H
VEN-VCC-L
VCC
5V
VOUT
VOUT
Figure 8-3. Precision Enable Behavior
VIN = EN, 10V/Div
VOUT, 2V/Div
IL, 1A/Div
PG, 5V/Div
2ms/Div
Figure 8-4. Typical Start-Up Behavior VIN = 12 V, VOUT = 5 V, IOUT = 1 A
8.3.3 Current Limit and Short Circuit

The LMR33610 incorporates both peak and valley inductor current limit to provide protection to the device from
overloads and short circuits and limit the maximum output current. Valley current limit prevents inductor current
runaway during short circuits on the output, while both peak and valley limits work together to limit the maximum
output current of the converter. Cycle-by-cycle current limit is used for overloads, while hiccup mode is used for
sustained short circuits. Finally, a zero current detector is used on the low-side power MOSFET to implement

LMR33610
DEM at light loads (see the Glossary). The typical value of this current limit is found under IZC in the Electrical
Characteristics.
When the device is overloaded, the valley of the inductor current may not reach below ILIMIT (see the Electrical
Characteristics) before the next clock cycle. When this occurs, the valley current limit control skips that cycle,
causing the switching frequency to drop. Further overload causes the switching frequency to continue to drop,
and the inductor ripple current to increase. When the peak of the inductor current reaches the high-side current
limit, ISC (see the Electrical Characteristics), the switch duty cycle is reduced and the output voltage falls out
of regulation. This represents the maximum output current from the converter and is given approximately by
Equation 1.
ILIMIT ISC
IOUT max 2 (1)
If, during current limit, the voltage on the FB input falls below about 0.4 V, due to a short circuit, the device enters
hiccup mode. In this mode, the device stops switching for tHC (see the System Characteristics), or approximately
94 ms, and then goes through a normal restart with soft start. If the short-circuit condition remains, the device
runs in current limit for approximately 20 ms (typical) and then shuts down again. This cycle repeats, as shown
in Figure 8-5, as long as the short-circuit-condition persists. This mode of operation reduces the temperature rise
of the device during a hard short on the output. The output current is greatly reduced during hiccup mode (see
the Typical Characteristics). Once the output short is removed and the hiccup delay is passed, the output voltage
recovers normally as shown in Figure 8-6.
Short Applied Short Removed
VOUT, 2V/Div
Inductor Current, 1A/Div
Inductor Current,
50ms/Div 1A/Div
50ms/Div
Figure 8-5. Inductor Current Burst in Short-Circuit Figure 8-6. Short-Circuit Transient and Recovery
Mode
8.3.4 Undervoltage Lockout and Thermal Shutdown

The LMR33610 incorporates an undervoltage-lockout feature on the output of the internal LDO (at the VCC pin).
When VCC reaches approximately 3.7 V, the device is ready to receive an EN signal and start up. When VCC
falls below approximately 3 V, the device shuts down, regardless of EN status. Since the LDO is in dropout
during these transitions, the above values roughly represent the input voltage levels during the transitions.
Thermal shutdown is provided to protect the regulator from excessive junction temperature. When the junction
temperature reaches about 165°C, the device shuts down. Restart occurs when the temperature falls to
approximately 148°C.
8.4 Device Functional Modes
8.4.1 Auto Mode
In auto mode, the device moves between PWM and PFM as the load changes. At light loads, the regulator
operates in PFM. At higher loads, the mode changes to PWM. The load current for which the device moves
from PFM to PWM can be found in the Application Curves. The output current at which the device changes

LMR33610
modes depends on the input voltage, inductor value, and the nominal switching frequency. The device is in
PWM mode for output currents above the curve. The device is in PFM for currents below the curve. The
curves apply for a nominal switching frequency of 400 kHz and the BOM shown in the Application Curves.
At higher switching frequencies, the load at which the mode change occurs is greater. For applications where
the switching frequency must be known for a given condition, the transition between PFM and PWM must be
carefully tested before the design is finalized.
In PWM mode, the regulator operates as a constant frequency converter, using PWM to regulate the output
voltage. While operating in this mode, the output voltage is regulated by switching at a constant frequency and
modulating the duty cycle to control the power to the load. This provides excellent line and load regulation and
low output voltage ripple.
In PFM, the high-side MOSFET is turned on in a burst of one or more pulses to provide energy to the load.
The duration of the burst depends on how long it takes the inductor current to reach IPEAK-MIN. The periodicity
of these bursts is adjusted to regulate the output, while diode emulation (DEM) is used to maximize efficiency
(see the Glossary). This mode provides high light-load efficiency by reducing the amount of input supply current
required to regulate the output voltage at light loads. PFM results in very good light-load efficiency, but also
yields larger output voltage ripple and variable switching frequency. Also, a small increase in output voltage
occurs at light loads. The actual switching frequency and output voltage ripple depends on the input voltage,
output voltage, and load. Figure 8-7 and Figure 8-8 show typical switching waveforms in PFM and PWM. See
the Application Curves for output voltage variation with load in auto mode.
SW, 10V/Div
SW, 10V/Div
VOUT, 10mV/Div VOUT, 10mV/Div
IL, 1A/Div
IL, 500mA/Div
20µs/Div 20µs/Div
Figure 8-7. Typical PFM Switching Waveforms, VIN Figure 8-8. Typical PWM Switching Waveforms, VIN
= 12 V, VOUT = 5 V, IOUT = 10 mA = 12 V, VOUT = 5 V, IOUT = 1 A, ƒS = 400 kHz
8.4.2 Dropout
The dropout performance of any buck regulator is affected by the RDSON of the power MOSFETs, the DC
resistance of the inductor, and the maximum duty cycle that the controller can achieve. As the input voltage level
approaches the output voltage, the off time of the high-side MOSFET starts to approach the minimum value
(see the Timing Characteristics). Beyond this point, the switching can become erratic and the output voltage
falls out of regulation. To avoid this problem, the LMR33610 automatically reduces the switching frequency to
increase the effective duty cycle and maintain regulation. In this data sheet, the dropout voltage is defined as the
difference between the input and output voltage when the output has dropped by 1% of its nominal value. Under
this condition, the switching frequency has dropped to its minimum value of about 140 kHz. Note that the 0.4-V
short circuit detection threshold is not activated when in dropout mode. Typical dropout characteristics can be
found in Figure 8-9 and Figure 8-10.

LMR33610
6 0.2
5.5
0.15
Drop-out Voltage (V)

Input Voltage (V)
4.5 0.1
4
0.05
3.5
0A 3.3V
1A 5V
3 0
4 4.5 5 5.5 6 6.5 7 0.25 0.5 0.75 1 1.25
Output Current (A)
Output Voltage (V) drop
drop
Figure 8-9. Overall Dropout Characteristic, VOUT = Figure 8-10. Typical Dropout Voltage vs Output
5V Current in Frequency Foldback, ƒSW = 140 kHz
8.4.3 Minimum Switch On Time

Every switching regulator has a minimum controllable on time dictated by the inherent delays and blanking
times associated with the control circuits. This imposes a minimum switch duty cycle and, therefore, a minimum
conversion ratio. The constraint is encountered at high input voltages and low output voltages. To help extend
the minimum controllable duty cycle, the LMR33610 automatically reduces the switching frequency when the
minimum on-time limit is reached. This way, the converter can regulate the lowest programmable output
voltage at the maximum input voltage. Use Equation 2 to estimate the approximate input voltage for a given
output voltage before frequency foldback occurs. The values of tON and fSW can be found in the Electrical
Characteristics. As the input voltage is increased, the switch on time (duty-cycle) reduces to regulate the output
voltage. When the on time reaches the limit, the switching frequency drops while the on time remains fixed.
VOUT
VIN d
t ON ˜ fSW (2)

LMR33610
9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information

The LMR33610 step-down DC-to-DC converter is typically used to convert a higher DC voltage to a lower
DC voltage with a maximum output current of 1 A. The following design procedure can be used to select
components for the LMR33610. Alternately, the WEBENCH Design Tool can be used to generate a complete
design. This tool uses an iterative design procedure and has access to a comprehensive database of
components. This allows the tool to create an optimized design and allows the user to experiment with various
options.
Note
In this data sheet, the effective value of capacitance is defined as the actual capacitance under
D.C. bias and temperature, not the rated or nameplate values. Use high-quality, low-ESR, ceramic
capacitors with an X5R or better dielectric throughout. All high value ceramic capacitors have a
large voltage coefficient in addition to normal tolerances and temperature effects. Under D.C. bias,
the capacitance drops considerably. Large case sizes and higher voltage ratings are better in this
regard. To help mitigate these effects, multiple capacitors can be used in parallel to bring the minimum
effective capacitance up to the required value. This can also ease the RMS current requirements on
a single capacitor. A careful study of bias and temperature variation of any capacitor bank must be
made to ensure that the minimum value of effective capacitance is provided.
9.2 Typical Application

Figure 9-1 shows a typical application circuit for the LMR33610. This device is designed to function over a wide
range of external components and system parameters. However, the internal compensation is optimized for a
certain range of external inductance and output capacitance. As a quick start guide, Figure 9-1 provides typical
component values for a range of the most common output voltages. The values given in the table are typical.
Other values can be used to enhance certain performance criterion as required by the application.
L
VOUT
VIN VIN SW
6 V to 36 V 10 µH 5V
CIN
CHF CBOOT 1A
4.7 µF
220 nF BOOT COUT
EN 2x 22 µF
0.1 µF
RFBT
PG CFF
100 NŸ
PG
100 NŸ VCC FB
CVCC
1 µF PGND AGND
RFBB
24.9 NŸ
Figure 9-1. Example Application Circuit (400 kHz)

LMR33610
9.2.1 Design Requirements

Table 9-1 provides the parameters for the detailed design procedure example.
Table 9-1. Detailed Design Parameters
Design Parameter Example Value
Input voltage 12 V (6 V to 36 V)
Output voltage 5V
Maximum output current 0 A to 1 A
Switching frequency 400 kHz
Table 9-2. Typical External Component Values

ƒSW COUT (Rated
VOUT (V) L (µH) RFBT (Ω) RFBB (Ω) CIN + CHF CBOOT CVCC CFF
(kHz) Capacitance)
400 3.3 10 2 × 22 µF 100 k 43.2 k 4.7 µF + 220 nF 100 nF 1 µF Open
1400 3.3 2.2 1 × 22 µF 100 k 43.2 k 4.7 µF + 220 nF 100 nF 1 µF Open
400 5 10 2 × 22 µF 100 k 24.9 k 4.7 µF + 220 nF 100 nF 1 µF Open
1400 5 2.2 1 × 22 µF 100 k 24.9 k 4.7 µF + 220 nF 100 nF 1 µF Open
400 12 15 2 × 22 µF 100 k 9.09 k 4.7 µF + 220 nF 100 nF 1 µF Open
1400 12 4.7 2 × 10 µF 100 k 9.09 k 4.7 µF + 220 nF 100 nF 1 µF Open
9.2.2 Detailed Design Procedure

The following design procedure applies to Figure 9-1 and Table 9-1.
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LMR33610 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Choosing the Switching Frequency
The choice of switching frequency is a compromise between conversion efficiency and overall solution size.
Lower switching frequency implies reduced switching losses and usually results in higher system efficiency.
However, higher switching frequency allows the use of smaller inductors and output capacitors hence, a more
compact design. 400 kHz was chosen for this example.
9.2.2.3 Setting the Output Voltage
The output voltage of LMR33610 is externally adjustable using a resistor divider network. The range of
recommended output voltage is found in the Recommended Operating Conditions. The divider network is
comprised of RFBT and RFBB and closes the loop between the output voltage and the converter. The converter
regulates the output voltage by holding the voltage on the FB pin equal to the internal reference voltage,
VREF. The resistance of the divider is a compromise between excessive noise pickup and excessive loading of
the output. Smaller values of resistance reduce noise sensitivity but also reduce the light-load efficiency. The
recommended value for RFBT is 100 kΩ with a maximum value of 1 MΩ. If a 1 MΩ is selected for RFBT, then
LMR33610
a feedforward capacitor must be used across this resistor to provide adequate loop phase margin (see CFF
Selection). Once RFBT is selected, use Equation 3 to select RFBB. VREF is nominally 1 V (see the Electrical
Characteristics for limits).
RFBT
RFBB
ª VOUT º
« 1»
¬ VREF ¼ (3)
For this 5-V example, RFBT = 100 kΩ and RFBB = 24.9 kΩ are chosen.
9.2.2.4 Inductor Selection
The parameters for selecting the inductor are the inductance and saturation current. The inductance is based
on the desired peak-to-peak ripple current and is normally chosen to be in the range of 20% to 40% of
the maximum output current. Experience shows that the best value for inductor ripple current is 30% of the
maximum load current. Use the maximum device current when selecting the ripple current for application with
a much smaller maximum load than the maximum available from the device. Use Equation 4 to determine the
value of inductance. The constant K is the percentage of inductor current ripple. For this example, K = 0.3 and
an inductance of L = 8.1 µH was found. The next standard value of 8 µH was selected.
VIN VOUT V
L ˜ OUT
fSW ˜ K ˜ IOUT max VIN (4)
Ideally, the saturation current rating of the inductor must be at least as large as the high-side switch current
limit, ISC (see the Electrical Characteristics). This ensures that the inductor does not saturate even during a short
circuit on the output. When the inductor core material saturates, the inductance falls to a very low value, causing
the inductor current to rise very rapidly. Although the valley current limit, ILIMIT, is designed to reduce the risk of
current run-away, a saturated inductor can cause the current to rise to high values very rapidly. This can lead
to component damage. Do not allow the inductor to saturate. Inductors with a ferrite core material have very
hard saturation characteristics, but usually have lower core losses than powdered iron cores. Powered iron cores
exhibit a soft saturation, allowing some relaxation in the current rating of the inductor. However, they have more
core losses at frequencies typically above 1 MHz. In any case, the inductor saturation current must not be less
than the device low-side current limit, ILIMIT (see the Electrical Characteristics). To avoid subharmonic oscillation,
the inductance value must not be less than that given in Equation 5. The maximum inductance is limited by
the minimum current ripple required for the current mode control to perform correctly. As a rule-of-thumb, the
minimum inductor ripple current must be no less than about 10% of the device maximum rated current under
nominal conditions.
VOUT
LMIN t 0.36 ˜
fSW (5)
9.2.2.5 Output Capacitor Selection

The value of the output capacitor and its ESR determine the output voltage ripple and load transient
performance. The output capacitor bank is usually limited by the load transient requirements rather than the
output voltage ripple. Use Equation 6 to estimate a lower bound on the total output capacitance and an upper
bound on the ESR, which is required to meet a specified load transient.

LMR33610
'IOUT ª K2 º
COUT t ˜«1 D ˜ 1 K ˜ 2 D»
fSW ˜ 'VOUT ˜ K ¬« 12 ¼»
2 K ˜ 'VOUT
ESR d
ª K2 § 1 ·º
2 ˜ 'IOUT «1 K ˜ ¨¨1 ¸»
¬« 12 © (1 D) ¸¹¼»
VOUT
D
VIN (6)
where
• ΔVOUT = output voltage transient
• ΔIOUT = output current transient
• K = ripple factor from Inductor Selection
Once the output capacitor and ESR have been calculated, use Equation 7 to check the peak-to-peak output
voltage ripple, Vr.
1
Vr # 'IL ˜ ESR 2 2
8 ˜ fSW ˜ COUT (7)
The output capacitor and ESR can then be adjusted to meet both the load transient and output ripple
requirements.
This example requires a ΔVOUT ≤ 250 mV for an output current step of ΔIOUT = 1 A. Equation 7 gives a minimum
value of 25 µF and a maximum ESR of 0.21 Ω. Assuming a 20% tolerance and a 10% bias de-rating, there
is a minimum capacitance of 35 µF. This can be achieved with a bank of 2 × 22-µF, 16-V, ceramic capacitors
in the 1210 case size. More output capacitance can be used to improve the load transient response. Ceramic
capacitors can easily meet the minimum ESR requirements. In some cases, an aluminum electrolytic capacitor
can be placed in parallel with the ceramics to help build up the required value of capacitance. In general, use a
capacitor of at least 10 V for output voltages of 3.3 V or less, while a capacitor of 16 V or more must be used for
output voltages of 5 V and above.
In practice, the output capacitor has the most influence on the transient response and loop phase margin. Load
transient testing and bode plots are the best way to validate any given design and must always be completed
before the application goes into production. In addition to the required output capacitance, a small ceramic
placed on the output can help reduce high frequency noise. Small case size ceramic capacitors in the range
of 1 nF to 100 nF can be very helpful in reducing voltage spikes on the output caused by inductor and board
parasitics.
The maximum value of total output capacitance must be limited to about 10 times the design value, or 1000
µF, whichever is smaller. Large values of output capacitance can adversely affect the start-up behavior of the
regulator as well as the loop stability. If values larger than noted here must be used, then a careful study of
start-up at full load and loop stability must be performed.
9.2.2.6 Input Capacitor Selection
The ceramic input capacitors provide a low impedance source to the regulator in addition to supplying the ripple
current and isolating switching noise from other circuits. A minimum of 4.7 µF of ceramic capacitance is required
on the input of the LMR33610. This must be rated for at least the maximum input voltage that the application
requires; preferably twice the maximum input voltage. This capacitance can be increased to reduce input voltage
ripple and maintain the input voltage during load transients. In addition, a small case size 220-nF ceramic
capacitor must be used at the input as close a possible to the regulator. This provides a high frequency bypass

LMR33610
for the control circuits internal to the device. For this example, a 4.7-µF, 50-V, X7R (or better) ceramic capacitor
is chosen. The 220 nF must also be rated at 50 V with an X7R dielectric.
Many times, it is desirable to use an electrolytic capacitor on the input in parallel with the ceramics. This is
especially true if long leads or traces are used to connect the input supply to the regulator. The moderate ESR
of this capacitor can help damp any ringing on the input supply caused by the long power leads. The use of
this additional capacitor also helps with momentary voltage dips caused by input supplies with unusually high
impedance.
Most of the input switching current passes through the ceramic input capacitor or capacitors. The approximate
worst case RMS value of this current can be calculated from Equation 8 and must be checked against the
manufacturers' maximum ratings.
IOUT
IRMS #
2 (8)
9.2.2.7 CBOOT
The LMR33610 requires a bootstrap capacitor connected between the BOOT pin and the SW pin. This capacitor
stores energy that is used to supply the gate drivers for the power MOSFETs. A high-quality ceramic capacitor of
100 nF and at least 10 V is required.
9.2.2.8 VCC
The VCC pin is the output of the internal LDO used to supply the control circuits of the regulator. This output
requires a 1-µF, 16-V ceramic capacitor connected from VCC to GND for proper operation. In general, avoid
loading this output with any external circuitry. However, this output can be used to supply the pullup for the
power-good function (see Power-Good Flag Output). A value of 100 kΩ is a good choice in this case. The
nominal output voltage on VCC is 5 V; see the Electrical Characteristics for limits. Do not short this output to
ground or any other external voltage.
9.2.2.9 CFF Selection
In some cases, a feedforward capacitor can be used across RFBT to improve the load transient response or
improve the loop-phase margin. This is especially true when values of RFBT > 100 kΩ are used. Large values of
RFBT, in combination with the parasitic capacitance at the FB pin, can create a small signal pole that interferes
with the loop stability. A CFF can help mitigate this effect. Use Equation 9 to estimate the value of CFF. The
value found with Equation 9 is a starting point; use lower values to determine if any advantage is gained by the
use of a CFF capacitor. The Optimizing Transient Response of Internally Compensated DC-DC Converters with
Feedforward Capacitor Application Report is helpful when experimenting with a feedforward capacitor.
VOUT ˜ COUT
CFF
VREF
120 ˜ RFBT ˜
VOUT (9)
9.2.2.10 External UVLO

In some cases, an input UVLO level different than that provided internal to the device is needed. This can
be accomplished by using the circuit shown in Figure 9-2. The input voltage at which the device turns on is
designated VON while the turnoff voltage is VOFF. First, a value for RENB is chosen in the range of 10 kΩ to 100
kΩ and then Equation 10 is used to calculate RENT and VOFF.

LMR33610
VIN
RENT
EN
RENB
Figure 9-2. Setup for External UVLO Application
§ V ON ·
R ENT ¨¨ 1¸¸ ˜ R ENB
© VEN H ¹
§ VEN HYS ·
V OFF V ON ˜ ¨¨ 1 ¸¸
© VEN H ¹ (10)
where
• VON = VIN turn-on voltage
• VOFF = VIN turn-off voltage
9.2.2.11 Maximum Ambient Temperature
As with any power conversion device, the LMR33610 dissipates internal power while operating. The effect of
this power dissipation is to raise the internal temperature of the converter above ambient. The internal die
temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance,
RθJA, of the device and PCB combination. The maximum internal die temperature for the LMR33610 must
be limited to 125°C. This establishes a limit on the maximum device power dissipation and, therefore, the
load current. Equation 11 shows the relationships between the important parameters. It is easy to see that
larger ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current. The
converter efficiency can be estimated by using the curves provided in this data sheet. If the desired operating
conditions cannot be found in one of the curves, then interpolation can be used to estimate the efficiency.
Alternatively, the EVM can be adjusted to match the desired application requirements and the efficiency can be
measured directly. The correct value of RθJA is more difficult to estimate. As stated in the Semiconductor and
IC Package Thermal Metrics Application Report, the value of RθJA given in the Thermal Information is not valid
for design purposes and must not be used to estimate the thermal performance of the application. The values
reported in that table were measured under a specific set of conditions that are rarely obtained in an actual
application.
TJ TA K 1
IOUT MAX
˜ ˜
R TJA 1 K VOUT (11)
where
• η = efficiency
The effective RθJA is a critical parameter and depends on many factors such as the following:
• Power dissipation
• Air temperature/flow
• PCB area
• Copper heat-sink area
• Number of thermal vias under the package
• Adjacent component placement
The HSOIC (DDA) package uses a die attach paddle or thermal pad (PAD) to provide a place to solder down to
the PCB heat-sinking copper. This provides a good heat conduction path from the regulator junction to the heat
LMR33610
sink and must be properly soldered to the PCB heat sink copper. Typical examples of RθJA versus copper board
area can be found in Figure 9-3. The copper area given in the graph is for each layer; the top and bottom layers
are 2-ounce copper each, while the inner layers are 1 ounce.
Figure 9-4 and Figure 9-5 show the typical curves of maximum output current versus ambient temperature. This
data was taken with a device and PCB combination, giving an RθJA as noted in the graph. Remember that the
data given in these graphs are for illustration purposes only and the actual performance in any given application
depends on all of the previously mentioned factors.
44 1.5
42
40 1.25
Maximum Output Current (A)

38
36 1
(ƒC/W)
34
32
0.75
JA
30
R
28
0.5
26
24
22 0.25
DDA, 4L
20
0 10 20 30 40 50 60 70 0
Copper Area (cm2) C003
0 20 40 60 80 100 120 140
Ambient Temperature (qC) max_
VIN = 12 V VOUT = 5 V
ƒSW = 400 kHz RθJA = 30°C/W
Figure 9-3. Typical RθJA vs Copper Area for a Four-
Layer Board and the HSOIC (DDA) Package Figure 9-4. Maximum Output Current vs Ambient
Temperature
1.5
1.25
Maximum Output Current (A)
0.75
0.5
0.25
0
0 20 40 60 80 100 120 140
Ambient Temperature (qC) max_
VIN = 12 V VOUT = 5 V
ƒSW = 400 kHz RθJA = 50°C/W
Figure 9-5. Maximum Output Current vs Ambient Temperature

LMR33610
Use the following resources as a guide to optimal thermal PCB design and estimating RθJA for a given
application environment:
• Thermal Design by Insight not Hindsight Application Report
• A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
• Semiconductor and IC Package Thermal Metrics Application Report
• Thermal Design Made Simple with LM43603 and LM43602 Application Report
• PowerPAD™ Thermally Enhanced Package Application Report
• PowerPAD™ Made Easy Application Report
• Using New Thermal Metrics Application Report

LMR33610
9.2.3 Application Curves

Unless otherwise specified, the following conditions apply: VIN = 12 V, TA = 25°C. Figure 9-20 shows the circuit
with the appropriate BOM from Table 9-3.
100 100
95 95
90 90
85 85
80 80
Efficiency (%)
Efficiency (%)
75 75
70 70
65 65
60 60
55 8V 55 5V
50 12V 50 12V
24V 24V
45 36V 45 36V
40 40
0.001 0.01 0.1 1 0.001 0.01 0.1 1
VOUT = 5 V 400 kHz DDA Package VOUT = 3.3 V 400 kHz DDA Package
Figure 9-6. Efficiency Figure 9-7. Efficiency

100 100
95 95
90 90
85 85
80 80
75 75
Efficiency (%)
Efficiency (%)
70 70
65 65
60 60
55 55
50 50
45 8V 45 5V
12V 12V
40 24V 40 24V
35 36V 35 36V
30 30
0.001 0.01 0.1 1 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1
VOUT = 5 V 1.4 MHz DDA Package VOUT = 3.3 V 1.4 MHz DDA Package
Figure 9-8. Efficiency Figure 9-9. Efficiency

5.05 3.345
8V 8V
5.045 12V 3.34 12V
24V 24V
5.04 36V 36V
3.335
Output Voltage (V)
Output Voltage (V)
5.035
3.33
5.03
3.325
5.025
3.32
5.02
3.315
5.015
5.01 3.31
5.005 3.305
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Output Current (A) line
Output Current (A) line
VOUT = 5 V VOUT = 3.3 V
Figure 9-10. Line and Load Regulation Figure 9-11. Line and Load Regulation

LMR33610
34 34
32 32
Input Supply Current (µA)
Input Supply Current (µA)

30 30
28 28
26 26
24 24
22 22
5V 3.3V
20 20
5 10 15 20 25 30 35 40 5 10 15 20 25 30 35 40
VOUT = 5 V IOUT = 0 A RFBT = 1 MΩ VOUT = 3.3 V IOUT = 0 A RFBT = 1 MΩ
Figure 9-12. Input Supply Current Figure 9-13. Input Supply Current
0.25 0.35
0.30
0.2
0.25
Output Current (A)
Output Current (A)

0.15
X 0.20
PWM X
0.15
0.1
PWM
PFM 0.10
PFM
X
0.05 X
0.05
5V 3.3V
0 0.00
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
VOUT = 5 V ƒSW = 400 kHz VOUT = 3.3 V ƒSW = 400 kHz
Figure 9-14. Mode Change Thresholds Figure 9-15. Mode Change Thresholds
IL, 500mA/Div IL, 500mA/Div

200µs/Div 200µs/Div
VIN = 12 V VOUT = 5 V VIN = 12 V VOUT = 3.3 V

tf = tr = 2 µs IOUT = 0 A to 1 A tf = tr = 2 µs IOUT = 0 A to 1 A
Figure 9-16. Load Transient Figure 9-17. Load Transient

LMR33610
IL, 500mA/Div IL, 500mA/Div
200µs/Div 200µs/Div
VIN = 12 V VOUT = 5 V VIN = 12 V VOUT = 3.3 V

tf = tr = 2 µs IOUT = 0.5 A to 1 A tf = tr = 2 µs IOUT = 0.5 A to 1 A
Figure 9-18. Load Transient Figure 9-19. Load Transient
L
VOUT
VIN VIN SW
U1
CIN CBOOT
CHF BOOT COUT
EN
0.1 µF
RFBT
PG 100 NŸ
PG
100 NŸ VCC FB
CVCC
1 µF PGND AGND
RFBB
Figure 9-20. Circuit for Application Curves
Table 9-3. BOM for Typical Application Curves DDA Package

VOUT (1) Frequency RFBB COUT CIN + CHF L U1
3.3 V 400 kHz 43.3 kΩ 4 × 22 µF 1 × 10 µF + 1 × 220 nF 6.8 µH, 14 mΩ LMR33610ADDA
3.3 V 1400 kHz 43.3 kΩ 4 × 22 µF 1 × 10 µF + 1 × 220 nF 2.2 µH, 11.4 mΩ LMR33610BDDA
5V 400 kHz 24.9 kΩ 4 × 22 µF 1 × 10 µF + 1 × 220 nF 8.2 µH, 14 mΩ LMR33610ADDA
5V 1400 kHz 24.9 kΩ 4 × 22 µF 1 × 10 µF + 1 × 220 nF 2.2 µH, 11.4 mΩ LMR33610BDDA
(1) The values in this table were selected to enhance certain performance criteria and may not represent typical values.
9.3 What to Do and What Not to Do

• Do not exceed the Absolute Maximum Ratings.
• Do not exceed the ESD Ratings.
• Do not exceed the Recommended Operating Conditions.
• Do not allow the EN input to float.
• Do not allow the output voltage to exceed the input voltage, nor go below ground.
• Do not use the value of RθJA given in the Thermal Information table to design your application. Use the
information in the Maximum Ambient Temperature section.
• Follow all the guidelines and suggestions found in this data sheet before committing the design to production.
TI application engineers are ready to help critique your design and PCB layout to help make your project a
success (see the Support Resources).

LMR33610
10 Power Supply Recommendations

The characteristics of the input supply must be compatible with the Absolute Maximum Ratings and
Recommended Operating Conditions found in this data sheet. In addition, the input supply must be capable
of delivering the required input current to the loaded regulator. Use Equation 12 to estimate the average input
current.
VOUT ˜ IOUT
IIN
VIN ˜ K (12)
where
• η = efficiency
If the regulator is connected to the input supply through long wires or PCB traces, special care is required to
achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse
effect on the operation of the regulator. The parasitic inductance, in combination with the low-ESR, ceramic
input capacitors, can form an under damped resonant circuit, resulting in overvoltage transients at the input to
the regulator. The parasitic resistance can cause the voltage at the VIN pin to dip whenever a load transient
is applied to the output. If the application is operating close to the minimum input voltage, this dip can cause
the regulator to momentarily shutdown and reset. The best way to solve these kind of issues is to reduce the
distance from the input supply to the regulator and use an aluminum or tantalum input capacitor in parallel with
the ceramics. The moderate ESR of these types of capacitors help damp the input resonant circuit and reduce
any overshoots. A value in the range of 20 µF to 100 µF is usually sufficient to provide input damping and help to
hold the input voltage steady during large load transients.
Sometimes, for other system considerations, an input filter is used in front of the regulator. This can lead
to instability, as well as some of the effects mentioned above, unless it is designed carefully. The AN-2162
Simple Success With Conducted EMI From DCDC Converters User's Guide provides helpful suggestions when
designing an input filter for any switching regulator.
In some cases, a transient voltage suppressor (TVS) is used on the input of regulators. One class of this
device has a snap-back characteristic (thyristor type). The use of a device with this type of characteristic is not
recommended. When the TVS fires, the clamping voltage falls to a very low value. If this voltage is less than
the output voltage of the regulator, the output capacitors discharge through the device back to the input. This
uncontrolled current flow can damage the device.
The input voltage must not be allowed to fall below the output voltage. In this scenario, such as a shorted input
test, the output capacitors discharges through the internal parasitic diode found between the VIN and SW pins of
the device. During this condition, the current can become uncontrolled, possibly causing damage to the device. If
this scenario is considered likely, then a Schottky diode between the input supply and the output must be used.

LMR33610
11 Layout
11.1 Layout Guidelines
The PCB layout of any DC/DC converter is critical to the optimal performance of the design. Bad PCB layout can
disrupt the operation of an otherwise good schematic design. Even if the converter regulates correctly, bad PCB
layout can mean the difference between a robust design and one that cannot be mass produced. Furthermore,
the EMI performance of the regulator is dependent on the PCB layout to a great extent. In a buck converter, the
most critical PCB feature is the loop formed by the input capacitor or capacitors and power ground, as shown in
Figure 11-1. This loop carries large transient currents that can cause large transient voltages when reacting with
the trace inductance. These unwanted transient voltages disrupt the proper operation of the converter. Because
of this, the traces in this loop must be wide and short, and the loop area as small as possible to reduce the
parasitic inductance. Figure 11-2 and Figure 11-1 show recommended layouts for the critical components of the
LMR33610.
• Place the input capacitor or capacitors as close as possible to the VIN and GND pins. VIN and GND pins
are adjacent, simplifying the input capacitor placement. A wide VIN plane must be used on a lower layer to
connect both of the VIN pairs together to the input supply.
• Place bypass capacitor for VCC close to the VCC pin. This capacitor must be placed close to the device and
routed with short, wide traces to the VCC and GND pins.
• Use wide traces for the CBOOT capacitor. Place CBOOT close to the device with short, wide traces to the
BOOT and SW pins.
• Place the feedback divider as close as possible to the FB pin of the device. Place RFBB, RFBT, and CFF, if
used, physically close to the device. The connections to FB and GND must be short and close to those pins
on the device. The connection to VOUT can be somewhat longer. However, this latter trace must not be routed
near any noise source (such as the SW node) that can capacitively couple into the feedback path of the
regulator.
• Use at least one ground plane in one of the middle layers. This plane acts as a noise shield and a heat
dissipation path.
• Connect the thermal pad to the ground plane. The SOIC package has a thermal pad (PAD) connection that
must be soldered down to the PCB ground plane. This pad acts as a heat-sink connection and an electrical
ground connection for the regulator. The integrity of this solder connection has a direct bearing on the total
effective RθJA of the application.
• Provide wide paths for VIN, VOUT, and GND. Making these paths as wide and direct as possible reduces any
voltage drops on the input or output paths of the converter and maximizes efficiency.
• Provide enough PCB area for proper heat sinking. As stated in Maximum Ambient Temperature, enough
copper area must be used to ensure a low RθJA, commensurate with the maximum load current and ambient
temperature. Make the top and bottom PCB layers with two-ounce copper; and no less than one ounce. With
the SOIC package, use an array of heat-sinking vias to connect the thermal pad (PAD) to the ground plane
on the bottom PCB layer. If the PCB design uses multiple copper layers (recommended), thermal vias can
also be connected to the inner layer heat-spreading ground planes.
• Keep switch area small. Keep the copper area connecting the SW pin to the inductor as short and wide as
possible. At the same time, the total area of this node must be minimized to help reduce radiated EMI.
See the following PCB layout resources for additional important guidelines:
• Layout Guidelines for Switching Power Supplies Application Report
• Simple Switcher PCB Layout Guidelines Application Report
• Construction Your Power Supply- Layout Considerations Seminar
• Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report

LMR33610
VIN
KEEP
CIN CURRENT SW
LOOP
SMALL
GND
Figure 11-1. Current Loops with Fast Edges
11.1.1 Ground and Thermal Considerations

As mentioned above, TI recommends using one of the middle layers as a solid ground plane. A ground plane
provides shielding for sensitive circuits and traces. It also provides a quiet reference potential for the control
circuitry. The AGND and PGND pins must be connected to the ground planes using vias next to the bypass
capacitors. PGND pins are connected directly to the source of the low-side MOSFET switch, and also connected
directly to the grounds of the input and output capacitors. The PGND net contains noise at the switching
frequency and can bounce due to load variations. The PGND trace, as well as the VIN and SW traces, must be
constrained to one side of the ground planes. The other side of the ground plane contains much less noise and
must be used for sensitive routes.
TI recommends providing adequate device heat sinking by using the thermal pad (PAD) of the device as the
primary thermal path. Use a minimum 4 × 3 array of 10 mil thermal vias to connect the PAD to the system
ground plane heat sink. The vias must be evenly distributed under the PAD. Use as much copper as possible.
For system ground plane, on the top and bottom layers for the best heat dissipation. Use a four-layer board with
the copper thickness for the four layers, starting from the top as: 2 oz / 1 oz / 1 oz / 2 oz. A four-layer board with
enough copper thickness and proper layout, provides low current conduction impedance, proper shielding, and
lower thermal resistance.

LMR33610
11.2 Layout Example
GND
HEATSINK INDUCTOR
VOUT
COUT COUT COUT
CBOOT
GND CHF
CIN
EN CVCC
VIN PGOOD
RFBB RFBT
GND
GND
HEATSINK
VIA VIA
Top Trace Bottom Trace
Ground Plane Bottom
Figure 11-2. Example Layout for HSOIC (DDA) Package

LMR33610
12 Device and Documentation Support

12.1 Device Support
12.1.1 Development Support
12.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LM33610 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
• Texas Instruments, Thermal Design by Insight not Hindsight Application Report
• Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Application Report
• Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
• Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
• Texas Instruments, PowerPAD™Thermally Enhanced Package Application Report
• Texas Instruments, PowerPAD™ Made Easy Application Report
• Texas Instruments, Using New Thermal Metrics Application Report
• Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
• Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
• Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar
• Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.

LMR33610
12.5 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
WEBENCH®SIMPLE SWITCHER® are registered trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 12-Jul-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LMR33610ADDAR ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 33610A Samples
LMR33610BDDAR ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 33610B Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMR33610ADDAR SO DDA 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
Power
PAD
LMR33610BDDAR SO DDA 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
Power
PAD
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMR33610ADDAR SO PowerPAD DDA 8 2500 366.0 364.0 50.0
LMR33610BDDAR SO PowerPAD DDA 8 2500 366.0 364.0 50.0
Pack Materials-Page 2
PACKAGE OUTLINE
DDA0008J SCALE 2.400
PowerPAD TM SOIC - 1.7 mm max height
PLASTIC SMALL OUTLINE
C
6.2
TYP SEATING PLANE
5.8
A PIN 1 ID
AREA 0.1 C
6X 1.27
8
1
5.0 2X
4.8 3.81
NOTE 3
4
5
0.51
8X
4.0 0.31
B 1.7 MAX
3.8 0.1 C A B
NOTE 4
0.25
TYP
0.10
SEE DETAIL A
4 5
EXPOSED
THERMAL PAD
3.1 0.25
2.5 GAGE PLANE
0.15
0 -8 1.27 0.00
1 8
0.40
DETAIL A
2.6 TYPICAL
2.0
4221637/B 03/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MS-012, variation BA.
www.ti.com
EXAMPLE BOARD LAYOUT
DDA0008J PowerPAD TM SOIC - 1.7 mm max height
(2.95)
NOTE 9
SOLDER MASK
(2.6) DEFINED PAD
SOLDER MASK
OPENING
8X (1.55) SEE DETAILS
1
8
8X (0.6)
(3.1)
SYMM SOLDER MASK
(1.3) OPENING
TYP (4.9)
NOTE 9
6X (1.27)
5
4
( 0.2) TYP
VIA SYMM METAL COVERED
BY SOLDER MASK
(1.3) TYP
(5.4)
LAND PATTERN EXAMPLE

SCALE:10X
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
SOLDER MASK METAL SOLDER MASK METAL UNDER

OPENING OPENING SOLDER MASK
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4221637/B 03/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
DDA0008J PowerPAD TM SOIC - 1.7 mm max height
(2.6)
BASED ON
0.125 THICK
STENCIL
8X (1.55)
1
8
8X (0.6)
(3.1)
SYMM
BASED ON
0.127 THICK
STENCIL
6X (1.27)
5
4
METAL COVERED SEE TABLE FOR

SYMM DIFFERENT OPENINGS
BY SOLDER MASK
FOR OTHER STENCIL
THICKNESSES
(5.4)
SOLDER PASTE EXAMPLE

EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
STENCIL SOLDER STENCIL

THICKNESS OPENING
0.1 2.91 X 3.47
0.125 2.6 X 3.1 (SHOWN)
0.150 2.37 X 2.83
0.175 2.20 X 2.62
4221637/B 03/2016
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DDA0008B SCALE 2.400
PowerPAD TM SOIC - 1.7 mm max height
C
6.2
TYP SEATING PLANE
5.8
A
PIN 1 ID
AREA 0.1 C
6X 1.27
8
1
5.0 2X
4.8 3.81
NOTE 3
4
5
0.51
8X
4.0 0.31
B 1.7 MAX
3.8 0.25 C A B
NOTE 4
0.25
TYP
0.10
SEE DETAIL A
4 5
EXPOSED
THERMAL PAD
3.4 0.25
9 GAGE PLANE
2.8
0.15
0 -8 1.27 0.00
1 8
0.40
DETAIL A
2.71 TYPICAL
2.11
4214849/A 08/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MS-012.
www.ti.com
EXAMPLE BOARD LAYOUT
DDA0008B PowerPAD TM SOIC - 1.7 mm max height
(2.95)
NOTE 9
(2.71) SOLDER MASK
DEFINED PAD
SOLDER MASK
OPENING
8X (1.55) SEE DETAILS
1
8
8X (0.6)
(3.4)
SYMM 9 SOLDER MASK
(1.3)
TYP OPENING
(4.9)
NOTE 9
6X (1.27)
4 5
(R0.05) TYP
SYMM METAL COVERED
( 0.2) TYP BY SOLDER MASK
VIA
(1.3) TYP
(5.4)
LAND PATTERN EXAMPLE

SCALE:10X
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
SOLDER MASK METAL SOLDER MASK METAL UNDER

OPENING OPENING SOLDER MASK
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS

PADS 1-8
4214849/A 08/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DDA0008B PowerPAD TM SOIC - 1.7 mm max height
(2.71)
BASED ON
0.125 THICK
STENCIL
8X (1.55) (R0.05) TYP
1
8
8X (0.6)
(3.4)
SYMM 9 BASED ON
0.125 THICK
STENCIL
6X (1.27)
5
4
METAL COVERED
SYMM SEE TABLE FOR
BY SOLDER MASK
DIFFERENT OPENINGS
FOR OTHER STENCIL
(5.4)
THICKNESSES
SOLDER PASTE EXAMPLE

EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
STENCIL SOLDER STENCIL

THICKNESS OPENING
0.1 3.03 X 3.80
0.125 2.71 X 3.40 (SHOWN)
0.150 2.47 X 3.10
0.175 2.29 X 2.87
4214849/A 08/2016
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated

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LMR33610

SNVSBI9A – OCTOBER 2019 – REVISED JUNE 2022

LMR33610 SIMPLE SWITCHER 3.8-V to 36-V, 1-A

Simplified Schematic Efficiency vs Output Current VOUT = 5 V, 400 kHz

2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

6 Pin Configuration and Functions

Table 6-1. Pin Functions

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

7.2 ESD Ratings

7.3 Recommended Operating Conditions

4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

7.4 Thermal Information

7.5 Electrical Characteristics

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5

(1) See Section 8.3.1 for details.

7.6 Timing Characteristics

6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

7.7 System Characteristics

(1) Deviation is with respect to VIN =12 V, IOUT = 1 A.

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7

7.8 Typical Characteristics

Shutdown Current (µA)

Peak Inductor Current (mA)

IOUT = 1 mA See Figure 9-20 IOUT = 0 A VOUT = 5 V See Figure 9-20

8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9

8.3 Feature Description

High = Power Good

Figure 8-1. Static Power-Good Operation

10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

Glitches do not cause false operation nor reset timer

tPG tPG tPG

Figure 8-2. Power-Good Timing Behavior

8.3.2 Enable and Start-up

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11

Figure 8-3. Precision Enable Behavior

VIN = EN, 10V/Div

Figure 8-4. Typical Start-Up Behavior VIN = 12 V, VOUT = 5 V, IOUT = 1 A

8.3.3 Current Limit and Short Circuit

12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

Short Applied Short Removed

Inductor Current, 1A/Div

8.3.4 Undervoltage Lockout and Thermal Shutdown

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 13

VOUT, 10mV/Div VOUT, 10mV/Div

14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: LMR33610

Drop-out Voltage (V)

8.4.3 Minimum Switch On Time

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 15

9 Application and Implementation

9.1 Application Information

9.2 Typical Application

Figure 9-1. Example Application Circuit (400 kHz)