BASKENT UNIVERSITY

DEPARTMENT OF MECHANICAL ENGINEERING

STUDENT:

MERT KAHYA
21794962

21.11.2023
CONTENTS
INTORDUCTION.....................................................................................................................1
OBJECTIVE OF THE EXPERIMENT..................................................................................2
EXPERIMENTAL SETUP......................................................................................................2
EXPERIMENT DATA..............................................................................................................2
CALCULATION.......................................................................................................................3
RESULT AND COMMENTS...................................................................................................9
INTORDUCTION
Conduction is defined as heat transfer incident in a –whether solid or fluid- static
environment by temperature difference. Conduction is expressed by Fourier Law as shown
below. Conduction heat transfer can be described with the Fourier law which is the relation
between temperature and heat transfer, the formula is explained as following.

ⅆT
q=−kA
ⅆx

Q: conduction heat transfer(W)

k: thermal conductivity(W/mK)

A: area (m2)

dT/dx: temperature gradient (K/m)

Conductional heat transfer is related with atomic and molecular motion. It can be
considered as energy transfer from the high energetic particles to the lower energetic particles
inside a material. When two surfaces are in contact, conductional heat transfer occurs on the
regions where two surfaces contacted each other physically. Size of contact region depends on
surface flatness of materials. Air gaps which are located on the surfaces do not contact make
an isolation effect against heat transfer and they cause a dramatic temperature decrease. On
the other hand, air gaps between the contacted surfaces could be filled up a material with high
conductivity to reduce the temperature decrease.

1
OBJECTIVE OF THE EXPERIMENT
To find heat conductivity of a given material and to examine the effect of thermal
contact resistance on heat transfer.

EXPERIMENTAL SETUP
The cylindrical heat transfer module is placed perpendicularly to the plate which
located on base. The heating part of the system comprises of a copper cylinder with a
diameter of 25 mm.Temperatures are measured by three thermocouples which are intervally
located with a distance 15 mm on the heating part. The cooling part of the system comprises
of a copper cylinder with a diameter of 25 mm and the cooling process is done by the water
flow from the reservoir under the cooling part. Temperatures are measured by three
thermocouples which are intervally located with a distance of 15 mm on the cooling part. The
temperature measurements on the region between the heating and cooling parts are done by
two thermocouples which are intervally located in the copper cylinder with a distance of 15
mm. The cylinder has a diameter of 25 mm and length of 30 mm. Overall 8 thermocouples are
intervally located with a distance of 15 mm.

EXPERIMENT DATA

VOLTAGE(V)
TEMPRATURE(°C)
V69 V79 V89
T1 43,2 48,9 55,5
T2 42,8 47,6 53,9
T3 42 47,1 50,8
T4 31,3 34,7 37,9
T5 29,2 31,2 33,4
T6 24,6 27 28,3
T7 24,4 25 26
T8 23 23,3 23,6

2
CALCULATION

1-)
Energy input
2
V
q=
R
q: Energy input (W)
V: Applied voltage (V)
R: Resistance (975 Ω)
For 69V:
2
69
q 80= =6 , 56 W
975

For 79 V:
2
79
q 97= =9 , 65 W
975
For 89 V:
2
89
q 112= =12 , 87 W
975

2-)

dT
q=−KA
dx
∆ L=15 mm, R=25mm

2 −3
πD πx (25 x 10 ) −4
A= = =4 , 9 x 10
4 4
qxL
K=
∆TxA

3
For 69 V:
qxL
K 12=
∆ T 12 A

−3
6 ,56 x (15 x 10 )
K 12= =373.705W /mK
( 43 , 2−4 2 , 8 ) x (4 , 9 x 10−4 )

6 , 56 x ( 15 x 10−3 )
K 23= =186.852W /m. K
( 4 2, 8−42 , 0 ) x(4 ,9 x 10−4 )

6 ,56 x ( 15 x 10−3 )
K 45= =71.182W /m. K
( 31 , 3−29 , 2 ) x (4 , 9 x 10−4 )

−3
6 , 56 x (15 x 10 )
K 67= =143 .410 W /m . K
( 24 , 6−2 4 , 4 ) x (4 ,9 x 10−4 )

6 ,56 x ( 15 x 10 )
−3
K 78= =106.773 W /m. K
( 2 4 , 4−2 3 , 0 ) x ( 4 , 9 x 10−4 )

FOR 79 V:
−3
9.65 x (15 x 10 )
K 12= =150.731 W /m . K
( 48 , 9−4 7 , 6 ) x (4 , 9 x 10−4 )

−3
9 , 65 x(15 x 10 )
K 23= =391.900 W /m. K
( 4 7 ,6−4 7 , 1 ) x (4 , 9 x 10−4 )

−3
9 ,65 x (15 x 10 )
K 45= =55.986 W /m. K
( 3 4 ,7−31 , 2 ) x (4 , 9 x 10−4 )

4
 9 , 65 x ( 15 x 10−3 )
K 67= =97.975 W /m . K
( 27−25 , 0 ) x (4 , 9 x 10−4 )

−3
9 , 65 x (15 x 10 )
K 78= =115.265W /m. K
( 25 , 0−23 , 3 ) x (4 , 9 x 10−4 )

FOR 89 V;
−3
12 , 87 x(15 x 10 )
K 12= =155.436 W /m . K
( 55 ,−5 3 , 9 ) x(4 , 9 x 4)

−3
12 , 87 x(15 x 10 )
K 23= =80.225 W /m . K
( 5 3 , 9−5 0 , 8 ) x (4 ,9 x 10−4 )

−3
12 ,87 x (15 x 10 )
K 45= =55.266 W /m. K
( 37 , 9−33 , 4 ) x (4 , 9 x 10−4)

−3
12 , 87 x (15 x 10 )
K 67= =108.129W /m. K
( 28 , 3−26 ) x (4 , 9 x 10−4 )
−3
12 , 87 x (15 x 10 )
K 78= =103.624 W /m . K
( 26−23 ,6 ) x (4 , 9 x 10−4 )

5
3-) and 4-)

GRAPH OF K-T
800

700

600

500
K(W/mK)

400

300

200
f(x) = 0.130456408288689 x² − 9.96722130686185 x + 361.065630671163
100 R² = 0.00346597956057826

0
23 28 33 38 43 48 53

T(°C)

y = 0,1305x2 - 9,9672x + 361,07  curve equation

FOR 69 V;

[ ] [ ]
2
42+31 , 3
K 34 = 0,1305 42+ 31 , 3 −9,9672 + 361,07
2 2

K 34=171.063 W /m. K

[ ] [ ]
2
31 ,3+29 ,2
K 56 = 0,1305 29 , 2+2 4 ,6 −9,9672 + 361,07
2 2

K 45=187.383 W /m. K

FOR 79 V;

[ ] [ ]
2
K 34 = 0,1305 47 , 1+ 3 4 , 7 −9,9672 47 ,1+34 ,7 + 361,07
2 2

6
 K 34=171.713 W /m. K

[ ] [ ]
2
31 ,2+27
K 56 = 0,1305 31 , 2+27 −9,9672 + 361,07
2 2

K 56=181.533 W /m. K

FOR 89

[ ] [ ]
2
K 34 = 0,1305 50 , 8+3 7 , 9 −9,9672 50 , 8+37 , 9 + 361,07
2 2
K 34=175.708 W /m. K

[ ] [ ]
2
33 , 4+ 28 ,3
K 56 = 0,1305 3 3 , 4 +2 8 ,3 −9,9672 + 361,07
2 2

K 56=177.782 W /m . K

5-)
∆T V
2
(T 3−T 4 )
q= → =
Rcontact + Rconduction R L
Rcontact +
k.A

FOR 69 V;

2
69 42 ,0−3 1 ,3
=
975 0.015
R contact ,34 + −4
171.063 ×4.9 × 10
Rcontact , 34=¿ 7.505 K/W

7
 2
69 29 , 2−24 ,6
=
975 0.015
R contact ,56 + −4
187.383× 4.9 ×10
Rcontact , 56=5.509 K /W

FOR 79 V;

2
79 4 7 , 1−3 4 , 7
=
975 0.015
R contact ,34 + −4
171.713 ×4.9 × 10
Rcontact , 34=¿ 6.390K/W

2
79 31 , 2−27
=
975 0.015
R contact ,56 + −4
181.533× 4.9 ×10
Rcontact , 56=4.546 K /W

FOR 89 V;

2
89 50 , 8−37 ,9
=
975 0.015
R contact ,34 + −4
175.708 ×4.9 × 10
Rcontact , 34=¿ 5.459K/W

2
89 33 , 4−28 ,3
=
975 0.015
R contact ,56 + −4
177.782× 4.9 ×10
Rcontact , 56=3.797 K /W

8
6-)
As this heat is transferred through the system, it encounters thermal resistance - which
is a measure of how much the system resists the flow of heat. In a perfect conductor, heat
flows freely without resistance, but in real-world materials, some degree of resistance is
always present. This resistance is influenced by factors such as the nature of the materials in
contact, their surface roughness, and the pressure with which they're pressed together.

The increased heat generated by a higher voltage may change the temperature of the
materials involved, which can alter their thermal properties and thus change the thermal
contact resistance. For example, many materials have thermal conductivity that varies with
temperature.

7-)

GRAPH OF TEMPRATURE CHANGE

50

40
V69
V79
T(°C)

30 V89

20

10

0
0 0.015 0.03 0.045 0.06 0.075 0.09 0.105

POSİTİON

The sharp decrease in temperature between points T3 and T4 on the graph may be due to the
application of thermal paste improving thermal conduction, a change in material properties
that enhances thermal conductivity, the engagement of a cooling mechanism, or improved
contact quality between heat transfer surfaces. Additional context on the experimental setup is
essential to identify the exact cause of this observed phenomenon.

9
RESULT AND COMMENTS
The experiment is understood as a connection with heat conduction and heat transfer
and the effect of air spaces on heat transfer is observed. After studying the data, there is a
small error that can be caused by unstable voltage and not fully isolated device, in addition
reading errors, thermocouple sensitivity, miscalculation and accuracy of the meter and non-
steady state device. However, to avoid error, the time required should be waited until steady
state. The data can be taken more carefully. Also the device can be more perfectly adiabatic

10