GS8662QT07/10/19/37BD-300M

165-Bump BGA 72Mb SigmaQuad-II+TM 300 MHz

1.8 V VDD
Military Temp
Burst of 2 SRAM 1.8 V and 1.5 V I/O

Features SRAMs. The GS8662QT07/10/19/37BD SigmaQuad SRAMs

are just one element in a family of low power, low voltage
• Military Temperature Range
HSTL I/O SRAMs designed to operate at the speeds needed to
• 2.0 Clock Latency
implement economical high performance networking systems.
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time Clocking and Addressing Schemes
• Dual-Range On-Die Termination (ODT) on Data (D), Byte The GS8662QT07/10/19/37BD SigmaQuad-II+ SRAMs are
Write (BW), and Clock (K, K) inputs synchronous devices. They employ two input register clock
• Burst of 2 Read and Write inputs, K and K. K and K are independent single-ended clock
• 1.8 V +100/–100 mV core power supply inputs, not differential inputs to a single differential clock input
• 1.5 V or 1.8 V HSTL Interface buffer.
• Pipelined read operation
• Fully coherent read and write pipelines Each internal read and write operation in a SigmaQuad-II+ B2
• ZQ pin for programmable output drive strength RAM is two times wider than the device I/O bus. An input data
• Data Valid Pin (QVLD) Support bus de-multiplexer is used to accumulate incoming data before
• IEEE 1149.1 JTAG-compliant Boundary Scan it is simultaneously written to the memory array. An output
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package data multiplexer is used to capture the data produced from a
• RoHS-compliant 165-bump BGA package available single memory array read and then route it to the appropriate
output drivers as needed. Therefore the address field of a
SigmaQuad™ Family Overview SigmaQuad-II+ B2 RAM is always one address pin less than
The GS8662QT07/10/19/37BD are built in compliance with the advertised index depth (e.g., the 8M x 8 has an 4M
the SigmaQuad-II+ SRAM pinout standard for Separate I/O addressable index).
synchronous SRAMs. They are 75,497,472-bit (72Mb)

Parameter Synopsis
-300M

tKHKH 3.3 ns

tKHQV 0.45 ns

Rev: 1.00 10/2012 1/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

8M x 8 SigmaQuad-II SRAM—Top View

1 2 3 4 5 6 7 8 9 10 11
NC/SA
A CQ SA SA W NW1 K R SA SA CQ
(144Mb)
NC/SA
B NC NC NC SA K NW0 SA NC NC Q3
(288Mb)

C NC NC NC VSS SA SA SA VSS NC NC D3

D NC D4 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q4 VDDQ VSS VSS VSS VDDQ NC D2 Q2

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D5 Q5 VDDQ VDD VSS VDD VDDQ NC NC NC

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q1 D1

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q6 D6 VDDQ VSS VSS VSS VDDQ NC NC Q0

M NC NC NC VSS VSS VSS VSS VSS NC NC D0

N NC D7 NC VSS SA SA SA VSS NC NC NC

P NC NC Q7 SA SA QVLD SA SA NC NC NC

R TDO TCK SA SA SA ODT SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:
1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
2. Pins A7 and B5 are the expansion addresses.

Rev: 1.00 10/2012 2/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

8M x 9 SigmaQuad-II SRAM—Top View

1 2 3 4 5 6 7 8 9 10 11
NC/SA
A CQ SA SA W NC K R SA SA CQ
(144Mb)
NC/SA
B NC NC NC SA K BW0 SA NC NC Q4
(288Mb)

C NC NC NC VSS SA SA SA VSS NC NC D4

D NC D5 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q5 VDDQ VSS VSS VSS VDDQ NC D3 Q3

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D6 Q6 VDDQ VDD VSS VDD VDDQ NC NC NC

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q2 D2

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q7 D7 VDDQ VSS VSS VSS VDDQ NC NC Q1

M NC NC NC VSS VSS VSS VSS VSS NC NC D1

N NC D8 NC VSS SA SA SA VSS NC NC NC

P NC NC Q8 SA SA QVLD SA SA NC D0 Q0

R TDO TCK SA SA SA ODT SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:
1. BW0 controls writes to D0:D8.
2. Pins A7 and B5 are the expansion addresses.

Rev: 1.00 10/2012 3/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

4M x 18 SigmaQuad-II+ SRAM—Top View

1 2 3 4 5 6 7 8 9 10 11
NC/SA NC/SA
A CQ SA W BW1 K R SA SA CQ
(144Mb) (288Mb )

B NC Q9 D9 SA NC K BW0 SA NC NC Q8

C NC NC D10 VSS SA SA SA VSS NC Q7 D8

D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7

E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6

F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5

G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4

K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3

L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2

M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2

N NC D17 Q16 VSS SA SA SA VSS NC NC D1

P NC NC Q17 SA SA QVLD SA SA NC D0 Q0

R TDO TCK SA SA SA ODT SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:
1. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
2. Pins A2 and A7 are the expansion addresses.

Rev: 1.00 10/2012 4/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

2M x 36 SigmaQuad-II+ SRAM—Top View

1 2 3 4 5 6 7 8 9 10 11
NC/SA NC/SA
A CQ SA W BW2 K BW1 R SA CQ
(288Mb ) (144Mb)

B Q27 Q18 D18 SA BW3 K BW0 SA D17 Q17 Q8

C D27 Q28 D19 VSS SA SA SA VSS D16 Q7 D8

D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15 D7

E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6

F Q30 Q21 D21 VDDQ VDD VSS VDD VDDQ D14 Q14 Q5

G D30 D22 Q22 VDDQ VDD VSS VDD VDDQ Q13 D13 D5

H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ

J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4

K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3

L Q33 Q24 D24 VDDQ VSS VSS VSS VDDQ D11 Q11 Q2

M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2

N D34 D26 Q25 VSS SA SA SA VSS Q10 D9 D1

P Q35 D35 Q26 SA SA QVLD SA SA Q9 D0 Q0

R TDO TCK SA SA SA ODT SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:
3. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35
4. Pins A2 and A10 are the expansion addresses.

Rev: 1.00 10/2012 5/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Pin Description Table

Symbol Description Type Comments
SA Synchronous Address Inputs Input —
R Synchronous Read Input Active Low
W Synchronous Write Input Active Low
BW0–BW3 Synchronous Byte Writes Input Active Low
Active Low
NW0–NW1 Synchronous Nybble Writes Input
(x8 only)
K Input Clock Input Active High
K Input Clock Input Active Low
TMS Test Mode Select Input —
TDI Test Data Input Input —
TCK Test Clock Input Input —
TDO Test Data Output Output —
VREF HSTL Input Reference Voltage Input —
ZQ Output Impedance Matching Input Input —
Qn Synchronous Data Outputs Output —
Dn Synchronous Data Inputs Input —
Doff Disable DLL when low Input Active Low
CQ Output Echo Clock Output —
CQ Output Echo Clock Output —
VDD Power Supply Supply 1.8 V Nominal
VDDQ Isolated Output Buffer Supply Supply 1.8 V or 1.5 V Nominal
VSS Power Supply: Ground Supply —
QVLD Q Valid Output Output —
Low = Low Impedance Range
ODT On-Die Termination Input
High/Float = High Impedance Range
NC No Connect — —
Notes:
1. NC = Not Connected to die or any other pin
2. When ZQ pin is directly connected to VDDQ, output impedance is set to minimum value and it cannot be connected to ground or left
unconnected.
3. K and K cannot be set to VREF voltage.

Rev: 1.00 10/2012 6/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Background
Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are
needed. Therefore, the SigmaQuad-II+ SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O
SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from
Separate I/O SRAMs can cut the RAM’s bandwidth in half.
SigmaQuad-II B2 SRAM DDR Read
The read port samples the status of the Address Input and R pins at each rising edge of K. A low on the Read Enable-bar pin, R,
begins a read cycle. Clocking in a high on the Read Enable-bar pin, R, begins a read port deselect cycle.

SigmaQuad-II B2 SRAM DDR Write

The write port samples the status of the W pin at each rising edge of K and the Address Input pins on the following rising edge of
K. A low on the Write Enable-bar pin, W, begins a write cycle. The first of the data-in pairs associated with the write command is
clocked in with the same rising edge of K used to capture the write command. The second of the two data in transfers is captured on
the rising edge of K along with the write address. Clocking in a high on W causes a write port deselect cycle.

Special Functions
Byte Write and Nybble Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A High on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven High or Low
during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 2beat data transfer. The x18
version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.

Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble
Write Enable” and “NWx” may be substituted in all the discussion above.

Example x18 RAM Write Sequence using Byte Write Enables

Data In Sample Time BW0 BW1 D0–D8 D9–D17
Beat 1 0 1 Data In Don’t Care
Beat 2 1 0 Don’t Care Data In

Resulting Write Operation

Byte 1 Byte 2 Byte 3 Byte 4
D0–D8 D9–D17 D0–D8 D9–D17
Written Unchanged Unchanged Written
Beat 1 Beat 2

Rev: 1.00 10/2012 7/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

FLXDrive-II Output Driver Impedance Control

HSTL I/O SigmaQuad-II+ SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to
VSS via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be
5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is
between 175Ω and 350Ω. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts
in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and
temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance
evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is
implemented with discrete binary weighted impedance steps.

Input Termination Impedance Control

These SigmaQuad-II+ SRAMs are supplied with programmable input termination on Data (D), Byte Write (BW), and Clock (K,K)
input receivers. The input termination is always enabled, and the impedance is programmed via the same RQ resistor (connected
between the ZQ pin and VSS) used to program output driver impedance, in conjuction with the ODT pin (6R). When the ODT pin
is tied Low, input termination is "strong" (i.e., low impedance), and is nominally equal to RQ*0.3 Thevenin-equivalent when RQ is
between 175Ω and 350Ω. When the ODT pin is tied High (or left floating—the pin has a small pull-up resistor), input termination
is "weak" (i.e., high impedance), and is nominally equal to RQ*0.6 Thevenin-equivalent when RQ is between 175Ω and 250Ω.
Periodic readjustment of the termination impedance occurs to compensate for drifts in supply voltage and temperature, in the same
manner as for driver impedance (see above).

Note:
D, BW, K, K inputs should always be driven High or Low; they should never be tri-stated (i.e., in a High-Z state). If the inputs are
tri-stated, the input termination will pull the signal to VDDQ/2 (i.e., to the switch point of the diff-amp receiver), which could cause
the receiver to enter a meta-stable state, resulting in the receiver consuming more power than it normally would. This could result
in the device’s operating currents being higher.

Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Read Truth Table

A R Output Next State Q Q

K↑ K↑ K↑ K↑ K↑
(tn) (tn) (tn) (tn+2) (tn+2½)

X 1 Deselect Hi-Z Hi-Z

V 0 Read Q0 Q1

Notes:
1. X = Don’t Care, 1 = High, 0 = Low, V = Valid.
2. R is evaluated on the rising edge of K.
3. Q0 and Q1 are the first and second data output transfers in a read.

Rev: 1.00 10/2012 8/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Write Truth Table

A W BWn/NWn BWn/NWn Input Next State D D

K↑ K↑ K↑ K↑ K ↑, K ↑ K↑ K↑
(tn + ½) (tn) (tn) (tn + ½) (tn), (tn + ½) (tn) (tn + ½)

V 0 0 0 Write Byte Dx0, Write Byte Dx1 D0 D1

V 0 0 1 Write Byte Dx0, Write Abort Byte Dx1 D0 X

V 0 1 0 Write Abort Byte Dx0, Write Byte Dx1 X D1

X 0 1 1 Write Abort Byte Dx0, Write Abort Byte Dx1 X X

X 1 X X Deselect X X
Notes:
1. X = Don’t Care, H = High, L = Low, V = Valid.
2. W is evaluated on the rising edge of K.
3. D0 and D1 are the first and second data input transfers in a write.
4. BWn represents any of the Byte Write Enable inputs (BW0, BW1, etc.). NWn represents any of the Nybble Write Enable inputs (NW0,
NW1).

x36 Byte Write Enable (BWn) Truth Table

BW0 BW1 BW2 BW3 D0–D8 D9–D17 D18–D26 D27–D35
1 1 1 1 Don’t Care Don’t Care Don’t Care Don’t Care
0 1 1 1 Data In Don’t Care Don’t Care Don’t Care
1 0 1 1 Don’t Care Data In Don’t Care Don’t Care
0 0 1 1 Data In Data In Don’t Care Don’t Care
1 1 0 1 Don’t Care Don’t Care Data In Don’t Care
0 1 0 1 Data In Don’t Care Data In Don’t Care
1 0 0 1 Don’t Care Data In Data In Don’t Care
0 0 0 1 Data In Data In Data In Don’t Care
1 1 1 0 Don’t Care Don’t Care Don’t Care Data In
0 1 1 0 Data In Don’t Care Don’t Care Data In
1 0 1 0 Don’t Care Data In Don’t Care Data In
0 0 1 0 Data In Data In Don’t Care Data In
1 1 0 0 Don’t Care Don’t Care Data In Data In
0 1 0 0 Data In Don’t Care Data In Data In
1 0 0 0 Don’t Care Data In Data In Data In
0 0 0 0 Data In Data In Data In Data In

Rev: 1.00 10/2012 9/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

x18 Byte Write Enable (BWn) Truth Table

BW0 BW1 D0–D8 D9–D17
1 1 Don’t Care Don’t Care
0 1 Data In Don’t Care
1 0 Don’t Care Data In
0 0 Data In Data In

x9 Byte Write Enable (BWn) Truth Table

BW0 D0–D8
1 Don’t Care
0 Data In
1 Don’t Care
0 Data In

x8 Nybble Write Enable (NWn) Truth Table

NW0 NW1 D0–D3 D4–D7
1 1 Don’t Care Don’t Care
0 1 Data In Don’t Care
1 0 Don’t Care Data In
0 0 Data In Data In

Rev: 1.00 10/2012 10/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Absolute Maximum Ratings

(All voltages reference to VSS)

Symbol Description Value Unit

VDD Voltage on VDD Pins –0.5 to 2.9 V
VDDQ Voltage in VDDQ Pins –0.5 to VDD V
VREF Voltage in VREF Pins –0.5 to VDDQ V
VI/O Voltage on I/O Pins –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V
VIN Input Voltage (Address, Control, Data, Clock) –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V
VTIN Input Voltage (TCK, TMS, TDI) –0.5 to VDDQ +0.5 (≤ 2.9 V max.) V
IIN Input Current on Any Pin +/–100 mA dc
IOUT Output Current on Any I/O Pin +/–100 mA dc
TJ Maximum Junction Temperature 125 oC

TSTG Storage Temperature –55 to 125 oC

Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.

Recommended Operating Conditions

Power Supplies
Parameter Symbol Min. Typ. Max. Unit
Supply Voltage VDD 1.7 1.8 1.9 V
I/O Supply Voltage VDDQ 1.4 — VDD V
Reference Voltage VREF VDDQ/2 – 0.05 — VDDQ/2 + 0.05 V
Note:
The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power
down sequence must be the reverse. VDDQ must not exceed VDD. For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.

Operating Temperature
Parameter Symbol Min. Typ. Max. Unit
Junction Temperature
TJ –55 25 125 °C
(Military Range Versions)
Note:
The part numbers of Military Temperature Range versions end with the character “M”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.

Rev: 1.00 10/2012 11/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Thermal Impedance
Test PCB θ JA (C°/W) θ JA (C°/W) θ JA (C°/W) θ JB (C°/W) θ JC (C°/W)
Package
Substrate Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s
165 BGA 4-layer 22.300 18.572 17.349 9.292 2.310
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.

HSTL I/O DC Input Characteristics

Parameter Symbol Min Max Units Notes
Input Reference Voltage VREF VDDQ /2 – 0.05 VDDQ /2 + 0.05 V —
Input High Voltage VIH1 VREF + 0.1 VDDQ + 0.3 V 1
Input Low Voltage VIL1 –0.3 VREF – 0.1 V 1
Input High Voltage VIH2 0.7 * VDDQ VDDQ + 0.3 V 2,3
Input Low Voltage VIL2 –0.3 0.3 * VDDQ V 2,3
Notes:
1. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.
2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
3. Parameters apply to ZQ during JTAG boundary scan testing only.

HSTL I/O AC Input Characteristics

Parameter Symbol Min Max Units Notes
Input Reference Voltage VREF VDDQ /2 – 0.08 VDDQ /2 + 0.08 V —
Input High Voltage VIH1 VREF + 0.2 VDDQ + 0.5 V 1,2,3
Input Low Voltage VIL1 –0.5 VREF – 0.2 V 1,2,3
Input High Voltage VIH2 VDDQ – 0.2 VDDQ + 0.5 V 4,5
Input Low Voltage VIL2 –0.5 0.2 V 4,5
Notes:
1. VIH(MAX) and VIL(MIN) apply for pulse widths less than one-quarter of the cycle time.
2. Input rise and fall times must be a minimum of 1 V/ns, and within 10% of each other.
3. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.
4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
5. Parameters apply to ZQ during JTAG boundary scan testing only.

Rev: 1.00 10/2012 12/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 1.8 V)

Parameter Symbol Test conditions Typ. Max. Unit

Input Capacitance CIN VIN = 0 V 4 5 pF
Output Capacitance COUT VOUT = 0 V 6 7 pF
Clock Capacitance CCLK VIN = 0 V 5 6 pF
Note:
This parameter is sample tested.

AC Test Conditions
Parameter Conditions
Input high level 1.25
Input low level 0.25 V
Max. input slew rate 2 V/ns
Input reference level 0.75
Output reference level VDDQ/2
Note:
Test conditions as specified with output loading as shown unless otherwise noted.

AC Test Load Diagram

DQ
RQ = 250 Ω (HSTL I/O)
VREF = 0.75 V
50Ω

VT == 0.75 V

Input and Output Leakage Characteristics

Parameter Symbol Test Conditions Min. Max
Input Leakage Current
IIL VIN = 0 to VDD –2 uA 2 uA
(except mode pins)
Doff IILDOFF VIN = 0 to VDD –20 uA 2 uA
ODT IIL ODT VIN = 0 to VDD –2 uA 20 uA
Output Disable,
Output Leakage Current IOL –2 uA 2 uA
VOUT = 0 to VDDQ

Rev: 1.00 10/2012 13/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Programmable Impedance HSTL Output Driver DC Electrical Characteristics

Parameter Symbol Min. Max. Units Notes

Output High Voltage VOH1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 1, 3

Output Low Voltage VOL1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 2, 3

Output High Voltage VOH2 VDDQ – 0.2 VDDQ V 4, 5

Output Low Voltage VOL2 Vss 0.2 V 4, 6

Notes:
1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175Ω ≤ RQ ≤ 350Ω).
2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175Ω ≤ RQ ≤350Ω).
3. Parameter tested with RQ = 250Ω and VDDQ = 1.5 V
4. 0Ω ≤ RQ ≤ ∞Ω
5. IOH = –1.0 mA
6. IOL = 1.0 mA

Operating Currents

-300M

Parameter Symbol Test Conditions –55

Notes
to
125°C

VDD = Max, IOUT = 0 mA

Operating Current (x36): DDR IDD 1225 mA 1, 2
Cycle Time ≥ tKHKH Min

VDD = Max, IOUT = 0 mA

Operating Current (x18): DDR IDD 980 mA 1, 2
Cycle Time ≥ tKHKH Min

VDD = Max, IOUT = 0 mA

Operating Current (x9): DDR IDD 980 mA 1, 2
Cycle Time ≥ tKHKH Min

VDD = Max, IOUT = 0 mA

Operating Current (x8): DDR IDD 980 mA 1, 2
Cycle Time ≥ tKHKH Min

Device deselected,
Standby Current (NOP): DDR ISB1 IOUT = 0 mA, f = Max, 255 mA 1, 3
All Inputs ≤ 0.2 V or ≥ VDD – 0.2 V

Notes:
1. Minimum cycle, IOUT = 0 mA
2. Operating current is calculated with 50% read cycles and 50% write cycles.
3. Standby Current is only after all pending read and write burst operations are completed.

Rev: 1.00 10/2012 14/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

AC Electrical Characteristics
-300M
Parameter Symbol Units Notes
Min Max
Clock
K, K Clock Cycle Time tKHKH 3.3 8.4 ns

tK Variable tKVar — 0.2 ns 4

K, K Clock High Pulse Width tKHKL 1.32 — ns

K, K Clock Low Pulse Width tKLKH 1.32 — ns

K to K High tKHKH 1.49 — ns

K to K High tKHKH 1.49 — ns

DLL Lock Time tKCLock 2048 — cycle 5

K Static to DLL reset tKCReset 30 — ns

Output Times
K, K Clock High to Data Output Valid tKHQV — 0.45 ns

K, K Clock High to Data Output Hold tKHQX –0.45 — ns

K, K Clock High to Echo Clock Valid tKHCQV — 0.45 ns

K, K Clock High to Echo Clock Hold tKHCQX –0.45 — ns

CQ, CQ High Output Valid tCQHQV — 0.27 ns

CQ, CQ High Output Hold tCQHQX –0.27 — ns

CQ, CQ High to QVLD tQVLD –0.27 0.27 ns

tCQHCQH
CQ Phase Distortion 1.24 — ns
tCQHCQH

K Clock High to Data Output High-Z tKHQZ — 0.45 ns

K Clock High to Data Output Low-Z tKHQX1 –0.45 — ns

Setup Times
Address Input Setup Time tAVKH 0.30 — ns 1

Control Input Setup Time (R, W) tIVKH 0.30 — ns 2

Control Input Setup Time (BWX) (BWX) tIVKH 0.30 — ns 3

Data Input Setup Time tDVKH 0.30 — ns

Hold Times
Address Input Hold Time tKHAX 0.30 — ns 1

Control Input Hold Time (R, W) tKHIX 0.30 — ns 2

Control Input Hold Time (BWX) (BWX) tKHIX 0.30 — ns 3

Data Input Hold Time tKHDX 0.30 — ns

Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control signals are R, W
3. Control signals are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).
4. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
5. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable.

Rev: 1.00 10/2012 15/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 Read NOP CQ-Based Timing Diagram
Read A0 / Write NOP Read A1 / Write NOP Read A2 / Write NOP Read A3 / Write NOP NOOP NOOP NOOP

Rev: 1.00 10/2012

K

tKHAX
tAVKH
Addr A0 A1 A2 A3

tKHIX
tIVKH
R

tKHIX
tIVKH
W

16/26
QVLD

Q Q0 Q0+1 Q1 Q1+1 Q2 Q2+1 Q3 Q3+1

tCQLQV
tCQHQV tCQLQX tCQHQX
CQ

tCQLQV tCQLQX
tQVLD tCQHQV tCQHQX tQVLD
CQ

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8662QT07/10/19/37BD-300M

© 2012, GSI Technology

 Read-Write CQ-Based Timing Diagram
Read A0/ Write A8 Read A1/ Write A7 Read A2/ Write A6 Read A3/ Write A5 NOOP NOOP NOOP

Rev: 1.00 10/2012

K

tAVKH tKHAX
tKHAX tAVKH
Addr A0 A8 A1 A7 A2 A6 A3 A5

tIVKH
tKHIX
R

tIVKH
tKHIX
W

tKHIX

17/26
tIVKH
tIVKH
tKHIX
BWx

tDVKH tDVKH
tKHDX tKHDX
D D8 D8+1 D7 D7+1 D6 D6+1 D5 D5+1

QVLD

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q Q0 Q0+1 Q1 Q1+1 Q2 Q2+1 Q3 Q3+1

tCQHQX
tCQHQV tCQLQV tCQLQX
CQ

tCQLQV tCQLQX
tQVLD tCQHQV tCQHQX tQVLD
CQ
GS8662QT07/10/19/37BD-300M

© 2012, GSI Technology

 Write NOP Timing Diagram
Read No-op / Write A0 Read No-op / Write A1 Read No-op / Write A2 Read No-op / Write A3 NO-OP NO-OP NO-OP

Rev: 1.00 10/2012

K

tKHAX
tAVKH
Addr A0 A1 A2 A3

tKHIX
tIVKH
R

tKHIX
tIVKH
W

18/26
tIVKH
tKHIX
tKHIX
tIVKH
BWx

tKHDX
tDVKH
tKHDX
tDVKH
D D0 D0+1 D1 D1+1 D2 D2+1 D3 D3+1

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8662QT07/10/19/37BD-300M

© 2012, GSI Technology

 GS8662QT07/10/19/37BD-300M

JTAG Port Operation

Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDD.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.

JTAG Pin Descriptions

Pin Pin Name I/O Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the
TCK Test Clock In
falling edge of TCK.
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state
TMS Test Mode Select In
machine. An undriven TMS input will produce the same result as a logic one input level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed
between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP
TDI Test Data In In Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to
the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input
level.
Output that is active depending on the state of the TAP state machine. Output changes in response to the
TDO Test Data Out Out
falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.

JTAG Port Registers

Overview
The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan

Rev: 1.00 10/2012 19/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.

JTAG TAP Block Diagram

· · · · · · · ·
Boundary Scan Register
· ·
·

1
0
108

Bypass Register

0
2 1 0
Instruction Register
TDI TDO
ID Code Register
31 30 29 · · ·· 2 1 0

Control Signals
TMS
Test Access Port (TAP) Controller
TCK

Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

ID Register Contents
Presence Register

GSI Technology
See BSDL Model JEDEC Vendor
ID Code

Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X X X X X X X X X X X X X X X X X X X X 0 0 0 1 1 0 1 1 0 0 1 1

Rev: 1.00 10/2012 20/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Tap Controller Instruction Set

Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.

JTAG Tap Controller State Diagram

Test Logic Reset
1 0

1 1 1
Run Test Idle Select DR Select IR
0 0 0

1 1
Capture DR Capture IR
0 0

Shift DR Shift IR
1 0 1 0

1 1
Exit1 DR Exit1 IR
0 0

Pause DR Pause IR
1 0 1 0

Exit2 DR 0 Exit2 IR 0
1 1

Update DR Update IR
1 0 1 0

Instruction Descriptions

BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.

SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is

Rev: 1.00 10/2012 21/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.

EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.

IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.

SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.

JTAG TAP Instruction Set Summary

Instruction Code Description Notes
EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1
IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
SAMPLE-Z 010 1
Forces all RAM output drivers to High-Z.
GSI 011 GSI private instruction. 1
SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1
GSI 101 GSI private instruction. 1
GSI 110 GSI private instruction. 1
BYPASS 111 Places Bypass Register between TDI and TDO. 1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.

Rev: 1.00 10/2012 22/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter Symbol Min. Max. Unit Notes
Test Port Input Low Voltage VILJ –0.3 0.3 * VDD V 1
Test Port Input High Voltage VIHJ 0.7 * VDD VDD +0.3 V 1
TMS, TCK and TDI Input Leakage Current IINHJ –300 1 uA 2
TMS, TCK and TDI Input Leakage Current IINLJ –1 100 uA 3
TDO Output Leakage Current IOLJ –1 1 uA 4
Test Port Output High Voltage VOHJ VDD – 0.2 — V 5, 6
Test Port Output Low Voltage VOLJ — 0.2 V 5, 7
Test Port Output CMOS High VOHJC VDD – 0.1 — V 5, 8
Test Port Output CMOS Low VOLJC — 0.1 V 5, 9
Notes:
1. Input Under/overshoot voltage must be –1 V < Vi < VDDn +1 V not to exceed V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ ≤ VIN ≤ VDDn
3. 0 V ≤ VIN ≤ VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDD supply.
6. IOHJ = –2 mA
7. IOLJ = + 2 mA
8. IOHJC = –100 uA
9. IOLJC = +100 uA

JTAG Port AC Test Conditions

Parameter Conditions JTAG Port AC Test Load
Input high level VDD – 0.2 V TDO
Input low level 0.2 V
Input slew rate 1 V/ns 50Ω 30pF*
Input reference level VDD/2
VDD/2
Output reference level VDD/2
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.

Rev: 1.00 10/2012 23/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

JTAG Port Timing Diagram

tTKC tTKH tTKL
TCK

tTH
tTS
TDI

tTH
tTS
TMS

tTKQ
TDO

tTH
tTS
Parallel SRAM input

JTAG Port AC Electrical Characteristics

Parameter Symbol Min Max Unit
TCK Cycle Time tTKC 50 — ns
TCK Low to TDO Valid tTKQ — 20 ns
TCK High Pulse Width tTKH 20 — ns
TCK Low Pulse Width tTKL 20 — ns
TDI & TMS Set Up Time tTS 10 — ns
TDI & TMS Hold Time tTH 10 — ns

Rev: 1.00 10/2012 24/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Package Dimensions—165-Bump FPBGA (Package D)

A1 CORNER TOP VIEW Ø0.10 M C BOTTOM VIEW A1 CORNER

Ø0.25 M C A B
Ø0.40~0.60 (165x)
1 2 3 4 5 6 7 8 9 10 11 11 10 9 8 7 6 5 4 3 2 1

A A
B B
C C
D D
E E

1.0
F F
G G
15±0.05

14.0
H H

1.0
J J
K K
L L
M M
N N
P P
R R

A
1.0 1.0

10.0

B 13±0.05
0.15 C

0.20(4x)

SEATING PLANE
1.40 MAX.
0.36~0.46

Rev: 1.00 10/2012 25/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
 GS8662QT07/10/19/37BD-300M

Ordering Information—GSI SigmaQuad-II+ SRAM

Speed
Org Part Number1 Type Package TJ2
(MHz)
8M x 8 GS8662QT07BD-300M SigmaQuad-II+ B2 SRAM 165-bump BGA 300 M
8M x 9 GS8662QT10BD-300M SigmaQuad-II+ B2 SRAM 165-bump BGA 300 M
4M x 18 GS8662QT19BD-300M SigmaQuad-II+ B2 SRAM 165-bump BGA 300 M
2M x 36 GS8662QT37BD-300M SigmaQuad-II+ B2 SRAM 165-bump BGA 300 M
Notes:
1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662QT38BD-300MT.
2. M = Military Temperature Range.

SigmaQuad-II+ SRAM Revision History

File Name Format/Content Description of changes
8662QT1937B-300M_r1 Creation of datasheet

Rev: 1.00 10/2012 26/26 © 2012, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Mouser Electronics

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