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TCA9545A
SCPS204D – JANUARY 2014 – REVISED NOVEMBER 2019

TCA9545A Low Voltage 4-channel I2C and SMbus Switch With Interrupt Logic and Reset
Functions
1 Features 2 Applications
•
1 1-of-4 Bidirectional translating switches • Servers
• I2C bus and SMBus compatible • Routers (telecom switching equipment)
• Four active-low interrupt inputs • Factory automation
• Active-low interrupt output • Products with I2C slave address conflicts (e.g.
• Active-low reset input multiple, identical temp sensors)
• Two address terminals, allowing up to four
devices on the I2C bus 3 Description
The TCA9545A is a quad bidirectional translating
• Channel selection via I2C bus, in any combination
switch controlled via the I2C bus. The SCL/SDA
• Power-up with all switch channels deselected upstream pair fans out to four downstream pairs, or
• Low RON switches channels. Any individual SCn/SDn channel or
• Allows voltage-level translation between 1.8-V, combination of channels can be selected, determined
by the contents of the programmable control register.
2.5-V, 3.3-V, and 5-V buses
Four interrupt inputs (INT3–INT0), one for each of the
• No glitch on power-up downstream pairs, are provided. One interrupt (INT)
• Supports hot insertion output acts as an AND of the four interrupt inputs.
• Low standby current An active-low reset (RESET) input allows the
• Operating power-supply voltage range of TCA9545A to recover from a situation in which one of
1.65 V to 5.5 V the downstream I2C buses is stuck in a low state.
Pulling RESET low resets the I2C state machine and
• 5.5 V Tolerant inputs
causes all the channels to be deselected, as does the
• 0 to 400-kHz Clock frequency internal power-on reset function.
• Latch-Up performance exceeds 100 mA per JESD
The pass gates of the switches are constructed such
78 that the VCC terminal can be used to limit the
• ESD Protection exceeds JESD 22 maximum high voltage, which will be passed by the
– 4000-V Human-body model (A114-A) TCA9545A. This allows the use of different bus
voltages on each pair, so that 1.8-V, 2.5-V, or 3.3-V
– 1500-V Charged-device model (C101)
parts can communicate with 5-V parts, without any
additional protection. External pull-up resistors pull
the bus up to the desired voltage level for each
channel. All I/O terminals are 5.5 V tolerant.

Device Information
ORDER NUMBER PACKAGE BODY SIZE
TCA9545APWR TSSOP (20) 6,5mm x 4,4mm

Simplified Application Diagram

Channel 0
VCC SD0
SDA SC0 Slaves A0, A1...AN
I2C or SMBus SCL INT0
INT
Master Channel 1
SD1
(e.g. µProcessor) RESET SC1 Slaves B0, B1...BN
INT1

TCA9545A
Channel 2
SD2
SC2 Slaves C0, C1...CN
INT2
A0
A1 Channel 3
GND SD3
SC3 Slaves D0, D1...DN
INT3

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 12
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 8.5 Programming........................................................... 12
8.6 Control Register ...................................................... 15
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3 9 Application and Implementation ........................ 17
9.1 Application Information............................................ 17
6 Specifications......................................................... 4
9.2 Typical Application .................................................. 17
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4 10 Power Supply Recommendations ..................... 20
10.1 Power-On Reset Requirements ........................... 20
6.3 Recommended Operating Conditions ...................... 4
6.4 Thermal Information .................................................. 4 11 Layout................................................................... 22
6.5 Electrical Characteristics........................................... 5 11.1 Layout Guidelines ................................................. 22
6.6 I2C Interface Timing Requirements........................... 6 11.2 Layout Example .................................................... 22
6.7 Switching Characteristics .......................................... 7 12 Device and Documentation Support ................. 23
6.8 Interrupt and Reset Timing Requirements ................ 7 12.1 Receiving Notification of Documentation Updates 23
6.9 Typical Characteristics .............................................. 8 12.2 Support Resources ............................................... 23
7 Parameter Measurement Information .................. 9 12.3 Trademarks ........................................................... 23
12.4 Electrostatic Discharge Caution ............................ 23
8 Detailed Description ............................................ 11
12.5 Glossary ................................................................ 23
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11 13 Mechanical, Packaging, and Orderable
Information ........................................................... 23

4 Revision History
Changes from Revision C (July 2019) to Revision D Page

• Changed VCC = 3.3 V to VCC = 2.5 V in Figure 16................................................................................................................ 17

Changes from Revision B (March 2014) to Revision C Page

• Moved Tstg to the Absolute Maximum Ratings table............................................................................................................... 4

• Changed the Handling Ratings table To: ESD Ratings table................................................................................................. 4
• Changed the last row of column B1 From: X To: 0 in Table 1 ............................................................................................ 16

Changes from Revision A (March 2014) to Revision B Page

• Updated pin names in graphics. ............................................................................................................................................ 1

Changes from Original (January 2014) to Revision A Page

• Updated PREVIEW document to full version. ....................................................................................................................... 1

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5 Pin Configuration and Functions

PW package
20-Pin TSSOP
Top View

A0 1 20 VCC

A1 2 19 SDA

RE SET 3 18 SCL

INT0 4 17 INT

SD0 5 16 SC3

SC0 6 15 SD3

INT1 7 14 INT3

SD1 8 13 SC2

SC1 9 12 SD2

GND 10 11 INT2

No t to scale

Pin Functions
PIN
DESCRIPTION
NO. NAME
1 A0 Address input 0. Connect directly to VCC or ground.
2 A1 Address input 1. Connect directly to VCC or ground.
Active-low reset input. Connect to VCC or VDPUM (1) through a pull-up resistor if not
3 RESET
used.
4 INT0 Active-low interrupt input 0. Connect to VDPU0 (1) through a pull-up resistor.
(1)
5 SD0 Serial data 0. Connect to VDPU0 through a pul-up resistor.
6 SC0 Serial clock 0. Connect to VDPU0 (1)
through a pull-up resistor.
7 INT1 Active-low interrupt input 1. Connect to VDPU1 (1) through a pull-up resistor.
8 SD1 Serial data 1. Connect to VDPU1 (1) through a pull-up resistor.
9 SC1 Serial clock 1. Connect to VDPU1 (1) through a pull-up resistor.
10 GND Ground
11 INT2 Active-low interrupt input 2. Connect to VDPU2 (1) through a pull-up resistor.
12 SD2 Serial data 2. Connect to VDPU2 (1) through a pull-up resistor.
13 SC2 Serial clock 2. Connect to VDPU2 (1) through a pull-up resistor.
14 INT3 Active-low interrupt input 3. Connect to VDPU3 (1) through a pull-up resistor.
15 SD3 Serial data 3. Connect to VDPU3 (1) through a pull-up resistor.
16 SC3 Serial clock 3. Connect to VDPU3 (1) through a pull-up resistor.
17 INT Active-low interrupt output. Connect to VDPUM (1) through a pull-up resistor.
18 SCL Serial clock line. Connect to VDPUM (1) through a pull-up resistor.
19 SDA Serial data line. Connect to VDPUM (1) through a pull-up resistor.
20 VCC Supply power

(1) VDPUX is the pull-up reference voltage for the associated data line. VDPUM is the master I2C master reference voltage and VDPU0–VDPU3
are the slave channel reference voltages.

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6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
(2)
VI Input voltage range –0.5 7 V
II Input current ±20 mA
IO Output current ±25 mA
Continuous current through VCC ±100 mA
Continuous current through GND ±100 mA
Ptot Total power dissipation 400 mW
TA Operating free-air temperature range –40 85 °C
Tstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

PARAMETER DEFINITION MIN MAX UNIT
Human Body Model (HBM), ESD Stress Voltage (2) All Terminals 4000 V
VESD (1)
Charged Device Model (CDM) ESD Stress Voltage (3) All Terminals 1500 V

(1) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by assembly line electrostatic discharges into
the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe
manufacturing with a standard ESD control process. Terminals listed as 250 V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process. Terminals listed as 250 V may actually have higher performance.

6.3 Recommended Operating Conditions (1)

MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
SCL, SDA 0.7 × VCC 6
VIH High-level input voltage V
A1, A0, INT3–INT0, RESET 0.7 × VCC VCC + 0.5
SCL, SDA –0.5 0.3 × VCC
VIL Low-level input voltage V
A1, A0, INT3–INT0, RESET –0.5 0.3 × VCC
TA Operating free-air temperature –40 85 °C

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.4 Thermal Information

TCA9545A
THERMAL METRIC (1) PW UNIT
20 TERMINALS
θJA Junction-to-ambient thermal resistance 115.3
θJCtop Junction-to-case (top) thermal resistance 48.7
θJB Junction-to-board thermal resistance 66.4 °C/W
ψJT Junction-to-top characterization parameter 6.5
ψJB Junction-to-board characterization parameter 65.8

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

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6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX UNIT
Power-on reset voltage, VCC
VPORR No load, VI = VCC or GND (2) 1.2 1.5 V
rising
Power-on reset voltage, VCC
VPORF No load,VI = VCC or GND (2) 0.8 1 V
falling (3)
5V 3.6
4.5 V to 5.5 V 2.6 4.5
3.3 V 1.9
3 V to 3.6 V 1.6 2.8
Vpass Switch output voltage VSWin = VCC, ISWout = –100 μA V
2.5 V 1.4
2.3 V to 2.7 V 1.0 1.8
1.8 V 0.8
1.65 V to 1.95 V 0.5 1.1
IOH INT VO = VCC 1.65 V to 5.5 V 10 μA
VOL = 0.4 V 3 7
SDA
IOL VOL = 0.6 V 1.65 V to 5.5 V 6 10 mA
INT VOL = 0.4 V 3
SCL, SDA ±1
SC3–SC0, SD3–SD0 ±1
II A1, A0 VI = VCC or GND (2) 1.65 V to 5.5 V ±1 μA
INT3–INT0 ±1
RESET ±1
5.5 V 50
VI = VCC or GND (2) 3.6 V 20
fSCL = 400 kHz IO = 0
tr,max = 300 ns 2.7 V 11
1.65 V 6
Operating mode
5.5 V 35
VI = VCC or GND (2) 3.6 V 14
fSCL = 100 kHz IO = 0
tr,max = 1 µs 2.7 V 5
1.65 V 2
ICC μA
5.5 V 1.6 2
3.6 V 1.0 1.3
Low inputs VI = GND (2) IO = 0
2.7 V 0.7 1.1
1.65 V 0.4 0.55
Standby mode
5.5 V 1.6 2
3.6 V 1.0 1.3
High inputs VI = VCC IO = 0
2.7 V 0.7 1.1
1.65 V 0.4 0.55
One INT3–INT0 input at 0.6 V,
3 20
Other inputs at VCC or GND (2)
INT3–INT0
One INT3–INT0 input at VCC – 0.6 V,
3 20
Supply-current Other inputs at VCC or GND (2)
ΔICC 1.65 V to 5.5 V μA
change SCL or SDA input at 0.6 V,
2 15
Other inputs at VCC or GND (2)
SCL, SDA
SCL or SDA input at VCC – 0.6 V,
2 15
Other inputs at VCC or GND (2)

(1) All typical values are at nominal supply voltage (VCC = 1.8 V, 2.5 V, 3.3 V, or 5 V), TA = 25°C.
(2) RESET = VCC (held high) when all other input voltages, VI = GND
(3) The power-on reset circuit resets the I2C bus logic with VCC < VPORF.
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Electrical Characteristics (continued)

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX UNIT
A1, A0 4.5 6
Ci INT3–INT0 VI = VCC or GND (2) 1.65 V to 5.5 V 4.5 6 pF
RESET 4.5 5.5

(4)
SCL, SDA VI = VCC or 15 19
Cio(OFF) Switch OFF 1.65 V to 5.5 V pF
SC3–SC0, SD3–SD0 GND (2) 6 8
4.5 V to 5.5 V 4 10 16
VO = 0.4 V IO = 15 mA
3 V to 3.6 V 5 13 20
RON Switch on-state resistance Ω
2.3 V to 2.7 V 7 16 45
VO = 0.4 V IO = 10 mA
1.65 V to 1.95 V 10 25 70

(4) Cio(ON) depends on the device capacitance and load that is downstream from the device.

6.6 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5)
STANDARD MODE FAST MODE
I2C BUS I2C BUS UNIT
MIN MAX MIN MAX
fscl I2C clock frequency 100 400 kHz
tsch I2C clock high time 4 0.6 μs
tscl I2C clock low time 4.7 1.3 μs
2
tsp I C spike time 50 50 ns
tsds I2C serial-data setup time 250 100 ns
tsdh I2C serial-data hold time 0 (1) 0 (1) μs
ticr I2C input rise time 1000 20 + 0.1Cb (2)
300 ns
2 (2)
ticf I C input fall time 300 20 + 0.1Cb 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 20 + 0.1Cb (2)
300 ns
tbuf I2C bus free time between stop and start 4.7 1.3 μs
2
tsts I C start or repeated start condition setup 4.7 0.6 μs
tsth I2C start or repeated start condition hold 4 0.6 μs
tsps I2C stop condition setup 4 0.6 μs
SCL low to SDA output low
tvdL(Data) Valid-data time (high to low) (3) 1 1 μs
valid
SCL low to SDA output high
tvdH(Data) Valid-data time (low to high) (3) 0.6 0.6 μs
valid
ACK signal from SCL low
tvd(ack) Valid-data time of ACK condition 1 1 μs
to SDA output low
2
Cb I C bus capacitive load 400 400 pF

(1) A device internally must provide a hold time of at least 300 ns for the SDA signal (referred to as the VIH min of the SCL signal), in order
to bridge the undefined region of the falling edge of SCL.
(2) Cb = total bus capacitance of one bus line in pF
(3) Data taken using a 1-kΩ pullup resistor and 50-pF load (see Figure 5)

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6.7 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 7)
FROM TO
PARAMETER MIN MAX UNIT
(INPUT) (OUTPUT)

(1)
RON = 20 Ω, CL = 15 pF 0.3
tpd Propagation delay time SDA or SCL SDn or SCn ns
RON = 20 Ω, CL = 50 pF 1
tiv Interrupt valid time (2) INTn INT 4 μs
(2)
tir Interrupt reset delay time INTn INT 2 μs

(1) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
(2) Data taken using a 4.7-kΩ pullup resistor and 100-pF load (see Figure 7)

6.8 Interrupt and Reset Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7)
PARAMETER MIN MAX UNIT
tPWRL Low-level pulse duration rejection of INTn inputs 1 μs
tPWRH High-level pulse duration rejection of INTn inputs 0.5 μs
tWL Pulse duration, RESET low 6 ns
(1)
trst RESET time (SDA clear) 500 ns
tREC(STA) Recovery time from RESET to start 0 ns

(1) trst is the propagation delay measured from the time the RESET terminal is first asserted low to the time the SDA terminal is asserted
high, signaling a stop condition. It must be a minimum of tWL.

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6.9 Typical Characteristics

800 1.8
VCC = 5.5V
700 VCC = 3.3V 1.6
VCC = 1.65V

ICC, Standby Mode (µA)

600 1.4

500 1.2
VOL (mV)

400 1

300 0.8

200 0.6
25ºC (Room Temperature)
100 0.4 85ºC
-40ºC
0 0.2
0 2 4 6 8 10 12 1.5 2 2.5 3 3.5 4 4.5 5 5.5
IOL (mA) D003
VCC (V) D004

Figure 1. SDA Output Low Voltage (VOL) vs Load Current Figure 2. Standby Current (ICC) vs Supply Voltage (VCC) at
(IOL) at Three VCC Levels Three Temperature Points
6 30
25ºC (Room Temperature)
5.8 85ºC
-40º 25
5.6
5.4
20
CIO(OFF) (pF)

RON (Ohm)

5.2
5 15
4.8
10
4.6
4.4 25ºC (Room Temperature)
5
4.2 85ºC
-40ºC
4 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V) D006
VCC (V) D001

Figure 3. Slave channel (SCn/SDn) capacitance (Cio(OFF)) vs. Figure 4. ON-Resistance (RON) vs Supply Voltage (VCC) at
Supply Voltage (VCC) at Three Temperature Points Three Temperatures

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7 Parameter Measurement Information

VCC

RL = 1 kΩ

SDn, SCn
DUT

CL = 50 pF
(See Note A)

I2C PORT LOAD CONFIGURATION

Two Bytes for Complete

Device Programming

Stop Start Address R/W Data Data Stop

Address Address ACK ACK
Condition Condition Bit 7 Bit 0 Bit 7 Bit 0 Condition
Bit 6 Bit 1 (A) (A)
(P) (S) (MSB) (LSB) (MSB) (LSB) (P)

BYTE DESCRIPTION
1 I2C address + R/W

2 Control register data

tscl tsch

0.7 × VCC
SCL
0.3 × VCC
tvd(ACK)
ticr tsts
or tvdL
tbuf ticf
tsp tvdH
0.7 × VCC
SDA
0.3 × VCC
ticf ticr tsdh tsps
tsth tsds Repeat
Start Stop
Start or Repeat
Condition Condition
Start Condition

VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
tr/tf = 30 ns.
C. The outputs are measured one at a time, with one transition per measurement.

Figure 5. I2C Interface Load Circuit, Byte Descriptions, and Voltage Waveforms

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Parameter Measurement Information (continued)

Start ACK or Read Cycle
SCL

SDA
30%

trst

RESET 50%
tREC
tWL

Figure 6. Reset Timing

VCC

RL = 4.7 kΩ

INT
DUT

CL = 100 pF
(See Note A)

INTERRUPT LOAD CONFIGURATION

INTn
INTn
0.5 × VCC (input) 0.5 × VCC
(input)
tir
tiv
INT INT
0.5 × VCC 0.5 × VCC
(output) (output)

VOLTAGE WAVEFORMS (tiv) VOLTAGE WAVEFORMS (tir)

A. CL includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
tr/tf = 30 ns.

Figure 7. Interrupt Load Circuit and Voltage Waveforms

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8 Detailed Description

8.1 Overview
The TCA9545A is a 4-channel, bidirectional translating I2C switch. The master SCL/SDA signal pair is directed to
four channels of slave devices, SC0/SD0-SC3/SD3. Any individual downstream channel can be selected as well
as any combination of the four channels. The TCA9545A also supports interrupt signals in order for the master to
detect an interrupt on the INT output terminal that can result from any of the slave devices connected to the
INT3-INT0 input terminals.
The device offers an active-low RESET input which resets the state machine and allows the TCA9545A to
recover should one of the downstream I2C buses get stuck in a low state. The state machine of the device can
also be reset by cycling the power supply, VCC, also known as a power-on reset (POR). Both the RESET function
and a POR will cause all channels to be deselected.
The connections of the I2C data path are controlled by the same I2C master device that is switched to
communicate with multiple I2C slaves. After the successful acknowledgment of the slave address (hardware
selectable by A0 and A1 terminals), a single 8-bit control register is written to or read from to determine the
selected channels and state of the interrupts.
The TCA9545A may also be used for voltage translation, allowing the use of different bus voltages on each
SCn/SDn pair such that 1.8-V, 2.5-V, or 3.3-V parts can communicate with 5-V parts. This is achieved by using
external pull-up resistors to pull the bus up to the desired voltage for the master and each slave channel.

8.2 Functional Block Diagram

TCA9545A
6
SC0

9
SC1

13
SC2

16
SC3

SD0 5

SD1 8

SD2 12

SD3 15

Switch Control Logic

10
GND

20
VCC
3 Power-on Reset
RESET

SCL 18 1
A0
Input Filter I2C Bus Control
19 2
SDA A1

4
INT0
INT1 7 Output 17
Interrupt Logic INT
INT2 11 Filter
INT3 14

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8.3 Feature Description

The TCA9545A is a 4-channel, bidirectional translating switch for I2C buses that supports Standard-Mode (100
kHz) and Fast-Mode (400 kHz) operation. The TCA9545A features I2C control using a single 8-bit control register
in which the four least significant bits control the enabling and disabling of the 4 switch channels of I2C data flow.
The TCA9545A also supports interrupt signals for each slave channel and this data is held in the four most
significant bits of the control register. Depending on the application, voltage translation of the I2C bus can also be
achieved using the TCA9545A to allow 1.8-V, 2.5-V, or 3.3-V parts to communicate with 5-V parts. Additionally,
in the event that communication on the I2C bus enters a fault state, the TCA9545A can be reset to resume
normal operation using the RESET pin feature or by a power-on reset which results from cycling power to the
device.

8.4 Device Functional Modes

8.4.1 RESET Input
The RESET input can be used to recover the TCA9545A from a bus-fault condition. The registers and the I2C
state machine within this device initialize to their default states if this signal is asserted low for a minimum of tWL.
All channels also are deselected in this case. RESET must be connected to VCC through a pull-up resistor.

8.4.2 Power-On Reset

When power is applied to VCC, an internal power-on reset holds the TCA9545A in a reset condition until VCC has
reached VPORR. At this point, the reset condition is released and the TCA9545A registers and I2C state machine
are initialized to their default states, all zeroes, causing all the channels to be deselected. Thereafter, VCC must
be lowered below at least VPORF to reset the device.

8.5 Programming
8.5.1 I2C Interface
The I2C bus is for two-way two-line communication between different ICs or modules. The two lines are a serial
data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device. Data transfer can be initiated only when the bus is not
busy.
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high
period of the clock pulse, as changes in the data line at this time are interpreted as control signals (see Figure 8).

SDA

SCL

Data Line Change

Stable; of Data
Data Valid Allowed

Figure 8. Bit Transfer

Both data and clock lines remain high when the bus is not busy. A high-to-low transition of the data line while the
clock is high is defined as the start condition (S). A low-to-high transition of the data line while the clock is high is
defined as the stop condition (P) (see Figure 9).

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Programming (continued)

SDA

SCL S P

Start Condition Stop Condition

Figure 9. Definition of Start and Stop Conditions

A device generating a message is a transmitter; a device receiving a message is the receiver. The device that
controls the message is the master, and the devices that are controlled by the master are the slaves (see
Figure 10).
SDA

SCL

Master Slave Master I2C

Transmitter/ Slave Transmitter/ Master Transmitter/ Multiplexer
Receiver Receiver Receiver Transmitter Receiver

Slave

Figure 10. System Configuration

The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one acknowledge (ACK) bit. The transmitter must release the SDA
line before the receiver can send an ACK bit.
When a slave receiver is addressed, it must generate an ACK after the reception of each byte. Also, a master
must generate an ACK after the reception of each byte that has been clocked out of the slave transmitter. The
device that acknowledges must pull down the SDA line during the ACK clock pulse so that the SDA line is stable
low during the high pulse of the ACK-related clock period (see Figure 11). Setup and hold times must be taken
into account.

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Programming (continued)

Data Output
by Transmitter

NACK

Data Output
by Receiver

ACK

SCL From
Master 1 2 8 9

Start Clock Pulse for ACK

Condition

Figure 11. Acknowledgment on the I2C Bus

A master receiver must signal an end of data to the transmitter by not generating an acknowledge (NACK) after
the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line high.
In this event, the transmitter must release the data line to enable the master to generate a stop condition.
Data is transmitted to the TCA9545A control register using the write mode shown in Figure 12.
Slave Address Control Register

SDA S 1 1 1 0 0 A1 A0 0 A X X X X B3 B2 B1 B0 A P

Start Condition R/W ACK From Slave ACK From Slave Stop Condition

Figure 12. Write Control Register

Data is read from the TCA9545A control register using the read mode shown in Figure 13.
Slave Address Control Register

SDA S 1 1 1 0 0 A1 A0 1 A INT3 INT2 INT1 INT0 B3 B2 B1 B0 NA P

Start Condition R/W ACK From Slave NACK From Master Stop Condition

Figure 13. Read Control Register

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8.6 Control Register

8.6.1 Device Address
Following a start condition, the bus master must output the address of the slave it is accessing. The address of
the TCA9545A is shown in Figure 14. To conserve power, no internal pullup resistors are incorporated on the
hardware-selectable address terminals, and they must be pulled high or low.
Slave Address

1 1 1 0 0 A1 A0 R/W

Fixed Hardware
Selectable

Figure 14. TCA9545A Address

The last bit of the slave address defines the operation to be performed. When set to a logic 1, a read is selected,
while a logic 0 selects a write operation.

8.6.2 Control Register Description

Following the successful acknowledgment of the slave address, the bus master sends a byte to the TCA9545A,
which is stored in the control register (see Figure 15). If multiple bytes are received by the TCA9545A, it saves
the last byte received. This register can be written and read via the I2C bus.
Interrupt Bits Channel-Selection Bits
(Read Only) (Read/Write)

7 6 5 4 3 2 1 0

INT3 INT2 INT1 INT0 B3 B2 B1 B0

Channel 0
Channel 1
Channel 2
Channel 3
INT0
INT1
INT2
INT3

Figure 15. Control Register

8.6.3 Control Register Definition

One or several SCn/SDn downstream pairs, or channels, are selected by the contents of the control register (see
Table 1). After the TCA9545A has been addressed, the control register is written. The four LSBs of the control
byte are used to determine which channel or channels are to be selected. When a channel is selected, the
channel becomes active after a stop condition has been placed on the I2C bus. This ensures that all SCn/SDn
lines are in a high state when the channel is made active, so that no false conditions are generated at the time of
connection. A stop condition must occur always right after the acknowledge cycle.

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Control Register (continued)

Table 1. Control Register Write (Channel Selection), Control Register Read (Channel Status) (1)
INT3 INT2 INT1 INT0 B3 B2 B1 B0 COMMAND
0 Channel 0 disabled
X X X X X X X
1 Channel 0 enabled
0 Channel 1 disabled
X X X X X X X
1 Channel 1 enabled
0 Channel 2 disabled
X X X X X X X
1 Channel 2 enabled
0 Channel 3 disabled
X X X X X X X
1 Channel 3 enabled
No channel selected,
0 0 0 0 0 0 0 0
power-up/reset default state

(1) Several channels can be enabled at the same time. For example, B3 = 0, B2 = 1, B1 = 1, B0 = 0 means that channels 0 and 3 are
disabled, and channels 1 are 2 and enabled. Care should be taken not to exceed the maximum bus capacity.

8.6.4 Interrupt Handling

The TCA9545A provides four interrupt inputs (one for each channel) and one open-drain interrupt output (see
Table 2). When an interrupt is generated by any device, it is detected by the TCA9545A and the interrupt output
is driven low. The channel does not need to be active for detection of the interrupt. A bit also is set in the control
register.
Bits 4–7 of the control register correspond to channels 0–3 of the TCA9545A, respectively. Therefore, if an
interrupt is generated by any device connected to channel 1, the state of the interrupt inputs is loaded into the
control register when a read is accomplished. Likewise, an interrupt on any device connected to channel 0 would
cause bit 4 of the control register to be set on the read. The master then can address the TCA9545A and read
the contents of the control register to determine which channel contains the device generating the interrupt. The
master then can reconfigure the TCA9545A to select this channel and locate the device generating the interrupt
and clear it.
It should be noted that more than one device can provide an interrupt on a channel, so it is up to the master to
ensure that all devices on a channel are interrogated for an interrupt.
The interrupt inputs can be used as general-purpose inputs if the interrupt function is not required.
If unused, interrupt input(s) must be connected to VCC.

Table 2. Control Register Read (Interrupt) (1)

INT3 INT2 INT1 INT0 B3 B2 B1 B0 COMMAND
0 No interrupt on channel 0
X X X X X X X
1 Interrupt on channel 0
0 No interrupt on channel 1
X X X X X X X
1 Interrupt on channel 1
0 No interrupt on channel 2
X X X X X X X
1 Interrupt on channel 2
0 No interrupt on channel 3
X X X X X X X
1 Interrupt on channel 3

(1) Several interrupts can be active at the same time. For example, INT3 = 0, INT2 = 1, INT1 = 1, INT0 = 0 means that there is no interrupt
on channels 0 and 3, and there is interrupt on channels 1 and 2.

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9 Application and Implementation

9.1 Application Information
Applications of the TCA9545A will contain an I2C (or SMBus) master device and up to four I2C slave devices.
The downstream channels are ideally used to resolve I2C slave address conflicts. For example, if four identical
digital temperature sensors are needed in the application, one sensor can be connected at each channel: 0, 1, 2,
and 3. When the temperature at a specific location needs to be read, the appropriate channel can be enabled
and all other channels switched off, the data can be retrieved, and the I2C master can move on and read the next
channel.
In an application where the I2C bus will contain many additional slave devices that do not result in I2C slave
address conflicts, these slave devices can be connected to any desired channel to distribute the total bus
capacitance across multiple channels. If multiple switches will be enabled simultaneously, additional design
requirements must be considered (See Design Requirements and Detailed Design Procedure).

9.2 Typical Application

A typical application of the TCA9545A will contain anywhere from 1 to 5 separate data pull-up voltages, VDPUX ,
one for the master device (VDPUM) and one for each of the selectable slave channels (VDPU0 – VDPU3). In the
event where the master device and all slave devices operate at the same voltage, then the pass voltage, Vpass =
VDPUX. Once the maximum Vpass is known, Vcc can be selected easily using Figure 17. In an application where
voltage translation is necessary, additional design requirements must be considered (See Design Requirements).
Figure 16 shows an application in which the TCA9545A can be used.
VDPUM = 1.65 V to 5.5 V
VCC = 2.5 V
VDPU0 = 1.65 V to 5.5 V
20
VCC
19 5
SDA SDA SD0
I2C/SMBus 18 6 Channel 0
SCL SCL SC0
Master 17 4
INT INT0
3 VDPU1 = 1.65 V to 5.5 V
RESET

SD1 8
9 Channel 1
SC1
7
INT1
VDPU2 = 1.65 V to 5.5 V
TCA9545A

12
SD2
13 Channel 2
SC2
11
INT2
VDPU3 = 1.65 V to 5.5 V

2 A1
1 15
A0 SD3
10 16 Channel 3
GND SC3
14
INT3

Figure 16. TCA9545A Typical Application Schematic

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Typical Application (continued)

9.2.1 Design Requirements
The pull-up resistors on the INT3-INT0 terminals in the application schematic are not required in all applications.
If the device generating the interrupt has an open-drain output structure or can be tri-stated, a pull-up resistor is
required. If the device generating the interrupt has a push-pull output structure and cannot be tri-stated, a pull-up
resistor is not required. The interrupt inputs should not be left floating in the application.
The A0 and A1 terminals are hardware selectable to control the slave address of the TCA9545A. These
terminals may be tied directly to GND or VCC in the application.
If multiple slave channels will be activated simultaneously in the application, then the total IOL from SCL/SDA to
GND on the master side will be the sum of the currents through all pull-up resistors, Rp.
The pass-gate transistors of the TCA9545A are constructed such that the VCC voltage can be used to limit the
maximum voltage that is passed from one I2C bus to another.
Figure 17 shows the voltage characteristics of the pass-gate transistors (note that the graph was generated using
data specified in the Electrical Characteristics section of this data sheet). In order for the TCA9545A to act as a
voltage translator, the Vpass voltage must be equal to or lower than the lowest bus voltage. For example, if the
main bus is running at 5 V and the downstream buses are 3.3 V and 2.7 V, Vpass must be equal to or below 2.7 V
to effectively clamp the downstream bus voltages. As shown in Figure 17, Vpass(max) is 2.7 V when the TCA9545A
supply voltage is 4 V or lower, so the TCA9545A supply voltage could be set to 3.3 V. Pull-up resistors then can
be used to bring the bus voltages to their appropriate levels (see Figure 16).

9.2.2 Detailed Design Procedure

Once all the slaves are assigned to the appropriate slave channels and bus voltages are identified, the pull-up
resistors, Rp, for each of the buses need to be selected appropriately. The minimum pull-up resistance is a
function of VDPUX, VOL,(max), and IOL:
VDPUX - VOL(max)
Rp(min) =
IOL (1)
The maximum pull-up resistance is a function of the maximum rise time, tr (300 ns for fast-mode operation, fSCL =
400 kHz) and bus capacitance, Cb:
tr
Rp(max) =
0.8473 ´ Cb (2)
2
The maximum bus capacitance for an I C bus must not exceed 400 pF for fast-mode operation. The bus
capacitance can be approximated by adding the capacitance of the TCA9545A, Cio(OFF), the capacitance of
wires/connections/traces, and the capacitance of each individual slave on a given channel. If multiple channels
will be activated simultaneously, each of the slaves on all channels will contribute to total bus capacitance.

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Typical Application (continued)

9.2.3 TCA9545A Application Curves

5 25
25ºC (Room Temperature) Standard-mode
85ºC Fast-mode
4 -40ºC 20

Rp(max) (kOhm)
3 15
Vpass (V)

2 10

1 5

0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0 50 100 150 200 250 300 350 400 450
VCC (V) D007
Cb (pF) D008
Space Space Standard-mode Fast-mode
spacespace spacespace (fSCL= 100 kHz, tr = 1 µs) (fSCL= 400 kHz, tr= 300 ns)

Figure 17. Pass-Gate Voltage (Vpass) vs Supply Voltage Figure 18. Maximum Pull-Up resistance (Rp(max)) vs Bus
(VCC) at Three Temperature Points Capacitance (Cb)

1.8

1.6

1.4

1.2
Rp(min) (kOhm)

0.8

0.6

0.4

0.2 VDPUX > 2V

VDPUX <= 2
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VDPUX (V) D009
VOL = 0.2*VDPUX, IOL = 2 mA when VDPUX ≤ 2 V
VOL = 0.4 V, IOL = 3 mA when VDPUX > 2 V

Figure 19. Minimum Pull-Up Resistance (Rp(min)) vs Pull-Up Reference Voltage (VDPUX)

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10 Power Supply Recommendations

The operating power-supply voltage range of the TCA9545A is 1.65 V to 5.5 V applied at the VCC pin. When the
TCA9545A is powered on for the first time or anytime the device needs to be reset by cycling the power supply,
the power-on reset requirements must be followed to ensure the I2C bus logic is initialized properly.

10.1 Power-On Reset Requirements

In the event of a glitch or data corruption, TCA9545A can be reset to its default conditions by using the power-on
reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This
reset also happens when the device is powered on for the first time in an application.
A power-on reset is shown in Figure 20.
VCC

Ramp-Down Ramp-Up

VCC_TRR

VCC drops below VPORF – 50 mV

Time
Time to Re-Ramp
VCC_FT VCC_RT

Figure 20. VCC is Lowered Below the POR Threshold, Then Ramped Back Up to VCC

Table 3 specifies the performance of the power-on reset feature for TCA9545A for both types of power-on reset.

Table 3. Recommended Supply Sequencing And Ramp Rates (1)

PARAMETER MIN TYP MAX UNIT
VCC_FT Fall time See Figure 20 1 100 ms
VCC_RT Rise time See Figure 20 0.1 100 ms
Time to re-ramp (when VCC drops below VPORF(min) – 50 mV or
VCC_TRR See Figure 20 40 μs
when VCC drops to GND)
Level that VCC can glitch down to, but not cause a functional
VCC_GH See Figure 21 1.2 V
disruption when VCC_GW = 1 μs
Glitch width that will not cause a functional disruption when
VCC_GW See Figure 21 10 μs
VCC_GH = 0.5 × VCC
VPORF Voltage trip point of POR on falling VCC See Figure 22 0.8 1.25 V
VPORR Voltage trip point of POR on rising VCC See Figure 22 1.05 1.5 V

(1) All supply sequencing and ramp rate values are measured at TA = 25°C

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Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width
(VCC_GW) and height (VCC_GH) are dependent on each other. The bypass capacitance, source impedance, and
device impedance are factors that affect power-on reset performance. Figure 21 and Table 3 provide more
information on how to measure these specifications.
VCC

VCC_GH

Time

VCC_GW

Figure 21. Glitch Width and Glitch Height

VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the
registers and the I2C/SMBus state machine are initialized to their default states. The value of VPOR differs based
on the VCC being lowered to or from 0. Figure 22 and Table 3 provide more details on this specification.
VCC

VPORR

VPORF

Time

POR

Time

Figure 22. VPOR

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11 Layout

11.1 Layout Guidelines

For PCB layout of the TCA9545A, common PCB layout practices should be followed but additional concerns
related to high-speed data transfer such as matched impedances and differential pairs are not a concern for I2C
signal speeds. It is common to have a dedicated ground plane on an inner layer of the board and terminals that
are connected to ground should have a low-impedance path to the ground plane in the form of wide polygon
pours and multiple vias. By-pass and de-coupling capacitors are commonly used to control the voltage on the
VCC terminal, using a larger capacitor to provide additional power in the event of a short power supply glitch and
a smaller capacitor to filter out high-frequency ripple.
In an application where voltage translation is not required, all VDPUX voltages and VCC could be at the same
potential and a single copper plane could connect all of pull-up resistors to the appropriate reference voltage. In
an application where voltage translation is required, VDPUM, VDPU0, VDPU1, VDPU2, and VDPU3 may all be on the
same layer of the board with split planes to isolate different voltage potentials.
To reduce the total I2C bus capacitance added by PCB parasitics, data lines (SCn, SDn and INTn) should be a
short as possible and the widths of the traces should also be minimized (e.g. 5-10 mils depending on copper
weight).

11.2 Layout Example

LEGEND
Partial Power Plane Polygonal
Copper Pour To I2C Master
VIA to Power Plane
VIA to GND Plane (Inner Layer)

By-pass/De-coupling
capacitors VDPUM

GND VCC
VDPU0
To Slave Channel 0

A0 VCC
VDPU3
A1 SDA

RESET SCL
To Slave Channel 3
TCA9545A

INT0 INT

SD0 SC3

SC0 SD3

INT1 INT3

SD1 SC2
To Slave Channel 1

SC1 SD2

GND INT2 VDPU2

To Slave Channel 2

GND
VDPU1

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12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

12.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.

12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following packaging information and addendum reflect the most current data available for the designated
devices. This data is subject to change without notice and revision of this document.

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TCA9545APWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PW545A

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TCA9545APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jun-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TCA9545APWR TSSOP PW 20 2000 356.0 356.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
PW0020A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
6.6 C
TYP PLANE
A 6.2
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1

2X
6.6 5.85
6.4
NOTE 3

10
11
0.30
20X
4.5 0.19 1.2 MAX
B
4.3
NOTE 4 0.1 C A B

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE 0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220206/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

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 EXAMPLE BOARD LAYOUT
PW0020A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

20X (1.5) SYMM

(R0.05) TYP
1
20X (0.45) 20

SYMM
18X (0.65)

10 11

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220206/A 02/2017
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

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 EXAMPLE STENCIL DESIGN
PW0020A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

20X (1.5) SYMM

(R0.05) TYP
1
20X (0.45) 20

SYMM
18X (0.65)

10 11

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220206/A 02/2017
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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