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TD62308AP/F/AF

The TD62308AP/F/AF is a 4-channel transistor array with NPN Darlington output stages and PNP input stages. It is a low-level input active driver suitable for use with 5V TTL, CMOS, and microprocessors. Each channel can sink up to 1.5A of current to drive relays, lamps, motors, or other loads. The device has output clamp diodes and is available in DIP-16 or HSOP-16 packages.

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0% found this document useful (0 votes)
87 views11 pages

TD62308AP/F/AF

The TD62308AP/F/AF is a 4-channel transistor array with NPN Darlington output stages and PNP input stages. It is a low-level input active driver suitable for use with 5V TTL, CMOS, and microprocessors. Each channel can sink up to 1.5A of current to drive relays, lamps, motors, or other loads. The device has output clamp diodes and is available in DIP-16 or HSOP-16 packages.

Uploaded by

Adam Starius
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
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TD62308AP/F/AF

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TD62308AP,TD62308F,TD62308AF
4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER

The TD62308AP/F/AF is a non−inverting transistor array which


is comprised of four NPN darlington output stages and PNP input
stages.
This device is low−level input active driver and is suitable for
operation with 5−V TTL, 5−V CMOS and 5−V Microprocessor
which have sink current output drivers.
Application include relay, hammer, lamp and stepping motor
drivers.

FEATURES
l Output current (single output) 1.5 A (Max)
l High sustaining voltage output 35 V (Min) (TD62308F)
50 V (Min)
(TD62308AP, TD62308AF)
l Output clamp diodes
l Input compatible with TTL and 5 V CMOS
l Low level active inputs
l Standard supply voltage
l Two VCC terminals VCC1, VCC2 (separated)
l GND and SUB terminal = heat sink
l Package type−AP : DIP−16 pin
Weight
l Package type−F, AF : HSOP−16 pin
DIP16−P−300−2.54A : 1.11 g (Typ.)
HSOP16−P−300−1.00 : 0.50 g (Typ.)

PIN CONNECTION (TOP VIEW)


TD62308AP TD62308F, TD62308AF

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TD62308AP/F/AF
SCHEMATICS (EACH DRIVER)

Note : The input and output parasitic diodes cannot be used as clamp diodes.

PRECAUTIONS for USING


(1) This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

(2) If a TD62308AP/F/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb
the counter electromotive force generated by the load. Please adhere to the device’s maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s maximum ratings.

MAXIMUM RATINGS (Ta = 25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Supply Voltage VCC −0.5~10 V


F −0.5~35
Output Sustaining Voltage VCE (SUS) V
AP, AF −0.5~50
Output Current IOUT 1.5 A / ch
Input Current IIN −10 mA
Input Voltage VIN −0.5~30 V
F 35
Clamp diode Reverse Voltage VR V
AP, AF 50
Clamp Diode Forward Current IF 1.5 A
1.47 / 2.7
AP
(Note 1)
Power Dissipation PD W
0.9 / 1.4
F, AF
(Note 2)
Operating Temperature Topr −40~85 °C
Storage Temperature Tstg −55~150 °C

Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%)


Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%)

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TD62308AP/F/AF
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)

CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT

Supply Voltage VCC ― 4.5 ― 5.5 V


F ― 0 ― 35
Output Sustaining Voltage VCE (SUS) V
AP, AF ― 0 ― 50
DC 1 circuit, Ta = 25°C 0 ― 1250
Duty = 10% 0 ― 1250
AP Tpw = 25 ms
Output Current IOUT 4 circuits Duty = 50% 0 ― 700 mA / ch
Ta = 85°C Duty = 10% 0 ― 1250
F, AF Tj = 120°C
Duty = 50% 0 ― 390
Input Voltage VIN ― 0 ― 25 V
VCC
Output On VIN (ON) ― 0 ―
−3.6
Input Voltage V
VCC
Output Off VIN (OFF) ― ― VCC
−1.0

Clamp Diode Reverse F ― ― ― 35


VR V
Voltage AP, AF ― ― ― 50
Clamp Diode Forward Current IF ― ― ― 1.25 A
AP Ta = 85°C (Note 1) ― ― 1.4
Power Dissipation PD W
F, AF Ta = 85°C (Note 2) ― ― 0.7

Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%)


Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 50%)

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TD62308AP/F/AF
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
TEST
CHARACTERISTIC SYMBOL CIR− TEST CONDITION MIN TYP. MAX UNIT
CUIT
VCE = 50 V, Ta = 25°C ― ― 50
AP, AF
Output Leakage VCE = 50 V, Ta = 85°C ― ― 100
ICEX 1 µA
Current
VCE = 35 V, Ta = 25°C ― ― 50
F
VCE = 35 V, Ta = 85°C ― ― 100
IOUT = 1.25 A ― ― 1.8
Output Saturation Voltage VCE (sat) 3 V
IOUT = 0.7 A ― ― 1.3
VCC
"H" Level VIH ― ― ― 25
−1.6
Input Voltage V
VCC
"L" Level VIL ― ― ― ―
−3.6
"H" Level IIH ― ― 10 µA
Input Current ― ―
"L" Level IIL ― −0.05 −0.36 mA

Clamp Diode AP, AF VR = 50 V, Ta = 25°C ― ― 50


IR 4 µA
Reverse Current F VR = 35 V, Ta = 25°C ― ― 50
Clamp Diode Forward Voltage VF 5 IF = 1.25 A ― 1.5 2.0 V
Output On ICC (ON) VCC = 5.5 V, VIN = 0 V ― 8.5 12.5 mA / ch
Supply Current 2
Output Off ICC (OFF) VCC = 5.5 V, VIN = VCC ― ― 1.0 µA
VOUT = 35 V
F
RL = 28 Ω
Turn−On Delay tON ― 0.2 ―
VOUT = 50 V
AP, AF
RL = 40 Ω
6 CL = 15 pF µs
VOUT = 35 V
F
RL = 28 Ω
Turn−Off Delay tON ― 5.0 ―
VOUT = 35 V
AP, AF
RL = 40 Ω

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TD62308AP/F/AF
TEST CIRCUIT
1. ICEX 2. ICC 3. VCE (sat)

4. IR 5. VF

6. tON、tOFF

Note 1: Pulse width 50 µs, duty cycle 10%


Output impedance 50 Ω tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance.

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TD62308AP/F/AF

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TD62308AP/F/AF

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TD62308AP/F/AF
PACKAGE DIMENSIONS
DIP16−P−300−2.54A Unit: mm

Weight: 1.11 g (Typ.)

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TD62308AP/F/AF
PACKAGE DIMENSIONS
HSOP16−P−300−1.00 Unit: mm

Weight: 0.50 g (Typ.)

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TD62308AP/F/AF

RESTRICTIONS ON PRODUCT USE 000707EBA

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

· The products described in this document are subject to the foreign exchange and foreign trade laws.

· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

10 2003-02-26
This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

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