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The document discusses different types of internal memory technologies, including RAM, ROM, SRAM, and DRAM. It provides details on how each type works, their relative speeds, costs, and applications. Dynamic RAM uses capacitors to store bits and requires refreshing even when powered. Static RAM uses flip-flops and does not require refreshing. ROM provides permanent non-volatile storage. Synchronous DRAM and DDR SDRAM synchronize data transfer with a clock to increase speeds.

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22 views15 pages

English

The document discusses different types of internal memory technologies, including RAM, ROM, SRAM, and DRAM. It provides details on how each type works, their relative speeds, costs, and applications. Dynamic RAM uses capacitors to store bits and requires refreshing even when powered. Static RAM uses flip-flops and does not require refreshing. ROM provides permanent non-volatile storage. Synchronous DRAM and DDR SDRAM synchronize data transfer with a clock to increase speeds.

Uploaded by

no.alha.20
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Computer Organization

and Architecture - Lecture 4

Internal Memory
Semiconductor Memory
• RAM
—Misnamed as all semiconductor memory is
random access
—Read/Write
—Volatile
—Temporary storage
—Static or dynamic
Memory Cell Operation
Dynamic RAM
• Bits stored as charge in capacitors
• Charges leak
• Need refreshing even when powered
• Simpler construction
• Smaller per bit
• Less expensive
• Need refresh circuits
• Slower
• Main memory
• Essentially analogue
—Level of charge determines value
Static RAM
• Bits stored as on/off switches
• No charges to leak
• No refreshing needed when powered
• More complex construction
• Larger per bit
• More expensive
• Does not need refresh circuits
• Faster
• Cache
• Digital
—Uses flip-flops
SRAM v DRAM
• Both volatile
—Power needed to preserve data
• Dynamic cell
—Simpler to build, smaller
—More dense
—Less expensive
—Needs refresh
—Larger memory units
• Static
—Faster
—Cache
Read Only Memory (ROM)
• Permanent storage
—Nonvolatile
• Microprogramming (see later)
• Library subroutines
• Systems programs (BIOS)
• Function tables
Types of ROM
• Written during manufacture
—Very expensive for small runs
• Programmable (once)
—PROM
—Needs special equipment to program
• Read “mostly”
—Erasable Programmable (EPROM)
– Erased by UV
—Electrically Erasable (EEPROM)
– Takes much longer to write than read
—Flash memory
– Erase whole memory electrically
Refreshing
• Refresh circuit included on chip
• Disable chip
• Count through rows
• Read & Write back
• Takes time
• Slows down apparent performance
Error Correction
• Hard Failure
—Permanent defect
• Soft Error
—Random, non-destructive
—No permanent damage to memory
• Detected using Hamming error correcting
code
Advanced DRAM Organization
• Basic DRAM same since first RAM chips
• Enhanced DRAM
—Contains small SRAM as well
—SRAM holds last line read (c.f. Cache!)
• Cache DRAM
—Larger SRAM component
—Use as cache or serial buffer
Synchronous DRAM (SDRAM)
• Access is synchronized with an external clock
• Address is presented to RAM
• RAM finds data (CPU waits in conventional DRAM)
• Since SDRAM moves data in time with system
clock, CPU knows when data will be ready
• CPU does not have to wait, it can do something
else
• Burst mode allows SDRAM to set up stream of
data and fire it out in block
• DDR-SDRAM sends data twice per clock cycle
(leading & trailing edge)
DDR SDRAM
• SDRAM can only send data once per clock
• Double-data-rate SDRAM can send data
twice per clock cycle
—Rising edge and falling edge
Cache DRAM
• Mitsubishi
• Integrates small SRAM cache (16 kb) onto
generic DRAM chip
• Used as true cache
—64-bit lines
—Effective for ordinary random access
• To support serial access of block of data
—E.g. refresh bit-mapped screen
– CDRAM can prefetch data from DRAM into SRAM
buffer
– Subsequent accesses solely to SRAM
Thanks ...

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