DuPont™ Kalrez®

Semiconductor Product Selector Guide

Technical Information—Rev. 15, July 2010

Process Typical Seal Typical Process Suggested Typical

Comments
Type Temperature Environment Products* Applications

TMS, TEOS, SiH4, 9100—Translucent

HDPCVD NH3, SiF4, O2, C2F6 product for etching,
Dynamic:
25–200 °C 9100 deposition and
PECVD N2O, NF3, CF4, • Door seals
“select”
8002 • Gate valves
ashing/stripping
8085 • Pendulum valves
processes.
CF4, C3F8, CHF3
Static:
Plasma SF6, O2, H2, • Chamber lid seals
Etching 25–200 °C 8002—Transparent
Processes HBr, BCl3, product for • Exhaust valves
ashing/stripping, and • Gas inlets/outlets
CCl4, Cl2
“select” etching and • Window seals
deposition processes. • Center rings
O2, CF4, CHF3, 8002
Ashing/
25–250 °C NH3, H2O Vapor 9100 Carrier:
Stripping 8085—General purpose
Forming Gas 8085 • Wafer/FPD
product for SACVD and Support/Transport
all plasma processes.
TEP, TEBO, TEOS, 8085
SACVD 25–250 °C
O3, NF3 8002
Metal CVD Organic precursors, 8900—Black product
WF6, TiCl4, SiH4, HF, 8900
ALD 25–300 °C for metal CVD, ALD,
F2, Cl2, ClF3, NF3, 9100 LPCVD, oxidation and
LPCVD H2O Vapor, O2, O3 • Quartz chamber
diffusion thermal
seal
process applications
Oxidation N2, O2 8900 • Fittings
150–300 °C • Center ring
Thermal Diffusion H2O, HCl, Cl2 8475 8475—White product
Processes for lamp anneal and • Plenum seals
Lamp Anneal Resistance to IR RTP thermal process
150–300 °C 8475 applications
RTP absorption
UPDI, Piranha,
Wafer Prep 25–125 °C SC-1, SC-2, O3, 6375UP—Black
HF (49%) • Door/lid seals
product for all wet
6375UP • Drain seals
HNO3, HF, H2O, process applications
Etching 25–180 °C 4079 • Seals for chemical
H3PO4, HNO3, containers
4079—Excellent
H2SO4 + Oxidant, • Fittings
Photolithography 25–125 °C chemical resistance
Organic Acids, nMP • Seals for filters/
Wet nMP/Alkanolamine 6375UP connectors
Stripping 25–125 °C 1050LF—Excellent
Hydroxlamine 1050LF amine resistance • Flow meters
Processes
CuSO4 Solution
Copper Plating 25–100 °C 6375UP
H2SO4, H2O2

* For more detailed information, refer to “Chemical Compatibility Guide.” Products in BOLD are preferred.
DuPont™ Kalrez® Parts for the Semiconductor Industry
Kalrez® perfluoroelastomer parts have been used successfully in highly aggressive sealing environments
for over 30 years. Kalrez® parts combine the resilience and sealing force characteristics of an elastomer
with the chemical inertness and thermal stability of DuPont™ Teflon® fluoropolymer resin. DuPont offers
molded O-rings and custom seals using a series of specialty products and ultrapure processing for the
semiconductor industry. DuPont™ Kalrez® UltraPure™ parts have excellent chemical and thermal stability
and have been specially formulated and processed to meet the unique requirements of wafer processing
environments.

Chemical and Thermal Resistance

Kalrez® seals resist attack by over 1,800 chemicals including reactive gases and plasmas, alkalis, acids
and solvents. Even in contact with these corrosive chemicals, Kalrez® seals retain their elastomeric
properties at temperatures as high as 325 °C. DuPont has over 30 years experience in
perfluoroelastomer research including polymer development, compounding, and parts manufacturing. As
the sealing needs of the semiconductor industry have evolved, this experience has enabled DuPont to
introduce new products that continue to increase seal life and reduce process contamination levels.

Ultrapure Processing Reduces Residual Contamination

Ultrapure post-cleaning and packaging is performed on Kalrez® parts as a secondary operation in a Class
100 clean room. Parts are cleaned using a proprietary process, followed by multiple rinses in UPDI water,
and then dried under a filtered air stream. The parts are sealed in certified-clean, antistatic packaging
material and shipped double-bagged, permitting easy clean room use by OEMs and fablines.
Ultrapure processing is standard for Kalrez® 9100, Kalrez® 8002, Kalrez® Sahara™ 8085, Kalrez® 8900,
Kalrez® Sahara™ 8475, Kalrez® 6375UP and Kalrez® Sahara™ 8575. It is optional for Kalrez® 4079,
Kalrez® 2037, and Kalrez® 1050LF. For these products, ultrapure processing can be specified by adding a
“UP” suffix to the product designation (e.g., Kalrez® 4079UP).

Suggested Products for Semiconductor Use

DuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for etching and deposition
process applications, e.g., HDPCVD, PECVD and ALD. It has also exhibited excellent performance in
“select” ashing/stripping processes. Kalrez® 9100 has been specifically designed for low erosion and
ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low
outgassing as well as excellent elastic recovery and mechanical strength properties and is well suited for
both static and dynamic sealing applications. A maximum continuous service temperature of 300 °C is
suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9100 parts.
DuPont™ Kalrez® 8002 is a clear, transparent product targeted for ashing/stripping and “select” etching
and deposition processes applications, e.g., SACVD. This unfilled product offers ultra-low particle
generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez® 8002 exhibits
excellent resistance to dry process chemistry, has good mechanical strength and is well suited for static,
low stress/low sealing force and “select” bonded door seal applications. A maximum continuous service
temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez®
8002 parts.
DuPont™ Kalrez® Sahara™ 8085 is a beige, general purpose product for etching, ashing/stripping and
deposition process applications, e.g., HDPCVD, PECVD and SACVD. It has been formulated for minimal
particle generation in NF3 plasma. Kalrez® Sahara™ 8085 exhibits very low particle generation and low
weight loss in oxygen and fluorine-based plasma, has excellent mechanical strength and is well-suited for
both static and dynamic sealing applications (e.g., bonded slit valve doors, bonded gate valves, bonded
pendulum valves, gas orifice seals, gas feed-through seals, chamber lid seals). A maximum continuous
service temperature of 240 °C is suggested. Kalrez® Sahara™ 8085 can also withstand short-term
excursions to 275 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® Sahara™ 8085
parts.
DuPont™ Kalrez® 8900 is a black product that has been specifically developed for semiconductor thermal
processes, e.g., oxidation, diffusion furnace, metal CVD, ALD and LPCVD. It offers outstanding thermal
stability, very low outgassing and excellent (low) compression set properties. Kalrez® 8900
perfluoroelastomer parts exhibit excellent retention of physical properties at elevated temperatures, have
excellent mechanical strength and are well-suited for both static and dynamic sealing applications. A
maximum continuous service temperature of 325 °C is suggested. Short excursions to higher
temperatures may also be possible. Ultrapure post-cleaning and packaging is standard for all Kalrez®
8900 parts.
DuPont™ Kalrez® Sahara™ 8475 has been specifically developed to meet the challenging requirements
associated with sealing applications in semiconductor thermal processes (i.e., oxidation, diffusion
furnace, LPCVD, RTP and lamp anneal). It exhibits excellent thermal stability and long-term sealing
performance, less IR absorption and significantly reduced outgassing properties at elevated
temperatures. Kalrez® Sahara™ 8475 has good mechanical properties and is well-suited for static and low
stress/low sealing force applications (e.g., quartz tube seals, ball joint seals, bell jar seals, plenum seals).
A maximum continuous service temperature of 300 °C is suggested. Ultrapure post-cleaning and
packaging is standard for all Kalrez® Sahara™ 8475 parts.
DuPont™ Kalrez® 6375UP is a black product for all wet process applications. This product exhibits
excellent chemical resistance to all different types of wet process chemicals including acids, bases and
amine-base strippers. It features low elemental extractables with good mechanical and compression set
properties and is well-suited for both static and dynamic wet process seal applications (e.g., filter seals,
drain seals and flowmeters). A maximum continuous service temperature of 275 °C is suggested.
Ultrapure post-cleaning and packaging is standard for Kalrez® 6375UP parts.

Additional Products Available

DuPont™ Kalrez® Sahara™ 8575 is a white product for “select” etching, ashing/stripping and deposition
process applications. It offers lower weight loss in oxygen and fluorine-based plasmas, low outgassing
and excellent elastic recovery properties. Kalrez® Sahara™ 8575 has excellent vacuum and long-term
sealing performance, good mechanical properties and is well-suited for both static and dynamic sealing
applications (e.g., gas inlets, chamber lid seals and slit valve door seals). A maximum continuous service
temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez®
Sahara™ 8575 parts.
DuPont™ Kalrez® 4079 is a black, low compression set product for use in many dry and wet
semiconductor process environments. It has excellent chemical resistance, good mechanical properties,
and outstanding thermal stability. Kalrez® 4079 exhibits low weight loss in reactive plasmas and has good
response to temperature cycling effects. It is not recommended for use in amines. A maximum continuous
service temperature of 316 °C is suggested. Short excursions to higher temperatures are possible.
Ultrapure post-cleaning and packaging is optional.
DuPont™ Kalrez® 2037 is a white product that is suitable for use in some plasma and gas deposition
applications. It exhibits very low weight loss in oxygen and fluorine-based plasmas and has good
mechanical strength properties. A maximum service temperature of 220 °C is suggested. Ultrapure
post-cleaning and packaging is optional.
DuPont™ Kalrez® 1050LF is a black product for use in select semiconductor wet process applications
where high concentrations of certain amines are present. It exhibits excellent amine resistance and has
excellent thermal stability and mechanical strength properties. Kalrez® 1050LF is not recommended for
use in organic or inorganic acids at elevated temperatures. A maximum continuous service temperature
of 288 °C is suggested. Ultrapure post-cleaning and packaging is available. Please order this product as
1050UP when specifying ultrapure post-cleaning and packaging.
Semiconductor Product Information1
Hardness Hardness Max. Continuous 100% Compression
9 5 7
Product Color Shore A Shore M Service Temp., Modulus Set at 70 hr
2 4
(pellet) (O-ring) °C MPa 204 °C, %
9100 Amber translucent 68
11
74 300 4.27
10
17
8

8002 Clear translucent 69

3
76 275 2.88
6
15
8

8085 Beige 80 86 240 7.50 42

8

8900 Black 73 80 325 10.73

10
8
8

8475 White 60 71 300 2.20 23

8

6375UP Black 75 83 275 7.23 25

8575 White 62 72 300 2.47 29
4079 Black 75 — 316 7.23 25
2037 White 79 — 220 6.20 27
1050LF Black 82 — 288 12.40 35

1
Not to be used for specification purposes
2
ASTM D2240 (pellet test specimens unless otherwise noted)
3
JIS 6253 (plied slab test specimens)
4
ASTM D2240 and ASTM D1414 (AS568 K214 O-ring test specimens)
5
ASTM D412 (dumbbell test specimens unless otherwise noted)
6
JIS 6251 (dumbbell test specimens)
7
ASTM D395B (pellet test specimens unless otherwise noted)
8
ASTM D395B and ASTM D1414 (AS568 K214 O-ring test specimens)
9
DuPont proprietary test method
10
ASTM D412 and ASTM D1414 (AS568 K214 O-Ring test specimens)
11
ASTM D2240 (plied slab test specimens)

Visit us at kalrez.dupont.com or vespel.dupont.com

Contact DuPont at the following regional locations:

North America Latin America Europe, Middle East, Africa

800-222-8377 +0800 17 17 15 +41 22 717 51 11

Greater China ASEAN Japan

+86-400-8851-888 +65-6586-3688 +81-3-5521-8484

The information set forth herein is furnished free of charge and is based on technical data that DuPont believes to be reliable and falls within the normal
range of properties. It is intended for use by persons having technical skill, at their own discretion and risk. This data should not be used to establish
specification limits nor used alone as the basis of design. Handling precaution information is given with the understanding that those using it will satisfy
themselves that their particular conditions of use present no health or safety hazards. Since conditions of product use and disposal are outside our
control, we make no warranties, express or implied, and assume no liability in connection with any use of this information. As with any product,
evaluation under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate or a recommendation to
infringe on patents.
Caution: Do not use in medical applications involving permanent implantation in the human body. For other medical applications, discuss with your
DuPont customer service representative and read Medical Caution Statement H-50103-3.
Copyright © 2010 DuPont. The DuPont Oval Logo, DuPont™, The miracles of science™, Kalrez®, Kalrez® Sahara™, Teflon®, UltraPure™, and Vespel®
are trademarks or registered trademarks of E.I. du Pont de Nemours and Company or its affiliates. All rights reserved.
(06/00) Reference No. KZE-H88232-00-P0710