Pw1 Cmos Daniel f1070

Download as pdf or txt
Download as pdf or txt
You are on page 1of 9

ELECTRICAL ENGINEERING DEPARTMENT

ACADEMIC SESSION: ____________


DEC50143 – CMOS IC DESIGN AND FABRICATION

PRACTICAL Layout Design and Simulation of NMOS and PMOS


WORK 1: Transistors

PRACTICAL
WORK DATE:
LECTURER’S WAN ZAIMI BIN WAN YUSOF
NAME:

GROUP NO.:

TOTAL
MARKS
STUDENT ID & NAME : (100%)

(1) DANIEL ISKANDAR BIN MOHD SHUKRI


(13DTK21F1070)

(2)
(3)

DATE SUBMIT : DATE RETURN :

RESULT

1.NMOS a)Transistor layout without DRC error

b. Transistor cross section


c.Id/Vd Characteristics Curve
d)Input/Output timing Diagram

2.PMOS
a)Transistor layout without DRC error

b.Transistor cross section


c.Id/Vd characteristics
D Input/Output timing diagram

DISCUSSION

1.Explain the terminology ‘technology feature’. (2 marks)


The term "technology feature" refers to a specific and distinctive characteristic or capability
of a technological product or system. In the context of technology, a feature is a unique
attribute or function that provides a certain benefit or advantage to the user. Technology
features can vary widely depending on the type of technology in question, such as software,
hardware, or a combination of both. These features are designed to meet specific user
needs, enhance usability, or differentiate a product from others in the market.

2.Describe the difference between micron and lambda unit in layout design
process. (2 marks)

In the context of layout design in the semiconductor industry, "micron" and "lambda" are
units of measurement used to describe the dimensions of features on an integrated circuit.
Here's a brief description of each:

- Lambda is a unit of measurement that is used to express feature sizes in terms of the
wavelength of light used in photolithography, a key process in semiconductor
manufacturing.

3.Explain the functions of design rules. (2 marks)


Design rules are a set of constraints imposed on the geometry of the
layout to ensure maximum yield for the components of the PIC in high-
volume manufacturing. Just as in electronic-integrated circuits, the rules
are created for a particular technology based on the fabrication process to
reproduce the intended design.

4.PMOS transistor is usually larger than NMOS transistor in layout. Give an


explanation. (2 marks)

The channel of a PMOS FET will be slightly wider than the channel of an
NMOS FET for channels that are similarly doped due to differences in
carrier mobility between P and N type semiconductors, resulting in equal
channel resistance for both. The PMOS FET needs a larger chip area to
create a wider channel.

5.State TWO (2) differences between NMOS transistor layout and PMOS
transistor layout. (2 marks)
In a NMOS, carriers are electrons, while in a PMOS, carriers are holes. When a high voltage
is applied to the gate, NMOS will conduct, while PMOS will not.

6.NMOS and PMOS transistors are good at passing which logic level?
Explain your answer. (2 marks)
PMOS pass transistor passes Strong '1' but weak '0' . An NMOS pass-transistor can pull
down to the positive supply rail, but it can only be pull-down to a threshold voltage above
the negative rail.

CONCLUSION

In conclusion, in practical work 1 I was able to install microwind and use it in


cemos. I can also describe circuits like mos transistors. I can also use this skill
in the future.

You might also like